WO2020107640A1 - 一种用于柔性 oled 面板薄膜封装的掩模版 - Google Patents

一种用于柔性 oled 面板薄膜封装的掩模版 Download PDF

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Publication number
WO2020107640A1
WO2020107640A1 PCT/CN2019/070130 CN2019070130W WO2020107640A1 WO 2020107640 A1 WO2020107640 A1 WO 2020107640A1 CN 2019070130 W CN2019070130 W CN 2019070130W WO 2020107640 A1 WO2020107640 A1 WO 2020107640A1
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area
oled panel
mask
reticle
flexible oled
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PCT/CN2019/070130
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English (en)
French (fr)
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杜骁
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武汉华星光电半导体显示技术有限公司
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Priority to US16/320,382 priority Critical patent/US20200168846A1/en
Publication of WO2020107640A1 publication Critical patent/WO2020107640A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the invention relates to the technical field of packaging of display devices, in particular, a reticle for thin film packaging of flexible OLED panels.
  • the packaging method applied to flexible panels is mainly thin film packaging technology (Thin Film Ecapsulation, referred to as TFE).
  • TFE thin film packaging technology
  • the TFE currently used in mass production is Barix packaging technology.
  • the principle is to build an inorganic-organic alternating multilayer film on the surface of the substrate by chemical vapor deposition and inkjet printing to complete the packaging of the substrate.
  • the functional layer that mainly blocks water and oxygen It is an inorganic encapsulation layer.
  • the main function of the organic layer is to disperse the internal stress of the inorganic layer when the substrate is bent. Since the inorganic film is a rigid film, it is easily separated from the substrate due to excessive internal stress when it is bent, or cracked or separated from the film due to uneven stress, resulting in failure of the encapsulation layer.
  • One aspect of the present invention is to provide a reticle for thin film encapsulation of a flexible OLED panel, and the inorganic encapsulation layer of the OLED bending zone portion can be transformed from the original overall encapsulation layer into multiple independent modularizations
  • the encapsulation layer reduces the internal stress of the inorganic thin film during bending, thereby reducing the risk of damage to the encapsulation layer when the bending region is repeatedly bent.
  • a reticle for thin film packaging of a flexible OLED panel includes a reticle frame and a reticle body disposed in the frame.
  • the mask version defines a shielding area and an opening area in the body, wherein the opening area corresponds to the AA area of the flexible OLED panel.
  • a precision mask area is also defined in the opening area, which corresponds to the bending area of the flexible OLED panel. Wherein the precision mask area defines precision openings spaced apart from each other, and the size of the precision opening corresponds to one or more pixels.
  • the size of the precision opening corresponds to one pixel in the bending area of the OLED panel, wherein the pixel includes three sub-pixels of red, green, and blue.
  • the size of the precision opening corresponds to three pixels in the bending area of the OLED panel, and each pixel is a pixel of one color.
  • the size of the precision opening preferably corresponds to 3 pixels or a multiple of 3 pixels, for example, 6, 9, 12, etc., to correspond to the actual use 3 pixels such as red, green and blue.
  • the size of the precision opening corresponds to a whole row of pixels in the bending area of the OLED panel perpendicular to the bending direction.
  • the size of the precision opening corresponds to 2 ⁇ N pixels of different shapes in the bending area of the OLED panel, where N is an integer equal to or greater than 3.
  • the number of precision openings defined in the precision mask area may be 3, 4, 5, 6, 7, 8, 9, 10, etc., depending on actual needs, and Unlimited.
  • the size of each precision opening may be different, may correspond to the same number of pixels, or may correspond to different numbers of pixels, respectively, depending on actual needs, and is not limited.
  • the area of the precision mask region corresponds to the bending region and extends 100-1000 ⁇ m toward the periphery of both sides.
  • the precision mask area is formed by one of electroforming, etching or metal wire drawing.
  • the range of the opening area corresponds to the AA area and expands outward by 100-500um.
  • two or more opening areas are defined in the mask body, and at least one opening area defines the precision mask area.
  • the thickness of the mask body is 0.02 ⁇ 0.2 mm.
  • the surface of the mask body is covered with a protective film.
  • a protective film For example, Al 2 O 3 inorganic coating or perfluorocarbon coating (PTFE coating) is used to prevent Mask damage during the TFE process.
  • PTFE coating perfluorocarbon coating
  • the mask body is fixed on the mask frame by laser spot welding.
  • the invention relates to a reticle for flexible OLED thin film packaging, which introduces the design concept of a precision metal reticle, and designs part or all of the metal reticle for packaging process to be a precision metal reticle with a PPI slightly lower than the substrate PPI
  • the encapsulation reticle of the present invention may divide part or all of the encapsulation area of the inorganic encapsulation layer.
  • the inorganic encapsulation layer of the flexible OLED bending region manufactured by using the reticle according to the present invention can be transformed from the original integral encapsulation layer into a plurality of mutually independent and independent modular encapsulation layer structures, thereby reducing the inorganic The internal stress of the entire thin film when the bending area is bent, thereby reducing the risk of damage to the encapsulation layer when the bending area of the flexible OLED is repeatedly bent.
  • FIG. 1 is a schematic structural diagram of a reticle for flexible OLED thin film packaging according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of an embodiment of a precision opening defined by a precision mask area of the reticle shown in FIG. 1;
  • FIG. 3 is a schematic structural view of another embodiment of a precision opening defined by a precision mask area of the reticle shown in FIG. 1;
  • FIG. 4 is a schematic view of another embodiment of a precision opening defined by a precision mask area of the reticle shown in FIG. 1;
  • FIG. 5 is a schematic top view of a flexible OLED substrate after thin film packaging using the mask plate according to the present invention.
  • FIG. 6 is a cross-sectional structural view of the flexible OLED substrate shown in FIG. 5;
  • FIG. 7 is a schematic structural view of a reticle for flexible OLED thin film packaging according to yet another embodiment of the present invention.
  • an embodiment of the present invention provides a reticle for thin film packaging of a flexible OLED panel, including a reticle frame 20 and a reticle body 10 disposed in the frame 20.
  • the mask body 10 defines a shielding area 11 and an opening area 12, wherein the opening area 12 corresponds to the AA area of the flexible OLED panel.
  • a precision mask area 14 is also defined in the opening area, which corresponds to the bending area of the flexible OLED panel.
  • the mask body 10 is fixed on the mask frame 20 by laser spot welding.
  • the thickness of the mask body 10 is 0.02-0.2 mm, and its surface may be covered with a protective film, for example, Al 2 O 3 or PTFE coating, to prevent Mask damage during the TFE process.
  • the range of the opening area corresponds to the AA area and expands outward by 100-500um, but is not limited to, and may be determined according to actual needs.
  • the precision mask region 14 may be constructed by one of electroforming, etching, or metal wire drawing, and its area corresponds to the bending region and extends 100-1000 ⁇ m toward the periphery of both sides.
  • the precision mask area defines a plurality of mutually separated precision openings, and the size of each precision opening corresponds to one or more number of pixels.
  • FIGS. 2 ⁇ 4 illustrate three embodiments of the precision opening, but these embodiments are only for illustrative purposes and are not limited in any way. The embodiments make corresponding equivalent or combination transformations.
  • the illustrated precision mask area 14 is provided with nine precision openings 140 of equal size, and there is a space 141 between each opening, and the size of each precision opening corresponds to three Pixel point 150.
  • the illustrated precision mask area 14 is provided with four precision openings 140 of the same size, and there are spaces 141 between each opening, and the size of each precision opening corresponds to 6 pixels 150 .
  • the illustrated precision mask area 14 is provided with three precision openings 140 of equal size, and there is a space 141 between each opening, and the size of each precision opening corresponds to a row of pixels 150 .
  • the area range of this row of pixels can be the area range of a whole row of pixels corresponding to the lateral direction of the bending zone.
  • the number of precision openings 140 defined in the precision mask region 14 may be 3, 4, 5, 6, 7, 8, 9, 10, etc., depending on actual needs There is no limit.
  • the size of each precision opening can be the same or different, can correspond to the same number of pixels, or can correspond to different numbers of pixels, depending on the actual needs, and Unlimited.
  • FIGS. 5 and 6 illustrate the packaged OLED substrate.
  • the packaging area on the OLED substrate includes an overall packaging area 110 and a modular packaging area 120.
  • the lower inorganic encapsulation layer on the OLED substrate 130 of the modular encapsulation area 120 after applying the mask plate according to the present invention, its encapsulation structure passes through the precision mask area by the original overall encapsulation layer After being masked in 14, it is transformed into a plurality of independent modular encapsulation layer structures 132 to reduce the internal stress of the whole inorganic film when bending in the bending area, thereby reducing the bending area of the flexible OLED when repeatedly bending There is a risk of damage to the encapsulation layer.
  • FIG. 7 illustrates a reticle for thin film packaging of a flexible OLED panel provided by yet another embodiment of the present invention, which includes a mask frame 20 and a mask disposed on the mask The mask body 10 in the template frame 20.
  • the mask body 10 defines a shielding area 11 and a plurality of opening areas 12, wherein the opening area 12 corresponds to the AA area of the flexible OLED panel. Each opening area defines a precision mask area 14, which corresponds to the bending area of the flexible OLED panel.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种用于柔性OLED面板薄膜封装的掩模版，包括掩模版框架(20)和设置在所述掩模板框架(20)内的掩模版本体(10)。其中所述掩模版本体(10)内定义有遮蔽区(11)和开口区(12)，其中所述开口区(12)对应于柔性OLED面板的AA区。所述开口区(12)内还定义有精密掩模板区(14)，其对应于所述柔性OLED面板的弯折区。其中所述精密掩模板区(14)定义有相互分隔的精密开口(140)，所述精密开口(140)的大小对应于一个或以上数量的像素点。一种用于柔性OLED面板薄膜封装的掩模版，其能够制作出模块化封装层(132)，从而减小该处无机薄膜在弯曲时的内部应力，进而降低所述弯折区在反复弯折时发生封装层损坏的风险。

Description

一种用于柔性OLED面板薄膜封装的掩模版 技术领域
本发明涉及显示器件的封装技术领域，尤其是，一种用于柔性OLED面板薄膜封装的掩模版。
 背景技术
随着移动通信技术的发展，手机功能有了极大发展，同时智能手机发展趋向于大屏化，而过大的屏幕会影响手机的便携性能，故设计可折叠型智能手机在移动通讯领域引起了极大关注。
如今随着OLED显示技术的不断向前发展，业界对于柔性OLED面板已实现量产，其主要用于构筑一次固定弯曲屏幕。而对于可折叠的柔性OLED基板开发过程仍存在许多亟待解决的问题，其中最主要的问题在于柔性基板弯折区域在反复折叠时，其耐久性不足。这是由于弯曲部分各膜层应力不同，在反复弯折的过程中会造成膜层分离或者封装层破坏等问题。
进一步的，传统显示面板采用的玻璃封装技术难以实现柔性需求，现阶段应用于柔性面板的封装方法主要是薄膜封装技术（Thin Film Ecapsulation，简称TFE）。目前应用于量产的TFE为Barix封装技术，原理是在基板表面通过化学气相沉积和喷墨打印构筑无机-有机交替的多层薄膜，从而完成对基板的封装，其中主要阻隔水氧的功能层为无机封装层，有机层的主要作用为分散基板弯曲时无机层的内部应力。而无机膜由于是属于刚性膜，其在弯折时由于其内部应力过大，容易与基板相互脱离，或因受力不均匀而破裂或离膜，从而造成封装层失效。
因此，确有必要来研发一种新型的用于柔性OLED面板薄膜封装的掩模版，来克服现有技术中的缺陷。
 技术问题
本发明的一个方面是提供一种用于柔性OLED面板薄膜封装的掩模版，其制作出的所述OLED弯折区部分的无机封装层能够从原来的整体封装层转变为多个独立的模块化封装层，从而减小该处无机薄膜在弯曲时的内部应力，进而降低所述弯折区在反复弯折时发生封装层损坏的风险。
 技术解决方案
本发明采用的技术方案如下：
一种用于柔性OLED面板薄膜封装的掩模版，包括掩模版框架和设置在所述框架内的掩模版本体。其中所述掩模版本体内定义有遮蔽区和开口区，其中所述开口区对应于柔性OLED面板的AA区。所述开口区内还定义有精密掩模板区，其对应于所述柔性OLED面板的弯折区。其中所述精密掩模板区定义有相互分隔设置的精密开口，所述精密开口的大小对应于一个或以上数量的像素点。
进一步的，在不同实施方式中，其中所述精密开口的大小对应于所述OLED面板弯折区中的一个像素点，其中所述像素点包含红、绿、蓝三个子像素点。
或者其中所述精密开口的大小对应于所述OLED面板弯折区中的三个像素点，每个像素点为一个颜色的像素点。而在其他不同实施方式中，所述精密开口的大小优选对应3个像素点或是3的整倍数量的像素点，例如，6个，9个，12个等等，以对应实际使用中的红、绿、蓝等3像素点。
进一步的，在不同实施方式中，其中所述精密开口的大小对应于所述OLED面板的弯折区中与弯折方向垂直的一整排像素点。
进一步的，在不同实施方式中，其中所述精密开口的大小对应于所述OLED面板的弯折区中不同形状的2~N个像素点，其中N为等于或是大于3的整数。
其中，在不同实施方式中，所述精密掩模板区内定义的精密开口的数量，具体可以是3、4、5、6、7、8、9、10等等，随实际需要而定，并无限定。相应的，每个精密开口的大小可以是各不相同，可以各自对应相同数量的像素点，也可以是分别对应不同数量的像素点，具体随实际需要而定，并无限定。
进一步的，在不同实施方式中，其中所述精密掩模板区的区域范围对应所述弯折区并向其两侧***延伸100~1000μm。
进一步的，在不同实施方式中，其中所述精密掩模板区是通过电铸、蚀刻或金属拉丝中的一种方法构筑形成。
进一步的，在不同实施方式中，其中所述开口区的范围对应所述 AA区并向其外扩100~500um。
进一步的，在不同实施方式中，其中所述掩模板本体内定义有两个或以上数量的开口区，其中至少一个开口区内定义有所述精密掩模板区。
进一步的，在不同实施方式中，其中所述掩模板本体的厚度为0.02~0.2 mm。
进一步的，在不同实施方式中，其中所述掩模板本体的表面覆盖有保护膜。例如，Al 2O 3无机镀膜层或全氟化碳涂层（PTFE涂层），用以防止TFE制程中Mask损伤。
进一步的，在不同实施方式中，其中所述掩模板本体是通过激光点焊固定在所述掩模板框架上。
 有益效果
本发明涉及的一种用于柔性OLED薄膜封装的掩模版，其引入精密金属掩模版的设计构思，将封装制程用金属掩模版的部分或全部设计为PPI比基板PPI稍低的精密金属掩模版区，经过设计改造后的本发明涉及的所述封装掩模版可对无机封装层的封装区域部分或全部进行划分。如此，应用本发明涉及的所述掩模版制作的所述柔性OLED弯折区的无机封装层可由原整体封装层转变为多个相互间隔并独立的模块化封装层结构，从而减小所述无机薄膜整体在所述弯折区弯曲时的内部应力，进而降低所述柔性OLED的弯折区在反复弯折时发生封装层损坏的风险。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明一个实施方式中涉及的一种用于柔性OLED薄膜封装的掩模版的结构示意图；
图2是图1所示的掩模版，其精密掩模板区定义的一个精密开口的一个实施方式的结构示意图；
图3是图1所示的掩模版，其精密掩模板区定义的一个精密开口的又一个实施方式的结构示意图；
图4是图1所示的掩模版，其精密掩模板区定义的一个精密开口的又一个实施方式的结构示意图；
图5是应用本发明涉及的所述掩模板进行薄膜封装后的柔性OLED基板的俯视示意图；
图6是图5所示的柔性OLED基板的剖视结构图；
图7是本发明又一个实施方式中涉及的一种用于柔性OLED薄膜封装的掩模版的结构示意图。
 本发明的实施方式
以下将结合附图和实施例，对本发明涉及的一种用于柔性OLED面板薄膜封装的掩模版的技术方案作进一步的详细描述。
请参阅图1所示，本发明的一个实施方式提供了一种用于柔性OLED面板薄膜封装的掩模版，包括掩模板框架20和设置在所述框架20内的掩模板本体10。
其中所述掩模板本体10内定义有遮蔽区11和开口区12，其中所述开口区12对应于柔性OLED面板的AA区。所述开口区内还定义有精密掩模板区14，其对应于所述柔性OLED面板弯折区。
其中所述掩模板本体10是通过激光点焊固定在所述掩模板框架20上。所述掩模板本体10的厚度为0.02~0.2 mm，其表面可以覆盖有保护膜，例如，Al 2O 3或PTFE涂层，用以防止TFE制程中Mask损伤。其中所述开口区的范围对应所述 AA区并向其外扩100~500um，但不限于，可随实际需要而定。其中所述精密掩模板区14可以是通过电铸、蚀刻或金属拉丝中的一种方法构筑形成，其区域范围对应所述弯折区并向其两侧***延伸100~1000μm。
进一步的，其中所述精密掩模板区定义有多个相互分隔的精密开口，每个精密开口的大小对应于一个或以上数量的像素点。具体的，请参阅图2~4所示，其图示了三种所述精密开口的实施方式，但这些实施方式仅为举例性说明，并无任何限定，本领域额一般技术人员可根据这些实施方式做出相应的等同或是组合变换。
具体的，请参阅图2所示，其图示的精密掩模板区14设置有9个同等大小的精密开口140，每个开口之间存有间隔141，每一精密开口的大小对应于3个像素点150。
请参阅图3所示，其图示的精密掩模板区14设置有4个同等大小的精密开口140，每个开口之间存有间隔141，每一精密开口的大小对应于6个像素点150。
请参阅图4所示，其图示的精密掩模板区14设置有3个同等大小的精密开口140，每个开口之间存有间隔141，每一精密开口的大小对应于一排像素点150。其中这一排像素点的区域范围可以是对应于所述弯折区横向的一整排像素点的区域范围。
进一步的，在不同实施方式中，所述精密掩模板区14内定义的精密开口140的数量，具体可以是3、4、5、6、7、8、9、10等等，随实际需要而定，并无限定。相应的，每个精密开口的大小可以是相同的，也可以是各不相同，可以各自对应相同数量的像素点，也可以是分别对应不同数量的像素点，具体可随实际需要而定，并无限定。
应用本发明涉及的所述掩模板进行柔性OLED薄膜封装，请参阅图5、6所示，其图示了封装后的所述OLED基板。其中所述OLED基板上的封装区包括了整体封装区110和模块化封装区120。其中所述模块化封装区120的OLED基板130上的下无机封装层，在应用了本发明涉及的所述掩模板后，其封装结构由原来的整体封装层，经过了所述精密掩模板区14的遮掩后，转变为多个独立的模块化封装层结构132，减小无机薄膜整体在所述弯折区弯曲时的内部应力，进而降低所述柔性OLED的弯折区在反复弯折时发生封装层损坏的风险。
进一步的，请参阅图7所示，其图示了本发明涉及的又一种实施方式提供的一种用于柔性OLED面板薄膜封装的掩模版，其包括掩模板框架20和设置在所述掩模板框架20内的掩模板本体10。
其中所述掩模板本体10上定义有遮蔽区11和多个开口区12，其中所述开口区12对应于柔性OLED面板的AA区。每个开口区内都定义有精密掩模板区14，其对应于所述柔性OLED面板的弯折区。
其中对于图7所示的这一实施方式，其与上述图1所示的单开口区实施方式的区别，仅在于其包括了多个开口区，而对于每一开口区的具体结构，并无实质区别。因此，为避免不必要的赘述，此处不再重复。
本发明的技术范围不仅仅局限于上述说明中的内容，本领域技术人员可以在不脱离本发明技术思想的前提下，对上述实施例进行多种变形和修改，而这些变形和修改均应当属于本发明的范围内。

Claims (10)

  1. 一种用于柔性OLED面板薄膜封装的掩模版，包括掩模版框架和设置在所述掩模板框架内的掩模版本体；
    其中所述掩模板本体内定义有遮蔽区和开口区，其中所述开口区对应于柔性OLED面板的AA区；
    其中所述开口区内还定义有精密掩模板区，其对应于所述柔性OLED面板的弯折区；
    其中所述精密掩模板区定义有相互分隔设置的精密开口，所述精密开口的大小对应于一个或以上数量的像素点。
  2. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述精密开口的大小对应于所述OLED面板弯折区中的一个像素点，其中所述像素点包含红、绿、蓝三个子像素点。
  3. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述精密开口的大小对应于所述OLED面板的弯折区中与弯折方向垂直的一整排像素点。
  4. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述精密开口的大小对应于所述OLED面板的弯折区中不同形状的2~N个像素点，其中N为等于或是大于3的整数。
  5. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述精密掩模板区的区域范围对应所述弯折区并向其两侧***延伸100~1000μm。
  6. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述精密掩模板区是通过电铸、蚀刻或金属拉丝中的一种方法构筑形成。
  7. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述开口区的范围对应所述 AA区并向其外扩100~500um。
  8. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述掩模板本体内定义有两个或以上数量的开口区，其中至少一个所述开口区内定义有所述精密掩模板区。
  9. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述掩模板本体的厚度为0.02~0.2 mm。
  10. 根据权利要求1所述的一种用于柔性OLED面板薄膜封装的掩模版，其中所述掩模板本体的表面覆盖有保护膜，所述保护膜为全氟化碳涂层或Al 2O 3无机镀膜层。
PCT/CN2019/070130 2018-11-26 2019-01-02 一种用于柔性 oled 面板薄膜封装的掩模版 WO2020107640A1 (zh)

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