WO2018181175A1 - 配線体、配線基板、及びタッチセンサ - Google Patents
配線体、配線基板、及びタッチセンサ Download PDFInfo
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- WO2018181175A1 WO2018181175A1 PCT/JP2018/012129 JP2018012129W WO2018181175A1 WO 2018181175 A1 WO2018181175 A1 WO 2018181175A1 JP 2018012129 W JP2018012129 W JP 2018012129W WO 2018181175 A1 WO2018181175 A1 WO 2018181175A1
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- Prior art keywords
- conductor
- wiring body
- wide
- resin
- portions
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Definitions
- the present invention relates to a wiring body, a wiring board, and a touch sensor.
- a wiring body for the designated countries that are permitted to be incorporated by reference, the contents described in Japanese Patent Application No. 2017-072259 filed in Japan on March 31, 2017 are incorporated herein by reference.
- Japanese Patent Application No. 2017-072259 filed in Japan on March 31, 2017 are incorporated herein by reference.
- a touch panel As a touch panel, a touch panel is known that includes a conductor portion having a mesh pattern of fine metal wires, and a moire suppression portion is formed at an intersection of the mesh pattern (see, for example, Patent Document 1).
- the area of the moire suppressing portion is formed so as to be larger than the area of the crossing portion of the thin lines.
- the problem to be solved by the present invention is to provide a wiring body, a wiring board, and a touch sensor that can suppress a decrease in reliability while improving visibility.
- a wiring body includes a resin portion and a conductor portion provided on the resin portion, the first conductor wire and the second conductor wire crossing each other to form a mesh,
- the conductor portion includes at least one wide portion arranged corresponding to the intersection of the first conductor wire and the second conductor wire,
- the wiring body satisfies the following formula (1). 6 ⁇ Sc / (La ⁇ Lb) ⁇ 30 (1)
- Sc is the area of the wide portion
- La is the width of the first conductor line
- Lb is the width of the second conductor line.
- the conductor portion is formed narrowly with respect to the plurality of sensing portions arranged at intervals along a predetermined direction, and connects the adjacent sensing portions to each other.
- the wide part may be arranged corresponding to at least one of the crossing parts existing in the connection part.
- the wide portion is disposed corresponding to at least one of the intersecting portions present in the sensing portion, and may satisfy the following expressions (5) to (7).
- a ⁇ B (5) (A 1 + A 1 ) / N 1 (6)
- B (B 1 + B 2 ) / N 2 (7)
- a 1 is the sum of the areas of the wide portions in one of the sensing units
- a 2 is the sum of the areas of the intersections in which the wide portions of the one sensing unit do not exist.
- N 1 is the number of the intersections in one of the sensing units, and in the formula (7), B 1 is the sum of the areas of the wide portions in one of the connection parts, and B 2 is one Is the sum of the areas of the intersecting portions where the wide portion does not exist, and N 2 is the number of the intersecting portions in one connecting portion.
- connection portion in the connection portion, the number of the intersecting portions arranged in parallel in a direction orthogonal to the extending direction of the connection portion may be three or less.
- a wiring board according to the present invention is a wiring board including the wiring body and a support body that supports the wiring body.
- a touch sensor according to the present invention is a touch sensor including the wiring board.
- FIG. 1 is a plan view showing a touch sensor according to an embodiment of the present invention.
- FIG. 2 is an exploded perspective view showing a wiring board according to an embodiment of the present invention.
- FIG. 3 is a plan view showing a first electrode according to an embodiment of the present invention.
- FIG. 4 is a plan view for explaining the aperture ratio.
- FIG. 5 is an enlarged plan view of a part of the first electrode according to the embodiment of the present invention.
- FIG. 6 is an enlarged plan view of a part of the first electrode according to another embodiment of the present invention.
- FIG. 7 is a plan view showing a first electrode according to another embodiment of the present invention.
- FIG. 8 is a plan view showing a second electrode according to an embodiment of the present invention.
- 9A to 9E are cross-sectional views (No. 1) for explaining the method of manufacturing the wiring board according to the embodiment of the invention.
- FIGS. 10A to 10F are sectional views (No. 2) for explaining the method of manufacturing the wiring board according to
- FIG. 1 is a plan view showing a touch sensor according to an embodiment of the present invention
- FIG. 2 is an exploded perspective view showing a wiring board according to an embodiment of the present invention
- FIG. 3 is an embodiment of the present invention.
- FIG. 4 is a plan view for explaining the aperture ratio
- FIG. 5 is an enlarged plan view of a part of the first electrode according to an embodiment of the present invention
- FIG. 7 is a plan view showing the first electrode according to another embodiment of the present invention
- FIG. It is a top view which shows the 2nd electrode which concerns on one embodiment of invention.
- the touch sensor 10 shown in FIG. 1 is a projected capacitive touch panel sensor, and is used as an input device having a function of detecting a touch position in combination with a display device (not shown), for example.
- the display device is not particularly limited, and a liquid crystal display, an organic EL display, electronic paper, or the like can be used.
- a detection electrode and a drive electrode (a first electrode 61 and a second electrode 81, which will be described later) are arranged so as to overlap with an image displayed on the display device, and between the two electrodes 61, 81.
- a predetermined voltage is periodically applied from an external circuit (not shown).
- a touch sensor 10 for example, when an operator's finger (external conductor) approaches the touch sensor 10, a capacitor (electrical capacity) is formed between the external conductor and the touch sensor 10, and a gap between two electrodes is formed. The electrical state of the changes.
- the touch sensor 10 can sense the operation position of the operator based on a change in the electrical state between the two electrodes.
- the wiring board 20 includes a cover panel 30, a wiring body 40, and a transparent substrate 200 as shown in FIGS. 1 and 2.
- the wiring board 20 of the present embodiment is configured to have light transmittance as a whole in order to ensure the visibility of the display device.
- the cover panel 30 is provided on one main surface of the wiring body 40. Such a cover panel 30 has sufficient rigidity to support the wiring body 40.
- the cover panel 30 includes a transparent portion 31 that has a rectangular outer shape and can transmit visible light, and a shielding portion 32 that blocks visible light.
- the transparent portion 31 is formed in a rectangular shape
- the shielding portion 32 is formed in a rectangular frame shape around the transparent portion 31.
- the material constituting the cover panel 30 include glass materials such as soda lime glass and borosilicate glass, and resin materials such as polymethyl methacrylate (PMMA) and polycarbonate (PC).
- the shielding part 32 is formed by applying, for example, black ink to the outer peripheral part of the back surface of the cover panel 30.
- a portion that overlaps the transparent portion 31 in a plan view is a sensing region 11 that can sense the operation position of the operator. Further, in the touch sensor 10, a portion overlapping the shielding portion 32 in a plan view is the non-sensing area 12 where the operator's operation position cannot be sensed.
- the transparent substrate 200 is provided on the other main surface of the wiring body 40. Such a transparent substrate 200 has sufficient rigidity to support the wiring body 40.
- the transparent substrate 200 has a rectangular outer shape and is made of a light transmissive material. Examples of the material constituting the transparent substrate 200 include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide resin (PI), polyetherimide resin (PEI), polycarbonate (PC), polyether ether ketone ( PEEK), liquid crystal polymer (LCP), cycloolefin polymer (COP), silicone resin (SI), acrylic resin, phenol resin, epoxy resin, green sheet, glass, and the like can be used.
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- PI polyimide resin
- PEI polyetherimide resin
- PC polycarbonate
- PEEK polyether ether ketone
- LCP liquid crystal polymer
- COP cycloolefin polymer
- SI silicone resin
- the wiring body 40 includes a first resin portion 50, a first conductor portion 60, a second resin portion 70, a second conductor portion 80, and a third resin portion 90. And.
- the wiring body 40 is configured to have light transmittance as a whole in order to ensure the visibility of the display device.
- the first resin portion 50 is provided to hold the first conductor portion 60.
- the first resin portion 50 has a rectangular outer shape and is made of a resin material having light transmittance.
- the light transmissive resin material include UV curable resins such as epoxy resins, acrylic resins, polyester resins, urethane resins, vinyl resins, silicone resins, phenol resins, polyimide resins, thermosetting resins, and thermoplastic resins. Resin etc. can be illustrated.
- the first conductor part 60 is provided on the first resin part 50.
- the first conductor portion 60 is configured in a mesh shape by a plurality of conductor wires 601. Specifically, a plurality of first conductor wires 601a extending linearly along a direction inclined with respect to the X direction (hereinafter also referred to as “first direction”), the first direction, A plurality of second conductor lines 601b extending along different directions (hereinafter, also referred to as “second directions”) cross each other, thereby forming a mesh-like structure in which quadrangular lattices are repeatedly arranged.
- a first conductor portion 60 is configured.
- “first conductor line 601a” and “second conductor line 601b” are collectively referred to as “conductor line 601” as necessary.
- the conductor wire 601 of the first conductor portion 60 is not limited to a straight line, but may be a curved line. Note that the width of the conductor wire 601 is preferably substantially constant in the extending direction of the conductor wire 601.
- the width La of the first conductor line 601a is preferably set within a range of 1 to 5 ⁇ m (1 ⁇ m ⁇ La ⁇ 5 ⁇ m).
- the width Lb of the second conductor line 601b is preferably set in the range of 1 to 5 ⁇ m (1 ⁇ m ⁇ Lb ⁇ 5 ⁇ m).
- the configuration of the first conductor portion 60 is not particularly limited to the above.
- the pitch between the first conductor wires 601a and the pitch between the second conductor wires 601b are the same, but the pitch between the first conductor wires 601a and the second conductor wire are the same.
- the pitch between the 601b may be different from each other.
- the width and pitch of the conductor wire 601 constituting the first conductor portion 60 are not particularly limited to those described above, and the conductor is such that the aperture ratio of the first electrode 61 (described later) is 96.5 to 98.0%. It is preferable that the width and pitch of the line 601 are set.
- the “aperture ratio” means a ratio represented by the following formula (7) (see FIG. 4).
- (Aperture ratio) (Pa ⁇ Wb) ⁇ (Pb ⁇ Wa) / (Pa ⁇ Pb) (7)
- Wa is the width of the conductor wire 2
- Wb is the width of the conductor wire 3
- Pa is an arbitrary conductor wire 2 adjacent to the conductor wire 2.
- Pb is the distance between any conductor line 3 and another conductor line 3 adjacent to the conductor line 3.
- the shape of the lattice included in the first conductor portion 60 is not particularly limited.
- it may be a triangle such as a regular triangle, an isosceles triangle, a right triangle, or a quadrangle such as a parallelogram or a trapezoid.
- the lattice shape may be an n-gon such as a hexagon, an octagon, a dodecagon, or an icosahedron, a circle, an ellipse, or a star. In this way, a geometric pattern obtained by repeating various graphic units can be used as the lattice shape of the first conductor portion 60.
- Such a first conductor portion 60 is composed of a conductive material and a binder resin.
- Conductive materials include metallic materials such as silver, copper, nickel, tin, bismuth, zinc, indium, palladium, graphite, carbon black (furnace black, acetylene black, ketjen black), carbon nanotubes, carbon nanofibers, etc. Can be mentioned.
- a metal salt may be used as the conductive material. Examples of the metal salt include the above-described metal salts.
- binder resin examples include acrylic resin, polyester resin, epoxy resin, vinyl resin, urethane resin, phenol resin, polyimide resin, silicone resin, and fluorine resin.
- Such a first conductor portion 60 is formed by applying and solidifying (curing) a conductive paste.
- a conductive paste configured by mixing the above-described conductive material and binder resin in water or a solvent and various additives can be exemplified.
- the solvent contained in the conductive paste include ⁇ -terpineol, butyl carbitol acetate, butyl carbitol, 1-decanol, butyl cellosolve, diethylene glycol monoethyl ether acetate, and tetradecane.
- the first conductor portion 60 includes a first electrode 61, a first lead wire 62, and a first terminal 63.
- the first electrode 61 is arranged so that at least a part thereof overlaps the sensing region 11.
- Each first electrode 61 extends in the X direction in the figure, and the plurality of first electrodes 61 are arranged in parallel in the Y direction in the figure.
- One end of the first lead wire 62 is connected to one end in the longitudinal direction of each first electrode 61.
- a first terminal 63 is connected to the other end of each first lead wiring 62.
- the first terminal 63 is electrically connected to, for example, an external circuit.
- the first lead wiring 62 and the first terminal 63 are arranged so as to overlap the non-sensing area 12.
- the number of the first electrodes 61 is not particularly limited and can be arbitrarily set. Further, the number of first lead wires 62 and the number of first terminals 63 are set according to the number of first electrodes 61. The first lead wiring 62 and the first terminal 63 may be configured in a mesh shape or a solid pattern.
- the first electrode 61 is configured in a mesh shape by a plurality of conductor wires 601.
- the first electrode 61 includes a plurality of first sensing portions 611 having a rhombus shape in plan view, and a band-shaped first connection portion 612 formed narrower than the first sensing portion 611. , Including.
- the first sensing units 611 are configured to have a mesh shape with a plurality of conductor wires 601, and the plurality of first sensing units 611 are arranged at substantially equal intervals while being spaced along the X direction. ing.
- the first connection portion 612 is also configured to have a mesh shape with a plurality of conductor wires 601, and the plurality of first connection portions 612 electrically connect the corner portions of the adjacent first sensing portions 611. Connected to.
- a crossing portion 602 (specifically, a second crossing portion 602b (described later) parallel to the direction orthogonal to the extending direction (X direction) of the first connection portion 612. The number of)) is preferably 3 or less.
- the intersection 602 between the first conductor line 601a and the second conductor line 601b (strictly speaking, the extension line of the first conductor line 601a and the second conductor line 601a)
- a wide portion 613 is formed at an intersection 602) with the extended line of the conductor wire 601b.
- wide portion 613, the center line CL 1 of the first conductor line 601a and the intersection point P of the center line CL 2 of the second conductor line 601b, and the center C of the wide portion 613, viewed are arranged to substantially match.
- the correspondence relationship between the intersecting portion 602 and the wide portion 613 is not particularly limited to the above, and it is only necessary that the intersection point P exists inside the outline of the wide portion 613 in plan view.
- the “center C of the wide portion” means “the center of gravity of the wide portion”.
- the width W of the wide portion 613 is larger than the width of the conductor wire 601 (the conductor wire on the larger side of the first conductor wire 601a or the second conductor wire 601b).
- the width W of the wide portion 613 corresponds to the diameter of a virtual circle inscribed in the wide portion 613, and corresponds to the diameter of the wide portion 613 when the wide portion 613 is substantially circular.
- Each wide portion 613 has a substantially perfect circle shape in plan view.
- the shape of the wide portion 613 is not particularly limited to the above.
- it may be a triangle such as a regular triangle, an isosceles triangle, a right triangle, or a quadrangle such as a parallelogram or a trapezoid.
- the shape of the wide portion 613 may be an n-gon such as a hexagon, an octagon, a dodecagon, or a decagon, a circle, an ellipse, a star, or a cross. For example, as shown in FIG.
- each of the four wide portions 613B has a triangular arc shape.
- the shape in which the notch was formed may be sufficient.
- the virtual circle VC shown in FIG. 6 is a virtual circle inscribed in the wide portion 613B, and the diameter of the virtual circle VC corresponds to the width of the wide portion 613B.
- a geometric pattern obtained by repeating various graphic units can be used as the shape of the wide portion 613.
- the material constituting the conductor wire 601 and the material constituting the wide portion 613 are substantially the same. For this reason, the conductor wire 601 and the wide portion 613 are integrally formed. .
- the boundary between the conductor wire 601 and the wide portion 613 is indicated by a broken line. Note that the material constituting the conductor wire 601 and the material constituting the wide portion 613 may be different.
- the area Sc of the wide portion 613, the width La of the first conductor line 601a connected to the wide portion 613, and the width Lb of the second conductor line 601b connected to the wide portion 613 This relationship satisfies the following equation (9). It is more preferable that the relationship between the area Sc of the wide portion 613, the width La of the first conductor line 601a, and the width Lb of the second conductor line 601b satisfies the following expression (10). 6 ⁇ Sc / (La ⁇ Lb) ⁇ 30 (9) 6 ⁇ Sc / (La ⁇ Lb) ⁇ 18 (10)
- the area Sc of the wide portion 613 is preferably 6 ⁇ m 2 to 500 ⁇ m 2 (6 ⁇ m 2 ⁇ Sc ⁇ 500 ⁇ m 2 ).
- the relationship among the width W of the wide portion 613, the width La of the first conductor line 601a, and the width Lb of the second conductor line 601b satisfies the following expression (11). Is preferable, and it is more preferable that the following expression (12) is satisfied.
- a first wide portion 613a is arranged at a first intersection 602a between the first conductor wire 601a and the second conductor wire 601b.
- a second wide portion 613b is disposed at a second intersection 602b between the first conductor wire 601a and the second conductor wire 601b.
- first intersection 602a” and “second intersection 602b” are collectively referred to as “intersection 602”
- first wide part 613a” and “second The “wide portion 613b” is collectively referred to as the “wide portion 613”.
- the first wide portion 613a and the second wide portion 613b have substantially the same shape.
- the first wide portion 613a and the second wide portion 613b may have different shapes.
- the plurality of first wide portions 613a have substantially the same shape, but the first wide portions 613a having different shapes may be mixed.
- the plurality of second wide portions 613b have substantially the same shape, the second wide portions 613b having different shapes may be mixed.
- the first wide portion 613a is arranged corresponding to at least one of the first intersecting portions 602a present in the first sensing portion 611, and the plurality of first wide portions 613a are Are arranged irregularly.
- the second wide portion 613b is arranged corresponding to at least one of the second intersecting portions 602b existing in the first connection portion 612, and the second wide portion 613b is the first connection portion. It is arranged corresponding to all the second intersecting portions 602b existing in the portion 612.
- the presence ratio of the second wide portion 613b is preferably higher than the presence ratio of the first wide portion 613a.
- the presence ratio of the first wide portion 613a refers to the number of the first wide portions 613a with respect to the number of the first intersecting portions 602a in the first sensing unit 611, and the second wide portion 613a.
- the existence ratio of the portion 613b means the number of the second wide portions 613b with respect to the number of the second intersecting portions 602b in the first connecting portion 612.
- the 1st wide part 613a does not need to exist in the 1st sensing part 611.
- a 1 is the total area of the first wide portion 613a of the first sensing unit 611 one
- a 2 is the first wide portion in the first sensing unit one 613a is the sum of the areas of the first cross portion 602a does not exist
- N 1 is the number of first cross portion 602a of the first sensing unit 611 one
- B 1 is the sum of the area of the second wide portion 613b in one of the first connecting portion 612
- B 2 is a second cross section 602b there is no second wide portion 613b of the first connecting portion 612 one
- the sum of the areas, N 2 is the number of second intersecting portions 602 b in one first connecting portion 612.
- the area of the intersecting portion 602 refers to the area of the portion where the first conductor line 601a and the second conductor line 601b intersect, and specifically, the width La of the first conductor line 601a
- the product with the width Lb of the second conductor wire 601b is said.
- the sheet resistance ⁇ s in the first sensing unit 611 is preferably 3 ⁇ / ⁇ to 30 ⁇ / ⁇ (3 ⁇ / ⁇ ⁇ ⁇ s ⁇ 30 ⁇ / ⁇ ). ).
- the sheet resistance ⁇ c in the first connection portion 612 is preferably 6 ⁇ / ⁇ to 60 ⁇ / ⁇ (6 ⁇ / ⁇ ⁇ ⁇ c ⁇ 60 ⁇ ). / ⁇ ).
- the ratio ( ⁇ s / ⁇ c ) of the sheet resistance ⁇ s and the sheet resistance ⁇ c is 0. It is preferably 4 to 0.7 (0.4 ⁇ ⁇ s / ⁇ c ⁇ 0.7).
- the second resin portion 70 has a rectangular outer shape and is made of a resin material having light transmittance.
- the resin material having light transmittance for example, a material similar to the resin material constituting the first resin portion 50 can be used.
- the second resin part 70 is provided on the first resin part 50 so as to cover the first conductor part 60.
- a rectangular first opening 701 is formed on one side of the second resin portion.
- the first terminal 63 is exposed from the first opening 701, so that the first terminal 63 and an external circuit can be connected.
- the second conductor portion 80 is provided on the second resin portion 70. As shown in FIG. 8, the second conductor portion 80 is configured in a mesh shape by a plurality of conductor wires 801. Specifically, a plurality of third conductor lines 801a extending linearly along the first direction, and a plurality of fourth conductor lines 801b extending linearly along the second direction, Intersect each other to form a mesh-like second conductor portion 80 in which square lattices are repeatedly arranged.
- “third conductor line 801a” and “fourth conductor line 801b” are collectively referred to as “conductor line 801” as necessary.
- the second conductor portion 80 includes a second electrode 81, a second lead wiring 82, and a second terminal 83.
- the second electrode 81 is arranged so that at least a part thereof overlaps the sensing region 11.
- Each second electrode 81 extends in the Y direction in the figure, and the plurality of second electrodes 81 are arranged in parallel in the X direction in the figure.
- One end of the second lead wire 82 is connected to one end of each second electrode 81 in the longitudinal direction.
- a second terminal 83 is connected to the other end of each second lead wiring 82.
- the second terminal 83 is electrically connected to an external circuit, for example.
- the second lead wiring 82 and the second terminal 83 are arranged so as to overlap the non-sensing area 12.
- the number of the second electrodes 81 is not particularly limited and can be arbitrarily set. Further, the number of second lead wires 82 and second terminals 83 is set according to the number of second electrodes 81.
- the second lead wiring 82 and the second terminal 83 may be configured in a mesh shape or a solid pattern.
- the second electrode 81 is configured to have a mesh shape with a plurality of conductor wires 801.
- the second electrode 81 includes a plurality of second sensing parts 811 having a rhombus shape in plan view, and a band-shaped second connection part 812 formed narrower than the second sensing part 811. , Including.
- the second sensing units 811 are configured to have a mesh shape with a plurality of conductor lines 801, and the plurality of second sensing units 811 are arranged at substantially equal intervals along the Y direction. In this case, the second sensing units 811 are arranged corresponding to the blank portions formed between the plurality of first sensing units 611 so as not to overlap the first sensing units 611.
- the second connection portion 812 is configured to have a mesh shape with a plurality of conductor wires 801, and the plurality of second connection portions 812 electrically connect the corner portions of the adjacent second sensing portions 811. Connected to.
- the second connection portion 812 intersects the first connection portion 612 via the second resin portion 70 in plan view.
- a third wide portion 813a is disposed at a third intersection 802a between the third conductor wire 801a and the fourth conductor wire 801b.
- a fourth wide portion 813b is disposed at a fourth intersection 802b between the third conductor wire 801a and the fourth conductor wire 801b.
- the configurations of the second sensing unit 811, the second connecting unit 812, the third wide portion 813a, and the fourth wide portion 813b are the same as the first sensing unit 611, the first connecting unit 612, and the first connecting unit 612. Since the configuration of the wide portion 613a and the second wide portion 613b is substantially the same, repeated description is omitted, and the first sensing unit 611, the first connection unit 612, and the first connection unit described above are omitted. The description of the wide portion 613a and the second wide portion 613b is cited.
- the third resin portion 90 is directly provided on the second resin portion 70 so as to cover the second conductor portion 80 as shown in FIGS. 1 and 2.
- the third resin portion 90 is an overcoat layer for protecting the second conductor portion 80 from the outside. Further, by covering the second conductor portion 80 with the third resin portion 90, light scattering on the surface of the second conductor portion 80 is suppressed, and the visibility of the wiring body 40 is improved.
- a rectangular second opening 901 is formed on one side of the third resin portion 90. From the second opening 901, the second terminal 83 is exposed, whereby the second terminal 83 and an external circuit can be connected. The second opening 901 overlaps the first opening 701, and the first terminal 63 is also exposed from the second opening 901.
- Such a third resin portion 90 is made of a light-transmissive resin material.
- the resin material having light transmittance for example, a material similar to the resin material constituting the first resin portion 50 can be used.
- FIGS. 9A to 9E and FIGS. 10A to 10F are cross-sectional views showing a method for manufacturing a wiring board according to an embodiment of the present invention.
- the first conductive material 110 is filled into the first intaglio plate 100 in which the first concave portion 101 having a shape corresponding to the shape of the first conductor portion 60 is formed.
- a release layer that improves the release property of the first conductive material 110 from the first intaglio 100 may be formed on the surface of the first intaglio 100.
- Examples of the method for filling the first intaglio 100 with the first conductive material 110 include a dispensing method, an ink jet method, and a screen printing method.
- the first conductive material 110 coated other than the first recess 101 is wiped off. Or the method of scraping, blotting, sticking, washing away, and blowing off can be mentioned.
- the first conductive material 110 the above-described conductive paste is used.
- the first conductive material 110 filled in the first recess 101 is solidified.
- the solidification treatment of the conductive material can be performed using at least one of heating, irradiation with energy rays (infrared rays, ultraviolet rays, laser light, and the like), and drying.
- the first resin material 120 is disposed so as to cover the first conductor portion 60 in the first recess 101.
- the 1st resin material 120 the material which comprises the 1st resin part 50 is used.
- Examples of a method for disposing the first resin material 120 on the first intaglio 100 include a vapor deposition method, a sputtering method, an ink jet method, and a photolithography method.
- the transparent substrate 200 is pressed against the first intaglio plate 100 so that the first resin material 120 is interposed between the first intaglio plate 100 and the transparent substrate 200.
- the first resin material 120 on the first intaglio 100 is solidified.
- the first resin material 120 can be solidified by using at least one of heating, irradiation with energy rays (infrared rays, ultraviolet rays, laser light, etc.), and drying. As the first resin material 120 is solidified, the first resin portion 50 is formed.
- the transparent substrate 200, the first resin portion 50, and the first conductor portion 60 are peeled from the first intaglio 100.
- a laminate in which the transparent substrate 200, the first resin portion 50, and the first conductor portion 60 are laminated is also referred to as an intermediate body 130.
- the second conductive material 150 is filled in the second intaglio plate 140 in which the second concave portion 141 having a shape corresponding to the shape of the second conductor portion 80 is formed.
- the second conductive material 150 the above-described conductive paste is used.
- a method for filling the second concave portion 141 with the second conductive material 150 a method similar to the method for filling the first concave portion 101 with the first conductive material 110 is used.
- the second conductive material 150 filled in the second recess 141 is solidified.
- a method for solidifying the second conductive material 150 a method similar to the method for solidifying the first conductive material 110 is used.
- the second resin material 160 is disposed on the intermediate 130 so as to cover the first conductor portion 60.
- a material constituting the second resin portion 70 is used.
- a method for arranging the second resin material 160 on the intermediate body 130 a method similar to the method for arranging the first resin material 120 on the first intaglio 100 is used.
- the intermediate body 130 is placed on the second intaglio plate 140 and the intermediate body 130 is pressed against the second intaglio plate 140.
- the second resin material 160 is solidified.
- a method for solidifying the second resin material 160 a method similar to the method for solidifying the first resin material 120 is used.
- the second resin material 160 is solidified, the second resin portion 70 is formed.
- the intermediate body 130, the second resin portion 70, and the second conductor portion 80 are peeled off from the second intaglio plate 140.
- the third resin material 170 is disposed on the second resin portion 70 so as to cover the second conductor portion 80.
- a material constituting the third resin portion 90 is used.
- a method for arranging the third resin material 170 on the second resin portion 70 a method similar to the method for arranging the first resin material 120 on the first intaglio 100 is used.
- the third resin material 170 is solidified.
- a method for solidifying the third resin material 170 a method similar to the method for solidifying the first resin material 120 is used. Thereby, the 3rd resin part 90 is formed.
- the cover panel 30 (see FIG. 2) is attached on the third resin portion 90. As described above, the wiring board 20 can be obtained.
- the wiring body 40, the wiring board 20, and the touch sensor 10 of the present embodiment have the following effects.
- the wide portion 613 is disposed corresponding to the intersecting portion 602 between the first conductor wire 601a and the second conductor wire 601b, and the above equation (8) is established. is doing.
- the electrical resistance can be reduced at the intersection 602 where currents from the first conductor line 601a and the second conductor line 601b concentrate, the deterioration due to thermal stress near the intersection 602 occurs. It is suppressed.
- the area Sc of the wide part 613 is suppressed, and the wide part 613 can be made difficult to see.
- the visibility of the wiring body 40 can be improved and the reliability of the wiring body 40 can be improved.
- the area Sc of the wide portion 613 to be 6 ⁇ m 2 to 500 ⁇ m 2 , the visibility improvement effect and the reliability improvement effect in the wiring body 40 can be more remarkably exhibited.
- the width La of the first conductor line 601a is set to be 1 to 5 ⁇ m
- the width Lb of the second conductor line 601b is set to be 1 to 5 ⁇ m. Yes. Thereby, it can suppress that the conductor wire 601 breaks in parts other than the intersection part 602, and can suppress that the conductor wire 601 becomes easy to see.
- the second wide portion 613b is arranged corresponding to at least one of the second intersecting portions 602b existing in the first connecting portion 612. Therefore, the electrical resistance can be reduced in the first connection portion 612 that is narrower than the first sensing portion 611 and in which current is more concentrated than the first sensing portion 611. Thereby, generation
- the first wide portion 613a is arranged corresponding to at least one of the first intersecting portions 602a existing in the first sensing portion 611, and the above equation (10) is established. is doing.
- the second wide part 613b is arranged, thereby suppressing the occurrence of deterioration due to thermal stress in the vicinity of the second intersection part 602b. Since the first wide portion 613a is also provided in the first sensing unit 611, the difference between the transmissivity in the first sensing unit 611 and the transmissivity in the first connection unit 612 is reduced. As a result, the visibility of the entire first electrode 61 can be improved.
- the number of second intersecting portions 602b arranged in parallel in the direction orthogonal to the extending direction of the first connection portion 612 is set to three or less. Therefore, it can suppress that the width
- the capacitance of the first connection portion 612 can be reduced by setting the upper limit value of the number of the second intersecting portions 602b as described above, the response of the first electrode 61 can be reduced. Improvements can be made.
- the “touch sensor 10” in the present embodiment corresponds to an example of the “touch sensor” in the present invention
- the “wiring board 20” in the present embodiment corresponds to an example of the “wiring board” in the present invention.
- the “cover panel 30” and the “transparent substrate 200” correspond to an example of the “support” in the present invention
- the “wiring body 40” in the present embodiment corresponds to an example of the “wiring body” in the present invention.
- first resin portion 50 in the present embodiment corresponds to an example of the “resin portion” in the present invention
- first electrode 61 in the present embodiment corresponds to an example of the “conductor portion” in the present invention
- first conductor line 601a in the present embodiment corresponds to an example of the “first conductor line” in the present invention
- second conductor line 601b in the present embodiment corresponds to the “first conductor line” in the present invention
- the “intersection 602” in the present embodiment corresponds to an example of the “intersection” in the present invention
- the “wide portion 613” in the present embodiment corresponds to the “wide portion” in the present invention.
- First sensing unit 611 in this embodiment corresponds to an example of “sensing unit” in the present invention
- first connection unit 612 in this embodiment " It corresponds to an example of “connecting portion”.
- the touch sensor of the present embodiment is a projected capacitive touch panel sensor composed of a wiring body having two conductor portions, but is not particularly limited thereto, and is a surface type composed of one conductor portion ( The present invention can also be applied to a capacitive type touch panel sensor.
- the touch sensor 10 of this embodiment includes a plurality of first electrodes 61 including a rhombus-shaped first sensing unit 611 and a plurality of second electrodes 81 including a rhombus-shaped second sensing unit 811.
- the touch sensor is not particularly limited to the above, and may be a touch sensor in which a plurality of strip electrodes are combined to cross each other.
- three or more conductor wires 601 may intersect.
- two of the plurality of conductor lines 601 intersecting at the intersecting portion 602 are defined as a first conductor line 601a and a second conductor line 601b, respectively.
- a metal material or a carbon-based material is used as the conductive material constituting the first conductor portion 60 and the second conductor portion 80.
- a mixture of a metal material and a carbon-based material may be used.
- a wiring board is provided as a form in which a release sheet is provided on the lower surface of the first resin portion 50, and the release sheet is peeled off at the time of mounting and adhered to a mounting target (film, surface glass, deflection plate, display glass, etc.). It may be configured.
- a resin portion that functions as an adhesive layer may be provided between the wiring body 40 and the cover panel 30. Moreover, you may mount in the above-mentioned mounting object through such a resin part.
- the mounting target corresponds to an example of the “support” in the present invention.
- the wiring body or the wiring substrate has been described as being used for a touch sensor, but is not particularly limited thereto.
- the wiring body may be used as a heater by energizing the wiring body and generating heat by resistance heating or the like.
- the mounting target on which the wiring body is mounted corresponds to an example of the “support” of the present invention.
- Example 1 a test sample was manufactured by the following method. That is, a conductive paste (a conductive paste made of a binder (polyester) and Ag particles) is filled in a recess formed on the surface of a metal intaglio, and the conductive paste is solidified to form a conductor portion. A resin material (UV curable acrylic resin) in a state (uncured state) is applied onto the intaglio, and the base material (PET film) is pressed against the intaglio via the amorphous resin material. After solidifying the material to form the resin part, the base material, the resin part, and the conductor part were released from the intaglio. As the solidification treatment of the conductive paste, heating at 150 ° C. for 30 minutes was performed. As a solidification treatment of the amorphous resin material, 1000 mJ ultraviolet irradiation was performed.
- a resin material a conductive paste made of a binder (polyester) and Ag particles
- the conductor pattern of the conductor part was a conductor pattern in which 30 electrodes were arranged in parallel.
- As the electrodes 30 rhombus-shaped sensing portions that are meshed with a plurality of conductor wires are arranged at intervals, and the plurality of sensing portions are band-shaped connection portions that are meshed with a plurality of conductor wires. Connected.
- One end of each electrode is provided with a connecting portion whose one end is not connected to the sensing portion.
- the length of one side of the sensing unit was 4 mm.
- the width (maximum width) of the connecting portion was 0.8 mm.
- the widths La and Lb of the conductor wires constituting the electrodes were as shown in Table 1.
- Wide portions were not formed at the intersections between the conductor lines existing in the sensing part, but wide portions having a substantially circular shape were formed at all the intersections between the conductor lines existing at the connection part.
- the width (diameter) W of the wide portion was as shown in Table 1.
- the aperture ratio of the conductor portion was set to be in the range of 96.5 to 98.0%.
- a test sample having the above-described configuration was produced.
- the ratio (Sc / (La ⁇ Lb)) is shown in Table 1.
- ⁇ Static resistance test ⁇ (Inspection method) A discharge test was conducted according to IEC61000-4-2 Ed2 using an electrostatic tester (ESS-2000 manufactured by Noise Research Laboratory, energy storage capacity: 150 pF, discharge resistance: 330 ⁇ ). Specifically, on a wooden desk, a metal plate that is GND-connected via two resistors (470 k ⁇ each), an insulating plate with a thickness of 0.5 mm, and a test sample are sequentially stacked to generate ESD. The vessel was brought into contact with one end of the connection part that was not connected to the sensing part, and contact discharge was performed. The discharge conditions were an output voltage (discharge voltage) of 6.0 kV and a discharge frequency of 3 times.
- test sample subjected to the above discharge test was evaluated for the presence or absence of disconnection in the conductor portion. Specifically, the resistance value between the connection part arranged at one end of the electrode and the sensing part arranged at the other end of the electrode was measured, and the continuity of each electrode was evaluated. Moreover, each connection part was visually observed from the surface side of the test sample, and the presence or absence of the disconnection in a connection part was evaluated.
- Table 1 shows the inspection results of Example 1.
- Example 2 to 4 In Examples 2 to 4, test samples were prepared in the same manner as in Example 1 except that the widths La and Lb of the conductor wires and the width W of the wide portion were as shown in Table 2. These test samples were subjected to electrostatic resistance inspection and appearance inspection. The results are shown in Table 2.
- Example 5 to 7 test samples were prepared in the same manner as in Example 1 except that the widths La and Lb of the conductor wires and the width W of the wide portion were as shown in Table 3. These test samples were subjected to electrostatic resistance inspection and appearance inspection. The results are shown in Table 3.
- Example 1 As a comparative example of Examples 1 and 2, test samples were prepared in the same manner as in Example 1 except that the width W of the wide portion was as shown in Table 1. The test sample was subjected to electrostatic resistance inspection and appearance inspection. The results are shown in Table 1.
- Example 3 As a comparative example of Examples 3 to 6, test samples were prepared in the same manner as in Example 1 except that the widths La and Lb of the conductor wires and the width W of the wide portion were as shown in Table 2. These test samples were subjected to electrostatic resistance inspection and appearance inspection. The results are shown in Table 2.
- the ratio (Sc / (La ⁇ Lb)) is set within the range of the above formula (8), so that the visibility of the wiring body is improved and the reliability is improved. It can be confirmed that can be appropriately realized.
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Abstract
Description
文献の参照による組み込みが認められる指定国については、2017年3月31日に日本国に出願された特願2017-072259に記載された内容を参照により本明細書に組み込み、本明細書の記載の一部とする。
下記(1)式を満たす配線体である。
6<Sc/(La×Lb)≦30 … (1)
上記(1)式において、Scは前記幅広部の面積であり、Laは前記第1の導体線の幅であり、Lbは前記第2の導体線の幅である。
6μm2≦Sc≦500μm2 … (2)
1μm≦La≦5μm … (3)
1μm≦Lb≦5μm … (4)
A<B … (5)
A=(A1+A1)/N1 … (6)
B=(B1+B2)/N2 … (7)
但し、上記(6)式において、A1は一の前記感知部における前記幅広部の面積の総和であり、A2は一の前記感知部における前記幅広部が存在しない前記交差部の面積の総和であり、N1は一の前記感知部における前記交差部の数であり、上記(7)式において、B1は一の前記接続部における前記幅広部の面積の総和であり、B2は一の前記接続部における前記幅広部が存在しない前記交差部の面積の総和であり、N2は一の前記接続部における前記交差部の数である。
La+Lb<W … (8)
上記(8)式において、Wは前記幅広部の幅である。
(開口率)=(Pa-Wb)×(Pb-Wa)/(Pa×Pb) … (7)
但し、上記(7)式において、Waは導体線2の幅であり、Wbは導体線3の幅であり、Paは任意の導体線2と、当該導体線2と隣り合う他の導体線2との間のピッチ(隣り合う導体線2同士の中心間距離)であり、Pbは任意の導体線3と、当該導体線3と隣り合う他の導体線3との間の距離を言う。
6<Sc/(La×Lb)≦30 … (9)
6<Sc/(La×Lb)≦18 … (10)
La+Lb<W … (11)
1.5≦W/(La+Lb)≦2.0 … (12)
A<B … (13)
A=(A1+A1)/N1 … (14)
B=(B1+B2)/N2 … (15)
但し、上記(14)式において、A1は一の第1の感知部611における第1の幅広部613aの面積の総和であり、A2は一の第1の感知部における第1の幅広部613aが存在しない第1の交差部602aの面積の総和であり、N1は一の第1の感知部611における第1の交差部602aの数であり、上記(15)式において、B1は一の第1の接続部612における第2の幅広部613bの面積の総和であり、B2は一の第1の接続部612における第2の幅広部613bが存在しない第2の交差部602bの面積の総和であり、N2は一の第1の接続部612における第2の交差部602bの数である。なお、交差部602の面積とは、第1の導体線601aと第2の導体線601bとが交差する部分の面積のことを言い、具体的には、第1の導体線601aの幅Laと第2の導体線601bの幅Lbとの積を言う。
透過性を有する樹脂材料としては、例えば、上記の第1の樹脂部50を構成する樹脂材料と同様の材料を用いることができる。
実施例1では、以下の方法により試験サンプルを製造した。すなわち、金属製の凹版の表面に形成された凹部に導電性ペースト(バインダ(ポリエステル系)とAg粒子からなる導電ペースト)を充填し、当該導電性ペーストを固化させ導体部を形成し、無定形状態(未硬化状態)の樹脂材料(UV硬化性アクリル樹脂)を凹版上に塗布し、当該無定形状態の樹脂材料を介して基材(PETフィルム)を凹版に押し付け、当該無定形状態の樹脂材料を固化させ樹脂部を形成した後、凹版から基材、樹脂部、及び導体部を離型した。導電性ペーストの固化処理としては、150℃、30分間の加熱を行った。無定形状態の樹脂材料の固化処理としては、1000mJの紫外線照射を行った。
(検査方法)
静電気試験機(ノイズ研究所製ESS-2000、エネルギ蓄積容量:150pF、放電抵抗:330Ω)を用いて、IEC61000-4-2 Ed2に準じて放電試験を行った。具体的には、木製の机の上に、二つの抵抗(それぞれ470kΩ)を介してGND接続された金属プレートと、厚さ0.5mmの絶縁プレートと、試験サンプルと、を順に重ね、ESD発生器を感知部に未接続とされた接続部の一端に接触させ、接触放電を行った。放電条件としては、出力電圧(放電圧)6.0kV、放電回数3回とした。
上記放電試験を行った試験サンプルに対して、導体部における断線の有無を評価した。具体的には、電極の一端に配された接続部と電極の他端に配された感知部との間の抵抗値を測定し、それぞれの電極の導通を評価した。また、試験サンプルの表面側から各接続部を目視観察し、接続部における断線の有無を評価した。評価基準としては、「電極の導通が確認できる」及び「各接続部に断線箇所が確認できない」の何れにも該当する場合には、信頼性向上効果があるとして「○」とし、「電極の導通が確認できる」及び「接続部に断線箇所が確認できない」のいずれか一方に該当しない場合には、信頼性向上効果に劣るとして「×」として評価を行った。
(検査方法)
三波長白色蛍光灯(照度1300lx)の光源が設置された、外光を遮った室内(暗室)にて、以下の透過光検査及び反射光検査を行った。
(a)透過光検査:試験サンプルの裏面から50cmの位置に上記の光源を配置し、試験サンプルの表面から30cm離れた位置から、試験サンプルの表面を目視観察した。
(b)反射光検査:試験サンプルの裏面に遮光性の黒板を配置し、試験サンプルの表面に対してその反射光照度が1000lx以上となるように光源を設置し、試験サンプルの表面から30cm離れた位置から、試験サンプルの表面を目視観察した。
「導体部の視えがない」及び「反射によるギラツキがない」の何れにも該当する場合には、視認性の向上効果に優れるとして「◎」とし、「僅かな導体部の視えがある」及び「反射によるギラツキが確認できる」の何れか一方に該当する場合には、視認性の向上効果があるとして「○」とし、「顕著な導体部の視えがある」及び「反射によるギラツキが確認できる」の両方に該当する場合には、視認性の向上効果に劣るとして「×」として評価を行った。
実施例2~4では、導体線の幅La,Lb及び幅広部の幅Wを表2に示すようにしたこと以外は実施例1と同様にして試験サンプルを作製した。これらの試験サンプルに対して、静電気耐性検査及び外観検査を行った。その結果を表2に示す。
実施例5~7では、導体線の幅La,Lb及び幅広部の幅Wを表3に示すようにしたこと以外は実施例1と同様にして試験サンプルを作製した。これらの試験サンプルに対して、静電気耐性検査及び外観検査を行った。その結果を表3に示す。
実施例1~2の比較例として、幅広部の幅Wを表1に示すようにしたこと以外は、実施例1と同様にして試験サンプルを作製した。この試験サンプルに対して、静電気耐性検査及び外観検査を行った。その結果を表1に示す。
実施例3~6の比較例として、導体線の幅La,Lb及び幅広部の幅Wを表2に示すようにしたこと以外は実施例1と同様にして試験サンプルを作製した。これらの試験サンプルに対して、静電気耐性検査及び外観検査を行った。その結果を表2に示す。
実施例7~8の比較例として、導体線の幅La,Lb及び幅広部の幅Wを表3に示すようにしたこと以外は実施例1と同様にして試験サンプルを作製した。これらの試験サンプルに対して、静電気耐性検査及び外観検査を行った。その結果を表3に示す。
表1~3に示すように、幅広部の面積Scと、導体線の幅La,Lbの積との比(Sc/(La×Lb))が上記(8)式の範囲内に設定された実施例1~7では、比(Sc/(La×Lb))が上記(8)式の範囲外に設定された比較例1~8と比較して、静電気による断線の発生が生じておらず、且つ、導体部の視えやギラツキが抑えられていることが確認できる。
11…感知領域
12…非感知領域
20…配線基板
30…カバーパネル
31…透明部
32…遮蔽部
40…配線体
50…第1の樹脂部
60…第1の導体部
601a…第1の導体線
601b…第2の導体線
602…交差部
61…第1の電極
611…第1の感知部
612…第1の接続部
613…幅広部
62…第1の引出配線
63…第1の端子
70…第2の樹脂部
701…第1の開口部
80…第2の導体部
801a…第3の導体線
801b…第4の導体線
81…第2の電極
811…第2の感知部
812…第2の接続部
82…第2の引出配線
83…第2の端子
90…第3の樹脂部
901…第2の開口部
100…第1の凹版
101…第1の凹部
110…第1の導電性材料
120…第1の樹脂材料
130…中間体
140…第2の凹版
141…第2の凹部
150…第2の導電性材料
160…第2の樹脂材料
170…第3の樹脂材料
200…透明基板
Claims (9)
- 樹脂部と、
前記樹脂部上に設けられ、第1の導体線と第2の導体線が相互に交差することにより網目状とされた導体部と、を備え、
前記導体部は、前記第1の導体線と前記第2の導体線との交差部に対応して配された少なくとも一つの幅広部を含み、
下記(1)式を満たす配線体。
6<Sc/(La×Lb)≦30 … (1)
上記(1)式において、Scは前記幅広部の面積であり、Laは前記第1の導体線の幅であり、Lbは前記第2の導体線の幅である。 - 請求項1に記載の配線体であって、
下記(2)式を満たす配線体。
6μm2≦Sc≦500μm2 … (2) - 請求項1に記載の配線体であって、
下記(3)式及び(4)式を満たす配線体。
1μm≦La≦5μm … (3)
1μm≦Lb≦5μm … (4) - 請求項1~3の何れか一項に記載の配線体であって、
前記導体部は、
所定方向に沿って間隔を空けて並べられた複数の感知部と、
前記感知部に対して幅狭に形成され、隣り合う前記感知部同士を接続する複数の接続部と、を含み、
前記幅広部は、前記接続部に存在する前記交差部の少なくとも一つに対応して配されている配線体。 - 請求項4に記載の配線体であって、
前記幅広部は、前記感知部に存在する前記交差部の少なくとも一つに対応して配されており、
下記(5)~(7)式を満たす配線体。
A<B … (5)
A=(A1+A1)/N1 … (6)
B=(B1+B2)/N2 … (7)
但し、上記(6)式において、A1は一の前記感知部における前記幅広部の面積の総和であり、A2は一の前記感知部における前記幅広部が存在しない前記交差部の面積の総和であり、N1は一の前記感知部における前記交差部の数であり、上記(7)式において、B1は一の前記接続部における前記幅広部の面積の総和であり、B2は一の前記接続部における前記幅広部が存在しない前記交差部の面積の総和であり、N2は一の前記接続部における前記交差部の数である。 - 請求項4又は5に記載の配線体であって、
前記接続部において、前記接続部の延在方向に対して直交する方向に並列している前記交差部の数は、三個以下である配線体。 - 請求項1~6の何れか一項に記載の配線体であって、
下記(8)式を満たす配線体。
La+Lb<W … (8)
上記(8)式において、Wは前記幅広部の幅である。 - 請求項1~7の何れか一項に記載の配線体と、
前記配線体を支持する支持体と、を備える配線基板。 - 請求項8に記載の配線基板を備えるタッチセンサ。
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CN201880010917.6A CN110291496A (zh) | 2017-03-31 | 2018-03-26 | 布线体、布线基板和触摸传感器 |
US16/483,222 US20200233535A1 (en) | 2017-03-31 | 2018-03-26 | Wiring body, wiring board, and touch sensor |
JP2019509801A JPWO2018181175A1 (ja) | 2017-03-31 | 2018-03-26 | 配線体、配線基板、及びタッチセンサ |
EP18775608.5A EP3605289A1 (en) | 2017-03-31 | 2018-03-26 | Wiring body, wiring substrate, and touch sensor |
KR1020197019729A KR20190094205A (ko) | 2017-03-31 | 2018-03-26 | 배선체, 배선 기판, 및 터치 센서 |
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US (1) | US20200233535A1 (ja) |
EP (1) | EP3605289A1 (ja) |
JP (1) | JPWO2018181175A1 (ja) |
KR (1) | KR20190094205A (ja) |
CN (1) | CN110291496A (ja) |
TW (1) | TW201903588A (ja) |
WO (1) | WO2018181175A1 (ja) |
Cited By (2)
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CN109634006A (zh) * | 2018-12-03 | 2019-04-16 | 深圳市华星光电技术有限公司 | Tft阵列基板的制作方法及tft阵列基板 |
EP4026692A4 (en) * | 2019-10-23 | 2022-11-16 | Nissha Co., Ltd. | TOUCH SENSOR |
Citations (4)
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JP2012108845A (ja) | 2010-11-19 | 2012-06-07 | Fujifilm Corp | タッチパネル用導電性フイルムを備えるタッチパネル及びタッチパネル用導電性フイルム |
JP3192845U (ja) * | 2014-06-24 | 2014-09-04 | 群創光電股▲ふん▼有限公司Innolux Corporation | タッチパネル |
JP2015204066A (ja) * | 2014-04-16 | 2015-11-16 | 大日本印刷株式会社 | タッチパネルセンサ、及び、タッチ位置検出機能付き表示装置 |
JP2017072259A (ja) | 2011-07-25 | 2017-04-13 | 株式会社エンプラス | 流体取扱装置および流体取扱方法 |
-
2018
- 2018-03-26 US US16/483,222 patent/US20200233535A1/en not_active Abandoned
- 2018-03-26 EP EP18775608.5A patent/EP3605289A1/en not_active Withdrawn
- 2018-03-26 CN CN201880010917.6A patent/CN110291496A/zh not_active Withdrawn
- 2018-03-26 WO PCT/JP2018/012129 patent/WO2018181175A1/ja active Application Filing
- 2018-03-26 JP JP2019509801A patent/JPWO2018181175A1/ja not_active Withdrawn
- 2018-03-26 KR KR1020197019729A patent/KR20190094205A/ko not_active Application Discontinuation
- 2018-03-29 TW TW107110940A patent/TW201903588A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012108845A (ja) | 2010-11-19 | 2012-06-07 | Fujifilm Corp | タッチパネル用導電性フイルムを備えるタッチパネル及びタッチパネル用導電性フイルム |
JP2017072259A (ja) | 2011-07-25 | 2017-04-13 | 株式会社エンプラス | 流体取扱装置および流体取扱方法 |
JP2015204066A (ja) * | 2014-04-16 | 2015-11-16 | 大日本印刷株式会社 | タッチパネルセンサ、及び、タッチ位置検出機能付き表示装置 |
JP3192845U (ja) * | 2014-06-24 | 2014-09-04 | 群創光電股▲ふん▼有限公司Innolux Corporation | タッチパネル |
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CN109634006A (zh) * | 2018-12-03 | 2019-04-16 | 深圳市华星光电技术有限公司 | Tft阵列基板的制作方法及tft阵列基板 |
CN109634006B (zh) * | 2018-12-03 | 2021-07-23 | Tcl华星光电技术有限公司 | Tft阵列基板的制作方法及tft阵列基板 |
EP4026692A4 (en) * | 2019-10-23 | 2022-11-16 | Nissha Co., Ltd. | TOUCH SENSOR |
Also Published As
Publication number | Publication date |
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US20200233535A1 (en) | 2020-07-23 |
EP3605289A1 (en) | 2020-02-05 |
TW201903588A (zh) | 2019-01-16 |
CN110291496A (zh) | 2019-09-27 |
KR20190094205A (ko) | 2019-08-12 |
JPWO2018181175A1 (ja) | 2019-11-07 |
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