WO2021057236A1 - 一种电路板及电子设备 - Google Patents

一种电路板及电子设备 Download PDF

Info

Publication number
WO2021057236A1
WO2021057236A1 PCT/CN2020/104974 CN2020104974W WO2021057236A1 WO 2021057236 A1 WO2021057236 A1 WO 2021057236A1 CN 2020104974 W CN2020104974 W CN 2020104974W WO 2021057236 A1 WO2021057236 A1 WO 2021057236A1
Authority
WO
WIPO (PCT)
Prior art keywords
hollow
circuit board
bending
area
bending area
Prior art date
Application number
PCT/CN2020/104974
Other languages
English (en)
French (fr)
Inventor
朱福建
丁海幸
乔吉涛
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021057236A1 publication Critical patent/WO2021057236A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • This application relates to the field of circuit boards, and in particular to a circuit board and electronic equipment.
  • Sliding cover phones and folding screens are concept phones that are popular in the market recently. They have larger screens and are therefore popular among consumers.
  • the main board connections on both sides of the folding machine basically adopt the following methods to realize the foldable and electrical performance transmission characteristics: the foldable is realized by the back cable Features, or connect two circuit boards separately through the FPC adapter board to achieve foldable features.
  • the application provides a circuit board and electronic equipment to improve the reliability of the electronic equipment.
  • a circuit board is provided, and the circuit board is applied to a foldable electronic device, such as a mobile phone or a notebook computer.
  • the circuit board includes a circuit board body, and the circuit board body is divided into a plurality of areas, which are respectively an assembly area and a bending area.
  • the circuit board body includes at least two assembling areas, and any two assembling areas are connected by bending areas, and each bending area and the two connecting assembling areas are arranged along the first direction.
  • each bending area is provided with multiple rows of first hollow components, and the multiple rows of first hollow components are arranged along the first direction.
  • the circuit board can be bent directly by the first hollow component provided, so there is no need to provide special bending parts.
  • the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device. Compared with the prior art adopting the cooperation of the main board and the flexible circuit board to achieve bending, there is no need to specially set the bending structure, and the reliability of the main board connection is improved.
  • the first hollow component includes a first hollow structure and a second hollow structure, and the first hollow structure and the second hollow structure are arranged in a single row along the second direction; wherein, The second direction and the first direction are at a set angle.
  • the specific first hollow structure and the second hollow structure are adopted to improve the bending effect of the circuit board.
  • the second direction is perpendicular to the first direction.
  • the second direction and the first direction may be at a certain other angle, such as different angles such as 60°, 80°, and 120°.
  • the length directions of the first hollow structure and the second hollow structure are the same as the second direction. Improve the flexibility of the bending zone.
  • each first hollow component includes two first hollow structures, and at least one second hollow structure, and at least one second hollow structure is located in the two hollow structures. Between the first hollow structure.
  • the lengths of the first hollow structures in adjacent first hollow components are different.
  • the hollow structure of different lengths improves the flexibility of the bending zone.
  • the length of the hollow structure provided in the embodiment of the present application can also be selected to be the same.
  • a second hollow component is also arranged in each bending area, and the first hollow component and the second hollow component are alternately arranged.
  • the second hollow component further improves the flexibility of the bending zone and improves the bending effect of the bending zone.
  • the second hollow component includes a second hollow structure.
  • the second hollow structure is provided to improve the flexibility of the bending zone.
  • each second hollow component may include one second hollow structure, or may include two or more second hollow structures. Wherein, the two second hollow structures are arranged along the second direction.
  • the first hollow structure is a hollow notch
  • the second hollow structure is a hollow hole.
  • the hollow holes of the first hollow component and the hollow holes of the second hollow component are arranged staggered. Through the staggered arrangement, the flexibility of the bending area is improved.
  • each hollow hole includes a long waist hole and a first reaming hole communicating with the long waist hole, and the diameter of the first reaming hole is larger than the width of the long waist hole.
  • each hollowed-out notch includes a notch and a second reaming hole communicating with the notch, and the diameter of the second reaming hole is larger than the width of the notch.
  • each bending area located on both sides of each bending area are respectively provided with a first connection end and a second connection end; each bending area is provided with a connection between the first connection end and the The wiring of the second connecting end, wherein the wiring goes around the plurality of first hollow components. Convenient for laying and routing.
  • the width of at least one of the bending areas is smaller than the width of the assembly area connected to the bending area in the first direction; or, the width of at least one of the bending areas is The width is equal to the width of the assembly area connected by the bending area.
  • a method for manufacturing a circuit board includes: dividing a bending area and an assembly area on the circuit board body; setting a plurality of first hollow components in the bending area, and a plurality of first hollow components A hollow component is arranged along the first direction.
  • the circuit board can be bent directly by the provided first hollow component, so there is no need to provide special bending parts, and the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device.
  • the main board and the flexible circuit board to achieve bending there is no need to specially set the bending structure, and the reliability of the main board connection is improved.
  • the opening a plurality of first hollow components in the bending area includes: opening a first hollow structure and a second hollow structure in the bending area; wherein, the first hollow structure and the second hollow structure The structures are arranged in a single row along the second direction. The first hollow structure and the second hollow structure improve the flexibility of the bending area.
  • the method further includes opening second hollow components between the first hollow components, and the first hollow components and the second hollow components are alternately arranged.
  • the second hollow component further improves the flexibility of the bending zone.
  • the opening of the second hollow component specifically refers to the opening of at least one second hollow structure.
  • the opening of the first hollow structure is specifically: opening a gap in the bending area, opening a second reaming hole at the closed end of the gap, and the diameter of the second reaming hole is greater than the width of the gap.
  • the second reaming improves the stress concentration of the first hollow structure.
  • the opening of the second hollow structure specifically includes: opening a long waist hole in the bending area, and opening first reaming holes at both ends of the long waist hole, and the diameter of the first reaming hole is larger than The width of the long waist hole.
  • the first reaming improves the stress concentration of the second hollow structure.
  • an electronic device in a third aspect, includes the circuit board described in any one of the above, and further includes a housing fixedly connected to each assembly area.
  • the electronic device includes the circuit board described in any one of the above, and further includes a housing fixedly connected to each assembly area.
  • the circuit board can be bent directly by the first hollow component provided, so there is no need to provide special bending parts.
  • the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device. Compared with the prior art adopting the cooperation of the main board and the flexible circuit board to achieve bending, there is no need to specially set the bending structure, and the reliability of the main board connection is improved.
  • FIG. 1a is a schematic diagram of an expanded state of a mobile terminal provided by an embodiment of the application.
  • FIG. 1b is a schematic diagram of a folded state of a mobile terminal according to an embodiment of the application.
  • FIG. 2 is a schematic diagram of the first circuit board provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of the structure of a bending area provided by an embodiment of the application.
  • FIG. 4 is a schematic structural diagram of a first hollow component provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of the structure of a hollow gap provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of the structure of a hollow hole provided by an embodiment of the application.
  • FIG. 7 is a schematic structural diagram of another first hollow component provided by an embodiment of the application.
  • FIG. 8 is a schematic structural diagram of a second hollow component provided by an embodiment of the application.
  • 9-12 are schematic diagrams of the bending of the circuit board provided by the embodiments of the application.
  • FIG. 13 is a schematic structural diagram of a second type of circuit board provided by an embodiment of the application.
  • FIG. 14 is a schematic structural diagram of a third circuit board provided by an embodiment of the application.
  • the circuit board is applied to foldable electronic devices, such as mobile phones, PDAs, notebook computers, or tablet computers.
  • foldable electronic devices such as mobile phones, PDAs, notebook computers, or tablet computers.
  • FIG. 1a the structure shown in FIG. 1a: a first housing 200, a rotating shaft mechanism 100, a second housing 300, and a flexible screen 400 fixed on the first housing 200 and the second housing 300.
  • the first housing 200, the rotating shaft mechanism 100, and the second housing 300 are arranged along the direction shown by the line b, and the rotating shaft mechanism 100 is connected to the first housing 200 and the second housing 300, respectively.
  • the housing 200 and the second housing 300 can rotate around the axis of the shaft mechanism 100 (direction shown by the line a), and the flexible screen 400 covers the first housing 200, the second housing 300 and the shaft mechanism 100, and They are adhesively connected to the first housing 200 and the second housing 300 respectively.
  • the mobile terminal includes two states: an expanded state and a folded state. As shown in FIG. 1a, when the mobile terminal is unfolded, the first housing 200 and the second housing 300 are arranged separately on both sides of the hinge mechanism 100, and the flexible screen 400 is unfolded at this time. When bending, the first housing 200 and the second housing 300 rotate relative to the rotating shaft mechanism 100, and after being folded, the state shown in FIG. 1b is formed.
  • the first housing 200 and the second housing 300 are stacked relative to each other, and The flexible screen 400 (not shown in the figure) is bent following the first housing 200 and the second housing 300.
  • Figure 1b shows a folding method in which the flexible screen 400 is located inside the mobile terminal, but the mobile terminal provided by the embodiment of the present application is not limited to the folding method shown in Figure 1b, and a manner in which the flexible screen 400 is exposed after being folded may also be used. fold.
  • Rigid circuit boards carrying electronic devices (such as cameras and chips) are respectively arranged in the first housing 200 and the second housing 300 of the mobile phone.
  • the flexible circuit board is often used in the prior art.
  • the connection between the rigid circuit board and the flexible circuit board is prone to failure after multiple pulls. Therefore, the embodiment of the present application provides a circuit board.
  • the structure of the circuit board will be described in detail below with reference to the accompanying drawings.
  • FIG. 2 shows the specific structure of a circuit board provided by an embodiment of the present application.
  • the circuit board shown in FIG. 2 includes a circuit board body, and the circuit board body is divided into three areas.
  • the first assembly area 10 and the second assembly area 30 are respectively used to carry electronic devices
  • the bending area 20 is used to connect the first assembly area 10 and the second assembly area 30.
  • the first assembly area 10 is fixed in the first housing
  • the second assembly area 30 is fixed in the second housing
  • the bending area 20 bypasses the first housing and the second housing and merges
  • the first assembly area 10 and the second assembly area 30 are connected.
  • the first assembly area 10, the second assembly area 30 and the bending area 20 are arranged along the first direction, and the bending area 20 is located between the first assembly area 10 and the second assembly area 30.
  • the first direction is a direction perpendicular to the axis of the rotating cable when the mobile terminal is folded.
  • the straight line a is the axis of the mobile terminal's rotating cable;
  • the straight line b is the first direction.
  • the width of the bending area 20 is smaller than the width of the first assembly area 10 and the second assembly area 30 connected by the bending area 20.
  • the first assembly area 10 and the second assembly area 30 located on both sides of the bending area 20 are respectively provided with a first connecting end 40 and a second connecting end 50; as shown in FIG. 2, the first assembly area 10 is provided with a first connection end 40, the second assembly area 30 is provided with a second connection end 50, and the bending area 20 is provided with a wire 60 connecting the first connection end 40 and the second connection end 50, through the wire 60
  • the first assembly area 10 is connected to the second assembly area 30.
  • the electrical components on the first assembly area 10 and the electrical components of the second assembly area 30 can be electrically connected and signal connected through the wiring 60.
  • connection mode of the components can be common connection modes in the prior art, which will not be repeated here, and this application only limits the arrangement mode of the wiring in the bending area.
  • the electrical devices on the first assembly area 10 and the second assembly area 30 may be chips, inductors, capacitors, or other electrical devices in a mobile terminal.
  • FIG. 3 shows the specific structure of the bending area 20 of the circuit board.
  • the circuit board provided by the embodiment of the present application has an integrated structure, the first assembly area 10, the second assembly area 30 and the folding
  • the bent area 20 is a different area on the circuit board. Since the first assembly area 10, the second assembly area 30 and the bending area 20 have the same layer structure, the rigidity of the first assembly area 10 and the second assembly area 30 are the same. Since the bending area 20 is provided with the first hollow component 21 and the second hollow component 22, the rigidity of the bending area 20 is reduced, so that the rigidity of the first bending area 20 is smaller than that of the first assembly area 10 and the second assembly area.
  • the bending zone 20 is rigid, and the flexibility of the bending area 20 is greater than that of the first assembly area 10 and the second assembly area 30, so that the bending area 20 can achieve a bending effect.
  • the specific structure of the bending zone 20 will be described in detail below with reference to the accompanying drawings.
  • the direction shown by the straight line b is the first direction.
  • the bending area provided by the embodiment of the present application includes a plurality of first hollow components 21 and a plurality of second hollow components 22, wherein the plurality of first hollow components 21 and the plurality of second hollow components 22 are arranged along the first direction.
  • the plurality of first hollow components 21 and the plurality of second hollow components 22 are arranged in a single row along the first direction, and the first hollow components 21 and the second hollow components 22 are alternately arranged, that is, two first hollow components
  • the spacing arrangement of the first hollow component 21 and the second hollow component 22 is specifically limited.
  • two second hollow components 22 can be spaced between the two first hollow components 21; or the order is as follows: two first hollow components 21.
  • first gap (not marked in the figure) between any adjacent first hollow component 21 and second hollow component 22, so that the bending area will not be broken.
  • the width of the first gap between the first hollow components 21 in the first direction can be set according to needs, such as different widths such as 0.1mm, 0.5mm, 1mm, 2mm, etc.
  • the two first gaps are not aligned.
  • the first gap between the hollow component 21 and the second hollow component 22 is specifically limited, and different first gaps can be designed according to actual needs.
  • the above-mentioned first gap may be the first gap of any two adjacent hollow components, wherein any adjacent hollow components include : Adjacent first hollow component 21 and second hollow component 22, adjacent first hollow component 21 and first hollow component 21, adjacent second hollow component 22 and second hollow component 22, etc. are different.
  • first hollow component 21 and the second hollow component 22 are arranged at equal intervals, but in the embodiment of the present application, the gap width between the first hollow component 21 and the second hollow component 22 is not limited. In actual production, the width of the spacing distance between the first hollow component 21 and the second hollow component 22 can be adjusted as required.
  • FIG. 4 shows the specific structure of the first hollow component 21 provided in the embodiment of the present application.
  • the first hollow component 21 provided in the embodiment of the present application includes a first hollow structure and a second hollow structure , Wherein the number of the first hollow structure is two, the number of the second hollow structure is one, and the first hollow structure and the second hollow structure are arranged in a single row along the second direction, and each first hollow structure And the length of the second hollow structure is also parallel to the second direction.
  • the second direction (line b) in FIG. 3 is perpendicular to the first direction (line a), that is, the second direction is the axial length direction of the mobile terminal.
  • the second direction provided in the embodiments of the present application can also be a direction that has a set angle with the first direction.
  • the second direction and the first direction have other angles: 60°, 80°, 120°, and other different angles. .
  • each first hollow component 21 two of the first hollow structures are hollow notches 211, and the opening directions of the two hollow notches 211 are opposite.
  • the hollow notch 211 is specifically provided on the circuit board, the opening position of the hollow notch 211 is located at the edge of the bending area, and the hollow hole 212 is disposed between the two hollow notches 211.
  • FIG. 5 shows the specific structure of a hollowed-out gap 211.
  • the two hollow notches 211 in the first hollow component 21 have the same structure, except that the opening directions are different. Therefore, one of the hollow notches 211 is used for description.
  • the hollow notch 211 includes a notch 2111 and a second reaming hole 2112 communicating with the notch 2111.
  • a mechanical drilling or a knife is used to form a closed slot at one end on the circuit board.
  • the slot is the above-mentioned notch 2111, and the length of the slot is along the second direction, and one end of the slot is open.
  • One end is a closed end, and the opening is located at the edge of the circuit board.
  • a slightly larger round hole is machined at the closed end perpendicular to the direction of the slot. This round hole is the second reaming hole 2112.
  • the diameter of the second reaming hole 2112 is larger than the width of the notch 2111.
  • the dimensions of the slot hole and the second reaming hole 2112 are specifically set, they can be set as required, and it is only necessary to ensure that the diameter of the second reaming hole 2112 is greater than the diameter of the slot hole.
  • the second reaming hole 2112 is combined with the slot hole in sections to form a graphic stress relief structure.
  • the second reaming hole 2112 can improve the stress generated when the slot hole is opened.
  • the second reaming hole 2112 can also release the stress applied to the hollow notch 211.
  • the second hollow structure in each first hollow component is a hollow hole 212, and the floor hollow hole 212 is located between the two hollow notches 211, and is separated from the hollow notch 211 by a second gap 213,
  • the second gap 213 is the physical structure of the circuit board in the bending area, so as to prevent the bending area from breaking.
  • the width of the second gap 213 in the second direction can be set according to actual needs, such as 1mm, 2mm, etc., but no matter how large the width is, it is necessary to ensure that the bending area has a certain width.
  • the structural strength and certain flexibility are examples of the width of the second gap 213 in the second direction.
  • the length direction of the hollow hole 212 is parallel to the second direction, and the hollow hole 212 includes a long waist hole 2122 and a first waist hole 2122 communicating with the long waist hole 2122.
  • the diameter of each first reaming hole 2121 is greater than the width of the long waist hole 2122.
  • a long slot with closed ends (long waist hole 2122) is formed by mechanical drilling or a gong knife on the circuit board, and a slightly larger round hole is machined at the end perpendicular to the slot length direction of the slot.
  • the sizes of the long slot and the first reaming hole 2121 are specifically set, they can be set as required, and it is only necessary to ensure that the diameter of the first reaming hole 2121 is greater than the diameter of the long slot.
  • the first reaming hole 2121 and the long slot hole are combined in sections to form a graphic stress relief structure.
  • the first reaming hole 2121 can improve the stress generated when the long slot hole is opened.
  • the first reamed hole 2121 can also release the stress applied to the hollow hole 212.
  • the first hollow component is not limited to the specific structure in FIG. 4, and other structural forms can also be used, as shown in FIG. 7, which shows another first hollow component 21.
  • the first hollow component 21 The hollow component 21 includes only one hollow notch 211 and one hollow hole 212, and in the adjacent first hollow component 21, the hollow hole 212 and the hollow notch 211 are arranged at different positions, and the opening directions of the two hollow holes 211 are opposite. , It can also reduce the rigidity of the bending area and improve the flexibility of the bending area.
  • the first hollow component 21 may include only one hollow notch, or one hollow hole, or two hollow notches and at least two hollow holes.
  • the second hollow component 22 provided by the embodiment of the present application includes two second hollow structures, and the two second hollow structures are arranged in a single row along the second direction.
  • Each second hollow structure is a hollow hole, and the length direction of the hollow hole is parallel to the second direction.
  • the specific shape of each second hollow structure can refer to the hollow hole in the first hollow component shown in FIG. 8. Therefore, the specific structure of the second hollow structure will not be described in detail here.
  • a third gap 2222 is spaced between the two hollow holes 221, and a fourth gap 223 is spaced between each hollow hole 221 and the edge of the circuit board.
  • the third gap 222 and the fourth gap 223 are the physical structure of the circuit board in the bending area, so as to avoid fracture in the bending area.
  • the width of the third gap 222 and the fourth gap 223 in the second direction can be set according to actual needs, such as 1mm, 2mm and other different widths, but no matter how large they are The width needs to ensure that the bending area has a certain structural strength and a certain flexibility.
  • the number of the second hollow structure in FIG. 8 is only an example, and the specific number of the second hollow structure is not limited in the embodiment of the present application, and one, two, three, four, etc. can be selected. Different numbers. However, no matter how many second hollow structures are used, the arrangement direction of the second hollow structures is along the second direction.
  • the first hollow structure in the first hollow component 21 and the second hollow component 22 provided by the embodiment of the present application are arranged, the first hollow structure in the first hollow component 21 and the second hollow structure in the second hollow component 22 are ,
  • the first hollow structure is staggered with the second hollow structure.
  • the three first hollow structures in the first hollow component 21 and the two second hollow structures in the second hollow component 22 are arranged at different positions along the second direction, so that the positions shown in FIG. 4
  • the second gap 213 in the first hollow component 21 shown is staggered with the third gap 222 and the fourth gap 223 in the second hollow component 22 shown in FIG. 8. From the above description, it can be seen that the second gap 213, the third gap 222, and the fourth gap 223 are the physical structure of the circuit board.
  • the staggered arrangement of the second gap 213, the third gap 222, and the fourth gap 223 can enhance The structural strength of the entire bending zone.
  • the second gap 213, the third gap 222, and the fourth gap 223 are bent, because the width of the second gap 213, the third gap 222, and the fourth gap 223 in the second direction is much smaller than that of the bending
  • the width of the zone in the second direction can effectively reduce the rigidity and strength of the bending zone and improve the flexibility of the bending zone.
  • the number of the first hollow component 21 and the second hollow component 22 shown in FIG. 3 is not limited in the embodiment of the present application, but the number of the first hollow component 21 and the second hollow component 22 is specifically provided. In terms of the number, it is satisfied that the greater the bending angle of the circuit board, the smaller the width of the first hollow structure and the second hollow structure in the first direction. Corresponding to the arrangement of the first hollow component 21 and the second hollow component 22, the greater the angle of the circuit board bending angle, the denser the first hollow component 21 and the second hollow component 22, and the smaller the bending angle.
  • the first hollow component 21 and the second hollow component 22 are sparser.
  • FIG. 2 shows the electrical connection between the first assembly area 10 and the second assembly area 30.
  • the wiring 60 When the wiring 60 is specifically arranged, the wiring 60 bypasses the plurality of first hollow components 21 And the second hollow component 22.
  • the wiring 60 When the wiring 60 is laid in the bending area, the wiring 60 is laid on the gap between the first hollow component 21 and the second hollow component 22.
  • the above gap is the physical structure of the circuit board, so it can carry the wiring 60, such as The wire 60 is laid on any of the above-mentioned first gap, second gap, third gap, and fourth gap.
  • a method for preparing the circuit board is also provided in the embodiment of the present application, which specifically includes the following steps:
  • Step 001 divide a bending area and an assembly area on the circuit board body; open a plurality of first hollow components in the bending area, and the plurality of first hollow components are arranged along the first direction;
  • a first hollow structure and a second hollow structure are provided in the bending area; wherein, the first hollow structure and the second hollow structure are arranged in a single row along the second direction.
  • a notch is opened in the bending area, and a second reaming hole is opened at the closed end of the notch, and the diameter of the second reaming hole is larger than the width of the notch.
  • the opening of the second hollow structure specifically includes: opening a long waist hole in the bending area, and opening first reaming holes at both ends of the long waist hole, and the diameter of the first reaming hole is larger than that of the long waist hole The width.
  • Step 002 Set second hollow components between the first hollow components, and the first hollow components and the second hollow components are alternately arranged.
  • opening the second hollow component specifically refers to opening at least one second hollow structure.
  • the opening of the second hollow structure specifically includes: opening a long waist hole in the bending area, and opening first reaming holes at both ends of the long waist hole, and the diameter of the first reaming hole is larger than the long waist hole.
  • the width of the waist hole For details, reference may be made to the above description in relation to FIG. 6 and FIG. 7.
  • the first hollow component and the second hollow component can be prepared in sequence according to the arrangement order of the first hollow component and the second hollow component, and it is not necessary to hollow out all the first hollow components.
  • the second hollow component is prepared.
  • the circuit board can be bent directly by the provided first hollow component, so there is no need to provide special bending parts, and the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device. Compared with the prior art adopting the cooperation of the main board and the flexible circuit board to achieve bending, there is no need to specially set the bending structure, and the reliability of the main board connection is improved.
  • the hollow component in the bending area provided by the embodiment of the present application is not limited to the specific structure mentioned above, and other alternative methods can also be used. As shown in FIG. 7, only the first hollow component or only the second hollow component in the bending area can also improve the flexibility of the bending area.
  • FIGS. 9-12 show different folding situations of the circuit board shown in FIG. 2.
  • the bending area 20 is bent 90 degrees to form an arc-shaped bend.
  • the first assembly area 10 and the second assembly area 30 are 90 degrees, corresponding to the first housing of the mobile terminal It also forms an angle of 90 degrees with the second housing; as shown in FIG. 10, in FIG. 10, the bending area 20 is flattened.
  • the first assembly area 10 and the second assembly area 30 are in a straight line and move accordingly.
  • the first housing and the second housing of the terminal are also arranged in a straight line, and the mobile terminal is in a fully opened state. As shown in FIG.
  • the bending area 20 is bent by 270 degrees to form an arc-shaped bend.
  • the first assembly area 10 and the second assembly area 30 are 270 degrees, corresponding to the first housing of the mobile terminal.
  • the body and the second housing also have an included angle of 270 degrees; as shown in Figure 12, the bending area 20 is bent 360 degrees, and the first assembly area 10 and the second assembly area 30 are also bent 360 degrees.
  • the first housing and the second housing of the mobile terminal are also folded in 360 degrees, and the mobile terminal is in a folded state.
  • the part of the circuit board located in the bending area 20 passes through the first hollow component 21 and the second hollow component 22 and the first hollow component 21 and the second hollow component 22.
  • a hollow component 21 and a second hollow component 22 reduce the physical structure strength of the bending area 20 on the circuit board, and pass through the first gap between the first hollow component 21 and the second hollow component 22, and the first hollow component 21
  • the inner second gap and the third gap in the second hollow component 22 are actually bent structures, so that the rigidity of the bending area 20 is less than the rigidity of the first assembly area 10 and the second assembly area 30, and the flexibility is greater than that of the first assembly area 10 and the second assembly area 30.
  • the first assembling area 10 and the second assembling area 30 realize the use of a whole circuit board to realize different states required when the mobile terminal is folded. This ensures the reliability of the mobile terminal when folded, and also facilitates the assembly of the mobile terminal.
  • FIG. 13 illustrates a schematic structural diagram of a second type of circuit board provided by an embodiment of the present application.
  • the division of the circuit board shown in FIG. 13 is the same as the division of the circuit board shown in FIG. 2. It is also divided into a first assembly area 10, a bending area 20, and a second assembly area 30.
  • the arrangement of the first assembly area 10, the second assembly area 30, and the bending area 20 is the same as that of FIG. To repeat, the only difference is that the width of the bending area 20 is different from the width of the bending area 20 shown in FIG. 2.
  • the width of the bending area 20 is the same as the width of the first assembly area 10 and the second assembly area 30, and the aforementioned width refers to the width along the second direction.
  • the first hollow component 21 and the second hollow component 22 of the bending zone 20 can also be bent similarly to those shown in FIGS. 9-12. Go into details again.
  • FIG. 14 illustrates a schematic structural diagram of a third circuit board provided by an embodiment of the present application.
  • the circuit board body is divided into multiple areas, which can be divided into assembly areas and bending areas according to their functions.
  • the number of assembly areas is four, which are named as the first assembly area 10 and the first assembly area 10 and the first assembly area for convenience of description.
  • the second assembly area 30, the third assembly area 40 and the fourth assembly area 50 are named as the first assembly area 10 and the second assembly area 30 of the circuit board in FIG. 2, which will not be repeated here.
  • the circuit board provided by the embodiment of the present application has three bending areas, which are named the first bending area 20a, the second bending area 20b, and the third bending area 20c for the convenience of description.
  • the first bending area 20a is connected to the first assembly area 10 and the second assembly area 30
  • the second bending area 20b is connected to the second assembly area 30 and the third assembly area 40
  • the third bending area 20c is connected to The third assembly area 40 and the fourth assembly area 50.
  • the circuit board shown in Fig. 14 can be regarded as an extension of the circuit board shown in Fig. 2. Any pair of assembly areas connected by the bending area in Fig. 14 can be equivalently regarded as the one shown in Fig. 2 Circuit board.
  • the circuit board body in the embodiment of the present application may include at least two assembly areas, such as the two assembly areas in FIG. 2 or the four assembly areas shown in FIG. Of course, three assembly areas, five assembly areas, etc., of different numbers can also be used. In the embodiment of the present application, the number of specific assembly areas is not limited.
  • the part of the circuit board located in the bending area passes through the first hollow component 21 and the second hollow component 22.
  • a hollow component 21 and a second hollow component 22 and the first hollow component 21 and the second hollow component 22 reduce the physical structure strength of the bending area on the circuit board, and pass through the first hollow component 21 and the second hollow component 22
  • the first gap between the first hollow component 21, the second gap inside the second hollow component 22, and the third gap inside the second hollow component 22 are the actual bending structure, which realizes that the rigidity of the bending zone is less than that of the first assembly zone and the first assembly zone.
  • the rigidity and flexibility of the second assembly area are greater than that of the first assembly area and the second assembly area, so that a whole circuit board is used to realize different states required when the mobile terminal is folded. This ensures the reliability of the mobile terminal when folded, and also facilitates the assembly of the mobile terminal.
  • the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device.
  • the connection difficulty of the circuit board is reduced, and the reliability of the connection of the main board is improved.
  • An embodiment of the present application also provides an electronic device, which includes the circuit board of any one of the foregoing, and further includes a housing fixedly connected to each assembly area.
  • the electronic device can be a mobile phone, a PDA, a notebook computer or a tablet computer, etc.
  • the structure shown in FIG. 1a a first housing 200, a rotating shaft mechanism 100, a second housing 300, and a flexible screen 400 fixed on the first housing 200 and the second housing 300.
  • the rotating shaft mechanism 100 is connected to the first housing 200 and the second housing 300 respectively.
  • the rotation of the rotating shaft mechanism 100 causes the first housing 200 and the second housing 300 to rotate relatively, and the flexible screen 400 covers The first housing 200, the second housing 300, and the rotating shaft mechanism 100 are respectively bonded to the first housing 200 and the second housing 300.
  • the mobile terminal includes two states: an expanded state and a folded state. As shown in FIG. 1a, when the mobile terminal is unfolded, the first housing 200 and the second housing 300 are arranged separately on both sides of the hinge mechanism 100, and the flexible screen 400 is unfolded at this time. When bending, the first housing 200 and the second housing 300 rotate relative to the rotating shaft mechanism 100, and after being folded, the state shown in FIG. 1b is formed.
  • the first housing 200 and the second housing 300 are stacked relative to each other, and The flexible screen 400 (not shown in the figure) is bent following the first housing 200 and the second housing 300.
  • Figure 1b shows a folding method in which the flexible screen 400 is located inside the mobile terminal, but the mobile terminal provided by the embodiment of the present application is not limited to the folding method shown in Figure 1b, and a manner in which the flexible screen 400 is exposed after being folded may also be used. fold.
  • the above-mentioned first housing and the second housing are provided with a circuit board carrying electronic devices (such as a camera, a chip), and the circuit board is the above-mentioned circuit board including an assembly area and a bending area.
  • the first hollow component improves the flexibility of the bending area through the first hollow component, so that the bending area can be folded along the first direction. It can be seen from the above description that the circuit board can be bent directly by the first hollow component provided, so there is no need to provide special bending parts. The circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device. Compared with the prior art adopting the cooperation of the main board and the flexible circuit board to achieve bending, there is no need to specially set the bending structure, and the reliability of the main board connection is improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本申请提供了一种电路板及电子设备，该电路板包括电路板本体，该电路板本体至少包括两个装配区，并且对于任意两个装配区之间通过折弯区连接，每个折弯区及其连接的两个装配区沿第一方向排列。每个折弯区内设置有多排第一镂空组件，多排第一镂空组件沿第一方向排列。通过在折弯区设置多排第一镂空组件，通过第一镂空组件改善了折弯区的柔韧性，使得折弯区可沿第一方向折叠。由上述描述可以看出，通过设置的第一镂空组件使得电路板可以直接折弯，因此无需设置专门的折弯部件，该电路板作为电子设备内的主板可直接连接需要折弯的部件。相比现有技术中采用主板与柔性电路板的配合实现折弯来说，无需专门设置折弯结构，并且改善了主板连接的可靠性。

Description

一种电路板及电子设备
相关申请的交叉引用
本申请要求在2019年09月29日提交中国专利局、申请号为201910936180.7、申请名称为“一种电路板及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到电路板领域，尤其涉及到一种电路板及电子设备。
背景技术
滑盖手机、折叠屏是近期市场热捧的概念机，其具有较大的屏幕，因此得到消费者的追崇。但是折叠手机在折叠时，需要解决两个壳体内的电路连接，折叠整机内两侧的主板连接基本都采用如下方式实现可折叠和电性能传输特性：通过背部的排线来实现可折叠的特性，或者通过FPC转接板分别连接两个电路板来实现可折叠的特性。但是在采用软硬结合时，采用软板(FPC转接板)与硬板(PCB板)结合的板方式来实现PCB板的连接需要成本比较高；并且软板与硬板组装过程中硬板和软板交接位置容易被拉扯失效；此外，软板与硬板技术制作难度高。
发明内容
本申请提供了一种电路板及电子设备，用以提高电子设备的可靠性。
第一方面，提供了一种电路板，该电路板应用于可折叠的电子设备，如手机或者笔记本电脑等。该电路板包括电路板本体，该电路板本体上划分有多个区，分别为装配区以及折弯区。其中，所述电路板本体至少包括两个装配区，并且对于任意两个装配区之间通过折弯区连接，每个折弯区及其连接的两个装配区沿第一方向排列。在具体设置折弯区时，每个折弯区内设置有多排第一镂空组件，且所述多排第一镂空组件沿所述第一方向排列。在上述结构中，通过在折弯区设置多排第一镂空组件，通过第一镂空组件改善了折弯区的柔韧性，使得折弯区可沿第一方向折叠。由上述描述可以看出，通过设置的第一镂空组件使得电路板可以直接折弯，因此无需设置专门的折弯部件，该电路板作为电子设备内的主板可直接连接需要折弯的部件。相比现有技术中采用主板与柔性电路板的配合实现折弯来说，无需专门设置折弯结构，并且改善了主板连接的可靠性。
在一个具体的可实施方案中，所述第一镂空组件包括第一镂空结构和第二镂空结构，且所述第一镂空结构和所述第二镂空结构沿第二方向单排排列；其中，所述第二方向与所述第一方向呈设定夹角。采用具体的第一镂空结构及第二镂空结构改善电路板的折弯效果。
在一个具体的可实施方案中，所述第二方向与所述第一方向垂直。当然也可以第二方向与第一方向呈一定其他的角度，如60°、80°、120°等不同的角度。
在一个具体的可实施方案中，所述第一镂空结构及所述第二镂空结构的长度方向与所述第二方向相同。改善折弯区的柔韧性。
在一个具体的可实施方案中，每个第一镂空组件包括两个所述第一镂空结构，以及至少一个所述第二镂空结构，且至少一个所述第二镂空结构位于所述两个所述第一镂空结构之间。在一个具体的可实施方案中，相邻的第一镂空组件中的第一镂空结构长度不同。通过不同的长度的镂空结构改善折弯区的柔韧性。当然在本申请实施例提供的镂空结构的长度也可以选择相同。
在一个具体的可实施方案中，每个折弯区内还设置有第二镂空组件，且所述第一镂空组件及所述第二镂空组件之间交替排列。通过第二镂空组件进一步的提高折弯区的柔韧性，改善折弯区的折弯效果。
在一个具体的可实施方案中，所述第二镂空组件包括第二镂空结构。通过设置的第二镂空结构改善折弯区的柔韧性。
在一个具体的可实施方案中，每个第二镂空组件可以包括一个第二镂空结构，也可以包括两个或两个以上的第二镂空结构。其中，两个第二镂空结构沿第二方向排列。
在一个具体的可实施方案中，所述第一镂空结构为镂空缺口，所述第二镂空结构为镂空孔。通过不同的镂空结构改善折弯区的柔韧性。
在一个具体的可实施方案中，相邻的第一镂空组件及第二镂空组件中，所述第一镂空组件的镂空孔与所述第二镂空组件的镂空孔相错设置。通过相错设置，改善折弯区的柔韧性。
在一个具体的可实施方案中，每个镂空孔包括长腰孔以及与所述长腰孔连通的第一扩孔，且所述第一扩孔的直径大于所述长腰孔的宽度。通过第一扩孔改善镂空孔的应力，提高折弯区的柔韧性。
在一个具体的可实施方案中，每个镂空缺口包括：缺口以及与所述缺口连通的第二扩孔，且所述第二扩孔的直径大于所述缺口的宽度。通过第二扩孔改善镂空孔的应力，提高折弯区的柔韧性。
在一个具体的可实施方案中，位于每个折弯区两侧的装配区分别设置有第一连接端及第二连接端；每个折弯区设置有连接所述第一连接端及所述第二连接端的走线，其中，所述走线绕过所述多个第一镂空组件。方便铺设走线。
在一个具体的可实施方案中，在垂直于所述第一方向上，至少一个所述折弯区的宽度小于该折弯区连接的装配区的宽度；或，至少一个所述折弯区的宽度等于该折弯区连接的装配区的宽度。
第二方面，提供了一种电路板的制备方法，该制备方法包括：在电路板本体上划分出折弯区及装配区；在折弯区内开设多个第一镂空组件，且多个第一镂空组件沿第一方向排列。通过设置的第一镂空组件使得电路板可以直接折弯，因此无需设置专门的折弯部件，该电路板作为电子设备内的主板可直接连接需要折弯的部件。相比现有技术中采用主板与柔性电路板的配合实现折弯来说，无需专门设置折弯结构，并且改善了主板连接的可靠性。
在一个具体的可实施方案中，所述在折弯区内开设多个第一镂空组件包括：在折弯区开设第一镂空结构及第二镂空结构；其中，第一镂空结构及第二镂空结构沿第二方向单排排列。通过第一镂空结构及第二镂空结构改善折弯区的柔韧性。
在一个具体的可实施方案中，该方法还包括在第一镂空组件之间开设第二镂空组件，且第一镂空组件与第二镂空组件交替排列。通过第二镂空组件进一步提高了折弯区的柔韧性。
在一个具体的可实施方案中，所述开设第二镂空组件具体为开设至少一个第二镂空结构。
在一个具体的可实施方案中，所述开设第一镂空结构具体为：在折弯区开设缺口，在缺口封闭的一端开设第二扩孔，且第二扩孔的直径大于缺口的宽度。通过第二扩孔改善了第一镂空结构的应力集中。
在一个具体的可实施方案中，所述开设第二镂空结构具体为：在折弯区开设长腰孔，在长腰孔的两端分别开设第一扩孔，且第一扩孔的直径大于长腰孔的宽度。通过第一扩孔改善了第二镂空结构的应力集中。
第三方面，提供了一种电子设备，该电子设备包括上述任一项所述的电路板，还包括与每个装配区固定连接的壳体。在上述结构中，通过在折弯区设置多排第一镂空组件，通过第一镂空组件改善了折弯区的柔韧性，使得折弯区可沿第一方向折叠。由上述描述可以看出，通过设置的第一镂空组件使得电路板可以直接折弯，因此无需设置专门的折弯部件，该电路板作为电子设备内的主板可直接连接需要折弯的部件。相比现有技术中采用主板与柔性电路板的配合实现折弯来说，无需专门设置折弯结构，并且改善了主板连接的可靠性。
附图说明
图1a为本申请实施例提供的移动终端的展开状态示意图；
图1b为本申请实施例提供的移动终端的折叠状态示意图；
图2为本申请实施例提供的第一种电路板的示意图；
图3为本申请实施例提供的折弯区的结构示意图；
图4为本申请实施例提供的一种第一镂空组件的结构示意图；
图5为本申请实施例提供的镂空缺口的结构示意图；
图6为本申请实施例提供的镂空孔的结构示意图；
图7为本申请实施例提供的另一种第一镂空组件的结构示意图；
图8为本申请实施例提供的第二镂空组件的结构示意图；
图9～图12为本申请实施例提供的电路板的弯折示意图；
图13为本申请实施例提供的第二种电路板的结构示意图；
图14为本申请实施例提供的第三种电路板的结构示意图。
具体实施方式
为方便理解本申请实施例提供的电路板，首先说明一下其应用场景，该电路板应用于可折叠的电子设备，如手机，PDA、笔记本电脑或平板电脑等。以手机为例，如图1a中所示的结构：第一壳体200、转轴机构100、第二壳体300及固定在第一壳体200及第二壳体300上的柔性屏400。继续参考图1a，第一壳体200、转轴机构100及第二壳体300沿直线b所示的方向排列，且转轴机构100分别与第一壳体200及第二壳体300连接，第一壳体200与第二壳体300可绕转轴机构100的轴线(直线a所示的方向)转动，而柔性屏400覆盖在第一壳体200、第二壳体300及转轴机构100上，并分别与第一壳体200及第二壳体300粘接连接。在使用时，移动终端包含两个状态：展开状态及折叠状态。如图1a所示移动终端在展开时，第一壳体200、第二壳体300分列在转轴机构100的两侧展开， 此时柔性屏400展开。在进行折弯时，第一壳体200与第二壳体300相对转轴机构100转动，在折叠后形成如图1b所示的状态，第一壳体200与第二壳体300相对层叠，而柔性屏400(图中未示出)跟随第一壳体200及第二壳体300折弯。在图1b中示出的为柔性屏400位于移动终端内部的折叠方式，但是本申请实施例提供的移动终端不限于图1b中所示的折叠方式，还可以采用折叠后柔性屏400外露的方式折叠。在手机的第一壳体200及第二壳体300内分别设置有承载有电子器件(如摄像头、芯片)的刚性电路板，在两个刚性电路板连接时现有技术中往往通过柔性电路板连接，但是刚性电路板与柔性电路板的连接处在多次拉扯后极易失效，因此本申请实施例提供了一种电路板。为方便理解本申请实施例提供的电路板，下面结合附图对其结构进行详细的说明。
如图2所示，图2示出了本申请实施例提供的一种电路板的具体结构，在图2所示的电路板包括一个电路板本体，该电路板本体上划分有三个区，第一装配区10、折弯区20及第二装配区30。其中，第一装配区10及第二装配区30分别用于承载电子器件，而折弯区20用于连接第一装配区10及第二装配区30。在电路板应用在手机内时，第一装配区10固定在第一壳体内，第二装配区30固定在第二壳体内，而折弯区20绕过第一壳体及第二壳体并连接第一装配区10及第二装配区30。继续参考图2，第一装配区10、第二装配区30及折弯区20沿第一方向排列，且折弯区20位于第一装配区10及第二装配区30之间。其中，第一方向为垂直于移动终端折叠时转动索绕的轴线的方向。一并参考图1a中所示，直线a为移动终端转动索绕的轴线；直线b为第一方向。在将电路板装配在移动终端内时，第一装配区10、折弯区20及第二装配区30沿直线b所示的方向排列。其中，在垂直于第一方向上，折弯区20的宽度小于该折弯区20连接的第一装配区10及第二装配区30的宽度。
继续参考图2，位于折弯区20两侧的第一装配区10及第二装配区30分别设置有第一连接端40及第二连接端50；如图2中所示，第一装配区10设置有第一连接端40，第二装配区30设置与第二连接端50，且折弯区20设置有连接第一连接端40及第二连接端50的走线60，通过走线60使得第一装配区10与第二装配区30实现连接，第一装配区10上的电器件与第二装配区30的电器件之间可以通过走线60实现电连接以及信号连接，其中，电器件的具体连接方式可以采用现有技术中常见的连接方式，在此不再赘述，本申请仅限定走线在折弯区中的设置方式。其中，第一装配区10及第二装配区30上的电器件可以芯片、电感、电容或者其他移动终端内的电器件。
一并参考图2及图3，图3示出了电路板的折弯区20的具体结构，本申请实施例提供的电路板为一体结构，第一装配区10、第二装配区30及折弯区20为电路板上的不同区。由于第一装配区10、第二装配区30及折弯区20的层结构相同，因此第一装配区10及第二装配区30的刚性相同。而折弯区20由于设置了第一镂空组件21及第二镂空组件22，因此降低了折弯区20的刚性，使得第一折弯区20的刚性小于第一装配区10及第二装配区30刚性，同时折弯区20的柔韧性大于第一装配区10及第二装配区30的柔韧性，从而使得折弯区20可以实现折弯效果。为方便理解，下面结合附图详细说明一下折弯区20的具体结构。
继续参考图3，在图3中，直线b示出的方向为第一方向。本申请实施例提供的折弯区包括多个第一镂空组件21及多个第二镂空组件22，其中，多个第一镂空组件21及多个第二镂空组件22沿第一方向排列。如图3中所示，多个第一镂空组件21及多个第二镂空 组件22沿第一方向单排排列，且第一镂空组件21及第二镂空组件22交替排列，即两个第一镂空组件21之间具有一个第二镂空组件22，但是应当理解的是图3所示的第一镂空组件21与第二镂空组件22仅仅为一种具体的排列方式，在本申请实施例中不具体限定第一镂空组件21与第二镂空组件22的间隔设置方式，如可以在两个第一镂空组件21之间间隔两个第二镂空组件22；或者按照如下排序：两个第一镂空组件21、两个第二镂空组件22、两个第一镂空组件21、两个第二镂空组件22……等不同的排序方式。
继续参考图3，在任意相邻的第一镂空组件21与第二镂空组件22之间间隔有第一间隙(图中未标示)，从而使得折弯区不会断裂。其中，第一镂空组件21之间的第一间隙在第一方向上的宽度可以根据需要设定，如0.1mm、0.5mm、1mm、2mm等不同的宽度，在本申请示例中不对两个第一镂空组件21与第二镂空组件22之间的第一间隙做具体限定，可以根据实际的需要设计不同的第一间隙。在折弯区的第一镂空组件21与第二镂空组件22按照其他方式排列时，上述第一间隙可以为任意相邻的两个镂空组件的第一间隙，其中，任意相邻的镂空组件包括：相邻的第一镂空组件21与第二镂空组件22、相邻的第一镂空组件21与第一镂空组件21、相邻的第二镂空组件22与第二镂空组件22等不同的情况。
另外，在图3中，第一镂空组件21与第二镂空组件22之间等间隔排列，但是在本申请实施例中并不限定第一镂空组件21与第二镂空组件22之间的间隙宽度相等，在实际生产中，可以根据需要调整第一镂空组件21与第二镂空组件22之间的间隔距离的宽度。
如图4所示，图4中示出了本申请实施例提供的第一镂空组件21的具体结构，在本申请实施例提供的第一镂空组件21中包括第一镂空结构及第二镂空结构，其中，第一镂空结构的个数为两个，第二镂空结构的个数为一个，且第一镂空结构及第二镂空结构沿第二方向呈单排排列，且每个第一镂空结构及第二镂空结构的长度也与第二方向平行。一并参考图3，在图3中第二方向(直线b)与第一方向(直线a)垂直，即第二方向为移动终端的轴线长度方向。当然本申请实施例提供的第二方向还可以为与第一方向呈设定夹角的方向，如第二方向与第一方向呈其他的角度：60°、80°、120°等不同的角度。
继续参考图4，每个第一镂空组件21中，其中的两个第一镂空结构为镂空缺口211，且两个镂空缺口211的开口方向相反。在电路板上具体设置镂空缺口211时，镂空缺口211的开口位置位于折弯区的边沿，而镂空孔212设置在了两个镂空缺口211之间。一并参考图5，图5中示出了一个镂空缺口211的具体结构。在本申请实施例中，第一镂空组件21中的两个镂空缺口211的结构相同，仅仅是开口方向不同而已，因此以其中的一个镂空缺口211来进行说明。
继续参考图5，镂空缺口211包括一个缺口2111以及与该缺口2111连通的第二扩孔2112。在具体制备时，在电路板上采用机械钻孔或锣刀形成一端封闭槽孔，该槽孔即为上述的缺口2111，且该槽孔长度方向沿第二方向，槽孔的一端开口，另一端为封闭端，其中开口位于电路板的边沿。之后，在垂直于槽孔方向的封闭端加工出稍大的圆孔，该圆孔即为第二扩孔2112，由图2可以看出，第二扩孔2112的直径大于缺口2111的宽度，在具体设置槽孔与第二扩孔2112的尺寸时，可以根据需要进行设定，只需要保证第二扩孔2112的直径大于槽孔的直径即可。在采用上述结构时，通过第二扩孔2112与槽孔进行分段式搭配组合，从而形成图形释放应力的结构，通过第二扩孔2112可以改善开槽孔时产生的应力，同时，在折弯区折弯时，通过第二扩孔2112也可以释放施加到镂空缺口211上的应力。
继续参考图4，每个第一镂空组件中的第二镂空结构为镂空孔212，且楼空孔212位 于两个镂空缺口211之间，并与镂空缺口211之间间隔有第二间隙213，该第二间隙213为折弯区电路板的实体结构，从而避免折弯区断裂。在具体设置第二间隙213时，第二间隙213沿第二方向的宽度可以根据实际需要设定，如采用1mm、2mm等不同的宽度，但是无论采用多大宽度，均需要保证折弯区具有一定的结构强度以及一定的柔韧性。
一并参考图4及图6，在具体设置镂空孔212时，镂空孔212的长度方向平行于第二方向，且该镂空孔212包括一个长腰孔2122以及与该长腰孔2122连通的第一扩孔2121；如图6所示，长腰孔2122的长度方向平行于第二方向，且第一扩孔2121的个数为两个，两个第一扩孔2121分列在长腰孔2122的两端且分别与长腰孔2122连通。其中，每个第一扩孔2121的直径均大于长腰孔2122的宽度。在具体制备时，在电路板上采用机械钻孔或锣刀形成两端封闭的长槽孔(长腰孔2122)，在垂直于长槽孔的槽长方向的末端加工出稍大的圆孔(第一扩孔2121)进行过渡形成狗骨状图形。在具体设置长槽孔与第一扩孔2121的尺寸时，可以根据需要进行设定，只需要保证第一扩孔2121的直径大于长槽孔的直径即可。在采用上述结构时，通过第一扩孔2121与长槽孔进行分段式搭配组合，从而形成图形释放应力的结构，通过第一扩孔2121可以改善开长槽孔时产生的应力，同时，在折弯区折弯时，通过第一扩孔2121也可以释放施加到镂空孔212上的应力。
当然对于第一镂空组件不仅限于图4中的具体结构，还可以采用其他的结构形式，如图7所示，图7示出了另外一种第一镂空组件21，在图7中，第一镂空组件21中仅包含一个镂空缺口211及一个镂空孔212，且相邻的第一镂空组件21中，镂空孔212与镂空缺口211的设置位置相错，且两个镂空孔211的开口方向相反，同样也可以降低折弯区的刚性，提高折弯区的柔韧性。当然也可以第一镂空组件21仅包含一个镂空缺口，或者一个镂空孔，或者两个镂空缺口及至少两个镂空孔等不同的方式。
一并参考图4及图8，本申请实施例提供的第二镂空组件22包括两个第二镂空结构，且两个第二镂空结构沿第二方向排列成单排。每个第二镂空结构为镂空孔，且镂空孔的长度方向平行于第二方向，其中，每个第二镂空结构的具体形状可以参考图8中所示的第一镂空组件中的镂空孔，因此在此不再详细赘述第二镂空结构的具体结构。继续参考图8，在具体设置第二镂空结构时，两个镂空孔221之间间隔有第三间隙2222，且每个镂空孔221与电路板的边沿间隔有第四间隙223。第三间隙222及第四间隙223为折弯区电路板的实体结构，从而避免折弯区断裂。在具体设置第三间隙222及第四间隙223时，第三间隙222及第四间隙223沿第二方向的宽度可以根据实际需要设定，如采用1mm、2mm等不同的宽度，但是无论采用多大宽度，均需要保证折弯区具有一定的结构强度以及一定的柔韧性。
应当理解的是图8中第二镂空结构的个数仅仅为一个示例，在本申请实施例中并不限定第二镂空结构的具体个数，可以选择一个、两个、三个、四个等不同的个数。但是无论采用多少个第二镂空结构，第二镂空结构的排列方向均沿第二方向。
继续参考图3，本申请实施例提供的第一镂空组件21及第二镂空组件22在排列时，第一镂空组件21中的第一镂空结构与第二镂空组件22中的第二镂空结构时，第一镂空结构与第二镂空结构相错。如图4中所示，第一镂空组件21中的三个第一镂空结构与第二镂空组件22中的两个第二镂空结构沿第二方向的设置位置相错，从而使得图4中所示的第一镂空组件21中的第二间隙213及图8中所示的第二镂空组件22中的第三间隙222及第四间隙223相错。由上述描述可知第二间隙213、第三间隙222及第四间隙223为电路 板的实体结构，通过第二间隙213、第三间隙222及第四间隙223之间相错的设置方式，可以增强整个折弯区的结构强度。另外在折弯时，第二间隙213、第三间隙222及第四间隙223被弯折，由于第二间隙213、第三间隙222及第四间隙223在第二方向的宽度远远小于折弯区在第二方向的宽度，从而可以有效地降低折弯区的刚性强度，提高折弯区的柔韧性。
另外，对于图3中所示的第一镂空组件21及第二镂空组件22的个数，在本申请实施例中不做限定，但是在具体设置第一镂空组件21及第二镂空组件22的个数时，满足：电路板弯折角度越大，第一镂空结构及第二镂空结构在第一方向的宽度越小。对应到第一镂空组件21及第二镂空组件22的排列来说，即为电路板弯折角度的角度越大，第一镂空组件21及第二镂空组件22越密集，弯折角度越小，第一镂空组件21及第二镂空组件22越稀疏。
继续参考图2及图3，图2中示出了第一装配区10与第二装配区30的电连接情况，在具体设置走线60时，走线60绕过多个第一镂空组件21及第二镂空组件22。在走线60铺设在折弯区是，走线60铺设在第一镂空组件21及第二镂空组件22中的间隙上，上述间隙为电路板的实体结构，因此可以承载走线60，如走线60铺设在上述的第一间隙、第二间隙、第三间隙及第四间隙中的任意间隙上。
为了方便理解本申请实施例提供的电路板，在本申请实施例中还提供了电路板的制备方法，具体包括以下步骤：
步骤001：在电路板本体上划分出折弯区及装配区；在折弯区内开设多个第一镂空组件，且多个第一镂空组件沿第一方向排列；
具体的，在折弯区开设第一镂空结构及第二镂空结构；其中，第一镂空结构及第二镂空结构沿第二方向单排排列。
其中，在制备第一镂空结构时，在折弯区开设缺口，在缺口封闭的一端开设第二扩孔，且第二扩孔的直径大于缺口的宽度。具体可以参考上述图4及图5中的描述。
在制备第二镂空结构时，开设第二镂空结构具体为：在折弯区开设长腰孔，在长腰孔的两端分别开设第一扩孔，且第一扩孔的直径大于长腰孔的宽度。具体可以参考上述图4及图6中的描述。
步骤002：在第一镂空组件之间开设第二镂空组件，且第一镂空组件与第二镂空组件交替排列。
具体的，开设第二镂空组件具体为开设至少一个第二镂空结构。其中，在制备第二镂空结构时，开设第二镂空结构具体为：在折弯区开设长腰孔，在长腰孔的两端分别开设第一扩孔，且第一扩孔的直径大于长腰孔的宽度。具体的可以参考上述关于图6及图7中的描述。
应当理解的是，在制备第一镂空组件及第二镂空组件时，可以按照第一镂空组件及第二镂空组件的排列顺序依次制备第一镂空组件及第二镂空组件，无需将所有第一镂空组件制备完后再制备第二镂空组件。通过设置的第一镂空组件使得电路板可以直接折弯，因此无需设置专门的折弯部件，该电路板作为电子设备内的主板可直接连接需要折弯的部件。相比现有技术中采用主板与柔性电路板的配合实现折弯来说，无需专门设置折弯结构，并且改善了主板连接的可靠性。
当然对于本申请实施例提供的折弯区中镂空组件不仅限于上述具体的结构，还可以采 用其他的可替换方式。如图7中所示的仅通过第一镂空组件或者还可以在折弯区仅设置第二镂空组件也同样可以改善折弯区的柔韧性。
一并参考图9～图12，其中图9～图12示出了图2中所示电路板的不同折叠情况。首先参考图9，折弯区20折弯90度，从而形成一个弧形的折弯，此时，第一装配区10与第二装配区30呈90度，对应的移动终端的第一壳体与第二壳体也呈90度的夹角；如图10所示，在图10中，折弯区20展平，此时第一装配区10与第二装配区30呈直线，对应的移动终端的第一壳体与第二壳体也呈直线排列，移动终端处于完全打开的状态。如图11所示，折弯区20折弯270度，从而形成一个弧形的折弯，此时，第一装配区10与第二装配区30呈270度，对应的移动终端的第一壳体与第二壳体也呈270度的夹角；如图12所示，折弯区20折弯360度，此时第一装配区10及第二装配区30也折弯360度，对应的移动终端的第一壳体及第二壳体也呈360度的折叠，移动终端处于折叠状态。
由上述描述可以看出，在折弯区20设置第一镂空组件21及第二镂空组件22时，电路板位于折弯区20的部分通过第一镂空组件21及第二镂空组件22中及第一镂空组件21与第二镂空组件22降低了电路板上折弯区20的实体结构强度，并且通过第一镂空组件21及第二镂空组件22之间的第一间隙，以及第一镂空组件21内部的第二间隙、第二镂空组件22内的第三间隙为实际折弯的结构，实现了折弯区20的刚性强度小于第一装配区10及第二装配区30的刚性，柔韧性大于第一装配区10及第二装配区30，实现采用一整块电路板实现移动终端折叠时所需的不同状态。从而保证了移动终端在折叠时的可靠性，同时也方便了移动终端的装配。
如图13所示，图13示例出了本申请实施例提供的第二种电路板的结构示意图，在图13中所示的电路板的划分情况与图2所示的电路板的划分相同，也分为第一装配区10、折弯区20及第二装配区30，其中，第一装配区10、第二装配区30及折弯区20的设置方式与图2相同，在此不再赘述，唯一的区别在于折弯区20的宽度与图2中所示的折弯区20的宽度不同。在图13中，折弯区20的宽度与第一装配区10及第二装配区30的宽度相同，上述的宽度指的是沿第二方向的宽度。在采用图13所示的电路板时，该电路板通过折弯区20的第一镂空组件21及第二镂空组件22同样也可实现类似图9～图12所示的折弯，在此不再详细赘述。
如图14所示，图14示例出本申请实施例提供的第三种电路板的结构示意图。在图14中，电路板本体上划分有多个区，按照功能可以划分为装配区以及折弯区，其中装配区的个数为四个，为方便描述分别命名为第一装配区10、第二装配区30、第三装配区40及第四装配区50。上述的四个装配区可以具体参考图2中的电路板的第一装配区10及第二装配区30，在此不再赘述。
继续参考图14，本申请实施例提供的电路板的折弯区为三个，为方便描述将其命名为第一折弯区20a、第二折弯区20b及第三折弯区20c。其中，第一折弯区20a分别连接第一装配区10及第二装配区30，第二折弯区20b分别连接第二装配区30及第三装配区40，第三折弯区20c分别连接第三装配区40及第四装配区50。其中，任一个折弯区的具体结构可以参考上述图3中折弯区的相应描述，在此不再赘述。对于图14所示的电路板可看做是图2所示的电路板的一种扩展，图14中任一一对通过折弯区连接的装配区可以等效看做图2中所示的电路板。
由图2、图13及图14可以看出，在本申请实施例中的电路板本体包括可以包括至少 两个装配区，如图2中的两个装配区、或者图14中所示的四个装配区，当然也可以采用三个、五个等不同个数的装配区，在本申请实施例中对具体的装配区个数不做限定。此外，对于电路板上任意两个装配区之间可以通过折弯区连接，并且通过折弯区设置的第一镂空组件21及第二镂空组件22时，电路板位于折弯区的部分通过第一镂空组件21及第二镂空组件22中及第一镂空组件21与第二镂空组件22降低了电路板上折弯区的实体结构强度，并且通过第一镂空组件21及第二镂空组件22之间的第一间隙，以及第一镂空组件21内部的第二间隙、第二镂空组件22内的第三间隙为实际折弯的结构，实现了折弯区的刚性强度小于第一装配区及第二装配区的刚性，柔韧性大于第一装配区及第二装配区，实现采用一整块电路板实现移动终端折叠时所需的不同状态。从而保证了移动终端在折叠时的可靠性，同时也方便了移动终端的装配。因此无需设置专门的折弯部件，该电路板作为电子设备内的主板可直接连接需要折弯的部件。相比现有技术中采用主板与柔性电路板的配合实现折弯来说，降低了电路板的连接难度，并且改善了主板连接的可靠性。
本申请实施例还提供了一种电子设备，该电子设备包括上述任一项的电路板，还包括与每个装配区固定连接的壳体。其中，电子设备可以为手机，PDA、笔记本电脑或平板电脑等。以手机为例，如图1a中所示的结构：第一壳体200、转轴机构100、第二壳体300及固定在第一壳体200及第二壳体300上的柔性屏400。继续参考图1a，转轴机构100分别与第一壳体200及第二壳体300连接，通过转轴机构100的转动使得第一壳体200与第二壳体300相对转动，而柔性屏400覆盖在第一壳体200、第二壳体300及转轴机构100上，并分别与第一壳体200及第二壳体300粘接连接。在使用时，移动终端包含两个状态：展开状态及折叠状态。如图1a所示移动终端在展开时，第一壳体200、第二壳体300分列在转轴机构100的两侧展开，此时柔性屏400展开。在进行折弯时，第一壳体200与第二壳体300相对转轴机构100转动，在折叠后形成如图1b所示的状态，第一壳体200与第二壳体300相对层叠，而柔性屏400(图中未示出)跟随第一壳体200及第二壳体300折弯。在图1b中示出的为柔性屏400位于移动终端内部的折叠方式，但是本申请实施例提供的移动终端不限于图1b中所示的折叠方式，还可以采用折叠后柔性屏400外露的方式折叠。上述的第一壳体及第二壳体内设置有承载有电子器件(如摄像头、芯片)的电路板，该电路板为上述包含装配区及折弯区的电路板，通过在折弯区设置多个第一镂空组件，通过第一镂空组件改善了折弯区的柔韧性，使得折弯区可沿第一方向折叠。由上述描述可以看出，通过设置的第一镂空组件使得电路板可以直接折弯，因此无需设置专门的折弯部件，该电路板作为电子设备内的主板可直接连接需要折弯的部件。相比现有技术中采用主板与柔性电路板的配合实现折弯来说，无需专门设置折弯结构，并且改善了主板连接的可靠性。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (14)

  1. 一种电路板，其特征在于，包括：电路板本体，所述电路板本体至少包括两个装配区，以及连接任意两个装配区的折弯区，其中，每个折弯区连接的两个装配区与该折弯区沿第一方向排列；
    每个折弯区内设置有多个第一镂空组件，且所述多个第一镂空组件沿所述第一方向排列。
  2. 根据权利要求1所述的电路板，其特征在于，所述第一镂空组件包括第一镂空结构和第二镂空结构，且所述第一镂空结构和所述第二镂空结构沿第二方向单排排列；其中，所述第二方向与所述第一方向呈设定夹角。
  3. 根据权利要求2所述的电路板，其特征在于，所述第二方向与所述第一方向垂直。
  4. 根据权利要求2或3所述的电路板，其特征在于，所述第一镂空结构及所述第二镂空结构的长度方向与所述第二方向相同。
  5. 根据权利要求2～4任一项所述的电路板，其特征在于，每个第一镂空组件包括两个所述第一镂空结构，以及至少一个所述第二镂空结构，且至少一个所述第二镂空结构位于所述两个所述第一镂空结构之间。
  6. 根据权利要求2～5任一项所述的电路板，其特征在于，每个折弯区内还设置有第二镂空组件，且所述第一镂空组件及所述第二镂空组件之间交替排列。
  7. 根据权利要求6所述的电路板，其特征在于，所述第二镂空组件包括第二镂空结构。
  8. 根据权利要求7所述的电路板，其特征在于，所述第一镂空结构为镂空缺口，所述第二镂空结构为镂空孔。
  9. 根据权利要求8所述的电路板，其特征在于，相邻的第一镂空组件及第二镂空组件中，所述第一镂空组件的镂空孔与所述第二镂空组件的镂空孔相错设置。
  10. 根据权利要求8所述的电路板，其特征在于，每个镂空孔包括长腰孔以及与所述长腰孔连通的第一扩孔，且所述第一扩孔的直径大于所述长腰孔的宽度。
  11. 根据权利要求8所述的电路板，其特征在于，每个镂空缺口包括：缺口以及与所述缺口连通的第二扩孔，且所述第二扩孔的直径大于所述缺口的宽度。
  12. 根据权利要求1～11任一项所述的电路板，其特征在于，位于每个折弯区两侧的装配区分别设置有第一连接端及第二连接端；每个折弯区设置有连接所述第一连接端及所述第二连接端的走线，其中，所述金属图层绕过所述多个第一镂空组件。
  13. 根据权利要求1～12任一项所述的电路板，其特征在于，在垂直于所述第一方向上，任一个所述折弯区的宽度小于该折弯区连接的装配区的宽度；或，任一个所述折弯区的宽度等于该折弯区连接的装配区的宽度。
  14. 一种电子设备，其特征在于，包括如权利要求1～13任一项所述的电路板，还包括与每个装配区固定连接的壳体。
PCT/CN2020/104974 2019-09-29 2020-07-27 一种电路板及电子设备 WO2021057236A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910936180.7A CN112584603A (zh) 2019-09-29 2019-09-29 一种电路板及电子设备
CN201910936180.7 2019-09-29

Publications (1)

Publication Number Publication Date
WO2021057236A1 true WO2021057236A1 (zh) 2021-04-01

Family

ID=75111139

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/104974 WO2021057236A1 (zh) 2019-09-29 2020-07-27 一种电路板及电子设备

Country Status (2)

Country Link
CN (1) CN112584603A (zh)
WO (1) WO2021057236A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7980863B1 (en) * 2008-02-14 2011-07-19 Metrospec Technology, Llc Printed circuit board flexible interconnect design
CN106605454A (zh) * 2015-08-06 2017-04-26 日本梅克特隆株式会社 多层柔性印刷线路板及其制造方法
CN106664792A (zh) * 2014-08-12 2017-05-10 日本梅克特隆株式会社 可伸缩柔性印刷电路板以及可伸缩柔性印刷电路板的制造方法
CN207201070U (zh) * 2017-08-25 2018-04-06 深圳市汇晨电子股份有限公司 一种可实现弯曲后还原的fpc板
EP3383147A1 (en) * 2015-03-13 2018-10-03 Samsung Display Co., Ltd. Flexible circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101267082B1 (ko) * 2008-02-15 2013-05-23 엘지디스플레이 주식회사 백 라이트 유닛 및 이를 이용한 액정표시장치
JP2013084729A (ja) * 2011-10-07 2013-05-09 Fujitsu Ltd 多層配線基板、電子装置、及び多層配線基板の製造方法
CN205051973U (zh) * 2015-09-02 2016-02-24 深圳市领德辉科技有限公司 一种柔性线路板的新型连接结构
CN206136441U (zh) * 2016-08-30 2017-04-26 深圳市和圣达光电有限公司 触摸屏fpc弯折区的防折断结构
KR102398331B1 (ko) * 2017-11-01 2022-05-16 엘지전자 주식회사 플렉서블 디스플레이 유닛 및 이를 구비하는 이동 단말기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7980863B1 (en) * 2008-02-14 2011-07-19 Metrospec Technology, Llc Printed circuit board flexible interconnect design
CN106664792A (zh) * 2014-08-12 2017-05-10 日本梅克特隆株式会社 可伸缩柔性印刷电路板以及可伸缩柔性印刷电路板的制造方法
EP3383147A1 (en) * 2015-03-13 2018-10-03 Samsung Display Co., Ltd. Flexible circuit board
CN106605454A (zh) * 2015-08-06 2017-04-26 日本梅克特隆株式会社 多层柔性印刷线路板及其制造方法
CN207201070U (zh) * 2017-08-25 2018-04-06 深圳市汇晨电子股份有限公司 一种可实现弯曲后还原的fpc板

Also Published As

Publication number Publication date
CN112584603A (zh) 2021-03-30

Similar Documents

Publication Publication Date Title
TWI306199B (zh)
TWI289372B (en) Stackable assembly signal flat cable
TWI249271B (en) Signal transmission cable assembly suitable for passing through revolving shaft mechanism
JP5979313B2 (ja) 多分割筐体の結合装置及び該結合装置を備えた電子装置
JP4176756B2 (ja) 電線支持装置
JP5493209B2 (ja) 巻束構造を有する信号伝送配線
KR102413137B1 (ko) 회전축 및 전자 기기
US9826647B2 (en) Connecting system of multi-section housing and electronic device provided with that connecting system
TW200537898A (en) Hinge connector for folding-type electronic apparatus
WO2021057236A1 (zh) 一种电路板及电子设备
CN111599302A (zh) 一种显示面板和显示装置
CN1638406B (zh) 用于折叠型移动终端的信号连接设备
CN113452814A (zh) 传输组件及可折叠电子设备
WO2005029930A1 (ja) フレキシブルプリント基板とそれを用いる接続構造
JP4121391B2 (ja) フレキシブルプリント基板及びフレキシブルプリント基板を有する折り畳み式電子機器
JP3544930B2 (ja) フレキシブルプリント基板およびそれを用いた電子機器
JP2010040929A (ja) 電子機器及びフレキシブルプリント配線板
JP5390546B2 (ja) 内部接続構造、平型集合導体、キーボード装置、電子機器、および携行型パーソナルコンピュータ
US7297006B2 (en) Flexible connector with printed circuit lines encircling two axes
CN210805175U (zh) 一种风扇屏电路拼接结构
JP4309230B2 (ja) 携帯端末装置及びフレキシブルプリント配線板
JPH0364992A (ja) 基板組立方法
KR20060076788A (ko) 두 축을 둘러싸는 인쇄 회로 라인들을 구비한 플랙시블커넥터
JPS58206267A (ja) 電子機器の配線構造

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20869557

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20869557

Country of ref document: EP

Kind code of ref document: A1