WO2021147865A1 - 一种雷达装置和移动平台 - Google Patents

一种雷达装置和移动平台 Download PDF

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Publication number
WO2021147865A1
WO2021147865A1 PCT/CN2021/072733 CN2021072733W WO2021147865A1 WO 2021147865 A1 WO2021147865 A1 WO 2021147865A1 CN 2021072733 W CN2021072733 W CN 2021072733W WO 2021147865 A1 WO2021147865 A1 WO 2021147865A1
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WO
WIPO (PCT)
Prior art keywords
radar device
metal heat
heat dissipation
board
antenna
Prior art date
Application number
PCT/CN2021/072733
Other languages
English (en)
French (fr)
Inventor
周琴
金晨逸
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CA3165368A priority Critical patent/CA3165368A1/en
Priority to EP21744314.2A priority patent/EP4084221A4/en
Publication of WO2021147865A1 publication Critical patent/WO2021147865A1/zh
Priority to US17/868,197 priority patent/US20220349988A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/027—Constructional details of housings, e.g. form, type, material or ruggedness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
    • H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • This application relates to the field of radar technology, in particular to a radar device and a mobile platform.
  • the antenna mainly relies on the antenna to emit millimeter waves (such as electromagnetic waves with a frequency of 30 to 300 GHz and a wavelength of 1 to 10 mm) to the outside world.
  • the radar device needs to be equipped with a connector to realize the electrical connection between the radar device and other devices (such as a vehicle-mounted computer).
  • the electrical connection structure in the connector will affect the working performance of the antenna.
  • the connector will invade the layout space of the antenna, therefore, the size of the antenna will be reduced, which is not conducive to improving the working performance of the antenna.
  • This application provides a radar device and a mobile platform that can effectively ensure the working performance of the antenna and the layout area.
  • the present application provides a radar device, including a housing, a connector, and an antenna board located in the housing; the antenna board can transmit electromagnetic waves to the outside or receive electromagnetic waves from the outside through the housing, and the housing can provide the antenna board Have a certain airtight space to prevent external dust, water vapor and other impurities from affecting the antenna board.
  • the antenna board has a first board surface and a second board surface arranged opposite to each other, and the first board surface is used for transmitting and receiving signals.
  • the connector has an electrical connection structure, and the electrical connection structure is used to establish electrical connections between other devices outside the housing and the antenna board. After the antenna board assembly is installed in the housing, the electrical connection structure of the connector is located on one side of the second board surface.
  • the electrical connection structure is arranged on the side of the second board to prevent the electrical connection structure from obstructing the signal transmission and reception of the antenna board. .
  • the electrical connection structure of the connector may be a structural member capable of realizing reliable electrical connection, such as a metal contact, an elastic sheet, or a PIN pin.
  • the second surface of the antenna board can be provided with conductive structures such as pads and vias.
  • conductive structures such as pads and vias.
  • the type of conductive structure can be adjusted adaptively according to actual requirements, and is not limited here.
  • the structure of the housing can be diverse.
  • the insulating part and the metal heat dissipating part in the radome, the bottom case can be independent structural parts, and the connection between the radome and the insulating part, between the radome and the metal heat dissipating part, and between the insulating part and the metal heat dissipating part can be used. Parts (such as screws) or welding and other processes are assembled into the whole shell.
  • the radome and the insulating part in the bottom case may be integrally formed injection molded parts, and the metal heat dissipating part may be fixedly connected to the insulating part or the radome by using a connector to assemble the entire housing.
  • the metal heat dissipating part and the insulating part can also be made into an integral structure by using a process such as over-injection.
  • the radome, the insulating portion, and the metal heat dissipation portion may be independent components.
  • the insulating part may be a frame structure.
  • the insulating part may include a bottom plate and a side plate located at the edge of the bottom plate.
  • a through hole structure may be provided in the bottom plate, the metal heat dissipation part may be fixedly connected to the bottom plate, and the metal heat dissipation part may The through hole structure is blocked to improve the airtightness of the connection between the insulating part and the metal heat dissipating part.
  • connection manner between the insulating portion and the metal heat dissipation portion can be various.
  • a first connecting part may be provided in the insulating part
  • a second connecting part may be provided in the metal heat dissipating part. After the first connecting part and the second connecting part are hermetically connected, a hermetic connection between the insulating part and the metal heat dissipating part can be realized.
  • the first connecting portion may be a flange or a groove structure arranged on the edge of the through hole structure
  • the second connecting portion may be a groove structure or a flange arranged on the edge of the metal heat dissipating portion, so that the protrusion in the insulating portion After the rim or groove structure is closely matched with the groove structure or flange in the metal heat dissipation portion, a hermetic butt connection between the insulating portion and the metal heat dissipation portion can be realized.
  • the first connection part in the insulating part can be heated to a molten state by a process such as laser welding, so that the first connection part and the second connection part Adhesion can improve the connection stability and airtightness between the insulating part and the metal heat dissipating part.
  • the insulating part and the metal heat dissipating part can also be fixedly connected and airtightly connected in the form of threaded connection, clamping connection, bonding, and the like.
  • a snap connection is adopted between the radome and the insulating part.
  • protrusions can be provided in the radome, and buckles can be provided in the insulating part.
  • the protrusions in the radome and the buckles in the insulating part buckle each other, thereby realizing the radome Fixed connection with the insulating part.
  • the number and arrangement positions of the protrusions can be various.
  • the number and arrangement positions of the buckles can be adjusted adaptively according to the number and positions of the protrusions.
  • the radome and the insulating portion may also be fixedly connected by bonding, threaded connection, welding, etc., which is not specifically limited in this application.
  • the upper edge of the insulating part may be provided with a groove
  • the lower edge of the radome may be provided with a flange.
  • a sealing ring may also be provided between the radome and the insulating part.
  • the sealing ring may be arranged in the groove. After the radome and the insulating part are buckled and fixed to each other, the flange of the radome is embedded in the groove of the insulating part and tightly abuts against the sealing ring. At the same time, The flange squeezes the sealing ring to make the sealing ring tightly abut against the inner wall of the groove, thereby improving the airtightness of the connection between the insulating part and the radome.
  • sealant or the like may be filled in the butt joint between the radome and the insulating part (for example, between the flange and the groove) to ensure the airtightness of the connection between the radome and the insulating part.
  • the flange may also be provided in the insulating part, and the groove may be provided in the radome.
  • the position and proportion of the metal heat dissipation portion in the bottom case can be various.
  • the metal heat dissipating part can be arranged directly opposite to the rear end of the antenna assembly, so that the heat generated by the antenna assembly can be effectively radiated or transferred to the metal heat dissipating part, so as to effectively improve the heat dissipation effect of the metal heat dissipating part on the antenna assembly.
  • the contour area of the antenna assembly may not be greater than the contour area of the metal heat dissipation portion, so that the heat generated by the antenna assembly can be effectively radiated or transferred to the metal heat dissipation portion, thereby improving the heat dissipation of the antenna assembly by the metal heat dissipation portion Effect.
  • the rear end of the antenna assembly can also be provided with a heating element (such as a controller, etc.), and a receiving groove for accommodating the heating element can also be provided on the inner side of the metal heat sink, which is conducive to improving the small size of the radar device.
  • a heating element such as a controller, etc.
  • a receiving groove for accommodating the heating element can also be provided on the inner side of the metal heat sink, which is conducive to improving the small size of the radar device.
  • it can effectively reduce the distance between the metal heat dissipating part and the heating element, and the distance between the metal heat dissipating part and the circuit board, so as to reduce the heat conduction distance between the circuit board and electronic components and the metal heat dissipating part, thereby It can improve the heat dissipation performance of the radar device.
  • an embodiment of the present application also provides a mobile platform, including an information processing system and any one of the foregoing radar devices.
  • the information processing system is used to determine the characteristic information of the detected object based on the electromagnetic waves generated by the radar device and the electromagnetic waves received.
  • the characteristic information includes but is not limited to target distance, orientation, height, speed, attitude, and even shape.
  • the information processing system can accurately measure the propagation time of the radar device from transmitting the electromagnetic wave to receiving the electromagnetic wave reflected by the target object. Since the speed of light is known, the propagation time can be converted into a measurement of the distance, thereby determining the radar device The distance to the target object.
  • the specific types of the above-mentioned mobile platforms are not limited.
  • they can be mobile platforms such as automobiles, ships, airplanes, trains, spacecraft, and drones, all of which are applicable to the technical solutions of this application.
  • FIG. 1 is an application scenario diagram of a millimeter wave radar device provided by an embodiment of the application
  • FIG. 2 is a schematic cross-sectional structure diagram of a millimeter wave radar device provided by an embodiment of the application;
  • FIG. 3 is an exploded view of another millimeter wave radar device provided by an embodiment of the application.
  • FIG. 4 is a schematic structural diagram of an antenna board provided by an embodiment of the application.
  • FIG. 5 is an exploded view of a partial structure of another millimeter wave radar device provided by an embodiment of the application.
  • Figure 6 is a top view of a bottom case provided by an embodiment of the application.
  • FIG. 7 is a cross-sectional view of a bottom shell provided by an embodiment of the application.
  • FIG. 8 is a partial interface diagram of a bottom case provided by an embodiment of the application.
  • Fig. 9 is a structural block diagram of a mobile platform provided by an embodiment of the application.
  • a radar device 20 may be installed in the vehicle 10 20 According to the wavelength of the emitted electromagnetic waves, it can be divided into millimeter wave radar devices, microwave radar devices, and so on. Take the millimeter wave radar device as an example.
  • the millimeter wave radar device 20 can emit electromagnetic waves (such as electromagnetic waves with a frequency of 30 to 300 GHz and a wavelength of 1 mm to 10 mm) to the road or the environment.
  • the millimeter-wave radar device 20 When the electromagnetic wave detects the target object 01 (such as road , Pedestrians, vehicles, etc.) will be reflected, and the millimeter-wave radar device 20 receives the reflected electromagnetic waves, so that the purpose of detecting road conditions or the environment can be achieved. For example, after the electromagnetic wave emitted by the millimeter-wave radar device 20 in the vehicle 10 detects the human body, the electromagnetic wave will be reflected by the human body. The millimeter-wave radar device 20 receives the reflected electromagnetic wave, and the distance between the human body and the vehicle 10 can be measured according to the transmission and reception time of the electromagnetic wave. the distance.
  • the target object 01 such as road , Pedestrians, vehicles, etc.
  • the millimeter wave radar device 20 may include a housing 21, an antenna board 22 for generating and receiving electromagnetic waves, a drive circuit or a controller connected to the antenna board 22 and other electronic devices (not shown in the figure)
  • the housing 21 of the millimeter-wave radar device 20 may have strong airtightness.
  • the shell 21 in the traditional millimeter wave radar device is usually made of insulating materials instead of all metal materials to avoid shielding and blocking electromagnetic waves. Phenomenon.
  • the power of the millimeter-wave radar device 20 continues to increase, its heat generation is also increasing.
  • the radar device needs to be equipped with a connector to realize the electrical connection between the radar device and other devices (such as a vehicle-mounted computer). Since the connector contains an electrical connection structure, if the electrical connection structure is located on the upper side of the antenna board 22, it will obstruct electromagnetic waves and affect the signal transmission and reception performance of the antenna board 22. Therefore, the location of the connector also needs to be set reasonably.
  • the embodiment of the present application provides a millimeter wave radar device 20 that can effectively dissipate heat and can effectively ensure the working performance of the antenna board 22.
  • references described in this specification to "one embodiment” or “some embodiments”, etc. mean that one or more embodiments of the present application include a specific feature, structure, or characteristic described in combination with the embodiment. Therefore, the sentences “in one embodiment”, “in some embodiments”, “in some other embodiments”, “in some other embodiments”, etc. appearing in different places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless it is specifically emphasized otherwise.
  • the terms “including”, “including”, “having” and their variations all mean “including but not limited to”, unless otherwise specifically emphasized.
  • the millimeter wave radar device 20 may include a housing 21 and an antenna board 22 installed in the housing 21.
  • the antenna board 22 may be a radio frequency board, and the radio frequency board may include a circuit board 221 and an antenna element 222 arranged on the surface of the circuit board 221.
  • the circuit board 221 can be a printed circuit board (Printed Circuit Board, PCB), or a flexible printed circuit board (Flexible Printed Circuit, FPC), etc.
  • the antenna element 222 can be set up by surface mounting, laser welding, etc.
  • the antenna board 22 may include one antenna element 222 or multiple antenna elements 222.
  • the multiple antenna elements 222 may be arranged on the circuit board 221 in the form of a rectangular array, a circular array, etc., or other arrangements may also be used. It is set on the circuit board 221, which is not specifically limited in this application.
  • the front end of the antenna board 22 mentioned below may be the transmitting end or the receiving end of the antenna board 22.
  • the antenna element 222 may be provided on the upper surface of the circuit board 221, the first surface (upper side) of the circuit board 221 may be the front end of the antenna board 22, the second surface (lower side) of the circuit board 221 and the left and right sides The two sides may be the rear end of the antenna board 22.
  • the housing 21 may include a bottom shell 212 and a radome 211.
  • the radome 211 and the bottom shell 212 enclose a receiving space for installing the antenna board 22, thereby forming a good protective effect on the antenna board 22 and preventing Foreign dust, water vapor and other impurities enter the containing cavity.
  • the bottom case 212 may include an insulating portion 2121 and a metal heat dissipation portion 2122.
  • the bottom case 212 The insulating portion 2121 may be located at the front end of the antenna board 22 or at the rear end of the antenna board 22, and the metal heat dissipation portion 2122 may be located at the rear end of the antenna board 22.
  • the insulating part 2121 of the bottom case 212 is located at the front end of the antenna board 22, the electromagnetic waves generated by the antenna can be transmitted to the external environment through the radome 211 or the insulating part 2121, and at the same time, electromagnetic waves in the external environment can pass through the radome 211 Or the insulating part 2121 is received by the antenna.
  • the metal heat dissipation portion 2122 By arranging the metal heat dissipation portion 2122 at the rear end of the antenna board 22, it is possible to prevent the metal heat dissipation portion 2122 from blocking or shielding the electromagnetic waves generated by the antenna board 22. At the same time, since the metal heat dissipation portion 2122 (such as copper or iron can be used) , Aluminum and other metal materials) have better thermal conductivity than the plastic radome 211 and insulating portion 2121, so that the heat dissipation of the millimeter wave radar device 20 can be improved.
  • the structure of the housing 21 can be various.
  • the radome 211, the insulating portion 2121, and the metal heat dissipation portion 2122 may be independent components.
  • the radome 211, the insulating portion 2121, and the metal heat dissipation portion 2122 may be separately molded, and then the molded radome 211, the insulating portion 2121, and the metal heat dissipation portion 2122 are assembled into the housing 21.
  • the insulating portion 2121 can be a frame structure, the bottom of the insulating portion 2121 can be provided with a through hole (not shown in the figure), and the metal heat dissipation portion 2122 can be fixedly connected to the bottom of the insulating portion 2121 and block the communication. Holes to ensure the airtightness of the connection between the insulating portion 2121 and the metal heat dissipating portion 2122.
  • the radome 211 is fixedly connected to the insulating portion 2121, and the lower edge of the radome 211 and the upper edge of the insulating portion 2121 are hermetically combined to ensure the airtightness of the connection between the insulating portion 2121 and the radome 211.
  • the connection form between the radome 211 and the insulating portion 2121 may be various.
  • the radome 211 and the insulating portion 2121 are connected by a clamping structure.
  • the radome 211 can be provided with protrusions 2111
  • the insulating portion 2121 can be provided with buckles 2123.
  • the protrusions 2111 in the radome 211 and the insulating portion 2121 are connected to each other.
  • the buckles 2123 are buckled with each other, so as to achieve a fixed connection between the antenna cover 211 and the insulating portion 2121.
  • the number and arrangement positions of the protrusions 2111 can be various.
  • the number and arrangement positions of the buckles 2123 can be adjusted adaptively according to the number and positions of the protrusions 2111.
  • the radome 211 and the insulating portion 2121 may also be fixedly connected by bonding, threaded connection, welding, etc., which is not specifically limited in this application.
  • the upper edge of the insulating portion 2121 is provided with a groove 2127, and the lower portion of the radome 211 A flange 2112 is provided on the edge.
  • the flange 2112 of the radome 211 is embedded in the groove 2127 of the insulating part 2121, and the flange 2112 can tightly abut the inner wall of the groove 2127 to ensure the antenna
  • the connection between the cover 211 and the insulating portion 2121 is airtight.
  • a sealing ring may be further provided between the radome 211 and the insulating portion 2121.
  • the sealing ring can be arranged in the groove 2127.
  • sealant or the like may be filled at the butt of the radome 211 and the insulating portion 2121 (for example, between the flange 2112 and the groove 2127) to ensure the connection between the radome 211 and the insulating portion 2121 Hermeticity.
  • a flange 2112 may be provided on the upper edge of the insulating portion 2121, and a groove 2127 may be provided on the lower edge of the radome 211.
  • the antenna cover 211 and the insulating portion 2121 may also be an integral structure.
  • the radome 211 and the insulating portion 2121 may be integrally formed by injection molding or other processes.
  • the radome 211 and the insulating part 2121 can be injection molded from resin, acrylonitrile, polyethylene, polypropylene, polycarbonate and other materials.
  • the radome 211 and the insulating part 2121 can be made of the same insulating material. Choose different insulating materials.
  • connection form between the insulating portion 2121 and the metal heat dissipation portion 2122 may also be various.
  • the insulating portion 2121 may include a first connecting portion 2124
  • the metal heat dissipation portion 2122 may include a second connecting portion 2125
  • the insulating portion 2121 and the metal heat dissipation portion 2122 may The airtight connection is realized by the first connecting portion 2124 and the second connecting portion 2125.
  • the first connecting portion 2124 may be a flange structure
  • the second connecting portion 2125 may be a groove structure fitted with the flange structure.
  • the flange structure can be arranged on the edge of the bottom through hole (not shown in the figure) of the insulating portion 2121 and arranged upward; the groove structure can be arranged on the edge of the metal heat dissipation portion 2122 and arranged downward.
  • the metal heat dissipation part 2122 can be placed in the insulating part 2121, so that the flange structure is embedded in the groove structure, and then the flange structure or the concave structure can be welded by laser welding.
  • the groove structure is heated to gradually melt the flange structure, and after cooling, a hermetic connection between the insulating portion 2121 and the metal heat dissipation portion 2122 (the flange structure and the groove structure) can be realized.
  • the flange structure may also be provided on the metal heat dissipation portion 2122, and the groove structure may be provided on the insulating portion 2121.
  • the gap between the flange structure and the groove structure can also be filled with hot melt glue, a sealing ring, etc., to ensure the airtightness of the connection between the insulating portion 2121 and the metal heat dissipation portion 2122.
  • connection structures may also be adopted between the insulating portion 2121 and the metal heat dissipation portion 2122 to achieve a hermetic connection.
  • the insulating portion 2121 and the metal heat dissipating portion 2122 may adopt the connection structure between the radome 211 and the insulating portion 2121 in the above-mentioned embodiment, or may adopt a threaded connection (such as a screw) for connection.
  • a protrusion can be provided in the insulating portion 2121 and a buckle can be provided in the metal heat dissipation portion 2122.
  • the protrusion in the insulating portion 2121 and the buckle in the metal heat dissipation portion 2122 are fastened to each other, so as to achieve a fixed connection between the insulating portion 2121 and the metal heat dissipation portion 2122.
  • the radome 211 and the insulating portion 2121 may also be connected by the above-mentioned connection structure between the insulating portion 2121 and the metal heat dissipation portion 2122 to achieve a hermetic connection, or other connection methods may be used to achieve a hermetic connection.
  • a groove and a flange structure can be provided at the contact part of the insulating part 2121 and the metal heat dissipating part 2122.
  • the groove (or flange) of the insulating part 2121 It is fitted with the flange (or groove) of the metal heat dissipating portion 2122, thereby achieving a hermetic connection between the insulating part 2121 and the metal heat dissipating portion 2122.
  • the metal heat dissipation portion 2122 and the insulating portion 2121 may also be an integral structure.
  • the radome 211 and the insulating portion 2121 may be integrally formed by injection molding or other processes.
  • the metal heat dissipating part 2122 can be formed by injection molding, stamping, etc., and then the formed metal heat dissipating part 2122 is placed in an injection mold, and insulating material is injected into the mold to shape the insulating part 2121 while achieving insulation. The combination between the part 2121 and the metal heat dissipating part 2122.
  • the specific shape and location of the metal heat dissipation portion 2122 can be adjusted according to actual heat dissipation requirements.
  • the circuit board 221 in the antenna board 22 has a rectangular structure.
  • the housing 21 in order to minimize the volume of the housing 21, the housing 21 may have a rectangular cubic structure.
  • the metal heat dissipation portion 2122 in order to enable the metal heat dissipation portion 2122 to have a good heat dissipation effect on the antenna board 22, the metal heat dissipation portion 2122 may also be provided in a rectangular plate structure.
  • the metal heat dissipation portion 2122 can be arranged directly below the circuit board 221, so that the heat generated by the antenna board 22 can be effectively radiated or transferred to the metal heat dissipation portion 2122, so as to effectively improve the metal heat dissipation portion 2122.
  • the contour area of the antenna board 22 may not be greater than the contour area of the metal heat dissipation portion 2122, so that the heat generated by the antenna board 22 can be effectively radiated or transferred to the metal heat dissipation portion 2122, thereby enhancing the metal heat dissipation portion 2122 The effect of heat dissipation on the antenna board 22.
  • the distance between the antenna board 22 and the metal heat dissipation portion 2122 may be minimized, or the distance between the antenna board 22 and the metal heat dissipation portion 2122 may be reduced as much as possible.
  • a heat-conducting element is arranged between the plate 22 and the metal heat dissipation portion 2122.
  • materials such as thermally conductive silica gel can be arranged between the lower side of the circuit board 221 and the upper side of the metal heat dissipation portion 2122, so that the heat generated by the antenna board 22 can be efficiently transferred to the metal heat dissipation portion 2122, thereby enhancing the millimeter wave The heat dissipation performance of the radar device 20.
  • the metal heat dissipation portion 2122 may be provided with structures such as heat dissipation fins to increase the heat exchange area between the metal heat dissipation portion 2122 and the outside, thereby effectively improving the metal The heat dissipation performance of the heat dissipation portion 2122.
  • a sheet, prismatic, columnar, or other structure may be provided on the outside of the metal heat dissipation portion 2122 to form heat dissipation fins, so as to increase the heat exchange area between the metal heat dissipation portion 2122 and the outside.
  • some electronic components or heating components may be provided on the lower surface of the circuit board 221.
  • a accommodating groove 2126 may be provided in the metal heat dissipation portion 2122, which is located on some of the lower surface of the circuit board 221
  • Electronic components can be accommodated in the accommodating slot 2126, which is beneficial to improve the miniaturization of the millimeter wave radar device 20; in addition, it can effectively reduce the distance between the metal heat dissipation portion 2122 and the electronic components, as well as the metal heat dissipation portion 2122 and the circuit.
  • the distance between the plates 221 is to reduce the thermal conduction distance between the circuit board 221 and the electronic components and the metal heat dissipation portion 2122, so as to improve the heat dissipation performance of the millimeter wave radar device 20.
  • the shape, contour, size, and number of the accommodating groove 2126 can be adjusted accordingly according to actual needs, which is not specifically limited in this application.
  • the millimeter wave radar device 20 may also include a multilayer board structure.
  • a separate circuit board can be provided on the lower side of the antenna board 22 for the installation of electronic components, and at the same time, it can also prevent the circuit board from blocking or interfering with the electromagnetic waves of the antenna board 22.
  • the circuit board may include components such as a driving circuit and a controller. The circuit board may be electrically connected to the antenna board 22 to drive the antenna element 222 to emit electromagnetic waves, or to process and calculate the electromagnetic waves received by the antenna element 222, etc. operate.
  • the metal heat dissipation portion 2122 may not be limited to be provided at the lower portion of the bottom case 212, but may also be provided on the side portion of the bottom case 212 (or the insulating portion 2121).
  • part of the side plate of the bottom case 212 may be made of a metal material.
  • a connector 2128 may be further provided in the housing 21.
  • the connector 2128 is provided on the side of the bottom shell 212.
  • the connector 2128 may include a plastic shell and an electrical connection structure (such as metal contacts, elastic pieces, PIN pins, etc.) provided in the plastic shell.
  • the connector 2128 may be arranged at the rear end of the antenna board 22.
  • arranging the connector 2128 at the rear end of the antenna board 22 can also avoid opening a gap to the antenna board 22 to avoid the connector 2128, thereby effectively increasing the layout area of the antenna board 22 (such as the circuit board 221) to achieve a complete layout.
  • the purpose of miniaturization of the plane size of the machine Specifically, referring to FIG.
  • the front and rear ends of the antenna board 22 can be distinguished by the dotted line in the figure; that is, the part above the dotted line may be the front end of the antenna board 22, and the part below the dotted line (including the following The side and the left and right sides) may be the rear end of the antenna board 22.
  • the connector 2128 may be provided at the rear end of the antenna board 22, specifically, the connector 2128 may be provided on the left side or the lower side of the bottom case 212.
  • the connector 2128 and the bottom shell 212 can be made into an integral structure by an injection molding process.
  • the connector 2128 and the insulating portion 2121 in the bottom shell 212 can be integrally injection-molded.
  • the finished connector 2128 may be placed in an injection mold, and then the insulating material may be injected into the mold, so as to realize the molding of the insulating portion 2121 and the connection between the insulating portion 2121 and the connector 2128.
  • the airtightness of the connection between the connector 2128 and the bottom shell 212 can be effectively increased, and at the same time, mass production is facilitated, which is beneficial to reduce the manufacturing cost.
  • the connector 2128 may be electrically connected to the antenna board 22 through a cable.
  • the connector 2128 and the antenna board 22 may also be directly connected.
  • the electrical connection structure 2129 of the connector 2128 is a spring sheet.
  • the lower surface of the antenna board 22 is provided with conductive structures such as pads or metal contacts (not shown in the figure).
  • the elastic sheet electrical connection structure 2129 will elastically contact the pads or metal contacts on the lower surface of the antenna board 22, thereby realizing the connection between the connector 2128 and the antenna board 22 Electrical connection.
  • the electrical connection structure 2129 of the connector 2128 is a PIN pin.
  • the lower surface of the antenna board 22 is provided with via holes (not shown in the figure). After the antenna board 22 is installed downwards in the housing 21, the PIN pin (electrical connection structure 2129) will be plugged into the via hole on the lower surface of the antenna board 22, thereby realizing the electrical connection between the connector 2128 and the antenna board 22. connect.
  • the type and shape of the electrical connection structure of the connector 2128 can be flexibly set according to different requirements.
  • the type and shape of the conductive structure in the antenna board 22 can also be flexibly set according to different requirements, which is not limited in this application.
  • the distribution of the insulating portion 2121 and the metal heat dissipation portion 2122 in the bottom shell 212 may be various.
  • part of the bottom and sides of the bottom case 212 may be the insulating part 2121, or the left side or part of the left side of the bottom case 212 may be the insulating part 2121, and the other part may be the metal heat dissipation part 2122.
  • the connector 2128 can be combined with the bottom shell 212 (insulating part 2121) through an injection molding process.
  • the connector 2128 can also be combined with the metal heat dissipating part 2122 through the insulating part 2121. Airtight connection to ensure the airtightness of the bottom shell 212.
  • an embodiment of the present application also provides a mobile platform 10, which includes an information processing system 30 and the millimeter wave radar device 20 in any of the foregoing embodiments.
  • the information processing system 30 is used to determine the characteristic information of the detected object according to the electromagnetic waves generated by the millimeter wave radar device 20 and the electromagnetic waves received.
  • the characteristic information includes but not limited to the target distance, azimuth, height, speed, attitude, and even shape.
  • the information processing system 30 can accurately measure the propagation time of the millimeter wave radar device 20 from emitting electromagnetic waves to receiving the electromagnetic waves reflected by the target object. Since the speed of light is known, the propagation time can be converted into a measurement of distance. Thus, the distance from the millimeter wave radar device 20 to the target object is determined.
  • the information processing system 30 may be a processor, a microprocessor (such as a digital signal processor, DSP), an AI chip (such as a Field Programmable Gate Array, FPGA), an application specific integrated circuit (such as an Application Specific Integrated Circuit, ASIC) Various forms of hardware devices.
  • a microprocessor such as a digital signal processor, DSP
  • an AI chip such as a Field Programmable Gate Array, FPGA
  • an application specific integrated circuit such as an Application Specific Integrated Circuit, ASIC
  • ASIC Application Specific Integrated Circuit
  • the autonomous vehicle includes the above-mentioned millimeter wave radar device 20, an information processing system 30, and an electronic control system 40.
  • the electronic control unit (ECU) may be an on-board computer.
  • the electronic control system 40 can control the automatic control system based on the characteristic information of the obstacle and the navigation information (such as a map).
  • the driving device of the driving car slows down, stops, or turns around; or, when the millimeter wave radar device 20 and the information processing system 30 determine obstacles, the electronic control system 40 can control the automatic driving based on the information of the obstacles.
  • the driving device of the car drives at a constant speed or accelerates.
  • the specific type of the above-mentioned mobile platform 10 is not limited.
  • it can be a mobile platform such as a car, a ship, an airplane, a train, a spacecraft, and an unmanned aerial vehicle, all of which are applicable to the technical solution of this application.

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  • Remote Sensing (AREA)
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  • Computer Networks & Wireless Communication (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Radar Systems Or Details Thereof (AREA)

Abstract

一种雷达装置（20）和移动平台(10)，涉及雷达技术领域，以解决雷达装置（20）工作性能不良的技术问题；雷达装置（20）包括壳体（21）、天线板（22）和连接器（2128）；天线板（22）设置在壳体（21）内，天线板（22）具有相背设置的第一板面和第二板面，且第一板面用于收发信号；连接器（2128）设置于壳体（21），用于与壳体（21）外部的其他器件连接；其中，连接器（2128）具有电连接结构（2129），电连接结构（2129）与天线板（22）电连接，且电连接结构（2129）位于第二板面的一侧。雷达装置（20）中，将连接器（2128）的电连接结构（2129）设置在第二板面的一侧，不会对天线板（22）的信号收发性能造成不良影响，且能够保证天线板（22）的布板面积。

Description

一种雷达装置和移动平台
相关申请的交叉引用
本申请要求在2020年01月20日提交中国国家知识产权局、申请号为202010067460.1、申请名称为“一种雷达装置和移动平台”的中国专利申请的优先权，以及要求在2020年11月11日提交中国国家知识产权局、申请号为202011256682.4、申请名称为“一种雷达装置和移动平台”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及雷达技术领域，尤其涉及一种雷达装置和移动平台。
背景技术
目前，具备自动驾驶功能的汽车逐渐成为汽车行业的主要发展方向，为了实现自动驾驶功能，雷达装置已成为汽车中不可或缺的关键部件；在实际应用中，车载毫米波雷达装置需要具备较高的工作性能以及防护等级，同时，也应具备一定的小型化、集成化设计。在毫米波雷达装置中，主要依靠天线向外界发射毫米波(如频率介于30至300GHz，波长介于1至10mm的电磁波)。在实际应用时，雷达装置中需要配备连接器，以实现雷达装置与其他器件(如车载电脑)之间的电连接。但是，在目前的雷达装置中，由于连接器的位置设置不合理，导致连接器中的电连接结构会影响天线的工作性能。或者，在有些雷达装置中，连接器会侵占天线的布设空间，因此，会降低天线的大小，不利于提升天线的工作性能。
发明内容
本申请提供了一种能有效保证天线工作性能和布板面积的雷达装置和移动平台。
一方面，本申请提供了一种雷达装置，包括壳体、连接器和位于壳体内的天线板；天线板可以透过壳体向外部发射电磁波或接收外界的电磁波，壳体可以为天线板提供具有一定密闭性的空间，以防止外界灰尘、水汽等杂质对天线板造成影响。天线板具有相背设置的第一板面和第二板面，且第一板面用于收发信号。连接器具有电连接结构，电连接结构用于建立壳体外部的其他器件与天线板之间的电连接。当天线板组件安装在壳体内后，连接器的电连接结构位于第二板面的一侧。由于在天线板中，用于第一板面的一侧用于收发信号，因此，将电连接结构设置在第二板面的一侧后，能够防止电连接结构对天线板的信号收发形成阻碍。另外，电连接结构与天线板之间也不会形成位置干涉，有利于提升天线板的布板面积。
在对连接器的电连接结构进行具体设置时。电连接结构可以是金属触点、弹片或PIN针等能够实现可靠电连接的结构件。
另外，在具体实施时，为了便于实现连接器与天线板之间的快速连接。天线板的第二板面可以设置焊盘、过孔等导电结构。在具体应用时，导电结构的类型可以根据实际需求进行适应性调整，在此不作限定。
在具体实施时，壳体的结构可以是多样的。
例如，天线罩、底壳中的绝缘部和金属散热部可以是独立的结构件，天线罩与绝缘部之间、天线罩与金属散热部之间、绝缘部和金属散热部之间可以采用连接件(如螺钉)或焊接等工艺组装成整个壳体。或者，天线罩和底壳中的绝缘部可以是一体成型的注塑件，金属散热部可以采用连接件与绝缘部或天线罩进行固定连接，以组装成整个壳体。或者，金属散热部和绝缘部之间也可以采用二次注塑等工艺制作成一体结构等。
具体来说，在本申请提供的一个实施方案中，天线罩、绝缘部和金属散热部可以为相互独立的部件。在具体实施时，绝缘部可以是框型结构，例如，绝缘部可以包括底板和位于底板边缘的侧板，底板中可以设置通孔结构，金属散热部可以与底板固定连接，且金属散热部可以封堵该通孔结构，以提升绝缘部和金属散热部之间的连接密闭性。
在具体实施时，绝缘部和金属散热部之间的连接方式可以是多样的。例如，绝缘部中可以设置第一连接部，金属散热部中可以设置第二连接部，第一连接部和第二连接部密闭连接后便可实现绝缘部和金属散热部之间的密闭连接。具体来说，第一连接部可以是设置在通孔结构边缘的凸缘或凹槽结构，第二连接部可以是设置在金属散热部边缘的凹槽结构或凸缘，使绝缘部中的凸缘或凹槽结构与金属散热部中的凹槽结构或凸缘进行紧密配合后，便可以实现绝缘部和金属散热部之间的密闭对接。在具体实施时，为了保证绝缘部和金属散热部之间的连接稳定性，可以采用激光焊接等工艺将绝缘部中的第一连接部加热至熔融状态，使第一连接部与第二连接部粘合，从而可以提升绝缘部和金属散热部之间的连接稳定性和密闭性。
在一些实施方式中，绝缘部和金属散热部之间也可以采用螺纹连接、卡接、粘接等形式实现固定连接和密闭对接。
例如，在本申请提供的一个实施例方案中，天线罩与绝缘部之间采用卡接连接。具体来说，天线罩中可以设置凸起，绝缘部中可以设置卡扣，天线罩与绝缘部进行连接时，天线罩中的凸起与绝缘部中的卡扣相互扣合，从而实现天线罩与绝缘部之间的固定连接。在具体实施时，凸起的数量和布置位置可以是多样的，另外，卡扣的数量和布置位置可以根据凸起的数量和位置作适应性调整。另外，在一些实施方式中，天线罩与绝缘部之间也可以采用粘接、螺纹连接、焊接等形式实现固定连接，本申请对此不作具体限定。
另外，为了保证天线罩与绝缘部之间的连接密闭性，在一些实施方案中，绝缘部的上边缘可以设有凹槽，天线罩的下边缘可以设有凸缘。当天线罩与绝缘部相互扣合固定时，天线罩的凸缘嵌入到绝缘部的凹槽中，且凸缘可以与凹槽的内壁紧密抵接，以保证天线罩与绝缘部之间的连接密闭性。
在一些实施中，为了提升天线罩与绝缘部之间的连接密闭性，天线罩与绝缘部之间还可以设置密封圈。具体来说，密封圈可以设置在凹槽内，当天线罩与绝缘部相互扣合固定后，天线罩的凸缘嵌入到绝缘部的凹槽中并与密封圈紧密抵接，与此同时，凸缘挤压密封圈，使密封圈与凹槽的内壁紧密抵接，从而提升绝缘部和天线罩之间的连接密闭性。在另一些实施方式中，还可以在天线罩与绝缘部的对接处(例如凸缘和凹槽之间)填充密封胶等，以保障天线罩和绝缘部之间的连接密闭性。在另一些实施方式中，凸缘也可以设置在绝缘部中，凹槽可以设置在天线罩中。
另外，在具体实施时，金属散热部在底壳中的位置以及占比可以是多样的。
例如，金属散热部可以正对天线组件的后端设置，从而使得天线组件所产生的热量能 够有效的辐射或传递至金属散热部处，以有效提升金属散热部对天线组件的散热效果。在一些实施方式中，天线组件的轮廓面积可以不大于金属散热部的轮廓面积，以使天线组件产生的热量能够有效的辐射或传递至金属散热部处，从而提升金属散热部对天线组件的散热效果。
另外，在一些实施方式中，天线组件的后端还可以设置发热元件(如控制器等)，金属散热部的内侧还可以设置用于容纳发热元件的容纳槽，从而有利于提升雷达装置的小型化设置；另外，还能够有效缩减金属散热部与发热元件之间的距离，以及金属散热部与电路板之间的距离，以降低电路板和电子元件与金属散热部之间的热传导距离，从而能够提升雷达装置的散热性能。
另一方面，本申请实施例还提供了一种移动平台，包括信息处理***和上述任意一种的雷达装置。信息处理***用于根据雷达装置产生的电磁波和接收到的电磁波，确定被探测物体的特征信息，特征信息包括但不限于目标距离、方位、高度、速度、姿态、甚至形状等信息。具体的，信息处理***可以通过准确测量雷达装置从发射电磁波到接收目标物体反射后的电磁波的传播时间，由于光速是已知的，传播时间即可被转换为对距离的测量，从而确定雷达装置到目标物体的距离。
在实际应用中，上述移动平台的具体类型不做限制，例如可以为汽车、船舶、飞机、火车、航天器、无人机等移动平台，均适用本申请技术方案。
附图说明
图1为本申请实施例提供的一种毫米波雷达装置的应用场景图；
图2为本申请实施例提供的一种毫米波雷达装置的剖面结构示意图；
图3为本申请实施例提供的另一种毫米波雷达装置的分解图；
图4为本申请实施例提供的一种天线板的结构示意图；
图5为本申请实施例提供的另一种毫米波雷达装置的部分结构的分解图；
图6为本申请实施例提供的一种底壳的俯视图；
图7为本申请实施例提供的一种底壳的截面图；
图8为本申请实施例提供的一种底壳的局部界面图；
图9为本申请实施例提供的一种移动平台的结构框图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的雷达装置，下面首先介绍一下其应用场景。
如图1所示，在车辆(如载客车辆、物流车辆，机器人等)领域中，为了使得车辆10能够对路况或所处的环境进行探测，可以在车辆10中安装雷达装置20，雷达装置20根据所发射电磁波波长的不同可以区分为毫米波雷达装置、微波雷达装置等。以毫米波雷达装置为例，毫米波雷达装置20能够向路面或环境中发射电磁波(如频率介于30至300GHz，波长介于1mm至10mm的电磁波)，当电磁波探测到目标物体01(如道路、行人、车辆等)后会被反射，毫米波雷达装置20接收反射后的电磁波，从而可以实现对路况或环境进行 探测等目的。例如，车辆10中的毫米波雷达装置20发射的电磁波探测到人体后，电磁波会被人体反射，毫米波雷达装置20接收被反射的电磁波，可以根据电磁波的收发时间测得人体与车辆10之间的距离。
如图2所示，毫米波雷达装置20中可以包括壳体21、用于产生和接收电磁波的天线板22、与天线板22连接的驱动电路或控制器等电子器件(图中未示出)，为了使得毫米波雷达装置20具备良好的防尘、防水性能，毫米波雷达装置20的壳体21可以具备较强的密闭性。为了防止壳体21对电磁波的发射和接收造成不良影响，传统的毫米波雷达装置中的壳体21通常采用绝缘材料制成，而不能采用全金属材质，以避免对电磁波产生屏蔽、阻挡等不良现象。但是随着毫米波雷达装置20功率的不断提升，其发热量也越来越大，为了保证毫米波雷达装置20的正常工作，其散热诉求也越来越高；但是由于塑料制成的壳体21的导热性和散热性较低，已不能满足毫米波雷达装置20的散热需求。
另外，在实际应用时，雷达装置中需要配备连接器，以实现雷达装置与其他器件(如车载电脑)之间的电连接。由于连接器中含有电连接结构，若该电连接结构位于天线板22的上侧，则会对电磁波形成阻碍，影响天线板22的信号收发性能。因此，连接器的设置位置也需要进行合理设置。
为此，本申请实施例提供了一种能够散热效果良好，能够有效保证天线板22工作性能的毫米波雷达装置20。
为了能够清楚了解本申请提供的毫米波雷达装置20，下面将结合附图和具体实施例进行具体说明。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。还应当理解，在本申请以下各实施例中，“至少一个”、“一个或多个”是指一个、两个或两个以上。术语“和/或”，用于描述关联对象的关联关系，表示可以存在三种关系；例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B的情况，其中A、B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
如图3所示，在本申请提供的一个实施例中，毫米波雷达装置20可以包括壳体21和安装在壳体21内的天线板22。具体来说，如图4所示，天线板22可以是射频板，射频板可以包括电路板221和设置在电路板221板面上的天线元件222。在具体实施时，电路板221可以是印制电路板(Printed Circuit Board，PCB)，也可以是柔性电路板(Flexible Printed Circuit，FPC)等，天线元件222可以采用表贴、激光焊接等工艺设置在电路板221上。另外，天线板22中可以包括一个天线元件222也可以包括多个天线元件222，多个天线元件222可以呈矩形阵列、环形阵列等形式设置在电路板221上，也可以采用其他的排布形 式设置在电路板221上，本申请对此不作具体限定。另外，下述中所提到的天线板22的前端可以是天线板22的发射端或接收端。例如，天线元件222可以设置在电路板221的上板面，电路板221的第一板面(上侧)可以是天线板22的前端，电路板221的第二板面(下侧)和左右两侧可以是天线板22的后端。
如图3所示，壳体21可以包括底壳212和天线罩211，天线罩211和底壳212围成用于安装天线板22的容纳空间，从而对天线板22形成良好的保护作用，防止外部灰尘、水汽等杂质进入容纳腔内。另外，为了提升毫米波雷达装置20的散热性能，请结合参阅图6，在本申请提供的一个实施例中底壳212可以包括绝缘部2121和金属散热部2122，在具体实施时，底壳212的绝缘部2121可以位于天线板22的前端也可以位于天线板22的后端，金属散热部2122可以位于天线板22的后端。当底壳212的绝缘部2121位于天线板22的前端时，天线所产生的电磁波可透过天线罩211或绝缘部2121传输至外界环境中，同时，外界环境中的电磁波可透过天线罩211或绝缘部2121后被天线所接收。通过将金属散热部2122设置在天线板22的后端，从而可以防止金属散热部2122对天线板22所产生的电磁波形成阻挡或屏蔽作用，同时，由于金属散热部2122(如可以采用铜、铁、铝等金属材料制成)相较于塑料材质的天线罩211和绝缘部2121具备较好的导热性，从而可以提升毫米波雷达装置20的散热性。
在具体实施时，壳体21的结构形式可以是多样的。
例如，如图3所示，在本申请提供的一个实施例中，天线罩211、绝缘部2121和金属散热部2122可以为相互独立的部件。具体来说，天线罩211、绝缘部2121和金属散热部2122可以分别进行成型，然后将成型后的天线罩211、绝缘部2121和金属散热部2122组装成壳体21。
在具体实施时，绝缘部2121可以是框型结构，绝缘部2121的底部可以设有通孔(图中未标示出)，金属散热部2122可以与绝缘部2121的底部固定连接，并封堵通孔，以保证绝缘部2121和金属散热部2122之间的连接密闭性。天线罩211与绝缘部2121固定连接，且天线罩211的下边缘与绝缘部2121的上边缘密闭结合，以保证绝缘部2121和天线罩211之间的连接密闭性。
在具体实施时，天线罩211与绝缘部2121之间的连接形式可以为多种。例如，如图3所示，在本申请提供的一个实施例中，天线罩211与绝缘部2121之间采用卡接结构进行连接。具体来说，天线罩211中可以设置凸起2111，绝缘部2121中可以设置卡扣2123，天线罩211与绝缘部2121进行连接时，天线罩211中的凸起2111与绝缘部2121中的卡扣2123相互扣合，从而实现天线罩211与绝缘部2121之间的固定连接。在具体实施时，凸起2111的数量和布置位置可以是多样的，另外，卡扣2123的数量和布置位置可以根据凸起2111的数量和位置作适应性调整。另外，在一些实施方式中，天线罩211与绝缘部2121之间也可以采用粘接、螺纹连接、焊接等形式实现固定连接，本申请对此不作具体限定。
另外，为了保证天线罩211与绝缘部2121之间的连接密闭性，如图3所示，在本申请提供的实施例中，绝缘部2121的上边缘设有凹槽2127，天线罩211的下边缘设有凸缘2112。当天线罩211与绝缘部2121相互扣合固定时，天线罩211的凸缘2112嵌入到绝缘部2121的凹槽2127中，且凸缘2112可以与凹槽2127的内壁紧密抵接，以保证天线罩211与绝缘部2121之间的连接密闭性。
在一些实施中，为了提升天线罩211与绝缘部2121之间的连接密闭性，天线罩211 与绝缘部2121之间还可以设置密封圈。具体来说，密封圈可以设置在凹槽2127内，当天线罩211与绝缘部2121相互扣合固定后，天线罩211的凸缘2112嵌入到绝缘部2121的凹槽2127中并与密封圈紧密抵接，与此同时，凸缘2112挤压密封圈，使密封圈与凹槽2127的内壁紧密抵接，从而提升绝缘部2121和天线罩211之间的连接密闭性。在另一些实施方式中，还可以在天线罩211与绝缘部2121的对接处(例如凸缘2112和凹槽2127之间)填充密封胶等，以保障天线罩211和绝缘部2121之间的连接密闭性。在另一些实施方式中，也可以设置在绝缘部2121的上边缘设置凸缘2112，在天线罩211的下边缘设置凹槽2127。
另外，在一些实施方式中，天线罩211和绝缘部2121也可以为一体结构。具体来说，天线罩211和绝缘部2121可以采用注塑等工艺进行一体成型。例如，天线罩211和绝缘部2121可以选用树脂、丙烯腈、聚乙烯、聚丙烯、聚碳酸酯等材料注塑成型，在具体实施时，天线罩211和绝缘部2121可以选用相同的绝缘材料也可以选用不同的绝缘材料。
在具体实施时，绝缘部2121和金属散热部2122之间的连接形式也可以是多样的。例如，如图7所示，在本申请提供的一个实施例中，绝缘部2121可以包括第一连接部2124，金属散热部2122可以包括第二连接部2125，绝缘部2121和金属散热部2122可以通过第一连接部2124和第二连接部2125实现密闭连接。请结合参阅图8，在本申请提供的一个实施例中，第一连接部2124可以是凸缘结构，第二连接部2125可以是与凸缘结构相嵌合的凹槽结构。具体来说，凸缘结构可以设置在绝缘部2121底部通孔(图中未标示出)的边缘，并朝上设置；凹槽结构可以设置在金属散热部2122的边缘，并朝下设置。将绝缘部2121和金属散热部2122进行固定连接时，可以将金属散热部2122放置在绝缘部2121内，使凸缘结构嵌入到凹槽结构内，然后采用激光焊接等工艺对凸缘结构或凹槽结构进行加热，使凸缘结构逐渐熔融，冷却后便可实现绝缘部2121和金属散热部2122(凸缘结构和凹槽结构)之间的密闭连接。在一些实施方式中，凸缘结构也可以设置在金属散热部2122上，凹槽结构可以设置在绝缘部2121上。另外，在一些实施方式中，凸缘结构和凹槽结构之间的缝隙内还可以填充热熔胶、密封圈等，以保证绝缘部2121和金属散热部2122之间的连接密闭性。
另外，在一些实施方式中，绝缘部2121和金属散热部2122之间也可以采用其他的连接结构实现密闭连接。例如，绝缘部2121和金属散热部2122之间可以采用上述实施例中的天线罩211与绝缘部2121之间的连接结构，也可以采用螺纹连接(如螺钉)等形式进行连接。例如，可以在绝缘部2121中设置凸起，在金属散热部2122中设置卡扣，绝缘部2121和金属散热部2122进行连接时，绝缘部2121中的凸起与金属散热部2122中的卡扣相互扣合，从而实现绝缘部2121和金属散热部2122之间的固定连接。另外，天线罩211与绝缘部2121之间也可以采用上述的绝缘部2121与金属散热部2122之间的连接结构实现密闭连接，也可以采用其他的连接方式实现密闭连接。例如，可以在绝缘部2121和金属散热部2122相接触的部位设置凹槽和凸缘结构，当绝缘部2121和金属散热部2122相互扣合固定后，绝缘部2121的凹槽(或凸缘)与金属散热部2122的凸缘(或凹槽)相嵌合，从而实现绝缘部2121和金属散热部2122之间的密闭连接。
另外，在一些实施方式中，金属散热部2122和绝缘部2121也可以为一体结构。具体来说，天线罩211和绝缘部2121可以采用注塑等工艺进行一体成型。例如，可以先对金属散热部2122采用注塑、冲压等工艺进行成型，然后将成型后的金属散热部2122放置在注塑模具中，在模具中注入绝缘材料以对绝缘部2121进行成型，同时实现绝缘部2121和金 属散热部2122之间的结合。
在一些实施方式中，金属散热部2122的具体形状和设置位置可以根据实际散热需求作相应调整。
例如，在本申请提供的实施例中，天线板22中的电路板221为矩形结构，在具体实施时，为了尽量缩小壳体21的体积，壳体21可以是矩形的立方体结构。另外，为了使得金属散热部2122能够对天线板22起到良好的散热效果，金属散热部2122也可以设置成矩形的板状结构。在具体实施时，可以将金属散热部2122设置在电路板221的正下方，从而使得天线板22所产生的热量能够有效的辐射或传递至金属散热部2122处，以有效提升金属散热部2122对天线板22的散热效果。在一些实施方式中，天线板22的轮廓面积可以不大于金属散热部2122的轮廓面积，以使天线板22产生的热量能够有效的辐射或传递至金属散热部2122处，从而提升金属散热部2122对天线板22的散热效果。在另一些实施方式中，为了使得天线板22所产生的热量能够更加高效的传递至金属散热部2122处，可以将天线板22和金属散热部2122之间的距离尽量缩小，或者还可以在天线板22和金属散热部2122之间设置导热件。例如，可以在电路板221的下侧和金属散热部2122的上侧之间设置导热硅胶等材料，以使天线板22所产生的热量能够高效的传递至金属散热部2122上，进而提升毫米波雷达装置20的散热性能。另外，为了提升金属散热部2122的散热性能，在一些实施方式中，金属散热部2122中可以设置散热鳍片等结构，以提升金属散热部2122与外界之间的热交换面积，从而有效提升金属散热部2122的散热性能。具体来说，可以在金属散热部2122的外侧设置片状、棱状、柱状等结构以形成散热鳍片，从而提升金属散热部2122与外界之间的热交换面积。
另外，在实际应用时，电路板221的下板面可以设置一些电子元件或发热元件(如控制器等)。请结合参阅图3，为了有效提升毫米波雷达装置20的散热性能，在本申请提供的一个实施例中，可以在金属散热部2122中设置容置槽2126，位于电路板221下板面的一些电子元件可以容纳在容置槽2126内，从而有利于提升毫米波雷达装置20的小型化设置；另外，还能够有效缩减金属散热部2122与电子元件之间的距离，以及金属散热部2122与电路板221之间的距离，以降低电路板221和电子元件与金属散热部2122之间的热传导距离，从而能够提升毫米波雷达装置20的散热性能。在具体实施时，容置槽2126的形状轮廓、大小以及数量可以根据实际需求作相应调整，本申请对此不作具体限定。
在一些实施方式中，一些电子元件还可以设置在额外的电路板221上。例如，毫米波雷达装置20中也可以包括多层板结构。具体来说，在天线板22的下侧还可以设置单独的电路板，以供电子元件的安装，同时还可以防止该电路板对天线板22的电磁波形成阻挡或干扰等。在具体实施时，电路板中可以包括驱动电路、控制器等部件，电路板可以与天线板22进行电连接，以驱动天线元件222发射电磁波，或对天线元件222接收的电磁波进行处理和计算等操作。
另外，在一些实施方式中，金属散热部2122可以不仅限于设置在底壳212的下部，还可以设置在底壳212(或绝缘部2121)的侧部。例如，底壳212的部分侧板可以由金属材料制成。
另一方面，为了便于实现毫米波雷达装置20与外部设备之间信号传输和电力传输，壳体21中还可以设置连接器2128。
如图3所示，在本申请提供的一个实施例中，连接器2128设置在底壳212的侧部。 具体来说，连接器2128可以包括塑料外壳和设置在塑料外壳内的电连接结构(如金属触点、弹片、PIN针等)。
为了防止连接器2128内的金属件对天线板22的正常工作形成干扰，连接器2128可以设置在天线板22的后端。另外，将连接器2128设置在天线板22的后端，还能避免对天线板22开设缺口来避让连接器2128，从而可以有效提高天线板22(如电路板221)的布板面积，达到整机平面尺寸小型化的目的。具体来说，请结合参阅图4，天线板22的前端和后端可以以图中的虚线为分界线进行区分；即虚线以上的部分可以是天线板22的前端，虚线以下的部分(包括下侧和左右两侧)可以是天线板22的后端。连接器2128可以设置在天线板22的后端，具体来说，连接器2128可以设置在底壳212的左侧或下侧。在具体实施时，为了提升连接器2128与底壳212之间的连接密闭性，连接器2128与底壳212之间可以采用注塑工艺制作成一体结构。为了便于制作，可以将连接器2128与底壳212中的绝缘部2121进行一体注塑成型。例如，可以将连接器2128成品放置在注塑模具中，然后将绝缘材料注入模具中，从而实现绝缘部2121的成型以及绝缘部2121与连接器2128之间的连接。通过这种方式可以有效增加连接器2128与底壳212之间的连接密闭性，同时，也便于进行大批量生产，有利于降低制作成本。
另外，在具体实施时，连接器2128可以通过线缆与天线板22进行电连接。或者，连接器2128与天线板22之间也可以直接连接。
以直接连接为例。如图3所示，在本申请提供的一个实施例中，连接器2128的电连接结构2129为弹片。天线板22的下板面设有焊盘或金属触点等导电结构(图中未示出)。当天线板22向下安装在壳体21内后，弹片(电连接结构2129)会与天线板22下板面的焊盘或金属触点弹性接触，从而实现连接器2128与天线板22之间的电连接。
或者，请结合参阅图5，在本申请提供的另一个实施例中，连接器2128的电连接结构2129为PIN针。天线板22的下板面设有过孔(图中未示出)。当天线板22向下安装在壳体21内后，PIN针(电连接结构2129)会与天线板22下板面的过孔实现插接，从而实现连接器2128与天线板22之间的电连接。
可以理解的是，在另外的实施例方式中，连接器2128的电连接结构的类型和形状构造可以根据不同需求进行灵活设置。相应的，天线板22中的导电结构的类型和形状构造也可以根据不同需求进行灵活设置，本申请对此不作限定。
另外，在具体实施时，绝缘部2121和金属散热部2122在底壳212中的分布情况可以是多样的。例如，底壳212的部分底部和侧部可以是绝缘部2121，或者，底壳212的左侧或部分左侧可以是绝缘部2121，其他部分是金属散热部2122。通过绝缘部2121和金属散热部2122的设置，可以使得连接器2128能够通过注塑工艺与底壳212(绝缘部2121)进行结合，同时，连接器2128还能通过绝缘部2121与金属散热部2122进行密闭连接，以保证底壳212的密闭性。
另一方面，如图9所示，本申请实施例还提供了一种移动平台10，包括信息处理***30和上述任意一种实施例中的毫米波雷达装置20。信息处理***30用于根据毫米波雷达装置20产生的电磁波和接收到的电磁波，确定被探测物体的特征信息，特征信息包括但不限于目标距离、方位、高度、速度、姿态、甚至形状等信息。具体的，信息处理***30可以通过准确测量毫米波雷达装置20从发射电磁波到接收目标物体反射后的电磁波的传播时间，由于光速是已知的，传播时间即可被转换为对距离的测量，从而确定毫米波雷达 装置20到目标物体的距离。
在具体实施时，信息处理***30可以是处理器、微处理器(如digital signal processor，DSP)、AI芯片(如Field Programmable Gate Array，FPGA)、专用集成电路(如Application Specific Integrated Circuit，ASIC)等各种形式的硬件装置。
以上述移动平台10为自动驾驶汽车为例，该自动驾驶汽车包括上述毫米波雷达装置20、信息处理***30和电子控制***40，该电子控制***40(electronic control Unit，ECU)可以为车载电脑。当毫米波雷达装置20识别出前方存在障碍物、信息处理***30计算出障碍物的特征信息时，电子控制***40则可以根据上述障碍物的特征信息，结合导航信息(如地图)，控制自动驾驶汽车的驱动装置进行减速、停止或者转弯绕行；或者，当毫米波雷达装置20和信息处理***30确定无障碍物时，电子控制***40则可以根据上述无障碍物的信息，控制自动驾驶汽车的驱动装置进行匀速行驶或者加速行驶。
可选的实施例中，上述移动平台10的具体类型不做限制，例如可以为汽车、船舶、飞机、火车、航天器、无人机等移动平台，均适用本申请技术方案。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。

Claims (13)

  1. 一种雷达装置，其特征在于，包括：
    壳体，具有容纳空间；
    天线板，设置在所述容纳空间内；所述天线板具有相背设置的第一板面和第二板面，且所述第一板面用于收发信号；
    连接器，设置于所述壳体，用于与所述壳体外部的其他器件连接；
    其中，所述连接器具有电连接结构，所述电连接结构与所述天线板电连接，且所述电连接结构位于所述第二板面的一侧。
  2. 根据权利要求1所述的雷达装置，其特征在于，所述电连接结构为金属触点、弹片或PIN针。
  3. 根据权利要求1或2所述的雷达装置，其特征在于，所述第二板面具有用于与所述电连接结构相连接的焊盘或过孔。
  4. 根据权利要求1至3中任一项所述的雷达装置，其特征在于，所述壳体包括：
    底壳，包括绝缘部和金属散热部；
    天线罩，与所述底壳固定连接，所述底壳和所述天线罩围成密闭的容纳空间；
    所述天线板的所述第一板面朝向所述天线罩设置，且所述金属散热部位于所述第二板面的一侧。
  5. 根据权利要求4所述的雷达装置，其特征在于，所述连接器的外壳与所述绝缘部一体成型。
  6. 根据权利要求4或5所述的雷达装置，其特征在于，所述绝缘部包括第一连接部，所述金属散热部包括第二连接部，所述第一连接部与所述第二连接部密闭连接。
  7. 根据权利要求6所述的雷达装置，其特征在于，所述第一连接部包括凹槽或凸缘结构，所述第二连接部包括与所述第一连接部相嵌合的凸缘或凹槽结构。
  8. 根据权利要求4至7中任一项所述的雷达装置，其特征在于，所述绝缘部包括底板和位于所述底板边缘的侧板，所述底板中设有通孔，所述第一连接部设置在所述通孔的边缘；
    所述第二连接部位于所述金属散热部的边缘，且所述金属散热部封堵所述通孔。
  9. 根据权利要求4至8中任一项所述的雷达装置，其特征在于，所述金属散热部正对所述天线板的所述第二板面设置。
  10. 根据权利要求9所述的雷达装置，其特征在于，所述天线板的轮廓面积不大于所述金属散热部的轮廓面积。
  11. 根据权利要求4至10中任一项所述的雷达装置，其特征在于，所述金属散热部的内侧具有容置槽；所述容置槽用于容纳所述雷达装置的发热元件。
  12. 根据权利要求4至11中任一项所述的雷达装置，其特征在于，所述金属散热部和所述天线组件之间设有导热件。
  13. 一种移动平台，其特征在于，包括信息处理***和如权利要求1至12中任一项所述的雷达装置；
    所述信息处理***与所述雷达装置信号连接，用于根据所述雷达装置的信号计算被探测物体的特征信息。
PCT/CN2021/072733 2020-01-20 2021-01-19 一种雷达装置和移动平台 WO2021147865A1 (zh)

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