WO2021081927A1 - Pcb散热组件和具有其的服务器 - Google Patents

Pcb散热组件和具有其的服务器 Download PDF

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Publication number
WO2021081927A1
WO2021081927A1 PCT/CN2019/114832 CN2019114832W WO2021081927A1 WO 2021081927 A1 WO2021081927 A1 WO 2021081927A1 CN 2019114832 W CN2019114832 W CN 2019114832W WO 2021081927 A1 WO2021081927 A1 WO 2021081927A1
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WO
WIPO (PCT)
Prior art keywords
wind deflector
heat dissipation
pcb
plate
dissipation assembly
Prior art date
Application number
PCT/CN2019/114832
Other languages
English (en)
French (fr)
Inventor
周雪松
潘建军
廖世震
张书浩
***
Original Assignee
北京比特大陆科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京比特大陆科技有限公司 filed Critical 北京比特大陆科技有限公司
Priority to PCT/CN2019/114832 priority Critical patent/WO2021081927A1/zh
Priority to US17/636,644 priority patent/US20220272872A1/en
Priority to EP19951028.0A priority patent/EP4007467A4/en
Publication of WO2021081927A1 publication Critical patent/WO2021081927A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes

Definitions

  • the present disclosure relates to the field of heat dissipation technology, and in particular, to a PCB heat dissipation assembly and a server having the same.
  • PCB Printed Circuit Board
  • PCB Printed Circuit Board
  • PCB printed Circuit Board
  • a radiator is usually installed on the PCB for heat dissipation.
  • the wind blown from the fan is easily blown out from the gap between the heat sink and the chassis, resulting in a decrease in heat dissipation efficiency.
  • an objective of the present disclosure is to provide a PCB heat dissipation assembly, which has a higher heat dissipation efficiency.
  • Another object of the present disclosure is to provide a server with the above-mentioned PCB heat dissipation assembly.
  • the PCB heat dissipation assembly includes: a PCB board on which a plurality of chips are arranged; at least one heat sink, the heat sink is arranged on the plurality of chips, and the heat dissipation device
  • the radiator includes a heat dissipation air duct; a wind deflector, the wind deflector is arranged adjacent to the at least one radiator, and the wind deflector is located on one side of the at least one radiator, the wind deflector Extend along the heat dissipation air duct.
  • the wind deflector can stop the air and make Air can flow through the radiator and fully take away the heat generated by the chip, thereby effectively improving the heat dissipation efficiency of the PCB heat dissipation component.
  • the wind deflector provided in this way has a simple structure, a small space occupation and a low cost.
  • a wind deflector is provided at one end of the wind deflector.
  • the distance between the wind deflector and the radiator gradually increases in a direction away from the wind deflector.
  • the wind deflector and the wind deflector are both welded and connected to the PCB board.
  • the bottom of the wind deflector is provided with a first flange
  • the bottom of the wind deflector is provided with a second flange
  • the wind deflector passes through the first flange and the
  • the PCB board is welded and connected
  • the wind deflector is welded and connected to the PCB board through the second flange
  • the first flange and the second flange are arranged at intervals.
  • the wind deflector is screwed to the PCB board.
  • At least one mounting seat and at least one mounting bar are fixed on the PCB board, and at least one mounting seat and at least one mounting bar are arranged at intervals along the length direction of the windshield, so The wind deflector is threadedly connected to the mounting seat, at least one of the mounting bars is opposite to the bottom of the wind deflector, and at least one of the mounting bars is supported between the wind deflector and the PCB board.
  • a connecting plate extending upward is provided on the mounting seat, a first nut member is provided on a side of the connecting plate away from the wind deflector, and the first screw passes through the wind deflector.
  • the plate is threadedly connected with the first nut member to fix the wind deflector on the mounting seat.
  • a positioning hole is formed on the wind deflector, and a positioning portion fitted in the positioning hole is provided on the connecting plate.
  • a backing plate is provided on a side of the wind deflector far away from the connecting plate, and the first screw passes through the backing plate, the wind deflector and the first nut member Threaded connection.
  • a horizontally extending support plate is provided on the mounting seat, at least one matching plate is provided on the wind deflector, the matching plate is provided on the upper surface of the support plate, and the second A screw passes through the matching plate and is threadedly connected with the support plate to fix the wind deflector on the mounting seat.
  • an upwardly extending extension plate is provided on the mounting seat, the support plate is connected to the top of the extension plate, and a second nut member is provided on the lower surface of the support plate.
  • the screw passes through the matching plate, and the supporting plate is threadedly connected with the second nut member.
  • the extension plate includes an extension plate body and a limiting plate, the wind deflector is provided with an opening, the support plate is fitted at the opening, and the edge of the opening is fitted Between the extension board body and the limiting board.
  • the server according to the embodiment of the second aspect of the present disclosure includes the PCB heat dissipation assembly according to the embodiment of the first aspect of the present disclosure.
  • Fig. 1 is a perspective view of a PCB heat dissipation assembly according to an embodiment of the present disclosure
  • Fig. 2 is another perspective view of the PCB heat dissipation assembly shown in Fig. 1, where the heat sink is not shown;
  • Fig. 3 is a perspective view of a PCB heat dissipation assembly according to another embodiment of the present disclosure.
  • Fig. 4 is an exploded view of the PCB heat dissipation assembly shown in Fig. 1, where the heat sink is not shown;
  • Fig. 5 is a perspective view of a PCB heat dissipation assembly according to still another embodiment of the present disclosure.
  • Fig. 6 is an exploded view of the PCB heat dissipation assembly shown in Fig. 5, where the heat sink is not shown;
  • Fig. 7 is a perspective view of the support plate and the extension plate of the PCB heat dissipation assembly shown in Fig. 6.
  • 121 mounting strip
  • 122 connecting plate
  • A flow direction of heat dissipation airflow
  • 1241 extension board body
  • 1242 limit board
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. Further, in the description of the present disclosure, unless otherwise specified, “plurality” means two or more than two.
  • the PCB heat dissipation assembly 100 according to an embodiment of the first aspect of the present disclosure will be described below with reference to FIGS. 1-7.
  • the PCB heat dissipation assembly 100 may be applied to a server (not shown in the figure).
  • the application of the PCB heat dissipation assembly 100 to a server is taken as an example for description.
  • the PCB heat dissipation assembly 100 includes a PCB board 1, at least one heat sink 2 and a windshield 3.
  • the PCB board 1 is provided with multiple chips 11, the heat sink 2 is provided on the multiple chips 11, and the heat sink 2 includes a heat dissipation air duct 21.
  • the wind deflector 3 is arranged adjacent to the at least one radiator 2, and the wind deflector 3 is located at one side of the at least one radiator 2, and the wind deflector 3 extends along the heat dissipation air duct 21.
  • a plurality of chips 11 are provided on the PCB board 1, and a plurality of heat sinks 2 including heat dissipation air ducts 21 are provided on the plurality of chips 11, so that the chips 11 produce The heat can be directly and fully conducted to the radiator 2.
  • the wind deflector 3 is located on the right side of the plurality of radiators 2, and the extending direction of the wind deflector 3 is consistent with the direction of the heat dissipation air duct 21.
  • the wind deflector 3 can stop the air blown by the fan and prevent the air from flowing out of the gap between the radiator 2 and the chassis wall of the server.
  • the air can be blown out through the heat sink 2 located above the chip 11, so as to take away the heat of the heat sink 2 and discharge the heat out of the server.
  • the windshield 3 when the PCB heat dissipation assembly 100 is applied to the server, the internal air duct of the server can be improved, and the loss of heat dissipation air volume can be reduced, so that more air can pass through the radiator 2 and take away the heat generated by the chip 11. Heat, thereby effectively improving the heat dissipation efficiency of the PCB heat dissipation assembly 100.
  • the wind deflector 3 provided in this way has a simple structure, a small space occupation, and a low cost.
  • the wind deflector 3 by arranging the wind deflector 3 on the side adjacent to the radiator 2 and extending the wind deflector 3 along the heat dissipation duct 21 of the radiator 2, the wind deflector 3 can resist the air It acts as a stop, so that air can flow through the heat sink 2 and fully take away the heat generated by the chip 11, thereby effectively improving the heat dissipation efficiency of the PCB heat dissipation assembly 100.
  • the wind deflector 3 provided in this way has a simple structure, a small space occupation, and a low cost.
  • a wind deflector 4 is provided at one end of the wind deflector 3.
  • the flow direction of the heat dissipation airflow is shown by the arrows in Figure 1, Figure 3 and Figure 5. Therefore, the air guide plate 4 so arranged can play a good role in guiding the air, so that the air can fully flow through the radiator 2 and discharge the heat of the radiator 2 out of the server chassis, which further improves the PCB heat dissipation assembly 100 The heat dissipation efficiency.
  • the wind deflector 3 and the wind deflector 4 may be metal parts or non-metal parts.
  • the distance between the wind deflector 4 and the radiator 2 gradually increases in the direction away from the wind deflector 3.
  • the air can fully flow to the heat sink 2 along the wind deflector 4, so that the heat dissipation efficiency of the PCB heat dissipation assembly 100 can be further improved, and the processing of the wind deflector 4 is facilitated.
  • the wind deflector 3 and the wind deflector 4 are both welded and connected to the PCB board 1.
  • the windshield 3 and the PCB board 1 and the wind deflector 4 and the PCB board 1 can be firmly connected, and the production cost of the PCB heat dissipation assembly 100 can be reduced.
  • the wind deflector 3 and the wind deflector 4 and the PCB board 1 can be welded through-hole or SMT (Surface Mounted Technology abbreviation). There is no need to drill insertion holes for the printed board, and the surface assembly components can be directly attached to the board. Assembly technology that is welded to a specified position on the surface of the printed board) welding, etc.
  • the bottom of the wind deflector 3 is provided with a first flange 31, and the bottom of the wind deflector 4 is provided with a second flange 41.
  • the wind deflector 3 passes through the first flange 31 and the PCB.
  • the board 1 is welded and connected, the air guide plate 4 is welded to the PCB board 1 through the second flange 41, and the first flange 31 and the second flange 41 are spaced apart. Therefore, by providing the first flange 31 and the second flange 41, the connection between the wind deflector 3 and the PCB board 1 and the wind deflector 4 and the PCB board 1 is more reliable.
  • the flanging 41 is arranged at intervals to effectively avoid stress concentration, thereby further ensuring the reliability of welding between the first flanging 31 and the PCB board 1 and the second flanging 41 and the PCB board 1.
  • the wind deflector 3 and the PCB board 1 are threadedly connected.
  • the windshield 3 and the PCB board 1 and the wind deflector 4 and the PCB board 1 can be firmly connected, and the assembly and disassembly are convenient, and the replacement is convenient.
  • At least one mounting base 12 and at least one mounting bar 121 are fixed on the PCB board 1, and the at least one mounting base 12 and at least one mounting bar 121 are spaced apart along the length direction of the windshield 3. It is provided that the wind deflector 3 is screwed to the mounting base 12, at least one mounting bar 121 is opposite to the bottom of the wind deflector 3, and at least one mounting bar 121 is supported between the wind deflector 3 and the PCB board 1.
  • the PCB board 1 is fixed (for example, by SMT welding) with two mounting bases 12 and four mounting bars 121, and the two mounting bases 12 and the four mounting bars 121 are all along the
  • the windshield 3 is arranged at intervals in the length direction, and the spaced installation strips 121 can prevent warping and deformation due to the excessively long length of the installation strips 121, thereby making the connection between the installation strips 121 and the PCB board 1 more reliable.
  • the wind deflector 3 is threadedly connected with the mounting seat 12, and the four mounting bars 121 are all supported in the gap between the wind deflector 3 and the PCB board 1. With this arrangement, the windshield 3 with an uneven bottom can be fixed on the PCB board 1 through the mounting seat 12.
  • the at least one mounting bar 121 can be supported between the windshield 3 and the PCB board 1, preventing the heat dissipation air from being lost from the gap between the windshield 3 and the PCB board 1, thereby further Improve the heat dissipation efficiency of the PCB heat dissipation assembly 100.
  • FIGS 3 and 4 show two mounting bases 12 and four mounting bars 121 for illustrative purposes, but after reading the technical solution of this application, a person of ordinary skill can obviously understand that the solution can be applied to other quantities. In the technical solutions of the mounting base 12 and the mounting bar 121, this also falls within the protection scope of the present disclosure.
  • the thickness of the bottom of the mounting base 12 may be less than the thickness of the mounting bar 121.
  • the examples in Figures 5-7 show two mounting bases 12 and five mounting bars 121.
  • the bottom of the mounting base 12 is roughly L-shaped, and the thickness of the bottom of the two mounting bases 12 is less than that of the mounting bar 121.
  • the part of the windshield 3 opposite to the mounting seat 12 protrudes from the part opposite to the mounting bar 121, so that the bottom of the windshield 3 can contact the mounting seat 12 and the mounting bar 121 to avoid the heat dissipation air volume from The gap between the wind deflector 3 and the mounting seat 12 or the wind deflector 3 and the mounting bar 121 is lost.
  • the thickness of the bottom of the mounting base 12 can also be greater than or equal to the thickness of the mounting bar 121, as long as the bottom of the windshield 3 is in full contact with the mounting bar 121 and the mounting base 12.
  • a connecting plate 122 extending upward is provided on the mounting base 12, and a first nut member 1221 is provided on the side of the connecting plate 122 away from the windshield 3,
  • the first screw 5 passes through the wind deflector 3 and is threadedly connected with the first nut 1221 to fix the wind deflector 3 on the mounting seat 12.
  • a connecting plate 122 is provided on the mounting base 12, and the connecting plate 122 extends vertically upwards.
  • the left side of the connecting plate 122 is provided with a first nut member 1221, and the first nut member 1221 The central axis extends horizontally.
  • the first screw 5 passes through the wind deflector 3 from right to left and is threadedly connected with the first nut member 1221, thereby fixing the wind deflector 3 on the mounting seat 12.
  • the first screw 5 needs to be removed from the first nut member 1221. Therefore, by providing the first nut 1221, while ensuring the structural strength of the connecting plate 122, the structure of the entire PCB heat dissipation assembly 100 is simple, and the assembly and disassembly of the windshield 3 is facilitated.
  • a positioning hole 32 is formed on the wind deflector 3, and a positioning portion 1222 fitted in the positioning hole 32 is provided on the connecting plate 122.
  • the mounting seat 12 is provided with an upwardly extending connecting plate 122, and the positioning portion 1222 is connected to the top of the connecting plate 122 and extends toward the windshield 3.
  • the positioning portion 1222 is extended into the positioning hole 32 of the wind deflector 3, and then the first screw 5 is threaded through the wind deflector 3 and the connecting plate 122 to the first nut 1221, thereby connecting the wind deflector 3 Fixed on the mounting base 12.
  • the windshield 3 can be more stably fixed on the mounting base 12, which is beneficial to improve the heat dissipation efficiency of the PCB heat dissipation assembly 100, and can improve the structural stability of the entire PCB heat dissipation assembly 100.
  • a backing plate 33 is provided on the side of the wind deflector 3 away from the connecting plate 122, and the first screw 5 passes through the backing plate 33, the wind deflector 3 and the first nut member. 1221 threaded connection. Therefore, by providing the backing plate 33, the contact area between the first screw 5 and the windshield 3 can be increased, the windshield 3 can be prevented from shaking, and the windshield 3 can be fixed on the mounting seat 12 more firmly.
  • a horizontally extending support plate 123 is provided on the mounting base 12, at least one matching plate 34 is provided on the wind deflector 3, and the matching plate 34 is provided on the support plate.
  • the second screw 6 passes through the mating plate 34 and is threadedly connected with the supporting plate 123 to fix the wind deflector 3 on the mounting seat 12.
  • the mounting base 12 is provided with a supporting plate 123.
  • the matching plate 34 on the wind deflector 3 is opposed to the supporting plate 123 up and down, and the second screw 6 passes through the matching plate 34 from top to bottom, and is threadedly connected with the supporting plate 123, thereby fixing the wind deflector 3
  • the second screw 6 needs to be disengaged from the supporting plate 123.
  • the structure is equally simple and easy to assemble and disassemble.
  • the mounting base 12 is provided with an upwardly extending extension plate 124, the support plate 123 is connected to the top of the extension plate 124, and a second nut member 1231 is provided on the lower surface of the support plate 123 , The second screw 6 passes through the matching plate 34 and the supporting plate 123 and is threadedly connected to the second nut member 1231.
  • an extension plate 124 is provided on the mounting seat 12, the extension plate 124 extends vertically upward, and two support plates 123 are respectively connected to the tops of the two extension plates 124.
  • the second screw 6 passes through the matching plate 34 and the supporting plate 123 from top to bottom, and is threadedly connected with the second nut 1231 on the lower surface of the supporting plate 123, so as to achieve a firm fixation of the windshield 3.
  • the second screw 6 is disengaged from the second nut 1231.
  • the arrangement of the second nut member 1231 increases the thickness of the support plate 123, ensures the structural strength of the support plate 123, and can realize the firm fixation of the windshield 3.
  • the extension plate 124 includes an extension plate body 1241 and a limiting plate 1242.
  • the wind deflector 3 is provided with an opening 35, and the support plate 123 is fitted at the opening 35.
  • the edge of the opening 35 It fits between the extension board body 1241 and the limiting board 1242.
  • the opening of the opening 35 faces the mounting seat 12.
  • the mating plate 34 is in contact with the supporting plate 123 under the avoidance of the opening 35, and the edge of the opening 35 is located at Between the extension board body 1241 and the limiting board 1242. Therefore, by fitting the edge of the opening 35 between the extension plate body 1241 and the limiting plate 1242, the left and right movement of the wind deflector 3 is restricted, and the stability of the fixing of the wind deflector 3 is further ensured.
  • the server (not shown in the figure) according to the embodiment of the second aspect of the present disclosure includes the PCB heat dissipation assembly 100 according to the embodiment of the first aspect of the present disclosure.
  • a fan is provided on the side of the PCB heat dissipation assembly 100 of the server.
  • the flow direction of the heat dissipation airflow is shown by arrow A in FIG. 1, FIG. 3, and FIG. 5.
  • a part of the heat dissipation airflow flows through the heat dissipation air duct 21 of the radiator 2 and then flows out of the server, thereby taking away the heat conducted by the chip 11 to the radiator 2, and the other part of the heat dissipation airflow flows between the windshield 3 and the radiator 2.
  • the heat dissipation of the chip 11 can also be achieved.
  • the wind deflector 3 can effectively stop the wind blown by the fan, thereby reducing the loss of heat dissipation air volume, improving the heat dissipation efficiency of the PCB heat dissipation assembly 100, and thereby improving the overall performance of the server.
  • the server of the embodiment of the present disclosure by adopting the above-mentioned PCB heat dissipation assembly 100, the heat dissipation efficiency of the server is higher, so that the overall performance of the server can be improved.
  • first feature and second feature may include one or more of these features.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种PCB散热组件(100)和具有其的服务器，PCB散热组件(100)包括：PCB板(1)，PCB板(1)上设有多个芯片(11)；至少一个散热器(2)，散热器(2)设在多个芯片(11)上，散热器(2)包括散热风道(21)；挡风板(3)，挡风板(3)邻近至少一个散热器(2)设置，且挡风板(3)位于至少一个散热器(2)的一侧，挡风板(3)沿散热风道(21)延伸。

Description

PCB散热组件和具有其的服务器 技术领域
本公开涉及散热技术领域，具体而言，涉及一种PCB散热组件和具有其的服务器。
背景技术
连接在PCB(Printed Circuit Board，中文名称为印制电路板，又称印刷线路板，是重要的电子部件，是电子元器件的支撑体，是电子元器件电气连接的载体)板上的多个电子元器件在工作过程中会产生热量，为了使这些热量及时排除，通常在PCB板上设置散热器进行散热。
相关技术中，从风扇吹出的风容易从散热片与机箱之间的缝隙吹出，导致散热效率的降低。
发明内容
本公开旨在至少解决现有技术中存在的技术问题之一。为此，本公开的一个目的在于提出一种PCB散热组件，所述PCB散热组件的具有较高的散热效率。
本公开的另一个目的在于提出一种具有上述PCB散热组件的服务器。
根据本公开第一方面实施例的PCB散热组件，包括：PCB板，所述PCB板上设有多个芯片；至少一个散热器，所述散热器设在多个所述芯片上，所述散热器包括散热风道；挡风板，所述挡风板邻近所述至少一个所述散热器设置，且所述挡风板位于所述至少一个所述散热器的一侧，所述挡风板沿所述散热风道延伸。
根据本公开实施例的PCB散热组件，通过在邻近散热器的一侧设置挡风板，且使挡风板沿散热器的散热风道延伸，挡风板可以对空气起到止挡作用，使空气可以流经散热器，并将芯片产生的热量充分带走，从而有效地提高了PCB散热组件的散热效率。而且，如此设置的挡风板结构简单，占用空间较小，成本较低。
根据本公开的一些示例，所述挡风板的一端设有导风板。
根据本公开的一些示例，沿朝向远离所述挡风板的方向、所述导风板与所述散热器之间的距离逐渐增加。
根据本公开的一些示例，所述挡风板和所述导风板均与所述PCB板焊接连接。
根据本公开的一些示例，所述挡风板的底部设有第一翻边，所述导风板的底部设有第二翻边，所述挡风板通过所述第一翻边与所述PCB板焊接连接，所述导风板通过所述第二翻边与所述PCB板焊接连接，所述第一翻边与所述第二翻边间隔设置。
根据本公开的一些示例，所述挡风板与所述PCB板螺纹连接。
根据本公开的一些示例，所述PCB板上固定有至少一个安装座和至少一个安装条，至少一个所述安装座和至少一个所述安装条沿所述挡风板的长度方向间隔设置，所述挡 风板螺纹连接至所述安装座，至少一个所述安装条与所述挡风板的底部相对，且至少一个所述安装条支撑在所述挡风板与所述PCB板之间。
根据本公开的一些示例，所述安装座上设有向上延伸的连接板，所述连接板的远离所述挡风板的一侧设有第一螺母件，第一螺钉穿过所述挡风板与所述第一螺母件螺纹连接以将所述挡风板固定在所述安装座上。
根据本公开的一些示例，所述挡风板上形成有定位孔，所述连接板上设有配合在所述定位孔内的定位部。
根据本公开的一些示例，所述挡风板的远离所述连接板的一侧设有垫板，所述第一螺钉穿过所述垫板、所述挡风板与所述第一螺母件螺纹连接。
根据本公开的一些示例，所述安装座上设有水平延伸的支撑板，所述挡风板上设有至少一个配合板，所述配合板设在所述支撑板的上表面上，第二螺钉穿过所述配合板与所述支撑板螺纹连接以将所述挡风板固定在所述安装座上。
根据本公开的一些示例，所述安装座上设有向上延伸的延伸板，所述支撑板连接在所述延伸板的顶部，所述支撑板的下表面上设有第二螺母件，第二螺钉穿过所述配合板、所述支撑板与所述第二螺母件螺纹连接。
根据本公开的一些示例，所述延伸板包括延伸板本体和限位板，所述挡风板上设有开口部，所述支撑板配合在所述开口部处，所述开口部的边缘配合在所述延伸板本体与所述限位板之间。
根据本公开第二方面实施例的服务器，包括根据本公开上述第一方面实施例的PCB散热组件。
本公开的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本公开的实践了解到。
附图说明
本公开的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本公开一个实施例的PCB散热组件的立体图；
图2是图1中所示的PCB散热组件的另一个角度的立体图，其中未示出散热器；
图3是根据本公开另一个实施例的PCB散热组件的立体图；
图4是图1中所示的PCB散热组件的***图，其中未示出散热器；
图5是根据本公开再一个实施例的PCB散热组件的立体图；
图6是图5中所示的PCB散热组件的***图，其中未示出散热器；
图7是图6中所示的PCB散热组件的支撑板和延伸板的立体图。
附图标记：
100：PCB散热组件；
1：PCB板；11：芯片；12：安装座；
121：安装条；122：连接板；A：散热气流流动方向；
1221：第一螺母件；1222：定位部；
123：支撑板；1231：第二螺母件；124：延伸板；
1241：延伸板本体；1242：限位板；
2：散热器；21：散热风道；3：挡风板；31：第一翻边；
32：定位孔；33：垫板；34：配合板；35：开口部；
4：导风板；41：第二翻边；5：第一螺钉；6：第二螺钉。
具体实施方式
下面详细描述本公开的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本公开，而不能理解为对本公开的限制。
在本公开的描述中，需要理解的是，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
需要说明的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。进一步地，在本公开的描述中，除非另有说明，“多个”的含义是两个或两个以上。
下面参考图1-图7描述根据本公开第一方面实施例的PCB散热组件100。PCB散热组件100可以应用于服务器(图未示出)，在本申请下面的描述中，以PCB散热组件100应用于服务器为例进行说明。
如图1、图3和图5所示，根据本公开第一方面实施例的PCB散热组件100，包括PCB板1、至少一个散热器2和挡风板3。
具体而言，PCB板1上设有多个芯片11，散热器2设在多个芯片11上，散热器2包括散热风道21。挡风板3邻近上述至少一个散热器2设置，且挡风板3位于上述至少一个散热器2的一侧，挡风板3沿散热风道21延伸。例如，在图1、图3和图5的示例中，多个芯片11设在PCB板1上，多个芯片11上设有多个包括散热风道21的散热器2，以使芯片11产生的热量能够直接且充分地传导至散热器2。挡风板3位于多个散热器2的右侧，且挡风板3的延伸方向与散热风道21的方向一致。当位于PCB板1侧面的风扇(图未示出)工作时，挡风板3可以对风扇吹出的空气起到止挡作用，防止空气从散热器2与服务器的机箱壁之间的缝隙流出，使空气可以经过位于芯片11上方的散热器2吹出，从而带走散热器2的热量，并将热量排出服务器外。由此，通过设置挡风板3，当PCB散热组件100应用于服务器时，可以改善服务器内部风道，减少散热 风量的流失，使更多的空气可以经过散热器2并带走芯片11产生的热量，从而有效提高了PCB散热组件100的散热效率。而且，如此设置的挡风板3结构简单，占用空间较小，成本较低。
根据本公开实施例的PCB散热组件100，通过在邻近散热器2的一侧设置挡风板3，且使挡风板3沿散热器2的散热风道21延伸，挡风板3可以对空气起到止挡作用，使空气可以流经散热器2，并将芯片11产生的热量充分带走，从而有效地提高了PCB散热组件100的散热效率。而且，如此设置的挡风板3结构简单，占用空间较小，成本较低。
在本公开的一些实施例中，参照图1-图6，挡风板3的一端设有导风板4。散热气流的流动方向如图1、图3和图5中的箭头所示。由此，如此设置的导风板4可以对空气起到很好的导向作用，使空气可以充分流经散热器2并将散热器2的热量排出服务器的机箱外，进一步提高了PCB散热组件100的散热效率。其中，挡风板3和导风板4可以为金属件或非金属件。
进一步地，如图1-图6所示，沿朝向远离挡风板3的方向、导风板4与散热器2之间的距离逐渐增加。如此设置，空气可以沿导风板4充分流向散热器2，从而可以进一步提高PCB散热组件100的散热效率，且方便了到导风板4的加工。
可选地，挡风板3和导风板4均与PCB板1焊接连接。由此，可以实现挡风板3与PCB板1以及导风板4与PCB板1的牢靠连接，且可以降低PCB散热组件100的生产成本。
进一步可选地，挡风板3和导风板4与PCB板1可以采用通孔焊接或SMT(Surface Mounted Technology的缩写，无需对印制板钻插装孔，直接将表面组装元器件贴、焊到印制板表面规定位置上的装联技术)焊接等。
进一步地，参照图1和图2，挡风板3的底部设有第一翻边31，导风板4的底部设有第二翻边41，挡风板3通过第一翻边31与PCB板1焊接连接，导风板4通过所述第二翻边41与PCB板1焊接连接，第一翻边31与第二翻边41间隔设置。由此，通过设置第一翻边31和第二翻边41，使挡风板3与PCB板1以及导风板4与PCB板1的连接更加牢靠，通过使第一翻边31与第二翻边41间隔设置，可以有效避免应力集中，从而进一步保证了第一翻边31与PCB板1、第二翻边41与PCB板1之间焊接的牢靠性。
在本公开的另一些实施例中，参照图3-图6，挡风板3与PCB板1螺纹连接。由此，同样可以实现挡风板3与PCB板1以及导风板4与PCB板1的牢靠连接，且装拆方便，便于更换。
进一步地，如图3-图6所示，PCB板1上固定有至少一个安装座12和至少一个安装条121，至少一个安装座12和至少一个安装条121沿挡风板3的长度方向间隔设置，挡风板3螺纹连接至安装座12，至少一个安装条121与挡风板3的底部相对，且至少一个安装条121支撑在挡风板3与PCB板1之间。
例如，在图3和图4的示例中，PCB板1上固定(例如，采用SMT焊接)有两个安 装座12和四个安装条121，两个安装座12和四个安装条121均沿挡风板3的长度方向间隔设置，间隔设置的安装条121可以防止由于安装条121长度过长而产生翘曲变形，从而可以使安装条121与PCB板1的连接更加牢靠。挡风板3与安装座12螺纹连接，四个安装条121均支撑在挡风板3与PCB板1之间的间隙中。如此设置，可以将底部不平的挡风板3通过安装座12固定在PCB板1上。而且，通过设置至少一个安装条121，至少一个安装条121可以支撑在挡风板3与PCB板1之间，防止散热风量从挡风板3与PCB板1之间的间隙流失，从而可以进一步提高PCB散热组件100的散热效率。
图3和图4中显示了两个安装座12和四个安装条121用于示例说明的目的，但是普通技术人员在阅读了本申请的技术方案之后、显然可以理解将该方案应用到其它数量的安装座12和安装条121的技术方案中，这也落入本公开的保护范围之内。
可选地，如图3-图6所示，安装座12的底部的厚度可以小于安装条121的厚度。例如，在图5-图7的示例示出了两个安装座12和五个安装条121，安装座12的底部大致呈L型，两个安装座12的底部的厚度均小于安装条121的厚度，相应地，挡风板3的与安装座12相对的部分凸出与安装条121相对的部分，从而使挡风板3的底部可以与安装座12、安装条121接触，避免散热风量从挡风板3与安装座12或挡风板3与安装条121之间的缝隙流失。当然，安装座12的底部的厚度还可以大于或等于安装条121的厚度，只要挡风板3的底部与安装条121、安装座12可以充分接触即可。
在本公开的一些具体实施例中，参照图3和图4，安装座12上设有向上延伸的连接板122，连接板122的远离挡风板3的一侧设有第一螺母件1221，第一螺钉5穿过挡风板3与第一螺母件1221螺纹连接以将挡风板3固定在安装座12上。例如，在图3和图4的示例中，安装座12上设有连接板122，连接板122竖直向上延伸，连接板122的左侧设有第一螺母件1221，第一螺母件1221的中心轴线水平延伸。安装时，第一螺钉5从右向左穿过挡风板3与第一螺母件1221螺纹连接，从而将挡风板3固定在安装座12上。当需要拆卸挡风板3时，只需将第一螺钉5从第一螺母件1221上拆下。由此，通过设置第一螺母件1221，在保证连接板122的结构强度的同时，使整个PCB散热组件100的结构简单，且方便挡风板3的装拆。
可选地，参照图3和图4，挡风板3上形成有定位孔32，连接板122上设有配合在定位孔32内的定位部1222。例如，在图3和图4的示例中，安装座12上设有向上延伸的连接板122，定位部1222连接在连接板122的顶部且朝向挡风板3延伸。安装时，使定位部1222伸入挡风板3的定位孔32内，然后使第一螺钉5穿过挡风板3和连接板122与第一螺母件1221螺纹连接，从而将挡风板3固定在安装座12上。由此，通过设置定位部1222，使挡风板3能够更加稳定地固定在安装座12上，有利于提高PCB散热组件100的散热效率，且可以提高整个PCB散热组件100的结构稳定性。
可选地，如图3和图4所示，挡风板3的远离连接板122的一侧设有垫板33，第一螺钉5穿过垫板33、挡风板3与第一螺母件1221螺纹连接。由此，通过设置垫板33，可以增加第一螺钉5与挡风板3的接触面积，防止挡风板3产生晃动，使挡风板3可以 更加牢靠地固定在安装座12上。
在本公开的另一些实施例中，参照图5-图7，安装座12上设有水平延伸的支撑板123，挡风板3上设有至少一个配合板34，配合板34设在支撑板123的上表面上，第二螺钉6穿过配合板34与支撑板123螺纹连接以将挡风板3固定在安装座12上。例如，在图5-图7的示例中，安装座12上设有支撑板123。安装时，使挡风板3上的配合板34与支撑板123上下相对，使第二螺钉6从上到下穿过配合板34，并与支撑板123螺纹连接，从而将挡风板3固定在安装座12上，拆卸时，只需使第二螺钉6与支撑板123脱离配合。由此，结构同样简单，便于装拆。
进一步地，如图5-图7所示，安装座12上设有向上延伸的延伸板124，支撑板123连接在延伸板124的顶部，支撑板123的下表面上设有第二螺母件1231，第二螺钉6穿过配合板34、支撑板123与第二螺母件1231螺纹连接。例如，在图5-图7的示例中，安装座12上设有延伸板124，延伸板124竖直向上延伸，两个支撑板123分别连接在两个延伸板124的顶部。安装时，使第二螺钉6从上到下穿过配合板34与支撑板123，并与支撑板123下表面的第二螺母件1231螺纹连接，从而实现挡风板3的牢靠固定，拆卸时，使第二螺钉6与第二螺母件1231脱离配合。由此，第二螺母件1231的设置增加了支撑板123的厚度，保证了支撑板123的结构强度，且可以实现挡风板3的牢靠固定。
进一步地，参照图5-图7，延伸板124包括延伸板本体1241和限位板1242，挡风板3上设有开口部35，支撑板123配合在开口部35处，开口部35的边缘配合在延伸板本体1241与限位板1242之间。例如，在图5-图7的示例中，开口部35的开口朝向安装座12，安装时，配合板34在开口部35的避让作用下与支撑板123接触，且开口部35的边缘位于在延伸板本体1241与限位板1242之间。由此，通过使开口部35的边缘配合在延伸板本体1241与限位板1242之间，限定了挡风板3左右方向的运动，进一步保证了挡风板3固定的牢靠性。
根据本公开第二方面实施例的服务器(图未示出)，包括根据本公开上述第一方面实施例的PCB散热组件100。例如，在服务器的PCB散热组件100的侧面设有风扇，当风扇工作时，散热气流的流动方向如图1、图3和图5中的箭头A所示。其中，一部分散热气流流经散热器2的散热风道21后流出服务器，从而带走芯片11传导至散热器2的热量，另一部分散热气流从挡风板3与散热器2之间流过，同样可以实现芯片11的散热。如此设置，挡风板3可以对风扇吹出的风起到很好的止挡作用，从而可以减小散热风量的流失，提升PCB散热组件100的散热效率，进而提升服务器的整体性能。
根据本公开实施例的服务器，通过采用上述PCB散热组件100，使服务器的散热效率较高，从而可以提升服务器的整体性能。
根据本公开实施例的服务器的其他构成以及操作对于本领域普通技术人员而言都是已知的，这里不再详细描述。
在本公开的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、 “宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
在本公开的描述中，“第一特征”、“第二特征”可以包括一个或者更多个该特征。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本公开的实施例，本领域的普通技术人员可以理解：在不脱离本公开的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本公开的范围由权利要求及其等同物限定。

Claims (14)

  1. 一种PCB散热组件，其特征在于，包括：
    PCB板，所述PCB板上设有多个芯片；
    至少一个散热器，所述散热器设在多个所述芯片上，所述散热器包括散热风道；
    挡风板，所述挡风板邻近所述至少一个所述散热器设置，且所述挡风板位于所述至少一个所述散热器的一侧，所述挡风板沿所述散热风道延伸。
  2. 根据权利要求1所述的PCB散热组件，其特征在于，所述挡风板的一端设有导风板。
  3. 根据权利要求2所述的PCB散热组件，其特征在于，沿朝向远离所述挡风板的方向、所述导风板与所述散热器之间的距离逐渐增加。
  4. 根据权利要求2或3所述的PCB散热组件，其特征在于，所述挡风板和所述导风板均与所述PCB板焊接连接。
  5. 根据权利要求4所述的PCB散热组件，其特征在于，所述挡风板的底部设有第一翻边，所述导风板的底部设有第二翻边，所述挡风板通过所述第一翻边与所述PCB板焊接连接，所述导风板通过所述第二翻边与所述PCB板焊接连接，所述第一翻边与所述第二翻边间隔设置。
  6. 根据权利要求1-3中任一项所述的PCB散热组件，其特征在于，所述挡风板与所述PCB板螺纹连接。
  7. 根据权利要求6所述的PCB散热组件，其特征在于，所述PCB板上固定有至少一个安装座和至少一个安装条，至少一个所述安装座和至少一个所述安装条沿所述挡风板的长度方向间隔设置，所述挡风板螺纹连接至所述安装座，至少一个所述安装条与所述挡风板的底部相对，且至少一个所述安装条支撑在所述挡风板与所述PCB板之间。
  8. 根据权利要求7所述的PCB散热组件，其特征在于，所述安装座上设有向上延伸的连接板，所述连接板的远离所述挡风板的一侧设有第一螺母件，第一螺钉穿过所述挡风板与所述第一螺母件螺纹连接以将所述挡风板固定在所述安装座上。
  9. 根据权利要求8所述的PCB散热组件，其特征在于，所述挡风板上形成有定位孔，所述连接板上设有配合在所述定位孔内的定位部。
  10. 根据权利要求8所述的PCB散热组件，其特征在于，所述挡风板的远离所述连接板的一侧设有垫板，所述第一螺钉穿过所述垫板、所述挡风板与所述第一螺母件螺纹连接。
  11. 根据权利要求7所述的PCB散热组件，其特征在于，所述安装座上设有水平延伸的支撑板，
    所述挡风板上设有至少一个配合板，所述配合板设在所述支撑板的上表面上，第二螺钉穿过所述配合板与所述支撑板螺纹连接以将所述挡风板固定在所述安装座上。
  12. 根据权利要求11所述的PCB散热组件，其特征在于，所述安装座上设有向上延伸的延伸板，所述支撑板连接在所述延伸板的顶部，所述支撑板的下表面上设有第二螺母件，第二螺钉穿过所述配合板、所述支撑板与所述第二螺母件螺纹连接。
  13. 根据权利要求12所述的PCB散热组件，其特征在于，所述延伸板包括延伸板本体和限位板，
    所述挡风板上设有开口部，所述支撑板配合在所述开口部处，所述开口部的边缘配合在所述延伸板本体与所述限位板之间。
  14. 一种服务器，其特征在于，包括根据权利要求1-13中任一项所述的PCB散热组件。
PCT/CN2019/114832 2019-10-31 2019-10-31 Pcb散热组件和具有其的服务器 WO2021081927A1 (zh)

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