WO2016017283A1 - Dispositif de détection de température et dispositif électronique - Google Patents

Dispositif de détection de température et dispositif électronique Download PDF

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Publication number
WO2016017283A1
WO2016017283A1 PCT/JP2015/066504 JP2015066504W WO2016017283A1 WO 2016017283 A1 WO2016017283 A1 WO 2016017283A1 JP 2015066504 W JP2015066504 W JP 2015066504W WO 2016017283 A1 WO2016017283 A1 WO 2016017283A1
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WO
WIPO (PCT)
Prior art keywords
temperature detection
housing
elastic member
wiring
substrate
Prior art date
Application number
PCT/JP2015/066504
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English (en)
Japanese (ja)
Inventor
三浦 忠将
和人 宮川
朗人 内藤
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株式会社村田製作所
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Filing date
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2016017283A1 publication Critical patent/WO2016017283A1/fr

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor

Definitions

  • the present invention relates to a temperature detection device and an electronic device.
  • the temperature detection device includes a substrate including wiring, and a thermistor element attached to the substrate and electrically connected to the wiring.
  • the substrate is formed in a band shape and has a first end and a second end in the longitudinal direction.
  • the thermistor element is fixed to the first end of the substrate.
  • the temperature detection device is used to detect the temperature of the casing of the electronic device.
  • substrate is arrange
  • the second end of the board is electrically connected to the circuit board.
  • the second end of the substrate is fixed to the circuit board of the electronic device without fixing the first end of the substrate to the housing.
  • the thermistor element is separated from the casing or the thermistor element is positioned at a predetermined position of the casing due to shaking of the casing. Not retained. Therefore, since the position of the thermistor element with respect to the housing becomes unstable, the temperature of the housing cannot be accurately detected.
  • an object of the present invention is to provide a temperature detection device and an electronic apparatus that can stabilize the position of the thermistor element with respect to the casing.
  • the temperature detection device of the present invention is A temperature detection device for detecting the temperature of the housing, A temperature detection unit including a substrate including wiring, and a thermistor element attached to the substrate and electrically connected to the wiring; And an elastic member that elastically presses the temperature detection unit, elastically contacts the temperature detection unit with the case, and detects the temperature of the case by the thermistor element.
  • the elastic member elastically presses the temperature detection unit and elastically contacts the temperature detection unit with the casing, so that the elastic member positions the thermistor element relative to the casing. It can be stabilized. For this reason, the thermistor element is not separated from the casing, and the thermistor element is held at a predetermined position of the casing. Therefore, the temperature of the housing can be detected with high accuracy.
  • the elastic member is composed of a heat insulating cushion material, The elastic member elastically presses a region overlapping the thermistor element of the temperature detection unit when viewed from a direction orthogonal to the substrate.
  • the elastic member is made of a heat insulating cushion material and elastically presses a region overlapping the thermistor element of the temperature detection unit.
  • a thermistor element is arrange
  • the elastic member is composed of a conductive leaf spring, The elastic member contacts the wiring of the substrate so as to be separable and is electrically connected to the wiring of the substrate.
  • the temperature detection unit since the elastic member contacts the wiring of the substrate in a separable manner, when the temperature detection device is mounted on an electronic device, the temperature detection unit is fixed to the housing, and the elastic member is It can be fixed to a circuit board of an electronic device.
  • the elastic member when disassembling the electronic device for parts replacement or repair, when the elastic member is removed from the housing together with the circuit board, the elastic member is in contact with the temperature detection unit so that the elastic member can be separated from the temperature detection unit. Can be easily separated. Thereafter, when the electronic device is reassembled, the elastic member can be easily brought into contact with the temperature detection unit by attaching the elastic member together with the circuit board to the housing. At this time, since the temperature detection unit is fixed to the casing, the position of the thermistor element can be held with respect to the casing, and the position adjustment of the thermistor element becomes unnecessary. Therefore, the assemblability when the temperature detection device is used in an electronic device is improved.
  • the contact of the elastic member to the wiring of the substrate is a line contact or a point contact.
  • the contact of the elastic member with the wiring of the substrate is a line contact or a point contact
  • the contact area of the elastic member with respect to the wiring is reduced, and heat conduction from the elastic member to the substrate is performed. Can be suppressed. Therefore, the temperature of the housing can be detected with higher accuracy.
  • the elastic member is A first connection portion electrically connected to the wiring of the substrate; A second connection portion electrically connected to the wiring of the circuit board; A folding portion that is folded between the first connection portion and the second connection portion;
  • the temperature detection device of the embodiment since the elastic member has the folded portion that is folded between the first connection portion and the second connection portion, the heat path from the second connection portion to the first connection portion is determined. Can be long. Thereby, the heat transmitted from the second connection portion to the first connection portion can be radiated from the folded portion. Therefore, the temperature of the housing can be detected with higher accuracy.
  • the electronic device of one embodiment is A housing, A circuit board disposed in the housing;
  • the temperature detection device is disposed in the casing and detects the temperature of the casing.
  • the position of the thermistor element with respect to the housing can be stabilized. Therefore, the temperature of the housing can be detected with high accuracy.
  • the electronic device of one embodiment is A housing, A circuit board disposed in the housing; The temperature detection device disposed in the housing and detecting the temperature of the housing; The temperature detection unit of the temperature detection device is fixed to the housing, The elastic member of the temperature detection device is fixed to the circuit board.
  • the temperature detection unit of the temperature detection device is fixed to the casing, and the elastic member of the temperature detection device is fixed to the circuit board.
  • the elastic member of the temperature detection device is fixed to the circuit board.
  • the elastic member elastically presses the temperature detection unit and elastically contacts the temperature detection unit with the casing, so that the position of the thermistor element with respect to the casing is stabilized. Can be made.
  • FIG. 1 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a first embodiment of the present invention. It is a perspective view of a temperature detection part. It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 2nd embodiment of the present invention. It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 3rd embodiment of the present invention. It is a perspective view of a temperature detection part. It is a perspective view of an elastic member. It is a perspective view of another elastic member. It is a simplified sectional view showing a temperature sensing device and electronic equipment of a 4th embodiment of the present invention.
  • FIG. 1 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a first embodiment of the present invention.
  • the electronic device 1 includes a housing 2, a circuit board 3 and a temperature detection device 4 disposed in the housing 2.
  • the electronic device 1 is a mobile device such as a smartphone, a tablet, or a notebook PC.
  • the housing 2 is a case formed in a rectangular parallelepiped shape, for example.
  • the case includes a case main body having an opening and a lid that covers the opening of the case main body.
  • a liquid crystal display is attached to the housing 2.
  • the circuit board 3 is mounted with an electronic component (hereinafter referred to as a heat generating component 7) having a large amount of heat, such as a CPU and a power amplifier.
  • a heat generating component 7 having a large amount of heat, such as a CPU and a power amplifier.
  • the housing 2 is heated by the heat from the heat generating component 7.
  • the temperature detection device 4 detects the temperature of the housing 2, and the control device of the electronic device 1 prevents, for example, the user from touching the high-temperature housing 2 based on the detection result of the temperature detection device 4. .
  • the temperature detection device 4 includes a temperature detection unit 5 and an elastic member 6.
  • the temperature detection unit 5 includes a substrate 10 and a thermistor element 20 attached to the substrate 10.
  • the elastic member 6 elastically presses the temperature detection unit 5, makes the temperature detection unit 5 elastically contact the case 2, and causes the thermistor element 20 to detect the temperature of the case 2.
  • FIG. 2 is a perspective view of the temperature detection unit 5.
  • the substrate 10 is a flexible printed circuit board.
  • the substrate 10 includes a base material 15, a first wiring 11 and a second wiring 12 disposed on the base material 15, and a cover portion 16 that covers a part of the first wiring 11 and the second wiring 12.
  • the base material 15 is formed in a strip shape.
  • the base material 15 has flexibility and electrical insulation.
  • the material of the base material 15 is, for example, polyimide or polyethylene terephthalate.
  • the first wiring 11 and the second wiring 12 each extend along the longitudinal direction of the base material 15.
  • the first wiring 11 and the second wiring 12 are arranged in parallel along the width direction of the base material 15.
  • the first wiring 11 and the second wiring 12 are formed of a conductive material.
  • the conductive material is, for example, a metal such as copper or an alloy of copper and nickel.
  • the first wiring 11 has a first terminal 11a and a second terminal 11b at both ends in the longitudinal direction.
  • the second wiring 12 has a first terminal 12a and a second terminal 12b at both ends in the longitudinal direction.
  • the first terminal 11 a of the first wiring 11 and the first terminal 12 a of the second wiring 12 are located on one end side in the longitudinal direction of the base material 15.
  • the second terminal 11 b of the first wiring 11 and the second terminal 12 b of the second wiring 12 are located on the other end side in the longitudinal direction of the base material 15.
  • the cover portion 16 covers a portion of the first wiring 11 excluding the first and second terminals 11a and 11b and a portion of the second wiring 12 excluding the first and second terminals 12a and 12b. That is, the first and second terminals 11 a and 11 b of the first wiring 11 and the first and second terminals 12 a and 12 b of the second wiring 12 are exposed from the cover portion 16.
  • the cover part 16 is formed of a resin film having electrical insulation.
  • the thermistor element 20 is, for example, a multilayer chip thermistor, and has a thermistor body 23, a first external electrode 21, and a second external electrode 22.
  • the thermistor body 23 includes a plurality of ceramic layers. A plurality of ceramic layers are laminated. An internal electrode is provided between adjacent ceramic layers.
  • the thermistor body 23 has a temperature characteristic in which the resistance value changes greatly with changes in ambient temperature.
  • the thermistor body 23 is, for example, an NTC thermistor whose resistance value decreases with increasing temperature.
  • An NTC thermistor is an oxide sintered body (ceramic sintered body) obtained by mixing and sintering two to four kinds of oxides selected from the group of transition elements such as manganese, nickel, iron, cobalt and copper. Can be made from The thermistor body 23 does not have to have an internal electrode.
  • the thermistor body 23 is formed in a substantially rectangular parallelepiped shape.
  • the thermistor body 23 has first and second end surfaces facing each other, and four side surfaces disposed between the first end surface and the second end surface.
  • the first and second external electrodes 21 and 22 are, for example, a base layer mainly composed of silver, a nickel plating layer formed on the base layer, and a tin plating layer formed on the nickel plating layer. Including.
  • the first external electrode 21 covers the first end face of the thermistor body 23. Specifically, the first external electrode 21 covers the first end face side of the four side surfaces of the thermistor body 23 in addition to the entire region of the first end face of the thermistor body 23.
  • the second external electrode 22 covers the second end face of the thermistor body 23. Specifically, the second external electrode 22 covers the second end face side of the four side surfaces of the thermistor body 23 in addition to the entire area of the second end face of the thermistor body 23.
  • the thermistor element 20 is electrically connected to the first and second wirings 11 and 12 of the substrate 10. More specifically, the first external electrode 21 of the thermistor element 20 is joined to the second terminal 11b of the first wiring 11 via solder. The second external electrode 22 of the thermistor element 20 is joined to the second terminal 12b of the second wiring 12 via solder.
  • the substrate 10 of the temperature detector 5 is electrically connected to the circuit substrate 3. More specifically, the first terminal 11a of the first wiring 11 is joined to the wiring of the circuit board 3 via solder. The 1st terminal 12a of the 2nd wiring 12 is joined to the wiring of circuit board 3 via solder.
  • the temperature detector 5 contacts the housing 2. Specifically, the surface of the substrate 15 opposite to the thermistor element 20 is in contact with the housing 2. The thermistor element 20 detects the heat of the housing 2 through the substrate 10.
  • the elastic member 6 is composed of a heat insulating cushion material.
  • the heat insulating cushion material is made of, for example, a foamable resin material such as foamed polyurethane, or a rubber material.
  • the elastic member 6 is formed in a substantially rectangular parallelepiped shape.
  • the elastic member 6 elastically presses the region overlapping the thermistor element 20 of the temperature detection unit 5 when viewed from the direction orthogonal to the substrate 10. More specifically, the elastic member 6 is disposed on the heat generating component 7 and directly presses the thermistor element 20. At this time, the elastic member 6 is elastically deformed and presses the thermistor element 20.
  • the operation of the temperature detection device 4 will be described.
  • the housing 2 is heated by the heat from the heat generating component 7. Since the substrate 10 is in contact with the housing 2, the thermistor element 20 detects the temperature of the housing 2 through the substrate 10. Based on the detection result (current change) of the thermistor element 20, the control device moves the fan and cools the housing 2 and the heat generating component 7. Since the elastic member 6 is located between the thermistor element 20 and the heat generating component 7, the heat from the heat generating component 7 is not easily transmitted directly to the thermistor element 20. For this reason, the thermistor element 20 can accurately detect the heat of the housing 2.
  • the end of the substrate 10 opposite to the thermistor element 20 is fixed to the circuit board 3.
  • the elastic member 6 is disposed between the end of the substrate 10 on the thermistor element 20 side and the heat generating component 7 on the circuit board 3.
  • the elastic member 6 is bonded to the heat generating component 7, and the thermistor element 20 is bonded to the elastic member 6.
  • the temperature detection device 4 is attached to the circuit board 3.
  • the temperature detection device 4 is attached to the housing 2 together with the circuit board 3 to assemble the electronic device 1.
  • the elastic member 6, the heat generating component 7, and the thermistor element 20 may not be bonded to each other.
  • the elastic member 6 elastically presses the temperature detection unit 5 and elastically contacts the temperature detection unit 5 with the housing 2.
  • the position of the thermistor element 20 can be stabilized. For this reason, even if vibration such as shaking occurs in the housing 2, the thermistor element 20 is not separated from the housing 2, and the thermistor element 20 is held at a predetermined position of the housing 2. Therefore, the temperature of the housing 2 can be detected with high accuracy.
  • the elastic member 6 is made of a heat insulating cushion material and elastically presses a region overlapping the thermistor element 20 of the temperature detection unit 5. Thereby, the thermistor element 20 is disposed between the housing 2 and the elastic member 6. Therefore, the elastic member 6 can press the thermistor element 20 directly against the housing 2, and can further stabilize the position of the thermistor element 20 with respect to the housing 2.
  • the position of the thermistor element 20 with respect to the housing 2 can be stabilized. Therefore, the temperature of the housing 2 can be detected with high accuracy.
  • FIG. 3 is a simplified cross-sectional view illustrating a temperature detection device and an electronic apparatus according to a second embodiment of the present invention.
  • the second embodiment is different from the first embodiment only in the configuration of the substrate. Only this different configuration will be described below. Note that in the second embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the substrate 10 ⁇ / b> A of the temperature detection unit 5 ⁇ / b> A is electrically connected to the first connection unit 10 a electrically connected to the thermistor element 20 and the wiring of the circuit board 3.
  • the constituent members of the substrate 10A are the same as the constituent members of the substrate 10 of the first embodiment shown in FIG.
  • the first connection portion 10a of the substrate 10A includes a second terminal 11b of the first wiring 11 and a second terminal 12b of the second wiring 12 shown in FIG.
  • the second connection portion 10b of the substrate 10A includes a first terminal 11a of the first wiring 11 and a first terminal 12a of the second wiring 12 shown in FIG.
  • the folded portion 10c is a portion between the first connection portion 10a and the second connection portion 10b, and is formed in a substantially U shape.
  • the folded portion 10 c extends in the substantially planar direction of the circuit board 3.
  • the length of the folded portion 10 c in the longitudinal direction is longer than the distance between the housing 2 and the circuit board 3.
  • returning part 10c may be formed in the shape of a bow, V shape, etc.
  • the substrate 10A has the folded portion 10c between the first connection portion 10a and the second connection portion 10b, so that the heat path from the second connection portion 10b to the first connection portion 10a. Can be lengthened.
  • the heat transmitted from the 2nd connection part 10b to the 1st connection part 10a can be thermally radiated from the folding
  • the cross-sectional areas of the first and second wirings 11 and 12 of the substrate 10A may be reduced while increasing the length of the substrate 10A or instead of increasing the length of the substrate 10A.
  • the widths of the first and second wirings 11 and 12 are reduced, and the thicknesses of the first and second wirings 11 and 12 are reduced.
  • FIG. 4 is a simplified cross-sectional view showing a temperature detection device and an electronic apparatus according to a third embodiment of the present invention.
  • the third embodiment is different from the first embodiment only in the configuration of the temperature detection device. Only this different configuration will be described below. Note that, in the third embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the temperature detection device 4B of the electronic apparatus 1B includes a temperature detection unit 5B and two elastic members 6B.
  • the temperature detection unit 5B includes a substrate 10B and a thermistor element 20 attached to the substrate 10B.
  • the elastic member 6 ⁇ / b> B elastically presses the temperature detection unit 5 ⁇ / b> B, makes the temperature detection unit 5 ⁇ / b> B elastically contact the case 2, and causes the thermistor element 20 to detect the temperature of the case 2.
  • FIG. 5 is a perspective view of the temperature detector 5B.
  • the substrate 10B is a flexible printed circuit board.
  • the substrate 10 ⁇ / b> B includes a base material 15, first wirings 11 and second wirings 12 disposed on the base material 15, and two cover portions 16 that cover parts of the first wirings 11 and the second wirings 12. .
  • the base material 15 is formed in a strip shape.
  • the base material 15 has flexibility and electrical insulation.
  • the material of the base material 15 is, for example, polyimide or polyethylene terephthalate.
  • the first wiring 11 and the second wiring 12 each extend along the longitudinal direction of the base material 15.
  • the first wiring 11 and the second wiring 12 are arranged in series along the longitudinal direction of the base material 15.
  • the first wiring 11 and the second wiring 12 are formed of a conductive material.
  • the conductive material is, for example, a metal such as copper or an alloy of copper and nickel.
  • the first wiring 11 has a first terminal 11a and a second terminal 11b at both ends in the longitudinal direction.
  • the second wiring 12 has a first terminal 12a and a second terminal 12b at both ends in the longitudinal direction.
  • the first terminal 11 a of the first wiring 11 is located on one end side in the longitudinal direction of the base material 15.
  • the first terminal 12 a of the second wiring 12 is located on the other end side in the longitudinal direction of the base material 15.
  • the 2nd terminal 11b of the 1st wiring 11 and the 2nd terminal 12b of the 2nd wiring 12 are arrange
  • One cover portion 16 covers a portion of the first wiring 11 excluding the first and second terminals 11a and 11b.
  • the other cover portion 16 covers a portion of the second wiring 12 excluding the first and second terminals 12a and 12b. That is, the first and second terminals 11 a and 11 b of the first wiring 11 and the first and second terminals 12 a and 12 b of the second wiring 12 are exposed from the cover portion 16.
  • the cover part 16 is formed of a resin film having electrical insulation.
  • the thermistor element 20 has a thermistor body 23, a first external electrode 21, and a second external electrode 22. Since the thermistor element 20 has the same configuration as the thermistor element 20 of the first embodiment, a detailed description thereof is omitted.
  • the thermistor element 20 is electrically connected to the first and second wirings 11 and 12 of the substrate 10B. More specifically, the first external electrode 21 of the thermistor element 20 is joined to the second terminal 11b of the first wiring 11 via solder. The second external electrode 22 of the thermistor element 20 is joined to the second terminal 12b of the second wiring 12 via solder. The thermistor element 20 is attached to the central portion in the longitudinal direction of the substrate 10B.
  • FIG. 6 is a perspective view of the elastic member 6B.
  • the elastic member 6 ⁇ / b> B is composed of a conductive leaf spring.
  • the material of the elastic member 6B is, for example, a metal such as copper or an alloy of copper and nickel.
  • the elastic member 6B is formed by bending a band-shaped metal plate.
  • the elastic member 6B includes a first connection portion 6a that is electrically connected to the wiring of the substrate 10B, a second connection portion 6b that is electrically connected to the wiring of the circuit board 3, a first connection portion 6a, and a second connection portion. And a folded portion 6c that is folded between the connecting portion 6b.
  • the first connection portion 6a is formed in a curved shape.
  • the 2nd connection part 6b is formed in flat form.
  • the folded portion 6c is a portion between the first connection portion 6a and the second connection portion 6b, and is formed in a substantially U shape.
  • the folded portion 6 c extends in a substantially planar direction of the circuit board 3.
  • the length of the folded portion 6 c in the longitudinal direction is longer than the distance between the housing 2 and the circuit board 3.
  • returning part 6c may be formed in the shape of a bow, V shape, etc.
  • the temperature detection unit 5B is fixed to the housing 2. Specifically, the surface of the substrate 15 opposite to the thermistor element 20 is fixed to the housing 2 via the adhesive member 8.
  • the adhesive member 8 is, for example, a double-sided tape and has thermal conductivity.
  • the adhesive member 8 is disposed so as to overlap the thermistor element 20 when viewed from the direction orthogonal to the base material 15.
  • the thermistor element 20 detects the heat of the housing 2 via the adhesive member 8 and the substrate 10B.
  • the thermistor element 20 is located immediately above the heat generating component 7 with a gap between the thermistor element 20 and the heat generating component 7. Since the thermistor element 20 has a gap with the heat generating component 7, the thermistor element 20 is thermally insulated from the heat generating component 7.
  • the elastic member 6B is fixed to the circuit board 3. Specifically, the second connection portion 6b of the elastic member 6B is joined to the wiring of the circuit board 3 via solder.
  • the two elastic members 6B are disposed so as to sandwich the heat generating component 7 therebetween.
  • the two elastic members 6B are arranged symmetrically with respect to the heat generating component 7.
  • the two elastic members 6B are in contact with the wirings 11 and 12 of the substrate 10B so as to be separated from each other, and are electrically connected to the wirings 11 and 12 of the substrate 10B.
  • the two elastic members 6B support both ends of the substrate 10B in the longitudinal direction.
  • the first connecting portion 6a of one elastic member 6B is in contact with the first terminal 11a of the first wiring 11 of the substrate 10B so as to be separated.
  • the first connection portion 6a of the other elastic member 6B is in contact with the first terminal 12a of the second wiring 12 of the substrate 10B so as to be separable.
  • the thermistor element 20 is electrically connected to the wiring of the circuit board 3 via the wirings 11 and 12 of the substrate 10B and the elastic member 6B.
  • the contact of the elastic member 6B to the wirings 11 and 12 of the substrate 10B is a line contact. That is, since the upper surface of the first connection portion 6a of the elastic member 6B is a curved surface, the contact surfaces of the upper surface of the first connection portion 6a with respect to the wirings 11 and 12 are linear.
  • the line contact means a general line contact and refers to a contact state when a bending surface formed by bending a belt-shaped member in the longitudinal direction contacts a flat surface. Therefore, the contact area of the elastic member 6B with respect to the wirings 11 and 12 can be reduced, and heat conduction from the elastic member 6B to the substrate 10B can be suppressed.
  • the contact of the elastic member 6B with respect to the wirings 11 and 12 of the substrate 10B may be point contact.
  • the convex part 6d is provided in the 1st connection part 6a of the elastic member 6B.
  • the convex portion 6d is formed by pressing from the back surface of the first connecting portion 6a with a punch or the like.
  • the convex portion 6d is not limited to a dot shape, and may be formed in an elongated shape extending from the first connection portion 6a to the second connection portion 6b.
  • the point contact means a general point contact, and refers to a contact state when a bent surface formed by bending a belt-shaped member at least in the longitudinal direction and the width direction contacts a flat surface.
  • the elastic member 6B contacts the wirings 11 and 12 of the substrate 10B so as to be separable. Therefore, when the temperature detection device 4B is mounted on the electronic device 1B, the temperature detection unit 5B is mounted on the housing 2.
  • the elastic member 6B can be fixed to the circuit board 3 of the electronic device 1B.
  • the elastic member 6B When the electronic device 1B is disassembled for parts replacement or repair, when the elastic member 6B is removed from the housing 2 together with the circuit board 3, the elastic member 6B is in contact with the temperature detection unit 5B so as to be separable. The member 6B can be easily separated from the temperature detection unit 5B. Thereafter, when the electronic device 1B is reassembled, the elastic member 6B can be easily brought into contact with the temperature detection unit 5B by attaching the elastic member 6B together with the circuit board 3 to the housing 2. At this time, since the temperature detection unit 5B is fixed to the casing 2, the position of the thermistor element 20 with respect to the casing 2 can be held, and the position adjustment of the thermistor element 20 becomes unnecessary. Therefore, the assemblability when the temperature detection device 4B is used in the electronic apparatus 1B is improved.
  • the elastic member 6B since the elastic member 6B has the folded portion 6c that is folded between the first connecting portion 6a and the second connecting portion 6b, the heat path from the second connecting portion 6b to the first connecting portion 6a is lengthened. Can do. Thereby, the heat transmitted from the 2nd connection part 6b to the 1st connection part 6a can be thermally radiated from the folding
  • FIG. 8 is a simplified cross-sectional view showing a temperature detection device and an electronic apparatus according to a fourth embodiment of the present invention.
  • the fourth embodiment is different from the third embodiment only in the configuration of the substrate and the arrangement of the elastic members. Only this different configuration will be described below. Note that in the fourth embodiment, identical parts to those of the third embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the substrate 10 of the temperature detection unit 5C is the same as the substrate 10 of the first embodiment shown in FIG. That is, as shown in FIGS. 2 and 8, the thermistor element 20 is located on one end side in the longitudinal direction of the base material 15. The first terminal 11 a of the first wiring 11 and the first terminal 12 a of the second wiring 12 are located on the other end side in the longitudinal direction of the base material 15. The surface of the substrate 15 opposite to the thermistor element 20 is fixed to the housing 2 via the adhesive member 8. The thermistor element 20 detects the heat of the housing 2 via the adhesive member 8 and the substrate 10. The thermistor element 20 is located immediately above the heat generating component 7.
  • the elastic member 6B is the same as the elastic member 6B of the third embodiment shown in FIG.
  • the two elastic members 6B support one end of the substrate 10 in the longitudinal direction.
  • the two elastic members 6B are arranged side by side in the width direction of the substrate 10 (direction perpendicular to the paper surface of FIG. 8).
  • the two elastic members 6B are in contact with the wirings 11 and 12 of the substrate 10 so as to be separated from each other, and are electrically connected to the wirings 11 and 12 of the substrate 10. Specifically, the first connection portion 6a of one elastic member 6B is in contact with the first terminal 11a of the first wiring 11 of the substrate 10 so as to be separated. The first connecting portion 6a of the other elastic member 6B is in contact with the first terminal 12a of the second wiring 12 of the substrate 10 so as to be separable.
  • the temperature detecting device 4C and the electronic device 1C have the same operational effects as those of the third embodiment.
  • the two elastic members 6B are arranged side by side in the width direction of the substrate 10, but may be arranged side by side in the longitudinal direction of the substrate 10.
  • the present invention is not limited to the above-described embodiment, and the design can be changed without departing from the gist of the present invention.
  • the feature points of the first to fourth embodiments may be variously combined.
  • an NTC thermistor is used as the thermistor element.
  • a PTC thermistor having a characteristic that the electrical resistance rapidly increases at the Curie temperature may be used.
  • the surface of the base material opposite to the thermistor element is brought into contact with the housing, but the thermistor element may be brought into contact with the housing.
  • the folded portion is provided in the leaf spring as the elastic member, but the folded portion may not be provided.
  • the shape of the leaf spring as the elastic member may be any shape as long as it has elasticity.

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  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Selon la présente invention, un élément élastique appuie sur une unité de détection de température de manière élastique, amenant l'unité de détection de température en contact avec un boîtier de manière élastique. De ce fait, l'élément élastique permet de stabiliser la position d'un élément de thermistance par rapport au boîtier. Par conséquent, même lorsqu'une vibration telle qu'un tremblement se produit dans le boîtier, l'élément de thermistance ne se sépare pas du boîtier, et l'élément de thermistance est maintenu en une position prescrite sur le boîtier.
PCT/JP2015/066504 2014-07-31 2015-06-08 Dispositif de détection de température et dispositif électronique WO2016017283A1 (fr)

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JP2014155958 2014-07-31

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019074327A (ja) * 2017-10-12 2019-05-16 株式会社オートネットワーク技術研究所 センサユニットおよび蓄電モジュール
CN113271748A (zh) * 2020-02-14 2021-08-17 夏普株式会社 电子设备

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Publication number Priority date Publication date Assignee Title
JP2001133333A (ja) * 1999-08-20 2001-05-18 Murata Mfg Co Ltd 温度センサ、温度センサの基板への装着方法、および温度検出装置、ならびに被測定物の温度検出構造
JP2011085425A (ja) * 2009-10-13 2011-04-28 Tdk Corp サーミスタ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133333A (ja) * 1999-08-20 2001-05-18 Murata Mfg Co Ltd 温度センサ、温度センサの基板への装着方法、および温度検出装置、ならびに被測定物の温度検出構造
JP2011085425A (ja) * 2009-10-13 2011-04-28 Tdk Corp サーミスタ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019074327A (ja) * 2017-10-12 2019-05-16 株式会社オートネットワーク技術研究所 センサユニットおよび蓄電モジュール
CN113271748A (zh) * 2020-02-14 2021-08-17 夏普株式会社 电子设备
JP2021128100A (ja) * 2020-02-14 2021-09-02 シャープ株式会社 電子機器
JP7440289B2 (ja) 2020-02-14 2024-02-28 シャープ株式会社 電子機器

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