WO2022006981A1 - 用于 lcp 基板的内层板结构及 lcp 基板 - Google Patents

用于 lcp 基板的内层板结构及 lcp 基板 Download PDF

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Publication number
WO2022006981A1
WO2022006981A1 PCT/CN2020/102722 CN2020102722W WO2022006981A1 WO 2022006981 A1 WO2022006981 A1 WO 2022006981A1 CN 2020102722 W CN2020102722 W CN 2020102722W WO 2022006981 A1 WO2022006981 A1 WO 2022006981A1
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WIPO (PCT)
Prior art keywords
board structure
layer board
lcp substrate
positioning portion
inner layer
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PCT/CN2020/102722
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English (en)
French (fr)
Inventor
陈康
陈勇利
韩佳明
阮桂祥
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瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022006981A1 publication Critical patent/WO2022006981A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present application relates to the technical field of circuit boards, and in particular, to an inner layer board for an LCP substrate and an LCP substrate.
  • LCP substrate As a kind of high frequency and high speed FPC, LCP substrate is widely used in the industry.
  • the LCP substrate is a multi-layer board, and the connection between the boards is mostly realized by high-temperature lamination without glue.
  • the inner layer board of the existing LCP substrate is usually etched with copper pads that are separated from the inner layer circuit, and at the same time, a window treatment is performed at the corresponding position of the outer layer board, so that the copper pads can be exposed from the outer layer board. Thereby, the positioning of the inner layer board and the outer layer board is realized.
  • the inner layer will melt due to the influence of high temperature, causing the inner layer circuit to be offset.
  • the independent setting of the copper pad and the inner layer circuit will cause the degree of offset between the two. This will cause dislocation between the copper pads and the inner layer circuit, which will affect the alignment accuracy of the inner layer board and the outer layer board, resulting in deviations in the positioning of the LCP substrate after lamination, and finally The performance of the LCP substrate is affected.
  • the present application discloses an inner-layer board structure for an LCP substrate and the LCP substrate, which are used to solve the problem of easy dislocation between the copper pads and the inner-layer circuit of the existing inner-layer board during the high-temperature lamination process .
  • an inner layer board structure for an LCP substrate including:
  • a base with a conductive layer on the base, and an inner layer circuit formed on the conductive layer;
  • the conductive layer is etched to expose the substrate, so that a positioning portion capable of exposing the substrate is formed on the conductive layer, and the conductive layer on the periphery of the positioning portion is connected to the inner layer circuit.
  • the cross-section of the positioning portion is circular.
  • the positioning portion is located at an edge of the base body.
  • a marking indication portion is further etched on the conductive layer for marking the positioning portion, so as to facilitate the identification of the positioning portion.
  • the marking indication portion is arranged around the positioning portion, and the marking indication portion has a structure adapted to the positioning portion.
  • an embodiment provides an LCP substrate including the inner layer board structure according to the first aspect of the present application.
  • an outer layer plate structure is further included, and the outer layer plate structure has a structure adapted to the inner layer plate structure.
  • the inner-layer board structure and the outer-layer board structure are both rectangular, and the positioning parts in the inner-layer board structure are arranged at four corners of the rectangle.
  • the outer layer board structure is provided with a window, and the window is disposed opposite to the positioning portion, so that the positioning portion can be exposed from the window.
  • the width of the LCP substrate is 250 mm
  • the length is 250 mm ⁇ 500 mm
  • the distance between the edge of the window and the edge of the LCP substrate is greater than 10 mm.
  • the beneficial effect of the present application is that: since the positioning part is directly formed by the conductive layer, and the positioning part is connected with the inner layer circuit, the deviation tendency of the positioning part and the inner layer circuit is converged when the inner layer board structure is pressed at a high temperature , so that the problem of affecting the alignment accuracy between the inner-layer board structure and the outer-layer board structure caused by the dislocation between the two can be improved, and the performance of the LCP substrate can be improved.
  • FIG. 1 shows a schematic structural diagram of an inner layer board structure provided according to an embodiment of the present application
  • FIG. 2 shows a schematic structural diagram of an outer layer plate structure provided according to an embodiment of the present application
  • FIG. 3 shows a schematic structural diagram of an LCP substrate provided in an embodiment of the present application in a high-temperature lamination process
  • FIG. 4 shows another schematic structural diagram of an LCP substrate provided in an embodiment of the present application during a high-temperature lamination process
  • the embodiments of the present application provide an LCP substrate.
  • the LCP substrate is improved in structure so that the alignment accuracy between multilayer boards can be improved during high temperature lamination, thereby improving the performance of the LCP substrate.
  • the number of layers of the LCP substrate can be determined according to requirements.
  • the following embodiments will be described by taking the double-layer plate structure as an example, but it should be understood that the related The technical means can be applied to LCP substrates with more layer structures without any obstacles.
  • the inner layer board structure 100 includes a base 110 , a conductive layer 120 is formed on the base 110 , the base 110 is formed of liquid crystal polymer, and the conductive layer 120 is made of conductive material formed, the conductive layer 120 is formed with inner layer lines for conducting electricity. Part of the conductive layer 120 is etched to expose the base body 110 , so that a positioning portion 130 capable of exposing the base body 110 is formed on the conductive layer 120 , and the positioning portion 130 is connected to the inner layer circuit.
  • the inner layer circuit on the base body 110 is formed of copper foil, so in actual design, the positioning portion 130 can be formed on the copper foil on the base body 110 .
  • the positioning portion 130 is directly formed of the conductive layer 120 and the positioning portion 130 is connected to the inner-layer circuit, the base 110 During the melting process, the positioning portion 130 and the inner layer circuit can be displaced in the same trend, and there will be no dislocation between the two, so that the impact of the dislocation between the inner layer board structure 100 and the outer layer can be improved.
  • the problem of alignment accuracy between the plate structures 200 can improve the performance of the LCP substrate.
  • the cross-section of the positioning portion 130 is circular, so that the structure of the positioning portion 130 itself will not change too much during the high-temperature pressing process, so that the high-temperature pressing process can always be guaranteed. positioning accuracy.
  • the positioning portion 130 may also adopt other structural forms, for example, its cross section may also be a square or a triangle.
  • the positioning portion 130 is disposed at the edge of the base body 110 , so that more space can be reserved for the inner layer circuit, and the structure of the positioning portion 130 itself can be prevented from being changed to a great extent.
  • the specific position of the positioning portion 130 relative to the base body 110 can be changed in various ways. Generally speaking, the distance between the positioning portion 130 and the edge of the base body 110 should not be less than 10 mm.
  • the LCP substrate as a whole, in addition to the positioning portion 130 , other pads or positioning points are generally provided on the base 110 , which may cause confusion and misidentification of the positioning portion 130 .
  • a marking indication part 140 is further etched on the base body 110 for marking the positioning part 130 so as to facilitate the identification of the positioning part 130 .
  • the marking indication part 140 and the positioning part 130 are in a matching relationship, and the area occupied by the two and the overall structure formed by the two can be sufficiently distinguished from other pads or positioning points, so it can facilitate the identification of the positioning part 130. effect.
  • the marking indication portion 140 should be set close to the positioning portion 130.
  • the marking indication portion 140 may surround the outer circumference of the positioning portion 130.
  • the formed external representations (such as the area occupied by the two, the overall structure formed by the two, etc., described above) undergo regular changes that can be captured or identified, and always retain the functions that are easy to identify.
  • the marking indicating part 130 can take various forms. For example, it can be designed following the positioning portion 130.
  • the marking indication portion 140 can also be configured with a circular cross-section, and in order to improve the For identification performance, there can be a plurality of marking indicating parts so that they can surround the outer circumference of the positioning part 130.
  • the marking indicating part 140 can also be configured to have an arc-shaped section, or even a roughly triangular section (as shown in FIG. 1 ). ), the purpose of surrounding the positioning portion 130 can also be achieved.
  • the marking indicating part 140 may also adopt other various structural forms, and the marking indicating part 140 and the positioning part 130 may have various structural combinations, which will not be described in detail herein.
  • the outer layer board structure 200 has a structure adapted to the inner layer board structure 100 .
  • fit refers to the fact that the outer-layer board structure 200 and the inner-layer board structure 100 can always fit together during the high-temperature lamination process, and the edge shapes can overlap, for example, when When the inner layer panel structure 100 is a rectangular structure (as shown in FIG. 1 ), the outer layer panel structure 200 should also be a rectangular structure (as shown in FIG. 2 ).
  • the inner-layer board structure 100 and the outer-layer board structure 200 do not necessarily have to be structurally matched, and various deformations can be made in the structure.
  • the area of the outer layer panel structure 200 may be larger than that of the inner layer panel structure 100, and the outer layer panel structure 200 may adopt a different structural form than the inner layer panel structure 100, for example, when the inner layer panel structure When 100 is a rectangle, the outer layer panel structure 200 may be a circular structure.
  • the LCP substrate has a rectangular structure as a whole.
  • the positioning portions 130 in the inner layer board structure 100 are disposed at the four corners of the rectangle, which is convenient for etching the positioning portions 130 and can also leave more space for the inner layer circuit.
  • the four corners can be opened with a window, so that each of the four corners is formed with a window 210 , and the window 210 needs to be opposite to the positioning portion 130 . It is arranged so that the positioning portion 130 can be exposed from the opening 210, and the alignment accuracy between the inner layer board structure 100 and the outer layer board structure 200 is ensured during the high temperature pressing process.
  • the opening 210 can be adapted to the structure of the positioning portion 130 , for example, when the cross-section of the positioning portion 130 is circular, the opening 210 can be designed as a circular hole.
  • the inner diameter of the opening should be larger than the outer diameter of the positioning portion 130 .
  • the radius of the positioning portion 130 is 0.2 mm ⁇ 1.0 mm, and the radius of the opening 210 may be 1.5 mm ⁇ 3.2 mm.
  • the arc radius of the marking indicating portion 130 may be 1.2 mm ⁇ 2.2 mm.
  • the alignment accuracy of the outer layer board structure 200 and the inner layer board structure 100 is high during the high temperature compression molding process of the LCP substrate, which is beneficial to To improve the performance of the LCP substrate, the production process of the LCP substrate will be described below with reference to Figures 1-4, and the above effects will be re-explained.
  • a base body 110 with a predetermined shape for example, a rectangle
  • the conductive layer 120 on the surface of the base body 100 is processed (eg, etching treatment) to form an inner layer circuit on the conductive layer.
  • a positioning portion 130 is formed on the substrate by etching, and the conductive layer portion of the positioning portion 130 is connected to the inner layer circuit to form the inner layer board structure 100 .
  • a corresponding material is used to make an outer layer board structure 200 that is structurally compatible with the inner layer board structure 100 , and at the same time, the outer layer board structure 200 is located at a position corresponding to the positioning portion 130 .
  • the outer layer board structure 200 is attached to the inner layer board structure 100 , so that the positioning portion 130 is exposed from the opening 210 ;
  • the inner-layer board structure 100 and the outer-layer board structure 200 are subjected to high-temperature lamination.
  • the positioning portion 130 on the inner-layer board structure 100 and the inner-layer circuit follow the same trend. Offset, there will be no positional deviation between the two, and the two will not be misaligned, and then the offset lines of the two are under control.
  • accurate process positioning can be performed, thereby improving the LCP substrate. performance.
  • the LCP substrate in this application includes the inner layer plate structure 100 and the outer layer plate structure 200.
  • the meanings of “inner” and “outer” here are defined based on the manufacturing process of the LCP substrate.
  • the outer layer board structure 200 needs to be placed outside the inner layer board structure 100 so that the positioning portion 130 can be seen through the opening window 210, so the outer layer board structure 200 at the near end of the line of sight is on the outside.
  • On the inside is the inner layer panel structure 100 at the far end of the line of sight.
  • the positional relationship between the inner layer panel structure 100 and the outer layer panel structure 200 should be flexibly understood.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本申请公开了一种用于LCP基板的内层板结构及LCP基板，该内层板结构包括基体，所述基体上具有导电层，所述导电层形成有内层线路，至少部分导电层被蚀刻后露出基体，从而在所述导电层上形成能够露出所述基体的定位部，所述定位部周缘的导电层与所述内层线路相连。本申请中的内层板结构在进行高温压合时，定位部和内层线路的偏移趋势趋同，从而能够改善由于两者之间错位而造成的影响内层板结构和外层板结构之间对位精度的问题，能够提高LCP基板的性能。

Description

用于LCP基板的内层板结构及LCP基板 技术领域
本申请涉及电路板技术领域，尤其涉及一种用于LCP基板的内层板及LCP基板。
 背景技术
随着5G通讯技术和毫米波技术的快速发展，高频高速FPC（柔性电路板）的需求量急剧上升。
 技术问题
LCP基板作为高频高速FPC的一种，在业内被广泛应用。LCP基板是一种多层板，板与板之间多采用无胶高温压合的方式实现连接。现有LCP基板的内层板上通常蚀刻有与内层线路独立分开的铜制焊盘，同时在外层板的相应位置处做开窗处理，使铜制焊盘能够从外层板上露出，从而实现内层板和外层板的定位。在无胶高温压合的过程中，受高温影响，内层板会发生熔融，使内层线路出现偏移，铜制焊盘和内层线路的独立设置的方式会造成两者的偏移程度不同，由此会造成铜制焊盘和内层线路之间出现错位，从而影响内层板和外层板的对位精度，导致压合后的LCP基板在制程定位时会出现偏差，最终使LCP基板的性能受到影响。
 技术解决方案
本申请公开了一种用于LCP基板的内层板结构及LCP基板，用于解决现有的内层板的铜制焊盘和内层线路之间在高温压合过程中容易出现错位的问题。
为此，根据第一方面，一种实施例中提供了一种用于LCP基板的内层板结构，包括：
基体，所述基体上具有导电层，所述导电层形成有内层线路；
其中，至少部分导电层被蚀刻后露出基体，从而在所述导电层上形成能够露出所述基体的定位部，所述定位部周缘的导电层与所述内层线路相连。
在所述内层板结构的一些实施例中，所述定位部的截面呈圆形。
在所述内层板结构的一些实施例中，所述定位部位于所述基体的边缘处。
在所述内层板结构的一些实施例中，在所述导电层上还蚀刻有标记指示部，用于标记所述定位部，从而便于识别所述定位部。
在所述内层板结构的一些实施例中，所述标记指示部环绕所述定位部设置，且所述标记指示部具有与所述定位部相适配的结构。
根据第二方面，一种实施例中提供了一种LCP基板，包括根据本申请第一方面所述的内层板结构。
在所述LCP基板的一些实施例中，还包括外层板结构，所述外层板结构具有与所述内层板结构相适配的结构。
在所述LCP基板的一些实施例中，所述内层板结构和所述外层板结构均为长方形，所述内层板结构中的定位部设置在所述长方形的四角点处。
在所述LCP基板的一些实施例中，所述外层板结构设有开窗，所述开窗与所述定位部相对设置，使所述定位部能够从所述开窗处露出。
在所述LCP基板的一些实施例中，所述LCP基板的宽度为250mm，长度为250mm~500mm，所述开窗的边缘与所述LCP基板的边缘之间的距离大于10mm。
 有益效果
本申请的有益效果在于：由于定位部直接由导电层形成，且该定位部与内层线路相连，使得该内层板结构在进行高温压合时，定位部和内层线路的偏移趋势趋同，从而能够改善由于两者之间错位而造成的影响内层板结构和外层板结构之间对位精度的问题，能够提高LCP基板的性能。
 附图说明
图1示出了根据本申请实施例所提供的一种内层板结构的结构示意图；
图2示出了根据本申请实施例所提供的一种外层板结构的结构示意图；
图3示出了根据本申请实施例所提供的LCP基板在高温压合过程中的一种结构示意图；
图4示出了根据本申请实施例所提供的LCP基板在高温压合过程中的另一种结构示意图
主要元件符号说明：
100-内层板结构；200-外层板结构；110-基体；120-导电层；130-定位部；140-标记指示部；210-开窗。
 本发明的实施方式
为进一步说明各实葹例，本申请提供有附图。这些附图为本申请揭露内容的一部分，其主要用以说明实施例，并可配合说明书的相关描述来解释实施例的运作原理。配合参考这些内容，本领域普通技术人员应能理解其他可能的实施方式以及本申请的优点。图中的组件并未按比例绘制，而类似的组件符号通常用来表示类似的组件。
下面结合附图和实施方式对本申请作进一步说明。
本申请实施例中提供了一种LCP基板，该LCP基板通过在结构上进行改进，使其在进行高温压合时，能够提升多层板之间的对位精度，从而提高LCP基板的性能。
需要说明的是，该LCP基板的层板数量可以根据需求而进行制定，为便利描述和理解，下文中的实施例将以双层板结构为例进行说明，但应当理解，下文所介绍的有关技术手段可以毫无障碍地应用在更多层结构的LCP基板中。
在一种实施例中，请参考图1，该内层板结构100包括基体110，在该基体110上具有导电层120，基体110是由液晶高分子聚合物形成的，导电层120由导电材料形成，该导电层120则形成有内层线路，用于导电。部分导电层120被蚀刻后露出基体110，从而在导电层120上形成能够露出基体110的定位部130，定位部130与内层线路相连。
一般而言，基体110上的内层线路是由铜箔形成的，因此在实际设计时，可将定位部130形成在基体110上的铜箔上。
在本申请实施例中，可以理解的是，当该内层板结构100参与高温压合时，由于定位部130直接由导电层120形成，且该定位部130与内层线路相连，在基体110熔融的过程中，定位部130和内层线路可以以相同的趋势偏移，两者之间不会出现错位，从而能够改善由于两者之间错位而造成的影响内层板结构100和外层板结构200之间对位精度的问题，能够提高LCP基板的性能。
在一种具体的实施例中，定位部130的截面呈圆形，使得在高温压合的过程中，该定位部130本身的结构不至于改变太多，由此能够始终保证高温压合过程中的定位精度。
在其他实施例中，定位部130还可以采用其他的结构形式，例如其截面还可以是方形或者三角形等。
在一种具体的实施例中，定位部130设置在基体110的边缘处，由此能够为内层线路留出更多的空间，还可以避免定位部130本身的结构发生较大程度的改变。
需要说明的是，定位部130相对于基体110的具***置可作出多种改变，一般而言，定位部130距离基体110边缘的距离不得小于10mm。
另一发面，针对LCP基板整体而言，除定位部130之外，基体110上一般还会设置其他多种焊盘或者定位点，由此可能会造成定位部130的混乱、误认。
对此，在一种具体的实施例中，在基体110上还蚀刻有标记指示部140，用于标记定位部130，从而便于识别定位部130。
可以理解的是，该标记指示部140和定位部130为配套设置关系，两者所占据的区域和形成的整体结构能够足够区分于其他焊盘或定位点，因此能够起到便于识别定位部130的作用。
需要说明的是，该标记指示部140宜靠近定位部130设置，例如该标记指示部140可以环绕在定位部130的外周，在高温压合的过程中，两者能够同步偏移，两者所形成的外在表征（例如前文中所介绍的两者所占据的区域、两者所形成的整体结构等）进行能够被捕捉或能够被识别的规律性变化，始终保留易于被识别的功能。
对于标记指示部130的具体结构而言，其可以采用多种形式。例如，其可以跟随定位部130进行设计，例如当定位部130采用前文实施例中的截面呈圆形时的定位部130时，该标记指示部140也可以构造成截面呈圆形，并且为了提高识别性能，标记指示部可以为多个，使其能够环绕在定位部130的外周，当然，该标记指示部140也可以构造成截面呈弧形，甚至是截面大致呈三角形（如图1所示），同样能够实现环绕定位部130的目的。
结合前文所述可知，当定位部130采用截面呈圆形，同时标记指示部140采用上述结构时，定位部130和标记指示部140在高温压合过程中本身的结构变化能够降到最低。
当然，标记指示部140还可以采用其他各种结构形式，同时标记指示部140和定位部130在结构上可以有多种组合方式，本文不一一展开描述。
在一种实施例中，请参考图2，外层板结构200具有与内层板结构100相适配的结构。
此处需要说明的是，“相适配”指的是，外层板结构200和内层板结构100在高温压合的过程中，两者能够始终贴合，且边缘形状能够重合，例如当内层板结构100是长方形结构时（如图1所示），该外层板结构200也应当是长方形结构（如图2所示）。
当然，内层板结构100和外层板结构200也并非必须在结构上相适配，两者在结构上可以做出多种变形。例如，在某些情况下，外层板结构200的面积可以大于内层板结构100的面积，同时外层板结构200可以采用不同于内层板结构100的结构形式，例如当内层板结构100是长方形时，外层板结构200可以是圆形结构。
便于理解，本文以内层板结构100和外层板结构200均为长方形为例进行说明，此时LCP基板在整体上呈现出长方形结构。
请参考图1，内层板结构100中的定位部130设置在长方形的四个角点处，便于蚀刻处定位部130，也能够为内层线路留出更多的空间。
对于外层板结构200而言，请参考图2，可以在其四个角点处进行开窗处理，使四个角点处各形成一个开窗210，该开窗210需要与定位部130相对设置，使定位部130能够从开窗210处露出，在高温压合的过程中，保证内层板结构100和外层板结构200之间的对位精度。
可以理解的是，该开窗210可以与定位部130的结构相适配，例如当定位部130的截面为圆形时，该开窗210可以被设计成圆形孔。另外，该开窗的内径应当大于定位部130的外径。
在一些具体的实施例中，定位部130的半径为0.2mm~1.0mm，开窗210的半径可以为1.5mm~3.2mm。在设置有标记指示部130的实施例中，当标记指示部130采用截面为弧形的结构时，标记指示部130的圆弧半径可以是1.2mm~2.2mm。
在一些具体的实施例中，LCP基板的宽度为250mm，长度为250mm~500mm，开窗210的边缘与LCP基板的边缘之间的距离大于10mm，在保证定位稳定性的同时，可以为LCP基板的内部线路留出更多的空间。
在本申请实施例中，由于对内层板结构100的结构进行改进，使得LCP基板在高温压合成型的过程中，外层板结构200和内层板结构100的对位精度高，有利于提升LCP基板的性能，下面将结合图1-4对LCP基板的生产过程进行说明，同时将对上述效果做出作出再次说明。
首先，请参考图1，取相应的材料制成具有预定形状的基体110（例如长方形），对该基体100表面的导电层120进行处理（如蚀刻处理），使导电层上形成内层线路，然后再通过蚀刻的方式在基体上形成定位部130，该定位部130的导电层部分与内层线路相连，形成内层板结构100。
接着，请参考图2，取相应的材料制成具有与内层板结构100在结构上相适配的外层板结构200，同时在该外层板结构200上对应于定位部130的位置处进行开窗处理，形成开窗210；
接着，请参考图3，将外层板结构200贴合到内层板结构100上，使定位部130从开窗210中露出；
最后，请参考图4，对内层板结构100和外层板结构200进行高温压合，在高温压合的过程中，内层板结构100上的定位部130和内层线路以相同的趋势进行偏移，两者之间不会出现位置偏差，两者不会错位，继而两者的偏移线路均在掌控之中，压合完成后，可进行精确的制程定位，从而提升LCP基板的性能。
需要说明的是，本申请中的LCP基板包括内层板结构100和外层板结构200，此处的“内”、“外”含义是基于LCP基板的制造工序而进行定义的，换言之，在高温压合过程中，需要将外层板结构200置于内层板结构100之外，以透过开窗210看到定位部130，因此处于外侧的是视线近端的外层板结构200，处于内侧的是视线远端的内层板结构100。
在其他更多场景中， 应当灵活理解内层板结构100和外层板结构200的位置关系。
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。

Claims (10)

  1. 用于LCP基板的内层板结构，其特征在于，包括：
    基体，所述基体上具有导电层，所述导电层形成有内层线路；
    其中，至少部分导电层被蚀刻后露出基体，从而在所述导电层上形成能够露出所述基体的定位部，所述定位部周缘的导电层与所述内层线路相连。
  2. 如权利要求1所述的用于LCP基板的内层板结构，其特征在于，所述定位部的截面呈圆形。
  3. 如权利要求1所述的用于LCP基板的内层板结构，其特征在于，所述定位部位于所述基体的边缘处。
  4. 如权利要求1-3中任一项所述的用于LCP基板的内层板结构，其特征在于，在所述导电层上还蚀刻有标记指示部，用于标记所述定位部，从而便于识别所述定位部。
  5. 如权利要求4所述的用于LCP基板的内层板结构，其特征在于，所述标记指示部环绕所述定位部设置，且所述标记指示部具有与所述定位部相适配的结构。
  6. LCP基板，其特征在于，包括如权利要求1-5中任一项所述的内层板结构。
  7. 如权利要求6所述的LCP基板，其特征在于，还包括外层板结构，所述外层板结构具有与所述内层板结构相适配的结构。
  8. 如权利要求7所述的LCP基板，其特征在于，所述内层板结构和所述外层板结构均为长方形，所述内层板结构中的定位部设置在所述长方形的四角点处。
  9. 如权利要求7所述的LCP基板，其特征在于，所述外层板结构设有开窗，所述开窗与所述定位部相对设置，使所述定位部能够从所述开窗处露出。
  10. 如权利要求9所述的LCP基板，其特征在于，所述LCP基板的宽度为250mm，长度为250mm~500mm，所述开窗的边缘与所述LCP基板的边缘之间的距离大于10mm。
PCT/CN2020/102722 2020-07-08 2020-07-17 用于 lcp 基板的内层板结构及 lcp 基板 WO2022006981A1 (zh)

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