WO2016190149A1 - 気密パッケージの製造方法 - Google Patents
気密パッケージの製造方法 Download PDFInfo
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- WO2016190149A1 WO2016190149A1 PCT/JP2016/064434 JP2016064434W WO2016190149A1 WO 2016190149 A1 WO2016190149 A1 WO 2016190149A1 JP 2016064434 W JP2016064434 W JP 2016064434W WO 2016190149 A1 WO2016190149 A1 WO 2016190149A1
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- sealing material
- glass substrate
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- glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
- C03C3/145—Silica-free oxide glass compositions containing boron containing aluminium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/712—Containers; Packaging elements or accessories, Packages
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2207/00—Compositions specially applicable for the manufacture of vitreous enamels
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Definitions
- the present invention relates to a method of manufacturing an airtight package by a sealing process using laser light (hereinafter referred to as laser sealing).
- ⁇ Efforts are being made to maintain the characteristics of the hermetic package and to extend its service life.
- a piezoelectric vibrator element is a sensitive element that easily deteriorates when exposed to oxygen or moisture in the surrounding environment. Therefore, it has been studied to incorporate the piezoelectric vibrator element into the piezoelectric vibrator package in an airtight state so as to maintain the characteristics of the piezoelectric vibrator package and extend its life.
- the glass substrate and the glass substrate are surrounded so as to surround the piezoelectric vibrator element in a state in which the glass substrate is opposed to the element base on which the piezoelectric vibrator element is arranged with a space therebetween.
- An airtight structure in which a gap between the element substrate and a sealing material layer is sealed has been studied.
- the element base ceramic, for example, alumina is generally used.
- the piezoelectric vibrator element has low heat resistance. Therefore, if the element substrate and the glass substrate are sealed by firing in the softening flow temperature range of the sealing material layer, the characteristics of the piezoelectric vibrator element may be thermally deteriorated.
- laser sealing has been studied as a sealing method for hermetic packages.
- only the portion to be sealed can be locally heated, so that it is possible to seal the element substrate and the glass substrate while preventing thermal degradation of elements having low heat resistance.
- laser sealing is a method in which the sealing material layer is locally heated to soften and flow the sealing material layer, so that the time required for sealing is short, and the sealing material layer reacts accordingly. The time to do is also shortened. As a result, the reaction layer is not sufficiently formed at the interface of the sealing material layer, and the sealing strength between the element substrate and the glass substrate is lowered.
- the present invention has been made in view of the above circumstances, and its technical problem is to devise a method capable of increasing the sealing strength of the entire hermetic package while preventing thermal deterioration of the housing member, thereby achieving the hermetic package. It is to improve the long-term reliability.
- the present inventor prepared a pair of glass substrates, sealed one glass substrate and the frame, and further formed a sealing material layer in advance on the upper edge of the frame, It is found that the above technical problem can be solved by housing the housing member and laser-sealing the other glass substrate and the frame, and proposes the present invention.
- the manufacturing method of the hermetic package of the present invention includes (1) preparing a first glass substrate and forming a first sealing material layer on the first glass substrate; A frame having an opening is prepared, and after placing the frame and the first glass substrate so that the bottom of the frame and the first sealing material layer are in contact with each other, the first sealing material layer is A step of sealing the frame and the first glass substrate, (3) a step of forming a second sealing material layer on the upper edge of the frame, and (4) housing the housing member in the frame And (5) preparing a second glass substrate and arranging the second glass substrate so that the second glass substrate and the second sealing material layer are in contact with each other, Irradiate from the second glass substrate side toward the second sealing material layer, and seal the second glass substrate and the frame through the second sealing material layer. And characterized by comprising a step of obtaining a hermetic package, the.
- Sealing material usually contains low melting point glass. This low-melting glass erodes the surface layer of the object to be sealed at the time of laser sealing, and a reaction layer is generated.
- a reaction layer is generated to some extent by laser sealing, and the fixing strength can be ensured.
- the material to be sealed is ceramic, the low melting point glass hardly erodes the ceramic surface layer during laser sealing, and the reaction layer is not sufficiently formed. That is, when the material to be sealed is glass, a reaction layer can be generated by laser sealing, but when it is ceramic, it is difficult to generate a reaction layer by laser sealing.
- the second sealing material layer and the second glass substrate are laser-sealed. .
- a reaction layer is sufficiently generated between the frame and the second sealing material layer, and the second sealing material layer is firmly fixed on the frame.
- the object to be sealed becomes glass
- a reaction layer is generated between the second glass substrate and the second sealing material layer, and the second sealing material layer becomes Firmly adheres to the glass substrate.
- the method for manufacturing an airtight package according to the present invention includes applying a paste containing the first sealing material onto the first glass substrate and firing the paste to form a sintered body of the first sealing material. It is preferable to form one sealing material layer. If it does in this way, the adhesion strength of the 1st glass substrate and the 1st sealing material layer can be raised, and the thickness of the 1st sealing material layer can be reduced.
- a sealing material containing 55 to 95% by mass of bismuth glass powder and 5 to 45% by mass of refractory filler powder is used as the first sealing material.
- Bismuth-based glass has better reactivity with an object to be sealed, particularly ceramic, than other types of glass. Thereby, the adhesion strength of the first glass substrate and the first sealing material layer can be increased. Furthermore, when the refractory filler powder is introduced, the thermal expansion coefficients of the first glass substrate and the first sealing material layer can be matched.
- the “bismuth-based glass” refers to glass containing Bi 2 O 3 as a main component, and specifically refers to glass containing 40% by mass or more of Bi 2 O 3 in the glass composition.
- the method for manufacturing an airtight package of the present invention uses a green sheet sintered body as the frame. If it does in this way, the dimensional accuracy and heat resistance of a frame can be improved.
- the first sealing material layer is fired to seal the frame and the first glass substrate. If it does in this way, the sealing strength of a frame and a 1st glass substrate can be raised.
- the paste including the second sealing material is applied to the upper edge portion of the frame body and fired to form a second sealing material sintered body. It is preferable to form a second sealing material layer. If it does in this way, the adhesion strength of the 2nd sealing material layer and a frame can be raised, and the thickness of the 2nd sealing material layer can be reduced.
- the manufacturing method of the hermetic package of the present invention includes, as a second sealing material, bismuth-based glass powder 55 to 95% by mass, refractory filler powder 5 to 45% by mass, and heat-resistant pigment 1 to 15% by mass. It is preferable to use the sealing material contained.
- Bismuth glass has a low melting point but high thermal stability (devitrification resistance). Thereby, it can soften and flow well at the time of laser sealing, and the accuracy of laser sealing can be increased.
- the refractory filler powder is introduced, the thermal expansion coefficients of the second sealing material layer and the frame can be matched.
- a heat-resistant pigment is introduced, the light absorption characteristics of laser light can be enhanced.
- the average thickness of the second sealing material layer is preferably less than 10 ⁇ m. If it does in this way, since it becomes easy to locally heat the whole 2nd sealing material layer by laser sealing, the adhering strength of a frame and the 2nd sealing material layer can be raised.
- the method for manufacturing an airtight package of the present invention it is preferable to use a resin in which piezoelectric vibrator elements or phosphor particles (preferably quantum dots) are dispersed as the housing member.
- the hermetic package of the present invention is preferably manufactured by the above-described method for manufacturing an airtight package.
- the method for manufacturing an airtight package of the present invention includes a step of preparing a first glass substrate and forming a first sealing material layer on the first glass substrate.
- Various glass substrates can be used as the first glass substrate.
- alkali-free glass, borosilicate glass, aluminosilicate glass, or the like can be used.
- the thickness of the first glass substrate is preferably 0.01 to 0.7 mm, particularly preferably 0.05 to 0.5 mm. Thereby, thickness reduction of an airtight package can be achieved.
- the glass substrate is characterized in that it is easy to reduce the thickness, has optical transparency, and has high surface smoothness.
- the first sealing material layer As a method of forming the first sealing material layer, a method of applying and baking a paste containing the first sealing material on the first glass substrate is preferable. If it does in this way, the adhesion strength of the 1st glass substrate and the 1st sealing material layer can be raised, and the thickness of the 1st sealing material layer can be reduced.
- the paste is preferably applied by screen printing, and the baking is preferably performed in an electric furnace.
- the firing temperature is preferably not higher than the heat resistance temperature of the first glass substrate, for example, 650 ° C. or lower, and preferably, for example, 480 ° C. or higher from the viewpoint of increasing the reaction depth of the first sealing material layer.
- the paste containing the first sealing material is preferably applied along the outer peripheral edge of the first glass substrate. If it does in this way, the accommodation volume which can be accommodated in a frame can be enlarged.
- the first sealing material a composite powder of glass powder and refractory filler powder can be used.
- Various materials can be used as the glass powder.
- bismuth glass, tin phosphate glass, vanadium glass, etc. can be used. From the viewpoint of thermal stability and depth of the reaction layer, bismuth. System glass is preferred.
- the “tin phosphate glass” refers to a glass mainly composed of SnO and P 2 O 5 , and specifically includes SnO and P 2 O 5 in a total amount of 40% by mass or more in the glass composition.
- titanium-based glass refers to glass mainly composed of V 2 O 5 , and specifically refers to glass containing 25% by mass or more of V 2 O 5 in the total amount in the glass composition.
- the first sealing material it is preferable to use a sealing material containing bismuth-based glass powder 55 to 95% by volume, refractory filler powder 5 to 45% by volume, and bismuth-based glass powder 70 to 90% by volume. More preferably, a sealing material containing 10 to 30% by volume of a refractory filler powder is used.
- the thermal expansion coefficient of the first sealing material is lowered, so that the thermal expansion coefficients of the first sealing material layer, the frame, and the first glass substrate are easily matched.
- the bismuth-based glass powder contained in the first sealing material has a glass composition in terms of mass%, Bi 2 O 3 55 to 74%, B 2 O 3 5 to 25%, ZnO 5 to 20%, SiO 2 It preferably contains 0 to 10%, Al 2 O 3 0 to 5%, Bi 2 O 3 55 to 69%, B 2 O 3 10 to 22%, ZnO 5 to 20%, SiO 2 more than 1 to 10 %, Al 2 O 3 1 to 3.7%, and CuO 0 to 5% are particularly preferable. In this way, the thermal stability of the bismuth-based glass is improved, and the thermal expansion coefficient of the bismuth-based glass is further reduced. Therefore, the thermal expansion of the first sealing material layer, the frame body, and the first glass substrate. Coefficients are easily matched.
- the refractory filler powder it is preferable to use one or more selected from cordierite, zircon, tin oxide, niobium oxide, zirconium phosphate ceramic, and willemite. These refractory filler powders have a low thermal expansion coefficient, high mechanical strength, and good compatibility with bismuth glass. Of the above refractory filler powders, cordierite is most preferred. Cordierite has a property that it is difficult to devitrify the bismuth glass even when the particle size is small, even when laser sealing. In addition to the above refractory filler powder, ⁇ -eucryptite, quartz glass and the like may be added.
- the average particle size D 50 of the refractory filler powder is preferably less than 2 ⁇ m, in particular less than 1.5 ⁇ m.
- the average particle diameter D 50 of the refractory filler powder is less than 2 [mu] m, together with the surface smoothness of the sealing material layer is improved, easily regulate the average thickness of the sealing material layer less than 10 [mu] m.
- Maximum particle diameter D 99 of the refractory filler powder is preferably less than 5 [mu] m, 4 [mu] m or less, particularly 3 ⁇ m or less.
- maximum particle diameter D 99 of the refractory filler powder is less than 5 [mu] m, together with the surface smoothness of the sealing material layer is improved, easily regulate the average thickness of the sealing material layer less than 10 [mu] m.
- average particle diameter D 50 ” and “maximum particle diameter D 99 ” indicate values measured on a volume basis by a laser diffraction method.
- the paste is usually produced by kneading the sealing material and the vehicle with a three-roller or the like.
- a vehicle usually includes a resin and a solvent.
- the resin used for the vehicle acrylic ester (acrylic resin), ethyl cellulose, polyethylene glycol derivative, nitrocellulose, polymethylstyrene, polyethylene carbonate, polypropylene carbonate, methacrylic ester and the like can be used.
- Solvents used in vehicles include N, N′-dimethylformamide (DMF), ⁇ -terpineol, higher alcohol, ⁇ -butyllactone ( ⁇ -BL), tetralin, butyl carbitol acetate, ethyl acetate, isoamyl acetate, diethylene glycol monoethyl Ether, diethylene glycol monoethyl ether acetate, benzyl alcohol, toluene, 3-methoxy-3-methylbutanol, triethylene glycol monomethyl ether, triethylene glycol dimethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monomethyl ether , Tripropylene glycol monobutyl ether, propylene carbonate, dimethyl sulfoxide (DM O), N-methyl-2-pyrrolidone and the like can be used.
- DMF N′-dimethylformamide
- ⁇ -BL ⁇ -
- the manufacturing method of the hermetic package of the present invention prepares a frame having an opening at the top, and the frame and the first glass substrate so that the bottom of the frame and the first sealing material layer are in contact with each other. After arranging, there is a step of sealing the frame and the first glass substrate through the first sealing material layer.
- the material of the frame is not particularly limited, but from the viewpoint of material cost and sintering strength, alumina, zirconia, mullite, etc. are preferable, and a green sheet sintered body is also preferable, particularly crystalline glass powder and refractory filler powder.
- a sintered body of a green sheet laminate of a composite powder containing is preferable.
- Use of a green sheet sintered body has an advantage that a frame body with high dimensional accuracy can be easily produced.
- the sealing of the frame and the first glass substrate is preferably performed by firing in an electric furnace or the like. Thereby, the sealing strength of a frame and a 1st glass substrate can be raised.
- the firing temperature is preferably not more than the heat resistance temperature of the frame and the first glass substrate, for example, 650 ° C. or less, and preferably 480 ° C. or more, for example, from the viewpoint of increasing the reaction depth of the first sealing material layer.
- the manufacturing method of the hermetic package of the present invention includes a step of forming a second sealing material layer on the upper edge of the frame.
- the surface roughness Ra of the upper edge portion of the frame body is preferably less than 0.5 ⁇ m, 0.2 ⁇ m or less, particularly 0.01 to 0.15 ⁇ m.
- the surface roughness RMS of the upper edge portion of the frame is preferably less than 1.0 ⁇ m, 0.5 ⁇ m or less, particularly 0.05 to 0.3 ⁇ m. In this way, the surface smoothness of the second sealing material layer is improved, and the accuracy of laser sealing can be increased. As a result, it becomes possible to increase the sealing strength of the entire hermetic package.
- “Surface roughness Ra” and “surface roughness RMS” can be measured by, for example, a stylus type or non-contact type laser film thickness meter or surface roughness meter.
- the paste is preferably applied by screen printing, and the baking is preferably performed in an electric furnace.
- the firing temperature is preferably not higher than the heat resistance temperature of the second glass substrate, for example, 550 ° C. or lower, and preferably, for example, 460 ° C. or higher from the viewpoint of increasing the reaction depth of the second sealing material layer.
- the second sealing material Various materials can be used as the second sealing material.
- a composite powder containing glass powder and refractory filler powder and further containing a heat-resistant pigment can be used.
- Various materials can be used as the glass powder.
- bismuth glass, tin phosphate glass, vanadium glass, etc. can be used. From the viewpoint of thermal stability and depth of the reaction layer, bismuth. System glass is preferred.
- the second sealing material it is preferable to use a sealing material containing bismuth-based glass powder 55 to 95% by volume, refractory filler powder 5 to 45% by volume, and heat-resistant pigment 1 to 15% by mass. More preferably, a sealing material containing 65 to 80% by volume of a glass powder, 20 to 35% by volume of a refractory filler powder, and 3 to 10% by mass of a heat-resistant pigment is used.
- a sealing material containing bismuth-based glass powder 55 to 95% by volume, refractory filler powder 5 to 45% by volume, and heat-resistant pigment 1 to 15% by mass. More preferably, a sealing material containing 65 to 80% by volume of a glass powder, 20 to 35% by volume of a refractory filler powder, and 3 to 10% by mass of a heat-resistant pigment is used.
- the thermal expansion coefficient of the first sealing material is lowered, so that the thermal expansion coefficients of the first sealing material layer, the frame, and the first glass substrate are easily matched.
- the bismuth-based glass powder contained in the second sealing material has a glass composition in terms of mass%, Bi 2 O 3 70 to 85%, B 2 O 3 5 to 15%, ZnO 0 to 15%, BaO 0
- Preferably 10 to 10%, Al 2 O 3 0 to 3%, CuO 3 to 15%, Fe 2 O 3 0 to 5%, Bi 2 O 3 74 to 85%, B 2 O 3 5 to 15 %, ZnO 0-10%, BaO 1-10%, Al 2 O 3 0-3%, CuO 5-15%, Fe 2 O 3 0.1-5% are particularly preferable.
- the thermal stability of the bismuth-based glass is improved, and the light absorption characteristics of laser light are further improved.
- the above-mentioned refractory filler powder is suitable.
- Cu-based oxides, Fe-based oxides, Cr-based oxides, Mn-based oxides and their spinel type complex oxides are suitable, and in particular, from the viewpoint of compatibility with bismuth-based glass, Mn-based oxides are preferred.
- Surface roughness Ra of the 2nd sealing material layer after forming the 2nd sealing material layer formed on the upper edge part of a frame is less than 0.5 micrometer, 0.2 micrometer or less, especially 0.01
- the surface roughness RMS is preferably regulated to be less than 1.0 ⁇ m and 0.5 ⁇ m or less, particularly 0.05 to 0.3 ⁇ m. If it does in this way, the adhesiveness of a 2nd glass substrate and a 2nd sealing material layer will improve, and the precision of laser sealing will improve. Note that the surface roughness Ra of the second sealing material layer can be reduced by polishing the upper edge of the frame and the surface of the second sealing material layer.
- the average thickness of the second sealing material layer is preferably regulated to less than 10 ⁇ m, less than 7 ⁇ m, particularly less than 6 ⁇ m. As the average thickness of the second sealing material layer is smaller, sealing is performed after laser sealing even if the thermal expansion coefficients of the second sealing material layer, the frame, and the second glass substrate are not sufficiently matched. The stress remaining in the part is reduced. In addition, the accuracy of laser sealing can be increased.
- the width of the second sealing material layer is preferably regulated to 0.05 to 1 mm, particularly 0.1 to 0.5 mm. If the width of the second sealing material layer is too small, the accuracy of laser sealing tends to be lowered. On the other hand, if the width of the second sealing material layer is too large, the size of the accommodating member that can be accommodated in the frame becomes small, and as a result, the performance of the hermetic package is likely to deteriorate.
- the thermal expansion coefficient of the first sealing material is preferably lower than the thermal expansion coefficient of the second sealing material, more preferably 5 ⁇ 10 ⁇ 7 / ° C. or lower, and more preferably 10 ⁇ 10 ⁇ 7. It is more preferable that the temperature is lower by at least 15 ° C./° C., particularly preferably by at least 15 ⁇ 10 ⁇ 7 / ° C. If the thermal expansion coefficient of the first sealing material is higher than the thermal expansion coefficient of the second sealing material, an undue stress tends to remain in the entire hermetic package.
- the softening point of the second sealing material is preferably lower than the softening point of the first sealing material, more preferably 30 ° C or more, more preferably 50 ° C or more, and more preferably 80 ° C or more. Is particularly preferred. When the softening point of the second sealing material is higher than the softening point of the first sealing material, it becomes difficult to generate a reaction layer during laser sealing.
- the average thickness of the second sealing material layer is preferably smaller than the average thickness of the first sealing material layer, more preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, further preferably 3 ⁇ m or more. Particularly preferred. If the average thickness of the second sealing material layer is larger than the average thickness of the first sealing material layer, it becomes difficult to form the first sealing material layer by firing or the like, and the accuracy of laser sealing is increased. It becomes difficult.
- the manufacturing method of the hermetic package of the present invention includes a step of housing the housing member in the frame.
- the housing member a member having low heat resistance is preferable, and in particular, a resin in which phosphor particles such as piezoelectric vibrator elements or quantum dots are dispersed is preferable.
- the resin may be cured after being accommodated in the frame or may be already cured.
- the method for manufacturing an airtight package of the present invention prepares a second glass substrate, and after arranging the second glass substrate so that the second glass substrate and the second sealing material layer are in contact with each other, the laser Light is irradiated from the second glass substrate side toward the second sealing material layer, and the second glass substrate and the frame are sealed through the second sealing material layer to obtain an airtight package. Process.
- the second glass substrate various glass substrates can be used, for example, alkali-free glass, borosilicate glass, aluminosilicate glass, and the like.
- the thickness of the second glass substrate is preferably 0.01 to 0.7 mm, particularly preferably 0.05 to 0.5 mm. Thereby, thickness reduction of an airtight package can be achieved.
- a semiconductor laser a YAG laser, a CO 2 laser, an excimer laser, an infrared laser, and the like are preferable in terms of easy handling.
- the laser beam output is preferably 5 to 20 W, particularly 8 to 15 W. If the output of the laser beam is too low, the sealing strength between the frame body and the second glass substrate tends to decrease. On the other hand, if the output of the laser beam is too high, the second glass substrate tends to break after laser sealing.
- the scanning speed of the laser beam is preferably 5 to 20 mm / s, particularly 8 to 15 mm / s. If the scanning speed of the laser beam is too slow, the productivity of the hermetic package tends to be lowered. On the other hand, when the scanning speed of the laser beam is too high, the sealing strength between the frame body and the second glass substrate tends to be lowered.
- the atmosphere for laser sealing is not particularly limited, and may be an air atmosphere or an inert atmosphere such as a nitrogen atmosphere.
- FIG. 1 is a conceptual perspective view for explaining an embodiment of a method for manufacturing an airtight package 1 of the present invention.
- the first sealing material layer 11 is formed in a frame shape along the outer peripheral edge of the first glass substrate 10. .
- the formation of the first sealing material layer 11 is preferably performed by firing in an electric furnace or the like.
- a frame body 12 having an opening at the top is prepared, and the frame body 12 is in contact with the bottom 12a of the frame body 12 and the first sealing material layer 11.
- the frame body 12 and the first glass substrate 10 are sealed via the first sealing material layer 11.
- the frame body 12 is preferably a sintered body of a green sheet laminate of a composite powder containing glass powder and refractory filler powder. Moreover, it is preferable to perform sealing of the frame 12 and the 1st glass substrate 10 by baking, such as an electric furnace. Furthermore, as shown in FIG.1 (c), the 2nd sealing material layer 13 is formed in the upper edge part 12b of the frame 12. As shown in FIG. Here, the surface roughness Ra of the upper edge portion 12b of the frame body 12 is preferably smoothed to 0.15 [mu] m or less by a polishing process or the like.
- the formation of the second sealing material layer 13 is preferably performed by firing in an electric furnace or the like, and the surface roughness Ra of the second sealing material layer 13 is preferably regulated to 0.15 ⁇ m or less.
- the accommodating member 14 is accommodated in the frame 12, as shown in FIG.1 (d).
- the housing member 14 is preferably a member having low heat resistance, and in particular, a resin in which piezoelectric vibrator elements or quantum dots are dispersed is preferable.
- the 2nd glass substrate 15 is prepared, and the 2nd glass substrate 15 is contacted so that the 2nd glass substrate 15 and the 2nd sealing material layer 13 may contact.
- the second glass substrate 15 and the frame are irradiated through the second sealing material layer 13 by irradiating the laser beam 16 from the second glass substrate 15 side toward the second sealing material layer 13.
- the body 12 is sealed.
- the airtight package 1 can be obtained.
- a first sealing material was produced.
- Table 1 shows the material configuration of the first sealing material.
- Bismuth-based glass has a glass composition of mass%, Bi 2 O 3 56.4%, B 2 O 3 17.9%, ZnO 15.7%, SiO 2 6.4%, Al 2 O 3 6. It contains 4% and has the particle sizes listed in Table 1.
- the refractory filler powder is cordierite powder and has the particle sizes shown in Table 1.
- the above-mentioned bismuth glass and refractory filler powder were mixed in the ratio shown in Table 1 to produce a first sealing material.
- the glass transition point, the softening point, and the thermal expansion coefficient were measured. The results are shown in Table 1.
- the glass transition point is a value measured with a push rod type TMA apparatus.
- Softening point is the temperature of the fourth inflection point measured with a macro DTA apparatus. The measurement was performed in an air atmosphere at a temperature rising rate of 10 ° C./min, and the measurement was performed from room temperature to 600 ° C.
- the thermal expansion coefficient is a value measured with a push rod type TMA apparatus.
- the measurement temperature range is 30 to 300 ° C.
- Table 2 shows the material configuration of the second sealing material.
- Bismuth-based glass has a glass composition of mass%, Bi 2 O 3 77.7%, B 2 O 3 8.3%, ZnO 1.8%, BaO 2.7%, CuO 8.5%, Fe2O3. It contains 0.5%, Al 2 O 3 0.5%, and has the particle sizes shown in Table 2.
- the refractory filler powder is cordierite powder and has the particle sizes shown in Table 2.
- the heat-resistant pigment is a composite oxide containing 54% by mass of MnO 2 , 44% by mass of Fe 2 O 3 and 2 % by mass of Al 2 O 3 , and has the particle sizes shown in Table 2.
- a first glass substrate (OA-10G manufactured by Nippon Electric Glass Co., Ltd.) was prepared.
- the dimensions of the first glass substrate are 6.0 mm ⁇ 1.7 mm ⁇ 0.1 mm thick.
- the powder is evenly dispersed by a three-roll mill. Kneaded until paste.
- the obtained paste containing the first sealing material was printed in a frame shape with a screen printer so as to have a width of about 0.2 mm along the outer peripheral edge of the first glass substrate. Then, after drying at 120 ° C. for 10 minutes in the air atmosphere, firing at 620 ° C. for 10 minutes in the air atmosphere, incineration of the resin component in the paste (debinding treatment) and first sealing The material was sintered to form a first sealing material layer on the first glass substrate. In addition, it was about 10 micrometers when the average thickness of the 1st sealing material layer was measured with the non-contact-type laser film thickness meter.
- a frame body material: MLS-26A manufactured by Nippon Electric Glass Co., Ltd.
- the dimensions of the frame are an outer dimension of 6.0 mm ⁇ 1.7 mm, an inner dimension of 5.4 mm ⁇ 1.1 mm, and a thickness of 0.6 mm.
- positioning a frame and a 1st glass substrate so that the bottom part of a frame and a 1st sealing material layer may contact it bakes at 620 degreeC for 10 minutes, a frame and a 1st glass substrate Sealed.
- the material was sintered to form a second sealing material layer on the upper edge of the frame. In addition, it was about 6 micrometers when the average thickness of the 2nd sealing material layer was measured with the non-contact-type laser film thickness meter.
- a second glass substrate (OA-10G manufactured by Nippon Electric Glass Co., Ltd.) was also prepared.
- the size of the second glass substrate is 6.0 mm ⁇ 1.7 mm ⁇ 0.1 mm thick.
- laser beam with a wavelength of 808 nm is 2nd sealing material from the 2nd glass substrate side.
- the laser beam irradiation speed was 10 mm / s and the output was 10 W.
- the obtained airtight package was subjected to a high-temperature, high-humidity and high-pressure test: HAST (Highly Accelerated Temperature and Humidity Stress test), and then the frame body and the second glass substrate were observed. No peeling was observed. It was. This result has shown that the sealing strength of a frame and a 2nd glass substrate is high.
- the HAST conditions are 121 ° C., humidity 100%, 2 atm, and 24 hours.
- the airtight package shown in Table 3 was prepared in the same manner as in [Example 1] except for the second glass substrate and frame material, and laser sealing conditions (Sample Nos. 1 to 6). Furthermore, sample no. The above adhesiveness and HAST were evaluated for 1 to 6. As a result, sample no. Nos. 1 to 6 were good in adhesion and HAST.
- non-alkali glass is OA-10G manufactured by Nippon Electric Glass Co., Ltd.
- alkaline borosilicate glass is BLC manufactured by Nippon Electric Glass Co., Ltd.
- LTCC is a sintered body of green sheet laminate (material: Nippon Electric Glass Stock It refers to the company MLS-26A).
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Abstract
Description
10 第一のガラス基板
11 第一の封着材料層
12 枠体
12a 枠体の底部
12b 枠体の上縁部
13 第二の封着材料層
14 収容部材
15 第二のガラス基板
16 レーザー光
Claims (10)
- (1)第一のガラス基板を用意すると共に、第一のガラス基板上に第一の封着材料層を形成する工程と、(2)上部に開口部を有する枠体を用意すると共に、枠体の底部と第一の封着材料層が接触するように、枠体と第一のガラス基板を配置した後、第一の封着材料層を介して枠体と第一のガラス基板を封着する工程と、(3)枠体の上縁部に第二の封着材料層を形成する工程と、(4)枠体内に収容部材を収容する工程と、(5)第二のガラス基板を用意すると共に、第二のガラス基板と第二の封着材料層が接触するように、第二のガラス基板を配置した後、レーザー光を第二のガラス基板側から第二の封着材料層に向けて照射し、第二の封着材料層を介して第二のガラス基板と枠体を封着して、気密パッケージを得る工程と、を備えることを特徴とする気密パッケージの製造方法。
- 第一の封着材料を含むペーストを第一のガラス基板上に塗布、焼成して、第一の封着材料の焼結体からなる第一の封着材料層を形成することを特徴とする請求項1に記載の気密パッケージの製造方法。
- 第一の封着材料として、ビスマス系ガラス粉末 55~95体積%、耐火性フィラー粉末 5~45体積%を含有する封着材料を用いることを特徴とする請求項1又は2に記載の気密パッケージの製造方法。
- 枠体として、グリーンシートの焼結体を用いることを特徴とする請求項1~3の何れかに記載の気密パッケージの製造方法。
- 第一の封着材料層を焼成して、枠体と第一のガラス基板を封着することを特徴とする請求項1~4の何れかに記載の気密パッケージの製造方法。
- 第二の封着材料を含むペーストを枠体の上縁部に塗布、焼成して、第二の封着材料の焼結体からなる第二の封着材料層を形成することを特徴とする請求項1~5の何れかに記載の気密パッケージの製造方法。
- 第二の封着材料として、ビスマス系ガラス粉末 55~95体積%、耐火性フィラー粉末 5~45体積%、耐熱顔料 1~15体積%を含有する封着材料を用いることを特徴とする請求項6に記載の気密パッケージの製造方法。
- 第二の封着材料層の平均厚みを10μm未満とすることを特徴とする請求項1~7の何れかに記載の気密パッケージの製造方法。
- 収容部材として、圧電振動子素子又は蛍光体粒子を分散させた樹脂を用いることを特徴とする請求項1~8の何れかに記載の気密パッケージの製造方法。
- 請求項1~9の何れかに記載の気密パッケージの製造方法により作製されてなることを特徴とする気密パッケージ。
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US15/576,922 US10377086B2 (en) | 2015-05-28 | 2016-05-16 | Manufacturing method for airtight package |
KR1020177023469A KR20180015610A (ko) | 2015-05-28 | 2016-05-16 | 기밀 패키지의 제조 방법 |
CN201680015812.0A CN107431045B (zh) | 2015-05-28 | 2016-05-16 | 气密封装体及其制造方法 |
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JP2015108176A JP6493798B2 (ja) | 2015-05-28 | 2015-05-28 | 気密パッケージの製造方法 |
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JP6913279B2 (ja) * | 2017-02-27 | 2021-08-04 | 日本電気硝子株式会社 | 気密パッケージ |
JP7082309B2 (ja) * | 2017-03-24 | 2022-06-08 | 日本電気硝子株式会社 | カバーガラス及び気密パッケージ |
TW201901866A (zh) * | 2017-05-23 | 2019-01-01 | 日商日本電氣硝子股份有限公司 | 氣密封裝體之製造方法及氣密封裝體 |
JP7047270B2 (ja) * | 2017-07-14 | 2022-04-05 | 日本電気硝子株式会社 | 封着材料層付きパッケージ基体の製造方法及び気密パッケージの製造方法 |
CN110972418B (zh) * | 2018-09-30 | 2022-01-07 | 比亚迪股份有限公司 | 电子设备壳体、电子设备和复合体 |
JP7360085B2 (ja) * | 2019-06-05 | 2023-10-12 | 日本電気硝子株式会社 | 粉末材料及び粉末材料ペースト |
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JP2010012595A (ja) * | 2008-07-01 | 2010-01-21 | Commiss Energ Atom | 吊り下げゲッター材料ベース構造 |
JP2011182155A (ja) * | 2010-03-01 | 2011-09-15 | Seiko Epson Corp | 圧電デバイスと圧電デバイスの製造方法 |
JP2015023263A (ja) * | 2013-07-24 | 2015-02-02 | 日本電気硝子株式会社 | 電気素子パッケージの製造方法及び電気素子パッケージ |
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JP2005222895A (ja) * | 2004-02-09 | 2005-08-18 | Hitachi Displays Ltd | 画像表示装置及びその製造方法 |
JP2008186697A (ja) | 2007-01-30 | 2008-08-14 | Univ Of Tokyo | パネル体の製造方法 |
JP2012014971A (ja) * | 2010-07-01 | 2012-01-19 | Asahi Glass Co Ltd | 電子デバイス及びその製造方法 |
CN103078063B (zh) * | 2013-01-30 | 2015-12-23 | 四川虹视显示技术有限公司 | 一种oled封装结构 |
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- 2016-05-16 US US15/576,922 patent/US10377086B2/en active Active
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JP2010012595A (ja) * | 2008-07-01 | 2010-01-21 | Commiss Energ Atom | 吊り下げゲッター材料ベース構造 |
JP2011182155A (ja) * | 2010-03-01 | 2011-09-15 | Seiko Epson Corp | 圧電デバイスと圧電デバイスの製造方法 |
JP2015023263A (ja) * | 2013-07-24 | 2015-02-02 | 日本電気硝子株式会社 | 電気素子パッケージの製造方法及び電気素子パッケージ |
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US10377086B2 (en) | 2019-08-13 |
KR20180015610A (ko) | 2018-02-13 |
JP2016225383A (ja) | 2016-12-28 |
CN107431045A (zh) | 2017-12-01 |
JP6493798B2 (ja) | 2019-04-03 |
TWI680594B (zh) | 2019-12-21 |
US20180147787A1 (en) | 2018-05-31 |
CN107431045B (zh) | 2020-02-07 |
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