WO2019146847A1 - 비전도성 반투명 메탈릭 컬러 박막 및 이의 제조방법 - Google Patents
비전도성 반투명 메탈릭 컬러 박막 및 이의 제조방법 Download PDFInfo
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- WO2019146847A1 WO2019146847A1 PCT/KR2018/006686 KR2018006686W WO2019146847A1 WO 2019146847 A1 WO2019146847 A1 WO 2019146847A1 KR 2018006686 W KR2018006686 W KR 2018006686W WO 2019146847 A1 WO2019146847 A1 WO 2019146847A1
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- layer
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- thin film
- nonconductive
- semi
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Definitions
- the present invention relates to a nonconductive semitransparent metallic color thin film and a method of manufacturing the same, and more particularly, to a nonconductive semitransparent metallic color thin film applied to a home appliance such as a refrigerator and a method of manufacturing the same.
- a door of a refrigerator is installed to be rotatable on a front surface of a refrigerator, and a refrigerator door is mainly exposed to a user when the storage room is closed. Therefore, the design and material of the front surface of the refrigerator door are important to provide the user with the beauty of the refrigerator, and the consumer's preference for the refrigerator door giving the impression of the steel material is increasing day by day.
- Such a door of the refrigerator should be able to control the operation of the refrigerator by the touch and the metallic color of the case of the refrigerator.
- An object of the present invention is to provide a nonconductive translucent metallic color thin film having a non-conductive and semi-transparent metallic color that can be operated by a touch sensor, Method.
- a nonconductive semitransparent metallic color thin film comprising: a substrate having a transparent glass substrate; A color layer forming step of forming a color layer on at least a part of one side of the glass substrate provided in the substrate preparing step; And a semi-transparent layer forming step of forming a semi-transparent layer on at least a part of one side of the color layer formed in the color layer forming step, wherein the semitransparent layer formed in the semi- And the transmittance to light traveling in one direction from the other side of the glass substrate is 5% to 20%.
- the light absorption rate of the semi-transparent layer formed in the semi-transparent layer forming step may be another characteristic of 60% to 80%.
- the transmittance or light absorption rate of the semi-transparent layer may be selectively determined by controlling the thickness of the semi-transparent layer deposited in the semi-transparent layer forming step.
- the semitransparent layer formed in the semitransparent layer forming step may be characterized by being formed of a compound of copper and oxygen.
- the sheet resistance value of the semi-transparent layer formed through the semi-transparent layer forming step is 8 to 50 (mega ohm per square).
- At least a part of the compound of copper and oxygen of the translucent layer may have another feature that the coupling ratio of copper to oxygen is 4: 2.9 to 4: 3.1.
- the ratio of the copper to oxygen compound having a copper to oxygen coupling ratio of 4: 2.9 to 4: 3.1 in the translucent layer is 80% to 100%.
- the color layer may be formed so that the refractive index of the color layer with respect to the light incident from the glass substrate side in the color layer forming step has a value between 2.0 and 2.5.
- the color layer may be formed by depositing the color layer in the color layer forming step to selectively determine the refractive index of the color layer by adjusting the thickness.
- the color layer formed in the color layer forming step may be further characterized by being formed of a compound of Zr and N.
- the color of the color layer formed through the color layer forming step is characterized by being determined by the thickness of the color layer formed by depositing Zr and N on at least a portion of one side of the glass substrate You may.
- the compounds of Zr and N in the color layer may have another feature that the binding ratio of Zr to N is 1: 0.9 to 1: 1.
- the ratio of Zr and N in which the Zr and N bond ratio is 1: 0.9 to 1: 1 in the color layer is 80% to 100%.
- the method may further include forming a resin layer having transparency to light on at least a part of one side of the semi-transparent layer formed in the semi-transparent layer forming step.
- the nonconductive semitransparent metallic color thin film according to an embodiment of the present invention for achieving the object of the present invention is a glass substrate; A color layer formed to a predetermined thickness on at least a portion of one side of the glass substrate; And a semi-transparent layer formed on at least a portion of the color layer to have a predetermined thickness, wherein the semi-transparent layer has a light absorptance of 60% to 80%.
- the semitransparent layer may be formed of a compound of copper and oxygen.
- the sheet resistance value of the semitransparent layer is 8 to 50 (mega ohm per square).
- At least a part of the compound of copper and oxygen of the translucent layer may have another feature that the coupling ratio of copper to oxygen is 4: 2.9 to 4: 3.1.
- the ratio of copper to oxygen in the coupling ratio of copper to oxygen of 4: 2.9 to 4: 3.1 in the translucent layer is 80% to 100%.
- the color layer may have another characteristic that the refractive index of light entering from the glass substrate side and proceeding therebetween has a value between 2.0 and 2.5.
- the color layer may be another feature that is formed of a compound of Zr and N.
- the compounds of Zr and N in the color layer may have another feature that the binding ratio of Zr to N is 1: 0.9 to 1: 1.
- the ratio of Zr and N in which the Zr and N bond ratio is 1: 0.9 to 1: 1 in the color layer is 80% to 100%.
- the resin layer may further include a resin layer having transparency to light and having a predetermined thickness at least partially on one side of the translucent layer.
- the nonconductive semitransparent metallic color thin film and the method of manufacturing the same according to the present invention can provide a required metallic color and provide a thin film having translucency by having a high sheet resistance value, assisting in proper switching of the touch sensor, It is possible to improve various operational functions and external design properties of home appliances such as refrigerators.
- FIG. 1 is a cross-sectional view schematically showing a side cross-section of a nonconductive semitransparent metallic color thin film according to an embodiment of the present invention.
- FIG. 2 is a flowchart schematically showing a method of manufacturing a nonconductive translucent methylic color thin film according to an embodiment of the present invention.
- FIG. 3 is a conceptual view schematically illustrating formation of a nonconductive semitransparent metallic color thin film by sputtering in a nonconductive semitransparent metallic color thin film manufacturing method according to an embodiment of the present invention.
- FIG. 4 is an image schematically showing the difference in color according to the thickness of the colorless ZrN in the nonconductive semitransparent metallic color thin film manufactured by the method of manufacturing the nonconductive semitransparent metallic color thin film according to the embodiment of the present invention.
- FIG. 5 is a graph schematically showing the XRD analysis result of a semi-transparent layer in the method of manufacturing a nonconductive semitransparent metallic color thin film according to an embodiment of the present invention.
- the glass substrate 100 has transparency to light. In addition, it is preferable that the hardness is high considering that it is applied to home appliances such as refrigerators. Therefore, it is also preferable that the glass substrate 100 is a tempered glass.
- a color layer 200 is formed on at least a portion of one side of the glass substrate 100 to a predetermined thickness.
- the color layer 200 is preferably capable of exhibiting a specific color, and metallic color, which is a metal color, is also preferable.
- the color layer 200 preferably has a refractive index of 2.0 or more with respect to light incident from the side of the glass substrate 100, and preferably has a value between 2.0 and 2.5 when the refractive index is limited.
- the color layer 200 preferably includes Zr (zirconium) and N (nitrogen) so as to faithfully realize a metallic color. More preferably, in the color layer 200 formed of a compound of Zr and N, it is preferable that at least some of the compounds of Zr and N have a binding ratio of Zr and N of 1: 0.9 to 1: 1.
- the ratio of the Zr and N compound in the color layer 200 having a binding ratio of Zr and N of 1: 0.9 to 1: 1 is 80% to 100%.
- a translucent layer 300 is formed on at least a portion of one side of the color layer 200 to a predetermined thickness. Therefore, it may be said that the color layer 200 is provided between the translucent layer 300 and the glass substrate 100.
- the translucent layer 300 preferably has a transmittance of 5% to 20% with respect to light traveling in one direction from the other side of the glass substrate 100, It is also preferable that the water absorption rate is 60% to 80%.
- the sheet resistance of the translucent layer 300 is 8 (mega ohm per square), and it is preferable that the range of the sheet resistance value of the translucent layer 300 is from 50 to 50 .
- This translucent layer 300 may be made of a compound of copper and oxygen. It is preferable that at least a part of the compound of copper and oxygen in the translucent layer 300 has a copper to oxygen bonding ratio of 4: 2.9 to 4: 3.1.
- the ratio of copper to oxygen in the coupling ratio of copper: oxygen of 4: 2.9 to 4: 3.1 in the translucent layer is 80% to 100%.
- a resin layer is further formed on the nonconductive semitransparent metallic color thin film. It is also preferable that a resin layer having a certain thickness is formed on at least a part of one side of the translucent layer 300.
- FIG. 1 A method for manufacturing the nonconductive semitransparent metallic color thin film will be described with reference to FIGS. 2 and 3.
- FIG. 1 A method for manufacturing the nonconductive semitransparent metallic color thin film will be described with reference to FIGS. 2 and 3.
- FIG. 2 is a flowchart schematically showing a method of manufacturing a nonconductive translucent methylic color thin film according to an embodiment of the present invention
- FIG. 3 is a cross-sectional view of a nonconductive translucent metallic color thin film according to an embodiment of the present invention, And schematically illustrating formation of a conductive semitransparent metallic color thin film as a schematic representation of the internal space of a sputter.
- a method for manufacturing a nonconductive semitransparent metallic color thin film includes a substrate preparation step, a color layer formation step, and a semi-transparent layer formation step, And a layer forming step.
- the substrate preparing step S110 is a step of preparing a glass substrate 100 having transparency to light.
- tempered glass As the glass substrate 100.
- the color layer forming step S120 is a step of forming a color layer 200 on at least a part of one side of the glass substrate 100 prepared in the substrate preparing step S110.
- one side may be understood as a direction from the outside to the inside of the refrigerator when the nonconductive metallic color thin film is applied to a home appliance such as a refrigerator.
- a color layer 200 is formed on one side of the glass substrate 100, as shown in FIG.
- the color layer 200 is a layer that shows a specific color, and forms the color layer 200 so as to have a metallic color metallic color to be implemented.
- the color layer 200 may be formed by various methods, preferably by sputtering.
- a glass substrate 100 is drawn into a sputter, and then the glass substrate 100 is sputtered using a sputtering structure as shown in FIG. 100 may be sputtered onto at least a portion of one side to implement the color layer 200.
- planar anode target material is sputtered toward the glass substrate 100 and deposited.
- reference numeral 33 denotes a deposition direction from the planar anode target material to the substrate side
- reference numeral 27 denotes a gas flow.
- the color layer 200 is formed so that the refractive index of the color layer 200 with respect to the light incident from the side of the glass substrate 100 and having a refractive index of between 2.0 and 2.5.
- the color layer 200 formed in the color layer formation step S120 is preferably formed of a compound of Zr and N.
- various materials may be used as a target material for sputtering, but it is preferable to use Zr (zirconium) as a cathode target material to realize a metallic color.
- Zr zirconium
- the film it is preferable to form the film by sputtering in an atmosphere of argon and nitrogen in the sputter. It is preferable to use Zr as a planar cathode target material.
- the color of the color layer 200 formed through the color layer forming step S120 may be determined by the thickness of the color layer 200 formed by depositing Zr and N on at least a portion of one side of the glass substrate 100.
- the compounds of Zr and N have a binding ratio of Zr and N of 1: 0.9 to 1: 1. More preferably, the Zr and N are combined so that the ratio of Zr and N occupying in the color layer ranges from 80% to 100%, with the combination ratio of Zr and N being 1: 0.9 to 1: 1.
- Table 1 shows hues realized according to the thickness of the ZrN layer and the thickness of the ZrN layer, which are the color layers 200 formed by sputtering zirconium.
- the thickness of the color layer 200 has a value between 10 and 150 nm. 4, an image implemented with different metallic colors depending on the deposition thickness of ZrN formed as the color layer 200 as shown in Table 1.
- the thickness for depositing ZrN is selectively set,
- the metal color, that is, the metallic color to be implemented can be realized.
- the translucent layer 300 formed in the semi-transparent layer forming step S130 preferably has a transmittance of 5% to 20% with respect to light traveling in one direction from the other side of the glass substrate 100.
- the light absorption rate of the translucent layer 300 is preferably 60% to 80%.
- the semitransparent layer 300 can be formed using a sputter having a structure as shown in FIG.
- the transmittance or light absorption rate of the semi-transparent layer 300 can be selectively determined by controlling the thickness of the semi-transparent layer 300 while the semi-transparent layer 300 is formed.
- the translucent layer 300 is preferably formed as a compound of copper and oxygen. It is also preferable to use copper as the planar anode target material to form the translucent layer 300 and to supply oxygen into the sputter to form the translucent layer 300.
- the semitransparent layer 300 can be deposited under conditions such that plasma DC power of 3 kilowatts is supplied, and 50 sccm of argon and 10 to 20 sccm / kW of oxygen are supplied under a vacuum pressure of 1 to 10 mtorr.
- At least a part of the compound of copper and oxygen in the translucent layer 300 formed of a compound of copper and oxygen through the semi-transparent layer forming step (S130) preferably has a copper to oxygen bonding ratio of 4: 2.9 to 4: 3.1 Do.
- the ratio of copper to oxygen in the coupling ratio of copper to oxygen of 4: 2.9 to 4: 3.1 in the translucent layer 300 is 80% to 100%.
- FIG. 5 An XRD analysis graph of the thus formed semi-transparent layer 300 is shown in FIG. 5, Is formed.
- the translucent layer 300 comprising copper and oxygen preferably has a thickness between 200 and 400 nanometers.
- the sheet resistance value of the semi-transparent layer 300 formed through the semi-transparent layer forming step S130 is 8 to 50 (mega ohm per square).
- the translucent layer 300 has a large sheet resistance value so that a correct switching operation can be performed when a touch sensor is attached.
- the nonconductive semitransparent metallic color thin film 10 can be formed through the substrate preparing step S110, the color layer forming step S120, and the semitransparent layer forming step S130.
- the resin layer forming step S140 is a step of forming a resin layer on at least one side of the semi-transparent layer 300 formed in the semi-transparent layer forming step S130.
- the resin layer (not shown) formed in the resin layer forming step S140 has transparency to light. If necessary, it is also preferable to form a black resin layer instead of the transparent resin layer.
- a touch sensor may be disposed on one side of the resin layer as described above.
- the nonconductive semitransparent metallic color thin film can be manufactured according to the nonconductive semitransparent metallic color thin film manufacturing method according to the embodiment of the present invention.
- the nonconductive semitransparent metallic color thin film and the method of manufacturing the same according to the present invention have a high sheet resistance value, so that the correct switching operation of the touch panel can be performed.
- the indoor lighting of the refrigerator is turned on, And provides a thin film which can realize a metallic color so that the color of the exterior material can be matched when the indoor lighting of the refrigerator is turned off.
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CN201880087326.9A CN111630202B (zh) | 2018-01-23 | 2018-06-14 | 非导电性金属色彩半透明膜及其制备方法 |
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KR1020180008295A KR102160429B1 (ko) | 2018-01-23 | 2018-01-23 | 비전도성 반투명 메탈릭 컬러 박막 및 이의 제조방법 |
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Citations (5)
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JP2000241070A (ja) * | 1999-02-22 | 2000-09-08 | Kazuichi Kusakabe | 冷蔵室内が見える家庭用冷蔵庫 |
KR20100103296A (ko) * | 2009-03-13 | 2010-09-27 | 삼성테크윈 주식회사 | 제품의 하우징에 형성되는 박막 |
KR20130003126A (ko) * | 2011-06-30 | 2013-01-09 | 한국기계연구원 | 색상을 가지는 표면처리물 및 이의 제조 방법 |
KR20170082094A (ko) * | 2016-01-05 | 2017-07-13 | 엘지전자 주식회사 | 냉장고 |
KR20170082095A (ko) * | 2016-01-05 | 2017-07-13 | 엘지전자 주식회사 | 냉장고 |
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JP2013086466A (ja) * | 2011-10-21 | 2013-05-13 | Asahi Glass Co Ltd | 前面板および前面板の製造方法 |
US20160147125A1 (en) * | 2014-11-24 | 2016-05-26 | Freescale Semiconductor, Inc. | Electronic devices wth transparent conducting electrodes, and methods of manufacture thereof |
KR101748996B1 (ko) | 2016-06-20 | 2017-06-19 | 엘지전자 주식회사 | 전면 패널 및 이를 구비한 냉장고 도어 |
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- 2018-01-23 KR KR1020180008295A patent/KR102160429B1/ko active IP Right Grant
- 2018-06-14 CN CN201880087326.9A patent/CN111630202B/zh active Active
- 2018-06-14 WO PCT/KR2018/006686 patent/WO2019146847A1/ko active Application Filing
Patent Citations (5)
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JP2000241070A (ja) * | 1999-02-22 | 2000-09-08 | Kazuichi Kusakabe | 冷蔵室内が見える家庭用冷蔵庫 |
KR20100103296A (ko) * | 2009-03-13 | 2010-09-27 | 삼성테크윈 주식회사 | 제품의 하우징에 형성되는 박막 |
KR20130003126A (ko) * | 2011-06-30 | 2013-01-09 | 한국기계연구원 | 색상을 가지는 표면처리물 및 이의 제조 방법 |
KR20170082094A (ko) * | 2016-01-05 | 2017-07-13 | 엘지전자 주식회사 | 냉장고 |
KR20170082095A (ko) * | 2016-01-05 | 2017-07-13 | 엘지전자 주식회사 | 냉장고 |
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CN111630202A (zh) | 2020-09-04 |
KR102160429B1 (ko) | 2020-09-29 |
KR20190089584A (ko) | 2019-07-31 |
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