WO2015104799A1 - 外観検査装置および外観検査方法 - Google Patents
外観検査装置および外観検査方法 Download PDFInfo
- Publication number
- WO2015104799A1 WO2015104799A1 PCT/JP2014/050109 JP2014050109W WO2015104799A1 WO 2015104799 A1 WO2015104799 A1 WO 2015104799A1 JP 2014050109 W JP2014050109 W JP 2014050109W WO 2015104799 A1 WO2015104799 A1 WO 2015104799A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- result
- control unit
- dimensional shape
- inspection apparatus
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2531—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object using several gratings, projected with variable angle of incidence on the object, and one detection device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Definitions
- FIG. 4 is a schematic diagram for explaining the direction of the inclination and the angle of the gradient that the minute inclination has.
- the inclination direction ⁇ and the inclination angle ⁇ are shown for the minute inclination g.
- the inclination direction ⁇ is obtained as an angle formed by a shadow g (xy) obtained by projecting the minute inclination g on the XY plane and the X direction, and corresponds to the azimuth angle of the minute inclination g.
- the gradient angle ⁇ is obtained as an angle formed by the straight line 1 parallel to the shadow g (xy) and the minute inclination g, and corresponds to the elevation angle of the minute inclination g.
- a slope (concave slope region Gc) existing on the surface Bs of the solder B is searched, and the quality of the state of the solder B is determined based on the result. To do.
- the quality of the state of the solder B is determined based on the result.
- step S108 the variable T is set to zero in step S201.
- Such a variable T is set so that the loop calculation of steps S114, S115, and S202 to S205 for correcting the influence of the reflected light is performed until the variable T reaches Tmax.
- the three-dimensional shape of the imaging region R31 including the surface Bs of the solder B is determined in step S114, and the angles ⁇ and ⁇ are obtained in step S115.
- step S202 the variable T is incremented, and in step S203, it is determined whether or not the variable T is equal to or less than Tmax. If it is determined in step S203 that the variable T is equal to or less than Tmax, the process proceeds to step S204.
- Equation 1 Since the light trajectory represented by Equation 1 does not coincide with the surface of the solder B except for the point (X1, Y1, Z1), among the data indicating the three-dimensional shape of the surface Bs of the solder B, the data satisfying Equation 1 is There is only one of (X1, Y1, Z1).
- the light trajectory expressed by Equation 2 matches the surface Bs of the solder B at points (X3, Y3, Z3) other than the point (X2, Y2, Z2). Therefore, not only data (X2, Y2, Z2) but also data (X3, Y3, Z3) satisfy Equation 2.
- two (or more) data among the data obtained in step S114 satisfy the equation indicating reflected light.
- the control device 100 calculates a three-dimensional shape based on the result of specifying the projector 32 that irradiates the reflected light. In such a configuration, it is possible to calculate the three-dimensional shape of the surface Bs of the solder B with high accuracy while suppressing the influence of reflected light.
- the user interface 200 can be configured to allow the user to set the angles ⁇ and ⁇ that indicate the search condition for the convex slope region Gv. If the convex slope region Gv larger than the predetermined area (the convex slope threshold area) cannot be detected in the added step, it is determined that the state of the solder B is bad in the pass / fail judgment in step S118.
- the specific method for obtaining the three-dimensional shape of the solder B is not limited to the above-described phase shift method, and may be various other methods such as a method using a stereo camera.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14878058.8A EP3070431B1 (en) | 2014-01-08 | 2014-01-08 | Visual inspection device and visual inspection method |
CN201480063618.0A CN106030240B (zh) | 2014-01-08 | 2014-01-08 | 外观检查装置及外观检查方法 |
JP2015556659A JP6116710B2 (ja) | 2014-01-08 | 2014-01-08 | 外観検査装置および外観検査方法 |
PCT/JP2014/050109 WO2015104799A1 (ja) | 2014-01-08 | 2014-01-08 | 外観検査装置および外観検査方法 |
KR1020167010036A KR101816616B1 (ko) | 2014-01-08 | 2014-01-08 | 외관 검사 장치 및 외관 검사 방법 |
US15/103,428 US9933371B2 (en) | 2014-01-08 | 2014-01-08 | Visual inspection apparatus and visual inspection method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/050109 WO2015104799A1 (ja) | 2014-01-08 | 2014-01-08 | 外観検査装置および外観検査方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015104799A1 true WO2015104799A1 (ja) | 2015-07-16 |
Family
ID=53523652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/050109 WO2015104799A1 (ja) | 2014-01-08 | 2014-01-08 | 外観検査装置および外観検査方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9933371B2 (ko) |
EP (1) | EP3070431B1 (ko) |
JP (1) | JP6116710B2 (ko) |
KR (1) | KR101816616B1 (ko) |
CN (1) | CN106030240B (ko) |
WO (1) | WO2015104799A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018163278A1 (ja) * | 2017-03-07 | 2018-09-13 | ヤマハ発動機株式会社 | 外観検査装置、外観検査方法 |
WO2023170814A1 (ja) * | 2022-03-09 | 2023-09-14 | ヤマハ発動機株式会社 | 三次元計測用演算装置、三次元計測用プログラム、記録媒体、三次元計測装置および三次元計測用演算方法 |
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CN108886888B (zh) * | 2016-03-29 | 2020-06-05 | 株式会社富士 | 电子元件安装机的动作确认装置 |
CN110132960B (zh) * | 2018-02-09 | 2021-12-14 | 飞旭电子(苏州)有限公司 | 电路板组件的检测方法 |
CN112683910A (zh) * | 2019-10-19 | 2021-04-20 | 武汉海川云谷软件技术有限公司 | 一种基于图像增强算法的汽车遮阳板视觉防错方法 |
EP3944308A1 (en) * | 2020-07-20 | 2022-01-26 | Nexperia B.V. | A semiconductor device and a method of manufacture |
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2014
- 2014-01-08 JP JP2015556659A patent/JP6116710B2/ja active Active
- 2014-01-08 CN CN201480063618.0A patent/CN106030240B/zh active Active
- 2014-01-08 EP EP14878058.8A patent/EP3070431B1/en active Active
- 2014-01-08 KR KR1020167010036A patent/KR101816616B1/ko active IP Right Grant
- 2014-01-08 US US15/103,428 patent/US9933371B2/en active Active
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018163278A1 (ja) * | 2017-03-07 | 2018-09-13 | ヤマハ発動機株式会社 | 外観検査装置、外観検査方法 |
JPWO2018163278A1 (ja) * | 2017-03-07 | 2019-11-07 | ヤマハ発動機株式会社 | 外観検査装置、外観検査方法 |
WO2023170814A1 (ja) * | 2022-03-09 | 2023-09-14 | ヤマハ発動機株式会社 | 三次元計測用演算装置、三次元計測用プログラム、記録媒体、三次元計測装置および三次元計測用演算方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106030240B (zh) | 2019-04-30 |
KR20160056936A (ko) | 2016-05-20 |
EP3070431A4 (en) | 2017-01-04 |
EP3070431B1 (en) | 2023-12-06 |
JP6116710B2 (ja) | 2017-04-19 |
EP3070431A1 (en) | 2016-09-21 |
CN106030240A (zh) | 2016-10-12 |
US9933371B2 (en) | 2018-04-03 |
US20160320314A1 (en) | 2016-11-03 |
JPWO2015104799A1 (ja) | 2017-03-23 |
KR101816616B1 (ko) | 2018-01-09 |
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