WO2018074510A1 - 有機el表示素子用封止剤 - Google Patents
有機el表示素子用封止剤 Download PDFInfo
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- WO2018074510A1 WO2018074510A1 PCT/JP2017/037662 JP2017037662W WO2018074510A1 WO 2018074510 A1 WO2018074510 A1 WO 2018074510A1 JP 2017037662 W JP2017037662 W JP 2017037662W WO 2018074510 A1 WO2018074510 A1 WO 2018074510A1
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- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- GMXOYEFGMAXIIU-UHFFFAOYSA-N C[N+](CC1=CC(=C(C=C1)C)C)(C1=CC=CC=C1)C Chemical compound C[N+](CC1=CC(=C(C=C1)C)C)(C1=CC=CC=C1)C GMXOYEFGMAXIIU-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- QVHMSMOUDQXMRS-UHFFFAOYSA-N PPG n4 Chemical compound CC(O)COC(C)COC(C)COC(C)CO QVHMSMOUDQXMRS-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- MOOIXEMFUKBQLJ-UHFFFAOYSA-N [1-(ethenoxymethyl)cyclohexyl]methanol Chemical compound C=COCC1(CO)CCCCC1 MOOIXEMFUKBQLJ-UHFFFAOYSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- AENNXXRRACDJAY-UHFFFAOYSA-N bis(2-dodecylphenyl)iodanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC AENNXXRRACDJAY-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical class [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 1
- ONRGBXGMVZEZLY-UHFFFAOYSA-N dimethyl-[(4-methylphenyl)methyl]-phenylazanium Chemical compound C1=CC(C)=CC=C1C[N+](C)(C)C1=CC=CC=C1 ONRGBXGMVZEZLY-UHFFFAOYSA-N 0.000 description 1
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ZCIJAGHWGVCOHJ-UHFFFAOYSA-N naphthalene phenol Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)O ZCIJAGHWGVCOHJ-UHFFFAOYSA-N 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- PBHPFFDRTUWVIT-UHFFFAOYSA-N oxetan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCO1 PBHPFFDRTUWVIT-UHFFFAOYSA-N 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- HMKGBOLFVMRQRP-UHFFFAOYSA-N tribenzyl(phenyl)azanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 HMKGBOLFVMRQRP-UHFFFAOYSA-N 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- ULNJZOIDTANZKR-UHFFFAOYSA-N tris[4-(4-acetylphenyl)sulfanylphenyl]sulfanium Chemical compound C1=CC(C(=O)C)=CC=C1SC1=CC=C([S+](C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=2C=CC(SC=3C=CC(=CC=3)C(C)=O)=CC=2)C=C1 ULNJZOIDTANZKR-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Definitions
- the present invention relates to an organic EL display element sealant that can be easily applied by an ink jet method, has excellent low outgassing properties, and can reduce damage to an ink jet apparatus.
- An organic electroluminescence (“organic EL”) display element has a laminated structure in which an organic light emitting material layer is sandwiched between a pair of electrodes facing each other, and electrons are injected into the organic light emitting material layer from one electrode. In addition, when holes are injected from the other electrode, electrons and holes are combined in the organic light emitting material layer to emit light.
- the organic EL display element since the organic EL display element performs self-emission, it has better visibility than a liquid crystal display element that requires a backlight, can be reduced in thickness, and can be driven by a DC low voltage. Has the advantage.
- Patent Document 1 discloses a method of sealing an organic light emitting material layer and an electrode of an organic EL display element with a laminated film of a silicon nitride film and a resin film formed by a CVD method.
- the resin film has a role of preventing pressure on the organic layer and the electrode due to internal stress of the silicon nitride film.
- Patent Document 1 In the method of sealing with a silicon nitride film disclosed in Patent Document 1, organic light emission occurs when a silicon nitride film is formed due to unevenness on the surface of the organic EL display element, adhesion of foreign matters, generation of cracks due to internal stress, or the like. The material layer or electrode may not be completely covered. If the coating with the silicon nitride film is incomplete, moisture will enter the organic light emitting material layer through the silicon nitride film. As a method for preventing moisture from entering into the organic light emitting material layer, Patent Document 2 discloses a method of alternately depositing an inorganic material film and a resin film. Patent Document 3 and Patent Document 4 Discloses a method of forming a resin film on an inorganic material film.
- a method for forming a resin film there is a method in which a sealing agent is applied on a substrate using an inkjet method and then the sealing agent is cured. If such a coating method by the ink jet method is used, a resin film can be uniformly formed at high speed. However, if the sealant is made to have a low viscosity in order to be suitable for application by the ink jet method, outgas is generated or the head portion of the ink jet device is damaged and the flow path is changed. In such a case, there is a problem that stable discharge cannot be performed for a long time.
- An object of this invention is to provide the sealing agent for organic EL display elements which can be apply
- Invention 1 contains a polymerizable compound and a polymerization initiator, has a viscosity at 25 ° C. of 5 to 50 mPa ⁇ s, a surface tension at 25 ° C. of 15 to 35 mN / m, and a sealing agent.
- the weight change rate of the ethylene, propylene, and diene rubber before and after the impregnation test is 10% or less. It is a sealant.
- the present invention 2 is an organic EL display element sealant used for coating by an ink jet method, which contains a polymerizable compound and a polymerization initiator, and immerses ethylene / propylene / diene rubber in the sealant.
- the encapsulant for organic EL display elements has a weight change rate of ethylene / propylene / diene rubber of 10% or less before and after the impregnation test.
- the present invention is described in detail below.
- the sealing agent for organic EL display elements of this invention 1 and the sealing agent for organic EL display elements of this invention 2 it describes as "the sealing agent for organic EL display elements of this invention". To do.
- the inventors of the present invention also have a specific range of the weight change rate of ethylene / propylene / diene rubber (hereinafter also referred to as “EPDM rubber”) before and after the impregnation test for the sealing agent for organic EL display elements having excellent ink jet coating properties.
- EPDM rubber ethylene / propylene / diene rubber
- the sealing agent for organic EL display elements of the present invention can be used as an ink jet method for coating by a non-heated ink jet method, or can be used for coating by a heat ink jet method.
- the “non-heated ink jet method” is a method of ink jet coating at a coating head temperature of less than 28 ° C.
- the “heated ink jet method” is an ink jet at a coating head temperature of 28 ° C. or higher. It is a method of applying.
- an ink jet coating head equipped with a heating mechanism is used.
- the viscosity and the surface tension can be lowered when discharging the sealing agent for organic EL display elements.
- Examples of the inkjet coating head equipped with the heating mechanism include KM1024 series manufactured by Konica Minolta, SG1024 series manufactured by Fuji Film Dimatix, and the like.
- the heating temperature of the coating head is preferably in the range of 28 ° C. to 80 ° C.
- the heating temperature of the coating head is within this range, the increase in the viscosity of the sealant for organic EL display elements over time is suppressed, and the ejection stability is improved.
- the sealing agent for organic EL display elements of the present invention 1 has a viscosity lower limit of 5 mPa ⁇ s and an upper limit of 50 mPa ⁇ s. When the viscosity is within this range, it can be suitably applied by an ink jet method.
- the said viscosity in this specification means the value measured on 25 degreeC and 100 rpm conditions using an E-type viscosity meter.
- the preferable lower limit of the viscosity of the sealing agent for organic EL display elements of the present invention when applied by the non-heating ink jet method is 5 mPa ⁇ s, and the preferable upper limit is 20 mPa.s. s.
- the more preferable lower limit of the viscosity of the sealing agent for organic EL display elements of the present invention when applied by the non-heating ink jet method is 8 mPa ⁇ s, and the more preferable upper limit is 16 mPa ⁇ s. s, a more preferred lower limit is 10 mPa ⁇ s, and a more preferred upper limit is 13 mPa ⁇ s. s.
- the preferable lower limit of the viscosity of the sealing agent for organic EL display elements of the present invention when used for coating by the heating ink jet method is 10 mPa ⁇ s, and the preferable upper limit is 50 mPa ⁇ s. s.
- the viscosity is within this range, it can be suitably applied by a heating ink jet method.
- the more preferable lower limit of the viscosity of the sealing agent for organic EL display elements of the present invention when used for coating by the heating ink jet method is 20 mPa ⁇ s, and the more preferable upper limit is 40 mPa ⁇ s. s.
- the sealing agent for organic EL display elements of the present invention 1 has a lower limit of surface tension of 15 mN / m and an upper limit of 35 mN / m. When the surface tension is within this range, it can be suitably applied by an ink jet method.
- the preferable lower limit of the surface tension is 20 mN / m
- the preferable upper limit is 30 mN / m
- the more preferable lower limit is 22 mN / m
- the more preferable upper limit is 28 mN / m.
- the sealing agent for organic EL display elements of the present invention 2 has a preferable lower limit of surface tension of 15 mN / m and a preferable upper limit of 35 mN / m.
- the surface tension When the surface tension is within this range, it can be suitably applied by an ink jet method.
- the more preferable lower limit of the surface tension is 20 mN / m
- the more preferable upper limit is 30 mN / m
- the still more preferable lower limit is 22 mN / m
- the still more preferable upper limit is 28 mN / m.
- the surface tension means a value measured by a Wilhelmy method using a dynamic wettability tester at 25 ° C.
- the encapsulant for organic EL display elements of the present invention has a weight change rate of the EPDM rubber before and after the impregnation test when the impregnation test is performed by leaving the EPDM rubber immersed in the encapsulant for 1 week at 25 ° C. Is 10% or less.
- the weight change rate of the EPDM rubber is 10% or less, the effect of reducing damage to the ink jet device is excellent.
- a preferable upper limit of the weight change rate of the EPDM rubber is 8%, and a more preferable upper limit is 5%.
- the weight change rate of the EPDM rubber before and after the impregnation test was specifically determined by placing an organic EL display element sealant in a brown screw tube and immersing an EPDM rubber having a weight W 1 (g) to cover the lid. and, after standing for 1 week at 25 ° C., wipe the surface with a cloth or the like is taken out EPDM rubber, by measuring the weight (W 2 (g)), it can be obtained by the following equation.
- Weight change rate (%) ((W 2 ⁇ W 1 ) / W 1 ) ⁇ 100
- the rate may be 10% or less.
- examples of such commercially available EPDM rubber include AS568-009 (manufactured by Mori Seika Co., Ltd.).
- the said weight average molecular weight is a value calculated
- examples of the column for measuring the weight average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko KK).
- tetrahydrofuran etc. are mentioned as a solvent used by GPC.
- the viscosity, the surface tension, and the weight change rate of the EPDM rubber before and after the impregnation test are selected as follows for the polymerizable compound, the polymerization initiator, and other components that may be contained. And it can be set as the range mentioned above by adjustment of a content rate.
- the sealing agent for organic EL display elements of the present invention contains a polymerizable compound.
- the polymerizable compound preferably contains 10 to 100 parts by weight of a compound containing 17% or more oxygen atoms in the molecule in 100 parts by weight of the whole polymerizable compound.
- the present inventors considered that the cause of the damage of the above-described ink jet device was high compatibility between the rubber material used for the head portion of the device and the sealant. Therefore, as a polymerizable compound to be blended in the sealant, it was examined to use a compound that is considered to have low compatibility with the rubber material based on the value of the solubility parameter.
- the present inventors have used a compound containing 17% or more of oxygen atoms in the molecule as a polymerizable compound so as to have a specific content, so that the EPDM rubber before and after the impregnation test can be easily used. It has been found that the weight change rate can be 10% or less.
- the compound containing 17% or more of oxygen atoms in the molecule preferably contains 20% or more, more preferably 25% or more of oxygen atoms in the molecule.
- a more preferred lower limit of the content of the compound containing 17% or more of oxygen atoms in the molecule in 100 parts by weight of the whole polymerizable compound is 20 parts by weight.
- the said polymeric compound does not contain the carbon chain skeleton which a carbon atom continues for 8 or more.
- the polymerizable compound does not contain a carbon chain skeleton in which 8 or more carbon atoms are continuous, the compatibility with the rubber material does not increase, and the effect of reducing damage to the ink jet apparatus is improved.
- the carbon chain skeleton having 8 or more continuous carbon atoms include an alkylene group having 8 or more carbon atoms, an alkenylene group having 8 or more carbon atoms, a combination of a cyclohexane ring and an alkylene group having 2 or more carbon atoms, or an alkenylene group. .
- a radical polymerizable compound or a cationic polymerizable compound can be used as the polymerizable compound.
- a (meth) acrylic compound is preferable.
- the (meth) acrylic compound may be a monofunctional (meth) acrylic compound or a polyfunctional (meth) acrylic compound.
- the above “(meth) acryl” means acryl or methacryl
- the above “(meth) acryl compound” means a compound having a (meth) acryloyl group
- the above “(meth) “Acryloyl” means acryloyl or methacryloyl.
- the monofunctional (meth) acrylic compound preferably has a cationic polymerizable group from the viewpoint of low outgassing property.
- the cationic polymerizable group include a vinyl ether group, an epoxy group, an oxetanyl group, an allyl ether group, a vinyl group, and a hydroxyl group.
- the monofunctional (meth) acrylic compound examples include 3,4-epoxycyclohexylmethyl (meth) acrylate, glycidyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, and (meth) acrylic.
- (meth) acrylate 3,4-epoxycyclohexylmethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, and 2- (2-vinyloxyethoxy) ethyl (meth) acrylate are preferable.
- the “(meth) acrylate” means acrylate or methacrylate.
- the preferred lower limit of the content of the monofunctional (meth) acrylic compound in 100 parts by weight of the polymerizable compound is 20 parts by weight, and the preferred upper limit is 80. Parts by weight.
- the content of the monofunctional (meth) acrylic compound is within this range, the obtained sealing agent for organic EL display elements is excellent due to low outgassing properties and the like.
- the minimum with more preferable content of the said monofunctional (meth) acryl compound is 30 weight part, and a more preferable upper limit is 60 weight part.
- the polyfunctional (meth) acrylic compound preferably has a polyoxyalkylene skeleton in the main chain from the viewpoint of inkjet coating properties and the like.
- the polyoxyalkylene skeleton is preferably a series of 2 to 6 oxyalkylene units.
- Examples of oxyalkylene units constituting the polyoxyalkylene skeleton include oxyethylene units and oxypropylene units.
- the polyfunctional (meth) acrylic compound preferably has a structure with less carbon chain branching, and more preferably is a straight chain, from the viewpoint of inkjet coating properties and the like.
- polyfunctional (meth) acrylic compound examples include diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and dipropylene glycol di (meth) acrylate. , Tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, polytetramethylene glycol di (meth) acrylate, and the like. Of these, tetraethylene glycol di (meth) acrylate is preferable.
- the preferred lower limit of the content of the polyfunctional (meth) acrylic compound in 100 parts by weight of the polymerizable compound is 20 parts by weight, and the preferred upper limit is 80. Parts by weight.
- the content of the polyfunctional (meth) acrylic compound is within this range, the obtained sealing agent for organic EL display elements is excellent in ink jet coating properties and the like.
- the minimum with more preferable content of the said polyfunctional (meth) acryl compound is 30 weight part, and a more preferable upper limit is 60 weight part.
- the content ratio of the monofunctional (meth) acrylic compound and the polyfunctional (meth) acrylic compound is expressed as a weight ratio.
- an epoxy compound an oxetane compound, a vinyl ether compound etc. are mentioned, for example.
- the epoxy compound examples include bisphenol A type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol O type epoxy resin, 2,2′-diallyl bisphenol A type epoxy resin, Alicyclic epoxy resin, hydrogenated bisphenol type epoxy resin, propylene oxide added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, sulfide type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene Epoxy resin, phenol novolac epoxy resin, orthocresol novolac epoxy resin, dicyclopentadiene novolac epoxy resin, biphenyl Examples thereof include a volac type epoxy resin, a naphthalene phenol novolac type epoxy resin, a glycidyl amine type epoxy resin, an alkyl polyol type epoxy resin, a rubber-modified epoxy resin, a glycidyl ester compound, and 1,6-hexan
- alicyclic epoxy resins are preferred.
- examples of commercially available alicyclic epoxy resins include Celoxide 2000, Celoxide 2021P, Celoxide 2081, Celoxide 3000, Celoxide 8000 (all manufactured by Daicel), and Sunsizer EPS (manufactured by Shin Nippon Rika Kogyo Co., Ltd.). ) And the like.
- oxetane compound examples include allyloxyoxetane, phenoxymethyloxetane, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3- (phenoxymethyl) oxetane, 3-ethyl-3-((2-ethylhexyloxy ) Methyl) oxetane, 3-ethyl-3-((3- (triethoxysilyl) propoxy) methyl) oxetane, 3-ethyl-3-((((3-ethyloxetane-3-yl) methoxy) methyl) oxetane, Examples include oxetanylsilsesquioxane, phenol novolac oxetane, 1,4-bis (((3-ethyl-3-oxetanyl) methoxy) methyl) benzene.
- vinyl ether compound examples include benzyl vinyl ether, cyclohexane dimethanol monovinyl ether, dicyclopentadiene vinyl ether, 1,4-butanediol divinyl ether, cyclohexane dimethanol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, dipropylene glycol. Examples thereof include divinyl ether and tripropylene glycol divinyl ether.
- the sealing agent for organic EL display elements of the present invention contains a polymerization initiator.
- a radical photopolymerization initiator, a thermal radical polymerization initiator, a cationic photopolymerization initiator, or a thermal cationic polymerization initiator is suitably used depending on the type of polymerizable compound used.
- photo radical polymerization initiator examples include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, benzyl, thioxanthone compounds, and the like.
- Examples of commercially available photo radical polymerization initiators include IRGACURE 184, IRGACURE 369, IRGACURE 379, IRGACURE 651, IRGACURE 819, IRGACURE 907, IRGACURE 2959, IRGACURE OXE01, and Lucin TPO (both benzoin methyl ether, benzoin methyl ether) Examples include ethyl ether and benzoin isopropyl ether (both manufactured by Tokyo Chemical Industry Co., Ltd.).
- thermal radical polymerization initiator what consists of an azo compound, an organic peroxide, etc. is mentioned, for example.
- the azo compound include 2,2′-azobis (2,4-dimethylvaleronitrile), azobisisobutyronitrile, and the like.
- the organic peroxide include benzoyl peroxide, ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxyester, diacyl peroxide, and peroxydicarbonate.
- thermal radical polymerization initiators examples include VPE-0201, VPE-0401, VPE-0601, VPS-0501, VPS-1001, and V-501 (all manufactured by Wako Pure Chemical Industries, Ltd.). ) And the like.
- the photocationic polymerization initiator is not particularly limited as long as it generates a protonic acid or a Lewis acid by light irradiation, and may be an ionic photoacid generating type or a nonionic photoacid generating type. May be.
- Examples of the anion portion of the ionic photoacid-generating photocationic polymerization initiator include BF 4 ⁇ , PF 6 ⁇ , SbF 6 ⁇ , and (BX 4 ) ⁇ (wherein X is at least two or more. And a phenyl group substituted with a fluorine or trifluoromethyl group).
- Examples of the ionic photoacid-generating photocationic polymerization initiator include aromatic sulfonium salts, aromatic iodonium salts, aromatic diazonium salts, aromatic ammonium salts having the above anion moiety, and (2,4-cyclohexane). And pentadien-1-yl) ((1-methylethyl) benzene) -Fe salt.
- aromatic sulfonium salt examples include bis (4- (diphenylsulfonio) phenyl) sulfide bishexafluorophosphate, bis (4- (diphenylsulfonio) phenyl) sulfide bishexafluoroantimonate, and bis (4- ( Diphenylsulfonio) phenyl) sulfide bistetrafluoroborate, bis (4- (diphenylsulfonio) phenyl) sulfide tetrakis (pentafluorophenyl) borate, diphenyl-4- (phenylthio) phenylsulfonium hexafluorophosphate, diphenyl-4- ( Phenylthio) phenylsulfonium hexafluoroantimonate, diphenyl-4- (phenylthio) phenylsulfonium tetraflu
- aromatic iodonium salt examples include diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium tetrafluoroborate, diphenyliodonium tetrakis (pentafluorophenyl) borate, bis (dodecylphenyl) iodonium hexafluorophosphate, bis (Dodecylphenyl) iodonium hexafluoroantimonate, bis (dodecylphenyl) iodonium tetrafluoroborate, bis (dodecylphenyl) iodonium tetrakis (pentafluorophenyl) borate, 4-methylphenyl-4- (1-methylethyl) phenyliodonium hexa Fluorophosphate, 4-methylphenyl-4- (1-methylethy
- aromatic diazonium salt examples include phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, and phenyldiazonium tetrakis (pentafluorophenyl) borate.
- aromatic ammonium salt examples include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, 1-benzyl-2-cyanopyridinium tetrafluoroborate, 1-benzyl -2-Cyanopyridinium tetrakis (pentafluorophenyl) borate, 1- (naphthylmethyl) -2-cyanopyridinium hexafluorophosphate, 1- (naphthylmethyl) -2-cyanopyridinium hexafluoroantimonate, 1- (naphthylmethyl)
- Examples include -2-cyanopyridinium tetrafluoroborate and 1- (naphthylmethyl) -2-cyanopyridinium tetrakis (pentafluorophenyl) borate.
- Examples of the (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe salt include (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene.
- nonionic photoacid-generating photocationic polymerization initiator examples include nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenol sulfonic acid ester, diazonaphthoquinone, N-hydroxyimide sulfonate, and the like.
- photocationic polymerization initiators examples include, for example, DTS-200 (manufactured by Midori Chemical Co., Ltd.), UVI6990, UVI6974 (all manufactured by Union Carbide), SP-150, SP-170 (all ADEKA), FC-508, FC-512 (all from 3M), IRGACURE261, IRGACURE290 (all from BASF), PI2074 (from Rhodia), and the like.
- the anion moiety is BF 4 ⁇ , PF 6 ⁇ , SbF 6 ⁇ , or (BX 4 ) ⁇ (where X is substituted with at least two fluorine or trifluoromethyl groups
- a sulfonium salt, a phosphonium salt, an ammonium salt, and the like are preferable.
- sulfonium salt examples include triphenylsulfonium tetrafluoroborate and triphenylsulfonium hexafluoroantimonate.
- Examples of the phosphonium salt include ethyltriphenylphosphonium hexafluoroantimonate and tetrabutylphosphonium hexafluoroantimonate.
- ammonium salt examples include dimethylphenyl (4-methoxybenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methoxybenzyl) ammonium hexafluoroantimonate, dimethylphenyl (4-methoxybenzyl) ammonium tetrakis (pentafluorophenyl).
- thermal cationic polymerization initiators include, for example, Sun-Aid SI-60, Sun-Aid SI-80, Sun-Aid SI-B3, Sun-Aid SI-B3A, Sun-Aid SI-B4 (all of which are Sanshin Chemical Industry Co., Ltd.). CXC1612, CXC1821 (all manufactured by King Industries) and the like.
- the content of the polymerization initiator is preferably 0.01 parts by weight and preferably 10 parts by weight with respect to 100 parts by weight of the polymerizable compound.
- the content of the polymerization initiator is 0.01 parts by weight or more, the obtained sealing agent for organic EL display elements is more excellent in curability.
- the content of the polymerization initiator is 10 parts by weight or less, the curing reaction of the obtained sealing agent for organic EL display elements does not become too fast, and the workability is improved, and the cured product is more uniform. It can be.
- the minimum with more preferable content of the said polymerization initiator is 0.05 weight part, and a more preferable upper limit is 5 weight part.
- the sealing agent for organic EL display elements of the present invention may contain a sensitizer.
- the sensitizer has a role of further improving the polymerization initiation efficiency of the polymerization initiator and further promoting the curing reaction of the sealing agent for organic EL display elements of the present invention.
- sensitizer examples include thioxanthone compounds such as 2,4-diethylthioxanthone, 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, 2,4-dichlorobenzophenone, o- Examples include methyl benzoylbenzoate, 4,4′-bis (dimethylamino) benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, and the like.
- thioxanthone compounds such as 2,4-diethylthioxanthone, 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, 2,4-dichlorobenzophenone, o- Examples include methyl benzoylbenzoate, 4,4′-bis (dimethylamino) benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, and the like.
- the content of the sensitizer is preferably 0.01 parts by weight and preferably 3 parts by weight with respect to 100 parts by weight of the polymerizable compound.
- the content of the sensitizer is 0.01 parts by weight or more, the sensitizing effect is more exhibited.
- the content of the sensitizer is 3 parts by weight or less, light can be transmitted to a deep part without excessive absorption.
- the minimum with more preferable content of the said sensitizer is 0.1 weight part, and a more preferable upper limit is 1 weight part.
- the sealing agent for organic EL display elements of the present invention may contain a silane coupling agent.
- the said silane coupling agent has a role which improves the adhesiveness of the sealing agent for organic EL display elements of this invention, a board
- silane coupling agent examples include 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltrimethoxysilane, and the like. These silane coupling agents may be used independently and 2 or more types may be used together.
- the content of the silane coupling agent is preferably 0.1 parts by weight and preferably 10 parts by weight with respect to 100 parts by weight of the polymerizable compound. When the content of the silane coupling agent is within this range, the effect of improving the adhesiveness is suppressed while suppressing the excess silane coupling agent from bleeding out.
- the minimum with more preferable content of the said silane coupling agent is 0.5 weight part, and a more preferable upper limit is 5 weight part.
- the sealing agent for organic EL display elements of the present invention may further contain a surface modifier as long as the object of the present invention is not impaired.
- a surface modifier By containing the surface modifier, the flatness of the coating film can be imparted to the organic EL display element sealant of the present invention.
- the surface modifier include surfactants and leveling agents.
- Examples of the surface modifier include silicone-based and fluorine-based ones.
- Examples of commercially available surface modifiers include BYK-340, BYK-345 (both manufactured by Big Chemie Japan) and Surflon S-611 (manufactured by AGC Seimi Chemical).
- the encapsulant for organic EL display elements of the present invention may contain a solvent for the purpose of adjusting the viscosity, but problems such as deterioration of the organic light emitting material layer and generation of outgas due to the remaining solvent. Therefore, it is preferable that the solvent is not contained or the solvent content is 0.05% by weight or less.
- the sealing agent for organic EL display elements of this invention contains well-known various additives, such as a reinforcing agent, a softening agent, a plasticizer, a viscosity modifier, a ultraviolet absorber, antioxidant, as needed. May be.
- Examples of the method for producing the sealing agent for organic EL display elements of the present invention include a polymerizable compound using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, and a three roll. And a method of mixing a polymerization initiator and an additive such as a silane coupling agent added if necessary.
- a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, and a three roll.
- a method of mixing a polymerization initiator and an additive such as a silane coupling agent added if necessary.
- the preferable lower limit of the total light transmittance of light at a wavelength of 380 to 800 nm of the cured product of the encapsulant for organic EL display elements of the present invention is 80%.
- the total light transmittance is 80% or more, the obtained organic EL display element has superior optical characteristics.
- a more preferable lower limit of the total light transmittance is 85%.
- cured material used for the measurement of the said total light transmittance is a photocurable sealing agent, it will obtain by, for example, irradiating 3000 mJ / cm ⁇ 2 > of ultraviolet rays with a wavelength of 365 nm with a LED lamp to a sealing agent. If it is a thermosetting sealant, it can be obtained by heating at 80 ° C. for 1 hour, for example.
- the transmittance at 400 nm after irradiating the cured product with ultraviolet rays for 100 hours is preferably 85% or more at an optical path length of 20 ⁇ m.
- the transmittance after irradiating the ultraviolet rays for 100 hours is 85% or more, the transparency is high, the loss of light emission is small, and the color reproducibility is excellent.
- a more preferable lower limit of the transmittance after irradiation with the ultraviolet rays for 100 hours is 90%, and a more preferable lower limit is 95%.
- the light source for irradiating the ultraviolet rays a conventionally known light source such as a xenon lamp or a carbon arc lamp can be used.
- permeability after irradiating the said ultraviolet-ray for 100 hours is a photocurable sealing agent, for example, ultraviolet rays with a wavelength of 365 nm will be 3000 mJ / cm with a LED lamp to sealing agent. If it is a thermosetting sealant, it can be obtained, for example, by heating at 80 ° C. for 1 hour.
- the sealant for an organic EL display device of the present invention has a moisture permeability of 100 g / 100 ⁇ m when the cured product is exposed to an environment of 85 ° C. and 85% RH for 24 hours in accordance with JIS Z 0208.
- m is preferably 2 or less.
- the moisture permeability is 100 g / m 2 or less, the effect of preventing moisture from reaching the organic light emitting material layer and the generation of dark spots is improved, and the resulting organic EL display element is more reliable. It will be a thing.
- cured material used for the said moisture permeability measurement is a photocurable sealing agent, for example, it can obtain by irradiating 3000 mJ / cm ⁇ 2 > of ultraviolet rays with a wavelength of 365 nm with a LED lamp to sealing agent. If it is a thermosetting sealing agent, it can obtain by heating at 80 degreeC for 1 hour, for example.
- the sealing agent for organic EL display elements of the present invention may have a moisture content of less than 0.5% when the cured product is exposed to an environment of 85 ° C. and 85% RH for 24 hours. preferable.
- the moisture content of the cured product is less than 0.5%, the effect of preventing the deterioration of the organic light emitting material layer due to moisture in the cured product is excellent, and the obtained organic EL display element is excellent in reliability. It becomes.
- a more preferable upper limit of the moisture content of the cured product is 0.3%.
- Examples of the method for measuring the moisture content include a method of obtaining by a Karl Fischer method in accordance with JIS K 7251, and a method of obtaining a weight increment after water absorption in accordance with JIS K 7209-2.
- cured material used for the measurement of the said moisture content is a photocurable sealing agent, it can obtain by irradiating 3000 mJ / cm ⁇ 2 > of ultraviolet rays with a wavelength of 365 nm with a LED lamp to a sealing agent, for example. If it is a thermosetting sealing agent, it can obtain by heating at 80 degreeC for 1 hour, for example.
- the sealing agent for organic EL display elements of the present invention 1 is suitably used for coating by an ink jet method
- the sealing agent for organic EL display elements of the present invention 2 is used for coating by an ink jet method.
- a method for producing an organic EL display element using the sealing agent for organic EL display elements of the present invention for example, a step of applying the sealing agent for organic EL display elements of the present invention to a substrate by an inkjet method, And a method of curing the applied sealing agent for organic EL display elements by light irradiation and / or heating.
- the organic EL display element sealant of the present invention may be applied to the entire surface of the substrate, or on a part of the substrate. It may be applied.
- the shape of the sealing portion of the sealing agent for organic EL display elements of the present invention formed by coating is not particularly limited as long as it is a shape that can protect the laminate having the organic light emitting material layer from the outside air. A shape that completely covers the body may be formed, a closed pattern may be formed in the peripheral portion of the laminate, or a pattern having a shape in which a partial opening is provided in the peripheral portion of the laminate. It may be formed.
- the organic EL display element sealant of the present invention irradiates light having a wavelength of 300 nm to 400 nm and an accumulated light amount of 300 to 3000 mJ / cm 2. Can be suitably cured.
- Examples of the light source for irradiating the organic EL display element sealant of the present invention with light include a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, an excimer laser, a chemical lamp, a black light lamp, and a microwave.
- Examples include an excited mercury lamp, a metal halide lamp, a sodium lamp, a halogen lamp, a xenon lamp, an LED lamp, a fluorescent lamp, sunlight, and an electron beam irradiation device.
- These light sources may be used independently and 2 or more types may be used together. These light sources are appropriately selected according to the absorption wavelength of the photo radical polymerization initiator or the photo cationic polymerization initiator.
- Examples of the light irradiation means to the organic EL display element sealant of the present invention include simultaneous irradiation of various light sources, sequential irradiation with a time difference, combined irradiation of simultaneous irradiation and sequential irradiation, and the like. Any irradiation means may be used.
- the cured product obtained by the step of curing the organic EL display element sealing agent by light irradiation and / or heating may be further coated with an inorganic material film.
- the inorganic material forming the inorganic material layer can be a conventionally known, for example, silicon nitride (SiN x), silicon oxide (SiO x), and the like.
- the inorganic material film may be a single layer or may be a laminate of a plurality of types of layers. Moreover, you may coat
- the method for producing the organic EL display element comprises a step of bonding a base material (hereinafter also referred to as “one base material”) coated with the organic EL display element sealing agent of the present invention and the other base material.
- the substrate on which the sealing agent for organic EL display elements of the present invention is applied (hereinafter also referred to as “one substrate”) may be a substrate on which a laminate having an organic light emitting material layer is formed. A base material on which the laminate is not formed may be used.
- the present invention is applied to the one substrate so that the laminate can be protected from the outside air when the other substrate is bonded. What is necessary is just to apply
- the sealing agent portion having a closed pattern may be formed in a shape that fits in the shape.
- the step of curing the organic EL display element sealant by light irradiation and / or heating may be performed before the step of bonding the one base material and the other base material, You may perform after the process of bonding a base material and said other base material.
- the organic EL display of the present invention preferably has a pot life of 1 minute or longer after irradiation with light and / or heating until the curing reaction proceeds and adhesion becomes impossible. When the pot life is 1 minute or longer, higher adhesion strength can be obtained without excessive curing before the one base material and the other base material are bonded together.
- a method of bonding the one base material and the other base material is not particularly limited, but it is preferable to bond them in a reduced-pressure atmosphere.
- the preferable lower limit of the degree of vacuum in the reduced-pressure atmosphere is 0.01 kPa, and the preferable upper limit is 10 kPa.
- the degree of vacuum in the reduced-pressure atmosphere is within this range, the one base material and the other base material are not spent for a long time to achieve a vacuum state due to the airtightness of the vacuum device and the ability of the vacuum pump. Bubbles in the sealing agent for organic EL display elements of the present invention when the material is bonded can be more efficiently removed.
- the sealing agent for organic EL display elements which can be apply
- Examples 1 to 9, Comparative Examples 1 to 3 In accordance with the blending ratio described in Table 1, each material was uniformly stirred and mixed at a stirring speed of 3000 rpm using a homodisper type stirring mixer (“Primix Corporation,“ Homodisper L type ”). To 9 and Comparative Examples 1 to 3 were prepared as sealants for organic EL display elements. About each sealing agent for organic EL display elements obtained in Examples and Comparative Examples, measurement was performed using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., “VISCOMETER TV-22”) at 25 ° C. and 100 rpm. Table 1 shows the measured viscosity and the surface tension measured at 25 ° C.
- each sealing agent for organic EL display elements obtained in Examples and Comparative Examples was put in a brown screw tube, covered with 10 g (W 1 ) of EPDM rubber, and allowed to stand at 25 ° C. for 1 week. Then, after removing the EPDM rubber and wiping the surface with a waste cloth, the weight (W 2 ) was measured, and the weight change rate of the EPDM rubber before and after the impregnation test was calculated according to the above formula.
- As the EPDM rubber AS568-009 (manufactured by Mori Seika Co., Ltd.) was used. The results are shown in Table 1.
- each material was uniformly stirred and mixed at a stirring speed of 3000 rpm using a homodisper type stirring mixer (manufactured by Primics Co., Ltd., “Homodisper L type”).
- the sealing agent for organic EL display elements was produced by performing the spin-drying
- the surface tension was measured with a dynamic wettability tester (Reska, “WET-6100”). Further, the obtained sealant for organic EL display element is put in a brown screw tube, covered with 10 g (W 1 ) of EPDM rubber, left to stand at 25 ° C. for 1 week, and then the EPDM rubber is taken out. After wiping the surface with a waste cloth, the weight (W 2 ) was measured, and the weight change rate of the EPDM rubber before and after the impregnation test was calculated according to the above formula. As the EPDM rubber, AS568-009 (manufactured by Mori Seika Co., Ltd.) was used.
- the obtained sealant for organic EL display element was alkali-washed with an ink-jet discharge device (“NanoPrinter500” manufactured by Microjet Co., Ltd.) with a droplet volume of 30 picoliters (manufactured by Asahi Glass Co., Ltd.). , “AN100”).
- the ink jet discharge performance was evaluated by assuming that “ ⁇ ” indicates that the liquid droplets were normally discharged from the ink jet nozzle and landed on the substrate, and “X” indicates that the liquid droplets were not normally discharged.
- IJH-30 manufactured by IJT was used as an inkjet coating head, and inkjet coating was performed without heating (head temperature 25 ° C.).
- Example 2 The same sealing agent for organic EL display elements as that prepared in Experimental Example 1 was prepared. Inkjet ejection properties were evaluated in the same manner as in Experimental Example 1 except that IJH-30 (manufactured by IJT) was used as an inkjet coating head and inkjet coating was performed while heating (head temperature 60 ° C.).
- the sealing agent for organic EL display elements which can be apply
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Abstract
Description
有機発光材料層内への水分の浸入を防止するための方法として、特許文献2には、無機材料膜と樹脂膜とを交互に蒸着する方法が開示されており、特許文献3や特許文献4には、無機材料膜上に樹脂膜を形成する方法が開示されている。
また、本発明2は、インクジェット法による塗布に用いられる有機EL表示素子用封止剤であって、重合性化合物と重合開始剤とを含有し、封止剤中にエチレン・プロピレン・ジエンゴムを浸漬させたまま25℃で1週間静置する含浸試験を行った際、含浸試験前後におけるエチレン・プロピレン・ジエンゴムの重量変化率が10%以下である有機EL表示素子用封止剤である。
以下に本発明を詳述する。なお、本発明1の有機EL表示素子用封止剤と本発明2の有機EL表示素子用封止剤とに共通する事項については、「本発明の有機EL表示素子用封止剤」として記載する。
なお、本明細書において、上記「非加熱式インクジェット法」は、28℃未満の塗布ヘッド温度でインクジェット塗布する方法であり、上記「加熱式インクジェット法」は、28℃以上の塗布ヘッド温度でインクジェット塗布する方法である。
なお、本明細書において上記粘度は、E型粘度計を用いて、25℃、100rpmの条件で測定される値を意味する。
また、本発明2の有機EL表示素子用封止剤は、表面張力の好ましい下限が15mN/m、好ましい上限が35mN/mである。上記表面張力がこの範囲であることにより、インクジェット法によって好適に塗布することができる。上記表面張力のより好ましい下限は20mN/m、より好ましい上限は30mN/m、更に好ましい下限は22mN/m、更に好ましい上限は28mN/mである。
なお、上記表面張力は、25℃において動的濡れ性試験機によりWilhelmy法によって測定された値を意味する。
なお、上記含浸試験前後におけるEPDMゴムの重量変化率は、具体的には、有機EL表示素子用封止剤を褐色スクリュー管に入れ、重量W1(g)のEPDMゴムを浸漬して蓋をし、25℃で1週間静置した後、EPDMゴムを取り出して表面をウエス等で拭き取り、重量(W2(g))を測定することにより、下記式によって求めることができる。
重量変化率(%)=((W2-W1)/W1)×100
なお、本明細書において上記重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)で測定を行い、ポリスチレン換算により求められる値である。GPCによってポリスチレン換算による重量平均分子量を測定する際のカラムとしては、例えば、Shodex LF-804(昭和電工社製)等が挙げられる。また、GPCで用いる溶媒としては、テトラヒドロフラン等が挙げられる。
上記重合性化合物は、分子内に酸素原子を17%以上含む化合物を、重合性化合物全体100重量部中に10~100重量部含有することが好ましい。
本発明者らは、上述したインクジェット装置のダメージの原因は、装置のヘッド部分等に用いられているゴム材料と封止剤との相溶性が高いことであると考えた。そのため、封止剤に配合する重合性化合物として、溶解度パラメータの値をもとに該ゴム材料との相溶性が低くなると考えられるものを用いることを検討した。しかしながら、溶解度パラメータの値をもとに重合性化合物を選択しても、上記含浸試験前後におけるEPDMゴムの重量変化率を10%以下とすることが難しく、インクジェット装置のダメージを充分に低減できないことがあった。そこで本発明者らは鋭意検討した結果、重合性化合物として上記分子内に酸素原子を17%以上含む化合物を特定の含有量となるように用いることで、容易に上記含浸試験前後におけるEPDMゴムの重量変化率を10%以下とすることができることを見出した。
また、上記重合性化合物全体100重量部中における上記分子内に酸素原子を17%以上含む化合物の含有量のより好ましい下限は20重量部である。
上記(メタ)アクリル化合物は、単官能(メタ)アクリル化合物であってもよいし、多官能(メタ)アクリル化合物であってもよく、上記単官能(メタ)アクリル化合物と上記多官能(メタ)アクリル化合物とを組み合わせて用いてもよい。
なお、本明細書において、上記「(メタ)アクリル」は、アクリル又はメタクリルを意味し、上記「(メタ)アクリル化合物」は、(メタ)アクリロイル基を有する化合物を意味し、上記「(メタ)アクリロイル」は、アクリロイル又はメタクリロイルを意味する。
上記カチオン重合性基としては、例えば、ビニルエーテル基、エポキシ基、オキセタニル基、アリルエーテル基、ビニル基、水酸基等が挙げられる。
なお、本明細書において上記「(メタ)アクリレート」は、アクリレート又はメタクリレートを意味する。
上記ポリオキシアルキレン骨格は、オキシアルキレン単位が2~6個連続したものであることが好ましい。
上記ポリオキシアルキレン骨格を構成するオキシアルキレン単位としては、オキシエチレン単位、オキシプロピレン単位等が挙げられる。
上記脂環式エポキシ樹脂のうち市販されているものとしては、例えば、セロキサイド2000、セロキサイド2021P、セロキサイド2081、セロキサイド3000、セロキサイド8000(いずれもダイセル社製)、サンソサイザーEPS(新日本理化工業社製)等が挙げられる。
上記重合開始剤としては、用いる重合性化合物の種類等に応じて、光ラジカル重合開始剤や、熱ラジカル重合開始剤や、光カチオン重合開始剤や、熱カチオン重合開始剤が好適に用いられる。
上記アゾ化合物としては、例えば、2,2’-アゾビス(2,4-ジメチルバレロニトリル)、アゾビスイソブチロニトリル等が挙げられる。
上記有機過酸化物としては、例えば、過酸化ベンゾイル、ケトンパーオキサイド、パーオキシケタール、ハイドロパーオキサイド、ジアルキルパーオキサイド、パーオキシエステル、ジアシルパーオキサイド、パーオキシジカーボネート等が挙げられる。
上記イオン性光酸発生型の光カチオン重合開始剤としては、例えば、上記アニオン部分を有する、芳香族スルホニウム塩、芳香族ヨードニウム塩、芳香族ジアゾニウム塩、芳香族アンモニウム塩、(2,4-シクロペンタジエン-1-イル)((1-メチルエチル)ベンゼン)-Fe塩等が挙げられる。
上記表面改質剤としては、例えば、界面活性剤やレベリング剤等が挙げられる。
上記表面改質剤のうち市販されているものとしては、例えば、BYK-340、BYK-345(いずれもビックケミー・ジャパン社製)、サーフロンS-611(AGCセイミケミカル社製)等が挙げられる。
上記全光線透過率は、例えば、AUTOMATIC HAZE MATER MODEL TC=III DPK(東京電色社製)等の分光計を用いて測定することができる。
また、上記全光線透過率の測定に用いる硬化物は、光硬化性の封止剤であれば、例えば、封止剤にLEDランプにて波長365nmの紫外線を3000mJ/cm2照射することにより得ることができ、熱硬化性の封止剤であれば、例えば、80℃で1時間加熱することにより得ることができる。
上記紫外線を照射する光源としては、例えば、キセノンランプ、カーボンアークランプ等、従来公知の光源を用いることができる。
また、上記紫外線を100時間照射した後の透過率の測定に用いる硬化物は、光硬化性の封止剤であれば、例えば、封止剤にLEDランプにて波長365nmの紫外線を3000mJ/cm2照射することにより得ることができ、熱硬化性の封止剤であれば、例えば、80℃で1時間加熱することにより得ることができる。
また、上記透湿度の測定に用いる硬化物は、光硬化性の封止剤であれば、例えば、封止剤にLEDランプにて波長365nmの紫外線を3000mJ/cm2照射することにより得ることができ、熱硬化性の封止剤であれば、例えば、80℃で1時間加熱することにより得ることができる。
上記含水率の測定方法としては、例えば、JIS K 7251に準拠してカールフィッシャー法により求める方法や、JIS K 7209-2に準拠して吸水後の重量増分を求める等の方法が挙げられる。
また、上記含水率の測定に用いる硬化物は、光硬化性の封止剤であれば、例えば、封止剤にLEDランプにて波長365nmの紫外線を3000mJ/cm2照射することにより得ることができ、熱硬化性の封止剤であれば、例えば、80℃で1時間加熱することにより得ることができる。
本発明の有機EL表示素子用封止剤を用いて有機EL表示素子を製造する方法としては、例えば、インクジェット法により、本発明の有機EL表示素子用封止剤を基材に塗布する工程と、塗布した有機EL表示素子用封止剤を光照射及び/又は加熱により硬化させる工程とを有する方法等が挙げられる。
これらの光源は、上記光ラジカル重合開始剤や光カチオン重合開始剤の吸収波長に合わせて適宜選択される。
上記無機材料膜を構成する無機材料としては、従来公知のものを用いることができ、例えば、窒化珪素(SiNx)や酸化珪素(SiOx)等が挙げられる。上記無機材料膜は、1層からなるものであってもよく、複数種の層を積層したものであってもよい。また、上記無機材料膜と本発明の有機EL表示素子用封止剤からなる樹脂膜とを、交互に繰り返して上記積層体を被覆してもよい。
本発明の有機EL表示素子用封止剤を塗布する基材(以下、「一方の基材」ともいう)は、有機発光材料層を有する積層体の形成されている基材であってもよく、該積層体の形成されていない基材であってもよい。
上記一方の基材が上記積層体の形成されていない基材である場合、上記他方の基材を貼り合わせた際に、上記積層体を外気から保護できるように上記一方の基材に本発明の有機EL表示素子用封止剤を塗布すればよい。即ち、他方の基材を貼り合わせた際に上記積層体の位置となる場所に全面的に塗布するか、又は、他方の基材を貼り合わせた際に上記積層体の位置となる場所が完全に収まる形状に、閉じたパターンの封止剤部を形成してもよい。
上記有機EL表示素子用封止剤を光照射及び/又は加熱により硬化させる工程を、上記一方の基材と上記他方の基材とを貼り合わせる工程の前に行なう場合、本発明の有機EL表示素子用封止剤は、光照射及び/又は加熱してから硬化反応が進行して接着ができなくなるまでの可使時間が1分以上であることが好ましい。上記可使時間が1分以上であることにより、上記一方の基材と上記他方の基材とを貼り合わせる前に硬化が進行し過ぎることなく、より高い接着強度を得ることができる。
上記減圧雰囲気下の真空度の好ましい下限は0.01kPa、好ましい上限は10kPaである。上記減圧雰囲気下の真空度がこの範囲であることにより、真空装置の気密性や真空ポンプの能力から真空状態を達成するのに長時間を費やすことなく、上記一方の基材と上記他方の基材とを貼り合わせる際の本発明の有機EL表示素子用封止剤中の気泡をより効率的に除去することができる。
表1に記載された配合比に従い、各材料を、ホモディスパー型撹拌混合機(プライミクス社製、「ホモディスパーL型」)を用い、撹拌速度3000rpmで均一に撹拌混合することにより、実施例1~9、比較例1~3の各有機EL表示素子用封止剤を作製した。
実施例及び比較例で得られた各有機EL表示素子用封止剤について、E型粘度計(東機産業社製、「VISCOMETER TV-22」)を用いて、25℃、100rpmの条件において測定した粘度、及び、25℃において動的濡れ性試験機(レスカ社製、「WET-6100型」)により測定した表面張力を表1に示した。
また、実施例及び比較例で得られた各有機EL表示素子用封止剤を褐色スクリュー管に入れ、EPDMゴム10g(W1)を浸漬して蓋をし、25℃で1週間静置した後、EPDMゴムを取り出して表面をウエスで拭き取った後、重量(W2)を測定し、上述した式により含浸試験前後におけるEPDMゴムの重量変化率を算出した。EPDMゴムとしては、AS568-009(森清化工社社製)を用いた。結果を表1に示した。
実施例及び比較例で得られた各有機EL表示素子用封止剤について以下の評価を行った。結果を表1に示した。
なお、インクジェット吐出性、濡れ広がり性、及び、装置ダメージの各評価において、インクジェット用塗布ヘッドとしてはIJH-30(IJT社製)を用い、インクジェット塗布は加熱を行わずに行った(ヘッド温度25℃)。
(1-1)インクジェット吐出性
実施例及び比較例で得られた各有機EL表示素子用封止剤を、インクジェット吐出装置(マイクロジェット社製、「NanoPrinter500」)を用いて、30ピコリットルの液滴量にて、アルカリ洗浄した無アルカリガラス(旭硝子社製、「AN100」)上に塗布した。インクジェットノズルから液滴が正常に吐出されて基板に着弾した場合を「○」、正常に吐出されなかった場合を「×」としてインクジェット吐出性を評価した。
実施例1~9及び比較例3で得られた各有機EL表示素子用封止剤を、インクジェット吐出装置(マイクロジェット社製、「NanoPrinter500」)を用いて、30ピコリットルの液滴量にて、アルカリ洗浄した無アルカリガラス(旭硝子社製、「AN100」)上に、5m/秒の速度にて500μmピッチで1000滴塗布した。塗布から10分後の無アルカリガラス上の液滴の直径を測定し、液滴の直径が150μm以上であった場合を「○」、液滴の直径が50μm以上150μm未満であった場合を「△」、液滴の直径が50μm未満であった場合を「×」として濡れ広がり性を評価した。
実施例1~9及び比較例3で得られた各有機EL表示素子用封止剤の硬化物の加熱時に発生するアウトガスをヘッドスペース法によるガスクロマトグラフ(JEOL社製、「JMS-Q1050GC」)により測定した。各有機EL表示素子用封止剤100mgをアプリケーターにて300μmの厚さに塗工した。次いで、LEDランプにて波長365nmの紫外線を3000mJ/cm2照射して封止剤を硬化した後、ヘッドスペース用バイアルに硬化させた封止剤硬化物を入れてバイアルを封止し、100℃で30分間加熱して、ヘッドスペース法により発生ガスを測定した。
発生したガスが300ppm未満であった場合を「○」、300ppm以上500ppm未満であった場合を「△」、500ppm以上であった場合を「×」として低アウトガス性を評価した。
実施例1~9及び比較例3で得られた各有機EL表示素子用封止剤を、インクジェット吐出装置(マイクロジェット社製、「NanoPrinter500」)を用いて、アルカリ洗浄した無アルカリガラス(旭硝子社製、「AN100」)上に、55Vの電圧で封止剤の製造直後から1か月間毎日100万発を吐出した。1ヶ月後に吐出された封止剤の重量が製造直後に吐出された封止剤の重量の95%以上であった場合を「○」、80%以上95%未満であった場合を「△」、80%未満であった場合を「×」として装置ダメージを評価した。
表2に記載された配合比に従い、各材料を、ホモディスパー型撹拌混合機(プライミクス社製、「ホモディスパーL型」)を用い、撹拌速度3000rpmで均一に撹拌混合した後、50℃、0.1MPaの環境に30分曝す脱水工程を行うことにより、有機EL表示素子用封止剤を作製した。
得られた有機EL表示素子用封止剤について、E型粘度計(東機産業社製、「VISCOMETER TV-22」)を用いて、25℃、100rpmの条件において測定した粘度、及び、25℃において動的濡れ性試験機(レスカ社製、「WET-6100型」)により表面張力を測定した。
また、得られた有機EL表示素子用封止剤を褐色スクリュー管に入れ、EPDMゴム10g(W1)を浸漬して蓋をし、25℃で1週間静置した後、EPDMゴムを取り出して表面をウエスで拭き取った後、重量(W2)を測定し、上述した式により含浸試験前後におけるEPDMゴムの重量変化率を算出した。EPDMゴムとしては、AS568-009(森清化工社社製)を用いた。
得られた有機EL表示素子用封止剤を、インクジェット吐出装置(マイクロジェット社製、「NanoPrinter500」)を用いて、30ピコリットルの液滴量にて、アルカリ洗浄した無アルカリガラス(旭硝子社製、「AN100」)上に塗布した。インクジェットノズルから液滴が正常に吐出されて基板に着弾した場合を「○」、正常に吐出されなかった場合を「×」としてインクジェット吐出性を評価した。なお、インクジェット用塗布ヘッドとしてはIJH-30(IJT社製)を用い、インクジェット塗布は加熱を行わずに行った(ヘッド温度25℃)。
実験例1で作製したものと同じ有機EL表示素子用封止剤を用意した。
インクジェット用塗布ヘッドとしてIJH-30(IJT社製)を用い、加熱しながらインクジェット塗布を行った(ヘッド温度60℃)こと以外は、実験例1と同様にしてインクジェット吐出性を評価した。
Claims (4)
- 重合性化合物と重合開始剤とを含有し、
25℃における粘度が5~50mPa・sであり、25℃における表面張力が15~35mN/mであり、かつ、
封止剤中にエチレン・プロピレン・ジエンゴムを浸漬させたまま25℃で1週間静置する含浸試験を行った際、含浸試験前後におけるエチレン・プロピレン・ジエンゴムの重量変化率が10%以下である
ことを特徴とする有機EL表示素子用封止剤。 - インクジェット法による塗布に用いられる有機EL表示素子用封止剤であって、
重合性化合物と重合開始剤とを含有し、
封止剤中にエチレン・プロピレン・ジエンゴムを浸漬させたまま25℃で1週間静置する含浸試験を行った際、含浸試験前後におけるエチレン・プロピレン・ジエンゴムの重量変化率が10%以下である
ことを特徴とする有機EL表示素子用封止剤。 - 重合性化合物は、分子内に酸素原子を17%以上含む化合物を、重合性化合物全体100重量部中に10~100重量部含有することを特徴とする請求項1又は2記載の有機EL表示素子用封止剤。
- 溶剤を含有しない、又は、溶剤の含有量が0.05重量%以下であることを特徴とする請求項1、2又は3記載の有機EL表示素子用封止剤。
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WO2019188812A1 (ja) * | 2018-03-30 | 2019-10-03 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
WO2019188805A1 (ja) * | 2018-03-30 | 2019-10-03 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
WO2019230697A1 (ja) * | 2018-05-31 | 2019-12-05 | パナソニックIpマネジメント株式会社 | 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004160337A (ja) * | 2002-11-12 | 2004-06-10 | Seiko Epson Corp | 吐出ヘッド、吐出装置、電気光学装置とその製造方法、及び電子機器 |
JP2008231328A (ja) * | 2007-03-22 | 2008-10-02 | Seiko Epson Corp | カラーフィルター用インク、カラーフィルター、画像表示装置、および、電子機器 |
JP2012214628A (ja) * | 2011-03-31 | 2012-11-08 | Brother Industries Ltd | インクジェット記録用水性インク、インクカートリッジ、インクジェット記録方法及びインクジェット記録装置 |
JP2015063574A (ja) * | 2013-09-24 | 2015-04-09 | キヤノン株式会社 | インク及びインクジェット記録方法 |
JP2015524494A (ja) * | 2012-07-19 | 2015-08-24 | ロリク アーゲーRolic Ag | 水捕捉層用放射線硬化性組成物、及びその製造方法 |
JP2016104521A (ja) * | 2014-12-01 | 2016-06-09 | セイコーエプソン株式会社 | インクジェット記録装置、インクジェット記録装置のメンテナンス方法、メンテナンス液、および液体セット |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3817081B2 (ja) | 1999-01-29 | 2006-08-30 | パイオニア株式会社 | 有機el素子の製造方法 |
JP2001307873A (ja) | 2000-04-21 | 2001-11-02 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス表示素子およびその製造方法 |
US8808457B2 (en) | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
JP2004188903A (ja) * | 2002-12-13 | 2004-07-08 | Konica Minolta Holdings Inc | キャッピング部材、クリーニング部材、配管部材、インクタンク部材、およびこれらを備えたuv硬化型インクジェット記録装置 |
JP2008153211A (ja) | 2006-11-22 | 2008-07-03 | Fujifilm Corp | バリア性フィルム基板およびその製造方法 |
JP5040386B2 (ja) * | 2007-03-19 | 2012-10-03 | コニカミノルタエムジー株式会社 | ヘッドメンテナンス装置及びインクジェット記録装置 |
JP5020700B2 (ja) * | 2007-05-11 | 2012-09-05 | キヤノン株式会社 | インクジェット記録用インクタンク |
JP6023439B2 (ja) * | 2012-03-06 | 2016-11-09 | 株式会社ダイセル | 脂環式エポキシ基含有重合体、硬化性樹脂組成物及びその硬化物 |
JP5916220B2 (ja) * | 2012-07-19 | 2016-05-11 | 日本化薬株式会社 | エネルギー線硬化型樹脂組成物及びその硬化物 |
WO2014126034A1 (ja) * | 2013-02-14 | 2014-08-21 | 富士フイルム株式会社 | インクジェット塗布用感光性樹脂組成物、熱処理物及びその製造方法、樹脂パターン製造方法、液晶表示装置、有機el表示装置、タッチパネル及びその製造方法、並びに、タッチパネル表示装置 |
JP6200203B2 (ja) * | 2013-05-16 | 2017-09-20 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法 |
JP2015185220A (ja) * | 2014-03-20 | 2015-10-22 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネセンス表示装置の製造方法及び有機エレクトロルミネセンス表示装置 |
KR20160011310A (ko) * | 2014-07-21 | 2016-02-01 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
JP2017531049A (ja) * | 2014-07-25 | 2017-10-19 | カティーバ, インコーポレイテッド | 有機薄膜インク組成物および方法 |
WO2016048120A1 (ko) * | 2014-09-26 | 2016-03-31 | 주식회사 엘지화학 | 자외선 경화형 잉크 조성물, 이를 이용한 디스플레이 기판의 베젤 패턴의 제조방법 및 이에 의하여 제조된 베젤 패턴 |
US10358565B2 (en) * | 2014-09-26 | 2019-07-23 | Lg Chem, Ltd. | UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby |
-
2017
- 2017-10-18 KR KR1020227022051A patent/KR20220100723A/ko not_active Application Discontinuation
- 2017-10-18 CN CN202310734056.9A patent/CN116782448A/zh active Pending
- 2017-10-18 CN CN201780015173.2A patent/CN108886848A/zh active Pending
- 2017-10-18 WO PCT/JP2017/037662 patent/WO2018074510A1/ja active Application Filing
- 2017-10-18 KR KR1020187025579A patent/KR102416056B1/ko active IP Right Grant
- 2017-10-18 JP JP2017556271A patent/JP6404496B2/ja active Active
- 2017-10-19 TW TW106135822A patent/TWI797092B/zh active
-
2018
- 2018-08-29 JP JP2018160202A patent/JP6985226B2/ja active Active
-
2021
- 2021-11-22 JP JP2021189470A patent/JP7457686B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004160337A (ja) * | 2002-11-12 | 2004-06-10 | Seiko Epson Corp | 吐出ヘッド、吐出装置、電気光学装置とその製造方法、及び電子機器 |
JP2008231328A (ja) * | 2007-03-22 | 2008-10-02 | Seiko Epson Corp | カラーフィルター用インク、カラーフィルター、画像表示装置、および、電子機器 |
JP2012214628A (ja) * | 2011-03-31 | 2012-11-08 | Brother Industries Ltd | インクジェット記録用水性インク、インクカートリッジ、インクジェット記録方法及びインクジェット記録装置 |
JP2015524494A (ja) * | 2012-07-19 | 2015-08-24 | ロリク アーゲーRolic Ag | 水捕捉層用放射線硬化性組成物、及びその製造方法 |
JP2015063574A (ja) * | 2013-09-24 | 2015-04-09 | キヤノン株式会社 | インク及びインクジェット記録方法 |
JP2016104521A (ja) * | 2014-12-01 | 2016-06-09 | セイコーエプソン株式会社 | インクジェット記録装置、インクジェット記録装置のメンテナンス方法、メンテナンス液、および液体セット |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019188812A1 (ja) * | 2018-03-30 | 2019-10-03 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
WO2019188805A1 (ja) * | 2018-03-30 | 2019-10-03 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
JPWO2019188805A1 (ja) * | 2018-03-30 | 2021-02-12 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
JPWO2019188812A1 (ja) * | 2018-03-30 | 2021-02-12 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
JP7474053B2 (ja) | 2018-03-30 | 2024-04-24 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
JP7474052B2 (ja) | 2018-03-30 | 2024-04-24 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
WO2019230697A1 (ja) * | 2018-05-31 | 2019-12-05 | パナソニックIpマネジメント株式会社 | 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置 |
JP2019210449A (ja) * | 2018-05-31 | 2019-12-12 | パナソニックIpマネジメント株式会社 | 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置 |
Also Published As
Publication number | Publication date |
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KR20190064528A (ko) | 2019-06-10 |
KR20220100723A (ko) | 2022-07-15 |
CN108886848A (zh) | 2018-11-23 |
JP2022016567A (ja) | 2022-01-21 |
JP6404496B2 (ja) | 2018-10-10 |
TWI797092B (zh) | 2023-04-01 |
JP6985226B2 (ja) | 2021-12-22 |
KR102416056B1 (ko) | 2022-07-01 |
JP7457686B2 (ja) | 2024-03-28 |
CN116782448A (zh) | 2023-09-19 |
JPWO2018074510A1 (ja) | 2018-10-18 |
TW201819472A (zh) | 2018-06-01 |
JP2018200891A (ja) | 2018-12-20 |
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