WO2022022156A1

WO2022022156A1 - Housing of electronic device, fabrication method therefor, and electronic device

Info

Publication number: WO2022022156A1
Application number: PCT/CN2021/101041
Authority: WO
Inventors: 金挺顺
Original assignee: Oppo广东移动通信有限公司
Priority date: 2020-07-27
Filing date: 2021-06-18
Publication date: 2022-02-03
Also published as: CN114002872A

Abstract

A housing of an electronic device, a fabrication method therefor, and an electronic device, wherein the housing (10) of the electronic device comprises a substrate (12) and a liquid crystal layer (13); and the liquid crystal layer (13) is arranged on the substrate (12), and comprises oriented liquid crystals, so that incident light entering the liquid crystal layer (13) can be emitted by reflection through the liquid crystals, and the wavelength of the reflected light changes along with changes to the incident angle of the incident light. The presenting effect of the housing (10) of the electronic device may be enriched, and the beauty of the housing (10) of the electronic device can be improved, which satisfies the usage requirements of users.

Description

电子设备的壳体及其制作方法、电子设备Housing of electronic device, method of making the same, and electronic device

【技术领域】【Technical field】

本申请涉及电子设备壳体技术领域，特别是涉及一种电子设备的壳体及其制作方法、电子设备。The present application relates to the technical field of electronic device casings, and in particular, to a casing of an electronic device and a manufacturing method thereof, and an electronic device.

【背景技术】【Background technique】

当前，电子设备如手机等已基本成为人们日常工作、生活不可或缺的工具。At present, electronic devices such as mobile phones have basically become indispensable tools for people's daily work and life.

随着行业的不断发展，具有单一色彩效果的电子设备的外壳如手机的电池盖板等已不能够满足用户日益增长的需求。With the continuous development of the industry, casings of electronic devices with a single color effect, such as battery covers of mobile phones, can no longer meet the increasing demands of users.

【发明内容】[Content of the invention]

本申请实施例提供一种电子设备的壳体，所述电子设备的壳体包括基体及液晶层；所述液晶层设置于所述基体上，包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化。An embodiment of the present application provides a casing of an electronic device, the casing of the electronic device includes a substrate and a liquid crystal layer; the liquid crystal layer is disposed on the substrate and includes oriented liquid crystal, so that the liquid crystal layer enters the liquid crystal layer. The incident light can be reflected by the liquid crystal, and the wavelength of the reflected light changes with the change of the incident angle of the incident light.

本申请实施例提供一种电子设备的壳体的制作方法，包括：提供一基体；及在所述基体上形成液晶层，其中，所述液晶层包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化。An embodiment of the present application provides a method for manufacturing a casing of an electronic device, including: providing a substrate; and forming a liquid crystal layer on the substrate, wherein the liquid crystal layer includes oriented liquid crystal, so that the liquid crystal enters the liquid crystal. The incident light of the layer can be reflected out through the liquid crystal, and the wavelength of the reflected light changes with the change of the incident angle of the incident light.

本申请实施例提供一种电子设备，包括：壳体及功能器件，其中所述壳体定义有容置空间，并包括基体、贴合层及液晶层；所述贴合层设置于所述基体的一侧，所述液晶层设置于贴合层的远离所述基体的一侧，并包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化；所述功能器件容置于所述容置空间内。An embodiment of the present application provides an electronic device, including: a casing and a functional device, wherein the casing defines an accommodating space and includes a substrate, a bonding layer and a liquid crystal layer; the bonding layer is disposed on the substrate The liquid crystal layer is disposed on the side of the bonding layer away from the substrate, and contains oriented liquid crystal, so that the incident light entering the liquid crystal layer can be reflected by the liquid crystal, and the reflection The wavelength of the light changes with the change of the incident angle of the incident light; the functional device is accommodated in the accommodating space.

【附图说明】【Description of drawings】

为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort. in:

图1是本申请电子设备一实施方式的结构示意图；1 is a schematic structural diagram of an embodiment of an electronic device of the present application;

图2是本申请电子设备的壳体一实施方式的结构示意图；FIG. 2 is a schematic structural diagram of an embodiment of the housing of the electronic device of the present application;

图3是本申请电子设备的壳体一实施方式中基体的结构示意图；3 is a schematic structural diagram of a base body in an embodiment of the housing of the electronic device of the present application;

图4是本申请电子设备的壳体一实施方式中光线入射液晶层的路径示意图；4 is a schematic diagram of a path of light entering a liquid crystal layer in an embodiment of the housing of the electronic device of the present application;

图5是本申请电子设备的壳体另一实施方式的结构示意图；5 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图6是本申请电子设备的壳体又一实施方式的结构示意图；6 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图7是本申请电子设备的壳体又一实施方式的结构示意图；7 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图8是本申请电子设备的壳体又一实施方式的结构示意图；8 is a schematic structural diagram of yet another embodiment of the housing of the electronic device of the present application;

图9是本申请电子设备的壳体又一实施方式的结构示意图；FIG. 9 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图10是本申请电子设备的壳体一实施方式中遮光层的结构示意图；10 is a schematic structural diagram of a light shielding layer in an embodiment of the housing of the electronic device of the present application;

图11是相关技术中电子设备的壳体一结构示意图；11 is a schematic structural diagram of a casing of an electronic device in the related art;

图12是本申请电子设备的壳体又一实施方式的结构示意图；12 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图13是本申请电子设备的壳体又一实施方式的结构示意图；13 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图14是相关技术中电子设备的壳体另一结构示意图；14 is another structural schematic diagram of the housing of the electronic device in the related art;

图15是本申请电子设备的壳体又一实施方式的结构示意图；15 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图16是本申请电子设备的壳体又一实施方式的结构示意图；16 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图17是本申请电子设备的壳体又一实施方式的结构示意图；17 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图18是本申请电子设备的壳体又一实施方式的结构示意图；18 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图19是相关技术中电子设备的壳体又一结构示意图；19 is another structural schematic diagram of the housing of the electronic device in the related art;

图20是本申请电子设备的壳体又一实施方式的结构示意图；20 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图21是本申请电子设备的壳体又一实施方式的结构示意图；21 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application;

图22是本申请电子设备的壳体的制作方法一实施方式的流程示意图；22 is a schematic flowchart of an embodiment of a method for manufacturing a casing of an electronic device of the present application;

图23是图22中步骤S20的流程示意图；Figure 23 is a schematic flowchart of step S20 in Figure 22;

图24是图23中步骤S23的流程示意图；Figure 24 is a schematic flowchart of step S23 in Figure 23;

图25是本申请电子设备的壳体的制作方法另一实施方式的流程示意图；25 is a schematic flowchart of another embodiment of a method for manufacturing a casing of an electronic device of the present application;

图26是本申请电子设备的壳体的制作方法又一实施方式的部分流程示意图。FIG. 26 is a partial schematic flowchart of another embodiment of the method for manufacturing a casing of an electronic device of the present application.

【具体实施方式】【detailed description】

下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

本申请实施例一方面提供了一种电子设备的壳体，所述电子设备的壳体包括基体及液晶层；所述液晶层设置于所述基体上，包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化。An aspect of the embodiments of the present application provides a casing of an electronic device, the casing of the electronic device includes a substrate and a liquid crystal layer; the liquid crystal layer is disposed on the substrate and includes oriented liquid crystals, so that the The incident light of the liquid crystal layer can be reflected by the liquid crystal, and the wavelength of the reflected light changes with the change of the incident angle of the incident light.

其中，根据权利要求1所述的电子设备的壳体，其特征在于，所述反射光的波长满足：λ＝2np sinθ，其中，λ为所述反射光的波长、n为所述液晶层的平均折射率，p为所述经过取向的液晶的螺距，θ为所述入射光的入射角度的余角。The housing of the electronic device according to claim 1, wherein the wavelength of the reflected light satisfies: λ=2np sinθ, wherein λ is the wavelength of the reflected light, and n is the wavelength of the liquid crystal layer. The average refractive index, p is the helical pitch of the oriented liquid crystal, and θ is the complementary angle of the incident angle of the incident light.

其中，所述壳体还包括反射层，所述反射层设置于所述液晶层的远离所述基体的一侧，或设置于所述液晶层的朝向所述基体的一侧，用于对入射的光线进行反射；在所述反射层设置于所述液晶层的朝向所述基体的一侧时，所述壳体还包括设置于所述基体的朝向所述反射层一侧的贴合层。Wherein, the casing further includes a reflective layer, and the reflective layer is disposed on the side of the liquid crystal layer away from the substrate, or on the side of the liquid crystal layer facing the substrate, for reflecting the incident light. When the reflective layer is arranged on the side of the liquid crystal layer facing the substrate, the casing further includes a bonding layer arranged on the side of the substrate facing the reflective layer.

其中，所述反射层为金属膜层，材质为铟、锡中的至少一种，所述反射层的厚度为20-30nm。Wherein, the reflective layer is a metal film layer, the material is at least one of indium and tin, and the thickness of the reflective layer is 20-30 nm.

其中，所述壳体还包括颜色层，所述颜色层设置于所述液晶层与所述反射层之间，厚度为9-13μm。Wherein, the casing further includes a color layer, and the color layer is disposed between the liquid crystal layer and the reflection layer, and has a thickness of 9-13 μm.

其中，所述壳体还包括颜色层，所述颜色层设置于所述反射层的远离所述液晶层的一侧，厚度为9-13μm；所述反射层为增透膜，材质为ZrO2、Nb2O5中的至少一种，所述反射层的厚度为40-80nm。Wherein, the casing further includes a color layer, the color layer is disposed on the side of the reflection layer away from the liquid crystal layer, and has a thickness of 9-13 μm; the reflection layer is an anti-reflection film, and the material is ZrO2, At least one of Nb2O5, the thickness of the reflective layer is 40-80nm.

其中，所述壳体还包括纹理层、遮光层及保护层；所述纹理层设置于所述液晶层与所述反射层之间，具有纹理图案；所述遮光层设置于所述反射层的远离所述纹理层的一侧，包括至少一层油墨层；在所述反射层设置于所述液晶层的远离所述基体的一侧时，所述保护层设置于所述基体的远离所述液晶层的一侧；在所述反射层设置于所述液晶层的朝向所述基体的一侧时，所述保护层设置于所述液晶层的远离所述基体的一侧。Wherein, the casing further includes a texture layer, a light shielding layer and a protective layer; the texture layer is disposed between the liquid crystal layer and the reflective layer, and has a texture pattern; the light shielding layer is disposed on the reflective layer. The side far from the texture layer includes at least one ink layer; when the reflective layer is disposed on the side of the liquid crystal layer far away from the substrate, the protective layer is disposed on the substrate far away from the One side of the liquid crystal layer; when the reflective layer is disposed on the side of the liquid crystal layer facing the substrate, the protective layer is disposed on the side of the liquid crystal layer away from the substrate.

其中，所述壳体还包括所述纹理层的厚度为9-12μm，所述纹理层的材质为紫外光固化胶；所述遮光层包括沿远离所述反射层的方向依次设置的三层白色油墨层和两层灰色油墨层，每层油墨层的厚度为5-8μm，所述遮光层的厚度为25-40μm；所述保护层的厚度为6-9μm，所述壳体的硬度不小于铅笔硬度3H。Wherein, the shell further includes the texture layer with a thickness of 9-12 μm, and the texture layer is made of ultraviolet curing glue; The ink layer and two gray ink layers, the thickness of each ink layer is 5-8 μm, the thickness of the light-shielding layer is 25-40 μm; the thickness of the protective layer is 6-9 μm, and the hardness of the shell is not less than Pencil hardness 3H.

其中，所述壳体还包括所述液晶为胆甾相液晶，所述胆甾相液晶包括可聚合单体、向列相液晶、手性化合物、紫外光吸收剂、光引发剂，所述液晶层的厚度为2-3μm；所述基体的材质为聚碳酸酯、聚甲基丙烯酸甲酯的复合板材，包括聚碳酸酯层及聚甲基丙烯酸甲酯层，所述基体的厚度为0.5mm或0.64mm，所述聚甲基丙烯酸甲酯层的厚度为40-55μm。Wherein, the shell further includes that the liquid crystal is a cholesteric liquid crystal, and the cholesteric liquid crystal includes a polymerizable monomer, a nematic liquid crystal, a chiral compound, an ultraviolet light absorber, and a photoinitiator. The thickness of the layer is 2-3 μm; the material of the substrate is a composite sheet of polycarbonate and polymethyl methacrylate, including a polycarbonate layer and a polymethyl methacrylate layer, and the thickness of the substrate is 0.5 mm or 0.64mm, and the thickness of the polymethyl methacrylate layer is 40-55 μm.

本申请实施例一方面提供了一种电子设备的壳体的制作方法，所述制作方法包括：提供一基体；及在所述基体上形成液晶层，其中，所述液晶层包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化。One aspect of the embodiments of the present application provides a method for manufacturing a casing of an electronic device, the manufacturing method includes: providing a substrate; and forming a liquid crystal layer on the substrate, wherein the liquid crystal layer includes oriented liquid crystals , so that the incident light entering the liquid crystal layer can be reflected out by the liquid crystal, and the wavelength of the reflected light changes with the change of the incident angle of the incident light.

其中，在所述基体上形成液晶层的步骤，包括：提供一承载膜；在所述承载膜上依次涂覆液晶取向剂及液晶，以在所述承载膜上形成所述经过取向的液晶；及将所述经过取向的液晶转移至所述基体上，以形成所述液晶层，其中，所述液晶层通过粘结层粘接在所述基体上。Wherein, the step of forming a liquid crystal layer on the substrate includes: providing a carrier film; sequentially coating a liquid crystal aligning agent and a liquid crystal on the carrier film to form the oriented liquid crystal on the carrier film; and transferring the oriented liquid crystal to the substrate to form the liquid crystal layer, wherein the liquid crystal layer is bonded to the substrate through an adhesive layer.

其中，所述承载膜的材质为聚对苯二甲酸乙二醇酯，所述粘结层的材质为紫外光固化树脂；将所述经过取向的液晶转移至所述基体上，并通过粘结层粘结在所述基体上，以形成所述液晶层的步骤，包括：利用卷涂机将紫外光固化树脂辊涂在所述经过取向的液晶与所述基体之间；对经过辊涂后的所述紫外光固化树脂进行紫外光光照，使得所述紫外光固化树脂固化形成所述粘结层，以将所述经过取向的液晶粘接在所述基体上，形成所述液晶层；及去除所述承载膜。Wherein, the material of the carrier film is polyethylene terephthalate, and the material of the adhesive layer is UV-curable resin; the oriented liquid crystal is transferred to the substrate, and is bonded by bonding The step of bonding the layer on the substrate to form the liquid crystal layer includes: using a roll coater to roll a UV-curable resin between the oriented liquid crystal and the substrate; The ultraviolet light-curable resin is subjected to ultraviolet light irradiation, so that the ultraviolet light-curable resin is cured to form the adhesive layer, so that the oriented liquid crystal is adhered to the substrate to form the liquid crystal layer; and Remove the carrier film.

其中，所述制作方法还包括：在所述液晶层的远离所述基体的一侧形成反射层，其中，所述反射层用于对入射的光线进行反射。Wherein, the manufacturing method further includes: forming a reflective layer on a side of the liquid crystal layer away from the substrate, wherein the reflective layer is used to reflect incident light.

其中，在所述液晶层的远离所述基体的一侧形成反射层的步骤之前，所述制作方法还包括：在所述液晶层的远离所述基体的一侧形成颜色层，其中，所述颜色层的厚度为9-13μm。Wherein, before the step of forming the reflective layer on the side of the liquid crystal layer away from the substrate, the manufacturing method further includes: forming a color layer on the side of the liquid crystal layer away from the substrate, wherein the The thickness of the color layer is 9-13 μm.

其中，在所述液晶层的远离所述基体的一侧形成反射层的步骤之后，所述制作方法还包括：在所述反射层的远离所述基体的一侧形成颜色层，其中，所述颜色层的厚度为9-13μm；其中，所述反射层为增透膜，所述反射层的厚度为40-80nm。Wherein, after the step of forming a reflective layer on a side of the liquid crystal layer away from the substrate, the manufacturing method further includes: forming a color layer on a side of the reflective layer away from the substrate, wherein the The thickness of the color layer is 9-13 μm; wherein, the reflective layer is an anti-reflection film, and the thickness of the reflective layer is 40-80 nm.

其中，所述制作方法还包括：对所述基体进行三维成型处理，以使得所述基体具有预设的三维形状；及对所述基体进行精加工处理，以得到具有预设尺寸的电子设备的壳体。Wherein, the manufacturing method further includes: performing a three-dimensional molding process on the base body, so that the base body has a preset three-dimensional shape; and performing a finishing process on the base body, so as to obtain an electronic device having a preset size. case.

本申请实施例一方面提供了一种电子设备，所述电子设备包括壳体及功能器件，其中所述壳体定义有容置空间，并包括基体、贴合层及液晶层；所述贴合层设置于所述基体的一侧，所述液晶层设置于贴合层的远离所述基体的一侧，并包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化；所述功能器件容置于所述容置空间内。An aspect of the embodiments of the present application provides an electronic device, the electronic device includes a casing and a functional device, wherein the casing defines an accommodating space and includes a substrate, a bonding layer and a liquid crystal layer; the bonding The liquid crystal layer is arranged on one side of the substrate, the liquid crystal layer is arranged on the side of the bonding layer away from the substrate, and contains oriented liquid crystal, so that the incident light entering the liquid crystal layer can pass through the liquid crystal layer. and the wavelength of the reflected light changes with the change of the incident angle of the incident light; the functional device is accommodated in the accommodating space.

其中，所述贴合层为薄膜，材质可以为聚对苯二甲酸乙二醇酯、聚氯乙烯、热塑性聚氨酯弹性体橡胶中的至少一种。Wherein, the bonding layer is a film, and the material can be at least one of polyethylene terephthalate, polyvinyl chloride, and thermoplastic polyurethane elastomer rubber.

其中，所述液晶层设置于所述贴合层与所述功能器件之间，或设置于所述贴合层的远离所述功能器件的一侧。Wherein, the liquid crystal layer is arranged between the bonding layer and the functional device, or is arranged on a side of the bonding layer away from the functional device.

本申请提供一种电子设备，请参阅图1，在一实施方式中，电子设备包括壳体10及功能器件20。其中，该壳体10定义有容置空间11，功能器件20设置于该容置空间11内，该壳体10能够起到保护功能器件20(例如，主板、电池等)的作用。The present application provides an electronic device. Please refer to FIG. 1 . In one embodiment, the electronic device includes a casing 10 and a functional device 20 . The housing 10 defines an accommodating space 11, and the functional device 20 is disposed in the accommodating space 11. The housing 10 can protect the functional device 20 (eg, a motherboard, a battery, etc.).

具体地，电子设备可以是手机、平板电脑、笔记本电脑、智能手环、智能手表等，此处不做限定。Specifically, the electronic device may be a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, etc., which is not limited here.

请参阅图2，在一实施方式中，壳体10可以包括基体12及液晶层13，其中，液晶层13可设置于基体12的一侧。Referring to FIG. 2 , in one embodiment, the casing 10 may include a base body 12 and a liquid crystal layer 13 , wherein the liquid crystal layer 13 may be disposed on one side of the base body 12 .

其中，基体12的材质可以为玻璃、塑料等。本实施方式中，基体12的材质可以为聚碳酸酯(polycarbonate，PC)与聚甲基丙烯酸甲酯(polymethyl methacrylate，PMMA)的复合板材，具体可以为PC、PMMA颗粒通过共挤制成的复合板材，如图3所示，基体12可包括PC层121及PMMA层122。在一些应用场景当中，根据实际需求，基体12可由具有一定颜色的材料制成。The material of the base body 12 may be glass, plastic, or the like. In this embodiment, the material of the substrate 12 may be a composite sheet of polycarbonate (PC) and polymethyl methacrylate (PMMA), specifically a composite sheet made of PC and PMMA particles through co-extrusion. For the plate, as shown in FIG. 3 , the base 12 may include a PC layer 121 and a PMMA layer 122 . In some application scenarios, the base body 12 may be made of a material with a certain color according to actual requirements.

进一步地，基体12的厚度可以是0.5mm或0.64mm，从而满足电子设备轻薄化的需求。其中，PMMA层122的厚度可以为40-55μm，采用该厚度的PMMA层122，使得基体12及保护层17能够相互配合而满足壳体10的耐磨要求，同时，还能够降低在对基体12进行高压成型处理过程中以及电子设备跌落等情况下开裂的几率。具体地，PMMA层122的厚度可以为40μm、45μm、50μm、55μm等，此处不做具体限定。Further, the thickness of the base body 12 may be 0.5 mm or 0.64 mm, so as to meet the requirement of light and thin electronic devices. The thickness of the PMMA layer 122 can be 40-55 μm, and the PMMA layer 122 of this thickness can be used to make the base body 12 and the protective layer 17 cooperate with each other to meet the wear resistance requirements of the casing 10 , and at the same time, it can also reduce the wear resistance of the base body 12 . The chance of cracking during the high pressure forming process and when electronic equipment is dropped, for example. Specifically, the thickness of the PMMA layer 122 may be 40 μm, 45 μm, 50 μm, 55 μm, etc., which is not specifically limited here.

液晶层13包含有液晶，该液晶可以为胆甾相液晶，具体可以包括可聚合单体、向列相液晶、手性化合物、紫外光吸收剂、光引发剂等。The liquid crystal layer 13 contains liquid crystals, which may be cholesteric liquid crystals, and may specifically include polymerizable monomers, nematic liquid crystals, chiral compounds, ultraviolet light absorbers, photoinitiators, and the like.

本实施方式中的液晶层13中的液晶可包含经过取向的液晶，进入液晶层13的入射光能够被该经过取向的液晶反射，从而提高壳体10的亮度、光泽度；另一方面，该经过取向的液晶对光线进行反射后能够使反射光呈现一定的颜色，而且进入液晶层13的入射光，由经过取向的液晶反射后产生随入射光的入射角度的改变而具有不同波长的反射光，从而在用户的观察角度的不同时，所观察到的液晶层13所呈现的颜色会随观察角度的变化而发生红移或者蓝移，从而使得液晶层13具有炫彩效果。The liquid crystal in the liquid crystal layer 13 in this embodiment may include oriented liquid crystal, and the incident light entering the liquid crystal layer 13 can be reflected by the oriented liquid crystal, thereby improving the brightness and gloss of the housing 10; on the other hand, the After the oriented liquid crystal reflects the light, the reflected light can show a certain color, and the incident light entering the liquid crystal layer 13 is reflected by the oriented liquid crystal to generate reflected light with different wavelengths as the incident angle of the incident light changes. Therefore, when the user's viewing angle is different, the observed color of the liquid crystal layer 13 will undergo a red shift or a blue shift with the change of the viewing angle, so that the liquid crystal layer 13 has a dazzling effect.

具体地，上述由经过取向的液晶反射的反射光波长满足如下公式：λ＝2np sinθ，其中，λ为反射光的波长，n为液晶层的平均折射率，p为经过取向的液晶的螺距，θ为入射光与液晶层13表面间的夹角，即入射光的入射角度的余角，如图4所示。其中，经过取向的液晶能够根据对应的螺距p进行排列。随着用户观察角度的变化，进入用户眼睛的入射光的入射角度改变，θ发生变化，从而导致反射光波长λ也相应改变，从而改变反射光的颜色。Specifically, the wavelength of the reflected light reflected by the oriented liquid crystal satisfies the following formula: λ=2np sinθ, where λ is the wavelength of the reflected light, n is the average refractive index of the liquid crystal layer, p is the helical pitch of the oriented liquid crystal, θ is the angle between the incident light and the surface of the liquid crystal layer 13 , that is, the complementary angle of the incident angle of the incident light, as shown in FIG. 4 . The aligned liquid crystals can be arranged according to the corresponding helical pitch p. As the user's viewing angle changes, the incident angle of the incident light entering the user's eyes changes, and θ changes, resulting in a corresponding change in the wavelength λ of the reflected light, thereby changing the color of the reflected light.

具体地，液晶层13的厚度可以为2-3μm，例如2μm、2.5μm、3μm等，具体可根据实际需求进行选择。Specifically, the thickness of the liquid crystal layer 13 can be 2-3 μm, such as 2 μm, 2.5 μm, 3 μm, etc., which can be selected according to actual needs.

在一应用场景中，请参阅图5，液晶层13与基体12之间还可设置一贴合层19，该贴合层19可以为薄膜，材质可以为聚对苯二甲酸乙二醇酯(polyethylene terephthalate，PET)、聚氯乙烯(Polyvinyl chloride，PVC)、热塑性聚氨酯弹性体橡胶(Thermoplastic polyurethanes，TPU)等中的至少一种。In an application scenario, please refer to FIG. 5 , a bonding layer 19 can also be arranged between the liquid crystal layer 13 and the substrate 12 , the bonding layer 19 can be a film, and the material can be polyethylene terephthalate ( At least one of polyethylene terephthalate (PET), polyvinyl chloride (Polyvinyl chloride, PVC), thermoplastic polyurethane elastomer rubber (Thermoplastic polyurethanes, TPU) and the like.

其中，液晶层13可以直接形成在基体12或贴合层19上，还可以通过粘结剂粘接在基体12或贴合层19上，具体可以采用紫外光(ultraviolet，UV)固化树脂作为粘结剂进行粘接，当然，还可以采用其它粘结剂，此处不做限定。The liquid crystal layer 13 can be directly formed on the substrate 12 or the bonding layer 19, and can also be bonded to the substrate 12 or the bonding layer 19 through an adhesive. Specifically, an ultraviolet (ultraviolet, UV) curing resin can be used as the adhesive. The adhesive is used for bonding. Of course, other adhesives can also be used, which are not limited here.

在实际使用时，液晶层13可位于壳体10的朝向电子设备内部的功能器件20的一侧，即，液晶层13设置于功能器件20与贴合层19之间。此时，基体12及贴合层19的材质为具有一定透光率的材质，从而使得外界光线能够经基体12而进入液晶层13；当然，液晶层13也可位于壳体10的远离电子设备内部的功能器件20的一侧，即，液晶层13设置于贴合层19的远离功能器件20的一侧。此时，基体12及贴合层19的材质既可以为透光材质，也可以为不透光材质，具体可根据实际需求选择。In actual use, the liquid crystal layer 13 may be located on the side of the casing 10 facing the functional device 20 inside the electronic device, that is, the liquid crystal layer 13 is disposed between the functional device 20 and the bonding layer 19 . At this time, the material of the base body 12 and the bonding layer 19 is a material with a certain light transmittance, so that the external light can enter the liquid crystal layer 13 through the base body 12 ; of course, the liquid crystal layer 13 can also be located in the casing 10 away from the electronic device. One side of the inner functional device 20 , that is, the liquid crystal layer 13 is disposed on the side of the bonding layer 19 away from the functional device 20 . At this time, the material of the base body 12 and the bonding layer 19 can be either a light-transmitting material or an opaque material, which can be selected according to actual needs.

请参阅图6及图7，在一实施方式中，电子设备的壳体10还可包括反射层15，该反射层15可用于对入射的光线进行反射，从而能够进一步提高壳体10的亮度，使得壳体10能够随着用户观察角度的变化，呈现出高亮的炫彩效果。Referring to FIGS. 6 and 7 , in one embodiment, the housing 10 of the electronic device may further include a reflective layer 15 , and the reflective layer 15 may be used to reflect incident light, thereby further improving the brightness of the housing 10 . As a result, the casing 10 can present a bright colorful effect with the change of the viewing angle of the user.

本实施方式中，反射层15可以为金属膜层，材质可以为铟、锡中的至少一种，厚度可以为20-30nm，例如20nm、25nm、30nm等。该种反射层15的反射性强，增亮效果好，从而使得壳体10能够呈现出更加高亮的炫彩效果。In this embodiment, the reflective layer 15 may be a metal film layer, the material may be at least one of indium and tin, and the thickness may be 20-30 nm, such as 20 nm, 25 nm, 30 nm, and the like. The reflective layer 15 has strong reflectivity and good brightness enhancement effect, so that the casing 10 can present a brighter dazzling effect.

当然，在其它实施方式中，反射层15也可以为增透膜，材质可以为ZrO ₂、Nb ₂O ₅中的至少一种，厚度可以为40-80nm，例如40μm、50μm、60μm、70μm、80μm等。该种反射层15既具有一定的反射性也具有一定的增透效果，从而满足不同的使用需求。 Of course, in other embodiments, the reflective layer 15 can also be an anti-reflection film, the material can be at least one of ZrO ₂ and Nb ₂ O ₅ , and the thickness can be 40-80 nm, such as 40 μm, 50 μm, 60 μm, 70 μm, 80μm, etc. The reflective layer 15 has both a certain reflectivity and a certain anti-reflection effect, so as to meet different usage requirements.

在一个应用场景中，请参阅图6，反射层15可设置于液晶层13的远离基体 12的一侧，在实际使用时，液晶层13和反射层15可设置于基体12的朝向电子设备内部结构的一侧。In an application scenario, please refer to FIG. 6 , the reflective layer 15 can be arranged on the side of the liquid crystal layer 13 away from the substrate 12 , and in actual use, the liquid crystal layer 13 and the reflective layer 15 can be arranged on the side of the substrate 12 facing the inside of the electronic device side of the structure.

在另一个应用场景中，请参阅图7，与图5对应的壳体10相似，本应用场景中的基体12的朝向液晶层13的一侧设置有贴合层19，反射层15可设置于液晶层13与贴合层19之间。In another application scenario, please refer to FIG. 7 . Similar to the housing 10 corresponding to FIG. 5 , in this application scenario, the side of the substrate 12 facing the liquid crystal layer 13 is provided with a bonding layer 19 , and the reflective layer 15 can be provided on the side of the liquid crystal layer 13 . between the liquid crystal layer 13 and the bonding layer 19 .

进一步地，请参阅图8和图9，在一实施方式中，电子设备的壳体10还可以包括纹理层14、遮光层16及保护层17。Further, referring to FIGS. 8 and 9 , in one embodiment, the housing 10 of the electronic device may further include a texture layer 14 , a light shielding layer 16 and a protective layer 17 .

其中，纹理层14可设置于液晶层13及反射层15之间，且具有纹理图案，从而使得壳体10能够进一步呈现纹理效果。The texture layer 14 can be disposed between the liquid crystal layer 13 and the reflective layer 15 and has a texture pattern, so that the casing 10 can further exhibit a texture effect.

具体地，纹理层14的材质可以为UV固化胶，该纹理层14可以通过UV转印等方式形成。需要说明的是，若纹理层14太薄，则壳体10所呈现出的纹理效果较差，而若纹理层14太厚，则会使纹理层14更脆，从而降低附着力，提高壳体10跌落时开裂的风险，考虑到这些因素，本实施方式中，纹理层14的厚度可以为9-12μm，具体可以是9μm、10μm、11μm、12μm等。Specifically, the texture layer 14 can be made of UV curing glue, and the texture layer 14 can be formed by UV transfer printing or the like. It should be noted that if the texture layer 14 is too thin, the texture effect presented by the casing 10 will be poor, and if the texture layer 14 is too thick, the texture layer 14 will be more brittle, thereby reducing the adhesion and improving the casing. 10 Risk of cracking when dropped, considering these factors, in this embodiment, the thickness of the texture layer 14 may be 9-12 μm, specifically 9 μm, 10 μm, 11 μm, 12 μm, and the like.

遮光层16可设置于反射层15的远离纹理层14的一侧，可包括至少一层油墨层，具体地，如图10所示，遮光层16可以包括沿远离反射层15的方向依次排列的三层白色油墨层161和两层灰色油墨层162，或者还可以包括沿远离反射层15的方向依次排列的三层黑色油墨层和两层灰色油墨层，此处不做具体限定。其中，灰色油墨层能够起到遮光和脱模的作用。The light shielding layer 16 may be disposed on the side of the reflective layer 15 away from the textured layer 14 , and may include at least one ink layer. Specifically, as shown in FIG. Three layers of white ink layers 161 and two layers of gray ink layers 162, or may also include three layers of black ink layers and two layers of gray ink layers arranged in sequence along the direction away from the reflective layer 15, which are not specifically limited here. Among them, the gray ink layer can play the role of shading and mold release.

其中，各层油墨层可通过印刷的方式形成，且每层油墨层的厚度可以为5-8μm，例如5μm、6μm、7μm、8μm等，遮光层16的总厚度可以为25-40μm，例如25μm、30μm、35μm、40μm等。需要指出的是，相对于采用一次印刷的方式形成该遮光层16的方式，本实施方式中所形成的油墨层薄、附着力强、脆性低，从而能够提高壳体10的稳定性。Wherein, each ink layer can be formed by printing, and the thickness of each ink layer can be 5-8 μm, such as 5 μm, 6 μm, 7 μm, 8 μm, etc., and the total thickness of the light shielding layer 16 can be 25-40 μm, such as 25 μm , 30μm, 35μm, 40μm, etc. It should be noted that, compared with the method of forming the light shielding layer 16 by one-time printing, the ink layer formed in this embodiment is thin, has strong adhesion, and is low in brittleness, thereby improving the stability of the casing 10 .

保护层17可通过淋涂硬化液的方式形成，具体可淋涂UV体系的硬化液。本实施方式中，保护层17的厚度可以为6-9μm，如6μm、7μm、8μm、9μm等，该保护层17能够满足耐磨、耐划伤的要求，且电子设备的壳体10的硬度满足不小于铅笔硬度3H(1000gf)。The protective layer 17 can be formed by flow coating of a curing liquid, specifically, a curing liquid of a UV system can be flow coated. In this embodiment, the thickness of the protective layer 17 can be 6-9 μm, such as 6 μm, 7 μm, 8 μm, 9 μm, etc. The protective layer 17 can meet the requirements of wear resistance and scratch resistance, and the hardness of the housing 10 of the electronic device Satisfy not less than pencil hardness 3H (1000gf).

在一个应用场景中，请参阅图8，保护层17可设置于基体12的远离液晶层13的一侧。在实际使用时，液晶层13、纹理层14、反射层15、及遮光层16可设置于基体12的朝向电子设备内部结构的一侧，而保护层17则可设置于基体12的背离电子设备的内部结构的一侧。In an application scenario, please refer to FIG. 8 , the protective layer 17 may be disposed on the side of the substrate 12 away from the liquid crystal layer 13 . In actual use, the liquid crystal layer 13 , the texture layer 14 , the reflective layer 15 , and the light shielding layer 16 can be disposed on the side of the substrate 12 facing the internal structure of the electronic device, and the protective layer 17 can be disposed on the side of the substrate 12 away from the electronic device side of the internal structure.

在另一个应用场景中，请参阅图9，与图7对应的壳体10相似，本应用场景中的壳体10的基体12的朝向液晶层13的一侧设置有贴合层19，遮光层16设置于反射层15与贴合层19之间，保护层17可设置于液晶层13的远离基体12的一侧。在实际使用时，基体12一侧朝向电子设备的内部结构，保护层17一侧远离电子设备的内部结构设置。In another application scenario, please refer to FIG. 9 , similar to the casing 10 corresponding to FIG. 7 , in this application scenario, the side of the base 12 of the casing 10 facing the liquid crystal layer 13 is provided with a bonding layer 19 and a light shielding layer. 16 is disposed between the reflective layer 15 and the bonding layer 19 , and the protective layer 17 can be disposed on the side of the liquid crystal layer 13 away from the substrate 12 . In actual use, one side of the base body 12 faces the internal structure of the electronic device, and the side of the protective layer 17 is disposed away from the internal structure of the electronic device.

另外，本实施方式中，保护层17还可具有一定的透光率，从而使得外界光线能够经保护层17而进入其它结构层。In addition, in this embodiment, the protective layer 17 may also have a certain light transmittance, so that external light can enter other structural layers through the protective layer 17 .

需要指出的是，在相关技术当中，壳体10可以不包括上述的液晶层13，具体请参阅图11。It should be pointed out that, in the related art, the casing 10 may not include the above-mentioned liquid crystal layer 13 , please refer to FIG. 11 for details.

在一个应用场景中，采用德国BYK微型三角度光泽度仪分别测试图8对应的实施方式中的壳体A的表面光泽度以及图11对应的壳体B的光泽度，其中，壳体B除了不具有液晶层13之外，其它结构均与壳体A相同，所得到的测试结果如下表1所示：In an application scenario, the German BYK miniature triangular gloss meter is used to test the surface gloss of the shell A in the embodiment corresponding to FIG. 8 and the gloss of the shell B corresponding to FIG. 11 , wherein the shell B except the Except for not having the liquid crystal layer 13, other structures are the same as the case A, and the obtained test results are shown in Table 1 below:

表1光泽度测试结果(一)Table 1 Gloss test results (1)

从上表1中能够看出，本实施方式中具有液晶层13的壳体A相对于相关技术中不具有液晶层13的壳体B具有较高的光泽度，从而进一步说明本实施方式中液晶层13的设置能够提高壳体10的亮度、光泽度。It can be seen from the above Table 1 that the case A with the liquid crystal layer 13 in this embodiment has higher gloss than the case B without the liquid crystal layer 13 in the related art, which further illustrates the liquid crystal in this embodiment. The provision of the layer 13 can improve the brightness and gloss of the casing 10 .

进一步地，在一些实施方式中，壳体10还可包括颜色层，该颜色层可以通过喷涂、丝印、打印、胶印等工艺形成。其中，颜色层所呈现的颜色可根据实际需求进行选择，此处不做限定。Further, in some embodiments, the housing 10 may further include a color layer, and the color layer may be formed by spraying, silk screen printing, printing, offset printing and other processes. The color presented by the color layer can be selected according to actual needs, which is not limited here.

具体地，请参阅图12、13，在一实施方式中，该颜色层18可设置于液晶层13与纹理层14之间，厚度可以为9-13μm，具体如9μm、10μm、11μm、12μm、13μm等。12, 13, in one embodiment, the color layer 18 can be disposed between the liquid crystal layer 13 and the texture layer 14, and the thickness can be 9-13 μm, specifically 9 μm, 10 μm, 11 μm, 12 μm, 13μm, etc.

本实施方式中颜色层18的设置使得颜色层18所具有的颜色与液晶层13的颜色以及随角度变色的效果叠加，从而能够使得壳体10所呈现出的颜色更加丰富。The disposition of the color layer 18 in this embodiment makes the color of the color layer 18 superimpose with the color of the liquid crystal layer 13 and the effect of changing color with an angle, so that the color presented by the casing 10 can be more abundant.

需要指出的是，在一个应用场景中，如图12，基体12的远离保护层17的一侧沿远离基体12的方向依次设置液晶层13、颜色层18、纹理层14、反射层15及遮光层16。It should be pointed out that in an application scenario, as shown in FIG. 12 , the liquid crystal layer 13 , the color layer 18 , the texture layer 14 , the reflective layer 15 and the light shielding layer are sequentially arranged on the side of the substrate 12 away from the protective layer 17 along the direction away from the substrate 12 Layer 16.

在另一个应用场景中，如图13，贴合层19的远离基体12的一侧沿远离基体13的方向依次设置遮光层16、反射层15、纹理层14、颜色层18、液晶层13及保护层17。In another application scenario, as shown in FIG. 13 , a light shielding layer 16 , a reflective layer 15 , a texture layer 14 , a color layer 18 , a liquid crystal layer 13 and a color layer 18 are sequentially arranged on the side of the bonding layer 19 away from the substrate 12 along the direction away from the substrate 13 . protective layer 17.

另外，本实施方式中壳体10的其它结构如基体12、液晶层13、纹理层14、反射层15、遮光层16、保护层17及贴合层19可以与上述实施方式中的相同，相关详细内容请检阅上述实施方式，此处不再赘述。In addition, other structures of the casing 10 in this embodiment, such as the substrate 12 , the liquid crystal layer 13 , the texture layer 14 , the reflective layer 15 , the light shielding layer 16 , the protective layer 17 and the bonding layer 19 , can be the same as those in the above-mentioned embodiment, related to For details, please refer to the above-mentioned implementation manner, which will not be repeated here.

需要指出的是，在相关技术当中，壳体10可以不包括上述的液晶层13，具体请参阅图14。It should be pointed out that, in the related art, the casing 10 may not include the above-mentioned liquid crystal layer 13 , please refer to FIG. 14 for details.

在一个应用场景中，采用德国BYK微型三角度光泽度仪分别测试图12对应的实施方式中的壳体C的表面光泽度以及图14对应的壳体D的光泽度，其中，壳体D除了不具有液晶层13之外，其它结构均与壳体C相同，所得到的测试结果如下表2所示：In an application scenario, the German BYK miniature triangular gloss meter is used to test the surface gloss of the shell C in the embodiment corresponding to FIG. 12 and the gloss of the shell D corresponding to FIG. 14 , wherein the shell D except for Except for not having the liquid crystal layer 13, other structures are the same as the case C, and the obtained test results are shown in Table 2 below:

表2光泽度测试结果(二)Table 2 gloss test results (two)

从上表2中能够看出，本实施方式中具有液晶层13的壳体C相对于相关技术中不具有液晶层13的壳体D具有较高的光泽度，从而也体现了本实施方式中液晶层13的设置能够提高壳体10的亮度、光泽度。It can be seen from Table 2 above that the case C with the liquid crystal layer 13 in this embodiment has higher gloss than the case D without the liquid crystal layer 13 in the related art, which also reflects the The provision of the liquid crystal layer 13 can improve the brightness and gloss of the casing 10 .

当然，在其它实施方式中，壳体10也可以不包括上述实施方式中的纹理层14、遮光层15及保护层17，例如图15、16中的壳体结构，图15中，颜色层18设置于液晶层13与反射层15之间，图16中的壳体10进一步包括设置于基体12一侧的贴合层19，同样，颜色层18设置于液晶层13与反射层15之间。Of course, in other embodiments, the casing 10 may not include the texture layer 14 , the light shielding layer 15 and the protective layer 17 in the above embodiments, for example, the casing structure in FIGS. 15 and 16 , and the color layer 18 in FIG. 15 . Disposed between the liquid crystal layer 13 and the reflective layer 15 , the housing 10 in FIG. 16 further includes a bonding layer 19 disposed on one side of the substrate 12 .

请参阅图17、18，在又一实施方式中，颜色层18可设置于反射层15的远离纹理层14的一侧，并位于反射层15与遮光层16之间，厚度可以为9-13μm，具体如9μm、10μm、11μm、12μm、13μm等。Referring to FIGS. 17 and 18 , in another embodiment, the color layer 18 can be disposed on the side of the reflective layer 15 away from the texture layer 14 and between the reflective layer 15 and the light shielding layer 16 , and the thickness can be 9-13 μm , specifically 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, etc.

需要指出的是，本实施方式中的反射层15可与上述实施方式中的不同，具体可以为增透膜，材质可以为ZrO ₂、Nb ₂O ₅中的至少一种，厚度可以为40-80nm，例如40μm、50μm、60μm、70μm、80μm等。 It should be pointed out that the reflective layer 15 in this embodiment may be different from those in the above-mentioned embodiments, and specifically may be an anti-reflection film, the material may be at least one of ZrO ₂ and Nb ₂ O ₅ , and the thickness may be 40- 80nm, such as 40µm, 50µm, 60µm, 70µm, 80µm, etc.

本实施方式中，反射层15为增透膜，颜色层18位于反射膜远离基体12的一侧，进入颜色层18的光线依次透过反射层15、纹理层14、液晶层13、基体12以及保护层17从而进入用户的眼睛当中，从而使得壳体10所呈现出的颜色更加鲜艳、通透；进一步地，颜色层18配合液晶层13以及反射层15对光线的反射作用，从而能够使得壳体10更加鲜艳、通透、高亮。In this embodiment, the reflective layer 15 is an anti-reflection film, the color layer 18 is located on the side of the reflective film away from the substrate 12 , and the light entering the color layer 18 sequentially passes through the reflective layer 15 , the texture layer 14 , the liquid crystal layer 13 , the substrate 12 and the The protective layer 17 enters the eyes of the user, so that the color presented by the casing 10 is more vivid and transparent; further, the color layer 18 cooperates with the reflection of the light by the liquid crystal layer 13 and the reflective layer 15, so as to make the casing 10 more bright and transparent. Body 10 is more vivid, transparent and bright.

另外，在本实施方式的一个应用场景中，请参阅图17，基体12的远离保护层17的一侧沿远离基体12的方向依次设置液晶层13、纹理层14、反射层15、颜色层18及遮光层16。In addition, in an application scenario of this embodiment, please refer to FIG. 17 , the liquid crystal layer 13 , the texture layer 14 , the reflective layer 15 , and the color layer 18 are sequentially provided on the side of the substrate 12 away from the protective layer 17 along the direction away from the substrate 12 . and the light shielding layer 16 .

在另一个应用场景中，如图18，贴合层19的远离基体12的一侧沿远离基体12的方向依次设置遮光层16、颜色层18、反射层15、纹理层14、液晶层13及保护层17。In another application scenario, as shown in FIG. 18 , a light shielding layer 16 , a color layer 18 , a reflective layer 15 , a texture layer 14 , a liquid crystal layer 13 , and a light shielding layer 16 , a color layer 18 , a reflective layer 15 , a texture layer 14 , a liquid crystal layer 13 , and a protective layer 17.

另外，本实施方式中壳体10的其它结构如基体12、液晶层13、纹理层14、反射层15、遮光层16、保护层17及贴合层19也可以上述实施方式中的相同，相关详细内容请检阅上述实施方式，此处不再赘述。In addition, other structures of the casing 10 in this embodiment, such as the substrate 12 , the liquid crystal layer 13 , the texture layer 14 , the reflective layer 15 , the light shielding layer 16 , the protective layer 17 and the bonding layer 19 , can also be the same as those in the above-mentioned embodiment. For details, please refer to the above-mentioned implementation manner, which will not be repeated here.

需要指出的是，在相关技术当中，壳体10可以不包括上述的液晶层13，具体请参阅图19。It should be pointed out that, in the related art, the casing 10 may not include the above-mentioned liquid crystal layer 13 , please refer to FIG. 19 for details.

在一个应用场景中，采用德国BYK微型三角度光泽度仪分别测试图17对应的实施方式中的壳体E的表面光泽度以及图19对应的壳体F、壳体G的光泽度，其中，壳体F除了不具有液晶层13之外，其它结构均与壳体E相同，壳体G不具有液晶层13，且反射层15的厚度为280nm，其它结构均与壳体E相同，所得到的测试结果如下表3所示：In an application scenario, the German BYK miniature triangular gloss meter is used to test the surface gloss of the shell E in the embodiment corresponding to FIG. 17 and the gloss of the shell F and the shell G corresponding to FIG. 19 , wherein, The casing F has the same structure as the casing E except that it does not have the liquid crystal layer 13, the casing G does not have the liquid crystal layer 13, and the thickness of the reflective layer 15 is 280 nm, and other structures are the same as the casing E. The test results are shown in Table 3 below:

表3光泽度测试结果(三)Table 3 gloss test results (three)

从上表3中能够看出，本实施方式中具有液晶层13的壳体E相对于相关技术中不具有液晶层13而其它结构与本实施方式中的壳体E相同的壳体F，光泽度明显较高；而且本实施方式中壳体E的反射层15厚度满足40-80nm，能够达到与上述相关技术中的反射层15厚度280nm的壳体G相同的光泽度效果，从而能够说明本实施方式中液晶层13的设置能够提高壳体10的亮度、光泽度。As can be seen from Table 3 above, the case E with the liquid crystal layer 13 in this embodiment is more glossy than the case F in the related art that does not have the liquid crystal layer 13 but has the same structure as the case E in this embodiment. In addition, the thickness of the reflective layer 15 of the casing E in this embodiment satisfies 40-80 nm, which can achieve the same gloss effect as the casing G with the reflective layer 15 thickness of 280 nm in the above-mentioned related art. The arrangement of the liquid crystal layer 13 in the embodiment can improve the brightness and gloss of the casing 10 .

当然，在其它实施方式中，壳体10也可以不包括上述实施方式中的纹理层14、遮光层15及保护层17。请分别参阅图20、21，图20中，颜色层18设置于反射层15的远离液晶层13的一侧，图21中的壳体10进一步包括设置于基体12一侧的贴合层19，同样，颜色层18设置于反射层15的远离液晶层13的一侧。Of course, in other embodiments, the casing 10 may not include the texture layer 14 , the light shielding layer 15 and the protective layer 17 in the above-mentioned embodiments. Please refer to FIGS. 20 and 21 respectively. In FIG. 20 , the color layer 18 is disposed on the side of the reflective layer 15 away from the liquid crystal layer 13 , and the housing 10 in FIG. 21 further includes a bonding layer 19 disposed on one side of the substrate 12 , Likewise, the color layer 18 is disposed on the side of the reflective layer 15 away from the liquid crystal layer 13 .

其中，对于上述各实施方式中的包含有贴合层19的电子设备的壳体10，可先在贴合层19上形成各结构层，以形成一膜片结构，然后再通过模内注塑等方式在膜片结构上注塑形成基体12得到。当然，也可以通过其它方式形成，此处不做具体限定。Wherein, for the housing 10 of the electronic device including the lamination layer 19 in the above-mentioned embodiments, each structural layer can be formed on the lamination layer 19 first to form a membrane structure, and then through in-mold injection molding, etc. It is obtained by injection molding the base body 12 on the diaphragm structure. Of course, it can also be formed in other ways, which is not specifically limited here.

本申请还提供一种电子设备的壳体的制作方法。请参阅图22，在一实施方式中，该电子设备的壳体的制作方法可以包括：The present application also provides a manufacturing method of a casing of an electronic device. Referring to FIG. 22, in one embodiment, the manufacturing method of the casing of the electronic device may include:

步骤S10：提供一基体；及Step S10: providing a substrate; and

步骤S20：在基体上形成液晶层；Step S20: forming a liquid crystal layer on the substrate;

需要指出的是，本实施方式中的液晶层包含有经过取向的液晶，进入液晶层的入射光能够被该经过取向的液晶反射，从而提高壳体的亮度、光泽度；另一方面，该经过取向的液晶对光线进行反射后能够使反射光呈现一定的颜色，而且进入液晶层的入射光，由经过取向的液晶反射后产生随入射光的入射角度的改变而具有不同波长的反射光，从而在用户的观察角度不同时，所观察到的壳体所呈现的颜色会随观察角度的变化而发生红移或者蓝移，从而产生炫彩效果。It should be pointed out that the liquid crystal layer in this embodiment includes oriented liquid crystal, and the incident light entering the liquid crystal layer can be reflected by the oriented liquid crystal, thereby improving the brightness and gloss of the casing; The oriented liquid crystal can make the reflected light show a certain color after reflecting the light, and the incident light entering the liquid crystal layer is reflected by the oriented liquid crystal to produce reflected light with different wavelengths with the change of the incident angle of the incident light. When the viewing angle of the user is different, the observed color of the casing will undergo a red-shift or a blue-shift with the change of the viewing angle, thereby producing a dazzling effect.

如上所述，经过取向的液晶在光线的照射下能够呈现出主颜色，并随着观察角度的变化而出现色变的现象。需要指出的是，可以根据所需要的主颜色的不同而选择不同种类的液晶制作上述液晶层。As mentioned above, the oriented liquid crystal can present the main color under the irradiation of light, and the phenomenon of color change occurs with the change of the observation angle. It should be pointed out that different types of liquid crystals can be selected according to different main colors required to manufacture the above-mentioned liquid crystal layer.

具体地，可以根据实际需求而采用不同的方式在基体上形成液晶层。例如，可以先在基体上涂覆取向剂，然后将液晶进一步涂在取向剂上，或者也可以采用其它方式，此处不做具体限定。Specifically, the liquid crystal layer can be formed on the substrate in different ways according to actual requirements. For example, the alignment agent may be coated on the substrate first, and then the liquid crystal may be further coated on the alignment agent, or other methods may also be used, which are not specifically limited here.

需要指出的是，请参阅图23，在一实施方式中，上述在基体上形成液晶层的步骤S20可包括：It should be pointed out that, referring to FIG. 23 , in one embodiment, the above-mentioned step S20 of forming the liquid crystal layer on the substrate may include:

步骤S21：提供一承载膜；Step S21: providing a carrier film;

其中，该承载膜的材质可以为高分子材料，例如可以是PET。Wherein, the material of the carrier film may be a polymer material, such as PET.

步骤S22：在承载膜上依次涂覆液晶取向剂及液晶，以形成经过取向的液晶；及Step S22: sequentially coating a liquid crystal aligning agent and a liquid crystal on the carrier film to form an oriented liquid crystal; and

其中，取向剂可以为聚乙烯醇取向剂，涂覆厚度可小于1μm。液晶的成分可以根据所需要呈现的颜色等因素进行选择和确定，此处不做具体限定。Wherein, the alignment agent may be a polyvinyl alcohol alignment agent, and the coating thickness may be less than 1 μm. The composition of the liquid crystal can be selected and determined according to factors such as the color to be displayed, which is not specifically limited here.

步骤S23：将经过取向的液晶转移至基体上，以形成液晶层，其中，液晶层通过粘结层粘接在基体上。Step S23 : transferring the oriented liquid crystal to the substrate to form a liquid crystal layer, wherein the liquid crystal layer is bonded to the substrate through an adhesive layer.

其中，粘结层的材质可以为UV固化树脂，厚度可以为4-6μm，具体如4μm、5μm、6μm等，此处不做限定。Wherein, the material of the adhesive layer may be UV curable resin, and the thickness may be 4-6 μm, specifically 4 μm, 5 μm, 6 μm, etc., which are not limited here.

请参阅图24，步骤S23可包括：Referring to FIG. 24, step S23 may include:

步骤S231：利用卷涂机将紫外光固化树脂辊涂在经过取向的液晶与基体之间；Step S231: using a coil coater to roll-coat the UV-curable resin between the oriented liquid crystal and the substrate;

具体地，可以设置UV固化树脂槽，并利用刮刀将UV固化树脂刮到承载膜上的液晶上，再通过卷涂机将液晶覆盖在基体上。Specifically, a UV-curable resin tank can be provided, and a doctor blade can be used to scrape the UV-curable resin onto the liquid crystal on the carrier film, and then the liquid crystal can be covered on the substrate by a roll coater.

步骤S232：对经过辊涂后的紫外光固化树脂进行紫外光光照，使得紫外光固化树脂固化形成粘结层，以将经过取向的液晶粘接在基体上，形成液晶层；及Step S232: irradiating the UV-curable resin with UV light after the roller coating, so that the UV-curable resin is cured to form a bonding layer, so as to bond the oriented liquid crystal to the substrate to form a liquid crystal layer; and

本实施方式中可以采用汞灯对UV固化树脂进行光照，固化能量可以为100～1000mj/cm ²。当然，也可以采用其它方式进行照射，此处不做具体限定。 In this embodiment, a mercury lamp can be used to illuminate the UV-curable resin, and the curing energy can be 100-1000 mj/cm ² . Of course, other methods can also be used for irradiation, which is not specifically limited here.

步骤S233：去除承载膜。Step S233: removing the carrier film.

在基体上形成液晶层之后，直接将承载膜去除即可。After the liquid crystal layer is formed on the substrate, the carrier film can be removed directly.

进一步地，请参阅图25，电子设备的壳体的制作方法还可以包括：Further, referring to FIG. 25 , the manufacturing method of the housing of the electronic device may further include:

步骤S30：在液晶层的远离基体的一侧形成反射层；Step S30: forming a reflective layer on the side of the liquid crystal layer away from the substrate;

本实施方式中，反射层可以为金属膜层，可以通过磁控溅射或者蒸发镀等方式形成，材质可以为铟、锡中的至少一种，厚度可以为20-30nm，例如20nm、25nm、30nm等，或者也可以为增透膜，材质可以为ZrO ₂、Nb ₂O ₅中的至少一种，厚度可以为40-80nm，例如40μm、50μm、60μm、70μm、80μm等。该反射层可用于对经由基体及液晶层入射的光线进行反射。 In this embodiment, the reflective layer can be a metal film layer, which can be formed by magnetron sputtering or evaporation plating, the material can be at least one of indium and tin, and the thickness can be 20-30nm, such as 20nm, 25nm, 30nm, etc., or an anti-reflection film, the material can be at least one of ZrO ₂ and Nb ₂ O ₅ , and the thickness can be 40-80nm, such as 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, etc. The reflective layer can be used to reflect light incident through the substrate and the liquid crystal layer.

进一步地，请参阅图26，在一实施方式中，电子设备的壳体的制作方法除了包括上述步骤S10、S20、S30之外，还可以包括：Further, referring to FIG. 26 , in one embodiment, the manufacturing method of the casing of the electronic device may further include:

步骤S40：在液晶层的远离基体的一侧形成纹理层；Step S40: forming a texture layer on the side of the liquid crystal layer away from the substrate;

其中，纹理层可以采用UV胶形成，具体可通过UV转印的方式形成纹理层。Wherein, the texture layer can be formed by using UV glue, and specifically, the texture layer can be formed by means of UV transfer printing.

具体地，可以在纹理模板上涂布UV胶，然后将基体的形成有液晶层的一侧贴在母版上，挤压贴合后，利用紫外灯照射固化，具体可采用有机发光二极管(light emitting diode，LED)固化，必要时可加汞灯进行二次固化，固化后进一步将母版与基体分离，从而将具有纹理的UV胶保留在基体液晶层上，形成具有纹理图案的纹理层。Specifically, UV glue can be coated on the texture template, and then the side of the substrate on which the liquid crystal layer is formed is attached to the master. emitting diode, LED) curing, if necessary, a mercury lamp can be added for secondary curing, after curing, the master is further separated from the substrate, so that the textured UV glue is retained on the substrate liquid crystal layer to form a textured layer with a textured pattern.

步骤S50：在反射层的远离基体的一侧形成遮光层；Step S50: forming a light shielding layer on the side of the reflective layer away from the substrate;

其中，遮光层可包括单层油墨层或者多层油墨层，本实施方式中，可通过印刷的方式在反射层的远离基体的一侧沿远离基体的方向依次形成三层白色油墨层和两层灰色油墨层，或者三层黑色油墨层和两层灰色油墨层，此处不做具体限定。Wherein, the light-shielding layer may include a single-layer ink layer or a multi-layer ink layer. In this embodiment, three layers of white ink layers and two layers of white ink layers and two layers of white ink layers can be formed on the side of the reflective layer away from the substrate along the direction away from the substrate by printing. The gray ink layer, or three black ink layers and two gray ink layers, are not specifically limited here.

步骤S60：在形成遮光层后，对基体进行三维成型处理，以使得基体具有预设的三维形状；Step S60: after the light-shielding layer is formed, three-dimensional molding is performed on the base body, so that the base body has a preset three-dimensional shape;

其中，可以采用高压成型设备对基体进行3D高压成型，以使基体具有预设的弧度。Wherein, high pressure forming equipment can be used to perform 3D high pressure forming on the base body, so that the base body has a preset radian.

具体地，在对基体进行三维成型处理时，高压成型设备的红外加热温度可以为380℃，加热时间可以为36s±15s，气压可以为65kg±10kg，基体的PC层一侧下模温度可以为130～140℃，上模温度可以在110～120℃范围内，预成型时间可以为10～20s，吹起时间可以为5～10s，保压时间可以为10～20s。在实际操作过程中，可根据需求调整上述各参数。Specifically, when the substrate is three-dimensionally molded, the infrared heating temperature of the high-pressure molding equipment can be 380°C, the heating time can be 36s±15s, the air pressure can be 65kg±10kg, and the temperature of the lower mold on the PC layer side of the substrate can be 130～140℃, the upper mold temperature can be in the range of 110～120℃, the preforming time can be 10～20s, the blowing time can be 5～10s, and the holding time can be 10～20s. In the actual operation process, the above parameters can be adjusted according to the requirements.

步骤S70：在基体的远离液晶层的一侧形成保护层；及Step S70: forming a protective layer on the side of the substrate away from the liquid crystal layer; and

在基体经三维成型处理后，可通过淋涂硬化液的方式在基体的远离液晶层的一侧形成该保护层。After the substrate is subjected to three-dimensional shaping, the protective layer can be formed on the side of the substrate away from the liquid crystal layer by means of a flow coating of a hardening liquid.

其中，该硬化液可以为UV体系的硬化液，形成保护层后，所得到的壳体的表面硬度不低于3H的铅笔硬度，并能够起到抗磨、抗划伤的作用。Wherein, the hardening liquid can be a hardening liquid of UV system. After forming the protective layer, the surface hardness of the obtained shell is not lower than the pencil hardness of 3H, and can play the role of anti-wear and anti-scratch.

步骤S80：对基体进行精加工处理，以得到具有预设尺寸的电子设备的壳体。Step S80 : finishing the base body to obtain a casing of an electronic device having a preset size.

其中，在形成保护层后，可以采用数控机床对基体进行精加工处理，具体可根据每个电子设备的壳体的形状、尺寸等要求进行精加工，从而得到电子设备的壳体。Wherein, after the protective layer is formed, the base body can be finished by using a numerical control machine tool, and specifically can be finished according to the shape and size of the casing of each electronic device, so as to obtain the casing of the electronic device.

进一步地，在一实施方式中，在制作电子设备的壳体的过程中，还可以形成一颜色层。Further, in one embodiment, in the process of manufacturing the housing of the electronic device, a color layer may also be formed.

具体地，在另一实施方式中，电子设备的壳体的制作方法与前述的电子设备的壳体的制作方法实施方式相比，不同之处在于，在步骤S40之前，该制作方法还可以包括：在液晶层的远离基体的一侧形成颜色层。Specifically, in another embodiment, the difference between the method for manufacturing a casing of an electronic device and the foregoing method for manufacturing a casing for an electronic device is that, before step S40, the manufacturing method may further include: : A color layer is formed on the side of the liquid crystal layer away from the substrate.

其中，该颜色层可以通过喷涂、丝印、打印、胶印等工艺形成。其中，颜色层所呈现的颜色可根据实际需求进行选择，此处不做限定。Wherein, the color layer can be formed by spraying, screen printing, printing, offset printing and other processes. The color presented by the color layer can be selected according to actual needs, which is not limited here.

本实施方式中的反射层为金属膜层，材质为铟、锡中的至少一种，反射层的厚度为20-30nm，例如20nm、25nm、30nm等。该种反射层的反射性强，增亮效果好，从而使得壳体能够呈现出更加高亮的炫彩效果。In this embodiment, the reflective layer is a metal film layer, and the material is at least one of indium and tin, and the thickness of the reflective layer is 20-30 nm, such as 20 nm, 25 nm, 30 nm, and the like. The reflective layer has strong reflectivity and good brightening effect, so that the shell can present a brighter dazzling effect.

在另一实施方式中，电子设备的壳体的制作方法与前述的不包含颜色层的电子设备的壳体的制作方法实施方式相比，不同之处在于，在步骤S30之后，该制作方法还可以包括：在反射层的远离液晶层的一侧形成颜色层。In another embodiment, the difference between the method for fabricating a housing of an electronic device and the aforementioned embodiments of the method for fabricating a housing for an electronic device that does not include a color layer is that after step S30, the fabricating method further comprises: It may include: forming a color layer on a side of the reflective layer away from the liquid crystal layer.

其中，本实施方式中的颜色层与前一实施方式中的颜色可以相同。Wherein, the color layer in this embodiment can be the same as the color in the previous embodiment.

而且，本实施方式中的不同之处还在于，反射层可以为增透膜，反射层的厚度可以为40-80nm，例如40μm、50μm、60μm、70μm、80μm等，此处不做具体限定。Moreover, the difference in this embodiment is that the reflective layer can be an anti-reflection film, and the thickness of the reflective layer can be 40-80 nm, such as 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, etc., which is not specifically limited here.

上述本实施方式中并不限定各步骤的顺序，在实际应用时，可根据产品结构等需求选择合适的顺序制作。The above-mentioned present embodiment does not limit the order of each step. In practical application, an appropriate order can be selected for production according to requirements such as product structure.

需要指出的是，本申请上述电子设备的壳体的制作方法能够用于制作上述电子设备的壳体实施方式中未包含有贴合层的壳体，该制作方法中所涉及到的各层结构的位置、材质、尺寸、功能等可与本申请上述电子设备的壳体的实施方式中对应相同，相关详细内容请参阅上述实施方式，此处不再赘述。It should be pointed out that the above-mentioned manufacturing method of the casing of the electronic device of the present application can be used to manufacture the casing of the above-mentioned electronic device that does not include the bonding layer in the embodiment, and the structures of each layer involved in the manufacturing method The position, material, size, function, etc. of the electronic device can be the same as those in the above-mentioned embodiments of the housing of the electronic device of the present application. Please refer to the above-mentioned embodiments for relevant details, which will not be repeated here.

以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。The above are only the embodiments of the present application, and are not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied in other related technical fields, All are similarly included in the scope of patent protection of the present application.

Claims

一种电子设备的壳体，其特征在于，包括：A housing for an electronic device, comprising:

基体；及matrix; and

液晶层，设置于所述基体上，包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化。A liquid crystal layer, disposed on the substrate, contains oriented liquid crystals, so that incident light entering the liquid crystal layer can be reflected out of the liquid crystal, and the wavelength of the reflected light changes with the incident angle of the incident light and change.
根据权利要求1所述的电子设备的壳体，其特征在于，所述反射光的波长满足：λ＝2np sinθ，其中，λ为所述反射光的波长、n为所述液晶层的平均折射率，p为所述经过取向的液晶的螺距，θ为所述入射光的入射角度的余角。The housing of an electronic device according to claim 1, wherein the wavelength of the reflected light satisfies: λ=2np sinθ, wherein, λ is the wavelength of the reflected light, and n is the average refraction of the liquid crystal layer ratio, p is the helical pitch of the oriented liquid crystal, and θ is the complementary angle of the incident angle of the incident light.
根据权利要求1所述的电子设备的壳体，其特征在于，还包括：The housing of an electronic device according to claim 1, further comprising:

反射层，设置于所述液晶层的远离所述基体的一侧，或设置于所述液晶层的朝向所述基体的一侧，用于对入射的光线进行反射；a reflective layer, disposed on the side of the liquid crystal layer away from the substrate, or on the side of the liquid crystal layer facing the substrate, for reflecting incident light;

其中，在所述反射层设置于所述液晶层的朝向所述基体的一侧时，所述壳体还包括设置于所述基体的朝向所述反射层一侧的贴合层。Wherein, when the reflective layer is disposed on the side of the liquid crystal layer facing the substrate, the casing further includes a bonding layer disposed on the side of the substrate facing the reflective layer.
根据权利要求3所述的电子设备的壳体，其特征在于，所述反射层为金属膜层，材质为铟、锡中的至少一种，所述反射层的厚度为20-30nm。The housing of the electronic device according to claim 3, wherein the reflective layer is a metal film layer, and the material is at least one of indium and tin, and the thickness of the reflective layer is 20-30 nm.
根据权利要求4所述的电子设备的壳体，其特征在于，还包括：The housing of an electronic device according to claim 4, further comprising:

颜色层，设置于所述液晶层与所述反射层之间，厚度为9-13μm。The color layer is arranged between the liquid crystal layer and the reflection layer, and has a thickness of 9-13 μm.
根据权利要求3所述的电子设备的壳体，其特征在于，还包括：The housing of an electronic device according to claim 3, further comprising:

颜色层，设置于所述反射层的远离所述液晶层的一侧，厚度为9-13μm；The color layer is disposed on the side of the reflective layer away from the liquid crystal layer, and has a thickness of 9-13 μm;

其中，所述反射层为增透膜，材质为ZrO ₂、Nb ₂O ₅中的至少一种，所述反射层的厚度为40-80nm。 Wherein, the reflective layer is an anti-reflection film, the material is at least one of ZrO ₂ and Nb ₂ O ₅ , and the thickness of the reflective layer is 40-80 nm.
根据权利要求3所述的电子设备的壳体，其特征在于，还包括：The housing of an electronic device according to claim 3, further comprising:

纹理层，设置于所述液晶层与所述反射层之间，具有纹理图案；a texture layer, disposed between the liquid crystal layer and the reflective layer, with a texture pattern;

遮光层，设置于所述反射层的远离所述纹理层的一侧，包括至少一层油墨层；及a light-shielding layer, disposed on the side of the reflective layer away from the textured layer, comprising at least one ink layer; and

保护层，其中，在所述反射层设置于所述液晶层的远离所述基体的一侧时，所述保护层设置于所述基体的远离所述液晶层的一侧；在所述反射层设置于所述液晶层的朝向所述基体的一侧时，所述保护层设置于所述液晶层的远离所述基体的一侧。a protective layer, wherein when the reflective layer is arranged on the side of the liquid crystal layer away from the substrate, the protective layer is arranged on the side of the substrate away from the liquid crystal layer; on the reflective layer When disposed on the side of the liquid crystal layer facing the substrate, the protective layer is disposed on the side of the liquid crystal layer away from the substrate.
根据权利要求7所述的电子设备的壳体，其特征在于，所述纹理层的厚度为9-12μm，所述纹理层的材质为紫外光固化胶；The casing of the electronic device according to claim 7, wherein the thickness of the texture layer is 9-12 μm, and the material of the texture layer is ultraviolet curing glue;

所述遮光层包括沿远离所述反射层的方向依次设置的三层白色油墨层和两层灰色油墨层，每层油墨层的厚度为5-8μm，所述遮光层的厚度为25-40μm；The light-shielding layer comprises three layers of white ink layers and two layers of gray ink layers arranged in sequence along the direction away from the reflective layer, the thickness of each ink layer is 5-8 μm, and the thickness of the light-shielding layer is 25-40 μm;

所述保护层的厚度为6-9μm，所述壳体的硬度不小于铅笔硬度3H。The thickness of the protective layer is 6-9 μm, and the hardness of the shell is not less than the pencil hardness of 3H.
根据权利要求1所述的电子设备的壳体，其特征在于，所述液晶为胆甾相液晶，所述胆甾相液晶包括可聚合单体、向列相液晶、手性化合物、紫外光吸收剂、光引发剂，所述液晶层的厚度为2-3μm；The casing of an electronic device according to claim 1, wherein the liquid crystal is a cholesteric liquid crystal, and the cholesteric liquid crystal comprises a polymerizable monomer, a nematic liquid crystal, a chiral compound, and a UV-absorbing liquid crystal. agent and photoinitiator, the thickness of the liquid crystal layer is 2-3 μm;

所述基体的材质为聚碳酸酯、聚甲基丙烯酸甲酯的复合板材，包括聚碳酸酯层及聚甲基丙烯酸甲酯层，所述基体的厚度为0.5mm或0.64mm，所述聚甲基丙烯酸甲酯层的厚度为40-55μm。The material of the base body is a composite sheet of polycarbonate and polymethyl methacrylate, including a polycarbonate layer and a polymethyl methacrylate layer, the thickness of the base body is 0.5 mm or 0.64 mm, and the polymethyl methacrylate The thickness of the methyl methacrylate layer is 40-55 μm.
一种电子设备的壳体的制作方法，其特征在于，包括：A method for manufacturing a casing of an electronic device, comprising:

提供一基体；及provide a substrate; and

在所述基体上形成液晶层，其中，所述液晶层包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化。A liquid crystal layer is formed on the substrate, wherein the liquid crystal layer contains oriented liquid crystal, so that incident light entering the liquid crystal layer can be reflected out of the liquid crystal, and the wavelength of the reflected light varies with the incident light changes with the incident angle.
根据权利要求10所述的制作方法，其特征在于，在所述基体上形成液晶层的步骤，包括：The manufacturing method according to claim 10, wherein the step of forming a liquid crystal layer on the substrate comprises:

提供一承载膜；providing a carrier film;

在所述承载膜上依次涂覆液晶取向剂及液晶，以在所述承载膜上形成所述经过取向的液晶；及coating a liquid crystal aligning agent and a liquid crystal in sequence on the carrier film to form the oriented liquid crystal on the carrier film; and

将所述经过取向的液晶转移至所述基体上，以形成所述液晶层，其中，所述液晶层通过粘结层粘接在所述基体上。The oriented liquid crystal is transferred to the substrate to form the liquid crystal layer, wherein the liquid crystal layer is adhered to the substrate through an adhesive layer.
根据权利要求11所述的制作方法，其特征在于，所述承载膜的材质为聚对苯二甲酸乙二醇酯，所述粘结层的材质为紫外光固化树脂；The manufacturing method according to claim 11, wherein the material of the carrier film is polyethylene terephthalate, and the material of the adhesive layer is UV-curable resin;

将所述经过取向的液晶转移至所述基体上，并通过粘结层粘结在所述基体上，以形成所述液晶层的步骤，包括：The step of transferring the oriented liquid crystal to the substrate and adhering to the substrate through an adhesive layer to form the liquid crystal layer includes:

利用卷涂机将紫外光固化树脂辊涂在所述经过取向的液晶与所述基体之间；Using a coil coater to roll-coat the UV-curable resin between the oriented liquid crystal and the substrate;

对经过辊涂后的所述紫外光固化树脂进行紫外光光照，使得所述紫外光固化树脂固化形成所述粘结层，以将所述经过取向的液晶粘接在所述基体上，形成所述液晶层；及The UV-curable resin after roller coating is irradiated with UV light, so that the UV-curable resin is cured to form the adhesive layer, so as to bond the oriented liquid crystal on the substrate to form the adhesive layer. the liquid crystal layer; and

去除所述承载膜。Remove the carrier film.
根据权利要求10所述的制作方法，其特征在于，还包括：The manufacturing method of claim 10, further comprising:

在所述液晶层的远离所述基体的一侧形成反射层，其中，所述反射层用于对入射的光线进行反射。A reflective layer is formed on the side of the liquid crystal layer away from the substrate, wherein the reflective layer is used for reflecting incident light.
根据权利要求13所述的制作方法，其特征在于，所述反射层为金属膜层，材质为铟、锡中的至少一种，所述反射层的厚度为20-30nm。The manufacturing method according to claim 13, wherein the reflective layer is a metal film layer, the material is at least one of indium and tin, and the thickness of the reflective layer is 20-30 nm.
根据权利要求14所述的制作方法，其特征在于，在所述液晶层的远离所述基体的一侧形成反射层的步骤之前，所述制作方法还包括：The manufacturing method according to claim 14, wherein before the step of forming a reflective layer on the side of the liquid crystal layer away from the substrate, the manufacturing method further comprises:

在所述液晶层的远离所述基体的一侧形成颜色层，其中，所述颜色层的厚度为9-13μm。A color layer is formed on the side of the liquid crystal layer away from the substrate, wherein the thickness of the color layer is 9-13 μm.
根据权利要求13所述的制作方法，其特征在于，在所述液晶层的远离所述基体的一侧形成反射层的步骤之后，所述制作方法还包括：The manufacturing method according to claim 13, wherein after the step of forming a reflective layer on the side of the liquid crystal layer away from the substrate, the manufacturing method further comprises:

在所述反射层的远离所述基体的一侧形成颜色层，其中，所述颜色层的厚度为9-13μm；forming a color layer on the side of the reflective layer away from the substrate, wherein the thickness of the color layer is 9-13 μm;

其中，所述反射层为增透膜，所述反射层的厚度为40-80nm。Wherein, the reflective layer is an anti-reflection film, and the thickness of the reflective layer is 40-80 nm.
根据权利要求15或16所述的制作方法，其特征在于，所述制作方法还包括：The manufacturing method according to claim 15 or 16, wherein the manufacturing method further comprises:

对所述基体进行三维成型处理，以使得所述基体具有预设的三维形状；及performing a three-dimensional shaping process on the base body so that the base body has a predetermined three-dimensional shape; and

对所述基体进行精加工处理，以得到具有预设尺寸的电子设备的壳体。The base body is subjected to a finishing process to obtain a housing of an electronic device having a predetermined size.
一种电子设备，其特征在于，包括：An electronic device, comprising:

壳体，定义有容置空间，并包括：A shell, which defines an accommodation space, and includes:

基体；及matrix; and

贴合层，设置于所述基体的一侧；a bonding layer, arranged on one side of the base;

液晶层，设置于贴合层的远离所述基体的一侧，并包含经过取向的液晶，以使得进入所述液晶层的入射光能够经所述液晶反射而出，且反射光的波长随所述入射光的入射角度的改变而变化；The liquid crystal layer is arranged on the side of the bonding layer away from the substrate, and contains oriented liquid crystal, so that the incident light entering the liquid crystal layer can be reflected by the liquid crystal, and the wavelength of the reflected light varies with It varies with the change of the incident angle of the incident light;

功能器件，容置于所述容置空间内。The functional device is accommodated in the accommodating space.
根据权利要求18所述的电子设备，其特征在于，所述贴合层为薄膜，材质可以为聚对苯二甲酸乙二醇酯、聚氯乙烯、热塑性聚氨酯弹性体橡胶中的至少一种。The electronic device according to claim 18, wherein the bonding layer is a film, and the material can be at least one of polyethylene terephthalate, polyvinyl chloride, and thermoplastic polyurethane elastomer rubber.
根据权利要求18所述的电子设备，其特征在于，所述液晶层设置于所述贴合层与所述功能器件之间，或设置于所述贴合层的远离所述功能器件的一侧。The electronic device according to claim 18, wherein the liquid crystal layer is disposed between the bonding layer and the functional device, or is disposed on a side of the bonding layer away from the functional device .