WO2021258302A1 - 镜头模组及其制作方法 - Google Patents

镜头模组及其制作方法 Download PDF

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Publication number
WO2021258302A1
WO2021258302A1 PCT/CN2020/097798 CN2020097798W WO2021258302A1 WO 2021258302 A1 WO2021258302 A1 WO 2021258302A1 CN 2020097798 W CN2020097798 W CN 2020097798W WO 2021258302 A1 WO2021258302 A1 WO 2021258302A1
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WO
WIPO (PCT)
Prior art keywords
hole
mounting bracket
accommodating hole
substrate
width
Prior art date
Application number
PCT/CN2020/097798
Other languages
English (en)
French (fr)
Inventor
彭满芝
刘瑞武
李嘉禾
Original Assignee
宏启胜精密电子(秦皇岛)有限公司
鹏鼎控股(深圳)股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏启胜精密电子(秦皇岛)有限公司, 鹏鼎控股(深圳)股份有限公司 filed Critical 宏启胜精密电子(秦皇岛)有限公司
Priority to CN202080065036.1A priority Critical patent/CN114402582B/zh
Priority to PCT/CN2020/097798 priority patent/WO2021258302A1/zh
Priority to TW109122165A priority patent/TWI741665B/zh
Publication of WO2021258302A1 publication Critical patent/WO2021258302A1/zh
Priority to US17/717,334 priority patent/US11917278B2/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • This application relates to the field of cameras, and in particular to a lens module and a manufacturing method thereof.
  • An embodiment of the present application provides a lens module, including:
  • a substrate, the substrate is provided with a receiving hole
  • the photosensitive chip, the photosensitive chip is arranged on the substrate and opposite to the containing hole;
  • a mounting bracket the mounting bracket is arranged on the base plate, the mounting bracket is provided with a through hole, the inner wall of the through hole extends in the direction of the central axis of the through hole to form a carrier, and the mounting bracket is close to One side of the carrier extends outward to form a connecting portion, the mounting bracket surrounds the through hole to form a multilayer coil, a capacitor, and a resistor through LDS, and the coil is formed from the inside to the outside on the mounting bracket A multilayer wrap-around inductor surrounding the through hole;
  • a filter the filter is arranged on the carrier and accommodated in the through hole;
  • a lens the lens is installed in the through hole
  • the circuit board is connected to the mounting bracket through the connecting portion.
  • the number of layers of the coil is greater than 2, and the multiple layers of the coil are conducted through via holes.
  • the accommodating hole includes a first accommodating hole and a second accommodating hole communicating with the first accommodating hole, and the width of the first accommodating hole is smaller than the width of the second accommodating hole so as to A flange is formed in the substrate, and the photosensitive chip is disposed on the flange.
  • the width of the first accommodating hole is smaller than the width of the photosensitive chip
  • the width of the photosensitive chip is smaller than or equal to the width of the second accommodating hole
  • the second accommodating hole The depth of the hole is greater than or equal to the thickness of the photosensitive chip so that the photosensitive chip is arranged in the containing hole.
  • a pad is further provided on a side of the mounting bracket close to the substrate, and the pad is used to connect with the substrate.
  • the embodiment of the present application also provides a method for manufacturing a lens module, which includes the following steps:
  • the photosensitive chip is arranged on the substrate and is opposite to the receiving hole arranged on the substrate;
  • the mounting bracket is provided with a through hole, the inner wall of the through hole extends in the direction of the central axis of the through hole to form a carrier, and the side of the mounting bracket close to the carrier outwards Extend to form a connecting part, around the through hole to form a multilayer coil, capacitor and resistor through LDS, the coil is formed on the mounting bracket from the inside to the outside through the LDS technology to form a multilayer wrap around the through hole Inductance composition;
  • the circuit board is connected to the mounting bracket through the connecting portion.
  • the number of layers of the coil is greater than 2, and the multiple layers of the coil are conducted through via holes.
  • the accommodating hole includes a first accommodating hole and a second accommodating hole communicating with the first accommodating hole, and the width of the first accommodating hole is smaller than the width of the second accommodating hole so as to A flange is formed in the substrate, and the photosensitive chip is arranged on the flange.
  • the width of the first accommodating hole is smaller than the width of the photosensitive chip
  • the width of the photosensitive chip is smaller than or equal to the width of the second accommodating hole
  • the second accommodating hole The depth of the hole is greater than or equal to the thickness of the photosensitive chip so that the photosensitive chip is arranged in the containing hole.
  • a pad is further provided on a side of the mounting bracket close to the substrate, and the pad is used to connect with the substrate.
  • the above-mentioned lens module and the manufacturing method of the lens module form a connecting portion extending outward on the mounting bracket, and the circuit board is connected to the mounting bracket through the connecting portion, thereby reducing the height of the circuit board and realizing the thickness of the lens module
  • the direction is lowered, and the LDS technology is used to form a multi-layer coil around the through hole from the inside to the outside on the mounting bracket, as well as capacitors and resistors.
  • the multi-layer coil is connected through the via hole, which can realize the maximum line space on the mounting bracket. Utilization, thereby reducing the size of the mounting bracket.
  • Fig. 1 is a cross-sectional view of a substrate in an embodiment of the present application.
  • Fig. 2 is a cross-sectional view of a photosensitive chip provided on the substrate shown in Fig. 1.
  • Fig. 3 is a cross-sectional view of the mounting bracket in an embodiment of the present application.
  • FIG. 4 is a cross-sectional view of the filter and lens installed on the mounting bracket shown in FIG. 3.
  • FIG. 4 is a cross-sectional view of the filter and lens installed on the mounting bracket shown in FIG. 3.
  • Fig. 5 is a cross-sectional view of a circuit board in an embodiment of the present application.
  • Fig. 6 is a cross-sectional view of connecting the mounting bracket to the substrate.
  • Fig. 7 is a cross-sectional view of connecting the circuit board and the mounting bracket.
  • Fig. 8 is a three-dimensional schematic diagram of the mounting bracket in an embodiment of the present application.
  • FIG. 9 is a schematic diagram of the design of the capacitor of the mounting bracket in FIG. 8.
  • Fig. 10 is a schematic diagram of the design of the coil of the mounting bracket in Fig. 8.
  • Fig. 11 is a cross-sectional view of connecting the circuit board and the mounting bracket in another embodiment of the present application.
  • the first housing hole 111 The first housing hole 111
  • This application provides a lens module, including:
  • a substrate, the substrate is provided with a receiving hole
  • the photosensitive chip, the photosensitive chip is arranged on the substrate and opposite to the containing hole;
  • a mounting bracket the mounting bracket is arranged on the base plate, the mounting bracket is provided with a through hole, the inner wall of the through hole extends in the direction of the central axis of the through hole to form a carrier, and the mounting bracket is close to One side of the carrier extends outward to form a connecting portion, the mounting bracket surrounds the through hole to form a multilayer coil, a capacitor, and a resistor through LDS, and the coil is formed from the inside to the outside on the mounting bracket A multilayer wrap-around inductor surrounding the through hole is formed; the number of coil layers is greater than 2, and the multiple layers of the coil are conducted through the via hole;
  • a filter the filter is arranged on the carrier and accommodated in the through hole;
  • a lens the lens is installed in the through hole
  • the circuit board is connected to the mounting bracket through the connecting portion.
  • This application also provides a method for manufacturing a lens module, including the following steps:
  • the photosensitive chip is arranged on the substrate and is opposite to the receiving hole arranged on the substrate;
  • the mounting bracket is provided with a through hole, the inner wall of the through hole extends in the direction of the central axis of the through hole to form a carrier, and the side of the mounting bracket close to the carrier outwards Extend to form a connecting part, around the through hole to form a multilayer coil, capacitor and resistor through LDS, the coil is formed on the mounting bracket from the inside to the outside through the LDS technology to form a multilayer wrap around the through hole Inductance composition; the number of layers of the coil is greater than 2, and the multiple layers of the coil are conducted through vias;
  • the circuit board is connected to the mounting bracket through the connecting portion.
  • the above-mentioned lens module and the manufacturing method of the lens module form a connecting portion extending outward on the mounting bracket, and the circuit board is connected to the mounting bracket through the connecting portion, thereby reducing the height of the circuit board and realizing the thickness of the lens module
  • the direction is lowered, and the LDS technology is used to form a multi-layer coil around the through hole from the inside to the outside on the mounting bracket, as well as capacitors and resistors.
  • the multi-layer coil is connected through the via hole, which can realize the maximum line space on the mounting bracket. Utilization, thereby reducing the size of the mounting bracket.
  • An embodiment of the present application provides a lens module 100 applied to an electronic device (not shown).
  • the electronic device can be a smart phone or a tablet computer.
  • the lens module 100 includes a substrate 10, a photosensitive chip 20, a mounting bracket 30, a filter 40, a lens 50 and a circuit board 60.
  • the substrate 10 defines an accommodating hole 11 passing through the substrate 10.
  • the photosensitive chip 20 is disposed on the substrate 10 in a flip chip manner, and the photosensitive chip 20 is opposite to the receiving hole 11.
  • the substrate 10 may be a ceramic substrate or a rigid board.
  • the accommodating hole 11 is a stepped hole.
  • the accommodating hole 11 includes a first accommodating hole 111 and a second accommodating hole 112 connected to the first accommodating hole 111.
  • the width of the first accommodating hole 111 is smaller than the width of the second accommodating hole 112 to form a flange 12 in the substrate 10.
  • the photosensitive chip 20 is arranged on the flange 12 in a flip chip manner.
  • the width of the first receiving hole 111 is smaller than the width of the photosensitive chip 20, and the width of the photosensitive chip 20 is smaller than or equal to the width of the second receiving hole 112.
  • the depth of the second accommodating hole 112 is greater than or equal to the thickness of the photosensitive chip 20 so that the photosensitive chip 20 is disposed in the accommodating hole 11.
  • the photosensitive chip 20 is a complementary metal oxide semiconductor (CMOS) chip or a charge coupled device (CCD) chip.
  • CMOS complementary metal oxide semiconductor
  • CCD charge coupled device
  • the mounting bracket 30 is fixed on the substrate 10.
  • the mounting bracket 30 defines a through hole 31 passing through the mounting bracket 30.
  • the through hole 31 is opposite to the receiving hole 11.
  • the through hole 31 is close to the inner wall of the substrate 10 and extends in the direction of the central axis of the through hole 31 to form a carrier 32.
  • the filter 40 is fixed on the carrier 32 through a hollow glue layer and is accommodated in the through hole 31.
  • one side of the carrier 32 is that the mounting bracket 30 is arranged on the upper surface of the substrate 10, but it is not limited to this.
  • the rim 12 has a similar structure.
  • the mounting bracket 30 extends outward from a side close to the substrate 10 to form a connecting portion 33.
  • the connecting portion 33 is provided with solder pads 331 for soldering or contact connection with the circuit board 60 or other substrates.
  • the mounting bracket 30 is further provided with a pad 34 on a side close to the substrate 10.
  • the pad 34 is used to connect with the substrate 10 or other carrier boards.
  • the mounting bracket 30 is connected to the substrate 10 by means of Surface Mounted Technology (SMT) or ACF (anisotropic conductive film, anisotropic conductive film).
  • SMT Surface Mounted Technology
  • ACF anisotropic conductive film, anisotropic conductive film
  • the mounting bracket 30 is further provided with a coil 35, a capacitor 36 and a resistor 37 around the through hole 31.
  • the mounting bracket 30 is processed and formed by an LDS (Laser Direct Structuring) process.
  • LDS Laser Direct Structuring
  • the coil 35, the capacitor 36, the resistor 37, etc. are directly designed on the mounting bracket 30 by way of circuit design.
  • the LDS process is a 3D-MID (Three-dimensional molded interconnect device) production technology that combines injection molding, laser processing and electroplating processes.
  • 3D-MID Three-dimensional molded interconnect device
  • the shielding, antenna and other functions generated by the combination with the conductive circuit form the so-called 3D-MID, which is suitable for local thin circuit production.
  • the mounting bracket 30 is multi-layered (more than two layers) through the LDS process, and a multilayer wrap-around inductor is formed on the mounting bracket 30 from the inside to the outside to surround the through hole 31
  • the coil 35 is formed (FIG. 10). Specifically, through injection molding, laser processing and electroplating on the outside of the injection molded part to form a wrap-around inductor, then injection molding, and multiple operations to form a wrap-around inductor that communicates with the inner inductor can be achieved.
  • the coil 35 is directly formed in the mounting bracket 30.
  • the number of layers of the coil 35 is greater than two, and the multilayer wrap-around coil 35 is conducted through a via hole (not shown in the figure).
  • a capacitor 36 is formed on the side wall of the through hole 31 ( Figure 9).
  • a current-controlling resistor 37 is formed at a local position of the mounting bracket 30, such as a single-layer area resistance and a multi-layer area drill-through resistance. .
  • the filter 40 may be an infrared cut-off filter, and the infrared cut-off filter uses precision optical coating technology to alternately coat high-refractive-index optical films on the optical substrate to realize the visible light region (400-630nm) , Near-infrared (700-1100nm) cut-off optical filter.
  • the lens 50 is installed in the through hole 31 of the mounting bracket 30.
  • the lens 50 is opposite to the photosensitive chip 20.
  • the material of the lens 50 may be resin.
  • the circuit board 60 and the mounting bracket 30 are connected by a connecting portion 33.
  • the circuit board 60 can be a ceramic substrate, a flexible board, a rigid board, or a rigid-flex board.
  • the circuit board 60 can be connected by ACF (anisotropic conductive film), hot-press soldering (Hotbar), conductive paste soldering, surface mounting technology (Surface Mounted Technology, SMT), TCB, etc. It is connected with the connecting portion 33 so that the height of the entire lens module 100 is reduced.
  • ACF anisotropic conductive film
  • Hotbar hot-press soldering
  • SMT Surface Mounted Technology
  • the circuit board 60 is provided with a connector 61.
  • the connector 61 is attached to the circuit board 60 through Surface Mounted Technology (SMT).
  • SMT Surface Mounted Technology
  • the substrate 10, the photosensitive chip 20, the mounting bracket 30, the filter 40, and the lens 50 can also be used as an independent component.
  • the circuit board 60 or other products can be bonded by gold wire.
  • the connection method of (Wirbond) is connected to the connection part 33.
  • This application also provides a manufacturing method of the lens module 100, which includes the following steps:
  • Step one referring to FIG. 1, a substrate 10 is fabricated.
  • the substrate 10 defines an accommodating hole 11 penetrating the substrate 10.
  • the accommodating hole 11 is a stepped hole.
  • the accommodating hole 11 includes a first accommodating hole 111 and a second accommodating hole 112 connected to the first accommodating hole 111.
  • the width of the first accommodating hole 111 is smaller than the width of the second accommodating hole 112 to form a flange 12 on the substrate 10.
  • Step two referring to FIG. 2, a photosensitive chip 20 is provided, and the photosensitive chip 20 is arranged on the substrate 10 by means of flip chip.
  • the width of the first accommodating hole 111 is smaller than the width of the photosensitive chip 20
  • the width of the photosensitive chip 20 is smaller than or equal to the width of the second accommodating hole 112
  • the second accommodating hole The depth of 112 is greater than or equal to the thickness of the photosensitive chip 20.
  • the photosensitive chip 20 is arranged on the flange 12 in a flip chip manner, so that the photosensitive chip 20 is arranged in the receiving hole 11.
  • Step three referring to Figure 3, make a mounting bracket 30.
  • multilayer processing is performed through an LDS (Laser Direct Structuring) process to form a mounting bracket 30 having a structure such as a coil 35, a capacitor 36, and a resistor 37.
  • LDS Laser Direct Structuring
  • the mounting bracket 30 defines a through hole 31 passing through the mounting bracket 30.
  • the inner wall on one side of the through hole 31 extends in the direction of the central axis of the through hole 31 to form a carrier 32.
  • the mounting bracket 30 extends outward from a side close to the carrier 32 to form a connecting portion 33.
  • the connecting portion 33 is provided with solder pads 331 for soldering or contact connection with the circuit board 60 or other substrates.
  • the mounting bracket 30 is further provided with a pad 34 on a side close to the carrier 32. The pad 34 is used to connect with the substrate 10 or other carrier boards.
  • a multilayer wrap-around inductor is formed on the mounting bracket 30 around the through hole 31 from inside to outside to form the coil 35.
  • the capacitor 36 is formed on the sidewall of the through hole 31.
  • the resistor 37 is formed at a local position of the mounting bracket 30 according to design requirements.
  • Step four referring to FIG. 4, a filter 40 and a lens 50 are provided, and the filter 40 and the lens 50 are set on the mounting bracket 30.
  • the filter 40 is fixed on the carrier 32 and contained in the through hole 31 through a hollow glue layer.
  • the lens 50 is installed in the through hole 31 of the mounting bracket 30.
  • Step 5 referring to Fig. 5, make a circuit board 60.
  • the connector 61 is attached to the circuit board 60 by using surface mount technology (SMT).
  • SMT surface mount technology
  • Step 6 referring to FIG. 6, set the mounting bracket 30 on the substrate 10.
  • the pad 34 of the mounting bracket 30 is connected to the substrate 10 by means of Surface Mounted Technology (SMT) or ACF (anisotropic conductive film).
  • SMT Surface Mounted Technology
  • ACF anisotropic conductive film
  • Step 7 referring to FIG. 7, connect the circuit board 60 to the mounting bracket 30.
  • ACF anisotropic conductive film, anisotropic conductive film), hot-press soldering (Hotbar), conductive paste soldering, surface mount technology (Surface Mounted Technology, SMT) and TCB and other connection methods
  • the circuit board 60 is connected to the solder pad 331 of the connecting portion 33 of the mounting bracket 30.
  • a connecting portion 33 is formed extending outward on the mounting bracket 30, and the circuit board 60 is connected to the mounting bracket 30 through the connecting portion 33, thereby reducing
  • the height of the circuit board 60 can be reduced in the thickness direction of the lens module 100, and the mounting bracket 30 surrounds the through hole 31 to form a multilayer wrap-around inductor forming coil 35 from the inside to the outside on the mounting bracket 30.
  • the multilayer wrap-around coil 35 is conducted through the via hole, which can maximize the utilization of the line space on the mounting bracket 30, thereby reducing the size of the mounting bracket 30.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

一种镜头模组（100），包括：基板（10），所述基板（10）开设有容置孔（11）；感光芯片（20），所述感光芯片（20）设置于所述基板（10）上且与所述容置孔（11）相对；安装支架（30），所述安装支架（30）设置于所述基板（10）上，所述安装支架（30）开设有通孔（31），所述通孔（31）的内壁向所述通孔（31）的中轴线方向延伸而形成一载台（32），所述安装支架（30）靠近所述载台（32）的一侧向外延伸而形成一连接部（33），所述安装支架（30）围绕所述通孔（31）通过LDS形成多层线圈（35）、电容（36）及电阻（37），所述线圈（35）在所述安装支架（30）上由内至外形成环绕所述通孔（31）的多层环绕式电感构成；滤光片（40），所述滤光片（40）设置于所述载台（32）上且容置于所述通孔（31）中；镜头（50），所述镜头（50）安装于所述通孔（31）中；及电路板（60），所述电路板（60）通过所述连接部（33）与所述安装支架（30）连接。还公开了一种镜头模组（100）的制作方法。

Description

镜头模组及其制作方法 技术领域
本申请涉及摄像头领域，尤其涉及一种镜头模组及其制作方法。
背景技术
目前，市售的众多电子设备大多会安装摄像头实现拍照功能，随着时代的发展和手机全面屏技术的进步，对摄像头模组小型化的要求越来越高，目前现有的摄像头尺寸并不能满足时代及手机设计的需求。
发明内容
鉴于上述状况，有必要提供一种镜头模组及其制作方法。
本申请的实施例提供了一种镜头模组，包括：
基板，所述基板开设有容置孔；
感光芯片，所述感光芯片设置于所述基板上且与所述容置孔相对；
安装支架，所述安装支架设置于所述基板上，所述安装支架开设有通孔，所述通孔的内壁向所述通孔的中轴线方向延伸而形成一载台，所述安装支架靠近所述载台的一侧向外延伸而形成一连接部，所述安装支架围绕所述通孔通过LDS形成多层线圈、电容及电阻，所述线圈在所述安装支架上由内至外形成环绕所述通孔的多层环绕式电感构成；
滤光片，所述滤光片设置于所述载台上且容置于所述通孔中；
镜头，所述镜头安装于所述通孔中；及
电路板，所述电路板通过所述连接部与所述安装支架连接。
根据本申请的一些实施例，所述线圈层数大于2，多层所述线圈通过过孔导通。
根据本申请的一些实施例，所述容置孔包括第一容置孔及与其连通的第二容置孔，所述第一容置孔的宽度小于所述第二容置孔的宽度以在所述基板中形成一凸缘，所述感光芯片设置于所述凸缘上。
根据本申请的一些实施例，所述第一容置孔的宽度小于所述感光芯片的宽度，所述感光芯片的宽度小于或等于所述第二容置孔的宽度，所述第二容置孔的深度大于或等于所述感光芯片的厚度从而将所述感光芯片设置于所述容置孔中。
根据本申请的一些实施例，所述安装支架靠近所述基板的一面上还设有焊盘，所述焊盘用于与所述基板连接。
本申请的实施例还提供了一种镜头模组的制作方法，包括以下步骤：
将感光芯片设置于基板上且与设置在所述基板上的容置孔相对；
制作一安装支架，所述安装支架开设有通孔，所述通孔的内壁向所述通孔的中轴线方向延伸而形成一载台，所述安装支架靠近所述载台的一侧向外延伸而形成一连接部，围绕所述通孔通过LDS形成多层线圈、电容及电阻，所述线圈通过LDS技术在所述安装支架上由内至外形成环绕所述通孔的多层环绕式电感构成；
将滤光片设置于所述载台上且容置于所述通孔中，将镜头安装于所述通孔中；
将所述安装支架设置于所述基板上；
将电路板通过所述连接部与所述安装支架连接。
根据本申请的一些实施例，所述线圈层数大于2，多层所述线圈通过过孔导通。
根据本申请的一些实施例，所述容置孔包括第一容置孔及与其 连通的第二容置孔，所述第一容置孔的宽度小于所述第二容置孔的宽度以在所述基板中形成一凸缘，所述感光芯片设置于所述凸缘上。
根据本申请的一些实施例，所述第一容置孔的宽度小于所述感光芯片的宽度，所述感光芯片的宽度小于或等于所述第二容置孔的宽度，所述第二容置孔的深度大于或等于所述感光芯片的厚度从而将所述感光芯片设置于所述容置孔中。
根据本申请的一些实施例，所述安装支架靠近所述基板的一面上还设有焊盘，所述焊盘用于与所述基板连接。
上述镜头模组及镜头模组的制作方法通过在安装支架上向外延伸形成一连接部，将电路板通过连接部与所述安装支架连接，减少了电路板的高度，可实现镜头模组厚度方向的降低，并利用LDS技术在安装支架上由内至外形成多层围绕所述通孔的线圈，以及电容、电阻，多层线圈通过过孔导通，可实现安装支架上线路空间的最大化利用，从而减小安装支架的尺寸。
附图说明
图1是本申请的一个实施例中的基板的剖视图。
图2是在图1所示基板上设置感光芯片的剖视图。
图3是本申请的一个实施例中的安装支架的剖视图。
图4是在图3所示安装支架上设置滤光片及镜头的剖视图。
图5是本申请的一个实施例中的电路板的剖视图。
图6是将安装支架与基板连接的剖视图。
图7是将电路板与安装支架连接的剖视图。
图8是本申请的一个实施例中的安装支架的立体示意图。
图9是图8中安装支架的电容的设计示意图。
图10是图8中安装支架的线圈的设计示意图。
图11是本申请的另一个实施例中将电路板与安装支架连接的 剖视图。
主要元件符号说明：
镜头模组                    100
基板                        10
容置孔                      11
第一容置孔                  111
第二容置孔                  112
凸缘                        12
感光芯片                    20
安装支架                    30
通孔                        31
载台                        32
连接部                      33
焊垫                        331
焊盘                        34
线圈                        35
电容                        36
电阻                        37
滤光片                      40
镜头                        50
电路板                      60
连接器                      61
具体实施方式：
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是 本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。当一个元件被认为是“设置于”另一个元件，它可以是直接设置在另一个元件上或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本申请。本文所使用的术语“或/及”包括一个或多个相关的所列项目的任意的和所有的组合。
本申请提供一种镜头模组，包括：
基板，所述基板开设有容置孔；
感光芯片，所述感光芯片设置于所述基板上且与所述容置孔相对；
安装支架，所述安装支架设置于所述基板上，所述安装支架开设有通孔，所述通孔的内壁向所述通孔的中轴线方向延伸而形成一载台，所述安装支架靠近所述载台的一侧向外延伸而形成一连接部，所述安装支架围绕所述通孔通过LDS形成多层线圈、电容及电阻，所述线圈在所述安装支架上由内至外形成环绕所述通孔的多层环绕式电感构成；所述线圈层数大于2，多层所述线圈通过过孔导通；
滤光片，所述滤光片设置于所述载台上且容置于所述通孔中；
镜头，所述镜头安装于所述通孔中；及
电路板，所述电路板通过所述连接部与所述安装支架连接。
本申请还提供一种镜头模组的制作方法，包括以下步骤：
将感光芯片设置于基板上且与设置在所述基板上的容置孔相对；
制作一安装支架，所述安装支架开设有通孔，所述通孔的内壁向所述通孔的中轴线方向延伸而形成一载台，所述安装支架靠近所述载台的一侧向外延伸而形成一连接部，围绕所述通孔通过LDS形成多层线圈、电容及电阻，所述线圈通过LDS技术在所述安装支架上由内至外形成环绕所述通孔的多层环绕式电感构成；所述线圈层数大于2，多层所述线圈通过过孔导通；
将滤光片设置于所述载台上且容置于所述通孔中，将镜头安装于所述通孔中；
将所述安装支架设置于所述基板上；
将电路板通过所述连接部与所述安装支架连接。
上述镜头模组及镜头模组的制作方法通过在安装支架上向外延伸形成一连接部，将电路板通过连接部与所述安装支架连接，减少了电路板的高度，可实现镜头模组厚度方向的降低，并利用LDS技术在安装支架上由内至外形成多层围绕所述通孔的线圈，以及电容、电阻，多层线圈通过过孔导通，可实现安装支架上线路空间的最大化利用，从而减小安装支架的尺寸。
请同时参阅图1至图7，本申请的一实施方式提供一种镜头模组100，其应用于一电子装置(图未示)中。所述电子装置可为一智能手机或一平板电脑等。所述镜头模组100包括一基板10、一感光芯片20、一安装支架30、一滤光片40、一镜头50及一电路板60。
所述基板10中开设有一贯穿所述基板10的容置孔11。所述感光芯片20通过倒装芯片(Flip chip)的方式设置于所述基板10上，且所述感光芯片20与所述容置孔11相对。
所述基板10可为陶瓷基板或硬板。
所述容置孔11为一台阶孔。所述容置孔11包括第一容置孔111及与其连通的第二容置孔112。所述第一容置孔111的宽度小于所述第二容置孔112的宽度以在所述基板10中形成一凸缘12。
所述感光芯片20通过倒装芯片(Flip chip)的方式设置于所述凸缘12上。所述第一容置孔111的宽度小于所述感光芯片20的宽度，所述感光芯片20的宽度小于或等于所述第二容置孔112的宽度。
所述第二容置孔112的深度大于或等于所述感光芯片20的厚度从而将所述感光芯片20设置于所述容置孔11中。
其中，所述感光芯片20为互补金属氧化物半导体(CMOS)芯片或电荷耦合元件(CCD)芯片。
所述安装支架30固定于所述基板10上。所述安装支架30开设有一贯穿所述安装支架30的通孔31。所述通孔31与所述容置孔11相对。所述通孔31靠近所述基板10的内壁向所述通孔31的中轴线方向延伸而形成一载台32。所述滤光片40通过一中空的胶层固定于所述载台32上且容置于所述通孔31中。本实施例中，所述载台32一侧为所述安装支架30设置于所述基板10上表面，但不限于此，所述载台32还可设置成与所述基板10上所述凸缘12相似的结构。
所述安装支架30靠近所述基板10的一侧向外延伸而形成一连接部33。所述连接部33上设有用于与电路板60或其他基板焊接或接触连接的焊垫331。
所述安装支架30靠近所述基板10的一面上还设有焊盘34。所述焊盘34用于与所述基板10或其他载板连接。
在一些实施例中，所述安装支架30通过表面贴装技术(Surface Mounted Technology，SMT)或ACF(anisotropic conductive film，异方性导电胶膜)等方式与所述基板10连接。
所述安装支架30围绕所述通孔31还设有线圈35、电容36及 电阻37。
具体地，所述安装支架30通过LDS(Laser Direct Structuring，激光直接成型)工艺加工形成。将线圈35、电容36及电阻37等通过电路设计的方式直接设计在安装支架30上面。
LDS工艺是一种注塑、激光加工与电镀工艺相结合的3D-MID(Three-dimensional molded interconnect device)生产技术，其原理是将普通的塑胶元件赋予电气互连功能，使塑料壳体、结构件除支撑、防护等功能外，与导电电路结合而产生的屏蔽、天线等功能，形成所谓3D-MID，适用于局部细线路制作。
请一并参阅如图8至图10，所述安装支架30通过LDS工艺，进行多层设计(大于两层)，在安装支架30上由内至外形成环绕通孔31的多层环绕式电感构成线圈35(图10)。具体地，通过注塑，并在注塑件外侧经过激光加工与电镀形成一层环绕式电感，再进行注塑，及形成与内层电感相互导通的一层环绕式电感的多次操作，即可实现在安装支架30中直接形成线圈35。所述线圈35层数大于2，多层环绕式线圈35通过过孔导通(图未示)。并且在通孔31的侧壁上形成电容36(图9)，根据设计需要，在安装支架30的局部位置形成控制电流的电阻37，如单层区域电阻及多层区域钻孔导通式电阻。
所述滤光片40可为一红外截止滤光片，所述红外截止滤光片是利用精密光学镀膜技术在光学基片上交替镀上高折射率的光学膜，实现可见光区(400-630nm)、近红外(700-1100nm)截止的光学滤光片。
所述镜头50安装于所述安装支架30的所述通孔31中。所述镜头50与所述感光芯片20相对。
所述镜头50的材质可为树脂。
所述电路板60与所述安装支架30通过连接部33连接。所述电 路板60可为陶瓷基板、软板、硬板或软硬结合板。
所述电路板60可通过ACF(anisotropic conductive film，异方性导电胶膜)、热压熔锡焊接(Hotbar)、导电膏焊接、表面贴装技术(Surface Mounted Technology，SMT)及TCB等连接方式与连接部33连接，使得整个镜头模组100的高度减小。
所述电路板60上设置有连接器61。所述连接器61通过表面贴装技术(Surface Mounted Technology，SMT)贴设于所述电路板60上。
如图11所示，所述基板10、感光芯片20、安装支架30、滤光片40及镜头50还可作为一独立的组件进行使用，所述电路板60或其他产品可通过金线键合(Wirbond)的连接方式与连接部33连接。
本申请还提供一种镜头模组100之制作方法，其包括以下步骤：
步骤一，请参阅图1，制作一基板10。
具体地，所述基板10中开设有一贯穿所述基板10的容置孔11。所述容置孔11为一台阶孔。所述容置孔11包括第一容置孔111及与其连通的第二容置孔112。所述第一容置孔111的宽度小于所述第二容置孔112的宽度以在所述基板10上形成一凸缘12。
步骤二，请参阅图2，提供一感光芯片20，通过倒装芯片(Flip chip)的方式将感光芯片20设置于所述基板10上。
具体地，所述第一容置孔111的宽度小于所述感光芯片20的宽度，所述感光芯片20的宽度小于或等于所述第二容置孔112的宽度，所述第二容置孔112的深度大于或等于所述感光芯片20的厚度。将所述感光芯片20通过倒装芯片的方式设置于所述凸缘12上，从而将所述感光芯片20设置于所述容置孔11中。
步骤三，请参阅图3，制作一安装支架30。
具体地，通过LDS(Laser Direct Structuring，激光直接成型) 工艺进行多层加工，形成具有线圈35、电容36及电阻37等结构的安装支架30。
所述安装支架30开设有一贯穿所述安装支架30的通孔31。所述通孔31一侧的内壁向所述通孔31的中轴线方向延伸而形成一载台32。所述安装支架30靠近所述载台32的一侧向外延伸而形成一连接部33。所述连接部33上设有用于与电路板60或其他基板焊接或接触连接的焊垫331。所述安装支架30靠近所述载台32的一面上还设有焊盘34。所述焊盘34用于与所述基板10或其他载板连接。
多层环绕式电感由内至***绕所述通孔31形成于安装支架30上构成所述线圈35。所述电容36形成于所述通孔31的侧壁上。所述电阻37根据设计需要形成于安装支架30的局部位置。
步骤四，请参阅图4，提供一滤光片40及镜头50，将滤光片40及镜头50设置于所述安装支架30上。
具体地，通过一中空的胶层将所述滤光片40固定于所述载台32上且容置于所述通孔31中。将所述镜头50安装于所述安装支架30的所述通孔31中。
步骤五，请参阅图5，制作一电路板60。
通过表面贴装技术(Surface Mounted Technology，SMT)将连接器61贴设于所述电路板60上。
步骤六，请参阅图6，将安装支架30设置于所述基板10上。
具体地，通过表面贴装技术(Surface Mounted Technology，SMT)或ACF(anisotropic conductive film，异方性导电胶膜)等方式将所述安装支架30的焊盘34与所述基板10连接。
步骤七，请参阅图7，将所述电路板60与所述安装支架30连接。
具体地，通过ACF(anisotropic conductive film，异方性导电胶膜)、热压熔锡焊接(Hotbar)、导电膏焊接、表面贴装技术(Surface  Mounted Technology，SMT)及TCB等连接方式将所述电路板60与所述安装支架30的连接部33的焊垫331连接。
本申请提供的镜头模组100及镜头模组100的制作方法，通过在安装支架30上向外延伸形成一连接部33，将电路板60通过连接部33与所述安装支架30连接，减少了电路板60的高度，可实现镜头模组100厚度方向的降低，并通过LDS在安装支架30上围绕所述通孔31由内至外形成环绕通孔31的多层环绕式电感构成线圈35，以及电容36、电阻37，多层环绕式线圈35通过过孔导通，可实现安装支架30上线路空间的最大化利用，从而减小安装支架30的尺寸。
以上实施方式仅用以说明本申请的技术方案而非限制，尽管参照以上较佳实施方式对本申请进行了详细说明，本领域的普通技术人员应当理解，可以对本申请的技术方案进行修改或等同替换都不应脱离本申请技术方案的精神和范围。

Claims (10)

  1. 一种镜头模组，包括：
    基板，所述基板开设有容置孔；
    感光芯片，所述感光芯片设置于所述基板上且与所述容置孔相对；
    安装支架，所述安装支架设置于所述基板上，所述安装支架开设有通孔，所述通孔的内壁向所述通孔的中轴线方向延伸而形成一载台，所述安装支架靠近所述载台的一侧向外延伸而形成一连接部，所述安装支架围绕所述通孔通过LDS形成多层线圈、电容及电阻，所述线圈在所述安装支架上由内至外形成环绕所述通孔的多层环绕式电感构成；
    滤光片，所述滤光片设置于所述载台上且容置于所述通孔中；
    镜头，所述镜头安装于所述通孔中；及
    电路板，所述电路板通过所述连接部与所述安装支架连接。
  2. 如权利要求1所述的镜头模组，其特征在于：所述线圈层数大于2，多层所述线圈通过过孔导通。
  3. 如权利要求1所述的镜头模组，其特征在于：所述容置孔包括第一容置孔及与其连通的第二容置孔，所述第一容置孔的宽度小于所述第二容置孔的宽度以在所述基板中形成一凸缘，所述感光芯片设置于所述凸缘上。
  4. 如权利要求3所述的镜头模组，其特征在于：所述第一容置孔的宽度小于所述感光芯片的宽度，所述感光芯片的宽度小于或等于所述第二容置孔的宽度，所述第二容置孔的深度大于或等于所述感光芯片的厚度从而将所述感光芯片设置于所述容置孔中。
  5. 如权利要求1所述的镜头模组，其特征在于：所述安装支架靠近所述基板的一面上还设有焊盘，所述焊盘用于与所述基板连接。
  6. 一种镜头模组的制作方法，包括以下步骤：
    将感光芯片设置于基板上且与设置在所述基板上的容置孔相对；
    制作一安装支架，所述安装支架开设有通孔，所述通孔的内壁向所述通孔的中轴线方向延伸而形成一载台，所述安装支架靠近所述载台的一侧向外延伸而形成一连接部，围绕所述通孔通过LDS形成多层线圈、电容及电阻，所述线圈通过LDS技术在所述安装支架上由内至外形成环绕所述通孔的多层环绕式电感构成；
    将滤光片设置于所述载台上且容置于所述通孔中，将镜头安装于所述通孔中；
    将所述安装支架设置于所述基板上；
    将电路板通过所述连接部与所述安装支架连接。
  7. 如权利要求6所述的镜头模组的制作方法，其特征在于：所述线圈层数大于2，多层所述线圈通过过孔导通。
  8. 如权利要求6所述的镜头模组的制作方法，其特征在于：所述容置孔包括第一容置孔及与其连通的第二容置孔，所述第一容置孔的宽度小于所述第二容置孔的宽度以在所述基板中形成一凸缘，所述感光芯片设置于所述凸缘上。
  9. 如权利要求8所述的镜头模组的制作方法，其特征在于：所述第一容置孔的宽度小于所述感光芯片的宽度，所述感光芯片的宽度小于或等于所述第二容置孔的宽度，所述第二容置孔的深度大于或等于所述感光芯片的厚度从而将所述感光芯片设置于所述容置孔中。
  10. 如权利要求6所述的镜头模组的制作方法，其特征在于：所述安装支架靠近所述基板的一面上还设有焊盘，所述焊盘用于与所述基板连接。
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