WO2020050657A1 - Connecteur d'inspection et procédé de fabrication de connecteur d'inspection - Google Patents

Connecteur d'inspection et procédé de fabrication de connecteur d'inspection Download PDF

Info

Publication number
WO2020050657A1
WO2020050657A1 PCT/KR2019/011500 KR2019011500W WO2020050657A1 WO 2020050657 A1 WO2020050657 A1 WO 2020050657A1 KR 2019011500 W KR2019011500 W KR 2019011500W WO 2020050657 A1 WO2020050657 A1 WO 2020050657A1
Authority
WO
WIPO (PCT)
Prior art keywords
pedot
connector
inspection connector
conductive portion
sheet
Prior art date
Application number
PCT/KR2019/011500
Other languages
English (en)
Korean (ko)
Inventor
정영배
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Publication of WO2020050657A1 publication Critical patent/WO2020050657A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes

Definitions

  • the present disclosure relates to an inspection connector disposed between the device under test and the test equipment, and a method for manufacturing the inspection connector.
  • an inspection connector is disposed between the device under test and test equipment. It is known that an inspection connector electrically connects the device under test and the test equipment to determine whether the device under test is defective based on whether the device under test and the test equipment are energized.
  • the terminal of the device under test does not have a connector for inspection directly in contact with the terminal of the test equipment, the terminal of the test equipment may be worn or damaged in the repetitive inspection process, and the entire test equipment may need to be replaced.
  • the occurrence of the need to replace the entire test equipment is prevented by using an inspection connector. Specifically, when the connector for inspection is worn or damaged by repeated contact with the terminal of the device under test, only the corresponding connector for inspection can be replaced.
  • the conventional inspection connector includes a conductor electrically connecting the terminal of the device under test and the terminal of the test equipment, and a sheet of insulator on which the conductor is arranged.
  • a plurality of the conductors of the connector for inspection are arranged to correspond to the spacing or pitch between a plurality of terminals of the device under test, thereby electrically connecting a plurality of terminals of the device under test and corresponding terminals of the test equipment. Order.
  • the conductor of the connector for inspection is composed of a plurality of conductive elastic particles mixed with a conductive elastic body which is a conductive polymer.
  • An embodiment of the present disclosure provides a conductive portion made of a conductive elastic body having improved conductivity.
  • An embodiment of the present disclosure provides a conductive portion made of a conductive elastic body with improved processability.
  • Inspection connector according to a representative embodiment, a sheet of insulating material; And a conductive portion extending in the vertical direction in the sheet to enable energization in the vertical direction.
  • the conductive portion includes any one of PEDOT and PEDOT complex.
  • An inspection connector includes a sheet of an insulating material; And a conductive portion extending in the vertical direction in the sheet to enable energization in the vertical direction.
  • the conductive portion is composed of at least one of PEDOT and PEDOT complex.
  • the conductive portion may include PEDOT.
  • the conductive portion may include a PEDOT composite.
  • the PEDOT composite may be a chemical bond of PEDOT and metal particles.
  • the metal particles may include an alloy including at least one or at least one of Cu, Mn, Ag, Au, and Pt.
  • the metal particles may include magnetic body particles.
  • the metal particles may include an alloy including at least one or at least one of Co, Ni, and Fe.
  • At least one of ethylene glycol, glycerol and dimethylsurfoxide may be chemically bonded to the PEDOT complex.
  • At least one of DBSA, OTs-PEPG / Py, CSA, BNSA and PTSA and PEDOT may be chemically bound to the PEDOT complex.
  • the carbon nanotube and the PEDOT may be chemically bonded to the PEDOT composite.
  • graphene and PEDOT may be chemically bound to the PEDOT complex.
  • a method of manufacturing a connector for inspection includes disposing a mixture of a magnetic material particle and a PEDOT composite containing PEDOT and a liquid insulating material in a mold; And generating a magnetic field so that the PEDOT composite is gathered at predetermined positions, and forming the conductive portion that allows the PEDOT composite to extend in the vertical direction and to conduct electricity in the vertical direction by forming the sheet by curing the insulating material.
  • the magnetic particles may include an alloy including at least one or at least one of Co, Ni, and Fe.
  • the conductivity of the conductive portion can be improved.
  • the workability of the conductive portion can be improved.
  • the conductive portion can be maintained or improved while improving convenience in manufacturing by realizing the conductive portion by using the conductive elastic body alone without mixing with the conductive particles.
  • electrical characteristics may be improved by positioning a conductive polymer in a conductive portion to be connected in the vertical direction using a magnetic field.
  • FIG. 1 is a partial cross-sectional view of an inspection connector 100 according to an embodiment, and shows an inspection connector 100 disposed between the device 10 to be tested and the test equipment 20.
  • FIG. 2 is a diagram showing an example of the chemical structure of PEDOT.
  • 3 is a diagram showing an example of the chemical structure of the PEDOT complex.
  • direction refers to the direction in which the terminal 11 of the device under test 10 is disposed based on the connector 100 for inspection
  • the direction directives such as “lower” means the direction in which the terminals 21 of the test equipment 20 are disposed based on the connector 100 for inspection.
  • the "thickness direction” of the connector 100 for inspection referred to in the present disclosure means an up-down direction. This is a reference for explaining the present disclosure so that it can be clearly understood, and depending on where the standard is placed, the up and down direction Of course, it can be defined differently.
  • the device 10 to be inspected may be a semiconductor device or the like.
  • the device 10 to be inspected includes a plurality of terminals 11.
  • the plurality of terminals 11 are arranged on the lower surface of the device under test 10.
  • the plurality of terminals 11 may contact the upper surface of the connector 100 for inspection.
  • the test equipment 20 includes a plurality of terminals 21.
  • the plurality of terminals 21 corresponds to the plurality of terminals 11.
  • the plurality of terminals 21 are arranged on the upper side of the device under test 10. When inspecting the device under test 10, the plurality of terminals 21 may contact the lower surface of the connector 100 for inspection.
  • each of the plurality of terminals 21 is arranged at a position facing each of the plurality of terminals 11 in the vertical direction.
  • each of the plurality of terminals 21 may include each of the plurality of terminals 11 of the plurality of conductive parts 130. It may be arranged in a position facing the inclined direction.
  • the test connector 100 is disposed between the device under test 10 and the test equipment 20 and is configured to electrically connect the device under test 10 and the test equipment 20 to each other.
  • the test connector 100 is a conductive portion 130 configured to electrically connect the sheet 110 of an insulating material, the terminal 11 of the device 10 to be tested, and the terminal 21 of the test equipment 20. ).
  • the sheet 110 has a thickness in the vertical direction.
  • the thickness of the sheet 110 (length in the thickness direction) is smaller than the length in the direction perpendicular to the thickness direction of the sheet 110.
  • the sheet 110 is formed of an electrically insulating material.
  • the sheet 110 may be formed of an elastically deformable material.
  • the sheet 110 may be made of an insulating elastic polymer material.
  • the elastic polymer material may be a polymer material having a crosslinked structure.
  • Examples of the curable polymer material forming material that can be used to obtain the crosslinked polymer material include conjugated diene systems such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber.
  • Block copolymer rubbers such as rubbers and hydrogenated products thereof, styrene-butadiene-diene block copolymer rubbers, styrene-isoprene block copolymers, and hydrogenated products thereof, chloroprene, urethane rubbers, polyester rubbers, epichlorohydrin rubbers , Silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.
  • the conductive portion 130 may extend in the vertical direction.
  • the conductive portion 130 extends in the vertical direction within the sheet 110 to enable energization in the vertical direction.
  • the conductive portion 130 is disposed on the sheet 110.
  • the conductive portion 130 may be supported by the sheet 110.
  • the plurality of conductive parts 130 are spaced apart from each other in a direction perpendicular to the vertical direction.
  • the plurality of conductive parts 130 may be arranged to be substantially spaced apart from each other.
  • Both ends of the conductive portion 130 in the vertical direction are exposed on the vertical surface of the sheet 110.
  • the upper end of the conductive portion 130 is exposed to the upper surface of the sheet 110, and the lower end of the conductive portion 130 is exposed to the lower surface of the sheet 110.
  • the upper end of the conductive portion 130 is configured to be able to contact the terminal 11 of the device under test 10
  • the lower end of the conductive portion 130 is configured to be able to contact the terminal 21 of the test equipment 20. .
  • the conductive portion 130 includes an exposed portion (not shown) exposed on the surface of the sheet 110.
  • the exposed portion is located at both ends of the conductive portion 130.
  • the sheet 110 may be configured to surround the conductive portion 130 excluding the exposed portion.
  • the conductive portion 130 is formed of a conductive material.
  • the conductive portion 130 may be formed of an elastically deformable material.
  • the conductive portion 130 includes any one of PEDOT and PEDOT composites.
  • PEDOT means Poly (3,4-ethylenedioxythiophene).
  • PEDOT complex means a chemical bond between PEDOT and another substance.
  • the conductive portion 130 may include both PEDOT and PEDOT composites, or may include only one of them.
  • FIG. 2 is a diagram showing an example of the chemical structure of PEDOT.
  • 3 is a diagram showing an example of the chemical structure of the PEDOT complex, conceptually showing that the S atom and other substances (A, B) of the PEDOT are covalently bonded. Only one material (A) may be bound to the PEDOT, or a plurality of materials (A, B) may be bound. The plurality of materials A and B may be the same material or different materials. In one unit of PEDOT, other materials (A, B) may act as a bridge to form a complex with another unit of PEDOT. The atom binding to another material may be arbitrarily selected from S atoms of PEDOT.
  • the conductive portion 130 is composed of at least one of PEDOT and PEDOT composite.
  • the conductive part 130 may be composed of only the PEDOT and the PEDOT complex, or may be composed of only one of the two.
  • “conductive part 130 is composed of at least one of PEDOT and PEDOT composite” means that, in addition to PEDOT and PEDOT composite, some impurities in the manufacturing process are added to the conductive portion 130 in trace amounts. Can be understood.
  • the PEDOT composite Prior to the manufacture of the connector 100, the PEDOT composite can be produced. After mixing the PEDOT, other materials to be chemically bound to the PEDOT, and other materials (for example, dispersing materials, distilled water, etc.), inducing chemical bonding between the PEDOT and the other materials, and then adding to help the above bonding Only the PEDOT complex can be collected so that dispersant and / or distilled water are not mixed.
  • a conductive portion 130 may be formed using the collected PEDOT composite.
  • the PEDOT or the PEDOT composite prepared to form the conductive portion 130 may be liquid.
  • embodiments of the PEDOT composite will be described.
  • the PEDOT complex may have a chemical bond between PEDOT and metal particles.
  • the metal particles may include an alloy including at least one or at least one of Cu, Mn, Ag, and Pt. Through this, the conductivity of the conductive part 130 can be improved.
  • the metal particles may include at least one of Cu, Mn, Ag and Pt.
  • the metal particles may include only Cu, or may include Cu and Mn.
  • the metal particles may include an alloy including at least one of Cu, Mn, Ag, and Pt.
  • the alloy including at least one of the Cu, Mn, Ag, and Pt may be an alloy in which a material other than Cu, Mn, Ag, and Pt is added to any one of Cu, Mn, Ag, and Pt, It may be an alloy formed of at least two or more of Cu, Mn, Ag and Pt.
  • the metal particles may be alloys in which other materials such as Fe are added to Cu, or may be alloys of Cu and Mn.
  • PEDOT and Cu are chemically bonded to the PEDOT complex.
  • IPA isopropyl alcohol, isopropyl alcohol
  • PEDOT is added and stirred for a certain period of time (for example, 1 to 24 hours), then Cu is in an ionic state.
  • PEDOT: Cu may be formed by slowly forming nanoparticles.
  • PEDOT and Mn are chemically bound to the PEDOT complex.
  • Mn (NO 3 ) 2 manganese nitrate
  • IPA Isopropyl alcohol, isopropyl alcohol
  • Mn slowly forms nanoparticles in the ionic state to form PEDOT: Mn.
  • PEDOT and Ag are chemically bonded to the PEDOT complex.
  • AgNO 3 is added to IPA (Isopropyl alcohol, isopropyl alcohol) and dispersed by ultrasonic waves. Then, PEDOT is added and stirred for a certain period of time (for example, 1 to 24 hours). To form PEDOT: Ag.
  • PEDOT and Pt are chemically bonded to the PEDOT complex.
  • H 2 PtCl 6 * H 2 O platinum chloride * water
  • PEDOT is added and stirred for a certain period of time (for example, 1 to 24 hours), Pt is in an ionic state.
  • PEDOT: Pt may be formed by slowly forming nanoparticles.
  • any metal particle may be chemically bound to PEDOT to form a PEDOT complex.
  • PEDOT and Au may be chemically bonded to the PEDOT complex, and PEDOT: Au may be prepared.
  • the metal particles may include magnetic substance particles.
  • the magnetic particle may include an alloy containing at least one or at least one of Co, Ni, and Fe.
  • the magnetic material particles may include at least one of Co, Ni, and Fe.
  • the magnetic particle may include only Co, or may include Co and Ni.
  • the magnetic particle may include an alloy including at least one of Co, Ni, and Fe.
  • the alloy containing at least one of Co, Ni, and Fe may be an alloy in which a material other than Co, Ni, and Fe is added to any one of Co, Ni, and Fe, and at least one of Co, Ni, and Fe. It may be an alloy formed by two or more.
  • the magnetic particles may be alloys in which other materials such as Cu are added to Co, or may be alloys of Co and Fe.
  • PEDOT and Co are chemically bonded to the PEDOT complex.
  • the monomers EDOT (3,4-ethylenedioxythiophene, ethylenedioxythiophene), LSA (lignosulfonic acid, lignosulfonic acid) and Co 3 O 4 (cobalt oxide) are synthesized by polymerization together and purified with methanol and distilled water. By doing so, PEDOT: Co can be formed.
  • PEDOT and Ni are chemically bonded to the PEDOT complex.
  • PEDOT: Ni may be formed by synthesizing EDOT, LSA and NiSO 4 (nickel sulfate) by polymerization together and purifying with methanol and distilled water.
  • PEDOT and Fe are chemically bonded to the PEDOT complex.
  • PEDOT: Fe may be formed by synthesizing EDOT, LSA, and Fe 3 O 4 (triiron tetraoxide) together by polymerization and purifying with methanol and distilled water.
  • any of the magnetic particles that can be utilized as the magnetic particles can be chemically bound to PEDOT to form a PEDOT complex.
  • At least one of ethylene glycol (ethylene glycol, EG), glycerol, and dimethylsurfoxide (DMSO) may be chemically bonded to the PEDOT complex. Through this, the distance between the PEDOT polymer strands can be narrowed to improve the conductivity of the conductive portion 130.
  • ethylene glycol ethylene glycol, EG
  • glycerol glycerol
  • DMSO dimethylsurfoxide
  • PEDOT and EG are chemically bound to the PEDOT complex.
  • the PEDOT complex may be PEDOT: PEG.
  • PEG means poly ethylene glycol.
  • PEDOT: PEG may be formed by mixing PEDOT and a PEG solution and stirring for 4 to 24 hours.
  • PEDOT and glycerol are chemically bound to the PEDOT complex.
  • PEDOT: glycerol may be formed by mixing PEDOT and glycerol solution and stirring for 4 to 24 hours.
  • PEDOT and DMSO are chemically bound to the PEDOT complex.
  • PEDOT: DMSO can be formed.
  • the PEDOT complex includes DBSA (dodecylbenzenesulfonate), OTs-PEPG / Py (Tosylates-poly (ethylene glycol) -blockpoly (propylene glycol) -block-poly (ethylene glycol) / pyridine), CSA (camphorsulfonate), BNSA (butylnaphthalenesulfonate) and At least one of PTSA (p-toluenesulfonic acid) and PEDOT may be chemically bound.
  • DBSA dodecylbenzenesulfonate
  • OTs-PEPG / Py Tosylates-poly (ethylene glycol) -blockpoly (propylene glycol) -block-poly (ethylene glycol) / pyridine
  • CSA camphorsulfonate
  • BNSA butylnaphthalenesulfonate
  • the conductivity of the conductive portion 130 increases as the alkyl chain of the organic acid to be added increases, which increases the doping level in the polymer chain and increases the conductivity in the molecule as well as the coordination structure of the polymer chain. This is because the intermolecular conductivity also increases.
  • PEDOT and DBSA are chemically bound to the PEDOT complex.
  • An example of a method of manufacturing PEDOT: DBSA is as follows. First, 100 ml of DBSA and 250 ml of distilled water are stirred, and then 3.52 g of EDOT, a monomer of PEDOT, is added. After quantifying 4.42 g of iron chloride in another beaker, add it to 150 ml of distilled water and stir until dissolved. Then, by mixing these two solutions and stirring at room temperature for 24 hours, PEDOT: DBSA can be formed.
  • PEDOT and OTs-PEPG / Py are chemically bound to the PEDOT complex.
  • An example of a method of manufacturing PEDOT: OTs-PEPG / Py is as follows. First, OTs-PEPG / Py and distilled water are stirred, and then EDOT is added. After quantifying a certain amount of iron chloride in another beaker, add it to distilled water and stir until dissolved. Then, by mixing these two solutions and stirring at room temperature, PEDOT: OTs-PEPG / Py can be formed.
  • PEDOT and CSA are chemically bound to the PEDOT complex.
  • One example of the manufacturing method of EDOT: CSA is as follows. First, CSA and distilled water are stirred, and then EDOT is added. After quantifying a certain amount of iron chloride in another beaker, add it to distilled water and stir until dissolved. Then, by mixing these two solutions and stirring at room temperature, PEDOT: CSA can be formed.
  • PEDOT and HSO 4 are chemically bound to the PEDOT complex.
  • One example of the manufacturing method of EDOT: HSO 4 is as follows. First, HSO 4 and distilled water are stirred, and then EDOT is added. After quantifying a certain amount of iron chloride in another beaker, add it to distilled water and stir until dissolved. Then, by mixing these two solutions and stirring at room temperature, PEDOT: HSO 4 can be formed.
  • PEDOT and BNSA are chemically bound to the PEDOT complex.
  • One example of the manufacturing method of EDOT: BNSA is as follows. First, BNSA and distilled water are stirred, and then EDOT is added. After quantifying a certain amount of iron chloride in another beaker, add it to distilled water and stir until dissolved. Then, by mixing these two solutions and stirring at room temperature, PEDOT: BNSA can be formed.
  • PEDOT and PTSA are chemically bound to the PEDOT complex.
  • An example of the manufacturing method of EDOT: PTSA is as follows. First, PTSA and distilled water are stirred, and then EDOT is added. After quantifying a certain amount of iron chloride in another beaker, add it to distilled water and stir until dissolved. Then, by mixing these two solutions and stirring at room temperature, PEDOT: PTSA can be formed.
  • At least one of CNT and graphene and PEDOT may be chemically bound to the PEDOT complex. Through this, the conductivity of the conductive part 130 can be improved.
  • CNT and PEDOT are chemically bound to the PEDOT complex.
  • a complex of CNT and PEDOT can be formed.
  • graphene and PEDOT are chemically bound to the PEDOT complex.
  • An example of the manufacturing method is as follows. After dispersing 0.1 g of graphene oxide (GO) in 100 ml of distilled water, 100 ml of PEDOT aqueous solution is added to the dispersed solution and stirred for 4 hours to mix well. Thereafter, the temperature was raised to 100 ° C, and 1 ml of hydrazine monohydrate was added to react for 24 hours, followed by filtration through filter paper and washing with distilled water. Then, by drying the powder on the filter paper in an oven for 12 hours or more, Graphene / PEDOT may be formed.
  • GO graphene oxide
  • PEDOT aqueous solution
  • Each of the above-described embodiments is not limited to forming a PEDOT complex only by chemical bonding of PEDOT with any one material, and includes forming a PEDOT complex by chemically bonding two or more different materials with PEDOT.
  • PEDOT and Cu are chemically bonded, and at least one other material other than Cu and PEDOT are chemically It covers until the formation of the bound PEDOT complex.
  • a PEDOT complex in which PEDOT and Cu are chemically bound and PEDOT and glycerol are chemically bound may be formed.
  • each of the above embodiments can be combined with each other.
  • the manufacturing method according to Example A includes disposing a solidified conductive portion 130 extending in the vertical direction in a mold.
  • the manufacturing method according to the embodiment A includes, after that, by injecting and curing a liquid insulating material such as silicon into the mold to form a sheet 110.
  • Example B it is also possible to manufacture the connector 100 for inspection using a 3D printing method.
  • the sheet 110 may be formed by 3D printing or the conductive portion 130 may be formed, or an overall inspection connector may be formed.
  • the manufacturing method according to Example C includes forming a hole in which the conductive portion 130 is disposed on the cured sheet 110.
  • the hole may be formed to penetrate the sheet 110 up and down.
  • the hole can be formed using a laser.
  • the manufacturing method according to the embodiment C includes forming a conductive portion 130 by injecting and curing at least one of the liquid PEDOT and the PEDOT composite into the hole of the sheet 110.
  • the manufacturing method according to Example D includes the step (a) of injecting a mixture of magnetic material particles, a PEDOT composite containing PEDOT, and a liquid insulating material at a specific location.
  • the liquid insulating material may be a liquid silicone material.
  • the magnetic particle may include an alloy including at least one or at least one of Co, Ni, and Fe.
  • the manufacturing method according to the embodiment D after step (a), includes the step (b) of generating a magnetic field such that the PEDOT composite is aligned to predetermined positions.
  • the PEDOT composite forms a conductive portion 130 by generating the magnetic field.
  • the conductive portion 130 extends in the vertical direction and enables energization in the vertical direction.
  • the liquid insulating material injected into the specific position together with the PEDOT composite is cured in the step (b).
  • the insulating material cured in step (b) may constitute at least a portion of the sheet 110.
  • the insulating material cured in the step (b) may perform a function of supporting the conductive portion 130.
  • the specific position may be inside the mold.
  • a mixture of the PEDOT composite and a liquid insulating material may be injected into the mold.
  • the liquid insulating material injected in step (a) is cured in step (b) to form a sheet 110.
  • the PEDOT composite may flow in a liquid insulating material and be aligned at predetermined positions.
  • the specific position may be inside a hole formed in the cured sheet.
  • a hole forming step of forming a hole penetrating the cured sheet in the vertical direction may be performed before the step (a).
  • the hole may be formed to penetrate the sheet up and down.
  • the hole can be formed using a laser.
  • a mixture of a PEDOT composite and a liquid insulating material may be injected into the hole.
  • the PEDOT composite may flow in the hole and be aligned at predetermined positions.
  • the liquid insulating material may be cured to form part of the sheet.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)

Abstract

Un connecteur d'inspection selon un mode de réalisation de l'invention comprend : une feuille de matériau isolant; et un élément conducteur s'étendant dans la direction verticale dans la feuille pour permettre à un courant électrique d'être appliqué dans la direction verticale. L'élément conducteur comprend un élément choisi pami un PEDOT et un composite PEDOT.
PCT/KR2019/011500 2018-09-06 2019-09-05 Connecteur d'inspection et procédé de fabrication de connecteur d'inspection WO2020050657A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180106603A KR102080006B1 (ko) 2018-09-06 2018-09-06 검사용 커넥터 및 검사용 커넥터의 제조방법
KR10-2018-0106603 2018-09-06

Publications (1)

Publication Number Publication Date
WO2020050657A1 true WO2020050657A1 (fr) 2020-03-12

Family

ID=69722667

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2019/011500 WO2020050657A1 (fr) 2018-09-06 2019-09-05 Connecteur d'inspection et procédé de fabrication de connecteur d'inspection

Country Status (2)

Country Link
KR (1) KR102080006B1 (fr)
WO (1) WO2020050657A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110012845A (ko) * 2009-07-31 2011-02-09 연세대학교 산학협력단 전도성 고분자/전이금속산화물/탄소나노튜브 나노복합소재 및 그의 제조 방법
JP2012231059A (ja) * 2011-04-27 2012-11-22 Nissei Eco Co Ltd 電磁波シールドカバー及びその製造法
KR20130133571A (ko) * 2012-05-29 2013-12-09 광주과학기술원 아민기를 갖는 비공액 고분자를 포함하는 유기전자소자용 기능층 및 이를 포함하는 유기전자소자
KR20140027131A (ko) * 2011-03-06 2014-03-06 헤레우스 프레셔스 메탈스 게엠베하 운트 코. 카게 고체 전해질로서 pedot/pss를 함유하는 캐패시터에서 폴리글리세롤로 전기적 파라미터를 개선하는 방법
KR101393601B1 (ko) * 2013-07-24 2014-05-13 주식회사 아이에스시 도전성 커넥터 및 그 제조방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101885714B1 (ko) 2016-11-08 2018-08-06 주식회사 대성엔지니어링 테스트 소켓

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110012845A (ko) * 2009-07-31 2011-02-09 연세대학교 산학협력단 전도성 고분자/전이금속산화물/탄소나노튜브 나노복합소재 및 그의 제조 방법
KR20140027131A (ko) * 2011-03-06 2014-03-06 헤레우스 프레셔스 메탈스 게엠베하 운트 코. 카게 고체 전해질로서 pedot/pss를 함유하는 캐패시터에서 폴리글리세롤로 전기적 파라미터를 개선하는 방법
JP2012231059A (ja) * 2011-04-27 2012-11-22 Nissei Eco Co Ltd 電磁波シールドカバー及びその製造法
KR20130133571A (ko) * 2012-05-29 2013-12-09 광주과학기술원 아민기를 갖는 비공액 고분자를 포함하는 유기전자소자용 기능층 및 이를 포함하는 유기전자소자
KR101393601B1 (ko) * 2013-07-24 2014-05-13 주식회사 아이에스시 도전성 커넥터 및 그 제조방법

Also Published As

Publication number Publication date
KR102080006B1 (ko) 2020-04-07

Similar Documents

Publication Publication Date Title
WO2020189901A1 (fr) Poudre conductrice et connecteur de test comprenant celle-ci
WO2015012498A1 (fr) Connecteur conducteur et son procédé de fabrication
WO2016126024A1 (fr) Prise de vérification ayant des particules conductrices en forme couplée
WO2021002690A1 (fr) Prise de test
EP0717418A2 (fr) Composition contenant un polymère et un matériau de remplissage conducteur et utilisation de celle-ci
WO2018008830A1 (fr) Matériau composite imprimable tridimensionnel destiné à une électrode flexible
WO2010047489A2 (fr) Dispositif d'interconnexion pour ensembles d'éléments de batterie
US6849335B2 (en) Anisotropic conductive sheet
CN101405608A (zh) 将多导线电缆的第一组导线与其他导线相区别的方法、使用该方法的测试连接器和包括这样的多导线电缆和测试连接器的套件
WO2023128428A1 (fr) Prise de test pour protection contre la perte de signaux
WO2014204161A2 (fr) Insert pour inspection
WO2018084518A1 (fr) Composition de pâte époxyde comprenant des nanofils de cuivre revêtus d'argent ayant une structure cœur-écorce, et film conducteur comprenant celle-ci
WO2020050657A1 (fr) Connecteur d'inspection et procédé de fabrication de connecteur d'inspection
CN105358627A (zh) 柔软导电材料和转换器
WO2011005026A2 (fr) Composition permettant de former des électrodes conductrices
WO2015156653A1 (fr) Procédé de fabrication d'une feuille de test, et feuille de test
WO2020101317A1 (fr) Connecteur destiné à une connexion électrique
WO2020096238A1 (fr) Particules électroconductrices et connecteur de transmission de signal doté de celles-ci
US20040217342A1 (en) Anisotropically conductive connector, production process thereof and application product thereof
WO2020076113A1 (fr) Fibre conductrice et son procédé de fabrication
WO2019045426A1 (fr) Prise de test et particules conductrices
CN106497067A (zh) 一种高导电率、高机械强度复合材料
WO2019045425A1 (fr) Prise de test comprenant des nanotubes de carbone
WO2020226288A1 (fr) Capteur de pression de type à sortie de chaleur de pointe comprenant un électrolyte et son procédé de fabrication
CN211043570U (zh) 一种单面pcb的测试装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19858540

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19858540

Country of ref document: EP

Kind code of ref document: A1