WO2020232927A1 - 一种oled显示面板及其制备方法 - Google Patents

一种oled显示面板及其制备方法 Download PDF

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Publication number
WO2020232927A1
WO2020232927A1 PCT/CN2019/106662 CN2019106662W WO2020232927A1 WO 2020232927 A1 WO2020232927 A1 WO 2020232927A1 CN 2019106662 W CN2019106662 W CN 2019106662W WO 2020232927 A1 WO2020232927 A1 WO 2020232927A1
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Prior art keywords
layer
organic
display panel
organic glue
retaining wall
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PCT/CN2019/106662
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English (en)
French (fr)
Inventor
曾宪祥
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武汉华星光电半导体显示技术有限公司
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Priority to US16/613,865 priority Critical patent/US11205765B2/en
Publication of WO2020232927A1 publication Critical patent/WO2020232927A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the invention relates to the field of display technology, in particular, an OLED display panel and a preparation method thereof.
  • organic light emitting diode displays have self-luminescence, low driving voltage, high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide operating temperature range, and can realize flexible display and large-area full-color display Many other advantages make it widely used in the fields of display, lighting and smart wear.
  • the OLED device is usually arranged on a thin film transistor array substrate (TFT substrate for short), including an anode, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and electrons which are sequentially formed on the TFT substrate. Injection layer and cathode.
  • TFT substrate thin film transistor array substrate
  • the TFT in the TFT substrate is used as the switching device and the driving device of the OLED.
  • the biggest difference between the OLED display and the traditional liquid crystal display is that the OLED does not need to use a backlight. Instead, the two types of carriers, electrons and holes, are injected into the organic light-emitting layer and combined to emit light in the organic light-emitting layer.
  • the organic light-emitting layer is very sensitive to water vapor and oxygen in the atmosphere, and it is prone to electrochemical corrosion in an environment containing water vapor and oxygen, which will cause damage to the OLED device. Therefore, if there is external water, Oxygen penetration will greatly reduce the life span of OLED devices.
  • the industry uses packaging structures to encapsulate OLEDs to isolate external water and oxygen and protect internal OLED devices.
  • TFE Thin Film Encapsulation
  • One aspect of the present invention is to provide an OLED display panel, which adopts a new type of packaging structure to solve the problem of poor TFE reliability of medium and large-size OLED panels, which easily causes water and oxygen to enter, thereby causing the organic light-emitting layer to fail.
  • the water and oxygen barrier ability of the OLED display panel packaging structure is to provide an OLED display panel, which adopts a new type of packaging structure to solve the problem of poor TFE reliability of medium and large-size OLED panels, which easily causes water and oxygen to enter, thereby causing the organic light-emitting layer to fail.
  • An OLED display panel includes a TFT substrate, wherein an OLED device layer is provided on the TFT substrate, and a TFE encapsulation layer is provided on the OLED device layer.
  • both ends of the TFT substrate are respectively provided with first retaining walls, and each of the first retaining walls is provided with a first organic glue layer, wherein the lateral size of the first organic glue layer is larger than the one arranged below it.
  • the lateral dimension of the first retaining wall further makes the part where the two meet to form a concave wedge-shaped structure.
  • the OLED device layer and the TFE encapsulation layer are located between the two first retaining walls and the two first organic glue layers provided thereon.
  • the material used for the first retaining wall is SiNx.
  • the first organic glue layer is also provided with a cured glue layer, so The cured adhesive layer downwardly fills the space between the TFE packaging layer and the two first retaining walls and the first organic adhesive layer.
  • the material used for the curing adhesive layer includes, but not limited to, thermal curing acrylic adhesive.
  • the TFE encapsulation layer is located between the two cured adhesive layers, and the upper surface of the TFE encapsulation layer is flush with the upper surface of the cured adhesive layer.
  • two second retaining walls arranged symmetrically are further arranged inside the two first retaining walls, and the second retaining walls are spaced apart from the first retaining walls, and the OLED The device layer is located between the two second retaining walls, and the cured adhesive layer fills the space between the first retaining wall and the second retaining wall.
  • the material used for the second retaining wall is SiNx.
  • each of the second retaining walls is provided with a second organic glue layer.
  • the lateral width of the second organic glue layer is larger than the lateral width of the second retaining wall disposed thereunder. This makes the part where the second retaining wall and the second organic glue layer connect to form three structures, for example, a relatively standard T-shaped wedge structure, a concave inverted L-shaped wedge structure, and a concave
  • the inverted L-shaped wedge structure, the specific structure can be determined according to specific needs, and there is no limitation.
  • the first organic glue layer and the second organic glue layer are made of the same organic glue material, for example, photosensitive polyimide (PSPI), but not limited to.
  • PSPI photosensitive polyimide
  • the OLED device layer and the TFE encapsulation layer are located between the two second retaining walls and the second organic glue layer provided thereon.
  • the TFE encapsulation layer includes a first inorganic layer disposed on both sides of the OLED device layer, and the height of the first inorganic layer is lower than that of the OLED device layer.
  • Another aspect of the present invention is to provide a method for preparing the OLED display panel of the present invention, which includes the following steps:
  • Step S1 Provide a TFT substrate, deposit a barrier layer on the TFT substrate, and then coat a layer of organic glue on the barrier layer; etch and cure the organic glue layer, and then Forming first organic glue layers respectively located at both ends of the TFT substrate;
  • Step S2 Dry etching the barrier wall layer to form the first barrier walls respectively located at both sides of the TFT substrate, because the cured organic layer is more resistant to etching, and the first organic layer after dry etching
  • the lateral width dimension of the first retaining wall below the glue layer will be smaller than that of the first organic glue layer above, thereby forming a concave wedge-shaped structure of the connecting part of the two;
  • Step S3 preparing an OLED device layer on the TFT substrate
  • Step S4 A TFE thin film encapsulation layer is prepared on the OLED device layer, wherein the TFE thin film encapsulation layer is located between the two first retaining walls and the first organic glue layer provided thereon.
  • it further includes the step S5 of forming a cured adhesive layer on the first organic adhesive layer, which is to drop the cured adhesive on the first organic adhesive layer by inkjet printing. The material is then cured to fix the wedge-shaped structure formed between the first organic glue layer and the first retaining wall downward.
  • the etching of the organic glue layer will also form a second organic glue layer that is spaced apart from the first organic glue layer, and then in step S2, for dry engraving of the retaining wall layer, a second retaining wall located below the second organic glue layer will also be formed, and the lateral width of the second retaining wall will be larger than that of the second organic glue layer above it.
  • the lateral width dimension is small, thus forming a wedge-shaped structure of the two connecting parts.
  • step S5 the dripped curing glue will be filled downward between the first retaining wall and the second retaining wall.
  • the present invention relates to an OLED display panel, which is provided at both ends of its TFT substrate with a retaining wall composed of columnar silicon nitride with good density, and then an organic glue layer is arranged on the combination, and the two are combined
  • the wedge-shaped structure formed to replace the existing side TFE packaging structure can effectively enhance the ability of the packaging on both sides of the display panel to block the intrusion of external water and oxygen.
  • the TFE packaging structure will also be provided at the two ends. Between the wedge-shaped structures, the water and oxygen barrier properties can be further increased.
  • the retaining wall surrounds the TFE film encapsulation layer from both sides, which can also effectively avoid the problem of water and oxygen penetration caused by the existing TFE encapsulation layer and the TFT substrate being easily peeled off at the edge of the substrate.
  • the use of an ultraviolet curing adhesive layer to fix the wedge-shaped structure formed by the barrier wall and the organic adhesive layer can once again improve the packaging effect of the OLED device layer provided on the TFT substrate. In this way, it can be further improved. This improves the reliability of the retaining wall packaging structure involved in the present invention, thereby avoiding the problem of easy intrusion of external water and oxygen, resulting in failure of the organic light-emitting layer.
  • FIG. 1 is a schematic structural diagram of an OLED display panel provided in an embodiment of the present invention.
  • step S1 is completed in a method for manufacturing an OLED display panel according to another embodiment of the present invention
  • step S2 is completed
  • step S3 is completed;
  • step S4 is completed.
  • an embodiment of the present invention provides an OLED display panel including a TFT substrate 100.
  • the TFT substrate 100 is provided with an OLED device layer 110 and a TFE encapsulation layer, wherein the OLED device layer 110 specifically includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, a cathode, etc. Wait, not repeat them here.
  • the TFE encapsulation layer wraps the OLED device layer 110 inside, which includes an organic layer and an inorganic layer arranged alternately.
  • the two ends of the TFT substrate 100 are provided with a symmetrically arranged first retaining wall 101 and a second retaining wall 103 arranged inside the first retaining wall 101, wherein the OLED device layer 110 and the TFE
  • the packaging layer is located between the two second retaining walls 103.
  • the first retaining wall 101 and the second retaining wall 103 are preferably made of SiNx material, but not limited to. Among them, SiNx has better compactness and can effectively enhance the water and oxygen resistance of the package.
  • the first retaining wall 101 is further provided with a first organic glue layer 102
  • the second retaining wall 103 is provided with a second organic glue layer 104.
  • the lateral width of the organic glue layer is greater than the lateral width of the retaining wall disposed under it, so that a configuration with a wide upper and a narrow lower is formed between the two.
  • the first organic glue layer 102 and the second organic glue layer 104 can be made of various organic glue materials known in the industry, for example, photosensitive polyimide (PSPI), which can be specifically determined as required. limited.
  • PSPI photosensitive polyimide
  • the configuration of the two is One down L shape. Since the second retaining wall 103 is located on the inner side of the end of the TFT substrate, the second organic glue layer 102 provided thereon may protrude beyond the side of the second retaining wall on both sides.
  • the configuration of both is a T-shape.
  • the configuration between the second organic glue layer 104 and the second retaining wall 103 is not limited to a T-shape, and it may only extend from one side of the second organic glue layer 104
  • the outer side of one side of the second retaining wall 103 is similar to the configuration of the first organic glue layer 102 and the first retaining wall 101, which can be specifically determined as required and is not limited.
  • the TFE encapsulation layer is disposed between the second barrier wall 103 and the second organic glue layer 104 disposed thereon, and includes a first inorganic layer 111 disposed on both sides of the OLED device layer 110,
  • the first inorganic layer 111 and the OLED device layer 110 are provided with a first organic layer 112
  • the first organic layer 112 is provided with a second inorganic layer 113
  • the second inorganic layer 113 is provided with a first organic layer 112.
  • Two organic layer 114 Two organic layer 114.
  • the TFE encapsulation layer in the figure has a 4-layer structure, which is only an example. In other embodiments, the number of stacked layers of the inorganic layer and the organic layer is not limited to four, and it can be determined as needed without limitation.
  • an ultraviolet curing adhesive layer 120 is further provided on the first retaining wall 101 and the second retaining wall 103 and the first organic glue layer 102 and the second organic glue layer 104 thereon.
  • the ultraviolet curing adhesive layer 120 includes two symmetrically arranged on both sides of the TFE encapsulation layer, and is filled downward to fill the first retaining wall 101 and the second retaining wall 103 and the first organic glue thereon The space between the layer 102 and the second organic glue layer 104.
  • the material used for the ultraviolet curing adhesive layer 120 may be thermal curing acrylic adhesive, but is not limited.
  • the configuration at the junction of the two is a wedge-shaped structure, and the same wedge-shaped structure is also formed on the second retaining wall 103 Between the second organic glue layer 104 and the second organic glue layer 104, when the ultraviolet curable glue is filled downward, a wedge structure between the three is formed, which plays a role of sealing and fixing.
  • the surface of the ultraviolet curing adhesive layer 120 is flush with the surface of the TFE encapsulation layer, together with the double-layer hollow wall structure filled with ultraviolet curing adhesive provided underneath, the two parts of the TFE encapsulation layer
  • the side part is entirely wrapped inside, so that the side part of the TFE encapsulation layer that is easily invaded by external water and oxygen is in a position isolated from the outside world, and only the upper surface is in contact with the external environment, thereby effectively improving the resistance to the OLED device layer
  • the encapsulation effect on both sides avoids the problem of poor reliability of the TFE encapsulation layer and easy entry of external water and oxygen, which causes the failure of the organic light-emitting layer.
  • another embodiment of the present invention provides a method for preparing the above-mentioned OLED display panel related to the present invention, which includes the following steps:
  • Step S1 Provide a TFT substrate 100, deposit a SiNx layer on the TFT substrate 100, coat an organic glue layer on the TFT substrate 100, and pattern the organic glue layer to form spaced all
  • the first organic glue layer 102 and the second organic glue layer 104 wherein the first organic glue layer 102 is symmetrically arranged on both ends of the TFT substrate 100, and the second organic glue layer 104 is symmetrical Set on the inner side of the first organic glue layer 102; please refer to FIG. 2 for the completed structure diagram;
  • Step S2 dry etching the SiNx layer, because the cured organic glue layer has stronger etching resistance, after dry etching, the size of the remaining SiNx layer under the organic glue layer will be smaller than
  • the upper organic glue layer is small, that is, the lateral length of the silicon nitride layer after etching is smaller than the lateral size of the organic glue layer thereon, so that the two form a wedge-shaped structure; correspondingly, corresponding to the first organic glue Below layer 102 is the first retaining wall 101, and below the second organic glue layer 104 is the second retaining wall 103; for the completed structural diagram, please refer to Figure 3;
  • an OLED device layer 110 on the TFT substrate 100 which specifically includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, a cathode, etc.; please refer to the completed structure diagram As shown in Figure 4;
  • a first inorganic layer 111 is provided on both sides of the OLED device layer 110, wherein the height of the first inorganic layer 111 is lower than all
  • the OLED device layer 110 is described so that the subsequent encapsulating ink can fill the size difference between the upper organic glue layer 104 and the lower second retaining wall 103 in the wedge-shaped structure, and then the first organic layer 112 and the second Inorganic layer 113, where the first organic layer 112 may be to wrap the OLED device layer 110 and the first inorganic layer 111 all inside, but the height of its upper surface does not exceed the surface of the second organic glue layer 104
  • the height of the surface of the second inorganic layer 113 disposed thereon is preferably the same as or slightly lower than the height of the surface of the second organic glue layer 104; for the completed structure diagram, please refer to FIG. 5 ;
  • the present invention relates to an OLED display panel, which is provided at both ends of its TFT substrate with a retaining wall composed of columnar silicon nitride with good density, and then an organic glue layer is arranged on the combination, and the two are combined
  • the wedge-shaped structure formed to replace the existing side TFE packaging structure can effectively enhance the ability of the packaging on both sides of the display panel to block the intrusion of external water and oxygen.
  • the TFE packaging structure will also be provided between the wedge-shaped structures, the water and oxygen barrier properties can be further increased.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
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Abstract

一种OLED显示面板，包括TFT基板（100），其中所述TFT基板（100）上设置有OLED器件层（110），所述OLED器件层（110）上设置有TFE封装层。其中所述TFT基板（100）的两端还分别设置有第一挡墙（101），每一所述第一挡墙（101）上设置有第一有机胶层（102），其中所述第一有机胶层（102）的横向尺寸大于其下设置的所述第一挡墙（101）的横向尺寸，进而使得两者相接的部分形成一个内凹的楔形结构。其中所述OLED器件层（110）和所述TFE封装层位于所述两第一挡墙（101）和其上设置的两所述第一有机胶层（102）之间。其采用的侧部封装结构能够有效提升其所在OLED显示面板侧部阻隔水氧的能力。

Description

一种OLED显示面板及其制备方法 技术领域
本发明涉及显示技术领域，尤其是，其中的一种OLED显示面板及其制备方法。
 背景技术
已知，有机发光二极管显示器具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，以及可实现柔性显示与大面积全色显示等诸多优点，使其在显示领域、照明领域及智能穿戴等领域有着广泛地应用。
具体来讲，其中OLED器件通常设于薄膜晶体管阵列基板(简称TFT基板)上，包括依次形成于TFT基板上的阳极、空穴注入层、空穴传输层、有机发光层、电子传输层、电子注入层与阴极。其中所述TFT基板中的TFT作为OLED的开关器件和驱动器件。
其中OLED显示器与传统的液晶显示器的最大差异在于OLED无需采用背光灯，而是通过电子和空穴这两种载流子注入有机发光层并在有机发光层内复合发光。
但其也有一个缺点，就是有机发光层对大气中的水汽以及氧气都非常敏感，在含有水汽、氧气的环境中容易发生电化学腐蚀，进而对OLED器件造成损害，所以，若有外界的水、氧渗透，会大大缩减OLED器件的寿命。对此，业界采用封装结构对OLED进行封装以隔绝外界的水、氧，保护内部的OLED器件。
其中，目前业界主流的OLED封装方式为TFE（Thin Film Encapsulation，TFE）封装，以阻止水汽、氧气进入到OLED内部。但是中大尺寸的面板TFE可靠性差，容易导致外部水、氧进入，进而使得其内的有机发光层失效。
因此，确有必要来开发一种新型的OLED显示面板来克服现有技术中的缺陷。
 技术问题
本发明的一个方面是提供一种OLED显示面板，其采用一种新型的封装结构能够针对中大尺寸OLED面板TFE可靠性差，容易导致水氧进入，进而使得有机发光层失效的问题，提升其所在OLED显示面板封装结构的阻隔水氧能力。
 技术解决方案
本发明采用的技术方案如下：
一种OLED显示面板，包括TFT基板，其中所述TFT基板上设置有OLED器件层，所述OLED器件层上设置有TFE封装层。其中所述TFT基板的两端还分别设置有第一挡墙，每一所述第一挡墙上设置有第一有机胶层，其中所述第一有机胶层的横向尺寸大于其下设置的所述第一挡墙的横向尺寸，进而使得两者相接的部分形成一个内凹的楔形结构。其中所述OLED器件层和所述TFE封装层位于所述两第一挡墙和其上设置的两所述第一有机胶层之间。
进一步的，在不同实施方式中，其中所述第一挡墙采用的材料为SiNx。
进一步的，在不同实施方式中，其中所述TFE封装层与所述两第一挡墙和第一有机胶层之间空间间隔，所述第一有机胶层上还设置有固化胶层，所述固化胶层向下填充所述TFE封装层与所述两第一挡墙和第一有机胶层之间的间隔空间。
进一步的，在不同实施方式中，其中所述固化胶层采用的材料包括热固化丙烯酸胶，但不限于。
进一步的，在不同实施方式中，其中所述TFE封装层位于两所述固化胶层之间，且所述TFE封装层的上表面与所述固化胶层的上表面平齐。
进一步的，在不同实施方式中，其中两所述第一挡墙内侧还设置有对称设置的两第二挡墙，所述第二挡墙与所述第一挡墙空间间隔设置，所述OLED器件层位于两所述第二挡墙之间，所述固化胶层填充所述第一挡墙和所述第二挡墙之间的空间。
进一步的，在不同实施方式中，其中所述第二挡墙采用的材料为SiNx。
进一步的，在不同实施方式中，其中每一所述第二挡墙上均设置有一第二有机胶层。
进一步的，在不同实施方式中，其中所述第二有机胶层的横向宽度大于其下设置的所述第二挡墙的横向宽度。这就使得所述第二挡墙和其上的第二有机胶层相接的部分形成3种结构，例如，比较标准的T型楔形结构，外凹的倒L型楔形结构，以及内凹的倒L型楔形结构，具体何种结构，可随具体需要而定，并无限定。
进一步的，在不同实施方式中，其中所述第一有机胶层和第二有机胶层采用同种有机胶材料构成，例如，光敏聚酰亚胺（PSPI），但不限于。
进一步的，在不同实施方式中，其中所述OLED器件层和TFE封装层位于两所述第二挡墙和其上设置的所述第二有机胶层之间。
进一步的，在不同实施方式中，其中TFE封装层包括设置在所述OLED器件层两侧的第一无机层，其中所述第一无机层的高度低于所述OLED器件层。
进一步的，本发明的又一方面是提供一种制备本发明涉及的所述OLED显示面板的制备方法，其包括以下步骤：
步骤S1、提供一TFT基板，于所述TFT基板上沉积一层挡墙层，再在所述挡墙层上涂布一层有机胶层；刻蚀所述有机胶层并对其固化，进而形成分别位于所述TFT基板两端的第一有机胶层；
步骤S2、对所述挡墙层进行干刻以形成分别位于所述TFT基板两侧端的所述第一挡墙，因为固化后的有机层耐刻蚀更强，干刻之后所述第一有机胶层下方的所述第一挡墙的横向宽度尺寸会比上方的所述第一有机胶层的小，从而形成两者相接部分的内凹楔形结构；
步骤S3、于所述TFT基板上制备出OLED器件层；
步骤S4、于所述OLED器件层上制备出TFE薄膜封装层，其中所述TFE薄膜封装层位于所述两第一挡墙和其上设置的第一有机胶层之间。
进一步的，在不同实施方式中，其还包括在所述第一有机胶层上形成固化胶层的步骤S5，其为通过喷墨打印的方式在所述第一有机胶层上滴加固化胶材料，然后使其固化进而向下固定住所述第一有机胶层和所述第一挡墙间形成的所述楔形结构。
进一步的，在不同实施方式中，在所述步骤S1中，对于所述有机胶层的蚀刻还会形成与所述第一有机胶层间隔设置的第二有机胶层，进而在步骤S2中，对于所述挡墙层的干刻，还会形成位于所述第二有机胶层下方的第二挡墙，所述第二挡墙的横向宽度尺寸会比其上方的所述第二有机胶层的横向宽度尺寸小，从而形成两者相接部分的楔形结构。
进一步的，在不同实施方式中，在步骤S5中，其中滴加的所述固化胶会向下填充在所述第一挡墙和第二挡墙之间。
 有益效果
本发明涉及的一种OLED显示面板，其在其TFT基板的两端设置由致密性较好的柱形氮化硅构成的挡墙，然后在结合其上设置的有机胶层，通过两者结合所构成的楔形结构来代替现有侧部TFE封装结构，可以有效增强所述显示面板两侧封装阻隔外部水、氧侵入的能力，同时所述TFE封装结构还会设置在所述两端部的楔形结构之间，还可进一步的增加其阻隔水、氧的侵入性能。
进一步的，所述挡墙从两侧将所述TFE薄膜封装层包围于其内，也可以有效避免现有的TFE封装层与TFT基板相接边缘易脱落而导致的渗透水氧的问题。
另外，使用紫外固化胶层向下固定所述挡墙和有机胶层形成的楔形结构，则能够再次的提高对所述TFT基板上设置的所述OLED器件层的封装效果，如此，可更进一步的提高本发明涉及的所述挡墙封装结构的可靠性，从而避免了外界水、氧容易侵入，从而导致有机发光层失效的问题。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明的一个实施方式中提供的一种OLED显示面板的结构示意图；
图2为本发明的又一个实施方式提供的一种OLED显示面板制备方法中，其步骤S1完成后的结构示意图；
图3为图2所述的OLED显示面板制备方法，其其步骤S2完成后的结构示意图；
图4为图2所述的OLED显示面板制备方法，其其步骤S3完成后的结构示意图；
图5为图2所述的OLED显示面板制备方法，其其步骤S4完成后的结构示意图。
 本发明的实施方式
以下将结合附图和实施例，对本发明涉及的一种OLED显示面板及其制备方法的技术方案作进一步的详细描述。
请参阅图1所示，本发明的一个实施方式提供了一种OLED显示面板，其包括TFT基板100。其中所述TFT基板100上设置有OLED器件层110和TFE封装层，其中所述OLED器件层110具体包括空穴注入层、空穴传输层、发光层、电子传输层、电子注入层、阴极等等，此处不再赘述。而所述TFE封装层将所述OLED器件层110包裹于内，其包括交替设置的有机物层和无机物层。
进一步的，其中所述TFT基板100的两端相对设置有对称设置的第一挡墙101和设置在所述第一挡墙101内侧的第二挡墙103，其中所述OLED器件层110和TFE封装层位于两所述第二挡墙103之间。其中所述第一挡墙101和第二挡墙103优选采用SiNx材料构成，但不限于。其中SiNx致密性较好，可以有效增强封装的阻水阻氧能力。
其中所述第一挡墙101上还设置有第一有机胶层102，所述第二挡墙103上设置有第二有机胶层104。其中所述有机胶层的横向宽度大于其下设置的所述挡墙的横向宽度，使得两者之间形成一个上宽下窄的构型。其中所述第一有机胶层102和第二有机胶层104可以是选用业界已知的各种有机胶材料构成，例如，光敏聚酰亚胺（PSPI），具体可随需要而定，并无限定。
具体来讲，由于所述第一挡墙101位于所述TFT基板100的端部，其上设置的第一有机胶层102的一侧不能伸出其端部外，因此两者的构型为一倒L型。而所述第二挡墙103由于是位于所述TFT基板的端部内侧，其上设置的第二有机胶层102可以是两侧均伸出于所述第二挡墙的侧部外，因此两者的构型为一T型。
但在其他实施方式中，所述第二有机胶层104和所述第二挡墙103之间的构型并不限于是T型，其也可以只是第二有机胶层104的一侧伸出所述第二挡墙103的一侧外，类似于所述第一有机胶层102与所述第一挡墙101的构型，具体可随需要而定，并无限定。
其中所述TFE封装层设置在所述第二挡墙103和其上设置的所述第二有机胶层104之间，其包括设置在所述OLED器件层110两侧的第一无机层111，所述第一无机层111和所述OLED器件层110上设置有第一有机层112，所述第一有机层112上设置有第二无机层113，所述第二无机层113上设置有第二有机层114。其中图中所述TFE封装层为4层结构，其仅为举例式说明。而在其他实施方式中，其所述无机层和有机层的叠层数量并不限于4层，可随需要而定，并无限定。
进一步的，其中所述第一挡墙101和第二挡墙103及其上的所述第一有机胶层102和第二有机胶层104上还设置有紫外固化胶层120。所述紫外固化胶层120包括两个对称设置在所述TFE封装层的两侧，并向下填充满所述第一挡墙101和第二挡墙103及其上的所述第一有机胶层102和第二有机胶层104之间的空间。其中所述紫外固化胶层120采用的材料可以是热固化丙烯酸胶，但不限于。
其中由于所述第一挡墙101和第一有机胶层102之间的横向尺寸特征使得两者相接处的构型为一个楔形结构，同样的楔形结构也形成在所述第二挡墙103与第二有机胶层104之间，如此，当所述紫外固化胶向下填充时，也就形成了一个三者之间的楔子结构，从而起到了密封固定的作用。
进一步的，其中所述紫外固化胶层120的表面与所述TFE封装层的表面平齐，连同其下部设置的双层中空填充了紫外固化胶的挡墙结构，将所述TFE封装层的两侧部整体包裹于内，使得所述TFE封装层容易被外界水、氧侵入的侧部均处于与外界隔绝的位置，只在上表面与外部环境接触，从而有效的提高对所述OLED器件层两侧部的封装效果，避免了TFE封装层可靠性差，外部水、氧容易进入，导致其有机发光层失效的问题。
进一步的，本发明的又一实施方式是提供一种制备上述本发明涉及的所述OLED显示面板的制备方法，其包括以下步骤：
步骤S1、提供一TFT基板100，于所述TFT基板100上沉积一层SiNx层，在于其上涂布一层有机胶层，对所述有机胶层进行图案化处理，从而形成间隔设置的所述第一有机胶层102和第二有机胶层104，其中所述第一有机胶层102为对称设置在所述TFT基板100的两端部，而所述第二有机胶层104则是对称设置在所述第一有机胶层102的内侧；完成后的结构图示，请参阅图2所示；
步骤S2、对所述SiNx层进行干刻，因为固化后的所述有机胶层的耐刻蚀性更强，干刻之后，剩下的处于所述有机胶层下方的SiNx层的尺寸会比上方的有机胶层小，即刻蚀后的所述氮化硅层的横向长度小于其上的有机胶层的横向尺寸，从而使得两者形成楔形结构；相应的，对应于所述第一有机胶层102下方的为所述第一挡墙101，而对应于所述第二有机胶层104下方的即为所述第二挡墙103；完成后的结构图示，请参阅图3所示；
S3、于所述TFT基板100上制作OLED器件层110，具体包括空穴注入层、空穴传输层、发光层、电子传输层、电子注入层、阴极等；完成后的结构图示，请参阅图4所示；
S4、于所述OLED 器件层110上制备TFE封装层，首先在所述OLED器件层110的两侧部外分别设置第一无机层111，其中所述第一无机层111的高度要低于所述OLED器件层110，以便于后续的封装墨水能填满楔形结构中的上方有机胶层104和下方的第二挡墙103间的尺寸差，然后在开始依次沉积第一有机层112、第二无机层113，其中所述第一有机层112可以是将所述OLED器件层110和第一无机层111全部包裹于内，但其上表面的高度不超过所述第二有机胶层104的表面高度，而其上设置的所述第二无机层113的表面高度优选与所述第二有机胶层104的表面高度一致或是略低于；完成后的结构图示，请参阅图5所示；
S6、于所述TFT基板100的两侧端部分别通过喷墨打印的方式滴上紫外固化胶，其中所述紫外固化胶会在紫外光下快速固化，进而向下固定住所述第一有机胶层102和所述第一挡墙101间形成的楔形结构，以及所述第二有机胶层104与所述第二挡墙103间形成的楔形结构；待所述固化胶固化后，两端部的紫外固化胶层120向下完全覆盖所述有机胶层，进而使得所述紫外固化胶层的内侧端部延伸到所述第二无机层113上，但会存在中间的空白部分，这一部分可以补充沉积一层所述TFE薄膜封装中的一层第二有机层114来填补，如此，完成本发明涉及的所述OLED显示面板的整体结构，具体结构图示，则请参阅图1所示。
本发明涉及的一种OLED显示面板，其在其TFT基板的两端设置由致密性较好的柱形氮化硅构成的挡墙，然后在结合其上设置的有机胶层，通过两者结合所构成的楔形结构来代替现有侧部TFE封装结构，可以有效增强所述显示面板两侧封装阻隔外部水、氧侵入的能力，同时所述TFE封装结构还会设置在所述两端部的楔形结构之间，还可进一步的增加其阻隔水、氧的侵入性能。
本发明的技术范围不仅仅局限于上述说明中的内容，本领域技术人员可以在不脱离本发明技术思想的前提下，对上述实施例进行多种变形和修改，而这些变形和修改均应当属于本发明的范围内。

Claims (10)

  1. 一种OLED显示面板，包括TFT基板，其中所述TFT基板上设置有OLED器件层，所述OLED器件层上设置有TFE封装层；
    其中所述TFT基板的两端还分别设置有第一挡墙，每一所述第一挡墙上设置有第一有机胶层，其中所述第一有机胶层的横向尺寸大于其下设置的所述第一挡墙的横向尺寸，进而使得两者相接的部分形成一个内凹的楔形结构；
    其中所述OLED器件层和所述TFE封装层位于所述两第一挡墙和其上设置的两所述第一有机胶层之间。
  2. 根据权利要求1所述的OLED显示面板，其中所述TFE封装层与两侧设置的所述两第一挡墙和第一有机胶层之间空间间隔，所述第一有机胶层上还设置有固化胶层，所述固化胶层还向下填充所述TFE封装层与所述两第一挡墙和第一有机胶层之间的间隔空间。
  3. 根据权利要求2所述的OLED显示面板，其中所述TFE封装层位于两所述固化胶层之间，且所述TFE封装层的上表面与所述固化胶层的上表面平齐。
  4. 根据权利要求2所述的OLED显示面板，其中两所述第一挡墙内侧还设置有对称设置的两第二挡墙，其中所述OLED器件层位于两所述第二挡墙之间；
    其中所述第二挡墙与所述第一挡墙空间间隔设置，所述固化胶层还向下填充所述第一挡墙和所述第二挡墙之间的空间。
  5. 根据权利要求4所述的OLED显示面板，其中每一所述第二挡墙上均设置有一第二有机胶层。
  6. 根据权利要求5所述的OLED显示面板，其中所述第二有机胶层的横向宽度大于其下设置的所述第二挡墙的横向宽度。
  7. 根据权利要求4所述的OLED显示面板，其中所述第一挡墙和第二挡墙均采用SiNx材料构成。
  8. 根据权利要求1所述的OLED显示面板，其中所述TFE封装层包括设置在所述OLED器件层两侧的第一无机层，其中所述第一无机层的高度低于所述OLED器件层。
  9. 一种制备根据权利要求1所述的OLED显示面板的制备方法，包括以下步骤：
    步骤S1、提供一TFT基板，于所述TFT基板上沉积一层挡墙层，再在所述挡墙层上涂布一层有机胶层；刻蚀所述有机胶层并对其固化，进而形成分别位于所述TFT基板两端的第一有机胶层；
    步骤S2、对所述挡墙层进行干刻以形成分别位于所述TFT基板两侧端的所述第一挡墙，因为固化后的有机层耐刻蚀更强，干刻之后所述第一有机胶层下方的所述第一挡墙的横向宽度尺寸会比上方的所述第一有机胶层的小，从而形成两者相接部分的内凹楔形结构；
    步骤S3、于所述TFT基板上制备出OLED器件层；以及
    步骤S4、于所述OLED器件层上制备出TFE薄膜封装层，其中所述TFE薄膜封装层位于所述两第一挡墙和其上设置的第一有机胶层之间。
  10. 根据权利要求9所述的制备方法，其还包括在所述第一有机胶层上形成固化胶层的步骤S5，其为通过喷墨打印的方式在所述第一有机胶层上滴加固化胶材料，然后使其固化进而向下固定住所述第一有机胶层和所述第一挡墙间形成的所述楔形结构。
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CN106981584A (zh) * 2017-03-20 2017-07-25 上海天马有机发光显示技术有限公司 柔性有机发光二极管显示面板、显示装置及其制作方法
CN109768184A (zh) * 2019-02-18 2019-05-17 武汉华星光电半导体显示技术有限公司 一种oled显示面板及其制备方法
CN110098349A (zh) * 2019-05-23 2019-08-06 武汉华星光电半导体显示技术有限公司 一种oled显示面板及其制备方法

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