WO2021056827A1 - ***级封装结构和电子设备 - Google Patents

***级封装结构和电子设备 Download PDF

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Publication number
WO2021056827A1
WO2021056827A1 PCT/CN2019/123544 CN2019123544W WO2021056827A1 WO 2021056827 A1 WO2021056827 A1 WO 2021056827A1 CN 2019123544 W CN2019123544 W CN 2019123544W WO 2021056827 A1 WO2021056827 A1 WO 2021056827A1
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package structure
chip
mounting surface
substrate
mems sensor
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PCT/CN2019/123544
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English (en)
French (fr)
Inventor
王德信
宋其超
宋青林
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歌尔微电子有限公司
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Publication of WO2021056827A1 publication Critical patent/WO2021056827A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Definitions

  • the present invention relates to the technical field of electronic equipment, in particular to a system-in-package structure and an electronic device using the system-in-package structure.
  • System-in-a-package is a kind of integration of active devices (including multiple functional chips, such as processors, memory, etc.) and passive devices (such as resistors, capacitors, inductors, etc.) in one package
  • the package form because it can flexibly choose existing packages for integration, or even 3D stacking, and has a large degree of freedom, so it is widely used in medical electronics, automotive electronics, power modules, image sensors, mobile phones, global positioning systems, Bluetooth etc.
  • the existing system-level packaging structures equipped with MEMS devices generally use flexible circuit boards to draw the MEMS devices from the system-level packaging structure. That is, the MEMS devices are generally mounted on the external flexible circuit. Board or other carrier. This brings about the following defects: the line is long, the parasitic capacitance and inductance increase, and the signal is affected.
  • the main purpose of the present invention is to provide a system-in-package structure and electronic equipment using the system-in-package structure, aiming to shorten the line length of the system-in-package structure equipped with MEMS devices, reduce parasitic capacitance and inductance, and avoid The signal is affected.
  • an embodiment of the present invention provides a system-in-package structure, which includes:
  • a base the base is provided with a mounting surface
  • An active device the active device is arranged on the mounting surface and is electrically connected to the substrate;
  • Passive devices the passive devices are arranged on the mounting surface and are electrically connected to the substrate;
  • a micro-electro-mechanical system device the micro-electro-mechanical system device is arranged on the mounting surface and is electrically connected to the substrate;
  • the plastic encapsulation layer is arranged on the mounting surface and covers the active device, the passive device and the microelectromechanical system device.
  • the MEMS device includes a MEMS sensor.
  • the MEMS sensor is a motion type MEMS sensor.
  • the MEMS sensor is an optical MEMS sensor
  • the optical MEMS sensor is provided with a detection surface
  • the plastic encapsulation layer is a transparent plastic encapsulation layer
  • the detection surface faces The mounting surface faces the direction.
  • the microelectromechanical system sensor is an environmental microelectromechanical system sensor
  • the environmental microelectromechanical system sensor is provided with a detection surface
  • the mounting surface is provided with a connecting surface connected to the other side of the substrate. Through holes, the detection surface is arranged facing the through holes.
  • the active device includes a first chip, the first chip is a surface mount device, and the first chip is mounted on the mounting surface and is electrically connected to the substrate. connection.
  • the active device further includes a second chip, and the second chip is provided on a surface of the first chip facing away from the mounting surface, and is electrically connected to the substrate through a wire. connection.
  • the first chip is a ball grid array packaged chip, a quad flat no-lead packaged chip, or a wafer-level chip-scale packaged chip.
  • the system-in-package structure further includes an auxiliary device, and the auxiliary device is provided on a surface of the substrate that faces away from the mounting surface.
  • An embodiment of the present invention also provides an electronic device, the electronic device includes a system-in-package structure, and the system-in-package structure includes:
  • a base the base is provided with a mounting surface
  • An active device the active device is arranged on the mounting surface and is electrically connected to the substrate;
  • Passive devices the passive devices are arranged on the mounting surface and are electrically connected to the substrate;
  • a micro-electro-mechanical system device the micro-electro-mechanical system device is arranged on the mounting surface and is electrically connected to the substrate;
  • the plastic encapsulation layer is arranged on the mounting surface and covers the active device, the passive device and the microelectromechanical system device.
  • the technical scheme of the present invention can obtain a system-level packaging structure integrating micro-electro-mechanical system devices, active devices, and passive devices by integrating micro-electro-mechanical system devices with active devices and passive devices.
  • the MEMS device is placed inside the package structure, which also avoids the use of flexible circuit boards, shortens the line length of the system-in-package structure equipped with MEMS devices, reduces parasitic capacitance and inductance, and avoids signal exposure. influences.
  • the packaging cost is also reduced.
  • the MEMS device is packaged in the plastic encapsulation layer, which can also effectively protect the MEMS device from being exposed and damaged, thereby further improving the service life and reliability of the MEMS device.
  • FIG. 1 is a schematic structural diagram of an embodiment of the system-in-package structure of the present invention
  • FIG. 2 is a schematic structural diagram of another embodiment of the system-in-package structure of the present invention.
  • FIG. 3 is a schematic structural diagram of another embodiment of the system-in-package structure of the present invention.
  • the terms “connected”, “fixed”, etc. should be interpreted broadly.
  • “fixed” can be a fixed connection, a detachable connection, or a whole; It can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components or the interaction relationship between two components, unless specifically defined otherwise.
  • the specific meanings of the above-mentioned terms in the present invention can be understood according to specific situations.
  • the present invention proposes a system-in-package structure 100, which can be applied to electronic devices such as mobile phones, notebook computers, tablet computers, and wearable devices, and aims to shorten the system-level packaging of the MEMS device 40.
  • the line length of the structure 100 reduces parasitic capacitance and inductance, and prevents signals from being affected.
  • the system-in-package structure 100 includes:
  • the base 10 is provided with a mounting surface 11;
  • the active device 20 is provided on the mounting surface 11 and is electrically connected to the substrate 10;
  • the passive device 30 is provided on the mounting surface 11 and is electrically connected to the substrate 10;
  • the MEMS device 40 is provided on the mounting surface 11 and is electrically connected to the substrate 10;
  • the plastic encapsulation layer 50 is provided on the mounting surface 11 and covers the active device 20, the passive device 30 and the MEMS device 40.
  • the substrate 10 may be a circuit board;
  • the active device 20 may be an integrated circuit (IC) device such as power supply, communication, radio frequency, and control, and the passive device 30 may be a passive device such as a capacitor, a resistor, and an inductor.
  • IC integrated circuit
  • Micro-Electro-Mechanical System (MEMS) devices including micro-electro-mechanical system sensors (ie MEMS sensors) and micro-electro-mechanical system actuators (ie MEMS actuators); MEMS actuators convert electrical signals into micro-actions or Micro-operated micro-electromechanical system device 40
  • typical MEMS actuators include: micro-motor, micro-switch, micro-clamp, etc.; digital micro-mirror and various micro-optical switches in optical micro-electro-mechanical system device 40; radio frequency micro-electro-mechanical system The radio frequency microswitch in the device 40; the mixer, valve, pump, etc. in the microfluidic microelectromechanical system device 40.
  • the molding layer 50 may be formed by curing a molding compound.
  • the technical solution of the present invention can obtain integrated system-level packaging of the MEMS device 40, the active device 20, and the passive device 30 by integrating the MEMS device 40, the active device 20, and the passive device 30.
  • the source device 30 is integrated into the system-in-package structure 100, thereby achieving the purpose of compactness and simple connection of the overall package structure.
  • the MEMS device 40 is placed inside the package structure, which also avoids the use of flexible circuit boards, shortens the line length of the system-in-package structure 100 equipped with the MEMS device 40, reduces parasitic capacitance and inductance, and avoids The signal is affected. Naturally, the packaging cost is also reduced.
  • the MEMS device 40 is encapsulated in the plastic encapsulation layer 50, which can also effectively protect the MEMS device 40 from being exposed and damaged, thereby further improving the service life and reliability of the MEMS device 40.
  • the MEMS device 40 includes a MEMS sensor.
  • the MEMS sensor includes, but is not limited to, a motion MEMS sensor 40a, an optical MEMS sensor 40b, and an environmental MEMS sensor 40c.
  • the MEMS sensor is a motion MEMS sensor 40a.
  • the sports MEMS sensor 40a may be an accelerometer, a gyroscope, a magnetometer, or the like.
  • the structure is simple, the manufacturing is convenient, and the stability and reliability are excellent.
  • the MEMS sensor is an optical MEMS sensor 40b
  • the optical MEMS sensor 40b is provided with a detection surface 40d
  • the plastic encapsulation layer 50 It is a transparent plastic encapsulation layer 50
  • the detecting surface 40d is arranged in a direction facing the mounting surface 11.
  • the optical MEMS sensor 40b may be an ambient light sensor (Ambient Light Sensor, ALS), a color sensor, a proximity sensor (PS), a pyroelectric infrared sensor, an optical fingerprint sensor, or a 3D sensing light sensor. Wait.
  • Ambient Light Sensor ALS
  • a color sensor e.g., a CCD sensor
  • PS proximity sensor
  • a pyroelectric infrared sensor e.g., a pyroelectric infrared sensor
  • an optical fingerprint sensor e.g., a 3D sensing light sensor.
  • the optical MEMS sensor 40b can obtain external information (light signals) through the transparent plastic encapsulation layer 50, so as to achieve the corresponding detection purpose. Both stability and reliability are excellent.
  • the MEMS sensor is an environmental MEMS sensor 40c
  • the environmental MEMS sensor 40c is provided with a detection surface 40d
  • the mounting surface 11 A through hole 13 connected to the other side of the base 10 is opened, and the detection surface 40 d is disposed facing the through hole 13.
  • the environmental MEMS sensor 40c includes an environmental MEMS sensor 40c such as acoustics, temperature, humidity, pressure, gas, and particles.
  • the environmental MEMS sensor 40c can obtain external information (sound, temperature, humidity, pressure, gas, particles, etc.) through the through hole 13 on the substrate 10, so as to achieve the corresponding detection purpose. Both stability and reliability are excellent.
  • the active device 20 includes a first chip 21, the first chip 21 is a surface mount device, and the first chip 21 is mounted on the The mounting surface 11 is electrically connected to the base 10.
  • the first chip 21 is a surface mounted device (Surface Mounted Devices, SMD), which can be mounted using Surface Mounted Technology (SMT), which is not only mature in technology, but also convenient to assemble, which is beneficial to improve the system of the present invention.
  • SMD Surface Mounted Devices
  • SMT Surface Mounted Technology
  • the structural stability and functional reliability of the level package structure 100 At the same time, the production efficiency of the system-in-package structure 100 of the present invention can also be effectively improved, and resource consumption can be reduced.
  • the active device 20 further includes a second chip 23, and the second chip 23 is disposed on the first chip 21 facing away from the mounting surface 11.
  • the surface is electrically connected to the substrate 10 through wires.
  • the occupied area of the components on the substrate 10 can be effectively reduced, thereby effectively reducing the size of the substrate 10 and reducing the volume of the system-in-package structure 100 of the present invention, thereby effectively implementing the present invention Miniaturization of the system-in-package structure 100.
  • the first chip 21 is a Ball Grid Array Package (BGA) chip, a Quad Flat No-lead Package (QFN) chip or a wafer Wafer Level Chip Scale Packaging (WLCSP) chips.
  • BGA Ball Grid Array Package
  • QFN Quad Flat No-lead Package
  • WLCSP Wafer Level Chip Scale Packaging
  • ball grid array packaged chips can accommodate more pins than other chips such as dual in-line package chips and quad flat package chips; the entire chip The bottom surface of the can be used as pins instead of only the surroundings; at the same time, it can have a shorter average wire length than the surrounding package type, and has better high-speed performance.
  • the ball grid array package chip has another advantage, that is, there can be a lower thermal impedance between the chip and the substrate 10, which allows the heat generated inside the chip to be more easily conducted to the substrate 10, thereby effectively dissipating heat. , To avoid overheating of the chip.
  • the square flat no-lead package chip is a leadless package. It is square or rectangular. A large-area exposed pad is provided at the center of the bottom of the package for heat conduction. The large-area exposed pad is provided around the Sexually connected conductive pads.
  • the square flat no-lead package chip does not have the traditional gull-wing lead, the conductive path between the internal pin and the pad is short, the self-inductance and the internal wiring resistance are very low, so it can provide excellent electrical performance.
  • the quad flat no-lead package chip also has excellent heat dissipation performance due to the large area exposed pad at the bottom.
  • wafer-level chip-scale packaged chips can effectively reduce the package volume, so it can be matched with mobile terminals to meet the characteristics of portable products.
  • circuit wiring is short and thick, it can effectively increase the bandwidth of data transmission, reduce current consumption, and improve the stability of data transmission.
  • the system-in-package structure 100 further includes an auxiliary device 60 provided on the surface of the substrate 10 that faces away from the mounting surface 11.
  • the auxiliary device 60 may be an active device 20, a passive device 30, a microelectromechanical system device 40, and the like.
  • the auxiliary device 60 is a passive device 30 such as a resistor, a capacitor, and an inductor.
  • arranging the auxiliary device 60 on the surface of the substrate 10 facing away from the mounting surface 11 can further reduce the occupied area of the components on the substrate 10, thereby further reducing the size of the substrate 10 and reducing the volume of the system-in-package structure 100 of the present invention. Furthermore, the miniaturization of the system-in-package structure 100 of the present invention is effectively realized.
  • the present invention also provides an electronic device, which includes the system-in-package structure 100 as described above, and the specific structure of the system-in-package structure 100 refers to the foregoing embodiment. Since this electronic device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought about by all the technical solutions of all the foregoing embodiments, which will not be repeated here.
  • the electronic device may be a mobile phone, a notebook computer, a tablet computer, a wearable device, etc.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

一种***级封装结构（100）和应用该***级封装结构（100）的电子设备。其中，***级封装结构（100）包括：基底（10），所述基底（10）设有安装面（11）；有源器件（20），所述有源器件（20）设于所述安装面（11），并与所述基底（10）电性连接；无源器件（30），所述无源器件（30）设于所述安装面（11），并与所述基底（10）电性连接；微机电***器件（40），所述微机电***器件（40）设于所述安装面（11），并与所述基底（10）电性连接；塑封层（50），所述塑封层（50）设于所述安装面（11），并包覆所述有源器件（20）、所述无源器件（30）及所述微机电***器件（40）。该封装结构可缩短搭载有微机电***器件（40）的***级封装结构（100）的线路长度，减小寄生电容、电感，避免信号受到影响。

Description

***级封装结构和电子设备 技术领域
本发明涉及电子设备技术领域，特别涉及一种***级封装结构和应用该***级封装结构的电子设备。
背景技术
***级封装(System In a Package，SIP)是一种将有源器件(包括多种功能芯片，例如处理器、存储器等)和无源器件(例如电阻、电容、电感等)集成在一个封装内的封装形式。***级封装由于可以灵活地选择已有的封装进行集成，甚至可以进行3D堆叠，自由度大，因而被广泛应用于医疗电子、汽车电子、功率模块、图像感应器、手机、全球定位***、蓝牙等方面。但是，现有的搭载有微机电***器件的***级封装结构，普遍是通过柔性电路板将微机电***器件由***级封装结构内部引出，即，微机电***器件一般贴装在外部的柔性电路板或其他载体之上。这样便带来了如下缺陷：线路长，寄生电容、电感增大，影响信号。
上述内容仅用于辅助理解本发明的技术方案，并不代表承认上述内容为现有技术。
发明内容
本发明的主要目的是提供一种***级封装结构和应用该***级封装结构的电子设备，旨在缩短搭载有微机电***器件的***级封装结构的线路长度，减小寄生电容、电感，避免信号受到影响。
为实现上述目的，本发明的一实施例提出一种***级封装结构，该***级封装结构包括：
基底，所述基底设有安装面；
有源器件，所述有源器件设于所述安装面，并与所述基底电性连接；
无源器件，所述无源器件设于所述安装面，并与所述基底电性连接；
微机电***器件，所述微机电***器件设于所述安装面，并与所述基底电性连接；
塑封层，所述塑封层设于所述安装面，并包覆所述有源器件、所述无源器件及所述微机电***器件。
在本发明的一实施例中，所述微机电***器件包括微机电***传感器。
在本发明的一实施例中，所述微机电***传感器为运动类微机电***传感器。
在本发明的一实施例中，所述微机电***传感器为光学类微机电***传感器，所述光学类微机电***传感器设有探测面，所述塑封层为透明塑封层，所述探测面面向所述安装面的面朝方向设置。
在本发明的一实施例中，所述微机电***传感器为环境类微机电***传感器，所述环境类微机电***传感器设有探测面，所述安装面开设有连通所述基底另一侧的贯通孔，所述探测面面向所述贯通孔设置。
在本发明的一实施例中，所述有源器件包括第一芯片，所述第一芯片为表面贴装器件，所述第一芯片贴装于所述安装面，并与所述基底电性连接。
在本发明的一实施例中，所述有源器件还包括第二芯片，所述第二芯片设于所述第一芯片的背离所述安装面的表面，并通过导线与所述基底电性连接。
在本发明的一实施例中，所述第一芯片为球栅阵列封装芯片、方形扁平无引脚封装芯片或晶圆片级芯片规模封装芯片。
在本发明的一实施例中，所述***级封装结构还包括辅助器件，所述辅助器件设于所述基底的背离所述安装面的表面。
本发明的一实施例还提出一种电子设备，该电子设备包括***级封装结构，该***级封装结构包括：
基底，所述基底设有安装面；
有源器件，所述有源器件设于所述安装面，并与所述基底电性连接；
无源器件，所述无源器件设于所述安装面，并与所述基底电性连接；
微机电***器件，所述微机电***器件设于所述安装面，并与所述基底电性连接；
塑封层，所述塑封层设于所述安装面，并包覆所述有源器件、所述无源器件及所述微机电***器件。
本发明的技术方案，通过将微机电***器件与有源器件和无源器件进行一体化***级封装，便可得到集微机电***器件、有源器件、无源器件于一体的***级封装结构，从而实现整体封装结构紧凑小巧、连接简单的目的。同时，微机电***器件置于封装结构内部，还避免了柔性电路板的使用，缩短了搭载有微机电***器件的***级封装结构的线路长度，减小了寄生电容、电感，避免了信号受到影响。自然，也降低了封装成本。此外，微机电***器件封装于塑封层之中，还可有效保护微机电***器件，避免其外露而遭到损坏，从而进一步提升了微机电***器件的使用寿命和可靠性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明***级封装结构一实施例的结构示意图；
图2为本发明***级封装结构另一实施例的结构示意图；
图3为本发明***级封装结构又一实施例的结构示意图。
附图标号说明：
标号 名称 标号 名称
100 ***级封装结构 40 微机电***器件
10 基底 40a 运动类微机电***传感器
11 安装面 40b 光学类微机电***传感器
13 贯通孔 40c 环境类微机电***传感器
20 有源器件 40d 探测面
21 第一芯片 50 塑封层
23 第二芯片 60 辅助器件
30 无源器件    
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数 量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电性连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
另外，本发明各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
本发明提出一种***级封装结构100，该***级封装结构100可应用于手机、笔记本电脑、平板电脑以及穿戴设备等电子设备之中，旨在缩短搭载有微机电***器件40的***级封装结构100的线路长度，减小寄生电容、电感，避免信号受到影响。
以下将就本发明***级封装结构100的具体结构进行说明，并以***级封装结构100水平放置为例进行介绍：
如图1所示，在本发明***级封装结构100一实施例中，该***级封装结构100包括：
基底10，所述基底10设有安装面11；
有源器件20，所述有源器件20设于所述安装面11，并与所述基底10电性连接；
无源器件30，所述无源器件30设于所述安装面11，并与所述基底10电性连接；
微机电***器件40，所述微机电***器件40设于所述安装面11，并与所述基底10电性连接；
塑封层50，所述塑封层50设于所述安装面11，并包覆所述有源器件20、所述无源器件30及所述微机电***器件40。
具体地，基底10可采用电路板；有源器件20可以是电源、通讯、射频、控制等集成电路(Integrated Circuit，IC)器件，无源器件30可以是电容、电阻、电感等被动器件。微机电***(Micro-Electro-Mechanical System，MEMS)器件，包括微机电***传感器(即MEMS传感器)和微机电***执行器(即MEMS执行器)；MEMS执行器是将电信号转化为微动作或微操作的微机电***器件40，典型的MEMS执行器包括：微电动机、微开关、微夹钳等；光学类微机电***器件40中的数字微镜和各种微光学开关；射频微机电***器件40中的射频微开关；微流体微机电***器件40中的混合器、阀、泵等。塑封层50可由塑封胶固化形成。
可以理解的，本发明的技术方案，通过将微机电***器件40与有源器件20和无源器件30进行一体化***级封装，便可得到集微机电***器件40、有源器件20、无源器件30于一体的***级封装结构100，从而实现整体封装结构紧凑小巧、连接简单的目的。同时，微机电***器件40置于封装结构内部，还避免了柔性电路板的使用，缩短了搭载有微机电***器件40的***级封装结构100的线路长度，减小了寄生电容、电感，避免了信号受到影响。自然，也降低了封装成本。此外，微机电***器件40封装于塑封层50之中，还可有效保护微机电***器件40，避免其外露而遭到损坏，从而进一步提升了微机电***器件40的使用寿命和可靠性。
在本发明的一实施例中，所述微机电***器件40包括微机电***传感器。具体地，微机电***传感器包括但不限于运动类微机电***传感器40a、光学类微机电***传感器40b、环境类微机电***传感器40c。
下面将对微机电***器件40包括微机电***传感器的设置，进行具体实施例的介绍：
如图1所示，在本发明的一实施例中，所述微机电***传感器为运动类微机电***传感器40a。具体地，运动类微机电***传感器40a可以是加速度计、陀螺仪、磁力计等。此时，不仅可保障相应的检测功能，而且对塑封 层50和基底10的设置无特殊要求，结构简单、制造方便，稳定性和可靠性均优异。
如图2所示，在本发明的一实施例中，所述微机电***传感器为光学类微机电***传感器40b，所述光学类微机电***传感器40b设有探测面40d，所述塑封层50为透明塑封层50，所述探测面40d面向所述安装面11的面朝方向设置。
具体地，光学类微机电***传感器40b可以为环境光传感器(Ambient Light Sensor，ALS)、颜色传感器、接近度传感器(Proximity Sensor，PS)、热释电红外传感器、光学指纹传感器、3D感应光传感器等。
此时，光学类微机电***传感器40b可通过透明塑封层50实现对外界信息(光信号)的获取，从而达到相应的检测目的。稳定性和可靠性均优异。
如图3所示，在本发明的一实施例中，所述微机电***传感器为环境类微机电***传感器40c，所述环境类微机电***传感器40c设有探测面40d，所述安装面11开设有连通所述基底10另一侧的贯通孔13，所述探测面40d面向所述贯通孔13设置。
具体地，环境类微机电***传感器40c包括声学、温度、湿度、压力、气体、颗粒等环境类微机电***传感器40c。
此时，环境类微机电***传感器40c可通过基底10上的贯通孔13实现对外界信息(声音、温度、湿度、压力、气体、颗粒等)的获取，从而达到相应的检测目的。稳定性和可靠性均优异。
下面将对有源器件20的具体设置进行介绍：
如图1所示，在本发明的一实施例中，所述有源器件20包括第一芯片21，所述第一芯片21为表面贴装器件，所述第一芯片21贴装于所述安装面11，并与所述基底10电性连接。
第一芯片21为表面贴装器件(Surface Mounted Devices，SMD)，其可采用表面贴装技术(Surface Mounted Technology，SMT)进行贴装，不仅工艺成熟，而且组装方便，从而有利于提升本发明***级封装结构100的结构 稳定性和功能可靠性。同时，还可有效提升本发明***级封装结构100的生产效率，降低资源消耗。
如图1所示，在本发明的一实施例中，所述有源器件20还包括第二芯片23，所述第二芯片23设于所述第一芯片21的背离所述安装面11的表面，并通过导线与所述基底10电性连接。
通过将第一芯片21和第二芯片23层叠设置，可有效减省基底10上元器件的占用面积，从而有效降低基底10大小，降低本发明***级封装结构100的体积，进而有效实现本发明***级封装结构100的小型化。
在本发明的一实施例中，所述第一芯片21为球栅阵列封装(Ball Grid Array Package，BGA)芯片、方形扁平无引脚封装(Quad Flat No-lead Package，QFN)芯片或晶圆片级芯片规模封装(Wafer Level Chip Scale Packaging，WLCSP)芯片。
具体地，球栅阵列封装芯片，能够比其他的如双列直插封装(Dual in-line package)芯片、四侧引脚扁平封装(Quad Flat Package)芯片等容纳更多的接脚；整个芯片的底部表面可全作为接脚使用，而不是只有周围可使用；同时，比起周围限定的封装类型还能具有更短的平均导线长度，具备更佳的高速效能。此外，球栅阵列封装芯片还具有另一个优势，那就是在芯片与基底10之间能有较低的热阻抗，这可以让芯片内部产生的热能够更加容易传导至基底10，从而进行有效散热，避免芯片过热。
方形扁平无引脚封装芯片，是一种无引脚封装，呈正方形或矩形，封装底部中央位置设置有一个大面积裸露焊盘用来导热，该大面积裸露焊盘的四周设置有用于实现电性连接的导电焊盘。方形扁平无引脚封装芯片不具有传统的鸥翼状引线，其内部引脚与焊盘之间的导电路径短，自感系数以及内部布线电阻很低，所以它能提供卓越的电性能。此外，方形扁平无引脚封装芯片由于底部大面积裸露焊盘的存在还具有出色的散热性能。
晶圆片级芯片规模封装芯片，其最大特点便是可有效地缩减封装体积，故可搭配于移动终端之上而符合便携式产品轻薄短小的特性需求。同时，其 由于电路布线的线路短且厚，故可有效增加数据传输的频宽、减少电流耗损，进而提升数据传输的稳定性。
如图1所示，在本发明的一实施例中，所述***级封装结构100还包括辅助器件60，所述辅助器件60设于所述基底10的背离所述安装面11的表面。具体地，辅助器件60可以为有源器件20、无源器件30、微机电***器件40等。一般情况下，辅助器件60为电阻、电容、电感等无源器件30。
可以理解的，将辅助器件60设置于基底10的背离安装面11的表面，可进一步降低基底10上元器件的占用面积，从而进一步降低基底10大小，降低本发明***级封装结构100的体积，进而有效实现本发明***级封装结构100的小型化。
本发明还提出一种电子设备，该电子设备包括如前所述的***级封装结构100，该***级封装结构100的具体结构参照前述实施例。由于本电子设备采用了前述所有实施例的全部技术方案，因此至少具有前述所有实施例的全部技术方案所带来的所有有益效果，在此不再一一赘述。
可以理解的，电子设备可以是手机、笔记本电脑、平板电脑、穿戴设备等。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (10)

  1. 一种***级封装结构，应用于电子设备，其特征在于，包括：
    基底，所述基底设有安装面；
    有源器件，所述有源器件设于所述安装面，并与所述基底电性连接；
    无源器件，所述无源器件设于所述安装面，并与所述基底电性连接；
    微机电***器件，所述微机电***器件设于所述安装面，并与所述基底电性连接；
    塑封层，所述塑封层设于所述安装面，并包覆所述有源器件、所述无源器件及所述微机电***器件。
  2. 如权利要求1所述的***级封装结构，其特征在于，所述微机电***器件包括微机电***传感器。
  3. 如权利要求2所述的***级封装结构，其特征在于，所述微机电***传感器为运动类微机电***传感器。
  4. 如权利要求2所述的***级封装结构，其特征在于，所述微机电***传感器为光学类微机电***传感器，所述光学类微机电***传感器设有探测面，所述塑封层为透明塑封层，所述探测面面向所述安装面的面朝方向设置。
  5. 如权利要求2所述的***级封装结构，其特征在于，所述微机电***传感器为环境类微机电***传感器，所述环境类微机电***传感器设有探测面，所述安装面开设有连通所述基底另一侧的贯通孔，所述探测面面向所述贯通孔设置。
  6. 如权利要求1至5中任一项所述的***级封装结构，其特征在于，所述有源器件包括第一芯片，所述第一芯片为表面贴装器件，所述第一芯片 贴装于所述安装面，并与所述基底电性连接。
  7. 如权利要求6所述的***级封装结构，其特征在于，所述有源器件还包括第二芯片，所述第二芯片设于所述第一芯片的背离所述安装面的表面，并通过导线与所述基底电性连接。
  8. 如权利要求6所述的***级封装结构，其特征在于，所述第一芯片为球栅阵列封装芯片、方形扁平无引脚封装芯片或晶圆片级芯片规模封装芯片。
  9. 如权利要求1至5中任一项所述的***级封装结构，其特征在于，所述***级封装结构还包括辅助器件，所述辅助器件设于所述基底的背离所述安装面的表面。
  10. 一种电子设备，其特征在于，包括如权利要求1至9中任一项所述的***级封装结构。
PCT/CN2019/123544 2019-09-29 2019-12-06 ***级封装结构和电子设备 WO2021056827A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203236987U (zh) * 2013-05-15 2013-10-16 中国电子科技集团公司第三十八研究所 一种基于sip封装的汽车胎压监测多芯片传感器模块
CN105939506A (zh) * 2015-03-05 2016-09-14 意法半导体(马耳他)有限公司 用于声学应用的具有污染防护元件的半导体集成设备及其制造方法
CN109216298A (zh) * 2018-08-10 2019-01-15 华进半导体封装先导技术研发中心有限公司 一种扇出型芯片封装结构及其制造方法
CN109671700A (zh) * 2018-12-26 2019-04-23 华进半导体封装先导技术研发中心有限公司 一种扇出型芯片封装结构及其制造方法
CN209396878U (zh) * 2018-11-26 2019-09-17 罗伯特·博世有限公司 传感器及其封装组件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203236987U (zh) * 2013-05-15 2013-10-16 中国电子科技集团公司第三十八研究所 一种基于sip封装的汽车胎压监测多芯片传感器模块
CN105939506A (zh) * 2015-03-05 2016-09-14 意法半导体(马耳他)有限公司 用于声学应用的具有污染防护元件的半导体集成设备及其制造方法
CN109216298A (zh) * 2018-08-10 2019-01-15 华进半导体封装先导技术研发中心有限公司 一种扇出型芯片封装结构及其制造方法
CN209396878U (zh) * 2018-11-26 2019-09-17 罗伯特·博世有限公司 传感器及其封装组件
CN109671700A (zh) * 2018-12-26 2019-04-23 华进半导体封装先导技术研发中心有限公司 一种扇出型芯片封装结构及其制造方法

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