WO2016017283A1 - Temperature detection device and electronic device - Google Patents

Temperature detection device and electronic device Download PDF

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Publication number
WO2016017283A1
WO2016017283A1 PCT/JP2015/066504 JP2015066504W WO2016017283A1 WO 2016017283 A1 WO2016017283 A1 WO 2016017283A1 JP 2015066504 W JP2015066504 W JP 2015066504W WO 2016017283 A1 WO2016017283 A1 WO 2016017283A1
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WO
WIPO (PCT)
Prior art keywords
temperature detection
housing
elastic member
wiring
substrate
Prior art date
Application number
PCT/JP2015/066504
Other languages
French (fr)
Japanese (ja)
Inventor
三浦　忠将
和人 宮川
朗人 内藤
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2016017283A1 publication Critical patent/WO2016017283A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor

Definitions

  • the present invention relates to a temperature detection device and an electronic device.
  • the temperature detection device includes a substrate including wiring, and a thermistor element attached to the substrate and electrically connected to the wiring.
  • the substrate is formed in a band shape and has a first end and a second end in the longitudinal direction.
  • the thermistor element is fixed to the first end of the substrate.
  • the temperature detection device is used to detect the temperature of the casing of the electronic device.
  • substrate is arrange
  • the second end of the board is electrically connected to the circuit board.
  • the second end of the substrate is fixed to the circuit board of the electronic device without fixing the first end of the substrate to the housing.
  • the thermistor element is separated from the casing or the thermistor element is positioned at a predetermined position of the casing due to shaking of the casing. Not retained. Therefore, since the position of the thermistor element with respect to the housing becomes unstable, the temperature of the housing cannot be accurately detected.
  • an object of the present invention is to provide a temperature detection device and an electronic apparatus that can stabilize the position of the thermistor element with respect to the casing.
  • the temperature detection device of the present invention is A temperature detection device for detecting the temperature of the housing, A temperature detection unit including a substrate including wiring, and a thermistor element attached to the substrate and electrically connected to the wiring; And an elastic member that elastically presses the temperature detection unit, elastically contacts the temperature detection unit with the case, and detects the temperature of the case by the thermistor element.
  • the elastic member elastically presses the temperature detection unit and elastically contacts the temperature detection unit with the casing, so that the elastic member positions the thermistor element relative to the casing. It can be stabilized. For this reason, the thermistor element is not separated from the casing, and the thermistor element is held at a predetermined position of the casing. Therefore, the temperature of the housing can be detected with high accuracy.
  • the elastic member is composed of a heat insulating cushion material, The elastic member elastically presses a region overlapping the thermistor element of the temperature detection unit when viewed from a direction orthogonal to the substrate.
  • the elastic member is made of a heat insulating cushion material and elastically presses a region overlapping the thermistor element of the temperature detection unit.
  • a thermistor element is arrange
  • the elastic member is composed of a conductive leaf spring, The elastic member contacts the wiring of the substrate so as to be separable and is electrically connected to the wiring of the substrate.
  • the temperature detection unit since the elastic member contacts the wiring of the substrate in a separable manner, when the temperature detection device is mounted on an electronic device, the temperature detection unit is fixed to the housing, and the elastic member is It can be fixed to a circuit board of an electronic device.
  • the elastic member when disassembling the electronic device for parts replacement or repair, when the elastic member is removed from the housing together with the circuit board, the elastic member is in contact with the temperature detection unit so that the elastic member can be separated from the temperature detection unit. Can be easily separated. Thereafter, when the electronic device is reassembled, the elastic member can be easily brought into contact with the temperature detection unit by attaching the elastic member together with the circuit board to the housing. At this time, since the temperature detection unit is fixed to the casing, the position of the thermistor element can be held with respect to the casing, and the position adjustment of the thermistor element becomes unnecessary. Therefore, the assemblability when the temperature detection device is used in an electronic device is improved.
  • the contact of the elastic member to the wiring of the substrate is a line contact or a point contact.
  • the contact of the elastic member with the wiring of the substrate is a line contact or a point contact
  • the contact area of the elastic member with respect to the wiring is reduced, and heat conduction from the elastic member to the substrate is performed. Can be suppressed. Therefore, the temperature of the housing can be detected with higher accuracy.
  • the elastic member is A first connection portion electrically connected to the wiring of the substrate; A second connection portion electrically connected to the wiring of the circuit board; A folding portion that is folded between the first connection portion and the second connection portion;
  • the temperature detection device of the embodiment since the elastic member has the folded portion that is folded between the first connection portion and the second connection portion, the heat path from the second connection portion to the first connection portion is determined. Can be long. Thereby, the heat transmitted from the second connection portion to the first connection portion can be radiated from the folded portion. Therefore, the temperature of the housing can be detected with higher accuracy.
  • the electronic device of one embodiment is A housing, A circuit board disposed in the housing;
  • the temperature detection device is disposed in the casing and detects the temperature of the casing.
  • the position of the thermistor element with respect to the housing can be stabilized. Therefore, the temperature of the housing can be detected with high accuracy.
  • the electronic device of one embodiment is A housing, A circuit board disposed in the housing; The temperature detection device disposed in the housing and detecting the temperature of the housing; The temperature detection unit of the temperature detection device is fixed to the housing, The elastic member of the temperature detection device is fixed to the circuit board.
  • the temperature detection unit of the temperature detection device is fixed to the casing, and the elastic member of the temperature detection device is fixed to the circuit board.
  • the elastic member of the temperature detection device is fixed to the circuit board.
  • the elastic member elastically presses the temperature detection unit and elastically contacts the temperature detection unit with the casing, so that the position of the thermistor element with respect to the casing is stabilized. Can be made.
  • FIG. 1 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a first embodiment of the present invention. It is a perspective view of a temperature detection part. It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 2nd embodiment of the present invention. It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 3rd embodiment of the present invention. It is a perspective view of a temperature detection part. It is a perspective view of an elastic member. It is a perspective view of another elastic member. It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 4th embodiment of the present invention.
  • FIG. 1 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a first embodiment of the present invention.
  • the electronic device 1 includes a housing 2, a circuit board 3 and a temperature detection device 4 disposed in the housing 2.
  • the electronic device 1 is a mobile device such as a smartphone, a tablet, or a notebook PC.
  • the housing 2 is a case formed in a rectangular parallelepiped shape, for example.
  • the case includes a case main body having an opening and a lid that covers the opening of the case main body.
  • a liquid crystal display is attached to the housing 2.
  • the circuit board 3 is mounted with an electronic component (hereinafter referred to as a heat generating component 7) having a large amount of heat, such as a CPU and a power amplifier.
  • a heat generating component 7 having a large amount of heat, such as a CPU and a power amplifier.
  • the housing 2 is heated by the heat from the heat generating component 7.
  • the temperature detection device 4 detects the temperature of the housing 2, and the control device of the electronic device 1 prevents, for example, the user from touching the high-temperature housing 2 based on the detection result of the temperature detection device 4. .
  • the temperature detection device 4 includes a temperature detection unit 5 and an elastic member 6.
  • the temperature detection unit 5 includes a substrate 10 and a thermistor element 20 attached to the substrate 10.
  • the elastic member 6 elastically presses the temperature detection unit 5, makes the temperature detection unit 5 elastically contact the case 2, and causes the thermistor element 20 to detect the temperature of the case 2.
  • FIG. 2 is a perspective view of the temperature detection unit 5.
  • the substrate 10 is a flexible printed circuit board.
  • the substrate 10 includes a base material 15, a first wiring 11 and a second wiring 12 disposed on the base material 15, and a cover portion 16 that covers a part of the first wiring 11 and the second wiring 12.
  • the base material 15 is formed in a strip shape.
  • the base material 15 has flexibility and electrical insulation.
  • the material of the base material 15 is, for example, polyimide or polyethylene terephthalate.
  • the first wiring 11 and the second wiring 12 each extend along the longitudinal direction of the base material 15.
  • the first wiring 11 and the second wiring 12 are arranged in parallel along the width direction of the base material 15.
  • the first wiring 11 and the second wiring 12 are formed of a conductive material.
  • the conductive material is, for example, a metal such as copper or an alloy of copper and nickel.
  • the first wiring 11 has a first terminal 11a and a second terminal 11b at both ends in the longitudinal direction.
  • the second wiring 12 has a first terminal 12a and a second terminal 12b at both ends in the longitudinal direction.
  • the first terminal 11 a of the first wiring 11 and the first terminal 12 a of the second wiring 12 are located on one end side in the longitudinal direction of the base material 15.
  • the second terminal 11 b of the first wiring 11 and the second terminal 12 b of the second wiring 12 are located on the other end side in the longitudinal direction of the base material 15.
  • the cover portion 16 covers a portion of the first wiring 11 excluding the first and second terminals 11a and 11b and a portion of the second wiring 12 excluding the first and second terminals 12a and 12b. That is, the first and second terminals 11 a and 11 b of the first wiring 11 and the first and second terminals 12 a and 12 b of the second wiring 12 are exposed from the cover portion 16.
  • the cover part 16 is formed of a resin film having electrical insulation.
  • the thermistor element 20 is, for example, a multilayer chip thermistor, and has a thermistor body 23, a first external electrode 21, and a second external electrode 22.
  • the thermistor body 23 includes a plurality of ceramic layers. A plurality of ceramic layers are laminated. An internal electrode is provided between adjacent ceramic layers.
  • the thermistor body 23 has a temperature characteristic in which the resistance value changes greatly with changes in ambient temperature.
  • the thermistor body 23 is, for example, an NTC thermistor whose resistance value decreases with increasing temperature.
  • An NTC thermistor is an oxide sintered body (ceramic sintered body) obtained by mixing and sintering two to four kinds of oxides selected from the group of transition elements such as manganese, nickel, iron, cobalt and copper. Can be made from The thermistor body 23 does not have to have an internal electrode.
  • the thermistor body 23 is formed in a substantially rectangular parallelepiped shape.
  • the thermistor body 23 has first and second end surfaces facing each other, and four side surfaces disposed between the first end surface and the second end surface.
  • the first and second external electrodes 21 and 22 are, for example, a base layer mainly composed of silver, a nickel plating layer formed on the base layer, and a tin plating layer formed on the nickel plating layer. Including.
  • the first external electrode 21 covers the first end face of the thermistor body 23. Specifically, the first external electrode 21 covers the first end face side of the four side surfaces of the thermistor body 23 in addition to the entire region of the first end face of the thermistor body 23.
  • the second external electrode 22 covers the second end face of the thermistor body 23. Specifically, the second external electrode 22 covers the second end face side of the four side surfaces of the thermistor body 23 in addition to the entire area of the second end face of the thermistor body 23.
  • the thermistor element 20 is electrically connected to the first and second wirings 11 and 12 of the substrate 10. More specifically, the first external electrode 21 of the thermistor element 20 is joined to the second terminal 11b of the first wiring 11 via solder. The second external electrode 22 of the thermistor element 20 is joined to the second terminal 12b of the second wiring 12 via solder.
  • the substrate 10 of the temperature detector 5 is electrically connected to the circuit substrate 3. More specifically, the first terminal 11a of the first wiring 11 is joined to the wiring of the circuit board 3 via solder. The 1st terminal 12a of the 2nd wiring 12 is joined to the wiring of circuit board 3 via solder.
  • the temperature detector 5 contacts the housing 2. Specifically, the surface of the substrate 15 opposite to the thermistor element 20 is in contact with the housing 2. The thermistor element 20 detects the heat of the housing 2 through the substrate 10.
  • the elastic member 6 is composed of a heat insulating cushion material.
  • the heat insulating cushion material is made of, for example, a foamable resin material such as foamed polyurethane, or a rubber material.
  • the elastic member 6 is formed in a substantially rectangular parallelepiped shape.
  • the elastic member 6 elastically presses the region overlapping the thermistor element 20 of the temperature detection unit 5 when viewed from the direction orthogonal to the substrate 10. More specifically, the elastic member 6 is disposed on the heat generating component 7 and directly presses the thermistor element 20. At this time, the elastic member 6 is elastically deformed and presses the thermistor element 20.
  • the operation of the temperature detection device 4 will be described.
  • the housing 2 is heated by the heat from the heat generating component 7. Since the substrate 10 is in contact with the housing 2, the thermistor element 20 detects the temperature of the housing 2 through the substrate 10. Based on the detection result (current change) of the thermistor element 20, the control device moves the fan and cools the housing 2 and the heat generating component 7. Since the elastic member 6 is located between the thermistor element 20 and the heat generating component 7, the heat from the heat generating component 7 is not easily transmitted directly to the thermistor element 20. For this reason, the thermistor element 20 can accurately detect the heat of the housing 2.
  • the end of the substrate 10 opposite to the thermistor element 20 is fixed to the circuit board 3.
  • the elastic member 6 is disposed between the end of the substrate 10 on the thermistor element 20 side and the heat generating component 7 on the circuit board 3.
  • the elastic member 6 is bonded to the heat generating component 7, and the thermistor element 20 is bonded to the elastic member 6.
  • the temperature detection device 4 is attached to the circuit board 3.
  • the temperature detection device 4 is attached to the housing 2 together with the circuit board 3 to assemble the electronic device 1.
  • the elastic member 6, the heat generating component 7, and the thermistor element 20 may not be bonded to each other.
  • the elastic member 6 elastically presses the temperature detection unit 5 and elastically contacts the temperature detection unit 5 with the housing 2.
  • the position of the thermistor element 20 can be stabilized. For this reason, even if vibration such as shaking occurs in the housing 2, the thermistor element 20 is not separated from the housing 2, and the thermistor element 20 is held at a predetermined position of the housing 2. Therefore, the temperature of the housing 2 can be detected with high accuracy.
  • the elastic member 6 is made of a heat insulating cushion material and elastically presses a region overlapping the thermistor element 20 of the temperature detection unit 5. Thereby, the thermistor element 20 is disposed between the housing 2 and the elastic member 6. Therefore, the elastic member 6 can press the thermistor element 20 directly against the housing 2, and can further stabilize the position of the thermistor element 20 with respect to the housing 2.
  • the position of the thermistor element 20 with respect to the housing 2 can be stabilized. Therefore, the temperature of the housing 2 can be detected with high accuracy.
  • FIG. 3 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a second embodiment of the present invention.
  • the second embodiment is different from the first embodiment only in the configuration of the substrate. Only this different configuration will be described below. Note that in the second embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the substrate 10 ⁇ / b> A of the temperature detection unit 5 ⁇ / b> A is electrically connected to the first connection unit 10 a electrically connected to the thermistor element 20 and the wiring of the circuit board 3.
  • the constituent members of the substrate 10A are the same as the constituent members of the substrate 10 of the first embodiment shown in FIG.
  • the first connection portion 10a of the substrate 10A includes a second terminal 11b of the first wiring 11 and a second terminal 12b of the second wiring 12 shown in FIG.
  • the second connection portion 10b of the substrate 10A includes a first terminal 11a of the first wiring 11 and a first terminal 12a of the second wiring 12 shown in FIG.
  • the folded portion 10c is a portion between the first connection portion 10a and the second connection portion 10b, and is formed in a substantially U shape.
  • the folded portion 10 c extends in the substantially planar direction of the circuit board 3.
  • the length of the folded portion 10 c in the longitudinal direction is longer than the distance between the housing 2 and the circuit board 3.
  • returning part 10c may be formed in the shape of a bow, V shape, etc.
  • the substrate 10A has the folded portion 10c between the first connection portion 10a and the second connection portion 10b, so that the heat path from the second connection portion 10b to the first connection portion 10a. Can be lengthened.
  • the heat transmitted from the 2nd connection part 10b to the 1st connection part 10a can be thermally radiated from the folding
  • the cross-sectional areas of the first and second wirings 11 and 12 of the substrate 10A may be reduced while increasing the length of the substrate 10A or instead of increasing the length of the substrate 10A.
  • the widths of the first and second wirings 11 and 12 are reduced, and the thicknesses of the first and second wirings 11 and 12 are reduced.
  • FIG. 4 is a simplified cross-sectional view showing a temperature detection device and an electronic apparatus according to a third embodiment of the present invention.
  • the third embodiment is different from the first embodiment only in the configuration of the temperature detection device. Only this different configuration will be described below. Note that, in the third embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the temperature detection device 4B of the electronic apparatus 1B includes a temperature detection unit 5B and two elastic members 6B.
  • the temperature detection unit 5B includes a substrate 10B and a thermistor element 20 attached to the substrate 10B.
  • the elastic member 6 ⁇ / b> B elastically presses the temperature detection unit 5 ⁇ / b> B, makes the temperature detection unit 5 ⁇ / b> B elastically contact the case 2, and causes the thermistor element 20 to detect the temperature of the case 2.
  • FIG. 5 is a perspective view of the temperature detector 5B.
  • the substrate 10B is a flexible printed circuit board.
  • the substrate 10 ⁇ / b> B includes a base material 15, first wirings 11 and second wirings 12 disposed on the base material 15, and two cover portions 16 that cover parts of the first wirings 11 and the second wirings 12. .
  • the base material 15 is formed in a strip shape.
  • the base material 15 has flexibility and electrical insulation.
  • the material of the base material 15 is, for example, polyimide or polyethylene terephthalate.
  • the first wiring 11 and the second wiring 12 each extend along the longitudinal direction of the base material 15.
  • the first wiring 11 and the second wiring 12 are arranged in series along the longitudinal direction of the base material 15.
  • the first wiring 11 and the second wiring 12 are formed of a conductive material.
  • the conductive material is, for example, a metal such as copper or an alloy of copper and nickel.
  • the first wiring 11 has a first terminal 11a and a second terminal 11b at both ends in the longitudinal direction.
  • the second wiring 12 has a first terminal 12a and a second terminal 12b at both ends in the longitudinal direction.
  • the first terminal 11 a of the first wiring 11 is located on one end side in the longitudinal direction of the base material 15.
  • the first terminal 12 a of the second wiring 12 is located on the other end side in the longitudinal direction of the base material 15.
  • the 2nd terminal 11b of the 1st wiring 11 and the 2nd terminal 12b of the 2nd wiring 12 are arrange
  • One cover portion 16 covers a portion of the first wiring 11 excluding the first and second terminals 11a and 11b.
  • the other cover portion 16 covers a portion of the second wiring 12 excluding the first and second terminals 12a and 12b. That is, the first and second terminals 11 a and 11 b of the first wiring 11 and the first and second terminals 12 a and 12 b of the second wiring 12 are exposed from the cover portion 16.
  • the cover part 16 is formed of a resin film having electrical insulation.
  • the thermistor element 20 has a thermistor body 23, a first external electrode 21, and a second external electrode 22. Since the thermistor element 20 has the same configuration as the thermistor element 20 of the first embodiment, a detailed description thereof is omitted.
  • the thermistor element 20 is electrically connected to the first and second wirings 11 and 12 of the substrate 10B. More specifically, the first external electrode 21 of the thermistor element 20 is joined to the second terminal 11b of the first wiring 11 via solder. The second external electrode 22 of the thermistor element 20 is joined to the second terminal 12b of the second wiring 12 via solder. The thermistor element 20 is attached to the central portion in the longitudinal direction of the substrate 10B.
  • FIG. 6 is a perspective view of the elastic member 6B.
  • the elastic member 6 ⁇ / b> B is composed of a conductive leaf spring.
  • the material of the elastic member 6B is, for example, a metal such as copper or an alloy of copper and nickel.
  • the elastic member 6B is formed by bending a band-shaped metal plate.
  • the elastic member 6B includes a first connection portion 6a that is electrically connected to the wiring of the substrate 10B, a second connection portion 6b that is electrically connected to the wiring of the circuit board 3, a first connection portion 6a, and a second connection portion. And a folded portion 6c that is folded between the connecting portion 6b.
  • the first connection portion 6a is formed in a curved shape.
  • the 2nd connection part 6b is formed in flat form.
  • the folded portion 6c is a portion between the first connection portion 6a and the second connection portion 6b, and is formed in a substantially U shape.
  • the folded portion 6 c extends in a substantially planar direction of the circuit board 3.
  • the length of the folded portion 6 c in the longitudinal direction is longer than the distance between the housing 2 and the circuit board 3.
  • returning part 6c may be formed in the shape of a bow, V shape, etc.
  • the temperature detection unit 5B is fixed to the housing 2. Specifically, the surface of the substrate 15 opposite to the thermistor element 20 is fixed to the housing 2 via the adhesive member 8.
  • the adhesive member 8 is, for example, a double-sided tape and has thermal conductivity.
  • the adhesive member 8 is disposed so as to overlap the thermistor element 20 when viewed from the direction orthogonal to the base material 15.
  • the thermistor element 20 detects the heat of the housing 2 via the adhesive member 8 and the substrate 10B.
  • the thermistor element 20 is located immediately above the heat generating component 7 with a gap between the thermistor element 20 and the heat generating component 7. Since the thermistor element 20 has a gap with the heat generating component 7, the thermistor element 20 is thermally insulated from the heat generating component 7.
  • the elastic member 6B is fixed to the circuit board 3. Specifically, the second connection portion 6b of the elastic member 6B is joined to the wiring of the circuit board 3 via solder.
  • the two elastic members 6B are disposed so as to sandwich the heat generating component 7 therebetween.
  • the two elastic members 6B are arranged symmetrically with respect to the heat generating component 7.
  • the two elastic members 6B are in contact with the wirings 11 and 12 of the substrate 10B so as to be separated from each other, and are electrically connected to the wirings 11 and 12 of the substrate 10B.
  • the two elastic members 6B support both ends of the substrate 10B in the longitudinal direction.
  • the first connecting portion 6a of one elastic member 6B is in contact with the first terminal 11a of the first wiring 11 of the substrate 10B so as to be separated.
  • the first connection portion 6a of the other elastic member 6B is in contact with the first terminal 12a of the second wiring 12 of the substrate 10B so as to be separable.
  • the thermistor element 20 is electrically connected to the wiring of the circuit board 3 via the wirings 11 and 12 of the substrate 10B and the elastic member 6B.
  • the contact of the elastic member 6B to the wirings 11 and 12 of the substrate 10B is a line contact. That is, since the upper surface of the first connection portion 6a of the elastic member 6B is a curved surface, the contact surfaces of the upper surface of the first connection portion 6a with respect to the wirings 11 and 12 are linear.
  • the line contact means a general line contact and refers to a contact state when a bending surface formed by bending a belt-shaped member in the longitudinal direction contacts a flat surface. Therefore, the contact area of the elastic member 6B with respect to the wirings 11 and 12 can be reduced, and heat conduction from the elastic member 6B to the substrate 10B can be suppressed.
  • the contact of the elastic member 6B with respect to the wirings 11 and 12 of the substrate 10B may be point contact.
  • the convex part 6d is provided in the 1st connection part 6a of the elastic member 6B.
  • the convex portion 6d is formed by pressing from the back surface of the first connecting portion 6a with a punch or the like.
  • the convex portion 6d is not limited to a dot shape, and may be formed in an elongated shape extending from the first connection portion 6a to the second connection portion 6b.
  • the point contact means a general point contact, and refers to a contact state when a bent surface formed by bending a belt-shaped member at least in the longitudinal direction and the width direction contacts a flat surface.
  • the elastic member 6B contacts the wirings 11 and 12 of the substrate 10B so as to be separable. Therefore, when the temperature detection device 4B is mounted on the electronic device 1B, the temperature detection unit 5B is mounted on the housing 2.
  • the elastic member 6B can be fixed to the circuit board 3 of the electronic device 1B.
  • the elastic member 6B When the electronic device 1B is disassembled for parts replacement or repair, when the elastic member 6B is removed from the housing 2 together with the circuit board 3, the elastic member 6B is in contact with the temperature detection unit 5B so as to be separable. The member 6B can be easily separated from the temperature detection unit 5B. Thereafter, when the electronic device 1B is reassembled, the elastic member 6B can be easily brought into contact with the temperature detection unit 5B by attaching the elastic member 6B together with the circuit board 3 to the housing 2. At this time, since the temperature detection unit 5B is fixed to the casing 2, the position of the thermistor element 20 with respect to the casing 2 can be held, and the position adjustment of the thermistor element 20 becomes unnecessary. Therefore, the assemblability when the temperature detection device 4B is used in the electronic apparatus 1B is improved.
  • the elastic member 6B since the elastic member 6B has the folded portion 6c that is folded between the first connecting portion 6a and the second connecting portion 6b, the heat path from the second connecting portion 6b to the first connecting portion 6a is lengthened. Can do. Thereby, the heat transmitted from the 2nd connection part 6b to the 1st connection part 6a can be thermally radiated from the folding
  • FIG. 8 is a simplified cross-sectional view showing a temperature detection device and an electronic apparatus according to a fourth embodiment of the present invention.
  • the fourth embodiment is different from the third embodiment only in the configuration of the substrate and the arrangement of the elastic members. Only this different configuration will be described below. Note that in the fourth embodiment, identical parts to those of the third embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the substrate 10 of the temperature detection unit 5C is the same as the substrate 10 of the first embodiment shown in FIG. That is, as shown in FIGS. 2 and 8, the thermistor element 20 is located on one end side in the longitudinal direction of the base material 15. The first terminal 11 a of the first wiring 11 and the first terminal 12 a of the second wiring 12 are located on the other end side in the longitudinal direction of the base material 15. The surface of the substrate 15 opposite to the thermistor element 20 is fixed to the housing 2 via the adhesive member 8. The thermistor element 20 detects the heat of the housing 2 via the adhesive member 8 and the substrate 10. The thermistor element 20 is located immediately above the heat generating component 7.
  • the elastic member 6B is the same as the elastic member 6B of the third embodiment shown in FIG.
  • the two elastic members 6B support one end of the substrate 10 in the longitudinal direction.
  • the two elastic members 6B are arranged side by side in the width direction of the substrate 10 (direction perpendicular to the paper surface of FIG. 8).
  • the two elastic members 6B are in contact with the wirings 11 and 12 of the substrate 10 so as to be separated from each other, and are electrically connected to the wirings 11 and 12 of the substrate 10. Specifically, the first connection portion 6a of one elastic member 6B is in contact with the first terminal 11a of the first wiring 11 of the substrate 10 so as to be separated. The first connecting portion 6a of the other elastic member 6B is in contact with the first terminal 12a of the second wiring 12 of the substrate 10 so as to be separable.
  • the temperature detecting device 4C and the electronic device 1C have the same operational effects as those of the third embodiment.
  • the two elastic members 6B are arranged side by side in the width direction of the substrate 10, but may be arranged side by side in the longitudinal direction of the substrate 10.
  • the present invention is not limited to the above-described embodiment, and the design can be changed without departing from the gist of the present invention.
  • the feature points of the first to fourth embodiments may be variously combined.
  • an NTC thermistor is used as the thermistor element.
  • a PTC thermistor having a characteristic that the electrical resistance rapidly increases at the Curie temperature may be used.
  • the surface of the base material opposite to the thermistor element is brought into contact with the housing, but the thermistor element may be brought into contact with the housing.
  • the folded portion is provided in the leaf spring as the elastic member, but the folded portion may not be provided.
  • the shape of the leaf spring as the elastic member may be any shape as long as it has elasticity.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

According to the present invention, an elastic member presses a temperature detection unit elastically, bringing the temperature detection unit into contact with a housing elastically. Due to this, the elastic member makes it possible to stabilize the position of a thermistor element relative to the housing. Consequently, even when a vibration such as shaking occurs in the housing, the thermistor element does not separate from the housing, and the thermistor element is held at a prescribed position on the housing.

Description

温度検知装置および電子機器Temperature detection device and electronic device
　本発明は、温度検知装置および電子機器に関する。 The present invention relates to a temperature detection device and an electronic device.
　従来、温度検知装置としては、特開平８－６８６９９号公報に記載されたものがある。温度検知装置は、配線を含む基板と、基板に取り付けられて配線に電気的に接続されるサーミスタ素子とを備えている。基板は、帯状に形成され、長手方向に第１端と第２端とを有する。サーミスタ素子は、基板の第１端に固定されている。 Conventionally, as a temperature detection device, there is one described in JP-A-8-68699. The temperature detection device includes a substrate including wiring, and a thermistor element attached to the substrate and electrically connected to the wiring. The substrate is formed in a band shape and has a first end and a second end in the longitudinal direction. The thermistor element is fixed to the first end of the substrate.
　温度検知装置は、電子機器の筐体の温度を検知するために、用いられる。このとき、基板の第１端に固定されたサーミスタ素子は、筐体の所定位置に配置される。基板の第２端は、回路基板に電気的に接続される。 The temperature detection device is used to detect the temperature of the casing of the electronic device. At this time, the thermistor element fixed to the 1st end of a board | substrate is arrange | positioned in the predetermined position of a housing | casing. The second end of the board is electrically connected to the circuit board.
特開平８－６８６９９号公報JP-A-8-68699
　ところで、前記従来の温度検知装置を電子機器に搭載する際、基板の第１端を、筐体に固定しないで、基板の第２端を、電子機器の回路基板に固定する。このように、基板の第１端は、筐体に固定されていないため、筐体の揺れ等に起因して、サーミスタ素子が、筐体から離隔したり、サーミスタ素子が、筐体の所定位置に保持されない。したがって、筐体に対するサーミスタ素子の位置が不安定となるため、筐体の温度を精度よく検知することができない。 By the way, when mounting the conventional temperature detection device on an electronic device, the second end of the substrate is fixed to the circuit board of the electronic device without fixing the first end of the substrate to the housing. As described above, since the first end of the substrate is not fixed to the casing, the thermistor element is separated from the casing or the thermistor element is positioned at a predetermined position of the casing due to shaking of the casing. Not retained. Therefore, since the position of the thermistor element with respect to the housing becomes unstable, the temperature of the housing cannot be accurately detected.
　そこで、本発明の課題は、筐体に対するサーミスタ素子の位置を安定させることができる温度検知装置および電子機器を提供することにある。 Therefore, an object of the present invention is to provide a temperature detection device and an electronic apparatus that can stabilize the position of the thermistor element with respect to the casing.
　前記課題を解決するため、本発明の温度検知装置は、
　筐体の温度を検知する温度検知装置であって、
　配線を含む基板と、前記基板に取り付けられて前記配線に電気的に接続されるサーミスタ素子とを有する温度検知部と、
　前記温度検知部を弾性的に押圧し、前記温度検知部を前記筐体に弾性的に接触させて、前記サーミスタ素子により前記筐体の温度を検知させる弾性部材と
を備えることを特徴としている。 In order to solve the above problems, the temperature detection device of the present invention is
A temperature detection device for detecting the temperature of the housing,
A temperature detection unit including a substrate including wiring, and a thermistor element attached to the substrate and electrically connected to the wiring;
And an elastic member that elastically presses the temperature detection unit, elastically contacts the temperature detection unit with the case, and detects the temperature of the case by the thermistor element.
　本発明の温度検知装置によれば、弾性部材は、温度検知部を弾性的に押圧し、温度検知部を筐体に弾性的に接触させるので、弾性部材は、筐体に対するサーミスタ素子の位置を安定させることができる。このため、サーミスタ素子は、筐体から離隔せず、サーミスタ素子は、筐体の所定位置に保持される。したがって、筐体の温度を精度よく検知することができる。 According to the temperature detection device of the present invention, the elastic member elastically presses the temperature detection unit and elastically contacts the temperature detection unit with the casing, so that the elastic member positions the thermistor element relative to the casing. It can be stabilized. For this reason, the thermistor element is not separated from the casing, and the thermistor element is held at a predetermined position of the casing. Therefore, the temperature of the housing can be detected with high accuracy.
　また、一実施形態の温度検知装置では、
　前記弾性部材は、断熱性クッション材から構成され、
　前記弾性部材は、前記基板に直交する方向からみて、前記温度検知部の前記サーミスタ素子に重なる領域を、弾性的に押圧する。 Moreover, in the temperature detection device of one embodiment,
The elastic member is composed of a heat insulating cushion material,
The elastic member elastically presses a region overlapping the thermistor element of the temperature detection unit when viewed from a direction orthogonal to the substrate.
　前記実施形態の温度検知装置によれば、弾性部材は、断熱性クッション材から構成され、温度検知部のサーミスタ素子に重なる領域を弾性的に押圧する。これにより、サーミスタ素子は、筐体と弾性部材との間に、配置される。したがって、弾性部材は、サーミスタ素子を直接的に筐体に押圧することができ、筐体に対するサーミスタ素子の位置を一層安定させることができる。 According to the temperature detection device of the embodiment, the elastic member is made of a heat insulating cushion material and elastically presses a region overlapping the thermistor element of the temperature detection unit. Thereby, a thermistor element is arrange | positioned between a housing | casing and an elastic member. Therefore, the elastic member can press the thermistor element directly to the casing, and can further stabilize the position of the thermistor element relative to the casing.
　また、一実施形態の温度検知装置では、
　前記弾性部材は、導電性を有する板バネから構成され、
　前記弾性部材は、前記基板の前記配線に離隔可能に接触して、前記基板の前記配線に電気的に接続される。 Moreover, in the temperature detection device of one embodiment,
The elastic member is composed of a conductive leaf spring,
The elastic member contacts the wiring of the substrate so as to be separable and is electrically connected to the wiring of the substrate.
　前記実施形態の温度検知装置によれば、弾性部材は、基板の配線に離隔可能に接触するので、温度検知装置を電子機器に搭載する際、温度検知部を筐体に固定し、弾性部材を電子機器の回路基板に固定することができる。 According to the temperature detection device of the embodiment, since the elastic member contacts the wiring of the substrate in a separable manner, when the temperature detection device is mounted on an electronic device, the temperature detection unit is fixed to the housing, and the elastic member is It can be fixed to a circuit board of an electronic device.
　そして、部品交換や修理などで電子機器を分解する際、弾性部材を回路基板ごと筐体から取り外すと、弾性部材は温度検知部に離隔可能に接触しているため、弾性部材を温度検知部から容易に離すことができる。その後、電子機器を再度組み立てる際、弾性部材を回路基板ごと筐体に取り付けると、弾性部材を温度検知部に容易に接触させることができる。このとき、温度検知部は、筐体に固定されているため、サーミスタ素子の筐体に対する位置を保持でき、サーミスタ素子の位置調整が不要になる。したがって、温度検知装置を電子機器に用いたときの組立性が良好となる。 Then, when disassembling the electronic device for parts replacement or repair, when the elastic member is removed from the housing together with the circuit board, the elastic member is in contact with the temperature detection unit so that the elastic member can be separated from the temperature detection unit. Can be easily separated. Thereafter, when the electronic device is reassembled, the elastic member can be easily brought into contact with the temperature detection unit by attaching the elastic member together with the circuit board to the housing. At this time, since the temperature detection unit is fixed to the casing, the position of the thermistor element can be held with respect to the casing, and the position adjustment of the thermistor element becomes unnecessary. Therefore, the assemblability when the temperature detection device is used in an electronic device is improved.
　また、一実施形態の温度検知装置では、前記弾性部材の前記基板の前記配線に対する接触は、線接触または点接触である。 Further, in the temperature detection device of one embodiment, the contact of the elastic member to the wiring of the substrate is a line contact or a point contact.
　前記実施形態の温度検知装置によれば、弾性部材の基板の配線に対する接触は、線接触または点接触であるので、弾性部材の配線に対する接触面積を小さくして、弾性部材から基板への熱伝導を抑制することができる。したがって、筐体の温度を一層精度よく検知することができる。 According to the temperature detection device of the embodiment, since the contact of the elastic member with the wiring of the substrate is a line contact or a point contact, the contact area of the elastic member with respect to the wiring is reduced, and heat conduction from the elastic member to the substrate is performed. Can be suppressed. Therefore, the temperature of the housing can be detected with higher accuracy.
　また、一実施形態の温度検知装置では、
　前記弾性部材は、
　前記基板の前記配線に電気的に接続される第１接続部と、
　前記回路基板の配線に電気的に接続される第２接続部と、
　前記第１接続部と前記第２接続部との間で折り返される折り返し部と
を備える。 Moreover, in the temperature detection device of one embodiment,
The elastic member is
A first connection portion electrically connected to the wiring of the substrate;
A second connection portion electrically connected to the wiring of the circuit board;
A folding portion that is folded between the first connection portion and the second connection portion;
　前記実施形態の温度検知装置によれば、弾性部材は、第１接続部と第２接続部との間で折り返される折り返し部を有するので、第２接続部から第１接続部への熱経路を長くすることができる。これにより、第２接続部から第１接続部に伝わる熱を折り返し部から放熱することができる。したがって、筐体の温度を一層精度よく検知することができる。 According to the temperature detection device of the embodiment, since the elastic member has the folded portion that is folded between the first connection portion and the second connection portion, the heat path from the second connection portion to the first connection portion is determined. Can be long. Thereby, the heat transmitted from the second connection portion to the first connection portion can be radiated from the folded portion. Therefore, the temperature of the housing can be detected with higher accuracy.
　また、一実施形態の電子機器は、
　筐体と、
　前記筐体内に配置される回路基板と、
　前記筐体内に配置され前記筐体の温度を検知する前記温度検知装置と
を備える。 Moreover, the electronic device of one embodiment is
A housing,
A circuit board disposed in the housing;
The temperature detection device is disposed in the casing and detects the temperature of the casing.
　前記実施形態の電子機器によれば、前記温度検知装置を有するので、サーミスタ素子の筐体に対する位置を安定させることができる。したがって、筐体の温度を精度よく検知することができる。 According to the electronic device of the embodiment, since the temperature detection device is included, the position of the thermistor element with respect to the housing can be stabilized. Therefore, the temperature of the housing can be detected with high accuracy.
　また、一実施形態の電子機器は、
　筐体と、
　前記筐体内に配置される回路基板と、
　前記筐体内に配置され前記筐体の温度を検知する前記温度検知装置と
を備え、
　前記温度検知装置の前記温度検知部は、前記筐体に固定され、
　前記温度検知装置の前記弾性部材は、前記回路基板に固定される。 Moreover, the electronic device of one embodiment is
A housing,
A circuit board disposed in the housing;
The temperature detection device disposed in the housing and detecting the temperature of the housing;
The temperature detection unit of the temperature detection device is fixed to the housing,
The elastic member of the temperature detection device is fixed to the circuit board.
　前記実施形態の電子機器によれば、温度検知装置の温度検知部は、筐体に固定され、温度検知装置の弾性部材は、回路基板に固定される。これにより、部品交換や修理などで電子機器を分解する際、弾性部材を回路基板ごと筐体から取り外すと、弾性部材は温度検知部に離隔可能に接触しているため、弾性部材を温度検知部から容易に離すことができる。その後、電子機器を再度組み立てる際、弾性部材を回路基板ごと筐体に取り付けると、弾性部材を温度検知部に容易に接触させることができる。このとき、温度検知部は、筐体に固定されているため、サーミスタ素子の筐体に対する位置を保持でき、サーミスタ素子の位置調整が不要になる。したがって、温度検知装置を電子機器に用いたときの組立性が良好となる。 According to the electronic apparatus of the embodiment, the temperature detection unit of the temperature detection device is fixed to the casing, and the elastic member of the temperature detection device is fixed to the circuit board. As a result, when disassembling the electronic device for parts replacement or repair, if the elastic member is removed from the housing together with the circuit board, the elastic member is in contact with the temperature detection unit so as to be separable. Can be easily separated from. Thereafter, when the electronic device is reassembled, the elastic member can be easily brought into contact with the temperature detection unit by attaching the elastic member together with the circuit board to the housing. At this time, since the temperature detection unit is fixed to the casing, the position of the thermistor element can be held with respect to the casing, and the position adjustment of the thermistor element becomes unnecessary. Therefore, the assemblability when the temperature detection device is used in an electronic device is improved.
　本発明の温度検知装置および電子機器によれば、弾性部材は、温度検知部を弾性的に押圧し、温度検知部を筐体に弾性的に接触させるので、筐体に対するサーミスタ素子の位置を安定させることができる。 According to the temperature detection device and the electronic apparatus of the present invention, the elastic member elastically presses the temperature detection unit and elastically contacts the temperature detection unit with the casing, so that the position of the thermistor element with respect to the casing is stabilized. Can be made.
本発明の第１実施形態の温度検知装置および電子機器を示す簡略断面図である。1 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a first embodiment of the present invention. 温度検知部の斜視図である。It is a perspective view of a temperature detection part. 本発明の第２実施形態の温度検知装置および電子機器を示す簡略断面図である。It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 2nd embodiment of the present invention. 本発明の第３実施形態の温度検知装置および電子機器を示す簡略断面図である。It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 3rd embodiment of the present invention. 温度検知部の斜視図である。It is a perspective view of a temperature detection part. 弾性部材の斜視図である。It is a perspective view of an elastic member. 他の弾性部材の斜視図である。It is a perspective view of another elastic member. 本発明の第４実施形態の温度検知装置および電子機器を示す簡略断面図である。It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 4th embodiment of the present invention.
　以下、本発明を図示の実施の形態により詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.
　（第１実施形態）
　図１は、本発明の第１実施形態の温度検知装置および電子機器を示す簡略断面図である。図１に示すように、電子機器１は、筐体２と、筐体２内に配置される回路基板３および温度検知装置４とを有する。電子機器１は、例えば、スマートフォン、タブレット、ノートＰＣなどのモバイル機器である。 (First embodiment)
FIG. 1 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the electronic device 1 includes a housing 2, a circuit board 3 and a temperature detection device 4 disposed in the housing 2. The electronic device 1 is a mobile device such as a smartphone, a tablet, or a notebook PC.
　筐体２は、例えば、直方体状に形成されたケースである。ケースは、開口部を有するケース本体とケース本体の開口部を覆う蓋部とを有する。筐体２には、例えば、液晶ディスプレイが取り付けられている。 The housing 2 is a case formed in a rectangular parallelepiped shape, for example. The case includes a case main body having an opening and a lid that covers the opening of the case main body. For example, a liquid crystal display is attached to the housing 2.
　回路基板３には、例えば、ＣＰＵおよびパワーアンプ等のような発熱量の多い電子部品（以下、発熱部品７という）が実装される。発熱部品７からの熱により、筐体２が加熱される。 The circuit board 3 is mounted with an electronic component (hereinafter referred to as a heat generating component 7) having a large amount of heat, such as a CPU and a power amplifier. The housing 2 is heated by the heat from the heat generating component 7.
　温度検知装置４は、筐体２の温度を検知し、電子機器１の制御装置は、温度検知装置４の検知結果に基づいて、例えば、使用者が高温の筐体２に触れることを防止する。温度検知装置４は、温度検知部５と弾性部材６とを有する。温度検知部５は、基板１０と基板１０に取り付けられるサーミスタ素子２０とを有する。弾性部材６は、温度検知部５を弾性的に押圧し、温度検知部５を筐体２に弾性的に接触させて、サーミスタ素子２０により筐体２の温度を検知させる。 The temperature detection device 4 detects the temperature of the housing 2, and the control device of the electronic device 1 prevents, for example, the user from touching the high-temperature housing 2 based on the detection result of the temperature detection device 4. . The temperature detection device 4 includes a temperature detection unit 5 and an elastic member 6. The temperature detection unit 5 includes a substrate 10 and a thermistor element 20 attached to the substrate 10. The elastic member 6 elastically presses the temperature detection unit 5, makes the temperature detection unit 5 elastically contact the case 2, and causes the thermistor element 20 to detect the temperature of the case 2.
　図２は、温度検知部５の斜視図である。図２に示すように、基板１０は、フレキシブルプリント基板である。基板１０は、基材１５と、基材１５上に配置される第１配線１１および第２配線１２と、第１配線１１および第２配線１２の一部を覆うカバー部１６とを有する。 FIG. 2 is a perspective view of the temperature detection unit 5. As shown in FIG. 2, the substrate 10 is a flexible printed circuit board. The substrate 10 includes a base material 15, a first wiring 11 and a second wiring 12 disposed on the base material 15, and a cover portion 16 that covers a part of the first wiring 11 and the second wiring 12.
　基材１５は、帯状に形成されている。基材１５は、可撓性および電気絶縁性を有する。基材１５の材料は、例えば、ポリイミドまたはポリエチレンテレフタレートである。 The base material 15 is formed in a strip shape. The base material 15 has flexibility and electrical insulation. The material of the base material 15 is, for example, polyimide or polyethylene terephthalate.
　第１配線１１および第２配線１２は、それぞれ、基材１５の長手方向に沿って、延在している。第１配線１１および第２配線１２は、基材１５の幅方向に沿って、平行に配列されている。第１配線１１および第２配線１２は、導電性材料で形成される。導電性材料は、例えば、銅や、銅とニッケルとの合金などの金属である。 The first wiring 11 and the second wiring 12 each extend along the longitudinal direction of the base material 15. The first wiring 11 and the second wiring 12 are arranged in parallel along the width direction of the base material 15. The first wiring 11 and the second wiring 12 are formed of a conductive material. The conductive material is, for example, a metal such as copper or an alloy of copper and nickel.
　第１配線１１は、長手方向の両端に、第１端子１１ａと第２端子１１ｂとを有する。第２配線１２は、長手方向の両端に、第１端子１２ａと第２端子１２ｂとを有する。第１配線１１の第１端子１１ａと第２配線１２の第１端子１２ａとは、基材１５の長手方向の一端側に位置する。第１配線１１の第２端子１１ｂと第２配線１２の第２端子１２ｂとは、基材１５の長手方向の他端側に位置する。 The first wiring 11 has a first terminal 11a and a second terminal 11b at both ends in the longitudinal direction. The second wiring 12 has a first terminal 12a and a second terminal 12b at both ends in the longitudinal direction. The first terminal 11 a of the first wiring 11 and the first terminal 12 a of the second wiring 12 are located on one end side in the longitudinal direction of the base material 15. The second terminal 11 b of the first wiring 11 and the second terminal 12 b of the second wiring 12 are located on the other end side in the longitudinal direction of the base material 15.
　カバー部１６は、第１配線１１の第１、第２端子１１ａ，１１ｂを除く部分と、第２配線１２の第１、第２端子１２ａ，１２ｂを除く部分とを、覆う。つまり、第１配線１１の第１、第２端子１１ａ，１１ｂと、第２配線１２の第１、第２端子１２ａ，１２ｂとは、カバー部１６から露出する。カバー部１６は、電気絶縁性を有する樹脂製フィルムで形成される。 The cover portion 16 covers a portion of the first wiring 11 excluding the first and second terminals 11a and 11b and a portion of the second wiring 12 excluding the first and second terminals 12a and 12b. That is, the first and second terminals 11 a and 11 b of the first wiring 11 and the first and second terminals 12 a and 12 b of the second wiring 12 are exposed from the cover portion 16. The cover part 16 is formed of a resin film having electrical insulation.
　サーミスタ素子２０は、例えば、積層型のチップサーミスタであって、サーミスタ本体２３と第１外部電極２１と第２外部電極２２とを有する。 The thermistor element 20 is, for example, a multilayer chip thermistor, and has a thermistor body 23, a first external electrode 21, and a second external electrode 22.
　サーミスタ本体２３は、複数のセラミックス層を含む。複数のセラミックス層は、積層される。隣り合うセラミックス層の間に、内部電極が設けられている。サーミスタ本体２３は、周囲温度の変化に対して抵抗値が大きく変化する温度特性を有する。サーミスタ本体２３は、例えば、温度上昇と共に抵抗値が小さくなるＮＴＣサーミスタである。ＮＴＣサーミスタは、例えば、マンガン、ニッケル、鉄、コバルトおよび銅等の遷移元素のグループから選ばれた二種から四種の酸化物を混合し焼結した酸化物焼結体（セラミックス焼結体）から作製できる。なお、サーミスタ本体２３は、内部電極を有さなくてもよい。 The thermistor body 23 includes a plurality of ceramic layers. A plurality of ceramic layers are laminated. An internal electrode is provided between adjacent ceramic layers. The thermistor body 23 has a temperature characteristic in which the resistance value changes greatly with changes in ambient temperature. The thermistor body 23 is, for example, an NTC thermistor whose resistance value decreases with increasing temperature. An NTC thermistor is an oxide sintered body (ceramic sintered body) obtained by mixing and sintering two to four kinds of oxides selected from the group of transition elements such as manganese, nickel, iron, cobalt and copper. Can be made from The thermistor body 23 does not have to have an internal electrode.
　サーミスタ本体２３は、略直方体形状に形成されている。サーミスタ本体２３は、互いに対向する第１、第２端面と、第１端面と第２端面との間に配置される４つの側面とを有する。 The thermistor body 23 is formed in a substantially rectangular parallelepiped shape. The thermistor body 23 has first and second end surfaces facing each other, and four side surfaces disposed between the first end surface and the second end surface.
　第１、第２外部電極２１，２２は、例えば、銀を主成分とする下地層と、下地層上に形成されたニッケルのめっき層と、ニッケルのめっき層上に形成されたスズのめっき層とを含む。 The first and second external electrodes 21 and 22 are, for example, a base layer mainly composed of silver, a nickel plating layer formed on the base layer, and a tin plating layer formed on the nickel plating layer. Including.
　第１外部電極２１は、サーミスタ本体２３の第１端面を覆っている。具体的には、第１外部電極２１は、サーミスタ本体２３の第１端面の全領域に加え、サーミスタ本体２３の４つの側面の第１端面側を覆う。 The first external electrode 21 covers the first end face of the thermistor body 23. Specifically, the first external electrode 21 covers the first end face side of the four side surfaces of the thermistor body 23 in addition to the entire region of the first end face of the thermistor body 23.
　第２外部電極２２は、サーミスタ本体２３の第２端面を覆っている。具体的に述べると、第２外部電極２２は、サーミスタ本体２３の第２端面の全領域に加え、サーミスタ本体２３の４つの側面の第２端面側を覆う。 The second external electrode 22 covers the second end face of the thermistor body 23. Specifically, the second external electrode 22 covers the second end face side of the four side surfaces of the thermistor body 23 in addition to the entire area of the second end face of the thermistor body 23.
　サーミスタ素子２０は、基板１０の第１、第２配線１１，１２に電気的に接続される。具体的に述べると、サーミスタ素子２０の第１外部電極２１は、半田を介して、第１配線１１の第２端子１１ｂに接合される。サーミスタ素子２０の第２外部電極２２は、半田を介して、第２配線１２の第２端子１２ｂに接合される。 The thermistor element 20 is electrically connected to the first and second wirings 11 and 12 of the substrate 10. More specifically, the first external electrode 21 of the thermistor element 20 is joined to the second terminal 11b of the first wiring 11 via solder. The second external electrode 22 of the thermistor element 20 is joined to the second terminal 12b of the second wiring 12 via solder.
　図１と図２に示すように、温度検知部５の基板１０は、回路基板３に電気的に接続される。具体的に述べると、第１配線１１の第１端子１１ａは、半田を介して、回路基板３の配線に接合される。第２配線１２の第１端子１２ａは、半田を介して、回路基板３の配線に接合される。 As shown in FIGS. 1 and 2, the substrate 10 of the temperature detector 5 is electrically connected to the circuit substrate 3. More specifically, the first terminal 11a of the first wiring 11 is joined to the wiring of the circuit board 3 via solder. The 1st terminal 12a of the 2nd wiring 12 is joined to the wiring of circuit board 3 via solder.
　温度検知部５は、筐体２に接触する。具体的に述べると、基材１５のサーミスタ素子２０と反対側の面は、筐体２に接触する。サーミスタ素子２０は、基板１０を介して、筐体２の熱を検知する。 The temperature detector 5 contacts the housing 2. Specifically, the surface of the substrate 15 opposite to the thermistor element 20 is in contact with the housing 2. The thermistor element 20 detects the heat of the housing 2 through the substrate 10.
　図１に示すように、弾性部材６は、断熱性クッション材から構成される。断熱性クッション材は、例えば、発泡ポリウレタンなどの発泡性樹脂材や、ゴム材などからなる。弾性部材６は、略直方体形状に形成されている。 As shown in FIG. 1, the elastic member 6 is composed of a heat insulating cushion material. The heat insulating cushion material is made of, for example, a foamable resin material such as foamed polyurethane, or a rubber material. The elastic member 6 is formed in a substantially rectangular parallelepiped shape.
　弾性部材６は、基板１０に直交する方向からみて、温度検知部５のサーミスタ素子２０に重なる領域を、弾性的に押圧する。具体的に述べると、弾性部材６は、発熱部品７上に配置され、サーミスタ素子２０を直接に押圧する。このとき、弾性部材６は、弾性変形して、サーミスタ素子２０を押圧する。 The elastic member 6 elastically presses the region overlapping the thermistor element 20 of the temperature detection unit 5 when viewed from the direction orthogonal to the substrate 10. More specifically, the elastic member 6 is disposed on the heat generating component 7 and directly presses the thermistor element 20. At this time, the elastic member 6 is elastically deformed and presses the thermistor element 20.
　前記温度検知装置４の動作について説明する。 The operation of the temperature detection device 4 will be described.
　図１に示すように、発熱部品７が、発熱すると、筐体２は、発熱部品７からの熱により、加熱される。基板１０は、筐体２と接触しているため、サーミスタ素子２０は、基板１０を介して、筐体２の温度を検知する。制御装置は、サーミスタ素子２０の検知結果（電流変化）に基づいて、ファンなどを動かして、筐体２や発熱部品７を冷却する。なお、弾性部材６は、サーミスタ素子２０と発熱部品７との間に位置しているため、発熱部品７からの熱は、サーミスタ素子２０に直接に伝わりにくくなる。このため、サーミスタ素子２０は、筐体２の熱を正確に検知することができる。 As shown in FIG. 1, when the heat generating component 7 generates heat, the housing 2 is heated by the heat from the heat generating component 7. Since the substrate 10 is in contact with the housing 2, the thermistor element 20 detects the temperature of the housing 2 through the substrate 10. Based on the detection result (current change) of the thermistor element 20, the control device moves the fan and cools the housing 2 and the heat generating component 7. Since the elastic member 6 is located between the thermistor element 20 and the heat generating component 7, the heat from the heat generating component 7 is not easily transmitted directly to the thermistor element 20. For this reason, the thermistor element 20 can accurately detect the heat of the housing 2.
　前記電子機器１および前記温度検知装置４の組立について説明する。 The assembly of the electronic device 1 and the temperature detection device 4 will be described.
　図１に示すように、基板１０のサーミスタ素子２０と反対側の端部を、回路基板３に、固定する。基板１０のサーミスタ素子２０側の端部と回路基板３上の発熱部品７との間に、弾性部材６を配置する。弾性部材６は、発熱部品７に接着され、サーミスタ素子２０は、弾性部材６に接着される。このように、温度検知装置４は、回路基板３に取り付けられる。そして、温度検知装置４を回路基板３ごと筐体２に取り付け、電子機器１を組み立てる。なお、弾性部材６、発熱部品７およびサーミスタ素子２０は、互いに、接着されていなくてもよい。 As shown in FIG. 1, the end of the substrate 10 opposite to the thermistor element 20 is fixed to the circuit board 3. The elastic member 6 is disposed between the end of the substrate 10 on the thermistor element 20 side and the heat generating component 7 on the circuit board 3. The elastic member 6 is bonded to the heat generating component 7, and the thermistor element 20 is bonded to the elastic member 6. Thus, the temperature detection device 4 is attached to the circuit board 3. Then, the temperature detection device 4 is attached to the housing 2 together with the circuit board 3 to assemble the electronic device 1. The elastic member 6, the heat generating component 7, and the thermistor element 20 may not be bonded to each other.
　前記温度検知装置４によれば、弾性部材６は、温度検知部５を弾性的に押圧し、温度検知部５を筐体２に弾性的に接触させるので、弾性部材６は、筐体２に対するサーミスタ素子２０の位置を安定させることができる。このため、筐体２に揺れ等の振動が発生しても、サーミスタ素子２０は、筐体２から離隔せず、サーミスタ素子２０は、筐体２の所定位置に保持される。したがって、筐体２の温度を精度よく検知することができる。 According to the temperature detection device 4, the elastic member 6 elastically presses the temperature detection unit 5 and elastically contacts the temperature detection unit 5 with the housing 2. The position of the thermistor element 20 can be stabilized. For this reason, even if vibration such as shaking occurs in the housing 2, the thermistor element 20 is not separated from the housing 2, and the thermistor element 20 is held at a predetermined position of the housing 2. Therefore, the temperature of the housing 2 can be detected with high accuracy.
　また、弾性部材６は、断熱性クッション材から構成され、温度検知部５のサーミスタ素子２０に重なる領域を弾性的に押圧する。これにより、サーミスタ素子２０は、筐体２と弾性部材６との間に、配置される。したがって、弾性部材６は、サーミスタ素子２０を直接的に筐体２に押圧することができ、筐体２に対するサーミスタ素子２０の位置を一層安定させることができる。 Further, the elastic member 6 is made of a heat insulating cushion material and elastically presses a region overlapping the thermistor element 20 of the temperature detection unit 5. Thereby, the thermistor element 20 is disposed between the housing 2 and the elastic member 6. Therefore, the elastic member 6 can press the thermistor element 20 directly against the housing 2, and can further stabilize the position of the thermistor element 20 with respect to the housing 2.
　前記電子機器１によれば、前記温度検知装置４を有するので、サーミスタ素子２０の筐体２に対する位置を安定させることができる。したがって、筐体２の温度を精度よく検知することができる。 According to the electronic device 1, since the temperature detection device 4 is provided, the position of the thermistor element 20 with respect to the housing 2 can be stabilized. Therefore, the temperature of the housing 2 can be detected with high accuracy.
　（第２実施形態）
　図３は、本発明の第２実施形態の温度検知装置および電子機器を示す簡略断面図である。第２実施形態は、前記第１実施形態とは、基板の構成のみが相違する。この相違する構成のみを以下に説明する。なお、第２実施形態において、前記第１実施形態と同一の部分には、同一の参照番号を付して、詳細な説明を省略する。 (Second Embodiment)
FIG. 3 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a second embodiment of the present invention. The second embodiment is different from the first embodiment only in the configuration of the substrate. Only this different configuration will be described below. Note that in the second embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
　図３に示すように、電子機器１Ａの温度検知装置４Ａでは、温度検知部５Ａの基板１０Ａは、サーミスタ素子２０に電気的に接続される第１接続部１０ａと、回路基板３の配線に電気的に接続される第２接続部１０ｂと、第１接続部１０ａと第２接続部１０ｂとの間で折り返される折り返し部１０ｃとを有する。 As shown in FIG. 3, in the temperature detection device 4 </ b> A of the electronic device 1 </ b> A, the substrate 10 </ b> A of the temperature detection unit 5 </ b> A is electrically connected to the first connection unit 10 a electrically connected to the thermistor element 20 and the wiring of the circuit board 3. A second connection portion 10b that is connected electrically, and a folded portion 10c that is folded between the first connection portion 10a and the second connection portion 10b.
　基板１０Ａの構成部材は、図２に示す第１実施形態の基板１０の構成部材と同じである。基板１０Ａの第１接続部１０ａは、図２に示す、第１配線１１の第２端子１１ｂと第２配線１２の第２端子１２ｂとからなる。基板１０Ａの第２接続部１０ｂは、図２に示す、第１配線１１の第１端子１１ａと第２配線１２の第１端子１２ａとからなる。 The constituent members of the substrate 10A are the same as the constituent members of the substrate 10 of the first embodiment shown in FIG. The first connection portion 10a of the substrate 10A includes a second terminal 11b of the first wiring 11 and a second terminal 12b of the second wiring 12 shown in FIG. The second connection portion 10b of the substrate 10A includes a first terminal 11a of the first wiring 11 and a first terminal 12a of the second wiring 12 shown in FIG.
　折り返し部１０ｃは、第１接続部１０ａと第２接続部１０ｂとの間の部分であり、略Ｕ字状に形成される。折り返し部１０ｃは、回路基板３の略平面方向に延在している。折り返し部１０ｃの長手方向の長さは、筐体２と回路基板３との間の距離よりも長い。なお、折り返し部１０ｃは、弓状やＶ字状などに形成されていてもよい。 The folded portion 10c is a portion between the first connection portion 10a and the second connection portion 10b, and is formed in a substantially U shape. The folded portion 10 c extends in the substantially planar direction of the circuit board 3. The length of the folded portion 10 c in the longitudinal direction is longer than the distance between the housing 2 and the circuit board 3. In addition, the folding | returning part 10c may be formed in the shape of a bow, V shape, etc.
　前記温度検知装置４Ａによれば、基板１０Ａは、第１接続部１０ａと第２接続部１０ｂとの間に折り返し部１０ｃを有するので、第２接続部１０ｂから第１接続部１０ａへの熱経路を長くすることができる。これにより、第２接続部１０ｂから第１接続部１０ａに伝わる熱を折り返し部１０ｃから放熱することができる。つまり、回路基板３からの熱が、基板１０Ａを介して、サーミスタ素子２０に伝達されることを抑制できる。したがって、筐体２の温度を一層精度よく検知することができる。 According to the temperature detection device 4A, the substrate 10A has the folded portion 10c between the first connection portion 10a and the second connection portion 10b, so that the heat path from the second connection portion 10b to the first connection portion 10a. Can be lengthened. Thereby, the heat transmitted from the 2nd connection part 10b to the 1st connection part 10a can be thermally radiated from the folding | returning part 10c. That is, heat from the circuit board 3 can be suppressed from being transmitted to the thermistor element 20 via the board 10A. Therefore, the temperature of the housing 2 can be detected with higher accuracy.
　なお、基板１０Ａの長さを長くしつつ、または、基板１０Ａの長さを長くする代わりに、基板１０Ａの第１、第２配線１１，１２の断面積を小さくするようにしてもよい。例えば、第１、第２配線１１，１２の幅を狭くしたり、第１、第２配線１１，１２の厚みを薄くする。 Note that the cross-sectional areas of the first and second wirings 11 and 12 of the substrate 10A may be reduced while increasing the length of the substrate 10A or instead of increasing the length of the substrate 10A. For example, the widths of the first and second wirings 11 and 12 are reduced, and the thicknesses of the first and second wirings 11 and 12 are reduced.
　（第３実施形態）
　図４は、本発明の第３実施形態の温度検知装置および電子機器を示す簡略断面図である。第３実施形態は、前記第１実施形態とは、温度検知装置の構成のみが相違する。この相違する構成のみを以下に説明する。なお、第３実施形態において、前記第１実施形態と同一の部分には、同一の参照番号を付して、詳細な説明を省略する。 (Third embodiment)
FIG. 4 is a simplified cross-sectional view showing a temperature detection device and an electronic apparatus according to a third embodiment of the present invention. The third embodiment is different from the first embodiment only in the configuration of the temperature detection device. Only this different configuration will be described below. Note that, in the third embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
　図４に示すように、電子機器１Ｂの温度検知装置４Ｂは、温度検知部５Ｂと２つの弾性部材６Ｂとを有する。温度検知部５Ｂは、基板１０Ｂと基板１０Ｂに取り付けられるサーミスタ素子２０とを有する。弾性部材６Ｂは、温度検知部５Ｂを弾性的に押圧し、温度検知部５Ｂを筐体２に弾性的に接触させて、サーミスタ素子２０により筐体２の温度を検知させる。 As shown in FIG. 4, the temperature detection device 4B of the electronic apparatus 1B includes a temperature detection unit 5B and two elastic members 6B. The temperature detection unit 5B includes a substrate 10B and a thermistor element 20 attached to the substrate 10B. The elastic member 6 </ b> B elastically presses the temperature detection unit 5 </ b> B, makes the temperature detection unit 5 </ b> B elastically contact the case 2, and causes the thermistor element 20 to detect the temperature of the case 2.
　図５は、温度検知部５Ｂの斜視図である。図５に示すように、基板１０Ｂは、フレキシブルプリント基板である。基板１０Ｂは、基材１５と、基材１５上に配置される第１配線１１および第２配線１２と、第１配線１１および第２配線１２の一部を覆う２つのカバー部１６とを有する。 FIG. 5 is a perspective view of the temperature detector 5B. As shown in FIG. 5, the substrate 10B is a flexible printed circuit board. The substrate 10 </ b> B includes a base material 15, first wirings 11 and second wirings 12 disposed on the base material 15, and two cover portions 16 that cover parts of the first wirings 11 and the second wirings 12. .
　基材１５は、帯状に形成されている。基材１５は、可撓性および電気絶縁性を有する。基材１５の材料は、例えば、ポリイミドまたはポリエチレンテレフタレートである。 The base material 15 is formed in a strip shape. The base material 15 has flexibility and electrical insulation. The material of the base material 15 is, for example, polyimide or polyethylene terephthalate.
　第１配線１１および第２配線１２は、それぞれ、基材１５の長手方向に沿って、延在している。第１配線１１および第２配線１２は、基材１５の長手方向に沿って、直列に配列されている。第１配線１１および第２配線１２は、導電性材料で形成される。導電性材料は、例えば、銅や、銅とニッケルとの合金などの金属である。 The first wiring 11 and the second wiring 12 each extend along the longitudinal direction of the base material 15. The first wiring 11 and the second wiring 12 are arranged in series along the longitudinal direction of the base material 15. The first wiring 11 and the second wiring 12 are formed of a conductive material. The conductive material is, for example, a metal such as copper or an alloy of copper and nickel.
　第１配線１１は、長手方向の両端に、第１端子１１ａと第２端子１１ｂとを有する。第２配線１２は、長手方向の両端に、第１端子１２ａと第２端子１２ｂとを有する。第１配線１１の第１端子１１ａは、基材１５の長手方向の一端側に位置する。第２配線１２の第１端子１２ａは、基材１５の長手方向の他端側に位置する。第１配線１１の第２端子１１ｂと第２配線１２の第２端子１２ｂとは、基板１０Ｂの長手方向の中央部に配置され、互いに対向する。 The first wiring 11 has a first terminal 11a and a second terminal 11b at both ends in the longitudinal direction. The second wiring 12 has a first terminal 12a and a second terminal 12b at both ends in the longitudinal direction. The first terminal 11 a of the first wiring 11 is located on one end side in the longitudinal direction of the base material 15. The first terminal 12 a of the second wiring 12 is located on the other end side in the longitudinal direction of the base material 15. The 2nd terminal 11b of the 1st wiring 11 and the 2nd terminal 12b of the 2nd wiring 12 are arrange | positioned in the center part of the longitudinal direction of the board | substrate 10B, and mutually oppose.
　一方のカバー部１６は、第１配線１１の第１、第２端子１１ａ，１１ｂを除く部分を、覆う。他方のカバー部１６は、第２配線１２の第１、第２端子１２ａ，１２ｂを除く部分を、覆う。つまり、第１配線１１の第１、第２端子１１ａ，１１ｂと、第２配線１２の第１、第２端子１２ａ，１２ｂとは、それぞれカバー部１６から露出する。カバー部１６は、電気絶縁性を有する樹脂製フィルムで形成される。 One cover portion 16 covers a portion of the first wiring 11 excluding the first and second terminals 11a and 11b. The other cover portion 16 covers a portion of the second wiring 12 excluding the first and second terminals 12a and 12b. That is, the first and second terminals 11 a and 11 b of the first wiring 11 and the first and second terminals 12 a and 12 b of the second wiring 12 are exposed from the cover portion 16. The cover part 16 is formed of a resin film having electrical insulation.
　サーミスタ素子２０は、サーミスタ本体２３と第１外部電極２１と第２外部電極２２とを有する。サーミスタ素子２０は、第１実施形態のサーミスタ素子２０と同様の構成であるため、詳細な説明を省略する。 The thermistor element 20 has a thermistor body 23, a first external electrode 21, and a second external electrode 22. Since the thermistor element 20 has the same configuration as the thermistor element 20 of the first embodiment, a detailed description thereof is omitted.
　サーミスタ素子２０は、基板１０Ｂの第１、第２配線１１，１２に電気的に接続される。具体的に述べると、サーミスタ素子２０の第１外部電極２１は、半田を介して、第１配線１１の第２端子１１ｂに接合される。サーミスタ素子２０の第２外部電極２２は、半田を介して、第２配線１２の第２端子１２ｂに接合される。サーミスタ素子２０は、基板１０Ｂの長手方向の中央部に取り付けられる。 The thermistor element 20 is electrically connected to the first and second wirings 11 and 12 of the substrate 10B. More specifically, the first external electrode 21 of the thermistor element 20 is joined to the second terminal 11b of the first wiring 11 via solder. The second external electrode 22 of the thermistor element 20 is joined to the second terminal 12b of the second wiring 12 via solder. The thermistor element 20 is attached to the central portion in the longitudinal direction of the substrate 10B.
　図６は、弾性部材６Ｂの斜視図である。図４と図６に示すように、弾性部材６Ｂは、導電性を有する板バネから構成される。弾性部材６Ｂの材料は、例えば、銅や、銅とニッケルとの合金などの金属である。 FIG. 6 is a perspective view of the elastic member 6B. As shown in FIGS. 4 and 6, the elastic member 6 </ b> B is composed of a conductive leaf spring. The material of the elastic member 6B is, for example, a metal such as copper or an alloy of copper and nickel.
　弾性部材６Ｂは、帯状の金属板を折り曲げられて形成される。弾性部材６Ｂは、基板１０Ｂの配線に電気的に接続される第１接続部６ａと、回路基板３の配線に電気的に接続される第２接続部６ｂと、第１接続部６ａと第２接続部６ｂとの間で折り返される折り返し部６ｃとを有する。 The elastic member 6B is formed by bending a band-shaped metal plate. The elastic member 6B includes a first connection portion 6a that is electrically connected to the wiring of the substrate 10B, a second connection portion 6b that is electrically connected to the wiring of the circuit board 3, a first connection portion 6a, and a second connection portion. And a folded portion 6c that is folded between the connecting portion 6b.
　第１接続部６ａは、湾曲状に形成されている。第２接続部６ｂは、平板状に形成されている。折り返し部６ｃは、第１接続部６ａと第２接続部６ｂとの間の部分であり、略Ｕ字状に形成される。折り返し部６ｃは、回路基板３の略平面方向に延在している。折り返し部６ｃの長手方向の長さは、筐体２と回路基板３との間の距離よりも長い。なお、折り返し部６ｃは、弓状やＶ字状などに形成されていてもよい。 The first connection portion 6a is formed in a curved shape. The 2nd connection part 6b is formed in flat form. The folded portion 6c is a portion between the first connection portion 6a and the second connection portion 6b, and is formed in a substantially U shape. The folded portion 6 c extends in a substantially planar direction of the circuit board 3. The length of the folded portion 6 c in the longitudinal direction is longer than the distance between the housing 2 and the circuit board 3. In addition, the folding | returning part 6c may be formed in the shape of a bow, V shape, etc.
　図４から図６に示すように、温度検知部５Ｂは、筐体２に固定される。具体的に述べると、基材１５のサーミスタ素子２０と反対側の面は、接着部材８を介して、筐体２に固定される。接着部材８は、例えば、両面テープであり、熱伝導性を有する。接着部材８は、基材１５に直交する方向からみて、サーミスタ素子２０に重なるように配置される。サーミスタ素子２０は、接着部材８および基板１０Ｂを介して、筐体２の熱を検知する。サーミスタ素子２０は、発熱部品７との間に隙間を有して、発熱部品７の直上に位置している。サーミスタ素子２０は、発熱部品７との間に隙間を有しているので、サーミスタ素子２０は、発熱部品７に対して空気断熱されている。 4 to 6, the temperature detection unit 5B is fixed to the housing 2. Specifically, the surface of the substrate 15 opposite to the thermistor element 20 is fixed to the housing 2 via the adhesive member 8. The adhesive member 8 is, for example, a double-sided tape and has thermal conductivity. The adhesive member 8 is disposed so as to overlap the thermistor element 20 when viewed from the direction orthogonal to the base material 15. The thermistor element 20 detects the heat of the housing 2 via the adhesive member 8 and the substrate 10B. The thermistor element 20 is located immediately above the heat generating component 7 with a gap between the thermistor element 20 and the heat generating component 7. Since the thermistor element 20 has a gap with the heat generating component 7, the thermistor element 20 is thermally insulated from the heat generating component 7.
　弾性部材６Ｂは、回路基板３に固定される。具体的に述べると、弾性部材６Ｂの第２接続部６ｂは、半田を介して、回路基板３の配線に接合される。２つの弾性部材６Ｂは、発熱部品７を挟むように配置される。２つの弾性部材６Ｂは、発熱部品７を基準として対称に配置される。 The elastic member 6B is fixed to the circuit board 3. Specifically, the second connection portion 6b of the elastic member 6B is joined to the wiring of the circuit board 3 via solder. The two elastic members 6B are disposed so as to sandwich the heat generating component 7 therebetween. The two elastic members 6B are arranged symmetrically with respect to the heat generating component 7.
　２つの弾性部材６Ｂは、基板１０Ｂの配線１１，１２に離隔可能に接触して、基板１０Ｂの配線１１，１２に電気的に接続される。２つの弾性部材６Ｂは、基板１０Ｂの長手方向の両端を支持する。具体的に述べると、一方の弾性部材６Ｂの第１接続部６ａは、基板１０Ｂの第１配線１１の第１端子１１ａに離隔可能に接触している。他方の弾性部材６Ｂの第１接続部６ａは、基板１０Ｂの第２配線１２の第１端子１２ａに離隔可能に接触している。これにより、サーミスタ素子２０は、基板１０Ｂの配線１１，１２と弾性部材６Ｂとを介して、回路基板３の配線に電気的に接続される。 The two elastic members 6B are in contact with the wirings 11 and 12 of the substrate 10B so as to be separated from each other, and are electrically connected to the wirings 11 and 12 of the substrate 10B. The two elastic members 6B support both ends of the substrate 10B in the longitudinal direction. Specifically, the first connecting portion 6a of one elastic member 6B is in contact with the first terminal 11a of the first wiring 11 of the substrate 10B so as to be separated. The first connection portion 6a of the other elastic member 6B is in contact with the first terminal 12a of the second wiring 12 of the substrate 10B so as to be separable. As a result, the thermistor element 20 is electrically connected to the wiring of the circuit board 3 via the wirings 11 and 12 of the substrate 10B and the elastic member 6B.
　弾性部材６Ｂの基板１０Ｂの配線１１，１２に対する接触は、線接触である。つまり、弾性部材６Ｂの第１接続部６ａの上面は、湾曲面であるので、第１接続部６ａ上面の配線１１，１２に対する接触面は、線状となる。線接触とは、一般的な線接触を意味し、帯状部材が長手方向曲げられて形成される曲げ面が平面と接触するときの接触状態をいう。したがって、弾性部材６Ｂの配線１１，１２に対する接触面積を小さくして、弾性部材６Ｂから基板１０Ｂへの熱伝導を抑制することができる。 The contact of the elastic member 6B to the wirings 11 and 12 of the substrate 10B is a line contact. That is, since the upper surface of the first connection portion 6a of the elastic member 6B is a curved surface, the contact surfaces of the upper surface of the first connection portion 6a with respect to the wirings 11 and 12 are linear. The line contact means a general line contact and refers to a contact state when a bending surface formed by bending a belt-shaped member in the longitudinal direction contacts a flat surface. Therefore, the contact area of the elastic member 6B with respect to the wirings 11 and 12 can be reduced, and heat conduction from the elastic member 6B to the substrate 10B can be suppressed.
　なお、弾性部材６Ｂの基板１０Ｂの配線１１，１２に対する接触を、点接触としてもよい。この場合、図７に示すように、弾性部材６Ｂの第１接続部６ａに、凸部６ｄを設ける。凸部６ｄは、第１接続部６ａの裏面からポンチなどによりプレス加工して形成される。もちろん、凸部６ｄは、点状に限らず、第１接続部６ａから第２接続部６ｂにわたって延在する細長い形状に、形成してもよい。点接触とは、一般的な点接触を意味し、帯状部材が少なくとも長手方向および幅方向に曲げられて形成される曲げ面が平面と接触するときの接触状態をいう。 The contact of the elastic member 6B with respect to the wirings 11 and 12 of the substrate 10B may be point contact. In this case, as shown in FIG. 7, the convex part 6d is provided in the 1st connection part 6a of the elastic member 6B. The convex portion 6d is formed by pressing from the back surface of the first connecting portion 6a with a punch or the like. Of course, the convex portion 6d is not limited to a dot shape, and may be formed in an elongated shape extending from the first connection portion 6a to the second connection portion 6b. The point contact means a general point contact, and refers to a contact state when a bent surface formed by bending a belt-shaped member at least in the longitudinal direction and the width direction contacts a flat surface.
　前記温度検知装置４Ｂによれば、弾性部材６Ｂは、基板１０Ｂの配線１１，１２に離隔可能に接触するので、温度検知装置４Ｂを電子機器１Ｂに搭載する際、温度検知部５Ｂを筐体２に固定し、弾性部材６Ｂを電子機器１Ｂの回路基板３に固定することができる。 According to the temperature detection device 4B, the elastic member 6B contacts the wirings 11 and 12 of the substrate 10B so as to be separable. Therefore, when the temperature detection device 4B is mounted on the electronic device 1B, the temperature detection unit 5B is mounted on the housing 2. The elastic member 6B can be fixed to the circuit board 3 of the electronic device 1B.
　そして、部品交換や修理などで電子機器１Ｂを分解する際、弾性部材６Ｂを回路基板３ごと筐体２から取り外すと、弾性部材６Ｂは温度検知部５Ｂに離隔可能に接触しているため、弾性部材６Ｂを温度検知部５Ｂから容易に離すことができる。その後、電子機器１Ｂを再度組み立てる際、弾性部材６Ｂを回路基板３ごと筐体２に取り付けると、弾性部材６Ｂを温度検知部５Ｂに容易に接触させることができる。このとき、温度検知部５Ｂは、筐体２に固定されているため、サーミスタ素子２０の筐体２に対する位置を保持でき、サーミスタ素子２０の位置調整が不要になる。したがって、温度検知装置４Ｂを電子機器１Ｂに用いたときの組立性が良好となる。 When the electronic device 1B is disassembled for parts replacement or repair, when the elastic member 6B is removed from the housing 2 together with the circuit board 3, the elastic member 6B is in contact with the temperature detection unit 5B so as to be separable. The member 6B can be easily separated from the temperature detection unit 5B. Thereafter, when the electronic device 1B is reassembled, the elastic member 6B can be easily brought into contact with the temperature detection unit 5B by attaching the elastic member 6B together with the circuit board 3 to the housing 2. At this time, since the temperature detection unit 5B is fixed to the casing 2, the position of the thermistor element 20 with respect to the casing 2 can be held, and the position adjustment of the thermistor element 20 becomes unnecessary. Therefore, the assemblability when the temperature detection device 4B is used in the electronic apparatus 1B is improved.
　また、弾性部材６Ｂは、第１接続部６ａと第２接続部６ｂとの間で折り返される折り返し部６ｃを有するので、第２接続部６ｂから第１接続部６ａへの熱経路を長くすることができる。これにより、第２接続部６ｂから第１接続部６ａに伝わる熱を折り返し部６ｃから放熱することができる。 Further, since the elastic member 6B has the folded portion 6c that is folded between the first connecting portion 6a and the second connecting portion 6b, the heat path from the second connecting portion 6b to the first connecting portion 6a is lengthened. Can do. Thereby, the heat transmitted from the 2nd connection part 6b to the 1st connection part 6a can be thermally radiated from the folding | returning part 6c.
　（第４実施形態）
　図８は、本発明の第４実施形態の温度検知装置および電子機器を示す簡略断面図である。第４実施形態は、前記第３実施形態とは、基板の構成および弾性部材の配置のみが相違する。この相違する構成のみを以下に説明する。なお、第４実施形態において、前記第３実施形態と同一の部分には、同一の参照番号を付して、詳細な説明を省略する。 (Fourth embodiment)
FIG. 8 is a simplified cross-sectional view showing a temperature detection device and an electronic apparatus according to a fourth embodiment of the present invention. The fourth embodiment is different from the third embodiment only in the configuration of the substrate and the arrangement of the elastic members. Only this different configuration will be described below. Note that in the fourth embodiment, identical parts to those of the third embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
　図８に示すように、電子機器１Ｃの温度検知装置４Ｃでは、温度検知部５Ｃの基板１０は、図２に示す第１実施形態の基板１０と同じである。つまり、図２と図８に示すように、サーミスタ素子２０は、基材１５の長手方向の一端側に位置する。第１配線１１の第１端子１１ａと第２配線１２の第１端子１２ａとは、基材１５の長手方向の他端側に位置する。基材１５のサーミスタ素子２０と反対側の面は、接着部材８を介して、筐体２に固定される。サーミスタ素子２０は、接着部材８および基板１０を介して、筐体２の熱を検知する。サーミスタ素子２０は、発熱部品７の直上に位置している。 As shown in FIG. 8, in the temperature detection device 4C of the electronic device 1C, the substrate 10 of the temperature detection unit 5C is the same as the substrate 10 of the first embodiment shown in FIG. That is, as shown in FIGS. 2 and 8, the thermistor element 20 is located on one end side in the longitudinal direction of the base material 15. The first terminal 11 a of the first wiring 11 and the first terminal 12 a of the second wiring 12 are located on the other end side in the longitudinal direction of the base material 15. The surface of the substrate 15 opposite to the thermistor element 20 is fixed to the housing 2 via the adhesive member 8. The thermistor element 20 detects the heat of the housing 2 via the adhesive member 8 and the substrate 10. The thermistor element 20 is located immediately above the heat generating component 7.
　弾性部材６Ｂは、図４に示す第３実施形態の弾性部材６Ｂと同じである。２つの弾性部材６Ｂは、基板１０の長手方向の一端を支持する。２つの弾性部材６Ｂは、基板１０の幅方向（図８の紙面と直交する方向）に並んで配置される。 The elastic member 6B is the same as the elastic member 6B of the third embodiment shown in FIG. The two elastic members 6B support one end of the substrate 10 in the longitudinal direction. The two elastic members 6B are arranged side by side in the width direction of the substrate 10 (direction perpendicular to the paper surface of FIG. 8).
　２つの弾性部材６Ｂは、基板１０の配線１１，１２に離隔可能に接触して、基板１０の配線１１，１２に電気的に接続される。具体的に述べると、一方の弾性部材６Ｂの第１接続部６ａは、基板１０の第１配線１１の第１端子１１ａに離隔可能に接触している。他方の弾性部材６Ｂの第１接続部６ａは、基板１０の第２配線１２の第１端子１２ａに離隔可能に接触している。 The two elastic members 6B are in contact with the wirings 11 and 12 of the substrate 10 so as to be separated from each other, and are electrically connected to the wirings 11 and 12 of the substrate 10. Specifically, the first connection portion 6a of one elastic member 6B is in contact with the first terminal 11a of the first wiring 11 of the substrate 10 so as to be separated. The first connecting portion 6a of the other elastic member 6B is in contact with the first terminal 12a of the second wiring 12 of the substrate 10 so as to be separable.
　前記温度検知装置４Ｃおよび前記電子機器１Ｃによれば、前記第３実施形態と同様の作用効果を有する。なお、２つの弾性部材６Ｂを基板１０の幅方向に並べて配置したが、基板１０の長手方向に並べて配置するようにしてもよい。 The temperature detecting device 4C and the electronic device 1C have the same operational effects as those of the third embodiment. The two elastic members 6B are arranged side by side in the width direction of the substrate 10, but may be arranged side by side in the longitudinal direction of the substrate 10.
　なお、本発明は上述実施形態に限定されず、本発明の要旨を逸脱しない範囲で設計変更可能である。例えば、前記第１から前記第４実施形態のそれぞれの特徴点を様々に組み合わせてもよい。 It should be noted that the present invention is not limited to the above-described embodiment, and the design can be changed without departing from the gist of the present invention. For example, the feature points of the first to fourth embodiments may be variously combined.
　前記実施形態では、サーミスタ素子として、ＮＴＣサーミスタを用いたが、キュリー温度で電気抵抗が急上昇するという特性を有するＰＴＣサーミスタを用いてよい。 In the above embodiment, an NTC thermistor is used as the thermistor element. However, a PTC thermistor having a characteristic that the electrical resistance rapidly increases at the Curie temperature may be used.
　前記実施形態では、基材のサーミスタ素子と反対側の面を、筐体に接触させたが、サーミスタ素子を、筐体に接触させるようにしてもよい。 In the above embodiment, the surface of the base material opposite to the thermistor element is brought into contact with the housing, but the thermistor element may be brought into contact with the housing.
　前記実施形態では、弾性部材としての板バネに、折り返し部を設けたが、折り返し部を設けないようにしてもよい。また、弾性部材としての板バネの形状は、弾性を有していれば、如何なる形状であってもよい。 In the above embodiment, the folded portion is provided in the leaf spring as the elastic member, but the folded portion may not be provided. Further, the shape of the leaf spring as the elastic member may be any shape as long as it has elasticity.
　１，１Ａ，１Ｂ，１Ｃ　電子機器
　２　筐体
　３　回路基板
　４，４Ａ，４Ｂ，４Ｃ　温度検知装置
　５，５Ａ，５Ｂ，５Ｃ　温度検知部
　６，６Ｂ　弾性部材
　６ａ　第１接続部
　６ｂ　第２接続部
　６ｃ　折り返し部
　７　発熱部品
　８　接着部材
　１０，１０Ａ，１０Ｂ　基板
　１０ａ　第１接続部
　１０ｂ　第２接続部
　１０ｃ　折り返し部
　１１　第１配線
　１１ａ　第１端子
　１１ｂ　第２端子
　１２　第２配線
　１２ａ　第１端子
　１２ｂ　第２端子
　１５　基材
　１６　カバー部
　２０　サーミスタ素子
　２１　第１外部電極
　２２　第２外部電極
　２３　サーミスタ本体 1, 1A, 1B, 1C Electronic device 2 Housing 3 Circuit board 4, 4A, 4B, 4C Temperature detection device 5, 5A, 5B, 5C Temperature detection unit 6, 6B Elastic member 6a First connection unit 6b Second connection unit 6c Folding part 7 Heat-generating component 8 Adhesive member 10, 10A, 10B Substrate 10a First connecting part 10b Second connecting part 10c Folding part 11 First wiring 11a First terminal 11b Second terminal 12 Second wiring 12a First terminal 12b First 2 terminals 15 base material 16 cover portion 20 thermistor element 21 first external electrode 22 second external electrode 23 thermistor body

Claims (7)

  1. 　筐体の温度を検知する温度検知装置であって、
    　配線を含む基板と、前記基板に取り付けられて前記配線に電気的に接続されるサーミスタ素子とを有する温度検知部と、
    　前記温度検知部を弾性的に押圧し、前記温度検知部を前記筐体に弾性的に接触させて、前記サーミスタ素子により前記筐体の温度を検知させる弾性部材と
    を備えることを特徴とする温度検知装置。     A temperature detection device for detecting the temperature of the housing,
    A temperature detection unit including a substrate including wiring, and a thermistor element attached to the substrate and electrically connected to the wiring;
    An elastic member that elastically presses the temperature detection unit, elastically contacts the temperature detection unit with the case, and detects the temperature of the case with the thermistor element. Detection device.
  2. 　請求項１に記載の温度検知装置において、
    　前記弾性部材は、断熱性クッション材から構成され、
    　前記弾性部材は、前記基板に直交する方向からみて、前記温度検知部の前記サーミスタ素子に重なる領域を、弾性的に押圧することを特徴とする温度検知装置。     The temperature detection device according to claim 1,
    The elastic member is composed of a heat insulating cushion material,
    The temperature detecting device, wherein the elastic member elastically presses a region overlapping the thermistor element of the temperature detecting unit when viewed from a direction orthogonal to the substrate.
  3. 　請求項１に記載の温度検知装置において、
    　前記弾性部材は、導電性を有する板バネから構成され、
    　前記弾性部材は、前記基板の前記配線に離隔可能に接触して、前記基板の前記配線に電気的に接続されることを特徴とする温度検知装置。     The temperature detection device according to claim 1,
    The elastic member is composed of a conductive leaf spring,
    The temperature detecting device, wherein the elastic member is in contact with the wiring of the substrate in a separable manner and is electrically connected to the wiring of the substrate.
  4. 　請求項３に記載の温度検知装置において、
    　前記弾性部材の前記基板の前記配線に対する接触は、線接触または点接触であることを特徴とする温度検知装置。     In the temperature detection device according to claim 3,
    The temperature detection device according to claim 1, wherein the contact of the elastic member to the wiring of the substrate is a line contact or a point contact.
  5. 　請求項３または４に記載の温度検知装置において、
    　前記弾性部材は、
    　前記基板の前記配線に電気的に接続される第１接続部と、
    　前記回路基板の配線に電気的に接続される第２接続部と、
    　前記第１接続部と前記第２接続部との間で折り返される折り返し部と
    を備えることを特徴とする温度検知装置。     In the temperature detection device according to claim 3 or 4,
    The elastic member is
    A first connection portion electrically connected to the wiring of the substrate;
    A second connection portion electrically connected to the wiring of the circuit board;
    A temperature detection apparatus comprising: a folded portion that is folded between the first connection portion and the second connection portion.
  6. 　筐体と、
    　前記筐体内に配置される回路基板と、
    　前記筐体内に配置され前記筐体の温度を検知する請求項１から５の何れか一つに記載の温度検知装置と
    を備えることを特徴とする電子機器。     A housing,
    A circuit board disposed in the housing;
    An electronic apparatus comprising: the temperature detection device according to any one of claims 1 to 5 that is disposed in the housing and detects a temperature of the housing.
  7. 　筐体と、
    　前記筐体内に配置される回路基板と、
    　前記筐体内に配置され前記筐体の温度を検知する請求項３から５の何れか一つに記載の温度検知装置と
    を備え、
    　前記温度検知装置の前記温度検知部は、前記筐体に固定され、
    　前記温度検知装置の前記弾性部材は、前記回路基板に固定されることを特徴とする電子機器。     A housing,
    A circuit board disposed in the housing;
    The temperature detection device according to any one of claims 3 to 5, wherein the temperature detection device is disposed in the housing and detects the temperature of the housing.
    The temperature detection unit of the temperature detection device is fixed to the housing,
    The electronic device, wherein the elastic member of the temperature detection device is fixed to the circuit board.
PCT/JP2015/066504 2014-07-31 2015-06-08 Temperature detection device and electronic device WO2016017283A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-155958 2014-07-31
JP2014155958 2014-07-31

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019074327A (en) * 2017-10-12 2019-05-16 株式会社オートネットワーク技術研究所 Sensor unit and power storage module
CN113271748A (en) * 2020-02-14 2021-08-17 夏普株式会社 Electronic device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133333A (en) * 1999-08-20 2001-05-18 Murata Mfg Co Ltd Temperature sensor, method of mounting temperature sensor on board, temperature detector, and temperature detecting structure of matter to be measured
JP2011085425A (en) * 2009-10-13 2011-04-28 Tdk Corp Thermistor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133333A (en) * 1999-08-20 2001-05-18 Murata Mfg Co Ltd Temperature sensor, method of mounting temperature sensor on board, temperature detector, and temperature detecting structure of matter to be measured
JP2011085425A (en) * 2009-10-13 2011-04-28 Tdk Corp Thermistor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019074327A (en) * 2017-10-12 2019-05-16 株式会社オートネットワーク技術研究所 Sensor unit and power storage module
CN113271748A (en) * 2020-02-14 2021-08-17 夏普株式会社 Electronic device
JP2021128100A (en) * 2020-02-14 2021-09-02 シャープ株式会社 Electronic apparatus
JP7440289B2 (en) 2020-02-14 2024-02-28 シャープ株式会社 Electronics

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