WO2019037652A1 - 显示面板及其制备方法 - Google Patents

显示面板及其制备方法 Download PDF

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Publication number
WO2019037652A1
WO2019037652A1 PCT/CN2018/100805 CN2018100805W WO2019037652A1 WO 2019037652 A1 WO2019037652 A1 WO 2019037652A1 CN 2018100805 W CN2018100805 W CN 2018100805W WO 2019037652 A1 WO2019037652 A1 WO 2019037652A1
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WO
WIPO (PCT)
Prior art keywords
cut
layer
area
functional layer
display panel
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PCT/CN2018/100805
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English (en)
French (fr)
Inventor
李晓虎
孙中元
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/332,942 priority Critical patent/US11139350B2/en
Publication of WO2019037652A1 publication Critical patent/WO2019037652A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes

Definitions

  • the present application belongs to the field of display technologies, and in particular, to a display panel and a method for fabricating the same.
  • OLED organic light emitting diode
  • a plurality of display panels are formed on a large piece of mother glass, and then the mother board is cut, and the mother board is cut into a plurality of displays. Panel, this cut is a full cut.
  • the existing flexible OLED device needs to remove the film layer on the connection area for connecting the circuit chip on the flexible display substrate to complete the connection between the flexible display substrate and the circuit chip.
  • the removal process is performed by a laser half-cut process. achieve.
  • One aspect of the present application provides a method of fabricating an OLED display panel, wherein the display panel is divided into a display area, a half-cut area, and a bezel area, and the method includes the following steps:
  • a layer to be cut continuously in the display area, the half-cut area and the frame area wherein a layer to be cut in the display area is located on the plurality of structural layers, and the half-cut area is to be
  • a cutting layer is located on the half-cut protective strip, and a layer to be cut in the bezel area is located on the functional layer of the driving circuit.
  • cutting the layer to be cut comprises cutting with a laser.
  • the layer to be cut comprises any one or more of a temporary film, a polarizer layer, and a touch screen.
  • forming the half-cut protective strip includes forming the half-cut protective strip at a location of the edge of the structural layer on the functional layer of the drive circuit.
  • the plurality of structural layers include a light emitting functional layer and an encapsulation layer on the light emitting functional layer, and at least the encapsulation layer of the plurality of structural layers extends into the semi-cutting region to Located on the functional layer of the driving circuit, wherein forming the half-cut protective strip further comprises forming the half-cut protective strip on the encapsulation layer.
  • the semi-cut protective strip is formed from a thermally conductive material.
  • forming the half-cut protective strip from a thermally conductive material comprises forming the semi-cut protective strip from graphite.
  • the half-cut protective strip further includes an insulating paste, and forming the half-cut protective strip includes adhering the graphite to the functional layer of the driving circuit with an insulating glue.
  • the semi-cut protective strip is formed using a graphite printing process.
  • the half-cut protective strip is formed to have a thickness of 10 ⁇ m to 100 ⁇ m in a direction perpendicular to the display panel.
  • the half-cut protective strip is formed to have a width of 0.1 mm to 2 mm.
  • the half-cut area is disposed at a position of the bezel area adjacent to the display area.
  • the display panel comprises an OLED display panel.
  • a display panel which is divided into a display area, a half-cut area, and a bezel area, and includes:
  • a cutting layer is located on the half-cut protective strip, and a layer to be cut in the bezel area is located on the functional layer of the driving circuit.
  • the half-cut protection strip is disposed at a location on the edge of the structural layer on the functional layer of the drive circuit.
  • the structural layer includes a light emitting functional layer and an encapsulation layer over the light emitting functional layer, and at least the encapsulation layer of the plurality of structural layers extends into the semi-cutting region to be located The driving circuit functional layer, wherein the half-cut protection strip is disposed on the encapsulation layer.
  • the semi-cut protective strip comprises a thermally conductive material.
  • the thermally conductive material comprises graphite.
  • the half-cut protective strip has a thickness of from 10 ⁇ m to 100 ⁇ m in a direction perpendicular to the display panel.
  • the half-cut protective strip has a width of from 0.1 mm to 2 mm.
  • 1 to 3 are schematic structural diagrams of a display panel according to an embodiment of the present application.
  • FIG. 4 is a flow chart of a method of preparing an OLED display panel according to an embodiment of the present application.
  • 5 to 7 are schematic structural diagrams of an OLED display panel prepared according to a method according to an embodiment of the present application.
  • the method of preparing a display panel according to the present application is performed by adding a half-cut protective strip over the functional layer of the driving circuit of the half-cutting region so that the laser is not cut under the half-cut protective strip when the laser cuts the layer to be cut along the half-cut line
  • the driving circuit functional layer in turn, better avoids damage to the functional layer of the driving circuit, thereby improving production yield.
  • the display panel in the half-cut region according to this embodiment, includes a driving circuit functional layer 3 provided on the base substrate 1, and a plurality of structural layers 2 located above the driving circuit functional layer 3.
  • the structural layer 2 includes a light-emitting functional layer 21 and an encapsulation layer 22 on the light-emitting functional layer 21.
  • the half-cut protective strip 5 is located between the driving circuit functional layer 3 and the light-emitting function layer 21 to protect the driving circuit functional layer 3 under the half-cut protective strip 5 when a laser is used for half-cutting.
  • the structure of the display area and the bezel area in this embodiment is the same as that described hereinafter with reference to Fig. 2, and the same description is omitted here.
  • the half-cut area refers to the area where the upper layer on the display panel needs to be cut, and the lower layer does not need to be cut.
  • an OLED display panel is used to connect a connection area of a circuit chip.
  • the display panel according to this embodiment adds a half-cut protection strip 5 over the functional layer of the driving circuit of the half-cut area so that heat is not conducted to the driving circuit function under the half-cut protection strip 5 when the laser is cut along the half-cut line.
  • Layer 3 in turn, better avoids damage to the driver circuit functional layer 3, thereby increasing production yield.
  • the method of preparing a display panel according to this embodiment solves the technical problem that the laser-cut half-cut line is poor, which makes it impossible to bind or damage the underlying metal.
  • FIG. 2 illustrates the structure of a display panel according to another embodiment of the present application.
  • the display panel can be divided into a bezel area, a half-cut area, and a display area.
  • the driving circuit functional layer 3 is located on the base substrate, and the plurality of structural layers 2 are located on the driving circuit functional layer 3 in the display area, and the half-cut protective strip 5 is located on the driving circuit functional layer 3 corresponding to the semi-cutting area.
  • the structural layer 2 includes a light-emitting functional layer 21 and an encapsulation layer 22 over the light-emitting functional layer 21, and the encapsulation layer 22 specifically includes a first inorganic layer 23 and a second inorganic layer 25.
  • the temporary film 4 is continuously located in the display area, the half-cut area and the frame area, wherein the temporary film 4 in the display area is located on the plurality of structural layers 2, in the half-cut area
  • the temporary film 4 is located on the half-cut protective strip 5, and the temporary film 4 in the frame region is located on the driving circuit functional layer 3.
  • This embodiment differs from the embodiment shown in Fig. 1 in that the structural layer 2 in the display zone does not extend above the half-cut protective strip 5 in the half-cut zone.
  • the half-cut protective strip 5 is disposed at a position of an edge of the light-emitting function layer 21 above the driving circuit functional layer 3.
  • FIG. 3 illustrates a structure of a display panel in a half-cut region according to another embodiment of the present application.
  • the structure of the display area and the bezel area in this embodiment is the same as that described above with reference to Fig. 2, and the same description is omitted here.
  • the encapsulation layer 22 and the light-emitting function layer 21 in the structural layer 2 extend into the half-cut region to be located on the functional layer of the driving circuit. That is, the half-cut protective strip 5 is formed on the encapsulation layer 22 for protecting the driving circuit functional layer 3 therebelow.
  • the layer to be cut referred to in the present application is a layer that is cut when cut.
  • An example of the layer to be cut of the temporary separation film 4 as a half-cut area, a display area, and a bezel area is shown in FIGS. 2 and 3.
  • the case where the polarizer layer and the touch screen are used as the layer to be cut is similar to these examples, and details are not described herein again.
  • Another aspect of the present application provides a method of fabricating an OLED display panel, wherein the display panel is divided into a display area, a half-cut area, and a bezel area. As shown in FIG. 4, the method includes the following steps:
  • the method of preparing an OLED display panel according to this embodiment is performed by adding a half-cut protective strip over the functional layer of the driving circuit of the half-cutting region so that heat is not transmitted to the underside of the half-cut protective strip when the laser is cut along the half-cut line Driving the functional layer of the circuit, thereby better avoiding damage to the functional layer of the driving circuit, thereby improving production yield.
  • the method of preparing a display panel according to this embodiment solves the technical problem that the laser-cut half-cut line is poor, which makes it impossible to bind or damage the underlying metal.
  • the display panel can be divided into a display area, a half-cut area, and a bezel area.
  • step S01 of FIG. 4 the driving circuit functional layer 3 is formed on the base substrate 1 with the flexible material or the glass 12.
  • the base substrate 1 may be a flexible material or a glass 12.
  • the glass 12 is selected as the base substrate 1, and at this time, a flexible substrate 11 composed of a flexible material polyimide (PI) is first formed on the glass 12.
  • PI flexible material polyimide
  • step S02 of FIG. 4 a plurality of structural layers 2 are formed on the drive circuit functional layer 3 in the display area.
  • forming the plurality of structural layers 2 includes:
  • the light-emitting function layer 21 includes a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an Emitting Material Layer (EML), and an electron transport layer (Electron Transport). Layer, ETL) and Electron Injection Layer (EIL).
  • HIL Hole Injection Layer
  • HTL Hole Transport Layer
  • ETL Emitting Material Layer
  • ETL Electron Injection Layer
  • the encapsulation layer 22 includes two layers of a first inorganic layer 23 and a second inorganic layer 25 formed by a chemical vapor deposition (CVD) method, and an inkjet printing coating cured between the two inorganic layers.
  • Organic resin layer 24 is not electrically conductive and is an insulating layer.
  • a half-cut protection strip 5 is formed at a position corresponding to the half-cut area above the drive circuit functional layer 3 for protecting the drive circuit under the half-cut protection strip 5 when performing half-cutting with a laser Functional layer 3.
  • forming the half-cut guard strip 5 includes forming a half-cut guard strip 5 at the location of the edge of the structural layer on the driver circuit functional layer 3, as shown in FIG.
  • the half-cut protection strip 5 can be used to protect the drive circuit functional layer 3 below it.
  • forming the half-cut protective strip further includes forming a half-cut protective strip on the encapsulation layer.
  • the light-emitting functional layer 21 of the plurality of structural layers 2 and the encapsulation layer 22 on the light-emitting functional layer 21 each extend to the functional layer of the driving circuit located in the half-cut region. That is, the half-cut protective strip 5 is formed on the encapsulation layer 22. In this embodiment, the half-cut protection strip 5 can be used to protect the drive circuit function layer 3 below it.
  • the half-cut protective strip 5 comprises a thermally conductive material.
  • the thermally conductive material is graphite 51, as shown in FIG.
  • the thermal conductivity of the graphite 51 is good, the heat is not conducted to the underside of the half-cut protective strip when the laser is subsequently used to cut the half-cut protective strip made of graphite 51 along the half-cut line.
  • the film structure in turn, better avoids damage to the underlying structure, thereby improving production yield.
  • other preferred thermally conductive materials may be substituted for graphite 51.
  • the half-cut protective strip 5 further includes an insulating paste 52.
  • the forming of the half-cut protective strip 5 includes bonding the graphite 51 to the driving circuit functional layer 3 with an insulating paste 52.
  • the underside of the graphite 51 layer is the insulating paste 52, so that the half-cut protective strip 5 and the lower driving circuit functional layer 3 are not electrically connected.
  • the role of the graphite 51 is only to prevent the half-cut energy from being excessively large, damaging the underlying metal line.
  • the half-cut protective strip 5 can be formed by graphite printing. Specifically, the graphite may be printed to a specified position by printing; or a mask having a desired pattern may be placed above the position where the half-cut protective strip 5 is required to be formed, and then the graphite is sprayed onto the mask to form a corresponding A half-cut protective strip 5 in the shape of a pattern.
  • the half-cut protective strip 5 has a size in the direction perpendicular to the OLED display panel of from 10 ⁇ m to 100 ⁇ m. That is, the thickness H of the half-cut protective strip 5 involved in FIGS. 2 to 4 is 10 ⁇ m to 100 ⁇ m.
  • the OLED display panel includes a display area, a bezel area, and a half-cut area, and the half-cut area is disposed at a position of the bezel area adjacent to the display area.
  • the half-cut protective strip 5 has a width L of 0.1 mm to 2 mm.
  • the distance d of the half-cut protective strip 5 from the boundary of the OLED display panel is from 1 mm to 5 mm, which does not hinder the laser cutting process.
  • a layer to be cut is continuously formed in the display area, the half-cut area, and the bezel area, wherein a layer to be cut in the display area is located on the plurality of structural layers
  • the layer to be cut of the half-cut area is located on the half-cut protection strip, and the layer to be cut in the frame area is located on the functional layer of the driving circuit.
  • the laser power ranges from 1w to 60w.
  • each structural layer can be adjusted as needed, and the material of each structural layer can be changed as needed.
  • the display device may be any product or component having a display function, such as an electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请提供一种显示面板及其制备方法。根据本申请的制备显示面板的方法通过在半切割区的驱动电路功能层上方加入半切割保护条，使得激光沿着半切割线进行切割时，热量不会传导至半切割保护条下方的驱动电路功能层，进而较好的避免对驱动电路功能层的损伤，从而提高了生产良率。

Description

显示面板及其制备方法
相关申请的交叉引用
本申请要求于2017年8月24日提交至中国知识产权局的中国专利申请No.201710735774.2的优先权，其全部内容以引用的方式合并于此。
技术领域
本申请属于显示技术领域，具体涉及一种显示面板及其制备方法。
背景技术
在有机发光二极管(OLED)的制造过程中，为了形成规模化的批量生产，会在大片的母板玻璃上形成许多显示面板，然后再对母板进行切割，将母板切割分断成多个显示面板，这种切割为全切割。另一方面，为了将每个显示面板的显示区与边框区分割以在边框区进行布线，还需要对边框区的部分结构层进行切割以移除这些结构层，但是边框区下层的导电金属层、基底等无需切割，这种切割为半切割。
现有的柔性OLED器件需要将柔性显示基板上的用于连接电路芯片的连接区域上的膜层移除，以完成柔性显示基板与电路芯片的连接，通常这种移除工艺通过激光半切割工艺实现。
发明内容
本申请的一个方面提供一种制备OLED显示面板的方法，其中，所述显示面板划分为显示区、半切割区和边框区，所述方法包括以下步骤：
在衬底基板上形成驱动电路功能层；
在所述显示区中的所述驱动电路功能层上形成多个结构层；
在所述驱动电路功能层上方对应所述半切割区的位置处形成半切割保护条，用于在进行半切割时保护所述半切割保护条下方的所述驱动电路功能层；
在所述显示区、所述半切割区和所述边框区连续地形成待切割层，其中，所述显示区中的待切割层位于所述多个结构层上，所述半切割区的待切割层位于所述半切割保护条上，所述边框区中的待切割层位于所述驱动电路功能层上。
在一个实施例中，对所述待切割层进行切割包括采用激光进行切割。
在一个实施例中，所述待切割层包括暂离膜、偏光片层、触摸屏中的任意一种或几种。
在一个实施例中，形成所述半切割保护条包括在所述驱动电路功能层上的所述结构层边缘的位置处形成所述半切割保护条。
在一个实施例中，所述多个结构层包括发光功能层和位于所述发光功能层上的封装层，并且所述多个结构层中至少所述封装层延伸到所述半切割区中以位于所述驱动电路功能层上，其中，形成所述半切割保护条还包括在所述封装层上形成所述半切割保护条。
在一个实施例中，由导热材料形成所述半切割保护条。
在一个实施例中，由导热材料形成所述半切割保护条包括由石墨形成所述半切割保护条。
在一个实施例中，所述半切割保护条还包括绝缘胶，形成所述半切割保护条包括采用绝缘胶将所述石墨粘贴至所述驱动电路功能层上方。
在一个实施例中，采用石墨印刷的方法形成所述半切割保护条。
在一个实施例中，在垂直于所述显示面板的方向上，将所述半切割保护条形成为具有10μm-100μm的厚度。
在一个实施例中，将所述半切割保护条形成为具有0.1mm-2 mm的宽度。
在一个实施例中，所述半切割区设于所述边框区靠近所述显示区的位置处。
在一个实施例中，所述显示面板包括OLED显示面板。
本申请的另一方面提供一种显示面板，所述显示面板划分为显示区、半切割区和边框区，并且包括：
位于衬底基板上的驱动电路功能层；
位于所述显示区中的所述驱动电路功能层上的多个结构层；
位于所述驱动电路功能层上方对应所述半切割区的位置处的半切割保护条，其用于在进行半切割时保护所述半切割保护条下方的所述驱动电路功能层；以及
连续地位于所述显示区、所述半切割区和所述边框区的待切割层，其中所述显示区中的待切割层位于所述多个结构层上，所述半切割区中的待切割层位于所述半切割保护条上，所述边框区中的待切割层位于所述驱动电路功能层上。
在一个实施例中，所述半切割保护条设于所述驱动电路功能层上所述结构层边缘的位置处。
在一个实施例中，所述结构层包括发光功能层和位于所述发光功能层上方的封装层，并且所述多个结构层中至少所述封装层延伸到所述半切割区中以位于所述驱动电路功能层上，其中，所述半切割保护条设于所述封装层上。
在一个实施例中，所述半切割保护条包括导热材料。
在一个实施例中，所述导热材料包括石墨。
在一个实施例中，在垂直于所述显示面板的方向上，所述半切割保护条的厚度为10μm-100μm。
在一个实施例中，所述半切割保护条的宽度为0.1mm-2mm。
附图说明
图1至图3为根据本申请实施例的显示面板的结构示意图；
图4为根据本申请实施例的制备OLED显示面板的方法的流程图；
图5至图7为根据本申请实施例的方法制备的OLED显示面板的结构示意图。
具体实施方式
申请人发现现有技术中至少存在如下问题：采用激光用于柔性OLED器件半切割工艺时，在切割过程中很容易造成诸如暂离膜的待切割层下面由导电金属制成的驱动电路功能层的损伤。
根据本申请的制备显示面板的方法通过在半切割区的驱动电路功能层上方加入半切割保护条，使得激光沿着半切割线对待切割层进行切割时，热量不会传导至半切割保护条下方的驱动电路功能层，进而较好地避免对驱动电路功能层的损伤，从而提高生产良率。
为使本领域技术人员更好地理解本申请的技术方案，下面结合附图和具体实施方式对本申请作进一步的详细描述。
图1为根据本申请的一个实施例的显示面板在半切割区中的结构。如图1所示，在根据该实施例的半切割区中，显示面板包括设于衬底基板1上的驱动电路功能层3和位于所述驱动电路功能层3上方的多个结构层2。结构层2包括发光功能层21和位于所述发光功能层21上的封装层22。半切割保护条5位于驱动电路功能层3和发光功能层21之间，以在采用激光进行半切割时保护所述半切割保护条5下方的驱动电路功能层3。该实施例中显示区和边框区的结构与下文中参照图2描述的结构相同，在此省略相同描述。
值得注意的是，在本申请中，半切割区是指显示面板上相对的上层需要切割，而下层无需切割的区域。例如，OLED显示面板用于连接电路芯片的连接区域。
根据该实施例的显示面板在半切割区的驱动电路功能层上方加入半切割保护条5，使得激光沿着半切割线进行切割时，热量不 会传导至半切割保护条5下方的驱动电路功能层3，进而较好地避免对驱动电路功能层3的损伤，从而提高生产良率。根据该实施例的制备显示面板的方法解决了激光切割半切割线不良造成无法绑定或者损伤下层金属的技术问题。
图2示出根据本申请另一实施例的显示面板的结构。如图2所示，显示面板可以划分为边框区、半切割区和显示区。驱动电路功能层3位于衬底基板上，多个结构层2位于显示区中的驱动电路功能层3上，半切割保护条5位于所述驱动电路功能层3上对应所述半切割区的位置处。与根据图1的实施例相似，结构层2包括发光功能层21和位于所述发光功能层21上方的封装层22，并且所述封装层22具体包括第一无机层23、第二无机层25以及夹在两层无机层之间的有机树脂层24。暂离膜4连续地位于所述显示区、所述半切割区和所述边框区中，其中所述显示区中暂离膜4位于所述多个结构层2上，所述半切割区中暂离膜4位于所述半切割保护条5上，所述边框区中暂离膜4位于所述驱动电路功能层3上。
该实施例与图1所示的实施例的区别在于，显示区中的结构层2没有延伸到半切割区中的半切割保护条5上方。在该实施例中，所述半切割保护条5设于所述驱动电路功能层3上方的所述发光功能层21边缘的位置处。
图3示出根据本申请另一本实施例的显示面板在半切割区中的结构。该实施例中显示区和边框区的结构与上文中参照图2描述的结构相同，在此省略相同描述。如图3所示，在根据该实施例的半切割区中，所述结构层2中的封装层22和发光功能层21延伸到所述半切割区中以位于所述驱动电路功能层上，即，半切割保护条5形成于封装层22上，以用于保护其下方的驱动电路功能层3。
需要注意的是，本申请中述及的待切割层为切割时被切割的层。图2、图3中示出暂离膜4作为半切割区、显示区和边框区的待切割层的示例。在这些示例中，需要对半切割区中的暂离膜4 进行切割，同时保护暂离膜4下方(半切割保护条5下方)的结构。可以理解的是，偏光片层、触摸屏作为待切割层的情况与这些示例类似，在此不再赘述。
本申请另一方面提供一种制备OLED显示面板的方法，其中，所述显示面板划分为显示区、半切割区和边框区。如图4所示，该方法包括以下步骤：
S01、以柔性材料或者玻璃为衬底基板，在衬底基板上形成驱动电路功能层；
S02、在驱动电路功能层上的所述显示区中形成多个结构层；
S03、在所述驱动电路功能层上方对应半切割区的位置处形成半切割保护条，用于在采用激光进行半切割时保护所述半切割保护条下方的驱动电路功能层；
S04、在所述显示区、所述半切割区和所述边框区连续地形成待切割层，其中，所述显示区中的待切割层位于所述多个结构层上，所述半切割区的待切割层位于所述半切割保护条上，所述边框区中的待切割层位于所述驱动电路功能层上。
根据该实施例的制备OLED显示面板的方法通过在半切割区的驱动电路功能层上方加入半切割保护条，使得激光沿着半切割线进行切割时，热量不会传导至半切割保护条下方的驱动电路功能层，进而较好地避免对驱动电路功能层的损伤，从而提高生产良率。根据该实施例的制备显示面板的方法解决了激光切割半切割线不良造成无法绑定或者损伤下层金属的技术问题。
下面参照图2至图7对图4中示出的制备OLED显示面板的方法进行详细描述。如上所述，所述显示面板可划分为显示区、半切割区和边框区。
在图4的步骤S01中，在以柔性材料或者玻璃12为衬底基板1上形成驱动电路功能层3。
也就是说，所述衬底基板1可以是柔性材料，也可以是玻璃12。在图2所示的实施例中，选用玻璃12作为衬底基板1，此时还需先在玻璃12上形成一层由柔性材料聚酰亚胺(PI)构成的 柔性基底11。
在图4的步骤S02中，在显示区中的所述驱动电路功能层3上形成多个结构层2。
在该实施例中，形成多个结构层2包括：
S02a、形成发光功能层21。具体地，发光功能层21包括：空穴注入层(Hole Injection Layer，HIL)、空穴传输层(Hole Transport Layer，HTL)、发光材料层(Emitting Material Layer，EML)、电子传输层(Electron Transport Layer，ETL)和电子注入层(Electron Injection Layer，EIL)。
S02b、形成封装层22。封装层22包括两层采用化学气相沉积(CVD，Chemical Vapor Deposition)法形成的第一无机层23和第二无机层25，以及夹在两层无机层之间的采用喷墨打印涂布固化的有机树脂层24。其中，采用CVD形成的无机层不导电，为绝缘层。
在图4的步骤S03中，在驱动电路功能层3上方对应半切割区的位置处形成半切割保护条5，用于在采用激光进行半切割时保护所述半切割保护条5下方的驱动电路功能层3。
需要说明的是，根据工艺不同，半切割区的结构不同，半切割保护条5下方的结构不同。
在一个实施例中，形成半切割保护条5包括在驱动电路功能层3上所述结构层边缘的位置处形成半切割保护条5，如图2所示。在该实施例中，半切割保护条5可用于保护其下方的驱动电路功能层3。
在另一个实施例中，所述多个结构层中至少所述封装层延伸到位于所述半切割区中的所述驱动电路功能层上。在该实施例中，形成半切割保护条还包括在所述封装层上形成半切割保护条。
在图3示出的实施例中，多个结构层2中的发光功能层21和位于发光功能层21上的封装层22均延伸到位于所述半切割区中的所述驱动电路功能层上，即半切割保护条5形成于封装层22上。在该实施例中，半切割保护条5可用于保护其下方的驱动电路功 能层3。
在一个实施例中，所述半切割保护条5包括导热材料。在一个实施例中，所述导热材料为石墨51，如图2所示。
在该实施例中，由于石墨51的导热性较好，使得后续使用激光沿着半切割线对由石墨51制成的半切割保护条进行切割时，热量不会传导至半切割保护条下方的薄膜结构，进而较好地避免下层结构的损伤，从而提高了生产良率。在其它实施例中，还可选用其他较好的导热材料替代石墨51。
在一个实施例中，如图2所示，所述半切割保护条5还包括绝缘胶52，形成半切割保护条5包括采用绝缘胶52将所述石墨51粘贴至所述驱动电路功能层3上方。在该实施例中，石墨51层下面为绝缘胶52，因此半切割保护条5与下方驱动电路功能层3并不导通。石墨51的作用仅为阻止半切割能量过大，损伤下层金属线。
在另一实施例中，如图3所示，石墨51层下面为采用CVD形成的无机层，该无机层不导电，其为绝缘层，因此可以不必设置绝缘胶52。此时，可以采用石墨印刷的方法形成半切割保护条5。具体地，可以采用打印的方式将石墨打印到指定位置处；也可以在需要形成半切割保护条5的位置上方放置具有所需图案的掩膜版，然后向掩膜版喷石墨，从而形成对应图案形状的半切割保护条5。
在一个实施例中，在垂直于所述OLED显示面板的方向上，所述半切割保护条5的尺寸为10μm-100μm。也就是说，图2至图4中所涉及的半切割保护条5的厚度H为10μm-100μm。
图6和图7示出根据本申请的显示面板的顶视图，其中，黑白的虚线为切割线。在图6所示的实施例中，OLED显示面板包括显示区、边框区和半切割区，所述半切割区设于所述边框区靠近所述显示区的位置处。所述半切割保护条5的宽度L为0.1mm-2mm。在另一实施例中，如图7所示，在半切割保护条5延伸的方向上，半切割保护条5距离OLED显示面板边界的距离d为 1mm-5mm，这样不妨碍激光切割工艺。
在图4的步骤S04中，在所述显示区、所述半切割区和所述边框区连续地形成待切割层，其中，所述显示区中的待切割层位于所述多个结构层上，所述半切割区的待切割层位于所述半切割保护条上，所述边框区中的待切割层位于所述驱动电路功能层上。具体地，采用激光进行切割时，激光功率范围在1w-60w。
应该理解的是，上述各实施例的具体实施方式还可做出许多变化。例如：各结构层的大小、厚度等可以根据需要进行调整，各结构层的材料可以根据需要进行改变。
本申请另一实施例提供一种显示装置，其包括上述任意一种OLED显示面板。所述显示装置可以为：电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
可以理解的是，以上实施方式仅仅是为了说明本申请的原理而采用的示例性实施方式，然而本申请并不局限于此。对于本领域内的普通技术人员而言，在不脱离本申请的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为落入本申请的保护范围内。

Claims (20)

  1. 一种制备显示面板的方法，其中，所述显示面板划分为显示区、半切割区和边框区，所述显示面板包括衬底基板、位于衬底基板上的驱动电路功能层、以及在所述显示区中的所述驱动电路功能层上的多个结构层，所述方法包括以下步骤：
    在所述驱动电路功能层上方对应所述半切割区的位置处形成半切割保护条，用于在进行半切割时保护所述半切割保护条下方的所述驱动电路功能层；
    在所述显示区、所述半切割区和所述边框区连续地形成待切割层，其中，所述显示区中的待切割层位于所述多个结构层上，所述半切割区的待切割层位于所述半切割保护条上，所述边框区中的待切割层位于所述驱动电路功能层上。
  2. 根据权利要求1所述的方法，其中，对所述待切割层进行切割包括采用激光进行切割。
  3. 根据权利要求1所述的方法，其中，所述待切割层包括暂离膜、偏光片层、触摸屏中的任意一种或几种。
  4. 根据权利要求1所述的方法，其中，形成所述半切割保护条包括在所述驱动电路功能层上的所述结构层边缘的位置处形成所述半切割保护条。
  5. 根据权利要求1所述的方法，其中，所述多个结构层包括发光功能层和位于所述发光功能层上的封装层，并且所述多个结构层中至少所述封装层延伸到所述半切割区中以位于所述驱动电路功能层上，其中，形成所述半切割保护条还包括在所述封装层上形成所述半切割保护条。
  6. 根据权利要求1所述的方法，其中，由导热材料形成所述半切割保护条。
  7. 根据权利要求6所述的方法，其中，由导热材料形成所述半切割保护条包括由石墨形成所述半切割保护条。
  8. 根据权利要求7所述的方法，其中，所述半切割保护条还包括绝缘胶，形成所述半切割保护条包括采用绝缘胶将所述石墨粘贴至所述驱动电路功能层上方。
  9. 根据权利要求7所述的方法，其中，采用石墨印刷的方法形成所述半切割保护条。
  10. 根据权利要求1所述的方法，其中，在垂直于所述显示面板的方向上，将所述半切割保护条形成为具有10μm-100μm的厚度。
  11. 根据权利要求1所述的方法，其中，将所述半切割保护条形成为具有0.1mm-2mm的宽度。
  12. 根据权利要求1所述的方法，其中，所述半切割区设于所述边框区靠近所述显示区的位置处。
  13. 根据权利要求1所述的方法，其中，所述显示面板包括OLED显示面板。
  14. 一种显示面板，所述显示面板划分为显示区、半切割区和边框区，并且包括：
    位于衬底基板上的驱动电路功能层；
    位于所述显示区中的所述驱动电路功能层上的多个结构层；
    位于所述驱动电路功能层上方对应所述半切割区的位置处的 半切割保护条，其用于在进行半切割时保护所述半切割保护条下方的所述驱动电路功能层；以及
    连续地位于所述显示区、所述半切割区和所述边框区的待切割层，其中所述显示区中的待切割层位于所述多个结构层上，所述半切割区中的待切割层位于所述半切割保护条上，所述边框区中的待切割层位于所述驱动电路功能层上。
  15. 根据权利要求14所述的显示面板，其中，所述半切割保护条设于所述驱动电路功能层上的所述结构层边缘的位置处。
  16. 根据权利要求14所述的显示面板，其中，所述结构层包括发光功能层和位于所述发光功能层上方的封装层，并且所述多个结构层中至少所述封装层延伸到所述半切割区中以位于所述驱动电路功能层上，其中，所述半切割保护条设于所述封装层上。
  17. 根据权利要求14所述的显示面板，其中，所述半切割保护条包括导热材料。
  18. 根据权利要求17所述的显示面板，其中，所述导热材料包括石墨。
  19. 根据权利要求14所述的显示面板，其中，在垂直于所述显示面板的方向上，所述半切割保护条的厚度为10μm-100μm。
  20. 根据权利要求14所述的显示面板，其中，所述半切割保护条的宽度为0.1mm-2mm。
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CN107482045A (zh) 2017-08-24 2017-12-15 京东方科技集团股份有限公司 一种显示面板及其制备方法
CN109599427B (zh) 2018-12-14 2021-05-14 京东方科技集团股份有限公司 显示基板的制备方法、显示面板及显示装置
CN110597420B (zh) * 2019-09-25 2023-06-27 京东方科技集团股份有限公司 触控组件和显示装置
CN111613141A (zh) * 2020-05-25 2020-09-01 武汉华星光电半导体显示技术有限公司 一种显示模组及显示面板
CN112614878A (zh) * 2021-01-19 2021-04-06 浙江宏禧科技有限公司 一种单曲面硅基微型显示器的制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250620A (ja) * 2006-03-14 2007-09-27 Seiko Epson Corp 基板の割断方法、および電気光学装置の製造方法
CN103325337A (zh) * 2012-03-22 2013-09-25 乐金显示有限公司 平板显示装置及其制造方法
CN106328680A (zh) * 2016-08-25 2017-01-11 昆山国显光电有限公司 有机发光显示装置的激光密封导热治具及激光密封方法
CN107482045A (zh) * 2017-08-24 2017-12-15 京东方科技集团股份有限公司 一种显示面板及其制备方法
CN207068857U (zh) * 2017-08-24 2018-03-02 京东方科技集团股份有限公司 一种显示面板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009098425A (ja) * 2007-10-17 2009-05-07 Hitachi Displays Ltd 液晶表示装置及びその製造方法
KR101503312B1 (ko) * 2008-06-25 2015-03-18 엘지디스플레이 주식회사 액정표시장치
KR20100089329A (ko) * 2009-02-03 2010-08-12 삼성전자주식회사 표시장치의 및 이의 제조방법
US8614776B2 (en) * 2010-10-26 2013-12-24 Samsung Display Co., Ltd. Display panel, display apparatus having the same, method of manufacturing the same and method of cutting the same
JP2015122148A (ja) * 2013-12-20 2015-07-02 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置
KR102124906B1 (ko) * 2013-12-26 2020-07-07 엘지디스플레이 주식회사 터치스크린을 구비한 유기전계 발광소자 및 이의 제조 방법
KR20160000980A (ko) * 2014-06-25 2016-01-06 삼성디스플레이 주식회사 디스플레이 장치
CN104536167A (zh) * 2014-12-23 2015-04-22 深圳市华星光电技术有限公司 一种窄边框显示装置
CN105373228A (zh) * 2015-11-05 2016-03-02 京东方科技集团股份有限公司 压力反馈装置、触控显示装置及其工作方法
CN106409875A (zh) * 2016-11-11 2017-02-15 上海天马微电子有限公司 一种显示面板、显示面板母板及其制作方法
DE102016122901A1 (de) * 2016-11-28 2018-05-30 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102490894B1 (ko) * 2018-02-08 2023-01-25 삼성디스플레이 주식회사 유기 발광 표시 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250620A (ja) * 2006-03-14 2007-09-27 Seiko Epson Corp 基板の割断方法、および電気光学装置の製造方法
CN103325337A (zh) * 2012-03-22 2013-09-25 乐金显示有限公司 平板显示装置及其制造方法
CN106328680A (zh) * 2016-08-25 2017-01-11 昆山国显光电有限公司 有机发光显示装置的激光密封导热治具及激光密封方法
CN107482045A (zh) * 2017-08-24 2017-12-15 京东方科技集团股份有限公司 一种显示面板及其制备方法
CN207068857U (zh) * 2017-08-24 2018-03-02 京东方科技集团股份有限公司 一种显示面板

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