WO2016119755A1 - 一种集成电路检测方法、装置及*** - Google Patents

一种集成电路检测方法、装置及*** Download PDF

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Publication number
WO2016119755A1
WO2016119755A1 PCT/CN2016/073073 CN2016073073W WO2016119755A1 WO 2016119755 A1 WO2016119755 A1 WO 2016119755A1 CN 2016073073 W CN2016073073 W CN 2016073073W WO 2016119755 A1 WO2016119755 A1 WO 2016119755A1
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WO
WIPO (PCT)
Prior art keywords
detecting
integrated circuit
detection
electrical parameter
circuit
Prior art date
Application number
PCT/CN2016/073073
Other languages
English (en)
French (fr)
Inventor
邓建平
曾诚
朱青松
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP16742817.6A priority Critical patent/EP3244223B1/en
Priority to BR112017016243-1A priority patent/BR112017016243B1/pt
Publication of WO2016119755A1 publication Critical patent/WO2016119755A1/zh
Priority to US15/663,002 priority patent/US10466297B2/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G01B7/20—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance formed by printed-circuit technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/08—Measuring resistance by measuring both voltage and current
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences

Definitions

  • the present invention relates to the field of electronics, and in particular, to a method, device and system for detecting integrated circuits.
  • PCB Printed Circuit Board integrates many different integrated circuits (ICs) to achieve a certain function.
  • the detection technology of single board function and channel function is mainly used to detect integrated circuits on the printed circuit board.
  • the detection software can be embedded in the printed circuit board, and the printed circuit board is excited by the embedded detection software, and the detection instrument or the printed circuit board receives the detection result; or the printed circuit board can be excited by the detection instrument, the detection instrument or the printing
  • the circuit board receives the detection result, thereby judging whether the electrical parameters of the integrated circuit in the certain circuit on the printed circuit board or the printed circuit board are abnormal through the functional failure of the printed circuit board, and whether the integrated circuit has a quality hazard.
  • the single board is a printed circuit board.
  • the integrated circuit is detected on the printed circuit board as an on-board detection integrated circuit.
  • the prior art can only detect the functional failure of the channel level of the printed circuit board or the printed circuit board, failing to specifically address the quality problem of an integrated circuit in the printed circuit board, thereby failing to accurately detect the integrated circuit. Electrical parameters, in the case of normal function of the printed circuit board, and the quality of the electrical parameters of the integrated circuit is not recognized.
  • Embodiments of the present invention provide an integrated circuit detection method, apparatus, and system capable of detecting electrical parameters of an integrated circuit on a printed circuit board in a powered state.
  • a first aspect of the embodiments of the present invention provides a printed circuit board, including:
  • N detecting circuits each of which is connected to a different integrated circuit, the detecting circuit is provided with a first detecting point and a second detecting point, and the first detecting point and the second detecting point are used for
  • the detecting instrument for performing the electrical parameter detection is connected, so that the detecting instrument acquires the first electrical parameter through the first detecting point and the second detecting point, and determines the connection with the detecting circuit according to the first electrical parameter Whether the electrical parameter of the integrated circuit is normal, wherein the N is an integer greater than or equal to 1, and the electrical parameter includes at least one of a total current, an on-resistance, and a voltage.
  • the first detection point is connected to a power supply of the printed circuit board that supplies power to the integrated circuit, and the second detection point is connected to a power supply pin of the integrated circuit;
  • the first detection point is coupled to a functional pin of the integrated circuit
  • the second detection point is coupled to a peripheral circuit of the integrated circuit.
  • the detection circuit includes at least one resistor or at least one magnetic bead, or at least one inductor.
  • the detecting circuit is a resistor, a first end of the resistor is a first detecting point, and a second end of the resistor is a second detecting point .
  • the detecting circuit is a magnetic bead or an inductor
  • the first end of the magnetic bead is a first detecting point
  • the second end of the magnetic bead is Is the second detection point.
  • a second aspect of the embodiments of the present invention provides a detecting apparatus, including:
  • a detection control module configured to set a detection state of the detection instrument, the detection device comprising the detection instrument
  • the detection control module is further configured to: control the detection instrument to connect the first detection point and the second detection point of the detection circuit of the printed circuit board in a power-on state, the first detection point and the second The detection point is related to the detection instrument used for electrical parameter detection Connecting the detection instrument to obtain the first electrical parameter through the first detection point and the second detection point, and the detection data processing module determines the electrical of the integrated circuit connected to the detection circuit according to the first electrical parameter Whether the parameter is normal, and the N is an integer greater than or equal to 1;
  • the detecting instrument is configured to detect that the detecting circuit obtains a first electrical parameter, and the first electrical parameter is an electrical parameter of the integrated circuit connected to the detecting circuit;
  • a detection data processing module configured to determine, according to the first electrical parameter, whether an electrical parameter of the integrated circuit connected to the detection circuit is normal.
  • the detection data processing module is specifically configured to:
  • the first electrical parameter is within a first preset range, the first preset range being a preset range of electrical parameters of the integrated circuit connected to the detecting circuit;
  • the first electrical parameter is not within the first predetermined range, determining that the electrical parameter of the integrated circuit connected to the detecting circuit is abnormal.
  • the detection control module is further configured to: control the detecting instrument to connect a function pin and a power pin of the integrated circuit, or control the detecting instrument to connect a function pin and a ground pin of the integrated circuit;
  • the detecting instrument is further configured to: detect the integrated circuit to obtain a second electrical parameter, and the second electrical parameter includes an electrical parameter of a function pin of the integrated circuit;
  • the detection data processing module is further configured to: determine, according to the second electrical parameter, whether an electrical parameter of a function pin of the integrated circuit is normal.
  • the detection data processing module is specifically configured to:
  • the second preset The range is a preset range of electrical parameters of the function pins of the integrated circuit
  • the electrical parameter includes at least one of a total current, an on resistance, and a voltage.
  • a third aspect of the embodiments of the present invention provides a method for detecting an integrated circuit, including:
  • the detecting device is configured to detect a detection state of the instrument, and the detecting device includes the detecting instrument;
  • the detecting device is connected to the first detecting point and the second detecting point of the detecting circuit of the printed circuit board in a power-on state;
  • the detecting instrument of the detecting device detects the detecting circuit to obtain a first electrical parameter, and the first electrical parameter is an electrical parameter of the integrated circuit connected to the detecting circuit;
  • the detecting device determines, according to the first electrical parameter, whether an electrical parameter of the integrated circuit connected to the detecting circuit is normal.
  • Determining, according to the first electrical parameter, whether the electrical parameter of the integrated circuit connected to the detecting circuit is normal includes:
  • the first electrical parameter is within a first preset range, the first preset range being a preset range of electrical parameters of the integrated circuit connected to the detecting circuit;
  • the first electrical parameter is not within the first predetermined range, determining that the electrical parameter of the integrated circuit connected to the detecting circuit is abnormal.
  • the method further includes:
  • the detection control module controls the detection instrument to connect a function pin and a power pin of the integrated circuit, or control the detection instrument to connect a function pin and a ground pin of the integrated circuit;
  • the detecting instrument detects that the integrated circuit obtains a second electrical parameter, and the second electrical parameter is an electrical parameter of a function pin of the integrated circuit;
  • the detection data processing module determines whether the electrical parameters of the function pins of the integrated circuit are normal according to the second electrical parameter.
  • the detecting data processing module determines whether the electrical parameters of the function pins of the integrated circuit are normal according to the second electrical parameter, including:
  • the second electrical parameter is within a second preset range, where the second preset range is a preset range of electrical parameters of a function pin of the integrated circuit;
  • the electrical parameter includes at least one of a total current, an on-resistance, and a voltage.
  • a detection system any of the above printed circuit boards and any of the above detection devices.
  • the integrated circuit detecting method, device and system provided by the embodiments of the present invention. Forming a detection circuit connected to the integrated circuit on the printed circuit board on the printed circuit board, and detecting, by the detecting circuit, electrical parameters of the integrated circuit connected to the detecting circuit, thereby determining and operating according to the first electrical parameter Whether the electrical parameters of the integrated circuit connected to the detecting circuit are normal, which overcomes the problem that the electrical parameters of the integrated circuit on the printed circuit board cannot be detected when the printed circuit board is in the power-on state in the prior art, and can effectively The electrical parameters of the integrated circuit on the printed circuit board in the powered state are detected.
  • FIG. 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of another printed circuit board according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of another printed circuit board according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a detecting apparatus according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of another detecting apparatus according to an embodiment of the present invention.
  • FIG. 6 is a flowchart of a method for detecting an integrated circuit according to an embodiment of the present invention.
  • FIG. 7 is a flowchart of another method for detecting an integrated circuit according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of a detection system according to an embodiment of the present invention.
  • FIG. 8a is a schematic diagram of a circuit of a detection system according to an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of another detection system according to an embodiment of the present invention.
  • FIG. 10 is a schematic diagram of still another detection system according to an embodiment of the present invention.
  • FIG. 10a is a schematic diagram of the specific detection system of FIG. 10 according to an embodiment of the present invention.
  • FIG. 10a is a schematic circuit diagram of a specific detection system of 10a according to an embodiment of the present invention.
  • FIG. 10b is a schematic diagram of the specific detection system of FIG. 10 according to an embodiment of the present invention.
  • FIG. 10b is a schematic circuit diagram of a specific detection system of 10b according to an embodiment of the present invention.
  • FIG. 11 is a schematic diagram of still another detection system according to an embodiment of the present invention.
  • the embodiment of the invention provides a printed circuit board 10, as shown in FIG. 1, comprising:
  • N detecting circuits 101 each of which is connected to a different integrated circuit 102, the detecting circuit is provided with a first detecting point a and a second detecting point b, and the detecting circuit is configured to detect and detect the detecting circuit
  • An electrical parameter of the connected integrated circuit wherein N is an integer greater than or equal to 1.
  • the first detection point and the second detection point are connected to a detection instrument for performing electrical parameter detection, so that the detection instrument acquires the first electrical through the first detection point and the second detection point. And determining, according to the first electrical parameter, whether an electrical parameter of the integrated circuit connected to the detecting circuit is normal, the electrical parameter including at least one of a total current, an on-resistance, and a voltage.
  • a detecting circuit connected to the integrated circuit on the printed circuit board is disposed on the printed circuit board, and electrical parameters of the integrated circuit connected to the detecting circuit are detected by the detecting circuit, thereby performing the first detecting according to the first detecting.
  • the problem is that it is possible to effectively detect the electrical parameters of the integrated circuit on the printed circuit board in the powered state.
  • the method for connecting the detecting circuit and the integrated circuit is as shown in FIG. 2, the first detecting point a is connected to the power supply VCC pin A of the printed circuit board, and the second detecting point b is The power supply (Volt Current Condenser, VCC) of the integrated circuit is connected to pin B.
  • VCC pin A is the power source of the printed circuit board that supplies power to the integrated circuit.
  • VCC pin A may be a pin of a circuit that provides a power function of a printed circuit board, or a pin of an external power source that supplies a printed circuit board.
  • the first detection point a is connected to the function pin C of the integrated circuit
  • the second detection point b is connected to the peripheral circuit 103 of the integrated circuit.
  • many circuits are integrated on the printed circuit board. Different circuits have different functions and are directly connected to each other.
  • the peripheral circuits can be other circuits on the printed circuit board.
  • the detecting circuit includes at least one resistor or at least one magnetic device, and the magnetic device is a magnetic bead or an inductor.
  • the detection circuit includes a resistor
  • the resistor The first end of the resistor is the first detection point
  • the second end of the resistor is the second detection point.
  • the resistors may be connected in series, or in parallel, or in a series connection in series and in parallel.
  • the detecting circuit includes a magnetic bead
  • the first end of the magnetic bead is a first detecting point
  • the second end of the magnetic bead is a second detecting point.
  • the magnetic beads can be connected in series, or in parallel, or in a hybrid manner of series and parallel.
  • the detecting circuit includes an inductor
  • the first end of the inductor is the first detecting point
  • the second end of the inductor is the second detecting point.
  • the inductors may be connected in series, or in parallel, or in a hybrid manner of series and parallel.
  • the embodiment of the invention provides a detecting device 20, as shown in FIG. 4, comprising:
  • the detection control module 201 is configured to set a detection state of the detection instrument 202, and the detection device includes the detection instrument.
  • the detection control module 201 is further configured to: control the detection instrument to connect the first detection point and the second detection point of the detection circuit of the printed circuit board in a power-on state, the printed circuit board includes N detections a circuit, each of the detection circuits being coupled to a different integrated circuit, the detection circuit being provided with a first detection point and a second detection point, the detection circuit for detecting the integrated circuit connected to the detection circuit An electrical parameter, wherein N is an integer greater than or equal to 1; wherein the first detection point and the second detection point are connected to a detection instrument for performing electrical parameter detection, such that the detection instrument passes the first The detection point and the second detection point acquire a first electrical parameter, and the detection data processing module determines whether the electrical parameter of the integrated circuit connected to the detection circuit is normal according to the first electrical parameter.
  • the detecting instrument 202 is configured to detect that the detecting circuit obtains a first detecting result, where the first detecting result includes an electrical parameter of the integrated circuit connected to the detecting circuit;
  • the detection data processing module 203 is configured to determine, according to the first detection result, whether an electrical parameter of the integrated circuit connected to the detection circuit is normal. Determining, according to the first electrical parameter, whether an electrical parameter of the integrated circuit connected to the detecting circuit is normal.
  • the detection control module of the detecting device controls the detecting instrument to detect that a detecting circuit connected to the integrated circuit on the printed circuit board is disposed on the printed circuit board, and the detecting circuit detects the connection with the detecting circuit.
  • An electrical parameter of the integrated circuit so as to determine whether the electrical parameter of the integrated circuit connected to the detecting circuit is normal according to the first detecting result, which overcomes the failure of the prior art to detect the printed circuit board when it is powered on
  • the problem of the electrical parameters of the integrated circuit on the printed circuit board enables efficient detection of the electrical parameters of the integrated circuit on the printed circuit board in the powered state.
  • the detection data processing module 203 is specifically configured to:
  • the first preset range is a preset range of electrical parameters of the integrated circuit connected to the detection circuit
  • the detection control module 201 is further configured to: control the detection instrument to connect a function pin and a power pin of the integrated circuit, and a function pin and a ground pin of the integrated circuit; that is, control the detection instrument Connecting a function pin and a power pin of the integrated circuit, or controlling the detecting instrument to connect a function pin and a ground pin of the integrated circuit;
  • the detecting instrument 202 is further configured to: detect the integrated circuit to obtain a second detection result, where the second detection result includes an electrical parameter of a function pin of the integrated circuit;
  • the detection data processing module 203 is further configured to: determine, according to the second detection result, whether an electrical parameter of a function pin of the integrated circuit is normal.
  • the detection data processing module 203 is specifically configured to:
  • the second preset range is a preset range of electrical parameters of a function pin of the integrated circuit
  • the detection data processing module may include a data recording sub-module 2031, a data analysis sub-module 2032, and an early warning sub-module 2033.
  • the data recording sub-module is configured to record the first detection result and the second detection result.
  • the data analysis sub-module is configured to determine whether the first detection result is within a first preset range, and if the first detection result is within a first preset range, determining the location connected to the detection circuit The electrical parameter of the integrated circuit is normal; if the first detection result is not within the first preset range, determining that the electrical parameter of the integrated circuit connected to the detecting circuit is abnormal; determining whether the second detecting result is In the second preset range, the second preset range is a preset range of electrical parameters of the function pins of the integrated circuit; if the second detection result is within the second preset range, determining the The electrical parameters of the function pins of the integrated circuit are normal; if the second detection result is not within the second predetermined range, determining that the electrical parameters of the function pins of the integrated circuit are abnormal.
  • the warning sub-module is configured to send, to the user equipment, an early detection prompt of the first detection result and/or the second detection result analyzed by the data analysis sub-module.
  • the electrical parameter includes at least one of a total current, an on-resistance, and a voltage.
  • the embodiment of the present invention provides a method for detecting an integrated circuit, which is applied to the printed circuit board shown in FIG. 1.
  • the detecting device shown in FIG. 1 is a method for detecting an integrated circuit, which is applied to the printed circuit board shown in FIG. 1.
  • Step 301 The detecting device sets a detection state of the detecting instrument, and the detecting device includes the detecting instrument.
  • Step 302 The detecting device is connected to the first detecting point and the second detecting point of the detecting circuit of the printed circuit board in the power-on state.
  • the printed circuit board includes N detecting circuits, each of which is connected to a different integrated circuit, and the detecting circuit is provided with a first detecting point and a second detecting point.
  • the detecting circuit is configured to detect an electrical parameter of the integrated circuit connected to the detecting circuit, and the N is an integer greater than or equal to 1.
  • the first detection point and the second detection point are connected to a detection instrument for performing electrical parameter detection, so that the detection instrument acquires the first electrical through the first detection point and the second detection point. And determining, by the detection data processing module, whether the electrical parameter of the integrated circuit connected to the detection circuit is normal according to the first electrical parameter.
  • Step 303 The detecting device detects that the detecting circuit obtains a first detecting result, where the first detecting result includes an electrical parameter of the integrated circuit connected to the detecting circuit.
  • the first test result is the first electrical parameter.
  • Step 304 The detecting device determines, according to the first detection result, whether an electrical parameter of the integrated circuit connected to the detecting circuit is normal.
  • the integrated circuit detecting method provided by the embodiment of the present invention adopts a detecting device, and the detecting circuit detects the electrical parameters of the integrated circuit connected to the detecting circuit, and the printed circuit board is disposed to be connected with the integrated circuit on the printed circuit board.
  • the detecting circuit determines whether the electrical parameter of the integrated circuit connected to the detecting circuit is normal according to the first detecting result, and overcomes the failure to detect the printing when the printed circuit board is in the power-on state in the prior art.
  • the problem of the electrical parameters of the integrated circuit on the board enables efficient detection of the electrical parameters of the integrated circuit on the printed circuit board in the powered state.
  • An embodiment of the present invention provides a method for detecting an integrated circuit, which is applied to the printed circuit board shown in FIG. 1 and the detecting device shown in FIG. 4.
  • the detecting device further includes a data recording sub-module, a data analysis sub-module, and an early warning.
  • a sub-module, as shown in FIG. 7, the method includes:
  • Step 401 The data recording submodule sets a detection information table.
  • the detection information table may include a printed circuit board name, an integrated circuit batch number, an integrated circuit model, a detection start time, and a detection end time. In actual applications, information such as the model number of the instrumentation can also be set.
  • Step 402 The detection control module controls the detection instrument to be in a detection state.
  • Step 403a the detection control module controls the detection instrument to be connected to the nth detection circuit.
  • n is an integer greater than or equal to 1 and less than or equal to N, and the N is an integer greater than or equal to 1.
  • the nth detecting circuit is the first detecting circuit 502 of the printed circuit board 50, the first detecting point a of the first detecting circuit and the power supply VCC of the printed circuit board.
  • the pin A is connected
  • the second detection point b of the first detecting circuit 502 is connected to the power supply VCC pin B of the first integrated circuit 501
  • the detection control module 512 in the detecting device 51 controls the detecting instrument 511 and the first detecting respectively.
  • Point a is connected to a second detection point b, which includes a resistor R1.
  • Figure 8a the specific circuit diagram of Figure 8.
  • the first detection point a of the first detection circuit 502 is connected to the function pin C of the first integrated circuit 501
  • the second detection point b of the first detection circuit 502 is
  • the peripheral circuits 503 of one integrated circuit 501 are connected, and the detection control module 512 in the detecting device 51 controls the detecting instruments 511 to be respectively connected to the first detecting point a and the second detecting point b, and the detecting circuit 502 includes a resistor R1.
  • Step 403b The detection control module controls the detection instrument to connect the function pin and the power pin of the nth integrated circuit, and the function pin and the ground pin of the nth integrated circuit.
  • the detection control module 512 in the detecting device 51 controls the detecting instrument 511 to be connected to the first integrated circuit 501.
  • the function pin C and the power pin VCC, and the function pin C and the ground (GND) pin of the first integrated circuit 501 are connected.
  • control detecting means 511 is connected to the function pin C of the first integrated circuit 501 and the power pin VCC, as shown in FIG. 10a1, and the specific circuit diagram of FIG. 10a.
  • control detecting instrument 511 is connected to the function pin C and the ground pin of the integrated circuit 501.
  • Figure 10b1 shows the specific circuit diagram of Figure 10b.
  • Step 404a The detection instrument detects and the nth detection circuit obtains the first detection result.
  • the detecting instrument detects the electrical parameter of the nth integrated circuit by the detecting circuit to obtain a first detecting result, where the first detecting result includes an electrical parameter of the integrated circuit connected to the detecting circuit, and the electrical parameter may be At least one of a total current, an on-resistance, a voltage, and other electrical parameters of the integrated circuit coupled to the detection circuit.
  • Step 404b The detecting instrument detects the nth integrated circuit to obtain a second detection result.
  • the detecting instrument first obtains the detection result of the function pin and the power pin of the nth integrated circuit connected through the detecting instrument, and acquires the function pin connection and the grounding pin of the nth integrated circuit connected through the detecting instrument. a result of the inspection, and finally a comprehensive analysis of the detection result to obtain a second detection result, where the second detection result includes an electrical parameter of a function pin of the integrated circuit, and the electrical parameter may be a function pin of the integrated circuit At least one of total current, on-resistance, voltage, and other electrical parameters.
  • Step 405 The data recording submodule reads the first detection result or the second detection result from the detecting instrument.
  • the data recording submodule may receive an instruction sent by the detection control module to read the first detection result or the second detection result, and the data recording submodule reads from the detection instrument according to the instruction for reading the first detection result or the second detection result. Take the first test result or the second test result.
  • Step 406 The data recording sub-module stores the first detection result or the second detection result in the detection information table.
  • Step 407a The data analysis sub-module determines, according to the first detection result, whether the electrical parameter of the integrated circuit connected to the detection circuit is normal.
  • the data analysis sub-module determines whether the first detection result is within a first preset range, and the first preset range is a preset range of electrical parameters of the integrated circuit connected to the detection circuit. If the first detection result is within the first preset range, step 408a is performed; if the first detection result is not within the first preset range, step 409a is performed.
  • Step 407b The data analysis sub-module determines, according to the second detection result, whether the electrical parameter of the function pin of the integrated circuit is normal.
  • the data analysis sub-module determines whether the second detection result is within a second preset range, and the second preset range is a preset range of electrical parameters of the function pins of the integrated circuit. If the second detection result is in the second preset range, step 408b is performed; if the second detection result is not in the second preset range, step 409b is performed.
  • Step 408a The data analysis sub-module determines that the electrical parameters of the integrated circuit connected to the detection circuit are normal.
  • Step 409a The data analysis sub-module determines that the electrical parameter of the integrated circuit connected to the detection circuit is abnormal.
  • Step 408b The data analysis sub-module determines that the electrical parameters of the function pins of the integrated circuit are normal.
  • Step 409b The data analysis sub-module determines that the electrical parameter of the function pin of the integrated circuit is abnormal.
  • Step 4010 The alert sub-module sends an alert prompt to the user equipment.
  • the warning sub-module sends an alert prompt to the user equipment for the detection result analyzed by the data analysis sub-module.
  • the warning prompt can be automatically sent to the mailbox, the mobile phone, or other terminal through the network.
  • the warning prompt also pushes the automatically created problem list link to be pushed to the terminal together. If the problem list to be analyzed is not processed, the warning sub-module follows the preset time. Automatically send alert prompts periodically.
  • Step 4011 The detection control module determines whether the nth integrated circuit is the Nth integrated circuit.
  • step 4012 is performed; if the nth integrated circuit is not the Nth integrated circuit, step 4013 is performed.
  • Step 4012 The detection control module sets the detection instrument to a non-detection state.
  • Step 4013 The detection control module controls the detection instrument to connect the first detection point and the second detection point of the n+1th detection circuit.
  • the integrated circuit detecting method provided by the embodiment of the present invention adopts a detecting device, and the detecting circuit detects the electrical parameters of the integrated circuit connected to the detecting circuit, and the printed circuit board is disposed to be connected with the integrated circuit on the printed circuit board.
  • Detecting circuit thereby determining, according to the first detection result, electrical of the integrated circuit connected to the detecting circuit Whether the parameter is normal, or the detecting device directly controls the function pin and the power pin of the detecting instrument connected to the integrated circuit, and the function pin and the ground pin connecting the integrated circuit to detect the electrical parameter of the function pin of the integrated circuit Therefore, whether the electrical parameter of the function pin of the integrated circuit is normal according to the second detection result overcomes the failure to detect the integrated circuit on the printed circuit board when the printed circuit board is in the power-on state in the prior art.
  • the problem of electrical parameters can effectively detect the electrical parameters of the integrated circuit on the printed circuit board in the powered state.
  • an integrated circuit of a plurality of printed circuit boards of the same type and the same batch can be detected, and the detection result of the same integrated circuit in the plurality of printed circuit boards obtained by statistical detection can be detected. Analyze whether there is an abnormality in the same integrated circuit in the printed circuit board of the batch.
  • the printed circuit board A uses a J-type integrated circuit, and in the process of processing the same batch of 1000 printed circuit boards A, since the J-type integrated circuits are in the same position in the printed circuit board A, the peripheral circuits Similarly, according to the detection results of 1000 J-type integrated circuits, the J-type integrated circuit with abnormal electrical parameters can be identified by means of the average method and the scatter plot.
  • the identification is a potential batch quality problem or an individual problem.
  • the printed circuit board A uses a plurality of J-type integrated circuits, the abnormal J-type integrated circuits can be identified in different positions according to the method described.
  • printed circuit board A uses a J-type integrated circuit
  • printed circuit board B uses two J-type integrated circuits in different positions, and two kinds of printed circuit boards are processed by 1000 pieces, which can be judged separately.
  • the three test results are compared and analyzed, and it is analyzed whether the J-type integrated circuit may have an abnormality, which is more accurate than the single-position identification conclusion.
  • the abnormal integrated IC individual performs physical analysis to determine whether there may be a potential hazard of the batch quality.
  • the embodiment of the present invention provides a detection system 70, as shown in FIG. 11, comprising: a printed circuit board 701, a detecting device 702,
  • the printed circuit board 701 includes N detecting circuits 7011, each of which is connected to a different integrated circuit 7012.
  • the detecting circuit is provided with a first detecting point a and a second detecting point b, and the detecting circuit An electrical parameter for detecting the integrated circuit connected to the detection circuit, the N being an integer greater than or equal to one.
  • the first detection point and the second detection point are connected to a detection instrument for performing electrical parameter detection, so that the detection instrument acquires the first electrical through the first detection point and the second detection point. And determining, by the detection data processing module, whether the electrical parameter of the integrated circuit connected to the detection circuit is normal according to the first electrical parameter.
  • the detecting device 702 includes:
  • a detection control module 7021 configured to set a detection state of the detection instrument, the detection device comprising the detection instrument;
  • the detection control module 7021 is further configured to: control the detection instrument to connect the first detection point and the second detection point of the detection circuit of the printed circuit board in a power-on state, the printed circuit board includes N detections a circuit, each of the detection circuits being coupled to a different integrated circuit, the detection circuit being provided with a first detection point and a second detection point, the detection circuit for detecting the integrated circuit connected to the detection circuit Electrical parameter, the N being an integer greater than or equal to 1;
  • the detecting instrument 7022 is configured to detect that the detecting circuit obtains a first detection result, where the first detection result includes an electrical parameter of the integrated circuit connected to the detecting circuit;
  • the detection data processing module 7023 is configured to determine, according to the first detection result, whether an electrical parameter of the integrated circuit connected to the detection circuit is normal.
  • the integrated circuit detecting method provided by the embodiment of the present invention adopts a detecting device, and the detecting circuit detects the electrical parameters of the integrated circuit connected to the detecting circuit, and the printed circuit board is disposed to be connected with the integrated circuit on the printed circuit board.
  • a detecting circuit so that whether the electrical parameter of the integrated circuit connected to the detecting circuit is normal according to the first detecting result, or the detecting device directly controls the function pin and the power pin of the detecting instrument connected to the integrated circuit, and the connection
  • the functional pin and the ground pin of the integrated circuit detect electrical parameters of the functional pins of the integrated circuit, thereby based on the second detection junction If it is judged whether the electrical parameters of the function pins of the integrated circuit are normal, the problem that the electrical parameters of the integrated circuit on the printed circuit board cannot be detected when the printed circuit board is in the power-on state is overcome in the prior art, and The electrical parameters of the integrated circuit on the printed circuit board in the powered state are effectively detected.
  • the power-on state described in the present invention includes a state in which the printed circuit board is energized but no service is running, and a state in which the printed circuit board is powered and the service is running.
  • the N detection circuits included in the printed circuit board of the present invention may be the same or different, and each of the detection circuits is connected to a different integrated circuit.
  • the first detection result described in the present invention is the first electrical parameter.
  • the second detection result is a second electrical parameter.
  • the electrical parameters include at least one of a total current, an on resistance, and a voltage.
  • the predetermined range of electrical parameters of the integrated circuit connected to the detection circuit is the range of empirical values of the integrated circuit when operating on the printed circuit board or the range of average values obtained by the test.
  • the preset range of electrical parameters of the functional pins of the integrated circuit is the range of empirical values of the integrated circuit when operating on the printed circuit board or the range of average values obtained by the test.
  • the disclosed system, apparatus, and method may be implemented in other manners.
  • the device embodiments described above are merely illustrative.
  • the division of the modules or units is only a logical function division.
  • there may be another division manner for example, multiple units or components may be used. Combinations can be integrated into another system, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication through some interface, device or unit. Connections can be in electrical, mechanical or other form.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
  • each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as a standalone product, may be stored in a computer readable storage medium.
  • the technical solution of the present invention which is essential or contributes to the prior art, or all or part of the technical solution, may be embodied in the form of a software product stored in a storage medium.
  • a number of instructions are included to cause a computer device (which may be a personal computer, server, or network device, etc.) or a processor to perform all or part of the steps of the methods described in various embodiments of the present invention.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .

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Abstract

一种集成电路检测方法、装置及***，涉及电子领域，解决了能够检测处于上电状态下的印制电路板上的集成电路的电气参数的问题。具体方案为N个检测电路（101），每个所述检测电路（101）连接一个不同的集成电路（102），所述检测电路（101）设置有第一检测点（a）和第二检测点（b），所述检测电路（101）用于检测与所述检测电路（101）相连的所述集成电路（102）的电气参数，所述N为大于等于1的整数。该方案用于检测印制电路板上的集成电路的电气参数的过程中。

Description

一种集成电路检测方法、装置及***
本申请要求于2015年01月30日提交中国专利局、申请号为201510052924.0、发明名称为“一种集成电路检测方法、装置及***”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子领域，尤其涉及一种集成电路检测方法、装置及***。
背景技术
印制电路板(Printed Circuit Board，PCB)集成许多不同的集成电路(integrated circuit，IC)以实现某种功能，通常主要采用单板功能和通道功能的检测技术在印制电路板上检测集成电路的质量隐患。可以在印制电路板内嵌检测软件，由内嵌检测软件激励印制电路板，检测仪表或印制电路板接收检测结果；或者，可以由检测仪表激励印制电路板，检测仪表或印制电路板接收检测结果，从而通过印制电路板的功能性故障判断印制电路板上或印制电路板的某个通道内的集成电路的电气参数是否异常，集成电路是否存在质量隐患。所述单板为印制电路板。在印制电路板上检测集成电路为在板检测集成电路。
但是，现有技术只能检测印制电路板或印制电路板的通道级的功能性故障，未能具体到印制电路板中的某个集成电路的质量问题，从而无法准确检测集成电路的电气参数，在印制电路板的功能正常的情况下，而集成电路的电气参数异常的质量隐患无法识别。
发明内容
本发明的实施例提供一种集成电路检测方法、装置及***，能够检测处于上电状态下的印制电路板上的集成电路的电气参数。
为达到上述目的，本发明的实施例采用如下技术方案：
本发明实施例的第一方面，提供一种印制电路板，包括：
N个检测电路，每个所述检测电路连接一个不同的集成电路，所述检测电路设置有第一检测点和第二检测点，所述第一检测点和所述第二检测点与用于进行电气参数检测的检测仪表相连，使得所述检测仪表通过所述第一检测点以及所述第二检测点获取第一电气参数，并根据所述第一电气参数判断与所述检测电路连接的集成电路的电气参数是否正常，其中，所述N为大于等于1的整数，所述电气参数包括总电流、导通电阻和电压中至少一个。
结合第一方面，在第一种可实现方式中，
所述第一检测点与为所述集成电路供电的所述印制电路板的电源连接，所述第二检测点与所述集成电路的电源管脚连接；
或者，所述第一检测点与所述集成电路的功能管脚连接，所述第二检测点与所述集成电路的***电路连接。
结合第一方面和第一种可实现方式，在第二种可能的实现方式中，
所述检测电路包括至少一个电阻或至少一个磁珠，或至少一个电感。
结合第二种可实现方式，在第三种可能的实现方式中，所述检测电路为电阻，所述电阻的第一端为第一检测点，所述电阻的第二端为第二检测点。
结合第三种可实现方式，在第四种可能的实现方式中，所述检测电路为磁珠或电感，所述磁珠的第一端为第一检测点，所述磁珠的第二端为第二检测点。
本发明实施例的第二方面，提供一种检测装置，包括：
检测控制模块，用于设置检测仪表的检测状态，所述检测装置包括所述检测仪表；
所述检测控制模块还用于:控制所述检测仪表连接处于上电状态下的印制电路板的检测电路的第一检测点和第二检测点，所述第一检测点和所述第二检测点与用于进行电气参数检测的检测仪表相 连，使得所述检测仪表通过所述第一检测点以及所述第二检测点获取第一电气参数，检测数据处理模块根据所述第一电气参数判断与所述检测电路连接的集成电路的电气参数是否正常，所述N为大于等于1的整数；
所述检测仪表，用于检测所述检测电路得到第一电气参数，所述第一电气参数为与所述检测电路相连的所述集成电路的电气参数；
检测数据处理模块，用于根据所述第一电气参数判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。
结合第二方面，在第一种可实现方式中，
所述检测数据处理模块具体用于：
判断所述第一电气参数是否在第一预设范围内，所述第一预设范围为与所述检测电路相连的所述集成电路的电气参数的预设范围；
若所述第一电气参数在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数正常；
若所述第一电气参数不在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数异常。
结合第二方面或第一种可实现方式，在第二种可实现方式中，
所述检测控制模块还用于:控制所述检测仪表连接所述集成电路的功能管脚和电源管脚，或控制所述检测仪表连接所述集成电路的功能管脚和接地管脚；
所述检测仪表还用于：检测所述集成电路得到第二电气参数，所述第二电气参数包括所述集成电路的功能管脚的电气参数；
所述检测数据处理模块还用于：根据所述第二电气参数判断所述集成电路的功能管脚的电气参数是否正常。
结合第二种可实现方式，在第三种可实现方式中，
所述检测数据处理模块具体用于：
判断所述第二电气参数是否在第二预设范围内，所述第二预设 范围为所述集成电路的功能管脚的电气参数的预设范围；
若所述第二电气参数在第二预设范围内，确定所述集成电路的功能管脚的电气参数正常；
若所述第二电气参数不在第二预设范围内，确定所述集成电路的功能管脚的电气参数异常。
结合第二方面、第一至第三种可实现方式，在第四种可实现方式中，所述电气参数包括总电流、导通电阻和电压中至少一个。
本发明实施例的第三方面，提供一种集成电路检测方法，包括：
所述检测装置设置检测仪表的检测状态，所述检测装置包括所述检测仪表；
所述检测装置连接处于上电状态下的所述印制电路板的检测电路的第一检测点和第二检测点；
所述检测装置的检测仪表检测所述检测电路得到第一电气参数，所述第一电气参数为与所述检测电路相连的所述集成电路的电气参数；
所述检测装置根据所述第一电气参数判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。
结合第三方面，在第一种可实现方式中，
所述根据所述第一电气参数判断所述与所述检测电路相连的所述集成电路的电气参数是否正常包括：
判断所述第一电气参数是否在第一预设范围内，所述第一预设范围为与所述检测电路相连的所述集成电路的电气参数的预设范围；
若所述第一电气参数在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数正常；
若所述第一电气参数不在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数异常。
结合第三方面或第一种可实现方式，在第二种可实现方式中，所述方法还包括：
所述检测控制模块控制所述检测仪表连接所述集成电路的功能管脚和电源管脚，或控制所述检测仪表连接所述集成电路的功能管脚和接地管脚；
所述检测仪表检测所述集成电路得到第二电气参数，所述第二电气参数为所述集成电路的功能管脚的电气参数；
所述检测数据处理模块根据所述第二电气参数判断所述集成电路的功能管脚的电气参数是否正常。
结合第二种可实现方式，在第三种可实现方式中，所述检测数据处理模块根据所述第二电气参数判断所述集成电路的功能管脚的电气参数是否正常包括：
判断所述第二电气参数是否在第二预设范围内，所述第二预设范围为所述集成电路的功能管脚的电气参数的预设范围；
若所述第二电气参数在第二预设范围内，确定所述集成电路的功能管脚的电气参数正常；
若所述第二电气参数不在第二预设范围内，确定所述集成电路的功能管脚的电气参数异常。
结合第三方面、第一至第三种可实现方式，在第四种可实现方式中，所述电气参数包括总电流、导通电阻和电压中至少一个。
本发明实施例的第四方面，提供一种检测***，以上任意所述的印制电路板和以上任意所述检测装置。
本发明实施例提供的集成电路检测方法、装置及***。在印制电路板上设置与该印制电路板上的集成电路连接的检测电路，通过检测电路检测与所述检测电路相连的所述集成电路的电气参数，从而根据第一电气参数判断与所述检测电路相连的所述集成电路的电气参数是否正常，克服了现有技术中在印制电路板处于上电状态时，无法检测该印制电路板上集成电路的电气参数的问题，能够有效地检测处于上电状态下的印制电路板上的集成电路的电气参数。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下 面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供一种印制电路板结构示意图；
图2为本发明实施例提供另一种印制电路板结构示意图；
图3为本发明实施例提供又一种印制电路板结构示意图；
图4为本发明实施例提供一种检测装置结构示意图；
图5为本发明实施例提供另一种检测装置结构示意图；
图6为本发明实施例提供一种集成电路检测方法流程图；
图7为本发明实施例提供另一种集成电路检测方法流程图；
图8为本发明实施例提供一种检测***示意图；
图8a为本发明实施例提供一种检测***电路示意图；
图9为本发明实施例提供另一种检测***示意图；
图10为本发明实施例提供又一种检测***示意图；
图10a为本发明实施例提供的图10的具体检测***示意图；
图10a1为本发明实施例提供的10a的具体检测***电路示意图；
图10b为本发明实施例提供的图10的具体检测***示意图；
图10b1为本发明实施例提供的10b的具体检测***电路示意图；
图11为本发明实施例提供再一种检测***示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
本发明实施例提供一种印制电路板10，如图1所示，包括：
N个检测电路101，每个所述检测电路连接一个不同的集成电路102，所述检测电路设置有第一检测点a和第二检测点b，所述检测电路用于检测与所述检测电路相连的所述集成电路的电气参数，所述N为大于等于1的整数。
其中，所述第一检测点和所述第二检测点与用于进行电气参数检测的检测仪表相连，使得所述检测仪表通过所述第一检测点以及所述第二检测点获取第一电气参数，并根据所述第一电气参数判断与所述检测电路连接的集成电路的电气参数是否正常，所述电气参数包括总电流、导通电阻和电压中至少一个。
这样一来，在印制电路板上设置与该印制电路板上的集成电路连接的检测电路，通过检测电路检测与所述检测电路相连的所述集成电路的电气参数，从而根据第一检测结果判断与所述检测电路相连的所述集成电路的电气参数是否正常，克服了现有技术中在印制电路板处于上电状态时，无法检测该印制电路板上集成电路的电气参数的问题，能够有效地检测处于上电状态下的印制电路板上的集成电路的电气参数。
可选的，检测电路与集成电路的连接方法如图2所示,所述第一检测点a与所述印制电路板的电源VCC管脚A连接，所述第二检测点b与所述集成电路的电源(Volt Current Condenser，VCC)管脚B连接。其中，VCC管脚A是为集成电路供电的所述印制电路板的电源。例如，可以是印制电路板的提供电源功能的电路的管脚，或者，为印刷电路板供电的外部电源的管脚。
可选的，如图3所示，所述第一检测点a与所述集成电路的功能管脚C连接，所述第二检测点b与所述集成电路的***电路103连接。通常，印刷电路板上集成很多电路，不同的电路有不同的功能，相互直接也是连接的，***电路可以是印刷电路板上其他电路。
需要说明的是，所述检测电路包括至少一个电阻或至少一个磁性器件，磁性器件为磁珠或电感。检测电路包括一个电阻时，电阻 的第一端为第一检测点，电阻的第二端为第二检测点。检测电路包括两个以上电阻时，电阻可以进行串联，或者并联，或者串联和并联的混合方式连接。同理，检测电路包括一个磁珠时，磁珠的第一端为第一检测点，磁珠的第二端为第二检测点。检测电路包括两个以上磁珠时，磁珠可以进行串联，或者并联，或者串联和并联的混合方式连接。检测电路包括一个电感时，电感的第一端为第一检测点，电感的第二端为第二检测点。检测电路包括两个以上电感时，电感可以进行串联，或者并联，或者串联和并联的混合方式连接。
实施例2
本发明实施例提供一种检测装置20，如图4所示，包括：
检测控制模块201，用于设置检测仪表202的检测状态，所述检测装置包括所述检测仪表。
所述检测控制模块201还用于:控制所述检测仪表连接处于上电状态下的印制电路板的检测电路的第一检测点和第二检测点，所述印制电路板包括N个检测电路，每个所述检测电路连接一个不同的集成电路，所述检测电路设置有第一检测点和第二检测点，所述检测电路用于检测与所述检测电路相连的所述集成电路的电气参数，所述N为大于等于1的整数；其中，所述第一检测点和所述第二检测点与用于进行电气参数检测的检测仪表相连，使得所述检测仪表通过所述第一检测点以及所述第二检测点获取第一电气参数，检测数据处理模块根据所述第一电气参数判断与所述检测电路连接的集成电路的电气参数是否正常。
所述检测仪表202，用于检测所述检测电路得到第一检测结果，所述第一检测结果包括与所述检测电路相连的所述集成电路的电气参数；
检测数据处理模块203，用于根据所述第一检测结果判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。根据所述第一电气参数判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。
这样一来，通过检测装置的检测控制模块控制检测仪表检测在印制电路板上设置与该印制电路板上的集成电路连接的检测电路，通过检测电路检测与所述检测电路相连的所述集成电路的电气参数，从而根据第一检测结果判断与所述检测电路相连的所述集成电路的电气参数是否正常，克服了现有技术中在印制电路板处于上电状态时，无法检测该印制电路板上集成电路的电气参数的问题，能够有效地检测处于上电状态下的印制电路板上的集成电路的电气参数。
所述检测数据处理模块203具体用于：
判断所述第一检测结果是否在第一预设范围内，所述第一预设范围为与所述检测电路相连的所述集成电路的电气参数的预设范围；
若所述第一检测结果在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数正常；
若所述第一检测结果不在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数异常。
所述检测控制模块201还用于:控制所述检测仪表连接所述集成电路的功能管脚和电源管脚，以及所述集成电路的功能管脚和接地管脚；即，控制所述检测仪表连接所述集成电路的功能管脚和电源管脚，或控制所述检测仪表连接所述集成电路的功能管脚和接地管脚；
所述检测仪表202还用于：检测所述集成电路得到第二检测结果，所述第二检测结果包括所述集成电路的功能管脚的电气参数；
所述检测数据处理模块203还用于：根据所述第二检测结果判断所述集成电路的功能管脚的电气参数是否正常。
所述检测数据处理模块203具体用于：
判断所述第二检测结果是否在第二预设范围内，所述第二预设范围为所述集成电路的功能管脚的电气参数的预设范围；
若所述第二检测结果在第二预设范围内，确定所述集成电路的 功能管脚的电气参数正常；
若所述第二检测结果不在第二预设范围内，确定所述集成电路的功能管脚的电气参数异常。
如图5所示，所述检测数据处理模块可以包括数据记录子模块2031、数据分析子模块2032和预警子模块2033，所述数据记录子模块用于记录第一检测结果和第二检测结果。所述数据分析子模块用于判断所述第一检测结果是否在第一预设范围内，若所述第一检测结果在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数正常；若所述第一检测结果不在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数异常；判断所述第二检测结果是否在第二预设范围内，所述第二预设范围为所述集成电路的功能管脚的电气参数的预设范围；若所述第二检测结果在第二预设范围内，确定所述集成电路的功能管脚的电气参数正常；若所述第二检测结果不在第二预设范围内，确定所述集成电路的功能管脚的电气参数异常。所述预警子模块用于向用户设备发送所述数据分析子模块分析的第一检测结果和/或第二检测结果的预警提示。
需要说明的是，所述电气参数包括总电流、导通电阻和电压中至少一个。本发明实施例提供的检测装置中部分功能模块的具体描述可以参考方法实施例中的对应内容，本实施例这里不再详细赘述。
实施例3
本发明实施例提供一种集成电路检测方法，应用于图1所示的印制电路板，如图4所示的检测装置，如图6所示，包括：
步骤301、检测装置设置检测仪表的检测状态，所述检测装置包括所述检测仪表。
步骤302、检测装置连接处于上电状态下的印制电路板的检测电路的第一检测点和第二检测点。
印制电路板包括N个检测电路，每个所述检测电路连接一个不同的集成电路，所述检测电路设置有第一检测点和第二检测点，所 述检测电路用于检测与所述检测电路相连的所述集成电路的电气参数，所述N为大于等于1的整数。其中，所述第一检测点和所述第二检测点与用于进行电气参数检测的检测仪表相连，使得所述检测仪表通过所述第一检测点以及所述第二检测点获取第一电气参数，检测数据处理模块根据所述第一电气参数判断与所述检测电路连接的集成电路的电气参数是否正常。
步骤303、检测装置检测所述检测电路得到第一检测结果，所述第一检测结果包括与所述检测电路相连的所述集成电路的电气参数。第一检测结果为第一电气参数。
步骤304、检测装置根据所述第一检测结果判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。
本发明实施例提供的集成电路检测方法采用检测装置，通过检测电路检测与所述检测电路相连的所述集成电路的电气参数，印制电路板上设置与该印制电路板上的集成电路连接的检测电路，从而根据第一检测结果判断与所述检测电路相连的所述集成电路的电气参数是否正常，克服了现有技术中在印制电路板处于上电状态时，无法检测该印制电路板上集成电路的电气参数的问题，能够有效地检测处于上电状态下的印制电路板上的集成电路的电气参数。
实施例4
本发明实施例提供一种集成电路检测方法，应用于图1所示的印制电路板和如图4所示的检测装置，所述检测装置还包括数据记录子模块、数据分析子模块和预警子模块，如图7所示，所述方法包括：
步骤401、数据记录子模块设置检测信息表。
所述检测信息表可以包括印制电路板名称、集成电路批次号、集成电路型号、检测开始时刻、检测结束时刻。实际应用中还可以设置检测仪表的型号等信息。
步骤402、检测控制模块控制检测仪表为检测状态。
步骤403a、检测控制模块控制检测仪表连接第n个检测电路的 第一检测点和第二检测点。
所述n为大于等于1且小于等于N的整数，所述N为大于等于1的整数。
示例的，如图8所示，假设第n个检测电路为印制电路板50的第1个检测电路502，第1个检测电路的第一检测点a与所述印制电路板的电源VCC管脚A连接，第1个检测电路502的第二检测点b与第1个集成电路501的电源VCC管脚B连接，检测装置51中的检测控制模块512控制检测仪表511分别与第一检测点a和第二检测点b连接，所述检测电路502包括电阻R1。如图8a所示，图8的具体的电路图。
可选的，如图9所示，第1个检测电路502的第一检测点a与第1个集成电路501的功能管脚C连接，第1个检测电路502的第二检测点b与第1个集成电路501的***电路503连接，检测装置51中的检测控制模块512控制检测仪表511分别与第一检测点a和第二检测点b连接，所述检测电路502包括电阻R1。
步骤403b、检测控制模块控制检测仪表连接第n个集成电路的功能管脚和电源管脚，以及连接所述第n个集成电路的功能管脚和接地管脚。
示例的，如图10所示，假设第n个集成电路为印制电路板50的第1个集成电路501，检测装置51中的检测控制模块512控制检测仪表511连接第1个集成电路501的功能管脚C和电源管脚VCC，以及连接第1个集成电路501的功能管脚C和接地(Ground，GND)管脚。
即，如图10a所示，控制检测仪表511连接第1个集成电路501的功能管脚C和电源管脚VCC，如图10a1所示，图10a的具体电路图。
如图10b所示，控制检测仪表511连接集成电路501的功能管脚C和接地管脚。如图10b1所示，图10b的具体的电路图。
步骤404a、检测仪表检测与第n个检测电路得到第一检测结果。
检测仪表通过检测电路检测所述第n个集成电路的电气参数得到第一检测结果，所述第一检测结果包括与所述检测电路相连的所述集成电路的电气参数，所述电气参数可以是与所述检测电路相连的所述集成电路的总电流、导通电阻、电压和其他电气参数中至少一个。
步骤404b、检测仪表检测第n个集成电路得到第二检测结果。
检测仪表先获取通过检测仪表连接的第n个集成电路的功能管脚和电源管脚的检测结果，再获取通过该检测仪表连接的所述第n个集成电路的功能管脚连接和接地管脚的检查结果，最后对检测结果进行综合分析得到第二检测结果，所述第二检测结果包括所述集成电路的功能管脚的电气参数，所述电气参数可以是所述集成电路的功能管脚的总电流、导通电阻、电压和其他电气参数中至少一个。
步骤405、数据记录子模块从检测仪表读取第一检测结果或第二检测结果。
数据记录子模块可以接收检测控制模块发送的读取第一检测结果或第二检测结果的指令，该数据记录子模块根据所述读取第一检测结果或第二检测结果的指令从检测仪表读取第一检测结果或第二检测结果。
步骤406、数据记录子模块将第一检测结果或第二检测结果存储到检测信息表。
步骤407a、数据分析子模块根据第一检测结果判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。
数据分析子模块判断所述第一检测结果是否在第一预设范围内，所述第一预设范围为与所述检测电路相连的所述集成电路的电气参数的预设范围。若所述第一检测结果在第一预设范围内，执行步骤408a；若所述第一检测结果不在第一预设范围内，执行步骤409a。
步骤407b、数据分析子模块根据第二检测结果判断所述集成电路的功能管脚的电气参数是否正常。
数据分析子模块判断所述第二检测结果是否在第二预设范围内，所述第二预设范围为所述集成电路的功能管脚的电气参数的预设范围。若所述第二检测结果在第二预设范围内，执行步骤408b；若所述第二检测结果不在第二预设范围内，执行步骤409b。
步骤408a、数据分析子模块确定所述与所述检测电路相连的所述集成电路的电气参数正常。
步骤409a、数据分析子模块确定所述与所述检测电路相连的所述集成电路的电气参数异常。
步骤408b、数据分析子模块确定所述集成电路的功能管脚的电气参数正常。
步骤409b、数据分析子模块确定所述集成电路的功能管脚的电气参数异常。
步骤4010、预警子模块向用户设备发送预警提示。
预警子模块向用户设备发送数据分析子模块分析的检测结果的预警提示。可以通过网络将预警提示自动发送至邮箱、手机、或其他终端，预警提示同时将自动创建的待分析问题单链接一起推送至终端，若待分析问题单未得到处理，预警子模块按照预设时间周期性自动发送预警提示。
步骤4011、检测控制模块判断所述第n个集成电路是否为第N个集成电路。
若所述第n个集成电路为第N个集成电路，执行步骤4012；若所述第n个集成电路不是第N个集成电路，执行步骤4013。
步骤4012、检测控制模块设置检测仪表为非检测状态。
步骤4013、检测控制模块控制检测仪表连接第n+1个检测电路的第一检测点和第二检测点。
本发明实施例提供的集成电路检测方法采用检测装置，通过检测电路检测与所述检测电路相连的所述集成电路的电气参数，印制电路板上设置与该印制电路板上的集成电路连接的检测电路，从而根据第一检测结果判断与所述检测电路相连的所述集成电路的电气 参数是否正常，或者，检测装置直接控制检测仪表连接集成电路的功能管脚和电源管脚，以及连接所述集成电路的功能管脚和接地管脚检测所述集成电路的功能管脚的电气参数，从而根据第二检测结果判断所述集成电路的功能管脚的电气参数是否正常，克服了现有技术中在印制电路板处于上电状态时，无法检测该印制电路板上集成电路的电气参数的问题，能够有效地检测处于上电状态下的印制电路板上的集成电路的电气参数。
需要说明的是，可以根据本发明所述的集成电路检测方法检测同类型同批次的多个印制电路板的集成电路，统计检测得到的多个印制电路板中同一集成电路的检测结果，分析该批次的印制电路板中同一集成电路是否存在异常。例如，印制电路板A使用了1片J型号集成电路，在加工同一批次1000片印制电路板A过程中，因为J型号集成电路在印制电路板A中所处位置相同，周边电路也相同，可以根据1000片J型号集成电路的检测结果，采用平均值法、散点图等方法识别出电气参数异常的J型号集成电路。从而根据异常J型号集成电路的分析结论，识别是潜在批次质量问题或者个体问题。同理，若印制电路板A使用了多片J型号集成电路，不同位置均可依照所述方法识别出异常的J型号集成电路。
特别的，不同类型印制电路板，不同批次集成电路间实现联动，有效识别集成电路的电气参数异常导致的质量隐患。例如，印制电路板A使用了1片J型号集成电路，印制电路板B在不同位置使用了2片J型号集成电路，2种印制电路板分别加工了1000片，可先分别判断3个位置的J型号集成电路是否存在异常情况，然后根据初步结论再拉通对比3个检测结果，分析J型号集成电路是否可能存在异常，比单一位置的识别结论更准确，当然，还可以根据检测结果异常的集成电路个体进行物理分析，判断是否可能存在批次质量异常隐患。
本发明实施例提供一种检测***70，如图11所示，包括：印制电路板701，检测装置702，
所述印制电路板701包括N个检测电路7011，每个所述检测电路连接一个不同的集成电路7012，所述检测电路设置有第一检测点a和第二检测点b，所述检测电路用于检测与所述检测电路相连的所述集成电路的电气参数，所述N为大于等于1的整数。其中，所述第一检测点和所述第二检测点与用于进行电气参数检测的检测仪表相连，使得所述检测仪表通过所述第一检测点以及所述第二检测点获取第一电气参数，检测数据处理模块根据所述第一电气参数判断与所述检测电路连接的集成电路的电气参数是否正常。
检测装置702包括：
检测控制模块7021，用于设置检测仪表的检测状态，所述检测装置包括所述检测仪表；
所述检测控制模块7021还用于:控制所述检测仪表连接处于上电状态下的印制电路板的检测电路的第一检测点和第二检测点，所述印制电路板包括N个检测电路，每个所述检测电路连接一个不同的集成电路，所述检测电路设置有第一检测点和第二检测点，所述检测电路用于检测与所述检测电路相连的所述集成电路的电气参数，所述N为大于等于1的整数；
所述检测仪表7022，用于检测所述检测电路得到第一检测结果，所述第一检测结果包括与所述检测电路相连的所述集成电路的电气参数；
检测数据处理模块7023，用于根据所述第一检测结果判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。
本发明实施例提供的集成电路检测方法采用检测装置，通过检测电路检测与所述检测电路相连的所述集成电路的电气参数，印制电路板上设置与该印制电路板上的集成电路连接的检测电路，从而根据第一检测结果判断与所述检测电路相连的所述集成电路的电气参数是否正常，或者，检测装置直接控制检测仪表连接集成电路的功能管脚和电源管脚，以及连接所述集成电路的功能管脚和接地管脚检测所述集成电路的功能管脚的电气参数，从而根据第二检测结 果判断所述集成电路的功能管脚的电气参数是否正常，克服了现有技术中在印制电路板处于上电状态时，无法检测该印制电路板上集成电路的电气参数的问题，能够有效地检测处于上电状态下的印制电路板上的集成电路的电气参数。
需要说明的是，本发明中所述的上电状态包括印制电路板通电但没有运行业务的状态和印制电路板通电且运行业务的状态。本发明中所述的印制电路板包括的N个检测电路可以相同，也可以不同，每个所述检测电路连接一个不同的集成电路。
本发明中所述的第一检测结果为第一电气参数。第二检测结果为第二电气参数。
基于上述各实施例，电气参数包括总电流、导通电阻和电压中至少一个。与检测电路相连的集成电路的电气参数的预设范围就是集成电路在印制电路板上工作时的经验值范围或测试得到的平均值的范围。集成电路的功能管脚的电气参数的预设范围为集成电路在印制电路板上工作时的经验值范围或测试得到的平均值的范围。
通过以上的实施方式的描述，所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，仅以上述各功能模块的划分进行举例说明，实际应用中，可以根据需要而将上述功能分配由不同的功能模块完成，即将装置的内部结构划分成不同的功能模块，以完成以上描述的全部或者部分功能。上述描述的***，装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的***，装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述模块或单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个***，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信 连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本发明各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)或处理器(processor)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (16)

  1. 一种印制电路板，其特征在于，包括：
    N个检测电路，每个所述检测电路连接一个不同的集成电路，所述检测电路设置有第一检测点和第二检测点，所述第一检测点和所述第二检测点与用于进行电气参数检测的检测仪表相连，使得所述检测仪表通过所述第一检测点以及所述第二检测点获取第一电气参数，并根据所述第一电气参数判断与所述检测电路连接的集成电路的电气参数是否正常，其中，所述N为大于等于1的整数，所述电气参数包括总电流、导通电阻和电压中至少一个。
  2. 根据权利要求1所述的印制电路板，其特征在于，所述第一检测点与为所述集成电路供电的所述印制电路板的电源连接，所述第二检测点与所述集成电路的电源管脚连接；
    或者，所述第一检测点与所述集成电路的功能管脚连接，所述第二检测点与所述集成电路的***电路连接。
  3. 根据权利要求1-2任意一项权利要求所述的印制电路板，其特征在于，所述检测电路包括至少一个电阻，或至少一个磁珠，或至少一个电感。
  4. 根据权利要求3所述的印制电路板，其特征在于，所述检测电路为电阻，所述电阻的第一端为第一检测点，所述电阻的第二端为第二检测点。
  5. 根据权利要求3所述的印制电路板，其特征在于，所述检测电路为磁珠或电感，所述磁珠的第一端为第一检测点，所述磁珠的第二端为第二检测点。
  6. 一种检测装置，其特征在于，包括：
    检测控制模块，用于设置检测仪表的检测状态，所述检测装置包括所述检测仪表；
    所述检测控制模块还用于:控制所述检测仪表连接处于上电状态下的印制电路板的检测电路的第一检测点和第二检测点，所述第一检测点和所述第二检测点与用于进行电气参数检测的检测仪表相连，使得所述检测仪 表通过所述第一检测点以及所述第二检测点获取第一电气参数，检测数据处理模块根据所述第一电气参数判断与所述检测电路连接的集成电路的电气参数是否正常，所述N为大于等于1的整数；
    所述检测仪表，用于检测所述检测电路得到第一电气参数，所述第一电气参数为与所述检测电路相连的所述集成电路的电气参数；
    检测数据处理模块，用于根据所述第一电气参数判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。
  7. 根据权利要求6所述的检测装置，其特征在于，所述检测数据处理模块具体用于：
    判断所述第一电气参数是否在第一预设范围内，所述第一预设范围为与所述检测电路相连的所述集成电路的电气参数的预设范围；
    若所述第一电气参数在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数正常；
    若所述第一电气参数不在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数异常。
  8. 根据权利要求6或7所述的检测装置，其特征在于，
    所述检测控制模块还用于:控制所述检测仪表连接所述集成电路的功能管脚和电源管脚，或控制所述检测仪表连接所述集成电路的功能管脚和接地管脚；
    所述检测仪表还用于：检测所述集成电路得到第二电气参数，所述第二电气参数为所述集成电路的功能管脚的电气参数；
    所述检测数据处理模块还用于：根据所述第二电气参数判断所述集成电路的功能管脚的电气参数是否正常。
  9. 根据权利要求8所述的检测装置，其特征在于，所述检测数据处理模块具体用于：
    判断所述第二电气参数是否在第二预设范围内，所述第二预设范围为所述集成电路的功能管脚的电气参数的预设范围；
    若所述第二电气参数在第二预设范围内，确定所述集成电路的功能管脚的电气参数正常；
    若所述第二电气参数不在第二预设范围内，确定所述集成电路的功能管脚的电气参数异常。
  10. 根据权利要求6-9任意一项权利要求所述的检测装置，其特征在于，所述电气参数包括总电流、导通电阻和电压中至少一个。
  11. 一种集成电路检测方法，其特征在于，应用于如权利要求1-5所述的印制电路板和如权利要求6-10所述的检测装置，包括：
    所述检测装置设置检测仪表的检测状态，所述检测装置包括所述检测仪表；
    所述检测装置连接处于上电状态下的所述印制电路板的检测电路的第一检测点和第二检测点；
    所述检测装置的检测仪表检测所述检测电路得到第一电气参数，所述第一电气参数为与所述检测电路相连的所述集成电路的电气参数；
    所述检测装置根据所述第一电气参数判断所述与所述检测电路相连的所述集成电路的电气参数是否正常。
  12. 根据权利要求11所述的集成电路检测方法，其特征在于，所述根据所述第一电气参数判断所述与所述检测电路相连的所述集成电路的电气参数是否正常包括：
    判断所述第一电气参数是否在第一预设范围内，所述第一预设范围为与所述检测电路相连的所述集成电路的电气参数的预设范围；
    若所述第一电气参数在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数正常；
    若所述第一电气参数不在第一预设范围内，确定所述与所述检测电路相连的所述集成电路的电气参数异常。
  13. 根据权利要求11或12所述的集成电路检测方法，其特征在于，所述方法还包括：
    所述检测控制模块控制所述检测仪表连接所述集成电路的功能管脚和电源管脚，或控制所述检测仪表连接所述集成电路的功能管脚和接地管脚；
    所述检测仪表检测所述集成电路得到第二电气参数，所述第二电气参 数为所述集成电路的功能管脚的电气参数；
    所述检测数据处理模块根据所述第二电气参数判断所述集成电路的功能管脚的电气参数是否正常。
  14. 根据权利要求13所述的集成电路检测方法，其特征在于，所述检测数据处理模块根据所述第二电气参数判断所述集成电路的功能管脚的电气参数是否正常包括：
    判断所述第二电气参数是否在第二预设范围内，所述第二预设范围为所述集成电路的功能管脚的电气参数的预设范围；
    若所述第二电气参数在第二预设范围内，确定所述集成电路的功能管脚的电气参数正常；
    若所述第二电气参数不在第二预设范围内，确定所述集成电路的功能管脚的电气参数异常。
  15. 根据权利要求11-14任意一项权利要求所述的集成电路检测方法，其特征在于，所述电气参数包括总电流、导通电阻和电压中至少一个。
  16. 一种检测***，其特征在于，包括：如权利要求1-5中任意一项权利要求所述的印制电路板和如权利要求6-10中任意一项权利要求所述的检测装置。
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US10466297B2 (en) 2019-11-05
CN104635141A (zh) 2015-05-20
BR112017016243A2 (zh) 2018-03-27
US20170328950A1 (en) 2017-11-16
EP3244223B1 (en) 2023-05-31
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