TWI618318B - Connector connection structure - Google Patents
Connector connection structure Download PDFInfo
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- TWI618318B TWI618318B TW105131347A TW105131347A TWI618318B TW I618318 B TWI618318 B TW I618318B TW 105131347 A TW105131347 A TW 105131347A TW 105131347 A TW105131347 A TW 105131347A TW I618318 B TWI618318 B TW I618318B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
將一對差動訊號端子的差動端子腳部焊接於配線基板的訊號圖案，前述配線基板的訊號圖案在絕緣殼體的背面的突出位置與差動端子腳部對向，將屏蔽接地連接部配設於關於一對差動端子腳部的各突出位置對稱的接地連接位置，並焊接於形成為關於一對差動端子腳部的各突出位置對稱的形狀的配線基板的接地圖案。由於一對的各差動訊號端子與接地的屏蔽接地連接部或者接地圖案之間產生的寄生電容幾乎相等，因此即使在一對差動訊號端子中流過高頻率的差動訊號，也不會產生由寄生電容的差分引起的共模電流。 The differential terminal leg portions of the pair of differential signal terminals are soldered to the signal pattern of the wiring substrate, and the signal pattern of the wiring substrate faces the differential terminal leg at a protruding position on the back surface of the insulating case, and the shield ground connection portion is shielded The ground connection position is symmetrically arranged at each of the protruding positions of the pair of differential terminal leg portions, and is soldered to the ground pattern of the wiring substrate formed in a shape symmetrical with respect to each of the protruding positions of the pair of differential terminal leg portions. Since the parasitic capacitances generated between the differential signal terminals of the pair and the grounded shield ground connection or the ground pattern are almost equal, even if a high frequency differential signal flows through a pair of differential signal terminals, no generation will occur. Common mode current caused by the difference in parasitic capacitance.
Description
本發明關於將流過反相高頻訊號之連接器之一對差動訊號端子焊接於配線基板之訊號圖案之連接器之連接構造，具體而言，關於將對差動訊號端子進行屏蔽之連接器之屏蔽殼金屬件在差動訊號端子及訊號圖案之焊接位置之周圍接地至配線基板之接地圖案之連接器之連接構造。 The present invention relates to a connection structure of a connector for soldering a differential signal terminal to a signal pattern of a wiring substrate through one of a connector for flowing an inverted high-frequency signal, and more particularly to a connection for shielding a differential signal terminal The shield metal shell of the device is grounded to the connector of the ground pattern of the wiring substrate around the soldering position of the differential signal terminal and the signal pattern.
如圖12、圖13所示，遵循連接主機設備和週邊設備的USB(Universal serial bus，通用序列匯流排)規格之USB連接器等用於高速數據傳輸用途的專利文獻1所記載之連接器100在供對方側插頭***的嵌合凹部101內突出設置有絕緣殼體102之支撐板部102a，裝配於絕緣殼體102之多個端子104之插頭接觸部104a露出至支撐板部102a之背面並與對方側插頭之插頭側端子接觸，各端子104之腳部104b從絕緣殼體102之背面突出。 As shown in FIG. 12 and FIG. 13, the connector 100 described in Patent Document 1 for use in high-speed data transmission, such as a USB (Universal Serial Bus) standard USB connector for connecting a host device and peripheral devices, is used. The support plate portion 102a of the insulating case 102 is protruded from the fitting recess 101 into which the plug of the other side is inserted, and the plug contact portion 104a of the plurality of terminals 104 of the insulating case 102 is exposed to the back surface of the support plate portion 102a. The leg portion 104b of each terminal 104 protrudes from the back surface of the insulating case 102 in contact with the plug-side terminal of the counterpart plug.
從絕緣殼體102的背面突出之各端子104的腳部104b以與絕緣殼體102之底面在同一面上的方式向下方折彎成曲柄狀，藉由焊接於露出至沿著絕緣殼體102之底面配置之印刷配線基板(未圖示)之對向面之對應的訊號圖案，連接器100被連接於印刷配線基板。 The leg portion 104b of each of the terminals 104 projecting from the back surface of the insulating case 102 is bent downward into a crank shape so as to be flush with the bottom surface of the insulating case 102, and is exposed to the insulating case 102. The signal pattern corresponding to the opposite surface of the printed wiring board (not shown) disposed on the bottom surface is connected to the printed wiring board.
由於與該連接器100連接之未圖示的對方側插頭形成為將外周面側設為接地電位之金屬筒狀，因此連接器100之嵌合凹部101也由接地的屏蔽殼金屬件105之嵌合筒部105a形成，將沿著其下端的絕緣殼體102之底面向外側折彎成直角之接地片105b焊接於露出至對向面的印刷配線基板之接地圖案，使屏蔽殼金屬件105成為接地電位。由此，藉由包圍各端子104的周圍之屏蔽殼金屬件105將插頭側端子及連接器100之端子104與外部阻隔來進行電磁屏蔽，避免流過這些端子之高頻訊號向外部輻射或者雜訊(noise)從外部疊加。 Since the counterpart plug (not shown) connected to the connector 100 is formed in a metal cylindrical shape having the outer peripheral surface side at the ground potential, the fitting recess 101 of the connector 100 is also embedded by the grounded shield metal member 105. The joint portion 105a is formed, and the grounding piece 105b bent at a right angle along the bottom surface of the insulating case 102 at the lower end thereof is welded to the ground pattern of the printed wiring board exposed to the opposite surface, so that the shield case metal member 105 becomes Ground potential. Therefore, electromagnetic shielding is performed by blocking the plug-side terminal and the terminal 104 of the connector 100 from the outside by shielding the shield metal member 105 around the terminals 104, thereby preventing high-frequency signals flowing through the terminals from radiating or externally. The noise is superimposed from the outside.
另一方面，由於通過將各端子104之周圍包圍成筒狀之屏蔽殼金屬件105，不能將從絕緣殼體102的背面突出之各端子104之腳部104b與外部阻隔，因此如圖13所示，在以往的連接器100中，藉由屏蔽罩106來包圍各端子104的全部腳部104b，前述屏蔽罩106藉由對導電性金屬板進行折彎加工而形成為包圍絕緣殼體102之背面側的空間之形狀。屏蔽罩106之下端也成為沿著絕緣殼體102之底面向外側折彎成直角的接地片106a，並焊接於露出至其對向面的印刷配線基板之接地圖案，使屏蔽罩106成為接地電位。 On the other hand, since the leg portion 104b of each terminal 104 protruding from the back surface of the insulating case 102 cannot be blocked from the outside by surrounding the periphery of each terminal 104 into the cylindrical shield case metal member 105, as shown in FIG. In the conventional connector 100, all the leg portions 104b of the respective terminals 104 are surrounded by the shield cover 106, and the shield cover 106 is formed to surround the insulating housing 102 by bending the conductive metal plate. The shape of the space on the back side. The lower end of the shield case 106 also becomes a grounding piece 106a bent at a right angle along the bottom surface of the insulating case 102, and is soldered to the ground pattern of the printed wiring board exposed to the opposite surface thereof, so that the shield case 106 becomes a ground potential. .
專利文獻1：日本特開2014-41797號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2014-41797
該以往的連接器100之連接構造中，從絕緣殼體102之背面突 出的各端子104的腳部104b大致被接地的屏蔽罩106包圍，因此與外部阻隔，但由於腳部104b折彎成曲柄狀，因此對流過端子104之高頻傳輸路產生不必要的電感。流過端子104的高頻訊號的頻率越高，該問題越顯著，按照USB3.0以上之規格，當端子104之轉送速度為640MB/s時，就構成不能忽視的傳輸損失。 In the connection structure of the conventional connector 100, the back surface of the insulating housing 102 is protruded Since the leg portion 104b of each of the terminals 104 is substantially surrounded by the shield Shield 106 that is grounded, it is blocked from the outside, but since the leg portion 104b is bent into a crank shape, unnecessary inductance is generated to the high-frequency transmission path flowing through the terminal 104. The higher the frequency of the high-frequency signal flowing through the terminal 104, the more significant the problem is. According to the specification of USB 3.0 or higher, when the transfer speed of the terminal 104 is 640 MB/s, a transmission loss that cannot be ignored is formed.
此外，在對流過鄰接地裝配於絕緣殼體脂一對差動訊號端子間之高頻訊號進行差動合成並生成轉送數據的遵循USB3.0以上規格之連接器中，當接地電位之屏蔽罩106或者屏蔽罩106之接地位置偏向一對差動訊號端子之一方接近時，由於產生於各差動訊號線之寄生電容不同，因此在彼此反相重複的差動電流產生寄生電容之差分，當高頻訊號之頻率變高時，產生不能忽視的大小的共模(common mode)電流。 In addition, the shield of the ground potential is used in a connector that conforms to the USB 3.0 or higher specification for the high-frequency signal that is alternately mounted between the pair of differential signal terminals of the insulating case grease and generates the transfer data. 106 or when the grounding position of the shield 106 is biased toward one of the pair of differential signal terminals, since the parasitic capacitances generated in the differential signal lines are different, the differential currents which are inverted in opposite phases generate a difference in parasitic capacitance. When the frequency of the high frequency signal becomes high, a common mode current of a size that cannot be ignored is generated.
此外，在遵循USB3.1規格之連接器中，將沿著支撐板部102a的上表面配置的多個端子及沿著下表面配置的多個端子之引腳分配(pin assign)設為左右對稱形狀，使得無論以正反的任一姿勢將對方側插頭之插頭側端子***嵌合凹部101，都能夠與對應的端子104電連接，但在這樣以往的連接器100中，從絕緣殼體102之背面突出的端子104之腳部104b從支撐板部102a之上表面及下表面露出之長度不同，不能使在絕緣殼體102之上下分開裝配之端子104之特性阻抗(impedance)相同。 Further, in the connector conforming to the USB 3.1 specification, the pin assignments of the plurality of terminals arranged along the upper surface of the support plate portion 102a and the plurality of terminals arranged along the lower surface are set to be bilaterally symmetric. The shape is such that the plug-side terminal of the counterpart plug can be electrically connected to the corresponding terminal 104 regardless of the posture of the front and the rear. However, in the conventional connector 100, the insulating housing 102 is provided. The leg portion 104b of the terminal 104 projecting from the back surface is different in length from the upper surface and the lower surface of the support plate portion 102a, and the characteristic impedance of the terminal 104 which is separately mounted above and below the insulating case 102 cannot be made the same.
而且，為了將從絕緣殼體102之背面突出的各端子104之腳部104b與周圍阻隔，需要準備對導電性金屬板進行折彎加工而成之屏蔽罩106並將其安裝於絕緣殼體102，零件之件數增加，同時需要額外的組裝工序。 Further, in order to block the leg portions 104b of the respective terminals 104 protruding from the back surface of the insulating case 102 from the surroundings, it is necessary to prepare the shield cover 106 which is formed by bending the conductive metal plate and attach it to the insulating case 102. The number of parts is increased and an additional assembly process is required.
本發明是鑒於這樣的問題點而完成的，因此本發明提供一種 減少在端子與配線基板之連接部產生之電感，即使流過轉送速度為640MB/s之高頻率之高頻訊號也會抑制阻抗之產生，並且數據傳輸特性優異的連接器之連接構造。 The present invention has been made in view of such problems, and therefore the present invention provides a The inductance generated at the connection portion between the terminal and the wiring board is reduced, and even if a high-frequency signal having a high frequency of a transfer speed of 640 MB/s is passed, the impedance is generated and the connection structure of the connector having excellent data transmission characteristics is suppressed.
此外，提供一種即使在鄰接地裝配於絕緣殼體的一對差動訊號端子流過高頻率的差動訊號，也不產生共模雜訊的連接器之連接構造。 Further, there is provided a connection structure of a connector which does not generate common mode noise even when a pair of differential signal terminals which are adjacently mounted to an insulating case have a high frequency differential signal.
此外，其目的在於提供一種不必另外準備屏蔽零件，就將從絕緣殼體突出的端子的腳部與外部屏蔽的連接器之連接構造。 Further, it is an object of the invention to provide a connection structure of a connector which shields a leg portion of a terminal projecting from an insulating case and an outer shield without separately preparing a shield member.
為了達成上述的目的，請求項1之連接器之連接構造由連接器及配線基板構成，前述連接器具有：多個端子，彼此絕緣地裝配於絕緣殼體；以及屏蔽殼金屬件，裝配於絕緣殼體之外側面，對裝配於絕緣殼體之多個端子進行屏蔽，前述配線基板配線有多個訊號圖案及接地圖案，將從絕緣殼體之背面突出的多個端子之腳部分別焊接於對應的多個訊號圖案，並且將屏蔽殼金屬件之屏蔽接地連接部焊接於第一接地圖案，將連接器連接於配線基板，其特徵係，在多個端子中，鄰接地裝配於絕緣殼體的至少一對端子係在一對的各端子間流過反相的高頻訊號的一對差動訊號端子，沿著絕緣殼體之背面配置前述配線基板，將一對差動訊號端子之各差動端子腳部分別焊接於配線基板之訊號圖案，前述配線基板之訊號圖案在各差動端子腳部從絕緣殼體之背面突出之突出位置與各差動端子腳部對向，將屏蔽接地連接部在一對差動端子腳部之突出位置之周圍配設於關於一對差動端子腳部之各突出位 置對稱的第一接地連接位置，並焊接於形成為關於一對差動端子腳部之各突出位置對稱的形狀的配線基板之第一接地圖案。 In order to achieve the above object, the connector structure of the connector of claim 1 is composed of a connector having a plurality of terminals, which are insulated from each other in an insulating case, and a shield metal member, which is mounted on the insulating member. a plurality of terminals mounted on the insulating case are shielded on a side surface of the housing, the wiring board has a plurality of signal patterns and a ground pattern, and the leg portions of the plurality of terminals protruding from the back surface of the insulating case are respectively soldered Corresponding a plurality of signal patterns, and soldering the shield ground connection portion of the shield metal member to the first ground pattern, and connecting the connector to the wiring substrate, wherein the plurality of terminals are adjacently mounted to the insulating housing At least one pair of terminals is a pair of differential signal terminals through which an inverted high-frequency signal flows between the pair of terminals, and the wiring board is disposed along the back surface of the insulating case, and each of the pair of differential signal terminals The differential terminal leg portion is respectively soldered to the signal pattern of the wiring substrate, and the signal pattern of the wiring substrate protrudes from the back surface of the insulating housing at each differential terminal leg portion Positioning with each of the differential terminal leg portions, the shield ground connection portion is disposed around each of the protruding positions of the pair of differential terminal legs at a protruding position of the pair of differential terminal leg portions The first ground connection position is symmetric, and is soldered to the first ground pattern of the wiring substrate formed in a shape symmetrical with respect to each of the protruding positions of the pair of differential terminal legs.
由於將從絕緣殼體之背面突出的一對差動訊號端子之差動端子腳部焊接於沿著絕緣殼體之背面配置的配線基板之對向的訊號圖案，因此無需折彎成曲柄狀，不產生額外的電感。 Since the differential terminal leg portions of the pair of differential signal terminals protruding from the back surface of the insulating case are soldered to the opposite signal pattern of the wiring substrate disposed along the back surface of the insulating case, there is no need to bend into a crank shape. Does not create additional inductance.
配設有屏蔽接地連接部之第一接地連接位置在一對差動端子腳部之各突出位置之周圍距離一對的各突出位置為等距離，此外，焊接屏蔽接地連接部的第一接地圖案是關於一對差動端子腳部的各突出位置對稱的形狀，因此一對的各差動訊號端子與接地的屏蔽接地連接部或者第一接地圖案之間產生的寄生電容幾乎相等，不產生由寄生電容的差分引起的共模電流。 The first ground connection position provided with the shield ground connection portion is equidistant from each of the protruding positions of the pair of differential terminal leg portions, and the first ground pattern of the shield shield ground connection portion is further The shape of each of the pair of differential terminal legs is symmetrical, so that the parasitic capacitance generated between the pair of differential signal terminals and the grounded shield ground connection or the first ground pattern is almost equal. Common mode current due to the difference in parasitic capacitance.
請求項2之連接器之連接構造的特徵係，多個端子與水平地裝配於絕緣殼體內之中間導電板絕緣，並沿著由中間導電板上下隔開的各列裝配，使中間導電板在一對差動端子腳部之突出位置之周圍從絕緣殼體之背面突出至關於一對差動端子腳部之各突出位置對稱的第二接地連接位置，並焊接於形成為關於一對差動端子腳部之各突出位置對稱的形狀之配線基板之第二接地圖案。 The connection structure of the connector of claim 2 is characterized in that the plurality of terminals are insulated from the intermediate conductive plates horizontally fitted in the insulating case, and are assembled along the columns separated by the intermediate conductive plates, so that the intermediate conductive plates are The periphery of the protruding position of the pair of differential terminal legs protrudes from the back surface of the insulating case to a second ground connection position symmetrical with respect to each protruding position of the pair of differential terminal leg portions, and is welded to be formed to be differential with respect to a pair a second ground pattern of the wiring substrate in which the protruding positions of the terminal leg portions are symmetric.
多個端子藉由焊接於第二接地圖案並接地的中間導電板被隔成絕緣殼體的上下各列，因此上下各列的端子間不發生高頻耦合。 Since the plurality of terminals are separated into the upper and lower columns of the insulating case by the intermediate conductive plates soldered to the second ground pattern and grounded, high frequency coupling does not occur between the terminals of the upper and lower columns.
中間導電板突出的第二接地連接位置在一對差動端子腳部的各突出位置的周圍距離一對的各突出位置為等距離，此外，焊接中間導電板的第二接地圖案是關於一對差動端子腳部的各突出位置對稱的形狀， 因此一對的各差動訊號端子與接地的中間導電板或者第二接地圖案之間產生的寄生電容幾乎相等，不產生由寄生電容的差分引起的共模電流。 The second ground connection position at which the intermediate conductive plate protrudes is equidistant from each of the protruding positions of the pair of differential terminal legs at a distance from each of the pair of protruding positions, and the second ground pattern of the welded intermediate conductive plate is about a pair a symmetrical shape of each protruding position of the differential terminal leg, Therefore, the parasitic capacitances generated between the differential signal terminals of the pair and the grounded intermediate conductive plate or the second ground pattern are almost equal, and the common mode current caused by the difference of the parasitic capacitance is not generated.
請求項3之連接器之連接構造的特徵係，在除了使一對差動訊號端子向中間導電板投影之投影區域以外之中間導電板貫穿設置錨孔，將中間導電板及絕緣殼體一體成形。 The connection structure of the connector of claim 3 is characterized in that an intermediate anchor plate is provided with an anchor hole in addition to a projection area for projecting a pair of differential signal terminals toward the intermediate conductive plate, and the intermediate conductive plate and the insulating case are integrally formed. .
絕緣殼體的一部分填充錨孔，中間導電板及絕緣殼體被牢固地一體化。 A part of the insulating case is filled with the anchor hole, and the intermediate conductive plate and the insulating case are firmly integrated.
由於在最接近一對差動訊號端子的中間導電板的投影區域未貫穿設置錨孔，因此接地的中間導電板距離一對的各差動訊號端子為等距離並以同一形狀對向，一對的各差動訊號端子與接地的中間導電板之間產生的寄生電容幾乎相等，不產生由寄生電容的差分引起的共模電流。 Since the anchor hole is not disposed in the projection area of the intermediate conductive plate closest to the pair of differential signal terminals, the grounded intermediate conductive plate is equidistant from the pair of differential signal terminals and is opposed to each other in the same shape. The parasitic capacitance generated between each of the differential signal terminals and the grounded intermediate conductive plate is almost equal, and a common mode current caused by the difference of the parasitic capacitance is not generated.
請求項4之連接器之連接構造的特徵係，將貫穿設置於投影區域之兩側之多個錨孔以關於投影區域對稱的形狀貫穿設置。 The connection structure of the connector of claim 4 is characterized in that a plurality of anchor holes penetrating through the two sides of the projection area are provided in a shape symmetrical with respect to the projection area.
由於貫穿設置於一對差動訊號端子附近的錨孔以關於投影區域對稱的形狀貫穿設置，因此一對的各差動訊號端子與接地的中間導電板之間產生的寄生電容幾乎相等，不產生由寄生電容的差分引起的共模電流。 Since the anchor holes provided in the vicinity of the pair of differential signal terminals are arranged in a symmetrical shape with respect to the projection area, the parasitic capacitances generated between the pair of differential signal terminals and the grounded intermediate conductive plate are almost equal, and are not generated. Common mode current caused by the difference in parasitic capacitance.
請求項5之連接器之連接構造的特徵係，在中間導電板貫穿設置多個錨孔，將貫穿設置於使一對差動訊號端子向中間導電板投影之各投影區域之多個錨孔以關於各投影區域對稱的形狀貫穿設置。 The connection structure of the connector of claim 5 is characterized in that a plurality of anchor holes are formed in the intermediate conductive plate, and a plurality of anchor holes are provided through the respective projection areas for projecting the pair of differential signal terminals toward the intermediate conductive plate. The shape of each projection area is symmetrically arranged.
絕緣殼體的一部分填充錨孔，中間導電板和絕緣殼體被牢固地一體化，貫穿設置於一對差動訊號端子的各投影區域的錨孔以關於各投 影區域對稱的形狀貫穿設置，因此一對的各差動訊號端子與接地的中間導電板之間產生的寄生電容幾乎相等，不產生由寄生電容的差分引起的共模電流。 A part of the insulating case is filled with the anchor hole, and the intermediate conductive plate and the insulating case are firmly integrated, and penetrate the anchor holes provided in the respective projection areas of the pair of differential signal terminals to The symmetrical shape of the shadow region is provided through, so that the parasitic capacitance generated between the pair of differential signal terminals and the grounded intermediate conductive plate is almost equal, and the common mode current caused by the difference of the parasitic capacitance is not generated.
請求項6之連接器之連接構造的特徵係，配線基板係配線有訊號圖案之導電層及連接有接地圖案之接地層彼此絕緣地層疊的多層基板，藉由多層基板之接地層覆蓋絕緣殼體之背面。 The connection structure of the connector of claim 6 is characterized in that the wiring substrate is a multilayer substrate in which a conductive layer of a signal pattern and a ground layer to which a ground pattern is connected are insulated from each other, and the insulating case is covered by a ground layer of the multilayer substrate. The back.
從絕緣殼體的背面突出的許多端子的各腳部及訊號圖案藉由屏蔽殼金屬件的屏蔽接地連接部及多層基板的接地層與外部阻隔。 The leg portions and the signal pattern of the plurality of terminals protruding from the back surface of the insulating case are blocked from the outside by the shield grounding portion of the shield metal member and the ground layer of the multilayer substrate.
根據請求項1的發明，即使在一對的各差動訊號端子流過高頻率的高頻訊號，在與配線基板的訊號圖案電連接的差動端子腳部也不產生額外的阻抗，能不使高頻訊號衰減地進行傳輸。 According to the invention of claim 1, even if a high-frequency high-frequency signal flows through each of the pair of differential signal terminals, no additional impedance is generated in the differential terminal portion electrically connected to the signal pattern of the wiring substrate. The high frequency signal is transmitted attenuated.
此外，由於鄰接地配置於絕緣殼體的一對差動訊號端子與其周圍的接地位置之間的寄生電容幾乎相等，因此即使反相的高頻訊號流過一對差動訊號端子，在一對差動訊號端子也不產生共模雜訊(common mode noise)。 Further, since the parasitic capacitance between the pair of differential signal terminals disposed adjacent to the insulating case and the grounding position thereof is almost equal, even if the inverted high frequency signal flows through the pair of differential signal terminals, the pair The differential signal terminal also does not generate common mode noise.
根據請求項2的發明，即使在絕緣殼體內水平地裝配接地的中間導電板，鄰接地配置於絕緣殼體的一對差動訊號端子與其周圍的中間導電板的第二接地連接位置或者第二接地圖案之間的寄生電容幾乎相等，因此即使反相的高頻訊號流過一對差動訊號端子，在一對差動訊號端子也 不產生共模雜訊。 According to the invention of claim 2, even if the grounded intermediate conductive plate is horizontally fitted in the insulating case, the pair of differential signal terminals adjacently disposed in the insulating case and the second ground connection position of the intermediate conductive plate around it or the second The parasitic capacitance between the ground patterns is almost equal, so even if the inverted high frequency signal flows through a pair of differential signal terminals, the pair of differential signal terminals also No common mode noise is generated.
根據請求項3的發明，即使將接地的中間導電板與一對差動訊號端子平行地水平裝配於絕緣殼體內，由於鄰接地配置於絕緣殼體的一對差動訊號端子與其周圍的中間導電板之間的寄生電容幾乎相等，因此在一對差動訊號端子也不產生共模雜訊。 According to the invention of claim 3, even if the grounded intermediate conductive plate is horizontally fitted in the insulating case in parallel with the pair of differential signal terminals, the pair of differential signal terminals disposed adjacent to the insulating case are electrically conductive in the middle thereof. The parasitic capacitance between the boards is almost equal, so no common mode noise is generated at the pair of differential signal terminals.
根據請求項4的發明，即使在一對差動訊號端子的附近貫穿設置將中間導電板及絕緣殼體牢固地一體化的錨孔，由於一對差動訊號端子與中間導電板之間的寄生電容幾乎相等，因此在一對差動訊號端子也不產生共模雜訊。 According to the invention of claim 4, even if an anchor hole for firmly integrating the intermediate conductive plate and the insulating case is provided in the vicinity of the pair of differential signal terminals, parasitic between the pair of differential signal terminals and the intermediate conductive plate The capacitors are almost equal, so no common mode noise is generated at the pair of differential signal terminals.
根據請求項5的發明，即使在使一對差動訊號端子向中間導電板投影的各投影區域貫穿設置將中間導電板及絕緣殼體牢固地一體化之錨孔，由於一對差動訊號端子與中間導電板之間的寄生電容幾乎相等，因此在一對差動訊號端子也不產生共模雜訊。 According to the invention of claim 5, even in the projection areas for projecting the pair of differential signal terminals to the intermediate conductive plate, the anchor holes for firmly integrating the intermediate conductive plate and the insulating case are provided through the pair of differential signal terminals. The parasitic capacitance between the intermediate conductive plates is almost equal, so no common mode noise is generated at the pair of differential signal terminals.
根據請求項6的發明，僅通過由層疊有接地層的多層基板覆蓋絕緣殼體的背面，就能將從絕緣殼體的背面突出的許多端子的各腳部和訊號圖案與外部阻隔。 According to the invention of claim 6, the leg portions and the signal patterns of the plurality of terminals protruding from the back surface of the insulating case can be blocked from the outside only by covering the back surface of the insulating case with the multilayer substrate on which the ground layer is laminated.
1‧‧‧連接器之連接構造 1‧‧‧Connector connection structure
2‧‧‧絕緣殼體 2‧‧‧Insulated housing
4‧‧‧屏蔽殼金屬件 4‧‧‧Shield metal parts
5‧‧‧中間導電板 5‧‧‧Intermediate conductive plate
20‧‧‧配線基板(FPC) 20‧‧‧Wiring substrate (FPC)
21‧‧‧接地層 21‧‧‧ Grounding layer
22‧‧‧訊號圖案 22‧‧‧Signal pattern
23A‧‧‧第一接地圖案 23A‧‧‧First grounding pattern
23B‧‧‧第二接地圖案 23B‧‧‧Second grounding pattern
31‧‧‧差動訊號端子 31‧‧‧Differential signal terminal
31a‧‧‧差動端子腳部 31a‧‧‧Differential terminal feet
40a~40h‧‧‧屏蔽接地腳部 40a~40h‧‧‧Shield grounding foot
50a~50f‧‧‧板接地腳部 50a~50f‧‧‧ board grounding foot
【圖1】是本發明的一實施方式的連接器之連接構造1的俯視圖。 Fig. 1 is a plan view showing a connection structure 1 of a connector according to an embodiment of the present invention.
【圖2】是表示將連接器10向配線基板20連接的狀態的立體圖。 FIG. 2 is a perspective view showing a state in which the connector 10 is connected to the wiring board 20.
【圖3】是從背面側的斜上方觀察連接器10的立體圖。 FIG. 3 is a perspective view of the connector 10 as seen obliquely from the back side.
【圖4】是連接器10的縱剖面圖。 FIG. 4 is a longitudinal sectional view of the connector 10.
【圖5】是表示向絕緣殼體2安裝許多端子3的工序的分解立體圖。 FIG. 5 is an exploded perspective view showing a step of attaching a plurality of terminals 3 to the insulating case 2.
【圖6】是裝配有許多端子3及中間導電板5的絕緣殼體2的縱剖面圖。 Fig. 6 is a longitudinal sectional view showing an insulating case 2 in which a plurality of terminals 3 and an intermediate conductive plate 5 are mounted.
【圖7】是表示在圖6中示出的絕緣殼體2的外側面裝配屏蔽殼金屬件4的組裝工序的分解立體圖。 FIG. 7 is an exploded perspective view showing an assembly process of attaching the shield case metal member 4 to the outer surface of the insulating case 2 shown in FIG. 6.
【圖8】是表示連接器10及配線基板20的連接的主要部分立體圖。 FIG. 8 is a perspective view of a main part showing the connection of the connector 10 and the wiring board 20.
【圖9】是表示一對差動端子腳部31a的各突出位置及第一接地圖案23A以及第二接地圖案23B的關係的主要部分放大後視圖。 FIG. 9 is an enlarged rear elevational view showing the relationship between the respective protruding positions of the pair of differential terminal leg portions 31a and the first ground pattern 23A and the second ground pattern 23B.
【圖10】是表示中間導電板5及使一對差動訊號端子31投影於中間導電板5上的投影區域7a、7b的關係的俯視圖。 FIG. 10 is a plan view showing the relationship between the intermediate conductive plate 5 and the projection regions 7a and 7b for projecting the pair of differential signal terminals 31 on the intermediate conductive plate 5.
【圖11】是表示從連接器10的背面側觀察的引腳分配的說明圖。 FIG. 11 is an explanatory view showing the pin assignment seen from the back side of the connector 10.
【圖12】是從正面側觀察以往的連接器100的立體圖。 FIG. 12 is a perspective view of the conventional connector 100 as seen from the front side.
【圖13】是從上方斜背面側觀察連接器100的分解立體圖。 Fig. 13 is an exploded perspective view of the connector 100 as seen obliquely from the upper side.
以下，使用圖1至圖11對本發明的一實施方式的連接器之連接構造1詳細地進行說明。如圖1所示，連接器之連接構造1是將連接器10連接於平行地配置於連接器10的背面的柔性配線基板(以下，稱為FPC)20的表面的構造，以下，對於各部分的說明，將與對方側插頭的連接方向的正面側(在圖1中為上方)作為前方，將背面側作為後方，將底面側(在圖1中為與紙面正交的進深方向)作為下方，將平面側作為上方進行說明。 Hereinafter, the connection structure 1 of the connector according to the embodiment of the present invention will be described in detail with reference to Figs. 1 to 11 . As shown in FIG. 1, the connector connection structure 1 is a structure in which the connector 10 is connected to the surface of a flexible wiring board (hereinafter referred to as FPC) 20 which is disposed in parallel on the back surface of the connector 10, and the following is for each part. In the description, the front side (upward in FIG. 1) of the connection direction of the counterpart plug is referred to as the front side, the back side is the rear side, and the bottom side (the depth direction orthogonal to the plane of the drawing in FIG. 1) is defined as the lower side. The plane side will be described as the upper side.
本實施方式的連接器10是遵循USB3.1規格的USB連接器， 如圖11所示，在由圖5所示的殼體主體2A、上部輔助殼體2B以及下部輔助殼體2C構成的絕緣殼體2，沿著上下二列的各AB列分別彼此絕緣地裝配有12根端子3(A1~A12)、3(B1~B12)。上部A列的兩側的A1及A12是被接地連接並形成接地電位的GND端子，A4及A9是供給5V直流電壓的Vbus端子，A5是以USB電力傳輸模式(USB power delivery mode)輸送較高電力的CC1端子，A8是二次匯流排的SBU1端子。 The connector 10 of the present embodiment is a USB connector conforming to the USB 3.1 specification. As shown in Fig. 11, the insulating case 2 composed of the case main body 2A, the upper auxiliary case 2B, and the lower auxiliary case 2C shown in Fig. 5 is separately insulated from each other along the respective AB columns of the upper and lower rows. There are 12 terminals 3 (A1~A12) and 3 (B1~B12). A1 and A12 on both sides of the upper column A are GND terminals that are grounded to form a ground potential, A4 and A9 are Vbus terminals that supply 5V DC voltage, and A5 is delivered in USB power delivery mode. The CC1 terminal of the power, A8 is the SBU1 terminal of the secondary bus.
此外，A6及A7是與遵循USB2.0以前的規格的USB插頭連接並收發數據的D+端子及D-端子，剩下的A2、A3以及A10、A11分別成對並成為以USB Super Speed模式或者USB Super Speed+模式高速地轉送數據的差動訊號端子3(以下，僅將差動訊號端子的圖式標記設為31)。其中，A2及A3是成對並高速地發送數據的TX1+端子31及TX1-端子31，在USB Super Speed+模式下，使8比特(bit)轉換成了10比特(bit)的高頻訊號在TX1+端子31及TX1-端子31中反相，並以最大640MB/s(5Gbps)的發送速度在發送方向流動。將編碼成10比特(bit)的數據以反相發送至鄰接地裝配於絕緣殼體2的TX1+端子31及TX1-端子31，藉此，即使從外部施加雜訊，也會相等地施加於兩者，能根據不受雜訊影響的兩者的電壓差對傳輸數據正確地進行解碼。此外，由於在一對TX1+端子31和TX1-端子31中流過彼此反向的電流，因此磁通被消除，由高頻訊號的高次諧波引起的EMI雜訊降低。 In addition, A6 and A7 are D+ terminals and D-terminals connected to a USB plug that conforms to the specifications before USB2.0, and the remaining A2, A3, and A10 and A11 are paired and become USB Super Speed mode or The USB Super Speed+ mode transfers the differential signal terminal 3 of the data at a high speed (hereinafter, only the pattern mark of the differential signal terminal is set to 31). Among them, A2 and A3 are TX1+ terminal 31 and TX1-terminal 31 which transmit data in pairs and transmit data at high speed. In USB Super Speed+ mode, 8 bits are converted into 10-bit high-frequency signals in TX1+ The terminal 31 and the TX1-terminal 31 are inverted, and flow in the transmission direction at a transmission speed of at most 640 MB/s (5 Gbps). The data encoded in 10 bits is inverted and transmitted to the TX1+ terminal 31 and the TX1-terminal 31 which are adjacently mounted to the insulating case 2, whereby even if noise is applied from the outside, it is equally applied to both The transmission data can be correctly decoded based on the voltage difference between the two that are not affected by the noise. Further, since currents which are opposite to each other flow in the pair of TX1+ terminal 31 and TX1-terminal 31, the magnetic flux is eliminated, and EMI noise caused by higher harmonics of the high-frequency signal is lowered.
A10及A11是成對並高速地接收數據的RX1-端子31及RX1+端子31，在USB Super Speed+模式下，同樣地使8比特(bit)轉換成了10比特(bit)的高頻訊號在RX1+端子31及RX1-端子31中反相，並以最大640MB/s(5Gbps)的發送速度在接收方向流動。亦即，在按照USB3.1規格工作的 USB Super Speed+模式下，將每一個通路的數據通訊線在收發的各方向各設一對並設為全雙工通訊，將在發送方向成對的TX1+端子31、TX1-端子31及在接收方向成對的RX1+端子31、RX1-端子31裝配於與GND端子鄰接的絕緣殼體2的左右兩側的彼此分離的位置，以便在進行收發的通訊訊號線間不產生高頻耦合。 A10 and A11 are RX1-terminal 31 and RX1+ terminal 31 that receive data in pairs and receive data at high speed. In USB Super Speed+ mode, 8-bit (bit) is converted into a 10-bit high-frequency signal at RX1+. The terminal 31 and the RX1-terminal 31 are inverted, and flow in the receiving direction at a transmission speed of at most 640 MB/s (5 Gbps). That is, working in accordance with the USB 3.1 specification In the USB Super Speed+ mode, the data communication lines of each channel are set in a pair in each direction of transmission and reception and set to full-duplex communication, which will be paired in the transmission direction of TX1+ terminal 31, TX1-terminal 31 and in the receiving direction. The pair of RX1+ terminals 31 and RX1-terminals 31 are mounted at positions separated from each other on the left and right sides of the insulating case 2 adjacent to the GND terminal so that high-frequency coupling does not occur between the communication signal lines for transmission and reception.
如圖5所示，A列的各端子3(A1~A12)在左右方向以等間距一體成形於由絕緣合成樹脂成形的上部輔助殼體2B，將上部輔助殼體2B從後方***殼體主體2A的凹部12，並沿著前後方向裝配於絕緣殼體2。在裝配於絕緣殼體2的狀態下，向上部輔助殼體2B的後方突出的各端子3(A1~A12)的腳部3a以與沿著絕緣殼體2的背面裝配的FPC20的表面對向的方式向上方折彎成直角。此外，如圖6所示，各端子3(A1~A12)的從上部輔助殼體2B向前方突出的前部沿著水平地向殼體主體2A的前方突出的支撐板部11的上表面露出，成為與沿著支撐板部11從前方***的對方側插頭接觸的接觸部3b。 As shown in Fig. 5, each of the terminals 3 (A1 to A12) of the row A is integrally molded at an equal interval in the left-right direction on the upper auxiliary casing 2B formed of an insulating synthetic resin, and the upper auxiliary casing 2B is inserted into the casing body from the rear. The recess 12 of 2A is fitted to the insulating case 2 in the front-rear direction. In the state of being mounted in the insulating case 2, the leg portions 3a of the respective terminals 3 (A1 to A12) protruding rearward of the upper auxiliary case 2B face the surface of the FPC 20 mounted along the back surface of the insulating case 2. The way to bend upwards into a right angle. Further, as shown in FIG. 6, the front portion of each of the terminals 3 (A1 to A12) projecting forward from the upper auxiliary casing 2B is exposed along the upper surface of the support plate portion 11 that protrudes horizontally toward the front of the casing main body 2A. The contact portion 3b that comes into contact with the counterpart plug inserted from the front along the support plate portion 11 is formed.
此外，下部B列的12根端子3(B1~B12)形成為與配置於左右對稱位置的上部A列的各端子3(A1~A12)相同的端子。即，B1及B12為GND端子，B4及B9為Vbus端子，B5為CC端子，B8為SBU端子，B6及B7為D+端子及D-端子，B2及B3為成對並高速地發送數據的TX2+端子31及TX2-端子31，B10及B11為成對並高速地接收數據的RX2-端子31及RX2+端子31。 Further, the twelve terminals 3 (B1 to B12) of the lower B row are formed as the same terminals as the respective terminals 3 (A1 to A12) arranged in the upper A column at the left-right symmetrical position. That is, B1 and B12 are GND terminals, B4 and B9 are Vbus terminals, B5 is a CC terminal, B8 is an SBU terminal, B6 and B7 are D+ terminals and D-terminals, and B2 and B3 are TX2+s that transmit data in pairs and transmit data at high speed. The terminal 31 and the TX2-terminal 31, B10 and B11 are the RX2-terminal 31 and the RX2+ terminal 31 that receive data in pairs and receive data at high speed.
如圖5所示，B列的各端子3(B1~B12)在左右方向以等間距一體成形於由絕緣合成樹脂成形的下部輔助殼體2C，將下部輔助殼體2C 從後方***上部輔助殼體2B的下方的殼體主體2A的凹部12，在A列的各端子3(A1~A12)的下方沿著前後方向裝配於絕緣殼體2。在裝配於殼體主體2A的狀態下，向下部輔助殼體2C的後方突出的各端子3(B1~B12)的腳部3a同樣以與FPC20的表面對向的方式向下方折彎成直角。此外，如圖6所示，各端子3(B1~B12)的從下部輔助殼體2C向前方突出的前部沿著水平地向殼體主體2A的前方突出的支撐板部11的下表面露出，成為與沿著支撐板部11從前方***的對方側插頭接觸的接觸部3b。 As shown in FIG. 5, each of the terminals 3 (B1 to B12) of the B row is integrally formed at a constant pitch in the left-right direction on the lower auxiliary casing 2C formed of an insulating synthetic resin, and the lower auxiliary casing 2C. The recessed portion 12 of the casing body 2A that is inserted into the lower portion of the upper auxiliary casing 2B from the rear is attached to the insulating casing 2 in the front-rear direction below the terminals 3 (A1 to A12) of the row A. In the state of being attached to the casing main body 2A, the leg portions 3a of the respective terminals 3 (B1 to B12) protruding rearward of the lower auxiliary casing 2C are bent downward at right angles so as to face the surface of the FPC 20. Further, as shown in FIG. 6, the front portion of each of the terminals 3 (B1 to B12) protruding forward from the lower auxiliary casing 2C is exposed along the lower surface of the support plate portion 11 that protrudes horizontally toward the front of the casing main body 2A. The contact portion 3b that comes into contact with the counterpart plug inserted from the front along the support plate portion 11 is formed.
藉此，沿著連接器10的支撐板部11***的對方側插頭即使呈與連接器10的各端子3接觸的電極露出於上表面及下表面的任一方的***姿勢，也與A列或者B列的任一方的對應端子3接觸。而且，如果是與上下的端子3(A1~A12)、3(B1~B12)均連接的對方側插頭，則能使用2個通路的8根數據通訊線路將有效最大傳送速率進一步變成兩倍的速度。在該情況下，上部A列的A2、A3的成對的TX1+端子31、TX1-端子31和A10、A11的成對的RX1-端子31、RX1+端子31分別在絕緣殼體2的上下，與下部B列的B10、B11的成對的RX2-端子31、RX2+端子31及B2、B3的成對的TX2+端子31、TX2-端子31接近，恐怕會相互進行高頻耦合。 Thereby, the counterpart plug inserted along the support plate portion 11 of the connector 10 is exposed to either of the upper surface and the lower surface even if the electrode that is in contact with each terminal 3 of the connector 10 is exposed to either the column A or The corresponding terminal 3 of either of the columns B is in contact. Further, if it is a counterpart plug that is connected to the upper and lower terminals 3 (A1 to A12) and 3 (B1 to B12), the effective maximum transfer rate can be further doubled by using eight data communication lines of two paths. speed. In this case, the pair of TX1+ terminals 31, TX1-terminal 31, and pairs of RX1-terminals 31 and RX1+ terminals 31 of A1 and A3 in the upper row A are respectively above and below the insulating case 2, and The pair of RX2-terminals 31, RX2+ terminals 31, and pairs of TX2+ terminals 31 and TX2-terminals 31 of B10 and B11 of the lower B-column are close to each other, and it is feared that high-frequency coupling is performed with each other.
因此，如後前述，在連接器10中，焊接於FPC20的第二接地圖案23B並接地的中間導電板5與A列及B列的各端子3絕緣，並水平地配設於絕緣殼體2的A列及B列的各端子3之間。中間導電板5是在使殼體主體2A成形時嵌件成形(insert molding)的，沿著水平面一體地裝配於包含支撐板部11的殼體主體2A的垂直方向的中間。藉此，扁平且厚度薄的支撐板部11的機械強度藉由剛性的中間導電板5得到加強。 Therefore, as described later, in the connector 10, the intermediate conductive plate 5 soldered to the second ground pattern 23B of the FPC 20 and grounded is insulated from the terminals 3 of the A and B columns, and horizontally disposed in the insulating housing 2 Between column A and column B of terminal 3. The intermediate conductive plate 5 is insert molded when the casing main body 2A is molded, and is integrally fitted to the middle of the casing main body 2A including the support plate portion 11 in the vertical direction along the horizontal plane. Thereby, the mechanical strength of the flat and thin support plate portion 11 is reinforced by the rigid intermediate conductive plate 5.
如圖10所示，在中間導電板5貫穿設置有許多的錨孔6，在嵌件成形至殼體主體2A時，流入錨孔6內的熔融樹脂固化，中間導電板5及殼體主體2A被牢固地-體化。錨孔6避開使裝配於絕緣殼體2的各一對差動訊號端子31在垂直方向投影於中間導電板5上的由圖中虛線表示的投影區域7a、7b而形成，貫穿設置於一對投影區域7a、7b的左右兩側的錨孔6的形狀及其位置以關於一對投影區域7a、7b對稱(symmetry)的方式形成。在此，在本實施方式中，所謂關於一對投影區域7a、7b對稱是指：關於將前後方向設為長尺寸方向的一對投影區域7a、7b之間的中心線呈線對稱。因此，一對各差動訊號端子31、31與其旁邊的貫穿設置有錨孔6的中間導電板5之間產生的寄生電容彼此幾乎相等，不產生由寄生電容的差分引起的共模電流。 As shown in FIG. 10, a plurality of anchor holes 6 are formed in the intermediate conductive plate 5, and when the insert is molded to the case main body 2A, the molten resin flowing into the anchor holes 6 is solidified, and the intermediate conductive plate 5 and the case main body 2A are solidified. It is firmly-bodyized. The anchor hole 6 is formed by avoiding the projection areas 7a and 7b indicated by broken lines in the figure in which the pair of differential signal terminals 31 mounted on the insulating case 2 are projected on the intermediate conductive plate 5 in the vertical direction. The shape and position of the anchor holes 6 on the left and right sides of the projection regions 7a, 7b are formed in a symmetry manner with respect to the pair of projection regions 7a, 7b. Here, in the present embodiment, the symmetry about the pair of projection regions 7a and 7b means that the center line between the pair of projection regions 7a and 7b having the longitudinal direction in the front-rear direction is line-symmetric. Therefore, the parasitic capacitances generated between the pair of differential signal terminals 31, 31 and the intermediate conductive plate 5 through which the anchor holes 6 are provided are almost equal to each other, and the common mode current caused by the difference of the parasitic capacitance is not generated.
此外，如圖7所示，埋設於支撐板部11的中間導電板5的輪廓與支撐板部11的左右的輪郭一致，如圖7所示，中間導電板5沿著支撐板部11的左右的兩個側面露出。中間導電板5在中間露出的支撐板部11的兩個側面的前方向左右的外側突出，成為與沿著支撐板部11從前方***的對方側插頭的未圖示的卡合凹部卡合的卡合突部8。藉由以金屬板形成的中間導電板5的兩個側面構成卡合突部8的一部分，卡合突部8與對方側插頭的卡合凹部可靠地卡合，而不會撓曲或者破損。此外，在對方側插頭的卡合凹部由設為接地電位的金屬板形成的情況下，在卡合突部8相對的中間導電板5的兩個側面也與卡合凹部抵接並接地。 Further, as shown in FIG. 7, the outline of the intermediate conductive plate 5 embedded in the support plate portion 11 coincides with the left and right wheels of the support plate portion 11, and as shown in FIG. 7, the intermediate conductive plate 5 is along the left and right sides of the support plate portion 11. The two sides are exposed. The intermediate conductive plate 5 protrudes outward in the front-rear direction of both side faces of the support plate portion 11 exposed in the middle, and is engaged with an engagement recess (not shown) that is inserted from the front side of the support plate portion 11 from the front side. The protrusion 8 is engaged. The two side faces of the intermediate conductive plate 5 formed of a metal plate constitute a part of the engagement projections 8, and the engagement projections 8 are reliably engaged with the engagement recesses of the counterpart plugs without being bent or broken. Further, when the engagement recessed portion of the counterpart plug is formed of a metal plate having a ground potential, both side faces of the intermediate conductive plate 5 facing the engagement projection 8 abut against the engagement recess and are grounded.
如圖5所示，中間導電板5以向殼體主體2A的後方開口的凹部2b的中間高度水平地裝配，上述一體成形有A列的各端子3(A1~A12) 的上部輔助殼體2B及一體成形有B列的各端子3(B1~B12)的下部輔助殼體2C分別被分至由中間導電板5隔開的凹部2b的上方及下方來進行容納。如圖6所示，上部輔助殼體2B及下部輔助殼體2C在其背面與凹部2b的周圍的殼體主體2A的背面在同一面連續的位置處藉由未圖示的卡定部來防止相對於後方脫落，絕緣殼體2的背面2D成為整體上沒有凹凸的垂直面。 As shown in Fig. 5, the intermediate conductive plate 5 is horizontally fitted at an intermediate height of the concave portion 2b opened to the rear of the casing main body 2A, and the terminals 3 (A1 to A12) of the A row are integrally formed as described above. The upper auxiliary casing 2B and the lower auxiliary casing 2C in which the terminals 3 (B1 to B12) of the B rows are integrally formed are respectively divided into upper and lower portions of the recess 2b partitioned by the intermediate conductive plate 5, and are accommodated. As shown in FIG. 6, the upper auxiliary casing 2B and the lower auxiliary casing 2C are prevented by a locking portion (not shown) at a position where the back surface of the casing main body 2A around the concave portion 2b is continuous on the same surface. The back surface 2D of the insulating case 2 is a vertical surface having no irregularities as a whole with respect to the rear side.
沿著上部A列及下部B列在左右方向以等間距裝配於絕緣殼體2的各12根端子3(A1~A12)、3(B1~B12)使各端子腳部3a從沿著前後方向裝配的絕緣殼體2的背面2D的突出位置突出。其中，對於高速轉送數據的差動訊號端子31，一對差動訊號端子31鄰接地裝配於絕緣殼體2，因此，如圖8所示，4對差動訊號端子31的差動端子腳部31a從分散於由中間導電板5隔成上部及下部的各部的左右兩側的4處的區域突出，成對的各差動端子腳部31a從各區域內的鄰接位置向後方突出。 Each of the twelve terminals 3 (A1 to A12) and 3 (B1 to B12) that are attached to the insulating case 2 at equal intervals in the left-right direction along the upper A column and the lower B column causes the terminal leg portions 3a to follow the front-rear direction. The protruding position of the back surface 2D of the assembled insulating housing 2 protrudes. In the differential signal terminal 31 for high-speed transfer data, a pair of differential signal terminals 31 are adjacently mounted to the insulative housing 2, and therefore, as shown in FIG. 8, the differential terminal portions of the four pairs of differential signal terminals 31 are provided. The 31a protrudes from the four regions on the left and right sides of the respective portions partitioned by the intermediate conductive plate 5 into the upper portion and the lower portion, and the pair of differential terminal leg portions 31a project rearward from the adjacent positions in the respective regions.
如圖7所示，為了焊接於沿著絕緣殼體2的背面裝配的FPC20的第二接地圖案23B，中間導電板5使板接地腳部50a、50b、50c、50d、50e、50f從絕緣殼體2的背面2D的6處位置向後方突出。各板接地腳部50a、50b、50c、50d、50e、50f在關於在其周圍突出的一對差動端子腳部31a的各突出位置對稱的第二接地連接位置從絕緣殼體2的背面突出。在此，在本說明書中，所謂關於一對差動端子腳部31a的各突出位置對稱是指：關於通過一對差動端子腳部31a的各突出位置的中點的垂直線呈線對稱的關係，或者在使一對差動端子腳部31a的各突出位置的一方以與另一方的突出位置重合的方式平行移動的情況下，關於重合的突出位置呈點對稱的關係。 As shown in FIG. 7, for soldering to the second ground pattern 23B of the FPC 20 mounted along the back surface of the insulating case 2, the intermediate conductive plate 5 causes the board grounding legs 50a, 50b, 50c, 50d, 50e, 50f from the insulating case The six positions of the back surface 2D of the body 2 protrude rearward. Each of the board grounding leg portions 50a, 50b, 50c, 50d, 50e, 50f protrudes from the back surface of the insulating housing 2 at a second ground connection position symmetrical with respect to each protruding position of the pair of differential terminal leg portions 31a projecting therearound. . Here, in the present specification, the symmetry about each protruding position of the pair of differential terminal leg portions 31a means that the vertical line with respect to the midpoint of each protruding position of the pair of differential terminal leg portions 31a is line symmetrical. In the case where the one of the respective protruding positions of the pair of differential terminal leg portions 31a is moved in parallel so as to overlap with the other protruding position, the protruding position of the overlapping is in a point symmetrical relationship.
即，板接地腳部50b的突出位置是關於通過上部A列的成對 的RX1-端子31的差動端子腳部31a的突出位置與RX1+端子31的差動端子腳部31a的突出位置的中點的垂直線呈左右線對稱的、距離任一突出位置均為等距離的位置，並且也是關於通過下部B列的成對的TX2+端子31的差動端子腳部31a的突出位置與TX2-端子31的差動端子腳部31a的突出位置的中點的垂直線呈左右對稱的位置。此外，板接地腳部50e的突出位置是關於通過上部A列的成對的TX1-端子31的差動端子腳部31a的突出位置與TX1+端子31的差動端子腳部31a的突出位置的中點的垂直線呈左右對稱的位置，並且也是關於通過下部B列的成對的RX2+端子31的差動端子腳部31a的突出位置與RX2-端子31的差動端子腳部31a的突出位置的中點的垂直線呈左右對稱的位置。亦即，在一對差動端子腳部31a的突出位置的周圍從絕緣殼體2的背面2D突出的板接地腳部50b、50e在與一對差動端子腳部31a的各突出位置為等距離的位置突出。 That is, the protruding position of the board grounding leg portion 50b is about the pair passing through the upper column A. The protruding position of the differential terminal leg portion 31a of the RX1-terminal 31 is symmetrical with respect to the vertical line of the midpoint of the protruding position of the differential terminal leg portion 31a of the RX1+ terminal 31, and is equidistant from any protruding position. The position of the differential terminal leg portion 31a of the pair of TX2+ terminals 31 passing through the lower column B is perpendicular to the vertical line of the midpoint of the protruding position of the differential terminal leg portion 31a of the TX2-terminal 31. Symmetrical position. Further, the protruding position of the board grounding leg portion 50e is in the middle of the protruding position of the differential terminal leg portion 31a of the pair of TX1-terminals 31 passing through the upper row A and the protruding position of the differential terminal leg portion 31a of the TX1+ terminal 31. The vertical line of the point is bilaterally symmetrical, and is also about the protruding position of the differential terminal leg portion 31a of the pair of RX2+ terminals 31 passing through the lower B column and the protruding position of the differential terminal leg portion 31a of the RX2-terminal 31. The vertical line of the midpoint is bilaterally symmetrical. In other words, the plate grounding leg portions 50b and 50e projecting from the rear surface 2D of the insulating case 2 around the protruding position of the pair of differential terminal leg portions 31a are at the respective protruding positions of the pair of differential terminal leg portions 31a. The location of the distance is outstanding.
在沿著上下2列的各AB列按各列裝配有12根端子3(A1~A12)、3(B1~B12)的絕緣殼體2的外周，裝配有將導電性金屬板折彎加工成橫向長的圓筒狀的屏蔽殼金屬件4。如圖7所示，向絕緣殼體2裝配屏蔽殼金屬件4是從屏蔽殼金屬件4的後方***絕緣殼體2，在絕緣殼體2的背面2D及屏蔽殼金屬件4的後端面一致的位置，將從屏蔽殼金屬件4的上面及底面的一部分切起的卡定爪41向絕緣殼體2的卡定孔13卡定來進行裝配。 The outer circumference of the insulating case 2 in which twelve terminals 3 (A1 to A12) and 3 (B1 to B12) are mounted in each column along the upper and lower two columns, and the conductive metal plate is bent and processed. A laterally long cylindrical shield metal member 4. As shown in FIG. 7, the shield case metal member 4 is attached to the insulating case 2, and the insulating case 2 is inserted from the rear of the shield case metal member 4, and the rear face 2D of the insulating case 2 and the rear end face of the shield case metal member 4 are identical. At the position, the locking claws 41 cut from a part of the upper surface and the bottom surface of the shield case metal member 4 are locked to the locking holes 13 of the insulating case 2 to be assembled.
在向絕緣殼體2裝配了屏蔽殼金屬件4的狀態下，在各端子3的接觸部3b在表面背面露出的支撐板部11的周圍隔著供對方側插頭***的嵌合凹部9而由筒狀的屏蔽殼金屬件4覆蓋，從沿著其後端面的環狀的8處位置朝向後方突出設置有焊接於FPC20的第一接地圖案23A的、構成屏蔽接地 連接部的屏蔽接地腳部40a~40h。各屏蔽接地腳部40a~40h在關於在其周圍從絕緣殼體2的背面突出的一對差動端子腳部31a的各突出位置對稱的第一接地連接位置向絕緣殼體2的後方突出。 In a state in which the shield case metal member 4 is attached to the insulating case 2, the contact portion 3b of each terminal 3 is surrounded by the fitting recess portion 9 into which the plug of the other side plug is inserted, around the support plate portion 11 exposed on the front and back surfaces. The tubular shield case metal member 4 is covered, and the first ground pattern 23A soldered to the FPC 20 is protruded from the annular 8 position along the rear end surface thereof to form a shield ground. The shield grounding leg portions 40a to 40h of the connecting portion. Each of the shield grounding leg portions 40a to 40h protrudes rearward of the insulating case 2 at a first ground connection position that is symmetrical with respect to each of the protruding positions of the pair of differential terminal leg portions 31a projecting from the rear surface of the insulating case 2 around the insulating case.
即，屏蔽接地腳部40b在距離上部A列的成對的RX1-端子31的差動端子腳部31a的突出位置和RX1+端子31的差動端子腳部31a的突出位置為等距離的周圍的位置突出，屏蔽接地腳部40d在距離上部A列的成對的TX1-端子31的差動端子腳部31a的突出位置及TX1+端子31的差動端子腳部31a的突出位置為等距離的周圍的位置突出。此外，屏蔽接地腳部40f在距離下部B列的成對的RX2+端子31的差動端子腳部31a的突出位置及RX2-端子31的差動端子腳部31a的突出位置為等距離的周圍的位置突出，屏蔽接地腳部40h在距離下部B列的成對的TX2+端子31的差動端子腳部31a的突出位置及TX2-端子31的差動端子腳部31a的突出位置為等距離的周圍的位置突出。即，在一對差動端子腳部31a的突出位置的周圍從絕緣殼體2的背面2D的周圍突出的屏蔽接地腳部40b、40d、40f、40h在分別與一對差動端子腳部31a的各突出位置為等距離的位置突出。 In other words, the shield grounding leg portion 40b is equidistant from the protruding position of the differential terminal leg portion 31a of the pair of RX1-terminals 31 in the upper row A and the protruding position of the differential terminal leg portion 31a of the RX1+ terminal 31. The position is protruded, and the shield grounding leg portion 40d is equidistant from the protruding position of the differential terminal leg portion 31a of the pair of TX1-terminals 31 in the upper row A and the protruding position of the differential terminal leg portion 31a of the TX1+ terminal 31. The position is outstanding. Further, the shield grounding leg portion 40f is equidistant from the protruding position of the differential terminal leg portion 31a of the pair of RX2+ terminals 31 of the lower B column and the protruding position of the differential terminal leg portion 31a of the RX2-terminal 31. The position is protruded, and the shield grounding leg portion 40h is equidistant from the protruding position of the differential terminal leg portion 31a of the pair of TX2+ terminals 31 of the lower B column and the protruding position of the differential terminal leg portion 31a of the TX2-terminal 31. The position is outstanding. In other words, the shield grounding leg portions 40b, 40d, 40f, and 40h projecting from the periphery of the back surface 2D of the insulating case 2 around the protruding position of the pair of differential terminal leg portions 31a are respectively paired with the pair of differential terminal leg portions 31a. Each prominent position is highlighted at an equidistant position.
從屏蔽殼金屬件4的後端面的兩側突出的屏蔽接地腳部40a、40e的中央部進一步向後方突出，***於FPC20的定位孔24，形成對連接器10及FPC20相對地進行定位的定位突起42。 The central portion of the shield grounding leg portions 40a, 40e protruding from both sides of the rear end surface of the shield case metal member 4 protrudes further rearward and is inserted into the positioning hole 24 of the FPC 20 to form a positioning position for the connector 10 and the FPC 20 to be relatively positioned. Protrusion 42.
如圖1、圖2所示，如這般構成的、對連接器10進行連接的FPC20使連接器10的絕緣殼體2的背面2D與使由訊號圖案22、第一接地圖案23A以及第二接地圖案23B構成的接地圖案露出的表面對向，並沿著背面2D進行裝配。 As shown in FIG. 1 and FIG. 2, the FPC 20 configured to connect the connector 10 such that the back surface 2D of the insulating case 2 of the connector 10 is made up of the signal pattern 22, the first ground pattern 23A, and the second The exposed surface of the ground pattern formed by the ground pattern 23B faces and is assembled along the back surface 2D.
FPC20由多層基板構成，在表面露出的第一接地圖案23A以及第二接地圖案23B通過通孔(through hole)等與將FPC20的表面側作為上層並形成於背面側的最下層的接地電位的接地層21電連接。接地層21均勻地形成於至少包圍所連接的連接器10的後方的FPC20的末端部(參照圖8)，由此包含差動訊號端子31的連接部的絕緣殼體2的背面2D的後方通過接地層21而被阻隔。露出至表面的各訊號圖案22彼此絕緣，並介由與接地層21不同的中間導電層被引出。 The FPC 20 is composed of a multilayer substrate, and the first ground pattern 23A and the second ground pattern 23B exposed on the surface are connected to the ground potential of the lowermost layer formed on the back side by the surface of the FPC 20 by a through hole or the like. The formation 21 is electrically connected. The ground layer 21 is uniformly formed at a distal end portion of the FPC 20 (refer to FIG. 8) surrounding at least the rear of the connected connector 10, whereby the rear side of the back surface 2D of the insulating case 2 including the connection portion of the differential signal terminal 31 passes. The ground layer 21 is blocked. The signal patterns 22 exposed to the surface are insulated from each other and are led out through an intermediate conductive layer different from the ground layer 21.
如上前述，連接器10和FPC20是將從屏蔽殼金屬件4的左右兩側突出的定位突起42***貫穿設置於FPC20的2處位置的定位孔24來相對地進行定位，在已定位的狀態下，露出至FPC20的表面的訊號圖案22、第一接地圖案23A以及第二接地圖案23B以分別焊接於對應的端子3(差動訊號端子31)的腳部3a(差動端子腳部31a)、屏蔽殼金屬件4的屏蔽接地腳部40a~40h以及中間導電板5的板接地腳部50a~50f的方式，形成於與各腳部的突出位置對向的位置。 As described above, the connector 10 and the FPC 20 are relatively positioned by inserting the positioning projections 42 projecting from the left and right sides of the shield case metal member 4 through the positioning holes 24 provided at the two positions of the FPC 20, in the positioned state. The signal pattern 22, the first ground pattern 23A, and the second ground pattern 23B exposed to the surface of the FPC 20 are respectively soldered to the leg portion 3a (differential terminal leg portion 31a) of the corresponding terminal 3 (differential signal terminal 31), The shield grounding leg portions 40a to 40h of the shield case metal member 4 and the plate grounding leg portions 50a to 50f of the intermediate conductive plate 5 are formed at positions facing the protruding positions of the respective leg portions.
需要說明的是，在本實施方式中，將焊接差動端子腳部31a的訊號圖案22用圖式標記22'表示，將形成於一對差動端子腳部31a的各突出位置的周圍的第一接地圖案23A及第二接地圖案23B分別用附圖標記23A'及圖式標記23B'表示。 In the present embodiment, the signal pattern 22 for soldering the differential terminal leg portion 31a is indicated by a reference numeral 22 ' , and is formed around the respective protruding positions of the pair of differential terminal leg portions 31a. A ground pattern 23A and a second ground pattern 23B are denoted by reference numeral 23A ' and the pattern mark 23B ' , respectively.
因此，屏蔽接地腳部40b、40d、40f、40h焊接於在其突出位置對向的FPC20的第一接地圖案23A並被接地，所以屏蔽殼金屬件4的接地位置也是與一對差動端子腳部31a的各突出位置的距離形成等距離的位置。而且，在一對差動端子腳部31a的各突出位置的周圍焊接於屏蔽接地腳 部40b、40d、40f、40h的第一接地圖案23A'的圖案形狀以關於一對差動端子腳部31a的各突出位置對稱的方式，在此，形成為關於通過各突出位置的中點的垂直線呈對稱形狀的橫向長的長方形，因此一對差動訊號端子31與屏蔽接地腳部40b、40d、40f、40h或者第一接地圖案23A'之間產生的寄生電容幾乎相等，即使在一對差動訊號端子31間流過反相的高頻訊號，也不產生共模雜訊。 Therefore, the shield grounding leg portions 40b, 40d, 40f, 40h are soldered to the first ground pattern 23A of the FPC 20 opposed to the protruding position thereof and grounded, so that the grounding position of the shield case metal member 4 is also a pair of differential terminal pins. The distances of the respective protruding positions of the portion 31a form equidistant positions. Further, the pattern shape of the first ground pattern 23A ' of the shield grounding leg portions 40b, 40d, 40f, 40h is welded around the respective protruding positions of the pair of differential terminal leg portions 31a with respect to the pair of differential terminal leg portions 31a. Each of the protruding positions is symmetrical, and is formed in a laterally long rectangular shape that is symmetrical with respect to a vertical line passing through a midpoint of each protruding position, so that the pair of differential signal terminals 31 and the shield grounding legs 40b, 40d, The parasitic capacitances generated between 40f, 40h or the first ground pattern 23A ' are almost equal, and even if an inverted high frequency signal flows between a pair of differential signal terminals 31, no common mode noise is generated.
同樣地，由於板接地腳部50b、50e焊接於在其突出位置對向的FPC20的第二接地圖案23B並被接地，因此中間導電板5的接地位置也是與一對差動端子腳部31a的各突出位置的距離形成等距離的位置。而且，在一對差動端子腳部31a的各突出位置的周圍焊接於板接地腳部50b、50e的第二接地圖案23B'的圖案形狀也形成為關於一對差動端子腳部31a的各突出位置對稱的橫向長的長方形，因此一對差動訊號端子31與板接地腳部50b、50e或者第二接地圖案23B'之間產生的寄生電容幾乎相等，即使在一對差動訊號端子31間流過反相的高頻訊號，也不產生共模雜訊。 Similarly, since the board grounding leg portions 50b, 50e are soldered to the second ground pattern 23B of the FPC 20 opposed to the protruding position thereof and grounded, the grounding position of the intermediate conductive plate 5 is also the same as that of the pair of differential terminal leg portions 31a. The distance of each protruding position forms an equidistant position. Further, the pattern shape of the second ground pattern 23B ' soldered to the board grounding leg portions 50b and 50e around the respective protruding positions of the pair of differential terminal leg portions 31a is also formed for each of the pair of differential terminal leg portions 31a. The laterally long rectangular shape is symmetrically protruded, so that the parasitic capacitance generated between the pair of differential signal terminals 31 and the board grounding leg portions 50b, 50e or the second ground pattern 23B ' is almost equal even in the pair of differential signal terminals 31. The high frequency signal that flows through the inversion does not generate common mode noise.
此外，在上述實施方式中，對避開使各對差動訊號端子31在垂直方向上向中間導電板5投影的圖10的虛線所示的各投影區域7a、7b而貫穿設置錨孔6的例子進行了說明，但只要是錨孔6的位置及形狀關於各投影區域7a、7b對稱，錨孔6的一部分或者全部也可以貫穿設置於各投影區域7a、7b，由此與貫穿設置有錨孔6的中間導電板5之間產生的寄生電容彼此幾乎相等，不產生由寄生電容的差分引起的共模電流。 Further, in the above-described embodiment, the anchor holes 6 are bored in the respective projection regions 7a and 7b shown by the broken lines in FIG. 10 in which the respective pairs of the differential signal terminals 31 are projected in the vertical direction toward the intermediate conductive plate 5. Although the example has been described, as long as the position and shape of the anchor hole 6 are symmetrical with respect to the respective projection areas 7a and 7b, a part or all of the anchor hole 6 may be provided through each of the projection areas 7a and 7b, thereby providing an anchor with the insertion. The parasitic capacitances generated between the intermediate conductive plates 5 of the holes 6 are almost equal to each other, and a common mode current caused by the difference of the parasitic capacitance is not generated.
上述實施方式中，以將柔性印刷配線板用作配線基板的例子進行了說明，但也可以是剛性基板。 In the above embodiment, the flexible printed wiring board has been described as an example of a wiring board, but a rigid board may be used.
此外，以遵循USB3.1規格的USB插口對上述連接器10進行了說明，但只要是至少在鄰接地配置於絕緣殼體的至少一對端子流過反相的高頻訊號的連接器，就能夠適用本發明。 Further, although the connector 10 has been described with a USB socket conforming to the USB 3.1 standard, as long as it is a connector in which at least a pair of terminals disposed adjacent to each other of the insulating case flow through the inverted high-frequency signal, The present invention can be applied.
因此，在連接器10中，也可以不具備上述實施方式中說明的中間導電板5。 Therefore, the intermediate conductive plate 5 described in the above embodiment may not be provided in the connector 10.
本發明適於將在一對端子流過反相的高頻訊號而消除雜訊的連接器連接於配線基板的連接器之連接構造。 The present invention is suitable for a connection structure of a connector in which a connector for eliminating noise by flowing a reversed high frequency signal to a pair of terminals is connected to a wiring board.
Claims (6)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2015/004930 WO2017056127A1 (en) | 2015-09-29 | 2015-09-29 | Connection structure for connector |
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| TW201712975A TW201712975A (en) | 2017-04-01 |
| TWI618318B true TWI618318B (en) | 2018-03-11 |
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| JP (1) | JP6436162B2 (en) |
| CN (1) | CN108352659B (en) |
| TW (1) | TWI618318B (en) |
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| TWI627803B (en) * | 2017-04-24 | 2018-06-21 | Use the grounding pin of the grounding piece to reduce the signal interference between the two rows of terminals | |
| JP7007180B2 (en) * | 2017-12-26 | 2022-01-24 | シーシーエス株式会社 | Luminescent device |
| CN110391538A (en) * | 2018-04-20 | 2019-10-29 | 安波福中央电气（上海）有限公司 | Electrical cnnector and its manufacturing method |
| CN112838444A (en) * | 2019-11-05 | 2021-05-25 | 沈晓萱 | Connector capable of reducing signal interference |
| JP7402746B2 (en) * | 2020-05-28 | 2023-12-21 | ヒロセ電機株式会社 | Charging connector unit |
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| JP2009231053A (en) * | 2008-03-24 | 2009-10-08 | Tyco Electronics Amp Kk | Electrical connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2006260836A (en) * | 2005-03-15 | 2006-09-28 | Fci Asia Technology Pte Ltd | Electric connector |
| JP2007080782A (en) * | 2005-09-16 | 2007-03-29 | Japan Aviation Electronics Industry Ltd | Electric connector |
| JP5063713B2 (en) * | 2010-01-28 | 2012-10-31 | 日本航空電子工業株式会社 | connector |
| US9240638B2 (en) * | 2011-03-17 | 2016-01-19 | Molex, Llc | Mezzanine connector with terminal brick |
| JP5696698B2 (en) * | 2012-08-23 | 2015-04-08 | Smk株式会社 | Receptacle connector |
| CN203859275U (en) * | 2014-05-30 | 2014-10-01 | 莫列斯公司 | Electrical connector |
| CN104505616A (en) * | 2014-12-11 | 2015-04-08 | 连展科技电子（昆山）有限公司 | Electric socket connector |
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| JP2009231053A (en) * | 2008-03-24 | 2009-10-08 | Tyco Electronics Amp Kk | Electrical connector |
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| CN108352659B (en) | 2019-06-11 |
| JP6436162B2 (en) | 2018-12-12 |
| JPWO2017056127A1 (en) | 2018-03-22 |
| CN108352659A (en) | 2018-07-31 |
| TW201712975A (en) | 2017-04-01 |
| WO2017056127A1 (en) | 2017-04-06 |
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