WO2021199421A1 - Circuit formation method and circuit formation device - Google Patents

Circuit formation method and circuit formation device Download PDF

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Publication number
WO2021199421A1
WO2021199421A1 PCT/JP2020/015298 JP2020015298W WO2021199421A1 WO 2021199421 A1 WO2021199421 A1 WO 2021199421A1 JP 2020015298 W JP2020015298 W JP 2020015298W WO 2021199421 A1 WO2021199421 A1 WO 2021199421A1
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WO
WIPO (PCT)
Prior art keywords
hole
resin layer
forming
resin
circuit
Prior art date
Application number
PCT/JP2020/015298
Other languages
French (fr)
Japanese (ja)
Inventor
佑 竹内
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2022511478A priority Critical patent/JP7230276B2/en
Priority to PCT/JP2020/015298 priority patent/WO2021199421A1/en
Publication of WO2021199421A1 publication Critical patent/WO2021199421A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to a circuit forming method and a circuit forming apparatus for forming a circuit using a curable resin.
  • the problem is to properly form a circuit using not only a curable resin but also a conductive fluid.
  • the present specification describes a resin layer forming step of forming a resin layer having holes on a base material with a curable resin, and a conductive fluid that develops conductivity by heating.
  • a coating step of applying to the inside of the hole a wiring forming step of forming wiring on the resin layer so as to energize the conductive fluid applied to the inside of the hole, and forming on the base material.
  • the area of the opening of the hole to the lower surface side of the resin layer is the upper surface side of the resin layer.
  • a method of forming a circuit for forming the resin layer so as to be smaller than the area of the opening of the hole in the hole is disclosed.
  • the present specification presents a resin layer forming apparatus for forming a resin layer having holes with a curable resin and a conductive fluid that develops conductivity by heating inside the holes.
  • a control device for forming a circuit by controlling the operation with the forming device is provided, and the resin layer forming device puts the resin layer on a base material to be peeled off after the circuit is formed, and the resin layer.
  • a resin layer having holes is formed of a curable resin on a base material that is peeled off after the circuit is formed.
  • the area of the hole opening on the lower surface side of the resin layer is smaller than the area of the hole opening on the upper surface side of the resin layer, and the conductive fluid is applied to the inside of the hole.
  • FIG. 1 shows the circuit forming device 10.
  • the circuit forming device 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see FIG. 2) 28.
  • the transfer device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are arranged on the base 29 of the circuit forming device 10.
  • the base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is orthogonal to the X-axis direction, and the lateral direction of the base 29 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is arranged on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction. Then, one end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • the stage 52 is slidably held in the Y-axis slide rail 50 in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and an elevating device 64.
  • the base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface.
  • the holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate mounted on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held. Further, the elevating device 64 is arranged below the base 60 and raises and lowers the base 60.
  • the first modeling unit 22 is a unit for modeling the wiring of the circuit board, and has a first printing unit 72 and a heating unit 74.
  • the first printing unit 72 has an inkjet head (see FIG. 2) 76 and a dispense head (see FIG. 2) 77.
  • the inkjet head 76 ejects metal ink linearly.
  • Metal ink is nanometer-sized metal fine particles dispersed in a solvent. Further, the surface of the metal fine particles is coated with a dispersant to prevent agglutination in a solvent.
  • the inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the dispense head 77 discharges the metal paste.
  • a metal paste is a resin in which micrometer-sized metal particles are dispersed in a resin that is cured by heating. By the way, the metal particles are in the form of flakes. Since the viscosity of the metal paste is relatively high as compared with the metal ink, the dispense head 77 ejects the metal paste from one nozzle having a diameter larger than the nozzle diameter of the inkjet head 76.
  • the heating unit 74 has a heater (see FIG. 2) 78.
  • the heater 78 is a device that heats the metal ink ejected by the inkjet head 76.
  • the metal ink is fired by being heated by the heater 78 to form wiring.
  • the solvent is vaporized and the protective film of the metal fine particles, that is, the dispersant is decomposed by applying energy, and the metal fine particles are brought into contact with each other or fused to be conductive. This is a phenomenon in which the rate increases. Then, by firing the metal ink, a metal wiring is formed.
  • the heater 78 is also a device that heats the metal paste discharged by the dispense head 77.
  • the metal paste is heated by the heater 78 to cure the resin.
  • the cured resin shrinks, and the flake-shaped metal particles dispersed in the resin come into contact with each other. As a result, the metal paste develops conductivity.
  • the second modeling unit 24 is a unit for modeling the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86.
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 ejects an ultraviolet curable resin.
  • the ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and discharged from a plurality of nozzles.
  • the cured portion 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88. For example, the surplus resin is scraped off by a roller or a blade while leveling the surface of the ultraviolet curable resin. Then, the thickness of the UV curable resin is made uniform.
  • the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curable resin with ultraviolet rays. As a result, the discharged ultraviolet curable resin is cured to form a resin layer.
  • the mounting unit 26 is a unit for mounting electronic components on a circuit board, and has a supply unit 100 and a mounting unit 102.
  • the supply unit 100 has a plurality of tape feeders (see FIG. 2) 104 that send out taped electronic components one by one, and supplies the components at the supply position.
  • the supply unit 100 also has a tray-type supply device (see FIG. 2) 105 that supplies parts from the tray.
  • the mounting unit 102 has a mounting head (see FIG. 2) 106 and a moving device (see FIG. 2) 108.
  • the mounting head 106 has a chuck (not shown) for holding a component supplied from the tape feeder 104 or the tray type feeder 105.
  • the chuck has a pair of gripping claws (not shown), and by bringing the pair of gripping claws close to each other, the parts are gripped, and by separating the pair of gripping claws, the gripped parts are released. do.
  • the moving device 108 moves the mounting head 106 between the supply position of the electronic component by the tape feeder 104 or the tray type feeding device 105 and the base 60. As a result, in the mounting unit 102, the parts supplied from the tape feeder 104 or the tray type feeding device 105 are held by the chuck, and the parts held by the chuck are mounted on the circuit.
  • the control device 28 includes a controller 110 and a plurality of drive circuits 112.
  • the plurality of drive circuits 112 include the electromagnetic motors 38 and 56, a holding device 62, an elevating device 64, an inkjet head 76, a dispense head 77, a heater 78, an inkjet head 88, a flattening device 90, an irradiation device 92, and a tape feeder 104. It is connected to the tray type supply device 105, the mounting head 106, and the moving device 108.
  • the controller 110 includes a CPU, ROM, RAM, and the like, and is mainly a computer, and is connected to a plurality of drive circuits 112. As a result, the operation of the transfer device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 110.
  • a plurality of circuit plates 120 are formed by the above-described configuration, and the circuit 122 is formed by screwing the plurality of circuit plates 120 in a stacked state.
  • Each of the plurality of circuit plates 120 is formed of a resin laminate made of an ultraviolet curable resin, wiring made of metal ink, parts supplied by the supply unit 100, and the like. Since the method of forming each of the plurality of circuit plates 120 is substantially the same, the method of forming the circuit plate 120c among the plurality of circuit plates 120 will be described below.
  • a heat-sensitive release film 70 is laid on the upper surface of the base 60 of the stage 52. Since the heat-sensitive release film 70 has adhesiveness, it appropriately adheres to the upper surface of the base 60. Then, the circuit plate 120 is formed on the heat-sensitive release film 70, and the adhesion of the heat-sensitive release film 70 to the base 60 prevents the circuit plate 120 from being displaced during circuit formation. Since the adhesiveness of the heat-sensitive release film 70 is reduced by heating, the heat-sensitive release film 70 is heated after the circuit plate 120 is formed on the heat-sensitive release film 70. The thermal release film 70 can be easily peeled off from the base 60 together with the circuit plate 120 formed on the base 60.
  • the stage 52 is moved below the second modeling unit 24.
  • the resin laminate 130 is formed on the heat-sensitive release film 70.
  • the resin laminate 130 has a plurality of holes 132, and is formed by repeatedly ejecting the ultraviolet-curable resin from the inkjet head 88 and irradiating the discharged ultraviolet-curable resin with ultraviolet rays by the irradiation device 92. Will be done.
  • the inkjet head 88 ejects the ultraviolet curable resin into a thin film on the upper surface of the heat-sensitive release film 70.
  • the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion on the upper surface of the heat-sensitive release film 70 is exposed.
  • the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the cured portion 86.
  • the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin film layer 136 of the resin is formed on the heat-sensitive release film 70.
  • the inkjet head 88 ejects the ultraviolet curable resin into a thin film only on the upper portion of the thin film layer 136. That is, the inkjet head 88 ejects the ultraviolet curable resin in the form of a thin film on the thin film layer 136 so that a predetermined portion on the upper surface of the heat-sensitive release film 70 is exposed. Then, the thin film-shaped ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film form with ultraviolet rays, so that the thin film layer 136 is placed on the thin film layer 136. Are laminated.
  • the ejection of the ultraviolet curable resin onto the thin film layer 136 and the irradiation of ultraviolet rays are repeated, and the plurality of thin film layers 136 are laminated to form the resin laminate 130 having the holes 132. ..
  • the hole 132 penetrates the resin laminate 130 in the vertical direction.
  • the stage 52 is moved below the first modeling unit 22.
  • the dispense head 77 discharges the metal paste 138 into the holes 132 of the resin laminate 130, as shown in FIG.
  • the dispense head 77 applies the metal paste 138 so that the upper surface of the resin laminate 130 and the upper surface of the metal paste 138 discharged into the hole 132 are flat, that is, flush with each other. Discharge.
  • the heating unit 74 of the first modeling unit 22 the metal paste 138 is heated by the heater 78.
  • the metal paste 138 is cured and the metal paste 138 becomes conductive. Since the conductive metal paste 138 functions as an electrode exposed on the lower surface side of the circuit plate 120c, the conductive metal paste 138 is referred to as a bottom electrode 140.
  • the inkjet head 76 ejects the metal ink 150 linearly into two lines on the upper surface of the resin laminate 130 as shown in FIG. 7. At this time, the inkjet head 76 ejects the metal ink 150 so as to come into contact with the bottom electrodes 140 formed inside the plurality of holes 132. That is, the metal ink 150 is ejected so as to connect the bottom electrodes 140 formed inside the plurality of holes 132. Then, in the heating unit 74 of the first modeling unit 22, the metal ink 150 is heated by the heater 78, so that the metal ink 150 is fired and the wiring 152 is formed.
  • two wirings 152 are formed on the upper surface of the resin laminate 130 so as to conduct with the bottom electrodes 140 formed inside the plurality of holes 132 of the resin laminate 130.
  • the two wirings 152 are arranged in a straight line with their ends facing each other.
  • the stage 52 is moved below the second modeling unit 24.
  • the resin laminate 160 is formed on the resin laminate 130.
  • the resin laminate 160 is formed so as to cover the two wirings 152 formed on the upper surface of the resin laminate 130.
  • the resin laminate 160 is formed with a cavity 162 in which the end portions of the two wirings 152 facing each other are exposed, and a plurality of holes 164 in which a part of each wiring 152 is exposed.
  • the resin laminate 160 is formed by repeating the ejection of the ultraviolet curable resin by the inkjet head 88 and the irradiation of ultraviolet rays by the irradiation device 92, similarly to the resin laminate 130.
  • the stage 52 is moved below the first modeling unit 22, and in the first printing unit 72, the inkjet head 76 puts the metal ink 170 inside the holes 164 of the resin laminate 160, as shown in FIG. Discharge.
  • the inkjet head 76 ejects the metal ink 170 so that the upper surface of the resin laminate 160 and the upper surface of the metal ink 170 ejected into the hole 164 are flush with each other.
  • the heating unit 74 of the first modeling unit 22 the metal ink 170 is heated by the heater 78, so that the metal ink 170 is fired. As a result, the metal ink 170 is metallized and vias 172 are formed.
  • the inkjet head 76 linearly ejects the metal ink 180 onto the upper surface of the resin laminate 160, as shown in FIG. At this time, the inkjet head 76 ejects the metal ink 180 so as to come into contact with the vias 172 formed inside the plurality of holes 164. That is, the metal ink 180 is ejected so as to connect the vias 172 formed inside the plurality of holes 164. Then, in the heating unit 74 of the first modeling unit 22, the metal ink 180 is heated by the heater 78, so that the metal ink 180 is fired and the wiring 182 is formed. As a result, the wiring 182 is formed on the upper surface of the resin laminate 160 so as to be conductive with the vias 172 formed inside the plurality of holes 164 of the resin laminate 160.
  • the stage 52 is moved below the second modeling unit 24.
  • the resin laminate 190 is formed on the resin laminate 160.
  • the resin laminate 190 is formed so as to cover the wiring 182 formed on the upper surface of the resin laminate 160.
  • the resin laminate 190 is formed with a cavity 192 communicating with the cavity 162 of the resin laminate 160 and a plurality of holes 194 in which a part of the wiring 182 is exposed.
  • the resin laminate 190 is formed by repeating the ejection of the ultraviolet curable resin by the inkjet head 88 and the irradiation of ultraviolet rays by the irradiation device 92, similarly to the resin laminates 130 and 160.
  • the stage 52 is moved below the first modeling unit 22, and in the first printing unit 72, the dispense head 77 is moved to the cavities 162 and 192 of the resin laminates 160 and 190.
  • the metal paste 200 is discharged inside.
  • the dispense head 77 discharges the metal paste 200 onto the end of the wiring 152 exposed inside the cavities 162 and 192.
  • the dispense head 77 discharges the metal paste 202 into the hole 194 of the resin laminate 190.
  • the dispense head 77 discharges the metal paste 202 onto the wiring 182 exposed inside the hole 194.
  • the stage 52 is moved below the mounting unit 26.
  • an electronic component (see FIG. 11) 210 is supplied by the tape feeder 104, and the electronic component 210 is held by the chuck of the mounting head 106.
  • the electronic component 210 is composed of a component main body 212 and two electrodes 214 arranged on the lower surface of the component main body 212.
  • the mounting head 106 is moved by the moving device 108, and the electronic component 210 held by the chuck is mounted inside the cavities 162 and 192.
  • the electronic component 210 is mounted inside the cavities 162 and 192 so that the electrode 214 of the electronic component 210 comes into contact with the metal paste 200 discharged onto the wiring 152.
  • the probe pin 216 is supplied by the tray type feeding device 105, and the probe pin 216 is held by the chuck of the mounting head 106. Then, the mounting head 106 is moved by the moving device 108, and the probe pin 216 held by the chuck is inserted into the hole 194. At this time, the probe pin 216 is inserted into the hole 194 so that the lower end of the probe pin 216 comes into contact with the metal paste 202 discharged into the hole 194. Since the depth dimension of the hole 194 is shorter than the length dimension of the probe pin 216, the upper end of the probe pin 216 inserted into the hole 194 protrudes from the upper surface of the resin laminate 190.
  • the stage 52 is moved below the first modeling unit 22.
  • the metal pastes 200 and 202 are heated by the heater 78, so that the metal pastes 200 and 202 are cured and the metal pastes 200 and 202 are made conductive.
  • the circuit plate 120c is formed. That is, in the circuit plate 120c, a plurality of resin laminates 130, 160, 190 are laminated, and wirings 152, 182 are formed between the laminated resin laminates 130, 160, 190.
  • the wirings 152 and 182 are conducted in the vertical direction by the via 172, the wiring 152 is conducted to the lower surface side of the circuit plate 120c by the bottom electrode 140, and the wiring 182 is conducted to the upper surface side of the circuit plate 120c by the probe pin 216. ing. Further, the electronic component 210 is mounted in the cavities 162 and 192 of the resin laminates 160 and 190 in a state of being conductive on the wiring 152. As described above, in the circuit forming apparatus 10, the packaged circuit plate 120c is formed on the heat-sensitive release film 70 according to the method described above.
  • the circuit plate 120c is formed by a method different from the above-mentioned method (hereinafter referred to as "first circuit forming method”) (hereinafter referred to as “second circuit forming method”). It is also possible. Specifically, the stage 52 is moved below the first modeling unit 22, and in the first printing section 72 of the first modeling unit 22, the dispense head 77 is placed on the heat-sensitive release film 70 as shown in FIG. The metal paste 138 is discharged to the machine. The discharge point of the metal paste 138 is the place where the hole 194 is formed when the resin laminate 130 is formed in the first circuit forming method. Then, when the metal paste 138 is discharged, the metal paste 138 is heated by the heater 78 in the heating unit 74 of the first modeling unit 22, so that the metal paste 138 becomes conductive. As a result, the bottom electrode 140 is formed.
  • first circuit forming method hereinafter referred to as "second circuit forming method”
  • the stage 52 is moved below the second modeling unit 24, and in the second printing section 84 of the second modeling unit 24, as shown in FIG. 6, the resin laminate 130 is placed on the upper surface of the heat-sensitive release film 70. It is formed. At this time, the resin laminate 130 is formed so that the hole 194 is located at the position of the bottom electrode 140 previously formed on the heat-sensitive release film 70. That is, in the first circuit forming method, the resin laminate 130 having the holes 132 is first formed on the heat-sensitive release film 70, and the bottom electrode 140 is formed inside the holes 132 of the resin laminate 130. ..
  • the bottom electrode 140 is first formed on the heat-sensitive release film 70, and the resin laminate 130 is formed so as to surround the bottom electrode 140, whereby the bottom electrode 140 is formed.
  • the formed portion functions as a hole 132.
  • the resin laminate 130 in the second circuit forming method similarly to the resin laminate 130 in the first circuit forming method, the ejection of the ultraviolet curable resin by the inkjet head 88 and the irradiation of ultraviolet rays by the irradiation device 92 are repeated. It is formed by that.
  • the resin laminate 160, 190, the wiring 152, 182, the via 172, and the like are formed in the same manner as in the first circuit forming method.
  • the circuit plate 120c is formed on the heat-sensitive release film 70 by mounting the electronic component 210 or the like.
  • the circuit plate 120c can be formed on the heat-sensitive release film 70 by either the first circuit forming method or the second circuit forming method. Then, when the circuit plate 120c is formed, the stage 52 is moved under the first modeling unit 22, and the heat-sensitive release film 70 is heated by the heater 78 in the heating unit 74 of the first modeling unit 22. As a result, the adhesiveness of the heat-sensitive release film 70 is reduced, and the circuit plate 120c can be easily peeled off from the base 60 together with the heat-sensitive release film 70. Then, the circuit plate 120c and the heat-sensitive release film 70 are peeled off to complete the production of the circuit plate 120c.
  • circuit plates 120a, b, d to f other than the circuit plate 120c are also produced by a method substantially similar to that of the circuit plate 120c. Then, when a plurality of circuit plates 120a to ff are created, the plurality of circuit plates 120a to ff are laminated as shown in FIG. At this time, for example, the circuit plate 120 is laminated so that the probe pin 216 protruding from the upper surface of the circuit plate 120c comes into contact with the bottom electrode 220 of the circuit plate 120b laminated on the circuit plate 120c.
  • the probe pin 216 has a built-in coil spring (not shown) and can be expanded and contracted.
  • the circuit plates 120 are stacked so that the probe pins 216 of the circuit plate 120c come into contact with the bottom electrode 220 of the circuit plate 120b, the probe pins 216 contract, and the probe is driven by the elastic force of the coil spring. The continuity between the pin 216 and the bottom electrode 220 is ensured. Then, the circuit 122 is formed by screwing the plurality of circuit plates 120 in a laminated state.
  • the bottom electrode 140 is attached to the heat-sensitive release film 70. It may come into close contact and separate from the circuit plate 120. That is, the bottom electrode 140 may come off from the hole 132 of the resin laminate 130 of the circuit plate 120 as the heat-sensitive release film 70 is peeled off.
  • the holes 132 of the resin laminate 130 have a generally cylindrical shape as shown in FIG. That is, the inner diameter of the hole 132 is ideally the same over the entire area, and the area of the opening of the hole 132 to the lower surface side of the resin laminate 130 (hereinafter, referred to as “lower surface side opening area”). The area of the opening of the hole 132 to the upper surface side of the resin laminate 130 (hereinafter, referred to as “upper surface side opening area”) is the same.
  • the adhesion between the bottom electrode 140 and the wiring 152 on the upper surface of the resin laminate 130 is increased on the lower surface of the resin laminate 130. If the adhesive strength between the bottom electrode 140 and the heat-sensitive release film 70 is lower than that of the bottom electrode 140, the bottom electrode 140 is likely to separate from the hole 132.
  • the metal paste 138 is first discharged onto the heat-sensitive release film 70.
  • the upper end portion of the metal paste 138 may be curved to form a hemispherical shape.
  • the ultraviolet curable resin is formed on the bottom electrode 140. It may get wet toward the upper end. In such a case, the lower surface side opening area of the hole 132 becomes smaller than the upper surface side opening area, and the bottom surface electrode 140 is more easily separated from the hole 132.
  • the circuit plate 120 is not formed by the second circuit forming method, but the circuit plate 120 is formed by the first circuit forming direction. Then, in order to prevent the bottom electrode 140 from coming off, the resin laminate 130 is formed so that the lower surface side opening area of the hole 230 is smaller than the upper surface side opening area as shown in FIG. 16 in the first circuit forming method. Will be done. That is, the resin laminate 130 has a tapered surface so that the inner wall surface of the resin laminate 130 that partitions the hole 230 faces the inside of the hole 230 toward the bottom and becomes a tapered surface toward the outside of the hole 230 toward the top. It is formed.
  • the metal paste 138 is discharged into the hole 230 of the resin laminate 130, and the metal paste 138 is heated by the heater 78 to cure the metal paste 138 and form the bottom electrode 140.
  • the bottom electrode 140 is formed inside the hole 230 whose lower surface opening area is smaller than the upper surface opening area, so that the heat-sensitive release film 70 is peeled from the circuit plate 120 after the circuit plate 120 is formed. At that time, it is possible to prevent the bottom electrode 140 from coming off.
  • the heat-sensitive release film 70 is peeled off, the force that the bottom electrode 140 is pulled together with the heat-sensitive release film 70 can be suppressed by the tapered surface of the inner wall of the resin laminate 130 that partitions the hole 230, which is effective. It is possible to prevent the bottom electrode 140 from coming off.
  • the controller 110 of the control device 28 has a resin layer forming portion 250, a coating portion 252, and a wiring forming portion 254.
  • the resin layer forming portion 250 is a functional portion for forming the resin laminate 130 having the holes 230.
  • the coating unit 252 is a functional unit for discharging the metal paste 138 into the hole 230.
  • the wiring forming portion 254 is a functional portion for forming the wiring 152 on the upper surface of the resin laminate 130 so as to be conductive with the bottom electrode 140 formed inside the hole 230.
  • the circuit forming apparatus 10 is an example of the circuit forming apparatus.
  • the second modeling unit 24 is an example of a resin layer forming apparatus.
  • the control device 28 is an example of the control device.
  • the thermal release film 70 is an example of a base material.
  • the inkjet head 76 and the heater 78 are examples of wiring forming devices.
  • the dispense head 77 is an example of a coating device.
  • the resin laminate 130 is an example of a resin layer.
  • Metal paste 138 is an example of a conductive fluid.
  • the wiring 152 is an example of wiring.
  • Hall 230 is an example of a hall.
  • the step executed by the resin layer forming unit 250 is an example of the resin layer forming step.
  • the step executed by the coating unit 252 is an example of the coating process.
  • the process executed by the wiring forming unit 254 is an example of the wiring forming process.
  • the present invention is not limited to the above-mentioned examples, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art.
  • the inner wall surface of the resin laminate 130 for partitioning the hole 230 is made a tapered surface, so that the opening area on the lower surface side of the hole 230 is smaller than the opening area on the upper surface side, but the hole 230 is partitioned.
  • Various shapes can be adopted as the shape of the inner wall surface of the resin laminate 130 to be formed. Specifically, for example, as shown in FIG.
  • the lower end of the inner wall surface of the resin laminate 130 that partitions the hole 230 is formed to have a shape that curves toward the inside of the hole 230, so that the lower surface of the hole 230 is formed.
  • the side opening area may be smaller than the upper surface side opening area.
  • the lower surface side opening area of the hole 230 may be smaller than the upper surface side opening area by forming the inner wall surface of the resin laminate 130 that partitions the hole 230 into a stepped surface shape. ..
  • the metal paste 138 is discharged so as to occupy the entire inside of the hole 230 of the resin laminate 130, but the metal paste 138 may be discharged only to a part of the hole 230.
  • the metal paste 260 is formed in the hole 230 so as to connect the opening of the hole 230 on the lower surface side of the resin laminate 130 and the opening of the hole 230 on the upper surface side of the resin laminate 130. Discharge to a part of. Then, by heating the metal paste 260, a bottom electrode 262 connecting the opening of the hole 230 on the upper surface side of the resin laminate 130 and the opening of the hole 230 on the lower surface side of the resin laminate 130 is formed.
  • the ultraviolet curable resin 264 is discharged to a place other than the bottom electrode 262 inside the hole 230, and the ultraviolet curable resin 264 is cured by irradiating the hole 230 with ultraviolet rays.
  • the bottom electrode 262 can be prevented from coming off as in the above embodiment. Can be done.
  • the metal paste is relatively expensive, it is possible to reduce the cost by suppressing the amount of the metal paste used.
  • the metal paste has a high viscosity, it is difficult to fill the inside of the hole with only the metal paste, but by using an ultraviolet curable resin having a low viscosity together, it is relatively easy to fill the inside of the hole with a metal. It can be filled with a paste and an ultraviolet curable resin.
  • the metal paste is adopted as the conductive fluid, but the metal ink may be adopted as the conductive fluid.
  • the metal ink and the metal paste as the conductive fluid, it is possible to effectively suppress the detachment of the bottom electrode.
  • the metal ink 270 is first discharged into a thin film into the hole 230 whose lower surface side opening area is smaller than the upper surface side opening area, and the metal ink 270 is heated to make it conductive. To form a metal thin film 272.
  • the metal ink 270 is discharged into a thin film on the upper surface of the heat-sensitive release film 70, and the metal ink 270 is heated to form the metal thin film 272 in close contact with the heat-sensitive release film 70. ..
  • the metal paste 276 is discharged onto the metal thin film 272. Then, the metal paste 276 is heated to make it conductive to form a metal block 278. As a result, a bottom electrode composed of the metal thin film 272 and the metal block 278 is formed inside the hole 230.
  • the metal thin film 272 and the heat-sensitive release film 70 are in close contact with each other, but the adhesion between the metal metal thin film 272 and the resin heat-sensitive release film 70 is relatively weak. Therefore, when the circuit plate 120 and the heat-sensitive release film 70 are peeled off, the metal thin film 272 that is in close contact with the heat-sensitive release film 70 is easily peeled off from the heat-sensitive release film 70.
  • the lower surface side of the bottom electrode is made of the metal thin film 272
  • the upper surface side of the bottom electrode is made of the metal block 278, so that the bottom electrode is separated when the circuit plate 120 and the heat-sensitive release film 70 are peeled off. Can be effectively suppressed.
  • the metal ink and the metal paste are heated by the heater 78, but the metal ink and the metal paste may be heated by irradiation with laser light or the like.
  • the metal paste is discharged by the dispense head 77, but the metal paste may be transferred by a stamp or the like. Further, metal ink or metal paste may be printed by screen printing.
  • Circuit forming device 24 Second modeling unit (resin forming device) 28: Control device 70: Heat-sensitive release film (base material) 76: Ink ink head (wiring forming device) 77: Dispens head (coating device) 78: Heater ( Wiring forming device) 130: Resin laminate (resin layer) 138: Metal paste (conductive fluid) 152: Wiring 230: Hole 250: Resin layer forming part (resin layer forming process) 252: Coating part (coating process) 254: Wiring forming part (wiring forming process) 270: Metal ink (metal-containing liquid) 276: Metal paste (resin paste)

Abstract

This circuit formation method comprising: a resin layer forming step for forming a resin layer having a hole on a base material with a curable resin; an application step for applying a conductive fluid that develops conductivity on heating to the inside of the hole; a wiring forming step for forming wiring so as to energize the conductive fluid applied to the inside of the hole; and a peeling step for peeling the resin layer formed on the base material off the base material, wherein in the resin layer forming step, the resin layer is formed so that the area of the hole opening on the lower surface side of the resin layer is smaller than the area of the hole opening on the upper surface side of the resin layer.

Description

回路形成方法および回路形成装置Circuit formation method and circuit formation device
　本発明は、硬化性樹脂を用いて回路を形成する回路形成方法および回路形成装置に関する。 The present invention relates to a circuit forming method and a circuit forming apparatus for forming a circuit using a curable resin.
　下記特許文献に記載されているように、硬化性樹脂を用いて回路を形成する技術が開発されている。 As described in the patent document below, a technique for forming a circuit using a curable resin has been developed.
国際公開第２０１４／００６６９９号International Publication No. 2014/006699
　硬化性樹脂だけでなく、導電性流体をも用いて回路を適切に形成することを課題とする。 The problem is to properly form a circuit using not only a curable resin but also a conductive fluid.
　上記課題を解決するために、本明細書は、ホールを有する樹脂層を硬化性樹脂により基材の上に形成する樹脂層形成工程と、加熱することで導電性を発現する導電性流体を、前記ホールの内部に塗布する塗布工程と、前記樹脂層の上に、前記ホールの内部に塗布された導電性流体と通電するように配線を形成する配線形成工程と、前記基材の上に形成された前記樹脂層と、前記基材とを剥離する剥離工程と、を含み、前記樹脂層形成工程は、前記樹脂層の下面側への前記ホールの開口の面積が、前記樹脂層の上面側への前記ホールの開口の面積より小さくなるように、前記樹脂層を形成する回路形成方法を開示する。 In order to solve the above problems, the present specification describes a resin layer forming step of forming a resin layer having holes on a base material with a curable resin, and a conductive fluid that develops conductivity by heating. A coating step of applying to the inside of the hole, a wiring forming step of forming wiring on the resin layer so as to energize the conductive fluid applied to the inside of the hole, and forming on the base material. In the resin layer forming step, the area of the opening of the hole to the lower surface side of the resin layer is the upper surface side of the resin layer. A method of forming a circuit for forming the resin layer so as to be smaller than the area of the opening of the hole in the hole is disclosed.
　上記課題を解決するために、本明細書は、ホールを有する樹脂層を硬化性樹脂により形成する樹脂層形成装置と、加熱することで導電性を発現する導電性流体を、前記ホールの内部に塗布する塗布装置と、前記樹脂層の上に、前記ホールの内部に塗布された導電性流体と通電するように配線を形成する配線形成装置と、前記樹脂層形成装置と前記塗布装置と前記配線形成装置との作動を制御することで回路を形成する制御装置と、を備え、前記樹脂層形成装置が、回路が形成された後に剥離される基材の上に前記樹脂層を、前記樹脂層の下面側への前記ホールの開口の面積が、前記樹脂層の上面側への前記ホールの開口の面積より小さくなるように形成する回路形成装置を開示する。 In order to solve the above problems, the present specification presents a resin layer forming apparatus for forming a resin layer having holes with a curable resin and a conductive fluid that develops conductivity by heating inside the holes. A coating device for coating, a wiring forming device for forming wiring on the resin layer so as to energize the conductive fluid coated inside the hole, the resin layer forming device, the coating device, and the wiring. A control device for forming a circuit by controlling the operation with the forming device is provided, and the resin layer forming device puts the resin layer on a base material to be peeled off after the circuit is formed, and the resin layer. Discloses a circuit forming apparatus for forming the opening area of the hole on the lower surface side of the resin layer so as to be smaller than the opening area of the hole on the upper surface side of the resin layer.
　本開示では、回路が形成された後に剥離される基材の上に、ホールを有する樹脂層が硬化性樹脂により形成される。そして、その樹脂層の下面側へのホールの開口の面積は、樹脂層の上面側へのホールの開口の面積より小さくされており、そのホールの内部に導電性流体が塗布される。これにより、硬化性樹脂だけでなく、導電性流体をも用いて回路を適切に形成することが可能となる。 In the present disclosure, a resin layer having holes is formed of a curable resin on a base material that is peeled off after the circuit is formed. The area of the hole opening on the lower surface side of the resin layer is smaller than the area of the hole opening on the upper surface side of the resin layer, and the conductive fluid is applied to the inside of the hole. This makes it possible to appropriately form a circuit using not only a curable resin but also a conductive fluid.
回路形成装置を示す図である。It is a figure which shows the circuit forming apparatus. 制御装置を示すブロック図である。It is a block diagram which shows the control device. 複数の回路プレートが積層された回路を示す断面図である。It is sectional drawing which shows the circuit in which a plurality of circuit plates are laminated. 感熱剥離フィルムが敷かれた基台を示す断面図である。It is sectional drawing which shows the base on which the thermal release film was laid. 樹脂積層体が形成された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state which the resin laminate is formed. 樹脂積層体のホールに底面電極が形成された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state which the bottom electrode is formed in the hole of the resin laminate. 樹脂積層体の上に配線が形成された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state which the wiring is formed on the resin laminate. 配線を覆うように樹脂積層体が積層された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state which the resin laminated body is laminated so as to cover a wiring. 樹脂積層体の上に配線が形成された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state which the wiring is formed on the resin laminate. 配線を覆うように樹脂積層体が積層された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state which the resin laminated body is laminated so as to cover a wiring. 電子部品及びプローブピンが装着された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state which the electronic component and the probe pin are attached. 底面電極が形成された状態の回路を示す断面図である。It is sectional drawing which shows the circuit in the state which the bottom electrode is formed. 回路プレートと、その回路プレートから剥離された感熱剥離フィルムとを示す断面図である。It is sectional drawing which shows the circuit plate and the thermal release film peeled off from the circuit plate. 従来の底面電極を示す断面図である。It is sectional drawing which shows the conventional bottom electrode. 従来の底面電極を示す断面図である。It is sectional drawing which shows the conventional bottom electrode. 本発明の底面電極を示す断面図である。It is sectional drawing which shows the bottom electrode of this invention. 変形例の底面電極を示す断面図である。It is sectional drawing which shows the bottom electrode of the modification. 変形例の底面電極を示す断面図である。It is sectional drawing which shows the bottom electrode of the modification. 変形例の底面電極を示す断面図である。It is sectional drawing which shows the bottom electrode of the modification. 変形例の底面電極を示す断面図である。It is sectional drawing which shows the bottom electrode of the modification.
　図１に回路形成装置１０を示す。回路形成装置１０は、搬送装置２０と、第１造形ユニット２２と、第２造形ユニット２４と、装着ユニット２６と、制御装置（図２参照）２８とを備える。それら搬送装置２０と第１造形ユニット２２と第２造形ユニット２４と装着ユニット２６とは、回路形成装置１０のベース２９の上に配置されている。ベース２９は、概して長方形状をなしており、以下の説明では、ベース２９の長手方向をＸ軸方向、ベース２９の短手方向をＹ軸方向、Ｘ軸方向及びＹ軸方向の両方に直交する方向をＺ軸方向と称して説明する。 FIG. 1 shows the circuit forming device 10. The circuit forming device 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see FIG. 2) 28. The transfer device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are arranged on the base 29 of the circuit forming device 10. The base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is orthogonal to the X-axis direction, and the lateral direction of the base 29 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.
　搬送装置２０は、Ｘ軸スライド機構３０と、Ｙ軸スライド機構３２とを備えている。そのＸ軸スライド機構３０は、Ｘ軸スライドレール３４とＸ軸スライダ３６とを有している。Ｘ軸スライドレール３４は、Ｘ軸方向に延びるように、ベース２９の上に配設されている。Ｘ軸スライダ３６は、Ｘ軸スライドレール３４によって、Ｘ軸方向にスライド可能に保持されている。さらに、Ｘ軸スライド機構３０は、電磁モータ（図２参照）３８を有しており、電磁モータ３８の駆動により、Ｘ軸スライダ３６がＸ軸方向の任意の位置に移動する。また、Ｙ軸スライド機構３２は、Ｙ軸スライドレール５０とステージ５２とを有している。Ｙ軸スライドレール５０は、Ｙ軸方向に延びるように、ベース２９の上に配設されており、Ｘ軸方向に移動可能とされている。そして、Ｙ軸スライドレール５０の一端部が、Ｘ軸スライダ３６に連結されている。そのＹ軸スライドレール５０には、ステージ５２が、Ｙ軸方向にスライド可能に保持されている。さらに、Ｙ軸スライド機構３２は、電磁モータ（図２参照）５６を有しており、電磁モータ５６の駆動により、ステージ５２がＹ軸方向の任意の位置に移動する。これにより、ステージ５２は、Ｘ軸スライド機構３０及びＹ軸スライド機構３２の駆動により、ベース２９上の任意の位置に移動する。 The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is arranged on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction. Then, one end of the Y-axis slide rail 50 is connected to the X-axis slider 36. The stage 52 is slidably held in the Y-axis slide rail 50 in the Y-axis direction. Further, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
　ステージ５２は、基台６０と、保持装置６２と、昇降装置６４とを有している。基台６０は、平板状に形成され、上面に基板が載置される。保持装置６２は、基台６０のＸ軸方向の両側部に設けられている。そして、基台６０に載置された基板のＸ軸方向の両縁部が、保持装置６２によって挟まれることで、基板が固定的に保持される。また、昇降装置６４は、基台６０の下方に配設されており、基台６０を昇降させる。 The stage 52 has a base 60, a holding device 62, and an elevating device 64. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate mounted on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held. Further, the elevating device 64 is arranged below the base 60 and raises and lowers the base 60.
　第１造形ユニット２２は、回路基板の配線を造形するユニットであり、第１印刷部７２と、加熱部７４とを有している。第１印刷部７２は、インクジェットヘッド（図２参照）７６とディスペンスヘッド（図２参照）７７とを有している。インクジェットヘッド７６が金属インクを線状に吐出する。金属インクは、ナノメートルサイズの金属の微粒子が溶剤中に分散されたものである。また、金属微粒子の表面は分散剤によりコーティングされており、溶剤中での凝集が防止されている。なお、インクジェットヘッド７６は、例えば、圧電素子を用いたピエゾ方式によって複数のノズルから金属インクを吐出する。 The first modeling unit 22 is a unit for modeling the wiring of the circuit board, and has a first printing unit 72 and a heating unit 74. The first printing unit 72 has an inkjet head (see FIG. 2) 76 and a dispense head (see FIG. 2) 77. The inkjet head 76 ejects metal ink linearly. Metal ink is nanometer-sized metal fine particles dispersed in a solvent. Further, the surface of the metal fine particles is coated with a dispersant to prevent agglutination in a solvent. The inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
　また、ディスペンスヘッド７７は金属ペーストを吐出する。金属ペーストは、加熱により硬化する樹脂に、マイクロメートルサイズの金属粒子が分散されたものである。ちなみに、金属粒子は、フレーク状とされている。なお、金属ペーストの粘度は、金属インクと比較して、比較的高いため、ディスペンスヘッド７７は、インクジェットヘッド７６のノズルの径より大きな径の１個のノズルから金属ペーストを吐出する。 In addition, the dispense head 77 discharges the metal paste. A metal paste is a resin in which micrometer-sized metal particles are dispersed in a resin that is cured by heating. By the way, the metal particles are in the form of flakes. Since the viscosity of the metal paste is relatively high as compared with the metal ink, the dispense head 77 ejects the metal paste from one nozzle having a diameter larger than the nozzle diameter of the inkjet head 76.
　加熱部７４は、ヒータ（図２参照）７８を有している。ヒータ７８は、インクジェットヘッド７６により吐出された金属インクを加熱する装置である。金属インクは、ヒータ７８により加熱されることで焼成し、配線が形成される。なお、金属インクの焼成とは、エネルギーを付与することによって、溶媒の気化や金属微粒子の保護膜、つまり、分散剤の分解等が行われ、金属微粒子が接触または融着をすることで、導電率が高くなる現象である。そして、金属インクを焼成することで、金属製の配線が形成される。 The heating unit 74 has a heater (see FIG. 2) 78. The heater 78 is a device that heats the metal ink ejected by the inkjet head 76. The metal ink is fired by being heated by the heater 78 to form wiring. In the firing of metal ink, the solvent is vaporized and the protective film of the metal fine particles, that is, the dispersant is decomposed by applying energy, and the metal fine particles are brought into contact with each other or fused to be conductive. This is a phenomenon in which the rate increases. Then, by firing the metal ink, a metal wiring is formed.
　また、ヒータ７８は、ディスペンスヘッド７７により吐出された金属ペーストをも加熱する装置である。金属ペーストは、ヒータ７８により加熱されることで、樹脂が硬化する。この際、金属ペーストでは、硬化した樹脂が収縮し、その樹脂に分散されたフレーク状の金属粒子が互いに接触する。これにより、金属ペーストが導電性を発現する。 The heater 78 is also a device that heats the metal paste discharged by the dispense head 77. The metal paste is heated by the heater 78 to cure the resin. At this time, in the metal paste, the cured resin shrinks, and the flake-shaped metal particles dispersed in the resin come into contact with each other. As a result, the metal paste develops conductivity.
　また、第２造形ユニット２４は、回路基板の樹脂層を造形するユニットであり、第２印刷部８４と、硬化部８６とを有している。第２印刷部８４は、インクジェットヘッド（図２参照）８８を有しており、インクジェットヘッド８８は紫外線硬化樹脂を吐出する。紫外線硬化樹脂は、紫外線の照射により硬化する樹脂である。なお、インクジェットヘッド８８は、例えば、圧電素子を用いたピエゾ方式でもよく、樹脂を加熱して気泡を発生させ複数のノズルから吐出するサーマル方式でもよい。 Further, the second modeling unit 24 is a unit for modeling the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 ejects an ultraviolet curable resin. The ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and discharged from a plurality of nozzles.
　硬化部８６は、平坦化装置（図２参照）９０と照射装置（図２参照）９２とを有している。平坦化装置９０は、インクジェットヘッド８８によって吐出された紫外線硬化樹脂の上面を平坦化するものであり、例えば、紫外線硬化樹脂の表面を均しながら余剰分の樹脂を、ローラもしくはブレードによって掻き取ることで、紫外線硬化樹脂の厚みを均一させる。また、照射装置９２は、光源として水銀ランプもしくはＬＥＤを備えており、吐出された紫外線硬化樹脂に紫外線を照射する。これにより、吐出された紫外線硬化樹脂が硬化し、樹脂層が形成される。 The cured portion 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88. For example, the surplus resin is scraped off by a roller or a blade while leveling the surface of the ultraviolet curable resin. Then, the thickness of the UV curable resin is made uniform. Further, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curable resin with ultraviolet rays. As a result, the discharged ultraviolet curable resin is cured to form a resin layer.
　また、装着ユニット２６は、回路基板に電子部品を装着するユニットであり、供給部１００と、装着部１０２とを有している。供給部１００は、テーピング化された電子部品を１つずつ送り出すテープフィーダ（図２参照）１０４を複数有しており、供給位置において部品を供給する。また、供給部１００は、トレイから部品を供給するトレイ型供給装置（図２参照）１０５も有している。 Further, the mounting unit 26 is a unit for mounting electronic components on a circuit board, and has a supply unit 100 and a mounting unit 102. The supply unit 100 has a plurality of tape feeders (see FIG. 2) 104 that send out taped electronic components one by one, and supplies the components at the supply position. The supply unit 100 also has a tray-type supply device (see FIG. 2) 105 that supplies parts from the tray.
　装着部１０２は、装着ヘッド（図２参照）１０６と、移動装置（図２参照）１０８とを有している。装着ヘッド１０６は、テープフィーダ１０４若しくはトレイ型供給装置１０５から供給される部品を保持するためのチャック（図示省略）を有する。チャックは、１対の把持爪（図示省略）を有しており、１対の把持爪を接近させることで、部品を把持し、１対の把持爪を離間させることで、把持した部品を離脱する。また、移動装置１０８は、テープフィーダ１０４若しくはトレイ型供給装置１０５による電子部品の供給位置と、基台６０との間で、装着ヘッド１０６を移動させる。これにより、装着部１０２では、テープフィーダ１０４若しくはトレイ型供給装置１０５から供給された部品が、チャックにより保持され、そのチャックによって保持された部品が回路に装着される。 The mounting unit 102 has a mounting head (see FIG. 2) 106 and a moving device (see FIG. 2) 108. The mounting head 106 has a chuck (not shown) for holding a component supplied from the tape feeder 104 or the tray type feeder 105. The chuck has a pair of gripping claws (not shown), and by bringing the pair of gripping claws close to each other, the parts are gripped, and by separating the pair of gripping claws, the gripped parts are released. do. Further, the moving device 108 moves the mounting head 106 between the supply position of the electronic component by the tape feeder 104 or the tray type feeding device 105 and the base 60. As a result, in the mounting unit 102, the parts supplied from the tape feeder 104 or the tray type feeding device 105 are held by the chuck, and the parts held by the chuck are mounted on the circuit.
　また、制御装置２８は、図２に示すように、コントローラ１１０と、複数の駆動回路１１２とを備えている。複数の駆動回路１１２は、上記電磁モータ３８，５６、保持装置６２、昇降装置６４、インクジェットヘッド７６、ディスペンスヘッド７７、ヒータ７８、インクジェットヘッド８８、平坦化装置９０、照射装置９２、テープフィーダ１０４、トレイ型供給装置１０５、装着ヘッド１０６、移動装置１０８に接続されている。コントローラ１１０は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１１２に接続されている。これにより、搬送装置２０、第１造形ユニット２２、第２造形ユニット２４、装着ユニット２６の作動が、コントローラ１１０によって制御される。 Further, as shown in FIG. 2, the control device 28 includes a controller 110 and a plurality of drive circuits 112. The plurality of drive circuits 112 include the electromagnetic motors 38 and 56, a holding device 62, an elevating device 64, an inkjet head 76, a dispense head 77, a heater 78, an inkjet head 88, a flattening device 90, an irradiation device 92, and a tape feeder 104. It is connected to the tray type supply device 105, the mounting head 106, and the moving device 108. The controller 110 includes a CPU, ROM, RAM, and the like, and is mainly a computer, and is connected to a plurality of drive circuits 112. As a result, the operation of the transfer device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 110.
　回路形成装置１０では、上述した構成によって、図３に示すように、複数の回路プレート１２０が形成され、それら複数の回路プレート１２０が積層された状態でビス止めされることで回路１２２が形成される。複数の回路プレート１２０の各々は、紫外線硬化樹脂による樹脂積層体，金属インクによる配線，供給部１００により供給される部品等により形成される。それら複数の回路プレート１２０の各々の形成方法は概ね同じであるため、複数の回路プレート１２０のうちの回路プレート１２０ｃの形成方法について、以下に説明する。 In the circuit forming apparatus 10, as shown in FIG. 3, a plurality of circuit plates 120 are formed by the above-described configuration, and the circuit 122 is formed by screwing the plurality of circuit plates 120 in a stacked state. NS. Each of the plurality of circuit plates 120 is formed of a resin laminate made of an ultraviolet curable resin, wiring made of metal ink, parts supplied by the supply unit 100, and the like. Since the method of forming each of the plurality of circuit plates 120 is substantially the same, the method of forming the circuit plate 120c among the plurality of circuit plates 120 will be described below.
　具体的には、ステージ５２の基台６０の上面に、まず、図４に示すように、感熱剥離フィルム７０が敷かれる。感熱剥離フィルム７０は、粘着性を有するため、基台６０の上面に適切に密着する。そして、感熱剥離フィルム７０の上に回路プレート１２０が形成されるが、感熱剥離フィルム７０の基台６０への密着により、回路形成時における回路プレート１２０のズレ等が防止される。なお、感熱剥離フィルム７０は、加熱により粘着性が低下するため、感熱剥離フィルム７０の上に回路プレート１２０が形成された後に、感熱剥離フィルム７０が加熱されることで、感熱剥離フィルム７０の上に形成された回路プレート１２０とともに感熱剥離フィルム７０を、基台６０から容易に剥離することができる。 Specifically, first, as shown in FIG. 4, a heat-sensitive release film 70 is laid on the upper surface of the base 60 of the stage 52. Since the heat-sensitive release film 70 has adhesiveness, it appropriately adheres to the upper surface of the base 60. Then, the circuit plate 120 is formed on the heat-sensitive release film 70, and the adhesion of the heat-sensitive release film 70 to the base 60 prevents the circuit plate 120 from being displaced during circuit formation. Since the adhesiveness of the heat-sensitive release film 70 is reduced by heating, the heat-sensitive release film 70 is heated after the circuit plate 120 is formed on the heat-sensitive release film 70. The thermal release film 70 can be easily peeled off from the base 60 together with the circuit plate 120 formed on the base 60.
　そして、基台６０の上に、感熱剥離フィルム７０が敷かれると、ステージ５２が、第２造形ユニット２４の下方に移動される。この際、第２造形ユニット２４において、図５に示すように、感熱剥離フィルム７０の上に樹脂積層体１３０が形成される。樹脂積層体１３０は、複数のホール１３２を有しており、インクジェットヘッド８８からの紫外線硬化樹脂の吐出と、吐出された紫外線硬化樹脂への照射装置９２による紫外線の照射とが繰り返されることにより形成される。 Then, when the heat-sensitive release film 70 is laid on the base 60, the stage 52 is moved below the second modeling unit 24. At this time, in the second modeling unit 24, as shown in FIG. 5, the resin laminate 130 is formed on the heat-sensitive release film 70. The resin laminate 130 has a plurality of holes 132, and is formed by repeatedly ejecting the ultraviolet-curable resin from the inkjet head 88 and irradiating the discharged ultraviolet-curable resin with ultraviolet rays by the irradiation device 92. Will be done.
　詳しくは、第２造形ユニット２４の第２印刷部８４において、インクジェットヘッド８８が、感熱剥離フィルム７０の上面に紫外線硬化樹脂を薄膜状に吐出する。この際、インクジェットヘッド８８は、感熱剥離フィルム７０の上面の所定の部分が露出するように、紫外線硬化樹脂を吐出する。続いて、紫外線硬化樹脂が薄膜状に吐出されると、硬化部８６において、紫外線硬化樹脂の膜厚が均一となるように、紫外線硬化樹脂が平坦化装置９０によって平坦化される。そして、照射装置９２が、その薄膜状の紫外線硬化樹脂に紫外線を照射する。これにより、感熱剥離フィルム７０の上に樹脂の薄膜層１３６が形成される。 Specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 ejects the ultraviolet curable resin into a thin film on the upper surface of the heat-sensitive release film 70. At this time, the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion on the upper surface of the heat-sensitive release film 70 is exposed. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the cured portion 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin film layer 136 of the resin is formed on the heat-sensitive release film 70.
　続いて、インクジェットヘッド８８が、その薄膜層１３６の上の部分にのみ紫外線硬化樹脂を薄膜状に吐出する。つまり、インクジェットヘッド８８は、感熱剥離フィルム７０の上面の所定の部分が露出するように、薄膜層１３６の上に紫外線硬化樹脂を薄膜状に吐出する。そして、平坦化装置９０によって薄膜状の紫外線硬化樹脂が平坦化され、照射装置９２が、その薄膜状に吐出された紫外線硬化樹脂に紫外線を照射することで、薄膜層１３６の上に薄膜層１３６が積層される。このように、薄膜層１３６の上への紫外線硬化樹脂の吐出と、紫外線の照射とが繰り返され、複数の薄膜層１３６が積層されることで、ホール１３２を有する樹脂積層体１３０が形成される。なお、ホール１３２は、樹脂積層体１３０を上下方向に貫通している。 Subsequently, the inkjet head 88 ejects the ultraviolet curable resin into a thin film only on the upper portion of the thin film layer 136. That is, the inkjet head 88 ejects the ultraviolet curable resin in the form of a thin film on the thin film layer 136 so that a predetermined portion on the upper surface of the heat-sensitive release film 70 is exposed. Then, the thin film-shaped ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film form with ultraviolet rays, so that the thin film layer 136 is placed on the thin film layer 136. Are laminated. In this way, the ejection of the ultraviolet curable resin onto the thin film layer 136 and the irradiation of ultraviolet rays are repeated, and the plurality of thin film layers 136 are laminated to form the resin laminate 130 having the holes 132. .. The hole 132 penetrates the resin laminate 130 in the vertical direction.
　上述した手順により樹脂積層体１３０が形成されると、ステージ５２が第１造形ユニット２２の下方に移動される。そして、第１造形ユニット２２の第１印刷部７２において、ディスペンスヘッド７７が、図６に示すように、樹脂積層体１３０のホール１３２の内部に金属ペースト１３８を吐出する。この際、ディスペンスヘッド７７は、樹脂積層体１３０の上面と、ホール１３２の内部に吐出された金属ペースト１３８の上面とが平らになるように、つまり、面一となるように、金属ペースト１３８を吐出する。そして、第１造形ユニット２２の加熱部７４において、金属ペースト１３８が、ヒータ７８により加熱される。これにより、金属ペースト１３８が硬化し、金属ペースト１３８が導電化する。なお、導電化した金属ペースト１３８は、回路プレート１２０ｃの下面側に露出する電極として機能するため、導電化した金属ペースト１３８を底面電極１４０と記載する。 When the resin laminate 130 is formed by the above procedure, the stage 52 is moved below the first modeling unit 22. Then, in the first printing unit 72 of the first modeling unit 22, the dispense head 77 discharges the metal paste 138 into the holes 132 of the resin laminate 130, as shown in FIG. At this time, the dispense head 77 applies the metal paste 138 so that the upper surface of the resin laminate 130 and the upper surface of the metal paste 138 discharged into the hole 132 are flat, that is, flush with each other. Discharge. Then, in the heating unit 74 of the first modeling unit 22, the metal paste 138 is heated by the heater 78. As a result, the metal paste 138 is cured and the metal paste 138 becomes conductive. Since the conductive metal paste 138 functions as an electrode exposed on the lower surface side of the circuit plate 120c, the conductive metal paste 138 is referred to as a bottom electrode 140.
　次に、第１造形ユニット２２の第１印刷部７２において、インクジェットヘッド７６が、図７に示すように、樹脂積層体１３０の上面に金属インク１５０を２本の線状に吐出する。この際、インクジェットヘッド７６は、複数のホール１３２の内部に形成された底面電極１４０と接触するように、金属インク１５０を吐出する。つまり、複数のホール１３２の内部に形成された底面電極１４０を繋ぐように、金属インク１５０が吐出される。そして、第１造形ユニット２２の加熱部７４において、金属インク１５０が、ヒータ７８により加熱されることで、金属インク１５０が焼成し、配線１５２が形成される。これにより、樹脂積層体１３０の複数のホール１３２の内部に形成された底面電極１４０と導通するように、樹脂積層体１３０の上面に２本の配線１５２が形成される。なお、２本の配線１５２は、互いの端部を対向させた状態で１直線状に配置されている。 Next, in the first printing unit 72 of the first modeling unit 22, the inkjet head 76 ejects the metal ink 150 linearly into two lines on the upper surface of the resin laminate 130 as shown in FIG. 7. At this time, the inkjet head 76 ejects the metal ink 150 so as to come into contact with the bottom electrodes 140 formed inside the plurality of holes 132. That is, the metal ink 150 is ejected so as to connect the bottom electrodes 140 formed inside the plurality of holes 132. Then, in the heating unit 74 of the first modeling unit 22, the metal ink 150 is heated by the heater 78, so that the metal ink 150 is fired and the wiring 152 is formed. As a result, two wirings 152 are formed on the upper surface of the resin laminate 130 so as to conduct with the bottom electrodes 140 formed inside the plurality of holes 132 of the resin laminate 130. The two wirings 152 are arranged in a straight line with their ends facing each other.
　次に、ステージ５２が、第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４において、図８に示すように、樹脂積層体１３０の上に樹脂積層体１６０が形成される。樹脂積層体１６０は、樹脂積層体１３０の上面に形成された２本の配線１５２を覆うように形成される。ただし、樹脂積層体１６０には、２本の配線１５２の互いに対向する端部が露出するキャビティ１６２と、各配線１５２の一部が露出する複数のホール１６４とが形成されている。なお、樹脂積層体１６０は、樹脂積層体１３０と同様に、インクジェットヘッド８８による紫外線硬化樹脂の吐出と、照射装置９２による紫外線の照射とが繰り返されることで、形成される。 Next, the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 8, the resin laminate 160 is formed on the resin laminate 130. The resin laminate 160 is formed so as to cover the two wirings 152 formed on the upper surface of the resin laminate 130. However, the resin laminate 160 is formed with a cavity 162 in which the end portions of the two wirings 152 facing each other are exposed, and a plurality of holes 164 in which a part of each wiring 152 is exposed. The resin laminate 160 is formed by repeating the ejection of the ultraviolet curable resin by the inkjet head 88 and the irradiation of ultraviolet rays by the irradiation device 92, similarly to the resin laminate 130.
　続いて、ステージ５２が第１造形ユニット２２の下方に移動され、第１印刷部７２において、インクジェットヘッド７６が、図９に示すように、樹脂積層体１６０のホール１６４の内部に金属インク１７０を吐出する。この際、インクジェットヘッド７６は、樹脂積層体１６０の上面と、ホール１６４の内部に吐出された金属インク１７０の上面とが面一となるように、金属インク１７０を吐出する。そして、第１造形ユニット２２の加熱部７４において、金属インク１７０が、ヒータ７８により加熱されることで、金属インク１７０が焼成する。これにより、金属インク１７０が金属化し、ビア１７２が形成される Subsequently, the stage 52 is moved below the first modeling unit 22, and in the first printing unit 72, the inkjet head 76 puts the metal ink 170 inside the holes 164 of the resin laminate 160, as shown in FIG. Discharge. At this time, the inkjet head 76 ejects the metal ink 170 so that the upper surface of the resin laminate 160 and the upper surface of the metal ink 170 ejected into the hole 164 are flush with each other. Then, in the heating unit 74 of the first modeling unit 22, the metal ink 170 is heated by the heater 78, so that the metal ink 170 is fired. As a result, the metal ink 170 is metallized and vias 172 are formed.
　続いて、第１造形ユニット２２の第１印刷部７２において、インクジェットヘッド７６が、図９に示すように、樹脂積層体１６０の上面に金属インク１８０を線状に吐出する。この際、インクジェットヘッド７６は、複数のホール１６４の内部に形成されたビア１７２と接触するように、金属インク１８０を吐出する。つまり、複数のホール１６４の内部に形成されたビア１７２を繋ぐように、金属インク１８０が吐出される。そして、第１造形ユニット２２の加熱部７４において、金属インク１８０が、ヒータ７８により加熱されることで、金属インク１８０が焼成し、配線１８２が形成される。これにより、樹脂積層体１６０の複数のホール１６４の内部に形成されたビア１７２と導通するように、樹脂積層体１６０の上面に配線１８２が形成される。 Subsequently, in the first printing unit 72 of the first modeling unit 22, the inkjet head 76 linearly ejects the metal ink 180 onto the upper surface of the resin laminate 160, as shown in FIG. At this time, the inkjet head 76 ejects the metal ink 180 so as to come into contact with the vias 172 formed inside the plurality of holes 164. That is, the metal ink 180 is ejected so as to connect the vias 172 formed inside the plurality of holes 164. Then, in the heating unit 74 of the first modeling unit 22, the metal ink 180 is heated by the heater 78, so that the metal ink 180 is fired and the wiring 182 is formed. As a result, the wiring 182 is formed on the upper surface of the resin laminate 160 so as to be conductive with the vias 172 formed inside the plurality of holes 164 of the resin laminate 160.
　次に、ステージ５２が、第２造形ユニット２４の下方に移動される。そして、第２造形ユニット２４において、図１０に示すように、樹脂積層体１６０の上に樹脂積層体１９０が形成される。樹脂積層体１９０は、樹脂積層体１６０の上面に形成された配線１８２を覆うように形成される。ただし、樹脂積層体１９０には、樹脂積層体１６０のキャビティ１６２と連通するキャビティ１９２と、配線１８２の一部が露出する複数のホール１９４とが形成されている。なお、樹脂積層体１９０は、樹脂積層体１３０，１６０と同様に、インクジェットヘッド８８による紫外線硬化樹脂の吐出と、照射装置９２による紫外線の照射とが繰り返されることで、形成される。 Next, the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 10, the resin laminate 190 is formed on the resin laminate 160. The resin laminate 190 is formed so as to cover the wiring 182 formed on the upper surface of the resin laminate 160. However, the resin laminate 190 is formed with a cavity 192 communicating with the cavity 162 of the resin laminate 160 and a plurality of holes 194 in which a part of the wiring 182 is exposed. The resin laminate 190 is formed by repeating the ejection of the ultraviolet curable resin by the inkjet head 88 and the irradiation of ultraviolet rays by the irradiation device 92, similarly to the resin laminates 130 and 160.
　そして、樹脂積層体１９０が形成されると、ステージ５２が第１造形ユニット２２の下方に移動され、第１印刷部７２において、ディスペンスヘッド７７が、樹脂積層体１６０，１９０のキャビティ１６２，１９２の内部に金属ペースト２００を吐出する。この際、ディスペンスヘッド７７は、キャビティ１６２，１９２の内部で露出している配線１５２の端部の上に、金属ペースト２００を吐出する。さらに、ディスペンスヘッド７７は、樹脂積層体１９０のホール１９４の内部に金属ペースト２０２を吐出する。この際、ディスペンスヘッド７７は、ホール１９４の内部で露出している配線１８２の上に、金属ペースト２０２を吐出する。 Then, when the resin laminate 190 is formed, the stage 52 is moved below the first modeling unit 22, and in the first printing unit 72, the dispense head 77 is moved to the cavities 162 and 192 of the resin laminates 160 and 190. The metal paste 200 is discharged inside. At this time, the dispense head 77 discharges the metal paste 200 onto the end of the wiring 152 exposed inside the cavities 162 and 192. Further, the dispense head 77 discharges the metal paste 202 into the hole 194 of the resin laminate 190. At this time, the dispense head 77 discharges the metal paste 202 onto the wiring 182 exposed inside the hole 194.
　このように、配線１５２，１８２の上に金属ペースト２００，２０２が吐出されると、ステージ５２が装着ユニット２６の下方に移動される。そして、装着ユニット２６では、テープフィーダ１０４により電子部品（図１１参照）２１０が供給され、その電子部品２１０が装着ヘッド１０６のチャックによって、保持される。なお、図１０に示すように、電子部品２１０は、部品本体２１２と、部品本体２１２の下面に配設された２個の電極２１４とにより構成されている。そして、装着ヘッド１０６が、移動装置１０８によって移動され、チャックにより保持された電子部品２１０が、キャビティ１６２，１９２の内部に装着される。この際、電子部品２１０の電極２１４が、配線１５２の上に吐出された金属ペースト２００に接触するように、電子部品２１０はキャビティ１６２，１９２の内部に装着される。 In this way, when the metal pastes 200 and 202 are discharged onto the wirings 152 and 182, the stage 52 is moved below the mounting unit 26. Then, in the mounting unit 26, an electronic component (see FIG. 11) 210 is supplied by the tape feeder 104, and the electronic component 210 is held by the chuck of the mounting head 106. As shown in FIG. 10, the electronic component 210 is composed of a component main body 212 and two electrodes 214 arranged on the lower surface of the component main body 212. Then, the mounting head 106 is moved by the moving device 108, and the electronic component 210 held by the chuck is mounted inside the cavities 162 and 192. At this time, the electronic component 210 is mounted inside the cavities 162 and 192 so that the electrode 214 of the electronic component 210 comes into contact with the metal paste 200 discharged onto the wiring 152.
　また、装着ユニット２６では、トレイ型供給装置１０５によりプローブピン２１６が供給され、そのプローブピン２１６が装着ヘッド１０６のチャックによって、保持される。そして、装着ヘッド１０６が、移動装置１０８によって移動され、チャックにより保持されたプローブピン２１６が、ホール１９４に挿入される。この際、プローブピン２１６の下端が、ホール１９４の内部に吐出された金属ペースト２０２に接触するように、プローブピン２１６はホール１９４に挿入される。なお、ホール１９４の深さ寸法は、プローブピン２１６の長さ寸法より短くされているため、ホール１９４に挿入されたプローブピン２１６の上端は、樹脂積層体１９０の上面から突出している。 Further, in the mounting unit 26, the probe pin 216 is supplied by the tray type feeding device 105, and the probe pin 216 is held by the chuck of the mounting head 106. Then, the mounting head 106 is moved by the moving device 108, and the probe pin 216 held by the chuck is inserted into the hole 194. At this time, the probe pin 216 is inserted into the hole 194 so that the lower end of the probe pin 216 comes into contact with the metal paste 202 discharged into the hole 194. Since the depth dimension of the hole 194 is shorter than the length dimension of the probe pin 216, the upper end of the probe pin 216 inserted into the hole 194 protrudes from the upper surface of the resin laminate 190.
　続いて、ステージ５２が第１造形ユニット２２の下方に移動される。そして、第１造形ユニット２２の加熱部７４において、金属ペースト２００，２０２が、ヒータ７８により加熱されることで、金属ペースト２００，２０２が硬化し、金属ペースト２００，２０２が導電化する。これにより、回路プレート１２０ｃが形成される。つまり、回路プレート１２０ｃでは、複数の樹脂積層体１３０，１６０，１９０が積層されており、積層された複数の樹脂積層体１３０，１６０，１９０の間に配線１５２，１８２が形成されている。そして、配線１５２，１８２がビア１７２により上下方向において導通するとともに、配線１５２が底面電極１４０により回路プレート１２０ｃの下面側に導通し、配線１８２がプローブピン２１６により回路プレート１２０ｃの上面側に導通している。また、樹脂積層体１６０，１９０のキャビティ１６２，１９２に、電子部品２１０が配線１５２に導通した状態で装着されている。このように、回路形成装置１０では、上述した方法に従って、パッケージ化された回路プレート１２０ｃが感熱剥離フィルム７０の上に形成される。 Subsequently, the stage 52 is moved below the first modeling unit 22. Then, in the heating unit 74 of the first modeling unit 22, the metal pastes 200 and 202 are heated by the heater 78, so that the metal pastes 200 and 202 are cured and the metal pastes 200 and 202 are made conductive. As a result, the circuit plate 120c is formed. That is, in the circuit plate 120c, a plurality of resin laminates 130, 160, 190 are laminated, and wirings 152, 182 are formed between the laminated resin laminates 130, 160, 190. Then, the wirings 152 and 182 are conducted in the vertical direction by the via 172, the wiring 152 is conducted to the lower surface side of the circuit plate 120c by the bottom electrode 140, and the wiring 182 is conducted to the upper surface side of the circuit plate 120c by the probe pin 216. ing. Further, the electronic component 210 is mounted in the cavities 162 and 192 of the resin laminates 160 and 190 in a state of being conductive on the wiring 152. As described above, in the circuit forming apparatus 10, the packaged circuit plate 120c is formed on the heat-sensitive release film 70 according to the method described above.
　また、回路形成装置１０では、上述した方法（以下、「第１回路形成方法」と記載する）と異なる方法（以下、「第２回路形成方法」と記載する）により、回路プレート１２０ｃを形成することも可能である。具体的には、ステージ５２が第１造形ユニット２２の下方に移動され、第１造形ユニット２２の第１印刷部７２において、ディスペンスヘッド７７が、図１２に示すように、感熱剥離フィルム７０の上に金属ペースト１３８を吐出する。なお、金属ペースト１３８の吐出箇所は、第１回路形成方法において樹脂積層体１３０が形成される際のホール１９４の形成箇所である。そして、金属ペースト１３８が吐出されると、第１造形ユニット２２の加熱部７４において、金属ペースト１３８が、ヒータ７８により加熱されることで、金属ペースト１３８が導電化する。これにより、底面電極１４０が形成される。 Further, in the circuit forming apparatus 10, the circuit plate 120c is formed by a method different from the above-mentioned method (hereinafter referred to as "first circuit forming method") (hereinafter referred to as "second circuit forming method"). It is also possible. Specifically, the stage 52 is moved below the first modeling unit 22, and in the first printing section 72 of the first modeling unit 22, the dispense head 77 is placed on the heat-sensitive release film 70 as shown in FIG. The metal paste 138 is discharged to the machine. The discharge point of the metal paste 138 is the place where the hole 194 is formed when the resin laminate 130 is formed in the first circuit forming method. Then, when the metal paste 138 is discharged, the metal paste 138 is heated by the heater 78 in the heating unit 74 of the first modeling unit 22, so that the metal paste 138 becomes conductive. As a result, the bottom electrode 140 is formed.
　続いて、ステージ５２が第２造形ユニット２４の下方に移動され、第２造形ユニット２４の第２印刷部８４において、図６に示すように、感熱剥離フィルム７０の上面に、樹脂積層体１３０が形成される。この際、感熱剥離フィルム７０の上に先に形成されている底面電極１４０の位置に、ホール１９４が位置するように、樹脂積層体１３０が形成される。つまり、第１回路形成方法では、感熱剥離フィルム７０の上に、まず、ホール１３２を有する樹脂積層体１３０が形成され、その樹脂積層体１３０のホール１３２の内部に、底面電極１４０が形成される。一方、第２回路形成方法では、感熱剥離フィルム７０の上に、まず、底面電極１４０が形成され、その底面電極１４０を取り囲むように、樹脂積層体１３０が形成されることで、底面電極１４０の形成箇所がホール１３２として機能する。なお、第２回路形成方法における樹脂積層体１３０も、第１回路形成方法における樹脂積層体１３０と同様に、インクジェットヘッド８８による紫外線硬化樹脂の吐出と、照射装置９２による紫外線の照射とが繰り返されることで、形成される。そして、第２回路形成方法において、金属ペースト１３８と樹脂積層体１６０とが形成された後に、第１回路形成方法と同様に、樹脂積層体１６０，１９０、配線１５２，１８２、ビア１７２等が形成され、電子部品２１０等が装着されることで、回路プレート１２０ｃが感熱剥離フィルム７０の上に形成される。 Subsequently, the stage 52 is moved below the second modeling unit 24, and in the second printing section 84 of the second modeling unit 24, as shown in FIG. 6, the resin laminate 130 is placed on the upper surface of the heat-sensitive release film 70. It is formed. At this time, the resin laminate 130 is formed so that the hole 194 is located at the position of the bottom electrode 140 previously formed on the heat-sensitive release film 70. That is, in the first circuit forming method, the resin laminate 130 having the holes 132 is first formed on the heat-sensitive release film 70, and the bottom electrode 140 is formed inside the holes 132 of the resin laminate 130. .. On the other hand, in the second circuit forming method, the bottom electrode 140 is first formed on the heat-sensitive release film 70, and the resin laminate 130 is formed so as to surround the bottom electrode 140, whereby the bottom electrode 140 is formed. The formed portion functions as a hole 132. In the resin laminate 130 in the second circuit forming method, similarly to the resin laminate 130 in the first circuit forming method, the ejection of the ultraviolet curable resin by the inkjet head 88 and the irradiation of ultraviolet rays by the irradiation device 92 are repeated. It is formed by that. Then, in the second circuit forming method, after the metal paste 138 and the resin laminate 160 are formed, the resin laminate 160, 190, the wiring 152, 182, the via 172, and the like are formed in the same manner as in the first circuit forming method. Then, the circuit plate 120c is formed on the heat-sensitive release film 70 by mounting the electronic component 210 or the like.
　このように、回路形成装置１０では、第１回路形成方法と第２回路形成方法との何れに手法によっても、回路プレート１２０ｃを感熱剥離フィルム７０の上に形成することが可能である。そして、回路プレート１２０ｃが形成されると、ステージ５２が第１造形ユニット２２の下に移動され、第１造形ユニット２２の加熱部７４において、感熱剥離フィルム７０がヒータ７８により加熱される。これにより、感熱剥離フィルム７０の粘着性が低下し、回路プレート１２０ｃを感熱剥離フィルム７０とともに、基台６０から容易に剥がすことができる。そして、回路プレート１２０ｃと感熱剥離フィルム７０とが剥離されることで、回路プレート１２０ｃの作成が完了する。また、回路プレート１２０ｃ以外の回路プレート１２０ａ，ｂ，ｄ～ｆも、回路プレート１２０ｃと略同様の方法により作成される。そして、複数の回路プレート１２０ａ～ｆが作成されると、図３に示すように、複数の回路プレート１２０ａ～ｆが積層される。この際、例えば、回路プレート１２０ｃの上面から突出しているプローブピン２１６が、その回路プレート１２０ｃの上に積層される回路プレート１２０ｂの底面電極２２０と接触するように、回路プレート１２０が積層される。なお、プローブピン２１６には、コイルスプリング（図示省略）が内蔵されており、伸縮可能とされている。このため、回路プレート１２０ｃのプローブピン２１６が回路プレート１２０ｂの底面電極２２０と接触するように、回路プレート１２０が積層された際に、プローブピン２１６が収縮することで、コイルスプリングの弾性力によりプローブピン２１６と底面電極２２０との導通が担保される。そして、それら複数の回路プレート１２０が積層された状態でビス止めされることで回路１２２が形成される。 As described above, in the circuit forming apparatus 10, the circuit plate 120c can be formed on the heat-sensitive release film 70 by either the first circuit forming method or the second circuit forming method. Then, when the circuit plate 120c is formed, the stage 52 is moved under the first modeling unit 22, and the heat-sensitive release film 70 is heated by the heater 78 in the heating unit 74 of the first modeling unit 22. As a result, the adhesiveness of the heat-sensitive release film 70 is reduced, and the circuit plate 120c can be easily peeled off from the base 60 together with the heat-sensitive release film 70. Then, the circuit plate 120c and the heat-sensitive release film 70 are peeled off to complete the production of the circuit plate 120c. Further, the circuit plates 120a, b, d to f other than the circuit plate 120c are also produced by a method substantially similar to that of the circuit plate 120c. Then, when a plurality of circuit plates 120a to ff are created, the plurality of circuit plates 120a to ff are laminated as shown in FIG. At this time, for example, the circuit plate 120 is laminated so that the probe pin 216 protruding from the upper surface of the circuit plate 120c comes into contact with the bottom electrode 220 of the circuit plate 120b laminated on the circuit plate 120c. The probe pin 216 has a built-in coil spring (not shown) and can be expanded and contracted. Therefore, when the circuit plates 120 are stacked so that the probe pins 216 of the circuit plate 120c come into contact with the bottom electrode 220 of the circuit plate 120b, the probe pins 216 contract, and the probe is driven by the elastic force of the coil spring. The continuity between the pin 216 and the bottom electrode 220 is ensured. Then, the circuit 122 is formed by screwing the plurality of circuit plates 120 in a laminated state.
　ただし、回路プレート１２０が感熱剥離フィルム７０の上に形成された後に、回路プレート１２０と感熱剥離フィルム７０とが剥離される際に、図１３に示すように、底面電極１４０が感熱剥離フィルム７０に密着し、回路プレート１２０から離脱する場合がある。つまり、底面電極１４０が、感熱剥離フィルム７０の剥離に伴って、回路プレート１２０の樹脂積層体１３０のホール１３２から抜け落ちる場合がある。 However, when the circuit plate 120 and the heat-sensitive release film 70 are peeled off after the circuit plate 120 is formed on the heat-sensitive release film 70, as shown in FIG. 13, the bottom electrode 140 is attached to the heat-sensitive release film 70. It may come into close contact and separate from the circuit plate 120. That is, the bottom electrode 140 may come off from the hole 132 of the resin laminate 130 of the circuit plate 120 as the heat-sensitive release film 70 is peeled off.
　これは、底面電極１４０と配線１５２との密着力が、底面電極１４０と感熱剥離フィルム７０との密着力より低いためである。また、樹脂積層体１３０のホール１３２は、理想的に、図１４に示すように、概して円柱形状とされる。つまり、ホール１３２の内径は、理想的に、全域に渡って同じとされ、樹脂積層体１３０の下面側へのホール１３２の開口の面積（以下、「下面側開口面積」と記載する）と、樹脂積層体１３０の上面側へのホール１３２の開口の面積（以下、「上面側開口面積」と記載する）とが同じとされている。このように、下面側開口面積と上面側開口面積とが同じとされている場合に、樹脂積層体１３０の上面での底面電極１４０と配線１５２との密着力が、樹脂積層体１３０の下面での底面電極１４０と感熱剥離フィルム７０との密着力より低いと、底面電極１４０がホール１３２から離脱し易くなる。 This is because the adhesion between the bottom electrode 140 and the wiring 152 is lower than the adhesion between the bottom electrode 140 and the heat-sensitive release film 70. Ideally, the holes 132 of the resin laminate 130 have a generally cylindrical shape as shown in FIG. That is, the inner diameter of the hole 132 is ideally the same over the entire area, and the area of the opening of the hole 132 to the lower surface side of the resin laminate 130 (hereinafter, referred to as “lower surface side opening area”). The area of the opening of the hole 132 to the upper surface side of the resin laminate 130 (hereinafter, referred to as “upper surface side opening area”) is the same. In this way, when the lower surface side opening area and the upper surface side opening area are the same, the adhesion between the bottom electrode 140 and the wiring 152 on the upper surface of the resin laminate 130 is increased on the lower surface of the resin laminate 130. If the adhesive strength between the bottom electrode 140 and the heat-sensitive release film 70 is lower than that of the bottom electrode 140, the bottom electrode 140 is likely to separate from the hole 132.
　さらに言えば、第２回路形成方法で回路プレート１２０が形成される場合には、感熱剥離フィルム７０の上に、まず、金属ペースト１３８が吐出される。この際、金属ペースト１３８の表面張力により、図１５に示すように、金属ペースト１３８の上端部が湾曲し、半球形状となる場合がある。そして、その金属ペースト１３８がヒータ７８の加熱により硬化し、底面電極１４０とされた後に、その底面電極１４０を取り囲むように樹脂積層体１３０が形成される際に、紫外線硬化樹脂が底面電極１４０の上端部に向って濡れ上がる場合がある。このような場合には、ホール１３２の下面側開口面積は上面側開口面積より小さくなり、底面電極１４０がホール１３２から、更に離脱し易くなる。 Furthermore, when the circuit plate 120 is formed by the second circuit forming method, the metal paste 138 is first discharged onto the heat-sensitive release film 70. At this time, due to the surface tension of the metal paste 138, as shown in FIG. 15, the upper end portion of the metal paste 138 may be curved to form a hemispherical shape. Then, after the metal paste 138 is cured by heating the heater 78 to form the bottom electrode 140, when the resin laminate 130 is formed so as to surround the bottom electrode 140, the ultraviolet curable resin is formed on the bottom electrode 140. It may get wet toward the upper end. In such a case, the lower surface side opening area of the hole 132 becomes smaller than the upper surface side opening area, and the bottom surface electrode 140 is more easily separated from the hole 132.
　このようなことに鑑みて、回路形成装置１０では、第２回路形成方法により回路プレート１２０は形成されず、第１回路形成方向により回路プレート１２０が形成される。そして、底面電極１４０の離脱を防止するべく、第１回路形成方法において、図１６に示すように、ホール２３０の下面側開口面積が上面側開口面積より小さくなるように、樹脂積層体１３０が形成される。つまり、ホール２３０を区画する樹脂積層体１３０の内壁面が、下方に向うほどホール２３０の内部に向うとともに、上方に向うほどホール２３０の外部に向うテーパ面となるように、樹脂積層体１３０が形成される。そして、樹脂積層体１３０のホール２３０の内部に、金属ペースト１３８が吐出され、その金属ペースト１３８がヒータ７８により加熱されることで、金属ペースト１３８が硬化し、底面電極１４０が形成される。このように、下面側開口面積が上面側開口面積より小さいホール２３０の内部に、底面電極１４０が形成されることで、回路プレート１２０が形成された後に、回路プレート１２０から感熱剥離フィルム７０が剥離される際に、底面電極１４０の離脱を防止することができる。特に、感熱剥離フィルム７０が剥離される際に、底面電極１４０が感熱剥離フィルム７０とともに引っ張られる力を、ホール２３０を区画する樹脂積層体１３０の内壁のテーパ面により押さえることができるため、効果的に底面電極１４０の離脱を防止することができる。 In view of this, in the circuit forming apparatus 10, the circuit plate 120 is not formed by the second circuit forming method, but the circuit plate 120 is formed by the first circuit forming direction. Then, in order to prevent the bottom electrode 140 from coming off, the resin laminate 130 is formed so that the lower surface side opening area of the hole 230 is smaller than the upper surface side opening area as shown in FIG. 16 in the first circuit forming method. Will be done. That is, the resin laminate 130 has a tapered surface so that the inner wall surface of the resin laminate 130 that partitions the hole 230 faces the inside of the hole 230 toward the bottom and becomes a tapered surface toward the outside of the hole 230 toward the top. It is formed. Then, the metal paste 138 is discharged into the hole 230 of the resin laminate 130, and the metal paste 138 is heated by the heater 78 to cure the metal paste 138 and form the bottom electrode 140. In this way, the bottom electrode 140 is formed inside the hole 230 whose lower surface opening area is smaller than the upper surface opening area, so that the heat-sensitive release film 70 is peeled from the circuit plate 120 after the circuit plate 120 is formed. At that time, it is possible to prevent the bottom electrode 140 from coming off. In particular, when the heat-sensitive release film 70 is peeled off, the force that the bottom electrode 140 is pulled together with the heat-sensitive release film 70 can be suppressed by the tapered surface of the inner wall of the resin laminate 130 that partitions the hole 230, which is effective. It is possible to prevent the bottom electrode 140 from coming off.
　なお、制御装置２８のコントローラ１１０は、図２に示すように、樹脂層形成部２５０と、塗布部２５２と、配線形成部２５４とを有している。樹脂層形成部２５０は、ホール２３０を有する樹脂積層体１３０を形成するための機能部である。塗布部２５２は、ホール２３０の内部に金属ペースト１３８を吐出するための機能部である。配線形成部２５４は、ホール２３０の内部に形成された底面電極１４０と導通するように、樹脂積層体１３０の上面に配線１５２を形成するための機能部である。 As shown in FIG. 2, the controller 110 of the control device 28 has a resin layer forming portion 250, a coating portion 252, and a wiring forming portion 254. The resin layer forming portion 250 is a functional portion for forming the resin laminate 130 having the holes 230. The coating unit 252 is a functional unit for discharging the metal paste 138 into the hole 230. The wiring forming portion 254 is a functional portion for forming the wiring 152 on the upper surface of the resin laminate 130 so as to be conductive with the bottom electrode 140 formed inside the hole 230.
　ちなみに、上記実施例において、回路形成装置１０は、回路形成装置の一例である。第２造形ユニット２４は、樹脂層形成装置の一例である。制御装置２８は、制御装置の一例である。感熱剥離フィルム７０は、基材の一例である。インクジェットヘッド７６及びヒータ７８は、配線形成装置の一例である。ディスペンスヘッド７７は、塗布装置の一例である。樹脂積層体１３０は、樹脂層の一例である。金属ペースト１３８は、導電性流体の一例である。配線１５２は、配線の一例である。ホール２３０は、ホールの一例である。樹脂層形成部２５０により実行される工程は、樹脂層形成工程の一例である。塗布部２５２により実行される工程は、塗布工程の一例である。配線形成部２５４により実行される工程は、配線形成工程の一例である。 By the way, in the above embodiment, the circuit forming apparatus 10 is an example of the circuit forming apparatus. The second modeling unit 24 is an example of a resin layer forming apparatus. The control device 28 is an example of the control device. The thermal release film 70 is an example of a base material. The inkjet head 76 and the heater 78 are examples of wiring forming devices. The dispense head 77 is an example of a coating device. The resin laminate 130 is an example of a resin layer. Metal paste 138 is an example of a conductive fluid. The wiring 152 is an example of wiring. Hall 230 is an example of a hall. The step executed by the resin layer forming unit 250 is an example of the resin layer forming step. The step executed by the coating unit 252 is an example of the coating process. The process executed by the wiring forming unit 254 is an example of the wiring forming process.
　また、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。例えば、上記実施例では、ホール２３０を区画する樹脂積層体１３０の内壁面をテーパ面とすることで、ホール２３０の下面側開口面積が上面側開口面積より小さくされているが、ホール２３０を区画する樹脂積層体１３０の内壁面の形状として、種々の形状を採用することが可能である。具体的には、例えば、図１７に示すように、ホール２３０を区画する樹脂積層体１３０の内壁面の下端部を、ホール２３０の内部に向って湾曲する形状とすることで、ホール２３０の下面側開口面積を上面側開口面積より小さくしてもよい。また、例えば、図１８に示すように、ホール２３０を区画する樹脂積層体１３０の内壁面を段差面形状とすることで、ホール２３０の下面側開口面積を上面側開口面積より小さくしてもよい。 Further, the present invention is not limited to the above-mentioned examples, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the inner wall surface of the resin laminate 130 for partitioning the hole 230 is made a tapered surface, so that the opening area on the lower surface side of the hole 230 is smaller than the opening area on the upper surface side, but the hole 230 is partitioned. Various shapes can be adopted as the shape of the inner wall surface of the resin laminate 130 to be formed. Specifically, for example, as shown in FIG. 17, the lower end of the inner wall surface of the resin laminate 130 that partitions the hole 230 is formed to have a shape that curves toward the inside of the hole 230, so that the lower surface of the hole 230 is formed. The side opening area may be smaller than the upper surface side opening area. Further, for example, as shown in FIG. 18, the lower surface side opening area of the hole 230 may be smaller than the upper surface side opening area by forming the inner wall surface of the resin laminate 130 that partitions the hole 230 into a stepped surface shape. ..
　また、上記実施例では、樹脂積層体１３０のホール２３０の内部の全てを占有するように金属ペースト１３８が吐出されているが、ホール２３０の一部にのみ金属ペースト１３８が吐出されてもよい。具体的には、図１９に示すように、樹脂積層体１３０の下面側のホール２３０の開口と、樹脂積層体１３０の上面側のホール２３０の開口とを繋ぐように、金属ペースト２６０をホール２３０の一部に吐出する。そして、その金属ペースト２６０を加熱することで、樹脂積層体１３０の上面側のホール２３０の開口と、樹脂積層体１３０の下面側のホール２３０の開口とを繋ぐ底面電極２６２を形成する。次に、ホール２３０の内部の底面電極２６２以外の箇所に紫外線硬化樹脂２６４を吐出し、紫外線を照射することで、その紫外線硬化樹脂２６４を硬化させる。このように、ホール２３０の一部に金属ペースト２６０を吐出し、ホール２３０の残りの部分に紫外線硬化樹脂２６４を吐出することでも、上記実施形態と同様に、底面電極２６２の離脱を防止することができる。また、金属ペーストは比較的、高価であるため、金属ペーストの使用量を抑制することで、コストダウンを図ることも可能となる。さらに言えば、金属ペーストは粘性が高いため、ホールの内部を金属ペーストのみで充填させることが困難であるが、粘性の低い紫外線硬化樹脂を併用することで、比較的、容易にホール内部を金属ペーストと紫外線硬化樹脂とにより充填することができる。 Further, in the above embodiment, the metal paste 138 is discharged so as to occupy the entire inside of the hole 230 of the resin laminate 130, but the metal paste 138 may be discharged only to a part of the hole 230. Specifically, as shown in FIG. 19, the metal paste 260 is formed in the hole 230 so as to connect the opening of the hole 230 on the lower surface side of the resin laminate 130 and the opening of the hole 230 on the upper surface side of the resin laminate 130. Discharge to a part of. Then, by heating the metal paste 260, a bottom electrode 262 connecting the opening of the hole 230 on the upper surface side of the resin laminate 130 and the opening of the hole 230 on the lower surface side of the resin laminate 130 is formed. Next, the ultraviolet curable resin 264 is discharged to a place other than the bottom electrode 262 inside the hole 230, and the ultraviolet curable resin 264 is cured by irradiating the hole 230 with ultraviolet rays. By discharging the metal paste 260 to a part of the hole 230 and the ultraviolet curable resin 264 to the remaining part of the hole 230 in this way, the bottom electrode 262 can be prevented from coming off as in the above embodiment. Can be done. Further, since the metal paste is relatively expensive, it is possible to reduce the cost by suppressing the amount of the metal paste used. Furthermore, since the metal paste has a high viscosity, it is difficult to fill the inside of the hole with only the metal paste, but by using an ultraviolet curable resin having a low viscosity together, it is relatively easy to fill the inside of the hole with a metal. It can be filled with a paste and an ultraviolet curable resin.
　また、上記実施例では、導電性流体として、金属ペーストが採用されているが、金属インクが導電性流体として採用されてもよい。この際、金属インクと金属ペーストとを導電性流体として採用することで、底面電極の離脱を効果的に抑制することが可能となる。具体的には、図２０に示すように、下面側開口面積が上面側開口面積より小さいホール２３０に、まず、金属インク２７０を薄膜状に吐出し、その金属インク２７０を加熱することで導電化させて、金属薄膜２７２を形成する。つまり、ホール２３０の内部において、感熱剥離フィルム７０の上面に金属インク２７０を薄膜状に吐出し、その金属インク２７０を加熱することで、感熱剥離フィルム７０と密着した状態の金属薄膜２７２を形成する。次に、ホール２３０の内部において、金属薄膜２７２の上に金属ペースト２７６を吐出する。そして、金属ペースト２７６を加熱することで導電化させて、金属塊２７８を形成する。これにより、ホール２３０の内部に、金属薄膜２７２と金属塊２７８とにより構成される底面電極が形成される。このような底面電極では、金属薄膜２７２と感熱剥離フィルム７０とが密着するが、金属製の金属薄膜２７２と、樹脂製の感熱剥離フィルム７０との密着力は、比較的弱い。このため、回路プレート１２０と感熱剥離フィルム７０とが剥離される際に、感熱剥離フィルム７０に密着している金属薄膜２７２は、感熱剥離フィルム７０から容易に剥がれる。これにより、底面電極の下面側を金属薄膜２７２により構成し、底面電極の上面側を金属塊２７８により構成することで、回路プレート１２０と感熱剥離フィルム７０とが剥離される際の底面電極の離脱を効果的に抑制することが可能となる。 Further, in the above embodiment, the metal paste is adopted as the conductive fluid, but the metal ink may be adopted as the conductive fluid. At this time, by adopting the metal ink and the metal paste as the conductive fluid, it is possible to effectively suppress the detachment of the bottom electrode. Specifically, as shown in FIG. 20, the metal ink 270 is first discharged into a thin film into the hole 230 whose lower surface side opening area is smaller than the upper surface side opening area, and the metal ink 270 is heated to make it conductive. To form a metal thin film 272. That is, inside the hole 230, the metal ink 270 is discharged into a thin film on the upper surface of the heat-sensitive release film 70, and the metal ink 270 is heated to form the metal thin film 272 in close contact with the heat-sensitive release film 70. .. Next, inside the hole 230, the metal paste 276 is discharged onto the metal thin film 272. Then, the metal paste 276 is heated to make it conductive to form a metal block 278. As a result, a bottom electrode composed of the metal thin film 272 and the metal block 278 is formed inside the hole 230. In such a bottom electrode, the metal thin film 272 and the heat-sensitive release film 70 are in close contact with each other, but the adhesion between the metal metal thin film 272 and the resin heat-sensitive release film 70 is relatively weak. Therefore, when the circuit plate 120 and the heat-sensitive release film 70 are peeled off, the metal thin film 272 that is in close contact with the heat-sensitive release film 70 is easily peeled off from the heat-sensitive release film 70. As a result, the lower surface side of the bottom electrode is made of the metal thin film 272, and the upper surface side of the bottom electrode is made of the metal block 278, so that the bottom electrode is separated when the circuit plate 120 and the heat-sensitive release film 70 are peeled off. Can be effectively suppressed.
　また、上記実施例では、ヒータ７８により、金属インク及び金属ペーストが加熱されているが、レーザ光等の照射により、金属インク及び金属ペーストが加熱されてもよい。 Further, in the above embodiment, the metal ink and the metal paste are heated by the heater 78, but the metal ink and the metal paste may be heated by irradiation with laser light or the like.
　また、上記実施例では、金属ペーストが、ディスペンスヘッド７７により吐出されているが、スタンプ等により金属ペーストが転写されてもよい。また、スクリーン印刷により、金属インク若しくは金属ペーストが印刷されてもよい。 Further, in the above embodiment, the metal paste is discharged by the dispense head 77, but the metal paste may be transferred by a stamp or the like. Further, metal ink or metal paste may be printed by screen printing.
　１０：回路形成装置　　２４：第２造形ユニット（樹脂形成装置）　　２８：制御装置　　７０：感熱剥離フィルム（基材）　　７６：インクジェットヘッド（配線形成装置）　　７７：ディスペンスヘッド（塗布装置）　　７８：ヒータ（配線形成装置）　　１３０：樹脂積層体（樹脂層）　　１３８：金属ペースト（導電性流体）　　１５２：配線　　２３０：ホール　　２５０：樹脂層形成部（樹脂層形成工程）　　２５２：塗布部（塗布工程）　　２５４：配線形成部（配線形成工程）　　２７０：金属インク（金属含有液）　　２７６：金属ペースト（樹脂ペースト） 10: Circuit forming device 24: Second modeling unit (resin forming device) 28: Control device 70: Heat-sensitive release film (base material) 76: Ink ink head (wiring forming device) 77: Dispens head (coating device) 78: Heater ( Wiring forming device) 130: Resin laminate (resin layer) 138: Metal paste (conductive fluid) 152: Wiring 230: Hole 250: Resin layer forming part (resin layer forming process) 252: Coating part (coating process) 254: Wiring forming part (wiring forming process) 270: Metal ink (metal-containing liquid) 276: Metal paste (resin paste)

Claims (4)

  1. 　ホールを有する樹脂層を硬化性樹脂により基材の上に形成する樹脂層形成工程と、
    　加熱することで導電性を発現する導電性流体を、前記ホールの内部に塗布する塗布工程と、
    　前記樹脂層の上に、前記ホールの内部に塗布された導電性流体と通電するように配線を形成する配線形成工程と、
    　前記基材の上に形成された前記樹脂層と、前記基材とを剥離する剥離工程と、
    　を含み、
    　前記樹脂層形成工程は、
    　前記樹脂層の下面側への前記ホールの開口の面積が、前記樹脂層の上面側への前記ホールの開口の面積より小さくなるように、前記樹脂層を形成する回路形成方法。     A resin layer forming step of forming a resin layer having holes on a base material with a curable resin, and
    A coating process in which a conductive fluid that develops conductivity by heating is applied to the inside of the hole, and
    A wiring forming step of forming wiring on the resin layer so as to energize the conductive fluid applied to the inside of the hole.
    A peeling step of peeling the resin layer formed on the base material and the base material,
    Including
    The resin layer forming step is
    A circuit forming method for forming the resin layer so that the area of the opening of the hole on the lower surface side of the resin layer is smaller than the area of the opening of the hole on the upper surface side of the resin layer.
  2. 　前記塗布工程は、
    　ナノメートルサイズの金属微粒子を含有する金属含有液を前記導電性流体として、前記ホールの内部において前記基材の上面に塗布し、マイクロメートルサイズの金属粒子を含有する樹脂ペーストを前記導電性流体として、前記ホールの内部において前記金属含有液の上面に塗布する請求項１に記載の回路形成方法。     The coating step is
    A metal-containing liquid containing nanometer-sized metal fine particles is applied as the conductive fluid on the upper surface of the base material inside the hole, and a resin paste containing micrometer-sized metal particles is used as the conductive fluid. The circuit forming method according to claim 1, wherein the metal-containing liquid is coated on the upper surface of the hole inside the hole.
  3. 　前記塗布工程は、
    　前記ホールの内部において前記樹脂層の下面側への開口と上面側への開口とを繋ぐように、前記導電性流体を、前記ホールの内部の一部に塗布し、前記ホールの内部の残りの部分に前記硬化性樹脂を塗布する請求項１または請求項２に記載の回路形成方法。     The coating step is
    The conductive fluid is applied to a part of the inside of the hole so as to connect the opening to the lower surface side and the opening to the upper surface side of the resin layer inside the hole, and the rest inside the hole. The circuit forming method according to claim 1 or 2, wherein the curable resin is applied to a portion.
  4. 　ホールを有する樹脂層を硬化性樹脂により形成する樹脂層形成装置と、
    　加熱することで導電性を発現する導電性流体を、前記ホールの内部に塗布する塗布装置と、
    　前記樹脂層の上に、前記ホールの内部に塗布された導電性流体と通電するように配線を形成する配線形成装置と、
    　前記樹脂層形成装置と前記塗布装置と前記配線形成装置との作動を制御することで回路を形成する制御装置と、
    　を備え、
    　前記樹脂層形成装置が、
    　回路が形成された後に剥離される基材の上に前記樹脂層を、前記樹脂層の下面側への前記ホールの開口の面積が、前記樹脂層の上面側への前記ホールの開口の面積より小さくなるように形成する回路形成装置。     A resin layer forming device for forming a resin layer having holes with a curable resin,
    A coating device that applies a conductive fluid that develops conductivity by heating to the inside of the hole, and
    A wiring forming device for forming wiring on the resin layer so as to energize the conductive fluid applied to the inside of the hole.
    A control device that forms a circuit by controlling the operation of the resin layer forming device, the coating device, and the wiring forming device.
    With
    The resin layer forming apparatus
    The resin layer is placed on a base material to be peeled off after the circuit is formed, and the area of the opening of the hole to the lower surface side of the resin layer is larger than the area of the opening of the hole to the upper surface side of the resin layer. A circuit forming device that is formed so as to be small.
PCT/JP2020/015298 2020-04-03 2020-04-03 Circuit formation method and circuit formation device WO2021199421A1 (en)

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JP2004087551A (en) * 2002-08-23 2004-03-18 Toppan Printing Co Ltd Process for producing multilaler wiring board, and multilaler wiring board produced through that process
JP2008034719A (en) * 2006-07-31 2008-02-14 Fujifilm Corp Electric wiring structure, liquid discharge head, liquid discharge device, and image forming apparatus
JP2010067897A (en) * 2008-09-12 2010-03-25 Hitachi Chem Co Ltd Method of manufacturing printed circuit board
JP2012209460A (en) * 2011-03-30 2012-10-25 Fujifilm Corp Pattern formation method and pattern formation device
WO2017009922A1 (en) * 2015-07-13 2017-01-19 富士機械製造株式会社 Wiring formation method and wiring formation device
WO2018142577A1 (en) * 2017-02-03 2018-08-09 株式会社Ｆｕｊｉ Circuit formation method and circuit formation device
WO2019123629A1 (en) * 2017-12-22 2019-06-27 株式会社Ｆｕｊｉ Method and device for manufacturing additively manufactured electronic device
WO2020012626A1 (en) * 2018-07-13 2020-01-16 株式会社Ｆｕｊｉ Circuit formation method and circuit formation device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087551A (en) * 2002-08-23 2004-03-18 Toppan Printing Co Ltd Process for producing multilaler wiring board, and multilaler wiring board produced through that process
JP2008034719A (en) * 2006-07-31 2008-02-14 Fujifilm Corp Electric wiring structure, liquid discharge head, liquid discharge device, and image forming apparatus
JP2010067897A (en) * 2008-09-12 2010-03-25 Hitachi Chem Co Ltd Method of manufacturing printed circuit board
JP2012209460A (en) * 2011-03-30 2012-10-25 Fujifilm Corp Pattern formation method and pattern formation device
WO2017009922A1 (en) * 2015-07-13 2017-01-19 富士機械製造株式会社 Wiring formation method and wiring formation device
WO2018142577A1 (en) * 2017-02-03 2018-08-09 株式会社Ｆｕｊｉ Circuit formation method and circuit formation device
WO2019123629A1 (en) * 2017-12-22 2019-06-27 株式会社Ｆｕｊｉ Method and device for manufacturing additively manufactured electronic device
WO2020012626A1 (en) * 2018-07-13 2020-01-16 株式会社Ｆｕｊｉ Circuit formation method and circuit formation device

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