WO2021057236A1 - Carte de circuit imprimé et dispositif électronique - Google Patents

Carte de circuit imprimé et dispositif électronique Download PDF

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Publication number
WO2021057236A1
WO2021057236A1 PCT/CN2020/104974 CN2020104974W WO2021057236A1 WO 2021057236 A1 WO2021057236 A1 WO 2021057236A1 CN 2020104974 W CN2020104974 W CN 2020104974W WO 2021057236 A1 WO2021057236 A1 WO 2021057236A1
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WO
WIPO (PCT)
Prior art keywords
hollow
circuit board
bending
area
bending area
Prior art date
Application number
PCT/CN2020/104974
Other languages
English (en)
Chinese (zh)
Inventor
朱福建
丁海幸
乔吉涛
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021057236A1 publication Critical patent/WO2021057236A1/fr

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/0278Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details

Definitions

  • This application relates to the field of circuit boards, and in particular to a circuit board and electronic equipment.
  • Sliding cover phones and folding screens are concept phones that are popular in the market recently. They have larger screens and are therefore popular among consumers.
  • the main board connections on both sides of the folding machine basically adopt the following methods to realize the foldable and electrical performance transmission characteristics: the foldable is realized by the back cable Features, or connect two circuit boards separately through the FPC adapter board to achieve foldable features.
  • the application provides a circuit board and electronic equipment to improve the reliability of the electronic equipment.
  • a circuit board is provided, and the circuit board is applied to a foldable electronic device, such as a mobile phone or a notebook computer.
  • the circuit board includes a circuit board body, and the circuit board body is divided into a plurality of areas, which are respectively an assembly area and a bending area.
  • the circuit board body includes at least two assembling areas, and any two assembling areas are connected by bending areas, and each bending area and the two connecting assembling areas are arranged along the first direction.
  • each bending area is provided with multiple rows of first hollow components, and the multiple rows of first hollow components are arranged along the first direction.
  • the circuit board can be bent directly by the first hollow component provided, so there is no need to provide special bending parts.
  • the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device. Compared with the prior art adopting the cooperation of the main board and the flexible circuit board to achieve bending, there is no need to specially set the bending structure, and the reliability of the main board connection is improved.
  • the first hollow component includes a first hollow structure and a second hollow structure, and the first hollow structure and the second hollow structure are arranged in a single row along the second direction; wherein, The second direction and the first direction are at a set angle.
  • the specific first hollow structure and the second hollow structure are adopted to improve the bending effect of the circuit board.
  • the second direction is perpendicular to the first direction.
  • the second direction and the first direction may be at a certain other angle, such as different angles such as 60°, 80°, and 120°.
  • the length directions of the first hollow structure and the second hollow structure are the same as the second direction. Improve the flexibility of the bending zone.
  • each first hollow component includes two first hollow structures, and at least one second hollow structure, and at least one second hollow structure is located in the two hollow structures. Between the first hollow structure.
  • the lengths of the first hollow structures in adjacent first hollow components are different.
  • the hollow structure of different lengths improves the flexibility of the bending zone.
  • the length of the hollow structure provided in the embodiment of the present application can also be selected to be the same.
  • a second hollow component is also arranged in each bending area, and the first hollow component and the second hollow component are alternately arranged.
  • the second hollow component further improves the flexibility of the bending zone and improves the bending effect of the bending zone.
  • the second hollow component includes a second hollow structure.
  • the second hollow structure is provided to improve the flexibility of the bending zone.
  • each second hollow component may include one second hollow structure, or may include two or more second hollow structures. Wherein, the two second hollow structures are arranged along the second direction.
  • the first hollow structure is a hollow notch
  • the second hollow structure is a hollow hole.
  • the hollow holes of the first hollow component and the hollow holes of the second hollow component are arranged staggered. Through the staggered arrangement, the flexibility of the bending area is improved.
  • each hollow hole includes a long waist hole and a first reaming hole communicating with the long waist hole, and the diameter of the first reaming hole is larger than the width of the long waist hole.
  • each hollowed-out notch includes a notch and a second reaming hole communicating with the notch, and the diameter of the second reaming hole is larger than the width of the notch.
  • each bending area located on both sides of each bending area are respectively provided with a first connection end and a second connection end; each bending area is provided with a connection between the first connection end and the The wiring of the second connecting end, wherein the wiring goes around the plurality of first hollow components. Convenient for laying and routing.
  • the width of at least one of the bending areas is smaller than the width of the assembly area connected to the bending area in the first direction; or, the width of at least one of the bending areas is The width is equal to the width of the assembly area connected by the bending area.
  • a method for manufacturing a circuit board includes: dividing a bending area and an assembly area on the circuit board body; setting a plurality of first hollow components in the bending area, and a plurality of first hollow components A hollow component is arranged along the first direction.
  • the circuit board can be bent directly by the provided first hollow component, so there is no need to provide special bending parts, and the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device.
  • the main board and the flexible circuit board to achieve bending there is no need to specially set the bending structure, and the reliability of the main board connection is improved.
  • the opening a plurality of first hollow components in the bending area includes: opening a first hollow structure and a second hollow structure in the bending area; wherein, the first hollow structure and the second hollow structure The structures are arranged in a single row along the second direction. The first hollow structure and the second hollow structure improve the flexibility of the bending area.
  • the method further includes opening second hollow components between the first hollow components, and the first hollow components and the second hollow components are alternately arranged.
  • the second hollow component further improves the flexibility of the bending zone.
  • the opening of the second hollow component specifically refers to the opening of at least one second hollow structure.
  • the opening of the first hollow structure is specifically: opening a gap in the bending area, opening a second reaming hole at the closed end of the gap, and the diameter of the second reaming hole is greater than the width of the gap.
  • the second reaming improves the stress concentration of the first hollow structure.
  • the opening of the second hollow structure specifically includes: opening a long waist hole in the bending area, and opening first reaming holes at both ends of the long waist hole, and the diameter of the first reaming hole is larger than The width of the long waist hole.
  • the first reaming improves the stress concentration of the second hollow structure.
  • an electronic device in a third aspect, includes the circuit board described in any one of the above, and further includes a housing fixedly connected to each assembly area.
  • the electronic device includes the circuit board described in any one of the above, and further includes a housing fixedly connected to each assembly area.
  • the circuit board can be bent directly by the first hollow component provided, so there is no need to provide special bending parts.
  • the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device. Compared with the prior art adopting the cooperation of the main board and the flexible circuit board to achieve bending, there is no need to specially set the bending structure, and the reliability of the main board connection is improved.
  • FIG. 1a is a schematic diagram of an expanded state of a mobile terminal provided by an embodiment of the application.
  • FIG. 1b is a schematic diagram of a folded state of a mobile terminal according to an embodiment of the application.
  • FIG. 2 is a schematic diagram of the first circuit board provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of the structure of a bending area provided by an embodiment of the application.
  • FIG. 4 is a schematic structural diagram of a first hollow component provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of the structure of a hollow gap provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of the structure of a hollow hole provided by an embodiment of the application.
  • FIG. 7 is a schematic structural diagram of another first hollow component provided by an embodiment of the application.
  • FIG. 8 is a schematic structural diagram of a second hollow component provided by an embodiment of the application.
  • 9-12 are schematic diagrams of the bending of the circuit board provided by the embodiments of the application.
  • FIG. 13 is a schematic structural diagram of a second type of circuit board provided by an embodiment of the application.
  • FIG. 14 is a schematic structural diagram of a third circuit board provided by an embodiment of the application.
  • the circuit board is applied to foldable electronic devices, such as mobile phones, PDAs, notebook computers, or tablet computers.
  • foldable electronic devices such as mobile phones, PDAs, notebook computers, or tablet computers.
  • FIG. 1a the structure shown in FIG. 1a: a first housing 200, a rotating shaft mechanism 100, a second housing 300, and a flexible screen 400 fixed on the first housing 200 and the second housing 300.
  • the first housing 200, the rotating shaft mechanism 100, and the second housing 300 are arranged along the direction shown by the line b, and the rotating shaft mechanism 100 is connected to the first housing 200 and the second housing 300, respectively.
  • the housing 200 and the second housing 300 can rotate around the axis of the shaft mechanism 100 (direction shown by the line a), and the flexible screen 400 covers the first housing 200, the second housing 300 and the shaft mechanism 100, and They are adhesively connected to the first housing 200 and the second housing 300 respectively.
  • the mobile terminal includes two states: an expanded state and a folded state. As shown in FIG. 1a, when the mobile terminal is unfolded, the first housing 200 and the second housing 300 are arranged separately on both sides of the hinge mechanism 100, and the flexible screen 400 is unfolded at this time. When bending, the first housing 200 and the second housing 300 rotate relative to the rotating shaft mechanism 100, and after being folded, the state shown in FIG. 1b is formed.
  • the first housing 200 and the second housing 300 are stacked relative to each other, and The flexible screen 400 (not shown in the figure) is bent following the first housing 200 and the second housing 300.
  • Figure 1b shows a folding method in which the flexible screen 400 is located inside the mobile terminal, but the mobile terminal provided by the embodiment of the present application is not limited to the folding method shown in Figure 1b, and a manner in which the flexible screen 400 is exposed after being folded may also be used. fold.
  • Rigid circuit boards carrying electronic devices (such as cameras and chips) are respectively arranged in the first housing 200 and the second housing 300 of the mobile phone.
  • the flexible circuit board is often used in the prior art.
  • the connection between the rigid circuit board and the flexible circuit board is prone to failure after multiple pulls. Therefore, the embodiment of the present application provides a circuit board.
  • the structure of the circuit board will be described in detail below with reference to the accompanying drawings.
  • FIG. 2 shows the specific structure of a circuit board provided by an embodiment of the present application.
  • the circuit board shown in FIG. 2 includes a circuit board body, and the circuit board body is divided into three areas.
  • the first assembly area 10 and the second assembly area 30 are respectively used to carry electronic devices
  • the bending area 20 is used to connect the first assembly area 10 and the second assembly area 30.
  • the first assembly area 10 is fixed in the first housing
  • the second assembly area 30 is fixed in the second housing
  • the bending area 20 bypasses the first housing and the second housing and merges
  • the first assembly area 10 and the second assembly area 30 are connected.
  • the first assembly area 10, the second assembly area 30 and the bending area 20 are arranged along the first direction, and the bending area 20 is located between the first assembly area 10 and the second assembly area 30.
  • the first direction is a direction perpendicular to the axis of the rotating cable when the mobile terminal is folded.
  • the straight line a is the axis of the mobile terminal's rotating cable;
  • the straight line b is the first direction.
  • the width of the bending area 20 is smaller than the width of the first assembly area 10 and the second assembly area 30 connected by the bending area 20.
  • the first assembly area 10 and the second assembly area 30 located on both sides of the bending area 20 are respectively provided with a first connecting end 40 and a second connecting end 50; as shown in FIG. 2, the first assembly area 10 is provided with a first connection end 40, the second assembly area 30 is provided with a second connection end 50, and the bending area 20 is provided with a wire 60 connecting the first connection end 40 and the second connection end 50, through the wire 60
  • the first assembly area 10 is connected to the second assembly area 30.
  • the electrical components on the first assembly area 10 and the electrical components of the second assembly area 30 can be electrically connected and signal connected through the wiring 60.
  • connection mode of the components can be common connection modes in the prior art, which will not be repeated here, and this application only limits the arrangement mode of the wiring in the bending area.
  • the electrical devices on the first assembly area 10 and the second assembly area 30 may be chips, inductors, capacitors, or other electrical devices in a mobile terminal.
  • FIG. 3 shows the specific structure of the bending area 20 of the circuit board.
  • the circuit board provided by the embodiment of the present application has an integrated structure, the first assembly area 10, the second assembly area 30 and the folding
  • the bent area 20 is a different area on the circuit board. Since the first assembly area 10, the second assembly area 30 and the bending area 20 have the same layer structure, the rigidity of the first assembly area 10 and the second assembly area 30 are the same. Since the bending area 20 is provided with the first hollow component 21 and the second hollow component 22, the rigidity of the bending area 20 is reduced, so that the rigidity of the first bending area 20 is smaller than that of the first assembly area 10 and the second assembly area.
  • the bending zone 20 is rigid, and the flexibility of the bending area 20 is greater than that of the first assembly area 10 and the second assembly area 30, so that the bending area 20 can achieve a bending effect.
  • the specific structure of the bending zone 20 will be described in detail below with reference to the accompanying drawings.
  • the direction shown by the straight line b is the first direction.
  • the bending area provided by the embodiment of the present application includes a plurality of first hollow components 21 and a plurality of second hollow components 22, wherein the plurality of first hollow components 21 and the plurality of second hollow components 22 are arranged along the first direction.
  • the plurality of first hollow components 21 and the plurality of second hollow components 22 are arranged in a single row along the first direction, and the first hollow components 21 and the second hollow components 22 are alternately arranged, that is, two first hollow components
  • the spacing arrangement of the first hollow component 21 and the second hollow component 22 is specifically limited.
  • two second hollow components 22 can be spaced between the two first hollow components 21; or the order is as follows: two first hollow components 21.
  • first gap (not marked in the figure) between any adjacent first hollow component 21 and second hollow component 22, so that the bending area will not be broken.
  • the width of the first gap between the first hollow components 21 in the first direction can be set according to needs, such as different widths such as 0.1mm, 0.5mm, 1mm, 2mm, etc.
  • the two first gaps are not aligned.
  • the first gap between the hollow component 21 and the second hollow component 22 is specifically limited, and different first gaps can be designed according to actual needs.
  • the above-mentioned first gap may be the first gap of any two adjacent hollow components, wherein any adjacent hollow components include : Adjacent first hollow component 21 and second hollow component 22, adjacent first hollow component 21 and first hollow component 21, adjacent second hollow component 22 and second hollow component 22, etc. are different.
  • first hollow component 21 and the second hollow component 22 are arranged at equal intervals, but in the embodiment of the present application, the gap width between the first hollow component 21 and the second hollow component 22 is not limited. In actual production, the width of the spacing distance between the first hollow component 21 and the second hollow component 22 can be adjusted as required.
  • FIG. 4 shows the specific structure of the first hollow component 21 provided in the embodiment of the present application.
  • the first hollow component 21 provided in the embodiment of the present application includes a first hollow structure and a second hollow structure , Wherein the number of the first hollow structure is two, the number of the second hollow structure is one, and the first hollow structure and the second hollow structure are arranged in a single row along the second direction, and each first hollow structure And the length of the second hollow structure is also parallel to the second direction.
  • the second direction (line b) in FIG. 3 is perpendicular to the first direction (line a), that is, the second direction is the axial length direction of the mobile terminal.
  • the second direction provided in the embodiments of the present application can also be a direction that has a set angle with the first direction.
  • the second direction and the first direction have other angles: 60°, 80°, 120°, and other different angles. .
  • each first hollow component 21 two of the first hollow structures are hollow notches 211, and the opening directions of the two hollow notches 211 are opposite.
  • the hollow notch 211 is specifically provided on the circuit board, the opening position of the hollow notch 211 is located at the edge of the bending area, and the hollow hole 212 is disposed between the two hollow notches 211.
  • FIG. 5 shows the specific structure of a hollowed-out gap 211.
  • the two hollow notches 211 in the first hollow component 21 have the same structure, except that the opening directions are different. Therefore, one of the hollow notches 211 is used for description.
  • the hollow notch 211 includes a notch 2111 and a second reaming hole 2112 communicating with the notch 2111.
  • a mechanical drilling or a knife is used to form a closed slot at one end on the circuit board.
  • the slot is the above-mentioned notch 2111, and the length of the slot is along the second direction, and one end of the slot is open.
  • One end is a closed end, and the opening is located at the edge of the circuit board.
  • a slightly larger round hole is machined at the closed end perpendicular to the direction of the slot. This round hole is the second reaming hole 2112.
  • the diameter of the second reaming hole 2112 is larger than the width of the notch 2111.
  • the dimensions of the slot hole and the second reaming hole 2112 are specifically set, they can be set as required, and it is only necessary to ensure that the diameter of the second reaming hole 2112 is greater than the diameter of the slot hole.
  • the second reaming hole 2112 is combined with the slot hole in sections to form a graphic stress relief structure.
  • the second reaming hole 2112 can improve the stress generated when the slot hole is opened.
  • the second reaming hole 2112 can also release the stress applied to the hollow notch 211.
  • the second hollow structure in each first hollow component is a hollow hole 212, and the floor hollow hole 212 is located between the two hollow notches 211, and is separated from the hollow notch 211 by a second gap 213,
  • the second gap 213 is the physical structure of the circuit board in the bending area, so as to prevent the bending area from breaking.
  • the width of the second gap 213 in the second direction can be set according to actual needs, such as 1mm, 2mm, etc., but no matter how large the width is, it is necessary to ensure that the bending area has a certain width.
  • the structural strength and certain flexibility are examples of the width of the second gap 213 in the second direction.
  • the length direction of the hollow hole 212 is parallel to the second direction, and the hollow hole 212 includes a long waist hole 2122 and a first waist hole 2122 communicating with the long waist hole 2122.
  • the diameter of each first reaming hole 2121 is greater than the width of the long waist hole 2122.
  • a long slot with closed ends (long waist hole 2122) is formed by mechanical drilling or a gong knife on the circuit board, and a slightly larger round hole is machined at the end perpendicular to the slot length direction of the slot.
  • the sizes of the long slot and the first reaming hole 2121 are specifically set, they can be set as required, and it is only necessary to ensure that the diameter of the first reaming hole 2121 is greater than the diameter of the long slot.
  • the first reaming hole 2121 and the long slot hole are combined in sections to form a graphic stress relief structure.
  • the first reaming hole 2121 can improve the stress generated when the long slot hole is opened.
  • the first reamed hole 2121 can also release the stress applied to the hollow hole 212.
  • the first hollow component is not limited to the specific structure in FIG. 4, and other structural forms can also be used, as shown in FIG. 7, which shows another first hollow component 21.
  • the first hollow component 21 The hollow component 21 includes only one hollow notch 211 and one hollow hole 212, and in the adjacent first hollow component 21, the hollow hole 212 and the hollow notch 211 are arranged at different positions, and the opening directions of the two hollow holes 211 are opposite. , It can also reduce the rigidity of the bending area and improve the flexibility of the bending area.
  • the first hollow component 21 may include only one hollow notch, or one hollow hole, or two hollow notches and at least two hollow holes.
  • the second hollow component 22 provided by the embodiment of the present application includes two second hollow structures, and the two second hollow structures are arranged in a single row along the second direction.
  • Each second hollow structure is a hollow hole, and the length direction of the hollow hole is parallel to the second direction.
  • the specific shape of each second hollow structure can refer to the hollow hole in the first hollow component shown in FIG. 8. Therefore, the specific structure of the second hollow structure will not be described in detail here.
  • a third gap 2222 is spaced between the two hollow holes 221, and a fourth gap 223 is spaced between each hollow hole 221 and the edge of the circuit board.
  • the third gap 222 and the fourth gap 223 are the physical structure of the circuit board in the bending area, so as to avoid fracture in the bending area.
  • the width of the third gap 222 and the fourth gap 223 in the second direction can be set according to actual needs, such as 1mm, 2mm and other different widths, but no matter how large they are The width needs to ensure that the bending area has a certain structural strength and a certain flexibility.
  • the number of the second hollow structure in FIG. 8 is only an example, and the specific number of the second hollow structure is not limited in the embodiment of the present application, and one, two, three, four, etc. can be selected. Different numbers. However, no matter how many second hollow structures are used, the arrangement direction of the second hollow structures is along the second direction.
  • the first hollow structure in the first hollow component 21 and the second hollow component 22 provided by the embodiment of the present application are arranged, the first hollow structure in the first hollow component 21 and the second hollow structure in the second hollow component 22 are ,
  • the first hollow structure is staggered with the second hollow structure.
  • the three first hollow structures in the first hollow component 21 and the two second hollow structures in the second hollow component 22 are arranged at different positions along the second direction, so that the positions shown in FIG. 4
  • the second gap 213 in the first hollow component 21 shown is staggered with the third gap 222 and the fourth gap 223 in the second hollow component 22 shown in FIG. 8. From the above description, it can be seen that the second gap 213, the third gap 222, and the fourth gap 223 are the physical structure of the circuit board.
  • the staggered arrangement of the second gap 213, the third gap 222, and the fourth gap 223 can enhance The structural strength of the entire bending zone.
  • the second gap 213, the third gap 222, and the fourth gap 223 are bent, because the width of the second gap 213, the third gap 222, and the fourth gap 223 in the second direction is much smaller than that of the bending
  • the width of the zone in the second direction can effectively reduce the rigidity and strength of the bending zone and improve the flexibility of the bending zone.
  • the number of the first hollow component 21 and the second hollow component 22 shown in FIG. 3 is not limited in the embodiment of the present application, but the number of the first hollow component 21 and the second hollow component 22 is specifically provided. In terms of the number, it is satisfied that the greater the bending angle of the circuit board, the smaller the width of the first hollow structure and the second hollow structure in the first direction. Corresponding to the arrangement of the first hollow component 21 and the second hollow component 22, the greater the angle of the circuit board bending angle, the denser the first hollow component 21 and the second hollow component 22, and the smaller the bending angle.
  • the first hollow component 21 and the second hollow component 22 are sparser.
  • FIG. 2 shows the electrical connection between the first assembly area 10 and the second assembly area 30.
  • the wiring 60 When the wiring 60 is specifically arranged, the wiring 60 bypasses the plurality of first hollow components 21 And the second hollow component 22.
  • the wiring 60 When the wiring 60 is laid in the bending area, the wiring 60 is laid on the gap between the first hollow component 21 and the second hollow component 22.
  • the above gap is the physical structure of the circuit board, so it can carry the wiring 60, such as The wire 60 is laid on any of the above-mentioned first gap, second gap, third gap, and fourth gap.
  • a method for preparing the circuit board is also provided in the embodiment of the present application, which specifically includes the following steps:
  • Step 001 divide a bending area and an assembly area on the circuit board body; open a plurality of first hollow components in the bending area, and the plurality of first hollow components are arranged along the first direction;
  • a first hollow structure and a second hollow structure are provided in the bending area; wherein, the first hollow structure and the second hollow structure are arranged in a single row along the second direction.
  • a notch is opened in the bending area, and a second reaming hole is opened at the closed end of the notch, and the diameter of the second reaming hole is larger than the width of the notch.
  • the opening of the second hollow structure specifically includes: opening a long waist hole in the bending area, and opening first reaming holes at both ends of the long waist hole, and the diameter of the first reaming hole is larger than that of the long waist hole The width.
  • Step 002 Set second hollow components between the first hollow components, and the first hollow components and the second hollow components are alternately arranged.
  • opening the second hollow component specifically refers to opening at least one second hollow structure.
  • the opening of the second hollow structure specifically includes: opening a long waist hole in the bending area, and opening first reaming holes at both ends of the long waist hole, and the diameter of the first reaming hole is larger than the long waist hole.
  • the width of the waist hole For details, reference may be made to the above description in relation to FIG. 6 and FIG. 7.
  • the first hollow component and the second hollow component can be prepared in sequence according to the arrangement order of the first hollow component and the second hollow component, and it is not necessary to hollow out all the first hollow components.
  • the second hollow component is prepared.
  • the circuit board can be bent directly by the provided first hollow component, so there is no need to provide special bending parts, and the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device. Compared with the prior art adopting the cooperation of the main board and the flexible circuit board to achieve bending, there is no need to specially set the bending structure, and the reliability of the main board connection is improved.
  • the hollow component in the bending area provided by the embodiment of the present application is not limited to the specific structure mentioned above, and other alternative methods can also be used. As shown in FIG. 7, only the first hollow component or only the second hollow component in the bending area can also improve the flexibility of the bending area.
  • FIGS. 9-12 show different folding situations of the circuit board shown in FIG. 2.
  • the bending area 20 is bent 90 degrees to form an arc-shaped bend.
  • the first assembly area 10 and the second assembly area 30 are 90 degrees, corresponding to the first housing of the mobile terminal It also forms an angle of 90 degrees with the second housing; as shown in FIG. 10, in FIG. 10, the bending area 20 is flattened.
  • the first assembly area 10 and the second assembly area 30 are in a straight line and move accordingly.
  • the first housing and the second housing of the terminal are also arranged in a straight line, and the mobile terminal is in a fully opened state. As shown in FIG.
  • the bending area 20 is bent by 270 degrees to form an arc-shaped bend.
  • the first assembly area 10 and the second assembly area 30 are 270 degrees, corresponding to the first housing of the mobile terminal.
  • the body and the second housing also have an included angle of 270 degrees; as shown in Figure 12, the bending area 20 is bent 360 degrees, and the first assembly area 10 and the second assembly area 30 are also bent 360 degrees.
  • the first housing and the second housing of the mobile terminal are also folded in 360 degrees, and the mobile terminal is in a folded state.
  • the part of the circuit board located in the bending area 20 passes through the first hollow component 21 and the second hollow component 22 and the first hollow component 21 and the second hollow component 22.
  • a hollow component 21 and a second hollow component 22 reduce the physical structure strength of the bending area 20 on the circuit board, and pass through the first gap between the first hollow component 21 and the second hollow component 22, and the first hollow component 21
  • the inner second gap and the third gap in the second hollow component 22 are actually bent structures, so that the rigidity of the bending area 20 is less than the rigidity of the first assembly area 10 and the second assembly area 30, and the flexibility is greater than that of the first assembly area 10 and the second assembly area 30.
  • the first assembling area 10 and the second assembling area 30 realize the use of a whole circuit board to realize different states required when the mobile terminal is folded. This ensures the reliability of the mobile terminal when folded, and also facilitates the assembly of the mobile terminal.
  • FIG. 13 illustrates a schematic structural diagram of a second type of circuit board provided by an embodiment of the present application.
  • the division of the circuit board shown in FIG. 13 is the same as the division of the circuit board shown in FIG. 2. It is also divided into a first assembly area 10, a bending area 20, and a second assembly area 30.
  • the arrangement of the first assembly area 10, the second assembly area 30, and the bending area 20 is the same as that of FIG. To repeat, the only difference is that the width of the bending area 20 is different from the width of the bending area 20 shown in FIG. 2.
  • the width of the bending area 20 is the same as the width of the first assembly area 10 and the second assembly area 30, and the aforementioned width refers to the width along the second direction.
  • the first hollow component 21 and the second hollow component 22 of the bending zone 20 can also be bent similarly to those shown in FIGS. 9-12. Go into details again.
  • FIG. 14 illustrates a schematic structural diagram of a third circuit board provided by an embodiment of the present application.
  • the circuit board body is divided into multiple areas, which can be divided into assembly areas and bending areas according to their functions.
  • the number of assembly areas is four, which are named as the first assembly area 10 and the first assembly area 10 and the first assembly area for convenience of description.
  • the second assembly area 30, the third assembly area 40 and the fourth assembly area 50 are named as the first assembly area 10 and the second assembly area 30 of the circuit board in FIG. 2, which will not be repeated here.
  • the circuit board provided by the embodiment of the present application has three bending areas, which are named the first bending area 20a, the second bending area 20b, and the third bending area 20c for the convenience of description.
  • the first bending area 20a is connected to the first assembly area 10 and the second assembly area 30
  • the second bending area 20b is connected to the second assembly area 30 and the third assembly area 40
  • the third bending area 20c is connected to The third assembly area 40 and the fourth assembly area 50.
  • the circuit board shown in Fig. 14 can be regarded as an extension of the circuit board shown in Fig. 2. Any pair of assembly areas connected by the bending area in Fig. 14 can be equivalently regarded as the one shown in Fig. 2 Circuit board.
  • the circuit board body in the embodiment of the present application may include at least two assembly areas, such as the two assembly areas in FIG. 2 or the four assembly areas shown in FIG. Of course, three assembly areas, five assembly areas, etc., of different numbers can also be used. In the embodiment of the present application, the number of specific assembly areas is not limited.
  • the part of the circuit board located in the bending area passes through the first hollow component 21 and the second hollow component 22.
  • a hollow component 21 and a second hollow component 22 and the first hollow component 21 and the second hollow component 22 reduce the physical structure strength of the bending area on the circuit board, and pass through the first hollow component 21 and the second hollow component 22
  • the first gap between the first hollow component 21, the second gap inside the second hollow component 22, and the third gap inside the second hollow component 22 are the actual bending structure, which realizes that the rigidity of the bending zone is less than that of the first assembly zone and the first assembly zone.
  • the rigidity and flexibility of the second assembly area are greater than that of the first assembly area and the second assembly area, so that a whole circuit board is used to realize different states required when the mobile terminal is folded. This ensures the reliability of the mobile terminal when folded, and also facilitates the assembly of the mobile terminal.
  • the circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device.
  • the connection difficulty of the circuit board is reduced, and the reliability of the connection of the main board is improved.
  • An embodiment of the present application also provides an electronic device, which includes the circuit board of any one of the foregoing, and further includes a housing fixedly connected to each assembly area.
  • the electronic device can be a mobile phone, a PDA, a notebook computer or a tablet computer, etc.
  • the structure shown in FIG. 1a a first housing 200, a rotating shaft mechanism 100, a second housing 300, and a flexible screen 400 fixed on the first housing 200 and the second housing 300.
  • the rotating shaft mechanism 100 is connected to the first housing 200 and the second housing 300 respectively.
  • the rotation of the rotating shaft mechanism 100 causes the first housing 200 and the second housing 300 to rotate relatively, and the flexible screen 400 covers The first housing 200, the second housing 300, and the rotating shaft mechanism 100 are respectively bonded to the first housing 200 and the second housing 300.
  • the mobile terminal includes two states: an expanded state and a folded state. As shown in FIG. 1a, when the mobile terminal is unfolded, the first housing 200 and the second housing 300 are arranged separately on both sides of the hinge mechanism 100, and the flexible screen 400 is unfolded at this time. When bending, the first housing 200 and the second housing 300 rotate relative to the rotating shaft mechanism 100, and after being folded, the state shown in FIG. 1b is formed.
  • the first housing 200 and the second housing 300 are stacked relative to each other, and The flexible screen 400 (not shown in the figure) is bent following the first housing 200 and the second housing 300.
  • Figure 1b shows a folding method in which the flexible screen 400 is located inside the mobile terminal, but the mobile terminal provided by the embodiment of the present application is not limited to the folding method shown in Figure 1b, and a manner in which the flexible screen 400 is exposed after being folded may also be used. fold.
  • the above-mentioned first housing and the second housing are provided with a circuit board carrying electronic devices (such as a camera, a chip), and the circuit board is the above-mentioned circuit board including an assembly area and a bending area.
  • the first hollow component improves the flexibility of the bending area through the first hollow component, so that the bending area can be folded along the first direction. It can be seen from the above description that the circuit board can be bent directly by the first hollow component provided, so there is no need to provide special bending parts. The circuit board can be directly connected to the parts that need to be bent as the main board in the electronic device. Compared with the prior art adopting the cooperation of the main board and the flexible circuit board to achieve bending, there is no need to specially set the bending structure, and the reliability of the main board connection is improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Carte de circuit imprimé et dispositif électronique. La carte de circuit imprimé comprend un corps de carte de circuit imprimé, le corps de carte de circuit imprimé comportant au moins deux zones d'assemblage ; deux zones d'assemblage quelconques sont reliées par l'intermédiaire d'une zone de courbure ; et chaque zone de courbure et les deux zones d'assemblage ainsi reliées sont agencées dans une première direction. De multiples rangées de premiers éléments évidés sont agencées dans chaque zone de pliage, et les multiples rangées de premiers éléments évidés sont agencées dans la première direction. Les multiples rangées de premiers éléments évidés sont disposées dans la zone de cintrage, de telle sorte que la flexibilité de la zone de pliage est améliorée par les premiers éléments évidés, et la zone de pliage peut être pliée dans la première direction. On peut voir à partir de la description que la carte de circuit imprimé peut être directement pliée au moyen des premiers éléments évidés ; par conséquent, il n'est pas nécessaire de fournir une unité de pliage spéciale, et la carte de circuit imprimé sert de carte mère dans un dispositif électronique, et peut être directement connectée à une unité devant être courbée. Par rapport à la réalisation d'une courbure au moyen d'une coopération entre une carte mère et une carte de circuit imprimé souple de l'état de la technique, il n'est pas nécessaire de fournir spécialement une structure de courbure, et la fiabilité de la connexion de carte mère est améliorée.
PCT/CN2020/104974 2019-09-29 2020-07-27 Carte de circuit imprimé et dispositif électronique WO2021057236A1 (fr)

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CN201910936180.7 2019-09-29
CN201910936180.7A CN112584603A (zh) 2019-09-29 2019-09-29 一种电路板及电子设备

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CN106605454A (zh) * 2015-08-06 2017-04-26 日本梅克特隆株式会社 多层柔性印刷线路板及其制造方法
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CN207201070U (zh) * 2017-08-25 2018-04-06 深圳市汇晨电子股份有限公司 一种可实现弯曲后还原的fpc板
EP3383147A1 (fr) * 2015-03-13 2018-10-03 Samsung Display Co., Ltd. Carte de circuit imprimé souple

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JP2013084729A (ja) * 2011-10-07 2013-05-09 Fujitsu Ltd 多層配線基板、電子装置、及び多層配線基板の製造方法
CN205051973U (zh) * 2015-09-02 2016-02-24 深圳市领德辉科技有限公司 一种柔性线路板的新型连接结构
CN206136441U (zh) * 2016-08-30 2017-04-26 深圳市和圣达光电有限公司 触摸屏fpc弯折区的防折断结构
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US7980863B1 (en) * 2008-02-14 2011-07-19 Metrospec Technology, Llc Printed circuit board flexible interconnect design
CN106664792A (zh) * 2014-08-12 2017-05-10 日本梅克特隆株式会社 可伸缩柔性印刷电路板以及可伸缩柔性印刷电路板的制造方法
EP3383147A1 (fr) * 2015-03-13 2018-10-03 Samsung Display Co., Ltd. Carte de circuit imprimé souple
CN106605454A (zh) * 2015-08-06 2017-04-26 日本梅克特隆株式会社 多层柔性印刷线路板及其制造方法
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