WO2016182352A1 - 소자핸들러 - Google Patents

소자핸들러 Download PDF

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Publication number
WO2016182352A1
WO2016182352A1 PCT/KR2016/004948 KR2016004948W WO2016182352A1 WO 2016182352 A1 WO2016182352 A1 WO 2016182352A1 KR 2016004948 W KR2016004948 W KR 2016004948W WO 2016182352 A1 WO2016182352 A1 WO 2016182352A1
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WIPO (PCT)
Prior art keywords
unit
burn
buffer
board
test
Prior art date
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PCT/KR2016/004948
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English (en)
French (fr)
Korean (ko)
Inventor
유홍준
Original Assignee
(주)제이티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)제이티 filed Critical (주)제이티
Priority to CN201680024865.9A priority Critical patent/CN107533102B/zh
Priority to SG11201708899UA priority patent/SG11201708899UA/en
Publication of WO2016182352A1 publication Critical patent/WO2016182352A1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Definitions

  • the present invention relates to a device handler, and more particularly, to a device handler for loading or withdrawing a device such as a semiconductor chip on a burn-in board.
  • 'devices' Semiconductor devices (hereinafter referred to as 'devices') undergo various tests such as electrical properties, heat or pressure reliability tests after the packaging process is completed.
  • the burn-in test is a burn-in test, in which a plurality of devices are inserted into a burn-in board, and the burn-in board is placed in a burn-in test apparatus to apply heat or pressure for a predetermined time. It is a test to determine if a defect occurs in the back device.
  • the device handler for burn-in test generally classifies (unloads) the device into each tray according to the classification criteria given according to the inspection result for each device such as good or bad from the burn-in board that has loaded the device that has undergone the burn-in test. It is a device that inserts (loads) a new device to perform burn-in test again in the empty place (socket) of burn-in board.
  • the performance of the device handler as described above is evaluated as the number of sorts per unit (UPH), UPH is depending on the time required to transfer the device, the burn-in board transfer between the components constituting the device handler Is determined.
  • UPH the number of sorts per unit
  • the type of the device to be sorted that is, the standard may be different.
  • the loading unit and the unloading unit may load a tray corresponding to the standard, and the DC test unit, the socket press on the burn-in board, the moving buffer, etc.
  • Members that meet the corresponding device specifications in the device has to be replaced by manual operation of the user, there is a problem that the replacement work is cumbersome.
  • BGA devices Vege devices
  • a plurality of balls are provided on the bottom surface instead of a lead projecting to the side as a terminal for coupling with an external terminal.
  • the inspection of the BG element is generally performed by being inserted into a socket in which a plurality of contact pins, so-called pogo pins, corresponding to the respective balls are contacted.
  • test socket for such a BG element is disclosed in registered Utility Model No. 20-0463425.
  • registered utility model No. 20-0463425 has an additional adapter installed on the test socket for guiding upon loading of a BG element so that the alignment between the contact pin and the ball terminal is always kept constant and the connection state is maintained. It can be kept constant, so that the accurate inspection of the device is effected.
  • the adapter structure disclosed in Korean Utility Model Registration No. 20-0463425 has to have a lateral spacing between the side of the device and the adapter for stable loading of the device. Due to such lateral spacing, the alignment between the contact pins and the ball terminals is poor. There is a disturbing problem.
  • the device when the device is unloaded from the test socket, the device is caught by the adapter to stop the operation of the device, thereby reducing the efficiency of the inspection work.
  • An object of the present invention is to provide a device handler for stably loading or withdrawing a device such as a semiconductor chip onto a burn-in board.
  • the loading unit 100 is loaded with a tray 30 is loaded with the elements to be burn-in test;
  • Disclosed is a device handler including an unloading unit in which good quality devices are stacked on a tray 30 among the stacked burn-in tested devices.
  • the device handler is a DC test unit that receives a device to be burned test from the loading unit 100 before loading the device to be burned test on the burn-in board 20 to test the DC characteristics of the device in advance It may further include 170.
  • the device handler may further include a sorting unit 300 configured to classify and load devices, which are determined to be a defective DC characteristic test result of the DC test unit 170, and devices that are determined to be bad as a result of the burn-in test. .
  • the device handler includes: a first moving buffer 600 temporarily loaded before the device having completed the DC characteristic test in the DC test unit 170 is loaded on the burn-in board 20;
  • the burn-in test device withdrawn from the X-Y table 410 may further include a second moving buffer 700 temporarily loaded.
  • the device handler may include the DC test unit 170, the socket press 45 on the XY table 410, the first moving buffer 600, and the second moving buffer 700 according to the specification of the device on which the burn-in test will be performed.
  • the kit exchange unit 900 for automatically replacing at least one of the exchange kit may further include.
  • the kit exchange unit 900, the main body portion 901 is provided with a buffer space 910 for temporarily storing the exchange kit to be exchanged, and the exchange kit installed in the main body 40 of the element handler to draw out the buffer space (
  • An exchange unit 930 may be temporarily stored in the 920 and exchanged with a new replacement kit in the main body 40 of the device handler.
  • the replacement kit is the DC test unit 170
  • the DC test unit 170 is inserted in the moving direction, and the electrical connection unit 171 for electrical connection with the DC test unit 170 is connected to the element handler. It may be installed in the body 40.
  • the device handler includes: a third transfer tool (510) for transferring devices between the loading unit (100) and the DC test unit (170); A fourth transfer tool (520) for transferring elements between the DC test unit (170) and the first moving buffer (600); A fifth transfer tool (550) for transferring elements between the second moving buffer (700) and the unloading portion (200); One or more sorting tools may be used to transfer elements between the first and second moving buffers 600 and 700 and the sorting unit 300.
  • the one or more sorting tools may include a first sorting tool (560) for transferring elements between the first moving buffer (600) and the sorting unit (300); It may include a second sorting tool 570 for transferring elements between the second moving buffer 700 and the sorting unit 300.
  • the exchange kit may include one or more fixed elements installed in the element accommodating part 610 of the first moving buffer 600, the element accommodating part 710 of the second moving buffer 700, and the element handler body 40.
  • a buffer wherein the element accommodating part 610 of the first moving buffer 600, the element accommodating part 710 of the second moving buffer 700, and the fixed buffer have the same structure, and the first moving buffer has the same structure.
  • the element accommodating part 610 of the 600 and the element accommodating part 710 of the second moving buffer 700 may be replaced by the element accommodating part 610 and the second moving part of the first moving buffer 600.
  • the exchange of the fixed buffer is at least one of the ends of the first moving buffer 600 and the second moving buffer 600 Can be done.
  • the exchange kit may include one or more fixed elements installed in the element accommodating part 610 of the first moving buffer 600, the element accommodating part 710 of the second moving buffer 700, and the element handler body 40.
  • a buffer wherein the element accommodating part 610 of the first moving buffer 600, the element accommodating part 710 of the second moving buffer 700, and the fixed buffer have the same structure, and the first moving buffer has the same structure.
  • the element accommodating part 610 of the 600, the element accommodating part 710 of the second moving buffer 700, and the fixed buffer are replaced with the element accommodating part 610 of the first moving buffer 600.
  • the second receiving buffer 710 of the element receiving portion 710 may be discharged in the linear movement direction of the other.
  • a socket press unit 90 for pressing the test socket installed in the burn-in board 20 in order to withdraw or load the device from the burn-in board (20).
  • the socket press unit 90 includes: a loading socket press 92 having a loading opening 92a for guiding an element to be burn-in test loaded in the test socket;
  • the test socket may include an unloading socket press 92 having an unloading opening 91a for guiding the pull-out tested device to be drawn out.
  • the unloading opening 91a may have a size larger than that of the loading opening 92a so that the withdrawal of the device may not be disturbed in the test socket.
  • the loading socket press 92 and the unloading socket press 91 may be disposed in an arrangement direction of the loading unit 100 and the unloading unit 200.
  • the first transfer tool 530 and the second transfer tool 540 correspond to the loading socket press 92 and the unloading socket press 91 so as to correspond to the loading unit 100 and the unloading. It may be installed at intervals in the arrangement direction (Y-axis direction) of the unit 200.
  • the device handler may further include a bin tray supply unit 80 installed in parallel with one side of the loading unit 100 to load a plurality of bin trays 30 to be loaded on the burn-in board 20. .
  • the device handler according to the present invention has the advantage that the device can be stably loaded or taken out stably.
  • the device handler according to the present invention is capable of stable loading or unloading of the device by using different adapter members used for loading the device and adapters for unloading the device, and thus quickly loading or unloading the device. This has a possible advantage.
  • the device handler according to the present invention automatically changes the DC test unit, the socket press on the XY table, and the buffer unit according to the specifications of the device when the size of the device to be sorted is changed, that is, when a tray containing the device of the changed standard is loaded.
  • Including a kit exchanger to replace has an advantage of significantly increasing the processing speed by shortening the replacement time of the DC test unit or the like.
  • FIG. 1 is a conceptual diagram illustrating an example of a device handler according to the present invention.
  • FIG. 2 is a plan view illustrating a configuration of the device handler of FIG. 1.
  • FIG. 3 is a cross-sectional view illustrating the configuration of first and second mobile buffers of the device handler of FIG. 1.
  • FIG. 4 is a layout view illustrating a process of moving an X-Y table and a burn-in board in the device handler of FIG. 1.
  • FIG. 5 is a conceptual diagram illustrating a process of exchanging a burn-in board between an X-Y table and a burn-in board exchange buffer unit in the device handler of FIG. 1.
  • 5A shows a state before the burn-in board is first exchanged between the X-Y table and the burn-in board replacement buffer section.
  • 5B shows a state after the burn-in board is exchanged between the X-Y table and the burn-in board replacement buffer section.
  • 5C and 5D are views illustrating a process of exchanging a burn-in board between the X-Y table and the burn-in board exchange buffer unit.
  • FIG. 6 is a conceptual diagram illustrating a process of exchanging a burn-in board between a burn-in board exchange buffer unit and a board loader in the device handler of FIG. 1.
  • Figure 6a is a state before replacing the burn-in board between the burn-in board replacement buffer unit and the board loader
  • Figure 6b is a middle state that the burn-in board is introduced into the rack of the board loader between the burn-in board exchange buffer unit and the board loader,
  • 6C is a view illustrating a state where a burn-in board is inserted into a rack of a board loader between a burn-in board exchange buffer unit and a board loader.
  • Figure 6d is a middle state that the burn-in board is drawn out from the rack of the board loader between the burn-in board exchange buffer unit and the board loader,
  • 6E is a conceptual diagram illustrating a state where a burn-in board is drawn out from the rack of the board loader between the burn-in board exchange buffer unit and the board loader.
  • FIG. 7 is a side view showing the configuration of the board loader.
  • FIG. 8A is a side cross-sectional view illustrating a burn-in board exchange buffer unit and a board loader having a modified configuration in the device handler of FIG. 1.
  • FIG. 8B is a side view illustrating the board loader of FIG. 8A.
  • FIG. 9 is a conceptual diagram illustrating a modification of the device inspection apparatus of FIG. 2.
  • FIG. 10 is a conceptual diagram illustrating an exchange process when an exchange kit is a test unit in the device inspection apparatus of FIG. 2.
  • FIG. 11 is a partial plan view illustrating an exchange process of the exchange kit of FIG. 10.
  • FIG. 12 is a plan view showing a device handler according to a modified first embodiment of the present invention.
  • FIG. 13 is a plan view illustrating a modification of the device handler of FIG. 12.
  • FIG. 14 is a plan view illustrating a device handler according to a second modified embodiment of the present invention.
  • 15A and 15B are partial plan views illustrating a process of transferring the first transfer tool and the second transfer tool among the device handlers of FIG. 14.
  • the device handler includes a plurality of devices for transporting the loading unit 100, the unloading unit 200, the sorting unit 300, and the elements 10. It comprises a transfer tool (510, 520, 530, 540, 550, 560, 570).
  • the burn-in board 20 refers to a board on which the first devices 10 are loaded so as to undergo a burn-in test in a burn-in test apparatus (not shown). 10) each have sockets into which they are inserted.
  • the burn-in board 20 is mounted on the X-Y table 410 installed in the device handler to unload the second devices 10 that have undergone the burn-in test and to load the first devices 10.
  • the XY table 410 loads the burn-in board 20 into which the second elements 10 are inserted and simultaneously unloads the burn-in board 20 into which the first elements 10 are inserted.
  • the burn-in board 20 to be replaced with the element 10 is supplied or the burn-in board 20 after the replacement of the element 10 is discharged.
  • Burn-in board exchanger (not shown).
  • the first elements 10 may be inserted into the empty positions of the burn-in board 20 by the first transfer tool 530, or the second elements 10 may be withdrawn from the burn-in board 20. It is configured to be driven by the XY table driver (not shown) to move the burn-in board (20).
  • the XY table driving unit includes a second transfer tool 540 and a first transfer tool to facilitate the second transfer tool 540 and the first transfer tool 530 to withdraw or load the elements 10 from the burn-in board 20.
  • Various configurations such as XY movement or XY- ⁇ movement of the XY table 410 loaded with the burn-in board 20 in conjunction with 530 may be possible.
  • the XY table driving unit withdraws the second elements 10 from the burn-in board 20 in cooperation with the second transfer tool 540 and the first element 10 in conjunction with the first transfer tool 530.
  • move the XY table 410 to the burn-in board replacement position It can be configured to.
  • the XY table 410 is installed in the main body 40 constituting the element handler according to the present invention, the main body 40 is the second transfer tool 540 and the first transfer tool 530 is the element 10 It may include a top plate 42 is formed with an opening 41 for pulling out or loading them from the burn-in board (20).
  • the upper side of the X-Y table 410 is provided with a socket press 45 for pressing the socket installed on the burn-in board 20 for the convenience of device withdrawal and loading in the burn-in board (20).
  • the socket press 45 to enable the withdrawal of the device plugged into the socket of the burn-in board 20 or to be stacked, and various configurations are possible according to the socket structure of the burn-in board 20.
  • the loading unit 100 is a configuration for loading the tray 30 (hereinafter referred to as a 'loading tray') on which the plurality of first elements 10 to be loaded on the burn-in board 20 may be loaded. Do.
  • the unloading unit 200 is configured to load and unload good elements (hereinafter referred to as 'good quality') among the second elements 10 in the tray 30 (hereinafter referred to as 'unloading tray').
  • 'good quality' the second elements 10 in the tray 30
  • 'unloading tray' the tray 30
  • the loading unit 100 and the unloading unit 200 each have a pair of guide rails 110 and 210 for guiding the tray 30 to be moved, and the tray 30. It is generally configured to include a drive unit (not shown) for moving the.
  • the loading unit 100 and the unloading unit 200 may be variously arranged according to design conditions, as shown in FIGS. 1 and 2, the test unit 170, the unloading unit 200, and sorting.
  • the unit 300, the first moving buffer 600, the second moving buffer 700, and the like are generally disposed in parallel with each other so as to be interposed therebetween, but are not limited thereto.
  • the empty trays 30 are unloaded so that the second devices 10 may be loaded by a tray transfer unit (not shown). It may be delivered to the unit 200.
  • the element 10 may remain in the tray 30, so that the elements 10 remaining in the tray 30 before the tray 30 is transferred from the loading unit 100 to the unloading unit 200.
  • the tray 30 to rotate the tray 30 to remove the remaining element 10 may be additionally installed.
  • the tray rotating unit 150 is installed on the transfer path of the tray 30 between the loading unit 100 and the unloading unit 200, and the loading unit ( The tray 30 is received from the 100, and the tray 30 is rotated, and then the tray 30 is transferred to the unloading unit 200.
  • one side of the tray rotating unit 150 supplies the empty tray 30 to the sorting unit 300, the unloading unit 200, etc. in addition to the sorting unit 300, or supplies the empty tray 30 from the loading unit 100.
  • a bin tray part (not shown) that can be temporarily loaded may be additionally installed.
  • the device handler supplies the first devices 10 from the loading units 100 before loading the burned board 20 in order to load only the good first device 10 on the burn-in board 20.
  • a test unit 170 may be additionally installed to test electrical characteristics such as DC characteristics of the device 10 in advance.
  • the test unit 170 is installed between the loading unit 100 and the first moving buffer 600, it is possible to configure a variety of configurations, such as consisting of a plurality of sockets that can be electrically connected to the first element (10) Preferably, the same number of sockets as the horizontal number of the trays 30 in the horizontal direction may be installed.
  • test result of each of the first elements 10 of the test unit 170 is used as data for sorting in the sorting unit 300 to be described later.
  • the device handler classifies the second defective devices 10 that need classification among the first defective devices 10 and the second devices 10 that are determined to be defective by the test unit 170. It may include a sorting unit 300 for loading.
  • the sorting unit 300 may be configured in various ways according to its arrangement and classification criteria, and according to each classification criteria (Good, Bad Reject 1, Bad 2, DC Failure, etc.) It includes a suitable number of trays 30 (sorting trays), which are loaded, and have a configuration similar to that of the loading unit 100 described above, or fixed to the main body 40, as shown in Figures 1 and 2 It may be disposed between the loading unit 100 and the unloading unit 200 in the state.
  • each classification criteria Good, Bad Reject 1, Bad 2, DC Failure, etc.
  • the sorting unit 300 is a fixed installation as shown in Figures 1 and 2, in addition to the configuration of the loading unit 100 and the unloading unit 200 similar to the configuration of the tray 30, respectively It may be configured to include a pair of guide rails to guide so as to guide, and a drive unit (not shown) for moving the tray (30).
  • the transfer tool includes a burn-in board 20 and a loading unit 100, a test unit 170, an unloading unit 200, a sorting unit 300, a first moving buffer 600, a second moving buffer (to be described later)
  • a configuration for transferring the elements 10 between the 700 various configurations are possible according to the arrangement of each configuration.
  • the transfer tool may include a third transfer tool 510 for transferring the elements 10 between the loading unit 100 and the test unit 170, the test unit 170, and the first moving buffer 600.
  • the first moving buffer 600 and one or more sorting tools 560 and 570 for transferring the elements 10 between the second moving buffer 700 and the sorting unit 300 may be included.
  • the transfer tool (510, 520, 530, 540, 550, 560, 570) is an element loaded on the tray 30 of the loading unit 100 between the first moving buffer 600 and the burn-in board (20) 10, the second element 10 from the burn-in board 20 between the first transfer tool 530 and the burn-in board 20 and the second moving buffer 700, which are received and inserted into the empty positions of the burn-in board 20. It may be configured to include a second transfer tool 540 for transferring the).
  • the arrangement of the elements 10 loaded on the burn-in board 20 is different from the arrangement of the elements 10 loaded on the tray 30 such as the loading unit 100, and the arrangement on the burn-in board 20 is relative. As many as.
  • the first transfer tool 530 and the second transfer tool 540 for transferring or withdrawing the element 10 to the burn-in board 20 are configured to transfer a large number of elements 10 relative to the remaining transfer tools. This is preferred.
  • the first transfer tool 530 and the second transfer tool 540 may be 12 ⁇ 2, and the remaining transfer tools may be 8 ⁇ 1, 8 ⁇ 2, or the like.
  • the use of the transfer tool for transferring a small number of elements 10 in a position requiring a relatively small number of transfers This can reduce the manufacturing cost of the device and at the same time improve the size and stability of the device.
  • first transfer tool 530 and the second transfer tool 540 may be configured to move integrally with each other in consideration of alternate loading and withdrawal of the element 10 on the burn-in board 20.
  • the third transfer tool 510 and the fourth transfer tool 520 are also transferred to the device 10 with the test unit 170 therebetween, the third transfer tool 510 and the fourth transfer tool 520 may be configured to move integrally with each other.
  • the number of pickers of the first transfer tool 530 and the second transfer tool 540 in the horizontal direction may be determined by considering the efficiency of the device 10 in the first and second moving buffers 600 and 700. It may be configured to be equal to the number of transverse direction of the device receiving groove (not shown) for the loading of the (10).
  • the sorting tools 560 and 570 may be configured in various ways such as one or a plurality.
  • the sorting tools 560, 570 are shown in FIGS. 1, 2, and 9 in order to quickly sort the elements 10 to be classified as defective in the first moving buffer 600 and the second moving buffer 700.
  • the second sorting tool 570 to transfer the elements 10 in the may be configured.
  • the first sorting tool 560 may be defective in the DC test unit 170 of the elements 10 contained in the first moving buffer 600 while moving between the first moving buffer 600 and the sorting unit 300.
  • the device 10 may be transferred while moving in the sorting tool moving area, such as by loading the inspected device 10 in a tray designated as DC defective among the trays arranged in the sorting unit 300.
  • the first sorting tool 560 is configured to move to the DC test unit 170, in addition to between the first moving buffer 600 and the sorting unit 300, thereby failing in the DC test unit 170
  • the inspected device 10 may be directly loaded into a tray designated as DC defective among the trays arranged in the sorting unit 300.
  • the DC test unit 170 horizontally moves the device 10 inspected as defective downwards in the drawing so that the first sorting tool 560 includes The element 10 can be transferred without interference of movement with the four transfer tool 520.
  • the second sorting tool 570 is a good device among the elements 10 contained in the second moving buffer 700 for transferring the elements 10 between the second moving buffer 700 and the sorting unit 300.
  • the device 10 may be transferred while moving in the sorting tool moving area, such as by loading the device 10 in one or more trays installed in the sorting unit 300 according to the classification level except for the following.
  • the sorting tools 560 and 570 are composed of the first sorting tool 560 and the second sorting tool 570, a faster device classification may be achieved.
  • any one of the trays of the sorting unit 300 may be used.
  • the element sorting of the first sorting tool 560 and the second sorting tool 570 is impossible.
  • the sorting unit 300 may include a buffer tray for temporarily stacking the trays when all the elements of the corresponding classification level are loaded in any one of the trays of the sorting unit 300, or may be classified into another classification class. After temporarily loading an element into the tray of the tray, the trays in which all of the classifiers are loaded may be configured to reload the temporarily loaded element after the new tray is replaced.
  • the transfer tools may include a picker transfer device for moving one or more pickers and pickers in the XZ, YZ, or XYZ directions, each of which has an adsorption head for adsorbing the element 10 by vacuum pressure at an end thereof. .
  • the transfer tools may be arranged in a row, pickers arranged in a row, such as 12 ⁇ 2.
  • the device handler loads the first devices 10 on the burn-in board 20 from the loading unit 100 or draws out the second devices 10 from the burn-in board 20 to the unloading unit 200.
  • the burn-in board 20 and the unloading unit 200 respectively, so as to improve the loading and withdrawal speed of the first device 10 and the first
  • the two elements 10 may include first moving buffers 600 and second moving buffers 700 that are temporarily loaded and transferred.
  • the first moving buffer 600 and the second moving buffer 700 are installed on the main body 40 so as to be movable so as to replace the element and the burn-in board 20 and the element replacement position 3, the loading unit 100 or unloading
  • the sorting operation speed is remarkably improved by moving the element replacement position 1 for exchanging the element with the part 200 and the sorting position 2 for exchanging the element with the sorting part 300 so that the exchange of the element 10 is made smoothly and seamlessly. Can be improved.
  • the first moving buffer 600 is a loading position (element replacement position) 1 and the first defective element (1) to receive and load the first element 10 from the test unit 170 by the second transfer tool 540 10) a sorting position 2 for transferring the sorting tools 300 to the sorting tray 30 of the sorting unit 300 by the sorting tools 560 and 570 and the remaining first devices 10 from which the first defective devices 10 are removed.
  • the third transfer tool 510 is configured to move to the loading position (element replacement position) (3) to be loaded on the burn-in board 20 of the XY table (410).
  • the first movable buffers 600 are movable to support the main body 40 with the element accommodating part 610 and the element accommodating part 610 on which the elements 10 are loaded. It comprises a guide member 620 and a moving device (not shown) for moving the element accommodating portion 610 through the guide member 620.
  • the element accommodating part 610 has a number of elements 10 in the horizontal direction of the element accommodating groove for loading the element 10 so that a larger number of elements 10 can be loaded at the mounting position 3. ) Is more than the number of transverse directions of the element receiving groove for loading.
  • the element accommodating part 610 is configured to stack the elements 10, and may be configured to directly load the elements 10 or may vary in size depending on the type of the element 10 to be sorted. They may include a separate receiving member (610a) formed.
  • the first moving buffers 600 are preferably configured in three so that the process may be simultaneously performed in each of the positions 1, 2, and 3.
  • the guide member 620 is configured not to interfere with other guide member 620 during movement.
  • the first moving buffers 600 are supported by the first element accommodating part 611 and the second guide member 622 which are supported by the first guide member 621 and move horizontally.
  • the second element accommodating part 612 supported and horizontally moved and the third element accommodating part 613 supported by the third guide member 623 and horizontally moved may be included.
  • the first to third guide members 621, 622, and 623 are configurations for guiding the respective element accommodating parts 611, 612, and 613 to be horizontally moved, and various configurations are possible, and are illustrated in FIG. 4.
  • the first guide member 621 is installed on the upper portion, that is, the upper end of the supporting member 640 of the main body 40
  • the second guide member 622 is the middle portion of the supporting member 640, that is, the middle portion.
  • the third guide member 623 may be installed at the lower side of the support member 640, that is, at the lower end or on the upper plate 42 of the main body 40.
  • the first to third guide members 621, 622, and 623 may be configured in pairs to stably support the element accommodating part 620.
  • the moving device 630 for horizontally moving the first to third guide members 621, 622, and 623 may be configured in various ways according to a driving method, and the first to third guide members 621, 622, and 623 may be used. It may include first to third mobile devices (631, 632, 633) for horizontally moving them.
  • the first to third moving devices 631, 632, and 633 are respectively a motor generating a rotational force and a belt, in particular, a timing belt and a pulley, coupled to the first to third guide members 621, 622, and 623. It can be configured by a combination of.
  • the first mobile buffers 600 are loaded at the loading position 1, that is, the first device 10 is loaded from the test unit 170 to the device receiving unit 610.
  • the first devices 10 loaded into the device accommodating part 610 include the first defective devices 10 determined as defective in the test part 170.
  • the first moving buffers 600 are moved to the sorting position 2 to sort the first defective elements 10 after the loading of the elements 10 at the loading position 1 is completed.
  • the first defective element 10 is transferred from the element accommodating part 610 to the sorting part 300 by a first sorting process, that is, a transfer tool. At this time, each of the first defective elements 10 is loaded on the tray 30 of the sorting unit 300 according to the defect standard.
  • the element determined as a good result of the test of the test unit 170 (hereinafter referred to as 'first normal element') ( 10) may be filled with the first normal elements 10 from a first fixed buffer (not shown) preloaded-buffering process.
  • the first fixed buffer is installed in the main body 40, the test result, the first normal element 10 is pre-loaded, the first moving buffer 600 when the first moving buffer 600 is placed in the sorting position 2 when empty or during operation
  • the first normal devices 10 may be loaded in the device accommodating part 610 of the first moving buffer 600.
  • the first normal elements 10 loaded on the first moving buffer 600 are loaded on the burn-in board 20 by a transfer tool.
  • the loading process is performed again by moving from the loading position 3 to the loading position 1 so that the first elements 10 can be loaded.
  • the second moving buffer 700 has a configuration similar to that of the first moving buffer 600, and receives the second elements 10 from the burn-in board 20 to be loaded by the second transfer tool 540 ( Element replacement position) and the sorting position 2 for transferring the second defective elements 10 to the tray 30 of the sorting unit 300 by the sorting tray transfer tool, and the second defective elements 10 are removed. It is configured to repeatedly move the remaining second element 10 to the unloading position (element replacement position) 1 that is loaded on the tray 30-the unloading tray-by the fifth transfer tool 550.
  • the second mobile buffer 700 having the configuration as described above has a similar configuration to the first mobile buffer 700, and as shown in Figure 3, the element accommodating portion 710 on which the elements 10 are loaded, And a guide member 720 for movably supporting the element accommodating part 710 to the main body 40 and a moving device 730 for horizontally moving the element accommodating part 710 through the guide member 720. do.
  • the element accommodating part 710 has a horizontal number of element accommodating grooves for loading the element 10 so that a larger number of elements 10 can be loaded at the mounting position 3. It is better than the number of transverse direction of the element receiving groove for loading.
  • the element accommodating part 710 is configured to load the elements 10, and may be configured to directly load the elements 10 or may vary in size depending on the type of the element 10 to be sorted. They may be formed of a separate receiving member (610a) formed.
  • the second moving buffer 700 may be configured in three so that the process may be performed at each position (1, 2, 3).
  • the guide member 720 is configured not to interfere with other guide member 720 during movement.
  • the second moving buffers 700 are supported by the first element accommodating part 711 and the second guide member 722 which are supported by the first guide member 721 and move horizontally.
  • the second element accommodating part 712 supported and horizontally moved and the third element accommodating part 713 supported and horizontally moved by the third guide member 723 may be configured.
  • the first to third guide members 721, 722, and 723 are configurations for guiding the buffers 711, 712, and 713 to be horizontally moved. Various configurations are possible, as shown in FIG. 4.
  • the first guide member 721 is installed on the upper portion, that is, the upper end of the supporting member 740 of the main body 40, and the second guide member 722 is the supporting member 740 of the first guide member 721.
  • the third guide member 723 may be installed on the lower portion of the support member 740, that is, the lower end or the upper plate 42 of the main body 40.
  • the first to third guide members 721, 722, and 723 may be configured in pairs to stably support the element accommodating part 720.
  • the moving device 730 for horizontally moving the first to third guide members 721, 722, and 723 may be configured in various ways according to a driving method, and the first to third guide members 721, 722, and 723 may be used.
  • the first to the third mobile devices (731, 732, 733) for horizontally moving them may be included.
  • the first to third moving devices 731, 732, and 733 are respectively a motor generating a rotational force, and a belt, in particular, a timing belt and a pulley coupled to the first to third guide members 721, 722, and 723. It can be configured by a combination of.
  • the second moving buffer 700 having the configuration as described above operates in a similar manner to the first moving buffer 600, and the second element 10 from the burn-in board 20 at the loading position 3 has an element accommodating portion ( 710, a stacking process, a second sorting process of transferring the second defective elements 10 to the sorting unit 300 at the sorting position 2, and unloading the remaining second elements 10 at the unloading position 1.
  • the unloading process of transferring to the tray 30 of the unit 200 is performed.
  • the same number of elements as the number of elements 10 loaded in the first moving buffer 600, for example, elements arranged such as 12 ⁇ 2 are transferred at a time.
  • the second defective elements 10 are transferred from the element accommodating part 710 to the sorting part 300 by a transfer tool. At this time, each of the second defective elements 10 is loaded on the tray 30 of the sorting unit 300 according to the defect standard.
  • the second normal elements 10 may be formed from a second fixed buffer (not shown) in which the second normal elements 10 are previously loaded. Can be filled-the buffering process.
  • the second fixed buffer is installed in the main body 40, the second normal element 10 is pre-loaded, when the first move or empty during the second movement buffer 700 is moved to the second position in the sorting position 2
  • the second normal devices 10 may be loaded in the device accommodating part 710 of the buffer 700.
  • FIG. 5 is a conceptual diagram illustrating a process of exchanging burn-in boards between the XY table and the burn-in board exchange buffer unit in the device handler of FIG. 1, and FIG. 5A illustrates a state before exchanging the burn-in board between the XY table and the burn-in board exchange buffer unit.
  • 5B is a view illustrating a state after the burn-in board is exchanged between the XY table and the burn-in board exchange buffer unit
  • FIG. 6 is a process of exchanging the burn-in board between the burn-in board exchange buffer unit and the board loader in the device handler of FIG. 1.
  • Figure 6a is a state before the burn-in board exchange between the burn-in board exchange buffer unit and the board loader
  • Figure 6b is a burn-in board between the burn-in board exchange buffer unit and the board loader is introduced into the rack of the board loader
  • 6C is a state where the burn-in board is inserted into the rack of the board loader between the burn-in board exchange buffer unit and the board loader
  • FIG. 6D is a burn-in board exchange buffer.
  • 6E is a conceptual diagram showing a state where the burn-in board is drawn out from the rack of the board loader between the board loader and the board loader between the board loader and the board loader.
  • 7 is a side view showing the board loader configuration.
  • the XY table 410 is connected to the board loader 800 and the second device 10. Replace with the new burn-in board 20 loaded.
  • the burn-in board 20 on the XY table 410 is replaced, the loading of the first device 10 and the unloading of the second device 10 are stopped, so that the loading and unloading of the device 10 is performed by the XY table.
  • the burn-in board 20 on 410 is delayed by the exchange time.
  • the device handler may include the first device 10 loaded thereon.
  • the burn-in board 20 and the burn-in board 20 in which the second devices 10 are loaded are alternately stored temporarily, and the burn-in board 20 in which the first device 10 of the XY table 410 is inserted is stored in a plurality of times.
  • the burn-in board 20 further includes a burn-in board exchange buffer unit 420 for exchanging with the burn-in board 20 in which the second element 10 of the board loader 800 is loaded.
  • the burn-in board exchange buffer unit 420 is installed between the board loader 800 and the X-Y table 410 to mediate the burn-in board 20, and various configurations are possible according to design and design.
  • the burn-in board exchange buffer unit 420 may be installed at the outermost side of the moving area of the main body 40, in particular, the X-Y table 410 or the board loader 800, depending on the configuration of the device.
  • the XY table 410 and the burn-in board exchange buffer unit 420 may include the burn-in board 20 and the second device on which the first elements 10 are loaded. 10) It is desirable to replace the burn-in board 20 loaded with them at the same time.
  • the XY table 410 has a pair of burn-in board seating portion 411 on which the burn-in board 20 is seated up and down and a pair of burn-in board seating portion 411 for simultaneous exchange of the burn-in board 20. It may be configured to include a burn-in board lifting portion 412 for moving the burn-in board 10 seated on the burn-in board seating portion 411 in at least one direction of the upper side and the lower side.
  • the burn-in board exchange buffer unit 420 includes a pair of burn-in board buffer units 421 in which the burn-in board 20 is seated up and down corresponding to the burn-in board seating portion 411 of the XY table 410. Can be configured.
  • the burn-in board buffer unit 421 may have any configuration as long as the burn-in board 20 can be stacked, and does not interfere with the movement of the first finger 441, the second finger 442, and the like. It is preferable to be configured so as not to.
  • the transfer of the burn-in board 20 between the XY table 410 and the burn-in board exchange buffer unit 420 is performed by the first finger 441 and the second finger part as shown in FIGS. 5A to 5D. 442, the configuration and installation positions of the first and second finger portions 441 and 442 may be configured in various ways depending on the design and design.
  • the X-Y table 410 receives the burn-in board 20 loaded with the second elements 10 from the burn-in board exchange buffer unit 420, as shown in FIGS. 5A and 5B.
  • the XY table 410 and the burn-in board exchange buffer unit 420 have a configuration in which the burn-in board 20 may be arranged up and down
  • the XY table 410 may be the burn-in board exchange buffer unit at either the upper side or the lower side.
  • the burn-in board 20 may be supplied from 420, and as shown in FIGS. 6D and 6E, it is preferable to be supplied from the upper side.
  • the second device 10 may be unloaded and the first device 10 may be loaded through the opening 41. So that it is driven in the XY direction.
  • the burn-in board exchange buffer unit 420 moves from the board loader 800 to the second device 10.
  • the burn-in board 20 loaded with these is supplied.
  • the burn-in board 20 in which the first device 10 is loaded is shown in FIG. 5C, and the second device 10 is loaded. They move toward the burn-in board exchange buffer unit 420 to receive the other burn-in board 20 loaded thereon.
  • the burn-in board 20 on the XY table 410 is burn-in board with the burn-in board exchange buffer unit 420, as shown in FIG. (20) It moves downward by the burn-in board lifting unit 412 for exchange.
  • the XY table 410 moved toward the burn-in board exchange buffer unit 420 is supplied with the burn-in board 20 positioned above the burn-in board exchange buffer unit 420, as shown in FIG.
  • the burn-in board 20 located under the XY table 410 is moved to the burn-in board buffer part 421 located under the burn-in board exchange buffer part 420.
  • the exchange of the burn-in board 20 between the X-Y table 410 and the burn-in board exchange buffer unit 420 is preferably performed simultaneously to shorten the exchange time.
  • the device handler according to the present invention includes a board loader 800 installed at one side to continuously receive the burn-in board 20, as shown in FIGS. 1 and 2.
  • the board loader 800 loads and loads the burn-in boards 20 into which the second devices 20 are inserted, and sequentially loads the burn-in boards 20 into which the first devices 10 are inserted.
  • Various configurations are possible as a configuration for continually exchanging the transport configuration, that is, the XY table 410 and the burn-in board 20.
  • the rack 50 in which the first devices 10 have been stacked is the second device to be unloaded. It is replaced with another rack 50 which is loading (10).
  • the XY table 410 and the like have to wait until the rack 50 is replaced and the new burn-in board 20 is supplied from the board loader 800, so that the processing speed of the device handler is reduced. .
  • the board loader 800 of the device handler may exchange the rack 50 without affecting the loading and unloading of the device 10 on the burn-in board 20.
  • a pair of rack loading portion 810 and a pair of rack loading are arranged in the Y-axis direction of the XY table 410 so that the rack 50 on which the plurality of burn-in boards 20 are stacked is stacked in a plurality of stages.
  • the elevator unit 820 may be installed between the units 810 to draw the rack 50 from the rack loading unit 810 to move the rack 50 up and down.
  • the rack loading unit 810 may be any configuration as long as the rack 50 can be loaded.
  • the rack loading portion 810 is configured in a pair is preferably installed on both sides of the elevator 820 around the elevator 820.
  • the burn-in board exchange buffer unit 420 is provided. And burn-in board 20.
  • the board loader 800 includes a pair of rack takeout units 830 corresponding to the pair of rack load units 810 to withdraw the racks 50 loaded on the rack load units 810, respectively. .
  • the rack take-out part 830 draws the rack 50 from the rack loading part 810 to the support part 821 of the elevator part 820, or, conversely, the rack (from the elevator part 820 to the rack loading part 810). 50) is configured to load.
  • the exchange process of the burn-in board 20 between the burn-in board exchange buffer unit 420 and the board loader 800 having the above configuration may be made in various forms according to each configuration, and an example thereof is attached to the accompanying drawings. Detailed description with reference to the following.
  • the burn-in board exchange buffer unit 420 receives the burn-in board 20 loaded with the second elements 10 from the board loader 800, as shown in FIGS. 6C and 6D.
  • the burn-in board exchange buffer unit 420 is either a board loader or a board loader.
  • the burn-in board 20 may be supplied from the 800, and in particular, the burn-in board 20 may be supplied from the upper side in consideration of board exchange between the XY table 410 and the burn-in board exchange buffer unit 420.
  • the burn-in board 20 in which the second elements 10 are loaded is drawn out from the board loader 800 and passes through the burn-in board buffer part 421 located above the burn-in board exchange buffer part 420.
  • the burn-in board seating part 411 which is transmitted to the burn-in board seating part 411 positioned on the upper side of the 410, and the burn-in board seating part 20 which is loaded with the first elements 10 is located at the bottom of the XY table 410. It is discharged to the board loader 800 through).
  • the burn-in board exchange buffer unit 420 exchanges the burn-in board 20 with the board loader 800 after the board exchange with the XY table 410 through a process as shown in FIGS. 6A and 6B. .
  • the burn-in board exchange buffer unit 420 has a burn-in board 20 received from the XY table 410, in particular, the burn-in board 20 seated on the burn-in board buffer unit 421 located at the lower side of the board loader 800 Retract into the empty seat of the rack 50.
  • the rack 50 is lifted up and down by the elevator unit 820 so that the burn-in board 20 can be pulled in or pulled out, and at least one of the uppermost or the lowermost side is burn-in for smooth exchange of the burn-in board 20. It is preferable that the board 20 is not filled.
  • the burn-in board exchange buffer unit 420 draws out a new burn-in board 20 in which the second element 10 is loaded from the rack 50.
  • the burn-in board 20 is withdrawn from the rack 50 and is seated on the burn-in board exchange buffer portion 420, especially the burn-in board buffer portion 421 located on the upper side.
  • burn-in board 20 is a burn-in board exchange buffer It is carried by one or more subfingers 443, 444 between the part 420 and the board loader 800.
  • the sub-fingers 443 and 444 have a burn-in board in a plurality of sub-movement sections corresponding to each of the sub-fingers 443 and 444 in the movement section between the burn-in board exchange buffer unit 420 and the board loader 800. 20) can be configured to convey.
  • FIG. 8A is a side cross-sectional view illustrating a burn-in board exchange buffer unit and a board loader having a modified configuration in the device handler of FIG. 1, and FIG. 8B is a side view illustrating the board loader of FIG. 8A.
  • the rack loader in which only the rack 50 is loaded without installing the configuration of an elevator unit in which the board loader 800 moves the rack 50 up and down is installed.
  • the burn-in board exchange buffer unit 420 may be configured to move up, down, left and right so that the burn-in board 20 may be drawn out from the rack 50 loaded in each rack loading unit 810. have.
  • the board loader 800 may include a plurality of racks 50, in this embodiment, rack loading units 810 into which nine racks 50 may be stacked. Can be.
  • the device handler according to the present invention may further include an exchange buffer driver 430 for vertical and horizontal movement of the burn-in board exchange buffer unit 420 as shown in FIGS. 8A and 8B.
  • the exchange buffer driver 430 has a burn-in board exchange buffer unit 420 vertically and horizontally, that is, vertical and horizontal movement so that the burn-in board 20 can be withdrawn from the rack 50 loaded in each rack loading unit 810.
  • Various configurations are possible as the configuration for driving the.
  • the exchange buffer driving unit 430 may include a first driving unit 432 for driving a shanghai movement of the burn-in board exchange buffer unit 420 based on the top and bottom of the rack 50 loaded in the board loader 800, and
  • the board loader 800 may include a second driving unit 431 for driving the horizontal movement of the burn-in board exchange buffer unit 420 based on the horizontal direction in which the rack 50 is disposed.
  • the first driving unit 432 and the second driving unit 431 are installed to support the burn-in board exchange buffer unit 420 and include a screw jack or a linear moving device.
  • the burn-in board replacement buffer unit 420 is driven to move in the vertical direction and the horizontal direction.
  • the device handler moves the burn-in board exchange buffer unit 420 up, down, left, and right in a state where the rack 50 is fixed, and draws out the burn-in board 20.
  • the processing speed of the device handler can be significantly increased.
  • the burn-in board exchange buffer unit 420 by configuring the burn-in board exchange buffer unit 420 to move up, down, left, and right, it is possible to simplify the configuration of the board loader 800 without requiring the installation of the elevator unit in the configuration of the board loader 800 and the board loader 800 By increasing the number of racks (50) to be loaded) the replacement cycle of the rack 50 is long, it is possible to improve the work efficiency.
  • the burn-in board exchange buffer unit 420 and the exchange buffer driver 430 may be configured as one board loader module together with the board loader 800.
  • the device handler having the configuration as described above, the type of the device to be sorted, that is, the standard may be different.
  • the loading unit 100 and the unloading unit 200 in the loading tray 30 corresponding to the corresponding standard Then, the DC test unit 170, the socket press 45 on the burn-in board 20, the buffer unit 600, 700, etc. in accordance with the corresponding device specifications in the device must be replaced by the user's manual work is a cumbersome replacement work There is a problem.
  • the device handler has a socket press on the DC test unit 170 and the XY table 410 according to the specification of the device when the size of the device to be sorted is changed. 45), and a kit exchange unit 900 for automatically replacing at least a portion of the buffer unit 600, 700, and the like.
  • the kit exchange unit 900, the DC test unit 170, the socket press 45 on the XY table 410, and the buffer unit 600, 700 according to the specifications of the device when the specifications of the device to be sorted is changed Various configurations are possible by automatically replacing at least a part of the back.
  • the exchange kit to be exchanged may be a DC test unit 170, a socket press on the X-Y table 410, the buffer unit 600, 700 and the like.
  • the exchange kit may be an element accommodating unit 610 or 710, a first fixed buffer, a second fixed buffer, or the like that constitute a part of the buffer unit, rather than the entire buffer unit.
  • the kit exchanging unit 900 includes, as a specific example, a main body 901 provided with a buffer space 910 for temporarily storing an exchange kit to be exchanged, and a main body 40 of an element handler. It may include an exchange unit 930 to take out the exchange kit installed in the) to temporarily store in the buffer space 920 and to exchange a new replacement kit in the main body 40 of the device handler.
  • the main body 901 may have any configuration as long as at least one new replacement kit to be exchanged is loaded and includes a free space for withdrawing and loading the replacement kit installed in the main body 40.
  • main body 901 is preferably installed to be movable up and down for the convenience of replacement of the exchange kit.
  • the exchange unit 930 is configured to withdraw the exchange kit installed in the main body 40, temporarily store it in the buffer space 920, and exchange the exchange kit with a new exchange kit. It is possible.
  • the main body 40 is preferably provided with one or more guide rails 902 for guiding the linear movement of the exchange kit.
  • the DC test unit 170 of the exchange kit requires an electrical connection, as shown in FIGS. 10 and 11, the DC test unit 170 is inserted in the moving direction and is electrically connected to the DC test unit 170.
  • Electrical connection 171 for the connection may be installed in the body 40.
  • the electrical connection unit 171 is configured to be electrically connected to the DC test unit 170 to enable the DC test by the DC test unit 170, it may be composed of one or more terminal members.
  • buffer units 600 and 700 of the exchange kit various configurations are possible according to the configuration and position of the buffer units 600 and 700.
  • the buffer units 600 and 700 may be installed in the main body 40 with various numbers and movable or fixed positions at various positions in a configuration for temporarily loading an element.
  • the buffer units 600 and 700 may include a first moving buffer 600, a second moving buffer 700, one or more fixed buffers, and the like as illustrated in FIGS. 1 and 9. .
  • the exchange kit, the element receiving portion 610 of the first moving buffer 600, the element receiving portion 710 of the second moving buffer 700 may be one or more fixed buffer.
  • the element receiving portion 610 of the first mobile buffer 600, the element receiving portion 710 of the second moving buffer 700, one or more fixed buffers may have the same structure, that is, the standard.
  • the element receiving part 610 of the first moving buffer 600 and the element receiving part 710 of the second moving buffer 700 are replaced with each other by the first moving buffer 600 as shown in FIG. 1.
  • the element receiving portion 610 of the first mobile buffer 600, the element receiving portion 710 of the second mobile buffer 700 and one or more fixed buffers (but fixed buffer may not be installed) is introduced along the linear movement direction of any one of the element receiving portion 610 of the first moving buffer 600 and the element receiving portion 710 of the second moving buffer (700).
  • the fixed buffer if a fixed buffer is installed
  • discharged in the linear movement direction of the other of the element receiving portion 610 of the first moving buffer 600 and the element receiving portion 710 of the second moving buffer 700 Can be.
  • kit exchanger 900, the loading unit 100, the unloading unit 200 is installed so as to be adjacent to the main body 40 in a position opposite to the sorting unit 300 based on the arrangement direction of the This is preferred.
  • the kit exchange unit 900 is movable adjacent to the main body 40 at a position opposite to the sorting unit 300 on the basis of the loading direction of the loading unit 100, the unloading unit 200.
  • the exchange kit can be replaced more easily by the operator and the device can be made compact.
  • the device handler is provided with an exchange kit loading unit 910 in which a plurality of exchange kits to be exchanged separately from the main body unit 901 are loaded. It may be further installed to be movable in a separated state.
  • the exchange kit loading unit 910 it is preferable that a plurality of exchange kits to be exchanged for the exchange of this, a plurality of exchange kits to be exchanged separately from the main body 901 is loaded and movable in a state separated in the element handler By being additionally installed, it is possible to maximize the space use efficiency of the device while simplifying the configuration of the kit exchange unit (900).
  • the kit exchanging unit 900 and the exchange kit loading unit 910 may maximize the space use efficiency of the device while simplifying the overall configuration by replacing the exchange kit by moving to the element handler only when the exchange kit needs to be replaced. Will be.
  • the device handler according to the first modification according to the present invention in the configuration of the device handler shown in Figure 1, as shown in Figure 12, is installed in parallel to one side of the loading unit 100 burn-in board It may include a bin tray supply unit 80 for loading a plurality of empty trays 30 to be loaded in the (20).
  • the DC test unit 170 may not be included as shown in FIG. 12 or may be included as shown in FIG. 13.
  • the element handler according to the first modification according to the present invention has only a function of stacking the element 10 on the burn-in board 20, or draws the element 10 from the burn-in board 20 to the tray 30. Only the loading function can be performed.
  • the loading unit 100 and the unloading unit 200 both load the tray 30 in which the device 10 is loaded, or the empty tray for loading the device 10. 30 is configured to load.
  • the element handler according to the first modification according to the present invention performs only the function of withdrawing the element 10 from the burn-in board 20 to load the tray 30 to the sorting unit 300 according to the inspection result Can be classified.
  • the device handler according to the first modification according to the present invention may perform only device loading or only device unloading on a test socket, wherein a socket press in which an adapter member of another specification is combined according to device loading or unloading is used. This is preferred.
  • the device mounting is performed on the test socket precisely by using the adapter member which minimizes the error with the device during device loading. Enough error with the device can be set so as not to interfere with unloading.
  • the socket press is configured to enable the stacking or withdrawing of the device by operating a test socket installed in a burn-in board or the like, and various configurations are possible according to the structure of the test socket.
  • the socket press is provided with an adapter member for guiding the device to be positioned at the correct position of the test socket, that is, at a position contacting terminals (pogo pins, etc.) for electrical connection with the terminal of the device.
  • the adapter member may be configured in various ways such as having an inclined surface when viewed from the upper side in such a manner that the device is seated on the test socket in the correct position.
  • the element handler according to the second modification according to the present invention in the configuration of the element handler shown in Figure 1, as shown in Figure 14, 15A and 15B, the loading socket press 92 And a socket press unit 90 including an unloading socket press 91.
  • the DC test unit 170 may be installed as an optional configuration as needed.
  • the socket press unit 90 includes a loading socket press 92 and an unloading socket press 91 to press a test socket (not shown) during loading or unloading of the device to load or withdraw the device.
  • a loading socket press 92 and an unloading socket press 91 to press a test socket (not shown) during loading or unloading of the device to load or withdraw the device.
  • the loading socket press 92 is configured to be seated at the correct position of the test socket installed on the burn-in board 20 when the device is loaded, and the adapter member is correctly seated on the test socket after the device is dropped inside. Is installed.
  • the adapter member has an opening 92a having a size substantially similar to the planar size of the device so as to be accurately seated on the test socket after the device falls.
  • the unloading socket press 91 is configured to be seated at the correct position of the test socket installed on the burn-in board 20 when the device is unloaded.
  • the unloading socket press 91 is vertically opened to allow the device to be pulled out, and the size of the opening 91a is larger than that of the loading socket press 92 described above so as not to interfere with the unloading of the device. This is preferred.
  • the socket press is composed of a single, if the opening of the adapter member is small in the socket press in order to load the correct position of the device, there is a problem of preventing the withdrawal of the device during unloading.
  • the socket press unit 90 includes the loading socket press 92 and the unloading socket press 91 to allow the device to be placed at a more accurate position when the device is loaded, and to be unloaded when the device is unloaded. Since it is not disturbed, the loading and withdrawal of the device can be performed smoothly.
  • the loading socket press 92 and the unloading socket press 91 are disposed in a direction in which the loading unit 100 and the unloading unit 200 are disposed, that is, perpendicular to the X-axis direction. It is preferable to arrange in the Y-axis direction.
  • the first transfer tool 530 and the second transfer tool 540 as shown in Figs. 14, 15A and 15B, to the loading socket press 92 and the unloading socket press 91.
  • the device handler according to the second modification according to the present invention similar to the configuration of the device handler according to the second modification is installed in parallel to one side of the loading unit 100 a plurality of to be loaded on the burn-in board 20 Loading the empty trays 30 may include a bin tray supply unit 80.

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PCT/KR2016/004948 2015-05-12 2016-05-11 소자핸들러 WO2016182352A1 (ko)

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CN111868536A (zh) * 2018-03-11 2020-10-30 宰体有限公司 元件检查装置

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KR102319412B1 (ko) * 2017-03-23 2021-11-01 (주)테크윙 핸들러
KR20190105893A (ko) * 2018-03-06 2019-09-18 (주)제이티 소자핸들러
KR20190120678A (ko) * 2018-04-16 2019-10-24 (주)제이티 소자핸들러
JP7430154B2 (ja) * 2021-03-29 2024-02-09 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

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