JP2001133333A - Temperature sensor, method of mounting temperature sensor on board, temperature detector, and temperature detecting structure of matter to be measured - Google Patents
Temperature sensor, method of mounting temperature sensor on board, temperature detector, and temperature detecting structure of matter to be measuredInfo
- Publication number
- JP2001133333A JP2001133333A JP2000248871A JP2000248871A JP2001133333A JP 2001133333 A JP2001133333 A JP 2001133333A JP 2000248871 A JP2000248871 A JP 2000248871A JP 2000248871 A JP2000248871 A JP 2000248871A JP 2001133333 A JP2001133333 A JP 2001133333A
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- Japan
- Prior art keywords
- temperature sensor
- temperature
- lead wire
- circuit board
- sensor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Measuring Temperature Or Quantity Of Heat (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、リード線を備え
た温度センサに関し、特に温度検知用のサーミスタに関
するものである。The present invention relates to a temperature sensor having a lead wire, and more particularly to a thermistor for detecting a temperature.
【０００２】[0002]
【従来の技術】リード線を備えた温度センサは、例え
ば、温度検出素子に負特性サーミスタ素子が用いられ、
マザーボードに搭載されるＣＰＵの発熱温度を検知する
用途に使用される。2. Description of the Related Art A temperature sensor having a lead wire uses, for example, a negative temperature coefficient thermistor element as a temperature detecting element.
It is used for detecting the heat generation temperature of a CPU mounted on a motherboard.
【０００３】温度センサは、正確に温度検知するため
に、被測定物に接触させて用いることがあり、本出願人
は、特願平１１−１０２９６５号において、温度センサ
のリード線にバネ性を有する材質を用いることで、負特
性サーミスタ素子とＣＰＵとの接触を確実にした発明を
提示している。[0003] In order to accurately detect temperature, a temperature sensor may be used in contact with an object to be measured. In Japanese Patent Application No. 11-102965, the present applicant discloses that a lead wire of a temperature sensor has a spring property. An invention has been proposed in which a material having the above characteristics ensures contact between the negative characteristic thermistor element and the CPU.
【０００４】図６は、上記発明の概略図であり、ＣＰＵ
１の発熱温度を検知するために、温度センサ２をＣＰＵ
１に弾性接触させたことを示している。図中の３は、プ
リント基板４とＣＰＵ１を接続するソケットを示す。FIG. 6 is a schematic diagram of the above-mentioned invention, in which a CPU
In order to detect the heat generation temperature of the temperature sensor 1, the temperature sensor 2 is connected to the CPU.
1 shows that the elastic member 1 was brought into elastic contact. Reference numeral 3 in the figure denotes a socket for connecting the printed board 4 and the CPU 1.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、リード
線５、６をプリント基板４のスルーホール４ａに垂直に
挿入し、はんだ８などで固定して、温度センサ２をプリ
ント基板４に対して垂直に搭載した後、上部からＣＰＵ
１を当接すると、図７（ａ）に示すように、リード線
５、６が所定方向と異なる向きに撓んだり、図７（ｂ）
に示すように、ＣＰＵ１挿入時の真上からの押圧によ
り、リード線５、６や負特性サーミスタ素子７が圧壊さ
れるという問題があった。However, the lead wires 5 and 6 are inserted vertically into the through holes 4a of the printed circuit board 4 and fixed with solder 8 or the like. After mounting, CPU from top
7, the lead wires 5, 6 bend in a direction different from the predetermined direction, as shown in FIG.
As shown in (1), there is a problem that the lead wires 5, 6 and the negative characteristic thermistor element 7 are crushed by pressing from directly above when the CPU 1 is inserted.
【０００６】この発明の目的は、リード線が所定方向に
撓んで温度検出素子と被測定物とが確実に接触する、正
確な温度検知が可能な温度センサおよび温度センサの基
板への装着方法を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a temperature sensor capable of accurately detecting a temperature, and a method of mounting the temperature sensor on a substrate, in which a lead wire bends in a predetermined direction and a temperature detection element and an object to be measured surely contact each other. To provide.
【０００７】[0007]
【課題を解決するための手段】この第１の発明の温度セ
ンサは、温度検出素子に形成された電極にバネ性を有す
るリード線の一端が取り付けられており、前記リード線
は、他端近傍に成形部部を有することを特徴とする。In the temperature sensor of the first invention, one end of a lead wire having a spring property is attached to an electrode formed on the temperature detecting element, and the lead wire is provided near the other end. A molded part.
【０００８】この第２の発明の温度センサは、前記成形
部がキンク部であり、このキンク部が、複数のリード線
において、同一方向に略半円弧状に湾曲していることを
特徴とする。The temperature sensor according to the second invention is characterized in that the molded portion is a kink portion, and the kink portion is curved in a substantially semicircular arc in the same direction on a plurality of lead wires. .
【０００９】この第３の発明の温度センサは、前記成形
部が屈曲部であり、この屈曲部は、複数のリード線が同
一方向に屈曲してなることを特徴とする。The temperature sensor according to the third invention is characterized in that the molded portion is a bent portion, and the bent portion is formed by bending a plurality of lead wires in the same direction.
【００１０】この第４の発明の温度センサは、前記成形
部が、前記屈曲部にさらにキンク部を有することを特徴
とする。[0010] The temperature sensor according to a fourth aspect of the present invention is characterized in that the molded portion has a kink portion at the bent portion.
【００１１】この第５の発明の温度センサは、複数の前
記リード線の間隔が、前記温度検出素子に形成された電
極に取り付けられた一端から他端にかけて、次第に広が
っていることを特徴とする。The temperature sensor according to a fifth aspect of the present invention is characterized in that the interval between the plurality of lead wires gradually increases from one end attached to an electrode formed on the temperature detecting element to the other end. .
【００１２】この第６の発明の温度センサは、前記リー
ド線が、リン青銅、洋白、ベリリウム、ＳＵＳ、Ｃｕ−
Ｔｉ合金、真鍮またはこれらにめっきを施したものなど
からなることを特徴する。In the temperature sensor according to the sixth aspect of the present invention, the lead wire may be made of phosphor bronze, nickel silver, beryllium, SUS, Cu-
It is characterized by being made of a Ti alloy, brass, or a plated version thereof.
【００１３】この第７の発明の温度センサは、前記温度
検出素子および前記リード線が絶縁被覆されていること
を特徴とする。[0013] A temperature sensor according to a seventh aspect of the invention is characterized in that the temperature detecting element and the lead wire are insulated.
【００１４】この第８の発明の温度センサは、前記温度
検出素子が、負特性サーミスタ素子であることを特徴と
する。The temperature sensor according to an eighth aspect of the present invention is characterized in that the temperature detecting element is a negative characteristic thermistor element.
【００１５】この第９の発明の温度センサの基板への装
着方法は、第１から第８の発明の温度センサを準備し、
前記温度センサのリード線を回路基板に形成されたスル
ーホールに挿入し、リード線の成形部をスルーホールに
係止させることにより、リード線の温度検出素子を前記
基板に対して斜めに自立させることを特徴とする。According to a ninth aspect of the present invention, there is provided a method of mounting a temperature sensor on a substrate, comprising preparing the temperature sensors of the first to eighth aspects,
The lead wire of the temperature sensor is inserted into a through-hole formed in the circuit board, and the molded part of the lead wire is locked in the through-hole, so that the temperature detecting element of the lead wire becomes self-supporting obliquely with respect to the board. It is characterized by the following.
【００１６】この第１０の発明の温度検出装置は、請求
項１から請求項８のいずれかに記載の温度センサと、前
記温度センサを装着した回路基板とからなることを特徴
とする。According to a tenth aspect of the present invention, there is provided a temperature detecting device comprising the temperature sensor according to any one of the first to eighth aspects and a circuit board on which the temperature sensor is mounted.
【００１７】この第１１の発明の被温度検出物の温度検
出構造は、回路基板と、前記回路基板に装着された請求
項１から請求項８に記載の温度センサと、前記回路基板
の上方に一定の間隔を設けて配置され、前記温度センサ
の温度検出素子と接触する被温度検出物とからなる、被
温度検出物の温度検出構造であって、前記温度センサ
は、前記リード線の成形部が前記スルーホールに係止す
ることによって前記基板に対して斜めに自立しており、
かつ前記温度センサのリード線は、前記回路基板に形成
されたスルーホールに挿入されて、前記被温度検出物か
ら前記温度検出素子にかかる応力によって撓んでいるこ
とを特徴とする。According to the eleventh aspect of the present invention, there is provided a temperature detecting structure for an object to be detected, comprising: a circuit board; a temperature sensor according to any one of claims 1 to 8 mounted on the circuit board; A temperature detection structure for the temperature-detected object, which is arranged at a fixed interval and comprises a temperature-detected object in contact with a temperature detecting element of the temperature sensor, wherein the temperature sensor includes a molding part of the lead wire. Are self-supporting obliquely with respect to the substrate by being locked in the through holes,
Further, the lead wire of the temperature sensor is inserted into a through hole formed in the circuit board, and is bent by a stress applied to the temperature detection element from the temperature detection target.
【００１８】これにより、温度検出素子の真上から被測
定物によって押圧しても、リード線がバネ性により所定
方向にスムーズに撓み、温度検出素子やリード線が圧壊
することなく、温度検出素子が被測定物と確実に接触す
る。Accordingly, even when the object to be measured is pressed from directly above the temperature detecting element, the lead wire smoothly bends in a predetermined direction due to the spring property, so that the temperature detecting element and the lead wire are not crushed. Makes sure contact with the object to be measured.
【００１９】[0019]
【発明の実施の形態】この発明の一つの実施の形態につ
いて図１を参照して説明する。なお、ここでは、温度検
出素子に負特性サーミスタ素子を用いて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG. Here, a description will be given using a negative temperature coefficient thermistor element as the temperature detection element.
【００２０】図１に示す温度センサ１１は、対向する表
面に一対の端子電極１３、１４が形成された温度検出素
子である負特性サーミスタ素子１２と、一端が端子電極
１３、１４に半田（図示せず）などで取り付けられたリ
ード線１５、１６と、負特性サーミスタ素子１２を絶縁
被覆する第１の外装樹脂１７ａと、他端を除いてリード
線１５、１６を絶縁被覆する第２の外装樹脂１７ｂと、
から構成される。リード線１５、１６の他端近傍は同一
方向に略半円弧状に湾曲され、キンク部１５ａ、１６ａ
が形成されている。The temperature sensor 11 shown in FIG. 1 has a negative characteristic thermistor element 12 as a temperature detecting element having a pair of terminal electrodes 13 and 14 formed on opposing surfaces, and one end soldered to the terminal electrodes 13 and 14. (Not shown), a first exterior resin 17a for insulatingly covering the negative characteristic thermistor element 12, and a second exterior for insulatingly covering the leads 15, 16 except for the other end. A resin 17b;
Consists of The vicinity of the other ends of the lead wires 15 and 16 is curved in a substantially semicircular arc in the same direction, and the kink portions 15a and 16a
Are formed.
【００２１】負特性サーミスタ素子１２は、チップ状の
負特性サーミスタ素体の両主面に、Ａｇ，Ｃｕ，Ａｕ，
Ｐｔまたはそれらを含む合金からなる端子電極１３、１
４を形成したものである。負特性サーミスタ素体は、チ
ップ状に限らず、円板などの板状であってもよい。The negative-characteristic thermistor element 12 is composed of Ag, Cu, Au,
Terminal electrodes 13, 1 made of Pt or an alloy containing them
4 is formed. The negative characteristic thermistor body is not limited to a chip shape, but may be a plate shape such as a disk.
【００２２】リード線１５、１６は、材質がリン青銅
（硬度：１／２Ｈ）で、断面が直径０．４ｍｍの円形で
あり、キンク部１５ａ、１６ａは、リード線１５、１６
の他端近傍を内半径０．７ｍｍの曲率で略半円弧状に湾
曲させたものである。リード線１５、１６は、リン青銅
の他、洋白、ベリリウム、ＳＵＳ、Ｃｕ−Ｔｉ合金、真
鍮またはこれらにめっきを施したものなど、銅被覆硬銅
線、銅被覆硬鋼線に比べてバネ性を有する材質であれば
よい。The lead wires 15 and 16 are made of phosphor bronze (hardness: 1/2 H) and have a circular cross section of 0.4 mm in diameter. The kink portions 15a and 16a are formed of lead wires 15 and 16 respectively.
Is curved in a substantially semicircular shape with a curvature having an inner radius of 0.7 mm. The lead wires 15 and 16 may be made of a material other than phosphor bronze, such as nickel silver, beryllium, SUS, Cu-Ti alloy, brass, or a material obtained by plating them. Any material having properties can be used.
【００２３】第１の外装樹脂１７ａは、負特性サーミス
タ素子１２を外部環境から保護し、かつ絶縁性を保持す
ることを目的としており、例えば絶縁性と耐熱性を有す
る強度の優れたエポキシ系樹脂、フェノール系樹脂など
からなる。The first exterior resin 17a is for protecting the negative temperature coefficient thermistor element 12 from the external environment and maintaining insulation properties. For example, an epoxy resin having excellent insulation and heat resistance and excellent strength is used. And a phenolic resin.
【００２４】第２の外装樹脂１７ｂは、絶縁性に加え、
リード線１５、１６のバネ性に対応する可撓性を有する
ものであり、例えばポリエステル系樹脂からなることが
好ましい。第２の外装樹脂１７ｂは、リード線１５、１
６のスルーホール４ａへの挿入や、プリント基板４への
はんだ付け性を損なわないよう、キンク部１５ａ、１６
ａの一端側にのみ形成される。The second exterior resin 17b has an insulating property,
The lead wires 15 and 16 have flexibility corresponding to the spring property, and are preferably made of, for example, a polyester resin. The second exterior resin 17b includes the lead wires 15, 1
The kink portions 15a, 16 are inserted into the through-holes 4a and solderability of the printed circuit board 4 is not impaired.
a is formed only on one end side.
【００２５】なお、第１の外装樹脂１７ａ、第２の外装
樹脂１７ｂは、同一樹脂であってもよく、この場合、ポ
リエステル系樹脂、またはシリコン系樹脂などが用いら
れる。さらに、リード線１５、１６の絶縁被覆について
は、絶縁チューブを用いても同様の効果がある。The first exterior resin 17a and the second exterior resin 17b may be the same resin. In this case, a polyester resin or a silicon resin is used. Further, as for the insulating coating of the lead wires 15 and 16, the same effect can be obtained by using an insulating tube.
【００２６】このような温度センサ１１を、従来例と同
様に、ＣＰＵ１の発熱温度を検知するために、プリント
基板４に装着した後、ＣＰＵ１に接触させる。このと
き、リード線１５、１６のキンク部１５ａ、１６ａの一
端側の長さは、負特性サーミスタ素子１２とＣＰＵ１と
を弾性接触させるため、温度センサ１１を装着するプリ
ント基板４からＣＰＵ１までの垂直な直線距離よりも長
くしておく。なお、プリント基板４の厚みは１．６ｍ
ｍ、スルーホール４ａの直径は１ｍｍである。The temperature sensor 11 is mounted on the printed circuit board 4 and then brought into contact with the CPU 1 in order to detect the heat generation temperature of the CPU 1 as in the conventional example. At this time, the length of one end side of the kink portions 15a, 16a of the lead wires 15, 16 is set to be vertical from the printed circuit board 4 on which the temperature sensor 11 is mounted to the CPU 1 in order to make the negative characteristic thermistor element 12 and the CPU 1 elastically contact. Longer than the straight line distance. The thickness of the printed circuit board 4 is 1.6 m.
m, the diameter of the through hole 4a is 1 mm.
【００２７】まず、温度センサ１１のリード線１５、１
６を他端からプリント基板４のスルーホール４ａに垂直
に挿入すると、キンク部１５ａ、１６ａの略半円弧状の
湾曲部がプリント基板４上面でつかえる。そこで、リー
ド線１５、１６を前記湾曲部と反対方向に斜めに倒す
と、スルーホール４ａ内に湾曲部が途中まで挿入され、
湾曲部下端がスルーホール４ａ内壁につかえる。このと
き、リード線１５、１６の他端側の一点は、スルーホー
ル４ａ内壁下端に接触する。また、キンク部１５ａ、１
６ａの湾曲部の略上半分はスルーホール４ａ内に挿入さ
れず、湾曲部上端は、プリント基板４上に接触してい
る。すなわち、温度センサ１１は、図２に示すように、
プリント基板４に対して約４５度の挿入角度で斜めに装
着される。First, the leads 15, 1 of the temperature sensor 11
6 is inserted perpendicularly into the through hole 4a of the printed circuit board 4 from the other end, the substantially semicircular curved portions of the kink portions 15a and 16a can be gripped on the upper surface of the printed circuit board 4. Then, when the lead wires 15 and 16 are inclined obliquely in the opposite direction to the bending portion, the bending portion is inserted halfway into the through hole 4a,
The lower end of the curved portion is used for the inner wall of the through hole 4a. At this time, one point on the other end side of the lead wires 15 and 16 contacts the lower end of the inner wall of the through hole 4a. Also, the kink portions 15a, 1
A substantially upper half of the curved portion 6a is not inserted into the through hole 4a, and the upper end of the curved portion is in contact with the printed circuit board 4. That is, as shown in FIG.
It is attached obliquely to the printed circuit board 4 at an insertion angle of about 45 degrees.
【００２８】この温度センサ１１は、キンク部１５ａ、
１６ａがスルーホール４ａに係止しているので、振動な
どが加わってもプリント基板４から外れにくい。また、
装着された方向と大幅に異なる向きに倒れにくい。した
がって、このままの装着状態で、リード線１５、１６の
他端をプリント基板４に半田１８などで固定し、温度セ
ンサ１１をプリント基板４に対して斜めに装着すること
ができる。The temperature sensor 11 has a kink portion 15a,
16a is locked in the through-hole 4a, so that it does not easily come off the printed circuit board 4 even when vibration is applied. Also,
It is hard to fall in a direction that is significantly different from the mounted direction. Therefore, in this mounting state, the other ends of the lead wires 15 and 16 can be fixed to the printed circuit board 4 with solder 18 or the like, and the temperature sensor 11 can be mounted obliquely to the printed circuit board 4.
【００２９】続いて、プリント基板４に対して斜めに装
着した温度センサ１１に真上からＣＰＵ１を当接する
と、リード線１５、１６は、そのまま所定方向に撓み、
負特性サーミスタ素子１２とＣＰＵ１とが接触する。Subsequently, when the CPU 1 comes into contact with the temperature sensor 11 mounted obliquely with respect to the printed circuit board 4 from directly above, the lead wires 15 and 16 bend in a predetermined direction as they are.
The negative characteristic thermistor element 12 comes into contact with the CPU 1.
【００３０】この温度センサ１１は、プリント基板４に
対して斜めに装着されているので、真上からの押圧によ
っても、リード線１５、１６が所定方向と異なる向きに
撓んだり、リード線１５、１６や負特性サーミスタ素子
１２が圧壊されることがない。また、リード線１５、１
６はバネ性を有しているので、負特性サーミスタ素子１
２とＣＰＵ１とを確実に接触させることができる。Since the temperature sensor 11 is mounted obliquely with respect to the printed circuit board 4, the lead wires 15 and 16 may be bent in a direction different from the predetermined direction or may be bent even when pressed from directly above. , 16 and the negative characteristic thermistor element 12 are not crushed. Also, lead wires 15, 1
6 has a spring property, so that the negative characteristic thermistor element 1
2 and the CPU 1 can be reliably contacted.
【００３１】なお、リード線１５、１６は、略半円弧状
に湾曲したキンク部１５ａ、１６ａに替えて、図３に示
すように、屈曲部１５ｂ、１６ｂを設けてもよい。この
とき、リード線１５、１６の屈曲部１５ｂ、１６ｂの一
端側と他端側とがなす角度は、９０度以上１８０度未満
であることとする。The lead wires 15, 16 may be provided with bent portions 15b, 16b as shown in FIG. 3 instead of the kink portions 15a, 16a curved in a substantially semicircular arc shape. At this time, the angle formed between one end side and the other end side of the bent portions 15b, 16b of the lead wires 15, 16 is 90 degrees or more and less than 180 degrees.
【００３２】また、上記屈曲部１５ｂ、１６ｂにさらに
キンク部１５ａ、１６ａを設け、図４（ａ）、（ｂ）に
示すように、キンク部１５ａ、１６ａの一端側と他端側
とで、９０度以上１８０度未満の角度を有するように形
成してもよい。Further, kink portions 15a and 16a are further provided on the bent portions 15b and 16b, and as shown in FIGS. 4A and 4B, one end and the other end of the kink portions 15a and 16a are provided. It may be formed so as to have an angle of 90 degrees or more and less than 180 degrees.
【００３３】図３および図４（ａ）、（ｂ）に示すリー
ド線１５、１６の場合、リード線１５、１６のキンク部
１５ａ、１６ａおよび屈曲部１５ｂ、１６ｂは、プリン
ト基板４のスルーホール４ａ内に挿入されない。すなわ
ち、リード線１５、１６を他端からプリント基板４のス
ルーホール４ａに垂直に挿入すると、キンク部１５ａ、
１６ａの略半円弧状の湾曲部あるいは屈曲部１５ｂ、１
６ｂが、プリント基板４の上面でスルーホール４ａにつ
かえ、リード線１５、１６の他端側はスルーホール４ａ
内でほぼ垂直に保持され、リード線１５、１６の一端側
はプリント基板４に対して斜めに自立する。よって、リ
ード線１５、１６は、所定方向と異なる向きには倒れに
くい。In the case of the lead wires 15 and 16 shown in FIGS. 3 and 4A and 4B, the kink portions 15a and 16a and the bent portions 15b and 16b of the lead wires 15 and 16 are formed through the through holes of the printed circuit board 4. 4a is not inserted. That is, when the lead wires 15 and 16 are vertically inserted into the through holes 4a of the printed circuit board 4 from the other ends, the kink portions 15a and 16
16a, a substantially semicircular curved portion or bent portion 15b, 1b
6b is held in the through hole 4a on the upper surface of the printed circuit board 4, and the other ends of the lead wires 15 and 16 are connected to the through hole 4a.
, And one end of the lead wires 15 and 16 stand up obliquely with respect to the printed circuit board 4. Therefore, the lead wires 15 and 16 are unlikely to fall in a direction different from the predetermined direction.
【００３４】なお、リード線１５、１６の間隔は、図５
で示すように、温度検出素子側の一端から他端にかけて
次第に広がっていてもよい。こうすることによって、リ
ード線１５、１６における他端どうしの間隔が、スルー
ホール４ａ、４ｂの間隔よりも広くなり、スルーホール
４ａ、４ｂにそれぞれ挿入されたリード線１５、１６
は、バネ性のためスルーホールの中で広がろうとする。
したがって、温度センサ１１をプリント基板４に対し
て、さらに安定して斜めに係止させることができ、半田
付け工程までに温度検出素子の位置が変わるのを防止す
ることができる。The distance between the lead wires 15 and 16 is shown in FIG.
As shown by, the temperature detection element may gradually expand from one end to the other end. By doing so, the interval between the other ends of the lead wires 15 and 16 becomes wider than the interval between the through holes 4a and 4b, and the lead wires 15 and 16 inserted into the through holes 4a and 4b, respectively.
Tends to spread in the through hole due to the spring property.
Therefore, the temperature sensor 11 can be more stably and obliquely locked to the printed circuit board 4, and the position of the temperature detecting element can be prevented from changing by the soldering step.
【００３５】また、このようなリード線１５、１６の一
端に取り付けた負特性サーミスタ素子１２に真上からＣ
ＰＵ１を当接しても、リード線１５、１６が所定方向と
異なる向きに撓んだり、リード線１５、１６や負特性サ
ーミスタ素子１２が圧壊されることがなく、負特性サー
ミスタ素子１２とＣＰＵ１とが確実に接触する。The negative thermistor element 12 attached to one end of each of the lead wires 15 and 16 has a C
Even if the PU1 is brought into contact, the lead wires 15 and 16 do not bend in a direction different from the predetermined direction, and the lead wires 15 and 16 and the negative characteristic thermistor element 12 are not crushed. Will surely contact.
【００３６】なお、この発明の温度センサにおいて、温
度検出素子は負特性サーミスタ素子に限定される理由は
なく、正特性サーミスタなどに置き換えることは可能で
あり、種々の電子部品に適用することができる。In the temperature sensor of the present invention, the temperature detecting element is not limited to the negative characteristic thermistor element, but can be replaced with a positive characteristic thermistor or the like, and can be applied to various electronic parts. .
【００３７】[0037]
【発明の効果】以上述べたように、この発明の温度セン
サは、バネ性を有するリード線に成形部を設けることに
より、温度検出素子を取り付けたリード線の一端側を、
基板上に斜めに自立させて装着することができる。した
がって、温度検出素子の真上から被測定物を押圧して
も、リード線がバネ性により所定方向にスムーズに撓
み、温度検出素子やリード線が圧壊することない。ま
た、温度検出素子が被測定物と確実に接触する。さら
に、リード線の間隔を広げることで、リード線のばね性
を利用して基板への係止効果を高めた結果、半田付け工
程までに温度検出素子の位置が変わるのを防止すること
ができる。以上のことから、正確な温度検知が可能な温
度センサを安価、容易に得ることができる。As described above, according to the temperature sensor of the present invention, one end of the lead wire to which the temperature detecting element is attached is provided by forming the molded part on the lead wire having the spring property.
It can be mounted on a substrate so as to be free standing diagonally. Therefore, even if the object to be measured is pressed from directly above the temperature detecting element, the lead wire is smoothly bent in a predetermined direction by the spring property, and the temperature detecting element and the lead wire are not crushed. Further, the temperature detecting element surely comes into contact with the object to be measured. Further, by increasing the distance between the lead wires, the effect of locking the lead wires to the substrate is enhanced by utilizing the spring properties of the lead wires, and thus, it is possible to prevent the position of the temperature detecting element from being changed before the soldering process. . From the above, a temperature sensor capable of accurate temperature detection can be easily obtained at low cost.
【図１】この発明に係る一つの実施の形態の温度センサ
の斜視図である。FIG. 1 is a perspective view of a temperature sensor according to one embodiment of the present invention.
【図２】この発明の温度センサをＣＰＵの温度検知に使
用した状態を示す概略図である。FIG. 2 is a schematic diagram showing a state in which the temperature sensor of the present invention is used for temperature detection of a CPU.
【図３】この発明の温度センサにおけるリード線の変形
例を示す部分断面図である。FIG. 3 is a partial sectional view showing a modified example of a lead wire in the temperature sensor of the present invention.
【図４】（ａ），（ｂ）ともに、この発明の温度センサ
におけるリード線の他の変形例を示す部分断面図であ
る。FIGS. 4A and 4B are partial cross-sectional views showing another modification of the lead wire in the temperature sensor of the present invention.
【図５】この発明の温度センサにおけるリード線の、さ
らに他の変形例を示す部分断面図である。FIG. 5 is a partial sectional view showing still another modification of the lead wire in the temperature sensor of the present invention.
【図６】従来の温度センサをＣＰＵの温度検知に使用し
た状態を示す概略図である。FIG. 6 is a schematic diagram showing a state in which a conventional temperature sensor is used for temperature detection of a CPU.
【図７】図６の変形例を示しており、（ａ）はリード線
が所定方向と反対に撓んだ状態、（ｂ）はリード線およ
び温度検出素子が圧壊した状態を示している。7A and 7B show a modified example of FIG. 6, in which FIG. 7A shows a state in which the lead wire is bent in a direction opposite to a predetermined direction, and FIG. 7B shows a state in which the lead wire and the temperature detecting element are crushed.
４ プリント基板 ４ａ スルーホール １１ 温度センサ １２ 負特性サーミスタ素子（温度検出
素子） １３、１４ 端子電極 １５、１６ リード線 １５ａ、１６ａ キンク部 １５ｂ、１６ｂ 屈曲部 １７ａ、１７ｂ 外装樹脂Reference Signs List 4 printed circuit board 4a through hole 11 temperature sensor 12 negative characteristic thermistor element (temperature detecting element) 13, 14 terminal electrode 15, 16 lead wire 15a, 16a kink portion 15b, 16b bent portion 17a, 17b exterior resin
───────────────────────────────────────────────────── フロントページの続き (72)発明者 若林 浅巳 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 (72)発明者 渡辺 徹 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 (72)発明者 山下 是如 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 Ｆターム(参考） 2F056 QF01 QF05 QF06 QF08 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Asami Wakabayashi 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock Company Murata Manufacturing Co., Ltd. (72) Inventor Toru Watanabe 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock (72) Inventor Yoshinori Yamashita 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term (reference) 2F056 QF01 QF05 QF06 QF08
Claims (11)
を有するリード線の一端が取り付けられており、 前記リード線は、他端近傍に成形部を有することを特徴
とする温度センサ。1. A temperature sensor, wherein one end of a resilient lead wire is attached to an electrode formed on a temperature detecting element, and the lead wire has a molded portion near the other end.
ク部は、複数のリード線において、同一方向に略半円弧
状に湾曲していることを特徴とする請求項１記載の温度
センサ。2. The temperature sensor according to claim 1, wherein the formed portion is a kink portion, and the kink portion is curved in a substantially semicircular arc in the same direction in a plurality of lead wires.
は、複数のリード線が同一方向に屈曲してなることを特
徴とする請求項１記載の温度センサ。3. The temperature sensor according to claim 1, wherein the formed portion is a bent portion, and the bent portion is formed by bending a plurality of lead wires in the same direction.
ク部を有することを特徴とする請求項３記載の温度セン
サ。4. The temperature sensor according to claim 3, wherein said bent portion has a kink portion further in said molded portion.
検出素子に形成された電極に取り付けられた一端から他
端にかけて、次第に広がっていることを特徴とする請求
項１から請求項４のいずれかに記載の温度センサ。5. The apparatus according to claim 1, wherein the interval between the plurality of lead wires gradually increases from one end attached to the electrode formed on the temperature detecting element to the other end. The temperature sensor according to any one of the above.
リウム、ＳＵＳ、Ｃｕ−Ｔｉ合金、真鍮またはこれらに
めっきを施したものなどからなることを特徴する請求項
１から請求項５のいずれかに記載の温度センサ。6. The lead wire according to claim 1, wherein the lead wire is made of phosphor bronze, nickel silver, beryllium, SUS, Cu—Ti alloy, brass, or a plated material thereof. A temperature sensor according to any one of the above.
絶縁被覆されていることを特徴とする請求項１から請求
項６のいずれかに記載の温度センサ。7. The temperature sensor according to claim 1, wherein the temperature detection element and the lead wire are covered with an insulating material.
素子であることを特徴とする請求項１から請求項７のい
ずれかに記載の温度センサ。8. The temperature sensor according to claim 1, wherein the temperature detection element is a negative temperature coefficient thermistor element.
の温度センサを準備し、前記温度センサのリード線を回
路基板に形成されたスルーホールに挿入し、前記リード
線の成形部を前記スルーホールに係止させることによ
り、前記温度センサの温度検出素子を前記基板に対して
斜めに自立させることを特徴とする、温度センサの装着
方法。9. A temperature sensor according to claim 1, wherein a lead wire of the temperature sensor is inserted into a through hole formed in a circuit board, and a molded portion of the lead wire is formed. A method for mounting a temperature sensor, characterized in that the temperature detection element of the temperature sensor is made to be self-supporting obliquely with respect to the substrate by being locked in the through hole.
載の温度センサと、前記温度センサを装着した回路基板
とからなる温度検出装置。10. A temperature detecting device comprising: the temperature sensor according to claim 1; and a circuit board on which the temperature sensor is mounted.
請求項１から請求項８に記載の温度センサと、前記回路
基板の上方に一定の間隔を設けて配置され、前記温度セ
ンサの温度検出素子と接触する被温度検出物とからな
る、被温度検出物の温度検出構造であって、 前記温度センサは、前記リード線の成形部が前記回路基
板のスルーホールに係止することによって前記回路基板
に対して斜めに自立しており、かつ前記温度センサのリ
ード線は、前記回路基板に形成されたスルーホールに挿
入されて、前記被温度検出物から前記温度検出素子にか
かる応力によって撓んでいることを特徴とする被温度検
出物の温度検出構造。11. A circuit board, a temperature sensor according to claim 1 mounted on said circuit board, and a predetermined interval above said circuit board, wherein a temperature of said temperature sensor is A temperature detection structure for a temperature detection target, comprising a temperature detection target in contact with a detection element, wherein the temperature sensor is configured such that a molded portion of the lead wire is locked in a through hole of the circuit board. The temperature sensor lead wire is independent of the circuit board and inserted into a through hole formed in the circuit board, and is bent by the stress applied to the temperature detection element from the temperature detection target. A temperature detection structure for detecting a temperature of an object to be detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000248871A JP3705093B2 (en) | 1999-08-20 | 2000-08-18 | Mounting method of temperature sensor and temperature detection structure of temperature object |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-234109 | 1999-08-20 | ||
| JP23410999 | 1999-08-20 | ||
| JP2000248871A JP3705093B2 (en) | 1999-08-20 | 2000-08-18 | Mounting method of temperature sensor and temperature detection structure of temperature object |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001133333A true JP2001133333A (en) | 2001-05-18 |
| JP3705093B2 JP3705093B2 (en) | 2005-10-12 |
Family
ID=26531373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000248871A Expired - Fee Related JP3705093B2 (en) | 1999-08-20 | 2000-08-18 | Mounting method of temperature sensor and temperature detection structure of temperature object |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3705093B2 (en) |
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| US6813952B2 (en) | 2003-03-19 | 2004-11-09 | Denso Corporation | Pressure sensor device having temperature sensor |
| JP2007130837A (en) * | 2005-11-09 | 2007-05-31 | Brother Ind Ltd | Ink jet printer head |
| JP2010252538A (en) * | 2009-04-16 | 2010-11-04 | Mitsumi Electric Co Ltd | Battery protection module and lead thermistor mounting method |
| CN101882744A (en) * | 2010-05-25 | 2010-11-10 | 张战士 | Connection method of thermistor and wire |
| JP2012164972A (en) * | 2011-01-17 | 2012-08-30 | Murata Mfg Co Ltd | Ceramic composite electronic component and electronic component element supply device used for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6813952B2 (en) | 2003-03-19 | 2004-11-09 | Denso Corporation | Pressure sensor device having temperature sensor |
| JP2007130837A (en) * | 2005-11-09 | 2007-05-31 | Brother Ind Ltd | Ink jet printer head |
| JP4710554B2 (en) * | 2005-11-09 | 2011-06-29 | ブラザー工業株式会社 | Inkjet printer head |
| JP2010252538A (en) * | 2009-04-16 | 2010-11-04 | Mitsumi Electric Co Ltd | Battery protection module and lead thermistor mounting method |
| CN101882744A (en) * | 2010-05-25 | 2010-11-10 | 张战士 | Connection method of thermistor and wire |
| JP2012164972A (en) * | 2011-01-17 | 2012-08-30 | Murata Mfg Co Ltd | Ceramic composite electronic component and electronic component element supply device used for manufacturing the same |
| JP2012182133A (en) * | 2011-03-02 | 2012-09-20 | Samsung Sdi Co Ltd | Battery pack |
| US9269946B2 (en) | 2011-03-02 | 2016-02-23 | Samsung Sdi Co., Ltd. | Battery pack having protection circuit module |
| KR20150103415A (en) * | 2014-03-03 | 2015-09-11 | 주식회사 엘지화학 | Protection Circuit Module Including Temperature Sensing Member and Battery Pack Comprising the Same |
| KR101717144B1 (en) | 2014-03-03 | 2017-03-16 | 주식회사 엘지화학 | Protection Circuit Module Including Temperature Sensing Member and Battery Pack Comprising the Same |
| WO2016017283A1 (en) * | 2014-07-31 | 2016-02-04 | 株式会社村田製作所 | Temperature detection device and electronic device |
| JP2016225488A (en) * | 2015-06-01 | 2016-12-28 | 株式会社村田製作所 | Coated lead type electronic component and manufacturing method thereof |
| JP6371002B1 (en) * | 2017-01-16 | 2018-08-08 | 株式会社芝浦電子 | Temperature sensor |
| CN112087075A (en) * | 2019-06-12 | 2020-12-15 | 本田技研工业株式会社 | Stator and thermistor unit |
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|---|---|
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