WO2020189901A1 - Poudre conductrice et connecteur de test comprenant celle-ci - Google Patents

Poudre conductrice et connecteur de test comprenant celle-ci Download PDF

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WO2020189901A1
WO2020189901A1 PCT/KR2020/002447 KR2020002447W WO2020189901A1 WO 2020189901 A1 WO2020189901 A1 WO 2020189901A1 KR 2020002447 W KR2020002447 W KR 2020002447W WO 2020189901 A1 WO2020189901 A1 WO 2020189901A1
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conductive
polymer
particles
conductive powder
present disclosure
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PCT/KR2020/002447
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English (en)
Korean (ko)
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정영배
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주식회사 아이에스시
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives

Definitions

  • the present disclosure relates to a novel conductive powder and a connector for inspection including the same.
  • a connector for inspection is disposed between the device to be inspected and test equipment.
  • An inspection method is known in which an inspection connector electrically connects a device to be inspected and a test equipment to determine whether a device to be inspected is defective based on whether the device to be inspected and the test equipment are energized.
  • the terminal of the device under test directly contacts the terminal of the test equipment without a connector for inspection, the terminal of the test equipment may be worn or damaged during the repetitive inspection process, resulting in the need to replace the entire test equipment.
  • the need to replace the entire test equipment is prevented by using a connector for inspection. Specifically, when the inspection connector is worn or damaged due to repeated contact with the terminal of the device under test, only the corresponding inspection connector can be replaced.
  • the conductive powder used for the conductive part of the inspection connector is used by plating gold (Au) on the magnetic core.
  • Au gold
  • the conductive powder present in the connector is subjected to force due to compression, and contact between the conductive powders occurs, causing deformation and abrasion of particles.
  • the gold plating layer on the surface is peeled off due to wear of the particles, iron (Fe), nickel (Ni), or cobalt (Co), which are components of the magnetic core with low conductivity, are exposed to the outside, reducing conductivity and increasing contact resistance, thereby generating electrical signals. You will not be able to deliver it properly.
  • the conventional conductive powder has irregular particle formation, the contact between the particles is made in the form of a contact point.
  • the contact point between the particles is distorted, resulting in unstable resistance and electrical signal transmission may not be performed smoothly.
  • Patent Document 1 Republic of Korea Patent Publication No. 10-2018-0132031 (2018. 12. 11.)
  • one aspect of the present disclosure is a core particle; And a polymer layer surrounding the surface of the core particles, wherein a plurality of conductive particles are bonded to the polymer layer, and the polymer includes one or more unsaturated hydrocarbons, aromatic hydrocarbons, or both. to provide.
  • the conductive powder according to an aspect of the present disclosure may exhibit excellent deformation resistance, abrasion resistance, and resistance stability. Even when the inspection connector is compressed, the polymer layer is flexibly deformed, and the contact between the particles is not shifted and the contact is maintained in the form of surface contact, and a plurality of conductive particles are bonded to the polymer layer, showing excellent resistance stability. , It can exhibit the effect of stably transmitting electrical signals even in repeated use.
  • FIG. 1 is a partial cross-sectional view of an inspection connector 100 according to an exemplary embodiment, and shows a state in which the inspection connector 100 is disposed between a device under test 10 and a test equipment 20.
  • FIG. 2 is a schematic diagram of a conductive powder 30 according to an aspect of the present disclosure. These particles are in the form of a polymer layer 40 coated on the core particle 60, and a plurality of conductive particles 50 are attached or bonded to the outer surface of the polymer layer, and injected or penetrated into the polymer layer. Can exist.
  • FIG. 3 is a schematic diagram showing a state in which the conductive powder according to an aspect of the present disclosure maintains a surface contact shape when pressure is applied before and after use.
  • the drawing shows the arrangement of the conductive powder 30 present in the conductive part before use
  • the drawing shows the form in which the conductive powders contact each other when pressure is applied up and down.
  • the conductive powder subjected to pressure increases the contact area as the polymer layer is elastically deformed. That is, the conductive powders are in surface contact with each other.
  • the conductive powder returns to its original position when the pressure is removed.
  • FIG. 4 is a schematic diagram showing a conductive powder obtained according to a manufacturing step of a conductive powder according to an aspect of the present disclosure in chronological order.
  • A shows a conductive powder obtained by coating a polymer layer on the surface of a core particle.
  • B shows the conductive powder in a state in which the conductive particles are absorbed by the polymer layer.
  • C denotes a conductive powder present by reducing the absorbed conductive particles so that a plurality of conductive particles are attached or bonded to the outer surface of the polymer layer and injected or penetrated into the interior of the polymer layer.
  • D shows the electroconductive powder before and after penetration of electroconductive particle.
  • FIG. 5 shows a scanning micrograph of a conductive powder coated with a polymer layer prepared according to an aspect of the present disclosure. According to the present disclosure, after coating, the conductive powder is well coated with a polymer layer without clumping together.
  • FIGS. 6 and 7 show cross-sectional photographs of the conductive powder coated with the polymer layer using a focused ion beam.
  • Embodiments or aspects of the present disclosure are exemplified for the purpose of describing the technical idea of the present disclosure.
  • the scope of the rights according to the present disclosure is not limited to the embodiments or aspects or specific descriptions thereof presented below.
  • the term “about” is used with the intention of including an error in a manufacturing process included in a specific numerical value or a slight numerical adjustment that falls within the scope of the technical idea of the present disclosure.
  • the term “about” means a range of ⁇ 10% of the value it refers to, ⁇ 5% on one side, and ⁇ 2% on the other. In the field of this disclosure, an approximation of this level is appropriate unless the values are specifically stated to require a narrower range.
  • the direction indicators such as “upper” and “upper” used in the present disclosure mean the direction in which the terminal 11 of the device under test 10 is arranged based on the test connector 100, and “downward", " A direction indicator such as “lower” refers to a direction in which the terminal 21 of the test equipment 20 is arranged based on the test connector 100.
  • the "thickness direction” of the inspection connector 100 referred to in the present disclosure means an up-down direction. This is a criterion for describing so that the present disclosure can be clearly understood to the end, and it goes without saying that the upper and lower sides may be differently defined depending on where the standard is placed.
  • core particles In one aspect of the present disclosure, core particles; And a polymer layer surrounding the surface of the core particle, wherein the polymer layer includes conductive particles bonded to a polymer, wherein the polymer includes one or more unsaturated hydrocarbons, aromatic hydrocarbons, or both.
  • the polymer layer includes conductive particles bonded to a polymer, wherein the polymer includes one or more unsaturated hydrocarbons, aromatic hydrocarbons, or both.
  • the bonding between the polymer layer and the plurality of conductive particles absorbs a solution containing the precursor of the conductive particles in the polymer layer while the polymer layer surrounds the core particles, and the It can be done by reducing the precursor.
  • some of the plurality of conductive particles may be attached or bonded to the outer surface of the polymer layer, and some of the remaining conductive particles may be injected or penetrated into the interior of the polymer layer.
  • some of the plurality of conductive particles are bonded to the polymer layer in a state exposed to the outer surface of the polymer layer, and the remaining part of the plurality of conductive particles is impregnated into the polymer layer. It may be bonded to the polymer layer in a state.
  • the present disclosure is made of a polymer, a plurality of conductive particles are bonded to the surface of the polymer, and the polymer may relate to a conductive powder containing one or more unsaturated hydrocarbons, aromatic hydrocarbons, or both. have.
  • the bonding between the polymer and the plurality of conductive particles may be achieved by absorbing a solution containing the precursor of the conductive particles in the polymer and reducing the precursor. Due to such bonding, some of the conductive particles may be attached or bonded to the surface of the polymer, and some of the remaining conductive particles may be injected or penetrated into the outside of the polymer.
  • some of the plurality of conductive particles may be bonded to the polymer in a state exposed to the outer surface, and some of the remaining conductive particles may be bonded to the polymer while being impregnated. I can.
  • the polymer is polyethylene, polypropylene, polytetrafluoroethylene, poly(vinyl chloride), polystyrene, polyacrylonitrile, poly(vinyl acetate), poly(methyl methacrylate), It may be one or more selected from the group consisting of a combination thereof and a block copolymer thereof. In one aspect of the present disclosure, the polymer may be a styrene block copolymer.
  • the polymer may be a styrene block copolymer.
  • the styrene block copolymer is a styrene-butadiene-styrene (SBS) copolymer, a SIS (styrene-isoprene-styrene) copolymer, a styrene-(ethylene-butadiene)-styrene (SEBS) copolymer. And it may be one or more selected from the group consisting of a combination thereof, but is not limited thereto. When such a polymer is used as a component of the polymer layer of the conductive powder, it has good adsorption to the core particles, and the effect to be achieved in the present disclosure can be excellently achieved.
  • SBS styrene-butadiene-styrene
  • SEBS SIS copoprene-styrene copolymer
  • SEBS styrene-(ethylene-butadiene)-styrene
  • the styrene block copolymer may have a structure as shown in Formula 1 below, and may be a styrene block copolymer, but may have two styrene polymer blocks.
  • x, y, z may be integers of 1 or more, x and z may be the same, and A may be any repeating unit usable by a person skilled in the art
  • the core particles may be magnetic particles, polymer particles, inorganic particles excluding metals, or organic-inorganic hybrid particles, but are not limited thereto.
  • the magnetic particles may include at least one selected from the group consisting of cobalt, nickel, iron, and an alloy including at least one of them, but is not limited thereto.
  • the conductivity of the conductive part 130 may be improved, and manufacturability may be improved in a manufacturing method described later by using the property of magnetizing magnetic particles in a magnetic field.
  • the alloy may be an alloy obtained by adding another material (eg, copper) to any one of magnetic materials (cobalt, nickel, and iron), or at least two of them. It may be an alloy formed in more than one.
  • the polymer of the polymer particles is polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, polybutadiene, polymethyl methacrylate, polymethyl acrylate, poly Carbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin , Saturated polyester resin, polyethylene terephthalate, polysulfone, polyphenylene oxide, polyacetal, polyimide, polyamideimide, polyetheretherketone, polyethersulfone, divinylbenzene polymer, divinylbenzene-based copolymer, and It may be one or more selected from the group consisting of a combination thereof, but is not limited thereto.
  • the polymer of the polymer particles may be a polymer obtained by polymerizing one or two or more polymerizable monomers having an ethylenically unsaturated group.
  • the polymerizable monomer having an ethylenically unsaturated group may be a non-crosslinkable monomer or a crosslinkable monomer.
  • examples of the non-crosslinkable monomer include styrene-based monomers such as styrene and ⁇ -methylstyrene; Carboxyl group-containing monomers such as (meth)acrylic acid, maleic acid, and maleic anhydride; Methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, cetyl (meth) Alkyl (meth)acrylate compounds such as acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate; Oxygen atom-containing (meth)acrylate compounds such as 2-hydroxyethyl (meth)acrylate, glycerol (meth)acrylate, polyoxyethylene (meth)
  • crosslinkable monomer for example, tetramethylolmethane tetra (meth) acrylate, tetramethylol methane tri (meth) acrylate, tetramethylol methane di (meth) acrylate, Trimethylolpropane tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, glycerol tri(meth)acrylate, glycerol di(meth)acrylate, (poly ) Multifunctional such as ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, (poly)tetramethylene glycol di(meth)acrylate, and 1,4-butanediol di(meth)acrylate (Meth)acrylate compounds; Triallyl (iso) cyanurate, trial
  • the polymerizable monomer having an ethylenically unsaturated group can be polymerized by a known method to obtain the polymer particles.
  • known methods include, for example, a method of suspension polymerization in the presence of a radical polymerization initiator, and a method of swelling a monomer together with a radical polymerization initiator using non-crosslinked seed particles to polymerize, but are limited thereto. no.
  • the polymer of the polymer particles is polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polypyrrole, polycarbazole, polyindole, polyazepine, polyaniline, polythiophene, poly (3,4-ethylenedioxythiophene), polyphenylene sulfide, polyacetylene, polystyrenesulfonate and polyphenylenevinylidene, poly(3,4-ethylenedioxythiophene), polystyrenesulfonate, and combinations thereof It may be one or more selected from the group consisting of, but is not limited thereto.
  • the inorganic particles may include one or more selected from the group consisting of silica, alumina, barium titanate, zirconia, carbon black, and combinations thereof, but is not limited thereto.
  • the particles formed of the silica are not particularly limited, but examples include particles obtained by hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups to form crosslinked polymer particles, followed by firing as necessary. I can.
  • Examples of the organic-inorganic hybrid particles include organic-inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin.
  • the organic-inorganic hybrid particle may be a core-shell type organic-inorganic hybrid particle having a core and a shell disposed on the surface of the core.
  • the core may be an organic core and the shell may be an inorganic shell.
  • the organic core may be a core made of the above-described polymer.
  • the conductive particles may be at least one selected from the group consisting of gold, silver, platinum, palladium, rhodium, and an alloy containing at least one of them, but is not limited thereto.
  • the alloy may be an alloy in which other materials (eg, phosphorus) are added to any one of conductive particles (gold, silver, platinum, palladium, and rhodium), or It may be an alloy formed on at least two or more of these.
  • the shape of the core particle is qualitatively spherical (spherical), angular (angular), tear drop shape (tear drop), cubic shape (cubic), sponge shape (sponge), needle Ancicular, cylindrical, irregular, ligamental, flake, fibrous, polygonal, dendritic, or aggregate It can be aggregate.
  • it is difficult to uniformly specify the size of the core particle because the size of the core particle is small and the size of each individual particle is different, but it can be represented by the diameter of a circle that encloses all the particles inside (Randall M. German, Powder metallurgy science, Metal Powder Industry, 2nd edition, page 64 (March 1, 1994)).
  • the size of the core particles may be in the range of about 20 ⁇ m to about 60 ⁇ m in diameter.
  • the polymer layer may surround or coat the surface of the core particles. In this case, although it is difficult to uniformly specify the thickness of the polymer layer, the thickness may be distributed within a range of about 0.1 ⁇ m to about 5 ⁇ m.
  • the conductive powder may further include a second coating layer.
  • the second coating layer may be present between the core particles and the polymer layer or on the polymer layer.
  • the second coating layer may include at least one selected from the group consisting of gold, silver, platinum, palladium, rhodium, and an alloy including any one or more of them, but is not limited thereto.
  • the size of the conductive powder may be in the range of about 20 ⁇ m to about 65 ⁇ m.
  • the present disclosure provides an inspection connector disposed between a device under test and a test equipment to electrically connect the device under test and the test equipment to each other, comprising: a sheet of an insulating material; And it may relate to a connector for inspection including a conductive portion extending in the vertical direction in the sheet to enable current in the vertical direction.
  • the conductive part may include a conductive powder according to one aspect of the present disclosure.
  • the device under test 10 may be a semiconductor device or the like.
  • the device under test 10 includes a plurality of terminals 11.
  • the plurality of terminals 11 are disposed on the lower side of the device under test 10.
  • the plurality of terminals 11 can contact the upper surface of the inspection connector 100.
  • the test equipment 20 includes a plurality of terminals 21.
  • the plurality of terminals 21 correspond to the plurality of terminals 11.
  • the plurality of terminals 21 can contact the lower side of the connector 100 for inspection.
  • each of the plurality of terminals 21 is disposed at a position facing each of the plurality of terminals 11 in the vertical direction.
  • each of the plurality of terminals 21 connects each of the plurality of terminals 11 to the plurality of conductive parts 130. It may be disposed at a position facing in an inclined direction.
  • the connector for inspection 100 is disposed between the device under test 10 and the test equipment 20 to electrically connect the device under test 10 and the test equipment 20 to each other. Is composed.
  • the test connector 100 is a conductive part 130 configured to electrically connect the sheet 110 of an insulating material, the terminal 11 of the device under test 10 and the terminal 21 of the test equipment 20. ).
  • the sheet 110 has a thickness in the vertical direction.
  • the thickness (length in the thickness direction) of the sheet 110 is smaller than the length in a direction perpendicular to the thickness direction of the sheet 110.
  • the sheet 110 is formed of an electrically insulating material.
  • the sheet 110 may be formed of an elastically deformable material.
  • the sheet 110 may be made of an elastic polymer material having insulating properties.
  • the elastic polymer material may be a polymer material having a crosslinked structure.
  • the curable polymer material forming material that can be used to obtain the crosslinked polymer material include conjugated diene-based materials such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber.
  • Block copolymer rubbers such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber , Silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like, but are not limited thereto.
  • the sheet 110 may include silicone rubber.
  • the silicone rubber may be a liquid silicone rubber (LSR).
  • the silicone rubber may be a polysiloxane, and may be a condensed type, an addition type, a polysiloxane containing a vinyl group or a hydroxyl group, and may be, for example, polydimethylsiloxane, polymethylphenylsiloxane, or polydiphenylsiloxane, but is limited thereto. It doesn't work.
  • the liquid silicone rubber usable in the present disclosure may include a liquid silicone rubber that can be used as an insulating material by a person skilled in the art within a range that does not deteriorate the performance of the inspection connector according to an aspect of the present disclosure.
  • the conductive part 130 may extend in the vertical direction.
  • the conductive part 130 extends in the vertical direction within the sheet 110 to enable electric current in the vertical direction.
  • the conductive part 130 is disposed on the sheet 110.
  • the conductive part 130 may be supported by the sheet 110.
  • the plurality of conductive parts 130 are spaced apart from each other in a direction perpendicular to the vertical direction.
  • the plurality of conductive parts 130 may be arranged substantially spaced apart from each other.
  • both ends of the conductive portion 130 in the vertical direction are exposed on the vertical surface of the sheet 110.
  • the upper end of the conductive part 130 is exposed on the upper surface of the sheet 110, and the lower end of the conductive part 130 is exposed on the lower surface of the sheet 110.
  • the upper end of the conductive part 130 is configured to be in contact with the terminal 11 of the device under test 10
  • the lower end of the conductive part 130 is configured to be in contact with the terminal 21 of the test equipment 20 .
  • the conductive part 130 includes an exposed part (not shown) exposed on the surface of the sheet 110, which means the surface of the conductive part 130.
  • the exposed portions are located at both ends of the conductive portion 130.
  • the sheet 110 may be configured to surround the conductive portion 130 except for the exposed portion.
  • the present disclosure provides a method for producing a conductive powder, comprising the steps of: (1) coating a polymer layer on the surface of the core particles (FIG. 4A); (2) absorbing a solution containing a precursor of conductive particles into the polymer layer (FIG. 4B); (3) It may relate to a manufacturing method including the step of reducing the precursor of the conductive particles absorbed in the polymer layer and bonding to the polymer layer (FIG. 4C).
  • the manufacturing method may further include a step of sufficiently bonding the conductive particles to the polymer layer by repeating (4) steps (2) and (3) after step (3). .
  • the conductive powder according to an aspect of the present disclosure may be prepared by a method comprising the following steps:
  • Step (1) The core particles and the polymer solution dissolved in an organic solvent are placed in a beaker and mixed. The polymer solution is separated by adding water and then removed.
  • Step (2) After that, ultrasonic treatment is performed to precipitate a polymer. The ultrasonic treatment and precipitation process are repeated until the water in the beaker becomes clear. Then, the water is removed and the polymer-coated core particles are washed with alcohol.
  • Step (3) Put the polymer-coated powder and the precursor solution of the conductive particles obtained in the above step into a separate conical tube and stir.
  • the precursor solution of the conductive particles may be obtained by dissolving a precursor containing conductive particles (eg, a compound such as silver trifluoroacetate (CF 3 COOAg)) in alcohol. After stirring, the precursor solution is removed.
  • a precursor containing conductive particles eg, a compound such as silver trifluoroacetate (CF 3 COOAg)
  • Step (4) Then, the reducing agent solution is added to the tube and stirred.
  • the reducing agent solution may be obtained by dissolving a reducing agent (eg, a reducing agent such as hydrazine hydrate (NH 2 NH 2 ⁇ xH 2 O)) in alcohol. After stirring, the reducing agent is removed, and the powder is washed with water or alcohol.
  • a reducing agent eg, a reducing agent such as hydrazine hydrate (NH 2 NH 2 ⁇ xH 2 O)
  • Step (5) Steps (3) and (4) are repeated until the conductive particles are sufficiently bonded to the polymer layer coated on the surface of the core particles. Finally, the powder is washed with alcohol and then dried to obtain a conductive powder of the present disclosure.
  • the weight ratio of the polymer and the solvent in the polymer solution may be 1:3 to 1:50.
  • the solvent of the polymer solution is n -pentane ( n- Pentane), n -hexane ( n- Hexane), n -heptane ( n- Heptane), n -octane ( n- Octane), 2 -Methylpentane, Cyclopentane, Cyclohexane, Methylcyclohexane, benzene, ethylbenzene, 1-Hexene, Tetrahydrofuran and Toluene It may be one or more selected from the group of.
  • the weight ratio of the compound containing the conductive particles and the solvent in the conductive particle solution may be 1:2 to 1:10.
  • the solvent of the conductive particle solution may be water or alcohol, and specifically, may be at least one selected from the group consisting of water, methanol, ethanol, 2-propanol, 1-butanol, and combinations thereof. .
  • the weight ratio of the reducing agent and the solvent in the reducing agent solution may be 1:5 to 1:40.
  • the solvent of the conductive particle solution may be water or alcohol, and specifically, may be at least one selected from the group consisting of water, methanol, ethanol, 2-propanol, 1-butanol, and combinations thereof. .
  • the manufacturing method according to Example A includes the step of disposing the solidified conductive portion 130 extending in the vertical direction in a mold.
  • the manufacturing method according to the embodiment A includes the step of forming the sheet 110 by injecting and curing a liquid insulating material such as silicon into the mold.
  • the inspection connector 100 may be manufactured using a 3D printing method.
  • the sheet 110 may be formed by 3D printing, the conductive portion 130 may be formed, or the entire inspection connector may be formed.
  • the manufacturing method according to Example C includes forming a hole in the cured sheet 110 in which the conductive portion 130 is disposed.
  • the hole may be formed to penetrate the sheet 110 vertically.
  • the hole may be formed using a laser.
  • the manufacturing method according to the embodiment C includes forming the conductive portion 130 by injecting and curing a solution containing the conductive powder according to an aspect of the present disclosure into the hole of the sheet 110.
  • the manufacturing method according to Example D includes the step (a) of injecting a mixture of a conductive powder and a liquid insulating material according to an aspect of the present disclosure into a specific location.
  • the liquid insulating material may be a liquid silicone material.
  • the manufacturing method according to the embodiment D includes, after step (a), generating a magnetic field so that the coated conductive powder is aligned at predetermined positions (b).
  • the conductive powder forms the conductive part 130 by generating the magnetic field.
  • the conductive part 130 extends in the vertical direction and enables electricity to be energized in the vertical direction.
  • the liquid insulating material injected into the specific position together with the conductive powder is cured after passing through the step (b).
  • the insulating material cured after step (b) may constitute at least a part of the sheet 110.
  • the insulating material cured after passing through the step (b) may perform a function of supporting the conductive part 130.
  • the specific location may be inside the mold.
  • a mixture of the conductive powder and the liquid insulating material may be injected into the mold.
  • the liquid insulating material injected in step (a) is cured after passing through step (b) to form the sheet 110.
  • the conductive powder may flow in the liquid insulating material to be aligned at predetermined positions.
  • the specific location may be inside a hole formed in a cured sheet.
  • a hole forming step of forming a hole penetrating the cured sheet in the vertical direction may be performed prior to the step (a).
  • the hole may be formed to penetrate the sheet vertically.
  • the hole may be formed using a laser.
  • a mixture of a conductive powder and a liquid insulating material according to an aspect of the present disclosure may be injected into the hole.
  • the conductive powder may flow inside the hole and may be aligned at preset positions.
  • the liquid insulating material is cured to form a part of the sheet.
  • a nickel core particle powder having an average particle diameter of 30 ⁇ m and a styrene-butadiene-styrene (SBS) solution dissolved in toluene are placed in a beaker and mixed. At this time, the weight ratio of the SBS polymer and toluene may be 1: 25 to 1: 40. After separating the SBS solution by adding water, it is removed.
  • SBS styrene-butadiene-styrene
  • the SBS-coated powder and conductive particle solution obtained in the above step are put into separate conical tubes and stirred.
  • the conductive particle solution may be obtained by dissolving a compound containing conductive particles (eg, a compound such as silver trifluoroacetate (CF 3 COOAg)) in ethanol.
  • a compound containing conductive particles eg, a compound such as silver trifluoroacetate (CF 3 COOAg)
  • the weight ratio of silver trifluoroacetate and ethanol may be 1:5.
  • the conductive particle solution is removed.
  • the reducing agent solution is added to the tube and stirred.
  • the reducing agent solution may be obtained by dissolving a reducing agent (eg, a reducing agent such as hydrazine hydrate (NH 2 NH 2 ⁇ xH 2 O)) in ethanol.
  • a reducing agent eg, a reducing agent such as hydrazine hydrate (NH 2 NH 2 ⁇ xH 2 O)
  • the weight ratio of the reducing agent and ethanol may be 1: 15.
  • the reducing agent is removed, and the powder is washed with water or alcohol.
  • Steps (3) and (4) are repeated until the conductive particles are sufficiently coated and impregnated in the polymer layer coated on the surface of the core particles. Finally, the powder was washed with alcohol and then dried to obtain a conductive powder of the present disclosure.
  • the surface and cross-section of the conductive powder of the present disclosure finally obtained from the above examples were observed using a Scanning Electron Microscope (SEM) and a focused ion beam (FIB).
  • SEM Scanning Electron Microscope
  • FIB focused ion beam
  • the SEM results are shown in Fig. 5, and the FIB results are shown in Figs. 6 and 7. According to this drawing, it can be seen that the conductive powder according to the present disclosure does not clump together and the polymer layer to which the conductive particles are bonded is well coated.

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  • Chemical & Material Sciences (AREA)
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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Power Engineering (AREA)
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Abstract

Selon un aspect, la présente invention concerne une poudre conductrice comprenant : des particules centrales ; et une couche de polymère entourant la surface des particules centrales, la couche de polymère comportant une pluralité de particules conductrices liées à celle-ci, et le polymère contenant un ou plusieurs hydrocarbures insaturés, des hydrocarbures aromatiques, ou les deux. La présente invention concerne, selon un aspect, un connecteur de test comprenant : une partie conductrice comprenant la poudre conductrice ; et une feuille d'un matériau isolant. La poudre conductrice selon un aspect de la présente invention peut présenter une excellente résistance à la déformation, une excellente résistance à l'abrasion et une excellente stabilité de résistance.
PCT/KR2020/002447 2019-03-21 2020-02-20 Poudre conductrice et connecteur de test comprenant celle-ci WO2020189901A1 (fr)

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KR10-2019-0032568 2019-03-21

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US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes
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