WO2019171517A1 - Dispositif de commande d'élément de support - Google Patents

Dispositif de commande d'élément de support Download PDF

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Publication number
WO2019171517A1
WO2019171517A1 PCT/JP2018/008871 JP2018008871W WO2019171517A1 WO 2019171517 A1 WO2019171517 A1 WO 2019171517A1 JP 2018008871 W JP2018008871 W JP 2018008871W WO 2019171517 A1 WO2019171517 A1 WO 2019171517A1
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WIPO (PCT)
Prior art keywords
holding member
component
mounting position
time
mounting
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Application number
PCT/JP2018/008871
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English (en)
Japanese (ja)
Inventor
大輔 山中
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2020504573A priority Critical patent/JP6967137B2/ja
Priority to PCT/JP2018/008871 priority patent/WO2019171517A1/fr
Publication of WO2019171517A1 publication Critical patent/WO2019171517A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • This specification discloses the technique regarding a holding member control apparatus.
  • the component mounting machine described in Patent Literature 1 includes a control unit that controls a moving speed while the suction nozzle moving unit moves the suction nozzle from a component recognition position to a predetermined position based on a recognition processing time by image processing.
  • the suction nozzle moving means is a rotary head equipped with a plurality of suction nozzles at equal intervals on the circumference.
  • the suction nozzle moving means moves the suction nozzles intermittently at intervals, and moves each suction nozzle from the component supply position to the component mounting position via the component recognition position.
  • the control means controls the moving speed while the suction nozzle moving means intermittently rotates the suction nozzle by the arrangement interval based on the recognition processing time.
  • a plurality of mounting heads rotate by intermittent rotation of an intermittent rotating disk, receive electronic components from a component supply device at a component receiving position, and electronically print on a printed wiring board at the component mounting position. Install the parts. While the intermittent turntable rotates, the component supply table moving device moves the component supply table to supply electronic components, and the X-axis slide, Y-axis slide, and Z-axis slide moving devices position the printed wiring board. .
  • a device that is an extension factor of the mounting cycle time is determined, and the acceleration when the operating device other than the device is operated Etc. are selected smaller than the maximum acceleration etc. to reduce vibration.
  • the component placement machine obtains the holding posture of the component with respect to the holding member by performing image processing on an image obtained by capturing the holding member holding the component, and corrects the mounting position of the component on the board based on the acquired holding posture.
  • the mounting position for actually mounting the component is set.
  • the component mounting machine moves the holding member from the imaging position toward the planned mounting position during image processing, and changes the target position of the holding member from the planned mounting position to the mounting position when the mounting position is set. ing.
  • the component mounting machine is trying to improve the component mounting accuracy and reduce the time required from holding the component to mounting.
  • the inventions described in the above patent documents are all directed to a device that intermittently moves the suction nozzle, which is a holding member, at an arrangement interval. That is, the invention described in the above-mentioned patent document is intended to control the movement of the holding member in accordance with the stop of the holding member, and is not intended to avoid the stop of the holding member at the planned mounting position.
  • the time required for image processing may vary, and the holding member may reach the planned mounting position before the mounting position is set. Even in such a case, the holding member temporarily stops at the planned mounting position, and moves toward the mounting position after the mounting position is set.
  • the initial speed of the holding member becomes zero, and the time required to move the holding member from the imaging position to the mounting position may be longer than when the holding member is not paused. There is.
  • the present specification discloses a holding member control device capable of continuing the movement of the holding member holding the component from the imaging position to the mounting position.
  • a holding member control device including an acquisition unit, a correction unit, and a movement control unit.
  • the acquisition unit performs image processing on an image obtained by imaging a holding member holding a component at an imaging position, and acquires a holding posture of the component with respect to the holding member.
  • the correction unit corrects a planned mounting position of the component on the board based on the holding posture of the component acquired by the acquisition unit, and sets a mounting position for actually mounting the component.
  • the movement control unit moves the holding member holding the component from the imaging position toward the mounting planned position, and when the mounting position is set by the correction unit, a target of the holding member The position is changed from the planned mounting position to the mounting position.
  • the movement control unit controls movement of the holding member so that a second timing at which the holding member reaches the planned mounting position is delayed with respect to a first timing at which the setting of the mounting position by the correction unit is expected. Then, the movement of the holding member from the imaging position to the mounting position is continued.
  • the movement control unit holds the holding member so that the second timing at which the holding member reaches the planned mounting position is delayed with respect to the first timing at which the setting of the mounting position by the correction unit is expected. Control the movement of. Thereby, said holding member control apparatus can continue the movement from the imaging position of a holding member to a mounting position.
  • FIG. 2 is a plan view illustrating a configuration example of a component mounting machine 10 and a simulation machine 100.
  • FIG. 3 is a block diagram illustrating an example of a control block of a holding member control device 40.
  • FIG. It is a top view for demonstrating an example of the mounting state of the components 80 when a mounting position is not correct
  • FIG. It is a schematic diagram for demonstrating an example of the relationship between 1st time T1 and 2nd time T2. It is a schematic diagram for demonstrating another example of the relationship between 1st time T1 and 2nd time T2. It is a schematic diagram for demonstrating the example of a setting of detour BY1.
  • Embodiment 1-1 Configuration Example of Board Production Line 10L
  • the board production line 10L includes a plurality (six in this embodiment) of component mounting machines 10, a board production line management device 10H, and a parts database 10DB.
  • a plurality (six) of component mounting machines 10 are provided along the conveyance direction (X-axis direction) of the substrate 90, and the substrate 90 is directed from the upstream component mounting device 10 toward the downstream component mounting device 10. Are sequentially conveyed, and a plurality of components 80 are mounted on the substrate 90.
  • the board production line management apparatus 10H controls a plurality of (six) component mounting machines 10 to manage board production.
  • the component database 10DB stores component information related to a plurality of components 80 mounted on the board 90.
  • a plurality (six) of component mounting machines 10, a board production line management device 10H, and a component database 10DB are connected to be communicable with each other.
  • each of a plurality (six) of component mounting machines 10 includes a substrate transfer device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15, and a control device 16. ing.
  • substrate conveyance apparatus 11 is comprised by the belt conveyor etc., for example, and conveys the board
  • the substrate 90 is a circuit board on which an electronic circuit or an electric circuit is formed.
  • the board transfer device 11 carries the board 90 into the machine of the component mounting machine 10 and positions the board 90 at a predetermined position in the machine.
  • the substrate transfer device 11 carries the substrate 90 out of the component mounting machine 10 after the component mounting process by the component mounting machine 10 is completed.
  • a board transfer device similar to the board transfer device 11 is provided between the adjacent component mounting machines 10, and the substrate 90 is directed from the upstream component mounting machine 10 to the downstream component mounting machine 10. Are transported in order.
  • the component supply device 12 supplies a component 80 to be mounted on the substrate 90.
  • the component supply device 12 includes a plurality of feeders 121 provided along the conveyance direction (X-axis direction) of the substrate 90. Each of the plurality of feeders 121 feeds and moves the carrier tape in which the plurality of components 80 are stored, and supplies the components 80 so as to be collected at a supply position located on the front end side of the feeder 121.
  • the component supply device 12 may supply a relatively large electronic component (for example, a lead component) compared to a chip component in a state of being arranged on the tray.
  • the component transfer device 13 includes a head driving device 131 and a moving table 132.
  • the head driving device 131 is configured to be able to move the moving table 132 in the X-axis direction and the Y-axis direction by a linear motion mechanism.
  • the component mounting head 20 is detachably (replaceable) provided on the movable table 132 by a clamp member (not shown).
  • the component mounting head 20 collects (holds) the component 80 supplied by the component supply device 12 using at least one holding member 30 and mounts the component 80 on the substrate 90 positioned by the substrate transfer device 11.
  • a suction nozzle or a chuck can be used as the holding member 30.
  • a digital imaging device having an imaging element can be used as the component camera 14 and the substrate camera 15, for example.
  • an image sensor such as a charge coupled device (CCD: Charge Coupled Device) or a complementary metal oxide semiconductor (CMOS) can be used as the imaging device.
  • CCD Charge Coupled Device
  • CMOS complementary metal oxide semiconductor
  • the component camera 14 and the board camera 15 perform imaging based on a control signal sent from the control device 16. Image data of images captured by the component camera 14 and the board camera 15 is transmitted to the control device 16.
  • the component camera 14 is fixed to the base of the component mounting machine 10 so that the optical axis is upward (vertically upward) in the Z-axis direction.
  • the component camera 14 can take an image of the component 80 held by the holding member 30 from below.
  • the board camera 15 is provided on the moving table 132 of the component transfer device 13 so that the optical axis is downward (vertically downward) in the Z-axis direction.
  • the substrate camera 15 can image the substrate 90 from above.
  • the control device 16 includes a known central processing unit and storage device, and a control circuit is configured (none of which is shown).
  • the central processing unit is a CPU (Central Processing Unit) and can perform various arithmetic processes.
  • the storage device includes a first storage device and a second storage device.
  • the first storage device is a volatile storage device (RAM: Random Access Memory), and the second storage device is a non-volatile storage device (ROM: Read Only Memory).
  • Information output from various sensors provided in the component mounting machine 10, image data, and the like are input to the control device 16.
  • the control device 16 sends a control signal to the component transfer device 13 based on a control program and predetermined mounting conditions set in advance.
  • control device 16 causes the holding member 30 to collect (hold) the component 80 supplied by the component supply device 12 and cause the component camera 14 to image the holding member 30 holding the component 80.
  • a position where the holding member 30 is imaged is defined as an imaging position P1.
  • the control device 16 performs image processing on the image captured by the component camera 14 and recognizes the holding posture of the component 80 with respect to the holding member 30.
  • the control device 16 can recognize, for example, a part serving as a reference position for positioning, a part characteristic in the appearance of the part 80, and the like by image processing and recognize the holding posture of the part 80.
  • the control device 16 moves the holding member 30 toward the upper side of the planned mounting position P2 set in advance by a control program or the like. Further, the control device 16 corrects the mounting position P2 based on the holding posture of the component 80, and sets the mounting position P3 where the component 80 is actually mounted.
  • the planned mounting position P2 and the mounting position P3 include rotation angles in addition to the positions (X-axis coordinates and Y-axis coordinates).
  • the control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and the rotation angle of the holding member 30 in accordance with the mounting position P3.
  • the control device 16 lowers the holding member 30 whose position (X-axis coordinate and Y-axis coordinate) and rotation angle are corrected, and mounts the component 80 on the substrate 90.
  • the control device 16 performs a mounting process for mounting the plurality of components 80 on the substrate 90 by repeating the above-described pick and place cycle.
  • the holding member control device 40 includes an acquisition unit 41, a correction unit 42, and a movement control unit 43 when viewed as a control block. It is preferable that the holding member control device 40 further includes at least a storage unit 44 of the storage unit 44 and the correction unit 45. As shown in FIG. 3, the holding member control device 40 of this embodiment includes an acquisition unit 41, a correction unit 42, a movement control unit 43, a storage unit 44, and a correction unit 45. In the present embodiment, the acquisition unit 41, the correction unit 42, the movement control unit 43, the storage unit 44, and the correction unit 45 are provided in the control device 16.
  • the acquisition unit 41 performs image processing on an image obtained by capturing the holding member 30 holding the component 80 at the imaging position P ⁇ b> 1, and acquires the holding posture of the component 80 with respect to the holding member 30.
  • the imaging of the holding member 30 holding the component 80 can be performed by, for example, the component camera 14.
  • the acquisition unit 41 can cause the component camera 14 to image the holding member 30 when the holding member 30 reaches the imaging position P1 and is stationary at the imaging position P1.
  • the acquisition unit 41 can also cause the component camera 14 to image the holding member 30 while moving the holding member 30 (so-called on-the-fly imaging).
  • the acquisition unit 41 performs image processing on the image captured by the component camera 14 and acquires the holding posture of the component 80 with respect to the holding member 30.
  • the image processing can take various methods.
  • the acquisition unit 41 can acquire the holding posture of the component 80 by performing image processing, for example, by binarization of image data, filtering, and hue extraction.
  • the acquisition unit 41 can also change the image processing method according to the type of the component 80, for example. In this case, the acquisition unit 41 can acquire the holding posture of the component 80 by an appropriate image processing method according to the type of the component 80, and can minimize the time required for image processing.
  • correction unit 42 The correction unit 42 corrects the scheduled mounting position P2 of the component 80 on the substrate 90 based on the holding posture of the component 80 acquired by the acquisition unit 41, and sets the mounting position P3 where the component 80 is actually mounted. For example, the component 80 indicated by a broken line in FIG. 4A is held by the holding member 30 without rotating at the center position 81 of the component 80 and is not corrected by the correction unit 42 (the correction amount is zero and the mounting is performed). It is assumed that it is mounted on the substrate 90).
  • the holding posture at this time is referred to as a first holding posture, and the mounting state at this time is referred to as a first mounting state.
  • the first holding posture is a normal holding posture
  • the first wearing state is a normal wearing state.
  • the component 80 is rotated counterclockwise by an angle ⁇ 1 at a position moved by a deviation ⁇ X from the center position 81 of the component 80 in a direction opposite to the X-axis direction (negative direction of the X-axis). It is assumed that the component 80 is held by the holding member 30 in the state.
  • the holding posture at this time is defined as a second holding posture. If correction by the correction unit 42 is not performed when the holding posture is the second holding posture, the component 80 is mounted on the substrate 90 in the state indicated by the solid line in FIG. 4A.
  • the correction unit 42 sets a position moved from the planned mounting position P2 by a deviation ⁇ X in the direction opposite to the X-axis direction (the negative direction of the X-axis) as the mounting position P3.
  • the correction unit 42 sets the correction rotation angle of the holding member 30 to an angle ⁇ 1 (clockwise).
  • the holding member 30 is lowered while being rotated clockwise by the angle ⁇ 1 at the mounting position P3.
  • the component 80 is mounted on the substrate 90 as shown by the solid line in FIG. 4B.
  • the mounting state at this time is the same as the first mounting state shown in FIG. 4A. In this way, the correction unit 42 can set the mounting position P3 based on the holding posture of the component 80 acquired by the acquisition unit 41.
  • Movement control unit 43 moves the holding member 30 holding the component 80 from the imaging position P1 toward the planned mounting position P2, and when the mounting position P3 is set by the correction unit 42, the target of the holding member 30 is set. The position is changed from the planned mounting position P2 to the mounting position P3. Further, the movement control unit 43 holds the holding member 30 so that the second timing TM2 at which the holding member 30 reaches the planned mounting position P2 is delayed with respect to the first timing TM1 at which the setting of the mounting position P3 by the correction unit 42 is expected. The movement of the holding member 30 is continued from the imaging position P1 to the mounting position P3.
  • the holding member 30 holding the component 80 is imaged and image processing is started at time T11.
  • the setting of the mounting position P3 by the correction unit 42 is expected at time T12 (first timing TM1).
  • a required time (time from time T11 to time T12) from when the acquisition unit 41 starts image processing to the first timing TM1 is defined as a first time T1.
  • the movement control unit 43 starts to move the holding member 30 from the imaging position P1 toward the planned mounting position P2.
  • T22 second timing TM2
  • a required time (time from time T21 to time T22) from the start of movement of the holding member 30 to the second timing TM2 is defined as a second time T2.
  • the movement control unit 43 controls the movement of the holding member 30 so that the second timing TM2 is delayed with respect to the first timing TM1, so that the correction unit 42 before the holding member 30 reaches the planned mounting position P2.
  • a mounting position P3 is set.
  • the movement control unit 43 changes the target position of the holding member 30 from the planned mounting position P2 to the mounting position P3. Therefore, the movement control unit 43 can continue the movement of the holding member 30 from the imaging position P1 to the mounting position P3 without temporarily stopping the holding member 30 at the planned mounting position P2.
  • the movement control unit 43 When the acquisition unit 41 starts image processing, the movement control unit 43 preferably starts moving the holding member 30 from the imaging position P1 toward the planned mounting position P2. In this case, as shown in FIG. 5B, time T11 and time T21 coincide. Therefore, the movement control unit 43 delays the second timing TM2 with respect to the first timing TM1 by controlling the movement of the holding member 30 so that the second time T2 is longer than the first time T1.
  • the movement control unit 43 gives an operation instruction to the head driving device 131 shown in FIG. 2, and the moving table on which the component mounting head 20 and the holding member 30 are provided. By moving 132 by the head driving device 131, the holding member 30 moves. Therefore, the second timing TM2 is set in consideration of the time required from the movement instruction by the movement control unit 43 until the movement of the holding member 30 is actually controlled.
  • the movement control unit 43 when the acquisition unit 41 starts image processing, the movement control unit 43 starts to move the holding member 30 from the imaging position P1 toward the planned mounting position P2. Accordingly, the movement control unit 43 controls the movement of the holding member 30 so that the second time T2 is longer than the first time T1, thereby setting the second timing TM2 with respect to the first timing TM1. Can be delayed.
  • the movement control unit 43 compared to the case where the movement of the holding member 30 is started after the acquisition unit 41 starts image processing (see FIG. 5A), the movement control unit 43 has a second time T2 (when the second timing TM2 is the same). The time during which the holding member 30 is moving) can be secured for a long time (see FIG. 5B). For this reason, the degree of freedom in controlling the movement of the holding member 30 is increased, and the choice of control is expanded.
  • the movement control unit 43 controls at least one of the speed V1, the acceleration A1, and the route RT1 when the holding member 30 moves from the imaging position P1 toward the mounting position P2, and the first timing TM1.
  • the second time T2 can be calculated by dividing the moving distance when the holding member 30 moves from the imaging position P1 to the planned mounting position P2 by the speed V1.
  • the moving distance is determined by a control program, mounting conditions, and the like. Therefore, the movement control unit 43 can delay the second timing TM2 with respect to the first timing TM1 by controlling the speed V1 so that the second time T2 becomes the predetermined time shown in FIG. 5A or 5B. it can.
  • the movement control unit 43 similarly controls the acceleration A1 so that the second time T2 becomes the predetermined time shown in FIG. 5A or 5B.
  • the second timing TM2 can be delayed with respect to the first timing TM1.
  • the holding member 30 moves linearly from the imaging position P1 to the planned mounting position P2 at a constant acceleration, and moves linearly from the planned mounting position P2 to the mounting position P3 at a constant acceleration.
  • the holding member 30 is stationary at the imaging position P1 before the movement is started (initial speed is zero), and starts moving simultaneously with the start of image processing.
  • the moving distance from the imaging position P1 to the planned mounting position P2 is 40 mm, and the moving distance from the planned mounting position P2 to the mounting position P3 is 1 mm.
  • the first time T1 is set to 6.4 seconds, and the initial acceleration A1 is set to 2 mm / s 2 .
  • the second time T2 is assumed to be 6.5 seconds obtained by adding 0.1 seconds to 6.4 seconds that is the first time T1.
  • the holding member 30 can continue to move from the imaging position P1 to the mounting position P3 without temporarily stopping at the planned mounting position P2.
  • acceleration control is not limited to linear equal acceleration control, and various acceleration controls can be used.
  • the component camera 14 can also perform the above-described on-the-fly imaging (the initial speed of the holding member 30 is not zero).
  • the movement control unit 43 can perform acceleration control in the same manner in both cases of FIGS. 5A and 5B. Further, when the holding member 30 moves from the imaging position P1 to the mounting position P3, it is not always necessary to pass through the planned mounting position P2.
  • the movement control unit 43 makes the movement distance when the holding member 30 moves from the imaging position P1 to the planned mounting position P2 constant, and the second time T2 is as shown in FIG. 5A or 5B.
  • the speed V1 or the acceleration A1 is controlled so as to be the predetermined time shown.
  • the movement control unit 43 can also delay the second timing TM2 with respect to the first timing TM1 by controlling the route RT1 when the holding member 30 moves from the imaging position P1 toward the planned mounting position P2.
  • the movement control unit 43 can control (route control) the route RT1 so that the speed V1 or the acceleration A1 is constant and the second time T2 becomes the predetermined time shown in FIG. 5A or 5B.
  • the movement control unit 43 increases the route length of the route RT1 as the second time T2 shown in FIG. 5A or 5B becomes longer, and the route length of the route RT1 as the second time T2 becomes shorter. To shorten.
  • the movement control unit 43 can also delay the second timing TM2 with respect to the first timing TM1 by controlling a plurality of speeds V1, acceleration A1, and route RT1.
  • the movement control unit 43 controls a plurality of control parameters among the speed V1, the acceleration A1, and the route RT1 so that the second time T2 becomes the predetermined time shown in FIG. 5A or 5B.
  • the movement control unit 43 controls at least one of the speed V1, the acceleration A1, and the route RT1 when the holding member 30 moves from the imaging position P1 toward the planned mounting position P2.
  • the second timing TM2 can be delayed with respect to the first timing TM1.
  • the movement control unit 43 sets at least the route RT1 of the holding member 30 by setting the detour BY1 when there is a possibility that the setting of the mounting position P3 by the correction unit 42 is not performed by the second timing TM2. Control is preferred.
  • the bypass circuit BY1 bypasses the holding member 30 so that the holding member 30 continues to move until the mounting position P3 is set by the correction unit 42. For example, it is assumed that the setting of the mounting position P3 by the correction unit 42 is not performed even after a predetermined time limit has elapsed since the movement of the holding member 30 from the imaging position P1 toward the mounting planned position P2. At this time, the movement control unit 43 can determine that there is a possibility that the setting of the mounting position P3 by the correction unit 42 is not performed by the second timing TM2.
  • FIG. 6 indicates an example of a route RT1 along which the holding member 30 moves when the detour BY1 is set by the movement control unit 43. Even when the detour BY1 is set by the movement control unit 43, the movement control unit 43 can perform at least one of the speed control and the acceleration control described above. In addition, the moving distance of the holding member 30 increases according to the detour BY1. Moreover, the broken line shown in the figure shows an example of a route RT1 along which the holding member 30 moves when the detour BY1 is not set.
  • the movement control unit 43 sets the detour BY1 to be shorter. Can do. Conversely, the longer the elapsed time is, the closer the holding member 30 is to the expected mounting position P2, so the movement control unit 43 needs to set the detour BY1 longer. Therefore, the movement control unit 43 sets a plurality of time limits with different times, sets the detour BY1 to be shorter as the time limit is shorter (shorter elapsed time), and the time limit is longer (longer elapsed time). The detour BY1 can be set longer. Thereby, the movement control part 43 can set the detour BY1 in steps according to the elapsed time, and can control the route RT1 of the holding member 30.
  • the movement control unit 43 sets at least the bypass BY1 when there is a possibility that the setting of the mounting position P3 by the correction unit 42 is not performed by the second timing TM2, thereby at least The path RT1 of the holding member 30 is controlled.
  • the bypass circuit BY1 bypasses the holding member 30 so that the holding member 30 continues to move until the mounting position P3 is set by the correction unit 42. Thereby, the movement control part 43 can avoid the temporary stop of the holding member 30 in the mounting
  • Storage unit 44 The storage unit 44 stores a predicted value of the first time T1 that is set in advance before starting the production of the substrate in which the component 80 is mounted on the substrate 90. It is preferable that the movement control unit 43 predicts the first timing TM1 using the predicted value of the first time T1 stored in the storage unit 44.
  • the first time T1 which is a required time from the start of the image processing by the acquisition unit 41 to the first timing TM1 generally depends on the required time for the image processing. As will be described later, the time required for image processing may vary depending on, for example, the type of the component 80, the holding posture of the component 80, and the like. Therefore, the storage unit 44 may store a preset predicted value of the first time T1 before starting substrate production.
  • the storage unit 44 is preferably a non-volatile storage device (not shown).
  • the predicted value of the first time T1 can be set based on, for example, part information (part 80 shape, image processing method, etc.) regarding the part 80.
  • the movement control unit 43 predicts the first timing TM1 using the predicted value of the first time T1 stored in the storage unit 44. Specifically, the movement control unit 43 reads the predicted value of the first time T1 from the storage unit 44, and predicts the timing at which the read first time T1 (predicted value) elapses as the first timing TM1 ( FIG. 5A and FIG. 5B).
  • the storage unit 44 stores a predicted value of the first time T1 that is set in advance before starting board production in which the component 80 is mounted on the board 90. Further, the movement control unit 43 predicts the first timing TM1 using the predicted value of the first time T1 stored in the storage unit 44. Thereby, the movement control part 43 can acquire the 1st timing TM1 easily.
  • the appearance shape is simple (such as a rectangular parallelepiped shape), and the time required for image processing is relatively short.
  • the component 80 is an electronic component including an integrated circuit
  • the appearance shape is complicated (a shape including a plurality of electrode terminals and protrusions), and the time required for image processing is relatively long.
  • the first time T1 may be different depending on the type of the component 80, and the storage unit 44 preferably stores the predicted value of the first time T1 for each type of the component 80.
  • the storage unit 44 stores the predicted value of the first time T1 for each type of component 80.
  • the storage unit 44 is provided so as to be able to communicate with a plurality (six) of component mounting machines 10, and the predicted value of the first time T1 stored in the storage unit 44 is a plurality (six) of component mounting machines 10 is preferably available.
  • the storage unit 44 is provided in each control device 16 of a plurality (six) of component mounting machines 10.
  • storage part 44 can also be provided in components database 10DB shown in FIG.
  • the storage unit 44 can also be provided in a device (for example, a cloud server) connected to a plurality of (six) component mounting machines 10 via a network.
  • any of these external devices can communicate with a plurality (six) of component mounting machines 10, and the predicted value of the first time T1 stored in the storage unit 44 is a plurality (six) of component mounting machines. 10 can be used. Therefore, each movement control unit 43 of the plurality of (six) component mounting machines 10 can predict the first timing TM1 by sharing the predicted value of the first time T1 stored in the external device. .
  • Correction unit 45 The correction unit 45 measures the first time T1 during board production, and based on the measured value of the first time T1, the predicted value of the first time T1 stored in the storage unit 44 is calculated. Correct it.
  • the correcting unit 45 preferably uses the longest measured value as the predicted value for the first time T1 among the plurality of measured values measured in a plurality of states in which the holding posture of the component 80 is different for the first time T1. .
  • the predicted value of the first time T1 can be set in advance before starting board production based on, for example, component information about the component 80 (shape of the component 80, image processing method, etc.). it can.
  • the first time T1 is actually used by using the component mounting machine 10, the component data generating device (not shown), etc. before starting the board production. It is good to measure and verify.
  • the component data generation device images the component 80 in the same imaging environment as the component mounting machine 10 and automatically generates component data based on the captured image.
  • the measurement and verification of the first time T1 can also be performed using the component mounting machine 10 during board production.
  • the correction unit 45 measures the first time T1 during substrate production, and the storage unit 44 stores the first time T1 based on the measured value of the first time T1. The predicted value for one hour T1 is corrected. Thereby, the movement control unit 43 can predict the first timing TM1 using the predicted value of the first time T1 with higher accuracy corrected by the correcting unit 45.
  • the correcting unit 45 sets the longest measurement value as the predicted value of the first time T1 among the plurality of measurement values measured in a plurality of states in which the holding posture of the component 80 is different for the first time T1. .
  • the correction unit 45 measures the first time T1 in a plurality of states with different holding postures for the same type of component 80.
  • the holding posture can be determined by the position and rotation angle of the component 80 with respect to the holding member 30.
  • the correction unit 45 sets the longest measurement value among the plurality of measurement values as the predicted value for the first time T1.
  • the correcting unit 45 sets the longest measured value among the plurality of measured values measured in the plurality of states in which the holding posture of the component 80 is different for the first time T1 as the predicted value of the first time T1. And thereby, the movement control unit 43 can predict the first timing TM1 by using the predicted value of the longest expected first time T1, and reliably stop the holding member 30 at the planned mounting position P2. It can be avoided.
  • transformation form control apparatus 16 can also be provided with the estimation part (illustration omitted) which estimates 1st timing TM1, after starting the movement of the holding member 30.
  • the prediction unit acquires the progress status of the image processing by the acquisition unit 41, and predicts the first timing TM1 based on the acquired progress status.
  • the movement control unit 43 differs between the first timing TM1 (pre-start timing) set before starting the movement of the holding member 30 and the first timing TM1 (post-start timing) predicted by the prediction unit.
  • the movement control unit 43 advances the second timing TM2 in accordance with the after-start timing. Conversely, the movement control unit 43 delays the second timing TM2 in accordance with the post-start timing when the post-start timing is later than the pre-start timing.
  • the holding member control device 40 can be used in the component mounting machine 10. Further, the holding member control device 40 can also be used in the simulation machine 100.
  • the simulation machine 100 has the same configuration as that of the component mounting machine 10 shown in FIG. 2, and the process of collecting the component 80 by the holding member 30 and mounting the component 80 on the mounting position P3 of the positioned substrate 90 is performed. It can be simulated. Even in the case where the holding member control device 40 is applied to the simulation machine 100, it is possible to obtain the same effects as those described above.
  • Control Method of Holding Member 30 What has been described above about the holding member control device 40 can also be understood as a control method of the holding member 30. Specifically, the control performed by the acquisition unit 41 corresponds to an acquisition process. The control performed by the correction unit 42 corresponds to a correction process. The control performed by the movement control unit 43 corresponds to a movement control process. The control performed by the storage unit 44 corresponds to a storage process. The control performed by the correction unit 45 corresponds to a correction process. Also in the control method of the holding member 30, it is possible to obtain the same operational effects as those already described for the holding member control device 40.
  • the movement control unit 43 causes the holding member 30 to be placed at the planned mounting position P2 with respect to the first timing TM1 at which the setting of the mounting position P3 by the correction unit 42 is expected.
  • the movement of the holding member 30 is controlled so that the reaching second timing TM2 is delayed.
  • the holding member control apparatus 40 can continue the movement of the holding member 30 from the imaging position P1 to the mounting position P3.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Cette invention concerne un dispositif de commande d'élément de support, comprenant une unité d'acquisition, une unité de correction et une unité de commande de déplacement. L'unité d'acquisition effectue un traitement d'image sur une image obtenue par imagerie, dans une position de capture d'image, d'un élément de support qui supporte un composant, et acquiert une posture de support du composant par rapport à l'élément de support. Sur la base de la posture de support du composant, qui est acquise par l'unité d'acquisition, l'unité de correction corrige une position planifiée de montage de composant dans un substrat et définit une position de montage dans laquelle le composant doit être réellement monté. L'unité de commande de déplacement déplace l'élément de support qui supporte le composant de la position de capture d'image vers la position planifiée de montage, et modifie une position cible de l'élément de support de la position planifiée de montage à la position de montage, lorsque la position de montage est définie par l'unité de correction. De plus, l'unité de commande de déplacement commande le déplacement de l'élément de support de telle sorte qu'un second instant auquel l'élément de support atteint la position planifiée de montage est retardé par rapport à un premier instant auquel le réglage de la position de montage par l'unité de correction est prévu, et amène l'élément de support à continuer à se déplacer de la position de capture d'image à la position de montage.
PCT/JP2018/008871 2018-03-07 2018-03-07 Dispositif de commande d'élément de support WO2019171517A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020504573A JP6967137B2 (ja) 2018-03-07 2018-03-07 保持部材制御装置
PCT/JP2018/008871 WO2019171517A1 (fr) 2018-03-07 2018-03-07 Dispositif de commande d'élément de support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/008871 WO2019171517A1 (fr) 2018-03-07 2018-03-07 Dispositif de commande d'élément de support

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WO2019171517A1 true WO2019171517A1 (fr) 2019-09-12

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135988A (ja) * 1997-10-27 1999-05-21 Matsushita Electric Ind Co Ltd 電子部品実装方法
JPH11298198A (ja) * 1998-04-14 1999-10-29 Tenryu Technics:Kk 電子部品装着方法
JP2009140945A (ja) * 2007-12-03 2009-06-25 Yamaha Motor Co Ltd 部品吸着装置、その吸着位置補正方法および実装機
JP2010147401A (ja) * 2008-12-22 2010-07-01 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置及び画像歪補正方法
WO2014174598A1 (fr) * 2013-04-24 2014-10-30 株式会社日立製作所 Dispositif de montage de composant, tête de montage, et dispositif de commande

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135988A (ja) * 1997-10-27 1999-05-21 Matsushita Electric Ind Co Ltd 電子部品実装方法
JPH11298198A (ja) * 1998-04-14 1999-10-29 Tenryu Technics:Kk 電子部品装着方法
JP2009140945A (ja) * 2007-12-03 2009-06-25 Yamaha Motor Co Ltd 部品吸着装置、その吸着位置補正方法および実装機
JP2010147401A (ja) * 2008-12-22 2010-07-01 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置及び画像歪補正方法
WO2014174598A1 (fr) * 2013-04-24 2014-10-30 株式会社日立製作所 Dispositif de montage de composant, tête de montage, et dispositif de commande

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