WO2020024937A1 - 一种改善软硬结合pcb板高低差钻孔的方法 - Google Patents
一种改善软硬结合pcb板高低差钻孔的方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- the invention relates to the field of PCB drilling, and in particular, to a method for improving the drilling of height difference between a flexible and a rigid PCB board.
- the rigid-flex board is a circuit board with FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards through processes such as compression bonding according to relevant process requirements.
- the flexible and rigid board can be used in some products with special requirements. It has both a certain flexible area and a certain rigid area, which greatly helps to save the internal space of the product, reduce the volume of the finished product, and improve the performance of the product.
- the combination of rigid and soft boards has greatly enriched the design pattern of circuit boards and has become one of the mainstreams of PCB development.
- the soft-hard board is a combination of a flexible circuit board and a rigid circuit board, there must be a difference in thickness in the combined structure, which will cause the difference in the surface structure and easily cause some drilling processing problems, such as a large number of burrs. .
- a phenolic board is usually used as a cover plate or a backing plate.
- the pressure foot of the rig is used to press the cover plate or the backing plate to make it closely adhere to the PCB board, and to some extent, the problem of the difference in drilling of the soft and hard plate is solved.
- the height difference between the soft and hard versions will be greater, and the drilling process is more demanding. It is difficult for phenolic boards to meet larger height differences and more precise drilling. Processing requirements.
- the prior art also has the problem of filling the plate surface with gaps to improve the drilling burr, but because the height of the gasket is difficult to grasp, it is easy to produce new height differences, and the gaskets are also aligned. The problem of connection and seamless filling is still difficult to meet the demand.
- an object of the present invention is to provide a method for improving the difference in height of a soft-hard combined PCB board by drilling. Prone to burrs.
- a method for improving the height difference drilling of a flexible and rigid combined PCB board comprising the steps of:
- the film filled with the ink on the surface of the soft and hard PCB is subjected to a film release treatment to obtain the drilled soft and hard bonded PCB board.
- the method for improving the height difference drilling of a flexible and rigid PCB board, wherein the step of using the ink to fill and cure the recessed area of the flexible and rigid PCB board to be drilled specifically includes:
- UV light curing is used to cure the ink filled on the flexible and rigid PCB, so that the recessed area after curing the ink on the flexible and rigid PCB and the cover plate, pad or another flexible and rigid PCB filled with ink The board fits seamlessly.
- the method for improving the height difference drilling of a soft-hard combined PCB board wherein the ink comprises 40-45% resin, 10-15% active monomer, 5-10% initiator, 30-40% filler, 3.5-4.5% auxiliaries and 0.01-0.1% toner.
- the method for improving the drilling of the height difference of a soft-hard combined PCB wherein the resin is one or more of polyurethane acrylate, aliphatic acrylate, polyether acrylate, and modified acrylate.
- the pencil hardness after the ink is cured is greater than 3B.
- the method for improving the drilling of the height difference of a flexible and rigid PCB board wherein the step of performing a film release treatment on the ink filled on the surface of the flexible and PCB board specifically includes:
- the ink filled on the surface of the soft-hard combined PCB board is subjected to a film-removal treatment by means of high-temperature water washing, dehydration or direct peeling, to obtain a drilled soft-hard combined PCB board.
- the intensity of the UV light curing is 600-1200mj / cm 2 .
- the method for improving the drilling height difference of the flexible and rigid combined PCB provided by the present invention can selectively fill the concave area of the area to be drilled on the flexible and rigid combined PCB by using ink. Compared with the entire surface coating, Better control of costs; and after the ink is filled and cured on the soft and hard PCB, after bonding the cover plate and the backing plate, due to the non-dead fill of the ink and the high coating hardness, it can effectively inhibit the drilling of the soft and hard PCB. The burr generated by the processing, thereby effectively improving the PCB level drilling problem.
- FIG. 1 is a flowchart of a preferred embodiment of a method for improving height difference drilling of a flexible and rigid combined PCB board according to the present invention.
- the present invention provides a method for improving the height difference drilling of a flexible and rigid PCB board.
- the present invention is described in further detail below. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
- the soft-hard PCB board is a circuit board with FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards through processes such as lamination and combining them according to relevant process requirements.
- FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards through processes such as lamination and combining them according to relevant process requirements.
- there must be a difference in thickness which causes a difference in the surface structure of the PCB board, which easily causes some serious drilling processing problems, such as burrs.
- the present invention provides a method for improving the difference in height difference between a rigid and a rigid PCB, and as shown in FIG. 1, the method includes the following steps:
- the present invention fills and cures the recessed area on the surface of the flexible and rigid PCB board with ink to make it flush with other areas of the surface of the flexible and rigid PCB board, and achieves seamless fit with the cover / pad, which is beneficial to ink filling and suppression.
- the burr is drilled to solve the problem of PCB height difference drilling. The ink will be removed after drilling.
- the present invention uses screen printing to fill the ink into the recessed area of the area to be drilled of the soft-hard combined PCB board. Compared with the entire board surface coating, the present invention uses the ink to selectively fill the soft-hard combined PCB.
- the concave area on the surface of the board can better control the cost; and the method of screen printing ink is mainly used to consider that each PCB factory has screen printing equipment, and the screen printing has a wide range of thickness, high precision, and good thickness uniformity.
- a cover plate and a backing plate are respectively attached to the upper and lower surfaces of the flexible and rigid combined PCB board, so that the concave area filled with the ink on the upper and lower surfaces of the soft and rigid combined PCB board and the cover plate and the backing plate are seamlessly attached.
- the ink filled in the concave area of the to-be-drilled area of the flexible and hard PCB board is cured by UV light curing, and the cover plate and the backing plate are respectively adhered to the upper and lower surfaces of the cured soft and hard PCB board.
- the curing method of UV light curing is preferred, and its environmental protection, high efficiency and easy operation are mainly considered.
- the intensity of the UV light curing is preferably 600-1200 mj / cm 2 .
- the ink includes 40-45% resin, 10-15% reactive monomer, 5-10% initiator, 30-40% filler, 3.5-4.5 by weight percent. % Auxiliaries and 0.01-0.1% toner.
- the resin is one or more of urethane acrylate, aliphatic acrylate, polyether acrylate, and modified acrylate, but is not limited thereto.
- the reactive monomer is preferably acrylic acid.
- the initiator is 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (photoinitiator TPO) or 1-hydroxycyclohexylphenyl ketone (photoinitiator 184), and the photoinitiator TPO is a high-efficiency curing agent that can be used to initiate the basic photopolymer of unsaturated resins; the photoinitiator 184 has high photoinitiating activity, excellent thermal stability, and does not generate yellowing Is one of the most commonly used photoinitiators in China, with a maximum absorption wavelength of 333nm, which is mainly used to initiate the rapid curing of acrylate and methacrylate systems.
- the filler is preferably talc powder or aerosilica, wherein the talc powder is a magnesium silicate salt talc group talc, the main component is hydrous magnesium silicate, which is pulverized, treated with hydrochloric acid, washed with water, and dried;
- the gas silica is fumed silica, which is mainly used as an additive in polymers, polymer composites and engineering plastics, and provides rheological control, thixotropic effect, anti-blocking, anti-settling, and is used as a powdery polymer and resin. filler.
- the auxiliary is preferably a silicone, for example, a polysiloxane.
- the toner is a colored powder substance, which is mixed with plastic pigments and then heated and injection-molded to produce plastic products of various colors. It is widely used in plastic coloring processes, and generally has blue, orange, green, Black, yellow, red, purple and pearlescent colors. Blue toner is preferred in the present invention.
- the resin As one of the embodiments, 42% of the resin, 13% of the reactive monomer, 6% of the initiator, 35% of the filler, 3.95% of the auxiliary agent, and 0.05% of the toner are mixed by weight percentage of the ink. Disperse and stir for 2h, adjust the glue viscosity to 12000 ⁇ 3000CPS, use different screen sizes to print the PCB surface with different height differences, fill the concave area and cure with UV light, and then perform the drilling processing test with the cover / pad. Detect burrs and finally remove the film.
- the pencil hardness after the ink is cured is greater than 3B, because if the ink hardness is too low (less than 3B), it is difficult for the ink to achieve the effect of suppressing burrs in drilling.
- the metal adhesion after the ink is cured is greater than 2B, because if the metal adhesion is too weak (less than 2B), it will affect the burr suppression effect of the drilling process and cause the board to move during processing, thereby affecting the installation effect.
- the ink filled on the soft-hard combined PCB board surface is subjected to a film release treatment to obtain the soft and hard of the drilled hole.
- the present invention adopts a high-temperature water washing method, a method of removing a medicine solution, or a direct peeling method to perform film-removing treatment on the ink filled on the surface of the soft-hard combined PCB to obtain a drilled soft-hard combined PCB.
- the NaOH solution with a concentration of 3% at 50 ° C is preferably used for the dewashing treatment for 30-200s, so that the filled ink is effectively removed.
- polyurethane acrylate acrylic monomer, photoinitiator TPO, talc, polysiloxane and blue toner, mix and stir for 2h at a ratio of 42: 13: 6: 35: 3.95: 0.05, and adjust to 12000CPS
- the viscosity of the glue using different screens to print the PCB surface with different height differences, fill the concave area of the PCB surface and UV curing, the intensity of the UV curing is 900mj / cm 2 , and then with a cover / pad
- the board was drilled and tested.
- the results of the burr detection are shown in Table 1. Finally, the film was removed.
- the UV light-curing ink prepared in Example 1 is selected by screen printing to fill the PCB surface level difference. After curing, it has excellent drilling processing performance, which can effectively suppress processing burrs and retreat. The film is fast and has no glue residue.
- the UV light-curing ink prepared in Example 2 is selected by screen printing to fill the PCB surface level difference. After curing, it has excellent drilling performance, can effectively suppress processing burrs, and retreat from processing. The film is fast and has no glue residue.
- the UV light-curing ink prepared in Example 2 is selected by screen printing to fill the PCB surface level difference. After curing, it has excellent drilling performance, can effectively suppress processing burrs, and retreat from processing. The film is fast and has no glue residue.
- the method for improving the drilling difference of the height difference between the rigid and the rigid PCBs provided by the present invention, by using ink to selectively fill the recessed areas of the rigid and rigid the PCBs to be drilled, compared with the entire surface coating, Can better control costs; and after the ink is filled and cured on the soft and hard PCB, after bonding the cover and the pad, due to the non-dead fill of the ink and the high coating hardness, the soft and hard PCB can be effectively suppressed.
- the burr generated by hole processing thereby effectively improving the PCB drilling process.
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Abstract
本发明公开一种改善软硬结合PCB板高低差钻孔的方法，其中，所述方法包括步骤：采用油墨对软硬结合PCB板待钻孔区域的凹区进行填充并固化；对所述填充并固化有油墨的软硬结合PCB板进行钻孔后，再对所述软硬结合PCB板面填充的油墨进行退膜处理，得到钻孔的软硬结合PCB板。本发明通过采用油墨有选择性填充软硬结合PCB板待钻孔区域的凹区，相比整个板面涂覆，能更好的控制成本；并且填充并固化油墨后的软硬结合PCB板在贴合盖板与垫板后，由于油墨的无死角填充以及高涂层硬度，可有效抑制软硬结合PCB板钻孔加工产生的毛刺，从而有效改善PCB高低差钻孔加工问题。
Description
本发明涉及PCB钻孔领域，尤其涉及一种改善软硬结合PCB板高低差钻孔的方法。
软硬结合板是柔性电路板与刚性线路板经过压合等工序，按相关工艺要求组合在一起形成的具有FPC特性和PCB特性的线路板。所述软硬结合板可用于一些有特殊要求的产品中，其既具有一定的挠性区域，也有一定的刚性区域，对节省产品内部空间，减少成品体积，提高产品性能有很大的帮助。
软硬结合板大大丰富了线路板的设计模式，已成为PCB发展的主流之一。然而，由于软硬结合板是柔性线路板与刚性线路板的结合，在组合结构中必然会存在厚薄差异化，从而造成其表层结构高低差，容易引起一些钻孔加工问题，例如产生大量毛刺等。目前通常使用酚醛板做盖板或垫板，通过钻机的压力脚施压于盖板或垫板，使其与PCB板紧贴，一定程度上解决了软硬结合版的高低差钻孔问题。但随着PCB设计多样化、精密化、功能化的发展，软硬结合版的高低差会更大，同时对钻孔加工要求更高，酚醛板很难满足更大高低差和更精密钻孔加工的要求。
当然，现有技术也有通过设置垫片来填充板面高低间隙以达到改善钻孔毛刺的问题，但是由于垫片的高度很难把握好，容易产生新的高低差，同时垫片还存在对位与连接、无缝填充的问题，仍难以满足需求。
因此，现有技术还有待于改进和发展。
发明内容
鉴于上述现有技术的不足，本发明的目的在于提供一种改善软硬结合PCB板高低差钻孔的方法，旨在解决现有技术在对具有高低差的软硬结合PCB板进行钻孔时易产生毛刺的问题。
本发明的技术方案如下：
一种改善软硬结合PCB板高低差钻孔的方法，其中，包括步骤：
采用油墨对软硬结合PCB板待钻孔区域的凹区进行填充并固化；
对所述填充并固化有油墨的软硬结合PCB板进行钻孔后，再对所述软硬结合PCB板面填充的油墨进行退膜处理，得到钻孔的软硬结合PCB板。
所述的改善软硬结合PCB板高低差钻孔的方法，其中，所述采用油墨对软硬结合PCB板待钻孔区域的凹区进行填充并固化的步骤具体包括：
采用丝网印刷的方式将油墨填充到软硬结合PCB板待钻孔区域的凹区；
采用UV光固化的方式对软硬结合PCB板上填充的油墨进行固化处理，使软硬结合PCB板上固化油墨后的凹区与盖板、垫板或另一填充有油墨的软硬结合PCB板无缝贴合。
所述的改善软硬结合PCB板高低差钻孔的方法，其中，所述油墨按重量百分比计包括40-45％的树脂、10-15％的活性单体、5-10％的引发剂、30-40％的填料、3.5-4.5％的助剂以及0.01-0.1％的色粉。
所述的改善软硬结合PCB板高低差钻孔的方法，其中，所述活性单体为丙烯酸。
所述的改善软硬结合PCB板高低差钻孔的方法，其中，所述树脂为聚氨酯丙烯酸酯、脂肪族丙烯酸酯、聚醚丙烯酸酯和改性丙烯酸酯的一种或多种。
所述的改善软硬结合PCB板高低差钻孔的方法，其中，所述油墨固化后的铅笔硬度大于3B。
所述的改善软硬结合PCB板高低差钻孔的方法，其中，所述油墨固化后的金属附着力大于2B。
所述的改善软硬结合PCB板高低差钻孔的方法，其中，对所述软硬结合PCB板面填充的油墨进行退膜处理的步骤具体包括：
采用高温水洗、药水褪除或直接剥离的方式对所述软硬结合PCB板面填充的油墨进行退膜处理，得到钻孔的软硬结合PCB板。
所述的改善软硬结合PCB板高低差钻孔的方法，其中，所述UV光固化的强度为600-1200mj/cm
2。
有益效果：本发明提供的改善软硬结合PCB板高低差钻孔的方法，通过采用油墨有选择性填充软硬结合PCB板上待钻孔区域的凹区，相比整个板面涂覆，能更好的控制成本；并且填充并固化油墨后的软硬结合PCB板在贴合盖板与垫 板后，由于油墨的无死角填充以及高涂层硬度，可有效抑制软硬结合PCB板钻孔加工产生的毛刺，从而有效改善PCB高低差钻孔加工问题。
图1为本发明一种改善软硬结合PCB板高低差钻孔的方法较佳实施例的流程图。
本发明提供了一种改善软硬结合PCB板高低差钻孔的方法，为使本发明的目的、技术方案及效果更加清楚、明确，以下对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。
软硬结合PCB板是柔性电路板与刚性线路板经过压合等工序，按相关工艺要求组合在一起形成的具有FPC特性和PCB特性的线路板。所述软硬结合PCB板在组合生产工艺中必然会存在厚薄差异化，从而造成PCB板表层结构高低差，这容易引起一些比较严重的钻孔加工问题，例如易产生毛刺等。
基于上述问题，本发明提供一种改善软硬结合PCB板高低差钻孔的方法，其中，如图1所示，包括步骤：
S100、采用油墨对软硬结合PCB板待钻孔区域的凹区进行填充并固化；
S200、对所述填充并固化有油墨的软硬结合PCB板进行钻孔后，再对所述软硬结合PCB板面填充的油墨进行退膜处理，得到钻孔的软硬结合PCB板。
具体来讲，本发明将油墨填充软硬结合PCB板面凹区并固化，使其与软硬结合PCB板面其它区域齐平，达到与盖/垫板无缝贴合，利于油墨填充并抑制钻孔加工毛刺，从而解决了PCB高低差钻孔加工问题，待钻孔加工后再将油墨褪除。
进一步地，本发明采用丝网印刷的方式将油墨填充到软硬结合PCB板待钻孔区域的凹区，相比整个板面涂覆，本发明采用油墨选择性地填充所述软硬结合PCB板表面凹区能更好的控制成本；并且采用丝网印刷油墨的方式，主要考虑各PCB厂都有丝网印刷设备，且丝网印刷厚度范围大、精密度高、厚度均匀性好。
具体来讲，当所述软硬结合PCB板上下表面待钻孔区域均存在凹区时，则需要同时对软硬结合PCB板上下表面待钻孔区域的凹区进行油墨填充，此时则优选在所述软硬结合PCB板上下表面分别贴合盖板和垫板，使所述软硬结合PCB板上下表面填充有油墨的凹区与所述盖板和垫板均实现无缝贴合。当所述软硬结合PCB板待钻孔区域只有下表面存在凹区时，则只需要对软硬结合PCB板待钻孔区域的下表面凹区进行油墨填充，使填充后的凹区能够与垫板实现五分贴合。
优选地，采用UV光固化的方式对软硬结合PCB板待钻孔区域凹区填充的油墨进行固化处理，在固化后的软硬结合PCB板上表面以及下表面分别贴合盖板和垫板。本发明优选UV光固化的固化方式，主要考虑其环保、高效、操作简便。
进一步地，在采用UV光固化油墨的过程中，所述UV光固化的强度优选为600-1200mj/cm
2。
优选地，在本发明中，所述油墨按重量百分比计包括40-45％的树脂、10-15％的活性单体、5-10％的引发剂、30-40％的填料、3.5-4.5％的助剂以及0.01-0.1％的色粉。
其中，所述树脂为聚氨酯丙烯酸酯、脂肪族丙烯酸酯、聚醚丙烯酸酯和改性丙烯酸酯的一种或多种，但不限于此。
所述活性单体优选为丙烯酸。
所述引发剂为2,4,6-三甲基苯甲酰基-二苯基氧化膦(光引发剂TPO)或1-羟基环己基苯基甲酮(光引发剂184)，所述光引发剂TPO是一种高效率的固化剂,它可以用于引发不饱和树脂的基本的光聚合物；所述光引发剂184具有很高的光引发活性、优良的热稳定性及不产生黄变性，是国内最常用的光引发剂之一，最大吸收波长333nm,主要用于引发丙烯酸酯和甲基丙烯酸酯等体系的快速固化。
所述填料优选为滑石粉或气硅，其中，所述滑石粉为硅酸镁盐类矿物滑石族滑石，主要成分为含水硅酸镁，经粉碎后，用盐酸处理，水洗，干燥而成；所述气硅为气相二氧化硅，主要作为助剂应用于聚合物，聚合物复合材料和工程塑料，提供流变控制，触变效果，抗粘连，抗沉降，作为粉状聚合物和树脂的填料。
所述助剂优选为有机硅，例如，聚硅氧烷。
所述色粉是一种有颜色的粉末物质，与塑胶颜料混合后，经加热注塑制成各种不同颜色的塑胶产品，它广泛应用于塑胶着色工艺中，一般有蓝色、橙色、绿色、黑色、黄色、红色、紫色及珠光色等多种颜色。本发明优选蓝色色粉。
作为其中一实施方式，按油墨按重量百分比计，将42％的树脂、13％的活性单体、6％的引发剂、35％的填料、3.95％的助剂以及0.05％的色粉进行混合分散搅拌2h，调成12000±3000CPS的胶液黏度，使用不同目数的网版印刷不同高低差的PCB板面，填充凹区并UV光固化，然后搭配盖/垫板进行钻孔加工测试，检测毛刺，最后做退膜处理。
优选地，在本发明中，所述油墨固化后的铅笔硬度大于3B，因为若油墨硬度太低(低于3B)，则油墨难以达到抑制钻孔加工毛刺的效果。
优选地，所述油墨固化后的金属附着力大于2B，因为若金属附着力太弱(低于2B)，则会影响钻孔加工毛刺抑制效果并导致加工时板材移动从而影响安装效果。
进一步地，在所述步骤S200中，对所述填充油墨的软硬结合PCB板进行钻孔后，再对所述软硬结合PCB板面填充的油墨进行退膜处理，得到钻孔的软硬结合PCB板，其中本发明采用高温水洗、药水褪除或直接剥离的方式对所述软硬结合PCB板面填充的油墨进行退膜处理，得到钻孔的软硬结合PCB板。
本发明优选采用50℃浓度为3％的NaOH溶液进行退洗处理30-200s，使填充的油墨被有效清除掉。
下面通过具体实施方式对本发明一种改善软硬结合PCB板高低差钻孔的方法做进一步地解释说明：
实施例1
按聚氨酯丙烯酸酯、丙烯酸单体、光引发剂TPO、滑石粉、聚硅氧烷和蓝色色粉按照重量百分比为42:13:6:35:3.95:0.05的比例进行混合搅拌2h，调成12000CPS的胶液粘度，使用不同目数的网版印刷不同高低差的PCB板面，填充PCB板面凹区并UV光固化，所述UV光固化的强度为900mj/cm
2，然后搭配盖/垫板进行钻孔加工测试，检测毛刺结果如表1所示，最后做退膜处理。
表1实施例1毛刺检测结果：
从上述实验结果可以看到，实施例1所配制的UV光固化油墨，选择合适的网版印刷填充PCB板面高低差，固化后具有优异钻孔加工性能，能有效的抑制加工毛刺，加工后退膜速度快且无残胶。
实施例2
按脂肪族丙烯酸酯、丙烯酸单体、光引发剂184、气硅、聚硅氧烷和蓝色色粉按照重量百分比为40:15:10:31:3.9:0.1的比例进行混合搅拌2h，调成14000CPS的胶液粘度，使用不同目数的网版印刷不同高低差的PCB板面，填充PCB板面凹区并UV光固化，所述UV光固化的强度为800mj/cm
2，然后搭配盖/垫板进行钻孔加工测试，检测毛刺结果如表2所示，最后做退膜处理。
表2实施例2毛刺检测结果：
从上述实验结果可以看到，实施例2所配制的UV光固化油墨，选择合适的网版印刷填充PCB板面高低差，固化后具有优异钻孔加工性能，能有效的抑制加工毛刺，加工后退膜速度快且无残胶。
实施例3
按聚醚丙烯酸酯、丙烯酸单体、光引发剂TPO、滑石粉、聚硅氧烷和蓝色色粉按照重量百分比为45:10:5:35.5:4.45:0.05的比例进行混合搅拌2h，调成10000CPS的胶液粘度，使用不同目数的网版印刷不同高低差的PCB板面，填充PCB板面凹区并UV光固化，所述UV光固化的强度为1000mj/cm
2，然后搭配 盖/垫板进行钻孔加工测试，检测毛刺结果如表2所示，最后做退膜处理。
表3实施例3毛刺检测结果：
从上述实验结果可以看到，实施例2所配制的UV光固化油墨，选择合适的网版印刷填充PCB板面高低差，固化后具有优异钻孔加工性能，能有效的抑制加工毛刺，加工后退膜速度快且无残胶。
综上所述，本发明提供的改善软硬结合PCB板高低差钻孔的方法，通过采用油墨有选择性填充软硬结合PCB板待钻孔区域的凹区，相比整个板面涂覆，能更好的控制成本；并且填充并固化油墨后的软硬结合PCB板在贴合盖板与垫板后，由于油墨的无死角填充以及高涂层硬度，可有效抑制软硬结合PCB板钻 孔加工产生的毛刺，从而有效改善PCB高低差钻孔加工问题。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。
Claims (9)
- 一种改善软硬结合PCB板高低差钻孔的方法，其特征在于，包括步骤：采用油墨对软硬结合PCB板待钻孔区域的凹区进行填充并固化；对所述填充并固化有油墨的软硬结合PCB板进行钻孔后，再对所述软硬结合PCB板面填充的油墨进行退膜处理，得到钻孔的软硬结合PCB板。
- 根据权利要求1所述的改善软硬结合PCB板高低差钻孔的方法，其特征在于，所述采用油墨对软硬结合PCB板待钻孔区域的凹区进行填充并固化的步骤具体包括：采用丝网印刷的方式将油墨填充到软硬结合PCB板待钻孔区域的凹区；采用UV光固化的方式对软硬结合PCB板上填充的油墨进行固化处理，使软硬结合PCB板上固化油墨后的凹区与盖板、垫板或另一填充有油墨的软硬结合PCB板无缝贴合。
- 根据权利要求1或2所述的改善软硬结合PCB板高低差钻孔的方法，其特征在于，所述油墨按重量百分比计包括40-45％的树脂、10-15％的活性单体、5-10％的引发剂、30-40％的填料、3.5-4.5％的助剂以及0.01-0.1％的色粉。
- 根据权利要求3所述的改善软硬结合PCB板高低差钻孔的方法，其特征在于，所述活性单体为丙烯酸。
- 根据权利要求3所述的改善软硬结合PCB板高低差钻孔的方法，其特征在于，所述树脂为聚氨酯丙烯酸酯、脂肪族丙烯酸酯、聚醚丙烯酸酯和改性丙烯酸酯的一种或多种。
- 根据权利要求3所述的改善软硬结合PCB板高低差钻孔的方法，其特征在于，所述油墨固化后的铅笔硬度大于3B。
- 根据权利要求3所述的改善软硬结合PCB板高低差钻孔的方法，其特征在于，所述油墨固化后的金属附着力大于2B。
- 根据权利要求1所述的改善软硬结合PCB板高低差钻孔的方法，其特征在于，对所述软硬结合PCB板面填充的油墨进行退膜处理的步骤具体包括：采用高温水洗、药水褪除或直接剥离的方式对所述软硬结合PCB板面填充的油墨进行退膜处理，得到钻孔的软硬结合PCB板。
- 根据权利要求2所述的改善软硬结合PCB板高低差钻孔的方法，其特征在于，所述UV光固化的强度为600-1200mj/cm 2。
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