WO2023128428A1 - Prise de test pour protection contre la perte de signaux - Google Patents

Prise de test pour protection contre la perte de signaux Download PDF

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Publication number
WO2023128428A1
WO2023128428A1 PCT/KR2022/020559 KR2022020559W WO2023128428A1 WO 2023128428 A1 WO2023128428 A1 WO 2023128428A1 KR 2022020559 W KR2022020559 W KR 2022020559W WO 2023128428 A1 WO2023128428 A1 WO 2023128428A1
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WO
WIPO (PCT)
Prior art keywords
conductive
test socket
elastic matrix
signal loss
terminals
Prior art date
Application number
PCT/KR2022/020559
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English (en)
Korean (ko)
Inventor
이제형
김석민
박준철
주학재
Original Assignee
주식회사 새한마이크로텍
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Application filed by 주식회사 새한마이크로텍 filed Critical 주식회사 새한마이크로텍
Publication of WO2023128428A1 publication Critical patent/WO2023128428A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Definitions

  • the present invention relates to a test socket used to measure electrical characteristics of an electrical device.
  • a performance test on the manufactured semiconductor device is required.
  • a test socket electrically connecting a contact pad of the test device and a terminal of the semiconductor device is required.
  • a test socket equipped with an anisotropic conductive sheet having an insulation part insulating and supporting a contact part in which conductive particles are disposed in the thickness direction of silicone rubber and adjacent contact parts is capable of flexible connection by absorbing mechanical shock or deformation, It has the advantage of low manufacturing cost.
  • the anisotropic conductive sheet 5 of the prior art test socket is composed of a contact portion 6 contacting the terminal 2 of the semiconductor element 1 and an insulating portion 8 insulating and supporting the adjacent contact portions 6.
  • the upper and lower ends of the contact portion 6 contact the terminal 2 of the semiconductor element 1 and the contact pad 4 of the semiconductor inspection device 3, respectively, to electrically connect the terminal 2 and the contact pad 4.
  • connect The contact portion 6 is formed by mixing and hardening small-sized spherical conductive particles 7 with silicone resin, and acts as a conductor through which electricity flows.
  • the insulating portion 8 is made of only an insulating material, signal interference between the contact portions 6 cannot be avoided during transmission of a high frequency signal, resulting in deterioration in high frequency signal transmission characteristics.
  • Patent Document 1 Korean Utility Model Publication No. 2009-0006326
  • Patent Document 2 Korean Patent Publication No. 10-2017-0066981
  • Patent Document 3 Korean Patent Registration No. 10-0375117
  • Patent Document 4 Korean Patent Registration No. 10-2133675
  • An object of the present invention is to improve the above problems, and to provide a test socket for preventing signal loss of a new structure with improved accuracy by minimizing signal loss at high frequencies.
  • the present invention is a test socket disposed between facing terminals to electrically connect the terminals, both ends of which are in contact with facing power or signal terminals, and a first elasticity in the form of a column.
  • a plurality of first conductive parts including a matrix and a plurality of first conductive particles arranged inside the first elastic matrix in a longitudinal direction of the first elastic matrix; a plurality of insulating supports configured to surround at least one of the plurality of first conductive parts;
  • a test socket for preventing signal loss includes a second conductive part configured to surround the plurality of insulating support parts and contact a plurality of ground terminals facing each other on both surfaces thereof.
  • the second conductive part includes a second elastic matrix configured to surround the plurality of insulating supports, and a plurality of second conductive particles arranged in the thickness direction of the second elastic matrix inside the second elastic matrix. do.
  • the first conductive particles and the second conductive particles are conductive particles having the same magnetic composition, and the insulating support, the first elastic matrix, and the second elastic matrix are formed by curing the same liquid resin.
  • the insulating support part, the first conductive part, and the second conductive part are formed by aligning the conductive particles included in the liquid resin at positions corresponding to the first conductive part and the second conductive part using magnetic force.
  • the plurality of first conductive parts includes a plurality of first conductive part groups including a plurality of first conductive part groups, and each of the insulating support parts includes a plurality of first conductive part groups belonging to each first conductive part group. It provides a test socket for preventing signal loss, characterized in that it is configured to surround the first conductive parts.
  • test socket for preventing signal loss is characterized in that a protruding portion is formed on at least one surface of the second conductive portion to contact the plurality of ground terminals.
  • At least one end of the first conductive portion includes an enlarged portion extending from an outer surface of the first conductive portion, and the second conductive portion includes a concave portion recessed in a direction away from the adjacent enlarged portion.
  • a test socket is provided to prevent signal loss.
  • the second conductive part may include a conductive plate having at least one first through hole and at least one second through hole, and a second elasticity covering at least one surface of the conductive plate and filling the second through hole. a matrix, and a plurality of second conductive particles arranged inside the second elastic matrix in a thickness direction of the second elastic matrix, wherein the first conductive part and the insulating support part are disposed in the first through hole. It provides a test socket for preventing signal loss, characterized in that.
  • test socket for preventing signal loss is characterized in that a third through hole is formed outside the first through hole or the second through hole formed outside the conductive plate.
  • a test socket for preventing signal loss is provided, wherein a third conductive part is disposed in the third through hole.
  • the conductive plate provides a test socket for preventing signal loss, characterized in that non-magnetic.
  • the conductive plate provides a test socket for preventing signal loss, characterized in that made of copper or copper alloy.
  • the conductive plate provides a test socket for preventing signal loss, characterized in that it includes a plurality of stacked sub-plates.
  • test socket for preventing signal loss is characterized in that the insulating support, the first elastic matrix, and the second elastic matrix include a silicone-based resin or a polytetrafluoroethylene (PTFE)-based resin.
  • PTFE polytetrafluoroethylene
  • test socket for preventing signal loss In the test socket for preventing signal loss according to the present invention, signal loss is minimized at high frequencies. Therefore, the accuracy in high-frequency inspection is improved.
  • FIG. 1 is a view showing a test socket according to the prior art.
  • FIG. 2 is a diagram illustrating a test socket for preventing signal loss according to an embodiment of the present invention.
  • FIG. 3 is a top view of the test socket for preventing signal loss shown in FIG. 2 .
  • FIG. 4 is a diagram illustrating a test socket for preventing signal loss according to another embodiment of the present invention.
  • FIG. 5 is a diagram illustrating a test socket for preventing signal loss according to another embodiment of the present invention.
  • FIG. 6 is a top view of the test socket for preventing signal loss shown in FIG. 5 .
  • FIG. 7 is a diagram illustrating a test socket for preventing signal loss according to another embodiment of the present invention.
  • FIG. 8 is a view of the test socket for preventing signal loss shown in FIG. 7 viewed from below.
  • FIG. 9 is a diagram illustrating a test socket for preventing signal loss according to another embodiment of the present invention.
  • FIG. 2 is a view showing a test socket for preventing signal loss according to an embodiment of the present invention
  • FIG. 3 is a view of the test socket for preventing signal loss shown in FIG. 2 viewed from above.
  • the test socket 100 for preventing signal loss serves to electrically connect the terminals by being disposed between facing terminals.
  • the test socket 100 for preventing signal loss serves to electrically connect terminals 4a and 4b of the test device 3 and terminals 2a and 2b of the semiconductor device 1 .
  • the test socket 100 for preventing signal loss includes a plurality of first conductive parts 10, a plurality of insulating support parts 20, It includes 2 conductive parts (30). Although four first conductive parts 10 are shown in FIG. 3 , the number of first conductive parts 10 may be tens to thousands.
  • Each of the first conductive parts 10 serves to electrically connect power terminals or signal terminals 2b and 4b facing each other.
  • the first conductive part 10 includes a first elastic matrix 12 and a plurality of first conductive particles 14 .
  • the first elastic matrix 12 has a columnar shape.
  • it may be a polygonal column shape such as a cylinder, a square, a hexagon, or an octagon.
  • the first elastic matrix 12 serves to support the first conductive particles 14 .
  • it serves to bring the first conductive part 10 into close contact with the terminals 2b and 4b while reducing the pressure applied to the terminals 2b and 4b while being elastically deformed during measurement.
  • the first elastic matrix 12 may be formed of various types of polymer materials. For example, it may be implemented with diene rubber such as silicon, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof. In addition, block copolymers such as styrene-butadiene block copolymers, styrene isoprene block copolymers, and hydrogen compounds thereof may be used. In addition, chloroprene, urethane rubber, polyethylene rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylene propylenediene copolymer, and the like may be implemented. In addition, it may be implemented with polytetrafluoroethylene (PTFE) resin. The first elastic matrix 12 is preferably implemented with a silicone-based resin or polytetrafluoroethylene (PTFE) resin.
  • diene rubber such as silicon, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof.
  • the first elastic matrix 12 can be obtained by curing a liquid resin.
  • the first conductive particles 14 are arranged in the longitudinal direction of the first elastic matrix 12 .
  • the first conductive particles 14 contact each other to impart conductivity in the longitudinal direction of the first conductive part 10 .
  • the first conductive portion 10 is compressed in the longitudinal direction. Further, as the first conductive particles 24 are closer to each other, electrical conductivity of the first conductive portion 10 in the longitudinal direction is further increased.
  • the first conductive particles 14 may be implemented with a single conductive metal material or an alloy of two or more metal materials such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, or the like.
  • the first conductive particles 14 may be implemented by coating the surface of the core metal with a metal having excellent conductivity such as gold, silver, rhodium, palladium, platinum, or silver and gold, silver and rhodium, silver and palladium, etc. .
  • the first conductive particles 14 are preferably magnetic particles.
  • it can be implemented by coating the surface of a core made of a metal having magnetism with a highly conductive metal.
  • Each insulating support 20 surrounds each first conductive portion 10 .
  • Each insulating support portion 20 supports each first conductive portion 10 and serves to insulate the first conductive portion 10 from the second conductive portion 30 .
  • the insulating support 20 may be formed of various types of polymer materials.
  • it may be implemented with diene rubber such as silicon, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof.
  • diene rubber such as silicon, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof.
  • block copolymers such as styrene-butadiene block copolymers, styrene isoprene block copolymers, and hydrogen compounds thereof may be used.
  • chloroprene, urethane rubber, polyethylene rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylene propylenediene copolymer, and the like may be implemented.
  • the insulating support 20 is preferably implemented with a silicone-based resin or polytetrafluoroethylene (PTFE) resin.
  • the insulating support 20 can be obtained by curing liquid resin.
  • the insulating support 20 may be formed of the same material as the first elastic matrix 12 .
  • the second conductive part 30 surrounds the plurality of insulating support parts 20 .
  • the second conductive part 30 is generally in the form of a plate in which some areas are replaced by the first conductive part 10 and the insulating support part 20 .
  • Both surfaces of the second conductive portion 30 contact a plurality of facing ground terminals 2a and 4a.
  • a protruding portion 36 is formed on at least one surface of the second conductive portion 30 (the surface on the testing device side in FIG. 2 ) so as to contact the plurality of ground terminals 4a.
  • the second conductive part 30 forms a structure similar to a coaxial cable together with the first conductive part 10, and serves to minimize signal loss of the first conductive part 10 during high-speed signal transmission. . Since the second conductive part 30 is connected to the ground terminals 2a and 4a, the second conductive part 30 is also in a grounded state.
  • the second conductive part 30 includes a second elastic matrix 32 and a plurality of second conductive particles 34 .
  • the second elastic matrix 32 may be formed of various types of polymer materials.
  • it may be implemented with diene rubber such as silicon, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof.
  • diene rubber such as silicon, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof.
  • block copolymers such as styrene-butadiene block copolymers, styrene isoprene block copolymers, and hydrogen compounds thereof may be used.
  • chloroprene, urethane rubber, polyethylene rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylene propylenediene copolymer, and the like may be implemented.
  • the second elastic matrix 32 is also preferably implemented with a silicone-based resin or a polytetrafluoroethylene (PTFE) resin.
  • the second elastic matrix 32 can be obtained by curing a liquid resin.
  • the second elastic matrix 32 may be formed of the same material as the first elastic matrix 12 .
  • the second conductive particles 34 are arranged in the thickness direction of the second elastic matrix 32 .
  • the second conductive particles 34 contact each other to impart conductivity in the thickness direction of the second conductive portion 30 .
  • the second conductive portion 30 is compressed in the longitudinal direction. Further, as the second conductive particles 34 are closer to each other, electrical conductivity of the second conductive portion 30 in the longitudinal direction is further increased.
  • the second conductive particles 34 may be implemented with a single conductive metal material such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, or the like, or an alloy of two or more of these metal materials. there is.
  • the second conductive particles 34 may also be implemented by coating the surface of the core metal with a metal such as gold, silver, rhodium, palladium, platinum, or silver and gold, silver and rhodium, silver and palladium, etc. having excellent conductivity. there is.
  • the second conductive particles 34 are also magnetic particles.
  • it can be implemented by coating the surface of a core made of a metal having magnetism with a highly conductive metal.
  • FIG. 4 is a diagram illustrating a test socket for preventing signal loss according to another embodiment of the present invention.
  • At least one end portion of the first conductive portion 110 (the end portion on the side of the semiconductor device 1 in FIG. 4 ) is enlarged from the outer surface of the first conductive portion 110 116 In that it is provided, there is a difference from the embodiment shown in FIGS. 2 and 3 . This is to increase the contact area with the terminal 2b of the semiconductor element 1.
  • the second conductive portion 130 is different from the embodiments shown in FIGS. 2 and 3 in that it includes a concave portion 138 recessed in a direction away from the adjacent enlarged portion 116 . This is because it is necessary to maintain a distance between the first conductive part 110 and the second conductive part 130 for impedance matching to prevent reflection of a high frequency signal.
  • FIG. 5 is a view showing a test socket for preventing signal loss according to another embodiment of the present invention
  • FIG. 6 is a view of the test socket for preventing signal loss shown in FIG. 5 viewed from above.
  • each of the insulating supports 220 surrounds the plurality of first conductive parts 210 .
  • the insulating support 220 has a rectangular shape.
  • the first conductive parts 210 belonging to the first conductive part group consisting of the plurality of first conductive parts 210 contact the terminal 2b of one semiconductor element.
  • the present embodiment has an advantage in that signal interference between semiconductor devices can be minimized when a plurality of semiconductor devices are simultaneously tested.
  • FIG. 7 is a view showing a test socket for preventing signal loss according to another embodiment of the present invention
  • FIG. 8 is a view of the test socket for preventing signal loss shown in FIG. 7 viewed from below.
  • This embodiment is different from the embodiments shown in FIGS. 2 and 3 in that the second conductive part 330 further includes the conductive plate 340 .
  • a plurality of first through holes 342 and a plurality of second through holes 344 are formed in the conductive plate 340 .
  • the second elastic matrix 332 of the second conductive part 330 covers the conductive plate 340 and at least one surface of the conductive plate 340 (a surface on the side of the semiconductor device 1 in FIG. 7). .
  • a plurality of second conductive particles 334 are arranged in the thickness direction of the second elastic matrix 332.
  • the conductive plate 340 is preferably non-magnetic.
  • the conductive plate 340 may be made of copper or a copper alloy.
  • the conductive plate 340 may be formed of one plate or may be formed by stacking a plurality of sub-plates.
  • the first through holes 342 and the second through holes 344 may be formed using a laser or a micro drill.
  • the first conductive portion 310 and the insulating support portion 320 are disposed within the first through hole 342 of the conductive plate 340 .
  • the first conductive part 310 is electrically separated from the conductive plate 340 and the second elastic matrix 332 in which the second conductive particles 334 are arranged by the insulating support part 320 .
  • FIG. 9 is a diagram illustrating a test socket for preventing signal loss according to another embodiment of the present invention.
  • the test socket 500 for preventing signal loss shown in FIG. 9 is different from the embodiments shown in FIGS. 7 and 8 in that a third through hole 445 is formed outside the conductive plate 440 .
  • the third through hole 445 is a method of aligning the first conductive particles 414 and the second conductive particles 434 having magnetic force by forming lines of magnetic force, and the test socket 500 for preventing signal loss shown in FIG. 9 It is formed for the purpose of minimizing non-uniformity by location in the process of manufacturing.
  • a difference may occur between lines of magnetic force passing through the center of the conductive plate 440 and lines of magnetic force passing through the outermost portion of the conductive plate 440 .
  • magnetic lines of force are also formed outside the outermost first through hole 442 or the second through hole 444 to create an environment similar to the center. However, if the magnetic lines of force are formed without forming the third through hole 445 , the lines of magnetic force may be distorted while passing through the conductive plate 440 .
  • the third through hole 445 serves as a passage through which lines of magnetic force pass without being distorted, thereby preventing distortion of lines of magnetic force.
  • the third through hole 445 may be formed, and as shown in FIG. 9 , the third elastic matrix 446 and the plurality of third conductive particles 447 are included in the third through hole 445.
  • a third conductive portion 448 may be formed.
  • the third conductive part 448 is formed by magnetic force lines passing through the first through hole 442 or the second through hole 444 at the center of the conductive plate 440 and the first through hole 442 or the second through hole at the outermost part. It serves to further reduce the non-uniformity between the lines of force passing through the holes 444.
  • the third elastic matrix 446 may be formed of various types of polymer materials.
  • the third conductive particles 447 are arranged in the longitudinal direction of the third elastic matrix 446 .
  • the third conductive particles 447 may be formed of various types of magnetic conductive particles.
  • Test sockets for signal loss protection 100, 200, 300, 400, 500: Test sockets for signal loss protection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)

Abstract

La présente invention concerne une prise de test servant à mesurer des caractéristiques électriques d'un dispositif électrique. La présente invention utilise une prise de test permettant une protection contre la perte de signaux et disposée entre des bornes en regard de connexion électrique. La prise de test se caractérise en ce qu'elle comprend : une pluralité de premières parties conductrices, comportant une première matrice élastique sous forme de colonne, dont les deux extrémités sont en contact avec des bornes d'alimentation ou de signaux en regard ; et une pluralité de premières particules conductrices agencées, à l'intérieur de la première matrice élastique, selon la direction longitudinale de la première matrice élastique ; une pluralité de supports isolants, conçus pour entourer au moins l'une des parties de la pluralité de premières parties conductrices ; et une seconde partie conductrice, entourant la pluralité de supports isolants et dont les deux surfaces sont en contact avec une pluralité de bornes de terre en regard. Dans la prise de test permettant la protection contre la perte de signaux selon la présente invention, la perte de signaux est réduite autant que possible. La vitesse et la précision d'inspection augmentent donc.
PCT/KR2022/020559 2021-12-27 2022-12-16 Prise de test pour protection contre la perte de signaux WO2023128428A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210188477A KR102389136B1 (ko) 2021-12-27 2021-12-27 신호 손실 방지용 테스트 소켓
KR10-2021-0188477 2021-12-27

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WO2023128428A1 true WO2023128428A1 (fr) 2023-07-06

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KR102389136B1 (ko) * 2021-12-27 2022-04-21 주식회사 새한마이크로텍 신호 손실 방지용 테스트 소켓
KR102478906B1 (ko) * 2022-07-08 2022-12-21 배명철 소자 테스트 소켓 및 그 제조 방법

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