WO2015190235A1 - Ruban adhésif, composant ainsi que procédé de fabrication de celui-ci, et moteur - Google Patents

Ruban adhésif, composant ainsi que procédé de fabrication de celui-ci, et moteur Download PDF

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Publication number
WO2015190235A1
WO2015190235A1 PCT/JP2015/064267 JP2015064267W WO2015190235A1 WO 2015190235 A1 WO2015190235 A1 WO 2015190235A1 JP 2015064267 W JP2015064267 W JP 2015064267W WO 2015190235 A1 WO2015190235 A1 WO 2015190235A1
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WO
WIPO (PCT)
Prior art keywords
adhesive layer
adhesive
adhesive tape
layer
thickness
Prior art date
Application number
PCT/JP2015/064267
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English (en)
Japanese (ja)
Inventor
誠二 秋山
森野　彰規
Original Assignee
Dic株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dic株式会社 filed Critical Dic株式会社
Priority to CN201580028500.9A priority Critical patent/CN106459679B/zh
Priority to JP2016524615A priority patent/JP6041178B2/ja
Publication of WO2015190235A1 publication Critical patent/WO2015190235A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets

Definitions

  • the present invention relates to an adhesive tape having a configuration in which a volume is expanded by applying a stimulus such as heating.
  • the adhesive tape can be suitably used for fixing two or more adherends, it is widely used in the production scenes of various products such as automobiles and electric devices.
  • the adhesive tape is required to be used when, for example, the other adherend is fixed in the gap of one adherend.
  • a motor mounted on a hybrid vehicle or the like a motor having a configuration in which a gap is generally provided at a predetermined position of a core (rotor core) and a magnet is embedded in the gap is known. Yes.
  • the use of an adhesive tape is being studied when fixing the magnet in the gap of the core portion.
  • the adhesive tape that can be used in the above application is formed on the first surface of the base material having a first surface and a second surface on the opposite side of the first surface and having a communication port, for example.
  • a first adhesive layer containing a thermosetting thermally expandable epoxy adhesive, and the thermosetting thermally expandable epoxy adhesive passes through the communication port of the substrate when heated, and
  • a thermosetting thermally expandable adhesive sheet that forms a second adhesive layer on the second surface is known (see, for example, Patent Document 1).
  • thermosetting thermally expandable adhesive sheet Since it is considered that the first adhesive layer constituting the thermosetting thermally expandable adhesive sheet is previously attached to an adherend such as a magnet, it has a good adhesive force even after the thermal expansion. It can be maintained.
  • fine irregularities may be formed on the surface of the second adhesive layer due to the thermal expansion.
  • the second adhesive layer having the surface on which the fine irregularities are formed cannot exhibit a sufficient adhesive force to the adherend.
  • the problem to be solved by the present invention is to provide an adhesive tape that can maintain excellent adhesive strength even after the expansion, among adhesive tapes that can expand by stimulation such as heating.
  • the inventors of the present invention provide an adhesive tape having an adhesive layer (B) on one side of the adhesive layer (A) directly or via another layer, and the adhesive tape is placed in an environment at 130 ° C.
  • Expansion rate in the thickness direction of the adhesive layer (A) after being left for a time [thickness of the adhesive layer (A) after being left / thickness of the adhesive layer (A) before being left] ⁇ 100 is 200% or more, and the expansion rate in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the adhesive layer (B) before being left)
  • the above problem can be solved by an adhesive tape characterized in that the [thickness] ⁇ 100 is 120% or less.
  • the adhesive tape of the present invention can maintain an excellent adhesive strength even after being expanded, it can be used for fixing two or more adherends, and in addition, the other adherend can be placed in the gap of one adherend. It can be suitably used for applications such as fixing the adherend and filling the voids of the adherend with the adhesive tape.
  • the adhesive tape of the present invention can follow the fine irregularities due to the expansion even when the adherend has minute irregularities and gaps, and as a result, exhibits excellent adhesive strength. Can do.
  • the adhesive tape of the present invention can expand or fix other adherends at predetermined positions in the voids of the adherends by expanding, the production efficiency of final products including motors can be increased. Can be improved.
  • the adhesive tape of the present invention is less likely to cause variations in the adhesive strength even when the expansion coefficient is appropriately changed.
  • the adhesive tape of the present invention is an adhesive tape having an adhesive layer (B) on one side of the adhesive layer (A) directly or via another layer, and the adhesive tape is placed in an environment of 130 ° C.
  • Expansion coefficient in the thickness direction of the adhesive layer (A) after being left for 1 hour [thickness of the adhesive layer (A) after being left / thickness of the adhesive layer (A) before being left] X100 is 200% or more, and the expansion coefficient in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the adhesive layer (B) before being left) The thickness] ⁇ 100 is 120% or less.
  • the adhesive layer (A) constituting the adhesive tape is a layer that can be expanded by applying a stimulus such as heat or light.
  • the expansion rate in the thickness direction of the adhesive layer (A) [the adhesive layer after being left ( Thickness of A) / thickness of adhesive layer (A) before leaving] ⁇ 100 is 200% or more.
  • the expansion coefficient is preferably 250% or more, and more preferably 250% to 1000%. If the adhesive tape has the adhesive layer (A) having the expansion coefficient, for example, even when the height (thickness) of the gap of one adherend is large, the other adherend is placed in the gap.
  • the body can be suitably fixed, or the space can be filled with the adhesive tape.
  • the expansion coefficient indicates that the adhesive layer (A) after being left with respect to the thickness of the adhesive layer (A) before being left standing when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of thickness ((thickness of the adhesive layer (A ′) formed by expansion). Specifically, the expansion coefficient refers to a value calculated by the following method.
  • the thickness of the adhesive layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
  • the adhesive tape after being left standing is taken out in an environment of 23 ° C., and the thickness of the adhesive layer (A ′) formed by immediately expanding the adhesive layer (A) is measured.
  • the expansion coefficient is calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (A) constituting the adhesive tape after standing] [The thickness of the adhesive layer (A ') formed by swelling] / of the adhesive layer (A) constituting the adhesive tape before standing Thickness] ⁇ 100
  • the adhesive layer (A) is previously attached to the adherend before the expansion. preferable. preferable.
  • the thickness of the adhesive layer (A) constituting the adhesive tape is preferably 1 ⁇ m or more, more preferably in the range of 10 ⁇ m to 250 ⁇ m, further preferably in the range of 20 ⁇ m to 150 ⁇ m, and 30 ⁇ m. A range of ⁇ 70 ⁇ m is particularly preferable in order to obtain a further excellent adhesive strength.
  • the thickness of the adhesive layer (A ′) formed by expanding the adhesive layer (A) is preferably in the range of 20 ⁇ m to 2500 ⁇ m, and preferably in the range of 40 ⁇ m to 1500 ⁇ m. It is preferable for obtaining even better adhesive strength.
  • the adhesive layer (A ′) preferably has a porous structure.
  • the thickness of the said adhesive bond layer (A) is 10% or more with respect to the total thickness of the said adhesive tape, and what is 30% or more It is more preferable to use it because, for example, it is easy to fix the other adherend in the gap of one adherend or to fill the gap with the adhesive tape.
  • the adhesive layer (A) As the adhesive layer (A), as described above, a layer that can be expanded by applying a stimulus such as heat or light can be used. Specifically, a layer containing various resins and an expansion agent is used. be able to.
  • the adhesive layer (A) can be formed, for example, by applying an adhesive composition (a) containing the resin and an expanding agent to a release liner or the like and drying it.
  • the adhesive composition (a) that can be used for forming the adhesive layer (A), as described above a composition containing a resin, an expansion agent, and a solvent as necessary can be used.
  • an epoxy resin, a urethane resin, a silicone resin, a phenol resin, a urea resin, a fluororesin, an acrylonitrile resin, an acrylic resin, a styrene resin, a vinyl resin such as a butadiene resin, or the like is used alone or in combination of two or more. be able to.
  • thermosetting resin As the resin, it is preferable to use an epoxy resin, which has excellent heat resistance after expansion, and the expanded adhesive layer (A ′) is remarkably over time. It is more preferable for obtaining an adhesive tape capable of preventing shrinkage.
  • the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hindered-in type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, triphenylmethane type epoxy resin, and phenol novolac.
  • Type epoxy resin, cresol novolak type epoxy resin, naphthol novolak type epoxy resin, dicyclopentadiene / phenol epoxy resin, alicyclic amine epoxy resin, aliphatic amine epoxy resin, and CTBN modification (carboxy-terminated butadiene nitrile modification) Halogen-modified epoxy resins or the like can be used alone or in combination of two or more, and the use of a cresol novolac type epoxy resin can be caused by the stimulation. Expansion easy, and preferable because it can hold the adhesive strength is excellent even after expansion.
  • thermosetting resin such as the epoxy resin is preferably contained in an amount of 10% by mass to 99% by mass with respect to the entire adhesive layer (A).
  • the adhesive composition (a) it is preferable to use an adhesive composition containing an expansion agent in forming the adhesive layer (A) that can expand by the stimulus.
  • the expansion agent is preferably one that can form a porous structure as the adhesive layer (A ′) after expansion, such as ammonium carbonate, ammonium hydrogen carbonate, ammonium nitrite, ammonium borohydride, azide, and the like.
  • Inorganic compounds fluorinated alkanes such as trichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, hydrazine compounds such as paratoluenesulfonyl hydrazide, semicarbazide compounds such as p-toluenesulfonyl semicarbazide, 5-morpholyl-1,2 Triazole compounds such as 1,3,4-thiatriazole and N-nitroso compounds such as N, N′-dinitrosotephthalamide can be used.
  • azo compounds such as azobisisobutyronitrile
  • hydrazine compounds such as paratoluenesulfonyl hydrazide
  • semicarbazide compounds such as p-toluenesulfonyl semicarbazide
  • 5-morpholyl-1,2 Triazole compounds such as 1,3,4-thiatriazole and N-nitroso compounds such as N
  • an expandable capsule such as a thermally expandable capsule in which a hydrocarbon solvent is microencapsulated can be used.
  • the expansion agent it is preferable to use a material capable of generating gas and expanding at a temperature around the softening point of the resin.
  • expansion agent use of a thermally expandable capsule in which a hydrocarbon solvent is microencapsulated among the above is used, for example, to inhibit the curing of the epoxy resin, or to form an adhesive layer (A ) Is preferable for preventing deterioration and the like.
  • thermally expandable capsule it is preferable to use a capsule having a volume after expansion (volume expansion coefficient) of 8 to 60 times with respect to the volume of the capsule before expansion.
  • thermal expandable capsule examples include EXPANSEL (manufactured by Nippon Philite Co., Ltd.), Matsumoto Microsphere (manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), and Microsphere (manufactured by Kureha Co., Ltd.).
  • the amount of the expansion agent used is preferably in the range of 0.3% by mass to 40% by mass with respect to the total amount of the adhesive layer (A). More preferably, the content is in the range of 0.0% by mass to 30% by mass, and the range of 3.0% by mass to 20% by mass expands to a sufficient volume for filling the voids of the adherend. It is preferable for obtaining an adhesive tape that can be maintained and can maintain an even better adhesive strength.
  • the adhesive composition (a) those containing a curing agent, a curing accelerator and the like can be used as necessary in addition to the above-described ones.
  • curing agent examples include bisphenol A, bisphenol F, bisphenol AD, hydroquinone, resorcin, methyl resorcin, biphenol, tetramethylbiphenol, dihydroxynaphthalene, dihydroxydiphenyl ether, phenol novolac resin, bisphenol A novolac resin, dicyclopentadiene phenol resin.
  • phenol resins such as terpene phenol resin, naphthol novolac resin, biphenyl phenol resin, polyhydric phenol resins obtained by condensation reaction of various phenols with various aldehydes such as hydroxybenzaldehyde, crotonaldehyde, glyoxal, And modified phenols obtained by polycondensation of heavy oil or pitch, phenol and formaldehyde compounds
  • phenolic resins such as methyl resin, acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride and methylnadic acid, amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and dicyandiamide Etc.
  • amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, dia
  • curing accelerator examples include imidazoles such as 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole; 1,8-diazabicyclo [5.4.0] undecene-7, triethylenediamine, benzyl Tertiary amines such as dimethylamine; organic phosphines such as tributylphosphine and triphenylphosphine can be used alone or in combination of two or more.
  • imidazoles such as 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole
  • 1,8-diazabicyclo [5.4.0] undecene-7 triethylenediamine
  • benzyl Tertiary amines such as dimethylamine
  • organic phosphines such as tributylphosphine and triphenylphosphine can be used alone or in combination of two or more.
  • the adhesive tape one having an adhesive layer (B) on one side of the adhesive layer (A) is used.
  • the adhesive layer (B) may be directly laminated on one surface side of the adhesive layer (A), or may be laminated via another layer such as a so-called base material. .
  • the expansion rate in the thickness direction of the adhesive layer (B) [the adhesive layer after being left ( B) thickness / thickness of adhesive layer (B) before standing] ⁇ 100 is 120% or less.
  • the expansion rate of the adhesive layer (B) is preferably 115% or less, and more preferably 100% to 115%.
  • the adhesive tape has the adhesive layer (B) having the expansion coefficient, it is possible to maintain excellent adhesive strength to the adherend even after the adhesive layer (A) has expanded.
  • the expansion rate of the adhesive layer (B) is such that, when the adhesive tape is left in an environment of 130 ° C. for 1 hour, the thickness of the adhesive layer (B) before being left is not changed. It refers to the ratio of the thickness of the adhesive layer.
  • the expansion rate of the adhesive layer (B) is the ratio of the adhesive layer (B) after being left with respect to the thickness of the adhesive layer (B) before being left when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of the thickness of the adhesive layer (B ′).
  • the expansion coefficient indicates a value calculated by the following method.
  • the thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
  • the adhesive tape after being left is taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) is immediately measured.
  • the expansion coefficient is calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] ⁇ 100
  • the thickness of the adhesive layer (B) is preferably in the range of 5 ⁇ m to 150 ⁇ m, and more preferably in the range of 10 ⁇ m to 100 ⁇ m, in order to express even better adhesive strength.
  • the thickness of the adhesive layer (B ′) after being left for 1 hour in the environment of 130 ° C. varies within the above expansion coefficient range as compared with the thickness of the adhesive layer (B) before being left standing. May be.
  • the thickness of the adhesive layer (B ′) is preferably in the range of 1 ⁇ m to 150 ⁇ m, and more preferably in the range of 5 ⁇ m to 100 ⁇ m, in order to express even better adhesive strength.
  • examples of the adhesive layer (B) include a layer having tackiness or adhesiveness, and examples thereof include a thermosetting adhesive layer and a pressure-sensitive adhesive layer.
  • the adhesive layer (B) can be formed using, for example, an adhesive composition (b) capable of forming a sticky or adhesive layer.
  • the adhesive composition (b) for example, an adhesive resin and, if necessary, a hardener can be used.
  • the adhesive bond layer (B) formed using the said adhesive composition (b) has a low expansion coefficient as above-mentioned, it can be used when forming the said adhesive bond layer (A). It is preferable that the swelling agent illustrated as a thing does not contain substantially.
  • the adhesive resin that can be used for the adhesive composition (b) a conventionally known resin can be selected and used.
  • a thermosetting resin or a pressure-sensitive adhesive resin can be used.
  • said adhesive resin when improving the production efficiency of the adhesive tape of this invention, it illustrates as adhesive resin (a) containing resin which can be used for formation of the said adhesive bond layer (A), for example The same ones can be used.
  • the adhesive resin even after the adhesive layer (A) is expanded, it can maintain excellent adhesive strength to the adherend, and particularly has excellent adhesive strength regardless of the influence of heat.
  • a thermosetting resin is preferably used, and an epoxy resin is more preferably used.
  • the epoxy resin it is possible to use the same resin as exemplified for the adhesive composition (a), even after the adhesive layer (A) is expanded. It is preferable for obtaining an adhesive tape having an adhesive layer (B) that can maintain excellent adhesive strength with respect to the adherend and can maintain excellent adhesive strength regardless of the influence of heat.
  • the adhesive composition (b) in addition to those described above, those containing a curing agent, a curing accelerator and the like can be used as necessary.
  • curing agent and hardening accelerator the thing similar to what was illustrated as a hardening
  • a coupling agent in addition to those described above, a coupling agent, a tackifier, an antifoaming agent, a pigment, an antioxidant, a core-shell type reinforcing agent, a thixotropic agent, You may use what contains a heat conductive filler, an insulating filler, etc.
  • the adhesive tape of the present invention for example, the step [1] of forming the adhesive layer (A) by applying the adhesive composition (a) to a release liner and drying it, separately from the step [1], Step [2] of forming the adhesive layer (B) by applying the adhesive composition (b) to a release liner and drying, etc., and the adhesive layer on one side of the adhesive layer (A) It can manufacture by passing (B) and passing through the process [3] of crimping them.
  • the adhesive layer (A) may be partially cured in the process of manufacturing the adhesive tape, but is preferably not substantially expanded or cured.
  • a part of the adhesive layer (B) may also be cured in the process of producing the adhesive tape, but it is preferable that the adhesive layer (B) is not substantially cured.
  • the adhesive tape of the present invention if necessary, a tape having a resin film layer or a metal layer (Z) between the adhesive layer (A) and the adhesive layer (B) is used. Can do. Since such an adhesive tape has good rigidity, it is excellent in sticking workability.
  • the layer (Z) examples include a resin film layer formed using a plastic film such as a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyimide film, and a polyethylene terephthalate film, and a metal such as aluminum and copper. Layer.
  • a plastic film such as a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyimide film, and a polyethylene terephthalate film, and a metal such as aluminum and copper.
  • the layer (Z) it is preferable to use a layer having a thickness of 1 ⁇ m to 200 ⁇ m, and it is more preferable to use a layer having a thickness of 12 ⁇ m to 50 ⁇ m.
  • the adhesive tape of the present invention can be expanded by applying a stimulus to the adhesive layer (A) or the entire adhesive tape.
  • a stimulus include heat and light as described above.
  • Examples of the method for giving the stimulus include methods such as heating and light irradiation, and it is preferable to employ a heating method.
  • the heating temperature is preferably a temperature corresponding to, for example, a temperature at which the expansion agent expands (expansion start temperature), specifically 80 ° C. to 300 ° C., preferably 100 ° C. to 200 ° C. Preferably there is.
  • the adhesive tape of the present invention expands in the thickness direction after the stimulus such as heating is given.
  • the adhesive tape of the present invention does not substantially expand in the flow direction or the width direction after the stimulation such as heating is given.
  • one adherend and the adhesive layer (A) constituting the adhesive tape are pasted in advance.
  • the adhesive layer (B) and another adherend are brought into contact with each other by placing the product obtained in a predetermined position and causing the adhesive layer (A) to stimulate and expand at least the adhesive layer (A).
  • attach is mentioned.
  • the said stimulus may be given to the said adhesive bond layer (A) which comprises the said adhesive tape, and may be given to the said adhesive tape whole.
  • the adhesive tape of the present invention includes, for example, a part (c1-1) constituting the adherend (C1), another part (c1-2) constituting the adherend (C1), or another adherend ( It can be suitably used for the manufacture of an article having a configuration in which C2) is bonded.
  • the article includes a step [1] of previously bonding the adhesive layer (A) constituting the adhesive tape and a portion (c1-1) constituting the adherend (C1), and at least the adhesive By stimulating and expanding the layer (A), the adhesive layer (B) constituting the adhesive tape and the part (c1-2) constituting the adherend (C1) or the adherend (C2) ) And the process [2] for bonding.
  • Examples of the article include a motor mounted on a hybrid vehicle.
  • an adhesive layer (A) that constitutes the adhesive tape and a part of a part such as a magnet are preliminarily bonded to a gap included in a core member that constitutes the motor. After placing, it can be produced by stimulating and expanding at least the adhesive layer (A).
  • the adhesive tape can be used for the purpose of filling the voids of the adherend.
  • at least the adhesive layer A Can be used to form a structure in which two or more locations in the gap are bonded by the adhesive tape.
  • EXPANSEL 051-40 manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 110 ° C., 3.2 parts by mass of a volume expansion coefficient at 130 ° C. of 7 times
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator
  • EXPANSEL 051-40 manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 110 ° C., 3.2 parts by mass of a volume expansion coefficient at 130 ° C. of 7 times
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator
  • Example 1 The thickness of the adhesive composition (a-1) after drying on the surface of a release film obtained by peeling one side of a 75 ⁇ m thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator The adhesive layer (A-1) was prepared by applying the coating solution so that the thickness of the adhesive layer became 50 ⁇ m and drying it with a dryer set at 75 ° C. for 10 minutes.
  • the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator.
  • the adhesive layer (B-1) was prepared by applying the coating to a thickness of 100 ⁇ m and drying for 10 minutes with a dryer set at 75 ° C.
  • the adhesive layer (B-1) is attached to the adhesive layer (A-1) obtained above, and the adhesive layer is moved back and forth once using a 2 kg hand roller. An adhesive tape in which the adhesive layer (B-1) was laminated on one side of (A-1) was obtained.
  • Example 2 Except that the adhesive composition (a-2) was used in place of the adhesive composition (a-1) and the adhesive layer (A-2) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
  • Example 3 Except that the adhesive composition (a-3) was used in place of the adhesive composition (a-1) and an adhesive layer (A-3) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
  • Example 4 Except that the adhesive composition (a-4) was used in place of the adhesive composition (a-1) and the adhesive layer (A-4) was formed, the same method as in Example 1 was used. An adhesive tape was prepared.
  • Example 5 An adhesive layer (A-5) is formed by using the adhesive composition (a-5) instead of the adhesive composition (a-1), and the adhesive composition (b- An adhesive tape was produced in the same manner as in Example 1 except that the adhesive composition (b-2) was used instead of 1) to form the adhesive layer (B-2).
  • Example 6 The thickness of the adhesive composition (a-1) after drying on the surface of a release film obtained by peeling one side of a 75 ⁇ m thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator
  • the layer (A-1) was prepared by coating the film so as to be 50 ⁇ m and drying it with a dryer set at 75 ° C. for 10 minutes.
  • the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator.
  • the adhesive layer (B-1) was prepared by applying the coating to a thickness of 50 ⁇ m and drying for 10 minutes with a dryer set at 75 ° C.
  • the adhesive layer (B-1) is affixed to the polyethylene terephthalate film, and the adhesive layer (A- An adhesive tape in which a polyethylene terephthalate film was laminated on one side of 1) and an adhesive layer (B-1) was laminated on the surface was obtained.
  • the adhesive tape was expanded by leaving it in an environment of 130 ° C. for 1 hour.
  • the thickness of the expanded adhesive tape and the thickness of the adhesive layer constituting it were measured using a thickness meter.
  • the expansion coefficient of the pressure-sensitive adhesive layer (A) was calculated by the following method.
  • the thickness of the adhesive layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after the standing was taken out in a 23 ° C. environment, and the thickness of the adhesive layer (A ′) formed by immediately expanding the adhesive layer (A) was measured.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (A) constituting the adhesive tape after standing] [The thickness of the adhesive layer (A ') formed by swelling] / of the adhesive layer (A) constituting the adhesive tape before standing Thickness] ⁇ 100
  • the expansion coefficient of the pressure-sensitive adhesive layer (B) was calculated by the following method.
  • the thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after the standing was taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) was immediately measured.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] ⁇ 100 The expansion coefficient of the adhesive tape was calculated by the following method.
  • the thickness of the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after standing was taken out in a 23 ° C. environment and immediately measured for its thickness.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [Thickness of the adhesive tape after being left / thickness of the adhesive tape before being left] ⁇ 100
  • the above fixed one was heated at 130 ° C. for 1 hour and then left to stand in a 23 ° C. environment for 30 minutes to cool.
  • the sample with the clip removed is used as a test piece, the ends of the two aluminum plates are chucked, and a tensile test is performed in a 180 ° direction at a tensile speed of 5 mm / min.
  • the adhesive strength of the adhesive tape was determined.
  • the other aluminum plate (C2) (2 in FIG. 1) was placed on the spacer and fixed with a clip. This was heated at 130 ° C. for 1 hour, and the adhesive tape was expanded to thermally bond the two aluminum plates.
  • the adhesive strength of the material from which the clip was removed was chucked at each end of the aluminum plate using a tensile tester, and the direction of 180 ° It was measured by carrying out a tensile test at a tensile speed of 5 mm / min (in the shear direction).
  • the shear adhesive strength 2 was evaluated is preferably approximately 120 N / cm 2 or more, and more preferably 300N / cm 2 or more, and still more preferably 450 N / cm 2 or more.
  • the surface corresponding to the expandable adhesive layer (A) constituting the adhesive tape is attached to the upper surface (C1-1) of the aluminum plate.
  • the above test was conducted. Further, the above-mentioned test was performed on the adhesive tape obtained in Comparative Example 2 so that the surface corresponding to the adhesive layer (B) was attached to one surface (C1-1) of the aluminum plate.
  • the surface corresponding to the adhesive layer (B) constituting the adhesive tape obtained in Examples 1 to 5 is previously pasted on the upper surface (C1-1) of the aluminum plate.
  • the adhesive layer (A) that can expand by stimulation is the same as the above [Method for measuring shearing adhesive force 2] except that it is arranged so as to come into contact with the aluminum plate (C2) after expansion. Shear adhesion was measured.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Permanent Field Magnets Of Synchronous Machinery (AREA)

Abstract

L'invention a pour objectif de fournir un ruban adhésif qui en ce qui concerne les rubans adhésifs à expansion sous l'effet d'une stimulation telle qu'un chauffage, ou similaire, permet de développer une excellente résistance d'assemblage par collage y compris après ladite expansion. Plus précisément, l'invention concerne un ruban adhésif qui est caractéristique en ce qu'il possède une couche d'adhésif (B) directement ou avec une autre couche pour intermédiaire, sur une des faces d'une couche d'adhésif (A). En outre, le taux d'expansion dans la direction de l'épaisseur de ladite couche d'adhésif (A) après repos d'une heure dudit ruban adhésif dans un environnement à 130°C, [épaisseur de la couche d'adhésif (A) après ledit repos / épaisseur de la couche d'adhésif (A) avant ledit repos]×100, est supérieur ou égal à 200%, et le taux d'expansion dans la direction de l'épaisseur de ladite couche d'adhésif (B) [épaisseur de la couche d'adhésif (B) après ledit repos / épaisseur de la couche d'adhésif (B) avant ledit repos]×100, est inférieur ou égal à 120%.
PCT/JP2015/064267 2014-06-11 2015-05-19 Ruban adhésif, composant ainsi que procédé de fabrication de celui-ci, et moteur WO2015190235A1 (fr)

Priority Applications (2)

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CN201580028500.9A CN106459679B (zh) 2014-06-11 2015-05-19 胶带、物品、电动机及物品的制造方法
JP2016524615A JP6041178B2 (ja) 2014-06-11 2015-05-19 接着テープ、物品、モーター及び物品の製造方法

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JPWO2016163514A1 (ja) * 2015-04-10 2017-08-10 株式会社寺岡製作所 接着シート
JP2017137420A (ja) * 2016-02-04 2017-08-10 Dic株式会社 物品の製造方法及びモーターの製造方法
WO2017208838A1 (fr) * 2016-06-02 2017-12-07 Dic株式会社 Bande adhésive thermiquement expansible, et article
WO2019131167A1 (fr) * 2017-12-26 2019-07-04 Dic株式会社 Procédé pour la fabrication d'un article à l'aide d'un ruban adhésif
WO2019155896A1 (fr) * 2018-02-09 2019-08-15 Dic株式会社 Bande adhésive, article, et procédé de fabrication d'article
JP2019182977A (ja) * 2018-04-09 2019-10-24 Dic株式会社 接着テープ、物品、モーター及び物品の製造方法
WO2022244535A1 (fr) * 2021-05-20 2022-11-24 ニッカン工業株式会社 Feuille thermiquement expansible
WO2023275657A1 (fr) * 2021-06-30 2023-01-05 3M Innovative Properties Company Feuille adhésive et procédé de fabrication associé, article et procédé de fabrication associé

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TW201910126A (zh) * 2017-08-16 2019-03-16 日商Ｄｉｃ股份有限公司 接著帶與接著方法
JP6711463B2 (ja) * 2017-08-21 2020-06-17 アイシン・エィ・ダブリュ株式会社 ロータの製造方法およびロータの製造装置
DE102017223042A1 (de) * 2017-12-18 2019-06-19 Volkswagen Aktiengesellschaft Rotor- oder Statoranordnung mit Permanentmagneten
JP7079763B2 (ja) * 2019-12-23 2022-06-02 本田技研工業株式会社 回転電機のロータ、永久磁石組立体、及び回転電機のロータの製造方法
JP7231129B2 (ja) * 2020-12-15 2023-03-01 Dic株式会社 接着シート、並びに物品及び物品の製造方法
JP2023108493A (ja) * 2022-01-25 2023-08-04 大日本印刷株式会社 発泡性接着シートおよび物品の製造方法

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JP2017137420A (ja) * 2016-02-04 2017-08-10 Dic株式会社 物品の製造方法及びモーターの製造方法
WO2017208838A1 (fr) * 2016-06-02 2017-12-07 Dic株式会社 Bande adhésive thermiquement expansible, et article
JPWO2017208838A1 (ja) * 2016-06-02 2019-02-14 Dic株式会社 熱膨張性接着テープ及び物品
WO2019131167A1 (fr) * 2017-12-26 2019-07-04 Dic株式会社 Procédé pour la fabrication d'un article à l'aide d'un ruban adhésif
JPWO2019131167A1 (ja) * 2017-12-26 2020-07-02 Dic株式会社 粘着テープを用いた物品の製造方法
WO2019155896A1 (fr) * 2018-02-09 2019-08-15 Dic株式会社 Bande adhésive, article, et procédé de fabrication d'article
JP2019182977A (ja) * 2018-04-09 2019-10-24 Dic株式会社 接着テープ、物品、モーター及び物品の製造方法
JP7077735B2 (ja) 2018-04-09 2022-05-31 Dic株式会社 接着テープ、物品、モーター及び物品の製造方法
WO2022244535A1 (fr) * 2021-05-20 2022-11-24 ニッカン工業株式会社 Feuille thermiquement expansible
WO2023275657A1 (fr) * 2021-06-30 2023-01-05 3M Innovative Properties Company Feuille adhésive et procédé de fabrication associé, article et procédé de fabrication associé

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JP2017052950A (ja) 2017-03-16
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JPWO2015190235A1 (ja) 2017-04-20
CN106459679B (zh) 2020-10-27
CN106459679A (zh) 2017-02-22

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