CN101998810B - 散热装置 - Google Patents
散热装置 Download PDFInfo
- Publication number
- CN101998810B CN101998810B CN200910306145.3A CN200910306145A CN101998810B CN 101998810 B CN101998810 B CN 101998810B CN 200910306145 A CN200910306145 A CN 200910306145A CN 101998810 B CN101998810 B CN 101998810B
- Authority
- CN
- China
- Prior art keywords
- fan
- radiator
- clamping part
- flange
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 230000002787 reinforcement Effects 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (5)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910306145.3A CN101998810B (zh) | 2009-08-27 | 2009-08-27 | 散热装置 |
US12/581,175 US8256500B2 (en) | 2009-08-27 | 2009-10-19 | Heat dissipation device having support brackets with buckles to support the fan |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910306145.3A CN101998810B (zh) | 2009-08-27 | 2009-08-27 | 散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101998810A CN101998810A (zh) | 2011-03-30 |
CN101998810B true CN101998810B (zh) | 2015-03-25 |
Family
ID=43623106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910306145.3A Expired - Fee Related CN101998810B (zh) | 2009-08-27 | 2009-08-27 | 散热装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8256500B2 (zh) |
CN (1) | CN101998810B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9599274B2 (en) * | 2012-12-31 | 2017-03-21 | Raytheon Company | Multi-stage thermal isolator for focal plane arrays and other devices |
CN104589787A (zh) * | 2015-02-06 | 2015-05-06 | 胡和萍 | 一种单色移印机散热模组 |
CN108135109B (zh) * | 2017-12-20 | 2024-03-29 | 珠海英搏尔电气股份有限公司 | 风机总成、电机控制器和电动车 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2479565Y (zh) * | 2001-01-31 | 2002-02-27 | 赐得利企业有限公司 | 电脑散热器的风扇锁扣装置 |
CN101460037A (zh) * | 2007-12-14 | 2009-06-17 | 富准精密工业(深圳)有限公司 | 散热装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5495392A (en) * | 1995-03-06 | 1996-02-27 | Shen; Tsan-Jung | CPU heat dissipating apparatus |
US5854738A (en) * | 1997-05-30 | 1998-12-29 | Intel Corporation | Apparatus for supporting a cooling assembly coupled to an integrated circuit |
TW511880U (en) * | 2002-01-18 | 2002-11-21 | Foxconn Prec Components Co Ltd | Assembly of heat dissipation apparatus |
TW584260U (en) * | 2002-06-28 | 2004-04-11 | Hon Hai Prec Ind Co Ltd | Heat sink device |
TWI255689B (en) * | 2003-12-16 | 2006-05-21 | Asia Vital Components Co Ltd | Structure and manufacturing method of heat sink module |
CN101854790B (zh) * | 2009-03-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
-
2009
- 2009-08-27 CN CN200910306145.3A patent/CN101998810B/zh not_active Expired - Fee Related
- 2009-10-19 US US12/581,175 patent/US8256500B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2479565Y (zh) * | 2001-01-31 | 2002-02-27 | 赐得利企业有限公司 | 电脑散热器的风扇锁扣装置 |
CN101460037A (zh) * | 2007-12-14 | 2009-06-17 | 富准精密工业(深圳)有限公司 | 散热装置 |
Also Published As
Publication number | Publication date |
---|---|
US20110048678A1 (en) | 2011-03-03 |
CN101998810A (zh) | 2011-03-30 |
US8256500B2 (en) | 2012-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SCIENBIZIP CONSULTING (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD. Effective date: 20150217 Free format text: FORMER OWNER: HONGZHUN PRECISION INDUSTRY CO., LTD. Effective date: 20150217 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150217 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. Applicant before: Foxconn Precision Industry Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20150827 |
|
EXPY | Termination of patent right or utility model |