WO2019085529A1 - 具有内置元器件的芯板的制作方法及电路板的制作方法 - Google Patents

具有内置元器件的芯板的制作方法及电路板的制作方法 Download PDF

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Publication number
WO2019085529A1
WO2019085529A1 PCT/CN2018/093623 CN2018093623W WO2019085529A1 WO 2019085529 A1 WO2019085529 A1 WO 2019085529A1 CN 2018093623 W CN2018093623 W CN 2018093623W WO 2019085529 A1 WO2019085529 A1 WO 2019085529A1
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Prior art keywords
board
built
core
manufacturing
component
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PCT/CN2018/093623
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English (en)
French (fr)
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林楚涛
李冲
李志东
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广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
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Publication of WO2019085529A1 publication Critical patent/WO2019085529A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to the field of circuit board technology, and in particular, to a method for fabricating a core board having built-in components and a method of fabricating the same.
  • the surface area of traditional rigid-flex board has been unable to meet the needs of component placement.
  • the electronic components need to be transferred from the surface of the board to the inside, and the board is embedded in the built-in form to form part of the board.
  • the electronic component is buried in the circuit board by pressing.
  • the acid-base syrup used in the browning process before the pressing will corrode the damaged electronic components and their solder joints, thus affecting the product quality of the circuit board.
  • the present invention overcomes the defects of the prior art, and provides a method for manufacturing a core board with built-in components and a method for manufacturing the circuit board, thereby solving the corrosion of the electronic components and their solder joints in the browning treatment. problem.
  • a manufacturing method of a core board with built-in components comprising S110: performing circuit fabrication on the core board; S120: mounting the components to be built on the core board correspondingly; S130: having a connection with the component The protective film of the window is covered on the core board, and the film thickness of the protective film used is larger than the height of the solder joint of the component; S140: filling the window of the protective film with resin powder, and vitrifying the resin powder to cover the element Wiring pins and solder joints of the device; S150: Remove the protective film to obtain a core board with built-in components.
  • the method for manufacturing the core plate having the built-in component, the built-in component is mounted and soldered on the core board, and the through window on the protective film is used to form a space having a height greater than the height of the solder joint of the component, and the space is filled with the resin powder and The resin powder is vitrified, and the protective film is taken out to obtain a core plate having built-in components.
  • the use of the inner wall of the through window on the protective film and the surface of the core plate effectively limits the position of the resin powder, so that the vitrified resin powder is effectively covered on the terminals and the solder joints of the component.
  • the connection stability between the components and the core board is effectively protected.
  • the resin powder in S140, is vitrified in a vacuum environment. During the vitrification of the resin powder, the resin powder melts first and then crystallizes and solidifies after it is melted. Since the process is treated in a vacuum, the air between the resin powders moves to the outside of the resin powder due to low atmospheric pressure. Thus, the bubbles in the resin after melting are further discharged, and the yield of the product is improved.
  • the protective film comprises a silica gel layer and a polyurethane layer for bonding the polyurethane layer to the core plate.
  • the silicone layer is sticky and easy to assemble and disassemble.
  • the polyurethane layer is not sticky and is convenient for resin powder processing.
  • the inner wall of the through window on the protective film and the one side of the component are spaced apart by 0.5 mm to 2 mm.
  • the fluidity of the resin during the vitrification process can be ensured, thereby ensuring that the resin can fill the through window.
  • a wire mesh is applied to the solder on the core board.
  • the solder can be applied to the plurality of places at the same time by using the solder on the core board.
  • the resin powder is subjected to a baking treatment at a temperature higher than a glass transition temperature of the resin powder. This method can ensure that the resin powder can be completely vitrified, and the processing quality of the product is ensured.
  • a manufacturing method of a circuit board comprising: S100: manufacturing a core board having built-in components by using the core board having the built-in components; S200: providing a prepreg and a daughter board; and S300: performing a sub-board and a core board Browning treatment; S400: stacking and splicing the core board, prepreg and daughter board with built-in components, and obtaining the mother board; S500: drilling, sinking, plating, wiring, soldering and surface treatment of the mother board to obtain a circuit board.
  • the browning treatment requires browning of each core board by using a syrup containing an acid and a base, and in the browning treatment of the core board, the vitrified resin powder protects the component wiring.
  • the feet and solder joints are not corroded, thus ensuring the reliability of component connections on the core.
  • the prepreg comprises a first prepreg that mates with the core panel and a second prepreg that mates with the daughterboard, and a semi-cured through window that mates with the side of the built-in component is formed on the first prepreg.
  • the second prepreg away from the component during pressing can buffer the core plate against the components on the core board by melting, thereby protecting the components.
  • the resin powder and the prepreg are made of the same resin material.
  • the resin powder and the prepreg are made of the same resin, and the cured resin powder and the prepreg have a uniform expansion coefficient.
  • the difference in expansion coefficient does not occur, and the problem of bursting of the circuit board is avoided.
  • the inner wall of the prepreg through window has a one-side spacing from the component of from 0.3 mm to 0.8 mm. In this way, while ensuring the fluidity of the resin, the impact of the flowing resin on the capacitor from the side during the pressing can be reduced.
  • FIG. 1 is a flow chart showing a method of fabricating a core board having built-in components according to an embodiment of the present invention
  • FIG. 2 is a schematic view showing the manufacture of an outer core plate having built-in components in a rigid-flex board according to an embodiment of the invention
  • FIG. 3 is a schematic diagram of a method for fabricating a circuit board according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing the manufacturing method of the rigid-flex plate according to the embodiment of the present invention.
  • a method for manufacturing a core board with built-in components includes: S110: performing circuit fabrication on the core board 100; S120: soldering the component 120 to be built in place to the core board 100; S130: The protective film 130 having the through window 131 matched with the component 120 is overlaid on the core board 100, and the film thickness of the protective film 130 used is greater than the solder joint height of the component 120; S140: the through window 131 of the protective film 130 The resin powder 140 is internally filled, and the resin powder 140 is vitrified to cover the terminals and solder joints of the component 120. S150: The protective film 130 is removed to obtain the core 100 having the built-in component 120.
  • the built-in component 120 is mounted on the core plate 100, and the through window 131 on the protective film 130 is used to form a space having a height greater than the height of the solder joint of the component 120, and is filled in the space.
  • the resin powder 140 is subjected to vitrification treatment of the resin powder 140, and the protective film 130 is taken out to obtain a core plate 100 having the built-in component 120.
  • the position of the resin powder 140 is effectively restricted, so that the vitrified resin powder 140 effectively covers the terminals and solder joints of the component 120. on.
  • the core board 100 having the built-in component 120 is subjected to the browning treatment, the connection stability of the component 120 and the core board 100 is effectively protected.
  • the core board 100 is pressed and fabricated into a circuit board, the problem that the prepreg resin flow is pressed against the component 120 under pressure to cause the component 120 to be damaged.
  • the powder will melt into a fluid, and the fluid will be filled in the bottom of the component 120, thus avoiding the problem that the core plate 100 is burst due to excessive expansion due to local expansion after being heated.
  • the resin powder 140 is vitrified in a vacuum environment. During the vitrification process of the resin powder 140, the resin powder 140 is first melted and crystallized and solidified after it is melted. Since the process is processed in a vacuum, the air between the resin powders 140 moves toward the outside air pressure. In addition to the resin powder 140, the bubbles in the resin after the melting are further discharged, and the yield of the product is improved.
  • the protective film 130 includes a silica gel layer and a polyurethane layer for bonding the polyurethane layer to the core plate 100.
  • the silicone layer is sticky and easy to assemble and disassemble.
  • the polyurethane layer is not sticky and is convenient for the treatment of the resin powder 140.
  • a distance between the inner wall of the through window 131 and the one side of the component 120 on the protective film 130 is 0.5 mm to 2 mm.
  • the inner wall of the through window 131 and the one side of the component 120 are spaced apart from each other by 0.5 mm to 2 mm, the fluidity of the resin during the vitrification process can be ensured, thereby ensuring that the resin can fill the through window 131.
  • the solder on the core board 100 is applied to the screen.
  • the solder can be applied to the plurality of places at the same time by using the solder on the core board 100.
  • the resin powder 140 is baked at a temperature higher than the glass transition temperature of the resin powder 140. This method can ensure that the resin powder 140 can be completely vitrified, and the processing quality of the product is ensured.
  • the component 120 described above may be any one or more of a resistor, a capacitor, an inductor, a diode, a transistor, and the like.
  • the present embodiment is described by taking a core board 100 having a built-in component 120 in a bonding board as an example.
  • the specific method is as follows:
  • the core board 100 is circuit-made.
  • solder is applied to the core board 100 by a wire mesh so that the core board 100 has the solder 110 for soldering.
  • S130' The protective film 130 having the through window 131 mated with the component 120 is overlaid on the core board 100, and the thickness of the protective film 130 used is larger than the solder joint height of the component 120.
  • the depth of the through window 131 on the protective film 130 is 50 ⁇ m higher than the capacitance solder joint; the inner wall of the through window 131 on the protective film 130 is spaced from the one side of the component 120 by 0.5 mm to 2 mm.
  • the resin powder 140 is filled into the through window 131 of the protective film 130, and the resin powder 140 is vitrified.
  • the resin powder 140 is vitrified in a vacuum atmosphere, and the resin powder 140 is baked at a temperature higher than the glass transition temperature of the resin powder 140. Specifically, the resin powder 140 may be baked at a temperature higher than the transition temperature by 10 ° C.
  • the embodiment further provides a method for manufacturing a circuit board, comprising: S100: fabricating a core board 100 having a built-in component 120 by using the core board having the built-in component; S200: providing a prepreg and a sub-substrate a plate; S300: browning the daughter board and the core board 100; S400: sequentially stacking and bonding the core board 100, the prepreg and the daughter board having the built-in component 120 to obtain the mother board; S500: drilling and sinking the mother board Copper, plating, wiring, solder masking and surface treatment to obtain a circuit board.
  • the daughter board and the core board 100 are etched by using a syrup containing an acid and a base during the browning treatment, and in the browning process of the core board 100, the vitrified resin powder 140 protects the components.
  • the 120 pin and solder joint are not corroded, thereby ensuring the reliability of the connection of the component 120 on the core 100.
  • the prepreg comprises a first prepreg that is mated with the core 100 and a second prepreg that is mated with the sub-board, and a semi-cured through window that is mated with the side of the built-in component 120 is formed on the first prepreg.
  • the second prepreg away from the component 120 during pressing can buffer the pressure of the component 120 on the component 120 of the core 100 by melting, thereby protecting the component 120.
  • the first prepreg may be a plurality of sheets stacked in sequence
  • the second prepreg may be a plurality of sheets stacked in sequence.
  • the resin powder 140 and the prepreg are made of the same resin material.
  • the resin powder 140 and the prepreg are made of the same resin, and the cured resin powder 140 and the prepreg have a uniform expansion coefficient, so that in the process of the component 120 working and heating, the expansion coefficient difference does not occur, and the problem of the board bursting is avoided. .
  • the inner wall of the prepreg through window 201a is spaced from the one side of the component 120 by a distance of 0.3 mm to 0.8 mm. This can reduce the impact of the flowing resin on the capacitor from the side in the press.
  • a method of fabricating a rigid-flex plate is described based on the core plate 100 having the built-in component 120 as a raw material.
  • the foregoing core plate 100 corresponds to the first outer core plate 100a in the rigid flexible bonding plate
  • the sub-plate corresponds to the flexible core plate 300a in the rigid flexible bonding plate
  • the prepreg corresponds to the first prepreg 200a in the rigid flexible bonding plate.
  • S200' The first prepreg 200a, the flexible core 300a, the second prepreg 400a, and the second outer core 500a are provided.
  • S300' The first outer core plate 100a, the flexible core plate 300a, and the second outer core plate 500a are subjected to a browning treatment.
  • S400' The first outer core plate 100a, the first prepreg 200a, the flexible core plate 300a, the second prepreg 400a, and the second outer core plate 500a are sequentially stacked and pressed to obtain a rigid-flex bonded plate mother plate.
  • the first prepreg 200a is three sheets, wherein two prepregs adjacent to the side of the first outer core sheet 100a constitute a first prepreg, and the first prepreg is provided with components. 120 mating prepreg through window 201a.
  • the resin powder 140 is made of the same resin as the first prepreg 200a.
  • the distance between the inner wall of the prepreg through window 201a and the one side of the component 120 is 0.3 mm to 0.8 mm, which can reduce the impact of the resin on the capacitor from the side in the press.
  • S500' Drilling, immersing copper, plating, wiring, soldering, opening, and surface treatment of the rigid-flex board together to obtain a rigid-flex board.

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  • Manufacturing & Machinery (AREA)
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Abstract

本发明涉及一种具有内置元器件的芯板的制作方法，包括：S110：对芯板进行电路制作；S120：将待内置的元器件对应贴装焊接在芯板上；S130：将具有与元器件配合的通窗的保护膜覆盖在芯板上，使用的所述保护膜的膜厚大于元器件焊点高度；S140：向保护膜的通窗内填充树脂粉末，对树脂粉末进行玻璃化处理，以覆盖元器件的接线脚和焊点；S150：去除保护膜，获得具有内置元器件的芯板，来解决棕化处理中药水对电子元器件及其焊点的腐蚀问题。

Description

具有内置元器件的芯板的制作方法及电路板的制作方法 技术领域
本发明涉及电路板技术领域，特别是涉及一种具有内置元器件的芯板的制作方法及电路板的制作方法。
背景技术
随着电子产品向高集成化、多功能化的方向发展，传统刚挠结合板表面面积已无法满足元件贴装的需求。电子元件需要从电路板的表面转移至内部，通过内置的形式嵌入电路板成为电路板的一部分。一般在电子元件完成焊接后，通过压合的方式将电子元件埋入电路板中。但由于压合前棕化处理采用的酸碱的药水会腐蚀损伤电子元器件及其焊点，如此影响了电路板的产品质量。
发明内容
基于此，本发明在于克服现有技术的缺陷，提供一种具有内置元器件的芯板的制作方法及电路板的制作方法，来解决棕化处理中药水对电子元器件及其焊点的腐蚀问题。
一种具有内置元器件的芯板的制作方法，包括S110：对芯板进行电路制作；S120：将待内置的元器件对应贴装焊接在芯板上；S130：将具有与元器件配合的通窗的保护膜覆盖在芯板上，使用的所述保护膜的膜厚大于元器件焊点高度；S140：向保护膜的通窗内填充树脂粉末，对树脂粉末进行玻璃化处理，以覆盖元器件的接线脚和焊点；S150：去除保护膜，获得具有内置元器件的芯板。
上述具有内置元器件的芯板的制作方法，内置元器件贴装、焊接在芯板上，利用保护膜上的通窗构成高度大于元器件焊点高度的空间，在空间内填充树脂粉末并对树脂粉末进行玻璃化处理，取出保护膜后获得具有内置元器件的芯板。利用保护膜上的通窗的内壁与芯板板面的配合，有效地限制了树脂粉末的位置，使玻璃化的树脂粉末有效地覆盖在元器件的接线脚和焊点上。如此在对具有内置元器件的芯板进行棕化处理时有效地保护了元器件与芯板的连接稳固性。避 免了在采用芯板压合制作电路板时，在压力作用下半固化片树脂流动对元器件产生挤压以致元器件受损的问题。并且在树脂粉末玻璃化处理的过程中，粉末会融化成流体，流体会填充在元器件的底部，如此避免了芯板在受热后由于局部膨胀过大，导致电路板爆裂的问题。
在其中一个实施例中，S140中，在真空环境下对树脂粉末进行玻璃化处理。在树脂粉末进行玻璃化处理的过程中，树脂粉末会先融化，并在其融化后再结晶固化，由于此过程在真空中处理，树脂粉末间的空气会由于外界气压低而移向树脂粉末外，如此进一步排出了融化后树脂内的气泡，提高了产品的合格率。
在其中一个实施例中，S140中，所述保护膜包括硅胶层和聚氨酯层，所述硅胶层用于将聚氨酯层粘接在芯板上。硅胶层具有粘性，拆装方便。聚氨酯层没有粘性，方便树脂粉末处理。
在其中一个实施例中，S130中，所述保护膜上的通窗的内壁与元器件的单侧间距为0.5mm～2mm。在通窗的内壁与元器件的单侧间距在0.5mm-2mm时，能保证树脂在玻璃化过程中的流动性，进而保证树脂能够填实通窗。
在其中一个实施例中，S110中，采用丝网对芯板上焊料。在对芯板上需要贴装多个元器件时，采用丝网对芯板上焊料的方式能同时对多处进行上焊料处理。
在其中一个实施例中，S140中，采用高于树脂粉末玻璃化转变温度的温度对树脂粉末进行烘烤处理。此种方式能保证树脂粉末能够全部玻璃化，保证了产品的处理质量。
一种电路板的制作方法，包括S100：采用所述的具有内置元器件的芯板的制作方法制作具有内置元器件的芯板；S200：提供半固化片和子板；S300：对子板和芯板进行棕化处理；S400：对具有内置元器件的芯板、半固化片和子板依次堆叠压合并获母板；S500：对母板进行钻孔、沉铜、电镀、线路、阻焊和表面处理，获得电路板。
上述电路板的制作方法，棕化处理是需要对采用包含有酸碱的药水对各芯板进行棕化处理，在对芯板进行棕化处理中，玻璃化后的树脂粉末会保护元器件接线脚和焊点不受腐蚀，进而保证芯板上元器件连接可靠性。
在其中一个实施例中，所述半固化片包括与芯板配合的第一半固化片和与子板配合的第二半固化片，在第一半固化片上开设有与内置元器件侧围配合的半固化通窗。压合中远离元器件的第二半固化片能通过融化来缓冲芯板对芯板上元器件的压力，进而保护了元器件。
在其中一个实施例中，所述树脂粉末和半固化片采用相同树脂材料制成。树脂粉末和半固化片采用相同树脂制成，固化的树脂粉末和半固化片具有一致的膨胀系数，如此，在元器件工作发热的过程中，不会出现膨胀系数差，避免了电路板爆裂的问题。
在其中一个实施例中，所述半固化片通窗的内壁与元器件的单侧间距为0.3mm-0.8mm。如此能在保证树脂流动性的同时，减少压合中流动树脂从侧面对电容的冲击。
附图说明
图1为本发明实施例所述的具有内置元器件的芯板的制作方法的步骤图；
图2为本发明实施例所述的刚挠结合板中具有内置元器件的外层芯板的制作示意图；
图3为本发明实施例所述的电路板的制作方法的步骤图；
图4为本发明实施例所述的刚挠结合板的制作方法的制作示意图。
附图标记说明：100、芯板，110、焊锡，120、元器件，130、保护膜，131、通窗，140、树脂粉末，100a、第一外层芯板，200a、第一半固化片，201a、半固化片通窗，300a、挠性芯板，400a、第二半固化片，500a、第二外层芯板。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施方式。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本发明的公开内容理解的更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元 件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。相反，当元件被称作“直接在”另一元件“上”时，不存在中间元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
参见图1，一种具有内置元器件的芯板的制作方法，包括：S110：对芯板100进行线路制作；S120：将待内置的元器件120对应贴装焊接在芯板100上；S130：将具有与元器件120配合的通窗131的保护膜130覆盖在芯板100上，使用的所述保护膜130的膜厚大于元器件120焊点高度；S140：向保护膜130的通窗131内填充树脂粉末140，对树脂粉末140进行玻璃化处理以覆盖元器件120的接线脚和焊点；S150：去除保护膜130，获得具有内置元器件120的芯板100。
上述具有内置元器件的芯板的制作方法，内置元器件120贴装焊接在芯板100上，利用保护膜130上的通窗131构成高度大于元器件120焊点高度的空间，在空间内填充树脂粉末140并对树脂粉末140进行玻璃化处理，取出保护膜130后获得具有内置元器件120的芯板100。利用保护膜130上的通窗131的内壁与芯板100板面的配合，有效地限制了树脂粉末140的位置，使玻璃化的树脂粉末140有效地覆盖在元器件120的接线脚和焊点上。如此在对具有内置元器件120的芯板100进行棕化处理时有效地保护了元器件120与芯板100的连接稳固性。避免了在采用芯板100压合制作电路板时，在压力作用下半固化片树脂流动对元器件120产生挤压以致元器件120受损的问题。并且在树脂粉末140玻璃化处理的过程中，粉末会融化成流体，流体会填充在元器件120的底部，如此避免了芯板100在受热后由于局部膨胀过大，导致电路板爆裂的问题。
优选地，S140中，在真空环境下对树脂粉末140进行玻璃化处理。在树脂 粉末140进行玻璃化处理的过程中，树脂粉末140会先融化，并在其融化后再结晶固化，由于此过程在真空中处理，树脂粉末140间的空气会由于外界气压低而移向树脂粉末140外，如此进一步排出了融化后树脂内的气泡，提高了产品的合格率。
优选地，S140中，所述保护膜130包括硅胶层和聚氨酯层，所述硅胶层用于将聚氨酯层粘接在芯板100上。硅胶层具有粘性，拆装方便。聚氨酯层没有粘性，方便树脂粉末140处理。
具体地，S130中，所述保护膜130上的通窗131的内壁与元器件120的单侧间距为0.5mm～2mm。在通窗131的内壁与元器件120的单侧间距在0.5mm-2mm时，能保证树脂在玻璃化过程中的流动性，进而保证树脂能够填实通窗131。
具体地，S110中，采用丝网对芯板100上焊料。在对芯板100上需要贴装多个元器件120时，采用丝网对芯板100上焊料的方式能同时对多处进行上焊料处理。
优选地，S140中，采用高于树脂粉末140玻璃化转变温度的温度对树脂粉末140进行烘烤处理。此种方式能保证树脂粉末140能够全部玻璃化，保证了产品的处理质量。
需要说明的是，上述的元器件120可以是电阻、电容、电感、二极管、三极管等中的任一种或几种。
参见图2，结合到本实施例，本实施例以结合板中具有内置元器件120的芯板100为例说明制作方法，具体方法如下：
S110’：对芯板100进行电路制作。
在S110’中，采用金属丝网对芯板100上焊料，使芯板100上具有用于焊接的焊锡110。
S120’：将待内置的元器件120对应贴装焊接至芯板100上；
S130’：将具有与元器件120配合的通窗131的保护膜130覆盖在芯板100上，使用的所述保护膜130的膜厚大于元器件120焊点高度。
具体地，保护膜130上通窗131深度高于电容焊点50μm；保护膜130上通 窗131的内壁与元器件120单侧间距为0.5mm～2mm。
S140’：向保护膜130的通窗131内填充树脂粉末140，对树脂粉末140进行玻璃化处理。
在真空环境下对树脂粉末140进行玻璃化处理，采用高于树脂粉末140玻璃化转变温度的温度对树脂粉末140进行烘烤处理。具体一般可以是采用高于转变温度10℃的温度对树脂粉末140进行烘烤处理。
S150’：去除保护膜130，获得具有内置元器件120的芯板100。
结合图3，本实施例还提供一种电路板的制作方法，包括S100：采用所述的具有内置元器件的芯板的制作方法制作具有内置元器件120的芯板100；S200：提供半固化片和子板；S300：对子板和芯板100进行棕化处理；S400：对具有内置元器件120的芯板100、半固化片和子板依次堆叠压合并获母板；S500：对母板进行钻孔、沉铜、电镀、线路、阻焊和表面处理，获得电路板。
上述电路板的制作方法，棕化处理时采用包含有酸碱的药水对子板和芯板100进行腐蚀，在对芯板100进行棕化处理中，玻璃化后的树脂粉末140会保护元器件120接线脚和焊点不受腐蚀，进而保证芯板100上元器件120的连接可靠性。
优选地，所述半固化片包括与芯板100配合的第一半固化片和与子板配合的第二半固化片，在第一半固化片上开设有与内置元器件120侧围配合的半固化通窗。压合中远离元器件120的第二半固化片能通过融化来缓冲子板对芯板100上元器件120的压力，进而保护了元器件120。其中，所述第一半固化片可为依次堆叠的多张，所述第二半固化片可为依次堆叠的多张。
优选地，所述树脂粉末140和半固化片采用相同树脂材料制成。树脂粉末140和半固化片采用相同树脂制成，固化的树脂粉末140和半固化片具有一致的膨胀系数，如此，在元器件120工作发热的过程中，不会出现膨胀系数差，避免了电路板爆裂的问题。
优选地，所述半固化片通窗201a的内壁与元器件120的单侧间距为0.3mm-0.8mm。如此能减少压合中流动树脂从侧面对电容的冲击。
参见图4，结合到本实施例，基于前述具有内置元器件120的芯板100为原 料，说明刚挠结合板的制作方法。前述的芯板100对应刚挠结合板中的第一外层芯板100a，子板对应刚挠结合板中的挠性芯板300a，半固化片对应刚挠结合板中的第一半固化片200a。
S100’：采用上述的具有内置元器件的芯板的制作方法制作具有内置元器件120的第一外层芯板100a；
S200’：提供第一半固化片200a、挠性芯板300a、第二半固化片400a和第二外层芯板500a。
S300’：对第一外层芯板100a、挠性芯板300a、第二外层芯板500a进行棕化处理。
S400’：对第一外层芯板100a、第一半固化片200a、挠性芯板300a、第二半固化片400a和第二外层芯板500a依次堆叠压合并获得刚挠结合板母板。
结合图4，可选地，在S300’中，第一半固化片200a为三张，其中靠近第一外层芯板100a侧的两张半固化片构成第一半固化片，在第一半固化片上开设有与元器件120配合的半固化片通窗201a。树脂粉末140与第一半固化片200a采用相同树脂制成。
具体地，半固化片通窗201a的内壁与元器件120的单侧间距为0.3mm-0.8mm，如此能减少压合中树脂从侧面对电容的冲击。
S500’：对刚挠结合板母板进行钻孔、沉铜、电镀、线路、阻焊、开盖、表面处理，获得刚挠结合板。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种具有内置元器件的芯板的制作方法，其特征在于，包括：
    S110：对芯板进行电路制作；
    S120：将待内置的元器件对应贴装焊接在芯板上；
    S130：将具有与元器件配合的通窗的保护膜覆盖在芯板上，使用的所述保护膜的膜厚大于元器件焊点高度；
    S140：向保护膜的通窗内填充树脂粉末，对树脂粉末进行玻璃化处理，以覆盖元器件的接线脚和焊点；
    S150：去除保护膜，获得具有内置元器件的芯板。
  2. 根据权利要求1所述的具有内置元器件的芯板的制作方法，其特征在于，S140中，在真空条件下对树脂粉末进行玻璃化处理。
  3. 根据权利要求1所述的具有内置元器件的芯板的制作方法，其特征在于，S140中，所述保护膜包括硅胶层和聚氨酯层，所述硅胶层用于将聚氨酯层粘接在芯板上。
  4. 根据权利要求1所述的具有内置元器件的芯板的制作方法，其特征在于，S130中，所述保护膜上的通窗的内壁与元器件的单侧间距为0.5mm～2mm。
  5. 根据权利要求1所述的具有内置元器件的芯板的制作方法，其特征在于，S110中，采用丝网对芯板上焊料。
  6. 根据权利要求1所述的具有内置元器件的芯板的制作方法，其特征在于，S140中，采用高于树脂粉末玻璃化转变温度的温度对树脂粉末进行烘烤处理。
  7. 一种电路板的制作方法，其特征在于，包括：
    S100：采用权利要求1-6任一项所述的具有内置元器件的芯板的制作方法制作具有内置元器件的芯板；
    S200：提供半固化片和子板；
    S300：对子板和芯板进行棕化处理；
    S400：对具有内置元器件的芯板、半固化片和子板依次堆叠压合并获母板；
    S500：对母板进行钻孔、沉铜、电镀、线路、阻焊和表面处理，获得电路板。
  8. 根据权利要求7所述的电路板的制作方法，其特征在于，所述半固化片包括与芯板配合的第一半固化片和与子板配合的第二半固化片，在第一半固化片上开设有与内置元器件侧围配合的半固化通窗。
  9. 根据权利要求7所述的电路板的制作方法，其特征在于，所述树脂粉末和半固化片采用相同树脂材料制成。
  10. 根据权利要求8所述的电路板的制作方法，其特征在于，所述半固化片通窗的内壁与元器件的单侧间距为0.3mm～0.8mm。
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