WO2015089967A1 - 触控面板及其制造方法 - Google Patents

触控面板及其制造方法 Download PDF

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Publication number
WO2015089967A1
WO2015089967A1 PCT/CN2014/075904 CN2014075904W WO2015089967A1 WO 2015089967 A1 WO2015089967 A1 WO 2015089967A1 CN 2014075904 W CN2014075904 W CN 2014075904W WO 2015089967 A1 WO2015089967 A1 WO 2015089967A1
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Prior art keywords
electrode
insulating layer
array
layer
transparent conductive
Prior art date
Application number
PCT/CN2014/075904
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English (en)
French (fr)
Inventor
张方振
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/415,694 priority Critical patent/US10045441B2/en
Publication of WO2015089967A1 publication Critical patent/WO2015089967A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Definitions

  • the touch panel is more intuitive and more user-friendly due to its use, in order to improve market competitiveness, reduce production process, and reduce
  • the capacitive touch panel 10' includes a plurality of row-distributed driving electrodes I, a plurality of column-distributed sensing electrodes 12', and a plurality of detecting units (not shown).
  • the driving electrode and the sensing electrode 12' are distributed horizontally and vertically, and a detection capacitance matrix is formed at the intersection.
  • the touch detection principle of the capacitive touch panel is: applying a touch scan signal to each row of driving electrodes, and the detecting unit sequentially detecting the output signals of the sensing electrodes corresponding to each row of driving electrodes, thereby detecting the capacitance change in the detecting capacitance matrix.
  • Implement touch detection to determine the touch location.
  • the driving electrode 11' and the sensing electrode 12' material For electronic products using the touch panel, in order not to affect the screen display, it is necessary to select the driving electrode 11' and the sensing electrode 12' material to have a transmittance of 90% 95%. However, as shown in Fig. 2, when the driving electrodes 11' and the sensing electrodes 12' distributed in the horizontal and vertical directions are formed, the transmittance and the reflectance of the entire portions of the touch panel are different, so that the screen display is uneven.
  • the invention provides a touch panel and a manufacturing method thereof, which are used to solve the difference in transmittance and reflectance of various parts of the entire touch panel when forming the driving electrodes and the sensing electrodes of the horizontal and vertical cross distribution in the prior art. , making the picture display uneven.
  • a touch panel including:
  • the heights of the two are different from each other in the height direction so as to be shifted from each other in the height direction, so that the first electrode, the second electrode sub-member, and the adjacent two of the filler blocks are mutually connected to each other. insulation;
  • the array of second electrode sub-pieces is connected in series by a plurality of rows of second electrodes, and the extending direction of each of the second electrodes is perpendicular to the extending direction of the first electrode.
  • the present invention also provides a method for manufacturing a touch panel, including:
  • a transparent conductive layer Forming a transparent conductive layer, the transparent conductive layer covering the entire substrate, the portion of the transparent conductive layer falling into the window array is formed as an array of second electrode sub-pieces, and the remaining portion is divided by the height difference structure a first electrode and a filler block between the first electrode and the second electrode sub-assembly, and the first electrode, the second electrode component, and adjacent ones of the filler blocks are opposite to each other
  • the heights of the substrate substrates are different so as to be staggered from each other in the height direction, so that the first electrode, the second electrode sub-member, and adjacent ones of the filler blocks are insulated from each other,
  • connection direction of the two end portions exposed by each of the bridge wires is perpendicular to the extending direction of each of the electrodes; each of the second electrode sub-members is overlapped with the end of the corresponding bridge wire, so that the The bridge wire connects the array of second electrode sub-pieces into a plurality of rows of second electrodes, and the extending direction of each of the second electrodes is perpendicular to an extending direction of the first electrode.
  • the transparent conductive layer is divided into the first electrode, the second electrode sub-assembly array and the filling block by the height difference structure, and the second electrode sub-assembly array is connected in series by the conductive bridge wiring array.
  • Two electrodes thus omitting the patterning process for the transparent conductive layer, thereby reducing
  • the production process reduces production costs.
  • the transparent conductive layer covers the entire base substrate, the uniformity of transmittance and reflectance of the entire touch panel is improved, thereby improving the uniformity of the display screen.
  • FIG. 1 is a schematic structural view of a touch panel in the prior art
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 3 is a schematic structural view of a touch panel according to an embodiment of the present invention.
  • Figure 4 is a cross-sectional view taken along line B-B of Figure 3;
  • Figure 5 is a schematic view showing the manufacturing process of the touch panel of Figure 3.
  • a touch panel includes a substrate substrate 10 , an array of conductive bridge wires 1 , an insulating height difference structure, and a transparent conductive layer (eg, indium oxide). Tin, indium zinc oxide).
  • the array of the bridge wires 1 is arranged on the base substrate 10 as shown in FIG.
  • the height difference structure is disposed on the base substrate 10 and covers the column 1 of the bridge.
  • the height difference structure is formed with an array of windows 17, and the window 17 exposes both ends of the bridge wires 1, as shown in FIG.
  • the transparent conductive layer covers the entire base substrate 10, and the portion of the transparent conductive layer that falls into the array of the window 17 is formed as an array of the second electrode sub-pieces 3, and the remaining portion is divided into the first electrode 2 by the height difference structure and located Between the first block 2 and the second electrode sub-piece 3 array between the filling blocks 5, 6, the first electrode 2, the second electrode sub-piece 3 and the adjacent ones of the filling blocks 5, 6 relative to the substrate
  • the heights of the substrates 10 are different so as to be shifted from each other in the height direction, so that the first electrode 2, the second electrode sub-member 3, and the adjacent ones of the filling blocks 5, 6 are insulated from each other as shown in FIG.
  • the connecting directions of the exposed ends of the bridge wires 1 are perpendicular to the extending direction of the first electrode 2, and the second electrode sub-pieces 3 overlapping with the end of the corresponding bridge wire 1 , such that the bridge wire 1 serially connects the second electrode component 3 array into a plurality of rows of second electrodes, the extending direction of each of the second electrodes and the extension of the first electrode 2
  • the direction is vertical, so that a detection capacitance matrix is formed at the intersection of the first electrode 2 and the second electrode, and detection of the touch can be realized.
  • the first electrode 2 is a sensing electrode, and the second electrode is a driving electrode.
  • the size of the bridge wire 1 is very small. In the usual design, the thickness and width of the bridge wire 1 are all below 70 microns.
  • the height difference structure includes a first insulating layer 12 and a second insulating layer 15 located above the first insulating layer 12.
  • Both the first insulating layer 12 and the second insulating layer 15 are formed of an inorganic insulating material.
  • the second insulating layer 15 falls within the range of the first insulating layer 12, and the area of the second insulating layer 15 is smaller than the area of the first insulating layer 12, thereby exposing a portion of the first insulating layer 12, as shown in FIG.
  • Two layers of insulation facilitate the formation of the desired height difference structure.
  • the specific process is as follows: First, the first insulating layer 12 is formed, and a window 17 is formed in the first insulating layer 12 by an etching process, as shown in FIG.
  • a second insulating layer is formed over the first insulating layer 12.
  • the layer 15 is etched to etch the second insulating layer 15 such that the second insulating layer 15 falls within the range of the first insulating layer 12, and the area of the second insulating layer 15 is smaller than that of the first insulating layer 12. The area is such that a portion of the first insulating layer 12 is exposed.
  • the second insulating layer 15 is formed with a plurality of slots 11 , and a portion of the transparent conductive layer falling into the slot 11 is formed as a filling block 6 adjacent to the first electrode 2, and the slot 11 makes The height of the first electrode 2 with respect to the base substrate 10 is different from the height of the adjacent filling block 6 with respect to the base substrate 10, so that the first electrode 2 and the adjacent filling block 6 are staggered in the height direction.
  • the first electrode 2 and the filling block 5, which are the same height as the base substrate 10, are separated by the slit 11.
  • the touch panel in this embodiment further includes a photosensitive layer 14 disposed on the second insulating layer 15 and forming the first electrode. Between the transparent conductive layers of 2, the cross sections of the second insulating layer 15 and the photosensitive layer 14 are formed into a plurality of T-shaped structures having a large end and a large bottom end.
  • the first insulating layer 12 and the second insulating layer 15 are selected from silicon nitride, silicon oxide, silicon oxynitride or a combination of any two or a combination of the three, and the T is formed by the following process.
  • Type structure :
  • a photosensitive layer 14 is coated on the second insulating layer 15, such as a transparent organic resin layer, as shown in FIG. 8; then, the photosensitive layer 14 is exposed and developed to form a photosensitive layer non-retained region and a photosensitive layer. Retaining area, as shown in FIG. 9; Finally, the second insulating layer 15 of the photosensitive layer non-retained area is engraved by dry etching, and a plurality of slots 11 are formed to expose the first insulating layer 12, so that the first insulating layer 12 The surface forms a height difference.
  • the longitudinal cross section of the second insulating layer 15 and the remaining photosensitive layer 14 constitutes a T-shaped structure having a small end and a large bottom end, as shown in FIG. 10, thereby ensuring a transparent conductive layer.
  • the transparent conductive layer is divided into the first electrode, the second electrode sub-assembly array and the filling block by the height difference structure, and the second electrode sub-assembly array is connected in series by the conductive bridge wiring array.
  • the two electrodes thus omitting the patterning process for the transparent conductive layer, reduce the manufacturing process and reduce the production cost.
  • the transparent conductive layer covers the entire base substrate, the uniformity of transmittance and reflectance of the entire touch panel is improved, thereby improving the uniformity of the display screen.
  • the scale of the bridge wire 1 is very small, the array of the bridge wires 1 does not adversely affect the uniformity of the transmittance and reflectance of the touch panel.
  • the transparent display layer is divided into two parts of the filling block 5 and the filling block 6 by the height difference structure, wherein the filling block 6 and The first electrode 2 is flush.
  • the present invention is not limited thereto, and the filling block 5 and the filling block 6 may be formed integrally, and the first electrode 2, the second electrode sub-member 3, and the adjacent one of the filling blocks are opposed to the base substrate 10
  • the heights are different so as to be staggered from each other in the height direction, so that the first electrode 2, the second electrode sub-member 3, and the adjacent two of the filler blocks are insulated from each other.
  • the heights of the first electrode 2, the second electrode sub-member 3, and the filling block with respect to the base substrate 10 are the highest, the first electrode 2 is the highest, the filling block is second, and the second electrode sub-piece 3 is the lowest.
  • the present invention is not limited thereto, and it may be set such that the first electrode 2 is the lowest, the filling block is second, and the array of the second electrode sub-pieces 3 is the highest.
  • an array of recesses may be formed on the second insulating layer 15, and a portion of the transparent conductive layer falling into the array of recesses is formed as an array of the second electrode sub-pieces 3, and then the array of the second electrode sub-pieces 3 is electrically conductive.
  • the array of bridge wires 1 is connected in series to a plurality of columns of second electrodes. Or, you can set it to other height order.
  • the touch panel may further include a third insulating layer 16 and the third insulating layer 16 and the substrate The top surface of the opposite side of the substrate 10 serves as an insulation protection as shown in FIG.
  • the following describes a method for manufacturing a touch panel according to the present invention, and specifically includes: preparing a substrate 10;
  • the transparent conductive layer covers the entire base substrate 10, the portion of the transparent conductive layer falling into the array of the window 17 is formed as an array of the second electrode sub-pieces 3, and the remaining portion is divided into the first by the height difference structure.
  • An electrode 2 and filling blocks 5 and 6 between the first electrode 2 and the second electrode sub-piece 3 array, the first electrode 2, the second electrode sub-member 3 and the adjacent two of the filling blocks 5 and 6 The heights are different from each other with respect to the base substrate 10 so as to be staggered from each other in the height direction, so that the first electrode 2, the second electrode sub-member 3, and the adjacent ones of the filling blocks 5 and 6 are insulated from each other,
  • the connecting directions of the two end portions of the bridge wires 1 are perpendicular to the extending direction of the first electrode 2; the second electrode sub-members 3 are overlapped with the ends of the corresponding bridge wires 1, so that the bridge wires 1 will
  • the second electrode sub-piece 3 array is serially connected in a plurality of rows of second electrodes, and each of the second electrodes extends in a direction perpendicular to the extending direction of the first electrode 2.
  • the first electrode 2 is a sensing electrode, and the second electrode is a driving electrode.
  • the steps of forming the height difference structure include:
  • the first insulating layer 12 is formed, and an array of windows 17 is formed in the first insulating layer 12 by an etching process, as shown in FIG. 7;
  • a second insulating layer 15 is formed over the first insulating layer 12, and the second insulating layer 15 is etched by an etching process, so that the second insulating layer 15 falls within the range of the first insulating layer 12, ::: The area of the insulating layer 15 is smaller than the area of the first insulating layer 12, thereby exposing a portion of the first insulating layer 12.
  • the first insulating layer 12 and the second insulating layer 15 are each formed of an inorganic insulating material.
  • the gap 11 is such that the height of the first electrode 2 relative to the base substrate 10 is different from the height of the adjacent filling block 6 relative to the base substrate 10, thereby The first electrode 2 is shifted from the adjacent filling block 6 in the height direction.
  • the first electrode 2 and the filling block 5, which are the same height as the base substrate 10, are separated by the slit 11.
  • the step of etching the second insulating layer 15 further includes:
  • a photosensitive layer 14 such as a transparent organic resin layer is coated on the second insulating layer 15, as shown in FIG.
  • the photosensitive layer 14 is exposed and developed to form a photosensitive layer non-retained region and a photosensitive layer retention region, as shown in FIG.
  • the second insulating layer 15 of the photosensitive layer non-retained region is etched away by the dry etching, and a plurality of slits 11 are formed to expose the first insulating layer 12 such that the surface of the first insulating layer 12 forms a height difference. Due to the undercut phenomenon in the dry etching process, the longitudinal section of the second insulating layer 15 and the remaining photosensitive layer 14 constitutes a T-shaped structure having a small top end and a small end, as shown in FIG.
  • the first electrode 2 and the adjacent filling block 6 can be completely broken by the slit 11, as shown in Fig. 11.
  • the manufacturing method of the touch panel prepared in the embodiment further includes the step of forming the third insulating layer 16, and the third insulating layer 16 constitutes a top surface of the side opposite to the substrate substrate 10. For protection of insulation) 3 ⁇ 4, as shown in Figure 4.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

本发明涉及触控技术领域，公开了一种触控面板及其制造方法。在所述触控面板中，透明导电层被所述高度差结构分割成为第一电极、第二电极子件阵列和填充块，并且第二电极子件阵列由导电的桥接线阵列串接成多列第二电极，因此省略了对透明导电层进行的构图工艺，从而减少了制作工艺，降低了生产成本。同时，由于透明导电层覆盖整个衬底基板，改善了整个触控面板透光率和反射率的均匀性，进而改善了显示画面的均匀性。

Description

)进步， 触控面板因其在使^上更直观， 更符合人性化设什， 为了提高市场竞争力， 减少制作工艺， 降
Figure imgf000002_0001
在触控面板技术中 ^于电阻式触控面板，
长、 透光率高、 可以支持多点触控等优点。 并且， 电容式触控面板对噪声和 对地寄生电容也有很好的抑制作用。 因此， 电容式触摸屏已成为如今触控面 板制造的热点之一。 如图 1所示， 触控面板 10 ' 包括多条行分布的驱动电极 I 、 多条列分布的感应电极 12 ' 以及多个检测单元 （图中未示出）。 驱动电 极 和感应电极 12 ' 横纵交叉分布， 并在交叉处形成检测电容矩阵。 电容 式触控面板的触摸检测原理为： 分别向各行驱动电极施加触控扫描信号， 检 测单元依次检测与每行驱动电极对应的感应电极的输出信号， 从而检测出检 测电容矩阵中的电容变化， 实现触摸检测， 确定触摸位置。
对于使用触控面板的电子产品， 为了不影响画面显示， 需要选择驱动电 极 11 ' 和感应电极 12 ' 材料的透过率为 90% 95 %。 但是， 如图 2所示， 在 形成横纵交叉分布的驱动电极 11 ' 和感应电极 12 ' 时， 会导致整个触控面板 各部分的透光率和反射率不同， 使得画面显示不均匀。
本发明提供一种触控面板及其制造方法， 用以解决现有技术中在形成横 纵交叉分布的驱动电极和感应电极时， 会导致整个触控面板各部分的透过率 和反射率不同， 使得画面显示不均匀的问题。
为解决上述技术问题， 本发明提供一种触控面板， 包括：
衬底基板； 绝缘的高度差结构， 所述高度差结构布置在所述衬底基板上； 透明导电层， 所述透明导电层覆盖整个所述衬底基板， 所述透明导电层 被所述高度差结构分割成为第一电极、 第二电极子件阵列以及位于第一电极 和第二电极子件阵列之间的填充块， 所述第一电极、 所述第二电极子件和所 述填充块中的相邻两者之间相对于所述衬底基板的高度不同从而在高度方向 上彼此错开， 使得所述第一电极、 所述第二电极子件和所述填充块中的相邻 两者之间彼此绝缘；
其中，所述第二电极子件阵列由导电的桥接线阵列串接成多列第二电极， 各所述第二电极的延伸方向与所述第一电极的延伸方向垂直。
此外， 本发明还提供一种制造触控面板的方法， 包括：
准备衬底基板；
在所述衬底基板上形成导电的桥接线阵列；
形成绝缘的高度差结构， 所述高度差结构布置在所述衬底基板上并且覆 盖所述桥接线阵列， 所述高度差结构形成有窗口阵列， 所述窗口阵列露出各 桥接线的两个端部；
形成透明导电层， 所述透明导电层覆盖整个所述衬底基板， 所述透明导 电层落入所述窗口阵列的部分形成为第二电极子件阵列， 其余部分被所述高 度差结构分割成为第一电极和位于第一电极和第二电极子件阵列之间的填充 块， 所述第一电极、 所述第二电极子件和所述填充块中的相邻两者之间相对 于所述衬底基板的高度不同从而在高度方向上彼此错开，使得所述第一电极、 所述第二电极子件和所述填充块中的相邻两者之间彼此绝缘，
其中， 各所述桥接线露出的两个端部的连线方向与所述每一电极的延伸 方向垂直； 各所述第二电极子件与相应的桥接线的端部搭接， 使得所述桥接 线将所述第二电极子件阵列串接成多列第二电极， 各所述第二电极的延伸方 向与所述第一电极的延伸方向垂直。
本发明的上述技术方案的有益效果如下：
上述技术方案中， 于透明导电层被所述高度差结构分割成为第一电极、 第二电极子件阵列和填充块， 并且第二电极子件阵列由导电的桥接线阵列串 接成多列第二电极， 因此省略了对透明导电层进行的构图工艺， 从而减少了 制作工艺， 降低了生产成本。 同时， 由于透明导电层覆盖整个衬底基板， 改 善了整个触控面板透光率和反射率的均匀性，进而改善了显示画面的均匀性。
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面 描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不^出创造性劳动性的前提下， 还可以根据这些附图获得其他的附图。
图 1表示现有技术中触控面板的结构示意图；
图 2表示图 1沿 A- A方向的剖视图；
图 3表示本发明实施例中触控面板的结构示意图；
图 4表示图 3沿 B- B方向的剖视图；
图 5 图 11表示图 3中触控面板的制造过程示意图。
下面将结合 图和实施例，对本发明的具体实施方式作进一步详细描述。 以下实施例用于说明本发明， 但不用来限制本发明的范围。
如图 3 图 1 1所示， 本发明实施例中提供一种触控面板， 其包括衬底基 板 10、 导电的桥接线 1的阵列、 绝缘的高度差结构、 透明导电层 （如： 氧化 铟锡、 氧化铟锌）。 其中， 桥接线 1的阵列布置在衬底基板 10上， 如图 5所 示。所述高度差结构布置在衬底基板 10上并且覆盖桥接线 1 列， 所述高度 差结构形成有窗口 17阵列， 窗口 17 列露出各桥接线 1的两个端部， 如图 7所示。 所述透明导电层覆盖整个衬底基板 10， 所述透明导电层落入窗口 17 阵列的部分形成为第二电极子件 3阵列， 其余部分被所述高度差结构分割成 为第一电极 2以及位于第一电极 2和第二电极子件 3阵列之间的填充块 5，6， 第一电极 2、 第二电极子件 3和填充块 5、 6中的相邻两者之间相对于衬底基 板 10的高度不同从而在高度方向上彼此错开， 使得第一电极 2、 第二电极子 件 3和填充块 5、 6中的相邻两者之间彼此绝缘， 如图 11所示。 各桥接线 1 露出的两个端部的连线方向与第一电极 2的延伸方向垂直， 各第二电极子件 3与相应的桥接线 1的端部搭接， 使得桥接线 1将第二电极子件 3阵列串接 成多列第二电极，各所述第二电极的延伸方向与第一电极 2的延伸方向垂直， 从而在第一电极 2和所述第二电极的交叉处形成检测电容矩阵， 能够实现对 触摸的检测。
其中， 第一电极 2为感应电极， 所述第二电极为驱动电极。 桥接线 1的 尺度非常小， 在通常的设计中， 桥接线 1的厚度和宽度均为 70微米以下。
具体的， 所述高度差结构包括第一绝缘层 12和位于第一绝缘层 12上方 的第二绝缘层 15， 第一绝缘层 12和第二绝缘层 15均由无机绝缘材质形成。 其中， 第二绝缘层 15落入第一绝缘层 12的范围内， 第二绝缘层 15的面积小 于第一绝缘层 12的面积， 从而露出部分第一绝缘层 12， 如图 10所示。 两层 绝缘层方便形成所需的高度差结构。 具体的工艺过程为： 首先， 形成第一绝 缘层 12， 采用刻蚀工艺在第一绝缘层 12中形成窗口 17 列， 如图 7所示； 然后， 在第一绝缘层 12上方形成第二绝缘层 15， 采) ¾刻蚀工艺对第二绝缘 层 15进行刻蚀， 使得第二绝缘层 15落入第一绝缘层 12的范围内， 第二绝缘 层 15的面积小于第一绝缘层 12的面积， 从而露出部分第一绝缘层 12。
进一步地， 第二绝缘层 15形成有多个槽隙 11， 所述透明导电层落入所 述槽隙 11的部分形成为与所述第一电极 2相邻的填充块 6， 槽隙 11使得第 一电极 2相对于衬底基板 10的高度不同于相邻的填充块 6相对于衬底基板 10的高度，丛而使得第一电极 2与相邻的填充块 6在高度方向上错开。同时， 相当于衬底基板 10高度相同的第一电极 2和填充块 5通过槽隙 11隔开。
为了使得第一电极 2和相邻的填充块 6通过槽隙 11完全断开，本实施例 中的触控面板还包括光敏层 14， 光敏层 14布置在第二绝缘层 15与形成第一 电极 2的透明导电层之间， 第二绝缘层 15和光敏层 14的截面形成为顶端大 底端小的多个 T型结构。
在一个具体的实施方式中，第一绝缘层 12和第二绝缘层 15选择氮化硅、 氧化硅、 氮氧化硅或任意两者的结合或三者的结合， 并通过以下过程形成所 述 T型结构：
首先， 在第二绝缘层 15上涂覆光敏层 14， 如： 透明有机树脂层， 如图 8 所示； 然后， 对光敏层 14进行曝光， 显影， 形成光敏层不保留区域和光敏层 保留区域， 如图 9所示； 最后， 采用干刻法刻馊掉光敏层不保留区域的第二 绝缘层 15， 形成多个槽隙 11， 露出第一绝缘层 12， 使得第一绝缘层 12的表 面形成一个高度差。 由于千刻过程中会出现底层过刻现象， 使得第二绝缘层 15和剩余的光敏层 14的纵截面组成顶端大底端小的 T型结构，如图 10所示， 从而可以保证透明导电层不同高度旦相邻图案之间的完全断开，如图 11所示。
上述技术方案中， 由于透明导电层被所述高度差结构分割成为第一电极、 第二电极子件阵列和填充块， 并且第二电极子件阵列由导电的桥接线阵列串 接成多列第二电极， 因此省略了对透明导电层进行的构图工艺， 丛而减少了 制作工艺， 降低了生产成本。 同时， 由于透明导电层覆盖整个衬底基板， 改 善了整个触控面板透光率和反射率的均匀性，进而改善了显示画面的均匀性。 此外， 由于桥接线 1的尺度非常小， 所以桥接线 1的阵列不会对触控面板透 光率和反射率的均匀性产生负面的影响。
显然， 以上只是为了有助于发明的理解而作的举例， 对于本技术领域的 普通技术人员来说， 在不脱离本发明技术原理的前提下， 还可以做出不同的 变型。
例如， 在上述实施例中， 在第一电极 2和第二电极子件 3的 列之间， 透明显示层被高度差结构分割成为填充块 5和填充块 6两部分， 其中， 填充 块 6与第一电极 2齐平。 然而， 本发明不限于此， 填充块 5和填充块 6可以 形成为一体， 并且第一电极 2、 第二电极子件 3和填充块中的相邻两者之间 相对于衬底基板 10的高度不同从而在高度方向上彼此错开，使得第一电极 2、 第二电极子件 3和填充块中的相邻两者之间彼此绝缘。
此外， 在上述实施例中， 第一电极 2、 第二电极子件 3和填充块相对于 衬底基板 10的高度为，第一电极 2最高，填充块其次，第二电极子件 3最低。 然而， 本发明不限于此， 可以设定为， 第一电极 2最低， 填充块其次， 第二 电极子件 3的阵列最高。在这种情况下， 第二绝缘层 15上可以形成有凹部阵 列， 透明导电层落入凹部阵列的部分形成为第二电极子件 3的阵列， 然后第 二电极子件 3的阵列由导电的桥接线 1的阵列串接成多列第二电极。 或者， 可以设定为其他高度顺序。
最后， 触控面板还可以包括第三绝缘层 16， 第三绝缘层 16构成与衬底 基板 10相反的一侧的顶面， 起到绝缘保护的作用， 如图 4所示。
在实际应用过程中， 需保证触控面板中各层的透过率大于 90 %， 最好大 于 95 %， 以不影响正常的画面显示。
下面结合图 4-图 11，说明根据本发明的触控面板的制造方法，具体包括: 准备衬底基板 10;
在衬底基板 10上形成导电的桥接线 1阵列；
形成绝缘的高度差结构，所述高度差结构布置在衬底基板 10上并且覆盖 桥接线 1阵列， 所述高度差结构形成有窗口 17阵列， 窗口 17阵列露出各桥 接线 1的两个端部；
形成透明导电层， 所述透明导电层覆盖整个衬底基板 10， 所述透明导电 层落入窗口 17阵列的部分形成为第二电极子件 3阵列，其余部分被所述高度 差结构分割成为第一电极 2和位于第一电极 2和第二电极子件 3阵列之间的 填充块 5和 6， 第一电极 2、第二电极子件 3和填充块 5和 6中的相邻两者之 间相对于衬底基板 10的高度不同从而在高度方向上彼此错开，使得第一电极 2、 第二电极子件 3和填充块 5和 6中的相邻两者之间彼此绝缘，
其中， 各桥接线 1露出的两个端部的连线方向与第一电极 2的延伸方向 垂直； 各第二电极子件 3与相应的桥接线 1的端部搭接， 使得桥接线 1将第 二电极子件 3阵列串接成多列第二电极， 各第二电极的延伸方向与第一电极 2的延伸方向垂直。
其中， 第一电极 2为感应电极， 所述第二电极为驱动电极。
如图 6 图 10所示， 形成所述高度差结构的歩骤包括：
首先， 形成第一绝缘层 12， 采用刻蚀工艺在第一绝缘层 12 中形成窗口 17阵列， 如图 7所示；
然后， 在第一绝缘层 12上方形成第二绝缘层 15， 采用刻蚀工艺对第二 绝缘层 15进行刻蚀， 使得第二绝缘层 15落入第一绝缘层 12的范围内， 第::：:: 绝缘层 15的面积小于第一绝缘层 12的面积， 从而露出部分第一绝缘层 12。
其中， 第一绝缘层 12和第二绝缘层 15均 无机绝缘材质形成。
进一步地， 上述工艺过程中， 在对第二绝缘层 15进行刻烛的步骤中， 在 第二绝缘层 15中形成多个槽隙 11 , 所述透明导电层落入所述槽隙 11的部分 形成为与所述第一电极 2相邻的填充块 6， 橹隙 11使得第一电极 2相对于衬 底基板 10的高度不同于相邻的填充块 6相对于衬底基板 10的高度， 从而使 得第一电极 2与相邻的填充块 6在高度方向上错开。 同时， 相当于衬底基板 10高度相同的第一电极 2和填充块 5通过槽隙 11隔开。
进一步地， 对所述第二绝缘层 15进行刻蚀的步骤还包括：
首先， 在第二绝缘层 15上涂覆光敏层 14 , 如： 透明有机树脂层， 如图 8 所示；
然后， 对光敏层 14进行曝光， 显影， 形成光敏层不保留区域和光敏层保 留区域， 如图 9所示；
最后， 釆^干刻法刻蚀掉光敏层不保留区域的第二绝缘层 15， 形成多个 槽隙 11， 露出第一绝缘层 12， 使得第一绝缘层 12的表面形成一个高度差。 由于干刻过程中会出现底层过刻现象， 使得第二绝缘层 15 和剩余的光敏层 14的纵截面组成顶端大底端小的 T型结构， 如图 10所示。
通过上述歩骤形成的 T型结构， 可以使得第一电极 2和相邻的填充块 6 通过槽隙 11完全断开， 如图 11所示。
最后，本实施例中制备触控面板的制造方法还包括形成第三绝缘层 16的 步骤， 第三绝缘层 16构成与衬底基板 10相反的一侧的顶面。 起到绝缘保护 的作) ¾， 如图 4所示。
在实际应用过程中， 需保证触控面板中各层的透过率大于 90 %， 最好大 于 95 % , 以不影响正常的画面显示。
本发明的技术方案可以用于 Add On , 0GS、 On Cel l等触摸显示装置上。 以上所述仅是本发明的优选实施方式， 应当指出， 对于本技术领域的普 通技术人员来说， 在不脱离本发明技术原理的前提下， 还可以做出若干改进 和替换， 这些改进和替换也应视为本发明的保护范围。

Claims

1. 一种触控面板， 其特征在于， 包括：
衬底基板；
绝缘的高度差结构， 所述高度差结构布置在所述衬底基板上；
透明导电层， 所述透明导电层覆盖整个所述衬底基板， 所述透明导电层 被所述高度差结构分割成为第一电极、 第二电极子件阵列以及位于第一电极 和第二电极子件阵列之间的填充块， 所述第一电极、 所述第二电极子件和所 述填充块中的相邻两者之间相对于所述衬底基板的高度不同从而在高度方向 上彼此错开， 使得所述第一电极、 所述第二电极子件和所述填充块中的相邻 两者之间彼此绝缘；
其中，所述第二电极子件阵列由导电的桥接线阵列串接成多列第二电极， 各所述第二电极的延伸方向与所述第一电极的延伸方向垂直。
2. 根据权利要求 1所述的触控面板， 其特征在于，
所述高度差结构包括第一绝缘层和位于所述第一绝缘层上方的第二绝缘 层， 所述第一绝缘层和所述第二绝缘层均由无机绝缘材质形成；
所述第一绝缘层形成有窗口阵列， 所述透明导电层填充在所述窗口阵列 的部分形成为所述第二电极子件阵列；
所述第二绝缘层落在所述第一绝缘层的范围内， 所述第二绝缘层的面积 小于所述第一绝缘层的面积， 从而露出部分第一绝缘层。
3. 根据权利要求 2所述的触控面板， 其特征在于，
所述第二绝缘层形成有多个槽隙， 所述透明导电层填充在所述槽隙的部 分形成为与所述第一电极相邻的填充块。
4. 根据权利要求 2或 3所述的触控面板， 其特征在于，
所述桥接线阵列布置在所述衬底基板上， 并且所述第一绝缘层覆盖所述 桥接线阵列， 所述窗口阵列露出各桥接线的两个端部；
各所述桥接线露出的两个端部的连线方向与所述每一电极的延伸方向垂 1£; 各所述第二电极子件与相应的桥接线的端部搭接， 使得所述第二电极子 件阵列串接成多列所述第二电极。
5. 根据权利要求 2至 4中任一项所述的触控面板， 其特征在于， 还包括光敏层， 所述光敏层布置在所述第二绝缘层与所述透明导电层之 间， 所述第二绝缘层和所述光敏层的截面形成为顶端大底端小的多个 T型结 构。
6. 根据权利要求 1至 5中任一项所述的触控面板， 其特征在于， 还包括第三绝缘层， 所述第三绝缘层构成与所述衬底基板相反的一侧的 顶面。
7. 根据权利要求 1至 6中任一项所述的触控面板， 其特征在于， 所述第一电极为感应电极， 所述第二电极为驱动电极。
8. 一种触控面板的制造方法， 其特征在于， 包括：
准备衬底基板；
在所述衬底基板上形成导电的桥接线阵列；
形成绝缘的高度差结构， 所述高度差结构布置在所述衬底基板上并且覆 盖所述桥接线阵列， 所述高度差结构形成有窗口阵列， 所述窗口阵列露出各 桥接线的两个端部；
形成透明导电层， 所述透明导电层覆盖整个所述衬底基板， 所述透明导 电层落入所述窗口阵列的部分形成为第二电极子件阵列， 其余部分被所述高 度差结构分割成为第一电极和位于第一电极和第二电极子件阵列之间的填充 块， 所述第一电极、 所述第二电极子件和所述填充块中的相邻两者之间相对 于所述衬底基板的高度不同从而在高度方向上彼此错开，使得所述第一电极、 所述第二电极子件和所述填充块中的相邻两者之间彼此绝缘，
其中， 各所述桥接线露出的两个端部的连线方向与所述每一电极的延伸 方向垂直； 各所述第二电极子件与相应的桥接线的端部搭接， 使得所述桥接 线将所述第二电极子件阵列串接成多列第二电极， 各所述第二电极的延伸方 向与所述第一电极的延伸方向垂直。
9. 根据权利要求 8所述的制造方法， 其特征在于，
形成所述高度差结构的步骤包括：
首先形成第一绝缘层， 采用刻蚀工艺在第一绝缘层中形成窗口阵列； 然后在所述第一绝缘层上方形成第二绝缘层， 采用刻蚀工艺对所述第二 绝缘层进行刻蚀， 使得所述第二绝缘层落入所述第一绝缘层的范園内， 所述 第二绝缘层的面积小于所述第一绝缘层的面积， 从而露出部分第一绝缘层， 其中， 所述第一绝缘层和所述第二绝缘层均由无机绝缘 质形成。
10. 根据权利要求 9所述的制造方法， 其特征在于，
在对所述第二绝缘层进行刻蚀的步骤中， 在所述第二绝缘层中形成多个 槽隙， 所述透明导电层落入所述槽隙的部分形成为与所述第一电极相邻的填 充块。
1 L 根据权利要求 9或 10所述的制造方法， 其特征在于，
对所述第二绝缘层进行刻蚀的步骤包括：
在所述第二绝缘层上涂覆光敏层；
对所述光敏层进行曝光， 显影， 形成光敏层不保留区域和光敏层保留区 采用干刻法刻蚀掉所述第二绝缘层位于光敏层不保留区域的部分， 露出 所述第一绝缘层， 所述第二绝缘层和所述光敏层的截面形成为顶端大底端小 的多个 T型结构。
12. 根据权利要求 8至 11中任一项所述的制造方法， 其特征在于， 包括形成第三绝缘层的步骤， 该第三绝缘层构成与衬底基板相反的一侧 的顶面。
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