WO2017026722A1 - Procédé de production de poudre d'argent pour une pâte électroconductrice pour frittage à haute température - Google Patents

Procédé de production de poudre d'argent pour une pâte électroconductrice pour frittage à haute température Download PDF

Info

Publication number
WO2017026722A1
WO2017026722A1 PCT/KR2016/008474 KR2016008474W WO2017026722A1 WO 2017026722 A1 WO2017026722 A1 WO 2017026722A1 KR 2016008474 W KR2016008474 W KR 2016008474W WO 2017026722 A1 WO2017026722 A1 WO 2017026722A1
Authority
WO
WIPO (PCT)
Prior art keywords
silver powder
silver
reaction solution
solution
parts
Prior art date
Application number
PCT/KR2016/008474
Other languages
English (en)
Korean (ko)
Inventor
진우민
권태현
이창근
우상덕
Original Assignee
엘에스니꼬동제련 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘에스니꼬동제련 주식회사 filed Critical 엘에스니꼬동제련 주식회사
Priority to JP2018527702A priority Critical patent/JP2018523758A/ja
Priority to CN201680047257.XA priority patent/CN107921543A/zh
Publication of WO2017026722A1 publication Critical patent/WO2017026722A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

Definitions

  • the present invention relates to a method for producing silver powder for high temperature sintered conductive paste.
  • a conductive metal paste is a paste in which electricity flows in a dried coating film having a coating ability capable of forming a coating film.
  • a conductive metal paste is a fluid composition in which a conductive filler (metal filler) is dispersed in a vehicle composed of a resin binder and a solvent. It is widely used for forming external electrodes of Recently, after the fact that the organic polymer is also known that electricity flows, research and development on the conductive polymer is actively progressed, but since the conductive polymer is obtained based on the conjugated double bond structure, the molecular chain is rigid, crystalline This has a problem that it is difficult to produce a paste having excellent coating suitability in that it is not easily dissolved by a solvent.
  • the conductive metal paste currently in practical use is a resin curable type in which a conductive filler is squeezed by curing the resin at a low temperature of 200 ° C. or lower to secure conduction, and an organic vehicle component volatilizes under a high temperature atmosphere of 500 to 1200 ° C.
  • a sintering type in which conductive fillers sinter to secure conduction.
  • the sintered conductive paste is composed of a conductive filler centered on a noble metal, a glass frit, and an organic vehicle (resin and an organic solvent), and the organic vehicle component is dried by treating the coated film at a high temperature.
  • This plastic evaporation and fusion between the metal pillars causes the sintered coating film to exhibit conductivity.
  • the glass frit component acts as an inorganic binder while being sintered in the coating film, thereby providing adhesion to the substrate.
  • the organic vehicle acts as an organic liquid medium for printing metal powder and glass frit. Organic matter remaining inside the cured coating film has an adverse effect on the performance of the application, such as increasing electrical resistance. It causes a problem of having to lower the content.
  • Patent Document 1 Japanese Patent Laid-Open No. 2005-48237
  • an alkali or a complexing agent is added to a silver salt-containing aqueous solution to reduce precipitation of finely dispersed spherical silver powder of 0.6 ⁇ m or less.
  • the method of obtaining the fine silver powder which has fine dispersibility which is fine silver powder and has a dispersibility closer to monodispersion with few aggregation of granules is proposed.
  • Patent Document 2 Japanese Patent Laid-Open No. 2010-70793 discloses an aqueous silver ammine complex solution by mixing and reacting an aqueous solution of silver nitrate with aqueous ammonia to obtain a silver ammine complex aqueous solution.
  • the method of obtaining the average particle diameter of 0.1 micrometer or more and less than 1 micrometer, the sharp particle size distribution, and the highly dispersible spherical silver powder is mixed by mixing a reducing agent aqueous solution and reducing precipitated silver particles.
  • the present invention is to solve the problems as described above, which is a silver powder that can be suitably used as the conductive metal filler of the sintered conductive paste, the heat shrinkage in the temperature range of 260 ⁇ 400 °C low, heat shrinkage of the substrate and silver powder It is to provide a method for producing silver powder that can suppress the difference in behavior.
  • the present invention is a silver powder by reacting the reaction solution preparation step (S21) and the first reaction solution and the second reaction solution to prepare a second reaction solution containing a first reaction solution and a reducing agent containing silver ions, ammonia and nitric acid It provides a silver powder manufacturing method comprising a; silver salt reduction step (S2) comprising a precipitation step (S22) to obtain.
  • ammonia is characterized in that it comprises 250 to 600 parts by weight based on 100 parts by weight of the silver ions.
  • the nitric acid is characterized in that it comprises 20 to 230 parts by weight based on 100 parts by weight of the silver ions.
  • the reducing agent is characterized in that it comprises 50 to 60 parts by weight based on 100 parts by weight of silver ions contained in the first reaction solution.
  • the reaction solution production step (S21) is a silver ions, ammonia aqueous solution and nitric acid solution to the solvent and stirred to prepare a first reaction solution by dissolving
  • the reaction solution production step (S21) is to add a reducing agent to the solvent It is characterized in that the stirring to dissolve to prepare a second reaction solution.
  • the precipitation step (S22) is characterized in that the step of reacting by dropwise addition or batch addition of the second reaction solution in the state of stirring the first reaction solution.
  • the precipitation step (S22) is characterized in that the step of reacting by further adding any one or more selected from the group consisting of fatty acids, fatty acid salts, surfactants, organometallic, chelate forming agents and protective colloids.
  • the reducing agent is characterized in that at least one member selected from the group consisting of hydroquinone, ascorbic acid, alkanolamine, hydrazine and formalin.
  • the present invention is a silver powder having a crystallite average diameter of 1.5um to 3um, the film prepared using the silver powder is maintained at a temperature increase rate of 3 °C / min in air at room temperature to 260 °C 2 hours, temperature rising rate 3 After the temperature was raised from 260 ° C. to 400 ° C. at 2 ° C./min.
  • the present invention is a method for producing a silver powder for high-temperature sintered conductive paste, which can produce a uniform silver powder by varying the amount of ammonia and nitric acid, as well as a substrate and silver powder with a shrinkage of 260-400 ° C. of less than 10%. It is possible to provide a high-temperature sintered conductive paste having excellent reliability after high-temperature sintering by suppressing the difference in heat shrinkage behavior.
  • shrinkage rate in 260-400 degreeC can be suppressed, it can use suitably as an electrically conductive filler used especially for the sintering type electrically conductive paste for laminated ceramic capacitors.
  • Method for producing a silver powder for high temperature sintered conductive paste is a silver salt manufacturing step (S1); Silver salt reduction step (S2); Purification step such as filtration and washing (S3); And a surface treatment step (S4).
  • the production method of silver powder according to the present invention necessarily includes a silver salt reduction step (S2), other steps can be omitted.
  • Silver salt preparation step (S1) is a silver salt solution containing silver ions (Ag + ) by acid treatment of silver (Ag + ) in the form of ingots, ribs, granules
  • the silver salt solution may be prepared by directly preparing a silver salt solution through this step, but commercially available silver nitrate may be performed afterwards using a silver salt complex or a silver intermediate solution.
  • Silver salt reduction step (S2) is a step of depositing silver particles by reducing the silver ions by adding a reducing agent and ammonia to the silver salt solution, silver ions, ammonia and nitric acid It includes a reaction solution manufacturing step (S21) for producing a second reaction solution containing a first reaction solution and a reducing agent including and a precipitation step (S22) of reacting the first reaction solution and the second reaction solution to obtain a silver powder. .
  • reaction solution preparation step (S21) ammonia and nitric acid are added to the silver salt solution containing silver ions, stirred, and dissolved to prepare a first reaction solution.
  • the silver ions are not limited as long as they are in the form of silver cations.
  • silver nitrate may be a silver salt complex or silver intermediate.
  • concentration of silver ions is not limited but may be in the range of 6 g / L to 40 g / L. If it is less than 6g / L yield is low economic problem, and if more than 40g / L there is a problem that causes the aggregation of the powder.
  • the present invention is believed to increase the firing temperature by adding ammonia and nitric acid to the silver salt solution to include silver powder in which ammonium nitrate combined with nitrate and ammonium ions is produced (precipitated), thereby increasing the firing temperature.
  • ammonia and nitric acid added to the silver salt solution to include silver powder in which ammonium nitrate combined with nitrate and ammonium ions is produced (precipitated), thereby increasing the firing temperature.
  • ammonia and nitric acid to the silver salt solution to include silver powder in which ammonium nitrate combined with nitrate and ammonium ions is produced (precipitated), thereby increasing the firing temperature.
  • ammonium nitrate combined with nitrate and ammonium ions is produced (precipitated)
  • Ammonia may be used in the form of an aqueous solution, and the amount of the aqueous ammonia solution may be added in an amount of 250 to 600 parts by weight based on 100 parts by weight of silver ions.
  • the amount of the aqueous ammonia solution may be added in an amount of 250 to 600 parts by weight based on 100 parts by weight of silver ions.
  • ammonia is added below 250 parts by weight, the effect of reducing heat shrinkage is insignificant, and when ammonia is added in excess of 600 parts by weight, there is a problem in that the size of the silver powder produced is greatly reduced.
  • a 25% aqueous solution of ammonia it is preferable to add 60 to 150 parts by weight based on 100 parts by weight of silver ions.
  • the ammonia includes its derivatives.
  • the amount of nitric acid used is preferably added in an amount of 20 to 230 parts by weight based on 100 parts by weight of silver ions.
  • the nitric acid includes its derivatives.
  • the first reaction solution containing silver ions, ammonia and nitric acid may be prepared in the form of a slurry by adding silver ions, aqueous ammonia and nitric acid to a solvent such as water, stirring and dissolving the solution. .
  • Reaction liquid preparation step (S21) according to an embodiment of the present invention also prepares a second reaction liquid containing a reducing agent.
  • the reducing agent may be at least one selected from the group consisting of ascorbic acid, alkanolamine, hydroquinone, hydrazine and formalin, and among these, hydroquinone may be preferably selected.
  • the amount of the reducing agent is preferably included in an amount of 50 to 60 parts by weight based on 100 parts by weight of silver ions contained in the first reaction solution. When using less than 50 parts by weight, all of the silver ions may not be reduced, and when used in excess of 60 parts by weight may increase the organic content may be a problem.
  • the second reaction solution containing a reducing agent may be prepared in an aqueous solution state by adding a reducing agent to a solvent such as water and stirring the solution.
  • Precipitation step (S22) is a step of obtaining a silver powder by reacting the first reaction solution and the second reaction solution, stirring the first reaction solution prepared by the reaction solution preparation step (S21)
  • the second reaction liquid can be slowly added dropwise or added in a batch to react.
  • the batch reaction may be completed in a short time to collectively add the bulk to prevent aggregation of the particles and to improve dispersibility.
  • dispersant examples include fatty acids, fatty acid salts, surfactants, organometallics, chelate formers and protective colloids.
  • the remaining organic matter content may be increased, so it is desirable to control the particle size, the remaining organic matter content, and the crystallite diameter of the silver powder without adding the dispersant.
  • Purification step (S3) is a silver salt reduction step (S2) after completing the silver particle precipitation reaction to remove and wash the silver powder dispersed in an aqueous solution or slurry using filtration and the like Step S31 is included. More specifically, after the silver particles in the silver powder dispersion are precipitated, the supernatant of the dispersion is discarded and filtered using a centrifuge, and the filter medium is washed with pure water. The washing process must be done by completely removing the wash water from which the powder has been washed. Therefore, the water content is reduced to less than 10%. It is also possible to optionally add the aforementioned dispersants to the reaction complete solution prior to filtration to prevent aggregation of the silver powder.
  • the purification step (S3) may further comprise a drying and disintegration step (S34) after washing.
  • Surface treatment step (S4) is a step of hydrophobizing the hydrophilic surface of the silver powder, it may be made selectively. More specifically, after controlling the moisture content of the wet cake (wet cake) obtained after filtration to less than 10% can be added to the surface treatment agent for the surface treatment of the silver powder and the moisture content can be adjusted to 70% to 85%. Thereafter, silver powder can be obtained through drying and pulverization. When surface treatment of silver powder, the powder should be well dispersed, and the surface treatment is sufficient. If the water content is low, the dispersion efficiency is poor, so it is better to surface-treat a certain amount with water content.
  • Silver powder prepared according to an embodiment of the present invention by measuring the diameter size of each of the 100 powders using a scanning electron microscope (SEM) and the average size is measured in the range of 1.5um to 3um, in the air
  • SEM scanning electron microscope
  • the organic matter content measured by TGA analysis in the range from normal temperature to 500 degreeC at the temperature increase rate of 10 degreeC / min is 1.0 weight% or less.
  • the film specimen prepared using the silver powder prepared according to an embodiment of the present invention is maintained at 260 °C, 260 °C 2 hours at room temperature at a heating rate of 3 °C / min in air, 400 °C at a heating rate of 3 °C / min To maintain the temperature at 400 °C for 2 hours until the shrinkage of 260 ⁇ 400 °C section is 10% or less.
  • the 1st reaction liquid was made to stir, the 2nd reaction liquid was added to this 1st reaction liquid collectively, and further stirred for 5 minutes after completion
  • stirring was stopped the particles in the mixed solution were allowed to settle, the supernatant of the mixed solution was discarded, the mixed solution was filtered using a centrifugal separator, the media was washed with pure water, dried, and silver powder was obtained.
  • the 1st reaction liquid was made to stir, the 2nd reaction liquid was added to this 1st reaction liquid collectively, and further stirred for 5 minutes after completion
  • stirring was stopped the particles in the mixed solution were allowed to settle, the supernatant of the mixed solution was discarded, the mixed solution was filtered using a centrifugal separator, the media was washed with pure water, dried, and silver powder was obtained.
  • the 1st reaction liquid was made to stir, the 2nd reaction liquid was added to this 1st reaction liquid collectively, and further stirred for 5 minutes after completion
  • stirring was stopped the particles in the mixed solution were allowed to settle, the supernatant of the mixed solution was discarded, the mixed solution was filtered using a centrifugal separator, the media was washed with pure water, dried, and silver powder was obtained.
  • the 1st reaction liquid was made to stir, the 2nd reaction liquid was added to this 1st reaction liquid collectively, and further stirred for 5 minutes after completion
  • stirring was stopped the particles in the mixed solution were allowed to settle, the supernatant of the mixed solution was discarded, the mixed solution was filtered using a centrifugal separator, the media was washed with pure water, dried, and silver powder was obtained.
  • the 1st reaction liquid was made to stir, the 2nd reaction liquid was added to this 1st reaction liquid collectively, and further stirred for 5 minutes after completion
  • stirring was stopped the particles in the mixed solution were allowed to settle, the supernatant of the mixed solution was discarded, the mixed solution was filtered using a centrifugal separator, the media was washed with pure water, dried, and silver powder was obtained.
  • the 1st reaction liquid was made to stir, the 2nd reaction liquid was added to this 1st reaction liquid collectively, and further stirred for 5 minutes after completion
  • stirring was stopped the particles in the mixed solution were allowed to settle, the supernatant of the mixed solution was discarded, the mixed solution was filtered using a centrifugal separator, the media was washed with pure water, dried, and silver powder was obtained.
  • the 1st reaction liquid was made to stir, the 2nd reaction liquid was added to this 1st reaction liquid collectively, and further stirred for 5 minutes after completion
  • stirring was stopped the particles in the mixed solution were allowed to settle, the supernatant of the mixed solution was discarded, the mixed solution was filtered using a centrifugal separator, the media was washed with pure water, dried, and silver powder was obtained.
  • the 1st reaction liquid was made to stir, the 2nd reaction liquid was added to this 1st reaction liquid collectively, and further stirred for 5 minutes after completion
  • stirring was stopped the particles in the mixed solution were allowed to settle, the supernatant of the mixed solution was discarded, the mixed solution was filtered using a centrifugal separator, the media was washed with pure water, dried, and silver powder was obtained.
  • the silver powders prepared according to the Examples and Comparative Examples of the present invention were measured by averaging the diameters of 100 powders using a scanning electron microscope manufactured by JEOL.
  • Example 1 1.54 0.22 7.8
  • Example 2 1.67 0.40 6.3
  • Example 3 1.61 0.68 7.5
  • Example 4 1.82 0.21 7.5
  • Example 5 1.95 0.10 6.0
  • Example 6 1.61 0.10 3.7 Comparative Example 1 1.43 0.49 16.2 Comparative Example 2 1.29 0.10 14.6

Abstract

La présente invention se rapporte à un procédé de production d'une poudre d'argent, le procédé comprenant : une étape de réduction de sel d'argent (S2) comprenant une étape de production de fluides de réaction (S21) comportant la production d'un premier fluide de réaction comprenant des ions d'argent, de l'ammoniac et de l'acide nitrique et d'un second fluide de réaction comprenant un agent réducteur; et une étape de précipitation (S22) dans laquelle une poudre d'argent est obtenue par la réaction du premier fluide de réaction et du second fluide de réaction. Le procédé de production permet de produire une poudre d'argent ayant un taux de retrait inférieur ou égal à 10 % dans l'intervalle de 260 à 400 °C.
PCT/KR2016/008474 2015-08-12 2016-08-01 Procédé de production de poudre d'argent pour une pâte électroconductrice pour frittage à haute température WO2017026722A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018527702A JP2018523758A (ja) 2015-08-12 2016-08-01 高温焼結型導電性ペースト用銀粉末の製造方法
CN201680047257.XA CN107921543A (zh) 2015-08-12 2016-08-01 高温烧结型导电性浆料用银粉末的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0113932 2015-08-12
KR1020150113932A KR101733165B1 (ko) 2015-08-12 2015-08-12 고온 소결형 도전성 페이스트용 은 분말의 제조방법

Publications (1)

Publication Number Publication Date
WO2017026722A1 true WO2017026722A1 (fr) 2017-02-16

Family

ID=57983277

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/008474 WO2017026722A1 (fr) 2015-08-12 2016-08-01 Procédé de production de poudre d'argent pour une pâte électroconductrice pour frittage à haute température

Country Status (4)

Country Link
JP (1) JP2018523758A (fr)
KR (1) KR101733165B1 (fr)
CN (1) CN107921543A (fr)
WO (1) WO2017026722A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200093657A (ko) * 2017-12-15 2020-08-05 도와 일렉트로닉스 가부시키가이샤 구상 은 분말 및 그의 제조 방법
CN111526955A (zh) * 2017-10-31 2020-08-11 LS-Nikko铜制炼株式会社 银粉末的制造方法以及包含银粉末的导电性浆料
CN115464147A (zh) * 2022-09-16 2022-12-13 北京曙光航空电气有限责任公司 一种银粉制造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102007856B1 (ko) * 2017-10-13 2019-08-06 엘에스니꼬동제련 주식회사 분산성이 개선된 은 분말의 제조방법
KR102061719B1 (ko) * 2017-10-30 2020-01-02 엘에스니꼬동제련 주식회사 은 분말 및 이의 제조방법
KR102061718B1 (ko) * 2017-10-30 2020-01-02 엘에스니꼬동제련 주식회사 표면 처리된 은 분말 및 이의 제조방법
KR102061720B1 (ko) * 2017-10-31 2020-01-02 엘에스니꼬동제련 주식회사 표면 처리된 은 분말 및 이의 제조방법
KR102081183B1 (ko) * 2017-10-31 2020-02-25 엘에스니꼬동제련 주식회사 은 분말의 제조방법
KR101953619B1 (ko) * 2018-05-08 2019-03-05 대주전자재료 주식회사 방사형 중공형 은 입자를 포함하는 은 분말 및 이의 제조방법
CN108941609A (zh) * 2018-09-10 2018-12-07 河南金渠银通金属材料有限公司 太阳能电池导电银浆用高性能球形超细银粉及其制备方法
KR102197542B1 (ko) * 2018-11-30 2020-12-31 엘에스니꼬동제련 주식회사 세척 특성이 개선된 은 분말의 제조방법
KR102178009B1 (ko) * 2018-11-30 2020-11-12 엘에스니꼬동제련 주식회사 수축률 조절이 가능한 은 분말의 제조방법
CN109637693A (zh) * 2018-12-17 2019-04-16 中国计量大学 一种基于***结银框架的导电银浆及其制备方法
KR102454264B1 (ko) * 2020-03-25 2022-10-14 엘에스니꼬동제련 주식회사 점도 안정성이 향상된 전도성 페이스트용 은 분말 및 이의 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007270312A (ja) * 2006-03-31 2007-10-18 Mitsui Mining & Smelting Co Ltd 銀粉の製造方法及び銀粉
JP2010070793A (ja) * 2008-09-17 2010-04-02 Dowa Electronics Materials Co Ltd 球状銀粉およびその製造方法
KR20100083224A (ko) * 2009-01-13 2010-07-22 충남대학교산학협력단 화학환원법에 의한 단분산 구형 은 분말의 제조방법
KR20120013417A (ko) * 2009-05-01 2012-02-14 이 아이 듀폰 디 네모아 앤드 캄파니 은 입자 및 그의 제조 방법
JP2012525506A (ja) * 2009-05-01 2012-10-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 銀粒子およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001107101A (ja) * 1999-10-12 2001-04-17 Mitsui Mining & Smelting Co Ltd 高分散性球状銀粉末及びその製造方法
JP4489389B2 (ja) * 2003-07-29 2010-06-23 三井金属鉱業株式会社 微粒銀粉の製造方法
JP4976642B2 (ja) * 2004-02-10 2012-07-18 三井金属鉱業株式会社 高結晶性銀粉及びその製造方法
JP5354041B2 (ja) * 2012-02-24 2013-11-27 住友金属鉱山株式会社 銀粉の製造方法
KR101729885B1 (ko) * 2013-06-25 2017-04-24 가켄 테크 가부시키가이샤 박편상 은분, 도전성 페이스트, 및 박편상 은분의 제조 방법
CN103724805A (zh) * 2013-12-18 2014-04-16 芜湖万润机械有限责任公司 一种综合性能优良的电容器用金属化薄膜及其制备方法
CN104376900A (zh) * 2014-11-18 2015-02-25 苏州东辰林达检测技术有限公司 一种透明导电薄膜及其制备方法
CN104599737B (zh) * 2014-12-17 2017-01-04 华南理工大学 一种微纳米银/高分子导电复合材料及其制备方法与应用

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007270312A (ja) * 2006-03-31 2007-10-18 Mitsui Mining & Smelting Co Ltd 銀粉の製造方法及び銀粉
JP2010070793A (ja) * 2008-09-17 2010-04-02 Dowa Electronics Materials Co Ltd 球状銀粉およびその製造方法
KR20100083224A (ko) * 2009-01-13 2010-07-22 충남대학교산학협력단 화학환원법에 의한 단분산 구형 은 분말의 제조방법
KR20120013417A (ko) * 2009-05-01 2012-02-14 이 아이 듀폰 디 네모아 앤드 캄파니 은 입자 및 그의 제조 방법
JP2012525506A (ja) * 2009-05-01 2012-10-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 銀粒子およびその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111526955A (zh) * 2017-10-31 2020-08-11 LS-Nikko铜制炼株式会社 银粉末的制造方法以及包含银粉末的导电性浆料
JP2021501267A (ja) * 2017-10-31 2021-01-14 エルエスニッコカッパー インコーポレイテッドＬｓ−Ｎｉｋｋｏ Ｃｏｐｐｅｒ Ｉｎｃ． 銀粉末の製造方法及び銀粉末を含む導電性ペースト
JP7069311B2 (ja) 2017-10-31 2022-05-17 エルエスニッコカッパー インコーポレイテッド 銀粉末の製造方法及び銀粉末を含む導電性ペースト
KR20200093657A (ko) * 2017-12-15 2020-08-05 도와 일렉트로닉스 가부시키가이샤 구상 은 분말 및 그의 제조 방법
KR102450279B1 (ko) 2017-12-15 2022-09-30 도와 일렉트로닉스 가부시키가이샤 구상 은 분말 및 그의 제조 방법
CN115464147A (zh) * 2022-09-16 2022-12-13 北京曙光航空电气有限责任公司 一种银粉制造方法

Also Published As

Publication number Publication date
JP2018523758A (ja) 2018-08-23
KR101733165B1 (ko) 2017-05-08
KR20170019727A (ko) 2017-02-22
CN107921543A (zh) 2018-04-17

Similar Documents

Publication Publication Date Title
WO2017026722A1 (fr) Procédé de production de poudre d'argent pour une pâte électroconductrice pour frittage à haute température
WO2018080092A1 (fr) Poudre d'argent et son procédé de préparation
WO2018226001A1 (fr) Particules d'argent et leur procédé de production
WO2017043837A1 (fr) Procédé de préparation de poudre d'argent au moyen de grains d'argent
JP6982688B2 (ja) 表面処理された銀粉末及びその製造方法
WO2015178696A1 (fr) Composition conductrice
WO2018080090A1 (fr) Poudre d'argent traitée en surface et son procédé de production
WO2020071841A1 (fr) Poudre d'argent et son procédé de fabrication
WO2021194061A1 (fr) Poudre d'argent pour pâte conductrice ayant une stabilité de viscosité améliorée, et son procédé de préparation
WO2018070817A1 (fr) Poudre d'argent pour frittage à haute température et son procédé de préparation
CN101697317A (zh) 一种多层瓷介质电容器用无铅化银钯内电极浆料的制备方法
WO2018070818A1 (fr) Poudre d'argent pour électrode de cellule solaire et pâte conductrice la comprenant
WO2020111903A1 (fr) Procédé de production de poudre d'argent avec retrait ajustable
WO2019088507A1 (fr) Poudre d'argent et son procédé de production
TW201315685A (zh) 銀微粒子及含有該銀微粒子之導電膏，導電膜及電子裝置
KR102007856B1 (ko) 분산성이 개선된 은 분말의 제조방법
WO2020106120A1 (fr) Procédé de preparation de poudre d'argent monodispersée
WO2018043995A1 (fr) Procédé de préparation de poudre d'argent disposant d'une surface spécifique accrue
WO2018066724A1 (fr) Procédé de préparation de poudre d'argent
WO2018080091A1 (fr) Poudre d'argent et son procédé de préparation
CN114005573B (zh) 一种高温电子浆料的制备方法
WO2019088508A1 (fr) Procédé pour la production de poudre d'argent et pâte conductrice comprenant de la poudre d'argent
WO2012165801A2 (fr) Complexe particulaire de cuivre destiné à l'électronique imprimée et pâte de cuivre
KR102178010B1 (ko) 세척이 용이한 은 분말의 제조방법
KR102061718B1 (ko) 표면 처리된 은 분말 및 이의 제조방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16835362

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2018527702

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16835362

Country of ref document: EP

Kind code of ref document: A1