WO2021056827A1 - Structure de système en boîtier et équipement électronique - Google Patents

Structure de système en boîtier et équipement électronique Download PDF

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Publication number
WO2021056827A1
WO2021056827A1 PCT/CN2019/123544 CN2019123544W WO2021056827A1 WO 2021056827 A1 WO2021056827 A1 WO 2021056827A1 CN 2019123544 W CN2019123544 W CN 2019123544W WO 2021056827 A1 WO2021056827 A1 WO 2021056827A1
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WO
WIPO (PCT)
Prior art keywords
package structure
chip
mounting surface
substrate
mems sensor
Prior art date
Application number
PCT/CN2019/123544
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English (en)
Chinese (zh)
Inventor
王德信
宋其超
宋青林
Original Assignee
歌尔微电子有限公司
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Application filed by 歌尔微电子有限公司 filed Critical 歌尔微电子有限公司
Publication of WO2021056827A1 publication Critical patent/WO2021056827A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Definitions

  • the present invention relates to the technical field of electronic equipment, in particular to a system-in-package structure and an electronic device using the system-in-package structure.
  • System-in-a-package is a kind of integration of active devices (including multiple functional chips, such as processors, memory, etc.) and passive devices (such as resistors, capacitors, inductors, etc.) in one package
  • the package form because it can flexibly choose existing packages for integration, or even 3D stacking, and has a large degree of freedom, so it is widely used in medical electronics, automotive electronics, power modules, image sensors, mobile phones, global positioning systems, Bluetooth etc.
  • the existing system-level packaging structures equipped with MEMS devices generally use flexible circuit boards to draw the MEMS devices from the system-level packaging structure. That is, the MEMS devices are generally mounted on the external flexible circuit. Board or other carrier. This brings about the following defects: the line is long, the parasitic capacitance and inductance increase, and the signal is affected.
  • the main purpose of the present invention is to provide a system-in-package structure and electronic equipment using the system-in-package structure, aiming to shorten the line length of the system-in-package structure equipped with MEMS devices, reduce parasitic capacitance and inductance, and avoid The signal is affected.
  • an embodiment of the present invention provides a system-in-package structure, which includes:
  • a base the base is provided with a mounting surface
  • An active device the active device is arranged on the mounting surface and is electrically connected to the substrate;
  • Passive devices the passive devices are arranged on the mounting surface and are electrically connected to the substrate;
  • a micro-electro-mechanical system device the micro-electro-mechanical system device is arranged on the mounting surface and is electrically connected to the substrate;
  • the plastic encapsulation layer is arranged on the mounting surface and covers the active device, the passive device and the microelectromechanical system device.
  • the MEMS device includes a MEMS sensor.
  • the MEMS sensor is a motion type MEMS sensor.
  • the MEMS sensor is an optical MEMS sensor
  • the optical MEMS sensor is provided with a detection surface
  • the plastic encapsulation layer is a transparent plastic encapsulation layer
  • the detection surface faces The mounting surface faces the direction.
  • the microelectromechanical system sensor is an environmental microelectromechanical system sensor
  • the environmental microelectromechanical system sensor is provided with a detection surface
  • the mounting surface is provided with a connecting surface connected to the other side of the substrate. Through holes, the detection surface is arranged facing the through holes.
  • the active device includes a first chip, the first chip is a surface mount device, and the first chip is mounted on the mounting surface and is electrically connected to the substrate. connection.
  • the active device further includes a second chip, and the second chip is provided on a surface of the first chip facing away from the mounting surface, and is electrically connected to the substrate through a wire. connection.
  • the first chip is a ball grid array packaged chip, a quad flat no-lead packaged chip, or a wafer-level chip-scale packaged chip.
  • the system-in-package structure further includes an auxiliary device, and the auxiliary device is provided on a surface of the substrate that faces away from the mounting surface.
  • An embodiment of the present invention also provides an electronic device, the electronic device includes a system-in-package structure, and the system-in-package structure includes:
  • a base the base is provided with a mounting surface
  • An active device the active device is arranged on the mounting surface and is electrically connected to the substrate;
  • Passive devices the passive devices are arranged on the mounting surface and are electrically connected to the substrate;
  • a micro-electro-mechanical system device the micro-electro-mechanical system device is arranged on the mounting surface and is electrically connected to the substrate;
  • the plastic encapsulation layer is arranged on the mounting surface and covers the active device, the passive device and the microelectromechanical system device.
  • the technical scheme of the present invention can obtain a system-level packaging structure integrating micro-electro-mechanical system devices, active devices, and passive devices by integrating micro-electro-mechanical system devices with active devices and passive devices.
  • the MEMS device is placed inside the package structure, which also avoids the use of flexible circuit boards, shortens the line length of the system-in-package structure equipped with MEMS devices, reduces parasitic capacitance and inductance, and avoids signal exposure. influences.
  • the packaging cost is also reduced.
  • the MEMS device is packaged in the plastic encapsulation layer, which can also effectively protect the MEMS device from being exposed and damaged, thereby further improving the service life and reliability of the MEMS device.
  • FIG. 1 is a schematic structural diagram of an embodiment of the system-in-package structure of the present invention
  • FIG. 2 is a schematic structural diagram of another embodiment of the system-in-package structure of the present invention.
  • FIG. 3 is a schematic structural diagram of another embodiment of the system-in-package structure of the present invention.
  • the terms “connected”, “fixed”, etc. should be interpreted broadly.
  • “fixed” can be a fixed connection, a detachable connection, or a whole; It can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components or the interaction relationship between two components, unless specifically defined otherwise.
  • the specific meanings of the above-mentioned terms in the present invention can be understood according to specific situations.
  • the present invention proposes a system-in-package structure 100, which can be applied to electronic devices such as mobile phones, notebook computers, tablet computers, and wearable devices, and aims to shorten the system-level packaging of the MEMS device 40.
  • the line length of the structure 100 reduces parasitic capacitance and inductance, and prevents signals from being affected.
  • the system-in-package structure 100 includes:
  • the base 10 is provided with a mounting surface 11;
  • the active device 20 is provided on the mounting surface 11 and is electrically connected to the substrate 10;
  • the passive device 30 is provided on the mounting surface 11 and is electrically connected to the substrate 10;
  • the MEMS device 40 is provided on the mounting surface 11 and is electrically connected to the substrate 10;
  • the plastic encapsulation layer 50 is provided on the mounting surface 11 and covers the active device 20, the passive device 30 and the MEMS device 40.
  • the substrate 10 may be a circuit board;
  • the active device 20 may be an integrated circuit (IC) device such as power supply, communication, radio frequency, and control, and the passive device 30 may be a passive device such as a capacitor, a resistor, and an inductor.
  • IC integrated circuit
  • Micro-Electro-Mechanical System (MEMS) devices including micro-electro-mechanical system sensors (ie MEMS sensors) and micro-electro-mechanical system actuators (ie MEMS actuators); MEMS actuators convert electrical signals into micro-actions or Micro-operated micro-electromechanical system device 40
  • typical MEMS actuators include: micro-motor, micro-switch, micro-clamp, etc.; digital micro-mirror and various micro-optical switches in optical micro-electro-mechanical system device 40; radio frequency micro-electro-mechanical system The radio frequency microswitch in the device 40; the mixer, valve, pump, etc. in the microfluidic microelectromechanical system device 40.
  • the molding layer 50 may be formed by curing a molding compound.
  • the technical solution of the present invention can obtain integrated system-level packaging of the MEMS device 40, the active device 20, and the passive device 30 by integrating the MEMS device 40, the active device 20, and the passive device 30.
  • the source device 30 is integrated into the system-in-package structure 100, thereby achieving the purpose of compactness and simple connection of the overall package structure.
  • the MEMS device 40 is placed inside the package structure, which also avoids the use of flexible circuit boards, shortens the line length of the system-in-package structure 100 equipped with the MEMS device 40, reduces parasitic capacitance and inductance, and avoids The signal is affected. Naturally, the packaging cost is also reduced.
  • the MEMS device 40 is encapsulated in the plastic encapsulation layer 50, which can also effectively protect the MEMS device 40 from being exposed and damaged, thereby further improving the service life and reliability of the MEMS device 40.
  • the MEMS device 40 includes a MEMS sensor.
  • the MEMS sensor includes, but is not limited to, a motion MEMS sensor 40a, an optical MEMS sensor 40b, and an environmental MEMS sensor 40c.
  • the MEMS sensor is a motion MEMS sensor 40a.
  • the sports MEMS sensor 40a may be an accelerometer, a gyroscope, a magnetometer, or the like.
  • the structure is simple, the manufacturing is convenient, and the stability and reliability are excellent.
  • the MEMS sensor is an optical MEMS sensor 40b
  • the optical MEMS sensor 40b is provided with a detection surface 40d
  • the plastic encapsulation layer 50 It is a transparent plastic encapsulation layer 50
  • the detecting surface 40d is arranged in a direction facing the mounting surface 11.
  • the optical MEMS sensor 40b may be an ambient light sensor (Ambient Light Sensor, ALS), a color sensor, a proximity sensor (PS), a pyroelectric infrared sensor, an optical fingerprint sensor, or a 3D sensing light sensor. Wait.
  • Ambient Light Sensor ALS
  • a color sensor e.g., a CCD sensor
  • PS proximity sensor
  • a pyroelectric infrared sensor e.g., a pyroelectric infrared sensor
  • an optical fingerprint sensor e.g., a 3D sensing light sensor.
  • the optical MEMS sensor 40b can obtain external information (light signals) through the transparent plastic encapsulation layer 50, so as to achieve the corresponding detection purpose. Both stability and reliability are excellent.
  • the MEMS sensor is an environmental MEMS sensor 40c
  • the environmental MEMS sensor 40c is provided with a detection surface 40d
  • the mounting surface 11 A through hole 13 connected to the other side of the base 10 is opened, and the detection surface 40 d is disposed facing the through hole 13.
  • the environmental MEMS sensor 40c includes an environmental MEMS sensor 40c such as acoustics, temperature, humidity, pressure, gas, and particles.
  • the environmental MEMS sensor 40c can obtain external information (sound, temperature, humidity, pressure, gas, particles, etc.) through the through hole 13 on the substrate 10, so as to achieve the corresponding detection purpose. Both stability and reliability are excellent.
  • the active device 20 includes a first chip 21, the first chip 21 is a surface mount device, and the first chip 21 is mounted on the The mounting surface 11 is electrically connected to the base 10.
  • the first chip 21 is a surface mounted device (Surface Mounted Devices, SMD), which can be mounted using Surface Mounted Technology (SMT), which is not only mature in technology, but also convenient to assemble, which is beneficial to improve the system of the present invention.
  • SMD Surface Mounted Devices
  • SMT Surface Mounted Technology
  • the structural stability and functional reliability of the level package structure 100 At the same time, the production efficiency of the system-in-package structure 100 of the present invention can also be effectively improved, and resource consumption can be reduced.
  • the active device 20 further includes a second chip 23, and the second chip 23 is disposed on the first chip 21 facing away from the mounting surface 11.
  • the surface is electrically connected to the substrate 10 through wires.
  • the occupied area of the components on the substrate 10 can be effectively reduced, thereby effectively reducing the size of the substrate 10 and reducing the volume of the system-in-package structure 100 of the present invention, thereby effectively implementing the present invention Miniaturization of the system-in-package structure 100.
  • the first chip 21 is a Ball Grid Array Package (BGA) chip, a Quad Flat No-lead Package (QFN) chip or a wafer Wafer Level Chip Scale Packaging (WLCSP) chips.
  • BGA Ball Grid Array Package
  • QFN Quad Flat No-lead Package
  • WLCSP Wafer Level Chip Scale Packaging
  • ball grid array packaged chips can accommodate more pins than other chips such as dual in-line package chips and quad flat package chips; the entire chip The bottom surface of the can be used as pins instead of only the surroundings; at the same time, it can have a shorter average wire length than the surrounding package type, and has better high-speed performance.
  • the ball grid array package chip has another advantage, that is, there can be a lower thermal impedance between the chip and the substrate 10, which allows the heat generated inside the chip to be more easily conducted to the substrate 10, thereby effectively dissipating heat. , To avoid overheating of the chip.
  • the square flat no-lead package chip is a leadless package. It is square or rectangular. A large-area exposed pad is provided at the center of the bottom of the package for heat conduction. The large-area exposed pad is provided around the Sexually connected conductive pads.
  • the square flat no-lead package chip does not have the traditional gull-wing lead, the conductive path between the internal pin and the pad is short, the self-inductance and the internal wiring resistance are very low, so it can provide excellent electrical performance.
  • the quad flat no-lead package chip also has excellent heat dissipation performance due to the large area exposed pad at the bottom.
  • wafer-level chip-scale packaged chips can effectively reduce the package volume, so it can be matched with mobile terminals to meet the characteristics of portable products.
  • circuit wiring is short and thick, it can effectively increase the bandwidth of data transmission, reduce current consumption, and improve the stability of data transmission.
  • the system-in-package structure 100 further includes an auxiliary device 60 provided on the surface of the substrate 10 that faces away from the mounting surface 11.
  • the auxiliary device 60 may be an active device 20, a passive device 30, a microelectromechanical system device 40, and the like.
  • the auxiliary device 60 is a passive device 30 such as a resistor, a capacitor, and an inductor.
  • arranging the auxiliary device 60 on the surface of the substrate 10 facing away from the mounting surface 11 can further reduce the occupied area of the components on the substrate 10, thereby further reducing the size of the substrate 10 and reducing the volume of the system-in-package structure 100 of the present invention. Furthermore, the miniaturization of the system-in-package structure 100 of the present invention is effectively realized.
  • the present invention also provides an electronic device, which includes the system-in-package structure 100 as described above, and the specific structure of the system-in-package structure 100 refers to the foregoing embodiment. Since this electronic device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought about by all the technical solutions of all the foregoing embodiments, which will not be repeated here.
  • the electronic device may be a mobile phone, a notebook computer, a tablet computer, a wearable device, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne une structure de système en boîtier (100) et un équipement électronique l'appliquant. La structure de système en boîtier (100) comprend : un substrat (10) pourvu d'une surface de montage (11) ; un dispositif actif (20) disposé sur la surface de montage (11) et connecté électriquement au substrat (10) ; un dispositif passif (30) disposé sur la surface de montage (11) et connecté électriquement au substrat (10) ; un dispositif de système microélectromécanique (40) disposé sur la surface de montage (11) et connecté électriquement au substrat (10) ; et une couche de mise en boîtier en plastique (50) qui est disposée sur la surface de montage (11) et recouvre le dispositif actif (20), le dispositif passif (30), et le dispositif de système microélectromécanique (40). La structure d'emballage peut raccourcir la longueur de circuit de la structure de système en boîtier (100) sur laquelle est monté le dispositif de système microélectromécanique (40), réduire la capacité parasite et l'inductance et éviter l'impact sur des signaux.
PCT/CN2019/123544 2019-09-29 2019-12-06 Structure de système en boîtier et équipement électronique WO2021056827A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201921642048.7U CN210156374U (zh) 2019-09-29 2019-09-29 ***级封装结构和电子设备
CN201921642048.7 2019-09-29

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WO2021056827A1 true WO2021056827A1 (fr) 2021-04-01

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203236987U (zh) * 2013-05-15 2013-10-16 中国电子科技集团公司第三十八研究所 一种基于sip封装的汽车胎压监测多芯片传感器模块
CN105939506A (zh) * 2015-03-05 2016-09-14 意法半导体(马耳他)有限公司 用于声学应用的具有污染防护元件的半导体集成设备及其制造方法
CN109216298A (zh) * 2018-08-10 2019-01-15 华进半导体封装先导技术研发中心有限公司 一种扇出型芯片封装结构及其制造方法
CN109671700A (zh) * 2018-12-26 2019-04-23 华进半导体封装先导技术研发中心有限公司 一种扇出型芯片封装结构及其制造方法
CN209396878U (zh) * 2018-11-26 2019-09-17 罗伯特·博世有限公司 传感器及其封装组件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203236987U (zh) * 2013-05-15 2013-10-16 中国电子科技集团公司第三十八研究所 一种基于sip封装的汽车胎压监测多芯片传感器模块
CN105939506A (zh) * 2015-03-05 2016-09-14 意法半导体(马耳他)有限公司 用于声学应用的具有污染防护元件的半导体集成设备及其制造方法
CN109216298A (zh) * 2018-08-10 2019-01-15 华进半导体封装先导技术研发中心有限公司 一种扇出型芯片封装结构及其制造方法
CN209396878U (zh) * 2018-11-26 2019-09-17 罗伯特·博世有限公司 传感器及其封装组件
CN109671700A (zh) * 2018-12-26 2019-04-23 华进半导体封装先导技术研发中心有限公司 一种扇出型芯片封装结构及其制造方法

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