WO2018076692A1 - Led灯珠及其制造方法 - Google Patents

Led灯珠及其制造方法 Download PDF

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Publication number
WO2018076692A1
WO2018076692A1 PCT/CN2017/086800 CN2017086800W WO2018076692A1 WO 2018076692 A1 WO2018076692 A1 WO 2018076692A1 CN 2017086800 W CN2017086800 W CN 2017086800W WO 2018076692 A1 WO2018076692 A1 WO 2018076692A1
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substrate
led
light source
led light
lamp bead
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PCT/CN2017/086800
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English (en)
French (fr)
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包锋
王勇
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包锋
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array

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  • the present disclosure relates to the field of light emitting diode (LED) illumination technology, and relates to, for example, an LED lamp bead and a method of manufacturing the same.
  • LED light emitting diode
  • LED lamps have the advantages of high brightness, low power consumption, simple driving, long life, etc., and are widely used in the field of lighting.
  • the LED lamp bead determines the performance of the LED lamp.
  • the LED lamp bead in the related art such as the G4, G9 type LED lamp bead, is usually formed by separately designing the LED light emitting portion and the LED driving circuit portion on different printed circuit boards (Printed Circuit Boards). .
  • the LED lamp bead and the manufacturing method thereof provided by the present disclosure are simple in structure and easy to manufacture.
  • an LED lamp bead comprising: an LED light source assembly, a lamp leg assembly electrically connected to the LED light source assembly, and a glass lamp cover sleeved on an outer side of the LED light source assembly, wherein
  • the glass lampshade is filled with an inert gas
  • the LED light source assembly includes a substrate and an LED light source and a driving circuit disposed on the substrate, wherein
  • the surface of the substrate is provided with a conductive material, and the lamp leg assembly is electrically connected to the driving circuit through the conductive material;
  • the driving circuit is electrically connected to the LED light source through the conductive material.
  • the LED light source is an alternating current (AC) high voltage LED light source.
  • AC alternating current
  • the inert gas is argon.
  • the substrate is made of a transparent ceramic material.
  • the electrically conductive material is nickel.
  • the model of the lamp leg assembly includes: G9, GY6.35, G5.3 or G4.
  • the present disclosure provides a method of manufacturing an LED lamp bead, including:
  • An LED light source and a driving circuit are attached on the substrate, and a surface of the substrate is provided with a conductive material;
  • the baked substrate is sealed.
  • the sealing the baked substrate comprises:
  • the fired substrate is sealed with a glass lamp and filled with an inert gas.
  • the inert gas is argon.
  • the present disclosure provides an LED lamp comprising the LED bead described above.
  • the LED lamp bead and the manufacturing method thereof provide the LED light source and the driving circuit integrated on one substrate, which simplifies the structure of the LED lamp bead in the related art, has high efficiency, large productivity and low cost.
  • the substrate is made of transparent ceramic material, ensuring that the illumination angle of the LED light source reaches 360°, and at the same time, the heat dissipation of the LED light source can be ensured;
  • the glass lamp cover is filled with argon gas to facilitate the shape of the LED light source heat dissipation lamp cover.
  • the halogen lamps in the related art have the same shape and are convenient for directly replacing the existing halogen lamps.
  • FIG. 1 is a schematic structural view of an LED lamp bead according to an embodiment of the present invention.
  • FIG. 2 is a schematic flow chart of a method for manufacturing an LED lamp bead according to an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention.
  • the LED lamp bead includes: an LED light source component 1 , a lamp leg assembly 2 electrically connected to the LED light source component 1 , and a LED light source disposed on the LED light source.
  • the LED light source assembly 1 includes a substrate 11, an LED light source 12 and a driving circuit 13, and the LED light source 12 and the driving circuit 13 are disposed on The substrate 11 is provided with a conductive material on the surface of the substrate 11, and the lamp leg assembly 2 is electrically connected to the driving circuit 13 through the conductive material; the driving circuit 13 passes through the conductive material and the The LED light source 12 is electrically connected.
  • the LED lamp bead provided in this embodiment uses an AC high-voltage LED light source, and can directly connect an alternating current, and the driving circuit is simple.
  • argon gas is filled into the glass lamp cover to dissipate heat from the LED light source.
  • the substrate is made of a transparent ceramic material, and a nickel material is provided on the surface of the substrate for conducting electricity.
  • the LED lamp bead provided in this embodiment may use various types of lamp leg components, such as G9, GY6.35, G5.3 or G4.
  • the LED lamp bead provided in this embodiment integrates the LED light source and the driving circuit onto one substrate, which simplifies the structure of the LED lamp bead in the related art, and ensures good light effect and driving effect.
  • the substrate is made of transparent ceramic material, ensuring that the illumination angle reaches 360°, and at the same time, the heat dissipation of the LED light source can be ensured;
  • the argon gas is filled in the glass lamp cover to facilitate the heat dissipation of the LED light source, and the shape of the lamp cover is consistent with the shape of the halogen lamp in the related art. It is convenient to directly replace the halogen lamp in the related art.
  • the embodiment further provides a method for manufacturing an LED lamp bead. As shown in FIG. 2, the manufacturing method includes the following steps:
  • an LED light source and a driving circuit are attached to the substrate, and a surface of the substrate is provided with a conductive material.
  • Nickel can be used as the conductive material, and the substrate can be made of transparent ceramic material.
  • the lamp leg assembly and the substrate are tightly combined, and the substrate can be combined with G9, GY6.35, G5.3 or G4.
  • the lamp foot assembly is used together;
  • step 120 the attached LED light source and the driver circuit are wire bonded to the conductive material of the substrate.
  • step 130 the front and back sides of the substrate after the wire bonding are respectively dispensed and baked.
  • doping phosphor in the glue used double-sided dispensing can increase the illumination angle and achieve 360° full-angle illumination;
  • the baked substrate is sealed.
  • the method may include: baking the baked substrate, sintering the bulb on the surface of the substrate; sealing the fired substrate with a glass lamp cover and filling the lamp cover with an inert gas, where argon gas may be selected.
  • the normal sealed products are tested, including electrical performance test and optical performance test, and the products with normal test results can be shipped after being packaged.
  • a plurality of substrates may be designed on the same piece of the board, so that the automatic placement machine and the wire bonding machine can simultaneously all the LED light sources on the board and the same
  • the drive circuit performs patching and wire bonding.
  • the panel is double-sidedly dispensed and baked, and then the baked panel is cut to form a separate substrate, and the substrate size is set in advance, such as each substrate.
  • the width is 9 mm, the length of each substrate is 20 mm, and each individual substrate is sealed.
  • the product is prevented from being detached from the substrate due to excessively high firing temperature during the foaming process, thereby causing low-quality and abnormal burning, and effective at the same time. Increased product life.
  • the manufacturing method of the LED lamp bead provided by the embodiment uses the integrated circuit system in package (SIP) technology to integrate the LED light source and the driving circuit onto a single substrate, and has a simple structure and reduces stroboscopic light.
  • SIP integrated circuit system in package
  • the manufacturing method can realize automatic operation of the production process, high efficiency, large productivity, and low cost.
  • the embodiment further provides an LED lamp comprising the LED lamp bead described above.
  • the LED lamp 20 includes an LED bead 201, and the LED bead 201 is any of the above LED bead.
  • the number of LED bead 201 in the LED lamp 20 may be at least one.
  • the present disclosure provides an LED lamp bead and a manufacturing method thereof, which integrates an LED light source and a driving circuit onto a substrate, which simplifies the structure of the LED lamp bead in the related art, reduces the production cost, improves the production efficiency, and increases the capacity. Capacity.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种LED灯珠及其制造方法。LED灯珠包括：LED光源组件（1）、与LED光源组件（1）电连接的灯脚组件（2）及套设于LED光源组件（1）外侧的玻璃灯罩（3），玻璃灯罩（3）内填充有惰性气体；LED光源组件（1）包括基板（11）以及布设于基板（11）上的LED光源（12）和驱动电路（13），其中，基板（11）的表面设有导电材料，灯脚组件（2）通过导电材料与驱动电路（13）电连接；驱动电路（13）通过导电材料与LED光源（12）电连接。

Description

LED灯珠及其制造方法 技术领域
本公开涉及发光二极管(Light Emitting Diode，LED)照明技术领域，例如涉及一种LED灯珠及其制造方法。
背景技术
LED灯具有亮度高、功耗小、驱动简单、寿命长等优点，广泛应用于照明领域。LED灯珠作为LED灯的核心部件，决定了LED灯的性能。
相关技术中的LED灯珠，如G4、G9型LED灯珠，通常是将LED发光部分和LED驱动电路部分分别设计在不同的印制电路板(Printed Circuit Board，)上，再进行组装而成。
相关技术中至少存在如下技术问题：LED灯珠结构复杂。
发明内容
本公开提供的LED灯珠及其制造方法，结构简单，易于制造。
第一方面，本公开提供一种LED灯珠，包括：LED光源组件、与所述LED光源组件电连接的灯脚组件及套设于所述LED光源组件外侧的玻璃灯罩，其中，
所述玻璃灯罩内填充有惰性气体；
所述LED光源组件包括基板以及布设于所述基板上的LED光源和驱动电路，其中，
所述基板的表面设有导电材料，所述灯脚组件通过所述导电材料与所述驱动电路电连接；
所述驱动电路通过所述导电材料与所述LED光源电连接。
可选地，所述LED光源为交流(alternating current，AC)高压LED光源。
可选地，所述惰性气体为氩气。
可选地，所述基板由透明陶瓷材料制成。
可选地，所述导电材料为镍。
可选地，所述灯脚组件的型号包括：G9、GY6.35、G5.3或者G4。
第二方面，本公开提供一种LED灯珠的制造方法，包括：
将LED光源和驱动电路贴在基板上，所述基板的表面设有导电材料；
将贴好的LED光源和驱动电路打线连接到所述基板的导电材料上；
对打线之后的基板正反两面分别点胶并烘烤；
对烘烤后的基板进行封泡。
可选地，所述对烘烤后的基板进行封泡，包括：
烧泡所述烘烤后的基板；
使用玻璃灯罩对烧泡后的基板进行密封并充入惰性气体。
可选地，所述惰性气体为氩气。
第三方面，本公开提供一种LED灯，所述LED灯包括上述LED灯珠。
本公开提供的LED灯珠及其制造方法，将LED光源和驱动电路集成到一块基板上，简化了相关技术中LED灯珠的结构，效率高，产能大，成本低。可选地，基板采用透明陶瓷材料制成，确保LED光源的光照角度达到360°，同时可以保证LED光源的散热；可选地，在玻璃灯罩内充入氩气，方便LED光源散热灯罩形状与相关技术中的卤素灯外形一致，便于可以直接替换现有卤素灯。
附图说明
图1为本实施例提供的一种LED灯珠的结构示意图；
图2为本实施例提供的一种LED灯珠的制造方法的流程示意图；
图3为本实施例提供的一种LED灯的结构示意图。
具体实施方式
发明人发现，相关技术中的LED发光部分和LED驱动电路部分分开设计，导致LED灯珠结构复杂。在不冲突的情况下，以下实施例和实施例中的特征可以 相互组合。
本实施例提供一种LED灯珠，如图1所示，所述LED灯珠包括：LED光源组件1、与所述LED光源组件1电连接的灯脚组件2及套设于所述LED光源组件1外侧的玻璃灯罩3，其中，所述玻璃灯罩3内填充有惰性气体；所述LED光源组件1包括基板11、LED光源12和驱动电路13，所述LED光源12和驱动电路13布设于所述基板11上，其中，所述基板11表面设有导电材料，所述灯脚组件2通过所述导电材料与所述驱动电路13电连接；所述驱动电路13通过所述导电材料与所述LED光源12电连接。
可选地，本实施例提供的LED灯珠使用AC高压LED光源，可以直接外接交流电，驱动电路简单。
可选地，在所述玻璃灯罩内充入氩气，以便LED光源散热。
可选地，所述基板采用透明陶瓷材料制成，在基板表面设有镍材料用于导电。
可选地，本实施例提供的LED灯珠可以选用多种型号的灯脚组件，如G9、GY6.35、G5.3或者G4。
本实施例提供的LED灯珠，将LED光源和驱动电路集成到一块基板上，简化了相关技术中LED灯珠的结构，同时保证良好的光效和驱动效果。进一步地，基板采用透明陶瓷材料制成，确保光照角度达到360°，同时可以保证LED光源的散热；在玻璃灯罩内充入氩气，方便LED光源散热，灯罩形状与相关技术中卤素灯外形一致，便于可以直接替换相关技术中的卤素灯。
本实施例还提供一种LED灯珠的制造方法，如图2所示，所述制造方法包括以下步骤：
在步骤110中、将LED光源和驱动电路贴在基板上，所述基板的表面设有导电材料。可以用镍作导电材料，基板可以采用透明陶瓷材料制成，在加工基板时，将灯脚组件与基板之间紧密结合，基板能够与G9、GY6.35、G5.3或者G4等多种型号的灯脚组件配合使用；
在步骤120中、将贴好的LED光源和驱动电路打线连接到所述基板的导电材料上。
在步骤130中、对打线之后的基板的正反两面分别点胶并烘烤。为了提高发 光效果，在使用的胶中掺杂荧光粉；采用双面点胶可以增加光照角度，实现360°全角度照射；
在步骤140中、对烘烤后的基板进行封泡。可以包括：烧泡所述烘烤后的基板，在基板表面烧结球泡；使用玻璃灯罩对烧泡后的基板进行密封并在灯罩内充入惰性气体，这里可以选择氩气。
封泡完成后，对正常封泡的产品进行测试，包括电性能测试和光学性能测试，对测试结果正常的产品进行包装后即可出厂。
可选地，为了提高生产效率，在加工基板时，可以将多个基板设计在同一块拼板上，这样自动化贴片机和打线机可以同时对所述拼板上的所有LED光源及其驱动电路进行贴片和打线。完成贴片和打线后，对所述拼板进行双面点胶和烘烤，再对烘烤后的拼板进行切割，形成单独的基板，基板尺寸提前已经设定好，如每个基板的宽度为9mm，每个基板的长度为20mm，再对每个单独的基板进行封泡。
由于本实施例中将灯脚组件与基板之间紧密结合，使得产品在烧泡过程中避免由于烧泡温度过高而导致灯脚组件从基板上脱落从而造成低良以及烧泡异常，同时有效提高了产品的使用寿命。
本施例提供的LED灯珠的制造方法，使用集成电路***级封装(System In Package，SIP)技术，将LED光源和驱动电路集成到一块基板上，结构简单，同时还能减小频闪。所述制造方法可以实现生产流程的自动化操作，效率高，产能大，成本低。
本实施例还提供一种LED灯，所述LED灯包括上述LED灯珠。参考图3，LED灯20包括LED灯珠201，LED灯珠201为上述任一种LED灯珠。LED灯20中LED灯珠201的个数可以为至少一个。
工业实用性
本公开提供一种LED灯珠及其制造方法，将LED光源和驱动电路集成到一块基板上，简化了相关技术中LED灯珠的结构，降低了生产成本，提高了生产效率高，加大了产能。

Claims (10)

  1. 一种LED灯珠包括：发光二极管LED光源组件、与所述LED光源组件电连接的灯脚组件及套设于所述LED光源组件外侧的玻璃灯罩，其中，
    所述玻璃灯罩内填充有惰性气体；
    所述LED光源组件包括基板以及布设于所述基板上的LED光源和驱动电路，其中，
    所述基板的表面设有导电材料，所述灯脚组件通过所述导电材料与所述驱动电路电连接；
    所述驱动电路通过所述导电材料与所述LED光源电连接。
  2. 根据权利要求1所述的LED灯珠，其中，所述LED光源为交流AC高压LED光源。
  3. 根据权利要求1所述的LED灯珠，其中，所述惰性气体为氩气。
  4. 根据权利要求1所述的LED灯珠，其中，所述基板由透明陶瓷材料制成。
  5. 根据权利要求1所述的LED灯珠，其中，所述导电材料为镍。
  6. 根据权利要求1所述的LED灯珠，其中，所述灯脚组件的型号包括：G9、GY6.35、G5.3或者G4。
  7. 一种LED灯珠的制造方法，包括：
    将发光二极管LED光源和驱动电路贴在基板上，所述基板的表面设有导电材料；
    将贴好的LED光源和驱动电路打线连接到所述基板的导电材料上；
    对打线之后的基板的正反两面分别点胶并烘烤；
    对烘烤后的基板进行封泡。
  8. 根据权利要求7所述的制造方法，其中，所述对烘烤后的基板进行封泡，包括：
    烧泡所述烘烤后的基板；
    使用玻璃灯罩对烧泡后的基板进行密封并充入惰性气体。
  9. 根据权利要求8所述的制造方法，其中，所述惰性气体为氩气。
  10. 一种LED灯，包括如权利要求1至6中任一项所述的LED灯珠。
PCT/CN2017/086800 2016-10-28 2017-06-01 Led灯珠及其制造方法 WO2018076692A1 (zh)

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CN106499975A (zh) * 2016-10-28 2017-03-15 包锋 Led灯珠及其制造方法
CN108167677A (zh) * 2017-12-27 2018-06-15 亚浦耳照明股份有限公司 一种led的制备方法及led灯

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