WO2021051787A1 - 一种显示装置及背光模组 - Google Patents

一种显示装置及背光模组 Download PDF

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Publication number
WO2021051787A1
WO2021051787A1 PCT/CN2020/083856 CN2020083856W WO2021051787A1 WO 2021051787 A1 WO2021051787 A1 WO 2021051787A1 CN 2020083856 W CN2020083856 W CN 2020083856W WO 2021051787 A1 WO2021051787 A1 WO 2021051787A1
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WO
WIPO (PCT)
Prior art keywords
transparent substrate
circuit board
display device
light emitting
glue layer
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Application number
PCT/CN2020/083856
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English (en)
French (fr)
Inventor
李富琳
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海信视像科技股份有限公司
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Publication of WO2021051787A1 publication Critical patent/WO2021051787A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details

Definitions

  • This application relates to the field of liquid crystal display, and in particular to a display device and a backlight module.
  • High-Dynamic Range (HDR) technology can provide more dynamic performance and image details, can better reflect the visual effects of objects in the real environment, and is generally considered to cause display The next change in the field. At the same time, HDR technology also puts forward higher requirements for liquid crystal display terminals-finer zone control and contrast.
  • the size of a mini LED is about 50 ⁇ m-300 ⁇ m. Using a huge number of mini LED dies as the backlight source and applied to the liquid crystal display field can not only realize the thinning of the backlight module, but also realize more refined dynamic control and improve the dynamic contrast of the liquid crystal display.
  • a diffuser support is usually placed between the light board and the diffuser to complete light mixing.
  • the LED spacing of the mini LED light board is very small, generally less than 5mm, which is not enough to place the diffuser support, so it is difficult to achieve conventional methods.
  • the application provides a display device and a backlight module for optimizing the light mixing effect.
  • a display device including: a backlight module and a display panel located on the light emitting side of the backlight module;
  • the backlight module includes: a circuit board, a plurality of micro light emitting diodes arranged on the circuit board, covering the plurality of micro light emitting diodes and a protective glue layer of the circuit board, arranged on the protective glue layer away from A transparent substrate on one side of the circuit board, and a diffuser plate disposed on the side of the transparent substrate away from the circuit board;
  • the thickness of the transparent substrate satisfies the light mixing distance of the micro light emitting diode.
  • the surface of the transparent substrate facing the protective adhesive layer is an uneven surface.
  • the uneven surface has a plurality of strip-shaped concave-convex edges arranged in parallel.
  • the surface of the transparent substrate facing the protective glue layer is coated with a scattering coating, and the scattering coating includes a colloidal layer and a colloidal layer. Of scattering particles.
  • a bonding adhesive layer is further included between the transparent substrate and the protective adhesive layer, and the bonding adhesive layer is in contact with the transparent substrate and the protective adhesive layer. There is no gap between the protective glue layers.
  • the backlight module further includes an optical film group disposed on a side of the diffusion sheet away from the transparent substrate.
  • the size of the micro light-emitting diode is 50 ⁇ m-300 ⁇ m.
  • the material of the protective glue layer is silica gel or epoxy resin.
  • the material of the transparent substrate is polymethyl methacrylate or polycarbonate.
  • a backlight module includes a circuit board, a plurality of micro light emitting diodes arranged on the circuit board, a protective glue layer covering the plurality of micro light emitting diodes and the circuit board, and arranged on a side of the protective glue layer away from the circuit board A transparent substrate of, and a diffuser plate disposed on the side of the transparent substrate away from the circuit board;
  • the thickness of the transparent substrate satisfies the light mixing distance of the micro light emitting diode.
  • the display device and the backlight module provided by the present application include a circuit board, a plurality of micro light emitting diodes arranged on the circuit board, covering the plurality of micro light emitting diodes and a protective glue layer of the circuit board, and arranged on the circuit board.
  • the protective adhesive layer has a transparent substrate on the side facing away from the circuit board, and a diffuser plate arranged on the side of the transparent substrate facing away from the circuit board; wherein the thickness of the transparent substrate meets the light mixing ratio of the micro light emitting diode distance.
  • the transparent substrate is used as the supporting structure between the protective glue layer and the diffuser, so that the light emitted by the micro light emitting diode can be fully mixed before reaching the diffuser, and the light mixing effect is optimized.
  • FIG. 1 is one of the schematic structural diagrams of a display device provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of the optical path of a transparent substrate provided by an embodiment of the application.
  • FIG. 3 is the second structural diagram of the display device provided by the embodiment of the application.
  • FIG. 5 is a schematic diagram of the structure of a transparent substrate provided by an embodiment of the application.
  • FIG. 6 is the fourth structural diagram of the display device provided by the embodiment of the application.
  • FIG. 7 is a schematic diagram of the structure of a scattering coating provided by an embodiment of the application.
  • FIG. 8 is the fifth schematic diagram of the structure of the display device provided by the embodiment of the present application.
  • FIG. 9 is a sixth structural diagram of the display device provided by the embodiment of the present application.
  • FIG. 10 is the seventh structural diagram of the display device provided by the embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a backlight module provided by an embodiment of the application.
  • the display device includes a backlight module 10 and a display panel 20 located on the light emitting side of the backlight module 10.
  • the display panel 20 is located on the light emitting side of the backlight module 10. It has a plurality of pixel units arranged in an array, and each pixel unit can independently control the light transmittance and color of the backlight module 10 incident on the pixel unit, so that the light transmitted by all the pixel units constitutes the display to be displayed Image.
  • the backlight module 10 can uniformly emit light in the entire light-emitting surface, and is used to provide the display panel 20 with light with sufficient brightness and uniform distribution, so that the display panel 20 can display images normally.
  • the backlight module 10 includes: a circuit board 101, a plurality of micro light emitting diodes 102 arranged on the circuit board 101, a protective glue layer 103 covering the plurality of micro light emitting diodes 102 and the circuit board 101, arranged on the protective glue layer 103
  • the transparent substrate 104 on the side facing away from the circuit board 101 and the diffuser 105 disposed on the side of the transparent substrate 104 facing away from the circuit board 101.
  • the circuit board 101 is used to provide driving electrical signals for the micro light emitting diodes.
  • the circuit board 101 is provided with solder feet and circuit lines.
  • the electrodes of the micro light emitting diode 102 are welded to the solder feet of the circuit board 101 through a welding process.
  • the circuit lines are used to electrically connect the micro light emitting diodes 102 to each other and the micro light emitting diodes. 102 is electrically connected to an external power drive board (not shown in the figure).
  • the circuit board 101 is a printed circuit board (Printed Circuit Board, PCB for short).
  • the PCB includes an electronic circuit and an insulating layer.
  • the insulating layer exposes the solder pins of the electronic circuit for welding the miniature light-emitting diode 102 to the outside. Cover the rest.
  • the circuit board 101 is an array substrate formed by arranging a thin film transistor driving circuit on a base substrate.
  • the surface of the array substrate has connection electrodes connected to the thin film transistor driving circuit, and the electrodes of each micro light emitting diode 102 Weld in one-to-one correspondence with each connecting electrode.
  • the substrate or base substrate of the above circuit board 101 can be made of flexible materials to form a flexible display device.
  • the circuit board 101 is plate-shaped, and the whole is rectangular or square.
  • the length of the circuit board 101 is 200-800mm, and the width is 100-500mm.
  • the display device may include a plurality of circuit boards 101, and the circuit boards 101 are spliced together to form a light board structure.
  • the seams between adjacent circuit boards 101 should be as small as possible, and even seamless splicing can be realized.
  • a plurality of miniature light emitting diodes 102 are used to emit light from the light source.
  • the micro light emitting diodes are fixed on one side surface of the circuit board 101 by welding, and a plurality of micro light emitting diodes 102 are arranged in rows or columns, and the distance between two adjacent micro light emitting diodes 102 is less than 5 mm.
  • the size of the miniature light-emitting diode in the embodiment of the present application is about 50 ⁇ m-300 ⁇ m.
  • the micro light emitting diode 101 is different from ordinary light emitting diodes, and specifically refers to a micro light emitting diode chip.
  • the small size of the light-emitting chip is conducive to controlling the dynamic light emission to a smaller partition, and further improving the contrast of the picture.
  • the micro light emitting diode 102 is a monochromatic micro light emitting diode.
  • the protective glue layer 103 functions to encapsulate the micro light emitting diode 102, thereby effectively preventing the occurrence of unfavorable conditions such as falling off and moisture of the micro light emitting diode.
  • the material used for the protective glue layer 103 includes silica gel or epoxy resin. It is also possible to use other materials whose light transmittance is close to the two.
  • the protective glue layer 103 is formed by spraying.
  • the distance between the upper surface of the protective glue layer 103 and the upper surface of the micro light emitting diode 102 is 100-300 ⁇ m.
  • the transparent substrate 104 can transmit light from the micro light emitting diode 102 and is used to support the diffusion plate 105.
  • the material of the transparent substrate 104 may be selected from at least one of polymethyl methacrylate or polycarbonate. However, it is not limited to this, and the transparent substrate 104 can also be made of other materials with high reflectivity and low absorbance. This is because light is reflected multiple times inside the transparent substrate 104. The use of materials with high reflectivity and low absorbance can minimize the attenuation of light as it propagates in the transparent substrate 104, thereby improving the light utilization rate of the backlight module. , Reduce power consumption.
  • the transparent substrate 104 serves as a supporting structure of the diffuser plate 105, so that the light emitted by the micro light emitting diode 102 can be fully mixed before reaching the diffuser plate.
  • the thickness of the transparent substrate 104 satisfies the light mixing distance of the micro light emitting diode 102, so that the light emitted by the micro light emitting diode can be fully mixed when reaching the diffuser 105 to ensure the backlight effect.
  • the thickness of the transparent substrate 104 is not greater than 10 mm.
  • the diffuser 105 continuously refracts and reflects light when passing through the diffuser, so as to achieve the effect of dispersing the light, thereby realizing the effect of uniform light.
  • the material used for the diffusion plate is generally selected from at least one of polymethyl methacrylate PMMA, polycarbonate PC, polystyrene-based material PS, and polypropylene PP.
  • the backlight module 10 does not have a diffuser support frame for supporting the diffuser 105 between the circuit board 101 and the diffuser 105.
  • the micro light emitting diode 102 is used as a point light source. Its emergent light type is in a cone shape, and the light intensity at the edge is less than the light intensity at the center. Therefore, it is necessary to mix the light in the edge area of two adjacent micro light emitting diodes to make the mixing. The difference between the light intensity of the light area and the light intensity of the central area is reduced. At present, the distance between the micro light emitting diodes 102 is very small, and it is not enough to place the diffuser support to complete the light mixing. Therefore, in the embodiment of the present application, the transparent substrate 104 is used to support the diffuser 105 so that the distance between the micro light emitting diode 102 and the diffuser 105 can be drawn.
  • the thickness of the transparent substrate 104 meets the light mixing distance of the micro light emitting diode 102, so that the light emitted by the micro light emitting diode can be fully mixed when it reaches the diffuser 105, and the backlight effect is optimized.
  • the protective glue layer 103 covering the micro light emitting diode 102 has the function of encapsulating the micro light emitting diode 102.
  • the micro light emitting diode can be packaged by glue dispensing, or the micro light emitting diode can be packaged by the whole layer coating method.
  • the whole-layer coating packaging method has higher production efficiency and excellent effects. Since the protective glue layer 103 is usually formed on the micro light emitting diode by spraying, its surface is not flat, and it is easy to form protrusions or depressions in local areas.
  • the protective adhesive layer 103 If there are protrusions on the surface of the protective adhesive layer 103 facing the transparent substrate, these protrusions are in contact with the transparent substrate 104, and the protective adhesive layer 103 and the transparent substrate 104 form an air layer in the area adjacent to the above-mentioned protrusions.
  • the refractive index of air is less than that of the protective glue layer, some light in the transparent substrate 104 can be totally reflected when it enters the interface with the air layer, but at the same incident angle
  • the critical angle increases due to the change of the total reflection conditions. The light that could have been totally reflected can exit from the interface, and the transparent substrate will exit at the convex portion. More light, resulting in bright bars.
  • the surface of the transparent substrate 104 facing the protective glue layer 103 is subjected to surface treatment, so that the surface becomes an uneven surface, thereby making the transparent substrate 104 and the protective adhesive layer 103 an uneven surface.
  • a uniform dielectric layer is formed between the glue layers 103. Uniform here means that in terms of the lateral distribution of the dielectric layer, the distribution of the air dielectric layer or the protective glue layer is uniform, and there will be no large areas of the air dielectric layer or protective glue layer in a certain area. Therefore, the reflection of light at the interface is also uniform, thereby ensuring the uniformity of the emitted light and avoiding the occurrence of bright stripes.
  • This application does not impose rigid requirements on the specific parameters of the above-mentioned uneven surface. Any uneven surface that can form a uniform dielectric layer between the transparent substrate 104 and the protective glue layer 103 is within the protection scope of this application.
  • the surface of the transparent substrate 104 on the side close to the protective glue layer 103 has a plurality of strip-shaped concave-convex ridges arranged in parallel.
  • the three-dimensional structure of the transparent substrate 104 is shown in FIG. 5.
  • a uniform dielectric layer is formed to ensure that the backlight emits uniformly from the surface of the transparent substrate 104 away from the protective glue layer 103, avoiding the occurrence of bright stripes, and improving the uniformity of display brightness.
  • the stripe uneven structure on the surface of the transparent substrate 104 in FIG. 4 can be formed by an etching process, a barrier material is provided on the surface of the transparent substrate 104, and an etching process is used to form the stripe uneven structure; or, it can also be formed on the transparent substrate 104
  • the surface of is covered with a film with a strip-shaped concave-convex structure; or a forming mold can be used to form a transparent substrate with a strip-shaped concave-convex ridge structure at one time.
  • the height of the strip-shaped concave-convex ridge is about 20 ⁇ m-50 ⁇ m, and the apex angle is less than or equal to 90°.
  • the transparent substrate 104 with this structure can form a uniform dielectric layer between the protective glue layer 103 and the transparent substrate 104.
  • the embodiment of the present application coats the scattering coating 106 on the surface of the transparent substrate 104 on the side close to the protective glue.
  • the scattering coating 106 is uniformly coated on the surface of the transparent substrate 104, and the coating thickness is about 50 ⁇ m-200 ⁇ m.
  • the scattering coating 106 is filled with some tiny solid particles, and light is scattered when incident on these particles, and the scattered light is uniformly emitted from the transparent substrate 104.
  • the scattering coating 106 can be formed by sputtering, evaporation or other processes in the prior art.
  • the scattering coating 106 includes a colloidal layer 1061 and scattering particles 1062.
  • the colloidal layer 1061 acts as a dispersant to uniformly disperse the scattering particles 1062 therein.
  • the scattering particles 1062 are tiny particles, such as titanium dioxide and/or silica particles. After light is incident on the scattering particles 1062, it will propagate in all directions.
  • the material of the colloid layer may be a transparent resin, and its thickness should be as small as possible on the basis of ensuring that sufficient scattering particles are filled, so as to reduce the attenuation of the incident light energy by the scattering coating 106.
  • the transparent resin When the transparent resin is in a liquid or colloidal state, the molecules have fluidity, so the scattering particles can be uniformly dispersed in it.
  • the transparent resin After the scattering coating 106 is coated on the transparent substrate 104, the transparent resin can be cured by heating or lighting. When light enters the scattering coating 106 from the transparent substrate 104, uniform scattering can occur in each area of the scattering coating 106, so that it will not be affected by the convex portion of the protective glue layer 103. It is ensured that the light can be uniformly emitted from the side of the transparent substrate 104 away from the protective glue layer 103, avoiding the generation of bright stripes, and improving the uniformity of display brightness.
  • an adhesive layer 107 is provided between the transparent substrate 104 and the protective adhesive layer 103, and the adhesive layer 107 is between the transparent substrate 104 and the protective adhesive layer 103. Fits without gaps.
  • the glue layer 107 only the uniform medium of the glue layer 107 exists between the transparent substrate 104 and the protective glue layer 103, so the total reflection conditions at all positions are the same when the light propagates in the transparent substrate. The problem of bright bars does not occur, thereby improving the uniformity of display brightness.
  • the bonding adhesive layer 107 may use ultraviolet curing adhesive.
  • the UV-curing adhesive has a good light-transmitting type, and is usually in a colloidal shape. After filling the ultraviolet curing glue between the transparent substrate 104 and the protective glue layer 103, use ultraviolet rays to irradiate the layer of the transparent substrate 104 away from the protective glue layer 103 for 5-10 minutes to cure the glue, thereby making the transparent substrate 104 and the protective glue layer 103 are closely attached to each other.
  • the backlight module 10 further includes an optical film group 108 disposed on the side of the diffuser 105 away from the transparent substrate 104.
  • the optical film set 108 may include one or more of prism films, quantum dot films, diffusers, reflective polarizers, etc.
  • the purpose of adding these films to the backlight module 10 is to make the backlight module Group 10 is suitable for a variety of practical applications.
  • the prism sheet can change the exit angle of light, thereby changing the viewing angle of the display device.
  • the quantum dot film can provide quantum dots with higher monochromaticity, which can be applied to quantum dot TVs to improve the display color gamut of TVs.
  • FIG. 10 is a schematic structural diagram of a display device provided in an embodiment of this application.
  • the display device is also provided with a quantum dot film 108' on the side of the diffuser plate 105 of the backlight module away from the transparent substrate 104, and the quantum dot film 108' is away from the diffuser plate 105.
  • An optical film 108 such as a prism sheet and a composite film is provided.
  • the micro light emitting diode 102 is a blue light micro light emitting diode.
  • the quantum dot film 108' includes a red quantum dot material and a green quantum dot material.
  • the red quantum dot material emits red light under the excitation of blue light
  • the green quantum dot material emits green light under the excitation of blue light. Due to the limited luminous efficiency of the quantum dot material, the blue light will not be completely absorbed.
  • the remaining blue light can be mixed with red light and green light into white light.
  • other color schemes can also be used.
  • the microdiode 102 emits blue light and the quantum dot film is excited to emit yellow light. The blue light and yellow light can also be mixed into white light.
  • the backlight module 10 includes a circuit board 101, a plurality of micro light emitting diodes 102 arranged on the circuit board 101, a protective glue layer 103 covering the plurality of micro light emitting diodes 102 and the circuit board 101, and is arranged on the protective glue
  • the layer 103 is a transparent substrate 104 on the side facing away from the circuit board 101, and a diffuser 105 disposed on the transparent substrate 104 on a side facing away from the circuit board 101.
  • the backlight module may be a backlight module in any possible implementation of the above content, and each component contained therein has the same as each corresponding component of the backlight module in any possible implementation of the above content. Structure and function. For the sake of brevity of the description, it will not be repeated here.
  • the transparent substrate 104 is used as the supporting structure of the diffuser 105, and the surface of the transparent substrate 104 close to the protective glue layer 103 is in contact with a uniform medium, and the reflection of light on the surface is uniform. Therefore, the light emitted from the transparent substrate 104 is also uniform.
  • the backlight module can provide uniform backlight illumination.
  • each includes a circuit board 101, a plurality of micro light emitting diodes 102 arranged on the circuit board 101, and a circuit board 101 covering the plurality of micro light emitting diodes 102 and the circuit board 101.
  • the protective glue layer 103 is disposed on the transparent substrate 104 on the side of the protective glue layer 103 away from the circuit board 101, and the diffuser 105 is disposed on the side of the transparent substrate 104 away from the circuit board 101.
  • the transparent substrate 104 serves as a supporting structure between the protective glue layer 103 and the diffuser 105, so that the light emitted by the micro light emitting diode 102 can be fully mixed before reaching the diffuser.
  • the medium contacted by the surface close to the protective glue layer 103 is a uniform medium, and the reflection of light on the surface is uniform, so the light emitted from the transparent substrate 104 is also uniform.
  • the display device can display images with uniform brightness, or the backlight module can provide backlight with uniform brightness.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

一种显示装置及背光模组（10），包括电路板（101），设置于电路板（101）上的多个微型发光二极管（102），覆盖多个微型发光二极管（102）和电路板（101）的保护胶层（103），设置于保护胶层（103）背离电路板（101）一侧的透明基板（104），以及设置于透明基板（104）背离电路板（101）一侧的扩散板（105）；其中，透明基板（104）的厚度满足微型发光二极管（102）的混光距离。通过将透明基板（104）作为保护胶层（103）和扩散板（105）之间的支撑结构，使微型发光二极管（102）发出的光在到达扩散板（105）前充分地混光，提升背光照明效果。

Description

一种显示装置及背光模组
相关申请交叉引用
本申请要求于2019年09月20日提交中国专利局、申请号为201910891020.5、发明名称为“一种显示装置及背光模组”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及液晶显示领域，尤其涉及一种显示装置及背光模组。
背景技术
高动态范围显示技术(High-Dynamic Range，简称HDR)，可以提供更多的动态表现和图像细节，能够更好地反映出真实环境中物体所自有的视觉效果，并被普遍认为会引发显示领域里的下一次变革。同时，HDR技术对液晶显示终端也提出更高的要求——更精细的分区控制和对比度。
微型发光二极管(mini LED)的尺寸约为50μm-300μm。采用巨量mini LED晶粒作为背光源应用到液晶显示领域，不仅可以实现背光模组的薄形化，还能实现更为精细化的动态控制，提升液晶显示的动态对比度。
在传统的直下式背光模组中，通常在灯板和扩散板之间放置扩散板支架完成混光。但mini LED灯板的LED间距很小，一般小于5mm，该间距不足以放置扩散板支架，因此常规做法难以实现。
发明内容
本申请提供一种显示装置及背光模组，用于优化混光效果。
本申请实施例的第一方面，提供了一种显示装置，包括：背光模组以及位于所述背光模组出光侧的显示面板；
所述背光模组包括：电路板，设置于所述电路板上的多个微型发光二极管，覆盖所述多个微型发光二极管和所述电路板的保护胶层，设置于所述保护胶层背离所述电路板一侧的透明基板，以及设置于所述透明基板背离所述电路板一侧的扩散板；
其中，所述透明基板的厚度满足所述微型发光二极管的混光距离。
在一些实施例中，在本申请提供的上述显示装置中，所述透明基板面向所述保护胶层一侧的表面为不平整表面。
在一些实施例中，在本申请提供的上述显示装置中，所述不平整表面具有多个平行设置的条形凹凸棱。
在一些实施例中，在本申请提供的上述显示装置中，所述透明基板面向所述保护胶层一侧的表面涂布有散射涂层，所述散射涂层包括胶体层和分布于胶体层的散射颗粒。
在一些实施例中，在本申请提供的上述显示装置中，在所述透明基板和所述保护胶层之间还包括贴合胶层，所述贴合胶层与所述透明基板和所述保护胶层之间无空隙贴合。
在一些实施例中，在本申请提供的上述显示装置中，所述背光模组还包括设置于所述扩散片背离所述透明基板一侧的光学膜片组。
在一些实施例中，在本申请提供的上述显示装置中，所述微型发光二极管的尺寸为50μm-300μm。
在一些实施例中，在本申请提供的上述显示装置中，所述保护胶层的材料 为硅胶或环氧树脂。
在一些实施例中，在本申请提供的上述显示装置中，所述透明基板的材料为聚甲基丙烯酸甲酯或聚碳酸酯。
本申请实施例的第一方面，提供了一种背光模组。包括电路板，设置于所述电路板上的多个微型发光二极管，覆盖所述多个微型发光二极管和所述电路板的保护胶层，设置于所述保护胶层背离所述电路板一侧的透明基板，以及设置于所述透明基板背离所述电路板一侧的扩散板；
其中，所述透明基板的厚度满足所述微型发光二极管的混光距离。
本申请有益效果如下：
本申请提供的显示装置及背光模组，包括电路板，设置于所述电路板上的多个微型发光二极管，覆盖所述多个微型发光二极管和所述电路板的保护胶层，设置于所述保护胶层背离所述电路板一侧的透明基板，以及设置于所述透明基板背离所述电路板一侧的扩散板；其中，所述透明基板的厚度满足所述微型发光二极管的混光距离。透明基板作为保护胶层和扩散板之间的支撑结构，使微型发光二极管发出的光在到达扩散板前充分地混光，优化混光效果。
附图说明
图1为本申请实施例提供的显示装置的结构示意图之一；
图2为本申请实施例提供的透明基板的光路原理图；
图3为本申请实施例提供的显示装置的结构示意图之二；
图4为本申请实施例提供的显示装置的结构示意图之三；
图5为本申请实施例提供的透明基板的结构示意图；
图6为本申请实施例提供的显示装置的结构示意图之四；
图7为本申请实施例提供的散射涂层的结构示意图；
图8本申请实施例提供的显示装置的结构示意图之五；
图9本申请实施例提供的显示装置的结构示意图之六；
图10本申请实施例提供的显示装置的结构示意图之七；
图11为本申请实施例提供的背光模组的结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
本申请实施例的第一方面，提供一种显示装置，如图1所示，该显示装置包括背光模组10和位于背光模组10出光侧的显示面板20。
显示面板20，位于背光模组10的出光侧。它有多个呈阵列排布的像素单元，每个像素单元都可以独立的控制背光模组10入射到该像素单元的光线透过率和色彩，以使全部像素单元透过的光线构成待显示的图像。
背光模组10，可以在整个出光面内均匀的发出光线，用于为显示面板20提供亮度充足且分布均匀的光线，以使显示面板20可以正常显示影像。
具体的，背光模组10包括：电路板101，设置于电路板101上的多个微型发光二极管102，覆盖多个微型发光二极管102和电路板101的保护胶层103，设置于保护胶层103背离电路板101一侧的透明基板104，以及设置于透明基 板104背离电路板101一侧的扩散板105。
其中，电路板101用于为微型发光二极管提供驱动电信号。在电路板101上设置有焊脚和电路线路，微型发光二极管102的电极通过焊接工艺焊接在电路板101的焊脚上，电路线路用于使微型发光二极管102之间互相电气连接以及微型发光二极管102与外置的电源驱动板(图中未示出)电气连接。
在本申请某些实施例中，电路板101是印刷电路板(Printed Circuit Board，简称PCB)，PCB包括电子线路和绝缘层，绝缘层将电子线路中焊接微型发光二极管102的焊脚裸露在外而将其余部分覆盖。
在本申请的某些实施例中，电路板101是在衬底基板设置薄膜晶体管驱动电路形成的阵列基板，阵列基板的表面具有连接至薄膜晶体管驱动电路的连接电极，各微型发光二极管102的电极与各连接电极一一对应焊接。
以上电路板101的衬底或衬底基板可以采用柔性材料来制作以形成柔性显示装置。
在本申请实施例中，电路板101为板状，整体呈长方形或正方形。电路板101的长度在200-800mm，宽度在100-500mm。根据显示装置的尺寸，在本申请实施例中，显示装置可以包括多个电路板101，电路板101之间通过拼接方式共同构成灯板结构。为了避免电路板101拼接带来的光学问题，相邻电路板101之间的拼缝尽量做到较小，甚至实现无缝拼接。
多个微型发光二极管102，用于发射光源光线。微型发光二极管通过焊接方式固定在电路板101的一侧表面，多个微型发光二极管102成行或成列排布，相邻两个微型发光二管102之间的距离小于5mm。
本申请实施例中的微型发光二极管的尺寸约为50μm-300μm之间。微型 发光二极管101不同于普通的发光二极管，其具体指的是微型发光二极管芯片。尺寸小的发光芯片有利于将动态发光控制到更小的分区，进一步提高画面的对比度。在本申请实施例中，微型发光二极管102为单色微型发光二极管。
保护胶层103的作用是对微型发光二极管102进行封装，从而有效的防止了微型发光二极管的脱落、潮湿等不利情况的发生。保护胶层103所用材料包括硅胶或环氧树脂。也可以使用其他光透过率与二者接近的材料。采用喷涂的形成来形成保护胶层103。
为了较好的保护微型发光二极管102，保护胶层103的上表面距离微型发光二极管102的上表面的距离在100-300μm。
透明基板104，能够使来自微型发光二极管102的光线透过且用于支撑扩散板105。透明基板104的材料可选自聚甲基丙烯酸甲酯或聚碳酸酯中的至少一个。但是也不限于此，透明基板104也可使用其他高反射率，低吸光率的材料制作。这是由于光线在透明基板104内部发生多次的反射，采用高反射率，低吸光率的材料可以尽可能的降低光线在透明基板104内传播时的衰减，从而提高背光模组的光利用率，降低功耗。透明基板104作为扩散板105的支撑结构，使微型发光二极管102发出的光在到达扩散板前充分地混光。
在本申请实施例中，透明基板104的厚度满足微型发光二极管102的混光距离，从而使微型发光二极管的出射光线在到达扩散板105时可以充分混光，保证背光效果。在本申请实施例中，透明基板104的厚度不大于10mm。
扩散板105，通过光线经过扩散板时不断发生折射与反射，从而达到将光线打散的效果，进而实现匀光的作用。扩散板所用材质一般选自聚甲基丙烯酸甲酯PMMA、聚碳酸酯PC、聚苯乙烯系材料PS、聚丙烯PP中的至少一种。
以及，背光模组10在电路板101与扩散板105之间不设置用于支撑扩散板105的扩散板支撑架。
微型发光二极管102作为点光源，它的出射光型呈一锥形，且边缘的光强小于中心的光强，因此需要使相邻的两个微型发光二极管的边缘区域光混光，以使混光区域的光强与中心区域的光强的差距减小。目前微型发光二极管102之间的间距很小，不足以放置扩散板支架来完成混光，因此本申请实施例利用透明基板104支撑扩散板105，以使微型发光二极管102与扩散板105之间拉开设定距离，透明基板104的厚度满足微型发光二极管102的混光距离，从而使微型发光二极管的出射光线在到达扩散板105时可以充分混光，优化背光效果。
在实际应用中，覆盖微型发光二极管102的保护胶层103具有封装微型发光二极管102的作用。在具体实施时，既可以采用点胶的方式封装微型发光二极管，也可以采用整层涂覆的方式封装微型发光二极管。而整层涂覆的封装方式具有更高的生产效率且效果优异。由于保护胶层103通常采用喷涂的方式形成于微型发光二极管之上，因此其表面并不平整，局部区域容易形成凸起或凹陷。如果保护胶层103面向透明基板一侧的表面存在凸起，这些凸起部分与透明基板104接触，保护胶层103与透明基板104在上述凸起部分相邻的区域形成空气层。参考图2所示的光路原理图，由于空气的折射率小于保护胶层的折射率，透明基板104中的一些光线入射到与空气层的交界面时可以发生全反射，而在同样入射角度的光线入射到与保护胶层的交界面时，由于全反射条件发生变化，临界角增大，原本可以发生全反射的光线可以从该交界面向外出射，那么透明基板就会在凸起部分处出射更多的光线，造成亮条。
为了解决上述问题，如图3所示，本申请实施例将透明基板104面向保护胶层103一侧的表面进行表面处理，使该表面成为一不平整表面，由此可以使透明基板104和保护胶层103之间形成均匀介质层。此处的均匀，是指就介质层的横向分布来说，空气介质层或者保护胶层的分布是均匀的，不会出现某块区域出现大片的空气介质层或者保护胶层。因此，光线在该分界面的反射情况也是均匀的，从而保证出射光的均匀性，避免亮条的产生。本申请不对上述不平整表面的具体参数作硬性要求，任何可以使透明基板104和保护胶层103之间形成均匀介质层的不平整表面都在本申请的保护范围之内。
在一些实施方式中，如图4所示，在本申请实施例提供的显示装置中，透明基板104靠近保护胶层103的一侧的表面具有多个平行设置的条形凹凸棱。该透明基板104的立体结构如图5所示。通过合适的设置条形凹凸棱凸起的高度与凹凸棱所包含的斜面与透明基板104背离该条形凹凸棱的平表面的夹角，可以使该条形凹凸棱与保护胶层103之间，形成均匀的介质层，保证背光从透明基板104背离保护胶层103一侧的表面均匀的出射，避免了亮条的产生，提高显示亮度的均匀性。
其中，图4中透明基板104表面的条形凹凸棱结构可以利用刻蚀工艺形成，在透明基板104表面设置阻挡材料，采用刻蚀工艺形成条形凹凸棱结构；或者，还可以在透明基板104的表面贴覆具有条形凹凸结构的膜片；或者可以采用成型模具一次形成带有条形凹凸棱结构的透明基板。条形凹凸棱的高度约为20μm-50μm，顶角小于或等于90°。这种结构的透明基板104可以和保护胶层103之间足以形成均匀的介质层。
在另一些实施方式中，如图6所示，本申请实施例在透明基板104靠近保 护胶一侧的表面涂布散射涂层106。散射涂层106均匀的涂布在透明基板104的表面，涂布厚度约为50μm-200μm。散射涂层106中填充有一些微小的固体颗粒，光线入射到这些颗粒上时发生散射，散射光均匀的从透明基板104出射。散射涂层106可以利用溅射、蒸镀或其他现有技术中的工艺形成。
请参考图7，为本申请实施例提供的散射涂层的结构示意图。如图7所示，散射涂层106包括胶体层1061和散射颗粒1062。其中，胶体层1061作为分散剂，使散射颗粒1062均匀的分散在其中。散射颗粒1062是一些微小的粒子，例如二氧化钛和/或二氧化硅颗粒，光线入射到散射颗粒1062上后，会向各个方向传播。具体的，胶体层的材料可以是透明树脂，它的厚度在保证填充足够的散射颗粒的基础上尽量的做到较小，从而减少散射涂层106对入射光线能量的衰减。透明树脂为液体或胶体状态时，分子具有流动性，因此可以使散射颗粒均匀的分散在其中。散射涂层106涂布到透明基板104上后，经过加热或光照，可以使透明树脂发生固化。当光线从透明基板104进入到散射涂层106时，在散射涂层106的各个区域都可以发生均匀的散射，从而不会受到保护胶层103的凸起部分的影响。保证了光线能从透明基板104背离保护胶层103的一侧均匀的出射，避免了亮条的产生，提高显示亮度的均匀性。
在一些实施方式中，如图8所示，本申请实施例在透明基板104和保护胶层103之间设置贴合胶层107，该贴合胶层与透明基板104和保护胶层103之间无空隙地贴合。通过设置贴合胶层107，使透明基板104与保护胶层103之间只存在贴合胶层107这一均匀介质，因此光线在透明基板中传播时在各位置处的全反射条件均相同，不会出现亮条的问题，由此提高显示亮度的均匀性。
贴合胶层107可以采用紫外固化胶。该紫外固化胶具有良好的透光型，通 常情况下呈胶体状。在透明基板104和保护胶层103之间填充该紫外固化胶后，利用紫外线从透明基板104背离保护胶层103的一层对其照射5-10分钟，即可使胶体固化，从而使透明基板104和保护胶层103之间紧密的贴合。
在实际应用中，如图9所示，背光模组10还包括设置于扩散片105背离透明基板104一侧的光学膜片组108。
其中，光学膜片组108可以包括棱镜片、量子点膜、扩散片、反射式偏光片等中的一种或者多种，在背光模组10中添加这些膜片的目的，是为了使背光模组10适应多种多样的实际应用。例如，棱镜片可以改变光线的出射角度，从而改变显示装置的可观看角度。量子点膜可以提供单色性更高的量子点发光，应用于量子点电视，提高电视的显示色域。
示例性的，请参考图10，为本申请实施例提供的一种显示装置的结构示意图。该显示装置除具有图1所示的显示装置的结构外，还在背光模组的扩散板105背离透明基板104的一侧设置量子点膜108’，在量子点膜108’背离扩散板105的设置棱镜片和复合膜等光学膜片108。如图10所示，微型发光二极管102为蓝光微型发光二极管，蓝光微型发光二极管在经过透明基板和扩散板之后，形成均匀的面光源照射在量子点膜108’上，以激发量子点膜108’发光。量子点膜108’中包括红色量子点材料和绿色量子点材料，红色量子点材料在蓝光的激发下出红光，绿色量子点材料在蓝光的激发下发出绿光。由于量子点材料的发光效率有限，所以蓝光不会被完全吸收，通过合理设置量子点膜108’中两种量子点颗粒的比例，就可以使剩余的蓝光与红光和绿光混合成白光。或者，也可以使用其他配色方案，例如微型二极管102发出蓝光，激发量子点膜发出黄光，蓝光和黄光同样可以混合成白光。
本申请实施例的第二方面，提供了一种背光模组。请参考图11所示，为本申请实施例提供的背光模组的结构示意图。如图11所示，背光模组10包括电路板101，设置于电路板101上的多个微型发光二极管102，覆盖多个微型发光二极管102和电路板101的保护胶层103，设置于保护胶层103背离电路板101一侧的透明基板104，以及设置于透明基板104背离电路板101一侧的扩散板105。具体的，本背光模组可以是上述内容中任一可能的实现方式中的背光模组，其包含的各个组件具有与上述内容中任一可能的实现方式中的背光模组的各对应组件相同的结构和功能。为了说明书的简洁，此处不再赘述。该背光模组中，采用透明基板104作为扩散板105的支撑结构，且透明基板104靠近保护胶层103一侧的表面接触的介质为均匀的介质，光线在该表面的反射情况是均匀的，因此从透明基板104出射的光也是均匀的。从而使背光模组能够提供均匀的背光照明。
综上所述，在本申请提供的显示装置以及背光模组中，均包括电路板101，设置于电路板101上的多个微型发光二极管102，覆盖多个微型发光二极管102和电路板101的保护胶层103，设置于保护胶层103背离电路板101一侧的透明基板104，以及设置于透明基板104背离电路板101一侧的扩散板105。其中透明基板104作为保护胶层103和扩散板105之间的支撑结构，使微型发光二极管102发出的光在到达扩散板前充分地混光。透明基板104经过特殊设计后，使其靠近保护胶层103一侧的表面接触的介质为均匀的介质，光线在该表面的反射情况是均匀的，因此从透明基板104出射的光也是均匀的。最终使显示装置可以显示出亮度均匀的画面，或者使背光模组可以提供亮度均匀的背光照明。
尽管已描述了本申请的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (10)

  1. 一种显示装置，其特征在于，包括：背光模组以及位于所述背光模组出光侧的显示面板；
    所述背光模组包括：电路板，设置于所述电路板上的多个微型发光二极管，覆盖所述多个微型发光二极管和所述电路板的保护胶层，设置于所述保护胶层背离所述电路板一侧的透明基板，以及设置于所述透明基板背离所述电路板一侧的扩散板；
    其中，所述透明基板的厚度满足所述微型发光二极管的混光距离。
  2. 如权利要求1所述的显示装置，其特征在于，所述透明基板面向所述保护胶层一侧的表面为不平整表面。
  3. 如权利要求2所述的显示装置，其特征在于，所述不平整表面具有多个平行设置的条形凹凸棱。
  4. 如权利要求1所述的显示装置，其特征在于，所述透明基板面向所述保护胶层一侧的表面涂布有散射涂层，所述散射涂层包括胶体层和分布于胶体层的散射颗粒。
  5. 如权利要求1所述的显示装置，其特征在于，在所述透明基板和所述保护胶层之间还包括贴合胶层，所述贴合胶层与所述透明基板和所述保护胶层之间无空隙贴合。
  6. 如权利要求1所述的显示装置，其特征在于，所述背光模组还包括设置于所述扩散片背离所述透明基板一侧的光学膜片组。
  7. 如权利要求1所述的显示装置，其特征在于，所述微型发光二极管的尺寸为50μm-300μm。
  8. 如权利要求1-7任一项所述的显示装置，其特征在于，所述保护胶层的材料为硅胶或环氧树脂。
  9. 如权利要求1-7任一项所述的显示装置，其特征在于，所述透明基板的材料为聚甲基丙烯酸甲酯或聚碳酸酯。
  10. 一种背光模组，其特征在于，包括电路板，设置于所述电路板上的多个微型发光二极管，覆盖所述多个微型发光二极管和所述电路板的保护胶层，设置于所述保护胶层背离所述电路板一侧的透明基板，以及设置于所述透明基板背离所述电路板一侧的扩散板；
    其中，所述透明基板的厚度满足所述微型发光二极管的混光距离。
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