WO2017152567A1 - Sonde d'oscilloscope, procédé, appareil et système pour tester une ondulation - Google Patents

Sonde d'oscilloscope, procédé, appareil et système pour tester une ondulation Download PDF

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Publication number
WO2017152567A1
WO2017152567A1 PCT/CN2016/091527 CN2016091527W WO2017152567A1 WO 2017152567 A1 WO2017152567 A1 WO 2017152567A1 CN 2016091527 W CN2016091527 W CN 2016091527W WO 2017152567 A1 WO2017152567 A1 WO 2017152567A1
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WO
WIPO (PCT)
Prior art keywords
probe
oscilloscope
double
grounding
spring
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Application number
PCT/CN2016/091527
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English (en)
Chinese (zh)
Inventor
李为龙
孙凤艳
Original Assignee
中兴通讯股份有限公司
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Publication of WO2017152567A1 publication Critical patent/WO2017152567A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R13/00—Arrangements for displaying electric variables or waveforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06788—Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments

Definitions

  • the present invention relates to the field of communications, and in particular to an oscilloscope probe, method, apparatus and system for testing ripple.
  • Ripple is a clutter signal containing periodic and random components attached to a DC level, and refers to the peak value of the AC voltage in the output voltage at rated output voltage and current. Excessive power ripple causes the electronics and system to be unstable.
  • Power ripple testing is usually done using an oscilloscope plus a voltage probe.
  • 1 is a schematic diagram of a power supply ripple test in the related art. As shown in FIG. 1, the positive end of the voltage probe receives a voltage test point, and the ground end of the voltage probe receives a reference ground of the voltage.
  • the power signal collected by the voltage probe is amplified by the back end of the oscilloscope, sampled by the ADC, and digitally processed, and displayed on the screen of the oscilloscope.
  • the peak value of the voltage measured is the ripple of the power supply to be tested.
  • a self-made short-needle pin is generally used to reduce the test loop.
  • the patent document with the application number 201320856284.5 provides a fixed ground pin method, which can select the ground clamp corresponding to the spacing according to the test device of different packages, but the method has two disadvantages: one is that the clamp is too Complex, need a variety of configurations; Second, it is no longer suitable for devices with tiny packages, such as 0402 package capacitors, the package size is 1mm*0.5mm, and the probe radius is 3mm. This can't be done with this fixture. Item test, operability is not strong.
  • 201310097255.X using two self-made collars, using a lateral test, placing the probe on the oblique side to touch the test device, but the test spacing used is too large, and the lateral test When it blocks the tester's line of sight, it is not conducive to actual operation.
  • the embodiment of the invention provides an oscilloscope probe, method, device and system for testing ripple, so as to at least solve the problem that the small package device is difficult to test in the ripple test in the related art.
  • an oscilloscope probe for testing ripple includes: a first connector connected to an oscilloscope, a signal probe and a ground probe, and the signal probe is connected to the first connector through a cable
  • the grounding probe comprises a sleeve, a double-ended spring and a grounding tip; wherein the grounding probe and the signal probe are connected by the second connecting member; the double-end spring is located in the sleeve, and the first end of the double-ended spring is in contact with the grounding tip, the double end The second end of the spring is fixed to the second connecting member.
  • the ground probe is an L-shaped component.
  • the grounding probe and the signal probe are fixedly connected by the second connecting member.
  • the second connector comprises a card holder and a groove; the grounding probe is connected to the card holder through the groove, and the grounding probe is fixed on the signal probe through the card holder.
  • the groove comprises at least one of the following: a wedge hole, a square hole.
  • the grounding tip has a sharp angle of 30 degrees and a bottom diameter of 2.5 millimeters.
  • the double ended spring comprises a horizontal partial spring and a vertical partial spring, wherein the horizontal partial spring is arranged to adjust the test spacing of the test ripple; the vertical partial spring is arranged to ensure stable contact of the oscilloscope probe with the test point.
  • a system for testing ripple comprising: an oscilloscope and the oscilloscope probe described above; the oscilloscope is configured to be connected to the oscilloscope probe to display the ripple detected by the oscilloscope probe.
  • a method for testing ripple comprising: touching a ground probe in an oscilloscope probe to a ground end of a device to be tested, wherein the signal probe in the oscilloscope probe is at a double-ended spring Directly contacting the positive electrode of the device to be tested under elasticity; wherein the grounding probe comprises a sleeve, the double-ended spring and a grounding tip; wherein the grounding probe is connected to the signal probe through a second connecting member
  • the double-ended spring is located in the sleeve, the first end of the double-ended spring is in contact with the grounding tip, and the second end of the double-ended spring is fixed on the second connecting member.
  • the double-ended spring comprises a horizontal partial spring and a vertical partial spring, wherein the horizontal partial spring is arranged to adjust a test pitch of the test ripple; the vertical partial spring is arranged to ensure the oscilloscope probe and the test point Stable contact.
  • the grounding probe is fixedly connected to the signal probe through the second connecting member.
  • the second connector comprises a card holder and a groove; the grounding probe is connected to the card holder through the groove, and the grounding probe is fixed on the signal probe by the card holder.
  • an apparatus for testing ripple comprising: a first contact module configured to point a ground probe in an oscilloscope probe to a ground end of a device to be tested; and a second contact module, set In order to vertically contact the signal probe in the oscilloscope probe to the positive pole of the device to be tested under the elasticity of the double-ended spring; wherein the ground probe comprises a sleeve, the double-ended spring and the grounding tip; wherein The grounding probe is coupled to the signal probe via a second connector; the double-ended spring is located within the sleeve, the first end of the double-ended spring is in contact with the grounding tip, the double-ended spring The second end is fixed to the second connecting member.
  • a computer storage medium is further provided, and the computer storage medium may store an execution instruction for performing the method of testing the ripple in the above embodiment.
  • An embodiment of the present invention provides an oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip. Due to the elastic expansion and contraction characteristics of the double-ended spring, the grounding is The flexible placement and stable grounding feature make it more suitable for testing small and medium-sized packaged devices, thus solving the problem that the small package devices are difficult to test in the ripple test in the related art, thereby improving the quality and efficiency of the ripple test.
  • FIG. 1 is a schematic diagram of a power supply ripple test in the related art
  • FIG. 2 is a structural diagram of an oscilloscope probe for testing ripple according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of connection of a signal probe 24 and a first connector 22 in an oscilloscope probe according to an embodiment of the invention
  • FIG. 4 is a structural relationship diagram of a second connecting member 210 and a grounding probe 26 in an oscilloscope probe according to an embodiment of the present invention
  • FIG. 5 is a schematic diagram showing a state of an oscilloscope probe when testing ripple according to an embodiment of the present invention
  • FIG. 6 is a structural block diagram of a system for testing ripple according to an embodiment of the present invention.
  • FIG. 7 is a flow chart of a method of testing ripple according to an embodiment of the present invention.
  • FIG. 8 is a block diagram showing the structure of an apparatus for testing ripple according to an embodiment of the present invention.
  • FIG. 2 is a structural diagram of an oscilloscope probe for testing ripple according to an embodiment of the present invention.
  • the oscilloscope probe includes: The first connector 22, the signal probe 24 and the ground probe 26 are connected.
  • 3 is a schematic diagram showing the connection of the signal probe 24 and the first connector 22 in the oscilloscope probe according to an embodiment of the present invention. As shown in FIG.
  • the signal probe 24 is connected to the first connector 22 through a cable 28, and the grounding probe 26 includes a sleeve 262, a double-ended spring 264 and a grounding tip 266; wherein the grounding probe 26 is coupled to the signal probe 24 via the second connector 210; the double-ended spring 264 is located within the sleeve 262, the first end of the double-ended spring 264 is grounded The tip 266 is in contact with the second end of the double end spring 264 being secured to the second connector 210.
  • the grounding probe 26 may be an L-shaped component, but is not limited thereto, such as a circular arc type component.
  • the grounding probe 26 and the signal probe 24 are fixedly connected by the second connecting member 210.
  • 4 is a structural relationship diagram of a second connecting member 210 and a grounding probe 26 in an oscilloscope probe according to an embodiment of the present invention.
  • the second connecting member 210 includes a card holder 2102 and a recess 2104; and the grounding probe 26
  • the groove 2104 includes at least one of the following: a wedge-shaped hole and a square hole; the grounding tip has a sharp angle of 30 degrees and a bottom diameter of 2.5 mm; as shown in FIG. 2, the grounding probe 26 is connected to the card holder 2102. It is fixed to the signal probe 24 by the card holder 2102.
  • the double ended spring 264 includes a horizontal portion spring and a vertical portion spring, wherein the horizontal portion spring is configured to adjust the test pitch of the test ripple; the vertical portion spring is configured to ensure stable contact of the oscilloscope probe with the test point.
  • Double end spring The specific structure of 264 can be seen in Figures 2 and 4.
  • the signal probe 24 includes a ground ring surface 242 and a positive electrode 244 of the probe; wherein the ground ring surface 242 is disposed to be connected to the grounding probe 26; the positive electrode 244 of the oscilloscope probe is set to the signal to be tested. .
  • An oscilloscope probe including the first connector 22, the signal probe 24, and the grounding probe 26 including the sleeve 262, the double-ended spring 264, and the grounding tip 266 provided by the above embodiment is characterized by the elastic expansion and contraction of the double-ended spring 264. Therefore, the grounding has the characteristics of flexible positioning and stable fixing, and since the grounding probe 26 is longer than the positive electrode 244 of the oscilloscope probe, thereby avoiding short circuit caused by malfunction during the test, for the small-package device of the single board
  • the ripple test is especially effective, and is more suitable for testing small and medium-sized package devices, thereby solving the problem that the small package device is difficult to test in the ripple test in the related art, thereby improving the quality and efficiency of the ripple test.
  • the tip assembly is a consumable item, the card holder is generally not easily damaged.
  • the needle tip assembly including the grounding tip 266) is damaged, only the replacement is required, and thus the embodiment is adopted.
  • the structure of the grounding probe 26 has the characteristics of convenient replacement.
  • FIG. 5 is a diagram showing a state of an oscilloscope probe when testing ripple according to an embodiment of the present invention.
  • FIG. 6 is a structural block diagram of a system for testing ripple according to an embodiment of the present invention. As shown in FIG. 6, the system includes an oscilloscope 62 and an oscilloscope probe 64.
  • the oscilloscope 62 is coupled to the oscilloscope probe 64 described above and is configured to display the ripple detected by the oscilloscope probe 64.
  • the oscilloscope probe 64 is the oscilloscope probe shown in FIG. 2 in the above embodiment.
  • the main structure of the oscilloscope probe reference may be made to the description of FIG. 2 to FIG. 5 in the foregoing embodiment, and details are not described herein again.
  • an oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip is used to test the ripple. Due to the elastic expansion of the double-ended spring, the grounding is It has the characteristics of flexible placement and stable grounding. It is more suitable for testing small and medium-sized packaged devices, thus solving the problem that the small package devices are not easy to test in the ripple test in the related art, thereby improving the quality and efficiency of the ripple test. .
  • FIG. 7 is a flowchart of a method for testing ripple according to an embodiment of the present invention. As shown in FIG. 7, the flow includes the following steps:
  • Step S702 touching the grounding probe in the oscilloscope probe to the ground end of the device to be tested;
  • Step S704 the signal probe in the oscilloscope probe is vertically contacted with the positive electrode of the device to be tested under the elastic action of the double-ended spring.
  • the oscilloscope probe used in this embodiment is the embodiment shown in FIG. 2-5 of the foregoing embodiment. Specifically, the structure of the oscilloscope probe is described in detail in FIG. 2-5 in the foregoing embodiment. , will not repeat them here.
  • an oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip is used to test the ripple. Due to the elastic expansion and contraction characteristics of the double-ended spring, the grounding is It has the characteristics of flexible placement and stable grounding, and is more suitable for testing small and medium-sized packaged devices, thus solving related technologies. In the ripple test, the small package device is difficult to test, which improves the quality and efficiency of the ripple test.
  • the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, by hardware, but in many cases, the former is A better implementation.
  • the technical solution of the present invention in essence or the contribution to the related art can be embodied in the form of a software product stored in a storage medium (such as ROM/RAM, disk, CD-ROM).
  • the instructions include a number of instructions for causing a terminal device (which may be a cell phone, computer, server, or network device, etc.) to perform the methods described in various embodiments of the present invention.
  • FIG. 8 is a structural block diagram of an apparatus for testing ripple according to an embodiment of the present invention. As shown in FIG. 8, the device includes:
  • the first contact module 82 is configured to point the ground probe in the oscilloscope probe to the ground end of the device to be tested;
  • the second contact module 84 is connected to the first contact module 82 and configured to vertically contact the signal probe of the oscilloscope probe to the positive electrode of the device to be tested under the elastic action of the double-ended spring.
  • the oscilloscope probe used in this embodiment is the embodiment shown in FIG. 2-5 of the foregoing embodiment. Specifically, the structure of the oscilloscope probe is described in detail in FIG. 2-5 in the foregoing embodiment. , will not repeat them here.
  • the apparatus tests the ripple by an oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip, which is characterized by the elastic expansion of the double-ended spring.
  • the grounding has the characteristics of flexible placement and stable grounding, and is more suitable for testing small and medium-sized packaged devices, thereby solving the problem that the small-package devices in the ripple test in the related art are difficult to test, thereby improving the quality of the ripple test. And efficiency.
  • each of the above modules may be implemented by software or hardware.
  • the foregoing may be implemented by, but not limited to, the foregoing modules are all located in the same processor; or, the modules are located in multiple In the processor.
  • An alternative embodiment of the present invention provides an optional oscilloscope probe, as shown in FIG. 2-5.
  • the general passive voltage probe includes a probe and a long ground clip with an alligator clip.
  • the probe (corresponding to the first connector and the signal probe in the above embodiment) is a coaxial cable (cable 28) connected to the BCN connector (the first connector 22) at one end, and is set to The test channel of the oscilloscope is connected, and the other end is the probe (signal probe 24), which is the test front end and is set as the spot measurement signal, including: the ground ring surface of the probe front end (ground ring surface 242), which is set as the grounding pin; the positive electrode of the probe (positive 244 of the oscilloscope probe), set to point the signal to be tested.
  • the grounding device in the alternative embodiment is divided into two parts, a card holder 2102 and a probe (grounding probe 26).
  • the picture on the left is the card holder. It has two functions. One is to fix the probe on the right side into the card holder 2102 through the “wedge” hole (groove 2104). When the other one acts, the entire grounding device is inserted into the probe. .
  • the right probe is similar to an L-shaped assembly.
  • the main structure of the assembly is a sleeve 262 of an internal double-ended spring 264.
  • the tip (ground tip 266) is loaded into the sleeve 262 prior to installation. Inside, the double-ended spring is inserted into the sleeve 262, one end of which is held against the tip of the needle, and the other end is fixed by a "wedge".
  • the tip size is 30 degrees for the sharp corner and 2.5 mm for the bottom.
  • the needle tip assembly is a consumable item, and the card holder is generally not easily damaged, and the discrete structure has the advantages of convenient replacement.
  • grounding device specifically, push the probe assembly (grounding probe 26) into the card holder 2102 to form a complete probe grounding device.
  • Embodiments of the present invention also provide a storage medium.
  • the foregoing storage medium may be configured to store program code for performing the following steps:
  • the signal probe in the oscilloscope probe is vertically contacted to the anode of the device to be tested under the elastic action of the double-ended spring.
  • the oscilloscope probe used in this embodiment is the embodiment shown in FIG. 2-5 of the foregoing embodiment. Specifically, the structure of the oscilloscope probe is described in detail in FIG. 2-5 in the foregoing embodiment. , will not repeat them here.
  • the foregoing storage medium may include, but not limited to, a USB flash drive, a Read-Only Memory (ROM), a Random Access Memory (RAM), a mobile hard disk, and a magnetic memory.
  • ROM Read-Only Memory
  • RAM Random Access Memory
  • a mobile hard disk e.g., a hard disk
  • magnetic memory e.g., a hard disk
  • modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices.
  • they may be implemented by program code executable by a computing device such that they may be stored in a storage device by a computing device and, in some cases, may be executed in a different order than herein.
  • the steps shown or described are either made separately into individual integrated circuit modules, or a plurality of modules or steps are fabricated as a single integrated circuit module.
  • the invention is not limited to any specific combination of hardware and software.
  • An oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip is provided in an embodiment of the present invention, and the grounding is both due to the elastic expansion and contraction characteristics of the double-ended spring.
  • the flexible placement and stable grounding feature make it more suitable for testing small and medium-sized packaged devices, thus solving the problem that the small package devices are difficult to test in the ripple test in the related art, thereby improving the quality and efficiency of the ripple test.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'invention concerne une sonde d'oscilloscope, un procédé, un appareil et un système pour tester une ondulation. La sonde d'oscilloscope comprend un premier connecteur (22) connecté à un oscilloscope et une sonde de signal (24) et une sonde de masse (26), la sonde de signal (24) étant connectée au premier connecteur (22) par l'intermédiaire d'un câble (28); et la sonde de masse (26) comprenant un manchon (262), un ressort à double extrémité (264) et une pointe d'aiguille de masse (266). La sonde de masse (26) est connectée à la sonde de signal (24) par le biais d'un deuxième connecteur (210), le ressort à double extrémité (264) étant situé à l'intérieur du manchon (262); une première extrémité du ressort à double extrémité (264) étant en contact avec la pointe d'aiguille de masse (266); et une deuxième extrémité du ressort à double extrémité (264) étant fixée sur le deuxième collecteur (210). La sonde d'oscilloscope résout le problème de la technique apparentée associé à la difficulté de tester un petit dispositif emballé dans un test d'ondulation, et améliore ainsi la qualité et l'efficacité du test d'ondulation.
PCT/CN2016/091527 2016-03-09 2016-07-25 Sonde d'oscilloscope, procédé, appareil et système pour tester une ondulation WO2017152567A1 (fr)

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CN201610134205.8 2016-03-09
CN201610134205.8A CN107179428A (zh) 2016-03-09 2016-03-09 测试纹波的示波器探头、方法、装置及***

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Cited By (2)

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CN108828337A (zh) * 2018-06-16 2018-11-16 桂林电子科技大学 纹波噪声测试装置
CN109521232A (zh) * 2018-11-20 2019-03-26 闻泰通讯股份有限公司 示波器探头辅助测试装置

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CN110632403A (zh) * 2019-08-27 2019-12-31 深圳市菲菱科思通信技术股份有限公司 自动化测试电源纹波噪声的方法
CN112230026B (zh) * 2020-11-09 2023-05-02 中国电子科技集团公司第二十九研究所 一种用于微***局部性能检测的微波探头
CN113092895A (zh) * 2021-03-11 2021-07-09 新华三信息安全技术有限公司 一种自动测试方法及自动测试设备

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CN201464497U (zh) * 2009-03-23 2010-05-12 英业达科技有限公司 测量制具
CN203705493U (zh) * 2013-12-23 2014-07-09 宇龙计算机通信科技(深圳)有限公司 一种测试纹波的示波器探头
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EP0232614A1 (fr) * 1985-12-30 1987-08-19 Tektronix, Inc. Sonde électronique
US6831452B2 (en) * 2002-04-16 2004-12-14 Agilent Technologies, Inc. Systems and methods for wideband single-end probing of variabily spaced probe points
US7161365B2 (en) * 2004-11-04 2007-01-09 Infineon Technologies Ag Apparatus and method for making ground connection
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CN108828337A (zh) * 2018-06-16 2018-11-16 桂林电子科技大学 纹波噪声测试装置
CN109521232A (zh) * 2018-11-20 2019-03-26 闻泰通讯股份有限公司 示波器探头辅助测试装置
CN109521232B (zh) * 2018-11-20 2023-09-19 闻泰通讯股份有限公司 示波器探头辅助测试装置

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