WO2020085708A1 - Transparent light emitting diode film - Google Patents

Transparent light emitting diode film Download PDF

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Publication number
WO2020085708A1
WO2020085708A1 PCT/KR2019/013537 KR2019013537W WO2020085708A1 WO 2020085708 A1 WO2020085708 A1 WO 2020085708A1 KR 2019013537 W KR2019013537 W KR 2019013537W WO 2020085708 A1 WO2020085708 A1 WO 2020085708A1
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WO
WIPO (PCT)
Prior art keywords
transparent
light emitting
film
emitting diode
electrode layer
Prior art date
Application number
PCT/KR2019/013537
Other languages
French (fr)
Inventor
Jangyoul CHAE
Jiwoong BAEK
Original Assignee
Hankuk Glass Industries Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hankuk Glass Industries Inc. filed Critical Hankuk Glass Industries Inc.
Publication of WO2020085708A1 publication Critical patent/WO2020085708A1/en

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Definitions

  • the present invention relates to a transparent light emitting diode film which is excellent in transparency, flexibility, and processability.
  • the present invention relates to a transparent light emitting diode film which is excellent in transparency, flexibility, and processability, which may be simply constructed by a scheme of bonding the transparent light emitting diode film to an attached object.
  • LED light emitting diode
  • the LED is inserted into a glass window of a building and is used as a lighting means or an advertising means.
  • the LED is embedded on an electrode layer directly formed on a glass sheet and then is sealed with a sealing member. Accordingly, when some LEDs are broken, the glass window itself should be replaced. Further, a window into which the LED is inserted itself should be separately designed and manufactured according to a design of a window of a building which is installed.
  • the present invention has been made in an effort to provide a transparent light emitting diode film which is excellent in transparency, flexibility, and processability. Specifically, the present invention has been made in an effort to provide a transparent light emitting diode film which is excellent in transparency, flexibility, and processability, which may be simply constructed by a scheme of bonding the transparent light emitting diode film to an attached object.
  • An exemplary embodiment of the present invention provides a transparent light emitting diode film including: a first transparent flexible film; a transparent electrode layer disposed on one surface of the first transparent flexible film and having at least one pattern; a plurality of light emitting diodes (LEDs) mounted on the transparent electrode layer; a protective substrate disposed on the transparent electrode layer and the plurality of light emitting diodes and protecting the light emitting diode; a second transparent flexible film disposed on the protective substrate; a transparent adhesive layer disposed on the second transparent flexible film; and a release film disposed on the transparent adhesive layer.
  • LEDs light emitting diodes
  • the transparent light emitting diode film may further include one or a plurality of flexible printed circuit boards (FPCBs) disposed on at least one edge portion of the transparent electrode layer.
  • FPCBs flexible printed circuit boards
  • Each of the first transparent flexible film and the second transparent flexible film may include at least one of polyethylene terephthalate (PET), polycarbonate (PC), and cyclo olefin polymer (COP).
  • PET polyethylene terephthalate
  • PC polycarbonate
  • COP cyclo olefin polymer
  • a thickness of the first transparent flexible film may be 200 to 300 mm and a thickness of the second transparent flexible film may be 20 to 300 mm.
  • the transparent electrode layer may be made of at least one of metallic nano wire, transparent conductive oxide, metal mesh, carbon nano tube, and graphene.
  • the transparent electrode layer may have a sheet resistance of 0.5 to 3 ⁇ /sq.
  • a ratio (W/L) of a total width W of the one or the plurality of flexible printed circuit boards to a length L of the edge portion of the transparent electrode layer may be 0.1 to 0.5.
  • the protective substrate may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, polyurethane, polycarbonate, polyolefin, polyvinyl chloride, and polyacetal.
  • PVB polyvinyl butyral
  • EVA ethylene vinyl acetate
  • ionoplast polymer polyurethane
  • polycarbonate polyolefin
  • polyvinyl chloride polyacetal
  • a thickness of the protective substrate may be 0.7 to 4 mm.
  • a peel strength of the transparent adhesive layer from the second transparent flexible film may be larger than a peel strength of the transparent adhesive layer from the release film.
  • the transparent adhesive layer may include at least one of an acrylic-based adhesive and a silicone-based adhesive.
  • the transparent light emitting diode film may further include an LED driving unit connected to the other end of the one or the plurality of flexible printed circuit boards and controlling the driving of a plurality of light emitting diodes according to an electrical signal.
  • Another exemplary embodiment of the present invention provides a laminate including: a first transparent flexible film; a transparent electrode layer disposed on one surface of the first transparent flexible film and having at least one pattern; a plurality of light emitting diodes (LEDs) mounted on the transparent electrode layer; a protective substrate disposed on the transparent electrode layer and the plurality of light emitting diodes and protecting the light emitting diode; a second transparent flexible film disposed on the protective substrate; a transparent adhesive layer disposed on the second transparent flexible film; and a substrate disposed on the transparent adhesive layer.
  • LEDs light emitting diodes
  • the transparent light emitting diode film according to an exemplary embodiment of the present invention can be simply constructed by a scheme in which the release film is removed and then the transparent light emitting diode film is bonded to an attached object.
  • the transparent light emitting diode film according to an exemplary embodiment of the present invention, which can be constructed in a case where the attached object is a plane and on various surfaces including a curved surface, etc.
  • a transparent light emitting diode film has a protective substrate configured therein to protect a light emitting diode LED from external shock or humidity.
  • a transparent light emitting diode film has a protective substrate configured therein to further enhance a UV blocking effect and flexibility.
  • FIG. 1 is a cross-sectional view schematically illustrating a transparent light emitting diode film according to an exemplary embodiment of the present invention.
  • FIG. 2 is a cross-sectional view schematically illustrating a transparent light emitting diode film according to another exemplary embodiment of the present invention.
  • FIG. 3 is a cross-sectional view schematically illustrating a transparent light emitting diode film according to yet another exemplary embodiment of the present invention.
  • FIG. 4 is a plan view schematically illustrating a transparent light emitting diode film according to an exemplary embodiment of the present invention.
  • first, second, and third are used for describing various arts, components, regions, layers, and/or sections, but are not limited thereto. The terms are only used to distinguish any part, component, region, layer, or section from the other part, component, region, layer, or section. Accordingly, the first part, component, region, layer, or section described below may be mentioned as the second part, component, region, layer, or section within the range without departing from the range of the present invention.
  • the present inventors have tried to manufacture a transparent light emitting diode film by using a transparent substrate film instead of a glass sheet.
  • the transparent light emitting diode film is configured between a light emitting diode and a release film without a separate protective substrate, the light emitting diode is exposed to shock from the outside or humidity, and as a result, durability is degraded.
  • the protective substrate is disposed between the light emitting diode and the release film to protect the light emitting diode from the shock from the outside or the humidity, thereby enhancing the durability. Furthermore, the protective substrate is disposed to further enhance the UV blocking effect and the flexibility.
  • FIG. 1 is a cross-sectional view schematically illustrating a transparent light emitting diode film 100 according to an exemplary embodiment of the present invention.
  • the transparent light emitting diode film 100 of FIG. 1 is to just describe the present invention and the present invention is not limited thereto. Accordingly, the transparent light emitting diode film 100 of FIG. 1 may be modified to various shapes.
  • the transparent light emitting diode film 100 includes: a first transparent flexible film 110; a transparent electrode layer 120 disposed on one surface of the first transparent flexible film 110 and having at least one pattern; a plurality of light emitting diodes (LEDs) 130 mounted on the transparent electrode layer 120; a protective substrate 140 disposed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 and protecting the light emitting diode 130; a second transparent flexible film 150 disposed on the protective substrate 140; a transparent adhesive layer 160 disposed on the second transparent flexible film 150; and a release film 170 disposed on the transparent adhesive layer 160.
  • LEDs light emitting diodes
  • the first transparent flexible film 110 serves to support other components of the transparent light emitting diode film 100.
  • the first transparent flexible film 110 may be one layer or a plurality of layers.
  • the first transparent flexible film 110 may be a light transmissive polymer film.
  • the light transmissive polymer film may have an insulating property and heat resistance in order to prevent a state change by external light while preventing power from being leaked to the outside.
  • the first transparent flexible film 110 at least one of polyethylene terephthalate (PET), polycarbonate (PC), and cyclo olefin polymer (COP) may be included.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • COP cyclo olefin polymer
  • a thickness of the first transparent flexible film 110 is not particularly limited. However, when the thickness of the first transparent flexible film 110 is too small, the first transparent flexible film 110 may be deformed or a crack may occur at a portion of the transparent electrode layer 120 due to a pressure applied to an LED side at the time of manufacturing the transparent light emitting diode film 100. On the contrary, when the thickness of the first transparent flexible film 110 is too large, the crack may occur in an attached object by stress in a case where the transparent light emitting diode film 100 is attached to the attached object (e.g., glass sheet). According to one example, the thickness of the first transparent flexible film 110 may be in the range of 200 to 300 mm.
  • the first transparent flexible film 110 is not easily deformed by heat, thereby further enhancing the durability of the transparent light emitting diode film 100.
  • the transparent electrode layer 120 as a portion disposed on one surface of the first transparent flexible film 110 serves to drive a light emitting diode (LED) 130.
  • LED light emitting diode
  • the transparent electrode layer 120 is excellent in light transmissivity, it may allow the external light to enter and a portion where the transparent electrode layer 120 is formed does not block a view of a user and further, an appearance property is also excellent.
  • the transparent electrode layer 120 may include a circuit pattern made of at least one of metallic nano wire, transparent conductive oxide, metal mesh, carbon nano tube, and graphene.
  • a non-limiting example of the metal nano wire may include Ag nano wire, copper nano wire, nickel nano wire, and the like, which may be singly used or two or more types thereof may be mixedly used.
  • a non-limiting example of the transparent conductive oxide may include Indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), indium oxide (In 2 O 3 ), and the like, which may be singly used or two or more types thereof may be mixedly used.
  • a non-limiting example of the metal mesh may include silver (Ag) mesh, copper (Cu) mesh, aluminum (Al) mesh, and the like, which may be singly used or two or more types thereof may be mixedly used. Among them, the silver nano wire, the copper mesh, and the silver mesh are excellent in conductivity and light transmittance and ITO and IZO has a low specific resistance value, may be deposited at a low temperature, and is high in transmittance of visible light.
  • the transparent electrode layer 120 may include a circuit pattern made of an electrode material selected from a group consisting of the Ag nano wire, the copper mesh, and the silver mesh.
  • a line width and a thickness of the circuit pattern are not particularly limited. However, when the circuit pattern has a width of approximately 5 to 15 mm and a thickness of approximately 0.2 to 1 mm, the transparent electrode layer 120 has a sheet resistance of approximately 0.5 to 3 ⁇ /sq.
  • the transparent electrode layer 120 may be formed through a method known to the art.
  • the electrode material is coated on the first transparent flexible film 110 and then a laser is irradiated onto the electrode material or mask and an etching process is performed to form at least circuit pattern.
  • the circuit pattern made of the electrode material may be formed on the first transparent flexible film 110 through an inkjet printing process.
  • the present invention is not limited thereto.
  • the light emitting diode (LED) 130 is a light emitting body which is mounted on the transparent electrode layer 120 and flickers according to supply of power. Since a plurality of light emitting diodes 130 are spaced apart from each other and arranged in a matrix form, various forms of characters or images may be displayed and a video may also be displayed.
  • the light emitting diode 130 available in an exemplary embodiment of the present invention may be used without a particular limit if being generally known to the art. Therefore, the light emitting diode 130 may be a single-color light emitting diode 130 having a color such as red (R), green (G), blue (B), etc., or two-color light emitting diodes 130 having colors such as R and G, or three-color light emitting diodes 130 having colors such as R, G, and B. When the respective light emitting diodes 130 are the three-color light emitting diodes 130 of R, G, and B, characters or images having various colors may be displayed.
  • the light emitting diode 130 may be fixed onto the transparent electrode layer 120 through a mounting method known to the art.
  • a pad (not illustrated) including a material having high electrical conductivity such as silver (Ag) may be formed in at least a part of the transparent electrode layer 120.
  • the light emitting diode 130 may be fixed onto the pad by using a low-temperature surface mount technology (SMT) process. At this time, the light emitting diode 130 may be attached to the pad through a soldering.
  • SMT surface mount technology
  • the protective substrate 140 is disposed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 to serve to protect the light emitting diode 130.
  • the protective substrate is disposed between the light emitting diode 130 and a release film 170 to protect the light emitting diode 130 from shock from the outside or humidity, thereby enhancing the durability. Furthermore, the protective substrate 140 is disposed to further enhance a UV blocking effect and flexibility.
  • the protective substrate 140 may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, polyurethane, polycarbonate, polyolefin, polyvinyl chloride, and polyacetal.
  • PVB polyvinyl butyral
  • EVA ethylene vinyl acetate
  • ionoplast polymer polyurethane
  • polycarbonate polyolefin
  • polyvinyl chloride polyacetal
  • the thickness of the protective substrate 140 may be 0.7 to 4 mm. When the thickness of the protective substrate 140 is too small, protection of a targeted light emitting diode 130 may be insufficient. When the protective substrate 140 is too thick, it is not advantageous in terms of protection of the light emitting diode 130 and flexibility may still deteriorate and peeling may occur.
  • the protective substrate 140 may be formed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 through the method known to the art. As one example, the protective substrate 140 may be formed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 through a lamination process of 105 to 135°C.
  • the second transparent flexible film 150 as a portion disposed on one surface of the protective substrate 140 serves to support other components of the transparent light emitting diode film 100.
  • the second transparent flexible film 150 is further configured to further firmly support the transparent light emitting diode film 100. Further, the second transparent flexible film 150 is configured together with the protective substrate 140 to more thoroughly protect the light emitting diode 130.
  • the second transparent flexible film 150 may be the light transmissive polymer film.
  • the light transmissive polymer film may have an insulating property and heat resistance in order to prevent a state change by external light while preventing power from being leaked to the outside.
  • the second transparent flexible film 150 at least one of polyethylene terephthalate (PET), polycarbonate (PC), and cyclo olefin polymer (COP) may be included.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • COP cyclo olefin polymer
  • the thickness of the second transparent flexible film 150 is not particularly limited. However, when the thickness of the second transparent flexible film 150 is too small, the second transparent flexible film 150 may be deformed or the crack may occur at a portion of the transparent electrode layer 120 due to a pressure applied to the LED side at the time of manufacturing the transparent light emitting diode film 100. On the contrary, when the thickness of the second transparent flexible film 150 is too large, the crack may occur in the attached object by stress in the case where the transparent light emitting diode film 100 is attached to the attached object (e.g., glass sheet). According to one example, the thickness of the second transparent flexible film 150 may be in the range of 20 to 300 mm.
  • the second transparent flexible film 150 is not easily deformed by heat, thereby further enhancing the durability of the transparent light emitting diode film 100.
  • the transparent adhesive layer 160 as a portion disposed on one surface of the second transparent flexible film 150 serves to bond the transparent light emitting diode film 100 to the attached object.
  • the transparent adhesive layer 160 may be disposed on an entire surface or a partial surface (e.g., a periphery portion or a corner portion) of the second transparent flexible film 150.
  • the transparent adhesive layer 160 is made of an optically transparent adhesive.
  • the transparent adhesive layer 160 may include at least one of an acrylic-based adhesive and a silicone-based adhesive.
  • the transparent adhesive layer 160 may maintain an adhering state with respect to the second transparent flexible film 150 and on the other hand, may be bonded (i.e., removed and attached) with respect to the release film 170 to be described below.
  • a peel strength of the transparent adhesive layer 160 from the second transparent flexible film 150 should be larger than the pee strength of the transparent adhesive layer 160 from the release film 170.
  • the peel strength from the second transparent flexible film 150 may be approximately 16 to 60 times, specifically, approximately 20 to 50 times larger than the peel strength from the release film 170.
  • the peel strength from the second transparent flexible film 150 may become 1000 ⁇ 200 gf/25 mm according to an ASTM D3130 test method.
  • the peel strength from the release film 170 specifically, the PVB film may become approximately 20 to 50 gf/25 mm.
  • the thickness of the transparent adhesive layer 160 is not particularly limited and may be, for example, approximately 20 to 250 mm.
  • the transparent adhesive layer 160 having such a thickness may have light transmittance of approximately 94% or more and a refractive index of approximately 1.4 to 1.5 in a wavelength (a wavelength of 400 to 700 nm) of a visible light region.
  • the transparent adhesive layer 160 may have a haze of 1.0% or less and a yellowness index (YI) of 1.0 or less.
  • YI yellowness index
  • the release film 170 as a portion disposed on one surface of the transparent adhesive layer 160 serves to protect an adhesive force of the transparent adhesive layer 160 before construction.
  • the release film 170 is removed from the transparent adhesive layer 160 during construction.
  • PET polybutylene terephthalate
  • the release film 170 may also include a release agent.
  • the release agent may adopt a general release agent component known in the art.
  • a non-limiting example thereof may include an epoxy-based release agent, a release agent made of a fluorine resin, a silicone-based release agent, an alkyd resin-based release agent, a water-soluble polymer, etc.
  • the non-limiting example may include a powder-type filler, e.g., silicone, silica, etc., if necessary.
  • a fine grain type powder filler two types of powder fillers may be mixedly used and in this case, an average particle size thereof may be appropriately selected by considering formed surface roughness.
  • the thickness of the release film 170 may be appropriately adjusted within a general range known to the art and may be, for example, approximately 50 to 200 mm.
  • a method for forming the release film 170 is not particularly limited and may adopt a known method such as hot pressing, hot roll lamination, extrusion lamination, application and drying of a coating solution, etc.
  • FIG. 2 is a cross-sectional view schematically illustrating a transparent light emitting diode film 100 according to another exemplary embodiment of the present invention.
  • the transparent light emitting diode film 100 of FIG. 2 is to just describe the present invention and the present invention is not limited thereto. Accordingly, the transparent light emitting diode film 100 of FIG. 2 may be modified to various shapes. Reference numerals of duplicated components with FIG. 1 are omitted.
  • the transparent light emitting diode film 100 includes: a first transparent flexible film 110; a transparent electrode layer 120 disposed on one surface of the first transparent flexible film 110 and having at least one pattern; a plurality of light emitting diodes (LEDs) 130 mounted on the transparent electrode layer 120; a protective substrate 140 disposed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 and protecting the light emitting diode 130; a second transparent flexible film 150 disposed on the protective substrate 140; a transparent adhesive layer 160 disposed on the second transparent flexible film 150; and a release film 170 disposed on the transparent adhesive layer 160 and further includes one or a plurality of flexible printed circuit boards (FPCBs) 180 disposed in at least one edge portion of the transparent electrode layer 120.
  • FPCBs flexible printed circuit boards
  • the flexible printed circuit board (FPCB) 180 as a portion disposed on a pad (not illustrated) positioned at the edge portion of the transparent electrode layer 120 electrically connects the transparent electrode layer 120 and an external circuit.
  • the external circuit may be an LED driving unit 190 controlling driving of the LED as illustrated in FIG. 3.
  • a part of the flexible printed circuit board 180 contacts the transparent electrode layer 120 and the remaining part is exposed to the outside to contact the external circuit.
  • the flexible printed circuit board preferably has a strip shape having a predetermined length.
  • a length of the flexible printed circuit board (FPCB) 180 may be approximately 10 to 150 mm and is not limited thereto.
  • each flexible printed circuit board 180 there may one or a plurality of flexible printed circuit boards 180.
  • the width of each flexible printed circuit board 180 it is preferable to adjust the width of each flexible printed circuit board 180 so that a ratio of a total width W of the flexible printed circuit board 180 to the length L of the edge portion of the transparent electrode layer 120 is in the range of approximately 0.1 to 0.5.
  • the total width W of the flexible printed circuit board 180 is acquired by adding widths W1 of n flexible printed circuit boards (n ⁇ W 1 ) and the widths of the respective flexible printed circuit boards 180 may be the same as or different from each other.
  • FIG. 4 briefly illustrates a relationship between the length L of the edge portion and the width W of the flexible printed circuit board 180.
  • the transparent light emitting diode film 100 is constructed in a form in which the release film 170 is removed by the transparent light emitting diode film 100 and the transparent adhesive layer 160 is attached to the attached object.
  • the transparent light emitting diode film 100 of a type attached to the attached object may include: a first transparent flexible film 110; a transparent electrode layer 120 disposed on one surface of the first transparent flexible film 110 and having at least one pattern; a plurality of light emitting diodes (LEDs) 130 mounted on the transparent electrode layer 120; a protective substrate 140 disposed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 and protecting the light emitting diode 130; a second transparent flexible film 150 disposed on the protective substrate 140; a transparent adhesive layer 160 disposed on the second transparent flexible film 150; and a substrate (not illustrated) disposed on the transparent adhesive layer.
  • LEDs light emitting diodes
  • An example of the attached object may include the glass sheet, in particular, a glass sheet used as an exterior material of the building.
  • the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention is excellent in light transmittance, it may allow external light to enter and the view of the user is not blocked and an appearance property is also excellent.

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Abstract

Disclosed is a transparent light emitting diode film according to an exemplary embodiment of the present invention, including: a first transparent flexible film; a transparent electrode layer disposed on one surface of the first transparent flexible film and having at least one pattern; a plurality of light emitting diodes (LEDs) mounted on the transparent electrode layer; a protective substrate disposed on the transparent electrode layer and the plurality of light emitting diodes and protecting the light emitting diode; a second transparent flexible film disposed on the protective substrate; a transparent adhesive layer disposed on the second transparent flexible film; and a release film disposed on the transparent adhesive layer.

Description

TRANSPARENT LIGHT EMITTING DIODE FILM
The present invention relates to a transparent light emitting diode film which is excellent in transparency, flexibility, and processability. Particularly, the present invention relates to a transparent light emitting diode film which is excellent in transparency, flexibility, and processability, which may be simply constructed by a scheme of bonding the transparent light emitting diode film to an attached object.
In general, since a light emitting diode (LED) as a device that transmits light by combining electrons and holes around a p-n junction or in an active layer by flowing current to a compound semiconductor terminal has a long life, high color reproduction rate, and lower power consumption, the LED is widely used for various purposes.
In particular, in recent years, the LED is inserted into a glass window of a building and is used as a lighting means or an advertising means. In this case, the LED is embedded on an electrode layer directly formed on a glass sheet and then is sealed with a sealing member. Accordingly, when some LEDs are broken, the glass window itself should be replaced. Further, a window into which the LED is inserted itself should be separately designed and manufactured according to a design of a window of a building which is installed.
The present invention has been made in an effort to provide a transparent light emitting diode film which is excellent in transparency, flexibility, and processability. Specifically, the present invention has been made in an effort to provide a transparent light emitting diode film which is excellent in transparency, flexibility, and processability, which may be simply constructed by a scheme of bonding the transparent light emitting diode film to an attached object.
An exemplary embodiment of the present invention provides a transparent light emitting diode film including: a first transparent flexible film; a transparent electrode layer disposed on one surface of the first transparent flexible film and having at least one pattern; a plurality of light emitting diodes (LEDs) mounted on the transparent electrode layer; a protective substrate disposed on the transparent electrode layer and the plurality of light emitting diodes and protecting the light emitting diode; a second transparent flexible film disposed on the protective substrate; a transparent adhesive layer disposed on the second transparent flexible film; and a release film disposed on the transparent adhesive layer.
The transparent light emitting diode film may further include one or a plurality of flexible printed circuit boards (FPCBs) disposed on at least one edge portion of the transparent electrode layer.
Each of the first transparent flexible film and the second transparent flexible film may include at least one of polyethylene terephthalate (PET), polycarbonate (PC), and cyclo olefin polymer (COP).
A thickness of the first transparent flexible film may be 200 to 300 mm and a thickness of the second transparent flexible film may be 20 to 300 mm.
The transparent electrode layer may be made of at least one of metallic nano wire, transparent conductive oxide, metal mesh, carbon nano tube, and graphene.
The transparent electrode layer may have a sheet resistance of 0.5 to 3 Ω/sq.
A ratio (W/L) of a total width W of the one or the plurality of flexible printed circuit boards to a length L of the edge portion of the transparent electrode layer may be 0.1 to 0.5.
The protective substrate may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, polyurethane, polycarbonate, polyolefin, polyvinyl chloride, and polyacetal.
A thickness of the protective substrate may be 0.7 to 4 mm.
A peel strength of the transparent adhesive layer from the second transparent flexible film may be larger than a peel strength of the transparent adhesive layer from the release film.
The transparent adhesive layer may include at least one of an acrylic-based adhesive and a silicone-based adhesive.
The transparent light emitting diode film may further include an LED driving unit connected to the other end of the one or the plurality of flexible printed circuit boards and controlling the driving of a plurality of light emitting diodes according to an electrical signal.
Another exemplary embodiment of the present invention provides a laminate including: a first transparent flexible film; a transparent electrode layer disposed on one surface of the first transparent flexible film and having at least one pattern; a plurality of light emitting diodes (LEDs) mounted on the transparent electrode layer; a protective substrate disposed on the transparent electrode layer and the plurality of light emitting diodes and protecting the light emitting diode; a second transparent flexible film disposed on the protective substrate; a transparent adhesive layer disposed on the second transparent flexible film; and a substrate disposed on the transparent adhesive layer.
The transparent light emitting diode film according to an exemplary embodiment of the present invention can be simply constructed by a scheme in which the release film is removed and then the transparent light emitting diode film is bonded to an attached object.
Further, flexibility is given to the transparent light emitting diode film according to an exemplary embodiment of the present invention, which can be constructed in a case where the attached object is a plane and on various surfaces including a curved surface, etc.
Further, according to an exemplary embodiment of the present invention, a transparent light emitting diode film has a protective substrate configured therein to protect a light emitting diode LED from external shock or humidity.
In addition, according to an exemplary embodiment of the present invention, a transparent light emitting diode film has a protective substrate configured therein to further enhance a UV blocking effect and flexibility.
FIG. 1 is a cross-sectional view schematically illustrating a transparent light emitting diode film according to an exemplary embodiment of the present invention.
FIG. 2 is a cross-sectional view schematically illustrating a transparent light emitting diode film according to another exemplary embodiment of the present invention.
FIG. 3 is a cross-sectional view schematically illustrating a transparent light emitting diode film according to yet another exemplary embodiment of the present invention.
FIG. 4 is a plan view schematically illustrating a transparent light emitting diode film according to an exemplary embodiment of the present invention.
Terms including first, second, and third are used for describing various arts, components, regions, layers, and/or sections, but are not limited thereto. The terms are only used to distinguish any part, component, region, layer, or section from the other part, component, region, layer, or section. Accordingly, the first part, component, region, layer, or section described below may be mentioned as the second part, component, region, layer, or section within the range without departing from the range of the present invention.
Special terms used herein are for the purpose of describing specific exemplary embodiments only and are not intended to limit the present invention. The singular forms used herein include plural forms as well, if the phrases do not clearly have the opposite meaning. The term "including" used in the specification means that a specific feature, region, integer, step, operation, element and/or component is embodied and existence or addition of other specific features, regions, integers, steps, operations, elements, and/or components is not excluded.
When any part is referred to as being "on", "over" the other part, which might be directly on or over the other parts or the other part may be involved therebetween. On the contrary, when any part is mentioned as being "directly on" the other parts, the other part is not interposed therebetween.
Unless defined otherwise, all terms including technical and scientific terms used herein have a meaning which is the same as a meaning commonly understood by those skilled in the art to which the present invention belongs. Commonly used predefined terms are further interpreted as having a meaning consistent with the relevant technical literature and the present disclosure, and are not to be construed as ideal or very formal meanings unless defined otherwise.
Hereinafter, exemplary embodiments of the present invention will be described in detail so as to be easily executed by those skilled in the art
As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.
The present inventors have tried to manufacture a transparent light emitting diode film by using a transparent substrate film instead of a glass sheet. However, when the transparent light emitting diode film is configured between a light emitting diode and a release film without a separate protective substrate, the light emitting diode is exposed to shock from the outside or humidity, and as a result, durability is degraded.
Therefore, in an exemplary embodiment of the present invention, the protective substrate is disposed between the light emitting diode and the release film to protect the light emitting diode from the shock from the outside or the humidity, thereby enhancing the durability. Furthermore, the protective substrate is disposed to further enhance the UV blocking effect and the flexibility.
FIG. 1 is a cross-sectional view schematically illustrating a transparent light emitting diode film 100 according to an exemplary embodiment of the present invention. The transparent light emitting diode film 100 of FIG. 1 is to just describe the present invention and the present invention is not limited thereto. Accordingly, the transparent light emitting diode film 100 of FIG. 1 may be modified to various shapes.
As illustrated in FIG. 1, the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention includes: a first transparent flexible film 110; a transparent electrode layer 120 disposed on one surface of the first transparent flexible film 110 and having at least one pattern; a plurality of light emitting diodes (LEDs) 130 mounted on the transparent electrode layer 120; a protective substrate 140 disposed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 and protecting the light emitting diode 130; a second transparent flexible film 150 disposed on the protective substrate 140; a transparent adhesive layer 160 disposed on the second transparent flexible film 150; and a release film 170 disposed on the transparent adhesive layer 160.
Hereinafter, the transparent light emitting diode film will be described in detail for each component.
The first transparent flexible film 110 serves to support other components of the transparent light emitting diode film 100. The first transparent flexible film 110 may be one layer or a plurality of layers.
The first transparent flexible film 110 may be a light transmissive polymer film. The light transmissive polymer film may have an insulating property and heat resistance in order to prevent a state change by external light while preventing power from being leaked to the outside.
Specifically, as the first transparent flexible film 110, at least one of polyethylene terephthalate (PET), polycarbonate (PC), and cyclo olefin polymer (COP) may be included. When the aforementioned material is used as the first transparent flexible film 110, the heat resistance is excellent and the durability of the transparent light emitting diode film 100 is enhanced.
A thickness of the first transparent flexible film 110 is not particularly limited. However, when the thickness of the first transparent flexible film 110 is too small, the first transparent flexible film 110 may be deformed or a crack may occur at a portion of the transparent electrode layer 120 due to a pressure applied to an LED side at the time of manufacturing the transparent light emitting diode film 100. On the contrary, when the thickness of the first transparent flexible film 110 is too large, the crack may occur in an attached object by stress in a case where the transparent light emitting diode film 100 is attached to the attached object (e.g., glass sheet). According to one example, the thickness of the first transparent flexible film 110 may be in the range of 200 to 300 mm. In this case, since the aforementioned problem does not occur and the heat resistance is also excellent, even though the transparent light emitting diode film 100 is exposed to external light (e.g., sunlight) for a long time, the first transparent flexible film 110 is not easily deformed by heat, thereby further enhancing the durability of the transparent light emitting diode film 100.
In the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention, the transparent electrode layer 120 as a portion disposed on one surface of the first transparent flexible film 110 serves to drive a light emitting diode (LED) 130.
Further, since the transparent electrode layer 120 is excellent in light transmissivity, it may allow the external light to enter and a portion where the transparent electrode layer 120 is formed does not block a view of a user and further, an appearance property is also excellent.
The transparent electrode layer 120 may include a circuit pattern made of at least one of metallic nano wire, transparent conductive oxide, metal mesh, carbon nano tube, and graphene.
Here, a non-limiting example of the metal nano wire may include Ag nano wire, copper nano wire, nickel nano wire, and the like, which may be singly used or two or more types thereof may be mixedly used. A non-limiting example of the transparent conductive oxide may include Indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), indium oxide (In2O3), and the like, which may be singly used or two or more types thereof may be mixedly used. A non-limiting example of the metal mesh may include silver (Ag) mesh, copper (Cu) mesh, aluminum (Al) mesh, and the like, which may be singly used or two or more types thereof may be mixedly used. Among them, the silver nano wire, the copper mesh, and the silver mesh are excellent in conductivity and light transmittance and ITO and IZO has a low specific resistance value, may be deposited at a low temperature, and is high in transmittance of visible light.
According to one example, the transparent electrode layer 120 may include a circuit pattern made of an electrode material selected from a group consisting of the Ag nano wire, the copper mesh, and the silver mesh. In this case, a line width and a thickness of the circuit pattern are not particularly limited. However, when the circuit pattern has a width of approximately 5 to 15 mm and a thickness of approximately 0.2 to 1 mm, the transparent electrode layer 120 has a sheet resistance of approximately 0.5 to 3 Ω/sq.
The transparent electrode layer 120 may be formed through a method known to the art. For example, in the transparent electrode layer 120, the electrode material is coated on the first transparent flexible film 110 and then a laser is irradiated onto the electrode material or mask and an etching process is performed to form at least circuit pattern. Alternatively, the circuit pattern made of the electrode material may be formed on the first transparent flexible film 110 through an inkjet printing process. However, the present invention is not limited thereto.
In the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention, the light emitting diode (LED) 130 is a light emitting body which is mounted on the transparent electrode layer 120 and flickers according to supply of power. Since a plurality of light emitting diodes 130 are spaced apart from each other and arranged in a matrix form, various forms of characters or images may be displayed and a video may also be displayed.
The light emitting diode 130 available in an exemplary embodiment of the present invention may be used without a particular limit if being generally known to the art. Therefore, the light emitting diode 130 may be a single-color light emitting diode 130 having a color such as red (R), green (G), blue (B), etc., or two-color light emitting diodes 130 having colors such as R and G, or three-color light emitting diodes 130 having colors such as R, G, and B. When the respective light emitting diodes 130 are the three-color light emitting diodes 130 of R, G, and B, characters or images having various colors may be displayed.
The light emitting diode 130 may be fixed onto the transparent electrode layer 120 through a mounting method known to the art. For example, a pad (not illustrated) including a material having high electrical conductivity such as silver (Ag) may be formed in at least a part of the transparent electrode layer 120. In this case, the light emitting diode 130 may be fixed onto the pad by using a low-temperature surface mount technology (SMT) process. At this time, the light emitting diode 130 may be attached to the pad through a soldering.
In the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention, the protective substrate 140 is disposed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 to serve to protect the light emitting diode 130.
In an exemplary embodiment of the present invention, the protective substrate is disposed between the light emitting diode 130 and a release film 170 to protect the light emitting diode 130 from shock from the outside or humidity, thereby enhancing the durability. Furthermore, the protective substrate 140 is disposed to further enhance a UV blocking effect and flexibility.
The protective substrate 140 may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, polyurethane, polycarbonate, polyolefin, polyvinyl chloride, and polyacetal.
The thickness of the protective substrate 140 may be 0.7 to 4 mm. When the thickness of the protective substrate 140 is too small, protection of a targeted light emitting diode 130 may be insufficient. When the protective substrate 140 is too thick, it is not advantageous in terms of protection of the light emitting diode 130 and flexibility may still deteriorate and peeling may occur.
The protective substrate 140 may be formed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 through the method known to the art. As one example, the protective substrate 140 may be formed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 through a lamination process of 105 to 135°C.
In the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention, the second transparent flexible film 150 as a portion disposed on one surface of the protective substrate 140 serves to support other components of the transparent light emitting diode film 100.
In addition to the first transparent flexible film 110, the second transparent flexible film 150 is further configured to further firmly support the transparent light emitting diode film 100. Further, the second transparent flexible film 150 is configured together with the protective substrate 140 to more thoroughly protect the light emitting diode 130.
The second transparent flexible film 150 may be the light transmissive polymer film. The light transmissive polymer film may have an insulating property and heat resistance in order to prevent a state change by external light while preventing power from being leaked to the outside.
Specifically, as the second transparent flexible film 150, at least one of polyethylene terephthalate (PET), polycarbonate (PC), and cyclo olefin polymer (COP) may be included. When the aforementioned material is used as the second transparent flexible film 150, the heat resistance is excellent and the durability of the transparent light emitting diode film 100 is enhanced.
The thickness of the second transparent flexible film 150 is not particularly limited. However, when the thickness of the second transparent flexible film 150 is too small, the second transparent flexible film 150 may be deformed or the crack may occur at a portion of the transparent electrode layer 120 due to a pressure applied to the LED side at the time of manufacturing the transparent light emitting diode film 100. On the contrary, when the thickness of the second transparent flexible film 150 is too large, the crack may occur in the attached object by stress in the case where the transparent light emitting diode film 100 is attached to the attached object (e.g., glass sheet). According to one example, the thickness of the second transparent flexible film 150 may be in the range of 20 to 300 mm. In this case, since the aforementioned problem does not occur and the heat resistance is also excellent, even though the transparent light emitting diode film 100 is exposed to the external light (e.g., sunlight) for a long time, the second transparent flexible film 150 is not easily deformed by heat, thereby further enhancing the durability of the transparent light emitting diode film 100.
In the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention, the transparent adhesive layer 160 as a portion disposed on one surface of the second transparent flexible film 150 serves to bond the transparent light emitting diode film 100 to the attached object. In this case, the transparent adhesive layer 160 may be disposed on an entire surface or a partial surface (e.g., a periphery portion or a corner portion) of the second transparent flexible film 150.
The transparent adhesive layer 160 is made of an optically transparent adhesive. For example, the transparent adhesive layer 160 may include at least one of an acrylic-based adhesive and a silicone-based adhesive. The transparent adhesive layer 160 may maintain an adhering state with respect to the second transparent flexible film 150 and on the other hand, may be bonded (i.e., removed and attached) with respect to the release film 170 to be described below. That is, when the transparent light emitting diode film 100 is attached to the attached object, the transparent light emitting diode film 100 is constructed in a scheme in which the release film 170 is removed and the transparent light emitting diode film 100 is attached to the attached object and in this case, in order to smoothly remove the release film 170, a peel strength of the transparent adhesive layer 160 from the second transparent flexible film 150 should be larger than the pee strength of the transparent adhesive layer 160 from the release film 170. For example, in the transparent adhesive layer 160, the peel strength from the second transparent flexible film 150 may be approximately 16 to 60 times, specifically, approximately 20 to 50 times larger than the peel strength from the release film 170. According to one example, in the transparent adhesive layer 160, the peel strength from the second transparent flexible film 150, specifically, the PET film may become 1000 ± 200 gf/25 mm according to an ASTM D3130 test method. Further, in the transparent adhesive layer 160, the peel strength from the release film 170, specifically, the PVB film may become approximately 20 to 50 gf/25 mm.
The thickness of the transparent adhesive layer 160 is not particularly limited and may be, for example, approximately 20 to 250 mm. The transparent adhesive layer 160 having such a thickness may have light transmittance of approximately 94% or more and a refractive index of approximately 1.4 to 1.5 in a wavelength (a wavelength of 400 to 700 nm) of a visible light region. Further, the transparent adhesive layer 160 may have a haze of 1.0% or less and a yellowness index (YI) of 1.0 or less. As a result, in the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention, the view of the user may not be blocked by the transparent adhesive layer 160 and the external light may be easily incident.
In the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention, the release film 170 as a portion disposed on one surface of the transparent adhesive layer 160 serves to protect an adhesive force of the transparent adhesive layer 160 before construction. The release film 170 is removed from the transparent adhesive layer 160 during construction.
As the release film 170, a general release film 170 used in the art may be used. Specifically, the release film 170 may include a polyester film such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc., a polyethylene film, a polypropylene film, cellophane, a diacetyl cellulose film, a triacetyl cellulose film, an acetyl cellulose butyrate film, a polyvinyl chloride film, a polyvinylidene chloride film, a polyvinyl alcohol film, an ethylene-vinyl acetate copolymer film, a polystyrene film, a polycarbonate film, a polymethylpentene film, a polysulfone film, a polyether ether ketone film, a poly ether sulfone film, a poly ether imide film, a polyimide film, a fluorine resin film, a polyamide film, an acrylic resin film, a norbornene-based resin film, a cycloolefin resin film, etc. The release film 170 may be transparent or semi-transparent, colored or non-colored. According to one example, the release film 170 is polyethylene terephthalate (PET).
The release film 170 may also include a release agent. The release agent may adopt a general release agent component known in the art. A non-limiting example thereof may include an epoxy-based release agent, a release agent made of a fluorine resin, a silicone-based release agent, an alkyd resin-based release agent, a water-soluble polymer, etc. Further, the non-limiting example may include a powder-type filler, e.g., silicone, silica, etc., if necessary. In this case, as a fine grain type powder filler, two types of powder fillers may be mixedly used and in this case, an average particle size thereof may be appropriately selected by considering formed surface roughness.
The thickness of the release film 170 may be appropriately adjusted within a general range known to the art and may be, for example, approximately 50 to 200 mm.
A method for forming the release film 170 is not particularly limited and may adopt a known method such as hot pressing, hot roll lamination, extrusion lamination, application and drying of a coating solution, etc.
FIG. 2 is a cross-sectional view schematically illustrating a transparent light emitting diode film 100 according to another exemplary embodiment of the present invention. The transparent light emitting diode film 100 of FIG. 2 is to just describe the present invention and the present invention is not limited thereto. Accordingly, the transparent light emitting diode film 100 of FIG. 2 may be modified to various shapes. Reference numerals of duplicated components with FIG. 1 are omitted.
As illustrated in FIG. 2, the transparent light emitting diode film 100 according to another exemplary embodiment of the present invention includes: a first transparent flexible film 110; a transparent electrode layer 120 disposed on one surface of the first transparent flexible film 110 and having at least one pattern; a plurality of light emitting diodes (LEDs) 130 mounted on the transparent electrode layer 120; a protective substrate 140 disposed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 and protecting the light emitting diode 130; a second transparent flexible film 150 disposed on the protective substrate 140; a transparent adhesive layer 160 disposed on the second transparent flexible film 150; and a release film 170 disposed on the transparent adhesive layer 160 and further includes one or a plurality of flexible printed circuit boards (FPCBs) 180 disposed in at least one edge portion of the transparent electrode layer 120.
In the transparent light emitting diode film 100 according to another exemplary embodiment of the present invention, the flexible printed circuit board (FPCB) 180 as a portion disposed on a pad (not illustrated) positioned at the edge portion of the transparent electrode layer 120 electrically connects the transparent electrode layer 120 and an external circuit. Here, the external circuit may be an LED driving unit 190 controlling driving of the LED as illustrated in FIG. 3. Accordingly, a part of the flexible printed circuit board 180 contacts the transparent electrode layer 120 and the remaining part is exposed to the outside to contact the external circuit. As a result, the flexible printed circuit board preferably has a strip shape having a predetermined length. In this case, a length of the flexible printed circuit board (FPCB) 180 may be approximately 10 to 150 mm and is not limited thereto.
There may one or a plurality of flexible printed circuit boards 180. However, when the flexible printed circuit board 180 is disposed at many portions of the edge portion of the transparent electrode layer 120, bonding reliability of the transparent light emitting diode film 100 may be degraded. Accordingly, it is preferable to adjust the width of each flexible printed circuit board 180 so that a ratio of a total width W of the flexible printed circuit board 180 to the length L of the edge portion of the transparent electrode layer 120 is in the range of approximately 0.1 to 0.5. Here, the total width W of the flexible printed circuit board 180 is acquired by adding widths W1 of n flexible printed circuit boards (n Х W1) and the widths of the respective flexible printed circuit boards 180 may be the same as or different from each other. FIG. 4 briefly illustrates a relationship between the length L of the edge portion and the width W of the flexible printed circuit board 180.
As described above, the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention is constructed in a form in which the release film 170 is removed by the transparent light emitting diode film 100 and the transparent adhesive layer 160 is attached to the attached object. That is, the transparent light emitting diode film 100 of a type attached to the attached object (substrate) may include: a first transparent flexible film 110; a transparent electrode layer 120 disposed on one surface of the first transparent flexible film 110 and having at least one pattern; a plurality of light emitting diodes (LEDs) 130 mounted on the transparent electrode layer 120; a protective substrate 140 disposed on the transparent electrode layer 120 and the plurality of light emitting diodes 130 and protecting the light emitting diode 130; a second transparent flexible film 150 disposed on the protective substrate 140; a transparent adhesive layer 160 disposed on the second transparent flexible film 150; and a substrate (not illustrated) disposed on the transparent adhesive layer.
An example of the attached object may include the glass sheet, in particular, a glass sheet used as an exterior material of the building. As described above, since the transparent light emitting diode film 100 according to an exemplary embodiment of the present invention is excellent in light transmittance, it may allow external light to enter and the view of the user is not blocked and an appearance property is also excellent.
The present invention is not limited to the exemplary embodiments, but may be manufactured in various different forms and it can be understood by those skilled in the art that the present invention can be executed in other detailed forms without changing the technical spirit or requisite features of the present invention. Therefore, it should be appreciated that the aforementioned embodiments are illustrative in all aspects and are not restricted.
<Description of symbols>
100: Transparent light emitting diode film,
110: First transparent flexible film,
120: Transparent electrode layer,
130: Light emitting diode,
140: Protective substrate,
150: Second transparent flexible film,
160: Transparent adhesive layer,
170: Release film,
180: Flexible printed circuit board,
190: LED driving unit

Claims (13)

  1. A transparent light emitting diode film comprising:
    a first transparent flexible film;
    a transparent electrode layer disposed on one surface of the first transparent flexible film and having at least one pattern;
    a plurality of light emitting diodes (LEDs) mounted on the transparent electrode layer;
    a protective substrate disposed on the transparent electrode layer and the plurality of light emitting diodes and protecting the light emitting diodes;
    a second transparent flexible film disposed on the protective substrate;
    a transparent adhesive layer disposed on the second transparent flexible film; and
    a release film disposed on the transparent adhesive layer.
  2. The transparent light emitting diode film of claim 1, further comprising:
    one or a plurality of flexible printed circuit boards (FPCBs) disposed on at least one edge portion of the transparent electrode layer.
  3. The transparent light emitting diode film of claim 1, wherein:
    each of the first transparent flexible film and the second transparent flexible film includes at least one of polyethylene terephthalate (PET), polycarbonate (PC), and cyclo olefin polymer (COP).
  4. The transparent light emitting diode film of claim 1, wherein:
    a thickness of the first transparent flexible film is 200 to 300 mm and a thickness of the second transparent flexible film is 20 to 300 mm.
  5. The transparent light emitting diode film of claim 1, wherein:
    the transparent electrode layer includes a circuit pattern made of at least one of metallic nano wire, transparent conductive oxide, metal mesh, carbon nano tube, and graphene.
  6. The transparent light emitting diode film of claim 1, wherein:
    the transparent electrode layer has a sheet resistance of 0.5 to 3 Ω/sq.
  7. The transparent light emitting diode film of claim 2, wherein:
    a ratio (W/L) of a total width W of the one or the plurality of flexible printed circuit boards to a length L of the edge portion of the transparent electrode layer is 0.1 to 0.5.
  8. The transparent light emitting diode film of claim 1, wherein:
    the protective substrate includes at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, polyurethane, polycarbonate, polyolefin, polyvinyl chloride, and polyacetal.
  9. The transparent light emitting diode film of claim 1, wherein:
    a thickness of the protective substrate is 0.7 to 4 mm.
  10. The transparent light emitting diode film of claim 1, wherein:
    a peel strength of the transparent adhesive layer from the second transparent flexible film is larger than a peel strength of the transparent adhesive layer from the release film.
  11. The transparent light emitting diode film of claim 1, wherein:
    the transparent adhesive layer includes at least one of an acrylic-based adhesive and a silicone-based adhesive.
  12. The transparent light emitting diode film of claim 2, further comprising:
    an LED driving unit connected to the other end of the one or the plurality of flexible printed circuit boards and controlling the driving of a plurality of light emitting diodes according to an electrical signal.
  13. A laminate comprising:
    a first transparent flexible film;
    a transparent electrode layer disposed on one surface of the first transparent flexible film and having at least one pattern;
    a plurality of light emitting diodes (LEDs) mounted on the transparent electrode layer;
    a protective substrate disposed on the transparent electrode layer and the plurality of light emitting diodes and protecting the light emitting diodes;
    a second transparent flexible film disposed on the protective substrate;
    a transparent adhesive layer disposed on the second transparent flexible film; and
    a substrate disposed on the transparent adhesive layer.
PCT/KR2019/013537 2018-10-23 2019-10-15 Transparent light emitting diode film WO2020085708A1 (en)

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KR1020180127022A KR20200045912A (en) 2018-10-23 2018-10-23 Transparent light emitting diode film

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