WO2016027776A1 - 接合構造体の製造方法および接合構造体 - Google Patents

接合構造体の製造方法および接合構造体 Download PDF

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Publication number
WO2016027776A1
WO2016027776A1 PCT/JP2015/073041 JP2015073041W WO2016027776A1 WO 2016027776 A1 WO2016027776 A1 WO 2016027776A1 JP 2015073041 W JP2015073041 W JP 2015073041W WO 2016027776 A1 WO2016027776 A1 WO 2016027776A1
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Prior art keywords
laser
perforated
manufacturing
diameter
joined
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PCT/JP2015/073041
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English (en)
French (fr)
Inventor
和義 西川
彰朗 角谷
聡 廣野
博田　知之
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オムロン株式会社
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Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to US15/327,658 priority Critical patent/US10471660B2/en
Priority to CN201580039992.1A priority patent/CN106536169A/zh
Priority to EP15834147.9A priority patent/EP3184283B1/en
Priority to KR1020177001688A priority patent/KR101889346B1/ko
Publication of WO2016027776A1 publication Critical patent/WO2016027776A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B29C66/73941—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset characterised by the materials of both parts being thermosets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7422—Aluminium or alloys of aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74281—Copper or alloys of copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74283—Iron or alloys of iron, e.g. steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/939—Measuring or controlling the joining process by measuring or controlling the speed characterised by specific speed values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0079—Liquid crystals

Definitions

  • the present invention relates to a method for manufacturing a bonded structure and a bonded structure.
  • Patent Document 1 a joining method for joining a first member and a second member made of different materials is known (see, for example, Patent Document 1).
  • Patent Document 1 discloses a bonding method in which a first member that is a resin material and a second member that is a metal material are bonded by a semiconductor laser.
  • the boundary surface of the second member is roughened by sandpaper or the like.
  • the semiconductor laser is absorbed at the boundary surface of the second member by irradiating the boundary surface of the first member and the second member with the semiconductor laser.
  • the first member in the vicinity of the boundary surface is melted, and the first member bites into the unevenness and is solidified.
  • the first member and the second member are joined.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a bonded structure and a bonded structure that can prevent the second member from being thermally deteriorated. Is to provide.
  • a method for manufacturing a joined structure according to the present invention is a method for producing a joined structure in which a first member and a second member are joined, and a perforated part having an opening is formed on the surface of the first member, and a perforated part. Forming a projecting portion projecting inwardly on the inner peripheral surface, a step of adjacently arranging the region where the perforated portion of the first member is formed and the second member, and perforating the first member from the second member side Irradiating the region where the portion is formed with a laser to fill the second member into the perforated portion of the first member and solidify the second member.
  • the irradiated joining laser is easily confined inside the perforated portion by the protruding portion, so that the energy of the joining laser can be efficiently converted into heat.
  • the energy of the laser for joining can be suppressed to the necessary minimum, it is possible to suppress the second member from being thermally deteriorated.
  • the perforated portion has a first diameter-expanded portion whose opening diameter increases from the surface side to the bottom portion in the depth direction, and an opening diameter from the surface side to the bottom portion in the depth direction. It may be formed so as to be continuous with the first reduced diameter portion, and the protruding portion may be disposed on the surface side.
  • the perforated portion has a second reduced diameter portion whose opening diameter decreases from the surface side to the bottom portion in the depth direction, and an opening diameter from the surface side to the bottom portion in the depth direction. It is formed so that the 2nd enlarged diameter part which becomes large, and the 3rd diameter-reduced part where opening diameter becomes small toward the bottom part from the surface side in the depth direction are formed, and it is in the position where the projection part entered the bottom side. It may be arranged.
  • the first member may be a metal, a thermoplastic resin, or a thermosetting resin.
  • the second member may be a resin that transmits laser.
  • the bonded structure according to the present invention is manufactured by any one of the above-described bonded structure manufacturing methods.
  • the irradiated joining laser is easily confined inside the perforated portion by the protruding portion, so that the energy of the joining laser can be efficiently converted into heat.
  • the energy of the laser for joining can be suppressed to the necessary minimum, it is possible to suppress the second member from being thermally deteriorated.
  • the second member can be prevented from being thermally deteriorated.
  • FIG. 1 It is a schematic diagram of the cross section of the joining structure body by 1st Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the joining structure of FIG. 1, Comprising: It is the schematic diagram which showed the state in which the perforated part was formed in the 1st member. It is a figure for demonstrating the manufacturing method of the joining structure of FIG. 1, Comprising: It is the schematic diagram which showed the state with which the laser for joining was irradiated from the 2nd member side. It is a schematic diagram of the cross section of the joining structure body by 2nd Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the joining structure of FIG.
  • the joined structure 100 is obtained by joining a first member 10 and a second member 20 made of different materials.
  • a perforated part 11 having an opening is formed on the surface 13 of the first member 10, and a projecting part 12 projecting inward is formed on the inner peripheral surface of the perforated part 11.
  • the second member 20 is filled in the perforated part 11 of the first member 10 and solidified.
  • FIG. 1 is a diagram schematically showing an enlarged joining interface between the first member 10 and the second member 20, and a plurality of perforated portions 11 are actually provided. In FIG. Only shown.
  • the material of the first member 10 is a metal, a thermoplastic resin, or a thermosetting resin.
  • the material of the second member 20 is a resin that transmits laser, and is a thermoplastic resin or a thermosetting resin.
  • the transmittance of the second member 20 with respect to a laser irradiated at the time of joining described later is preferably 15% or more when the thickness is 3 mm.
  • the metal examples include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof.
  • a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
  • thermoplastic resin examples include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP (Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF ( Polysulfone), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), P I (polyamideimide), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polyteth
  • TPE thermoplastic elastomer
  • examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
  • thermosetting resin examples include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone).
  • EP epoxy
  • PUR polyurethane
  • UF urea formaldehyde
  • MF melamine formaldehyde
  • PF phenol formaldehyde
  • UP unsaturated polyester
  • SI silicone
  • FRP fiber reinforced plastic
  • a filler may be added to the above-described thermoplastic resin and thermosetting resin.
  • the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
  • the perforated part 11 is a substantially circular non-through hole when seen in a plan view, and a plurality of perforated parts 11 are formed on the surface 13 of the first member 10.
  • the opening diameter R1 of the surface 13 of the perforated part 11 is preferably 30 ⁇ m or more and 100 ⁇ m or less. This is because if the opening diameter R1 is less than 30 ⁇ m, the irradiated bonding laser is not sufficiently confined in the perforated portion 11, and the conversion efficiency for converting the energy of the bonding laser into heat may be reduced. Because. On the other hand, when the opening diameter R1 exceeds 100 ⁇ m, the number of the perforated portions 11 per unit area decreases, and the conversion efficiency for converting the energy of the laser for bonding into heat may decrease. Moreover, it is preferable that the depth of the perforation part 11 is 10 micrometers or more. This is because if the depth is less than 10 ⁇ m, the conversion efficiency for converting the energy of the laser for bonding into heat may decrease.
  • the interval between the perforated parts 11 is preferably 200 ⁇ m or less. This is because when the interval between the perforations 11 exceeds 200 ⁇ m, the number of perforations 11 per unit area decreases, and the conversion efficiency for converting the energy of the laser for bonding into heat may decrease. .
  • interval of the punching part 11 it is the distance which the punching part 11 does not overlap and crush.
  • interval of the perforated part 11 is the same. This is because when the perforated portions 11 are equally spaced, the heat distribution when the bonding laser is irradiated is isotropic.
  • the perforated part 11 of the first embodiment includes an enlarged diameter part 111 whose opening diameter increases from the surface 13 side toward the bottom part 113 in the depth direction (Z direction), and a bottom part from the surface 13 side in the depth direction. It is formed so that the reduced diameter portion 112 whose opening diameter becomes smaller toward 113 is connected.
  • the enlarged diameter portion 111 is formed so as to increase in diameter in a curved shape, and the reduced diameter portion 112 is formed so as to reduce in diameter in a curved shape.
  • the enlarged diameter portion 111 is an example of the “first enlarged diameter portion” in the present invention
  • the reduced diameter portion 112 is an example of the “first reduced diameter portion” in the present invention.
  • the enlarged diameter portion 111 is disposed on the surface 13 side, and the reduced diameter portion 112 is disposed on the bottom 113 side.
  • the opening diameter (inner diameter) R2 of the boundary part between the enlarged diameter part 111 and the reduced diameter part 112 is the largest, and the opening diameter R1 is smaller than the opening diameter R2.
  • the protrusion part 12 is arrange
  • This protrusion 12 is formed over the entire length in the circumferential direction, for example, and is formed in an annular shape.
  • the perforated part 11 is formed, for example, by being irradiated with a processing laser.
  • a processing laser As the type of laser, a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected from the viewpoint of enabling pulse oscillation, and considering the laser wavelength, a fiber laser, a YAG laser, a YAG The second harmonic of the laser, YVO 4 laser, and semiconductor laser are preferred.
  • the laser output is set in consideration of the laser irradiation diameter, the type of material of the first member 10, the shape (for example, thickness) of the first member 10, and the like.
  • the output upper limit of the laser is preferably 40W. This is because when the laser output exceeds 40 W, the energy is large and it is difficult to form the perforated part 11 having the protruding part 12.
  • fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON As an example of an apparatus for forming the perforated part 11, there can be mentioned fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON. With this fiber laser marker, it is possible to irradiate a laser where one pulse is composed of a plurality of subpulses. For this reason, since the energy of a laser is easy to concentrate on the depth direction, it is suitable for forming the perforated part 11. Specifically, when the first member 10 is irradiated with a laser, the first member 10 is locally melted so that the formation of the perforated part 11 proceeds. At this time, since the laser is composed of a plurality of sub-pulses, the melted first member 10 is not easily scattered and easily deposited in the vicinity of the perforated portion 11.
  • the melted first member 10 is deposited inside the perforated part 11, thereby forming the protruding part 12.
  • the laser irradiation direction is, for example, a direction perpendicular to the surface 13, and the axis of the perforated part 11 is perpendicular to the surface 13.
  • one period of the subpulse is 15 ns or less. This is because if one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the perforated part 11 having the protruding part 12.
  • one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
  • the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the perforated part 11 having the protruding parts 12.
  • the 2nd member 20 is joined to the surface 13 of the 1st member 10 in which the perforated part 11 was formed.
  • the second member 20 is joined to the first member 10 by laser welding, for example. Thereby, the 2nd member 20 is solidified in the state with which the perforated part 11 was filled.
  • laser for bonding fiber laser, YAG laser, YVO 4 laser, a semiconductor laser, carbon dioxide laser, an excimer laser can be selected.
  • Such a bonded structure 100 is applicable, for example, when a resin cover (not shown) is bonded to a metal case (not shown) of a photoelectric sensor.
  • the metal case corresponds to the first member 10
  • the resin cover corresponds to the second member 20.
  • the perforated part 11 is formed on the surface 13 of the first member 10, and the protruding part 12 is formed on the inner peripheral surface of the perforated part 11.
  • the perforated part 11 and the protruding part 12 are formed by irradiating a laser in which one pulse is composed of a plurality of sub-pulses.
  • it is formed using the fiber laser marker MX-Z2000 or MX-Z2050 described above.
  • the second member 20 is disposed adjacent to the surface 13 of the first member 10. Then, in a state where the first member 10 and the second member 20 are pressurized, the surface 13 of the first member 10 is irradiated with a laser for bonding from the second member 20 side. For this reason, the energy of the laser is converted into heat on the surface 13 of the first member 10, and the temperature of the surface 13 of the first member 10 increases. Thereby, the second member 20 in the vicinity of the surface 13 of the first member 10 is melted, and the second member 20 is filled in the perforated portion 11. Then, the 2nd member 20 is solidified, the 2nd member 20 is joined to the 1st member 10, and the joined structure 100 (refer FIG. 1) is formed.
  • the projecting portion 12 projecting inwardly is formed on the inner peripheral surface of the perforated portion 11, so that the irradiated joining laser is introduced into the perforated portion 11 by the projecting portion 12. Since it is easy to be confined, the energy of the laser for bonding can be efficiently converted into heat. Thereby, since the energy of the laser for joining can be suppressed to the minimum necessary, it is possible to suppress the second member 20 from being thermally deteriorated.
  • the laser absorption layer (illustration omitted) may be provided in the surface 13 of the 1st member 10, or the surface of the 2nd member 20.
  • the laser absorbing layer a pigment-based or dye-based laser absorbing material having an absorptivity with respect to the wavelength of the laser for bonding can be appropriately selected and used. If comprised in this way, the conversion efficiency which converts the energy of the laser for joining into heat
  • the thickness of the laser absorption layer is preferably 10 ⁇ m or less in order to ensure the filling property of the second member 20 into the perforated portion 11. Further, the second member 20 may be blended with a laser absorber as long as the second member 20 satisfies the required laser transmittance.
  • the joined structure 200 is obtained by joining the first member 30 and the second member 20 made of different materials.
  • a perforated part 31 having an opening is formed on the surface 33 of the first member 30, and a projecting part 32 projecting inward is formed on the inner peripheral surface of the perforated part 31.
  • the perforated portion 31 of the first member 30 is filled with the second member 20 and solidified.
  • the perforated part 31 of the second embodiment has a reduced diameter part 311 in which the opening diameter decreases from the surface 33 side toward the bottom part 314 in the depth direction (Z direction), and from the surface 33 side toward the bottom part 314 in the depth direction.
  • the enlarged diameter portion 312 having a larger opening diameter and the reduced diameter portion 313 having a smaller opening diameter from the surface 33 side toward the bottom portion 314 in the depth direction are connected.
  • the reduced diameter portion 311 is formed to linearly reduce the diameter
  • the enlarged diameter portion 312 is formed to increase in a curved shape
  • the reduced diameter portion 313 is formed to reduce in a curved shape. ing.
  • the reduced diameter portion 311 is an example of the “second reduced diameter portion” in the present invention
  • the expanded diameter portion 312 is an example of the “second expanded diameter portion” in the present invention
  • the reduced diameter portion 313 is It is an example of the “third reduced diameter portion” of the present invention.
  • the diameter-reduced part 311, diameter-expanded part 312 and diameter-reduced part 313 are arrange
  • the opening diameter (inner diameter) R4 of the boundary part between the reduced diameter part 311 and the enlarged diameter part 312 is the opening diameter R3 of the surface 33 and the enlarged diameter part 312 and the reduced diameter part 313. It is smaller than the opening diameter R5 of the boundary portion.
  • the protrusion part 32 is arrange
  • the protrusion 32 is formed over the entire length in the circumferential direction, and is formed in an annular shape.
  • the other configuration of the first member 30 is the same as that of the first member 10 described above.
  • the perforated part 31 is formed on the surface 33 of the first member 30, and the protruding part 32 is formed on the inner peripheral surface of the perforated part 31.
  • the perforated part 31 and the protruding part 32 are formed by irradiating a laser in which one pulse is composed of a plurality of sub-pulses.
  • it is formed using the fiber laser marker MX-Z2000 or MX-Z2050 described above.
  • the protruding portion 32 is disposed at a position where it enters the bottom portion 314 side. Such a difference may be caused by, for example, the material of the first member 30 or laser irradiation conditions. Due to such differences.
  • the second member 20 is disposed adjacent to the surface 33 of the first member 30. Then, in a state where the first member 30 and the second member 20 are pressurized, the surface 33 of the first member 30 is irradiated with a laser for bonding from the second member 20 side. For this reason, the energy of the laser is converted into heat on the surface 33 of the first member 30, and the temperature of the surface 33 of the first member 30 increases. Thereby, the second member 20 in the vicinity of the surface 33 of the first member 30 is melted, and the second member 20 is filled in the perforated part 31. Then, the 2nd member 20 is solidified and the 2nd member 20 is joined to the 1st member 30, and joined structure 200 (refer to Drawing 4) is formed.
  • the projecting portion 32 projecting inwardly is formed on the inner peripheral surface of the perforated portion 31, so that the irradiated joining laser is introduced into the perforated portion 31 by the projecting portion 32. Since it is easy to be confined, the energy of the laser for bonding can be efficiently converted into heat. Thereby, since the energy of the laser for joining can be suppressed to the minimum necessary, it is possible to suppress the second member 20 from being thermally deteriorated.
  • the laser absorption layer (illustration omitted) may be provided in the surface 33 of the 1st member 30, or the surface of the 2nd member 20.
  • Example 1 In this Experimental Example 1, a bonded structure 500 (see FIG. 9) according to Example 1 corresponding to the second embodiment and a bonded structure according to Comparative Example 1 were produced, and the bonding strength and the second member of each were manufactured. Appearance was evaluated. The results are shown in Table 1.
  • the first member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the second member 502 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • the laser is irradiated to a predetermined region R on the surface of the first member 501.
  • the predetermined region R is an area where the bonded structure 500 is bonded, and is 12.5 mm ⁇ 20 mm. Further, this laser irradiation was performed using a fiber laser marker MX-Z2000 manufactured by OMRON. The processing conditions by this laser are as follows.
  • the frequency is a frequency of a pulse constituted by a plurality (20 in this example) of sub-pulses. That is, under this irradiation condition, laser (pulse) is irradiated 10,000 times at intervals of 65 ⁇ m while moving 650 mm per second, and the pulse is composed of 20 sub-pulses. Note that the number of scans is the number of times the laser is repeatedly irradiated to the same location.
  • a perforated portion is formed in the predetermined region R of the first member 501, and the perforated portion protrudes from the surface into the perforated portion. Part is formed. That is, as shown in Table 1, the opening diameter R4 (see FIG. 4) is smaller than the surface opening diameter R3 (see FIG. 4) and the opening diameter R5 (see FIG. 4).
  • the second member 502 is disposed adjacent to the predetermined region R of the first member 501, and the predetermined region R is irradiated with laser from the second member 502 side with a predetermined pressure applied. As a result, the second member 502 is joined to the first member 501.
  • the bonding conditions by this laser are as follows.
  • the same materials as in Example 1 were used as materials for the first member and the second member.
  • the perforated part was formed using the fiber laser without a pulse control function. That is, the perforated portion was formed by irradiating a laser in which one pulse is not composed of a plurality of subpulses. For this reason, a mortar-shaped (conical) perforated portion was formed in the first member of Comparative Example 1. That is, as shown in Table 1, the first member of Comparative Example 1 is not formed with a protruding portion that protrudes inward from the inner peripheral surface, and has a shape corresponding to the opening diameters R4 and R5 of Example 1. Not formed.
  • the joining conditions by a laser were as follows.
  • Laser Semiconductor laser (wavelength 808 nm) Oscillation mode: Continuous oscillation Output: 100W Focal diameter: 4mm Scanning speed: 1mm / sec Contact pressure: 0.6 MPa And about the joining structure 500 of Example 1, and the joining structure of the comparative example 1, the joint strength and the external appearance of the 2nd member were evaluated.
  • joining strength was performed using the electromechanical universal testing machine 5900 made from Instron. Specifically, the test was conducted at a tensile speed of 5 mm / min in both the shearing direction and the peeling direction (vertical direction), and the test was terminated when the second member broke or the joint interface broke. And when the 2nd member fractured
  • the appearance of the second member after joining was evaluated visually. Specifically, if the second member is not burned, discolored or deformed, it is evaluated as pass ( ⁇ ), and if the second member is burned, discolored, or deformed, it is evaluated as rejected (x). did.
  • the bonding strength was acceptable in both the shearing direction and the peeling direction, and the appearance of the second member 502 was also acceptable. This is because when the second member 502 is joined to the first member 501, the irradiated laser is easily confined inside the perforated portion by the protruding portion, so that the energy of the laser can be efficiently converted into heat. This is because the energy of the laser can be minimized. That is, in the joint structure 500 of Example 1, the thermal deterioration of the second member 502 could be suppressed.
  • Example 2 In Experimental Example 2, a bonded structure according to Example 2 corresponding to the second embodiment and a bonded structure according to Comparative Example 2 were produced, and the bonding strength and the appearance of the second member were evaluated for each. The results are shown in Table 2.
  • Experimental Example 2 the material of the first member was changed from Experimental Example 1. Specifically, in the joined structure of Experimental Example 2, PBT (Juranex (registered trademark) 3316 made by Wintech Polymer) was used as the material of the first member. Moreover, the laser processing conditions of Example 2 were changed as follows with the change of the material of the first member.
  • Laser Fiber laser (wavelength 1062nm)
  • Oscillation mode Pulse oscillation (frequency 10kHz)
  • Output 1.1W Scanning speed: 650mm / sec Scanning frequency: 3 times
  • Irradiation interval 65 ⁇ m Number of subpulses: 3
  • the joining conditions of Example 2 were changed as follows.
  • the joint strength was acceptable in both the shearing direction and the peeling direction, and the appearance of the second member was also acceptable. That is, even when PBT, which is a resin, is used as the material of the first member, the laser energy can be efficiently converted into heat by forming the perforated part having the protruding part. Therefore, it is possible to suppress the second member from being thermally deteriorated.
  • the surface 13 may be flat or curved.
  • the enlarged diameter portion 111 and the reduced diameter portion 112 are formed to be continuous.
  • the present invention is not limited to this, and the depth direction is provided between the enlarged diameter portion and the reduced diameter portion.
  • a straight extending portion may be formed. The same applies to the second embodiment.
  • surroundings of the perforation part 11 showed the flat example, it is not restricted to this, Opening of the perforation part 11 like the 1st member 10a by the 1st modification shown in FIG.
  • a bulging portion 14 that bulges upward from the surface 13 may be formed around.
  • the raised portion 14 is formed so as to surround the perforated portion 11 and is formed in a substantially circular shape when seen in a plan view.
  • the raised portion 14 is formed, for example, by depositing the melted first member 10a when a laser in which one pulse is composed of a plurality of sub-pulses is irradiated. The same applies to the second embodiment.
  • the present invention is not limited to this, as in the first member 10b according to the second modification shown in FIG.
  • the shaft center of the perforated part 11 b may be formed so as to be inclined with respect to the surface 13.
  • a protruding portion 12b protruding inward is formed on the inner peripheral surface of the perforated portion 11b.
  • the perforated part 11b is formed, for example, by making the laser irradiation direction oblique to the surface 13 (45 ° or more and less than 90 °). Thereby, even if the obstacle at the time of irradiating a laser exists above the area
  • the example in which the one protrusion part 12 was formed in the perforation part 11 was shown, not only this but perforation like the 1st member 10c by the 3rd modification shown in FIG.
  • a plurality of protruding portions 121c and 122c may be formed on the portion 11c.
  • This perforated part 11c can be formed, for example, by changing the laser output condition and irradiating the same part with the laser. If comprised in this way, since the surface area of the perforated part 11c becomes large, the energy of the laser for joining can be more efficiently converted into heat.
  • FIG. 12 there are two protruding portions 121c and 122c, but three or more protruding portions may be formed. The same applies to the second embodiment.
  • one perforated portion 11d may be formed by multiple times of laser irradiation with different positions. That is, one perforated part 11d may be formed by overlapping a part of the perforated part formed by laser irradiation. A protruding portion 12d protruding inward is formed on the inner peripheral surface of the perforated portion 11d.
  • the first to fourth modifications described above may be combined as appropriate.
  • the present invention is applicable to a method for manufacturing a joined structure in which a first member and a second member made of different materials are joined, and a joined structure.

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Abstract

　接合構造体の製造方法は、第１部材と第２部材とが接合された接合構造体の製造方法であり、第１部材の表面に開口を有する穿孔部を形成するとともに、穿孔部の内周面に内側に突出する突出部を形成する工程と、第１部材の穿孔部が形成された領域と第２部材とを隣接配置する工程と、第２部材側から第１部材の穿孔部が形成された領域にレーザを照射することにより、第１部材の穿孔部に第２部材を充填して固化させる工程とを備える。

Description

接合構造体の製造方法および接合構造体
　本発明は、接合構造体の製造方法および接合構造体に関する。
　従来、異なる材料からなる第１部材および第２部材を接合させる接合方法が知られている（たとえば、特許文献１参照）。
　特許文献１には、樹脂材料である第１部材と、金属材料である第２部材とを半導体レーザにより接合する接合方法が開示されている。第２部材の境界面は、サンドペーパなどにより凹凸状に荒らされている。そして、第１部材および第２部材の境界面に半導体レーザが照射されることにより、第２部材の境界面において半導体レーザが吸収される。これにより、境界面付近の第１部材が溶融され、その第１部材が凹凸に食い込み固化される。その結果、第１部材および第２部材が接合される。
特開２００８－１６２２８８号公報
　しかしながら、上記した従来の接合方法では、第２部材の境界面に照射された半導体レーザが反射されやすいので、レーザのエネルギを効率的に熱に変換するのが困難である。したがって、従来の接合方法では、レーザのエネルギを高くする必要があるので、樹脂材料が熱劣化（たとえば、焼け、変色、変形など）しやすいという問題点がある。
　本発明は、上記の課題を解決するためになされたものであり、本発明の目的は、第２部材が熱劣化するのを抑制することが可能な接合構造体の製造方法および接合構造体を提供することである。
　本発明による接合構造体の製造方法は、第１部材と第２部材とが接合された接合構造体の製造方法であり、第１部材の表面に開口を有する穿孔部を形成するとともに、穿孔部の内周面に内側に突出する突出部を形成する工程と、第１部材の穿孔部が形成された領域と第２部材とを隣接配置する工程と、第２部材側から第１部材の穿孔部が形成された領域にレーザを照射することにより、第１部材の穿孔部に第２部材を充填して固化させる工程とを備える。
　このように構成することによって、照射された接合用のレーザが突出部により穿孔部の内部に閉じ込められやすいので、接合用のレーザのエネルギを効率的に熱に変換することができる。これにより、接合用のレーザのエネルギを必要最小限に抑えることができるので、第２部材が熱劣化するのを抑制することができる。
　上記接合構造体の製造方法において、穿孔部は、深さ方向において表面側から底部に向けて開口径が大きくなる第１拡径部と、深さ方向において表面側から底部に向けて開口径が小さくなる第１縮径部とが連なるように形成されており、突出部が表面側に配置されるようにしてもよい。
　上記接合構造体の製造方法において、穿孔部は、深さ方向において表面側から底部に向けて開口径が小さくなる第２縮径部と、深さ方向において表面側から底部に向けて開口径が大きくなる第２拡径部と、深さ方向において表面側から底部に向けて開口径が小さくなる第３縮径部とが連なるように形成されており、突出部が底部側に入り込んだ位置に配置されるようにしてもよい。
　上記接合構造体の製造方法において、第１部材は、金属、熱可塑性樹脂、または、熱硬化性樹脂であってもよい。
　上記接合構造体の製造方法において、第２部材は、レーザを透過する樹脂であってもよい。
　本発明による接合構造体は、上記したいずれか１つの接合構造体の製造方法によって製造されている。
　このように構成することによって、照射された接合用のレーザが突出部により穿孔部の内部に閉じ込められやすいので、接合用のレーザのエネルギを効率的に熱に変換することができる。これにより、接合用のレーザのエネルギを必要最小限に抑えることができるので、第２部材が熱劣化するのを抑制することができる。
　本発明の接合構造体の製造方法および接合構造体によれば、第２部材が熱劣化するのを抑制することができる。
本発明の第１実施形態による接合構造体の断面の模式図である。 図１の接合構造体の製造方法を説明するための図であって、第１部材に穿孔部が形成された状態を示した模式図である。 図１の接合構造体の製造方法を説明するための図であって、第２部材側から接合用のレーザが照射された状態を示した模式図である。 本発明の第２実施形態による接合構造体の断面の模式図である。 図４の接合構造体の製造方法を説明するための図であって、第１部材に穿孔部が形成された状態を示した模式図である。 図４の接合構造体の製造方法を説明するための図であって、第２部材側から接合用のレーザが照射された状態を示した模式図である。 実施例の第１部材がレーザにより加工される状態を示した斜視図である。 実施例の第２部材がレーザにより第１部材に接合される状態を示した斜視図である。 実施例の接合構造体を示した斜視図である。 第１実施形態の第１変形例による第１部材を示した模式図である。 第１実施形態の第２変形例による第１部材を示した模式図である。 第１実施形態の第３変形例による第１部材を示した模式図である。 第１実施形態の第４変形例による第１部材を示した模式図である。
　以下、本発明の実施形態について図面を参照して説明する。
　（第１実施形態）
　まず、図１を参照して、本発明の第１実施形態による接合構造体１００について説明する。
　接合構造体１００は、図１に示すように、異なる材料からなる第１部材１０および第２部材２０が接合されたものである。第１部材１０の表面１３には、開口を有する穿孔部１１が形成され、その穿孔部１１の内周面には、内側に突出する突出部１２が形成されている。そして、第１部材１０の穿孔部１１には、第２部材２０が充填されて固化されている。なお、図１は、第１部材１０および第２部材２０の接合界面を拡大して模式的に示した図であり、実際には穿孔部１１が複数設けられているが、図１では１つだけ示した。
　第１部材１０の材料は、金属、熱可塑性樹脂、または、熱硬化性樹脂である。第２部材２０の材料は、レーザを透過する樹脂であって、熱可塑性樹脂、または、熱硬化性樹脂である。この第２部材２０の、後述する接合時に照射されるレーザについての透過率は、厚みが３ｍｍのときに１５％以上であることが好ましい。
　上記金属の一例としては、鉄系金属、ステンレス系金属、銅系金属、アルミ系金属、マグネシウム系金属、および、それらの合金が挙げられる。また、金属成型体であってもよく、亜鉛ダイカスト、アルミダイカスト、粉末冶金などであってもよい。
　上記熱可塑性樹脂の一例としては、ＰＶＣ（ポリ塩化ビニル）、ＰＳ（ポリスチレン）、ＡＳ（アクリロニトリル・スチレン）、ＡＢＳ（アクリロニトリル・ブタジエン・スチレン）、ＰＭＭＡ（ポリメチルメタクリレート）、ＰＥ（ポリエチレン）、ＰＰ（ポリプロピレン）、ＰＣ（ポリカーボネート）、ｍ－ＰＰＥ（変性ポリフェニレンエーテル）、ＰＡ６（ポリアミド６）、ＰＡ６６（ポリアミド６６）、ＰＯＭ（ポリアセタール）、ＰＥＴ（ポリエチレンテレフタレート）、ＰＢＴ（ポリブチレンテレフタレート）、ＰＳＦ（ポリサルホン）、ＰＡＲ（ポリアリレート）、ＰＥＩ（ポリエーテルイミド）、ＰＰＳ（ポリフェニレンサルファイド）、ＰＥＳ（ポリエーテルサルホン）、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＡＩ（ポリアミドイミド）、ＬＣＰ（液晶ポリマー）、ＰＶＤＣ（ポリ塩化ビニリデン）、ＰＴＦＥ（ポリテトラフルオロエチレン）、ＰＣＴＦＥ（ポリクロロトリフルオロエチレン）、および、ＰＶＤＦ（ポリフッ化ビニリデン）が挙げられる。また、ＴＰＥ（熱可塑性エラストマ）であってもよく、ＴＰＥの一例としては、ＴＰＯ（オレフィン系）、ＴＰＳ（スチレン系）、ＴＰＥＥ（エステル系）、ＴＰＵ（ウレタン系）、ＴＰＡ（ナイロン系）、および、ＴＰＶＣ（塩化ビニル系）が挙げられる。
　上記熱硬化性樹脂の一例としては、ＥＰ（エポキシ）、ＰＵＲ（ポリウレタン）、ＵＦ（ユリアホルムアルデヒド）、ＭＦ（メラミンホルムアルデヒド）、ＰＦ（フェノールホルムアルデヒド）、ＵＰ（不飽和ポリエステル）、および、ＳＩ（シリコーン）が挙げられる。また、ＦＲＰ（繊維強化プラスチック）であってもよい。
　なお、上記した熱可塑性樹脂および熱硬化性樹脂には、充填剤が添加されていてもよい。充填剤の一例としては、無機系充填剤（ガラス繊維、無機塩類など）、金属系充填剤、有機系充填剤、および、炭素繊維などが挙げられる。
　穿孔部１１は、平面的に見てほぼ円形の非貫通孔であり、第１部材１０の表面１３に複数形成されている。穿孔部１１の表面１３の開口径Ｒ１は、３０μｍ以上、１００μｍ以下が好ましい。これは、開口径Ｒ１が３０μｍを下回ると、照射された接合用のレーザが穿孔部１１内に十分に閉じ込められず、接合用のレーザのエネルギを熱に変換する変換効率が低下する場合があるためである。一方、開口径Ｒ１が１００μｍを上回ると、単位面積あたりの穿孔部１１の数が減少して、接合用のレーザのエネルギを熱に変換する変換効率が低下する場合があるためである。また、穿孔部１１の深さは、１０μｍ以上であることが好ましい。これは、深さが１０μｍを下回ると、接合用のレーザのエネルギを熱に変換する変換効率が低下する場合があるためである。
　また、穿孔部１１の間隔（所定の穿孔部１１の中心と、所定の穿孔部１１と隣接する穿孔部１１の中心との距離）は、２００μｍ以下であることが好ましい。これは、穿孔部１１の間隔が２００μｍを上回ると、単位面積あたりの穿孔部１１の数が減少して、接合用のレーザのエネルギを熱に変換する変換効率が低下する場合があるためである。なお、穿孔部１１の間隔の下限の一例としては、穿孔部１１が重畳して潰れない距離である。また、穿孔部１１の間隔は同じであることが好ましい。これは、穿孔部１１が等間隔であると、接合用のレーザが照射される際の熱の分布が等方的になるためである。
　ここで、第１実施形態の穿孔部１１は、深さ方向（Ｚ方向）において表面１３側から底部１１３に向けて開口径が大きくなる拡径部１１１と、深さ方向において表面１３側から底部１１３に向けて開口径が小さくなる縮径部１１２とが連なるように形成されている。拡径部１１１は、曲線状に拡径するように形成され、縮径部１１２は、曲線状に縮径するように形成されている。なお、拡径部１１１は、本発明の「第１拡径部」の一例であり、縮径部１１２は、本発明の「第１縮径部」の一例である。
　そして、拡径部１１１が表面１３側に配置されるとともに、縮径部１１２が底部１１３側に配置されている。このため、穿孔部１１において、拡径部１１１と縮径部１１２との境界部分の開口径（内径）Ｒ２が最も大きくなっており、開口径Ｒ１が開口径Ｒ２よりも小さくなっている。これにより、突出部１２が第１部材１０の表面１３側に配置されている。この突出部１２は、たとえば、周方向における全長にわたって形成されており、環状に形成されている。
　この穿孔部１１は、たとえば、加工用のレーザが照射されることによって形成される。レーザの種類としては、パルス発振が可能な観点から、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ４レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択でき、レーザの波長を考慮すると、ファイバレーザ、ＹＡＧレーザ、ＹＡＧレーザの第２高調波、ＹＶＯ４レーザ、半導体レーザが好ましい。なお、レーザの出力は、レーザの照射径、第１部材１０の材料の種類、第１部材１０の形状（たとえば厚み）などを考慮して設定される。たとえば、レーザの出力上限は４０Ｗが好ましい。これは、レーザの出力が４０Ｗを超えると、エネルギが大きく、突出部１２を有する穿孔部１１を形成することが困難であるためである。
　穿孔部１１を形成する装置の一例としては、オムロン製のファイバレーザマーカＭＸ－Ｚ２０００またはＭＸ－Ｚ２０５０を挙げることができる。このファイバレーザマーカでは、１パルスが複数のサブパルスで構成されるレーザを照射することが可能である。このため、レーザのエネルギを深さ方向に集中させやすいので、穿孔部１１を形成するのに好適である。具体的には、第１部材１０にレーザが照射されると、第１部材１０が局部的に溶融されることにより穿孔部１１の形成が進行する。このとき、レーザが複数のサブパルスで構成されているため、溶融された第１部材１０が飛散されにくく、穿孔部１１の近傍に堆積されやすい。そして、穿孔部１１の形成が進行すると、溶融された第１部材１０が穿孔部１１の内部に堆積されることにより、突出部１２が形成される。なお、レーザの照射方向は、たとえば、表面１３に対して垂直方向であり、穿孔部１１の軸心が表面１３に対して垂直になる。
　なお、上記ファイバレーザマーカによる加工条件としては、サブパルスの１周期が１５ｎｓ以下であることが好ましい。これは、サブパルスの１周期が１５ｎｓを超えると、熱伝導によりエネルギが拡散しやすくなり、突出部１２を有する穿孔部１１を形成しにくくなるためである。なお、サブパルスの１周期は、サブパルスの１回分の照射時間と、そのサブパルスの照射が終了されてから次回のサブパルスの照射が開始されるまでの間隔との合計時間である。
　また、上記ファイバレーザマーカによる加工条件としては、１パルスのサブパルス数は、２以上５０以下であることが好ましい。これは、サブパルス数が５０を超えると、サブパルスの単位あたりの出力が小さくなり、突出部１２を有する穿孔部１１を形成しにくくなるためである。
　そして、第２部材２０は、穿孔部１１が形成された第１部材１０の表面１３に接合されている。この第２部材２０は、たとえばレーザ溶着によって第１部材１０に接合されている。これにより、第２部材２０が穿孔部１１に充填された状態で固化されている。なお、接合用のレーザの種類としては、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ４レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択できる。
　このような接合構造体１００は、たとえば、光電センサの金属ケース（図示省略）に樹脂カバー（図示省略）を接合させる場合に適用可能である。この場合には、金属ケースが第１部材１０に相当し、樹脂カバーが第２部材２０に相当する。
　－接合構造体の製造方法－
　次に、図１～図３を参照して、第１実施形態による接合構造体１００の製造方法について説明する。
　まず、第１部材１０の表面１３に穿孔部１１を形成するとともに、その穿孔部１１の内周面に突出部１２を形成する。この穿孔部１１および突出部１２は、たとえば、図２に示すように、１パルスが複数のサブパルスで構成されたレーザを照射することによって形成される。具体例としては、上記したファイバレーザマーカＭＸ－Ｚ２０００またはＭＸ－Ｚ２０５０を用いて形成する。
　その後、図３に示すように、第１部材１０の表面１３に第２部材２０が隣接配置される。そして、第１部材１０および第２部材２０が加圧された状態で、第２部材２０側から接合用のレーザが第１部材１０の表面１３に照射される。このため、そのレーザのエネルギが第１部材１０の表面１３で熱に変換され、第１部材１０の表面１３の温度が高くなる。これにより、第１部材１０の表面１３近傍の第２部材２０が溶融され、その第２部材２０が穿孔部１１に充填される。その後、第２部材２０が固化されることにより、第２部材２０が第１部材１０に接合され、接合構造体１００（図１参照）が形成される。
　ここで、第１実施形態では、穿孔部１１の内周面に内側に突出する突出部１２が形成されていることによって、照射された接合用のレーザが突出部１２により穿孔部１１の内部に閉じ込められやすいので、接合用のレーザのエネルギを効率的に熱に変換することができる。これにより、接合用のレーザのエネルギを必要最小限に抑えることができるので、第２部材２０が熱劣化するのを抑制することができる。
　なお、第１部材１０および第２部材２０が隣接配置されたときに、第１部材１０の表面１３または第２部材２０の表面にレーザ吸収層（図示省略）が設けられていてもよい。このレーザ吸収層としては、接合用のレーザの波長に対して吸収性を有する顔料系または染料系のレーザ吸収材などを適宜選択して用いることができる。このように構成すれば、接合用のレーザのエネルギを熱に変換する変換効率の向上を図ることができる。なお、レーザ吸収層の厚みは、第２部材２０の穿孔部１１への充填性を確保するために１０μｍ以下が好ましい。また、第２部材２０が要求されるレーザの透過性を満たす範囲内において、第２部材２０にレーザ吸収材が配合されていてもよい。
　（第２実施形態）
　次に、図４を参照して、本発明の第２実施形態による接合構造体２００について説明する。
　接合構造体２００は、図４に示すように、異なる材料からなる第１部材３０および第２部材２０が接合されたものである。第１部材３０の表面３３には、開口を有する穿孔部３１が形成され、その穿孔部３１の内周面には、内側に突出する突出部３２が形成されている。そして、第１部材３０の穿孔部３１には、第２部材２０が充填されて固化されている。
　第２実施形態の穿孔部３１は、深さ方向（Ｚ方向）において表面３３側から底部３１４に向けて開口径が小さくなる縮径部３１１と、深さ方向において表面３３側から底部３１４に向けて開口径が大きくなる拡径部３１２と、深さ方向において表面３３側から底部３１４に向けて開口径が小さくなる縮径部３１３とが連なるように形成されている。縮径部３１１は、直線状に縮径するように形成され、拡径部３１２は、曲線状に拡径するように形成され、縮径部３１３は、曲線状に縮径するように形成されている。なお、縮径部３１１は、本発明の「第２縮径部」の一例であり、拡径部３１２は、本発明の「第２拡径部」の一例であり、縮径部３１３は、本発明の「第３縮径部」の一例である。
　そして、表面３３側から底部３１４側に向けて順に、縮径部３１１、拡径部３１２および縮径部３１３が配置されている。このため、穿孔部３１において、縮径部３１１と拡径部３１２との境界部分の開口径（内径）Ｒ４が、表面３３の開口径Ｒ３、および、拡径部３１２と縮径部３１３との境界部分の開口径Ｒ５よりも小さくなっている。これにより、突出部３２が底部３１４側に入り込んだ位置に配置されている。この突出部３２は、たとえば、周方向における全長にわたって形成されており、環状に形成されている。
　なお、第１部材３０のその他の構成は、上記した第１部材１０と同様である。
　－接合構造体の製造方法－
　次に、図４～図６を参照して、第２実施形態による接合構造体２００の製造方法について説明する。
　まず、第１部材３０の表面３３に穿孔部３１を形成するとともに、その穿孔部３１の内周面に突出部３２を形成する。この穿孔部３１および突出部３２は、たとえば、図５に示すように、１パルスが複数のサブパルスで構成されたレーザを照射することによって形成される。具体例としては、上記したファイバレーザマーカＭＸ－Ｚ２０００またはＭＸ－Ｚ２０５０を用いて形成する。なお、第２実施形態では、第１実施形態と異なり、突出部３２が底部３１４側に入り込んだ位置に配置されるが、このような違いは、たとえば、第１部材３０の材料やレーザ照射条件などの違いに起因する。
　その後、図６に示すように、第１部材３０の表面３３に第２部材２０が隣接配置される。そして、第１部材３０および第２部材２０が加圧された状態で、第２部材２０側から接合用のレーザが第１部材３０の表面３３に照射される。このため、そのレーザのエネルギが第１部材３０の表面３３で熱に変換され、第１部材３０の表面３３の温度が高くなる。これにより、第１部材３０の表面３３近傍の第２部材２０が溶融され、その第２部材２０が穿孔部３１に充填される。その後、第２部材２０が固化されることにより、第２部材２０が第１部材３０に接合され、接合構造体２００（図４参照）が形成される。
　ここで、第２実施形態では、穿孔部３１の内周面に内側に突出する突出部３２が形成されていることによって、照射された接合用のレーザが突出部３２により穿孔部３１の内部に閉じ込められやすいので、接合用のレーザのエネルギを効率的に熱に変換することができる。これにより、接合用のレーザのエネルギを必要最小限に抑えることができるので、第２部材２０が熱劣化するのを抑制することができる。
　なお、第１部材３０および第２部材２０が隣接配置されたときに、第１部材３０の表面３３または第２部材２０の表面にレーザ吸収層（図示省略）が設けられていてもよい。
　－実験例－
　次に、図７～図９を参照して、上記した第２実施形態の効果を確認するために行った実験例１および２について説明する。
　［実験例１］
　この実験例１では、第２実施形態に対応する実施例１による接合構造体５００（図９参照）と、比較例１による接合構造体とを作製し、それぞれについての接合強度および第２部材の外観を評価した。その結果を表１に示す。
Figure JPOXMLDOC01-appb-T000001
  
　まず、実施例１による接合構造体５００の作製方法について説明する。
　実施例１の接合構造体５００では、第１部材５０１の材料としてＳＵＳ３０４を用いるとともに、第２部材５０２の材料としてＰＭＭＡ（三菱レイヨン製のアクリライト（登録商標））を用いた。第１部材５０１は、板状に形成されており、長さが１００ｍｍであり、幅が２９ｍｍであり、厚みが３ｍｍである。第２部材５０２は、板状に形成されており、長さが１００ｍｍであり、幅が２５ｍｍであり、厚みが３ｍｍである。
　そして、図７に示すように、第１部材５０１の表面の所定領域Ｒにレーザを照射する。この所定領域Ｒは、接合構造体５００が接合される面積であり、１２．５ｍｍ×２０ｍｍとした。また、このレーザの照射は、オムロン製のファイバレーザマーカＭＸ－Ｚ２０００を用いて行った。このレーザによる加工条件は、以下のとおりである。
　＜レーザ加工条件＞
　レーザ：ファイバレーザ（波長１０６２ｎｍ）
　発振モード：パルス発振（周波数１０ｋＨｚ）
　出力：３．８Ｗ
　走査速度：６５０ｍｍ／ｓｅｃ
　走査回数：２０回
　照射間隔：６５μｍ
　サブパルス数：２０
　なお、周波数は、複数（この例では２０）のサブパルスによって構成されるパルスの周波数である。つまり、この照射条件では、１秒間に６５０ｍｍ移動しながら６５μｍの間隔で１万回レーザ（パルス）を照射し、そのパルスが２０のサブパルスによって構成されている。なお、走査回数は、レーザが同じ箇所に繰り返し照射される回数である。
　このように、１パルスが複数のサブパルスで構成されるレーザを照射することにより、第１部材５０１の所定領域Ｒには穿孔部が形成されるとともに、その穿孔部内に表面から入り込んだ位置に突出部が形成される。すなわち、表１に示すように、開口径Ｒ４（図４参照）が、表面の開口径Ｒ３（図４参照）および開口径Ｒ５（図４参照）よりも小さくなっている。
　そして、図８に示すように、第１部材５０１の所定領域Ｒに第２部材５０２を隣接配置し、所定の圧力を与えた状態で第２部材５０２側からレーザを所定領域Ｒに照射することにより、第２部材５０２が第１部材５０１に接合される。このレーザによる接合条件は、以下のとおりである。
　＜レーザ接合条件＞
　レーザ：半導体レーザ（波長８０８ｎｍ）
　発振モード：連続発振
　出力：３０Ｗ
　焦点径：４ｍｍ
　走査速度：１ｍｍ／ｓｅｃ
　密着圧力：０．６ＭＰａ
　このようにして、実施例１の接合構造体５００（図９参照）を作製した。
　次に、比較例１による接合構造体の作製方法について説明する。
　比較例１の接合構造体では、第１部材および第２部材の材料として実施例１と同じものを用いた。そして、比較例１の接合構造体では、パルスコントロール機能のないファイバレーザを用いて穿孔部を形成した。すなわち、１パルスが複数のサブパルスで構成されていないレーザを照射することにより穿孔部が形成された。このため、比較例１の第１部材には、すり鉢状（円錐状）の穿孔部が形成された。つまり、表１に示すように、比較例１の第１部材には、内周面から内側に突出する突出部が形成されておらず、実施例１の開口径Ｒ４およびＲ５に対応する形状が形成されていない。また、比較例１では、レーザによる接合条件を以下のようにした。
　＜レーザ接合条件＞
　レーザ：半導体レーザ（波長８０８ｎｍ）
　発振モード：連続発振
　出力：１００Ｗ
　焦点径：４ｍｍ
　走査速度：１ｍｍ／ｓｅｃ
　密着圧力：０．６ＭＰａ
　そして、実施例１の接合構造体５００および比較例１の接合構造体について、接合強度および第２部材の外観を評価した。
　なお、接合強度の評価は、インストロン製の電気機械式万能試験機５９００を用いて行った。具体的には、せん断方向および剥離方向（垂直方向）ともに引張速度５ｍｍ／ｍｉｎで試験を行い、第２部材の破断または接合界面の破断で試験を終了した。そして、第２部材が破断した場合に、接合強度が合格（○）であると評価し、接合界面が破断（剥離）した場合に、接合強度が不合格（×）であると評価した。
　また、接合後の第２部材の外観の評価は、目視によって行った。具体的には、第２部材に焼け、変色、変形がない場合に合格（○）であると評価し、第２部材に焼け、変色、変形がある場合に不合格（×）であると評価した。
　上記した表１に示すように、実施例１の接合構造体５００では、せん断方向および剥離方向ともに接合強度が合格であり、第２部材５０２の外観も合格であった。これは、第２部材５０２を第１部材５０１に接合する際に、照射されたレーザが突出部により穿孔部の内部に閉じ込められやすいので、レーザのエネルギを効率的に熱に変換することができることから、レーザのエネルギを必要最小限に抑えることができるためである。つまり、実施例１の接合構造体５００では、第２部材５０２の熱劣化を抑制することができた。
　これに対して、比較例１の接合構造体では、せん断方向および剥離方向ともに接合強度が合格であったが、第２部材に焼けが発生しており外観が不合格であった。これは、第２部材を第１部材に接合する際に、レーザのエネルギを効率的に熱に変換するのが困難であることから、レーザのエネルギ（接合用レーザの出力）が実施例１に比べて高く設定されたためである。
　［実験例２］
　この実験例２では、第２実施形態に対応する実施例２による接合構造体と、比較例２による接合構造体とを作製し、それぞれについての接合強度および第２部材の外観を評価した。その結果を表２に示す。
Figure JPOXMLDOC01-appb-T000002
  
　この実験例２では、第１部材の材料を実験例１から変更した。具体的には、実験例２の接合構造体では、第１部材の材料としてＰＢＴ（ウィンテックポリマー製のジュラネックス（登録商標）３３１６）を用いた。また、第１部材の材料の変更に伴い、実施例２のレーザ加工条件を以下のように変更した。
　＜レーザ加工条件＞
　レーザ：ファイバレーザ（波長１０６２ｎｍ）
　発振モード：パルス発振（周波数１０ｋＨｚ）
　出力：１．１Ｗ
　走査速度：６５０ｍｍ／ｓｅｃ
　走査回数：３回
　照射間隔：６５μｍ
　サブパルス数：３
　また、実施例２の接合条件を以下のように変更した。
　＜レーザ接合条件＞
　レーザ：半導体レーザ（波長８０８ｎｍ）
　発振モード：連続発振
　出力：１．０Ｗ
　焦点径：４ｍｍ
　走査速度：１ｍｍ／ｓｅｃ
　密着圧力：０．６ＭＰａ
　また、比較例２の接合条件を以下のように変更した。
　＜レーザ接合条件＞
　レーザ：半導体レーザ（波長８０８ｎｍ）
　発振モード：連続発振
　出力：２．５Ｗ
　焦点径：４ｍｍ
　走査速度：１ｍｍ／ｓｅｃ
　密着圧力：０．６ＭＰａ
　このようにして、穿孔部に突出部が形成された実施例２の接合構造体と、穿孔部に突出部が形成されていない比較例２の接合構造体とが作製された。なお、接合強度および外観の評価方法は実験例１と同様である。
　上記した表２に示すように、実施例２の接合構造体では、せん断方向および剥離方向ともに接合強度が合格であり、第２部材の外観も合格であった。すなわち、第１部材の材料として樹脂であるＰＢＴを用いた場合であっても、突出部を有する穿孔部を形成することにより、レーザのエネルギを効率的に熱に変換することができるので、レーザのエネルギを必要最小限に抑えることができることから、第２部材が熱劣化するのを抑制することができた。
　これに対して、比較例２の接合構造体では、せん断方向および剥離方向ともに接合強度が合格であったが、第２部材に焼けが発生しており外観が不合格であった。これは、第２部材を第１部材に接合する際に、レーザのエネルギを効率的に熱に変換するのが困難であることから、レーザのエネルギが実施例２に比べて高く設定されたためである。
　（他の実施形態）
　なお、今回開示した実施形態は、すべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施形態のみによって解釈されるものではなく、特許請求の範囲の記載に基づいて画定される。また、本発明の技術的範囲には、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。
　たとえば、第１実施形態において、表面１３が、平坦であってもよいし、湾曲されていてもよい。なお、第２実施形態についても同様である。
　また、第１実施形態では、拡径部１１１と縮径部１１２とが連なるように形成される例を示したが、これに限らず、拡径部と縮径部との間に深さ方向に真っ直ぐ延びる部分が形成されていてもよい。なお、第２実施形態についても同様である。
　また、第１実施形態では、穿孔部１１の周囲が平坦である例を示したが、これに限らず、図１０に示す第１変形例による第１部材１０ａのように、穿孔部１１の開口の周囲に表面１３から上方に***する***部１４が形成されていてもよい。***部１４は、穿孔部１１の周囲を取り囲むように形成されており、平面的に見てほぼ円形に形成されている。この***部１４は、たとえば、１パルスが複数のサブパルスで構成されるレーザが照射される際に、溶融された第１部材１０ａが堆積されることによって形成される。なお、第２実施形態についても同様である。
　また、第１実施形態では、穿孔部１１の軸心が表面１３に対して垂直である例を示したが、これに限らず、図１１に示す第２変形例による第１部材１０ｂのように、穿孔部１１ｂの軸心が表面１３に対して傾斜するように形成されていてもよい。穿孔部１１ｂの内周面には内側に突出する突出部１２ｂが形成されている。この穿孔部１１ｂは、たとえば、レーザの照射方向を表面１３に対して斜め（４５°以上９０°未満）にすることにより形成される。これにより、穿孔部１１ｂを形成する領域の上方に、レーザを照射する際の障害物が存在する場合であっても、穿孔部１１ｂを形成することができる。なお、第２実施形態についても同様である。
　また、第１実施形態では、穿孔部１１に１つの突出部１２が形成される例を示したが、これに限らず、図１２に示す第３変形例による第１部材１０ｃのように、穿孔部１１ｃに複数の突出部１２１ｃおよび１２２ｃが形成されていてもよい。この穿孔部１１ｃは、たとえば、レーザの出力条件を変更して、レーザを同じ箇所に照射することにより形成することが可能である。このように構成すれば、穿孔部１１ｃの表面積が大きくなるため、より効率的に接合用のレーザのエネルギを熱に変換することができる。なお、図１２では突出部は１２１ｃおよび１２２ｃの２箇所であるが、３箇所以上形成されていてもよい。なお、第２実施形態についても同様である。
　また、図１３に示す第１実施形態の第４変形例による第１部材１０ｄのように、位置をずらした複数回のレーザ照射により１つの穿孔部１１ｄを形成するようにしてもよい。すなわち、レーザ照射によって形成される穿孔部の一部が重畳されることにより、１つの穿孔部１１ｄが形成されるようにしてもよい。穿孔部１１ｄの内周面には内側に突出する突出部１２ｄが形成されている。なお、第２実施形態についても同様である。また、上記した第１～第４変形例を適宜組み合わせるようにしてもよい。
　本発明は、異なる材料からなる第１部材および第２部材が接合された接合構造体の製造方法および接合構造体に利用可能である。
　１０、１０ａ、１０ｂ、１０ｃ、１０ｄ　　　第１部材
　１１、１１ｂ、１１ｃ、１１ｄ　　　　　　　穿孔部
　１２、１２ｂ、１２１ｃ、１２２ｃ、１２ｄ　突出部
　１３　　　表面
　２０　　　第２部材
　３０　　　第１部材
　３１　　　穿孔部
　３２　　　突出部
　３３　　　表面
　１００　　接合構造体
　１１１　　拡径部（第１拡径部）
　１１２　　縮径部（第１縮径部）
　１１３　　底部
　２００　　接合構造体
　３１１　　縮径部（第２縮径部）
　３１２　　拡径部（第２拡径部）
　３１３　　縮径部（第３縮径部）
　３１４　　底部

Claims (6)

  1. 　第１部材と第２部材とが接合された接合構造体の製造方法であって、
    　前記第１部材の表面に開口を有する穿孔部を形成するとともに、前記穿孔部の内周面に内側に突出する突出部を形成する工程と、
    　前記第１部材の穿孔部が形成された領域と前記第２部材とを隣接配置する工程と、
    　前記第２部材側から前記第１部材の穿孔部が形成された領域にレーザを照射することにより、前記第１部材の穿孔部に前記第２部材を充填して固化させる工程とを備えることを特徴とする接合構造体の製造方法。
  2. 　請求項１に記載の接合構造体の製造方法において、
    　前記穿孔部は、深さ方向において表面側から底部に向けて開口径が大きくなる第１拡径部と、深さ方向において表面側から底部に向けて開口径が小さくなる第１縮径部とが連なるように形成されており、前記突出部が表面側に配置されることを特徴とする接合構造体の製造方法。
  3. 　請求項１に記載の接合構造体の製造方法において、
    　前記穿孔部は、深さ方向において表面側から底部に向けて開口径が小さくなる第２縮径部と、深さ方向において表面側から底部に向けて開口径が大きくなる第２拡径部と、深さ方向において表面側から底部に向けて開口径が小さくなる第３縮径部とが連なるように形成されており、前記突出部が底部側に入り込んだ位置に配置されることを特徴とする接合構造体の製造方法。
  4. 　請求項１～３のいずれか１つに記載の接合構造体の製造方法において、
    　前記第１部材は、金属、熱可塑性樹脂、または、熱硬化性樹脂であることを特徴とする接合構造体の製造方法。
  5. 　請求項１～４のいずれか１つに記載の接合構造体の製造方法において、
    　前記第２部材は、レーザを透過する樹脂であることを特徴とする接合構造体の製造方法。
  6. 　請求項１～５のいずれか１つに記載の接合構造体の製造方法によって製造されたことを特徴とする接合構造体。
     
     
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