WO2017152567A1 - 测试纹波的示波器探头、方法、装置及*** - Google Patents

测试纹波的示波器探头、方法、装置及*** Download PDF

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Publication number
WO2017152567A1
WO2017152567A1 PCT/CN2016/091527 CN2016091527W WO2017152567A1 WO 2017152567 A1 WO2017152567 A1 WO 2017152567A1 CN 2016091527 W CN2016091527 W CN 2016091527W WO 2017152567 A1 WO2017152567 A1 WO 2017152567A1
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Prior art keywords
probe
oscilloscope
double
grounding
spring
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PCT/CN2016/091527
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English (en)
French (fr)
Inventor
李为龙
孙凤艳
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中兴通讯股份有限公司
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Publication of WO2017152567A1 publication Critical patent/WO2017152567A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R13/00—Arrangements for displaying electric variables or waveforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06788—Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments

Definitions

  • the present invention relates to the field of communications, and in particular to an oscilloscope probe, method, apparatus and system for testing ripple.
  • Ripple is a clutter signal containing periodic and random components attached to a DC level, and refers to the peak value of the AC voltage in the output voltage at rated output voltage and current. Excessive power ripple causes the electronics and system to be unstable.
  • Power ripple testing is usually done using an oscilloscope plus a voltage probe.
  • 1 is a schematic diagram of a power supply ripple test in the related art. As shown in FIG. 1, the positive end of the voltage probe receives a voltage test point, and the ground end of the voltage probe receives a reference ground of the voltage.
  • the power signal collected by the voltage probe is amplified by the back end of the oscilloscope, sampled by the ADC, and digitally processed, and displayed on the screen of the oscilloscope.
  • the peak value of the voltage measured is the ripple of the power supply to be tested.
  • a self-made short-needle pin is generally used to reduce the test loop.
  • the patent document with the application number 201320856284.5 provides a fixed ground pin method, which can select the ground clamp corresponding to the spacing according to the test device of different packages, but the method has two disadvantages: one is that the clamp is too Complex, need a variety of configurations; Second, it is no longer suitable for devices with tiny packages, such as 0402 package capacitors, the package size is 1mm*0.5mm, and the probe radius is 3mm. This can't be done with this fixture. Item test, operability is not strong.
  • 201310097255.X using two self-made collars, using a lateral test, placing the probe on the oblique side to touch the test device, but the test spacing used is too large, and the lateral test When it blocks the tester's line of sight, it is not conducive to actual operation.
  • the embodiment of the invention provides an oscilloscope probe, method, device and system for testing ripple, so as to at least solve the problem that the small package device is difficult to test in the ripple test in the related art.
  • an oscilloscope probe for testing ripple includes: a first connector connected to an oscilloscope, a signal probe and a ground probe, and the signal probe is connected to the first connector through a cable
  • the grounding probe comprises a sleeve, a double-ended spring and a grounding tip; wherein the grounding probe and the signal probe are connected by the second connecting member; the double-end spring is located in the sleeve, and the first end of the double-ended spring is in contact with the grounding tip, the double end The second end of the spring is fixed to the second connecting member.
  • the ground probe is an L-shaped component.
  • the grounding probe and the signal probe are fixedly connected by the second connecting member.
  • the second connector comprises a card holder and a groove; the grounding probe is connected to the card holder through the groove, and the grounding probe is fixed on the signal probe through the card holder.
  • the groove comprises at least one of the following: a wedge hole, a square hole.
  • the grounding tip has a sharp angle of 30 degrees and a bottom diameter of 2.5 millimeters.
  • the double ended spring comprises a horizontal partial spring and a vertical partial spring, wherein the horizontal partial spring is arranged to adjust the test spacing of the test ripple; the vertical partial spring is arranged to ensure stable contact of the oscilloscope probe with the test point.
  • a system for testing ripple comprising: an oscilloscope and the oscilloscope probe described above; the oscilloscope is configured to be connected to the oscilloscope probe to display the ripple detected by the oscilloscope probe.
  • a method for testing ripple comprising: touching a ground probe in an oscilloscope probe to a ground end of a device to be tested, wherein the signal probe in the oscilloscope probe is at a double-ended spring Directly contacting the positive electrode of the device to be tested under elasticity; wherein the grounding probe comprises a sleeve, the double-ended spring and a grounding tip; wherein the grounding probe is connected to the signal probe through a second connecting member
  • the double-ended spring is located in the sleeve, the first end of the double-ended spring is in contact with the grounding tip, and the second end of the double-ended spring is fixed on the second connecting member.
  • the double-ended spring comprises a horizontal partial spring and a vertical partial spring, wherein the horizontal partial spring is arranged to adjust a test pitch of the test ripple; the vertical partial spring is arranged to ensure the oscilloscope probe and the test point Stable contact.
  • the grounding probe is fixedly connected to the signal probe through the second connecting member.
  • the second connector comprises a card holder and a groove; the grounding probe is connected to the card holder through the groove, and the grounding probe is fixed on the signal probe by the card holder.
  • an apparatus for testing ripple comprising: a first contact module configured to point a ground probe in an oscilloscope probe to a ground end of a device to be tested; and a second contact module, set In order to vertically contact the signal probe in the oscilloscope probe to the positive pole of the device to be tested under the elasticity of the double-ended spring; wherein the ground probe comprises a sleeve, the double-ended spring and the grounding tip; wherein The grounding probe is coupled to the signal probe via a second connector; the double-ended spring is located within the sleeve, the first end of the double-ended spring is in contact with the grounding tip, the double-ended spring The second end is fixed to the second connecting member.
  • a computer storage medium is further provided, and the computer storage medium may store an execution instruction for performing the method of testing the ripple in the above embodiment.
  • An embodiment of the present invention provides an oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip. Due to the elastic expansion and contraction characteristics of the double-ended spring, the grounding is The flexible placement and stable grounding feature make it more suitable for testing small and medium-sized packaged devices, thus solving the problem that the small package devices are difficult to test in the ripple test in the related art, thereby improving the quality and efficiency of the ripple test.
  • FIG. 1 is a schematic diagram of a power supply ripple test in the related art
  • FIG. 2 is a structural diagram of an oscilloscope probe for testing ripple according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of connection of a signal probe 24 and a first connector 22 in an oscilloscope probe according to an embodiment of the invention
  • FIG. 4 is a structural relationship diagram of a second connecting member 210 and a grounding probe 26 in an oscilloscope probe according to an embodiment of the present invention
  • FIG. 5 is a schematic diagram showing a state of an oscilloscope probe when testing ripple according to an embodiment of the present invention
  • FIG. 6 is a structural block diagram of a system for testing ripple according to an embodiment of the present invention.
  • FIG. 7 is a flow chart of a method of testing ripple according to an embodiment of the present invention.
  • FIG. 8 is a block diagram showing the structure of an apparatus for testing ripple according to an embodiment of the present invention.
  • FIG. 2 is a structural diagram of an oscilloscope probe for testing ripple according to an embodiment of the present invention.
  • the oscilloscope probe includes: The first connector 22, the signal probe 24 and the ground probe 26 are connected.
  • 3 is a schematic diagram showing the connection of the signal probe 24 and the first connector 22 in the oscilloscope probe according to an embodiment of the present invention. As shown in FIG.
  • the signal probe 24 is connected to the first connector 22 through a cable 28, and the grounding probe 26 includes a sleeve 262, a double-ended spring 264 and a grounding tip 266; wherein the grounding probe 26 is coupled to the signal probe 24 via the second connector 210; the double-ended spring 264 is located within the sleeve 262, the first end of the double-ended spring 264 is grounded The tip 266 is in contact with the second end of the double end spring 264 being secured to the second connector 210.
  • the grounding probe 26 may be an L-shaped component, but is not limited thereto, such as a circular arc type component.
  • the grounding probe 26 and the signal probe 24 are fixedly connected by the second connecting member 210.
  • 4 is a structural relationship diagram of a second connecting member 210 and a grounding probe 26 in an oscilloscope probe according to an embodiment of the present invention.
  • the second connecting member 210 includes a card holder 2102 and a recess 2104; and the grounding probe 26
  • the groove 2104 includes at least one of the following: a wedge-shaped hole and a square hole; the grounding tip has a sharp angle of 30 degrees and a bottom diameter of 2.5 mm; as shown in FIG. 2, the grounding probe 26 is connected to the card holder 2102. It is fixed to the signal probe 24 by the card holder 2102.
  • the double ended spring 264 includes a horizontal portion spring and a vertical portion spring, wherein the horizontal portion spring is configured to adjust the test pitch of the test ripple; the vertical portion spring is configured to ensure stable contact of the oscilloscope probe with the test point.
  • Double end spring The specific structure of 264 can be seen in Figures 2 and 4.
  • the signal probe 24 includes a ground ring surface 242 and a positive electrode 244 of the probe; wherein the ground ring surface 242 is disposed to be connected to the grounding probe 26; the positive electrode 244 of the oscilloscope probe is set to the signal to be tested. .
  • An oscilloscope probe including the first connector 22, the signal probe 24, and the grounding probe 26 including the sleeve 262, the double-ended spring 264, and the grounding tip 266 provided by the above embodiment is characterized by the elastic expansion and contraction of the double-ended spring 264. Therefore, the grounding has the characteristics of flexible positioning and stable fixing, and since the grounding probe 26 is longer than the positive electrode 244 of the oscilloscope probe, thereby avoiding short circuit caused by malfunction during the test, for the small-package device of the single board
  • the ripple test is especially effective, and is more suitable for testing small and medium-sized package devices, thereby solving the problem that the small package device is difficult to test in the ripple test in the related art, thereby improving the quality and efficiency of the ripple test.
  • the tip assembly is a consumable item, the card holder is generally not easily damaged.
  • the needle tip assembly including the grounding tip 266) is damaged, only the replacement is required, and thus the embodiment is adopted.
  • the structure of the grounding probe 26 has the characteristics of convenient replacement.
  • FIG. 5 is a diagram showing a state of an oscilloscope probe when testing ripple according to an embodiment of the present invention.
  • FIG. 6 is a structural block diagram of a system for testing ripple according to an embodiment of the present invention. As shown in FIG. 6, the system includes an oscilloscope 62 and an oscilloscope probe 64.
  • the oscilloscope 62 is coupled to the oscilloscope probe 64 described above and is configured to display the ripple detected by the oscilloscope probe 64.
  • the oscilloscope probe 64 is the oscilloscope probe shown in FIG. 2 in the above embodiment.
  • the main structure of the oscilloscope probe reference may be made to the description of FIG. 2 to FIG. 5 in the foregoing embodiment, and details are not described herein again.
  • an oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip is used to test the ripple. Due to the elastic expansion of the double-ended spring, the grounding is It has the characteristics of flexible placement and stable grounding. It is more suitable for testing small and medium-sized packaged devices, thus solving the problem that the small package devices are not easy to test in the ripple test in the related art, thereby improving the quality and efficiency of the ripple test. .
  • FIG. 7 is a flowchart of a method for testing ripple according to an embodiment of the present invention. As shown in FIG. 7, the flow includes the following steps:
  • Step S702 touching the grounding probe in the oscilloscope probe to the ground end of the device to be tested;
  • Step S704 the signal probe in the oscilloscope probe is vertically contacted with the positive electrode of the device to be tested under the elastic action of the double-ended spring.
  • the oscilloscope probe used in this embodiment is the embodiment shown in FIG. 2-5 of the foregoing embodiment. Specifically, the structure of the oscilloscope probe is described in detail in FIG. 2-5 in the foregoing embodiment. , will not repeat them here.
  • an oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip is used to test the ripple. Due to the elastic expansion and contraction characteristics of the double-ended spring, the grounding is It has the characteristics of flexible placement and stable grounding, and is more suitable for testing small and medium-sized packaged devices, thus solving related technologies. In the ripple test, the small package device is difficult to test, which improves the quality and efficiency of the ripple test.
  • the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, by hardware, but in many cases, the former is A better implementation.
  • the technical solution of the present invention in essence or the contribution to the related art can be embodied in the form of a software product stored in a storage medium (such as ROM/RAM, disk, CD-ROM).
  • the instructions include a number of instructions for causing a terminal device (which may be a cell phone, computer, server, or network device, etc.) to perform the methods described in various embodiments of the present invention.
  • FIG. 8 is a structural block diagram of an apparatus for testing ripple according to an embodiment of the present invention. As shown in FIG. 8, the device includes:
  • the first contact module 82 is configured to point the ground probe in the oscilloscope probe to the ground end of the device to be tested;
  • the second contact module 84 is connected to the first contact module 82 and configured to vertically contact the signal probe of the oscilloscope probe to the positive electrode of the device to be tested under the elastic action of the double-ended spring.
  • the oscilloscope probe used in this embodiment is the embodiment shown in FIG. 2-5 of the foregoing embodiment. Specifically, the structure of the oscilloscope probe is described in detail in FIG. 2-5 in the foregoing embodiment. , will not repeat them here.
  • the apparatus tests the ripple by an oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip, which is characterized by the elastic expansion of the double-ended spring.
  • the grounding has the characteristics of flexible placement and stable grounding, and is more suitable for testing small and medium-sized packaged devices, thereby solving the problem that the small-package devices in the ripple test in the related art are difficult to test, thereby improving the quality of the ripple test. And efficiency.
  • each of the above modules may be implemented by software or hardware.
  • the foregoing may be implemented by, but not limited to, the foregoing modules are all located in the same processor; or, the modules are located in multiple In the processor.
  • An alternative embodiment of the present invention provides an optional oscilloscope probe, as shown in FIG. 2-5.
  • the general passive voltage probe includes a probe and a long ground clip with an alligator clip.
  • the probe (corresponding to the first connector and the signal probe in the above embodiment) is a coaxial cable (cable 28) connected to the BCN connector (the first connector 22) at one end, and is set to The test channel of the oscilloscope is connected, and the other end is the probe (signal probe 24), which is the test front end and is set as the spot measurement signal, including: the ground ring surface of the probe front end (ground ring surface 242), which is set as the grounding pin; the positive electrode of the probe (positive 244 of the oscilloscope probe), set to point the signal to be tested.
  • the grounding device in the alternative embodiment is divided into two parts, a card holder 2102 and a probe (grounding probe 26).
  • the picture on the left is the card holder. It has two functions. One is to fix the probe on the right side into the card holder 2102 through the “wedge” hole (groove 2104). When the other one acts, the entire grounding device is inserted into the probe. .
  • the right probe is similar to an L-shaped assembly.
  • the main structure of the assembly is a sleeve 262 of an internal double-ended spring 264.
  • the tip (ground tip 266) is loaded into the sleeve 262 prior to installation. Inside, the double-ended spring is inserted into the sleeve 262, one end of which is held against the tip of the needle, and the other end is fixed by a "wedge".
  • the tip size is 30 degrees for the sharp corner and 2.5 mm for the bottom.
  • the needle tip assembly is a consumable item, and the card holder is generally not easily damaged, and the discrete structure has the advantages of convenient replacement.
  • grounding device specifically, push the probe assembly (grounding probe 26) into the card holder 2102 to form a complete probe grounding device.
  • Embodiments of the present invention also provide a storage medium.
  • the foregoing storage medium may be configured to store program code for performing the following steps:
  • the signal probe in the oscilloscope probe is vertically contacted to the anode of the device to be tested under the elastic action of the double-ended spring.
  • the oscilloscope probe used in this embodiment is the embodiment shown in FIG. 2-5 of the foregoing embodiment. Specifically, the structure of the oscilloscope probe is described in detail in FIG. 2-5 in the foregoing embodiment. , will not repeat them here.
  • the foregoing storage medium may include, but not limited to, a USB flash drive, a Read-Only Memory (ROM), a Random Access Memory (RAM), a mobile hard disk, and a magnetic memory.
  • ROM Read-Only Memory
  • RAM Random Access Memory
  • a mobile hard disk e.g., a hard disk
  • magnetic memory e.g., a hard disk
  • modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices.
  • they may be implemented by program code executable by a computing device such that they may be stored in a storage device by a computing device and, in some cases, may be executed in a different order than herein.
  • the steps shown or described are either made separately into individual integrated circuit modules, or a plurality of modules or steps are fabricated as a single integrated circuit module.
  • the invention is not limited to any specific combination of hardware and software.
  • An oscilloscope probe including a first connector, a signal probe, and a grounding probe including a sleeve, a double-ended spring, and a grounding tip is provided in an embodiment of the present invention, and the grounding is both due to the elastic expansion and contraction characteristics of the double-ended spring.
  • the flexible placement and stable grounding feature make it more suitable for testing small and medium-sized packaged devices, thus solving the problem that the small package devices are difficult to test in the ripple test in the related art, thereby improving the quality and efficiency of the ripple test.

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Abstract

一种测试纹波的示波器探头、方法、装置及***，其中，该示波器探头包括：与示波器连接的第一连接器（22），信号探头（24）和接地探头（26），信号探头（24）通过电缆（28）与第一连接器（22）连接，接地探头（26）包括套筒（262）、双端弹簧（264）和接地针尖（266）；其中，接地探头（26）与信号探头（24）通过第二连接件（210）连接；双端弹簧（264）位于套筒（262）内，双端弹簧（264）的第一端与接地针尖（266）接触，双端弹簧（264）的第二端固定于第二连接件（210）上。通过该示波器探头，解决了相关技术中的纹波测试中小封装器件不易测试的问题，进而提高了纹波测试的质量和效率。

Description

测试纹波的示波器探头、方法、装置及*** 技术领域
本发明涉及通信领域，具体而言，涉及一种测试纹波的示波器探头、方法、装置及***。
背景技术
纹波是附着于直流电平之上的包含周期性与随机性成分的杂波信号，指在额定输出电压、电流的情况下，输出电压中的交流电压的峰值。电源纹波过大会导致电子器件与***工作不稳定。
电源纹波测试通常使用示波器加电压探头的方式。图1是相关技术中的电源纹波测试的示意图，如图1所示，电压探头的正端接待测电压测试点，电压探头的地端接待测电压的参考地。电压探头采集到的电源信号，经过示波器后端的放大、ADC采样、数字处理后，显示在示波器的屏幕上，最终测量得到的电压峰峰值就是待测电源的纹波。
相关技术中的纹波测试时，一般选用自制短地针，减小测试环路。比如，申请号为201320856284.5的专利文件，提供了一种固定式的地针的方式，该方法可以根据不同封装的测试器件选择对应间距的地夹具，但是该方法存在两个缺点：一是夹具太复杂，需要有多种配置；二是对于微小封装的器件不再适用，如0402封装的电容，其封装尺寸长X宽是1mm*0.5mm，而探头的半径是3mm，使用该夹具无法完成这项测试，可操作性不强。申请号为201310097255.X的专利文件，使用两个自制的套环，采用侧向式测试，将探头斜侧放置，从而点触测试器件，但是该方法采用的测试间距过大，而且侧向测试时，会挡住测试者的视线，不利于实际操作。
对于上述问题，目前尚未提出有效的解决方案。
发明内容
本发明实施例提供了一种测试纹波的示波器探头、方法、装置及***，以至少解决了相关技术中的纹波测试中小封装器件不易测试的问题。
根据本发明实施例的一个方面，提供了一种测试纹波的示波器探头，该示波器探头包括：与示波器连接的第一连接器，信号探头和接地探头，信号探头通过电缆与第一连接器连接，接地探头包括套筒、双端弹簧和接地针尖；其中，接地探头与信号探头通过第二连接件连接；双端弹簧位于套筒内，双端弹簧的第一端与接地针尖接触，双端弹簧的第二端固定于第二连接件上。
可选地，接地探头为L型组件。
可选地，接地探头与信号探头通过第二连接件固定连接。
可选地，第二连接件包括卡座和凹槽；接地探头通过凹槽与卡座连接，接地探头通过卡座固定在信号探头上。
可选地，凹槽包括以下至少之一：楔形孔、方形孔。
可选地，接地针尖的尖角为30度，底部直径为2.5毫米。
可选地，双端弹簧包括水平部分弹簧和垂直部分弹簧，其中，水平部分弹簧设置为调整测试纹波的测试间距；垂直部分弹簧设置为确保示波器探头与测试点稳定接触。
根据本发明实施例的一个方面，提供了一种测试纹波的***，包括：示波器和上述的示波器探头；该示波器，设置为与上述示波器探头连接，显示上述示波器探头测试到的纹波。
根据本发明实施例的一个方面，提供了一种测试纹波的方法，包括：将示波器探头中的接地探头点触待测试器件的地端，所述示波器探头中的信号探头在双端弹簧的弹性作用下垂直接触于所述待测试器件的正极；其中，所述接地探头包括套筒、所述双端弹簧和接地针尖；其中，所述接地探头与所述信号探头通过第二连接件连接；所述双端弹簧位于所述套筒内，所述双端弹簧的第一端与所述接地针尖接触，所述双端弹簧的第二端固定于第二连接件上。
可选地，所述双端弹簧包括水平部分弹簧和垂直部分弹簧，其中，所述水平部分弹簧设置为调整测试纹波的测试间距；所述垂直部分弹簧设置为确保所述示波器探头与测试点稳定接触。
可选地，所述接地探头通过所述第二连接件与所述信号探头固定连接。
可选地，所述第二连接件包括卡座和凹槽；所述接地探头通过所述凹槽与所述卡座连接，所述接地探头通过所述卡座固定在所述信号探头上。
根据本发明实施例的一个方面，提供了一种测试纹波的装置，包括：第一接触模块，设置为将示波器探头中的接地探头点触待测试器件的地端；第二接触模块，设置为将所述示波器探头中的信号探头在双端弹簧的弹性作用下垂直接触于所述待测试器件的正极；其中，所述接地探头包括套筒、所述双端弹簧和接地针尖；其中，所述接地探头与所述信号探头通过第二连接件连接；所述双端弹簧位于所述套筒内，所述双端弹簧的第一端与所述接地针尖接触，所述双端弹簧的第二端固定于第二连接件上。
在本发明实施例中，还提供了一种计算机存储介质，该计算机存储介质可以存储有执行指令，该执行指令用于执行上述实施例中的测试纹波的方法。
通过本发明实施例，提供了一种包括第一连接器、信号探头和包括套筒、双端弹簧和接地针尖的接地探头的示波器探头，由于双端弹簧的弹性伸缩的特点，使得接地既有灵活放置、也能稳定地固定地的特点，更加适合对中小封装器件进行测试，进而解决了相关技术中的纹波测试中小封装器件不易测试的问题，进而提高了纹波测试的质量和效率。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是相关技术中的电源纹波测试的示意图；
图2是根据本发明实施例提供的测试纹波的示波器探头的结构图；
图3是根据本发明实施例提供的示波器探头中信号探头24和第一连接器22的连接示意图；
图4是本发明实施例提供的示波器探头中第二连接件210和第接地探头26的结构关系图；
图5是根据本发明实施例的测试纹波时的示波器探头的状态示意图；
图6是根据本发明实施例的测试纹波的***的结构框图；
图7是根据本发明实施例的测试纹波的方法的流程图；
图8是根据本发明实施例的测试纹波的装置的结构框图。
具体实施方式
下文中将参考附图并结合实施例来详细说明本发明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
需要说明的是，本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
在本发明实施例中提供了一种测试纹波的示波器探头，图2是根据本发明实施例提供的测试纹波的示波器探头的结构图，如图2所示，该示波器探头包括：与示波器连接的第一连接器22，信号探头24和接地探头26。图3是根据本发明实施例提供的示波器探头中信号探头24和第一连接器22的连接示意图，如图3所示，信号探头24通过电缆28与第一连接器22连接，接地探头26包括套筒262、双端弹簧264和接地针尖266；其中，接地探头26与信号探头24通过第二连接件210连接；双端弹簧264位于套筒262内，双端弹簧264的第一端与接地针尖266接触，双端弹簧264的第二端固定于第二连接件210上。
需要说明的是，上述接地探头26可以为L型组件，但并不限于此，比如圆弧型组件。接地探头26与信号探头24通过第二连接件210固定连接。图4是本发明实施例提供的示波器探头中第二连接件210和第接地探头26的结构关系图，如图4所示，第二连接件210包括卡座2102和凹槽2104；接地探头26通过凹槽2104与卡座2102连接，该凹槽2104包括以下至少之一：楔形孔、方形孔；接地针尖的尖角为30度，底部直径为2.5毫米；如图2所示，接地探头26通过卡座2102固定在信号探头24上。
可选，双端弹簧264包括水平部分弹簧和垂直部分弹簧，其中，水平部分弹簧设置为调整测试纹波的测试间距；垂直部分弹簧设置为确保示波器探头与测试点稳定接触。双端弹簧 264的具体结构可以从图2和图4中看出。
需要说明的是，如图3所示，信号探头24包括地环面242和探头的正极244；其中，地环面242设置为连接接地探头26；示波器探头的正极244设置为点测待测信号。
通过上述实施例提供的一种包括第一连接器22、信号探头24和包括套筒262、双端弹簧264和接地针尖266的接地探头26的示波器探头，由于双端弹簧264的弹性伸缩的特点，使得接地既有灵活放置、也能稳定地固定地的特点，并且由于接地探头26比示波器探头的正极244长，从而也避免了测试过程中由于误动作导致短路，对于单板小封装器件的纹波测试尤其有效,更加适合对中小封装器件进行测试，进而解决了相关技术中的纹波测试中小封装器件不易测试的问题，进而提高了纹波测试的质量和效率。
需要说明的是，在实际测试中，由于针尖组件是易耗品，卡座一般不易损坏，当针尖组件(包括接地针尖266)损坏的情况下，只需要进行更换就可，因而采用本实施例中接地探头26的结构具有更换方便的特点。
图5示出了根据本发明实施例的测试纹波时的示波器探头的状态示意图。
在本实施例中提供了一种测试纹波的***，图6是根据本发明实施例的测试纹波的***的结构框图，如图6所示，***包括：示波器62和示波器探头64，
示波器62与上述示波器探头64连接，设置为显示示波器探头64测试到的纹波。
需要说明的是，该示波器探头64为上述实施例中图2所示的示波器探头，对于该示波器探头的主要结构可以参考上述实施例中对图2-图5的描述，此处不再赘述。
通过上述***，采用一种包括第一连接器、信号探头和包括套筒、双端弹簧和接地针尖的接地探头的示波器探头来测试纹波，由于双端弹簧的弹性伸缩的特点，使得接地既有灵活放置、也能稳定地固定地的特点，更加适合对中小封装器件进行测试，进而解决了相关技术中的纹波测试中小封装器件不易测试的问题，进而提高了纹波测试的质量和效率。
在本实施例中提供了一种测试纹波的方法，图7是根据本发明实施例的测试纹波的方法的流程图，如图7所示，该流程包括如下步骤：
步骤S702，将示波器探头中的接地探头点触待测试器件的地端；
步骤S704，将所述示波器探头中的信号探头在双端弹簧的弹性作用下垂直接触于所述待测试器件的正极。
需要说明的是，在本实施例中采用的示波器探头是上述实施例图2-5所示的实施例，具体地，该示波器探头的结构详见上述实施例中图2-5相对应的描述，此处不再赘述。
通过上述步骤，采用一种包括第一连接器、信号探头和包括套筒、双端弹簧和接地针尖的接地探头的示波器探头来测试纹波，由于双端弹簧的弹性伸缩的特点，使得接地既有灵活放置、也能稳定地固定地的特点，更加适合对中小封装器件进行测试，进而解决了相关技术 中的纹波测试中小封装器件不易测试的问题，进而提高了纹波测试的质量和效率。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到根据上述实施例的方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本发明的技术方案本质上或者说对相关技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端设备(可以是手机，计算机，服务器，或者网络设备等)执行本发明各个实施例所述的方法。
在本实施例中提供了一种测试纹波的装置，图8是根据本发明实施例的测试纹波的装置的结构框图，如图8所示，该装置包括：
第一接触模块82，设置为将示波器探头中的接地探头点触待测试器件的地端；
第二接触模块84，与上述第一接触模块82连接，设置为将所述示波器探头中的信号探头在双端弹簧的弹性作用下垂直接触于所述待测试器件的正极。
需要说明的是，在本实施例中采用的示波器探头是上述实施例图2-5所示的实施例，具体地，该示波器探头的结构详见上述实施例中图2-5相对应的描述，此处不再赘述。
通过上述装置，上述装置通过一种包括第一连接器、信号探头和包括套筒、双端弹簧和接地针尖的接地探头的示波器探头来测试纹波，由于双端弹簧的弹性伸缩的特点，使得接地既有灵活放置、也能稳定地固定地的特点，更加适合对中小封装器件进行测试，进而解决了相关技术中的纹波测试中小封装器件不易测试的问题，进而提高了纹波测试的质量和效率。
需要说明的是，上述各个模块是可以通过软件或硬件来实现的，对于后者，可以通过以下方式实现，但不限于此：上述模块均位于同一处理器中；或者，上述模块分别位于多个处理器中。
为了更好的理解本发明实施例，以下结合优选的实施例对本发明实施例做进一步解释。
本发明可选实施例提供了一种可选的示波器探头，具体如图2-5所示，其中，一般的无源电压探头包括一根探棒，一根带鳄鱼夹的长地夹。其中探棒(相当于上述实施例中的第一连接器和信号探头)如图3，是一根同轴电缆(电缆28)，一端连接BCN连接器(第一连接器22)，设置为与示波器的测试通道相连，另外一端为探头(信号探头24)，是测试前端，设置为点测信号，其中包括：探头前端的地环面(地环面242)，设置为接地针；探头的正极(示波器探头的正极244)，设置为点测待测信号。
如图4所示，本可选实施例中的接地装置分成两部分，卡座2102与探针(接地探头26)。左图为卡座，有两个作用，一是将右侧的探针通过“楔形”孔(凹槽2104)固定在卡座2102内，另外一个作用时，将整个接地装置套进探棒内。右侧探针类似一个L型组件，组件的主要结构是一个内部双端弹簧264的套筒262，安装前将先针尖(接地针尖266)装入套筒262 内，再双端弹簧塞入套筒262内，其一端顶住针尖，另外一端由“楔形”固定。针尖的规格是尖角30度，底部直径2.5mm。
在实际测试中，针尖组件是易耗品，卡座一般不易损坏，本分立结构具有更换方便的优点。
采用本发明可选实施例的示波器探头测试单板电源纹波的步骤如下：
1，将接地装置装配好，具体是将探针组件(接地探头26)赛入卡座2102，构成一个完整探头接地装置。
2，将接地装置替换原始的长地线，组成一个完整的电源纹波测试探头。
3，将探头的地针针尖(接地针尖266)的针尖点触单板待测器件的地端(负端)。
4，利用接地装置的内部水平弹簧的弹性，根据待测器件水平尺寸拔动探棒，使其正极探针与待测器件的正极垂直在同一位置。
5，利用接地装置内部弹簧(双端弹簧264)的弹性将正在探头垂直向下顶住待测器件的两端，从而保证与测试点良好接触，从而完成纹波的点测工作。
6，测试完成后，直接将探头提起，由于接地针比探头的正极长，不用担心测试过程中，形成短路，从而烧坏器件。测试过程中，经常会遇到针尖断裂的情况，可以直接拆卸下来，更换地针组件即可。
本发明的实施例还提供了一种存储介质。可选地，在本实施例中，上述存储介质可以被设置为存储用于执行以下步骤的程序代码：
S1，将示波器探头中的接地探头点触待测试器件的地端；
S2，将所述示波器探头中的信号探头在双端弹簧的弹性作用下垂直接触于所述待测试器件的正极。
需要说明的是，在本实施例中采用的示波器探头是上述实施例图2-5所示的实施例，具体地，该示波器探头的结构详见上述实施例中图2-5相对应的描述，此处不再赘述。
可选地，在本实施例中，上述存储介质可以包括但不限于：U盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、移动硬盘、磁碟或者光盘等各种可以存储程序代码的介质。
可选地，本实施例中的具体示例可以参考上述实施例及可选实施方式中所描述的示例，本实施例在此不再赘述。
显然，本领域的技术人员应该明白，上述的本发明的各模块或各步骤可以用通用的计算装置来实现，它们可以集中在单个的计算装置上，或者分布在多个计算装置所组成的网络上， 可选地，它们可以用计算装置可执行的程序代码来实现，从而，可以将它们存储在存储装置中由计算装置来执行，并且在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤，或者将它们分别制作成各个集成电路模块，或者将它们中的多个模块或步骤制作成单个集成电路模块来实现。这样，本发明不限制于任何特定的硬件和软件结合。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
工业实用性
在本发明实施例中提供了一种包括第一连接器、信号探头和包括套筒、双端弹簧和接地针尖的接地探头的示波器探头，由于双端弹簧的弹性伸缩的特点，使得接地既有灵活放置、也能稳定地固定地的特点，更加适合对中小封装器件进行测试，进而解决了相关技术中的纹波测试中小封装器件不易测试的问题，进而提高了纹波测试的质量和效率。

Claims (13)

  1. 一种测试纹波的示波器探头，该示波器探头包括：与示波器连接的第一连接器，信号探头和接地探头，所述信号探头通过电缆与所述第一连接器连接，所述接地探头包括套筒、双端弹簧和接地针尖；
    其中，所述接地探头与所述信号探头通过第二连接件连接；所述双端弹簧位于所述套筒内，所述双端弹簧的第一端与所述接地针尖接触，所述双端弹簧的第二端固定于所述第二连接件上。
  2. 根据权利要求1所述的示波器探头，其中，所述接地探头为L型组件。
  3. 根据权利要求1所述的示波器探头，其中，所述接地探头与所述信号探头通过所述第二连接件固定连接。
  4. 根据权利要求3所述的示波器探头，其中，所述第二连接件包括卡座和凹槽；所述接地探头通过所述凹槽与所述卡座连接，所述接地探头通过所述卡座固定在所述信号探头上。
  5. 根据权利要求4所述的示波器探头，其中，所述凹槽包括以下至少之一：楔形孔、方形孔。
  6. 根据权利要求1所述的示波器探头，其中，所述接地针尖的尖角为30度，底部直径为2.5毫米。
  7. 根据权利要求1至6中任一项所述的示波器探头，其中，所述双端弹簧包括水平部分弹簧和垂直部分弹簧，其中，所述水平部分弹簧设置为调整测试纹波的测试间距；所述垂直部分弹簧设置为确保所述示波器探头与测试点稳定接触。
  8. 一种测试纹波的***，其中，包括：示波器和权利要求1至7中任一项所述的示波器探头；所述示波器，设置为与所述示波器探头连接，显示所述示波器探头测试到的纹波。
  9. 一种测试纹波的方法，包括：
    将示波器探头中的接地探头点触待测试器件的地端，所述示波器探头中的信号探头在双端弹簧的弹性作用下垂直接触于所述待测试器件的正极；
    其中，所述接地探头包括套筒、所述双端弹簧和接地针尖；其中，所述接地探头与所述信号探头通过第二连接件连接；所述双端弹簧位于所述套筒内，所述双端弹簧的第一端与所述接地针尖接触，所述双端弹簧的第二端固定于所述第二连接件上。
  10. 根据权利要求9所述的方法，其中，所述双端弹簧包括水平部分弹簧和垂直部分弹簧，其中，所述水平部分弹簧设置为调整测试纹波的测试间距；所述垂直部分弹簧设置为确保所述示波器探头与测试点稳定接触。
  11. 根据权利要求9所述的方法，其中，所述接地探头通过所述第二连接件与所述信号探头固定连接。
  12. 根据权利要求9所述的方法，其中，所述第二连接件包括卡座和凹槽；所述接地探头通过所述凹槽与所述卡座连接，所述接地探头通过所述卡座固定在所述信号探头上。
  13. 一种测试纹波的装置，包括：
    第一接触模块，设置为将示波器探头中的接地探头点触待测试器件的地端；
    第二接触模块，设置为将所述示波器探头中的信号探头在双端弹簧的弹性作用下垂直接触于所述待测试器件的正极；
    其中，所述接地探头包括套筒、所述双端弹簧和接地针尖；其中，所述接地探头与所述信号探头通过第二连接件连接；所述双端弹簧位于所述套筒内，所述双端弹簧的第一端与所述接地针尖接触，所述双端弹簧的第二端固定于所述第二连接件上。
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