WO2021088633A1 - 筒灯 - Google Patents

筒灯 Download PDF

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Publication number
WO2021088633A1
WO2021088633A1 PCT/CN2020/122060 CN2020122060W WO2021088633A1 WO 2021088633 A1 WO2021088633 A1 WO 2021088633A1 CN 2020122060 W CN2020122060 W CN 2020122060W WO 2021088633 A1 WO2021088633 A1 WO 2021088633A1
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WO
WIPO (PCT)
Prior art keywords
housing
reflective
shell
bottom plate
side wall
Prior art date
Application number
PCT/CN2020/122060
Other languages
English (en)
French (fr)
Inventor
刘泽玉
肖一胜
王爱萍
Original Assignee
苏州欧普照明有限公司
欧普照明股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州欧普照明有限公司, 欧普照明股份有限公司 filed Critical 苏州欧普照明有限公司
Priority to EP20885406.7A priority Critical patent/EP3974705A4/en
Publication of WO2021088633A1 publication Critical patent/WO2021088633A1/zh
Priority to US17/562,998 priority patent/US11732851B2/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design

Definitions

  • This application relates to the field of lighting technology, in particular to a downlight.
  • lamps have become an indispensable electrical appliance in people's daily life, which can provide lighting for the environment.
  • a lens is generally used in the current lamp to distribute light for the light-emitting unit.
  • lamps there are many types of lamps on the market, such as chandeliers, ceiling lamps, wall washers, etc., each with different characteristics.
  • downlights as a kind of decorative lamps, can provide accent lighting for local areas, and have a good effect of setting off the atmosphere.
  • a metal shell is usually used, and in order to reduce the cost, the structure of each part of the downlight is usually designed to be easy to assemble.
  • the simpler the assembly structure the lower the safety of the product, and the more likely the metal shell is to be charged. Therefore, how to avoid electrification of the metal shell while simplifying the assembly structure is a technical problem to be solved urgently in this field.
  • the embodiment of the present application provides a downlight to solve the above-mentioned problem.
  • the embodiment of the present application provides a downlight, which includes a metal shell, an insulating reflective shell, a photoelectric module, and a diffuser plate;
  • the metal housing has a housing bottom plate, a housing side wall surrounding the housing bottom plate, an assembly cavity enclosed by the housing bottom plate and the housing side wall, and a housing mounting opening facing the housing bottom plate.
  • a shell power port is provided on the bottom plate;
  • the insulating reflective shell has a mounting bottom plate, a reflective side wall surrounding the mounting bottom plate, a light source cavity enclosed by the mounting bottom plate and the reflective side wall, and a light exit facing the mounting bottom plate.
  • the bottom plate is provided with a reflective shell power port corresponding to the shell power port, and a circle of creeping wall is provided around the side of the reflective shell power port facing the light outlet;
  • the optoelectronic module is arranged in the light source cavity and is attached to the mounting base plate, and the insulating reflective shell is clamped and fixed in the assembling cavity so that the power port of the reflective shell is aligned with the power port of the shell ;
  • the diffuser plate is clamped and fixed with the metal casing and closes the casing installation opening.
  • a wire buckle is provided on the mounting base plate, and the wire buckle is located in an area enclosed by the creepage wall and on one side of the power port of the reflective housing, so The wire clip can clamp the power cord together with the creepage wall.
  • the side of the wire buckle facing the axis of the power port of the reflective housing is provided with a compression rib, and the side of the wire buckle facing away from the power port of the reflective housing is connected to A wedge-in gap is formed between the creepage walls, and the downlight further includes a wedge, which is inserted into the wedge-in gap and can push the pressing rib to clamp the power cord.
  • the photoelectric module includes a substrate, a light source, and a driving element, and the light source and the driving element are both disposed on the substrate and facing the light exit port.
  • the substrate is an aluminum substrate
  • the mounting bottom plate is attached to the housing bottom plate
  • a hot-melt column is provided on the mounting base plate, a hot-melt perforation is provided on the substrate, and the end of the hot-melt column passes through the hot-melt perforation and is formed by thermal melting. Riveted end.
  • a first clamping ring groove is provided on the side wall of the housing, a reflective housing clamping piece is provided on the reflective side wall, and the insulating reflective housing and the metal housing pass through The first clamping ring groove and the reflective shell clamping member are clamped and fixed.
  • a plurality of the reflective shell clamping members are arranged in a circumferential direction on a side of the reflective side wall adjacent to the light outlet.
  • a second clamping ring groove is provided on the side wall of the housing, and the diffuser plate is clamped and fixed to the second clamping ring groove.
  • the above-mentioned downlight further includes a lug spring, a riveting hole is provided on the side wall of the housing, and the lug spring is riveted and fixed to the metal housing through the riveting hole.
  • an escape notch is provided on the reflective side wall corresponding to the riveting hole.
  • an insulating wall is provided around a side of the power port of the reflector housing away from the light outlet, and the insulating wall penetrates the power port of the housing.
  • the downlight disclosed in the embodiment of the present application can effectively increase the difficulty of creepage and effectively reduce the risk of electrification of the metal shell by attaching the photoelectric module to the mounting base plate and setting a circle of creepage walls around the power port of the reflective shell.
  • Figure 1 is an exploded structural view of the downlight disclosed in an embodiment of the application
  • FIG. 5 is a specific structural view of the photoelectric module disclosed in the embodiment of the application.
  • Figure 6 is an overall cross-sectional structural view of the downlight disclosed in an embodiment of the application.
  • Fig. 7 is a partial enlarged structural view of area A in Fig. 6.
  • the embodiment of the application discloses a downlight, as shown in FIG. 1 to FIG. 7, which includes a metal shell 1, an insulating reflective shell 2, a photoelectric module 3 and a diffuser 4.
  • the metal shell 1 is the main body and the protective structure of the downlight.
  • the metal housing 1 has a housing bottom plate 10, a housing side wall 11 surrounding the housing bottom plate 10, an assembly cavity 12 surrounded by the housing bottom plate 10 and the housing side wall 11, and an assembly cavity 12 that faces the housing bottom plate 10. Housing installation port 13.
  • the metal shell 1 may also include a decorative flange 14 surrounding the shell mounting opening 13.
  • the housing bottom plate 10 is provided with a housing power port 100 for the external power cord 9 to penetrate into the assembly cavity 12.
  • the insulating reflective shell 2 in this embodiment can be made of a material with high reflectivity, such as PC (polycarbonate).
  • the insulating reflective shell 2 may have a mounting bottom plate 20, a reflective side wall 21 surrounding the mounting bottom plate 20, a light source cavity 22 surrounded by the mounting bottom plate 20 and the reflective side wall 21, and a light source facing the mounting bottom plate 20. ⁇ 23.
  • a reflective housing power port 200 corresponding to the housing power port 100 is provided on the mounting base plate 20.
  • the reflective housing power port 200 is also used for the power cord 9 to pass through, and the reflective housing power port 200 faces the light outlet 23.
  • the optoelectronic module 3 is arranged in the light source cavity 22 and attached to the mounting base plate 20.
  • the optoelectronic module 3 in this embodiment may include a substrate 30, a light source 31, and a plurality of driving elements 32, a light source 31 and a plurality of driving elements.
  • the components 32 are all disposed on the substrate 30.
  • the light source 31 may be surrounded around the driving element 32.
  • the photoelectric module 3 and the insulating reflective shell 2 can be fixedly connected in various ways, such as clamping, bonding, etc. are all considered.
  • this embodiment provides a relatively simple fixing method.
  • the hot-melt column 202 can be provided on the mounting base plate 20, and the hot-melt perforation 300 can be provided on the base plate 30.
  • the base plate 30 is attached to the base plate 30 during assembly. Install the bottom plate 20 and make the end of the hot-melt column 202 pass through the hot-melt perforation 300, and then heat-melt the end of the hot-melt column 202 to form a thick riveted end to fix the substrate 30, thereby fixing the substrate 30 to the mounting bottom plate 20 . After the substrate 30 is fixed, the light source 31 can emit light toward the light outlet 33.
  • the insulating reflective shell 2 and the photoelectric module 3 can be integrated into the installation cavity 12 and the insulated reflective shell 2 can be clamped and fixed with the metal shell 1.
  • the metal shell 1 in this embodiment can be formed by stamping. Therefore, the clamping structure on the metal shell 1 also needs to be simplified as much as possible to facilitate subsequent processing and forming.
  • a first snap ring groove 110 may be provided on the side wall 11 of the housing, and the snap ring groove 110 may be directly formed on the side wall 11 of the housing formed by a lathe.
  • the structure is simple and easy to process.
  • a reflective shell clamping member 210 may be provided on the reflective side wall 21, and the insulating reflective shell 2 and the metal shell 1 can be clamped and fixed with the reflective shell clamping member 210 through the first clamping ring groove 110.
  • the insulating reflective shell 2 is usually made of an insulating polymer material, which is convenient to form, it is convenient to form a reflective shell clip 210 with a more complicated structure, and the good elasticity of the polymer material can also be used for clip deformation to improve the clip effect.
  • a plurality of buckle-style reflective shell clamping members 210 are arranged circumferentially on the side of the reflective side wall 21 adjacent to the light outlet 23.
  • the shell power port 100 can be aligned with the reflective shell power port 200, and then the power cord 9 can pass through the shell power port 100 and the reflective shell power port 200 in turn until the creepage is exceeded
  • the wall 201 can be electrically connected to the substrate 30 of the optoelectronic module 3 by bending back later. Due to the existence of the creepage wall 201, the potential energy needs to cross the creepage wall 201 before it can pass through the reflective shell power port 200. Therefore, compared with the ordinary setting method, this structure has higher safety and can effectively prevent the metal shell 1 is charged.
  • the power cord 9 in this embodiment may have an insulating sheath 90 and a wire 91 wrapped by the insulating sheath 90.
  • the insulating sheath 90 can penetrate the power port 100 of the housing and reflect The shell power port 200 is flush with the creepage wall 201 or exceeds the creepage wall 201 afterwards.
  • the wire 91 can be independently extended from the end of the insulating sheath 90 and bent toward the optoelectronic module 3 to be electrically connected to it.
  • a wire clip 203 can be provided on the mounting base plate 20.
  • the wire clip 203 is located in the area surrounded by the creepage wall 201 and is also in the reflective shell.
  • the clip buckle 203 can clamp the insulating sheath 90 together with the creepage wall 201.
  • a compression rib 203a can also be provided on the side of the cord buckle 203 facing the axis of the power port 200 of the reflective housing, and the cord A wedge gap 204 is formed between the side of the buckle 203 facing away from the power port 200 of the reflective shell and the creepage wall 201.
  • a wedge 5 can be set inside the downlight.
  • the pressing rib 203a can squeeze the insulating outer skin 90 to produce significant deformation, thereby restricting its longitudinal movement ability.
  • the wedge 5 in this embodiment can adopt the usual wedge-shaped structure. However, in consideration of avoiding escaping from the wedge-in gap 204, a screw can be used as the wedge 5. A thread can be provided in the wedge-in gap 204, and the head of the screw is used for extrusion. Card line buckle 203.
  • a circle of insulating walls 205 can be arranged around the side of the reflective housing power port 200 away from the light outlet 23.
  • the insulating walls 205 can be Pass out the power port 100 of the housing. In this way, a layer of insulation protection can be formed between the power cord 9 and the metal casing 1 by the insulating wall 205, and the insulation effect is better.
  • the structure of the shell bottom plate 10 is usually not too complicated.
  • the shell bottom plate 10 in this embodiment is basically flat, and it is difficult to provide some heat dissipation channels and other structures. Therefore, in order to ensure the thermal safety of the downlight provided in this embodiment and prevent local overheating, the substrate 30 in this embodiment may be an aluminum substrate, and the mounting bottom plate 20 is attached to the housing bottom plate 10 at the same time.
  • the difference between the aluminum substrate and the usual PCB substrate is that it has a metal aluminum layer. Due to the poor thermal conductivity of the PCB's junction substrate, the heat will be concentrated near the components and cannot be quickly diffused laterally. It can only transfer the heat away as soon as possible through the longitudinal heat transfer.
  • the aluminum substrate has a metal aluminum layer
  • the heat emitted by the light source 31 and the driving element 32 can be quickly transferred horizontally through the metal aluminum layer, so that the heat of the entire metal aluminum layer is balanced, and therefore the demand for longitudinal heat transfer is reduced.
  • the heat conduction method in which the mounting bottom plate 20 is attached to the housing bottom plate 10 can already meet the heat dissipation requirements, and can effectively reduce the processing cost of the metal housing 1 while avoiding local overheating.
  • the diffuser plate 4 can be clamped and fixed with the metal shell 1 and the shell mounting opening 13 can be closed.
  • a second snap ring groove 111 can also be provided on the side wall 11 of the housing. The second snap ring groove 111 needs to be set near the housing installation opening 13, and then the edge of the diffuser 4 can be used. It is directly clamped and fixed with the second clamping ring groove 111.
  • a lug spring 6 is usually provided as a mounting component.
  • a riveting hole 112 can be provided on the housing side wall 11, and the lug spring 6 can be riveted and fixed to the metal housing 1 through the riveting hole 112.
  • a avoidance notch 211 may be provided on the reflective sidewall 21 corresponding to the riveting hole 112.
  • the downlight provided by the embodiments of the present application can effectively increase the difficulty of creepage and effectively reduce the risk of electrification of the metal shell.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种筒灯，包括金属外壳(1)、绝缘反射壳(2)、光电模组(3)以及扩散板(4)；金属外壳(1)具有外壳底板(10)、外壳侧壁(11)、装配腔(12)以及外壳安装口(13)，外壳底板(10)上设置有外壳电源口(100)；绝缘反射壳(2)具有安装底板(20)、反射侧壁(21)、光源腔(22)以及出光口(23)，安装底板(20)上设置有对应外壳电源口(100)的反射壳电源口(200)，反射壳电源口(200)朝向出光口(23)的一侧围绕设置有一圈爬电墙(201)；光电模组(3)设置在光源腔(22)内并贴合安装底板(20)，绝缘反射壳(2)卡接固定在装配腔(12)内并使反射壳电源口(200)与外壳电源口(100)对准；扩散板(4)与金属外壳(1)卡接固定并封闭外壳安装口(13)。筒灯能够有效提高爬电难度，有效降低金属外壳(1)带电的风险。

Description

筒灯 技术领域
本申请涉及照明技术领域，尤其涉及一种筒灯。
背景技术
随着人们生活水平的日渐提高，灯具已经成为人们日常生活中一种必不可少的电器，可以为环境提供照明作用。为了提升照明效果，当前灯具内普遍采用透镜为发光单元进行配光。
目前市场上的灯具类型多种多样，例如吊灯、吸顶灯、洗墙灯等各自具有不同的特点。其中筒灯作为一种装饰灯具能够为局部区域提供重点照明，具有良好的烘托氛围的效果。
相关技术中的筒灯为了提升外观效果，通常采用金属外壳，并且为了降低成本，筒灯的各部分结构通常会被设计的易于装配。但装配结构越简单，产品的安全性就越低，金属外壳就越有可能被带电。因此，如何在简化装配结构的同时避免金属外壳带电是本领域亟待解决的技术问题。
发明内容
本申请实施例提供一种筒灯，以解决上述问题。
本申请实施例采用下述技术方案：
本申请实施例提供了一种筒灯，包括金属外壳、绝缘反射壳、光电模组以及扩散板；
所述金属外壳具有外壳底板、围绕所述外壳底板的外壳侧壁、由所述外壳底板与所述外壳侧壁共同围成的装配腔以及正对所述外壳底板的外壳安装口，所述外壳底板上设置有外壳电源口；
所述绝缘反射壳具有安装底板、围绕所述安装底板的反射侧壁、由所述 安装底板以及所述反射侧壁共同围成的光源腔以及正对所述安装底板的出光口，所述安装底板上设置有对应所述外壳电源口的反射壳电源口，所述反射壳电源口朝向所述出光口的一侧围绕设置有一圈爬电墙；
所述光电模组设置在所述光源腔内并贴合所述安装底板，所述绝缘反射壳卡接固定在所述装配腔内并使所述反射壳电源口与所述外壳电源口对准；
所述扩散板与所述金属外壳卡接固定并封闭所述外壳安装口。
可选地，上述的筒灯中，所述安装底板上设置有卡线扣，所述卡线扣位于所述爬电墙所包围的区域内且位于所述反射壳电源口的一侧，所述卡线扣能够与所述爬电墙共同夹紧电源线。
可选地，上述的筒灯中，所述卡线扣朝向所述反射壳电源口的轴线的一侧设置有压紧凸棱，所述卡线扣背离所述反射壳电源口的一侧与所述爬电墙之间形成有进楔间隙，所述筒灯还包括楔子，所述楔子塞入所述进楔间隙内并能够推动所述压紧凸棱夹紧电源线。
可选地，上述的筒灯中，所述光电模组具备基板、光源以及驱动元件，所述光源以及所述驱动元件均设置在所述基板上且朝向所述出光口。
可选地，上述的筒灯中，基板为铝基板，所述安装底板与所述外壳底板相贴合。
可选地，上述的筒灯中，所述安装底板上设置有热熔柱，所述基板上设置有热熔穿孔，所述热熔柱的端部穿过所述热熔穿孔并热熔形成铆接端。
可选地，上述的筒灯中，所述外壳侧壁上设置有第一卡接环槽，所述反射侧壁上设置有反射壳卡接件，所述绝缘反射壳与所述金属外壳通过所述第一卡接环槽与所述反射壳卡接件进行卡接固定。
可选地，上述的筒灯中，所述反射侧壁临近所述出光口的一侧沿周向排布有多个所述反射壳卡接件。
可选地，上述的筒灯中，所述外壳侧壁上设置有第二卡接环槽，所述扩散板与所述第二卡接环槽卡接固定。
可选地，上述的筒灯中，还包括耳簧，所述外壳侧壁上设置有铆接孔，所述耳簧通过所述铆接孔与所述金属外壳铆接固定。
可选地，上述的筒灯中，所述反射侧壁上对应所述铆接孔设置有避让缺口。
可选地，上述的筒灯中，所述反射壳电源口背离所述出光口的一侧围绕设置有一圈绝缘围壁，所述绝缘围壁穿出所述外壳电源口。
本申请实施例采用的上述至少一个技术方案能够达到以下有益效果：
本申请实施例公开的筒灯通过将光电模组贴合安装底板并围绕反射壳电源口设置一圈爬电墙，能够有效提高爬电难度，有效降低金属外壳带电的风险。
附图说明
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1为本申请实施例公开的筒灯的***结构视图；
图2为本申请实施例公开的金属外壳与耳簧的具体结构视图；
图3为本申请实施例公开的金属外壳的剖视结构视图；
图4为本申请实施例公开的绝缘反射壳的具体结构视图；
图5为本申请实施例公开的光电模组的具体结构视图；
图6为本申请实施例公开的筒灯的整体剖视结构视图；
图7为图6中A区域的局部放大结构视图。
附图标记说明：
1-金属外壳、10-外壳底板、100-外壳电源口、11-外壳侧壁、110-第一卡接环槽、111-第二卡接环槽、112-铆接孔、12-装配腔、13-外壳安装口、14-装饰翻边、2-绝缘反射壳、20-安装底板、200-反射壳电源口、201-爬电 墙、202-热熔柱、203-卡线扣、203a-压紧凸棱、204-进楔间隙、21-反射侧壁、210-反射壳卡接件/卡扣；211-避让缺口、22-光源腔、23-出光口、3-光电模组、30-基板、300-热熔穿孔、31-光源、32-驱动元件、4-扩散板、5-楔子、6-耳簧、9-电源线、90-绝缘外皮、91-导线。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下结合附图，详细说明本申请各实施例提供的技术方案。
本申请实施例公开了一种筒灯，如图1至图7所示，包括金属外壳1、绝缘反射壳2、光电模组3以及扩散板4。其中，金属外壳1是筒灯的主体以及保护结构。如图2和图3所示，金属外壳1具有外壳底板10、围绕外壳底板10的外壳侧壁11、由外壳底板10与外壳侧壁11共同围成的装配腔12以及正对外壳底板10的外壳安装口13。除此之外，金属外壳1还可包括围绕外壳安装口13的装饰翻边14。在外壳底板10上设置有外壳电源口100用于外部的电源线9穿入装配腔12。
本实施例中的绝缘反射壳2可采用具有高反射率的材料制成，例如PC(聚碳酸酯)等。如图4所示，绝缘反射壳2可具有安装底板20、围绕安装底板20的反射侧壁21、由安装底板20以及反射侧壁21共同围成的光源腔22以及正对安装底板20的出光口23。与此同时，在安装底板20上设置有对应外壳电源口100的反射壳电源口200，反射壳电源口200也用于电源线9穿过，反射壳电源口200朝向出光口23的一侧还围绕设置有一圈爬电墙201。
光电模组3设置在光源腔22内并贴合安装底板20，如图5所示，本实 施例中的光电模组3可包括基板30、光源31以及若干驱动元件32，光源31以及若干驱动元件32均设置在基板30上。其中，考虑到均匀出光，可以将光源31围绕在驱动元件32的周围。本实施例中的光电模组3与绝缘反射壳2可以通过各种方式进行固定连接，例如卡接、粘接等均在考虑之列。如图4所示，本实施例提供一种较为简单的固定方式，可以在安装底板20上设置热熔柱202，同时在基板30上设置热熔穿孔300，在装配时将基板30贴合在安装底板20上并使热熔柱202的端部穿过热熔穿孔300，之后将热熔柱202的端部热熔形成粗壮的铆接端来固定基板30，从而将基板30与安装底板20相固定。基板30被固定好后，光源31可以向出光口33方向射出光线。
将光电模组3与绝缘反射壳2固定连接之后，可以再将绝缘反射壳2与光电模组3整体装入安装腔12内并利用绝缘反射壳2与金属外壳1卡接固定。绝缘反射壳2与金属外壳1的卡接固定方式也有很多种。考虑到金属外壳1的制造成本，本实施例中的金属外壳1可以采用冲压成型，因此金属外壳1上的卡接结构也需要尽量简化结构，以便于后续加工成型。
如图2和图3所示，本实施例中可以在外壳侧壁11上设置第一卡接环槽110，可以卡接环槽110可以通过车床直接在冲压成型的外壳侧壁11上成型，结构简单并且易于加工。同时如图4所示在反射侧壁21上可以设置反射壳卡接件210，绝缘反射壳2与金属外壳1可通过第一卡接环槽110与反射壳卡接件210进行卡接固定。由于绝缘反射壳2通常采用绝缘高分子材料，成型方便，因此便于成型出结构较为复杂的反射壳卡接件210，并且也可以利用高分子材料的良好弹性进行卡接形变，提高卡接效果。例如，本实施例中便在反射侧壁21临近出光口23的一侧沿周向排布设置了多个卡扣样式的反射壳卡接件210。
当绝缘反射壳固定在装配腔12内时，可以使外壳电源口100与反射壳电源口200对准，之后电源线9可以依次穿过外壳电源口100以及反射壳电源口200，直至超过爬电墙201，之后再向回弯折才能够与光电模组3的基板 30进行电连接。由于爬电墙201的存在，电势能需要越过爬电墙201才有可能通过反射壳电源口200，因此相较于普通的设置方式，这种结构具有更高的安全性，能够有效防止金属外壳1带电。
如图6和图7所示，本实施例中的电源线9可以具备绝缘外皮90以及被绝缘外皮90包裹的导线91，为了保证良好的绝缘性能，绝缘外皮90可以贯穿外壳电源口100以及反射壳电源口200之后与爬电墙201平齐或超出爬电墙201。之后导线91可由绝缘外皮90的端部单独伸出并向光电模组3弯曲并与其电连接。
为了固定电源线9，如图4、6、7所示，本实例可以在安装底板20上设置卡线扣203，卡线扣203位于爬电墙201所包围的区域内，并且也处于反射壳电源口200的一侧。卡线扣203能够与爬电墙201共同夹紧绝缘外皮90。进一步地，为了防止电源线9沿长度方向随意移动，造成与光电模组3脱离，还可以在卡线扣203朝向反射壳电源口200的轴线的一侧设置压紧凸棱203a，而卡线扣203背离反射壳电源口200的一侧与爬电墙201之间形成有进楔间隙204。筒灯内部可以设置一个楔子5，当电源线9穿过卡线扣203与爬电墙201之间后，可以将楔子5塞入进楔间隙204内，楔子5会挤压并推动卡线扣203发生形变，使压紧凸棱203a夹紧绝缘外皮90。此时压紧凸棱203a可以将绝缘外皮90挤压发生明显形变，从而限制其长度方向的移动能力。本实施例中的楔子5可以采用通常的楔形结构，但考虑到避免脱离进楔间隙204，可以采用螺丝作为楔子5，在进楔间隙204内可以设置螺纹，螺丝的头部便用于挤压卡线扣203。
更进一步地，本实施例还可以在反射壳电源口200背离出光口23的一侧围绕设置一圈绝缘围壁205，当绝缘反射壳2被装配在装配腔12内部时，绝缘围壁205可以穿出外壳电源口100。这样可以在电源线9与金属外壳1之间再由绝缘围壁205形成一层绝缘保护，绝缘效果更好。
对于采用冲压成型的金属外壳1而言，其外壳底板10的结构通常无法太 过复杂，例如本实施例中外壳底板10基本为平面，很难设置一些散热通道等结构。因此为了保证本实施例所提供的筒灯的热安全，防止局部过热，本实施例中的基板30可以采用铝基板，同时使安装底板20与外壳底板10相贴合。铝基板与通常的PCB基板的区别在于具有金属铝层。PCB的结缘基材由于导热能力较差，因此热量会集中在元器件附近，无法快速横向扩散，只能够通过纵向的热传递将热量尽快传递出去。而铝基板由于具备金属铝层，因此光源31与驱动元件32所发出的热量可以通过金属铝层快速横向传递，从而使整个金属铝层的热量均衡，因此对纵向的热传递需求降低，通过将安装底板20与外壳底板10相贴合的导热方式便已经能够满足散热要求，在避免局部过热的同时还可以有效降低金属外壳1的加工成本。
在本实施例中，当将绝缘反射壳2以及光电模组3装入装配腔12之后，可以将扩散板4与金属外壳1卡接固定并封闭外壳安装口13。与绝缘反射壳2类似，也可以在外壳侧壁11上设置第二卡接环槽111，第二卡接环槽111需要设置在临近外壳安装口13的位置，之后可以利用扩散板4的边缘直接与第二卡接环槽111进行卡接固定。
对于筒灯而言，通常还会具备耳簧6这一安装部件，本实施例中可以在外壳侧壁11上设置铆接孔112，耳簧6可以通过铆接孔112与金属外壳1铆接固定。为了防止绝缘反射壳2的反射侧壁21遮挡铆接孔112或者与铆接结构发生干涉，可以在反射侧壁21上对应铆接孔112设置避让缺口211。
综上所述，本申请实施例所提供的筒灯能够有效提高爬电难度，有效降低金属外壳带电的风险。
本申请上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之 内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (12)

  1. 一种筒灯，其中，包括金属外壳、绝缘反射壳、光电模组以及扩散板；
    所述金属外壳具有外壳底板、围绕所述外壳底板的外壳侧壁、由所述外壳底板与所述外壳侧壁共同围成的装配腔以及正对所述外壳底板的外壳安装口，所述外壳底板上设置有外壳电源口；
    所述绝缘反射壳具有安装底板、围绕所述安装底板的反射侧壁、由所述安装底板以及所述反射侧壁共同围成的光源腔以及正对所述安装底板的出光口，所述安装底板上设置有对应所述外壳电源口的反射壳电源口，所述反射壳电源口朝向所述出光口的一侧围绕设置有一圈爬电墙；
    所述光电模组设置在所述光源腔内并贴合所述安装底板，所述绝缘反射壳卡接固定在所述装配腔内并使所述反射壳电源口与所述外壳电源口对准；
    所述扩散板与所述金属外壳卡接固定并封闭所述外壳安装口。
  2. 根据权利要求1所述的筒灯，其中，所述安装底板上设置有卡线扣，所述卡线扣位于所述爬电墙所包围的区域内且位于所述反射壳电源口的一侧，所述卡线扣能够与所述爬电墙共同夹紧电源线。
  3. 根据权利要求2所述的筒灯，其中，所述卡线扣朝向所述反射壳电源口的轴线的一侧设置有压紧凸棱，所述卡线扣背离所述反射壳电源口的一侧与所述爬电墙之间形成有进楔间隙，所述筒灯还包括楔子，所述楔子塞入所述进楔间隙内并能够推动所述压紧凸棱夹紧电源线。
  4. 根据权利要求1至3任一项所述的筒灯，其中，所述光电模组具备基板、光源以及驱动元件，所述光源以及所述驱动元件均设置在所述基板上且朝向所述出光口。
  5. 根据权利要求4所述的筒灯，其中，基板为铝基板，所述安装底板与 所述外壳底板相贴合。
  6. 根据权利要求4所述的筒灯，其中，所述安装底板上设置有热熔柱，所述基板上设置有热熔穿孔，所述热熔柱的端部穿过所述热熔穿孔并热熔形成铆接端。
  7. 根据权利要求1至3任一项所述的筒灯，其中，所述外壳侧壁上设置有第一卡接环槽，所述反射侧壁上设置有反射壳卡接件，所述绝缘反射壳与所述金属外壳通过所述第一卡接环槽与所述反射壳卡接件进行卡接固定。
  8. 根据权利要求7所述的筒灯，其中，所述反射侧壁临近所述出光口的一侧沿周向排布有多个所述反射壳卡接件。
  9. 根据权利要求1至3任一项所述的筒灯，其中，所述外壳侧壁上设置有第二卡接环槽，所述扩散板与所述第二卡接环槽卡接固定。
  10. 根据权利要求1至3任一项所述的筒灯，其中，还包括耳簧，所述外壳侧壁上设置有铆接孔，所述耳簧通过所述铆接孔与所述金属外壳铆接固定。
  11. 根据权利要求10所述的筒灯，其中，所述反射侧壁上对应所述铆接孔设置有避让缺口。
  12. 根据权利要求1至3任一项所述的筒灯，其中，所述反射壳电源口背离所述出光口的一侧围绕设置有一圈绝缘围壁，所述绝缘围壁穿出所述外壳电源口。
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CN210717150U (zh) * 2019-11-08 2020-06-09 欧普照明股份有限公司 筒灯

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US11732851B2 (en) 2023-08-22

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