WO2018113020A1 - 柔性显示面板的制作方法 - Google Patents

柔性显示面板的制作方法 Download PDF

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Publication number
WO2018113020A1
WO2018113020A1 PCT/CN2016/113057 CN2016113057W WO2018113020A1 WO 2018113020 A1 WO2018113020 A1 WO 2018113020A1 CN 2016113057 W CN2016113057 W CN 2016113057W WO 2018113020 A1 WO2018113020 A1 WO 2018113020A1
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flexible
substrate
flexible display
display panel
rigid substrate
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PCT/CN2016/113057
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English (en)
French (fr)
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秦芳
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武汉华星光电技术有限公司
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Priority to US15/505,099 priority Critical patent/US10581026B2/en
Publication of WO2018113020A1 publication Critical patent/WO2018113020A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a flexible display panel.
  • OLED Organic Light Emitting Display
  • OLED has self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast ratio, near 180° viewing angle, wide temperature range, and flexible display.
  • a large-area full-color display and many other advantages have been recognized by the industry as the most promising display device.
  • OLED can be divided into two types: passive matrix OLED (PMOLED) and active matrix OLED (AMOLED), namely direct addressing and thin film transistor matrix addressing.
  • PMOLED passive matrix OLED
  • AMOLED active matrix OLED
  • the AMOLED has pixels arranged in an array, belongs to an active display type, has high luminous efficiency, and is generally used as a high-definition large-sized display device.
  • the OLED device generally includes a substrate, an anode disposed on the substrate, a hole injection layer disposed on the anode, a hole transport layer disposed on the hole injection layer, and a light-emitting layer disposed on the hole transport layer.
  • the principle of illumination of OLED devices is that semiconductor materials and organic luminescent materials are driven by electric fields, causing luminescence by carrier injection and recombination.
  • an OLED device generally uses an indium tin oxide (ITO) electrode and a metal electrode as anodes and cathodes of the device, respectively.
  • ITO indium tin oxide
  • electrons and holes are injected from the cathode and the anode to the electron transport layer and the hole transport layer, respectively.
  • the electrons and holes migrate to the light-emitting layer through the electron transport layer and the hole transport layer, respectively, and meet in the light-emitting layer to form excitons and excite the light-emitting molecules, and the latter emits visible light through radiation relaxation.
  • the mainstream flexible OLED display panel is manufactured by coating a glass substrate as a carrier, coating a polyimide (PI) film on the entire surface of the glass substrate, curing the PI film, and the PI film acts as a flexible substrate, and then A thin film transistor layer, an OLED device layer, and a thin film encapsulation layer are sequentially formed from the PI film, thereby obtaining a flexible OLED display mother board.
  • the flexible OLED display mother board is fabricated into each flexible OLED display panel by cutting, because the entire surface of the PI film is adhered to the glass substrate. It is not easy to cut by ordinary cutter wheel. When cutting with a common cutter wheel, problems such as low cutting yield and short cycle time of the cutter wheel are easy to occur.
  • the PI film is separated from the glass substrate by a laser lift off (LLO) machine to obtain a flexible OLED display panel.
  • LLO laser lift off
  • An object of the present invention is to provide a method for manufacturing a flexible display panel, which can save the purchase cost of the laser cutting device, thereby reducing the manufacturing cost of the flexible display panel, and improving the cutting yield of the flexible display mother board by using a common cutter wheel, and improving the cutting yield. Cutting the life of the cutter wheel of the flexible display motherboard.
  • the present invention provides a method for fabricating a flexible display panel, comprising the following steps:
  • Step 1 providing a rigid substrate, forming a plurality of grooves arranged at intervals on the rigid substrate;
  • Step 2 forming a plurality of flexible substrates in the plurality of grooves
  • Step 3 forming a display device layer on the rigid substrate and a plurality of flexible substrates to obtain a flexible display mother board;
  • Step 4 cutting the flexible display mother board along the edges of the plurality of grooves to obtain a plurality of flexible substrate units, the flexible substrate unit including a rigid substrate, a flexible substrate and a display arranged in order from bottom to top Device layer
  • Step 5 peeling the flexible substrate in the flexible substrate unit from the rigid substrate to obtain a plurality of flexible display panels, the flexible display panel comprising a flexible substrate and a display device layer disposed on the flexible substrate.
  • the rigid substrate is a glass substrate.
  • a plurality of grooves arranged at intervals are formed on the rigid substrate by physical or chemical methods.
  • the flexible substrate is formed by coating an organic material in the plurality of grooves, and after curing, forming a plurality of flexible substrates.
  • the material of the flexible substrate is polyimide.
  • the upper surface of the flexible substrate is flush with the upper surface of the region on the rigid substrate between the plurality of grooves.
  • the flexible display mother board is cut by a cutter wheel.
  • the display device layer includes an OLED device.
  • the flexible substrate unit is irradiated from the rigid substrate side by using a laser to separate the flexible substrate in the flexible substrate unit from the rigid substrate, thereby peeling the flexible substrate from the rigid substrate.
  • the invention also provides a method for manufacturing a flexible display panel, comprising the following steps:
  • Step 1 providing a rigid substrate, forming a plurality of grooves arranged at intervals on the rigid substrate;
  • Step 2 forming a plurality of flexible substrates in the plurality of grooves
  • Step 3 forming a display device layer on the rigid substrate and a plurality of flexible substrates to obtain a flexible display mother board;
  • Step 4 cutting the flexible display mother board along the edges of the plurality of grooves to obtain a plurality of flexible substrate units, the flexible substrate unit including a rigid substrate, a flexible substrate and a display arranged in order from bottom to top Device layer
  • Step 5 peeling the flexible substrate in the flexible substrate unit from the rigid substrate to obtain a plurality of flexible display panels, the flexible display panel comprising a flexible substrate and a display device layer disposed on the flexible substrate;
  • the rigid substrate is a glass substrate
  • a plurality of grooves arranged at intervals are formed on the rigid substrate by physical or chemical methods.
  • a flexible display panel is provided by forming a flexible substrate on a rigid substrate, forming a flexible substrate in the recess, and fabricating the flexible substrate and the rigid substrate. After the device layer is displayed, a flexible display mother board is obtained, and then the flexible display mother board is cut along the edge of the groove by a common cutter wheel to obtain a flexible substrate unit, and the flexible substrate is obtained by laser stripping to remove the rigid substrate in the flexible substrate unit.
  • the panel saves the purchase cost of the laser cutting device, thereby reducing the manufacturing cost of the flexible display panel, and improving the cutting yield of the flexible display mother board by the common cutter wheel, and improving the cutter wheel for cutting the flexible display mother board.
  • the service life in addition, also reduces the amount of organic materials used to make flexible substrates, further reducing production costs.
  • FIG. 1 is a flow chart of a method of fabricating a flexible display panel of the present invention
  • step 1 is a schematic view of step 1 of a method for fabricating a flexible display panel of the present invention
  • step 2 is a schematic diagram of step 2 of a method for fabricating a flexible display panel of the present invention
  • step 3 is a schematic diagram of step 3 of a method for fabricating a flexible display panel of the present invention.
  • step 4 is a schematic diagram of step 4 of a method for fabricating a flexible display panel of the present invention.
  • FIG. 6 is a schematic diagram of step 5 of the method for fabricating the flexible display panel of the present invention.
  • the present invention provides a method for fabricating a flexible display panel, including the following steps:
  • Step 1 as shown in FIG. 2, a rigid substrate 10 is provided, and a plurality of grooves 11 are formed on the rigid substrate 10.
  • the rigid substrate 10 is a glass substrate.
  • a plurality of grooves 11 are formed on the rigid substrate 10 by physical or chemical methods.
  • Step 2 As shown in FIG. 3, a plurality of flexible substrates 20 are respectively formed in the plurality of grooves 11.
  • the flexible substrate 20 is formed by coating an organic material in the plurality of grooves 11 and solidifying to form a plurality of flexible substrates 20.
  • the material of the flexible substrate 20 is polyimide (PI).
  • the upper surface of the flexible substrate 20 is flush with the upper surface of the region of the rigid substrate 10 between the plurality of grooves 11.
  • Step 3 As shown in FIG. 4, the display device layer 30 is formed on the rigid substrate 10 and the plurality of flexible substrates 20 to obtain a flexible display mother board 40.
  • the display device layer 30 includes an OLED device.
  • Step 4 As shown in FIG. 5, the flexible display mother board 40 is cut along the edges of the plurality of grooves 11 to obtain a plurality of flexible substrate units 50, which are sequentially arranged from bottom to top.
  • the rigid substrate 10, the flexible substrate 20, and the display device layer 30 are provided.
  • the flexible display mother board 40 is cut by a common cutter wheel.
  • step 4 of the present invention since the cutting position of the flexible display mother board 40 does not include the flexible substrate 20, the flexible display mother board 40 needs only to be cut by using a common cutter wheel, so that a high cutting yield can be obtained. At the same time, it can improve the service life of the cutter wheel.
  • Step 5 as shown in FIG. 6, the flexible substrate 20 in the flexible substrate unit 50 is rigid
  • the substrate 10 is peeled off to obtain a plurality of flexible display panels 60 including a flexible substrate 20 and a display device layer 30 disposed on the flexible substrate 20.
  • the flexible substrate unit 50 is irradiated from the rigid substrate 10 side by using a laser, so that the flexible substrate 20 in the flexible substrate unit 50 is separated from the rigid substrate 10, and then the The flexible substrate 20 is peeled off from the rigid substrate 10.
  • the present invention provides a method of fabricating a flexible display panel in which a flexible substrate is formed in a recess by forming a recess on a rigid substrate, and a display device is fabricated on the flexible substrate and the rigid substrate.
  • a flexible display mother board is obtained, and then the flexible display mother board is cut along the edge of the groove by a common cutter wheel to obtain a flexible substrate unit, and the flexible display panel is obtained by removing the rigid substrate in the flexible substrate unit by laser stripping,
  • the method saves the purchase cost of the laser cutting device, thereby reducing the manufacturing cost of the flexible display panel, and improving the cutting yield of the flexible display mother board by the common cutter wheel, and improving the use of the cutter wheel for cutting the flexible display mother board.
  • the lifetime in addition, also reduces the amount of organic material used to make the flexible substrate, further reducing production costs.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供一种柔性显示面板的制作方法，通过在刚性基板（10）上形成凹槽（11），在所述凹槽（11）内形成柔性衬底（20），在所述柔性衬底（20）与刚性基板（10）上制作显示器件层（30）后，得到柔性显示母板（40），之后采用普通刀轮沿凹槽（11）的边缘对柔性显示母板（40）进行切割，得到柔性基板单元（50），通过激光剥离去除柔性基板单元（50）中的刚性基板（10）后即得到柔性显示面板（60）。该方法节省了激光切割设备的购置成本，从而降低了柔性显示面板的制造成本，同时提高了采用普通刀轮切割柔性显示母板的切割良率，提高了切割柔性显示母板的刀轮的使用寿命，另外，还减少了制作柔性衬底的有机材料的使用量，进一步降低生产成本。

Description

柔性显示面板的制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性显示面板的制作方法。
背景技术
有机发光二极管显示装置(Organic Light Emitting Display，OLED)具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，被业界公认为是最有发展潜力的显示装置。
OLED按照驱动方式可以分为无源矩阵型OLED(Passive Matrix OLED，PMOLED)和有源矩阵型OLED(Active Matrix OLED，AMOLED)两大类，即直接寻址和薄膜晶体管矩阵寻址两类。其中，AMOLED具有呈阵列式排布的像素，属于主动显示类型，发光效能高，通常用作高清晰度的大尺寸显示装置。
OLED器件通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层、设于空穴注入层上的空穴传输层、设于空穴传输层上的发光层、设于发光层上的电子传输层、设于电子传输层上的电子注入层、及设于电子注入层上的阴极。OLED器件的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED器件通常采用氧化铟锡(ITO)电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
基于OLED的平板显示及照明领域近年来受到科研和学术界的广泛关注。尤其是最近几年以来，具有广阔前景的柔性OLED显示面板已经崭露头角，成为各大面板厂商竞争的焦点。
目前主流的柔性OLED显示面板的制作方法是：以玻璃基板为载体，在整面玻璃基板上涂布一层聚酰亚胺(PI)膜，对PI膜进行固化，PI膜充当柔性基板，然后从PI膜往上依次制作薄膜晶体管层、OLED器件层和薄膜封装层，如此即制得柔性OLED显示母板。通过切割将柔性OLED显示母板制作成各柔性OLED显示面板，因玻璃基板上附着有整面的PI膜，所 以不容易通过普通刀轮切割实现，使用普通刀轮进行切割时，容易出现切割良率低、刀轮使用周期短等问题，因此需要购买昂贵的激光切割设备对柔性OLED显示母板进行切割，切割完成后通过激光剥离(Laser lift off，LLO)机台将PI膜与玻璃基板分离，即得到柔性OLED显示面板。但是，上述制程中使用的激光切割设备价格昂贵且能量均一性需要进行严格控制，因此增加了制造成本。
发明内容
本发明的目的在于提供一种柔性显示面板的制作方法，能够节省激光切割设备的购置成本，从而降低柔性显示面板的制造成本，同时提高采用普通刀轮切割柔性显示母板的切割良率，提高切割柔性显示母板的刀轮的使用寿命。
为实现上述目的，本发明提供一种柔性显示面板的制作方法，包括如下步骤：
步骤1、提供一刚性基板，在所述刚性基板上形成间隔设置的数个凹槽；
步骤2、在所述数个凹槽中分别形成数个柔性衬底；
步骤3、在所述刚性基板与数个柔性衬底上制作显示器件层，得到柔性显示母板；
步骤4、沿所述数个凹槽的边缘对所述柔性显示母板进行切割，得到数个柔性基板单元，所述柔性基板单元包括从下到上依次设置的刚性基板、柔性衬底及显示器件层；
步骤5、将所述柔性基板单元中的柔性衬底从刚性基板上剥离，得到数个柔性显示面板，所述柔性显示面板包括柔性衬底及设于所述柔性衬底上的显示器件层。
所述刚性基板为玻璃基板。
所述步骤1中，采用物理或者化学的方法在所述刚性基板上形成间隔设置的数个凹槽。
所述步骤2中，所述柔性衬底的制作方法为：在所述数个凹槽中分别涂布有机材料，固化后，形成数个柔性衬底。
所述柔性衬底的材料为聚酰亚胺。
所述步骤2中，所述柔性衬底的上表面与所述刚性基板上位于数个凹槽之间的区域的上表面齐平。
所述步骤4中，采用刀轮对所述柔性显示母板进行切割。
所述显示器件层包括OLED器件。
所述步骤5中，采用激光从刚性基板一侧对所述柔性基板单元进行照射，使所述柔性基板单元中的柔性衬底与刚性基板分离，进而将所述柔性衬底从刚性基板上剥离。
本发明还提供一种柔性显示面板的制作方法，包括如下步骤：
步骤1、提供一刚性基板，在所述刚性基板上形成间隔设置的数个凹槽；
步骤2、在所述数个凹槽中分别形成数个柔性衬底；
步骤3、在所述刚性基板与数个柔性衬底上制作显示器件层，得到柔性显示母板；
步骤4、沿所述数个凹槽的边缘对所述柔性显示母板进行切割，得到数个柔性基板单元，所述柔性基板单元包括从下到上依次设置的刚性基板、柔性衬底及显示器件层；
步骤5、将所述柔性基板单元中的柔性衬底从刚性基板上剥离，得到数个柔性显示面板，所述柔性显示面板包括柔性衬底及设于所述柔性衬底上的显示器件层；
其中，所述刚性基板为玻璃基板；
其中，所述步骤1中，采用物理或者化学的方法在所述刚性基板上形成间隔设置的数个凹槽。
本发明的有益效果：本发明提供的一种柔性显示面板的制作方法，通过在刚性基板上形成凹槽，在所述凹槽内形成柔性衬底，在所述柔性衬底与刚性基板上制作显示器件层后，得到柔性显示母板，之后采用普通刀轮沿凹槽的边缘对柔性显示母板进行切割，得到柔性基板单元，通过激光剥离去除柔性基板单元中的刚性基板后即得到柔性显示面板，该方法节省了激光切割设备的购置成本，从而降低了柔性显示面板的制造成本，同时提高了采用普通刀轮切割柔性显示母板的切割良率，提高了切割柔性显示母板的刀轮的使用寿命，另外，还减少了制作柔性衬底的有机材料的使用量，进一步降低生产成本。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为本发明的柔性显示面板的制作方法的流程图；
图2为本发明的柔性显示面板的制作方法的步骤1的示意图；
图3为本发明的柔性显示面板的制作方法的步骤2的示意图；
图4为本发明的柔性显示面板的制作方法的步骤3的示意图；
图5为本发明的柔性显示面板的制作方法的步骤4的示意图；
图6为本发明的柔性显示面板的制作方法的步骤5的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1，本发明提供一种柔性显示面板的制作方法，包括如下步骤：
步骤1、如图2所示，提供一刚性基板10，在所述刚性基板10上形成间隔设置的数个凹槽11。
具体的，所述刚性基板10为玻璃基板。
具体的，所述步骤1中，采用物理或者化学的方法在所述刚性基板10上形成间隔设置的数个凹槽11。
步骤2、如图3所示，在所述数个凹槽11中分别形成数个柔性衬底20。
具体的，所述步骤2中，所述柔性衬底20的制作方法为：在所述数个凹槽11中分别涂布有机材料，固化后，形成数个柔性衬底20。
优选的，所述柔性衬底20的材料为聚酰亚胺(PI)。
优选的，所述柔性衬底20的上表面与所述刚性基板10上位于数个凹槽11之间的区域的上表面齐平。
步骤3、如图4所示，在所述刚性基板10与数个柔性衬底20上制作显示器件层30，得到柔性显示母板40。
具体的，所述显示器件层30包括OLED器件。
步骤4、如图5所示，沿所述数个凹槽11的边缘对所述柔性显示母板40进行切割，得到数个柔性基板单元50，所述柔性基板单元50包括从下到上依次设置的刚性基板10、柔性衬底20及显示器件层30。
具体的，所述步骤4中，采用普通刀轮对所述柔性显示母板40进行切割。
具体的，本发明步骤4中，由于柔性显示母板40的切割位置不包含柔性衬底20，因此只需要采用普通刀轮对柔性显示母板40进行切割，即可获得较高的切割良率，同时能够提高刀轮的使用寿命。
步骤5、如图6所示，将所述柔性基板单元50中的柔性衬底20从刚性 基板10上剥离，得到数个柔性显示面板60，所述柔性显示面板60包括柔性衬底20及设于所述柔性衬底20上的显示器件层30。
具体的，所述步骤5中，采用激光从刚性基板10一侧对所述柔性基板单元50进行照射，使所述柔性基板单元50中的柔性衬底20与刚性基板10分离，进而将所述柔性衬底20从刚性基板10上剥离。
综上所述，本发明提供一种柔性显示面板的制作方法，通过在刚性基板上形成凹槽，在所述凹槽内形成柔性衬底，在所述柔性衬底与刚性基板上制作显示器件层后，得到柔性显示母板，之后采用普通刀轮沿凹槽的边缘对柔性显示母板进行切割，得到柔性基板单元，通过激光剥离去除柔性基板单元中的刚性基板后即得到柔性显示面板，该方法节省了激光切割设备的购置成本，从而降低了柔性显示面板的制造成本，同时提高了采用普通刀轮切割柔性显示母板的切割良率，提高了切割柔性显示母板的刀轮的使用寿命，另外，还减少了制作柔性衬底的有机材料的使用量，进一步降低生产成本。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (16)

  1. 一种柔性显示面板的制作方法，包括如下步骤：
    步骤1、提供一刚性基板，在所述刚性基板上形成间隔设置的数个凹槽；
    步骤2、在所述数个凹槽中分别形成数个柔性衬底；
    步骤3、在所述刚性基板与数个柔性衬底上制作显示器件层，得到柔性显示母板；
    步骤4、沿所述数个凹槽的边缘对所述柔性显示母板进行切割，得到数个柔性基板单元，所述柔性基板单元包括从下到上依次设置的刚性基板、柔性衬底及显示器件层；
    步骤5、将所述柔性基板单元中的柔性衬底从刚性基板上剥离，得到数个柔性显示面板，所述柔性显示面板包括柔性衬底及设于所述柔性衬底上的显示器件层。
  2. 如权利要求1所述的柔性显示面板的制作方法，其中，所述刚性基板为玻璃基板。
  3. 如权利要求1所述的柔性显示面板的制作方法，其中，所述步骤1中，采用物理或者化学的方法在所述刚性基板上形成间隔设置的数个凹槽。
  4. 如权利要求1所述的柔性显示面板的制作方法，其中，所述步骤2中，所述柔性衬底的制作方法为：在所述数个凹槽中分别涂布有机材料，固化后，形成数个柔性衬底。
  5. 如权利要求1所述的柔性显示面板的制作方法，其中，所述柔性衬底的材料为聚酰亚胺。
  6. 如权利要求1所述的柔性显示面板的制作方法，其中，所述步骤2中，所述柔性衬底的上表面与所述刚性基板上位于数个凹槽之间的区域的上表面齐平。
  7. 如权利要求1所述的柔性显示面板的制作方法，其中，所述步骤4中，采用刀轮对所述柔性显示母板进行切割。
  8. 如权利要求1所述的柔性显示面板的制作方法，其中，所述显示器件层包括OLED器件。
  9. 如权利要求1所述的柔性显示面板的制作方法，其中，所述步骤5中，采用激光从刚性基板一侧对所述柔性基板单元进行照射，使所述柔性基板单元中的柔性衬底与刚性基板分离，进而将所述柔性衬底从刚性基板上剥离。
  10. 一种柔性显示面板的制作方法，包括如下步骤：
    步骤1、提供一刚性基板，在所述刚性基板上形成间隔设置的数个凹槽；
    步骤2、在所述数个凹槽中分别形成数个柔性衬底；
    步骤3、在所述刚性基板与数个柔性衬底上制作显示器件层，得到柔性显示母板；
    步骤4、沿所述数个凹槽的边缘对所述柔性显示母板进行切割，得到数个柔性基板单元，所述柔性基板单元包括从下到上依次设置的刚性基板、柔性衬底及显示器件层；
    步骤5、将所述柔性基板单元中的柔性衬底从刚性基板上剥离，得到数个柔性显示面板，所述柔性显示面板包括柔性衬底及设于所述柔性衬底上的显示器件层；
    其中，所述刚性基板为玻璃基板；
    其中，所述步骤1中，采用物理或者化学的方法在所述刚性基板上形成间隔设置的数个凹槽。
  11. 如权利要求10所述的柔性显示面板的制作方法，其中，所述步骤2中，所述柔性衬底的制作方法为：在所述数个凹槽中分别涂布有机材料，固化后，形成数个柔性衬底。
  12. 如权利要求10所述的柔性显示面板的制作方法，其中，所述柔性衬底的材料为聚酰亚胺。
  13. 如权利要求10所述的柔性显示面板的制作方法，其中，所述步骤2中，所述柔性衬底的上表面与所述刚性基板上位于数个凹槽之间的区域的上表面齐平。
  14. 如权利要求10所述的柔性显示面板的制作方法，其中，所述步骤4中，采用刀轮对所述柔性显示母板进行切割。
  15. 如权利要求10所述的柔性显示面板的制作方法，其中，所述显示器件层包括OLED器件。
  16. 如权利要求10所述的柔性显示面板的制作方法，其中，所述步骤5中，采用激光从刚性基板一侧对所述柔性基板单元进行照射，使所述柔性基板单元中的柔性衬底与刚性基板分离，进而将所述柔性衬底从刚性基板上剥离。
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