JP5175746B2 - 多層フレキシブル回路基板 - Google Patents
多層フレキシブル回路基板 Download PDFInfo
- Publication number
- JP5175746B2 JP5175746B2 JP2008554156A JP2008554156A JP5175746B2 JP 5175746 B2 JP5175746 B2 JP 5175746B2 JP 2008554156 A JP2008554156 A JP 2008554156A JP 2008554156 A JP2008554156 A JP 2008554156A JP 5175746 B2 JP5175746 B2 JP 5175746B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- multilayer flexible
- base layer
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 44
- 239000011889 copper foil Substances 0.000 claims description 38
- 239000000853 adhesive Substances 0.000 claims description 37
- 230000001070 adhesive effect Effects 0.000 claims description 36
- 239000010408 film Substances 0.000 claims description 23
- 239000012787 coverlay film Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000004821 Contact adhesive Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 87
- 238000010438 heat treatment Methods 0.000 description 29
- 238000000034 method Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
Claims (8)
- 接着シートと、
前記接着シートの上面側に固着される上部ベース層であって、前記接着シートと接触する第1絶縁層と、当該第1絶縁層の上面に接着されて、第1回路パターンを形成するための第1銅箔層とを含む上部ベース層と、
前記接着シートの下面側に固着される下部ベース層であって、前記接着シートと接触する第2絶縁層と、当該第2絶縁層の下側に接着されて、第2回路パターンを形成するための第2銅箔層を含む下部ベース層と、
を含み、
互いに固着された前記接着シートと前記上部ベース層は、前記第1回路パターンが形成されるパターン形成領域を挟む両側の位置に、前記下部ベース層の一部を露出させる切欠部を有する多層フレキシブル回路基板。 - 前記接着シートは、プリプレグ又はボンディングシートを含む請求項1に記載の多層フレキシブル回路基板。
- 前記第1及び第2絶縁層は、FR−4又はポリイミドフィルムを含むことを特徴とする請求項1に記載の多層フレキシブル回路基板。
- 前記第1銅箔層に塗布された上部カバーレイフィルムを含む請求項1に記載の多層フレキシブル回路基板。
- 前記第2銅箔層に塗布された下部カバーレイフィルムを含む請求項1に記載の多層フレキシブル回路基板。
- 前記下部ベース層は、導電性接着部材を利用して対象モジュールの基板と接合される請求項1に記載の多層フレキシブル回路基板。
- 前記導電性接着部材は、異方性導電フィルム(ACF:Anisotropic Conductive Film)を含む請求項6に記載の多層フレキシブル回路基板。
- 前記対象モジュールは、携帯端末機のカメラモジュールである請求項6に記載の多層フレキシブル回路基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060014093A KR101154565B1 (ko) | 2006-02-14 | 2006-02-14 | 다층 연성회로기판 및 그 제조 방법 |
KR10-2006-0014093 | 2006-02-14 | ||
PCT/KR2007/000792 WO2007094614A1 (en) | 2006-02-14 | 2007-02-14 | Multi-layer flexible printed circuit board and method for manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009527106A JP2009527106A (ja) | 2009-07-23 |
JP5175746B2 true JP5175746B2 (ja) | 2013-04-03 |
Family
ID=38371747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008554156A Active JP5175746B2 (ja) | 2006-02-14 | 2007-02-14 | 多層フレキシブル回路基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7977577B2 (ja) |
JP (1) | JP5175746B2 (ja) |
KR (1) | KR101154565B1 (ja) |
CN (1) | CN101313638B (ja) |
WO (1) | WO2007094614A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100949105B1 (ko) * | 2007-11-20 | 2010-03-22 | 삼신써키트 주식회사 | 연성 인쇄 회로 기판 및 그 제조 방법 |
KR101093282B1 (ko) | 2009-10-30 | 2011-12-14 | 삼성에스디아이 주식회사 | 이차전지 팩 |
EP2330655B1 (en) | 2009-12-02 | 2018-11-14 | Samsung SDI Co., Ltd. | Secondary battery |
KR101631423B1 (ko) * | 2012-11-09 | 2016-06-16 | 제이엑스금속주식회사 | 표면 처리 동박 및 그것을 사용한 적층판 |
KR102128786B1 (ko) * | 2013-04-05 | 2020-07-01 | 엘지이노텍 주식회사 | 카메라 모듈의 초음파 접합장치 |
US10338753B2 (en) | 2015-11-03 | 2019-07-02 | Microsoft Technology Licensing, Llc | Flexible multi-layer sensing surface |
US10649572B2 (en) | 2015-11-03 | 2020-05-12 | Microsoft Technology Licensing, Llc | Multi-modal sensing surface |
US10955977B2 (en) | 2015-11-03 | 2021-03-23 | Microsoft Technology Licensing, Llc | Extender object for multi-modal sensing |
CN107396551B (zh) * | 2017-07-28 | 2019-04-30 | 贵州鑫阳科技股份有限公司 | 用于控制板坯加工的设备 |
CN107809857B (zh) * | 2017-11-22 | 2023-08-01 | 苏州市亿利华电子有限公司 | 一种多层pcb板涂胶压合装置 |
GB2576524B (en) * | 2018-08-22 | 2022-08-03 | Pragmatic Printing Ltd | Profiled Thermode |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930555Y2 (ja) * | 1980-05-26 | 1984-08-31 | 株式会社フジクラ | プリント基板 |
JP2562182B2 (ja) * | 1988-07-28 | 1996-12-11 | 日東電工株式会社 | 離型シート仮接着フレキシブル回路の製法およびその離型シート仮接着フレキシブル回路 |
JP2591599B2 (ja) * | 1989-01-17 | 1997-03-19 | 住友電気工業株式会社 | フレキシブル回路基板 |
US5589251A (en) * | 1990-08-06 | 1996-12-31 | Tokai Electronics Co., Ltd. | Resonant tag and method of manufacturing the same |
JPH04334088A (ja) * | 1991-05-09 | 1992-11-20 | Sumitomo Bakelite Co Ltd | フレキシブル印刷回路板の製造方法 |
JP2665134B2 (ja) | 1993-09-03 | 1997-10-22 | 日本黒鉛工業株式会社 | フレキシブル回路基板及びその製造方法 |
JPH08264914A (ja) * | 1995-03-24 | 1996-10-11 | Sumitomo Electric Ind Ltd | 加熱圧着接続型バンプ付きfpc |
JPH09232377A (ja) * | 1996-02-27 | 1997-09-05 | Toshiba Corp | 実装構造体およびその製造方法 |
KR20020003818A (ko) | 2000-07-03 | 2002-01-15 | 카나가와 치히로 | 가요성 인쇄 배선용 기판 |
JP3788917B2 (ja) * | 2001-04-02 | 2006-06-21 | 日東電工株式会社 | フレキシブル多層配線回路基板の製造方法 |
JP3895125B2 (ja) | 2001-04-12 | 2007-03-22 | 日東電工株式会社 | 補強板付フレキシブルプリント回路板 |
US6739837B2 (en) * | 2002-04-16 | 2004-05-25 | United Technologies Corporation | Bladed rotor with a tiered blade to hub interface |
JP2005144816A (ja) * | 2003-11-13 | 2005-06-09 | Tomoegawa Paper Co Ltd | フレキシブル金属積層体 |
JP2005243830A (ja) | 2004-02-25 | 2005-09-08 | Kyocera Chemical Corp | プリント配線板 |
JP4319167B2 (ja) * | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | シールドフィルム、シールドプリント配線板、シールドフレキシブルプリント配線板、シールドフィルムの製造方法及びシールドプリント配線板の製造方法 |
JP5222490B2 (ja) * | 2007-04-25 | 2013-06-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
JP5280034B2 (ja) * | 2007-10-10 | 2013-09-04 | 日東電工株式会社 | 配線回路基板用両面粘着テープ又はシートおよび配線回路基板 |
-
2006
- 2006-02-14 KR KR1020060014093A patent/KR101154565B1/ko not_active IP Right Cessation
-
2007
- 2007-02-14 JP JP2008554156A patent/JP5175746B2/ja active Active
- 2007-02-14 CN CN2007800001905A patent/CN101313638B/zh active Active
- 2007-02-14 US US11/910,142 patent/US7977577B2/en active Active
- 2007-02-14 WO PCT/KR2007/000792 patent/WO2007094614A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101313638A (zh) | 2008-11-26 |
KR20070081865A (ko) | 2007-08-20 |
US7977577B2 (en) | 2011-07-12 |
CN101313638B (zh) | 2010-12-08 |
KR101154565B1 (ko) | 2012-06-08 |
WO2007094614A1 (en) | 2007-08-23 |
US20080289861A1 (en) | 2008-11-27 |
JP2009527106A (ja) | 2009-07-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5175746B2 (ja) | 多層フレキシブル回路基板 | |
JP4038206B2 (ja) | リジッド・フレキシブルプリント回路基板の製造方法 | |
JP6956475B2 (ja) | 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム | |
JP4874305B2 (ja) | 電気・電子部品内蔵回路基板とその製造方法 | |
JP6726070B2 (ja) | 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム | |
JP2010239022A (ja) | フレキシブルプリント配線基板及びこれを用いた半導体装置 | |
JP2007110010A (ja) | フレキシブルプリント配線板、フレキシブルプリント回路板、およびそれらの製造方法 | |
TWI606769B (zh) | 剛撓結合板之製作方法 | |
TW201246486A (en) | Method of making an electronic device having a liquid crystal polymer solder mask and related devices | |
JP6752669B2 (ja) | 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム | |
JP5524315B2 (ja) | 多層フレキシブルプリント配線板を用いた表示素子モジュール | |
JP4133756B2 (ja) | プリント配線基板の接続方法 | |
JP2009044124A (ja) | 多層印刷回路基板及びその製造方法 | |
JP7062548B2 (ja) | 多層プリント配線板の製造方法、および多層プリント配線板 | |
WO2011152033A1 (ja) | プリント配線板の接続構造、及びカメラモジュール | |
JP5344018B2 (ja) | 配線板接続体および配線板モジュール | |
US20070285905A1 (en) | Electronic device, display apparatus, flexible circuit board and fabrication method thereof | |
TWI401010B (zh) | 軟硬結合電路板之製作方法 | |
JP2004031476A (ja) | 電子部品内蔵多層プリント基板及びその製造方法 | |
JP2008205244A (ja) | プリント配線板及びプリント配線板の製造方法 | |
JP2008311553A (ja) | 複合多層プリント配線板の製造方法 | |
JP2006332246A (ja) | 回路基板、回路基板の接続構造および電子機器 | |
JP6387226B2 (ja) | 複合基板 | |
KR101924458B1 (ko) | 전자 칩이 내장된 회로기판의 제조 방법 | |
JP6735793B2 (ja) | 複合基板及びリジッド基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091109 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111025 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120124 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120710 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20121009 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20121016 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121026 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121225 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130107 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5175746 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |