WO2020078116A1 - Alloy resistor and manufacturing method therefor - Google Patents

Alloy resistor and manufacturing method therefor Download PDF

Info

Publication number
WO2020078116A1
WO2020078116A1 PCT/CN2019/103469 CN2019103469W WO2020078116A1 WO 2020078116 A1 WO2020078116 A1 WO 2020078116A1 CN 2019103469 W CN2019103469 W CN 2019103469W WO 2020078116 A1 WO2020078116 A1 WO 2020078116A1
Authority
WO
WIPO (PCT)
Prior art keywords
alloy
resistance
resistor
resistance element
strip
Prior art date
Application number
PCT/CN2019/103469
Other languages
French (fr)
Chinese (zh)
Inventor
南式荣
杨漫雪
Original Assignee
南京萨特科技发展有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南京萨特科技发展有限公司 filed Critical 南京萨特科技发展有限公司
Publication of WO2020078116A1 publication Critical patent/WO2020078116A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals

Definitions

  • This application relates to the field of electronic components, especially resistors.
  • Patent CN101118794B proposes to stamp the resistance alloy tape into a single-sided broken strip as required, form a conductive layer by barrel plating or electroplating, and then form a protective layer by printing, etc., and finally manufacture an alloy resistor.
  • the conductive layer of the electrode of the resistor is copper layer, nickel layer and tin layer in order from the inside to the outside.
  • the copper plating layer must be controlled to a certain thickness, resulting in the production cycle of the product The longer the production difficulty, the higher the production cost of the product.
  • the electroplating waste liquid has pollution to the environment, the treatment of the waste liquid also increases the cost of the enterprise.
  • the present invention provides an alloy resistor whose structure does not require barrel-plated copper layers or electroplating to form electrodes.
  • the present invention also provides a method for manufacturing the alloy resistor.
  • the alloy resistor of the present invention can adopt the following technical solution:
  • An alloy resistor includes a strip-shaped resistance element, electrodes connected and fixed at both ends of the resistance element, the electrode includes a side wall covering the end surface of the resistance element, a top wall extending inward from the upper end of the side wall, and a side wall A bottom wall extending inwardly from a lower end, the top wall covers the upper surface of the resistance element, and the bottom wall covers the lower surface of the resistance element; the side wall, top wall, and bottom wall form a U shape.
  • the alloy resistor adopts U-shaped electrodes to be assembled on both ends of the resistance element through tight fitting, and does not need to form electrodes by barrel plating or electroplating.
  • the electrode is made of pure copper material.
  • the upper surface and the lower surface of the resistance element are covered with a protective layer, and the protective layer is paint or functional epoxy resin.
  • a manufacturing method for manufacturing the above alloy resistor includes the following steps:
  • step b Divide the strip in step b into single resistors by stamping or cutting;
  • the resistance value of a single resistor is trimmed by laser or mechanical means to reach the required resistance range
  • the U-shaped metal material and the alloy material are assembled and welded to form the electrode, which has high controllability and good product stability;
  • the production process of the product can be simplified, the production efficiency can be improved, and the product cost can be reduced.
  • this method does not produce electroplating pollution.
  • the resistance alloy material used may be an alloy of manganese copper tin, iron chromium aluminum or nickel chromium aluminum silicon.
  • a single resistor is coated with a thin film of anti-oxidation material.
  • FIG. 3 is an embodiment of a method for manufacturing a high-power precision resistor.
  • the alloy resistor 10 includes a strip-shaped resistance element 12 and electrodes 11 connected and fixed at both ends of the resistance element.
  • the electrode 11 includes a side wall 111 covering the end surface of the resistance element 12, a top wall 112 extending inwardly from the upper end of the side wall 111, and a bottom wall 113 extending inwardly from the lower end of the side wall 112, the top wall 112 covering the resistance On the upper surface of the element, the bottom wall 113 covers the lower surface of the resistance element; the side walls, top wall, and bottom wall form a U shape.
  • the electrode 11 is made of pure copper material.
  • the upper surface and the lower surface of the resistance element 12 are covered with a protective layer, and the protective layer is paint or functional epoxy resin.
  • the second embodiment is an embodiment of the manufacturing method of the alloy resistor in the first embodiment.
  • the manufacturing method includes the following steps:
  • the electrode material used may be pure copper.
  • the alloy material is stamped into strips 12 of the required size.
  • the resistance alloy material used can be alloys such as manganese copper tin, iron chromium aluminum or nickel chromium aluminum silicon, as shown in Figure 3 (a);
  • the resistor 10 includes a strip-shaped resistance element 12, a U-shaped electrode 11, and a protective layer 13 applied to the upper and lower surfaces of the resistance element 12.
  • the resistance element 12 may be an alloy material with low resistance temperature coefficient such as copper manganese tin, nickel chromium aluminum silicon or iron chromium aluminum, and the surface of the material is roughened (not shown) to increase its contact with the electrode 11 and the protective layer 13 Adhesion.
  • the electrode 11 may be a pure copper material with a low resistivity, and the surface of the electrode 11 is roughened (not shown) to increase its adhesion to the resistance element 12.
  • the method of connecting the resistance element 12 and the electrode 11 may be welding or other assembly methods.
  • the material of the protective layer may be paint or functional epoxy resin, and the application method of the protective layer may be printing, spraying and other protective layer molding methods.
  • the surface of the resistor 10 may be coated with a thin film of anti-oxidation material (not shown) to ensure that the resistor is protected from oxidation during preparation, storage and processing.
  • the anti-oxidation thin film material may be rosin, active resin, azole, etc.
  • the anti-oxidation thin film material is applied to the surface of the electrode.
  • the anti-oxidation thin film material can be applied by spraying, dipping or other common methods of similar thin film materials.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

Disclosed are an alloy resistor (10) and a manufacturing method therefor. The alloy resistor (10) comprises a strip-shaped resistor element (12), and electrodes (11) connected and fixed at both ends of the resistor element (12), wherein each of the electrodes (11) comprises a side wall (111) covering an end face of the resistor element (12), a top wall (112) extending inwards from an upper end of the side wall (111), and a bottom wall (113) extending inwards from a lower end of the side wall (111); and the side wall (111), the top wall (112) and the bottom wall (113) form a U shape. A U-shaped metallic material and an alloy material are used to form the electrodes (11) by means of assembling and welding, thus achieving high controllability and good product stability; the forming mode of the electrodes (11) by assembling and welding is simple, can simplify the production process of the product, improve the production efficiency and reduce the product cost; and no electroplating pollution is produced.

Description

一种合金电阻器及其制造方法Alloy resistor and manufacturing method thereof 技术领域Technical field
本申请涉及电子元件领域,尤其是电阻器。This application relates to the field of electronic components, especially resistors.
背景技术Background technique
传统合金精密电阻器两端电极通常是采用滚镀铜层和电镀镍锡层工艺形成。专利CN101118794B提出将电阻合金带冲压成需求的单边断开条状,通过滚镀或电镀方式形成一层导电层,再经过印刷等方式形成保护层,最终制造出合金电阻器。该电阻器的电极导电层由内往外依次为铜层、镍层和锡层,为了保证良好的可焊性和电阻器阻值的稳定性,铜镀层须管控在一定厚度,导致产品的生产周期较长,生产难度高,一定程度上增加了产品的生产成本。另由于电镀废液对环境存在污染,废液的处理也增加了企业的成本。The electrodes on both ends of traditional alloy precision resistors are usually formed by barrel copper plating and nickel-tin plating. Patent CN101118794B proposes to stamp the resistance alloy tape into a single-sided broken strip as required, form a conductive layer by barrel plating or electroplating, and then form a protective layer by printing, etc., and finally manufacture an alloy resistor. The conductive layer of the electrode of the resistor is copper layer, nickel layer and tin layer in order from the inside to the outside. In order to ensure good solderability and stability of the resistance of the resistor, the copper plating layer must be controlled to a certain thickness, resulting in the production cycle of the product The longer the production difficulty, the higher the production cost of the product. In addition, because the electroplating waste liquid has pollution to the environment, the treatment of the waste liquid also increases the cost of the enterprise.
发明内容Summary of the invention
发明目的:针对上述问题,本发明提供一种合金电阻器,该合金电阻器的结构不需要滚镀铜层或电镀的方式形成电极。Object of the Invention: In view of the above problems, the present invention provides an alloy resistor whose structure does not require barrel-plated copper layers or electroplating to form electrodes.
而针对上述问题,本发明同时提供了该合金电阻器的制造方法。In response to the above problems, the present invention also provides a method for manufacturing the alloy resistor.
技术方案:为达到上述目的,本发明合金电阻器可采用如下技术方案:Technical solution: To achieve the above purpose, the alloy resistor of the present invention can adopt the following technical solution:
一种合金电阻器,包括条状的电阻元件,连接并固定在电阻元件两端的电极,所述电极包括覆盖在电阻元件端面的侧壁、自侧壁上端向内延伸的顶壁、自侧壁下端向内延伸的底壁,所述顶壁覆盖于电阻元件的上表面,底壁覆盖于电阻元件的下表面;所述侧壁、顶壁、底壁形成U形。An alloy resistor includes a strip-shaped resistance element, electrodes connected and fixed at both ends of the resistance element, the electrode includes a side wall covering the end surface of the resistance element, a top wall extending inward from the upper end of the side wall, and a side wall A bottom wall extending inwardly from a lower end, the top wall covers the upper surface of the resistance element, and the bottom wall covers the lower surface of the resistance element; the side wall, top wall, and bottom wall form a U shape.
有益效果:该合金电阻器采用U形的电极通过紧配方式组装在电阻元件的两端,不需要通过滚镀铜层或电镀的方式形成电极。Beneficial effect: The alloy resistor adopts U-shaped electrodes to be assembled on both ends of the resistance element through tight fitting, and does not need to form electrodes by barrel plating or electroplating.
进一步的,电极为纯铜材料制成。所述电阻元件的上表面及下表面均覆盖有保护层,该保护层为漆料或功能环氧树脂。Further, the electrode is made of pure copper material. The upper surface and the lower surface of the resistance element are covered with a protective layer, and the protective layer is paint or functional epoxy resin.
而本发明提供的合金电阻器的制造方法可采用以下技术方案:The manufacturing method of the alloy resistor provided by the present invention may adopt the following technical solutions:
一种制造上述合金电阻器的制造方法,包括以下步骤:A manufacturing method for manufacturing the above alloy resistor includes the following steps:
a.将电极材料冲压成U形;将电阻合金材料冲压成要求尺寸的条状;a. Stamp the electrode material into a U shape; stamp the resistance alloy material into a strip of the required size;
b.将两条U形电极材料通过紧配方式组装在电阻合金材料宽度方向上的两端;b. Assemble the two U-shaped electrode materials at the two ends in the width direction of the resistance alloy material by tight fitting;
c.采用焊接的方式将U形电极材料与条状电阻合金材料连接,其中焊接位置在合金材料和电极材料接触的条状区域;c. Welding is used to connect the U-shaped electrode material to the strip resistance alloy material, where the welding position is in the strip area where the alloy material and the electrode material are in contact;
d.通过冲压或切割方式将步骤b中条状带材分割成单颗电阻器;d. Divide the strip in step b into single resistors by stamping or cutting;
e.通过激光或机械方式对单颗电阻器的阻值进行修整,达到要求的阻值范围;e. The resistance value of a single resistor is trimmed by laser or mechanical means to reach the required resistance range;
f.通过喷涂或印刷的方式在电阻元件上下表面施加保护层。f. Apply a protective layer on the upper and lower surfaces of the resistance element by spraying or printing.
有益效果:相对于现有技术,该电阻器的制造方法中,采用U形金属材料与合金材料组装焊接的方式形成电极,可控性高,产品稳定性好;组装焊接的电极成型方式简单,可简化产品的生产流程,提高生产效率,降低产品成本;相对于电镀工艺制备电极,该方法不产生电镀污染。Beneficial effect: Compared with the prior art, in the manufacturing method of the resistor, the U-shaped metal material and the alloy material are assembled and welded to form the electrode, which has high controllability and good product stability; The production process of the product can be simplified, the production efficiency can be improved, and the product cost can be reduced. Compared with the preparation of the electrode by the electroplating process, this method does not produce electroplating pollution.
进一步的,所用电阻合金材料可以使锰铜锡、铁铬铝或镍铬铝硅等合金。单颗电阻器表面涂覆抗氧化材料薄膜。Further, the resistance alloy material used may be an alloy of manganese copper tin, iron chromium aluminum or nickel chromium aluminum silicon. A single resistor is coated with a thin film of anti-oxidation material.
附图说明BRIEF DESCRIPTION
图1为本发明中合金电阻器的侧视图;1 is a side view of the alloy resistor in the present invention;
图2为本发明中合金电阻器的横截面;2 is a cross section of the alloy resistor in the present invention;
图3为制造大功率精密电阻器方法的一个实施例。FIG. 3 is an embodiment of a method for manufacturing a high-power precision resistor.
具体实施方式detailed description
实施例一Example one
本实施例是本发明中合金电阻器的实施例This embodiment is an embodiment of an alloy resistor in the present invention
请结合图1及图2所示。该合金电阻器10包括条状的电阻元件12,连接并固定在电阻元件两端的电极11。所述电极11包括覆盖在电阻元件12端面的侧壁111、自侧壁111上端向内延伸的顶壁112、自侧壁112下端向内延伸的底壁113,所述顶壁112覆盖于电阻元件的上表面,底壁113覆盖于电阻元件的下表面;所述侧壁、顶壁、底壁形成U形。该电极11为纯铜材料制成。所述电阻元件12的上表面及下表面均覆盖有保护层,该保护层为漆料或功能环氧树脂。Please refer to Figure 1 and Figure 2. The alloy resistor 10 includes a strip-shaped resistance element 12 and electrodes 11 connected and fixed at both ends of the resistance element. The electrode 11 includes a side wall 111 covering the end surface of the resistance element 12, a top wall 112 extending inwardly from the upper end of the side wall 111, and a bottom wall 113 extending inwardly from the lower end of the side wall 112, the top wall 112 covering the resistance On the upper surface of the element, the bottom wall 113 covers the lower surface of the resistance element; the side walls, top wall, and bottom wall form a U shape. The electrode 11 is made of pure copper material. The upper surface and the lower surface of the resistance element 12 are covered with a protective layer, and the protective layer is paint or functional epoxy resin.
实施例二Example 2
本实施例二为实施例一中合金电阻器的制造方法的实施例。The second embodiment is an embodiment of the manufacturing method of the alloy resistor in the first embodiment.
请结合图3所示,该制作方法包括如下步骤:Please refer to FIG. 3, the manufacturing method includes the following steps:
a.将电极材料冲压成要求尺寸的U形条状11,所用电极材料可以是纯铜。将合金材料冲压成要求尺寸的条状12,所用电阻合金材料可以使锰铜锡、铁铬铝或镍铬铝硅等合金,如图3(a)所示;a. Press the electrode material into a U-shaped strip 11 of the required size. The electrode material used may be pure copper. The alloy material is stamped into strips 12 of the required size. The resistance alloy material used can be alloys such as manganese copper tin, iron chromium aluminum or nickel chromium aluminum silicon, as shown in Figure 3 (a);
b.将两条U形电极材料11通过紧配方式组装在电阻合金材料12宽度方向上的两端,如图3(b)所示;b. Assemble the two U-shaped electrode materials 11 at both ends in the width direction of the resistance alloy material 12 by tight fitting, as shown in FIG. 3 (b);
c.采用焊接的方式将U形电极材料11与条状电阻合金材料12连接,其中焊接位置在合金材料和电极材料接触的条状区域,如图3(c)所示;c. Welding is used to connect the U-shaped electrode material 11 to the strip-shaped resistance alloy material 12, where the welding position is in the strip-shaped area where the alloy material and the electrode material are in contact, as shown in FIG. 3 (c);
d.通过冲压或切割方式将i中条状带材分割成需求尺寸的单颗电阻器,如图3(d)所示;d. Divide the strip in i into individual resistors of required size by stamping or cutting, as shown in Figure 3 (d);
e.通过激光或机械方式对j中单颗电阻器的阻值进行修整,达到要求的阻值范围,如图3(e)所示;e. Modify the resistance of single resistor in j by laser or mechanical method to achieve the required resistance range, as shown in Figure 3 (e);
f.通过喷涂或印刷的方式在电阻合金上下表面施加保护层,如图3(f)所示。f. Apply a protective layer on the upper and lower surfaces of the resistance alloy by spraying or printing, as shown in Figure 3 (f).
如图2所示,电阻器10包括条状电阻元件12、U状电极11以及施加于电阻元件12上下表面的保护层13。电阻元件12可以是铜锰锡、镍铬铝硅或铁铬铝等低电阻温度系数的合金材料,且材料表面经过粗化处理(未示出),以增加其与电极11和保护层13的附着力。电极11可以是电阻率较低的纯铜材料,电极11表面经过粗化(未示出),以增加其与电阻元件12的附着力。连接电阻元件12和电极11的方式可以是焊接或其他组装方式。保护层的材质可以为漆料或功能环氧树脂,保护层的施加方式可以是印刷、喷涂等保护层成型方式。As shown in FIG. 2, the resistor 10 includes a strip-shaped resistance element 12, a U-shaped electrode 11, and a protective layer 13 applied to the upper and lower surfaces of the resistance element 12. The resistance element 12 may be an alloy material with low resistance temperature coefficient such as copper manganese tin, nickel chromium aluminum silicon or iron chromium aluminum, and the surface of the material is roughened (not shown) to increase its contact with the electrode 11 and the protective layer 13 Adhesion. The electrode 11 may be a pure copper material with a low resistivity, and the surface of the electrode 11 is roughened (not shown) to increase its adhesion to the resistance element 12. The method of connecting the resistance element 12 and the electrode 11 may be welding or other assembly methods. The material of the protective layer may be paint or functional epoxy resin, and the application method of the protective layer may be printing, spraying and other protective layer molding methods.
电阻器10表面可以涂覆有抗氧化材料薄膜(未示出),以保证在制备、保存及加工过程中保护所述电阻器不被氧化。所述抗氧化薄膜材料可以为松香类,活性树脂类和唑类等。所述抗氧化薄膜材料施加于电极的表面。所述抗氧化薄膜材料可以通过喷涂、浸泡或者其他类似薄膜材料通用的方法来施加。The surface of the resistor 10 may be coated with a thin film of anti-oxidation material (not shown) to ensure that the resistor is protected from oxidation during preparation, storage and processing. The anti-oxidation thin film material may be rosin, active resin, azole, etc. The anti-oxidation thin film material is applied to the surface of the electrode. The anti-oxidation thin film material can be applied by spraying, dipping or other common methods of similar thin film materials.
本发明具体实现该技术方案的方法和途径很多,以上所述仅是本发明的优选实施方式。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进,这些改进也应视为本发明的保护范围。本实施例中未明确的各组成部分均可用现有技术加以实现。There are many methods and ways for the present invention to specifically implement the technical solution, and the above are only preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principles of the present invention, several improvements can be made, and these improvements should also be regarded as the scope of protection of the present invention. The components that are not clear in this embodiment can be implemented with the existing technology.

Claims (6)

  1. 一种合金电阻器,包括条状的电阻元件,连接并固定在电阻元件两端的电极,其特征在于:所述电极包括覆盖在电阻元件端面的侧壁、自侧壁上端向内延伸的顶壁、自侧壁下端向内延伸的底壁,所述顶壁覆盖于电阻元件的上表面,底壁覆盖于电阻元件的下表面;所述侧壁、顶壁、底壁形成U形。An alloy resistor includes a strip-shaped resistance element and electrodes connected and fixed at both ends of the resistance element, characterized in that the electrode includes a side wall covering the end surface of the resistance element and a top wall extending inward from the upper end of the side wall 1. A bottom wall extending inward from the lower end of the side wall, the top wall covers the upper surface of the resistance element, and the bottom wall covers the lower surface of the resistance element; the side wall, top wall, and bottom wall form a U shape.
  2. 根据权利要求1所述的合金电阻器,其特征在于:电极为纯铜材料制成。The alloy resistor according to claim 1, wherein the electrode is made of pure copper material.
  3. 根据权利要求2所述合金电阻器,其特征在于:所述电阻元件的上表面及下表面均覆盖有保护层,该保护层为漆料或功能环氧树脂。The alloy resistor according to claim 2, wherein the upper surface and the lower surface of the resistance element are covered with a protective layer, and the protective layer is paint or functional epoxy resin.
  4. 一种制造如权利要求1至3中任一项合金电阻器的制造方法,其特征在于,包括以下步骤:A method for manufacturing an alloy resistor according to any one of claims 1 to 3, characterized in that it includes the following steps:
    a.将电极材料冲压成U形;将电阻合金材料冲压成要求尺寸的条状;a. Stamp the electrode material into a U shape; stamp the resistance alloy material into a strip of the required size;
    b.将两条U形电极材料通过紧配方式组装在电阻合金材料宽度方向上的两端;b. Assemble the two U-shaped electrode materials at the two ends in the width direction of the resistance alloy material by tight fitting;
    c.采用焊接的方式将U形电极材料与条状电阻合金材料连接,其中焊接位置在合金材料和电极材料接触的条状区域;c. Welding is used to connect the U-shaped electrode material to the strip resistance alloy material, where the welding position is in the strip area where the alloy material and the electrode material are in contact;
    d.通过冲压或切割方式将步骤b中条状带材分割成单颗电阻器;d. Divide the strip in step b into single resistors by stamping or cutting;
    e.通过激光或机械方式对单颗电阻器的阻值进行修整,达到要求的阻值范围;e. The resistance value of a single resistor is trimmed by laser or mechanical means to reach the required resistance range;
    f.通过喷涂或印刷的方式在电阻元件上下表面施加保护层。f. Apply a protective layer on the upper and lower surfaces of the resistance element by spraying or printing.
  5. 根据权利要求4中所述的制造方法,其特征在于:所用电阻合金材料可以使锰铜锡、铁铬铝或镍铬铝硅等合金。The manufacturing method according to claim 4, characterized in that the resistance alloy material used may be an alloy of manganese copper tin, iron chromium aluminum or nickel chromium aluminum silicon.
  6. 根据权利要求5中所述的制造方法,其特征在于:单颗电阻器表面涂覆抗氧化材料薄膜。The manufacturing method according to claim 5, wherein the surface of the single resistor is coated with a thin film of anti-oxidation material.
PCT/CN2019/103469 2018-10-18 2019-08-30 Alloy resistor and manufacturing method therefor WO2020078116A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811213121.9 2018-10-18
CN201811213121.9A CN109411166A (en) 2018-10-18 2018-10-18 A kind of alloy fled rheostat and its manufacturing method

Publications (1)

Publication Number Publication Date
WO2020078116A1 true WO2020078116A1 (en) 2020-04-23

Family

ID=65467476

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/103469 WO2020078116A1 (en) 2018-10-18 2019-08-30 Alloy resistor and manufacturing method therefor

Country Status (2)

Country Link
CN (1) CN109411166A (en)
WO (1) WO2020078116A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109411166A (en) * 2018-10-18 2019-03-01 南京萨特科技发展有限公司 A kind of alloy fled rheostat and its manufacturing method
CN111926266A (en) * 2020-08-14 2020-11-13 苏州利昇达电子科技有限公司 Alloy resistor with strong anti-interference performance and manufacturing method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420601A (en) * 1987-07-16 1989-01-24 Jgc Corp Composit chip varister
CN1542871A (en) * 2003-04-28 2004-11-03 罗姆股份有限公司 Chip resistor and method of manufacturing the same
CN1877753A (en) * 2005-06-06 2006-12-13 余英梅 Resistance and method for producing same
CN101118794A (en) * 2006-07-31 2008-02-06 信昌电子陶瓷股份有限公司 Manufacture process of high precision alloy fled rheostat
CN102436884A (en) * 2011-09-15 2012-05-02 南京萨特科技发展有限公司 Preparation method of alloy plate precision current sensing resistor
CN103165254A (en) * 2011-12-16 2013-06-19 深圳市业展电子有限公司 Manufacturing method of precision alloy sampling resistor
CN203300351U (en) * 2013-06-19 2013-11-20 隆科电子(惠阳)有限公司 Varistor device in shape of rectangular strip
CN109411166A (en) * 2018-10-18 2019-03-01 南京萨特科技发展有限公司 A kind of alloy fled rheostat and its manufacturing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420601A (en) * 1987-07-16 1989-01-24 Jgc Corp Composit chip varister
CN1542871A (en) * 2003-04-28 2004-11-03 罗姆股份有限公司 Chip resistor and method of manufacturing the same
CN1877753A (en) * 2005-06-06 2006-12-13 余英梅 Resistance and method for producing same
CN101118794A (en) * 2006-07-31 2008-02-06 信昌电子陶瓷股份有限公司 Manufacture process of high precision alloy fled rheostat
CN102436884A (en) * 2011-09-15 2012-05-02 南京萨特科技发展有限公司 Preparation method of alloy plate precision current sensing resistor
CN103165254A (en) * 2011-12-16 2013-06-19 深圳市业展电子有限公司 Manufacturing method of precision alloy sampling resistor
CN203300351U (en) * 2013-06-19 2013-11-20 隆科电子(惠阳)有限公司 Varistor device in shape of rectangular strip
CN109411166A (en) * 2018-10-18 2019-03-01 南京萨特科技发展有限公司 A kind of alloy fled rheostat and its manufacturing method

Also Published As

Publication number Publication date
CN109411166A (en) 2019-03-01

Similar Documents

Publication Publication Date Title
WO2020078116A1 (en) Alloy resistor and manufacturing method therefor
JP4640952B2 (en) Chip resistor and manufacturing method thereof
JP5353839B2 (en) Electronic components
JP5706186B2 (en) Chip resistor and manufacturing method thereof
JPH04164310A (en) Manufacture of chip type solid electrolytic capacitor
JP2013524469A (en) Flat cell membrane conductor and method of manufacturing the same
WO2016139975A1 (en) Ntc thermistor to be buried in substrate and method for producing same
JPS6041847B2 (en) Manufacturing method for chip-type electronic components
US5639014A (en) Integral solder and plated sealing cover and method of making same
JPH0122975B2 (en)
JP3080923B2 (en) Method for manufacturing solid electrolytic capacitor
TWI436389B (en) Electronic Parts
JP2000058369A (en) Film capacitor
JPH05243078A (en) Chip type laminar ceramic capacitor and manufacture thereof
JP2005340699A (en) Surface mounting electronic component, packaging structure and method of electronic component
JP2000021607A (en) Manufacture of chip thermistor
JPH0231784Y2 (en)
JP2976048B2 (en) Manufacturing method of chip-type ceramic electronic component
JPS6013297B2 (en) Manufacturing method of solid electrolytic capacitor
JPS6336663Y2 (en)
JP2017092421A (en) Solid electrolyte capacitor, and method of manufacturing the same
JP2008109007A (en) Method of manufacturing bottom-surface electrode type solid-state electrolytic capacitor, and lead frame used for the same
JP2013232543A (en) Chip solid electrolytic capacitor
JPH05144658A (en) Electronic component having lead terminal and its manufacture
JPS593570Y2 (en) Chip type solid electrolytic capacitor

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19873388

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19873388

Country of ref document: EP

Kind code of ref document: A1