WO2017034295A1 - 열가소성 수지 조성물 및 이로부터 제조된 성형품 - Google Patents
열가소성 수지 조성물 및 이로부터 제조된 성형품 Download PDFInfo
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- WO2017034295A1 WO2017034295A1 PCT/KR2016/009307 KR2016009307W WO2017034295A1 WO 2017034295 A1 WO2017034295 A1 WO 2017034295A1 KR 2016009307 W KR2016009307 W KR 2016009307W WO 2017034295 A1 WO2017034295 A1 WO 2017034295A1
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- resin composition
- thermoplastic resin
- acid
- inorganic filler
- dicarboxylic acid
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Definitions
- the present invention relates to a thermoplastic resin composition and a molded article produced therefrom. More specifically, the present invention relates to a polyamide-based thermoplastic resin composition and a molded article produced therefrom having excellent heat resistance and impact resistance while improving plating adhesion.
- Thermoplastic resins have a lower specific gravity than glass or metals, and in particular, polyamides among thermoplastic resins have excellent performances such as heat resistance, abrasion resistance, and chemical resistance, and thus are areas of glass and metals including electric and electronic products and automobile parts. Is quickly replacing.
- the plating treatment on the polyamide resin is intended for decoration, corrosion resistance, and the like, and the appearance characteristics after plating and the adhesion between the plating film and the resin (plating properties) are important characteristics.
- the coating property was improved by adding an inorganic material to the polyamide resin composition, but there was a limitation in the applicable use due to the decrease in the impact strength.
- the polyolefin having an epoxy group was added to the polyamide resin composition. The improvement in impact strength was still limited.
- ABS acrylonitrile-butadiene-styrene
- An object of the present invention is to provide a thermoplastic resin composition and a molded article produced therefrom having improved plating adhesion by using an optimal polyamide resin and an impact modifier.
- Another object of the present invention is to add an inorganic filler having an optimum combination, to ensure excellent appearance, to provide a thermoplastic resin composition with improved physical properties such as impact resistance, heat resistance and plating properties, and molded articles produced therefrom. It is for.
- thermoplastic resin composition comprises (A) about 20 to about 70 weight percent of an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) about 0.1 to about 20 weight percent of olefinic copolymer; And (C) about 10 to about 60 weight percent of the inorganic filler.
- the aromatic polyamide resin (A) may include terephthalic acid and isophthalic acid as aromatic dicarboxylic acid units.
- the aromatic polyamide resin (A) may include the terephthalic acid and the isophthalic acid in a weight ratio of about 6: about 4 to about 8: about 2.
- the aromatic polyamide resin (A) may have a glass transition temperature of about 110 to about 135 °C.
- the aromatic polyamide resin (A) may comprise hexamethylene terephthalamide and hexamethylene isophthalamide.
- the olefin copolymer (B) is an ethylene- ⁇ -olefin copolymer; Or a modified ethylene- ⁇ -olefin copolymer wherein the ethylene- ⁇ -olefin copolymer is modified with at least one compound of ⁇ , ⁇ -unsaturated dicarboxylic acid and ⁇ , ⁇ -unsaturated dicarboxylic acid derivative. have.
- At least one compound of the ⁇ , ⁇ -unsaturated dicarboxylic acid and ⁇ , ⁇ -unsaturated dicarboxylic acid derivatives may be maleic acid, maleic anhydride, maleic hydrazide, dichloro male One or more of acid anhydrides, unsaturated dicarboxylic acids, fumaric acid, citric acid, and citric anhydride.
- the olefin copolymer (B) may include a maleic anhydride modified ethylene-octene copolymer.
- the inorganic filler (C) is a first inorganic filler containing at least one of calcium carbonate, talc, mica and wollastonite; A second inorganic filler comprising at least one of glass fibers, glass beads, and glass flakes; Or mixtures thereof.
- the inorganic filler may include the first inorganic filler and the second inorganic filler in a weight ratio of about 1: about 1 to about 1: about 5.
- Another aspect of the present invention relates to a molded article prepared from the thermoplastic resin composition.
- the molded article may have a plating adhesion measured from about 1 cm to about 15 N / cm, based on JIS C6481, about 10 cm ⁇ 10 cm ⁇ 3.2 mm specimens.
- thermoplastic resin composition according to the present invention has a merit that the plating adhesion is remarkably improved by using a polyamide resin containing at least two aromatic dicarboxylic acids as a repeating unit and an optimal impact modifier, thereby easily plating.
- thermoplastic resin composition having improved impact resistance, heat resistance, and plating property, and a molded article manufactured therefrom, while securing an excellent appearance by adding two kinds of inorganic fillers in combination.
- thermoplastic resin composition according to the present invention comprises (A) an aromatic polyamide resin comprising at least two aromatic dicarboxylic acid units; (B) an olefin copolymer; And (C) an inorganic filler.
- the aromatic polyamide resin according to one embodiment of the present invention includes at least two aromatic dicarboxylic acid units.
- the aromatic polyamide resin may be a copolymer, terpolymer or more polymer formed from monomers containing aromatic groups, wherein the term copolymer is used to repeat two or more amide and / or diamide molecular repeating units.
- the aromatic polyamide resin is a structure containing an aromatic compound in the main chain, dicarboxylic acid monomer containing about 10 to about 100 mol% of aromatic dicarboxylic acid (aromatic dicarboxylic acid) It can be prepared by polycondensation of a monomer consisting of (monomer) and aliphatic diamine or alicyclic diamine.
- aromatic dicarboxylic acid may have 4 to 20 carbon atoms
- the aromatic dicarboxylic acid monomer contains an aromatic benzene ring in a molecule, for example, terephthalic acid or isophthalic acid. (isophthalic acid), but is not limited thereto.
- the aromatic polyamide resin may include repeating units made from dicarboxylic acid units and aliphatic or alicyclic diamine units, and the dicarboxylic acid units may include 10 to 100 mol% of aromatic dicarboxylic acid units. have.
- the aromatic dicarboxylic acid unit is terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4 -Phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid, 4,4'-oxydibenzoic acid, diphenylmethane-4,4'-dicarboxylic acid, diphenylsulfone-4,4 '-Dicarboxylic acid, 4,4'-biphenyldicarboxylic acid, combinations thereof, and the like.
- the aromatic dicarboxylic acid unit may include terephthalic acid and isophthalic acid, and specifically, terephthalic acid and isophthalic acid may be included in a weight ratio of about 6: about 4 to about 8: about 2.
- terephthalic acid and isophthalic acid may be included in a weight ratio of about 6: about 4 to about 8: about 2.
- the dicarboxylic acid unit may further include units derived from non-aromatic dicarboxylic acids in addition to the aromatic dicarboxylic acid units.
- the non-aromatic dicarboxylic acid may be an aliphatic or alicyclic dicarboxylic acid.
- the non-aromatic dicarboxylic acid may be malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, trimethyladipic acid, pimelic acid, 2,2-dimethylglutar Aliphatic dicarboxylic acids such as acid, 2,2-diethylsuccinic acid, azelaic acid, sebacic acid, and suveric acid; Or alicyclic dicarboxylic acids such as 1,3-cyclopentanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid; And the like. Units derived from such non-aromatic dicarboxylic acids may be used alone or in combination of two or more thereof.
- the content of the non-aromatic dicarboxylic acid unit in the dicarboxylic acid unit may be about 90 mol% or less, for example, 80 mol% or less, specifically 70 mol% or less, and more specifically 60 mol% or less.
- the aliphatic diamine units may be derived from aliphatic alkylene diamines having 4 to 18 carbon atoms, and the aliphatic alkylene diamines having 4 to 18 carbon atoms include 1,6-hexanediamine, 1,7-heptane diamine, Linear aliphatic alkylenediamines such as 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine and 1,12-dodecanediamine; 1-butyl-1,2-ethanediamine, 1,1-dimethyl-1,4-butanediamine, 1-ethyl-1,4-butanediamine, 1,2-dimethyl-1,4-butanediamine, 1, 3-dimethyl-1,4-butanediamine, 1,4-dimethyl-1,4-butanediamine, 2,3-dimethyl-1,4-butanediamine, 2-methyl-1,5-pentanediamine, 3- Methyl-1,
- the aliphatic diamine unit is 1,6-hexanediamine, 1,7-heptane diamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, 1-butyl- 1,2-ethanediamine, 1,1-dimethyl-1,4-butanediamine, 1-ethyl-1,4-butanediamine, 1,2-dimethyl-1,4-butanediamine, 1,3-dimethyl- 1,4-butanediamine, 1,4-dimethyl-1,4-butanediamine, 2,3-dimethyl-1,4-butanediamine, 2-methyl-1,5-pentanediamine, 3-methyl-1, 5-pentanediamine, 2,5-dimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 3,3-dimethyl-1,6-hexanediamine, 2,2-dimethyl- 1,6-hexanediamine, 2,2,4-trimethyl-1,6-hexan
- the aromatic polyamide resin is a polyamide consisting of hexamethylene terephthalamide and hexamethylene isophthalamide, polyamide or hexamethylene terephthalamide, and 2-methylpentamethylene, consisting of hexamethylene terephthalamide and hexamethylene adipamide.
- the aromatic polyamide resin may be a polyamide composed of hexamethylene terephthalamide and hexamethylene isophthalamide.
- the thermoplastic resin composition including the aromatic polyamide resin may maintain excellent heat resistance and impact resistance while improving plating adhesion and plating property.
- the glass transition temperature (Tg) of the aromatic polyamide resin may be about 110 to about 135 °C, for example, about 115 to about 130 °C. In the above range, the thermoplastic resin composition may have excellent heat resistance, plating properties, and the like.
- the molecular weight of the aromatic polyamide resin is not particularly limited, and the intrinsic viscosity (IV) measured by a Ubbelodhde viscometer in a sulfuric acid solution at about 25 ° C. is about 0.75 dL / g or more, eg For example, about 0.75 to 1.15 dL / g can be used.
- the aromatic polyamide resin may be included in an amount of about 20 wt% to about 70 wt%, such as about 40 wt% to about 60 wt%, based on 100 wt% of the total thermoplastic resin composition.
- the content of the aromatic polyamide resin is out of the above range, there is a fear that the heat resistance, mechanical strength and the like of the thermoplastic resin composition are lowered.
- the olefin copolymer according to one embodiment of the present invention may be introduced into a thermoplastic resin composition to improve adhesion (plating property) between the molded article and the plated film during a plating process on a molded article made of the resin composition.
- the olefin copolymer may be a copolymer polymerized with an olefin monomer or a copolymer of an olefin monomer and an acrylic monomer.
- alkylene having 1 to 19 carbon atoms may be used as the olefin monomer.
- ethylene, propylene, isopropylene, butylene, isobutylene or octene can be used, and these can be used individually or in mixture.
- the (meth) acrylic acid alkyl ester or (meth) acrylic acid ester may be used as the acrylic monomer.
- alkyl refers to C1 to C10 alkyl
- specific examples of the (meth) acrylic acid alkyl ester include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and butyl (meth).
- Acrylate and the like specifically, may be methyl (meth) acrylate.
- the olefin copolymer is ethylene- ⁇ -olefin copolymer; Or a modified ethylene- ⁇ -olefin copolymer wherein the ethylene- ⁇ -olefin copolymer is modified with at least one compound of ⁇ , ⁇ -unsaturated dicarboxylic acid or ⁇ , ⁇ -unsaturated dicarboxylic acid derivative.
- a modified ethylene- ⁇ -olefin copolymer wherein the ethylene- ⁇ -olefin copolymer is modified with at least one compound of ⁇ , ⁇ -unsaturated dicarboxylic acid or ⁇ , ⁇ -unsaturated dicarboxylic acid derivative.
- At least one compound of the ⁇ , ⁇ -unsaturated dicarboxylic acid and ⁇ , ⁇ -unsaturated dicarboxylic acid derivatives may be maleic acid, maleic anhydride, maleic hydrazide, dichloro male Acid anhydrides, unsaturated dicarboxylic acids, fumaric acid, citric acid, citric anhydride, combinations thereof, and the like.
- it may be maleic acid or maleic anhydride.
- maleic anhydride modified ethylene-octene copolymer may be used as the olefin copolymer.
- compatibility of a thermoplastic resin composition, plating adhesion, etc. can be improved further.
- the olefin copolymer may be included in an amount of about 0.1 wt% to about 20 wt%, such as about 3 wt% to about 18 wt%, based on 100 wt% of the total thermoplastic resin composition.
- the content of the olefin copolymer is less than about 0.1% by weight, it may be difficult to improve the plating property or plating adhesion of the thermoplastic resin composition, and when it exceeds about 20% by weight, it is uneconomical and the impact strength of the thermoplastic resin composition The improvement effect is no longer increased, but there is a concern that other physical properties such as heat resistance and rigidity are lowered.
- Inorganic filler according to an embodiment of the present invention may be added to ensure the excellent appearance and plating adhesion of the thermoplastic resin composition at the same time, to ensure the desired level of mechanical strength.
- the inorganic filler may include a first inorganic filler, a second inorganic filler, or a mixture thereof.
- the inorganic fillers are distinguished by naming them as 'first' and 'second', respectively, but are terms for distinguishing types of inorganic fillers and do not affect the interpretation of the scope of rights.
- the first inorganic filler may include calcium carbonate, talc, mica, wollastonite, combinations thereof, and the like.
- calcium carbonate or the like can be used.
- the calcium carbonate may have a structure such as amorphous calcium carbonate, aragonite or calcite, and the average particle diameter of the calcium carbonate may be about 0.05 to about 300 ⁇ m.
- the particle size of the particle is quantified by a measurement method to express the average size of the population, it is used universally, the mode diameter representing the maximum value of the distribution, the median diameter corresponding to the median value of the integral distribution curve, Various average diameters (number average, length average, area average, mass average, volume average, etc.), and the like, in the present invention, unless otherwise specified, the average particle diameter is the number average particle diameter, and D50 (the point where the distribution ratio is 50%). Particle diameter).
- the second inorganic filler may include glass fibers, glass beads, glass flakes, combinations thereof, and the like.
- glass fiber or the like can be used.
- the glass fiber is a conventional one used in the art, it may be used with a diameter of about 8 to about 20 ⁇ m, length of about 1.5 to about 8 mm.
- the diameter of the glass fiber is in the above range, it is possible to realize the effect of excellent strength reinforcement, when the length of the glass fiber is in the above range, it is easy to put into the processing equipment such as an extruder, the strength reinforcing effect of the thermoplastic resin composition is also greatly Can be improved.
- the glass fibers may be used in combination with fibers such as carbon fibers, basalt fibers, fibers made from biomass, and combinations thereof.
- the biomass means a living organism using a plant or microorganism as an energy source.
- the glass fiber may be a circular cross-section, elliptical, rectangular or a dumbbell-shaped two connected two circles.
- the glass fiber may have an aspect ratio of less than about 1.5, and for example, a circular cross-sectional glass fiber of 1 may be used.
- the aspect ratio is then defined as the ratio of the longest diameter to the smallest diameter in the cross section of the glass fiber.
- the glass fiber may be surface treated with a predetermined sizing agent to prevent the reaction with the resin and to improve the degree of impregnation.
- Surface treatment of the glass fiber may be performed at the time of glass fiber production or in a later step.
- inorganic fillers by using two kinds of inorganic fillers can improve the appearance characteristics and plating properties at the same time.
- the inorganic filler includes the first inorganic filler and the second inorganic filler in a weight ratio of about 1: about 1 to about 1: about 5, for example, about 1: about 1.5 to about 1: about 4. can do. In the above range may be excellent in appearance characteristics, mechanical strength, plating adhesion and the like of the thermoplastic resin composition.
- the inorganic filler may be included in an amount of about 10 wt% to about 60 wt%, such as about 20 wt% to about 55 wt%, based on 100 wt% of the thermoplastic resin composition.
- the content of the inorganic filler is out of the above range, there is a fear that the appearance characteristics, mechanical strength, plating adhesion and the like of the thermoplastic resin composition is lowered.
- the thermoplastic resin composition according to one embodiment of the present invention may further include an additive optionally according to its use.
- the additive may further include a flame retardant, a lubricant, a plasticizer, a heat stabilizer, an antioxidant, a light stabilizer, a colorant, and the like, and may be used by mixing two or more kinds according to the properties of the final molded product.
- the flame retardant is a material for reducing combustibility, and includes a phosphate compound, a phosphite compound, a phosphonate compound, a polysiloxane, a phosphazene compound, a phosphinate compound or a melamine compound It may include at least one of, but is not limited thereto.
- the lubricant is a material that helps the flow or movement of the resin composition by lubricating the metal surface in contact with the thermoplastic resin composition during processing, molding, extrusion, may be used a commonly used material.
- the plasticizer is a material that increases the flexibility, processing workability, or expandability of the thermoplastic resin composition, and a material commonly used may be used.
- the heat stabilizer is a material that suppresses thermal decomposition of the thermoplastic resin composition when kneading or molding at a high temperature, a material commonly used may be used.
- the antioxidant is a substance which prevents decomposition of the resin composition and loss of intrinsic properties by inhibiting or blocking a chemical reaction between the thermoplastic resin composition and oxygen, and among the phenol type, phosphite type, thioether type or amine type antioxidants It may include at least one, but is not limited thereto.
- the light stabilizer is a material that inhibits or blocks the decomposition of the thermoplastic resin composition from ultraviolet rays and changes color or loss of mechanical properties.
- titanium oxide may be used.
- the colorant may be used conventional pigments or dyes.
- the additive may be included in an amount of about 1 to about 15 parts by weight based on about 100 parts by weight of the thermoplastic resin composition consisting of (A) + (B) + (C).
- thermoplastic resin composition according to one embodiment of the present invention may be prepared by a known method for preparing a resin composition.
- it may be prepared in the form of pellets by mixing the components of the present invention and other additives at the same time and then melt extruding in an extruder.
- the molded article according to the present invention can be produced from the above-mentioned thermoplastic resin composition.
- the thermoplastic resin composition of the present invention is excellent in heat resistance, impact resistance and plating properties, and can be applied to a molded article requiring excellent heat resistance, impact resistance and plating properties without limitation. Specifically, it may be used as an interior material or exterior material for automobiles, and in particular, may be plated on the molded product, and may be used by replacing a metal with a tail trim component for automobiles.
- thermoplastic resin compositions of the following Examples and Comparative Examples are as follows.
- the components shown in Table 1 below were added to a mixer and dry mixed. Then, the L / D was 45 and ⁇ was 44 mm in a twin screw extruder, and a pellet-type thermoplastic resin composition was prepared through the extruder. The prepared pellets were prepared for the evaluation of physical properties using a 10oz injection molding machine set at 330 ° C.
- Plating adhesion, roughness after etching (Ra), plating lifting force, impact strength, and heat deformation temperature were measured for the thermoplastic resin compositions of Examples 1 to 7 and Comparative Examples 1 to 5, and the plating properties, impact resistance, and heat resistance were measured. Evaluated.
- the evaluation method of the evaluation item is as follows, and the evaluation result of each item is described in Table 2.
- Plating adhesion (N / cm): The plating adhesion was measured using a 10 cm ⁇ 10 cm ⁇ 3.2 mm specimen in accordance with JIS C6481.
- Hot plating blister (with / without): After leaving the specimen for 10 cm ⁇ 10 cm ⁇ 3.2 mm at 250 ° C. for 7 days, the presence or absence of blister was confirmed.
- Izod impact strength (kgfcm / cm): measured in accordance with ASTM D256 for 1/8 "notched specimens.
- Example Comparative example One 2 3 4 5 6 7 One 2 3 4 5 Plating adhesion (N / cm) 5 11 6 10 8 11 6 0.4 0.4 0.2 2 3 Ra (nm) after etching 243 300 320 370 350 480 230 180 168 134 187 198 High Temperature Plating Lift radish radish radish radish radish radish radish radish radish radish U U U U U U U U U Izod impact strength 6.9 10.9 8.3 10.0 12.7 17.0 12.5 5.1 5.5 5.3 11.2 9.9 Heat deflection temperature 281 275 284 278 278 270 274 285 269 288 261 279
- thermoplastic resin composition according to Examples 1 to 7 From Table 1 and Table 2, in the case of the thermoplastic resin composition according to Examples 1 to 7, it can be seen that the plating properties, impact resistance and heat resistance are all excellent.
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Abstract
Description
실시예 | 비교예 | |||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 1 | 2 | 3 | 4 | 5 | |
(a-1) | 55 | 50 | 55 | 50 | 60 | 55 | 60 | 60 | - | - | - | - |
(a-2) | - | - | - | - | - | - | - | - | 60 | - | 50 | - |
(a-3) | - | - | - | - | - | - | - | - | - | 60 | - | 50 |
(b-1) | 5 | 10 | - | - | 10 | 15 | - | - | - | - | 10 | 10 |
(b-2) | - | - | 5 | 10 | - | - | 10 | - | - | - | - | - |
(c-1) | 10 | 10 | 10 | 10 | - | - | - | 10 | 10 | 10 | 10 | 10 |
(c-2) | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
실시예 | 비교예 | |||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 1 | 2 | 3 | 4 | 5 | |
도금 밀착력 (N/cm) | 5 | 11 | 6 | 10 | 8 | 11 | 6 | 0.4 | 0.4 | 0.2 | 2 | 3 |
에칭 후 Ra (nm) | 243 | 300 | 320 | 370 | 350 | 480 | 230 | 180 | 168 | 134 | 187 | 198 |
고온 도금 들뜸 | 무 | 무 | 무 | 무 | 무 | 무 | 무 | 유 | 유 | 유 | 유 | 유 |
아이조드 충격강도 | 6.9 | 10.9 | 8.3 | 10.0 | 12.7 | 17.0 | 12.5 | 5.1 | 5.5 | 5.3 | 11.2 | 9.9 |
열변형 온도 | 281 | 275 | 284 | 278 | 278 | 270 | 274 | 285 | 269 | 288 | 261 | 279 |
Claims (12)
- (A) 적어도 2종의 방향족 디카르복실산 단위를 포함하는 방향족 폴리아미드 수지 약 20 내지 약 70 중량%;(B) 올레핀계 공중합체 약 0.1 내지 약 20 중량%; 및(C) 무기필러 약 10 내지 약 60 중량%를 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 방향족 폴리아미드 수지(A)는 테레프탈산 및 이소프탈산을 방향족 디카르복실산 단위로 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제2항에 있어서, 상기 방향족 폴리아미드 수지(A)는 상기 테레프탈산 및 상기 이소프탈산을 약 6 : 약 4 내지 약 8 : 약 2의 중량비로 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 방향족 폴리아미드 수지(A)는 유리전이온도가 약 110 내지 약 135℃인 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 방향족 폴리아미드 수지(A)는 헥사메틸렌 테레프탈아미드 및 헥사메틸렌 이소프탈아미드를 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 올레핀계 공중합체(B)는 에틸렌-α-올레핀 공중합체; 또는 상기 에틸렌-α-올레핀 공중합체를 α,β-불포화 디카르복실산 및 α,β-불포화 디카르복실산 유도체 중 1종 이상의 화합물로 변성시킨 변성 에틸렌-α-올레핀 공중합체;를 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 α,β-불포화 디카르복실산 및 α,β-불포화 디카르복실산 유도체 중 1종 이상의 화합물은 말레산, 말레산 무수물, 말레산 하이드라지드(maleic hydrazide), 디클로로 말레산 무수물, 불포화된 디카르복실산, 푸마르산, 시트르산, 및 시트르산 무수물 중 1종 이상을 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 올레핀계 공중합체(B)는 말레산 무수물 변성 에틸렌-옥텐 공중합체(maleic anhydride modified ethylene-octene copolymer)를 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 무기필러(C)는 탄산칼슘, 탈크, 마이카 및 월라스토나이트 중 1종 이상을 포함하는 제1 무기필러; 유리섬유, 유리비드 및 유리플레이크 중 1종 이상을 포함하는 제2 무기필러; 또는 이들의 혼합물을 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 무기필러는 상기 제1 무기필러 및 제2 무기필러를 약 1 : 약 1 내지 약 1 : 약 5의 중량비로 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항 내지 제10항 중 어느 한 항에 따른 열가소성 수지 조성물로부터 제조된 성형품.
- 제11항에 있어서, 상기 성형품은 JIS C6481에 준하여, 약 10cm × 약 10cm × 약 3.2mm 시편에 대해 측정된 도금 밀착력이 약 1 내지 약 15 N/cm인 것을 특징으로 하는 성형품.
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JP6871236B2 (ja) | 2021-05-12 |
EP3342827B1 (en) | 2022-08-10 |
CN107922732B (zh) | 2020-06-12 |
US10703904B2 (en) | 2020-07-07 |
KR101823204B1 (ko) | 2018-03-09 |
JP2018525502A (ja) | 2018-09-06 |
CN107922732A (zh) | 2018-04-17 |
US20180244919A1 (en) | 2018-08-30 |
KR20170024201A (ko) | 2017-03-07 |
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EP3342827A1 (en) | 2018-07-04 |
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