WO2019127723A1 - 一种液晶面板及其制作方法、显示装置 - Google Patents

一种液晶面板及其制作方法、显示装置 Download PDF

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Publication number
WO2019127723A1
WO2019127723A1 PCT/CN2018/073091 CN2018073091W WO2019127723A1 WO 2019127723 A1 WO2019127723 A1 WO 2019127723A1 CN 2018073091 W CN2018073091 W CN 2018073091W WO 2019127723 A1 WO2019127723 A1 WO 2019127723A1
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Prior art keywords
liquid crystal
array substrate
array
end surface
substrate
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PCT/CN2018/073091
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English (en)
French (fr)
Inventor
李泳锐
阙成文
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惠州市华星光电技术有限公司
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Priority to US15/994,437 priority Critical patent/US10606135B2/en
Publication of WO2019127723A1 publication Critical patent/WO2019127723A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Definitions

  • the present invention relates to the field of liquid crystal display technology, and in particular, to a liquid crystal panel, a manufacturing method thereof, and a display device.
  • Chip On Film which is to fix the chip (IC) on the flexible film of the flexible circuit board (FPC).
  • This package technology is used in many display panels such as LCD and OLED. Chip.
  • This chip is mostly used as a source driver and a gate driver for display drivers.
  • the driving circuit one end of the COF is connected to the printed circuit board (PCB), which is responsible for receiving the data signal transmitted from the printed circuit board, and the other end of the COF is connected to the display panel (Panel) for transmitting the data signal output by the IC to On the display panel, the display panel is driven to display.
  • PCB printed circuit board
  • the display panel Panel
  • the connection between the COF and the printed circuit board and the display panel is completed by a bonding process.
  • the bonding (ie bonding) position of the drive line is conventionally made by using a TFT (Thin Film Transistor) substrate with a line slightly larger than the CF (color filter) substrate of the upper layer. (usually greater than 1mm), the required binding position of the line is exposed, in order to leave the binding position of the drive line, so you need to set the outer frame to cover the binding area, so as not to be seen by the user and affect the appearance of the display.
  • TFT Thin Film Transistor
  • a narrow-frame TV is to narrow the non-display area of the edge, and the frame adopts a more compact and meticulous shape to make the product more beautiful.
  • borderless panel that is, the outer frame of the non-display area of the occlusion panel is removed, and the frameless display is realized.
  • the binding end of the TFT substrate side is longer than the CF substrate, it is necessary to retain a special outer frame to cover The connection line of the binding area affects the narrow frame, and the borderless display cannot be realized.
  • the present invention provides a liquid crystal panel, a manufacturing method thereof, and a display device, which can prevent a long binding area from extending on the side of the TFT substrate, and is advantageous for the display device to realize an ultra-narrow bezel or no border.
  • a liquid crystal panel comprising a color filter substrate, an array substrate, a liquid crystal disposed between the color film substrate and the array substrate, a flip chip, a driving chip and a circuit board disposed on the flip chip; One end of the flip chip is attached to the end surface of the array substrate, and is electrically connected to the metal wire array in the array substrate, and the other end of the flip chip is bonded to the circuit board.
  • the color filter substrate and the array substrate are flush with the end surface of the flip chip, and the flip chip is simultaneously attached to the color filter substrate and the array substrate. End face.
  • one end of the flip chip is bonded to the array substrate, and an end surface of the color filter substrate protrudes from an end surface of the array substrate to block the flip chip.
  • a conductive adhesive layer is adhered between the end surface of the array substrate and the flip chip, and the conductive adhesive layer is electrically connected to the metal wire array.
  • the periphery of the color filter substrate and the array substrate is encapsulated with a sealant, and the array substrate and the end surface of the sealant are formed with conductive dots, and the metal wire array is led out to The conductive dots are electrically connected, and the conductive adhesive layer encapsulates the conductive dots therein.
  • Another object of the present invention is to provide a method for fabricating a liquid crystal panel, comprising:
  • a flip chip with a driving chip and a circuit board is bonded to the end surface of the liquid crystal cell to electrically connect the flip chip to the conductive dot.
  • the method further comprises: grinding the end faces of the one end of the liquid crystal cell provided with the metal wire array to improve the surface finish.
  • the silver glue is printed on the end surface of the polished liquid crystal cell to form a dot array, and each silver glue dot is At least one metal wire of the array of metal wires is turned on.
  • a conductive adhesive layer is first disposed on the flip chip and the liquid crystal cell provided with one end of the metal wire array. Then, the conductive adhesive layer is adhered to the end surface of the liquid crystal cell by means of hot pressing.
  • Still another object of the present invention is to provide a display device including a backlight module and the liquid crystal panel, and the backlight module is disposed on a side of the array substrate.
  • the flip-chip film When the signal is connected to the liquid crystal panel, the flip-chip film is pressed onto the end surface of the array substrate by end-face bonding, thereby realizing the conduction of the metal wire array in the array substrate, and the TFT substrate side can be prevented from extending.
  • the longer binding area facilitates the display device to achieve an ultra-narrow bezel or no border.
  • FIG. 1 is a schematic structural view of a liquid crystal panel according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a conductive dot according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a display device according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of another liquid crystal panel according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a method for fabricating a liquid crystal panel according to an embodiment of the invention.
  • FIG. 6 is a process diagram of a manufacturing process of a liquid crystal panel according to an embodiment of the present invention.
  • the display device of the embodiment of the present invention includes a liquid crystal panel 10 and a backlight module 20 .
  • the backlight module 20 is disposed on the side of the array substrate 12 of the liquid crystal panel 10 , and the side of the color film substrate 11 is a light emitting surface.
  • the upper surface of the color filter substrate 11 and the array substrate 12 are bonded to the upper polarizer P1 and the lower polarizer P2, respectively.
  • the liquid crystal panel mainly includes a color filter substrate 11 , an array substrate 12 , a liquid crystal 13 disposed between the color filter substrate 11 and the array substrate 12 , a flip chip 14 , a driving chip 15 and a circuit disposed on the flip chip 14 .
  • the flip-chip film 14 is bonded to the end surface of the array substrate 12 and electrically connected to the metal wire array 120 in the array substrate 12.
  • the other end of the flip chip 14 is bonded to the circuit board 16, and the flip chip 14 is bent. Thereafter, the circuit board 16 is disposed on the side of the back surface of the array substrate 12.
  • the color film substrate 11 and the array substrate 12 are flush with the end surface of the flip chip 14 , and the flip chip 14 is bonded to the end faces of the color filter substrate 11 and the array substrate 12 at the same time, so that the liquid crystal panel has a flat end surface.
  • a conductive adhesive layer 17 is adhered between the end surface of the array substrate 12 and the flip chip 14 .
  • the conductive adhesive layer 17 is electrically connected to the metal wire array 120 .
  • the periphery of the color filter substrate 11 and the array substrate 12 is encapsulated with a frame adhesive T.
  • the glue T encapsulates the liquid crystal 13 between the color filter substrate 11 and the array substrate 12 to prevent moisture from entering.
  • the end surface of the array substrate 12 and the sealant T are formed with conductive dots 18, and the metal wire array 120 of the array substrate 12 located in the sealant T is electrically connected to the conductive dots 18, and the conductive adhesive layer 17 encapsulates the conductive dots 18 therein.
  • the flip chip 14 is adhered to the end faces of the array substrate 12, the sealant T, and the color filter substrate 11 through the conductive paste layer 17.
  • the conductive adhesive layer 17 is an ACF (Anisotropic Conductive Film) adhesive
  • the conductive dot 18 is a material having good conductivity such as Ag.
  • one end of the flip chip 14 is attached to the array substrate 12.
  • the width of the color filter substrate 11 is larger than the width of the array substrate 12, that is, the end surface of the color filter substrate 11.
  • the conductive adhesive layer 17 is only attached to the end surface of the array substrate 12 and the sealant T, and the flip chip 14 is attached to the surface of the conductive adhesive layer 17, and the color filter substrate 11 is shielded above the flip chip 14 . It is possible to avoid exposure of the flip chip 14 and require additional design of the frame structure to block.
  • the backlight module 20 includes a light guide plate 21 , an optical film set 22 disposed on a surface of the light guide plate, and a back plate 23 , and the back plate 23 includes a light guide plate 21 .
  • the bottom surface portion, the side portion for fixing the light source 200, and the top surface portion for carrying the liquid crystal panel 10, the optical film group 22 is disposed on the light guide plate 21, and the end surface thereof abuts the end surface of the top surface portion of the back plate 23.
  • the liquid crystal panel 10 is pasted on the top surface portion of the back sheet 23 by a light-shielding glue.
  • a reflective layer 24 may be disposed between the bottom surface portion of the back plate 23 and the light guide plate 21, and the reflective layer is attached to the bottom surface of the light guide plate 21 and extends to abut the side portion of the back plate 23 to maximize the light source.
  • the projected light is reflected back to the light guide plate, and the bottom surface of the bottom plate portion of the back plate 23 is further provided with a bottom surface recessed portion for receiving the crystalline film 14 and the circuit board 16.
  • the side portion of the back plate 23 can also be opened for driving the chip 15.
  • the embedded side recesses allow the backing plate 23 to serve both as a fixing and heat sink for the light source 200 and as a receiving member for the flip chip 14, the driver chip 15, and the circuit board 16, making the structure of the display device more compact.
  • the present invention also provides a method for fabricating a liquid crystal panel, including:
  • a conductive dot 18 is formed at one end of each liquid crystal cell with the metal wire array 120, so that the conductive dot 18 is electrically connected to the metal wire array 120; specifically, the silver paste is printed on the end surface of the polished liquid crystal cell by using the showerhead P to form In the dot array, each silver glue dot is electrically connected to at least one metal wire of the metal wire array 120, thereby realizing multi-channel signal access, and the silver glue droplets are attached to the end face of the panel by the jetting force of the printing. At the same time, it will infiltrate into the gap between the sealant T and the array substrate 12, and can be better combined with the metal wire terminals disposed on the array substrate 12;
  • the chip-on-film 14 with the driving chip 15 and the circuit board 16 is bonded to the end surface of the liquid crystal cell, so that the flip chip 14 and the conductive dot 18 are electrically connected.
  • the conductive film layer 17 is first disposed on the flip chip 14 and the end of the liquid crystal cell provided with the metal wire array 120, and then hot pressed.
  • the conductive adhesive layer 17 is adhered to the end surface of the liquid crystal cell by the thermal head Y to maintain a good electrical connection between the flip chip 14 and the liquid crystal cell.
  • each color film substrate 11 and the array substrate 12 are flush with the end surface of the flip chip 14 , and the flip chip 14 is simultaneously bonded to the end surface of the color filter substrate 11 and the array substrate 12 , and the conductive adhesive
  • the layer 17 is adhered to the end faces of the array substrate 12, the sealant T, and the color filter substrate 11.
  • the end surface of the color filter substrate 11 protrudes from the end surface of the array substrate 12, the conductive adhesive layer 17 is only attached to the end surface of the array substrate 12 and the sealant T, and the flip chip 14 is attached to the surface of the conductive adhesive layer 17, and the color filter substrate 11 is blocked above the flip chip 14 .
  • the flip-chip film When the signal is connected to the liquid crystal panel, the flip-chip film is pressed onto the end surface of the array substrate by end-face bonding, thereby realizing the conduction of the metal wire array in the array substrate, and the TFT substrate side can be prevented from extending.
  • the longer binding area facilitates the display device to achieve an ultra-narrow bezel or no border.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种液晶面板(10)、液晶面板(10)的制作方法及显示装置，液晶面板（10）包括彩膜基板（11）、阵列基板（12）、设于彩膜基板（11）与阵列基板（12）之间的液晶（13）、覆晶薄膜（14）、设于覆晶薄膜（14）上的驱动芯片（15）与电路板（16），覆晶薄膜（14）一端贴合于阵列基板（12）端面，并与阵列基板（12）内的金属导线阵列（120）电连接，覆晶薄膜（14）的另一端与电路板（16）绑定。在对液晶面板（10）进行信号接入时，采用端面绑定的方式将覆晶薄膜（14）压合在阵列基板（12）的端面，从而实现阵列基板（12）内的金属导线阵列（120）的导通，可以避免TFT基板侧延伸出较长的绑定区，有利于显示装置实现超窄边框或无边框。

Description

一种液晶面板及其制作方法、显示装置 技术领域
本发明涉及液晶显示技术领域，尤其涉及一种液晶面板及其制作方法、显示装置。
背景技术
覆晶薄膜(Chip On Film，COF)，即将芯片(IC)固定于柔性电路板(FPC)的晶粒软膜上，在众多显示面板如LCD、OLED等中，都要用到这种封装技术的芯片。这种芯片多用作显示驱动的源极驱动(Source Driver)和栅极驱动(Gate Driver)。在驱动电路中，COF一端连接到印制电路板(PCB)，负责接收印制电路板传输过来的数据信号，COF的另一端连接显示面板(Panel)，用于将IC输出的数据信号传输到显示面板上，以驱动显示面板进行显示。
具体地，COF与印制电路板和显示面板的连接是通过绑定(Bonding)工艺完成的，在LCD(Liquid Crystal Display，即液晶显示器)的制作过程中，出于液晶驱动的需要，需要预留驱动线路的绑定(即bonding)位置，传统的做法是将带有线路的TFT(Thin Film Transistor，薄膜晶体管)基板做得比上层的CF(color filter，彩色滤光片)基板稍大一些(通常大于1mm)，将需要的绑定位置的线路裸露出来，以便留出驱动线路的绑定位置，这样需要设置外框将绑定区盖住，以免被用户看到而影响显示外观。
近年来，随着LCD显示行业的不断发展，面板外观有逐渐变窄的趋势。诸如窄边框电视，是将边缘非显示区域做窄，边框采用更简洁、细致的造型，使产品更为美观。甚至有提出“无边框”面板概念，即去掉遮挡面板非显示区的外框，实现无边框显示，然而，由于TFT基板侧的绑定端比CF基板长，需要保留专门的外框以盖住绑定区的连接线路，影响窄边框化，无边框显示也无法实现。
发明内容
鉴于现有技术存在的不足，本发明提供了一种液晶面板及其制作方法、显 示装置，可以避免TFT基板侧延伸出较长的绑定区，有利于显示装置实现超窄边框或无边框。
为了实现上述的目的，本发明采用了如下的技术方案：
一种液晶面板，包括彩膜基板、阵列基板、设于所述彩膜基板与所述阵列基板之间的液晶、覆晶薄膜、设于所述覆晶薄膜上的驱动芯片与电路板，所述覆晶薄膜一端贴合于所述阵列基板端面，并与所述阵列基板内的金属导线阵列电连接，所述覆晶薄膜的另一端与所述电路板绑定。
作为其中一种实施方式，所述彩膜基板与所述阵列基板贴合有所述覆晶薄膜的端面平齐，所述覆晶薄膜同时贴合于所述彩膜基板与所述阵列基板的端面。
作为其中一种实施方式，在所述阵列基板上贴合有所述覆晶薄膜的一端，所述彩膜基板的端面伸出于所述阵列基板端面，并遮挡所述覆晶薄膜。
作为其中一种实施方式，所述阵列基板端面与所述覆晶薄膜之间粘附有导电胶层，所述导电胶层与所述金属导线阵列电连接。
作为其中一种实施方式，所述彩膜基板与所述阵列基板之间的***封装有框胶，所述阵列基板与所述框胶的端面形成有导电网点，所述金属导线阵列引出至与所述导电网点电连接，所述导电胶层将所述导电网点封装于其中。
本发明的另一目的在于提供一种液晶面板的制作方法，包括：
切割母版，形成多个液晶盒；
在各所述液晶盒设置有金属导线阵列的一端制作导电网点，使所述导电网点与所述金属导线阵列电连接；
分别在所述液晶盒的上下表面贴附上偏光片、下偏光片；
在所述液晶盒端面贴合带驱动芯片与电路板的覆晶薄膜，使所述覆晶薄膜与所述导电网点导通。
作为其中一种实施方式，在各所述液晶盒设置有金属导线阵列的一端制作导电网点前还包括：对液晶盒设置有金属导线阵列的一端的端面打磨，以提高表面光洁度。
作为其中一种实施方式，在各所述液晶盒设置有金属导线阵列的一端制作导电网点时，在打磨后的液晶盒端面喷印银胶，形成点状阵列，每一个银胶点 与所述金属导线阵列的至少一条金属导线导通。
作为其中一种实施方式，在所述液晶盒端面贴合带驱动芯片与电路板的覆晶薄膜时，先在所述覆晶薄膜与所述液晶盒设置有金属导线阵列的一端设置导电胶层，然后采用热压的方式使导电胶层贴合于所述液晶盒端面。
本发明的又一目的在于提供一种显示装置，包括背光模组和所述的液晶面板，所述背光模组设于所述阵列基板所在侧。
本发明在对液晶面板进行信号接入时，采用端面绑定的方式将覆晶薄膜压合在阵列基板的端面，从而实现阵列基板内的金属导线阵列的导通，可以避免TFT基板侧延伸出较长的绑定区，有利于显示装置实现超窄边框或无边框。
附图说明
图1为本发明实施例的一种液晶面板的结构示意图；
图2为本发明实施例的导电网点的结构示意图；
图3为本发明实施例的一种显示装置的结构示意图；
图4为本发明实施例的另一种液晶面板的结构示意图；
图5为本发明实施例的一种液晶面板的制作方法示意图；
图6为本发明实施例的一种液晶面板的制作工艺过程图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参阅图1～图3，本发明实施例的显示装置包括液晶面板10和背光模组20，背光模组20设于液晶面板10的阵列基板12所在侧，彩膜基板11所在侧为出光面，彩膜基板11、阵列基板12外表面分别贴合有上偏光片P1、下偏光片P2。具体地，液晶面板主要包括彩膜基板11、阵列基板12、设于彩膜基板11与阵列基板12之间的液晶13、覆晶薄膜14、设于覆晶薄膜14上的驱动芯片15与电路板16，覆晶薄膜14一端贴合于阵列基板12端面，并与阵列基板12内的金属导线阵列120电连接，覆晶薄膜14的另一端与电路板16绑定，覆晶薄膜14弯折后，电路板16设于阵列基板12的背面所在侧。
彩膜基板11与阵列基板12贴合有覆晶薄膜14的端面平齐，覆晶薄膜14同时贴合于彩膜基板11与阵列基板12的端面，使得液晶面板具有平整的端面。阵列基板12端面与覆晶薄膜14之间粘附有导电胶层17，导电胶层17与金属导线阵列120电连接，彩膜基板11与阵列基板12之间的***封装有框胶T，框胶T将液晶13封装于彩膜基板11与阵列基板12之间，以防止水汽进入。阵列基板12与框胶T的端面形成有导电网点18，阵列基板12位于框胶T内的金属导线阵列120引出至与导电网点18电连接，导电胶层17将导电网点18封装于其中，同时，覆晶薄膜14通过该导电胶层17粘贴在阵列基板12、框胶T以及彩膜基板11的端面。
本实施例中，导电胶层17为ACF(Anisotropic Conductive Film，即异方性导电胶膜)胶，导电网点18为Ag等导电性能较好的材料。
如图4所示，在另一种实施方式中，在阵列基板12上贴合有覆晶薄膜14的一端，彩膜基板11的宽度大于阵列基板12的宽度，即彩膜基板11的端面伸出于阵列基板12端面，导电胶层17只贴合在阵列基板12与框胶T的端面，覆晶薄膜14贴合在导电胶层17表面，彩膜基板11遮挡在覆晶薄膜14上方，可以避免覆晶薄膜14暴露而需要额外设计框架结构遮挡。
如图3所示，本实施例的显示装置中，背光模组20包括导光板21、设于导光板上表面的光学膜片组22以及背板23，背板23包括用于承载导光板21的底面部分、用于固定光源200的侧面部分以及用于承载液晶面板10的顶面部分，光学膜片组22设于导光板21上，且其端面与背板23的顶面部分端面抵接，液晶面板10通过遮光胶粘贴在背板23的顶面部分。背板23的底面部分与导光板21之间还可以设置一层反射层24，该反射层贴合于导光板21底面并延伸至抵接在背板23的侧面部分，可以最大限度地将光源200投射的光线反射回导光板，背板23的底面部分底部还可开设有用于供覆晶薄膜14和电路板16容纳的底面凹陷部，背板23的侧面部分还可开设有供驱动芯片15嵌入的侧面凹陷部，使得背板23既作为光源200的固定和散热件，又作为覆晶薄膜14、驱动芯片15和电路板16的容纳件，使得显示装置的结构更加紧凑。
如图5和6，本发明还提供了一种液晶面板的制作方法，包括：
S01、切割母版，形成多个液晶盒；
S02、利用磨削装置M对液晶盒设置有金属导线阵列120的一端的端面打磨，以提高表面光洁度；
S03、在各液晶盒设置有金属导线阵列120的一端制作导电网点18，使导电网点18与金属导线阵列120电连接；具体是，利用喷头P在打磨后的液晶盒端面喷印银胶，形成点状阵列，每一个银胶点与金属导线阵列120的至少一条金属导线导通，以此实现多通道的信号接入，藉由喷印的喷射力度，银胶液滴在附着在面板端面的时候会顺势往框胶T与阵列基板12缝隙内进行渗入，可更好的与设置在阵列基板12上的金属导线端子进行结合；
S04、分别在液晶盒的上下表面贴附上偏光片P1、下偏光片P2；
S05、在液晶盒端面贴合带驱动芯片15与电路板16的覆晶薄膜14，使覆晶薄膜14与导电网点18导通。在液晶盒端面贴合带驱动芯片15与电路板16的覆晶薄膜14时，先在覆晶薄膜14与液晶盒设置有金属导线阵列120的一端设置导电胶层17，然后采用热压的方式利用热压头Y使导电胶层17贴合于液晶盒端面，使覆晶薄膜14与液晶盒之间保持良好的电性连接。
切割后的液晶盒中，每个彩膜基板11与阵列基板12贴合有覆晶薄膜14的端面平齐，覆晶薄膜14同时贴合于彩膜基板11与阵列基板12的端面，导电胶层17粘贴在阵列基板12、框胶T以及彩膜基板11的端面。或者，彩膜基板11的端面伸出于阵列基板12端面，导电胶层17只贴合在阵列基板12与框胶T的端面，覆晶薄膜14贴合在导电胶层17表面，彩膜基板11遮挡在覆晶薄膜14上方。
本发明在对液晶面板进行信号接入时，采用端面绑定的方式将覆晶薄膜压合在阵列基板的端面，从而实现阵列基板内的金属导线阵列的导通，可以避免TFT基板侧延伸出较长的绑定区，有利于显示装置实现超窄边框或无边框。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种液晶面板，其中，包括彩膜基板、阵列基板、设于所述彩膜基板与所述阵列基板之间的液晶、覆晶薄膜、设于所述覆晶薄膜上的驱动芯片与电路板，所述覆晶薄膜一端贴合于所述阵列基板端面，并与所述阵列基板内的金属导线阵列电连接，所述覆晶薄膜的另一端与所述电路板绑定。
  2. 根据权利要求1所述的液晶面板，其中，所述彩膜基板与所述阵列基板贴合有所述覆晶薄膜的端面平齐，所述覆晶薄膜同时贴合于所述彩膜基板与所述阵列基板的端面。
  3. 根据权利要求1所述的液晶面板，其中，在所述阵列基板上贴合有所述覆晶薄膜的一端，所述彩膜基板的端面伸出于所述阵列基板端面，并遮挡所述覆晶薄膜。
  4. 根据权利要求1所述的液晶面板，其中，所述阵列基板端面与所述覆晶薄膜之间粘附有导电胶层，所述导电胶层与所述金属导线阵列电连接。
  5. 根据权利要求4所述的液晶面板，其中，所述彩膜基板与所述阵列基板之间的***封装有框胶，所述阵列基板与所述框胶的端面形成有导电网点，所述金属导线阵列引出至与所述导电网点电连接，所述导电胶层将所述导电网点封装于其中。
  6. 根据权利要求2所述的液晶面板，其中，所述阵列基板端面与所述覆晶薄膜之间粘附有导电胶层，所述导电胶层与所述金属导线阵列电连接。
  7. 根据权利要求6所述的液晶面板，其中，所述彩膜基板与所述阵列基板之间的***封装有框胶，所述阵列基板与所述框胶的端面形成有导电网点，所述金属导线阵列引出至与所述导电网点电连接，所述导电胶层将所述导电网点封装于其中。
  8. 根据权利要求3所述的液晶面板，其中，所述阵列基板端面与所述覆晶薄膜之间粘附有导电胶层，所述导电胶层与所述金属导线阵列电连接。
  9. 根据权利要求8所述的液晶面板，其中，所述彩膜基板与所述阵列基板之间的***封装有框胶，所述阵列基板与所述框胶的端面形成有导电网点，所述金属导线阵列引出至与所述导电网点电连接，所述导电胶层将所述导电网点封装于其中。
  10. 一种液晶面板的制作方法，其中，包括：
    切割母版，形成多个液晶盒；
    在各所述液晶盒设置有金属导线阵列的一端制作导电网点，使所述导电网点与所述金属导线阵列电连接；
    分别在所述液晶盒的上下表面贴附上偏光片、下偏光片；
    在所述液晶盒端面贴合带驱动芯片与电路板的覆晶薄膜，使所述覆晶薄膜与所述导电网点导通。
  11. 根据权利要求10所述的液晶面板的制作方法，其中，在各所述液晶盒设置有金属导线阵列的一端制作导电网点前还包括：对液晶盒设置有金属导线阵列的一端的端面打磨，以提高表面光洁度。
  12. 根据权利要求11所述的液晶面板的制作方法，其中，在各所述液晶盒设置有金属导线阵列的一端制作导电网点时，在打磨后的液晶盒端面喷印银胶，形成点状阵列，每一个银胶点与所述金属导线阵列的至少一条金属导线导通。
  13. 根据权利要求12所述的液晶面板的制作方法，其中，在所述液晶盒端面贴合带驱动芯片与电路板的覆晶薄膜时，先在所述覆晶薄膜与所述液晶盒设置有金属导线阵列的一端设置导电胶层，然后采用热压的方式使导电胶层贴合于所述液晶盒端面。
  14. 一种显示装置，其中，包括背光模组和液晶面板，所述液晶面板包括彩膜基板、阵列基板、设于所述彩膜基板与所述阵列基板之间的液晶、覆晶薄膜、设于所述覆晶薄膜上的驱动芯片与电路板，所述覆晶薄膜一端贴合于所述阵列基板端面，并与所述阵列基板内的金属导线阵列电连接，所述覆晶薄膜的另一端与所述电路板绑定，所述背光模组设于所述阵列基板所在侧。
  15. 根据权利要求14所述的显示装置，其中，所述阵列基板端面与所述覆晶薄膜之间粘附有导电胶层，所述导电胶层与所述金属导线阵列电连接。
  16. 根据权利要求15所述的显示装置，其中，所述彩膜基板与所述阵列基板之间的***封装有框胶，所述阵列基板与所述框胶的端面形成有导电网点，所述金属导线阵列引出至与所述导电网点电连接，所述导电胶层将所述导电网点封装于其中。
  17. 根据权利要求14所述的显示装置，其中，所述彩膜基板与所述阵列基 板贴合有所述覆晶薄膜的端面平齐，所述覆晶薄膜同时贴合于所述彩膜基板与所述阵列基板的端面。
  18. 根据权利要求17所述的显示装置，其中，所述阵列基板端面与所述覆晶薄膜之间粘附有导电胶层，所述导电胶层与所述金属导线阵列电连接，所述彩膜基板与所述阵列基板之间的***封装有框胶，所述阵列基板与所述框胶的端面形成有导电网点，所述金属导线阵列引出至与所述导电网点电连接，所述导电胶层将所述导电网点封装于其中。
  19. 根据权利要求14所述的显示装置，其中，在所述阵列基板上贴合有所述覆晶薄膜的一端，所述彩膜基板的端面伸出于所述阵列基板端面，并遮挡所述覆晶薄膜。
  20. 根据权利要求19所述的显示装置，其中，所述阵列基板端面与所述覆晶薄膜之间粘附有导电胶层，所述导电胶层与所述金属导线阵列电连接，所述彩膜基板与所述阵列基板之间的***封装有框胶，所述阵列基板与所述框胶的端面形成有导电网点，所述金属导线阵列引出至与所述导电网点电连接，所述导电胶层将所述导电网点封装于其中。
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