WO2019105021A1 - 独立驱动的薄膜分离机构 - Google Patents

独立驱动的薄膜分离机构 Download PDF

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Publication number
WO2019105021A1
WO2019105021A1 PCT/CN2018/092386 CN2018092386W WO2019105021A1 WO 2019105021 A1 WO2019105021 A1 WO 2019105021A1 CN 2018092386 W CN2018092386 W CN 2018092386W WO 2019105021 A1 WO2019105021 A1 WO 2019105021A1
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Prior art keywords
adsorption
membrane separation
separation mechanism
independently driven
mounting platform
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PCT/CN2018/092386
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English (en)
French (fr)
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魏民
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北京创昱科技有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
    • H01L31/1896—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]

Definitions

  • the present invention relates to the field of solar cell technologies, and in particular, to an independently driven thin film separation mechanism, and more particularly, to a proprietary wet etching process, an epitaxial lift-off system, which can be applied to a large-capacity machine.
  • an independently driven thin film separation mechanism and more particularly, to a proprietary wet etching process, an epitaxial lift-off system, which can be applied to a large-capacity machine.
  • multiple films can be separated from the substrate at one time, which can significantly improve the production efficiency and equipment utilization, while meeting the requirements of the process.
  • FIG. 1 a typical wet etching process is shown in FIG. 1.
  • a wafer loaded with a polymer film for example, a gallium arsenide wafer
  • the robot is used to transfer the bar to the process.
  • a wet etching process is performed in the chamber, and after the process is completed, the column is transferred to the unloading position to unload the etched film and the wafer, and then the separation mechanism is used to separate the film and the wafer, and finally the film and the wafer are respectively unloaded to The respective Kaseri.
  • an epitaxial lift-off system is usually used.
  • the epitaxial lift-off system is designed to separate a thin film (eg, a thin photovoltaic film) from a grown wafer (eg, a gallium arsenide substrate) that accepts a polymer film that is bonded to the wafer as an input and outputs a separate wafer (eg, arsenic) A gallium wafer) and a film (eg, a photovoltaic film) affixed to a polymer frame.
  • the separated film is used to prepare a thin film solar cell, and the separated wafer or substrate (for example, a gallium arsenide wafer) can be repeatedly used after being polished and cleaned, thereby significantly reducing the cost of thin film power generation.
  • the bottleneck of the whole equipment is how to quickly and reliably separate the film from the substrate.
  • each robot separates one film at a time; this method has a clear certainty that it occupies a large space, especially for the basket size of the transfer film and the substrate, and The coordination between multiple robots is also complicated;
  • the object of the present invention is to provide an independently driven membrane separation mechanism which can simultaneously separate a plurality of membranes and independently drive the separation of each membrane, thereby solving the problem that the conventional membrane separation device cannot achieve both large capacity and independent driving. Technical problem.
  • the present invention provides an independently driven membrane separation mechanism including a mounting platform, and one side of the mounting platform is provided with a plurality of first adsorption assemblies for respectively adsorbing the bottom surface of the wafer, each of the first adsorption The component corresponds to a wafer, and the mounting platform is provided with a plurality of second adsorption components for respectively adsorbing the film on the top surface of the wafer.
  • the first adsorption component and the second adsorption component are in one-to-one correspondence, and the adsorption direction is opposite, each of the first
  • the two adsorption components are all connected to a driving mechanism, and can be moved up and down under the driving of the driving mechanism, and each driving mechanism is independently disposed and disposed on the mounting platform.
  • each of the first adsorption assemblies are located on the same plane.
  • each of the first adsorption assemblies includes at least two vacuum suction cups, and two adjacent vacuum suction cups are disposed at intervals, and are respectively disposed on the same side of the installation platform by the mechanical arms.
  • the mechanical arm is a vacuum fork.
  • top surface of the robot arm is used to mount the first adsorption assembly, and the end of the mechanical arm is coupled to the mounting platform.
  • the first type is: the driving mechanism comprises a connecting rod, a bearing, a first rotating shaft and a motor with a second rotating shaft, the bearing is arranged on the mounting platform, the first rotating shaft passes through the bearing and is fixedly connected with the inner ring of the bearing, and one end of the connecting rod The second end of the first rotating shaft is sleeved on the first rotating shaft, and the first rotating shaft is sleeved with a first gear, and the second rotating shaft is sleeved with a second gear that meshes with the first gear.
  • each of the first rotating shafts is coaxial.
  • first rotating shaft is perpendicular to the connecting rod.
  • each second adsorption component is connected to the driving mechanism through a connecting rod, one end of the connecting rod is connected with the second adsorption component, the other end is fixedly sleeved on the periphery of the rotating shaft of the driving mechanism, and the connecting rod is driven by the driving mechanism The lower shaft rotates.
  • first adsorption assembly and the second adsorption assembly are vacuum suction cups, and the vacuum suction cup is connected to the vacuum generator through a hose.
  • the membrane separation mechanism further includes a slide rail, and the installation platform is slidably disposed on the slide rail.
  • the bottom of the mounting platform is provided with a sliding slot that cooperates with the sliding rail.
  • the membrane separation mechanism of the present invention wherein a first adsorption assembly and a second adsorption assembly are provided, each of the second adsorption assemblies being coupled to a drive mechanism and movable up and down by the drive mechanism.
  • the first adsorption assembly is first placed on the bottom surface of the wafer, the second adsorption assembly is placed on the surface of the film, and the second adsorption assembly is driven to move upward by the suction and drive mechanism of the first adsorption assembly and the second adsorption assembly, so that the film Gradually peel off the wafer.
  • the membrane separation mechanism can perform automatic separation of multiple films, which is convenient, quick, high in production efficiency and large in productivity. Moreover, since the respective driving mechanisms are independently disposed, the separation or repeated separation of each film can be performed independently without affecting each other. Therefore, the technical problem that the conventional thin film separation device can not achieve both large capacity and independent driving is solved.
  • the separation mechanism has high flexibility in film separation, and thus has strong application value and promotion significance in the field of solar cell preparation.
  • Each of the first adsorption assemblies of the present invention are located on the same plane, so that moving the installation platform at one time can simultaneously place each mechanical arm at the bottom of the wafer, thereby further improving work efficiency.
  • the driving mechanism of the invention drives the second adsorption component to rotate by using the rotating shaft, thereby further improving the automation degree of the work, and the structure is simple, the operation is convenient, and the installation and promotion are easy.
  • the slide rail provided by the invention can freely move the mounting platform and the driving mechanism over a wider range, so that the separating mechanism can separate the film in a larger range, and also facilitate the separation of the separated film and the wafer. Transportation and further cleaning, etc., further increase the degree of automation and save manpower.
  • FIG. 1 is a schematic view of a typical wet etching process
  • FIG. 2 is a schematic structural view of a film separation mechanism according to an embodiment of the present invention.
  • FIG. 3 is a schematic view showing a state after a film and a wafer are separated according to an embodiment of the present invention
  • FIG. 4 is a schematic view showing a state in which a separation failure film is separately processed according to an embodiment of the present invention.
  • a plurality means two or more unless otherwise stated.
  • the orientation or positional relationship of the terms “upper”, “lower”, “left”, “right”, “inside”, “outside”, “front end”, “back end”, “head”, “tail”, etc. is The orientation and the positional relationship shown in the drawings are merely for the convenience of the description of the invention and the simplification of the description, and are not intended to indicate or imply that the device or component referred to has a specific orientation, is constructed and operated in a specific orientation, and therefore cannot be understood. To limit the invention. Moreover, the terms “first”, “second”, “third”, and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; can be mechanical or electrical; can be directly connected or indirectly connected through an intermediate medium. The specific meanings of the above terms in the present invention can be understood by those skilled in the art as the case may be.
  • the embodiment provides an independently driven membrane separation mechanism, which comprises a mounting platform 7, and a side of the mounting platform 7 is provided with a plurality of first adsorption components for respectively adsorbing the bottom surface of the wafer. 2.
  • Each of the first adsorption assemblies 2 corresponds to one wafer
  • the mounting platform 7 is provided with a plurality of second adsorption assemblies 1 for respectively adsorbing the thin films on the top surface of the wafer, the first adsorption assembly 2 and the second adsorption assembly 1
  • each of the second adsorption assemblies 1 is connected to a driving mechanism, and can be moved up and down under the driving of the driving mechanism, and each driving mechanism is independently disposed and disposed on the mounting platform 7.
  • Each of the first adsorption assemblies 2 is located on the same plane.
  • Each of the first adsorption assemblies 2 includes two vacuum suction cups, and two adjacent vacuum suction cups are spaced apart from each other, and are respectively disposed on the same side of the mounting platform 7 through the vacuum forks 14; specifically, the vacuum suction cups are installed in the vacuum
  • the top surface of the fork piece 14 is connected to the mounting platform 7 at the end of the vacuum fork piece 14.
  • the driving mechanism comprises a connecting rod 11, a bearing 4, a first rotating shaft 3 and a motor 5 with a second rotating shaft 12, and the bearing 4 is arranged on the mounting platform 7, and the first rotating shaft 3 passes through the bearing 4 and is fixed to the inner ring of the bearing 4.
  • one end of the connecting rod 11 is connected to the second adsorption assembly 1 , and the other end is fixedly sleeved on the outer periphery of the first rotating shaft 3 .
  • the first rotating shaft 3 is sleeved with the first gear 8
  • the second rotating shaft 12 is sleeved with the first A second gear 13 meshed by a gear 8.
  • the first rotating shaft 3 is perpendicular to the connecting rod 11 and each of the first rotating shafts 3 is coaxial.
  • the second adsorption assembly 1 is the same as the first adsorption assembly 2, and is also a vacuum suction cup, and the vacuum suction cup is connected with a vacuum generator through a hose.
  • the membrane separation mechanism of this embodiment further includes a slide rail 6 on which the mounting platform 7 is slidably disposed. Specifically, the bottom of the mounting platform 7 is provided with a sliding slot that cooperates with the sliding rail 6.
  • the film separation mechanism of the embodiment has two or more films that can be processed at a time, and specifically needs to be consistent with the number of columns in the column, so that the solar film substrate after one layer of the process can be unloaded at a time.
  • the driving method of the separating mechanism is not limited to the motor 5, and other methods such as a worm gear or a rotary cylinder may be used.
  • each motor 5 drives a respective second shaft 12 to rotate, and the second shaft 12 drives the first shaft 3 to rotate by gear engagement, thereby sequentially driving the connecting rod 11 and
  • the second adsorption assembly 1 rotates up and down, and maintains the second adsorption assembly 1 at a certain angle (for example, 10°) with the first adsorption assembly 2; the entire installation platform 7 moves along the slide rail 6 to the unloading position bar (not shown)
  • the vacuum fork 14 is inserted into the bottom of the wafer so that the first adsorption assembly 2 adsorbs the wafer; the second rotating shaft 12 continues to rotate, and the second adsorption assembly 1 is further moved downward until the second adsorption assembly 1 is pressed.
  • the vacuum adsorption function of the first adsorption assembly 2 and the second adsorption assembly 1 is activated; the entire installation platform 7 continues to move along the slide rail 6, and the processed film wafer is taken out from the fence. Moving to the separation position for film separation; since the first adsorption assembly 2 adsorbs the bottom surface of the wafer, the second adsorption assembly 1 adsorbs the surface of the film, and the adsorption direction of the first adsorption assembly 2 and the second adsorption assembly 1 is opposite.
  • the motor 5 drives the second rotating shaft 12 to rotate in the opposite direction, and finally drives the connecting rod 11 and the second adsorption assembly 1 to reverse, thereby gradually peeling off the film from the top surface of the wafer, and finally the separating mechanism successfully realizes the film 10 and the wafer 9. Separation, as shown in Figure 3.
  • the separation operation can be repeated 2 to 3 times according to the process or actual conditions.
  • deionized water is required, specific protection is required for the motor 5 and the gear portion, such as adding a shield directly above it.
  • the membrane separation mechanism of the present embodiment is provided with a first adsorption assembly and a second adsorption assembly, each of which is connected to a drive mechanism and can be moved up and down under the driving of the drive mechanism.
  • the first adsorption assembly is first placed on the bottom surface of the wafer, the second adsorption assembly is placed on the surface of the film, and the second adsorption assembly is driven to move upward by the suction and drive mechanism of the first adsorption assembly and the second adsorption assembly, so that the film Gradually peel off the wafer.
  • the membrane separation mechanism can perform automatic separation of multiple films, which is convenient, quick, high in production efficiency and large in productivity. Moreover, since the respective driving mechanisms are independently disposed, the separation or repeated separation of each film can be performed independently without affecting each other. Therefore, the technical problem that the conventional thin film separation device can not achieve both large capacity and independent driving is solved.
  • the separation mechanism has high flexibility in film separation, and thus has strong application value and promotion significance in the field of solar cell preparation.
  • Each of the first adsorption assemblies of the embodiment is located on the same plane, so that moving the installation platform at one time can simultaneously place each mechanical arm at the bottom of the wafer, thereby further improving work efficiency.
  • the driving mechanism of the embodiment drives the second adsorption component to rotate by using the rotating shaft, thereby further improving the automation degree of the work, and the structure is simple, the operation is convenient, and the installation and promotion are easy.
  • the slide rail provided in this embodiment can freely move the mounting platform and the driving mechanism over a wider range, so that the separating mechanism can separate the film in a larger range, and also facilitate the transportation of the separated film and the wafer. And the next step of cleaning and the like, thereby further increasing the degree of automation and saving manpower.
  • the thin film separating mechanism of the embodiment integrates a plurality of separate separating mechanisms, and successfully realizes automatic separation of the film and the wafer (for example, a gallium arsenide solar substrate), which is convenient and quick, and improves the productivity;
  • the separation mechanism corresponding to each film has an independent driving mechanism, so that the separation failure film can be separately separated and processed according to the process requirements, and the number of times of processing the separation failure film can be arbitrarily set, thereby improving the film separation. Flexibility and fault tolerance.
  • the membrane separation mechanism has a simple structure, is easy to operate and maintain, is easy to popularize, has low cost, and is easy to implement.

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Abstract

一种独立驱动的薄膜分离机构。该分离机构包括安装平台，安装平台的一侧设有多个用于分别吸附晶片底面的第一吸附组件，每个第一吸附组件对应于一个晶片，安装平台上设有多个用于分别吸附位于晶片顶面的薄膜的第二吸附组件，第一吸附组件和第二吸附组件一一对应，且吸附方向相反，每个第二吸附组件均连接一个驱动机构，且可在驱动机构的驱动下进行上下移动，各个驱动机构独立设置且均设于安装平台上。

Description

独立驱动的薄膜分离机构 技术领域
本发明涉及太阳能电池技术领域，尤其涉及一种独立驱动的薄膜分离机构，更具体地，是可应用于一种专有的湿法刻蚀工艺——外延剥离***中，可应用于大产能机台上，并可一次独立地将多片薄膜从衬底分离，在显著提高生产效率和设备利用率的同时，又能满足工艺的要求。
背景技术
目前，典型的湿法刻蚀工艺过程如图1所示，首先将装载带有聚合物薄膜的晶片(例如砷化镓晶片)放到特制的栏具内，然后使用机械手将栏具传输到工艺腔室内进行湿法刻蚀工艺，待工艺完成后再将栏具传输到卸载位以卸载刻蚀后的薄膜与晶片，随后使用分离机构对薄膜和晶片进行分离，最后将薄膜和晶片分别卸载至各自的卡塞里。
上述的薄膜与晶片分离环节，通常会用到外延剥离***。外延剥离***旨在将薄膜(例如薄的光伏膜)与生长的晶片(例如砷化镓基板)分离，该***以贴合在晶片上的聚合物薄膜作为输入，并输出单独的晶片(例如砷化镓晶片)和粘贴到聚合物框架上的薄膜(例如光伏膜)。分离出的薄膜用于制备薄膜太阳能电池，分离出的晶片或衬底(例如砷化镓晶片)经过抛光和清洗后可重复使用多次，从而显著降低薄膜发电的成本。
以砷化镓太阳能电池生产线中的外延剥离设备为例，整个设备的瓶颈是如何快速可靠的完成薄膜与衬底的分离，为了获得较大产能，一般而言，主要有如下几种方法：
(1)使用两套或多套分离机械手，每个机械手一次分离一片薄膜；此方法有个明显确定就是占地空间大，尤其是对于转载薄膜与衬底的 篮具尺寸要求较高，另外，多个机械手间的协调工作也比较复杂；
(2)一次卸载和分离多片薄膜，一般地会由一套分离驱动装置提供动力，从而同时分离多片薄膜。针对此方法，一个明显的缺点是：当分离过程中，出现有一片或若干片分离失败的情况时，整个***的灵活性和容错性不高。具体地讲，如果工艺要求在第一次分离失败时，需要重试2～3次，那么对于已分离的薄膜和基板就会重复接触，而按照砷化镓薄膜的制作工艺，是应该尽可能避免此类情况的发生。
因此设计一台既可以实现大产能又是独立驱动的自动化薄膜分离机构就显得很有必要。
发明内容
(一)要解决的技术问题
本发明的目的是提供一种独立驱动的薄膜分离机构，其既可同时分离多片薄膜，又能独立驱动每片薄膜的分离，从而解决传统薄膜分离设备不能兼具实现大产能又能独立驱动的技术问题。
(二)技术方案
为了解决上述技术问题，本发明提供了一种独立驱动的薄膜分离机构，其包括安装平台，安装平台的一侧设有多个用于分别吸附晶片底面的第一吸附组件，每个第一吸附组件对应于一个晶片，安装平台上设有多个用于分别吸附位于晶片顶面的薄膜的第二吸附组件，第一吸附组件和第二吸附组件一一对应，且吸附方向相反，每个第二吸附组件均连接一个驱动机构，且可在驱动机构的驱动下进行上下移动，各个驱动机构独立设置且均设于安装平台上。
进一步地，各个第一吸附组件均位于同一平面上。
进一步地，各个第一吸附组件至少包括两个真空吸盘，相邻两个真空吸盘间隔设置，且分别通过机械臂设于安装平台的同一侧。优选地，机械臂为真空叉片。
进一步地，机械臂的顶面用于安装第一吸附组件，机械臂的端部 与安装平台连接。
驱动机构的设置有两种方案：
第一种是：驱动机构包括连接杆、轴承、第一转轴和带有第二转轴的电机，轴承设于安装平台上，第一转轴穿过轴承并与轴承的内圈固定连接，连接杆一端与第二吸附组件连接，另一端固定套接于第一转轴的***，第一转轴上套接有第一齿轮，第二转轴上套接有与第一齿轮啮合的第二齿轮。
进一步地，各个第一转轴均同轴。
进一步地，第一转轴与连接杆垂直。
第二种是：每个第二吸附组件均通过连接杆与驱动机构连接，连接杆一端与第二吸附组件连接，另一端固定套接于驱动机构的转轴***，且连接杆在驱动机构的驱动下绕转轴进行转动。
进一步地，第一吸附组件和第二吸附组件均为真空吸盘，真空吸盘通过软管连接有真空发生器。
进一步地，薄膜分离机构还包括滑轨，安装平台可滑动地设于滑轨上。优选地，安装平台底部设有与滑轨配合滑动的滑槽。
(三)有益效果
本发明的上述技术方案具有以下有益效果：
1、本发明的薄膜分离机构，设置了第一吸附组件和第二吸附组件，每个第二吸附组件均连接一个驱动机构，且可在驱动机构的驱动下进行上下移动。使用时，先将第一吸附组件置于晶片底面，将第二吸附组件置于薄膜表面，利用第一吸附组件和第二吸附组件相反的吸力和驱动机构驱动第二吸附组件向上移动，使得薄膜逐渐从晶片上撕离。由于第一吸附组件和第二吸附组件为多组，因而该薄膜分离机构可进行多片薄膜的自动化分离，方便快捷，生产效率高，产能大。又由于各个驱动机构独立设置，使得每片薄膜的分离或重复分离可独立进行，彼此互不影响。因而解决了传统薄膜分离设备不能兼具实现大产能又能独立驱动的技术问题。该分离机构在进行薄膜分离时灵活性 高，因而在太阳能电池制备领域具有很强的应用价值和推广意义。
2、本发明的各个第一吸附组件均位于同一平面上，因而移动一次安装平台可同时将各个机械臂同时置于晶片底部，从而进一步提高了工作效率。
3、本发明的驱动机构利用转轴驱动第二吸附组件转动，进一步提高了工作的自动化程度，而且结构简单，操作方便，易于安装和推广。
4、本发明设置的滑轨，可使安装平台和驱动机构在更大范围内自由移动，从而使得该分离机构可对更大范围内的薄膜进行分离，也便于对分离后的薄膜和晶片进行运输和进行下一步的清洗等处理，从而进一步提高了自动化程度，节省了人力。
附图说明
图1为目前典型的湿法刻蚀工艺过程示意图；
图2为本发明实施例的薄膜分离机构的结构示意图；
图3为本发明实施例的薄膜与晶片分离后的状态示意图；
图4为本发明实施例的单独处理分离失败薄膜的状态示意图。
其中，1、第二吸附组件；2、第一吸附组件；3、第一转轴；4、轴承；5、电机；6、滑轨；7、安装平台；8、第一齿轮；9、分离后的晶片；10、分离后的薄膜；11、连接杆；12、第二转轴；13、第二齿轮；14、真空叉片；A、代表对分离失败的薄膜重新分离。
具体实施方式
下面结合附图和实施例对本发明的实施方式作进一步详细描述。以下实施例用于说明本发明，但不能用来限制本发明的范围。
在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。术语“上”、“下”、“左”、“右”、“内”、“外”、“前端”、“后端”、“头部”、“尾部”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有 特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”、“第三”等仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以视具体情况理解上述术语在本发明中的具体含义。
如图2至图4所示，本实施例提供了一种独立驱动的薄膜分离机构，其包括安装平台7，安装平台7的一侧设有多个用于分别吸附晶片底面的第一吸附组件2，每个第一吸附组件2对应于一个晶片，安装平台7上设有多个用于分别吸附位于晶片顶面的薄膜的第二吸附组件1，第一吸附组件2和第二吸附组件1一一对应，且吸附方向相反，每个第二吸附组件1均连接一个驱动机构，且可在驱动机构的驱动下进行上下移动，各个驱动机构独立设置且均设于安装平台7上。
各个第一吸附组件2均位于同一平面上。各个第一吸附组件2均包括两个真空吸盘，相邻两个所述真空吸盘间隔设置，且分别通过真空叉片14设于安装平台7的同一侧；具体的，所述真空吸盘安装于真空叉片14的顶面，真空叉片14的端部与安装平台7连接。
驱动机构包括连接杆11、轴承4、第一转轴3和带有第二转轴12的电机5，轴承4设于安装平台7上，第一转轴3穿过轴承4并与轴承4的内圈固定连接，连接杆11一端与第二吸附组件1连接，另一端固定套接于第一转轴3的***，第一转轴3上套接有第一齿轮8，第二转轴12上套接有与第一齿轮8啮合的第二齿轮13。本实施例中，第一转轴3与连接杆11垂直，且各个第一转轴3均同轴。
本实施例中，第二吸附组件1同第一吸附组件2一样，同样为真空吸盘，且真空吸盘通过软管连接有真空发生器。本实施例的薄膜分离机构还包括滑轨6，安装平台7可滑动地设于滑轨6上。具体地，安 装平台7底部设有与滑轨6配合滑动的滑槽。
另外，本实施例的薄膜分离机构，其每次可处理的薄膜数量是两个以上，具体地需要和栏具中的列数一致，这样可以保证一次卸载一层工艺后的太阳能薄膜基板。而对于分离机构的驱动方式，并不局限于电机5，也可使用例如蜗轮蜗杆或旋转气缸等其他方式。
本实施例的独立驱动的薄膜分离机构的工作过程如下：每个电机5分别驱动各自的第二转轴12旋转，第二转轴12通过齿轮啮合带动第一转轴3转动，从而依次带动连接杆11和第二吸附组件1上下转动，并使第二吸附组件1与第一吸附组件2保持一定的角度(如10°)；整个安装平台7沿滑轨6移动至卸载位栏具(图中未示出)内，将真空叉片14***晶片底部，以便第一吸附组件2吸附晶片；第二转轴12继续旋转，并带动第二吸附组件1继续向下移动，直至第二吸附组件1压紧工艺后的薄膜，并打开真空发生器，启动第一吸附组件2和第二吸附组件1的真空吸附功能；整个安装平台7继续沿滑轨6移动，将工艺后的薄膜晶片从栏具内取出，运动至分离位以进行薄膜分离；由于第一吸附组件2吸附晶片底面，第二吸附组件1吸附薄膜表面，第一吸附组件2和第二吸附组件1的吸附方向相反，电机5驱动第二转轴12反向旋转，最终依次带动连接杆11和第二吸附组件1反转，因而使得薄膜逐渐从晶片顶面撕离，最终该分离机构成功实现了薄膜10与晶片9的分离，如图3所示。
在分离过程中，当其中一片薄膜出现分离失败时，如图4所示左边第二片未成功分离，则可在程序中设定单独去分离第二片，如图4中的A部所示，可根据工艺或实际情况重复分离动作2～3次。在分离过程中，如果需要使用去离子水，则需要对电机5和齿轮部分进行特定的防护，比如在其正上方增设护板等。
由上可知，本实施例的薄膜分离机构，设置了第一吸附组件和第二吸附组件，每个第二吸附组件均连接一个驱动机构，且可在驱动机构的驱动下进行上下移动。使用时，先将第一吸附组件置于晶片底 面，将第二吸附组件置于薄膜表面，利用第一吸附组件和第二吸附组件相反的吸力和驱动机构驱动第二吸附组件向上移动，使得薄膜逐渐从晶片上撕离。由于第一吸附组件和第二吸附组件为多组，因而该薄膜分离机构可进行多片薄膜的自动化分离，方便快捷，生产效率高，产能大。又由于各个驱动机构独立设置，使得每片薄膜的分离或重复分离可独立进行，彼此互不影响。因而解决了传统薄膜分离设备不能兼具实现大产能又能独立驱动的技术问题。该分离机构在进行薄膜分离时灵活性高，因而在太阳能电池制备领域具有很强的应用价值和推广意义。
本实施例的各个第一吸附组件均位于同一平面上，因而移动一次安装平台可同时将各个机械臂同时置于晶片底部，从而进一步提高了工作效率。本实施例的驱动机构利用转轴驱动第二吸附组件转动，进一步提高了工作的自动化程度，而且结构简单，操作方便，易于安装和推广。本实施例设置的滑轨，可使安装平台和驱动机构在更大范围内自由移动，从而使得该分离机构可对更大范围内的薄膜进行分离，也便于对分离后的薄膜和晶片进行运输和进行下一步的清洗等处理，从而进一步提高了自动化程度，节省了人力。
综上所述，本实施例的薄膜分离机构，将多个单独的分离机构集成到一起，成功实现了薄膜与晶片(例如砷化镓太阳能基板)的自动化分离，方便快捷，提高了产能；并且对应每片薄膜的分离机构都有独立的驱动机构，从而可根据工艺需要，对分离失败的薄膜进行单独重复分离和处理，且可任意设定对分离失败薄膜的处理次数，进而提高了薄膜分离的灵活性和容错性。而且该薄膜分离机构结构简单，易于操作和维护，便于推广，成本低，易于实现。
本发明的实施例是为了示例和描述而给出的，而并不是无遗漏的或者将本发明限于所公开的形式。很多修改和变化对于本领域的普通技术人员而言是显而易见的。选择和描述实施例是为了更好说明本发明的原理和实际应用，并且使本领域的普通技术人员能够理解本发明 从而设计适于特定用途的带有各种修改的各种实施例。

Claims (10)

  1. 一种独立驱动的薄膜分离机构，其特征在于，包括安装平台(7)，所述安装平台(7)的一侧设有多个用于分别吸附晶片底面的第一吸附组件(2)，每个所述第一吸附组件(2)对应于一个所述晶片，所述安装平台(7)上设有多个用于分别吸附位于所述晶片顶面的薄膜的第二吸附组件(1)，所述第一吸附组件(2)和第二吸附组件(1)一一对应，且吸附方向相反，每个所述第二吸附组件(1)均连接一个驱动机构，且可在所述驱动机构的驱动下进行上下移动，各个所述驱动机构独立设置且均设于所述安装平台(7)上。
  2. 根据权利要求1所述的独立驱动的薄膜分离机构，其特征在于，各个所述第一吸附组件(2)均位于同一平面上。
  3. 根据权利要求2所述的独立驱动的薄膜分离机构，其特征在于，各个所述第一吸附组件(2)至少包括两个真空吸盘，相邻两个所述真空吸盘间隔设置，且分别通过机械臂设于安装平台(7)的同一侧。
  4. 根据权利要求3所述的独立驱动的薄膜分离机构，其特征在于，所述机械臂的顶面用于安装所述第一吸附组件(2)，所述机械臂的端部与所述安装平台(7)连接。
  5. 根据权利要求1至4中任一项所述的独立驱动的薄膜分离机构，其特征在于，所述驱动机构包括连接杆(11)、轴承(4)、第一转轴(3)和带有第二转轴(12)的电机(5)，所述轴承(4)设于所述安装平台(7)上，所述第一转轴(3)穿过所述轴承(4)并与所述轴承(4)的内圈固定连接，所述连接杆(11)一端与所述第二吸附组件(1)连接，另一端固定套接于所述第一转轴(3)的***，所述第一转轴(3)上套接有第一齿轮(8)，所述第二转轴(12)上套接有与所述第一齿轮(8)啮合的第二齿轮(13)。
  6. 根据权利要求5所述的独立驱动的薄膜分离机构，其特征在于，各个所述第一转轴(3)均同轴。
  7. 根据权利要求5所述的独立驱动的薄膜分离机构，其特征在于，所述第一转轴(3)与所述连接杆(11)垂直。
  8. 根据权利要求1至4中任一项所述的独立驱动的薄膜分离机构，其特征在于，每个所述第二吸附组件(1)均通过连接杆(11)与所述驱动机构连接，所述连接杆(11)一端与所述第二吸附组件(1)连接，另一端固定套接于所述驱动机构的转轴***，且所述连接杆(11)在所述驱动机构的驱动下绕所述转轴进行转动。
  9. 根据权利要求1所述的独立驱动的薄膜分离机构，其特征在于，所述第一吸附组件(2)和第二吸附组件(1)均为真空吸盘，所述真空吸盘通过软管连接有真空发生器。
  10. 根据权利要求1所述的独立驱动的薄膜分离机构，其特征在于，还包括滑轨(6)，所述安装平台(7)可滑动地设于所述滑轨(6)上。
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