WO2018024041A1 - 母板基板、母板面板、显示面板及其制作方法、显示装置 - Google Patents

母板基板、母板面板、显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2018024041A1
WO2018024041A1 PCT/CN2017/089338 CN2017089338W WO2018024041A1 WO 2018024041 A1 WO2018024041 A1 WO 2018024041A1 CN 2017089338 W CN2017089338 W CN 2017089338W WO 2018024041 A1 WO2018024041 A1 WO 2018024041A1
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Prior art keywords
reflective structure
substrate
reflective
reflection
display
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PCT/CN2017/089338
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English (en)
French (fr)
Inventor
周桢力
蒋志亮
梁逸南
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Priority to US15/735,368 priority Critical patent/US10680211B2/en
Publication of WO2018024041A1 publication Critical patent/WO2018024041A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/878—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • Embodiments of the present disclosure relate to a motherboard substrate, a motherboard panel, a display panel, a method of fabricating the same, and a display device.
  • OLED Organic Light-Emitting Diode
  • Embodiments of the present disclosure provide a motherboard substrate, a motherboard panel, a display panel, a method of fabricating the same, and a display device.
  • At least one embodiment of the present disclosure provides a motherboard substrate including a plurality of display substrates arranged in an array and a region between adjacent display substrates, each display substrate including a to-be-packaged area, and the to-be-packaged area is provided with The first reflective structure, the outer side of the display substrate is located between the adjacent display substrates, and is provided with a second reflective structure, and the second reflective structure is spaced apart from the first reflective structure.
  • the first reflective structure is a U-shaped reflective structure
  • the to-be-packaged area of the display substrate is further provided with a trace portion, and the trace portion is disposed in an open area of the U-shaped reflective structure.
  • the U-shaped reflective structure includes a second reflective portion and a third reflective portion that are opposite in position, and a first reflective portion between the second reflective portion and the third reflective portion, the first reflective portion and the first reflective portion The traces are opposite.
  • the second reflective structure includes a fourth reflective portion, a fifth reflective portion, and a sixth reflective portion. The fourth reflecting portion is disposed outside the first reflecting portion, the fifth reflecting portion is disposed outside the second reflecting portion, and the sixth reflecting portion is disposed outside the third reflecting portion .
  • the first reflecting portion, the second reflecting portion, and the third reflecting portion have a width of 200 ⁇ m to 400 ⁇ m
  • the fourth reflecting portion, the fifth reflecting portion, and the sixth reflecting portion are The width is from 50 ⁇ m to 250 ⁇ m.
  • the second reflective structure further includes a seventh reflecting portion and an eighth reflecting portion, wherein the seventh reflecting portion is disposed outside the corner portion formed by the first reflecting portion and the second reflecting portion, The eight reflection portion is disposed outside the corner portion formed by the first reflection portion and the third reflection portion.
  • the second reflective structure is a metal strip structure.
  • the second reflective structure comprises a plurality of metal block structures arranged in an array.
  • the metal block structure is a rectangular metal block structure, a circular metal block structure, or a triangular metal block structure.
  • the materials of the first reflective structure and the second reflective structure are both molybdenum.
  • An embodiment of the present disclosure provides a motherboard panel including the motherboard substrate and a opposite substrate connected to the motherboard substrate by a sealant. Embodiments of the present disclosure provide a display panel that is cut from the motherboard panel. Embodiments of the present disclosure provide a display device including the display panel. An embodiment of the present disclosure provides a method for manufacturing a display panel, including:
  • first reflective structure Forming a first reflective structure on a portion of the display substrate to be packaged on the mother substrate, and forming a second reflective structure on an outer side of the display substrate, the second reflective structure being located outside the first reflective structure and a reflective structure is arranged at intervals;
  • Pressure is applied to the surface of the cutting line, and the display panel is formed after the split.
  • the second reflective structure is a metal strip structure on the side of the motherboard substrate away from the sealant
  • the cutting line is scored, the path of the cutting line falling into the space between the first reflective structure and the second reflective structure.
  • the second reflective structure includes a plurality of metal block structures arranged in an array, and a cutting line is scribed on a side of the motherboard substrate away from the sealant, and a path of the cutting line falls into the first reflective structure and the The spacing between the second reflective structures or the spacing of the plurality of metal block structures.
  • FIG. 1 is a schematic structural view of a motherboard substrate according to an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view showing a display substrate and a second reflective structure on an outer side thereof according to an embodiment of the present disclosure
  • FIG. 3 is a cross-sectional view showing a display substrate and a second reflective structure on an outer side thereof according to another embodiment of the present disclosure
  • FIG. 4 is a cross-sectional view showing a display substrate and a second reflective structure on an outer side thereof according to still another embodiment of the present disclosure
  • FIG. 5 is a flow chart of a method of manufacturing a display panel according to an embodiment of the present disclosure.
  • the uncut OLED motherboard panel includes a plurality of OLED display panels spaced apart from each other, each OLED display panel comprising: an evaporation substrate, an OLED device on the evaporation substrate, opposite to the vapor deposition substrate above the vapor deposition substrate Package substrate.
  • each OLED display panel comprising: an evaporation substrate, an OLED device on the evaporation substrate, opposite to the vapor deposition substrate above the vapor deposition substrate Package substrate.
  • the to-be-packaged region 1 has a U-shaped metal structure formed by a coating process, the U-shaped metal structure includes the second metal portion and the third metal portion opposite in position, and the second metal portion and The first metal portion between the third metal portions, the opening region of the U-shaped metal structure is a wiring portion, and the wiring portion is connected to the printed circuit board or the flexible printed circuit board.
  • the sealant is coated on the area to be packaged of the package substrate, and the sealant is sintered by the laser sintering device to achieve good packaging of the OLED display panel.
  • the inventors have noted that in order to achieve a narrow bezel of the display device, one technical solution is to narrow the widths of the first metal portion, the second metal portion, and the third metal portion of the U-shaped metal structure.
  • the coating width of the sealant is within a certain range, which results in the coating width of the sealant is greater than that of the first metal portion, the second metal portion, and the third metal.
  • the width of the part when the frame sealant outside the U-shaped metal structure is laser-sintered, since there is no reflection of the metal part on the laser, the effective sintering cannot be performed.
  • the OLED display is cut, the OLED display is greatly affected. The cutting effect of the screen and the poor packaging of the OLED display.
  • the embodiments of the present disclosure provide a motherboard substrate, a motherboard panel, a display panel, a display device, and How to make the display panel.
  • an embodiment of the present disclosure provides a motherboard substrate including a plurality of display substrates 10 arranged in an array and regions located outside or between adjacent display substrates 10 .
  • each display substrate 10 includes a to-be-packaged area, and the to-be-packaged area is provided with a first reflective structure 100, and an outer side of the display substrate 100 is disposed between the adjacent display substrates 10 with a second reflection.
  • the structure 200, the second reflective structure 200 is spaced apart from the first reflective structure 100.
  • the first reflective structure 100 is for reflecting light.
  • the first reflective structure 100 can be a metal structure.
  • the material thereof is, for example, molybdenum;
  • the second reflective structure 200 is also used to reflect light.
  • the second reflective structure 200 can be, for example, a metal structure.
  • the material thereof is, for example, molybdenum.
  • the motherboard substrate needs to be connected to the opposite substrate through the sealant.
  • the sealant is coated between the to-be-packaged area and the opposite-side substrate of the mother board substrate, between the second reflective structure and the opposite side substrate, and on the mother board substrate corresponding to the space between the first reflective structure and the second reflective structure Between the opposite side substrate.
  • the frame sealant is subjected to laser sintering, since the first reflection structure and the second reflection structure both reflect the laser light, the frame sealant in the above region can be sufficiently irradiated with laser light, and thus can be sufficiently sintered.
  • the path of the cutting line avoids the first reflective structure and the second reflective structure, in the pair of the mother board
  • the mother board panel can be easily ruptured to form the display panel, so that the cutting effect of the mother board panel is greatly improved, and the packaging effect of the display panel is also better.
  • the width of the first reflective structure can be made narrower, thereby achieving a narrow bezel design of the display device.
  • the first reflective structure 100 is a U-shaped reflective structure.
  • the area to be packaged of the display substrate 10 further includes a wiring portion 104 which is disposed in an open area of the U-shaped reflective structure, and the wiring portion is connected to a printed circuit board or a flexible printed circuit board (not shown).
  • the trace portion is usually a metal trace portion
  • the metal trace portion can reflect the laser light, and thus the sealant applied between the trace portion and the opposite substrate can be sufficiently obtained. sintering.
  • the first reflective structure 100 includes second reflective portions 102 and third reflective portions 103 that are opposite in position, and first reflective portions between the second reflective portion 102 and the third reflective portion 103. 101.
  • the first reflection portion is opposite to the line portion.
  • the second reflective structure 200 includes a fourth reflective portion 201, a fifth reflective portion 202, and a sixth reflective portion 203.
  • the fourth reflection portion 201 is disposed outside the first reflection portion 101
  • the fifth reflection portion 202 is disposed outside the second reflection portion 102
  • the sixth reflection portion 203 is disposed outside the third reflection portion 103 .
  • the side opposite to the side of the line portion 104 is a first side, and the sides adjacent to the first side are a second side.
  • Side and third side Referring to FIG. 2, in the above embodiment, the first reflecting portion 101 is located at the first side, the second reflecting portion 102 is located at the second side, and the third reflecting portion 103 is located at the third side, and the fourth reflecting portion is correspondingly 201 is located outside the first side, the fifth reflecting portion 202 is located outside the second side, and the sixth reflecting portion 203 is located outside the third side.
  • the widths of the first reflecting portion 101, the second reflecting portion 102, and the third reflecting portion 103 may vary.
  • the widths of the first reflecting portion 101, the second reflecting portion 102, and the third reflecting portion 103 are 200 ⁇ m to 400 ⁇ m.
  • the coating width of the sealant is generally about 450 ⁇ m. Therefore, the widths of the fourth reflecting portion 201, the fifth reflecting portion 202, and the sixth reflecting portion 203 are 50 ⁇ m to 250 ⁇ m.
  • the coating width of the sealant can be varied.
  • the coating width of the sealant can be made narrower, for example, 350 mm to 450 mm, in which case the first reflective structure 100 and the first The width of the two reflective structures 200 will also be adjusted accordingly.
  • the second reflective structure 200 further includes a seventh reflective portion 204 and an eighth reflective portion 205.
  • the seventh reflecting portion 204 is disposed outside the corner portion formed by the first reflecting portion 101 and the second reflecting portion 102
  • the eighth reflecting portion 205 is disposed outside the corner portion formed by the first reflecting portion 101 and the third reflecting portion 103.
  • the second reflecting structure has a stronger reflection effect on the laser, and the frame sealing glue can be more fully sintered, so that the cutting effect of the mother board panel is better, and the packaging effect is better.
  • the shape of the second reflective structure 200 may be, for example, a metal strip structure or a plurality of metal block structures arranged in an array, but embodiments of the present disclosure are not limited thereto.
  • the second reflective structure 200 is a metal strip structure.
  • the path of the cutting line falls into the interval between the first reflection structure and the metal strip structure due to the first reflection structure
  • the metal strip structure and the sealant attached to the region between the first reflective structure and the metal strip structure can be sufficiently sintered, so that the display panel can be easily removed from the motherboard panel when pressure is applied along the extending direction of the cutting line.
  • the upper part is separated, so the cutting effect of the mother board panel during cutting is better.
  • the second reflective structure 200 includes a plurality of metal block structures arranged in an array.
  • the shape of the metal block structure may be, for example, a rectangular metal block structure, a circular metal block structure, or a triangular metal block structure, but embodiments of the present disclosure are not limited thereto.
  • the cutting path falls into the interval between the first reflection structure and the second reflection structure, or falls into a plurality of metals
  • the space between the block structures due to the first reflective structure, the plurality of metal block structures, the spacing of the plurality of metal block structures, and the gap between the first reflective structure and the plurality of metal block structures Sufficient sintering can be obtained, and therefore, when pressure is applied along the extending direction of the cutting line, the display panel can be more easily separated from the mother panel, and thus the cutting effect of the mother panel during cutting is better.
  • An embodiment of the present disclosure provides a motherboard panel including the motherboard substrate and a opposite substrate connected to the motherboard substrate by a sealant.
  • the mother panel has a better cutting effect.
  • Embodiments of the present disclosure provide a display panel cut from the motherboard panel. Since the cutting effect of the mother board panel is better, the packaging effect of the display panel is also better.
  • Embodiments of the present disclosure provide a display device including the display panel.
  • the display device may be, for example, a product or a component such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like.
  • the display device can realize a narrow bezel design.
  • an embodiment of the present disclosure further provides a method for manufacturing a display panel, including:
  • Step 101 forming a first reflective structure on a portion of the display substrate to be packaged on the mother substrate, and forming a second reflective structure on the outer side of the display substrate, the second reflective structure being located outside the first reflective structure and first The reflection structure is spaced apart;
  • Step 102 between the to-be-packaged area and the opposite substrate, between the second reflective structure and the opposite substrate, and the spacing portion between the first reflective structure and the second reflective structure on the motherboard substrate and the opposite substrate Coated sealant;
  • Step 103 performing laser sintering on the sealant
  • Step 104 scribing a cutting line on a side of the motherboard substrate away from the sealant, the path of the cutting line avoiding the first reflective structure and the second reflective structure;
  • Step 105 Apply pressure to the surface of the cutting line, and form a display panel after splitting.
  • step 104 the path of the cutting line avoids the first reflective structure and the second reflective structure, mainly as the following two embodiments:
  • the second reflective structure is a metal strip structure.
  • the path of the cutting line avoids the first reflective structure and the second reflective structure, meaning that the path of the cutting line falls into the space between the first reflective structure and the second reflective structure.
  • the second reflective structure comprises a plurality of metal block structures arranged in an array.
  • the path of the cutting line avoids the first reflective structure and the second reflective structure means that the path of the cutting line falls within the interval between the first reflective structure and the second reflective structure, or falls into a plurality of metals The spacing of the block structure.
  • the display panel manufactured by the above method has better cutting effect and better packaging effect.
  • the width of the first reflective structure can be made narrower, thereby realizing the narrow bezel design of the display panel.

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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
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  • Electroluminescent Light Sources (AREA)
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Abstract

一种母板基板、母板面板、显示面板、显示装置及显示面板的制作方法。母板基板包括阵列排布的多个显示基板（10）和位于相邻显示基板之间的区域，每个显示基板包括待封装区（1），待封装区设置有第一反射结构（100），显示基板的外侧位于相邻显示基板之间的区域设置有第二反射结构（200），第二反射结构与第一反射结构间隔设置。

Description

母板基板、母板面板、显示面板及其制作方法、显示装置
相关申请的交叉引用
本申请要求于2016年08月01日向SIPO提交的名称为“母板基板、母板面板、显示面板及其制作方法、显示装置”的中国专利申请No.201610622334.1的优先权，其全文通过引用合并于本文。
技术领域
本公开的实施例涉及一种母板基板、母板面板、显示面板及其制作方法、显示装置。
背景技术
OLED(Organic Light-Emitting Diode，有机发光二级管，简称OLED)显示屏由于具有薄、轻、宽视角、主动发光、发光颜色连续可调、成本低、响应速度快、能耗小、驱动电压低、工作温度范围宽、生产工艺简单、发光效率高及可柔性显示等优点，已被列为极具发展前景的下一代显示技术。
发明内容
本公开的实施例提供一种母板基板、母板面板、显示面板及其制作方法、显示装置。
本公开的至少一个实施例提供一种母板基板，包括阵列排布的多个显示基板和位于相邻显示基板之间的区域，每个显示基板包括待封装区，所述待封装区设置有第一反射结构，所述显示基板的外侧位于相邻显示基板之间的区域设置有第二反射结构，所述第二反射结构与第一反射结构间隔设置。
例如，所述第一反射结构为U型反射结构，所述显示基板的待封装区还设置有走线部，所述走线部设置于所述U型反射结构的开口区。
又例如，所述U型反射结构包括位置相对的第二反射部和第三反射部，以及位于第二反射部和第三反射部之间的第一反射部，所述第一反射部与所 述走线部相对。所述第二反射结构包括第四反射部、第五反射部和第六反射部。所述第四反射部设置于所述第一反射部的外侧，所述第五反射部设置于所述第二反射部的外侧，所述第六反射部设置于所述第三反射部的外侧。
例如，所述第一反射部、所述第二反射部以及所述第三反射部的宽度为200μm～400μm，所述第四反射部、所述第五反射部以及所述第六反射部的宽度为50μm～250μm。
例如，所述第二反射结构还包括第七反射部和第八反射部，所述第七反射部设置于所述第一反射部与所述第二反射部形成的角部外侧，所述第八反射部设置于所述第一反射部与所述第三反射部形成的角部外侧。例如，所述第二反射结构为金属条结构。
例如，所述第二反射结构包括阵列排布的多个金属块结构。
例如，所述金属块结构为矩形金属块结构、圆形金属块结构或者三角形金属块结构。
例如，所述第一反射结构和所述第二反射结构的材质均为钼。
本公开实施例提供一种母板面板，包括所述的母板基板以及与所述母板基板通过封框胶连接的对侧基板。本公开实施例提供一种显示面板，所述显示面板由所述母板面板切割而成。本公开实施例提供一种显示装置，包括所述显示面板。本公开实施例提供一种显示面板的制作方法，包括：
在母板基板上每个显示基板的待封装区形成第一反射结构，以及在显示基板外侧形成第二反射结构，所述第二反射结构位于所述第一反射结构的外侧且与所述第一反射结构间隔设置；
在所述待封装区与对侧基板之间、第二反射结构与对侧基板之间，以及母板基板上对应第一反射结构和第二反射结构之间的间隔部分与对侧基板之间涂覆封框胶；
对封框胶进行激光烧结；
在母板基板远离封框胶的一侧刻划切割线，切割线的路径避让第一反射结构和第二反射结构；以及
在切割线表面施加压力，裂片后形成显示面板。
例如，所述第二反射结构为金属条结构，在母板基板远离封框胶的一侧 刻划切割线，切割线的路径落入第一反射结构与所述第二反射结构之间的间隔。
例如，所述第二反射结构包括阵列排布的多个金属块结构，在母板基板远离封框胶的一侧刻划切割线，切割线的路径落入所述第一反射结构与所述第二反射结构之间的间隔，或者落入所述多个金属块结构的间隔。
附图说明
以下将结合附图对本公开的实施例进行更详细的说明，以使本领域普通技术人员更加清楚地理解本公开的实施例，其中：
图1为本公开实施例母板基板的结构示意图；
图2为本公开实施例一显示基板与位于其外侧的第二反射结构的截面图；
图3为本公开另一实施例的一显示基板与位于其外侧的第二反射结构的截面图；
图4为本公开又一实施例的一显示基板与位于其外侧的第二反射结构的截面图；
图5为本公开实施例显示面板的制造方法流程图。
具体实施方式
下面将结合本公开的实施例中的附图，对本公开的实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开的一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在无须做出创造性劳动前提下所获得的所有其它实施例，都应属于本公开保护的范围。
除非另外定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当 被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
未切割的OLED母板面板包括间隔设置的多个OLED显示面板，每个OLED显示面板包括：蒸镀基板，位于蒸镀基板之上的OLED器件，在蒸镀基板的上方与蒸镀基板位置相对的封装基板。母板面板封装完成后，需要对其进行切割操作，将OLED显示面板切割分离，切割分离之后的OLED显示面板即为一个OLED显示屏。
对于OLED显示面板的蒸镀基板，其待封装区1具有通过镀膜工艺形成的U型金属结构，U型金属结构包括位置相对的第二金属部和第三金属部，以及位于第二金属部和第三金属部之间的第一金属部，U型金属结构的开口区为走线部，走线部与印刷电路板或者柔性印刷电路板连接。当对OLED显示面板进行封装时，需要在封装基板的待封装区涂覆封框胶，通过激光烧结设备对封框胶进行烧结，以实现对OLED显示面板的良好封装。
发明人注意到，为了实现显示装置的窄边框，一种技术方案为：将U型金属结构的第一金属部、第二金属部以及第三金属部的宽度做窄。然而，为了保证OLED显示屏的封装性能，封框胶的涂覆宽度要在一定范围内，这就导致了封框胶的涂覆宽度要大于第一金属部、第二金属部以及第三金属部的宽度，超出U型金属结构外侧的封框胶在进行激光烧结时，由于没有金属部对激光的反射作用，无法进行有效烧结，当对OLED显示屏进行切割时，会大大影响到OLED显示屏的切割效果，并导致OLED显示屏封装不良。
为了提高母板面板的切割效果，并提高显示面板的封装效果，同时有利于显示装置实现窄边框设计，本公开的实施例提供了一种母板基板、母板面板、显示面板、显示装置及显示面板的制作方法。
如图1所示，本公开实施例提供一种母板基板，包括阵列排布的多个显示基板10和位于相邻显示基板10外侧或之间的区域。请参考图2所示，每个显示基板10包括待封装区，所述待封装区设置有第一反射结构100，显示基板100的外侧位于相邻显示基板10之间的区域设置有第二反射结构200，第二反射结构200与第一反射结构100间隔设置。
第一反射结构100用于对光起到反射作用。例如，第一反射结构100可以为金属结构。当第一反射结构100为金属结构时，其材质例如采用钼；类 似的，第二反射结构200也用于对光起到反射作用。第二反射结构200例如可以为金属结构。当第二反射结构200为金属结构时，其材质例如采用钼。
在本公开实施例的技术方案中，母板基板需要通过封框胶与对侧基板连接。封框胶涂覆在母板基板的待封装区与对侧基板之间、第二反射结构与对侧基板之间以及母板基板上对应第一反射结构与第二反射结构之间的间隔部分与对侧基板之间。当对封框胶进行激光烧结时，由于第一反射结构和第二反射结构对激光均有反射作用，因此，上述区域的封框胶可以得到充分的激光照射，因而可以充分烧结。
基于上述原理，当对由母板基板以及与其通过封框胶连接的对侧基板形成的母板面板进行切割时，切割线的路径避让第一反射结构与第二反射结构，在对母板面板沿切割线方向施加压力时，母板面板可以较为容易地裂片形成显示面板，因而母板面板的切割效果得到了大大提高，进而显示面板的封装效果也较好。并且，基于上述设计，第一反射结构的宽度可以做得较窄，从而实现显示装置的窄边框设计。
在本公开的一个示例实施例中，请参考图2和图3所示，第一反射结构100为类似U型的反射结构。显示基板10的待封装区还包括走线部104，走线部104设置于U型反射结构的开口区，走线部与印刷电路板或者柔性印刷电路板(图中未示出)连接。
在该示例实施例中，由于走线部通常为金属走线部，金属走线部可以对激光起到反射作用，因而涂覆在走线部与对侧基板之间的封框胶可以得到充分烧结。
例如，请参考图2所示，第一反射结构100包括位置相对的第二反射部102和第三反射部103，以及位于第二反射部102和第三反射部103之间的第一反射部101，第一反射部与走线部相对。第二反射结构200包括第四反射部201、第五反射部202和第六反射部203。
第四反射部201设置于第一反射部101的外侧，第五反射部202设置于第二反射部102的外侧，第六反射部203设置于第三反射部103的外侧。
在本公开的实施例中，设定显示基板的待封装区中，与走线部104一侧相对的侧边为第一侧边，与第一侧边相邻的两侧边为第二侧边和第三侧边， 参考图2可知，上述实施例为：第一反射部101位于第一侧边，第二反射部102位于第二侧边，第三反射部103位于第三侧边，相应的，第四反射部201位于第一侧边外侧，第五反射部202位于第二侧边外侧，第六反射部203位于第三侧边外侧。
需要说明的是，上述所说的位置相对，指的是相应部分在母板基板上的正投影互相平行。
第一反射部101、第二反射部102和第三反射部103的宽度可以变化。考虑到显示装置的窄边框设计，例如，第一反射部101、第二反射部102和第三反射部103的宽度为200μm～400μm。为了保证显示面板良好的封装效果，封框胶的涂覆宽度一般为450μm左右，因此，第四反射部201、第五反射部202以及第六反射部203的宽度为50μm～250μm。封框胶的涂覆宽度可以变化，为了实现显示装置的窄边框设计，封框胶的涂覆宽度可以做得更窄，例如为350mm～450mm，在此情况下，第一反射结构100和第二反射结构200的宽度也会做相应的调整。
在本公开的一个示例实施例中，如图3所示，第二反射结构200还包括第七反射部204和第八反射部205。第七反射部204设置于第一反射部101与第二反射部102形成的角部外侧，第八反射部205设置于第一反射部101与第三反射部103形成的角部外侧。采用这样的设计，第二反射结构对激光的反射效果更强，封框胶可以得到更加充分的烧结，因而母板面板的切割效果更好，进而封装效果也更好。
在上述各实施例中，第二反射结构200的形状例如可以为金属条结构，或者包括阵列排布的多个金属块结构，但是本公开的实施例并不限于此。
在图2和图3所示的实施例中，第二反射结构200为金属条结构。当对由母板基板以及与其通过封框胶连接的对侧基板形成的母板面板进行切割时，切割线的路径落入第一反射结构与金属条结构的间隔中，由于与第一反射结构、金属条结构以及第一反射结构和金属条结构之间区域连接的封框胶均可以得到充分烧结，因此，在沿切割线的延伸方向施加压力时，显示面板可以较为容易地从母板面板上分离开来，因而母板面板在切割时的切割效果较好。
在图4所示的实施例中，第二反射结构200包括阵列排布的多个金属块结构。金属块结构的形状例如可以为矩形金属块结构、圆形金属块结构或者三角形金属块结构，但是本公开的实施例并不限于此。当对由母板基板以及与其通过封框胶连接的对侧基板形成的母板面板进行切割时，切割的路径落入第一反射结构与第二反射结构的间隔中，或者落入多个金属块结构之间的间隔中，由于与第一反射结构、多个金属块结构、多个金属块结构的间隔以及第一反射结构和多个金属块结构之间的间隔部分连接的封框胶均可以得到充分烧结，因此，在沿切割线的延伸方向施加压力时，显示面板可以较为容易地从母板面板上分离开来，因而母板面板在切割时的切割效果较好。
本公开实施例提供一种母板面板，包括所述母板基板以及与所述母板基板通过封框胶连接的对侧基板。该母板面板的切割效果较好。
本公开实施例提供一种显示面板，由所述母板面板切割而成。由于所述母板面板的切割效果较好，因而该显示面板的封装效果也较好。
本公开实施例提供一种显示装置，包括所述显示面板。该显示装置例如可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等产品或部件。该显示装置可以实现窄边框设计。
如图5所示，本公开实施例还提供一种显示面板的制作方法，包括：
步骤101：在母板基板上每个显示基板的待封装区形成第一反射结构，以及在显示基板外侧形成第二反射结构，所述第二反射结构位于第一反射结构的外侧且与第一反射结构间隔设置；
步骤102：在待封装区与对侧基板之间、第二反射结构与对侧基板之间，以及母板基板上对应第一反射结构和第二反射结构之间的间隔部分与对侧基板之间涂覆封框胶；
步骤103：对封框胶进行激光烧结；
步骤104：在母板基板远离封框胶的一侧刻划切割线，切割线的路径避让第一反射结构和第二反射结构；
步骤105：在切割线表面施加压力，裂片后形成显示面板。
步骤104中，切割线的路径避让第一反射结构和第二反射结构，主要表现为以下两个实施例：
在一个实施例中，第二反射结构为金属条结构。在该实施例中，切割线的路径避让第一反射结构和第二反射结构，指的是，切割线的路径落入第一反射结构与第二反射结构之间的间隔。
在另一个实施例中，第二反射结构包括阵列排布的多个金属块结构。在该实施例中，切割线的路径避让第一反射结构和第二反射结构指的是：切割线的路径落入第一反射结构与第二反射结构之间的间隔，或者落入多个金属块结构的间隔。
采用上述方法制作的显示面板，其切割效果较好，进而封装效果也较好，同时，第一反射结构的宽度可以做得较窄，因而实现显示面板的窄边框设计。
以上所述，仅为本公开的示例性实施例，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。

Claims (15)

  1. 一种母板基板，包括：阵列排布的多个显示基板，每个显示基板包括待封装区，所述待封装区设置有第一反射结构，所述显示基板的外侧设置有第二反射结构，所述第二反射结构与第一反射结构间隔设置。
  2. 如权利要求1所述的母板基板，其中所述第一反射结构为U型反射结构，所述显示基板的待封装区还设置有走线部，所述走线部设置于所述U型反射结构的开口区内。
  3. 如权利要求2所述的母板基板，其中所述U型反射结构包括位置相对的第二反射部和第三反射部，以及位于第二反射部和第三反射部之间的第一反射部，所述第一反射部与所述走线部相对，所述第二反射结构包括第四反射部、第五反射部和第六反射部，其中：
    第四反射部设置于第一反射部的外侧，第五反射部设置于第二反射部的外侧，第六反射部设置于第三反射部的外侧。
  4. 如权利要求3所述的母板基板，其中所述第一反射部、第二反射部以及第三反射部的宽度为200μm～400μm，所述第四反射部、第五反射部以及第六反射部的宽度为50μm～250μm。
  5. 如权利要求3所述的母板基板，其中所述第二反射结构还包括第七反射部和第八反射部，所述第七反射部设置于所述第一反射部与所述第二反射部形成的角部外侧，所述第八反射部设置于所述第一反射部与所述第三反射部形成的角部外侧。
  6. 如权利要求1-5任一项所述的母板基板，其中所述第二反射结构为金属条结构。
  7. 如权利要求1-5任一项所述的母板基板，其中所述第二反射结构包括阵列排布的多个金属块结构。
  8. 如权利要求7所述的母板基板，其中所述金属块结构为矩形金属块结 构、圆形金属块结构或者三角形金属块结构。
  9. 如权利要求1～8任一项所述的母板基板，其中所述第一反射结构和所述第二反射结构的材质均为钼。
  10. 一种母板面板，包括如权利要求1～9任一项所述的母板基板以及与所述母板基板通过封框胶连接的对侧基板。
  11. 一种显示面板，其中所述显示面板由权利要求10所述的母板面板切割而成。
  12. 一种显示装置，包括如权利要求11所述的显示面板。
  13. 一种显示面板的制作方法，包括：
    在母板基板上每个显示基板的待封装区形成第一反射结构，以及在显示基板外侧形成第二反射结构，所述第二反射结构位于第一反射结构的外侧且与第一反射结构间隔设置；
    在所述待封装区与对侧基板之间、第二反射结构与对侧基板之间，以及母板基板上对应第一反射结构和第二反射结构之间的间隔部分与对侧基板之间涂覆封框胶；
    对所述封框胶进行激光烧结；
    在所述母板基板远离所述封框胶的一侧刻划切割线，切割线的路径避让所述第一反射结构和所述第二反射结构；以及
    在所述切割线的表面施加压力，裂片后形成所述显示面板。
  14. 如权利要求13所述的制作方法，其中所述第二反射结构为金属条结构，所述方法还包括：
    在所述母板基板远离所述封框胶的一侧刻划的所述切割线的路径落入第一反射结构与第二反射结构之间的间隔。
  15. 如权利要求13所述的制作方法，其中所述第二反射结构包括阵列排布的多个金属块结构，所述制作方法还包括：
    在母板基板远离封框胶的一侧刻划切割线，切割线的路径落入第一反射 结构与第二反射结构之间的间隔，或者落入多个金属块结构的间隔。
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