WO2024062605A1 - Circuit forming device and circuit forming method - Google Patents

Circuit forming device and circuit forming method Download PDF

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Publication number
WO2024062605A1
WO2024062605A1 PCT/JP2022/035405 JP2022035405W WO2024062605A1 WO 2024062605 A1 WO2024062605 A1 WO 2024062605A1 JP 2022035405 W JP2022035405 W JP 2022035405W WO 2024062605 A1 WO2024062605 A1 WO 2024062605A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
conductive paste
electrode
resin
mounting
Prior art date
Application number
PCT/JP2022/035405
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French (fr)
Japanese (ja)
Inventor
謙磁 塚田
亮二郎 富永
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/035405 priority Critical patent/WO2024062605A1/en
Publication of WO2024062605A1 publication Critical patent/WO2024062605A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the present invention relates to a circuit forming apparatus and the like that mounts electronic components so that electrodes are in contact with conductive paste.
  • Patent Document 1 listed below describes a technique for mounting electronic components so that electrodes are in contact with conductive paste.
  • the object of the present invention is to appropriately form a substrate including an electronic component mounted so that an electrode is in contact with a conductive paste.
  • the present specification provides a first coating device that applies a conductive paste to a position shifted away from the electronic component from a scheduled mounting position of an electrode of the electronic component, and a A circuit forming apparatus is disclosed that includes a mounting device for mounting the electronic component so that the electrode contacts the conductive paste applied by the device.
  • the present specification includes a coating process of applying a conductive paste to a position shifted away from the electronic component from a planned mounting position of an electrode of the electronic component, and a coating process of applying the conductive paste to a position that is shifted away from the electronic component, and a conductive paste applied in the coating process.
  • a circuit forming method including a mounting step of mounting the electronic component so that the electrodes are in contact with each other.
  • a conductive paste is applied to a position shifted away from the electronic component from the planned mounting position of the electrode of the electronic component. Then, electronic components are mounted so that the electrodes are in contact with the applied conductive paste. This makes it possible to appropriately form a substrate including an electronic component mounted so that the electrode is in contact with the conductive paste.
  • FIG. 2 is a block diagram showing a control device.
  • FIG. 2 is a cross-sectional view showing a circuit board with a resin laminate formed thereon.
  • FIG. 2 is a cross-sectional view showing a circuit board with wiring formed on a resin laminate.
  • FIG. 2 is a cross-sectional view showing a circuit board with conductive paste applied on wiring.
  • FIG. 2 is a cross-sectional view showing a circuit board with a thermosetting resin coated on a resin layer.
  • FIG. 2 is a cross-sectional view showing a circuit board with electronic components mounted thereon.
  • FIG. 3 is a cross-sectional view showing a circuit board with electronic components pressed against a resin laminate.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached.
  • FIG. 13 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
  • FIG. 3 is a diagram showing the adhesion area ratio for each size of electronic components.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
  • FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
  • FIG. 1 shows a circuit forming apparatus 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a fourth modeling unit 25, a pressing unit 26, a mounting unit 27, and a control unit 26.
  • a device (see FIG. 2) 28 is provided.
  • the conveyance device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, and the mounting unit 27 are arranged on the base 29 of the circuit forming apparatus 10. has been done.
  • the base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the short direction of the base 29 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 includes a base 60, a holding device 62, a lifting device (see FIG. 2) 64, and a heater (see FIG. 2) 66.
  • the base 60 is formed into a flat plate shape, and a substrate is placed on the top surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the substrate is fixedly held.
  • the lifting device 64 is disposed below the base 60 and raises and lowers the base 60.
  • the heater 66 is built into the base 60 and heats the substrate placed on the base 60 to an arbitrary temperature.
  • the first modeling unit 22 is a unit that shapes wiring on a circuit board, and includes a first printing section 72 and a firing section 74.
  • the first printing section 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 discharges metal ink in a linear manner.
  • Metal ink is made by dispersing nanometer-sized metal particles, such as silver, in a solvent. Note that the surface of the metal fine particles is coated with a dispersant to prevent agglomeration in the solvent. Further, the inkjet head 76 ejects metal ink from a plurality of nozzles using a piezo system using piezoelectric elements, for example.
  • the baking section 74 has an infrared irradiation device 78 (see Figure 2).
  • the infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays.
  • the metal ink irradiated with infrared rays is baked, and wiring is formed.
  • baking of metal ink is a phenomenon in which, by applying energy, the solvent is evaporated and the protective film for the metal particles, i.e., the dispersant is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.
  • the second modeling unit 23 is a unit that models the resin layer of the circuit board, and includes a second printing section 84 and a curing section 86.
  • the second printing section 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges ultraviolet curing resin.
  • Ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be of a piezo type using a piezoelectric element, for example, or may be a thermal type of heating resin to generate bubbles and ejecting the bubbles from a plurality of nozzles.
  • the curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the top surface of the UV-curable resin discharged by the inkjet head 88, for example by leveling the surface of the UV-curable resin while scraping off excess resin with a roller or blade, thereby making the thickness of the UV-curable resin uniform.
  • the irradiation device 92 has a mercury lamp or LED as a light source, and irradiates the discharged UV-curable resin with ultraviolet light. This hardens the discharged UV-curable resin, forming a resin layer.
  • the third modeling unit 24 is a unit that models connection parts between electrodes and wiring of electronic components on a circuit board, and has a third printing unit 100.
  • the third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 discharges conductive paste.
  • the conductive paste is made by dispersing micrometer-sized metal particles in a resin that hardens by heating at a relatively low temperature.
  • the metal particles are in the form of flakes, and the viscosity of the conductive paste is relatively high compared to the metal ink.
  • the amount of conductive paste discharged by the dispenser 106 is controlled by the inner diameter of the needle, the pressure at the time of discharge, and the discharge time.
  • the conductive paste discharged by the dispenser 106 is heated by the heater 66 built into the base 60.
  • the heated conductive paste causes the resin to harden.
  • the resin hardens and contracts, and the flaky metal particles dispersed in the resin come into contact with each other. Thereby, the conductive paste exhibits conductivity.
  • the resin of the conductive paste is an organic adhesive, and exhibits adhesive strength by being cured by heating.
  • the fourth modeling unit 25 is a unit that models resin for fixing electronic components to a circuit board, and has a fourth printing section 110.
  • the fourth printing section 110 has a dispenser (see FIG. 2) 116, and the dispenser 116 dispenses thermosetting resin.
  • a thermosetting resin is a resin that hardens by heating.
  • the dispenser 116 is of a piezo type using a piezoelectric element, for example.
  • the thermosetting resin discharged by the dispenser 116 is heated by a heater 66 built into the base 60 and hardens.
  • the pressing unit 26 is a unit for pressing the circuit board, and has a pressing part 120.
  • the pressing section 120 includes a pressing plate (see FIG. 8) 122, a rubber plate (see FIG. 8) 124, and a cylinder (see FIG. 2) 126.
  • the rubber plate 124 is made of silicone rubber, for example, and has a plate shape.
  • the pressing plate 122 is made of, for example, steel and has a plate shape.
  • a rubber plate 124 is attached to the lower surface of the pressing plate 122, and the pressing plate 122 is pressed toward the circuit board by the operation of the cylinder 126. As a result, the circuit board is pressed by the pressing plate 122 via the rubber plate 124. Note that by controlling the operation of the cylinder 126, the force with which the substrate is pressed can be changed in a controllable manner.
  • the mounting unit 27 is a unit for mounting electronic components on a circuit board, and includes a supply section 130 and a mounting section 132.
  • the supply unit 130 has a plurality of tape feeders (see FIG. 2) 134 that feed out taped electronic components one by one, and supplies the electronic components at a supply position.
  • the supply unit 130 is not limited to the tape feeder 134, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Further, the supply unit 130 may be configured to include both a tape type and a tray type, or other types of supply devices.
  • the mounting section 132 includes a mounting head (see FIG. 2) 136 and a moving device (see FIG. 2) 138.
  • the mounting head 136 has a suction nozzle (not shown) for suctioning and holding the electronic component.
  • the suction nozzle is supplied with negative pressure from a positive and negative pressure supply device (not shown), and suctions and holds the electronic component by suctioning air. Then, by supplying a slight positive pressure from the positive/negative pressure supply device, the electronic component is detached.
  • the moving device 138 moves the mounting head 136 between the position where the electronic components are supplied by the tape feeder 134 and the substrate placed on the base 60. As a result, in the mounting section 132, the electronic component supplied from the tape feeder 134 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.
  • control device 28 includes a controller 140 and a plurality of drive circuits 142, as shown in FIG.
  • the plurality of drive circuits 142 include the electromagnetic motors 38 and 56, a holding device 62, a lifting device 64, a heater 66, an inkjet head 76, an infrared irradiation device 78, an inkjet head 88, a flattening device 90, an irradiation device 92, a dispenser 106, It is connected to the dispenser 116, cylinder 126, tape feeder 134, mounting head 136, and moving device 138.
  • the controller 140 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 142. As a result, the operations of the transport device 20 , the first modeling unit 22 , the second modeling unit 23 , the third modeling unit 24 , the fourth modeling unit 25 , the pressing unit 26 , and the mounting unit 27 are controlled by the controller 140 .
  • a resin laminate is formed on the base 60, and wiring is formed on the upper surface of the resin laminate. Then, the electrodes of the electronic component are electrically connected to the wiring via the conductive paste, and the electronic component is fixed with the resin, thereby forming a circuit board.
  • the stage 52 is moved below the second modeling unit 23. Then, in the second modeling unit 23, as shown in FIG. 3, a resin laminate 152 is formed on the base 60 of the stage 52.
  • the resin laminate 152 is formed by repeatedly ejecting the ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet rays by the irradiation device 92.
  • the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the upper surface of the base 60. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by a flattening device 90 in the curing section 86 so that the thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet rays. As a result, a thin film-like resin layer 153 is formed on the base 60.
  • the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the thin film resin layer 153.
  • the thin film-like ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet rays onto the thin film-like ultraviolet curable resin, thereby forming a layer on the thin film-like resin layer 153.
  • a thin film-like resin layer 153 is laminated.
  • the resin laminate 152 is formed by repeating the discharging of the ultraviolet curable resin onto the thin film-like resin layer 153 and the irradiation of ultraviolet rays, and by stacking a plurality of resin layers 153.
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 ejects the metal ink 160 in a line shape according to the circuit pattern onto the upper surface of the resin laminate 152, as shown in FIG. 4.
  • the infrared irradiation device 78 irradiates the metal ink 160 ejected according to the circuit pattern with infrared rays. As a result, the metal ink 160 is baked, and wiring 162 is formed on the upper surface of the resin laminate 152. Note that in FIG.
  • wiring 162a the wiring on the left side in FIG. 4 is described as wiring 162a
  • the wiring in the center is described as wiring 162b
  • the wiring on the right side is described as wiring 162c.
  • the stage 52 is moved below the third modeling unit 24.
  • the dispenser 106 prints on both ends of the wiring 162b, and on the wiring 162a and the wiring 162c facing both ends of the wiring 162b. Dispense conductive paste 166 onto the end.
  • the heater 66 built into the base 60 heats the resin laminate 152 according to the heating conditions of the conductive paste.
  • the heating conditions of the conductive paste are heating conditions for completely hardening the conductive paste, and are set by the manufacturer of the conductive paste.
  • the heating conditions of the conductive paste are also set according to the results of heating the conductive paste experimentally performed by a user of the conductive paste. In this way, the conductive paste 166 is heated according to the heating conditions of the conductive paste and completely hardens, thereby exhibiting conductivity.
  • the stage 52 is moved below the fourth modeling unit 25. Then, in the fourth printing section 110 of the fourth modeling unit 25, the dispenser 116 applies heat to the upper surface of the resin laminate 152 between the ends of the two wires 162a, b facing each other, as shown in FIG.
  • the thermosetting resin 170 is discharged onto the upper surface of the resin laminate 152 between the ends of the two wires 162b and 162c facing each other.
  • the stage 52 is moved below the mounting unit 27.
  • an electronic component (see FIG. 7) is supplied by a tape feeder 134, and the electronic component 172 is held by a suction nozzle of a mounting head 136.
  • the electronic component 172 is a so-called chip component, and is composed of a component body 176 and two electrodes 178 disposed on the lower surface of the component body 176.
  • the mounting head 136 is moved by the moving device 138, and the electronic component 172 held by the suction nozzle is mounted on the upper surface of the resin laminate 152, as shown in FIG.
  • two electronic components 172 are mounted on the upper surface of the resin laminate 152, and the sizes of these two electronic components 172 are different. Therefore, a small-sized electronic component will be referred to as an electronic component 172a, and a large-sized electronic component will be referred to as an electronic component 172b. Then, the two electronic components 172a, b are connected so that the electronic component 172a is electrically connected to the two wirings 162a, b, and the electronic component 172b is electrically connected to the two wirings 162b, c. is mounted on the upper surface of the resin laminate 152.
  • electronic component 172a is mounted so that electrode 178 contacts conductive paste 166 in a hardened state on wiring 162a, b.
  • component body 176 of electronic component 172a contacts thermosetting resin 170 dispensed between wiring 162a, b.
  • Electronic component 172b is mounted so that electrode 178 contacts conductive paste 166 in a hardened state on wiring 162b, c.
  • component body 176 of electronic component 172b contacts thermosetting resin 170 dispensed between wiring 162b, c.
  • conductive paste 166 is dispensed at the intended attachment position of electrode 178 to wiring 162
  • thermosetting resin 170 is dispensed at the intended attachment position of component body 176.
  • the planned mounting position of the electrode 178 is the relative position of the electrode 178 with respect to the electronic component 172 among the positions where the electronic component 172 is mounted on the upper surface of the resin laminate 152 and the wiring 162, and is the position where the electrode 178 comes into contact when the electronic component 172 is mounted.
  • the planned mounting position of the component body 176 is the relative position of the component body 176 with respect to the electronic component 172 among the positions where the electronic component 172 is mounted on the upper surface of the resin laminate 152, and is the position where the component body 176 comes into contact when the electronic component 172 is mounted.
  • thermosetting resin 170 in contact with the component body 176 is sealed between the component body 176 and the resin laminate 152. That is, the thermosetting resin 170 is filled between the upper surface of the resin laminate 152 and the lower surface of the component body 176.
  • the amount of the thermosetting resin 170 dispensed by the dispenser 116 is controlled so that the thermosetting resin 170 does not spill out from between the upper surface of the resin laminate 152 and the lower surface of the component body 176.
  • the electronic component 172a is electrically connected to the two wirings 162a, b
  • the electronic component 172b is electrically connected to the two wirings 162b, c. connected.
  • the electronic component 172 is mounted so that the electrode 178 contacts the hardened conductive paste 166, the contact area between the electrode 178 and the conductive paste 166 at this point is small.
  • the component body 176 of the electronic component 172 contacts the thermosetting resin 170, but since the thermosetting resin 170 is uncured at this point, the contact area between the component body 176 and the thermosetting resin 170 is growing.
  • the stage 52 is moved below the pressing unit 26. Then, in the pressing section 120 of the pressing unit 26, as shown in FIG. 8, the electronic component 172 mounted on the resin laminate 152 is pressed from above to below by the pressing plate 122 via the rubber plate 124.
  • the rubber plate 124 is attached to the lower surface of the press plate 122, the rubber plate 124 is elastically deformed when the two electronic components 172 are pressed, and the two electronic components with different height dimensions are Part 172 can be pressed appropriately.
  • the resin laminate 152 is heated by the heater 66 built into the base 60.
  • the thermosetting resin 170 is heated and hardened via the resin laminate 152.
  • the heating temperature is, for example, a temperature at which the thermosetting resin 170 is cured (for example, 85° C.). That is, the thermosetting resin 170 sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176 is hardened while being pressed by the rubber plate 124 . This further increases the contact area between the component body 176 and the thermosetting resin 170, and the adhesive force of the thermosetting resin 170 fixes the electronic component 172 to the upper surface of the resin laminate 152 in the component body 176.
  • the electronic component 172 when the electronic component 172 is pressed, that is, when the electronic component 172 mounted on the resin laminate 152 is pressed toward the resin laminate 152, it comes into contact with the electrode 178 of the electronic component 172.
  • the conductive paste 166 is deformed, and the contact area between the electrode 178 and the conductive paste 166 increases. This ensures electrical connection between the electronic component 172 and the wiring 162.
  • the electronic component 172 is fixed to the upper surface of the resin laminate 152 by the adhesive force of the thermosetting resin 170, thereby forming the circuit board 180 shown in FIG.
  • the adhesive area ratio of the small-sized electronic component 172a by the thermosetting resin 170 is smaller than the adhesive area ratio of the large-sized electronic component 172b by the thermosetting resin 170.
  • the electronic component 172a may be displaced, resulting in poor conduction.
  • the adhesive area ratio of the thermosetting resin 170 of the electronic component 172 is the ratio of the adhesive area of the electronic component 172 by the thermosetting resin 170 to the area of the mounting surface of the electronic component 172 to the circuit board, that is, the bottom surface of the electronic component 172. It is a percentage of the adhesive area.
  • the area of the mounting surface of the small-sized electronic component 172a is XA1
  • the adhesive area of the small-sized electronic component 172a with the thermosetting resin 170 is XS1. Therefore, the adhesive area ratio of the small-sized electronic component 172a by the thermosetting resin 170 is XS1/XA1.
  • the area of the mounting surface of the large-sized electronic component 172b is XA2
  • the adhesive area of the large-sized electronic component 172b with the thermosetting resin 170 is XS2. Therefore, the adhesive area ratio of the thermosetting resin 170 of the large-sized electronic component 172b is XS2/XA2.
  • the adhesion area ratio XS1/XA1 of the small-sized electronic component 172a is clearly smaller than the adhesion area ratio XS2/XA2 of the large-sized electronic component 172b.
  • thermosetting resin 170 of the small-sized electronic component 172a is considerably smaller than that of the thermosetting resin 170 of the large-sized electronic component 172b, so that the attached electronic component 172a There is a risk of misalignment and poor continuity.
  • the conductive paste 166 that connects the electrode 178 of the electronic component 172a and the wiring 162 is inserted from the planned mounting position of the electrode 178. It is applied at a position shifted in the direction away from the electronic component 172a (hereinafter referred to as the "separation direction"). Specifically, when the conductive resin paste 166 is applied to the planned mounting position of the electrode 178 of the small-sized electronic component 172a, as shown in FIG. Conductive paste 166 is applied so that it overlaps center 192 .
  • the size of the small electronic component 172a is, for example, 0.6 mm x 0.3 mm (the length in the horizontal direction of the paper in FIG. 10 is 0.6 mm, and the length in the vertical direction of the paper is 0.3 mm).
  • the conductive paste 166 is applied to the intended mounting position of the electrode 178 of the small-sized electronic component 172a, the conductive paste 166 is applied between the pair of conductive pastes 166 applied corresponding to the pair of electrodes 178
  • the electronic component 172a contacts the thermosetting resin 170 in the space. That is, the shaded area in FIG. 10 is the adhesive area XS1 of the electronic component 172a by the thermosetting resin 170. Further, the dot portion in FIG.
  • the adhesion area ratio XS1 (shaded area)/XA1 (dot area) of the electronic component 172a is approximately 23%.
  • the adhesion area ratio of the electronic component 172a is approximately 23 %.
  • the conductive paste 166 is applied to a position shifted away from the intended mounting position of the electrode 178. That is, the conductive paste 166 is applied so that the center 192 of the conductive paste 166 is shifted away from the center 190 of the electrode 178 of the electronic component 172a.
  • the conductive paste 166 is applied to a position shifted away from the intended attachment position of the electrode 178 in this way, a pair of conductive pastes 166 applied corresponding to a pair of electrodes 178 are separated from each other. , the space between the pair of conductive pastes 166 becomes wider.
  • the adhesive area ratio XS1 (shaded area)/XA1 (dot area) of the electronic component 172a becomes approximately 43%.
  • the adhesive area ratio of the electronic component 172a when the conductive paste 166 is applied to a position shifted away from the scheduled mounting position of the electrode 178 of the electronic component 172a (hereinafter referred to as "adhesion area ratio at the separated position"). ) is approximately 43%.
  • the conductive paste 166 is applied to a position shifted away from the scheduled mounting position of the electrode 178 of the electronic component 172a, so that the contact area ratio of the electronic component 172a increases, and the mounted electronic component It becomes possible to prevent the positional shift of 172a.
  • the conductive resin paste 166 is applied to the planned mounting position of the electrode 178 of the large-sized electronic component 172a, as shown in FIG.
  • Conductive paste 166 is applied so as to overlap with each other.
  • the size of the large-sized electronic component 172b is, for example, 1.0 mm x 0.5 mm (the length in the horizontal direction of the paper in FIG. 12 is 1.0 mm, and the length in the vertical direction of the paper is 0.5 mm).
  • the conductive paste 166 is applied to the intended mounting position of the electrode 178 of the electronic component 172b, the size of the electronic component 172b is large and the space between the pair of electrodes 178 is also relatively large.
  • the adhesive area XS2 hatchched area where 172b and thermosetting resin 170 contact is also large. Therefore, the adhesion area ratio XS2 (shaded area)/XA2 (dotted area) of the electronic component 172b is approximately 43%. In other words, the adhesion area ratio at the intended mounting position of the electrode 178 of the electronic component 172b is approximately 43%. In this way, the adhesive area ratio (approximately 43%) for the large electronic component 172b at the planned mounting position is approximately the same as the adhesive area ratio (approximately 43%) for the small electronic component 172a at the separated position.
  • the conductive paste 166 When the conductive paste 166 is applied to the component 172b, the conductive paste 166 does not need to be applied at a position shifted from the planned mounting position of the electrode 178, but is applied at the planned mounting position of the electrode 178.
  • the size of electronic component 172a is, for example, 0.6 mm x 0.3 mm, and since electronic component 172a is small, conductive paste 166 is applied to a position shifted from the intended mounting position of the electrode. For this reason, even for electronic component 172a, that is, electronic components smaller than 0.6 mm x 0.3 mm, conductive paste 166 is applied to a position shifted from the intended mounting position of the electrode. Specifically, as shown in FIG. 13, when conductive resin paste 166 is applied to the intended mounting position of electrode 178 of electronic component 172c smaller than 0.6 mm x 0.3 mm, for example, electronic component 172c of 0.4 mm x 0.2 mm (0.4 mm in the horizontal direction of the paper in FIG.
  • conductive paste 166 is applied so that center 210 of electrode 178 and center 212 of conductive paste 166 overlap.
  • the conductive resin paste 166 is applied in this manner to the intended mounting positions of the electrodes 178 of the electronic component 172c, the pair of conductive pastes 166 applied corresponding to the pair of electrodes 178 come into contact with each other, and there is no space between the pair of conductive pastes 166. Therefore, when the conductive resin paste 166 is applied to the intended mounting positions of the electrodes 178 of the electronic component 172c, the contact area between the electronic component 172c and the thermosetting resin 170 is 0, and the adhesion area ratio of the electronic component 172c is 0%. In other words, the adhesion area ratio at the intended mounting positions of the electrodes 178 of the electronic component 172c is 0%.
  • the conductive paste 166 is applied to a position of the electronic component 172c that is shifted away from the planned mounting position of the electrode 178. That is, the conductive paste 166 is applied so that the center 212 of the conductive paste 166 is shifted away from the center 210 of the electrode 178 of the electronic component 172c. As a result, the pair of conductive pastes 166 are separated from each other, and the adhesive area of the electronic component 172c by the thermosetting resin 170 is secured, so that the adhesive area ratio of the electronic component 172c is approximately 43%. Thereby, even if the electronic component 172c is smaller than the electronic component 172a, it is possible to prevent the electronic component 172c from being misaligned.
  • the adhesion area ratio at the scheduled mounting position for electronic components a and c (for example, 0.6 mm x 0.3 mm, for example, 0.4 mm x 0.2 mm) is as follows: Because the adhesive area ratio is lower than the bonding area ratio at the scheduled mounting position for electronic components 172b (for example, 1.0 mm x 0.5 mm) larger than c, the conductive paste was shifted from the scheduled mounting position for electronic components a and c. applied to the location.
  • the adhesion area ratio at the separated position for electronic components a and c is 40% or more, that is, the same level as the adhesion area ratio at the scheduled mounting position for electronic component 172b, which is larger in size than electronic components a and c. It becomes possible to do so.
  • the space between a pair of electrodes is larger than the space between a pair of electrodes of electronic component 172b (e.g., 1.0 mm x 0.5 mm).
  • the adhesion area ratio at the intended mounting position for electronic components having sizes of 1.6 mm x 0.8 mm, 2.0 mm x 1.2 mm, and 3.2 mm x 1.6 mm is larger than the adhesion area ratio at the intended mounting position for electronic component 172b (e.g., 1.0 mm x 0.5 mm).
  • the adhesion area ratio at the intended mounting position for an electronic component of 1.6 mm x 0.8 mm is about 61%
  • the adhesion area ratio at the intended mounting position for an electronic component of 2.0 mm x 1.2 mm is about 69%
  • the adhesion area ratio at the intended mounting position for an electronic component of 3.2 mm x 1.6 mm is about 80%.
  • the conductive paste 166 when the conductive paste 166 is applied to electronic components of 1.6 mm x 0.8 mm, 2.0 mm x 1.2 mm, and 3.2 mm x 1.6 mm, the conductive paste 166 does not need to be applied at a position shifted from the intended mounting position of the electrode 178, but is applied at the intended mounting position of the electrode 178. In other words, the conductive paste 166 is applied at the intended mounting position of the electrode 178 for electronic components of 1.0 mm x 0.5 mm or more, and is applied at a position shifted from the intended mounting position of the electrode 178 for electronic components of less than 1.0 mm x 0.5 mm.
  • the standard size for determining whether the conductive paste 166 is applied to the intended installation position or offset from the intended installation position, i.e., 1.0 mm x 0.5 mm, is set by the operator, but the standard size can be changed as desired.
  • the adhesion area ratio increases and the adhesive force of the thermosetting resin 170 for electronic components increases; however, the conductive paste 166 If the amount of deviation from the planned mounting position is too large, there is a risk that the electrical conductivity of the electronic component cannot be ensured. Specifically, for example, as shown in FIG. 16, when the conductive paste 166 is applied to the electronic component 172a, if there is too much misalignment between the center 190 of the electrode 178 and the center 192 of the conductive paste 166. , the conductive area ratio of the conductive paste 166 becomes smaller.
  • the conductive area ratio of the conductive paste 166 is the percentage of the contact area (shaded area) between the electrode 178 and the conductive paste 166 to the area (dot area) on the mounting surface of one electrode 178.
  • the amount of misalignment between the center 190 of the electrode 178 and the center 192 of the conductive paste 166 is too large, so that the conductive area ratio of the conductive paste 166 is about 30%.
  • the conductivity between the conductive paste 166 and the electrode 178 cannot be properly ensured.
  • the amount of deviation between the center 190 of the electrode 178 and the center 192 of the conductive paste 166 is adjusted so that the conductive area ratio of the conductive paste 166 is 50% or more.
  • the conductive area ratio of the conductive paste 166 can be increased to 50% or more. (approximately 80% in FIG. 17). This makes it possible to appropriately ensure the conductivity between the conductive paste 166 and the electrode 178.
  • the controller 140 of the control device 28 includes an application section 220 and a mounting section 222, as shown in FIG.
  • the application section 220 is a functional section for applying the conductive paste 166 to a position shifted in the direction away from the intended mounting position of the electrode 178.
  • the mounting section 222 is a functional section for mounting the electronic component 172 so that the electrode 178 comes into contact with the conductive paste 166 applied by the application section 220.
  • the circuit forming device 10 is an example of a circuit forming device.
  • Dispenser 106 is an example of a first coating device.
  • Dispenser 116 is an example of a second coating device.
  • the mounting section 132 is an example of a mounting device.
  • the conductive paste 166 is an example of a conductive paste.
  • Thermosetting resin 170 is an example of a curable resin.
  • Electronic component 172 is an example of an electronic component.
  • the component body 176 is an example of a component body.
  • Electrode 178 is an example of an electrode.
  • 1.0 mm x 0.5 mm is an example of the predetermined size.
  • the process performed by the coating unit 220 is an example of a coating process.
  • the process performed by the mounting unit 222 is an example of a mounting process.
  • the present invention is not limited to the above-mentioned embodiments, but can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art.
  • the present invention is applied to a mode in which the thermosetting resin 170 is applied between the pair of conductive pastes 166, but the thermosetting resin 170 is applied between the pair of conductive pastes 166.
  • the present invention may be applied to an embodiment in which the resin 170 is not applied. Specifically, for example, as shown in FIG. 13, when the conductive resin paste 166 is applied to the electronic component 172c at the intended mounting position of the electrode 178, the pair of conductive pastes 166 come into contact with each other.
  • thermosetting resin 170 is applied before the electronic component 172 is mounted, but the thermosetting resin 170 may be applied after the electronic component 172 is mounted. At this time, the thermosetting resin 170 is applied between the lower surface of the component body 176 of the mounted electronic component 172 and the upper surface of the resin laminate 152. That is, the thermosetting resin 170 is applied to the resin laminate 152 at the position where the component body 176 is scheduled to be mounted. Then, after the thermosetting resin 170 is applied between the lower surface of the component body 176 of the electronic component 172 and the upper surface of the resin laminate 152, the electronic component 172 is pressed by the rubber plate 124.
  • the size that serves as the standard for determining whether the conductive paste 166 is applied to the intended attachment position or displaced from the intended attachment position is set by the operator, but the default value is It may be entered.
  • the electronic component 172 is mounted with the conductive paste 166 completely cured, and the electronic component 172 is pressed by the rubber plate 124.
  • the electronic component 172 may be mounted with the conductive paste 166 semi-hardened, and the electronic component 172 may be pressed by the rubber plate 124.
  • the electronic component 172 may be mounted with the conductive paste 166 neither semi-cured nor completely cured, and the electronic component 172 may be pressed by the rubber plate 124. Note that when the electronic component 172 is mounted with the conductive paste 166 in a semi-cured state, neither semi-cured nor completely cured, and the electronic component 172 is pressed by the rubber plate 124, heating by the heater 66 is performed. The conductive paste is completely cured.
  • the conductive paste 166 is used as the conductive fluid that electrically connects the wiring 162 and the electrode 178 of the electronic component 172, but various pastes may be used as long as they exhibit conductivity. It is possible to employ fluids.
  • thermosetting resin is used as the curable resin for fixing the electronic component 172 to the resin laminate 152, but ultraviolet curable resin, two-component mixed curable resin, thermoplastic resin, etc. It is possible to form resin or the like.
  • an ultraviolet curing resin is used as the resin for forming the resin laminate 152
  • a thermosetting resin is used as the resin for fixing the electronic component 172.
  • the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different curable resins, the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different.
  • the same curable resin may be used.
  • the conductive paste is discharged by the dispenser 106, but it may be transferred by a transfer device or the like. Further, the conductive paste may be printed by screen printing.
  • Circuit forming device (electrical circuit forming device) 106: Dispenser (first coating device) 116: Dispenser (second coating device) 132: Mounting part (mounting device) 166: Conductive paste (conductive fluid) 170: Heat Curable resin (curable resin) 172: Electronic component 176: Component body 178: Electrode 220: Coating section (coating process) 222: Mounting section (fitting process)

Abstract

Provided is a circuit forming device comprising a first application device and a mounting device. The first application device applies a conductive paste at a position displaced from a planned mounting position of an electrode of an electronic component toward a direction away from the electronic component. The mounting device mounts the electronic component such that the electrode comes in contact with the conductive paste applied by the first application device.

Description

回路形成装置、および回路形成方法Circuit forming device and circuit forming method
　本発明は、導電性ペーストに電極が接触するように電子部品を装着する回路形成装置等に関する。 The present invention relates to a circuit forming apparatus and the like that mounts electronic components so that electrodes are in contact with conductive paste.
　下記特許文献１には、導電性ペーストに電極が接触するように電子部品を装着する技術が記載されている。 Patent Document 1 listed below describes a technique for mounting electronic components so that electrodes are in contact with conductive paste.
特開２０１９－１５３７０１号公報Japanese Patent Application Publication No. 2019-153701
　導電性ペーストに電極が接触するように装着された電子部品を含む基板を適切に形成することを課題とする。 The object of the present invention is to appropriately form a substrate including an electronic component mounted so that an electrode is in contact with a conductive paste.
　上記課題を解決するために、本明細書は、電子部品の電極の装着予定位置から、前記電子部品から離れる方向にズレた位置に導電性ペーストを塗布する第１塗布装置と、前記第１塗布装置により塗布された導電性ペーストに前記電極が接触するように前記電子部品を装着する装着装置と、を備える回路形成装置を開示する。 In order to solve the above problems, the present specification provides a first coating device that applies a conductive paste to a position shifted away from the electronic component from a scheduled mounting position of an electrode of the electronic component, and a A circuit forming apparatus is disclosed that includes a mounting device for mounting the electronic component so that the electrode contacts the conductive paste applied by the device.
　また、本明細書は、電子部品の電極の装着予定位置から、前記電子部品から離れる方向にズレた位置に導電性ペーストを塗布する塗布工程と、前記塗布工程において塗布された導電性ペーストに前記電極が接触するように前記電子部品を装着する装着工程と、を含む回路形成方法を開示する。 Further, the present specification includes a coating process of applying a conductive paste to a position shifted away from the electronic component from a planned mounting position of an electrode of the electronic component, and a coating process of applying the conductive paste to a position that is shifted away from the electronic component, and a conductive paste applied in the coating process. Disclosed is a circuit forming method including a mounting step of mounting the electronic component so that the electrodes are in contact with each other.
　本開示では、電子部品の電極の装着予定位置から、電子部品から離れる方向にズレた位置に導電性ペーストが塗布される。そして、塗布された導電性ペーストに電極が接触するように電子部品が装着される。これにより、導電性ペーストに電極が接触するように装着された電子部品を含む基板を適切に形成することが可能となる。 In the present disclosure, a conductive paste is applied to a position shifted away from the electronic component from the planned mounting position of the electrode of the electronic component. Then, electronic components are mounted so that the electrodes are in contact with the applied conductive paste. This makes it possible to appropriately form a substrate including an electronic component mounted so that the electrode is in contact with the conductive paste.
回路形成装置を示す図である。It is a figure showing a circuit formation device. 制御装置を示すブロック図である。FIG. 2 is a block diagram showing a control device. 樹脂積層体が形成された状態の回路基板を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit board with a resin laminate formed thereon. 樹脂積層体の上に配線が形成された状態の回路基板を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit board with wiring formed on a resin laminate. 配線の上に導電性ペーストが塗布された状態の回路基板を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit board with conductive paste applied on wiring. 樹脂層の上に熱硬化性樹脂が塗布された状態の回路基板を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit board with a thermosetting resin coated on a resin layer. 電子部品が装着された状態の回路基板を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit board with electronic components mounted thereon. 電子部品が樹脂積層体に向って押し付けられた状態の回路基板を示す断面図である。FIG. 3 is a cross-sectional view showing a circuit board with electronic components pressed against a resin laminate. 従来の手法により形成された回路基板を示す断面図である。1 is a cross-sectional view showing a circuit board formed by a conventional method. 電極の装着予定位置に塗布された導電性ペーストを示すイメージ図である。FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached. 電極の装着予定位置からズレた位置に塗布された導電性ペーストを示すイメージ図である。FIG. 13 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode. 電極の装着予定位置に塗布された導電性ペーストを示すイメージ図である。FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached. 電極の装着予定位置に塗布された導電性ペーストを示すイメージ図である。FIG. 3 is an image diagram showing a conductive paste applied to a position where an electrode is scheduled to be attached. 電極の装着予定位置からズレた位置に塗布された導電性ペーストを示すイメージ図である。FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode. 電子部品のサイズ毎の接着面積率を示す図である。FIG. 3 is a diagram showing the adhesion area ratio for each size of electronic components. 電極の装着予定位置からズレた位置に塗布された導電性ペーストを示すイメージ図である。FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode. 電極の装着予定位置からズレた位置に塗布された導電性ペーストを示すイメージ図である。FIG. 3 is an image diagram showing a conductive paste applied to a position shifted from the intended position of the electrode.
　図１に回路形成装置１０を示す。回路形成装置１０は、搬送装置２０と、第１造形ユニット２２と、第２造形ユニット２３と、第３造形ユニット２４と、第４造形ユニット２５と、押圧ユニット２６と、装着ユニット２７と、制御装置（図２参照）２８とを備える。それら搬送装置２０と第１造形ユニット２２と第２造形ユニット２３と第３造形ユニット２４と第４造形ユニット２５と押圧ユニット２６と装着ユニット２７とは、回路形成装置１０のベース２９の上に配置されている。ベース２９は、概して長方形状をなしており、以下の説明では、ベース２９の長手方向をＸ軸方向、ベース２９の短手方向をＹ軸方向、Ｘ軸方向及びＹ軸方向の両方に直交する方向をＺ軸方向と称して説明する。 FIG. 1 shows a circuit forming apparatus 10. The circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a fourth modeling unit 25, a pressing unit 26, a mounting unit 27, and a control unit 26. A device (see FIG. 2) 28 is provided. The conveyance device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, and the mounting unit 27 are arranged on the base 29 of the circuit forming apparatus 10. has been done. The base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the short direction of the base 29 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.
　搬送装置２０は、Ｘ軸スライド機構３０と、Ｙ軸スライド機構３２とを備えている。そのＸ軸スライド機構３０は、Ｘ軸スライドレール３４とＸ軸スライダ３６とを有している。Ｘ軸スライドレール３４は、Ｘ軸方向に延びるように、ベース２９の上に配設されている。Ｘ軸スライダ３６は、Ｘ軸スライドレール３４によって、Ｘ軸方向にスライド可能に保持されている。さらに、Ｘ軸スライド機構３０は、電磁モータ（図２参照）３８を有しており、電磁モータ３８の駆動により、Ｘ軸スライダ３６がＸ軸方向の任意の位置に移動する。また、Ｙ軸スライド機構３２は、Ｙ軸スライドレール５０とステージ５２とを有している。Ｙ軸スライドレール５０は、Ｙ軸方向に延びるように、ベース２９の上に配設されており、Ｘ軸方向に移動可能とされている。そして、Ｙ軸スライドレール５０の一端部が、Ｘ軸スライダ３６に連結されている。そのＹ軸スライドレール５０には、ステージ５２が、Ｙ軸方向にスライド可能に保持されている。さらに、Ｙ軸スライド機構３２は、電磁モータ（図２参照）５６を有しており、電磁モータ５６の駆動により、ステージ５２がＹ軸方向の任意の位置に移動する。これにより、ステージ５２は、Ｘ軸スライド機構３０及びＹ軸スライド機構３２の駆動により、ベース２９上の任意の位置に移動する。 The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Further, the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
　ステージ５２は、基台６０と、保持装置６２と、昇降装置（図２参照）６４と、ヒータ（図２参照）６６とを有している。基台６０は、平板状に形成され、上面に基板が載置される。保持装置６２は、基台６０のＸ軸方向の両側部に設けられている。そして、基台６０に載置された基板のＸ軸方向の両縁部が、保持装置６２によって挟まれることで、基板が固定的に保持される。また、昇降装置６４は、基台６０の下方に配設されており、基台６０を昇降させる。また、ヒータ６６は、基台６０に内蔵されており、基台６０に載置された基板を任意の温度に加熱する。 The stage 52 includes a base 60, a holding device 62, a lifting device (see FIG. 2) 64, and a heater (see FIG. 2) 66. The base 60 is formed into a flat plate shape, and a substrate is placed on the top surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the substrate is fixedly held. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60. Furthermore, the heater 66 is built into the base 60 and heats the substrate placed on the base 60 to an arbitrary temperature.
　第１造形ユニット２２は、回路基板の配線を造形するユニットであり、第１印刷部７２と、焼成部７４とを有している。第１印刷部７２は、インクジェットヘッド（図２参照）７６を有しており、インクジェットヘッド７６が金属インクを線状に吐出する。金属インクは、ナノメートルサイズの金属、例えば銀の微粒子が溶剤中に分散されたものである。なお、金属微粒子の表面は分散剤によりコーティングされており、溶剤中での凝集が防止されている。また、インクジェットヘッド７６は、例えば、圧電素子を用いたピエゾ方式によって複数のノズルから金属インクを吐出する。 The first modeling unit 22 is a unit that shapes wiring on a circuit board, and includes a first printing section 72 and a firing section 74. The first printing section 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 discharges metal ink in a linear manner. Metal ink is made by dispersing nanometer-sized metal particles, such as silver, in a solvent. Note that the surface of the metal fine particles is coated with a dispersant to prevent agglomeration in the solvent. Further, the inkjet head 76 ejects metal ink from a plurality of nozzles using a piezo system using piezoelectric elements, for example.
　焼成部７４は、赤外線照射装置（図２参照）７８を有している。赤外線照射装置７８は、吐出された金属インクに赤外線を照射する装置である。赤外線が照射された金属インクは焼成し、配線が形成される。なお、金属インクの焼成とは、エネルギーを付与することによって、溶媒の気化や金属微粒子の保護膜、つまり、分散剤の分解等が行われ、金属微粒子が接触または融着をすることで、導電率が高くなる現象である。そして、金属インクが焼成することで、金属製の配線が形成される。 The baking section 74 has an infrared irradiation device 78 (see Figure 2). The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays. The metal ink irradiated with infrared rays is baked, and wiring is formed. Note that baking of metal ink is a phenomenon in which, by applying energy, the solvent is evaporated and the protective film for the metal particles, i.e., the dispersant is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.
　また、第２造形ユニット２３は、回路基板の樹脂層を造形するユニットであり、第２印刷部８４と、硬化部８６とを有している。第２印刷部８４は、インクジェットヘッド（図２参照）８８を有しており、インクジェットヘッド８８は紫外線硬化樹脂を吐出する。紫外線硬化樹脂は、紫外線の照射により硬化する樹脂である。なお、インクジェットヘッド８８は、例えば、圧電素子を用いたピエゾ方式でもよく、樹脂を加熱して気泡を発生させ複数のノズルから吐出するサーマル方式でもよい。 Further, the second modeling unit 23 is a unit that models the resin layer of the circuit board, and includes a second printing section 84 and a curing section 86. The second printing section 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges ultraviolet curing resin. Ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. Note that the inkjet head 88 may be of a piezo type using a piezoelectric element, for example, or may be a thermal type of heating resin to generate bubbles and ejecting the bubbles from a plurality of nozzles.
　硬化部８６は、平坦化装置（図２参照）９０と照射装置（図２参照）９２とを有している。平坦化装置９０は、インクジェットヘッド８８によって吐出された紫外線硬化樹脂の上面を平坦化するものであり、例えば、紫外線硬化樹脂の表面を均しながら余剰分の樹脂を、ローラもしくはブレードによって掻き取ることで、紫外線硬化樹脂の厚みを均一させる。また、照射装置９２は、光源として水銀ランプもしくはＬＥＤを備えており、吐出された紫外線硬化樹脂に紫外線を照射する。これにより、吐出された紫外線硬化樹脂が硬化し、樹脂層が形成される。 The curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the top surface of the UV-curable resin discharged by the inkjet head 88, for example by leveling the surface of the UV-curable resin while scraping off excess resin with a roller or blade, thereby making the thickness of the UV-curable resin uniform. The irradiation device 92 has a mercury lamp or LED as a light source, and irradiates the discharged UV-curable resin with ultraviolet light. This hardens the discharged UV-curable resin, forming a resin layer.
　第３造形ユニット２４は、回路基板の上に電子部品の電極と配線との接続部を造形するユニットであり、第３印刷部１００を有している。第３印刷部１００は、ディスペンサ（図２参照）１０６を有しており、ディスペンサ１０６は導電性ペーストを吐出する。導電性ペーストは、比較的低温の加熱により硬化する樹脂に、マイクロメートルサイズの金属粒子が分散されたものである。ちなみに、金属粒子は、フレーク状とされており、導電性ペーストの粘度は、金属インクと比較して比較的高い。なお、ディスペンサ１０６による導電性ペーストの吐出量は、ニードルの内径や吐出時の圧力および吐出時間により制御される。 The third modeling unit 24 is a unit that models connection parts between electrodes and wiring of electronic components on a circuit board, and has a third printing unit 100. The third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 discharges conductive paste. The conductive paste is made by dispersing micrometer-sized metal particles in a resin that hardens by heating at a relatively low temperature. Incidentally, the metal particles are in the form of flakes, and the viscosity of the conductive paste is relatively high compared to the metal ink. Note that the amount of conductive paste discharged by the dispenser 106 is controlled by the inner diameter of the needle, the pressure at the time of discharge, and the discharge time.
　そして、ディスペンサ１０６により吐出された導電性ペーストは、基台６０に内蔵されているヒータ６６により加熱される。加熱された導電性ペーストでは、樹脂が硬化する。この際、導電性ペーストでは、樹脂が硬化して収縮し、その樹脂に分散されたフレーク状の金属粒子が接触する。これにより、導電性ペーストが導電性を発揮する。また、導電性ペーストの樹脂は、有機系の接着剤であり、加熱により硬化することで接着力を発揮する。 Then, the conductive paste discharged by the dispenser 106 is heated by the heater 66 built into the base 60. The heated conductive paste causes the resin to harden. At this time, in the conductive paste, the resin hardens and contracts, and the flaky metal particles dispersed in the resin come into contact with each other. Thereby, the conductive paste exhibits conductivity. Further, the resin of the conductive paste is an organic adhesive, and exhibits adhesive strength by being cured by heating.
　第４造形ユニット２５は、電子部品を回路基板に固定するための樹脂を造形するユニットであり、第４印刷部１１０を有している。第４印刷部１１０は、ディスペンサ（図２参照）１１６を有しており、ディスペンサ１１６は熱硬化性樹脂を吐出する。熱硬化性樹脂は、加熱により硬化する樹脂である。なお、ディスペンサ１１６は、例えば、圧電素子を用いたピエゾ方式である。そして、ディスペンサ１１６により吐出された熱硬化性樹脂は、基台６０に内蔵されているヒータ６６により加熱され、硬化する。 The fourth modeling unit 25 is a unit that models resin for fixing electronic components to a circuit board, and has a fourth printing section 110. The fourth printing section 110 has a dispenser (see FIG. 2) 116, and the dispenser 116 dispenses thermosetting resin. A thermosetting resin is a resin that hardens by heating. Note that the dispenser 116 is of a piezo type using a piezoelectric element, for example. The thermosetting resin discharged by the dispenser 116 is heated by a heater 66 built into the base 60 and hardens.
　また、押圧ユニット２６は、回路基板を押圧するためのユニットであり、押圧部１２０を有している。押圧部１２０は、押圧プレート（図８参照）１２２と、ゴムプレート（図８参照）１２４と、シリンダ（図２参照）１２６とを有している。ゴムプレート１２４は、例えば、シリコン製のゴムにより成形されており、板形状とされている。また、押圧プレート１２２は、例えば、鋼材により成形されており、板形状とされている。そして、押圧プレート１２２の下面にゴムプレート１２４が貼着されており、シリンダ１２６の作動により、押圧プレート１２２が、回路基板に向って押し付けられる。これにより、回路基板が、ゴムプレート１２４を介して押圧プレート１２２により押圧される。なお、シリンダ１２６の作動が制御されることで、基板を押圧する力を制御可能に変更することができる。 Further, the pressing unit 26 is a unit for pressing the circuit board, and has a pressing part 120. The pressing section 120 includes a pressing plate (see FIG. 8) 122, a rubber plate (see FIG. 8) 124, and a cylinder (see FIG. 2) 126. The rubber plate 124 is made of silicone rubber, for example, and has a plate shape. Further, the pressing plate 122 is made of, for example, steel and has a plate shape. A rubber plate 124 is attached to the lower surface of the pressing plate 122, and the pressing plate 122 is pressed toward the circuit board by the operation of the cylinder 126. As a result, the circuit board is pressed by the pressing plate 122 via the rubber plate 124. Note that by controlling the operation of the cylinder 126, the force with which the substrate is pressed can be changed in a controllable manner.
　また、装着ユニット２７は、回路基板に電子部品を装着するユニットであり、供給部１３０と、装着部１３２とを有している。供給部１３０は、テーピング化された電子部品を１つずつ送り出すテープフィーダ（図２参照）１３４を複数有しており、供給位置において、電子部品を供給する。なお、供給部１３０は、テープフィーダ１３４に限らず、トレイから電子部品をピックアップして供給するトレイ型の供給装置でもよい。また、供給部１３０は、テープ型とトレイ型との両方、あるいはそれ以外の供給装置を備えた構成でもよい。 Furthermore, the mounting unit 27 is a unit for mounting electronic components on a circuit board, and includes a supply section 130 and a mounting section 132. The supply unit 130 has a plurality of tape feeders (see FIG. 2) 134 that feed out taped electronic components one by one, and supplies the electronic components at a supply position. Note that the supply unit 130 is not limited to the tape feeder 134, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Further, the supply unit 130 may be configured to include both a tape type and a tray type, or other types of supply devices.
　装着部１３２は、装着ヘッド（図２参照）１３６と、移動装置（図２参照）１３８とを有している。装着ヘッド１３６は、電子部品を吸着保持するための吸着ノズル（図示省略）を有する。吸着ノズルは、正負圧供給装置（図示省略）から負圧が供給されることで、エアの吸引により電子部品を吸着保持する。そして、正負圧供給装置から僅かな正圧が供給されることで、電子部品を離脱する。また、移動装置１３８は、テープフィーダ１３４による電子部品の供給位置と、基台６０に載置された基板との間で、装着ヘッド１３６を移動させる。これにより、装着部１３２では、テープフィーダ１３４から供給された電子部品が、吸着ノズルにより保持され、その吸着ノズルによって保持された電子部品が、基板に装着される。 The mounting section 132 includes a mounting head (see FIG. 2) 136 and a moving device (see FIG. 2) 138. The mounting head 136 has a suction nozzle (not shown) for suctioning and holding the electronic component. The suction nozzle is supplied with negative pressure from a positive and negative pressure supply device (not shown), and suctions and holds the electronic component by suctioning air. Then, by supplying a slight positive pressure from the positive/negative pressure supply device, the electronic component is detached. Furthermore, the moving device 138 moves the mounting head 136 between the position where the electronic components are supplied by the tape feeder 134 and the substrate placed on the base 60. As a result, in the mounting section 132, the electronic component supplied from the tape feeder 134 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.
　また、制御装置２８は、図２に示すように、コントローラ１４０と、複数の駆動回路１４２とを備えている。複数の駆動回路１４２は、上記電磁モータ３８，５６、保持装置６２、昇降装置６４、ヒータ６６、インクジェットヘッド７６、赤外線照射装置７８、インクジェットヘッド８８、平坦化装置９０、照射装置９２、ディスペンサ１０６、ディスペンサ１１６、シリンダ１２６、テープフィーダ１３４、装着ヘッド１３６、移動装置１３８に接続されている。コントローラ１４０は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１４２に接続されている。これにより、搬送装置２０、第１造形ユニット２２、第２造形ユニット２３、第３造形ユニット２４、第４造形ユニット２５、押圧ユニット２６、装着ユニット２７の作動が、コントローラ１４０によって制御される。 Further, the control device 28 includes a controller 140 and a plurality of drive circuits 142, as shown in FIG. The plurality of drive circuits 142 include the electromagnetic motors 38 and 56, a holding device 62, a lifting device 64, a heater 66, an inkjet head 76, an infrared irradiation device 78, an inkjet head 88, a flattening device 90, an irradiation device 92, a dispenser 106, It is connected to the dispenser 116, cylinder 126, tape feeder 134, mounting head 136, and moving device 138. The controller 140 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 142. As a result, the operations of the transport device 20 , the first modeling unit 22 , the second modeling unit 23 , the third modeling unit 24 , the fourth modeling unit 25 , the pressing unit 26 , and the mounting unit 27 are controlled by the controller 140 .
　回路形成装置１０では、上述した構成によって、基台６０の上に樹脂積層体が形成され、その樹脂積層体の上面に配線が形成される。そして、導電性ペーストを介して、電子部品の電極が配線に電気的に接続され、その電子部品が樹脂により固定されことで、回路基板が形成される。 In the circuit forming apparatus 10, with the above-described configuration, a resin laminate is formed on the base 60, and wiring is formed on the upper surface of the resin laminate. Then, the electrodes of the electronic component are electrically connected to the wiring via the conductive paste, and the electronic component is fixed with the resin, thereby forming a circuit board.
　具体的には、まず、ステージ５２が第２造形ユニット２３の下方に移動される。そして、第２造形ユニット２３において、図３に示すように、ステージ５２の基台６０の上に樹脂積層体１５２が形成される。樹脂積層体１５２は、インクジェットヘッド８８からの紫外線硬化樹脂の吐出と、吐出された紫外線硬化樹脂への照射装置９２による紫外線の照射とが繰り返されることにより形成される。 Specifically, first, the stage 52 is moved below the second modeling unit 23. Then, in the second modeling unit 23, as shown in FIG. 3, a resin laminate 152 is formed on the base 60 of the stage 52. The resin laminate 152 is formed by repeatedly ejecting the ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet rays by the irradiation device 92.
　詳しくは、第２造形ユニット２３の第２印刷部８４において、インクジェットヘッド８８が、基台６０の上面に紫外線硬化樹脂を薄膜状に吐出する。続いて、紫外線硬化樹脂が薄膜状に吐出されると、硬化部８６において、紫外線硬化樹脂の膜厚が均一となるように、紫外線硬化樹脂が平坦化装置９０によって平坦化される。そして、照射装置９２が、その薄膜状の紫外線硬化樹脂に紫外線を照射する。これにより、基台６０の上に薄膜状の樹脂層１５３が形成される。 Specifically, in the second printing section 84 of the second modeling unit 23, the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the upper surface of the base 60. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by a flattening device 90 in the curing section 86 so that the thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet rays. As a result, a thin film-like resin layer 153 is formed on the base 60.
　続いて、インクジェットヘッド８８が、その薄膜状の樹脂層１５３の上に紫外線硬化樹脂を薄膜状に吐出する。そして、平坦化装置９０によって薄膜状の紫外線硬化樹脂が平坦化され、照射装置９２が、その薄膜状に吐出された紫外線硬化樹脂に紫外線を照射することで、薄膜状の樹脂層１５３の上に薄膜状の樹脂層１５３が積層される。このように、薄膜状の樹脂層１５３の上への紫外線硬化樹脂の吐出と、紫外線の照射とが繰り返され、複数の樹脂層１５３が積層されることで、樹脂積層体１５２が形成される。 Subsequently, the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the thin film resin layer 153. Then, the thin film-like ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet rays onto the thin film-like ultraviolet curable resin, thereby forming a layer on the thin film-like resin layer 153. A thin film-like resin layer 153 is laminated. In this way, the resin laminate 152 is formed by repeating the discharging of the ultraviolet curable resin onto the thin film-like resin layer 153 and the irradiation of ultraviolet rays, and by stacking a plurality of resin layers 153.
　次に、樹脂積層体１５２が形成されると、ステージ５２が第１造形ユニット２２の下方に移動される。そして、第１造形ユニット２２の第１印刷部７２において、インクジェットヘッド７６が、図４に示すように、樹脂積層体１５２の上面に金属インク１６０を、回路パターンに応じて線状に吐出する。続いて、回路パターンに応じて吐出された金属インク１６０に、第１造形ユニット２２の焼成部７４において、赤外線照射装置７８が赤外線を照射する。これにより、金属インク１６０が焼成し、樹脂積層体１５２の上面に配線１６２が形成される。なお、図４では、３本の配線１６２が形成されるが、それら３本の配線１６２を区別する場合に、図４での左側の配線を配線１６２ａと記載し、中央の配線を配線１６２ｂと記載し、右側の配線を配線１６２ｃと記載する。 Next, when the resin laminate 152 is formed, the stage 52 is moved below the first modeling unit 22. Then, in the first printing section 72 of the first modeling unit 22, the inkjet head 76 ejects the metal ink 160 in a line shape according to the circuit pattern onto the upper surface of the resin laminate 152, as shown in FIG. 4. Next, in the baking section 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates the metal ink 160 ejected according to the circuit pattern with infrared rays. As a result, the metal ink 160 is baked, and wiring 162 is formed on the upper surface of the resin laminate 152. Note that in FIG. 4, three wirings 162 are formed, but when distinguishing between these three wirings 162, the wiring on the left side in FIG. 4 is described as wiring 162a, the wiring in the center is described as wiring 162b, and the wiring on the right side is described as wiring 162c.
　続いて、樹脂積層体１５２の上に配線１６２が形成されると、ステージ５２が第３造形ユニット２４の下方に移動される。そして、第３造形ユニット２４の第３印刷部１００において、ディスペンサ１０６が、図５に示すように、配線１６２ｂの両端部の上と、その配線１６２ｂの両端部と対向する配線１６２ａ及び配線１６２ｃの端部の上に導電性ペースト１６６を吐出する。 Subsequently, when the wiring 162 is formed on the resin laminate 152, the stage 52 is moved below the third modeling unit 24. Then, in the third printing section 100 of the third modeling unit 24, the dispenser 106 prints on both ends of the wiring 162b, and on the wiring 162a and the wiring 162c facing both ends of the wiring 162b. Dispense conductive paste 166 onto the end.
　このように、導電性ペースト１６６が配線１６２の端部に吐出されると、基台６０に内蔵されているヒータ６６により樹脂積層体１５２が導電性ペーストの加熱条件に従って加熱される。これにより、樹脂積層体１５２を介して導電性ペースト１６６が加熱されて、硬化する。なお、導電性ペーストの加熱条件は、導電性ペーストを完全に硬化させるための加熱条件であり、導電性ペーストの製造元のメーカにより設定されている。また、導電性ペーストの加熱条件は、導電性ペーストのユーザにより実験的に実施された導電性ペーストの加熱結果に応じて設定されている。このように、導電性ペースト１６６が導電性ペーストの加熱条件に従って加熱されて、完全に硬化することで、導電性を発揮する。 When the conductive paste 166 is thus discharged onto the end of the wiring 162, the heater 66 built into the base 60 heats the resin laminate 152 according to the heating conditions of the conductive paste. This causes the conductive paste 166 to be heated through the resin laminate 152 and harden. The heating conditions of the conductive paste are heating conditions for completely hardening the conductive paste, and are set by the manufacturer of the conductive paste. The heating conditions of the conductive paste are also set according to the results of heating the conductive paste experimentally performed by a user of the conductive paste. In this way, the conductive paste 166 is heated according to the heating conditions of the conductive paste and completely hardens, thereby exhibiting conductivity.
　このように、配線１６２の端部に吐出された導電性ペースト１６６が加熱により硬化すると、ステージ５２は第４造形ユニット２５の下方に移動される。そして、第４造形ユニット２５の第４印刷部１１０において、ディスペンサ１１６が、図６に示すように、互いに対向する２本の配線１６２ａ，ｂの端部の間において樹脂積層体１５２の上面に熱硬化性樹脂１７０を吐出し、互いに対向する２本の配線１６２ｂ，ｃの端部の間において樹脂積層体１５２の上面に熱硬化性樹脂１７０を吐出する。 In this way, when the conductive paste 166 discharged onto the end of the wiring 162 is cured by heating, the stage 52 is moved below the fourth modeling unit 25. Then, in the fourth printing section 110 of the fourth modeling unit 25, the dispenser 116 applies heat to the upper surface of the resin laminate 152 between the ends of the two wires 162a, b facing each other, as shown in FIG. The thermosetting resin 170 is discharged onto the upper surface of the resin laminate 152 between the ends of the two wires 162b and 162c facing each other.
　そして、互いに対向する２本の配線１６２の端部の間において樹脂積層体１５２の上面に熱硬化性樹脂１７０が吐出されると、ステージ５２が装着ユニット２７の下方に移動される。装着ユニット２７では、テープフィーダ１３４により電子部品（図７参照）１７２が供給され、その電子部品１７２が装着ヘッド１３６の吸着ノズルによって、保持される。なお、電子部品１７２は、所謂チップ部品であり、部品本体１７６と、部品本体１７６の下面に配設された２個の電極１７８とにより構成されている。そして、装着ヘッド１３６が、移動装置１３８によって移動され、吸着ノズルにより保持された電子部品１７２が、図７に示すように、樹脂積層体１５２の上面に装着される。なお、図７では、２個の電子部品１７２が樹脂積層体１５２の上面に装着されており、それら２個の電子部品１７２のサイズは異なっている。このため、小さなサイズの電子部品を電子部品１７２ａと記載し、大きなサイズの電子部品を電子部品１７２ｂと記載する。そして、電子部品１７２ａが２本の配線１６２ａ，ｂと電気的に接続され、電子部品１７２ｂが２本の配線１６２ｂ，ｃと電気的に接続されるように、それら２個の電子部品１７２ａ，ｂが樹脂積層体１５２の上面に装着される。 Then, when the thermosetting resin 170 is discharged onto the upper surface of the resin laminate 152 between the ends of the two wires 162 facing each other, the stage 52 is moved below the mounting unit 27. In the mounting unit 27, an electronic component (see FIG. 7) is supplied by a tape feeder 134, and the electronic component 172 is held by a suction nozzle of a mounting head 136. Note that the electronic component 172 is a so-called chip component, and is composed of a component body 176 and two electrodes 178 disposed on the lower surface of the component body 176. Then, the mounting head 136 is moved by the moving device 138, and the electronic component 172 held by the suction nozzle is mounted on the upper surface of the resin laminate 152, as shown in FIG. In addition, in FIG. 7, two electronic components 172 are mounted on the upper surface of the resin laminate 152, and the sizes of these two electronic components 172 are different. Therefore, a small-sized electronic component will be referred to as an electronic component 172a, and a large-sized electronic component will be referred to as an electronic component 172b. Then, the two electronic components 172a, b are connected so that the electronic component 172a is electrically connected to the two wirings 162a, b, and the electronic component 172b is electrically connected to the two wirings 162b, c. is mounted on the upper surface of the resin laminate 152.
　具体的には、電子部品１７２ａは、電極１７８が配線１６２ａ，ｂの上で硬化した状態の導電性ペースト１６６に接触するように、装着される。この際、電子部品１７２ａの部品本体１７６は、配線１６２ａ，ｂの間に吐出された熱硬化性樹脂１７０に接触する。また、電子部品１７２ｂは、電極１７８が配線１６２ｂ，ｃの上で硬化した状態の導電性ペースト１６６に接触するように、装着される。この際、電子部品１７２ｂの部品本体１７６は、配線１６２ｂ，ｃ間に吐出された熱硬化性樹脂１７０に接触する。つまり、導電性ペースト１６６は配線１６２への電極１７８の装着予定位置に吐出されており、熱硬化性樹脂１７０は部品本体１７６の装着予定位置に吐出されている。なお、電極１７８の装着予定位置は、樹脂積層体１５２及び配線１６２の上面での電子部品１７２が装着される位置のうちの、電子部品１７２に対する電極１７８の相対的な位置であり、電子部品１７２が装着された際に電極１７８が接触する位置である。また、部品本体１７６の装着予定位置は、樹脂積層体１５２の上面での電子部品１７２が装着される位置のうちの、電子部品１７２に対する部品本体１７６の相対的な位置であり、電子部品１７２が装着された際に部品本体１７６が接触する位置である。このため、電子部品１７２が樹脂積層体１５２に装着されることで、電極１７８が配線１６２の上で硬化した状態の導電性ペースト１６６に接触し、部品本体１７６が熱硬化性樹脂１７０に接触する。また、部品本体１７６に接触する熱硬化性樹脂１７０は、その部品本体１７６と樹脂積層体１５２との間に封じ込められる。つまり、樹脂積層体１５２の上面と部品本体１７６の下面との間に、熱硬化性樹脂１７０が封入される。なお、樹脂積層体１５２の上面と部品本体１７６の下面との間から熱硬化性樹脂１７０がはみ出ないように、ディスペンサ１１６による熱硬化性樹脂１７０の吐出量が制御されている。 Specifically, electronic component 172a is mounted so that electrode 178 contacts conductive paste 166 in a hardened state on wiring 162a, b. At this time, component body 176 of electronic component 172a contacts thermosetting resin 170 dispensed between wiring 162a, b. Electronic component 172b is mounted so that electrode 178 contacts conductive paste 166 in a hardened state on wiring 162b, c. At this time, component body 176 of electronic component 172b contacts thermosetting resin 170 dispensed between wiring 162b, c. In other words, conductive paste 166 is dispensed at the intended attachment position of electrode 178 to wiring 162, and thermosetting resin 170 is dispensed at the intended attachment position of component body 176. The planned mounting position of the electrode 178 is the relative position of the electrode 178 with respect to the electronic component 172 among the positions where the electronic component 172 is mounted on the upper surface of the resin laminate 152 and the wiring 162, and is the position where the electrode 178 comes into contact when the electronic component 172 is mounted. The planned mounting position of the component body 176 is the relative position of the component body 176 with respect to the electronic component 172 among the positions where the electronic component 172 is mounted on the upper surface of the resin laminate 152, and is the position where the component body 176 comes into contact when the electronic component 172 is mounted. Therefore, by mounting the electronic component 172 on the resin laminate 152, the electrode 178 comes into contact with the conductive paste 166 in a hardened state on the wiring 162, and the component body 176 comes into contact with the thermosetting resin 170. The thermosetting resin 170 in contact with the component body 176 is sealed between the component body 176 and the resin laminate 152. That is, the thermosetting resin 170 is filled between the upper surface of the resin laminate 152 and the lower surface of the component body 176. The amount of the thermosetting resin 170 dispensed by the dispenser 116 is controlled so that the thermosetting resin 170 does not spill out from between the upper surface of the resin laminate 152 and the lower surface of the component body 176.
　このように、２個の電子部品１７２ａ，ｂが装着されることで、電子部品１７２ａが２本の配線１６２ａ，ｂと電気的に接続され、電子部品１７２ｂが２本の配線１６２ｂ，ｃと電気的に接続される。ただし、電極１７８が、硬化した状態の導電性ペースト１６６に接触するように、電子部品１７２は装着されるため、この時点において電極１７８と導電性ペースト１６６との接触面積は小さい。一方で、電子部品１７２の部品本体１７６は熱硬化性樹脂１７０に接触するが、熱硬化性樹脂１７０はこの時点において未硬化であるため、部品本体１７６と熱硬化性樹脂１７０との接触面積は大きくなる。 In this way, by installing the two electronic components 172a, b, the electronic component 172a is electrically connected to the two wirings 162a, b, and the electronic component 172b is electrically connected to the two wirings 162b, c. connected. However, since the electronic component 172 is mounted so that the electrode 178 contacts the hardened conductive paste 166, the contact area between the electrode 178 and the conductive paste 166 at this point is small. On the other hand, the component body 176 of the electronic component 172 contacts the thermosetting resin 170, but since the thermosetting resin 170 is uncured at this point, the contact area between the component body 176 and the thermosetting resin 170 is growing.
　このように、電子部品１７２が樹脂積層体１５２の上面に装着されると、ステージ５２は押圧ユニット２６の下方に移動される。そして、押圧ユニット２６の押圧部１２０において、図８に示すように、樹脂積層体１５２に装着された電子部品１７２が上方から下方に向って押圧プレート１２２によりゴムプレート１２４を介して押し付けられる。なお、樹脂積層体１５２に２個の電子部品１７２ａ，ｂが装着されており、それら２個の電子部品１７２のサイズは異なっている。また、２個の電子部品の高さ寸法は異なる。しかし、押圧プレート１２２の下面にゴムプレート１２４が貼着されているため、２個の電子部品１７２が押圧される際にゴムプレート１２４が弾性変形することで、高さ寸法の異なる２個の電子部品１７２を適切に押し付けることができる。 In this way, when the electronic component 172 is mounted on the upper surface of the resin laminate 152, the stage 52 is moved below the pressing unit 26. Then, in the pressing section 120 of the pressing unit 26, as shown in FIG. 8, the electronic component 172 mounted on the resin laminate 152 is pressed from above to below by the pressing plate 122 via the rubber plate 124. Note that two electronic components 172a and 172b are attached to the resin laminate 152, and the sizes of these two electronic components 172 are different. Further, the height dimensions of the two electronic components are different. However, since the rubber plate 124 is attached to the lower surface of the press plate 122, the rubber plate 124 is elastically deformed when the two electronic components 172 are pressed, and the two electronic components with different height dimensions are Part 172 can be pressed appropriately.
　また、押圧ユニット２６において電子部品が押圧されている際に、基台６０に内蔵されているヒータ６６により樹脂積層体１５２が加熱される。これにより、樹脂積層体１５２を介して熱硬化性樹脂１７０が加熱されて、硬化する。ここで、加熱温度は、例えば、熱硬化性樹脂１７０が硬化する温度（例えば、８５℃）である。つまり、樹脂積層体１５２の上面と部品本体１７６の下面との間に封入された状態の熱硬化性樹脂１７０がゴムプレート１２４により押圧されながら硬化する。これにより、部品本体１７６と熱硬化性樹脂１７０との接触面積は更に大きくなり、熱硬化性樹脂１７０の接着力により、電子部品１７２は部品本体１７６において樹脂積層体１５２の上面に固定される。また、電子部品１７２が押圧されることで、つまり、樹脂積層体１５２に装着されている電子部品１７２が樹脂積層体１５２に向って押し付けられることで、電子部品１７２の電極１７８と接触している導電性ペースト１６６が変形し、電極１７８と導電性ペースト１６６との接触面積が増大する。これにより、電子部品１７２と配線１６２との電気的な接続が担保される。 Furthermore, when the electronic component is pressed by the pressing unit 26, the resin laminate 152 is heated by the heater 66 built into the base 60. As a result, the thermosetting resin 170 is heated and hardened via the resin laminate 152. Here, the heating temperature is, for example, a temperature at which the thermosetting resin 170 is cured (for example, 85° C.). That is, the thermosetting resin 170 sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176 is hardened while being pressed by the rubber plate 124 . This further increases the contact area between the component body 176 and the thermosetting resin 170, and the adhesive force of the thermosetting resin 170 fixes the electronic component 172 to the upper surface of the resin laminate 152 in the component body 176. Furthermore, when the electronic component 172 is pressed, that is, when the electronic component 172 mounted on the resin laminate 152 is pressed toward the resin laminate 152, it comes into contact with the electrode 178 of the electronic component 172. The conductive paste 166 is deformed, and the contact area between the electrode 178 and the conductive paste 166 increases. This ensures electrical connection between the electronic component 172 and the wiring 162.
　このように熱硬化性樹脂１７０の接着力により、電子部品１７２が樹脂積層体１５２の上面に固定されることで、図９に示す回路基板１８０が形成される。ただし、回路基板１８０では、小さなサイズの電子部品１７２ａの熱硬化性樹脂１７０による接着面積率は、大きなサイズの電子部品１７２ｂの熱硬化性樹脂１７０による接着面積率と比較して小さいため、装着された電子部品１７２ａが位置ずれして導通不良となる虞がある。詳しくは、電子部品１７２の熱硬化性樹脂１７０による接着面積率は、電子部品１７２の回路基板への装着面、つまり、電子部品１７２の下面の面積に対する、電子部品１７２の熱硬化性樹脂１７０による接着面積の百分率である。ここで、小さなサイズの電子部品１７２ａの装着面の面積はＸＡ１であり、小さなサイズの電子部品１７２ａの熱硬化性樹脂１７０による接着面積はＸＳ１である。このため、小さなサイズの電子部品１７２ａの熱硬化性樹脂１７０による接着面積率は、ＸＳ１／ＸＡ１である。一方、大きなサイズの電子部品１７２ｂの装着面の面積はＸＡ２であり、大きなサイズの電子部品１７２ｂの熱硬化性樹脂１７０による接着面積はＸＳ２である。このため、大きなサイズの電子部品１７２ｂの熱硬化性樹脂１７０による接着面積率は、ＸＳ２／ＸＡ２である。そして、図９から解るように、小さなサイズの電子部品１７２ａの接着面積率ＸＳ１／ＸＡ１は、大きなサイズの電子部品１７２ｂの接着面積率ＸＳ２／ＸＡ２より明らかに小さい。このため、小さなサイズの電子部品１７２ａの熱硬化性樹脂１７０による接着力は、大きなサイズの電子部品１７２ｂの熱硬化性樹脂１７０による接着力と比較して相当小さいため、装着された電子部品１７２ａが位置ずれして導通不良となる虞がある。 In this manner, the electronic component 172 is fixed to the upper surface of the resin laminate 152 by the adhesive force of the thermosetting resin 170, thereby forming the circuit board 180 shown in FIG. However, on the circuit board 180, the adhesive area ratio of the small-sized electronic component 172a by the thermosetting resin 170 is smaller than the adhesive area ratio of the large-sized electronic component 172b by the thermosetting resin 170. There is a possibility that the electronic component 172a may be displaced, resulting in poor conduction. Specifically, the adhesive area ratio of the thermosetting resin 170 of the electronic component 172 is the ratio of the adhesive area of the electronic component 172 by the thermosetting resin 170 to the area of the mounting surface of the electronic component 172 to the circuit board, that is, the bottom surface of the electronic component 172. It is a percentage of the adhesive area. Here, the area of the mounting surface of the small-sized electronic component 172a is XA1, and the adhesive area of the small-sized electronic component 172a with the thermosetting resin 170 is XS1. Therefore, the adhesive area ratio of the small-sized electronic component 172a by the thermosetting resin 170 is XS1/XA1. On the other hand, the area of the mounting surface of the large-sized electronic component 172b is XA2, and the adhesive area of the large-sized electronic component 172b with the thermosetting resin 170 is XS2. Therefore, the adhesive area ratio of the thermosetting resin 170 of the large-sized electronic component 172b is XS2/XA2. As can be seen from FIG. 9, the adhesion area ratio XS1/XA1 of the small-sized electronic component 172a is clearly smaller than the adhesion area ratio XS2/XA2 of the large-sized electronic component 172b. Therefore, the adhesive force of the thermosetting resin 170 of the small-sized electronic component 172a is considerably smaller than that of the thermosetting resin 170 of the large-sized electronic component 172b, so that the attached electronic component 172a There is a risk of misalignment and poor continuity.
　このようなことに鑑みて、小さなサイズの電子部品１７２ａの接触面積率を大きくするべく、電子部品１７２ａの電極１７８と配線１６２とを導通する導電性ペースト１６６が、電極１７８の装着予定位置から、電子部品１７２ａから離れる方向（以下、「離間方向」と記載する）にズレた位置に塗布される。具体的には、小さなサイズの電子部品１７２ａの電極１７８の装着予定位置に導電性樹脂ペースト１６６が塗布される場合には、図１０に示すように、電極１７８の中央１９０と導電性ペースト１６６の中央１９２とが重なるように、導電性ペースト１６６が塗布される。なお、小さなサイズの電子部品１７２ａのサイズは、例えば、０．６ｍｍ×０．３ｍｍ（図１０における紙面左右方向の長さが０．６ｍｍ、紙面上下方向の長さが０．３ｍｍ）である。このように導電性ペースト１６６が小さなサイズの電子部品１７２ａの電極１７８の装着予定位置に塗布された場合には、１対の電極１７８に対応して塗布される１対の導電性ペースト１６６の間のスペースにおいて電子部品１７２ａが熱硬化性樹脂１７０と接触する。つまり、図１０での斜線部が、電子部品１７２ａの熱硬化性樹脂１７０による接着面積ＸＳ１である。また、図１０でのドット部が、電子部品１７２ａの装着面の面積ＸＡ１である。このため、電子部品１７２ａの接着面積率ＸＳ１（斜線部）／ＸＡ１（ドット部）は、約２３％となる。つまり、導電性ペースト１６６が電子部品１７２ａの電極１７８の装着予定位置に塗布された場合の電子部品１７２ａの接着面積率（以下、「装着予定位置での接着面積率」と記載する）は約２３％となる。 In view of this, in order to increase the contact area ratio of the small-sized electronic component 172a, the conductive paste 166 that connects the electrode 178 of the electronic component 172a and the wiring 162 is inserted from the planned mounting position of the electrode 178. It is applied at a position shifted in the direction away from the electronic component 172a (hereinafter referred to as the "separation direction"). Specifically, when the conductive resin paste 166 is applied to the planned mounting position of the electrode 178 of the small-sized electronic component 172a, as shown in FIG. Conductive paste 166 is applied so that it overlaps center 192 . Note that the size of the small electronic component 172a is, for example, 0.6 mm x 0.3 mm (the length in the horizontal direction of the paper in FIG. 10 is 0.6 mm, and the length in the vertical direction of the paper is 0.3 mm). In this way, when the conductive paste 166 is applied to the intended mounting position of the electrode 178 of the small-sized electronic component 172a, the conductive paste 166 is applied between the pair of conductive pastes 166 applied corresponding to the pair of electrodes 178 The electronic component 172a contacts the thermosetting resin 170 in the space. That is, the shaded area in FIG. 10 is the adhesive area XS1 of the electronic component 172a by the thermosetting resin 170. Further, the dot portion in FIG. 10 is the area XA1 of the mounting surface of the electronic component 172a. Therefore, the adhesion area ratio XS1 (shaded area)/XA1 (dot area) of the electronic component 172a is approximately 23%. In other words, when the conductive paste 166 is applied to the planned mounting position of the electrode 178 of the electronic component 172a, the adhesion area ratio of the electronic component 172a (hereinafter referred to as "adhesion area ratio at the planned mounting position") is approximately 23 %.
　そこで、電子部品１７２ａの接触面積率を大きくするべく、図１１に示すように、導電性ペースト１６６が、電極１７８の装着予定位置から離間方向にズレた位置に塗布される。つまり、導電性ペースト１６６の中央１９２が、電子部品１７２ａの電極１７８の中央１９０から離間方向にズレるように、導電性ペースト１６６が塗布される。このように導電性ペースト１６６が電極１７８の装着予定位置から離間方向にズレた位置に塗布されると、１対の電極１７８に対応して塗布される１対の導電性ペースト１６６が互いに離れるため、１対の導電性ペースト１６６の間のスペースが広くなる。このため、電子部品１７２ａの熱硬化性樹脂１７０による接着面積ＸＳ１（斜線部）が大きくなることで、電子部品１７２ａの接着面積率ＸＳ１（斜線部）／ＸＡ１（ドット部）は、約４３％となる。つまり、導電性ペースト１６６が電子部品１７２ａの電極１７８の装着予定位置から離間方向にズレた位置に塗布された場合の電子部品１７２ａの接着面積率（以下、「離間位置での接着面積率」と記載する）は約４３％となる。このように、導電性ペースト１６６が、電子部品１７２ａの電極１７８の装着予定位置から離間方向にズレた位置に塗布されることで、電子部品１７２ａの接触面積率が大きくなり、装着された電子部品１７２ａの位置ズレ等を防止することが可能となる。 Therefore, in order to increase the contact area ratio of the electronic component 172a, as shown in FIG. 11, the conductive paste 166 is applied to a position shifted away from the intended mounting position of the electrode 178. That is, the conductive paste 166 is applied so that the center 192 of the conductive paste 166 is shifted away from the center 190 of the electrode 178 of the electronic component 172a. When the conductive paste 166 is applied to a position shifted away from the intended attachment position of the electrode 178 in this way, a pair of conductive pastes 166 applied corresponding to a pair of electrodes 178 are separated from each other. , the space between the pair of conductive pastes 166 becomes wider. Therefore, as the adhesive area XS1 (shaded area) of the electronic component 172a by the thermosetting resin 170 increases, the adhesive area ratio XS1 (shaded area)/XA1 (dot area) of the electronic component 172a becomes approximately 43%. Become. In other words, the adhesive area ratio of the electronic component 172a when the conductive paste 166 is applied to a position shifted away from the scheduled mounting position of the electrode 178 of the electronic component 172a (hereinafter referred to as "adhesion area ratio at the separated position"). ) is approximately 43%. In this way, the conductive paste 166 is applied to a position shifted away from the scheduled mounting position of the electrode 178 of the electronic component 172a, so that the contact area ratio of the electronic component 172a increases, and the mounted electronic component It becomes possible to prevent the positional shift of 172a.
　一方で、大きなサイズの電子部品１７２ａの電極１７８の装着予定位置に導電性樹脂ペースト１６６が塗布される場合には、図１２に示すように、電極１７８の中央２００と導電性ペースト１６６の中央２０２とが重なるように、導電性ペースト１６６が塗布される。なお、大きなサイズの電子部品１７２ｂのサイズは、例えば、１．０ｍｍ×０．５ｍｍ（図１２における紙面左右方向の長さが１．０ｍｍ、紙面上下方向の長さが０．５ｍｍ）である。このように導電性ペースト１６６が電子部品１７２ｂの電極１７８の装着予定位置に塗布された場合に、電子部品１７２ｂのサイズは大きく、１対の電極１７８の間のスペースも比較的大きいため、電子部品１７２ｂと熱硬化性樹脂１７０とが接触する接着面積ＸＳ２（斜線部）も大きい。このため、電子部品１７２ｂの接着面積率ＸＳ２（斜線部）／ＸＡ２（ドット部）は、約４３％となる。つまり、電子部品１７２ｂの電極１７８の装着予定位置での接着面積率は約４３％となる。このように、大きな電子部品１７２ｂに対する装着予定位置での接着面積率（約４３％）は、小さな電子部品１７２ａに対する離間位置での接着面積率（約４３％）と略同じであるため、大きな電子部品１７２ｂに対して導電性ペースト１６６が塗布される場合に、導電性ペースト１６６は、電極１７８の装着予定位置からズラして塗布される必要はなく、電極１７８の装着予定位置に塗布される。 On the other hand, when the conductive resin paste 166 is applied to the planned mounting position of the electrode 178 of the large-sized electronic component 172a, as shown in FIG. Conductive paste 166 is applied so as to overlap with each other. The size of the large-sized electronic component 172b is, for example, 1.0 mm x 0.5 mm (the length in the horizontal direction of the paper in FIG. 12 is 1.0 mm, and the length in the vertical direction of the paper is 0.5 mm). When the conductive paste 166 is applied to the intended mounting position of the electrode 178 of the electronic component 172b, the size of the electronic component 172b is large and the space between the pair of electrodes 178 is also relatively large. The adhesive area XS2 (hatched area) where 172b and thermosetting resin 170 contact is also large. Therefore, the adhesion area ratio XS2 (shaded area)/XA2 (dotted area) of the electronic component 172b is approximately 43%. In other words, the adhesion area ratio at the intended mounting position of the electrode 178 of the electronic component 172b is approximately 43%. In this way, the adhesive area ratio (approximately 43%) for the large electronic component 172b at the planned mounting position is approximately the same as the adhesive area ratio (approximately 43%) for the small electronic component 172a at the separated position. When the conductive paste 166 is applied to the component 172b, the conductive paste 166 does not need to be applied at a position shifted from the planned mounting position of the electrode 178, but is applied at the planned mounting position of the electrode 178.
　なお、上述したように、電子部品１７２ａのサイズは、例えば、０．６ｍｍ×０．３ｍｍであり、電子部品１７２ａは小さいため、導電性ペースト１６６が電極の装着予定位置からズレた位置に塗布される。このため、電子部品１７２ａ、つまり、０．６ｍｍ×０．３ｍｍより小さいサイズの電子部品に対しても、導電性ペースト１６６が電極の装着予定位置からズレた位置に塗布される。具体的には、図１３に示すように、０．６ｍｍ×０．３ｍｍより小さいサイズの電子部品１７２ｃ、例えば、０．４ｍｍ×０．２ｍｍ（図１３における紙面左右方向の長さが０．４ｍｍ、紙面上下方向の長さが０．２ｍｍ）の電子部品１７２ｃの電極１７８の装着予定位置に導電性樹脂ペースト１６６が塗布される場合に、電極１７８の中央２１０と導電性ペースト１６６の中央２１２とが重なるように、導電性ペースト１６６が塗布される。このように電子部品１７２ｃの電極１７８の装着予定位置に導電性樹脂ペースト１６６が塗布されると、１対の電極１７８に対応して塗布された１対の導電性ペースト１６６が接触し、１対の導電性ペースト１６６の間のスペースがない。このため、電子部品１７２ｃの電極１７８の装着予定位置に導電性樹脂ペースト１６６が塗布された場合に、電子部品１７２ｃと熱硬化性樹脂１７０とが接触する接着面積は０となり、電子部品１７２ｃの接着面積率は０％となる。つまり、電子部品１７２ｃの電極１７８の装着予定位置での接着面積率は０％となる。　 As described above, the size of electronic component 172a is, for example, 0.6 mm x 0.3 mm, and since electronic component 172a is small, conductive paste 166 is applied to a position shifted from the intended mounting position of the electrode. For this reason, even for electronic component 172a, that is, electronic components smaller than 0.6 mm x 0.3 mm, conductive paste 166 is applied to a position shifted from the intended mounting position of the electrode. Specifically, as shown in FIG. 13, when conductive resin paste 166 is applied to the intended mounting position of electrode 178 of electronic component 172c smaller than 0.6 mm x 0.3 mm, for example, electronic component 172c of 0.4 mm x 0.2 mm (0.4 mm in the horizontal direction of the paper in FIG. 13 and 0.2 mm in the vertical direction of the paper), conductive paste 166 is applied so that center 210 of electrode 178 and center 212 of conductive paste 166 overlap. When the conductive resin paste 166 is applied in this manner to the intended mounting positions of the electrodes 178 of the electronic component 172c, the pair of conductive pastes 166 applied corresponding to the pair of electrodes 178 come into contact with each other, and there is no space between the pair of conductive pastes 166. Therefore, when the conductive resin paste 166 is applied to the intended mounting positions of the electrodes 178 of the electronic component 172c, the contact area between the electronic component 172c and the thermosetting resin 170 is 0, and the adhesion area ratio of the electronic component 172c is 0%. In other words, the adhesion area ratio at the intended mounting positions of the electrodes 178 of the electronic component 172c is 0%.
　そこで、電子部品１７２ｃの接触面積率を大きくするべく、図１４に示すように、導電性ペースト１６６が、電子部品１７２ｃの電極１７８の装着予定位置から離間方向にズレた位置に塗布される。つまり、導電性ペースト１６６の中央２１２が、電子部品１７２ｃの電極１７８の中央２１０から離間方向にズレるように、導電性ペースト１６６が塗布される。これにより、１対の導電性ペースト１６６が互いに離れて、電子部品１７２ｃの熱硬化性樹脂１７０による接着面積が確保されることで、電子部品１７２ｃの接着面積率は約４３％となる。これにより、電子部品１７２ａより小さな電子部品１７２ｃにおいても、電子部品１７２ｃの位置ズレ等を防止することが可能となる。 Therefore, in order to increase the contact area ratio of the electronic component 172c, as shown in FIG. 14, the conductive paste 166 is applied to a position of the electronic component 172c that is shifted away from the planned mounting position of the electrode 178. That is, the conductive paste 166 is applied so that the center 212 of the conductive paste 166 is shifted away from the center 210 of the electrode 178 of the electronic component 172c. As a result, the pair of conductive pastes 166 are separated from each other, and the adhesive area of the electronic component 172c by the thermosetting resin 170 is secured, so that the adhesive area ratio of the electronic component 172c is approximately 43%. Thereby, even if the electronic component 172c is smaller than the electronic component 172a, it is possible to prevent the electronic component 172c from being misaligned.
　つまり、図１５に示すように、電子部品ａ，ｃ（例えば、０．６ｍｍ×０．３ｍｍ、例えば、０．４ｍｍ×０．２ｍｍ）に対する装着予定位置での接着面積率は、電子部品ａ，ｃより大きなサイズの電子部品１７２ｂ（例えば、1．０ｍｍ×０．５ｍｍ）に対する装着予定位置での接着面積率より低いため、電子部品ａ，ｃに対して導電性ペーストが装着予定位置からズレた位置に塗布される。これにより、電子部品ａ，ｃに対して離間位置での接着面積率を４０％以上、つまり、電子部品ａ，ｃより大きなサイズの電子部品１７２ｂに対する装着予定位置での接着面積率と同程度とすることが可能となる。つまり、熱硬化性樹脂１７０による電子部品ａ，ｃの接着力を、熱硬化性樹脂１７０による電子部品ｂの接着力と同程度とすることが可能となる。これにより、電子部品１７２ｂより小さい電子部品ａ，ｃの位置ズレ等を適切に防止することが可能となる。 That is, as shown in FIG. 15, the adhesion area ratio at the scheduled mounting position for electronic components a and c (for example, 0.6 mm x 0.3 mm, for example, 0.4 mm x 0.2 mm) is as follows: Because the adhesive area ratio is lower than the bonding area ratio at the scheduled mounting position for electronic components 172b (for example, 1.0 mm x 0.5 mm) larger than c, the conductive paste was shifted from the scheduled mounting position for electronic components a and c. applied to the location. As a result, the adhesion area ratio at the separated position for electronic components a and c is 40% or more, that is, the same level as the adhesion area ratio at the scheduled mounting position for electronic component 172b, which is larger in size than electronic components a and c. It becomes possible to do so. In other words, it is possible to make the adhesive strength of the electronic components a and c by the thermosetting resin 170 comparable to the adhesive strength of the electronic component b by the thermosetting resin 170. Thereby, it becomes possible to appropriately prevent the positional deviation of the electronic components a and c, which are smaller than the electronic component 172b.
　一方で、電子部品１７２ｂ（例えば、１．０ｍｍ×０．５ｍｍ）より大きい電子部品、例えば、１．６ｍｍ×０．８ｍｍ、２．０ｍｍ×１．２ｍｍ、３．２ｍｍ×１．６ｍｍのサイズの電子部品において、図示は省略するが、１対の電極の間のスペースは、電子部品１７２ｂ（例えば、１．０ｍｍ×０．５ｍｍ）の１対の電極の間のスペースより大きい。このため、１．６ｍｍ×０．８ｍｍ、２．０ｍｍ×１．２ｍｍ、３．２ｍｍ×１．６ｍｍのサイズの電子部品に対する装着予定位置での接着面積率は、電子部品１７２ｂ（例えば、１．０ｍｍ×０．５ｍｍ）に対する装着予定位置での接着面積率より大きい。具体的には、図１５に示すように、１．６ｍｍ×０．８ｍｍのサイズの電子部品に対する装着予定位置での接着面積率は約６１％であり、２．０ｍｍ×１．２ｍｍのサイズの電子部品に対する装着予定位置での接着面積率は約６９％であり、３．２ｍｍ×１．６ｍｍのサイズの電子部品に対する装着予定位置での接着面積率は約８０％である。このため、１．６ｍｍ×０．８ｍｍ、２．０ｍｍ×１．２ｍｍ、３．２ｍｍ×１．６ｍｍのサイズの電子部品に対して導電性ペースト１６６が塗布される場合に、導電性ペースト１６６は、電極１７８の装着予定位置からズラして塗布される必要はなく、電極１７８の装着予定位置に塗布される。つまり、１．０ｍｍ×０．５ｍｍ以上のサイズの電子部品に対して、導電性ペースト１６６は電極１７８の装着予定位置に塗布され、１．０ｍｍ×０．５ｍｍ未満のサイズの電子部品に対して、電極１７８の装着予定位置からズラして塗布される。なお、導電性ペースト１６６が装着予定位置に塗布されるか、装着予定位置からズラして塗布されるかの基準となるサイズ、つまり、１．０ｍｍ×０．５ｍｍは作業者により設定されているが、その基準となるサイズを任意に変更することが可能である。 On the other hand, in electronic components larger than electronic component 172b (e.g., 1.0 mm x 0.5 mm), e.g., electronic components having sizes of 1.6 mm x 0.8 mm, 2.0 mm x 1.2 mm, and 3.2 mm x 1.6 mm, although not shown in the figures, the space between a pair of electrodes is larger than the space between a pair of electrodes of electronic component 172b (e.g., 1.0 mm x 0.5 mm). Therefore, the adhesion area ratio at the intended mounting position for electronic components having sizes of 1.6 mm x 0.8 mm, 2.0 mm x 1.2 mm, and 3.2 mm x 1.6 mm is larger than the adhesion area ratio at the intended mounting position for electronic component 172b (e.g., 1.0 mm x 0.5 mm). Specifically, as shown in Fig. 15, the adhesion area ratio at the intended mounting position for an electronic component of 1.6 mm x 0.8 mm is about 61%, the adhesion area ratio at the intended mounting position for an electronic component of 2.0 mm x 1.2 mm is about 69%, and the adhesion area ratio at the intended mounting position for an electronic component of 3.2 mm x 1.6 mm is about 80%. Therefore, when the conductive paste 166 is applied to electronic components of 1.6 mm x 0.8 mm, 2.0 mm x 1.2 mm, and 3.2 mm x 1.6 mm, the conductive paste 166 does not need to be applied at a position shifted from the intended mounting position of the electrode 178, but is applied at the intended mounting position of the electrode 178. In other words, the conductive paste 166 is applied at the intended mounting position of the electrode 178 for electronic components of 1.0 mm x 0.5 mm or more, and is applied at a position shifted from the intended mounting position of the electrode 178 for electronic components of less than 1.0 mm x 0.5 mm. The standard size for determining whether the conductive paste 166 is applied to the intended installation position or offset from the intended installation position, i.e., 1.0 mm x 0.5 mm, is set by the operator, but the standard size can be changed as desired.
　なお、導電性ペースト１６６が電極１７８の装着予定位置からズラして塗布されることで、接着面積率が大きくなり、熱硬化性樹脂１７０による電子部品の接着力は高くなるが、導電性ペースト１６６の装着予定位置からのズレ量が多すぎると、電子部品の導電性を担保することができなくなる虞がある。詳しくは、例えば、図１６に示すように、電子部品１７２ａに対して導電性ペースト１６６が塗布される際に、電極１７８の中央１９０と導電性ペースト１６６の中央１９２とのズレ量が多すぎると、導電性ペースト１６６の導電面積率が小さくなる。ここで、導電性ペースト１６６の導電面積率は、１つの電極１７８の装着面での面積（ドット部）に対する、その電極１７８と導電性ペースト１６６との接触面積（斜線部）の百分率である。図１６に示す電子部品１７２ａでは、電極１７８の中央１９０と導電性ペースト１６６の中央１９２とのズレ量が多すぎるため、導電性ペースト１６６の導電面積率は約３０％となっている。このように導電性ペースト１６６の導電面積率が低い場合には、導電性ペースト１６６と電極１７８との導電性を適切に担保することができない。このようなことに鑑みて、導電性ペースト１６６の導電面積率が５０％以上となるように、電極１７８の中央１９０と導電性ペースト１６６の中央１９２とのズレ量が調整される。具体的には、例えば、図１７に示すように、電極１７８の中央１９０と導電性ペースト１６６の中央１９２とのズレ量が調整されることで、導電性ペースト１６６の導電面積率が５０％以上（図１７では８０％程度）とされる。これにより、導電性ペースト１６６と電極１７８との導電性を適切に担保することが可能となる。 Note that by applying the conductive paste 166 at a position shifted from the intended mounting position of the electrode 178, the adhesion area ratio increases and the adhesive force of the thermosetting resin 170 for electronic components increases; however, the conductive paste 166 If the amount of deviation from the planned mounting position is too large, there is a risk that the electrical conductivity of the electronic component cannot be ensured. Specifically, for example, as shown in FIG. 16, when the conductive paste 166 is applied to the electronic component 172a, if there is too much misalignment between the center 190 of the electrode 178 and the center 192 of the conductive paste 166. , the conductive area ratio of the conductive paste 166 becomes smaller. Here, the conductive area ratio of the conductive paste 166 is the percentage of the contact area (shaded area) between the electrode 178 and the conductive paste 166 to the area (dot area) on the mounting surface of one electrode 178. In the electronic component 172a shown in FIG. 16, the amount of misalignment between the center 190 of the electrode 178 and the center 192 of the conductive paste 166 is too large, so that the conductive area ratio of the conductive paste 166 is about 30%. When the conductive area ratio of the conductive paste 166 is low as described above, the conductivity between the conductive paste 166 and the electrode 178 cannot be properly ensured. In view of this, the amount of deviation between the center 190 of the electrode 178 and the center 192 of the conductive paste 166 is adjusted so that the conductive area ratio of the conductive paste 166 is 50% or more. Specifically, as shown in FIG. 17, for example, by adjusting the amount of misalignment between the center 190 of the electrode 178 and the center 192 of the conductive paste 166, the conductive area ratio of the conductive paste 166 can be increased to 50% or more. (approximately 80% in FIG. 17). This makes it possible to appropriately ensure the conductivity between the conductive paste 166 and the electrode 178.
　また、制御装置２８のコントローラ１４０は、図２に示すように、塗布部２２０と装着部２２２とを有している。塗布部２２０は、導電性ペースト１６６を電極１７８の装着予定位置から離間方向にズレた位置に塗布するための機能部である。装着部２２２は、塗布部２２０により塗布された導電性ペースト１６６に電極１７８が接触するように電子部品１７２を装着するための機能部である。 Further, the controller 140 of the control device 28 includes an application section 220 and a mounting section 222, as shown in FIG. The application section 220 is a functional section for applying the conductive paste 166 to a position shifted in the direction away from the intended mounting position of the electrode 178. The mounting section 222 is a functional section for mounting the electronic component 172 so that the electrode 178 comes into contact with the conductive paste 166 applied by the application section 220.
　なお、上記実施例において、回路形成装置１０は、回路形成装置の一例である。ディスペンサ１０６は、第１塗布装置の一例である。ディスペンサ１１６は、第２塗布装置の一例である。装着部１３２は、装着装置の一例である。導電性ペースト１６６は、導電性ペーストの一例である。熱硬化性樹脂１７０は、硬化性樹脂の一例である。電子部品１７２は、電子部品の一例である。部品本体１７６は、部品本体の一例である。電極１７８は、電極の一例である。１．０ｍｍ×０．５ｍｍは、所定サイズの一例である。また、塗布部２２０により実行される工程は、塗布工程の一例である。装着部２２２により実行される工程は、装着工程の一例である。 Note that in the above embodiment, the circuit forming device 10 is an example of a circuit forming device. Dispenser 106 is an example of a first coating device. Dispenser 116 is an example of a second coating device. The mounting section 132 is an example of a mounting device. The conductive paste 166 is an example of a conductive paste. Thermosetting resin 170 is an example of a curable resin. Electronic component 172 is an example of an electronic component. The component body 176 is an example of a component body. Electrode 178 is an example of an electrode. 1.0 mm x 0.5 mm is an example of the predetermined size. Further, the process performed by the coating unit 220 is an example of a coating process. The process performed by the mounting unit 222 is an example of a mounting process.
　なお、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。例えば、上記実施例では、１対の導電性ペースト１６６の間に熱硬化性樹脂１７０が塗布される態様に本発明が適用されているが、１対の導電性ペースト１６６の間に熱硬化性樹脂１７０が塗布されない態様に本発明が適用されてもよい。具体的には、例えば、図１３に示すように、電子部品１７２ｃに対して電極１７８の装着予定位置に導電性樹脂ペースト１６６が塗布されると、１対の導電性ペースト１６６が接触する。このような場合には、短絡が生じるため好ましくない。そこで、図１４に示すように、電子部品１７２ｃに対して電極１７８の装着予定位置から離間方向にズレた位置に導電性樹脂ペースト１６６が塗布されると、１対の導電性ペースト１６６が離間する。これにより、短絡を防止することが可能となる。このように、１対の導電性ペースト１６６の間に熱硬化性樹脂１７０が塗布されない態様に本発明が適用されることで、短絡を防止することが可能となる。 Note that the present invention is not limited to the above-mentioned embodiments, but can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the present invention is applied to a mode in which the thermosetting resin 170 is applied between the pair of conductive pastes 166, but the thermosetting resin 170 is applied between the pair of conductive pastes 166. The present invention may be applied to an embodiment in which the resin 170 is not applied. Specifically, for example, as shown in FIG. 13, when the conductive resin paste 166 is applied to the electronic component 172c at the intended mounting position of the electrode 178, the pair of conductive pastes 166 come into contact with each other. In such a case, a short circuit may occur, which is not preferable. Therefore, as shown in FIG. 14, when the conductive resin paste 166 is applied to the electronic component 172c at a position deviated in the separating direction from the planned mounting position of the electrode 178, the pair of conductive pastes 166 are separated. . This makes it possible to prevent short circuits. In this way, by applying the present invention to an embodiment in which the thermosetting resin 170 is not applied between the pair of conductive pastes 166, short circuits can be prevented.
　また、上記実施例では、電子部品１７２が装着される前に、熱硬化性樹脂１７０が塗布されているが、電子部品１７２が装着された後に、熱硬化性樹脂１７０が塗布されてもよい。この際、熱硬化性樹脂１７０は、装着された電子部品１７２の部品本体１７６の下面と樹脂積層体１５２の上面との間に塗布される。つまり、熱硬化性樹脂１７０は、樹脂積層体１５２での部品本体１７６の装着予定位置に塗布される。そして、熱硬化性樹脂１７０が電子部品１７２の部品本体１７６の下面と樹脂積層体１５２の上面との間に塗布された後に、電子部品１７２がゴムプレート１２４により押圧される。 Furthermore, in the above embodiment, the thermosetting resin 170 is applied before the electronic component 172 is mounted, but the thermosetting resin 170 may be applied after the electronic component 172 is mounted. At this time, the thermosetting resin 170 is applied between the lower surface of the component body 176 of the mounted electronic component 172 and the upper surface of the resin laminate 152. That is, the thermosetting resin 170 is applied to the resin laminate 152 at the position where the component body 176 is scheduled to be mounted. Then, after the thermosetting resin 170 is applied between the lower surface of the component body 176 of the electronic component 172 and the upper surface of the resin laminate 152, the electronic component 172 is pressed by the rubber plate 124.
　また、上記実施例では、導電性ペースト１６６が装着予定位置に塗布されるか、装着予定位置からズラして塗布されるかの基準となるサイズは作業者により設定されているが、デフォルト値として入力されていてもよい。 Furthermore, in the above embodiment, the size that serves as the standard for determining whether the conductive paste 166 is applied to the intended attachment position or displaced from the intended attachment position is set by the operator, but the default value is It may be entered.
　また、上記実施例では、導電性ペースト１６６が完全に硬化した状態で電子部品１７２が装着されて、その電子部品１７２がゴムプレート１２４により押圧される。一方で、導電性ペースト１６６が半硬化した状態で電子部品１７２が装着されて、その電子部品１７２がゴムプレート１２４により押圧されてもよい。また、導電性ペースト１６６が半硬化も完全硬化もしていない状態で電子部品１７２が装着されて、その電子部品１７２がゴムプレート１２４により押圧されてもよい。なお、導電性ペースト１６６が半硬化の状態及び半硬化も完全硬化もしていない状態で電子部品１７２が装着されて、その電子部品１７２がゴムプレート１２４により押圧される場合には、ヒータ６６による加熱で導電性ペーストが完全に硬化する。 Furthermore, in the above embodiment, the electronic component 172 is mounted with the conductive paste 166 completely cured, and the electronic component 172 is pressed by the rubber plate 124. On the other hand, the electronic component 172 may be mounted with the conductive paste 166 semi-hardened, and the electronic component 172 may be pressed by the rubber plate 124. Alternatively, the electronic component 172 may be mounted with the conductive paste 166 neither semi-cured nor completely cured, and the electronic component 172 may be pressed by the rubber plate 124. Note that when the electronic component 172 is mounted with the conductive paste 166 in a semi-cured state, neither semi-cured nor completely cured, and the electronic component 172 is pressed by the rubber plate 124, heating by the heater 66 is performed. The conductive paste is completely cured.
　また、上記実施例では、配線１６２と電子部品１７２の電極１７８とを電気的に接続する導電性流体として導電性ペースト１６６が採用されているが、導電性を発揮するものであれば、種々の流体を採用することが可能である。 Further, in the above embodiment, the conductive paste 166 is used as the conductive fluid that electrically connects the wiring 162 and the electrode 178 of the electronic component 172, but various pastes may be used as long as they exhibit conductivity. It is possible to employ fluids.
　また、上記実施形態では、電子部品１７２を樹脂積層体１５２に固定するための硬化性樹脂として、熱硬化性樹脂が採用されているが、紫外線硬化樹脂，２液混合型硬化性樹脂，熱可塑性樹脂などを形成することが可能である。また、上記実施例では、樹脂積層体１５２を形成する樹脂として紫外線硬化樹脂が採用され、電子部品１７２を固定する樹脂として熱硬化性樹脂が採用されている。つまり、樹脂積層体１５２を形成する樹脂と、電子部品１７２を固定する樹脂とが異なる硬化性樹脂とされているが、樹脂積層体１５２を形成する樹脂と、電子部品１７２を固定する樹脂とが同じ硬化性樹脂とされてもよい。 Further, in the above embodiment, a thermosetting resin is used as the curable resin for fixing the electronic component 172 to the resin laminate 152, but ultraviolet curable resin, two-component mixed curable resin, thermoplastic resin, etc. It is possible to form resin or the like. Further, in the above embodiment, an ultraviolet curing resin is used as the resin for forming the resin laminate 152, and a thermosetting resin is used as the resin for fixing the electronic component 172. In other words, although the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different curable resins, the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different. The same curable resin may be used.
　また、上記実施例では、導電性ペーストは、ディスペンサ１０６により吐出されているが、転写装置等により転写されてもよい。また、スクリーン印刷により、導電性ペーストが印刷されてもよい。 Furthermore, in the above embodiment, the conductive paste is discharged by the dispenser 106, but it may be transferred by a transfer device or the like. Further, the conductive paste may be printed by screen printing.
　１０：回路形成装置（電気回路形成装置）　　１０６：ディスペンサ（第１塗布装置）　　１１６：ディスペンサ（第２塗布装置）　　１３２：装着部（装着装置）　　１６６：導電性ペースト（導電性流体）　　１７０：熱硬化性樹脂（硬化性樹脂）　　１７２：電子部品　　１７６：部品本体　　１７８：電極　　２２０：塗布部（塗布工程）　　２２２：装着部（装着工程） 10: Circuit forming device (electrical circuit forming device) 106: Dispenser (first coating device) 116: Dispenser (second coating device) 132: Mounting part (mounting device) 166: Conductive paste (conductive fluid) 170: Heat Curable resin (curable resin) 172: Electronic component 176: Component body 178: Electrode 220: Coating section (coating process) 222: Mounting section (fitting process)

Claims (7)

  1. 　電子部品の電極の装着予定位置から、前記電子部品から離れる方向にズレた位置に導電性ペーストを塗布する第１塗布装置と、
    　前記第１塗布装置により塗布された導電性ペーストに前記電極が接触するように前記電子部品を装着する装着装置と、
    　を備える回路形成装置。     a first coating device that applies a conductive paste to a position shifted away from the electronic component from a planned mounting position of the electrode of the electronic component;
    a mounting device for mounting the electronic component so that the electrode contacts the conductive paste applied by the first coating device;
    A circuit forming device comprising:
  2. 　前記第１塗布装置は、
    　装着予定の電子部品のサイズが所定サイズ未満である場合に、前記電子部品の電極の装着予定位置から、前記電子部品から離れる方向にズレた位置に導電性ペーストを塗布し、装着予定の電子部品のサイズが所定サイズ以上である場合に、前記電子部品の電極の装着予定位置に導電性ペーストを塗布する請求項１に記載の回路形成装置。     The first coating device includes:
    When the size of the electronic component to be mounted is less than a predetermined size, a conductive paste is applied to a position shifted away from the electronic component from the planned mounting position of the electrode of the electronic component, and the electronic component to be mounted is 2. The circuit forming apparatus according to claim 1, wherein a conductive paste is applied to a position where an electrode of the electronic component is scheduled to be attached when the size of the electronic component is a predetermined size or more.
  3. 　前記第１塗布装置は、
    　装着予定の電子部品のサイズが所定サイズ未満である場合に、前記導電性ペーストの中央が前記電子部品の電極の装着予定位置の中央から、前記電子部品から離れる方向にズレるように導電性ペーストを塗布し、装着予定の電子部品のサイズが所定サイズ以上である場合に、前記導電性ペーストの中央が前記電子部品の電極の装着予定位置の中央に重なるように導電性ペーストを塗布する請求項２に記載の回路形成装置。     The first coating device includes:
    When the size of the electronic component to be mounted is less than a predetermined size, the conductive paste is applied so that the center of the conductive paste is shifted away from the center of the planned mounting position of the electrode of the electronic component in a direction away from the electronic component. 2. The conductive paste is applied so that the center of the conductive paste overlaps the center of the planned mounting position of the electrode of the electronic component when the size of the electronic component to be applied and mounted is equal to or larger than a predetermined size. The circuit forming device described in .
  4. 　電子部品の部品本体の装着予定位置に硬化性樹脂を塗布する第２塗布装置を備える請求項１ないし請求項３のいずれか１つに記載の回路形成装置。 The circuit forming apparatus according to any one of claims 1 to 3, further comprising a second coating device that applies a curable resin to a scheduled mounting position of a component body of an electronic component.
  5. 　前記第１塗布装置は、
    　前記電子部品の装着面の面積に対する硬化性樹脂の前記電子部品への接着面積の百分率が４０％以上となるように、電子部品の電極の装着予定位置から、前記電子部品から離れる方向にズレた位置に導電性ペーストを塗布する請求項４に記載の回路形成装置。     The first coating device includes:
    The electrodes of the electronic component are shifted away from the intended mounting position of the electronic component so that the percentage of the adhesive area of the curable resin to the electronic component with respect to the area of the mounting surface of the electronic component is 40% or more. 5. The circuit forming apparatus according to claim 4, wherein a conductive paste is applied to the position.
  6. 　前記第１塗布装置は、
    　前記電子部品の装着面での電極の面積に対する導電性ペーストの電極への接着面積の百分率が５０％以上となるように、前記電子部品の電極の装着予定位置から、前記電子部品から離れる方向にズレた位置に導電性ペーストを塗布する請求項１ないし請求項３のいずれか１つに記載の回路形成装置。     The first coating device includes:
    from the planned mounting position of the electrode of the electronic component in a direction away from the electronic component so that the percentage of the adhesive area of the conductive paste to the electrode with respect to the area of the electrode on the mounting surface of the electronic component is 50% or more. The circuit forming apparatus according to any one of claims 1 to 3, wherein the conductive paste is applied to the shifted position.
  7. 　電子部品の電極の装着予定位置から、前記電子部品から離れる方向にズレた位置に導電性ペーストを塗布する塗布工程と、
    　前記塗布工程において塗布された導電性ペーストに前記電極が接触するように前記電子部品を装着する装着工程と、
    　を含む回路形成方法。     a coating step of applying a conductive paste to a position shifted away from the electronic component from the planned mounting position of the electrode of the electronic component;
    a mounting step of mounting the electronic component so that the electrode contacts the conductive paste applied in the coating step;
    A circuit formation method including.
PCT/JP2022/035405 2022-09-22 2022-09-22 Circuit forming device and circuit forming method WO2024062605A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005108966A (en) * 2003-09-29 2005-04-21 Tdk Corp Mounting method of electronic component
WO2022113186A1 (en) * 2020-11-25 2022-06-02 株式会社Fuji Electric circuit forming method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005108966A (en) * 2003-09-29 2005-04-21 Tdk Corp Mounting method of electronic component
WO2022113186A1 (en) * 2020-11-25 2022-06-02 株式会社Fuji Electric circuit forming method

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