CN101998810B - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN101998810B
CN101998810B CN200910306145.3A CN200910306145A CN101998810B CN 101998810 B CN101998810 B CN 101998810B CN 200910306145 A CN200910306145 A CN 200910306145A CN 101998810 B CN101998810 B CN 101998810B
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fan
radiator
clamping part
flange
heat abstractor
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Expired - Fee Related
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CN200910306145.3A
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CN101998810A (zh
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廉志晟
邓根平
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Scienbizip Consulting Shenzhen Co Ltd
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Scienbizip Consulting Shenzhen Co Ltd
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Priority to US12/581,175 priority patent/US8256500B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置包括一散热器、一置于散热器上的风扇及固定该风扇的支架，所述风扇具有一凸缘，所述支架底部与散热器的底部固定连接，顶部朝风扇延伸出至少一对间隔的卡扣部，该卡扣部套设在所述风扇的凸缘上，将所述风扇固定到所述散热器上。与现有技术相比，本发明散热装置通过支架上的卡扣部套设在风扇的凸缘上，可将风扇方便地组装到散热器上或从散热器上快捷地拆卸，简化了散热装置的拆装。

Description

散热装置
技术领域
本发明涉及一种散热装置，特别是指一种具有风扇支架的散热装置。
背景技术
安装于电路板上的电子元器件在运行时会产生大量的热量，这些热量如果不能被有效地散去，将直接导致温度急剧上升，而严重影响到电子元器件的工作性能及寿命。为此，通常在电子元器件上安装一散热装置来进行散热。
传统的散热装置包括一散热器及一通过螺钉固定在散热器上的风扇。该散热装置使用一段时间后，在散热器表面会附着一层尘埃。由于尘埃的导热性能极差，会对散热装置的散热性能造成影响，同时也会对风扇寿命造成影响。所以需要将风扇从散热器上拆卸下来，对散热器表面的尘埃进行清除，但由于风扇是采用锁螺丝的方式与散热器连接，风扇的拆卸很不方便。
发明内容
有鉴于此，有必要提供一种便于拆卸和组装的散热装置。
一种散热装置包括一散热器、一置于散热器上的风扇及固定该风扇的支架，所述风扇具有一凸缘，所述支架底部与散热器的底部固定连接，顶部朝风扇延伸出至少一对间隔的卡扣部，该卡扣部套设在所述风扇的凸缘上，将所述风扇固定到所述散热器上。
与现有技术相比，本发明散热装置通过支架上的卡扣部套设在风扇的凸缘上，可将风扇方便地组装到散热器上或从散热器上快捷地拆卸，简化了散热装置的拆装。
附图说明
图1是本发明一个实施例中散热装置的立体组装图。
图2是图1中散热装置的立体分解图。
图3是图2中散热装置的风扇和支架的倒视图。
具体实施方式
如图1所示，本发明一实施例的散热装置包括一散热器10、一置于散热器10上的风扇20及将风扇20固定在散热器10上的二相对设置的支架30。
如图2所示，散热器10包括一导热基座12、设置在该导热基座12上的一鳍片组14及将基座12和鳍片组14连接的三热管16。所述鳍片组14由若干平行、间隔排列的鳍片18连接而成，该鳍片18可采用铜片或铝片等导热性能良好的材料制成。鳍片组14中及鳍片组14与基座12之间分别开设通道13，三热管16的两端对应***通道13内。基座12前后侧的边缘各开设二锁固孔122，在本实施例中，该锁固孔122为螺孔。基座12呈矩形板状，并由诸如铜、铝等导热性能良好的材料制成，其四角处向外延伸出四扣耳124，四柱状扣件126安装在该四扣耳124上。
所述风扇20包括二相互平行的上、下凸缘22、24，其中，下凸缘24四角处的顶部及底部均开设四扣槽26。
每一支架30优选地由塑料材料制成，其包括一横杆31以及二连接杆32，该二连接杆32从该横杆31两端向下且相向倾斜延伸，以使二连接杆32末端的间距与上述散热器10的导热基座12侧面的锁固孔122的位置对应。可以理解地，当导热基座12的尺寸足够大时，该二连接杆32也可垂直向下延伸。每一连接杆32的末端均设有一竖直向下延伸的结合部35，每一结合部35上均开设有一通孔300，以供一锁固件38穿过，而将该连接杆32锁固至散热器10的导热基座12上。所述横杆31的两端部内侧各向内延伸出二上下间隔相对的卡扣部34，该二卡扣部34具有弹性。每一卡扣部34均包括一弹性延伸臂342及自延伸臂342末端内侧凸伸出的一卡块344，该卡块344在本实施例中呈倒钩状。二相对的卡扣部34的延伸臂342间距略大于上述风扇20的下凸缘24的厚度，以便可套设在该下凸缘24上。在上述二卡扣部34中位于下侧的卡扣部34的下方设有一加强筋36，该加强筋36呈直角三角形，并将该卡扣部34与连接杆32相连。
组装该散热装置时，首先使风扇20的下凸缘24抵触支架30的卡扣部34的延伸臂342，使卡扣部34的延伸臂342向外弹性形变，使卡块344卡入风扇20下凸缘24的扣槽26内，同时将散热器10的各组件组装在一起，然后将连接有风扇20的支架30向下朝散热器10移动，使支架30底部的二通孔300对准散热器10基座12的四锁固孔122，四锁固件38穿过通孔300锁入锁固孔122内，从而将风扇20安装在散热器10上。将风扇20从散热器10上拆卸时，仅需扳动支架30卡扣部34的延伸臂342，使延伸臂342向外弹性变形而使卡块344脱离风扇20的扣槽26，即可将风扇20从散热器10上拆卸。
与现有技术相比，本发明散热装置通过支架30上的卡扣部34卡入风扇20开设的扣槽26内，可将风扇20方便地组装到散热器10上或从散热器10上快捷地拆卸，简化了散热装置的拆装。并且本发明的支架30由塑料制成，比由金属制成的支架更节省成本。

Claims (5)

1.一种散热装置包括一散热器、一置于散热器上的风扇及固定该风扇的支架，所述风扇具有一凸缘，其特征在于：所述支架底部与散热器的底部固定连接，顶部朝风扇延伸出至少一对上下间隔相对的卡扣部，该卡扣部套设在所述风扇的凸缘上，将所述风扇固定到所述散热器上，所述支架包括一横杆及从该横杆两端向下延伸的二连接杆，所述横杆的两端部朝向风扇各延伸出所述一对上下间隔相对的卡扣部，所述卡扣部具有弹性，每一卡扣部包括一弹性延伸臂及自延伸臂末端内侧凸伸出的一卡块，该风扇的凸缘的顶部及底部均开设扣槽，每一对上下间隔相对的卡扣部的卡块分别对应卡入风扇的凸缘的顶部及底部开设的扣槽内，将风扇的凸缘夹置在每一对上下相对的卡扣部之间。
2.如权利要求1所述的散热装置，其特征在于：所述散热器包括一基座及一结合于基座的鳍片组，鳍片组包括若干相连接的鳍片，基座上开设若干锁固孔，所述支架底部开设有与所述锁固孔相配合的通孔，以供锁固件穿过从而将支架底部与散热器的基座固定连接。
3.如权利要求2所述的散热装置，其特征在于：所述散热器还包括若干热管，所述鳍片组及鳍片组与基座之间分别开设若干通道，所述热管的两端对应***所述通道内。
4.如权利要求1所述的散热装置，其特征在于：所述支架由塑料制成。
5.如权利要求1所述的散热装置，其特征在于：所述一对间隔相对的卡扣部中位于下侧的卡扣部的下方设有一加强筋，该加强筋将该卡扣部与连接杆相连。
CN200910306145.3A 2009-08-27 2009-08-27 散热装置 Expired - Fee Related CN101998810B (zh)

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CN200910306145.3A CN101998810B (zh) 2009-08-27 2009-08-27 散热装置
US12/581,175 US8256500B2 (en) 2009-08-27 2009-10-19 Heat dissipation device having support brackets with buckles to support the fan

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CN200910306145.3A CN101998810B (zh) 2009-08-27 2009-08-27 散热装置

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9599274B2 (en) * 2012-12-31 2017-03-21 Raytheon Company Multi-stage thermal isolator for focal plane arrays and other devices
CN104589787A (zh) * 2015-02-06 2015-05-06 胡和萍 一种单色移印机散热模组
CN108135109B (zh) * 2017-12-20 2024-03-29 珠海英搏尔电气股份有限公司 风机总成、电机控制器和电动车

Citations (2)

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Publication number Priority date Publication date Assignee Title
CN2479565Y (zh) * 2001-01-31 2002-02-27 赐得利企业有限公司 电脑散热器的风扇锁扣装置
CN101460037A (zh) * 2007-12-14 2009-06-17 富准精密工业(深圳)有限公司 散热装置

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US5495392A (en) * 1995-03-06 1996-02-27 Shen; Tsan-Jung CPU heat dissipating apparatus
US5854738A (en) * 1997-05-30 1998-12-29 Intel Corporation Apparatus for supporting a cooling assembly coupled to an integrated circuit
TW511880U (en) * 2002-01-18 2002-11-21 Foxconn Prec Components Co Ltd Assembly of heat dissipation apparatus
TW584260U (en) * 2002-06-28 2004-04-11 Hon Hai Prec Ind Co Ltd Heat sink device
TWI255689B (en) * 2003-12-16 2006-05-21 Asia Vital Components Co Ltd Structure and manufacturing method of heat sink module
CN101854790B (zh) * 2009-03-30 2013-07-03 鸿富锦精密工业（深圳）有限公司 散热装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2479565Y (zh) * 2001-01-31 2002-02-27 赐得利企业有限公司 电脑散热器的风扇锁扣装置
CN101460037A (zh) * 2007-12-14 2009-06-17 富准精密工业(深圳)有限公司 散热装置

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CN101998810A (zh) 2011-03-30
US8256500B2 (en) 2012-09-04

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