JP2019082385A - Temperature sense presentation apparatus - Google Patents

Temperature sense presentation apparatus Download PDF

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JP2019082385A
JP2019082385A JP2017209569A JP2017209569A JP2019082385A JP 2019082385 A JP2019082385 A JP 2019082385A JP 2017209569 A JP2017209569 A JP 2017209569A JP 2017209569 A JP2017209569 A JP 2017209569A JP 2019082385 A JP2019082385 A JP 2019082385A
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heater
unit
temperature detection
thermal sensation
temperature
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佐藤　邦生
Kunio Sato
邦生 佐藤
元 志方
Hajime Shikata
元 志方
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Alps Alpine Co Ltd
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Alps Alpine Co Ltd
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Abstract

To improve the touch of a temperature sense presentation region while accurately detecting the temperature of a heater in a temperature sense presentation region.SOLUTION: The apparatus includes a substrate and a heater provided on the substrate, and a temperature detection unit for generating an electric signal according to the temperature of the heater, and the heater includes a first heater part formed on a first surface of the substrate in the temperature sense presentation region, and a second heater part formed on a second surface opposite to the first surface of the substrate and thermally connected to the first heater part, and the temperature sense detection unit is disposed in the temperature sense presentation apparatus in contact with the second heater part.SELECTED DRAWING: Figure 4

Description

本開示は、温覚呈示装置に関する。   The present disclosure relates to a warmth presentation device.

ペルチェ素子に温度変化を生じさせることで、対象物の温覚情報をユーザに呈示する温覚呈示装置が知られている。   There is known a thermal sensation presentation apparatus that presents thermal sensation information of an object to a user by causing a Peltier element to cause a temperature change.

特開平７−７２０１８号公報Japanese Patent Application Laid-Open No. 7-72018

しかしながら、上記のような従来技術では、ユーザが手で触れる温覚呈示領域にヒータを設ける場合に、温覚呈示領域におけるヒータの温度を精度良く検出しつつ、温覚呈示領域の手触りを良好にすることが難しい。温覚呈示領域におけるヒータの温度を精度良く検出するために、温覚呈示領域に温度検出部を設けると、温覚呈示領域内に温度検出部に係る凹凸が生じて温覚呈示領域の手触りが悪くなりやすい。温覚呈示領域の手触りが悪くなると、温覚呈示領域での温覚や触覚などの呈示能力が悪くなる傾向がある。   However, in the prior art as described above, when the heater is provided in the thermal sensation presentation area touched by the user, the touch of the thermal sensation presentation area is favorably made while accurately detecting the temperature of the heater in the thermal sensation presentation area. It is difficult to do. If the temperature detection unit is provided in the warm sensation presentation region in order to detect the temperature of the heater in the warm sensation presentation region with high accuracy, the unevenness related to the temperature detection unit is generated in the warm sensation presentation region and the touch of the warm sensation presentation region is It is easy to get worse. When the touch of the thermal sensation presentation area becomes worse, the presentation ability of the thermal sensation presentation area such as the thermal sensation and the touch tends to deteriorate.

そこで、１つの側面では、本発明は、温覚呈示領域におけるヒータの温度を精度良く検出しつつ、温覚呈示領域の手触りを良好にすることを目的とする。   Therefore, in one aspect, the present invention aims to improve the touch of the warm sensation presentation area while detecting the temperature of the heater in the warm sensation presentation area with high accuracy.

１つの側面では、基材と、
前記基材に設けられるヒータと、
前記ヒータの温度に応じた電気信号を生成する温度検出部とを含み、
前記ヒータは、前記基材の第１面における温覚呈示領域内に形成される第１ヒータ部と、前記基材における前記第１面とは逆側の第２面に形成されかつ前記第１ヒータ部に熱的に接続される第２ヒータ部とを含み、
前記温度検出部は、前記第２ヒータ部に接触する、温覚呈示装置が提供される。 In one aspect, the substrate,
A heater provided on the substrate;
A temperature detection unit that generates an electrical signal according to the temperature of the heater;
The heater is formed on a second heater surface formed on the first surface of the base in a warm sensation presenting region, and on the second surface of the base opposite to the first surface and the first heater And a second heater portion thermally connected to the heater portion;
The temperature detection unit may be provided with a thermal sensation presentation apparatus, which contacts the second heater unit.

１つの側面では、本発明によれば、温覚呈示領域におけるヒータの温度を精度良く検出しつつ、温覚呈示領域の手触りを良好にすることが可能となる。   In one aspect, according to the present invention, it is possible to make the touch of the thermal sensation presentation region good while detecting the temperature of the heater in the thermal sensation presentation region with high accuracy.

一実施例による温覚呈示装置を示す斜視図である。It is a perspective view showing the warmth presentation device by one example. 温覚呈示装置の分解斜視図である。It is a disassembled perspective view of a thermal sensation presentation apparatus. 基材の上面を示す平面図である。It is a top view which shows the upper surface of a base material. 基材の下面を示す平面図である。It is a top view which shows the lower surface of a base material. 第１ヒータ部と第２ヒータ部と温度検出部との関係の一例の説明図である。It is explanatory drawing of an example of the relationship between a 1st heater part, a 2nd heater part, and a temperature detection part. 変形例の説明図である。It is explanatory drawing of a modification. 第１ヒータ部と第２ヒータ部と温度検出部との関係の他の一例の説明図である。It is explanatory drawing of another example of the relationship between a 1st heater part, a 2nd heater part, and a temperature detection part. 変形例による温覚呈示装置を示す分解斜視図である。It is a disassembled perspective view which shows the warmth presentation apparatus by a modification.

以下、添付図面を参照しながら各実施例について詳細に説明する。   Hereinafter, each example will be described in detail with reference to the attached drawings.

図１は、一実施例による温覚呈示装置１を示す斜視図である。図２は、温覚呈示装置１の分解斜視図である。図１には、直交する３軸Ｘ，Ｙ，Ｚが定義されている。以下では、説明上、Ｚ方向の正側を"上側"とする。   FIG. 1 is a perspective view showing a thermal sensation presentation apparatus 1 according to one embodiment. FIG. 2 is an exploded perspective view of the thermal sensation presentation apparatus 1. Three orthogonal axes X, Y, Z are defined in FIG. In the following, for the sake of explanation, the positive side in the Z direction is referred to as "upper side".

温覚呈示装置１は、基材１０と、ヒータ２０と、温度検出部４０と、筐体５０とを含む。   The thermal sensation presentation apparatus 1 includes a base 10, a heater 20, a temperature detection unit 40, and a housing 50.

基材１０は、板状の絶縁部材である。本実施例では、一例として、基材１０は、ＦＰＣ（Flexible Printed Circuits）で用いられる基材である。例えば、基材１０は、ポリイミド等で形成されるフィルムである。図１及び図２に示す例では、一例として、基材１０は、中央部に開口１２を有し、開口１２を介して冷感呈示部６０が露出される。冷感呈示部６０は、ユーザに冷感を呈示する部位であり、例えばペルチェ素子を含んでよい。   The base 10 is a plate-like insulating member. In the present embodiment, as an example, the substrate 10 is a substrate used in an FPC (Flexible Printed Circuits). For example, the substrate 10 is a film formed of polyimide or the like. In the example shown in FIG. 1 and FIG. 2, as an example, the base material 10 has an opening 12 at the central portion, and the cold sensation presentation unit 60 is exposed through the opening 12. The cold sensation presentation unit 60 is a part that presents a cold sensation to the user, and may include, for example, a Peltier element.

ヒータ２０は、ユーザに温感を呈示する部品であり、発熱抵抗体を含む。尚、本実施例では、ヒータ２０は、冷感呈示部６０と協動して、ユーザに冷感及び温感の組み合わせによる温覚呈示を呈示するが、変形例では、冷感呈示部６０が省略されてもよい。発熱抵抗体は、例えば銀やニッケル合金等であってよい。ヒータ２０の詳細な構造は、後述する。   The heater 20 is a component that presents a warm sensation to the user, and includes a heating resistor. In the present embodiment, the heater 20 cooperates with the coolness presentation unit 60 to present the user with a thermal sensation presentation by a combination of coolness and warmth, but in the modification, the coolness presentation unit 60 It may be omitted. The heat generating resistor may be, for example, silver or a nickel alloy. The detailed structure of the heater 20 will be described later.

温度検出部４０は、ヒータ２０の温度に応じた電気信号を生成する。温度検出部４０は、例えばサーミスタである。温度検出部４０は、図２に示すように、基材１０の下面側に設けられる。温度検出部４０とヒータ２０との位置関係は、後述する。   The temperature detection unit 40 generates an electrical signal according to the temperature of the heater 20. The temperature detection unit 40 is, for example, a thermistor. The temperature detection part 40 is provided in the lower surface side of the base material 10, as shown in FIG. The positional relationship between the temperature detection unit 40 and the heater 20 will be described later.

筐体５０は、例えば樹脂により形成される。筐体５０は、支持部５０１と、突出部５０４とを形成する。   The housing 50 is formed of, for example, a resin. The housing 50 forms a support portion 501 and a projecting portion 504.

支持部５０１は、基材１０を支持する。支持部５０１は、図２に示すように、ＸＹ平面内に延在する表面５０１１を供し、表面５０１１には、凹部５０１２が設けられる。凹部５０１２には温度検出部４０が配置される。即ち凹部５０１２内の空間は、温度検出部４０の搭載空間として機能する。凹部５０１２を設けることで、温度検出部４０の配置が容易となる。   The support portion 501 supports the substrate 10. As shown in FIG. 2, the support portion 501 provides a surface 5011 extending in the XY plane, and the surface 5011 is provided with a recess 5012. The temperature detection unit 40 is disposed in the recess 5012. That is, the space in the recess 5012 functions as a mounting space for the temperature detection unit 40. The provision of the recess 5012 facilitates the arrangement of the temperature detection unit 40.

突出部５０４は、支持部５０１の外周部に突設される。突出部５０４は、温覚呈示領域を画成する。即ち、支持部５０１の表面５０１１上に基材１０載置された状態において、基材１０の上面における突出部５０４で囲まれた領域は、温覚呈示領域として機能する。温覚呈示領域とは、ユーザの手が触れることが想定される領域である。温覚呈示領域が突出部５０４で囲まれることで、ユーザは温覚呈示領域の範囲を容易に認識できる。   The protruding portion 504 is provided so as to protrude from the outer peripheral portion of the support portion 501. The protrusion 504 defines a warm sensation presentation area. That is, in a state where the base material 10 is placed on the surface 5011 of the support part 501, the area surrounded by the projecting part 504 on the upper surface of the base material 10 functions as a warmth sensation presenting area. The thermal sensation presenting area is an area where it is assumed that the user's hand touches. By the warm sense presentation area being surrounded by the protruding portion 504, the user can easily recognize the range of the warm sense presentation area.

次に、図３Ａ以降を参照して、ヒータ２０について更に説明する。   Next, the heater 20 will be further described with reference to FIG. 3A and thereafter.

図３Ａは、基材１０の上面（第１面の一例）を示す平面図であり、図３Ｂは、基材１０の下面（第２面の一例）を示す平面図である。   FIG. 3A is a plan view showing the upper surface (an example of the first surface) of the base material 10, and FIG. 3B is a plan view showing the lower surface (an example of the second surface) of the base material 10.

ヒータ２０は、第１ヒータ部２１と、第２ヒータ部２２とを含む。第１ヒータ部２１及び第２ヒータ部２２は、好ましくは、同一の材料（発熱抵抗体）により形成される。   The heater 20 includes a first heater unit 21 and a second heater unit 22. The first heater portion 21 and the second heater portion 22 are preferably formed of the same material (heating resistor).

第１ヒータ部２１は、基材１０の上面における温覚呈示領域内に形成される。第１ヒータ部２１は、一定幅の線状のパターンで形成される。但し、幅は可変であってもよい。尚、第１ヒータ部２１は、ポリイミドシートのような絶縁材で上側の表面が被覆されてよい。   The first heater unit 21 is formed in the warmth sense presentation area on the upper surface of the base material 10. The first heater portion 21 is formed in a linear pattern of a fixed width. However, the width may be variable. The upper surface of the first heater unit 21 may be covered with an insulating material such as a polyimide sheet.

本実施例では、一例として、第１ヒータ部２１は、図３Ａに示すように、開口１２を囲む態様のパターンで形成される。但し、パターンは任意であり、例えば螺旋状のパターンで形成されてもよい。   In the present embodiment, as an example, as shown in FIG. 3A, the first heater portion 21 is formed in a pattern of an aspect surrounding the opening 12. However, the pattern is arbitrary, and may be formed, for example, in a spiral pattern.

第２ヒータ部２２は、基材１０の下面に形成される。第２ヒータ部２２は、第１ヒータ部２１に熱的に接続される。この第２ヒータ部２２と第１ヒータ部２１との間の熱的な接続態様については、後述する。   The second heater unit 22 is formed on the lower surface of the substrate 10. The second heater unit 22 is thermally connected to the first heater unit 21. The thermal connection between the second heater 22 and the first heater 21 will be described later.

次に、図４乃至図６を参照して、第１ヒータ部２１と第２ヒータ部２２との間の熱的な接続態様、及び、第２ヒータ部２２と温度検出部４０との関係、について説明する。   Next, referring to FIGS. 4 to 6, the thermal connection between the first heater unit 21 and the second heater unit 22 and the relationship between the second heater unit 22 and the temperature detection unit 40, Will be explained.

図４は、第１ヒータ部２１と第２ヒータ部２２と温度検出部４０との関係の一例の説明図であり、第２ヒータ部２２の形成領域の概略的な断面図である。図４には、熱の輸送経路として矢印Ｒ１１が模式的に示されている。   FIG. 4 is an explanatory view of an example of the relationship between the first heater unit 21, the second heater unit 22, and the temperature detection unit 40, and is a schematic cross-sectional view of a formation region of the second heater unit 22. In FIG. 4, an arrow R11 is schematically shown as a heat transport route.

基材１０は、図４に示すように、上面から下面まで延在する貫通穴（スルーホール）１０１を有する。貫通穴１０１には、第１ヒータ部２１（及び第２ヒータ部２２）と同じ材料が充填され、接続部２４が形成される。第１ヒータ部２１及び第２ヒータ部２２は、接続部２４に接触する。即ち、図４に示す例では、ヒータ２０は、第１ヒータ部２１と第２ヒータ部２２に加えて、接続部２４を含む。接続部２４は、第１ヒータ部２１と第２ヒータ部２２と一体に形成されてよい。   As shown in FIG. 4, the substrate 10 has a through hole 101 extending from the upper surface to the lower surface. The through hole 101 is filled with the same material as the first heater portion 21 (and the second heater portion 22), and the connection portion 24 is formed. The first heater unit 21 and the second heater unit 22 contact the connection unit 24. That is, in the example shown in FIG. 4, the heater 20 includes the connection portion 24 in addition to the first heater portion 21 and the second heater portion 22. The connection portion 24 may be integrally formed with the first heater portion 21 and the second heater portion 22.

尚、図４に示す例では、一例として、貫通穴１０１の内壁には、メッキ３０が形成される。メッキ３０に代えて、印刷やエッチングなどで導体が形成されてもよい。但し、変形例では、メッキ３０は省略されてもよい。   In the example shown in FIG. 4, the plating 30 is formed on the inner wall of the through hole 101 as an example. Instead of the plating 30, a conductor may be formed by printing, etching or the like. However, in the modification, the plating 30 may be omitted.

第２ヒータ部２２には、図４に示すように、温度検出部４０が接触する。この際、温度検出部４０は、第２ヒータ部２２に接触するだけでよいが、第２ヒータ部２２に両面テープや接着剤等で接合されてもよい。上述のように、温度検出部４０が凹部５０１２内に配置される場合は、単なる接触だけでも（即ち接合でなくても）、温度検出部４０と第２ヒータ部２２との間の接触を安定的に維持できる。尚、温度検出部４０の接続線４０１は、基材１０の下面に実装されうる処理装置のチップ（図示せず）に接続されてもよいし、温覚呈示装置１の筐体５０の外部に引き出されてもよい。   As shown in FIG. 4, the temperature detection unit 40 is in contact with the second heater unit 22. At this time, the temperature detection unit 40 may only be in contact with the second heater unit 22. However, the temperature detection unit 40 may be joined to the second heater unit 22 with a double-sided tape, an adhesive, or the like. As described above, in the case where the temperature detection unit 40 is disposed in the recess 5012, the contact between the temperature detection unit 40 and the second heater unit 22 is stabilized even by simple contact (that is, not bonding). Can be maintained. The connection line 401 of the temperature detection unit 40 may be connected to a chip (not shown) of the processing device that can be mounted on the lower surface of the substrate 10, or outside the housing 50 of the thermal sensation presentation device 1 It may be pulled out.

図４に示す例によれば、基材１０の上面における温覚呈示領域内に、温度検出部４０が設けられないので、温覚呈示領域内に温度検出部が設けられる場合に比べて、温覚呈示領域の手触りを良好にすることができる。即ち、温覚呈示領域内に温度検出部が設けられる場合は、温度検出部４０が突起となるので、ユーザの手触りに突起物の感覚が生じ、手触りが悪化し易い。これに対して、図４に示す例によれば、温度検出部４０が基材１０の下面に設けられるので、温覚呈示領域の手触りを良好にすることができる。この結果、温覚呈示領域での温覚や触覚などの呈示能力を高めることができる。   According to the example shown in FIG. 4, since the temperature detection unit 40 is not provided in the warmth sense presentation region on the upper surface of the substrate 10, compared to the case where the temperature sense unit is provided in the warmth sensation presentation region, The feel of the sensation presenting area can be improved. That is, when the temperature detection unit is provided in the warmth sense presentation area, since the temperature detection unit 40 is a protrusion, a sense of the protrusion is generated on the touch of the user, and the touch is easily deteriorated. On the other hand, according to the example shown in FIG. 4, since the temperature detection part 40 is provided in the lower surface of the base material 10, the touch of a warm sense presentation area | region can be made favorable. As a result, it is possible to enhance the presentation ability such as warmth or touch in the warmth presentation area.

また、図４に示す例によれば、温度検出部４０が接触する第２ヒータ部２２は、第１ヒータ部２１と熱的に接続され、ヒータ２０の一部であるので、温度検出部４０により温覚呈示領域におけるヒータ２０の温度を精度良く検出できる。具体的には、図４にて矢印Ｒ１１で模式的に示すように、第１ヒータ部２１側の熱は、貫通穴１０１内の接続部２４を通って第２ヒータ部２２側に至り、第２ヒータ部２２における温度検出部４０との接触部へと至る。このとき、第１ヒータ部２１側から、第２ヒータ部２２における温度検出部４０との接触部へと至る熱輸送経路における温度差は略無い。これにより、温度検出部４０により温覚呈示領域におけるヒータ２０の温度を精度良く検出できる。   Further, according to the example shown in FIG. 4, since the second heater unit 22 in contact with the temperature detection unit 40 is thermally connected to the first heater unit 21 and is a part of the heater 20, the temperature detection unit 40 is Thus, the temperature of the heater 20 in the warm sense presentation area can be detected with high accuracy. Specifically, as schematically shown by the arrow R11 in FIG. 4, the heat on the first heater portion 21 side reaches the second heater portion 22 side through the connection portion 24 in the through hole 101, and It leads to the contact part with the temperature detection part 40 in 2 heater parts 22. At this time, there is substantially no temperature difference in the heat transport path from the first heater portion 21 side to the contact portion with the temperature detection portion 40 in the second heater portion 22. Thus, the temperature detection unit 40 can accurately detect the temperature of the heater 20 in the warmth sense presenting region.

ここで、第１ヒータ部２１側から、第２ヒータ部２２における温度検出部４０との接触部へと至る熱輸送経路における熱の損失を最小化する観点からは、第２ヒータ部２２における温度検出部４０との接触部は、好ましくは、接続部２４の直下に設けられる。但し、図５に示す変形例のように、第２ヒータ部２２における温度検出部４０との接触部は、接続部２４の直下から比較的長い距離離れていてもよい。例えば、温度検出部４０は、上面視で、温覚呈示領域に重なる位置に設けられていれば、第２ヒータ部２２と接触している限り、温覚呈示領域内におけるヒータ２０の温度を良好な精度で検出できる。   Here, from the viewpoint of minimizing the heat loss in the heat transport path from the first heater portion 21 side to the contact portion with the temperature detection portion 40 in the second heater portion 22, the temperature in the second heater portion 22 The contact portion with the detection unit 40 is preferably provided immediately below the connection portion 24. However, as in the modification shown in FIG. 5, the contact portion of the second heater unit 22 with the temperature detection unit 40 may be separated by a relatively long distance from immediately below the connection unit 24. For example, as long as the temperature detection unit 40 is provided at a position overlapping the warm sense presentation area in top view, the temperature detection unit 40 has a good temperature of the heater 20 in the warm sense presentation area as long as it is in contact with the second heater unit 22 It can be detected with good accuracy.

図６は、第１ヒータ部２１と第２ヒータ部２２と温度検出部４０との関係の他の一例の説明図であり、第２ヒータ部２２の形成領域の概略的な断面図である。図６には、熱の輸送経路として矢印Ｒ１１が模式的に示されている。   FIG. 6 is an explanatory view of another example of the relationship between the first heater unit 21, the second heater unit 22, and the temperature detection unit 40, and is a schematic cross-sectional view of the formation region of the second heater unit 22. In FIG. 6, an arrow R11 is schematically shown as a heat transport route.

基材１０は、図６に示すように、側面に接続部２６が形成される。接続部２６は、第１ヒータ部２１（及び第２ヒータ部２２）と同じ材料により形成される。第１ヒータ部２１及び第２ヒータ部２２は、接続部２６に接触する。即ち、図６に示す例では、ヒータ２０は、第１ヒータ部２１と第２ヒータ部２２に加えて、接続部２６を含む。接続部２６は、第１ヒータ部２１と第２ヒータ部２２と一体に形成されてよい。   As shown in FIG. 6, the base 10 is provided with the connection portion 26 on the side surface. The connection portion 26 is formed of the same material as the first heater portion 21 (and the second heater portion 22). The first heater unit 21 and the second heater unit 22 are in contact with the connection unit 26. That is, in the example shown in FIG. 6, the heater 20 includes the connection portion 26 in addition to the first heater portion 21 and the second heater portion 22. The connection portion 26 may be integrally formed with the first heater portion 21 and the second heater portion 22.

第２ヒータ部２２には、図４に示した例と同様、図６に示すように、温度検出部４０が接触する。   As shown in FIG. 6, the temperature detection unit 40 is in contact with the second heater unit 22 as in the example shown in FIG.

図６に示す例によれば、図４に示した例と同様、基材１０の上面における温覚呈示領域内に、温度検出部４０が設けられないので、温覚呈示領域内に温度検出部が設けられる場合に比べて、温覚呈示領域の手触りを良好にすることができる。この結果、温覚呈示領域での温覚や触覚などの呈示能力を高めることができる。また、温度検出部４０が接触する第２ヒータ部２２は、第１ヒータ部２１と熱的に接続され、ヒータ２０の一部であるので、温度検出部４０により温覚呈示領域におけるヒータ２０の温度を精度良く検出できる。   According to the example shown in FIG. 6, as in the example shown in FIG. 4, since the temperature detection unit 40 is not provided in the warmth sense presentation area on the upper surface of the base material 10, Compared with the case where is provided, the touch of the thermal sensation presenting area can be improved. As a result, it is possible to enhance the presentation ability such as warmth or touch in the warmth presentation area. Further, the second heater unit 22 in contact with the temperature detection unit 40 is thermally connected to the first heater unit 21 and is a part of the heater 20. The temperature can be detected accurately.

以上のように、本実施例によれば、温度検出部４０は、温覚呈示領域が形成される基材１０の上面ではなく、下面に設けられ、かつ、温覚呈示領域内の第１ヒータ部２１に熱的に接続される第２ヒータ部２２に接触する。これにより、温覚呈示領域におけるヒータ２０の温度を精度良く検出しつつ、温覚呈示領域の手触りを良好にすることができる。   As described above, according to the present embodiment, the temperature detection unit 40 is provided not on the upper surface of the base 10 on which the thermal sensation presenting region is formed but on the lower surface, and the first heater in the thermal sensation presenting region It contacts the second heater unit 22 thermally connected to the unit 21. As a result, while the temperature of the heater 20 in the thermal sensation presenting area is accurately detected, the touch of the thermal sensation presenting area can be improved.

以上、各実施例について詳述したが、特定の実施例に限定されるものではなく、特許請求の範囲に記載された範囲内において、種々の変形及び変更が可能である。また、前述した実施例の構成要素を全部又は複数を組み合わせることも可能である。   As mentioned above, although each Example was explained in full detail, it is not limited to a specific example, A various deformation | transformation and change are possible within the range described in the claim. In addition, it is also possible to combine all or a plurality of the components of the above-described embodiment.

例えば、上述した実施例では、基材１０として、ＦＰＣで用いられる基材が用いられるが、これに限られない。例えば、図７に示す変形例による温覚呈示装置１Ａのように、基材１０Ａは、印刷基板により形成されてもよい。   For example, although the base material used by FPC is used as the base material 10 in the Example mentioned above, it is not restricted to this. For example, as in the warmth sense presentation device 1A according to the modification shown in FIG. 7, the base 10A may be formed of a printed circuit board.

１ 温覚呈示装置
１Ａ 温覚呈示装置
１０ 基材
１０Ａ 基材
１２ 開口
２０ ヒータ
２１ 第１ヒータ部
２２ 第２ヒータ部
２４ 接続部
２６ 接続部
３０ メッキ
４０ 温度検出部
５０ 筐体
６０ 冷感呈示部
１０１ 貫通穴
４０１ 接続線
５０１ 支持部
５０４ 突出部
５０１１ 表面
５０１２ 凹部 DESCRIPTION OF SYMBOLS 1 thermal sensation presentation apparatus 1A thermal sensation presentation apparatus 10 substrate 10A substrate 12 opening 20 heater 21 first heater unit 22 second heater unit 24 connection unit 26 connection unit 30 plating 40 temperature detection unit 50 housing 60 cooling sensation presentation unit 101 through hole 401 connection line 501 support portion 504 protrusion 5011 surface 5012 recess

Claims (6)

基材と、
前記基材に設けられるヒータと、
前記ヒータの温度に応じた電気信号を生成する温度検出部とを含み、
前記ヒータは、前記基材の第１面における温覚呈示領域内に形成される第１ヒータ部と、前記基材における前記第１面とは逆側の第２面に形成されかつ前記第１ヒータ部に熱的に接続される第２ヒータ部とを含み、
前記温度検出部は、前記第２ヒータ部に接触する、温覚呈示装置。 A substrate,
A heater provided on the substrate;
A temperature detection unit that generates an electrical signal according to the temperature of the heater;
The heater is formed on a second heater surface formed on the first surface of the base in a warm sensation presenting region, and on the second surface of the base opposite to the first surface and the first heater And a second heater portion thermally connected to the heater portion;
The temperature sensing unit is in contact with the second heater unit. 前記第２ヒータ部は、前記基材に垂直な方向に視て、前記温覚呈示領域に重なる領域に設けられる、請求項１に記載の温覚呈示装置。   The thermal sensation presentation apparatus according to claim 1, wherein the second heater unit is provided in an area overlapping the thermal sensation presentation area in a direction perpendicular to the base material. 前記第１ヒータ部及び前記第２ヒータ部は、同一の材料により形成される、請求項１又は２に記載の温覚呈示装置。   The thermal sensation presentation apparatus according to claim 1, wherein the first heater unit and the second heater unit are formed of the same material. 前記基材は、前記第１面から前記第２面まで延在する貫通穴を有し、該貫通穴に、前記材料が充填され、
前記第１ヒータ部及び前記第２ヒータ部は、前記貫通穴内の前記材料に接触する、請求項３に記載の温覚呈示装置。 The substrate has a through hole extending from the first surface to the second surface, and the through hole is filled with the material;
The thermal sensation presentation apparatus according to claim 3, wherein the first heater unit and the second heater unit contact the material in the through hole. 前記基材を支持する支持部を更に含み、
前記支持部は、前記温度検出部が配置される凹部を有する、請求項１〜４のうちのいずれか１項に記載の温覚呈示装置。 Further comprising a support for supporting the substrate,
The thermal sensation presentation apparatus according to any one of claims 1 to 4, wherein the support portion has a recess in which the temperature detection portion is disposed. 前記支持部の外周部に突設され、前記温覚呈示領域を囲む突出部を更に含む、請求項５に記載の温覚呈示装置。   The thermal sensation presentation apparatus according to claim 5, further comprising: a projecting part protruding from an outer peripheral part of the support part and surrounding the thermal sensation presenting area.
JP2017209569A 2017-10-30 2017-10-30 Temperature sense presentation apparatus Pending JP2019082385A (en)

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