WO2015089967A1 - 触控面板及其制造方法 - Google Patents
触控面板及其制造方法 Download PDFInfo
- Publication number
- WO2015089967A1 WO2015089967A1 PCT/CN2014/075904 CN2014075904W WO2015089967A1 WO 2015089967 A1 WO2015089967 A1 WO 2015089967A1 CN 2014075904 W CN2014075904 W CN 2014075904W WO 2015089967 A1 WO2015089967 A1 WO 2015089967A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- insulating layer
- array
- layer
- transparent conductive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 15
- 238000005530 etching Methods 0.000 claims description 8
- 230000000717 retained effect Effects 0.000 claims description 7
- 238000001312 dry etching Methods 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000003491 array Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 abstract description 10
- 238000000059 patterning Methods 0.000 abstract description 3
- 238000002310 reflectometry Methods 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Definitions
- the touch panel is more intuitive and more user-friendly due to its use, in order to improve market competitiveness, reduce production process, and reduce
- the capacitive touch panel 10' includes a plurality of row-distributed driving electrodes I, a plurality of column-distributed sensing electrodes 12', and a plurality of detecting units (not shown).
- the driving electrode and the sensing electrode 12' are distributed horizontally and vertically, and a detection capacitance matrix is formed at the intersection.
- the touch detection principle of the capacitive touch panel is: applying a touch scan signal to each row of driving electrodes, and the detecting unit sequentially detecting the output signals of the sensing electrodes corresponding to each row of driving electrodes, thereby detecting the capacitance change in the detecting capacitance matrix.
- Implement touch detection to determine the touch location.
- the driving electrode 11' and the sensing electrode 12' material For electronic products using the touch panel, in order not to affect the screen display, it is necessary to select the driving electrode 11' and the sensing electrode 12' material to have a transmittance of 90% 95%. However, as shown in Fig. 2, when the driving electrodes 11' and the sensing electrodes 12' distributed in the horizontal and vertical directions are formed, the transmittance and the reflectance of the entire portions of the touch panel are different, so that the screen display is uneven.
- the invention provides a touch panel and a manufacturing method thereof, which are used to solve the difference in transmittance and reflectance of various parts of the entire touch panel when forming the driving electrodes and the sensing electrodes of the horizontal and vertical cross distribution in the prior art. , making the picture display uneven.
- a touch panel including:
- the heights of the two are different from each other in the height direction so as to be shifted from each other in the height direction, so that the first electrode, the second electrode sub-member, and the adjacent two of the filler blocks are mutually connected to each other. insulation;
- the array of second electrode sub-pieces is connected in series by a plurality of rows of second electrodes, and the extending direction of each of the second electrodes is perpendicular to the extending direction of the first electrode.
- the present invention also provides a method for manufacturing a touch panel, including:
- a transparent conductive layer Forming a transparent conductive layer, the transparent conductive layer covering the entire substrate, the portion of the transparent conductive layer falling into the window array is formed as an array of second electrode sub-pieces, and the remaining portion is divided by the height difference structure a first electrode and a filler block between the first electrode and the second electrode sub-assembly, and the first electrode, the second electrode component, and adjacent ones of the filler blocks are opposite to each other
- the heights of the substrate substrates are different so as to be staggered from each other in the height direction, so that the first electrode, the second electrode sub-member, and adjacent ones of the filler blocks are insulated from each other,
- connection direction of the two end portions exposed by each of the bridge wires is perpendicular to the extending direction of each of the electrodes; each of the second electrode sub-members is overlapped with the end of the corresponding bridge wire, so that the The bridge wire connects the array of second electrode sub-pieces into a plurality of rows of second electrodes, and the extending direction of each of the second electrodes is perpendicular to an extending direction of the first electrode.
- the transparent conductive layer is divided into the first electrode, the second electrode sub-assembly array and the filling block by the height difference structure, and the second electrode sub-assembly array is connected in series by the conductive bridge wiring array.
- Two electrodes thus omitting the patterning process for the transparent conductive layer, thereby reducing
- the production process reduces production costs.
- the transparent conductive layer covers the entire base substrate, the uniformity of transmittance and reflectance of the entire touch panel is improved, thereby improving the uniformity of the display screen.
- FIG. 1 is a schematic structural view of a touch panel in the prior art
- Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
- FIG. 3 is a schematic structural view of a touch panel according to an embodiment of the present invention.
- Figure 4 is a cross-sectional view taken along line B-B of Figure 3;
- Figure 5 is a schematic view showing the manufacturing process of the touch panel of Figure 3.
- a touch panel includes a substrate substrate 10 , an array of conductive bridge wires 1 , an insulating height difference structure, and a transparent conductive layer (eg, indium oxide). Tin, indium zinc oxide).
- the array of the bridge wires 1 is arranged on the base substrate 10 as shown in FIG.
- the height difference structure is disposed on the base substrate 10 and covers the column 1 of the bridge.
- the height difference structure is formed with an array of windows 17, and the window 17 exposes both ends of the bridge wires 1, as shown in FIG.
- the transparent conductive layer covers the entire base substrate 10, and the portion of the transparent conductive layer that falls into the array of the window 17 is formed as an array of the second electrode sub-pieces 3, and the remaining portion is divided into the first electrode 2 by the height difference structure and located Between the first block 2 and the second electrode sub-piece 3 array between the filling blocks 5, 6, the first electrode 2, the second electrode sub-piece 3 and the adjacent ones of the filling blocks 5, 6 relative to the substrate
- the heights of the substrates 10 are different so as to be shifted from each other in the height direction, so that the first electrode 2, the second electrode sub-member 3, and the adjacent ones of the filling blocks 5, 6 are insulated from each other as shown in FIG.
- the connecting directions of the exposed ends of the bridge wires 1 are perpendicular to the extending direction of the first electrode 2, and the second electrode sub-pieces 3 overlapping with the end of the corresponding bridge wire 1 , such that the bridge wire 1 serially connects the second electrode component 3 array into a plurality of rows of second electrodes, the extending direction of each of the second electrodes and the extension of the first electrode 2
- the direction is vertical, so that a detection capacitance matrix is formed at the intersection of the first electrode 2 and the second electrode, and detection of the touch can be realized.
- the first electrode 2 is a sensing electrode, and the second electrode is a driving electrode.
- the size of the bridge wire 1 is very small. In the usual design, the thickness and width of the bridge wire 1 are all below 70 microns.
- the height difference structure includes a first insulating layer 12 and a second insulating layer 15 located above the first insulating layer 12.
- Both the first insulating layer 12 and the second insulating layer 15 are formed of an inorganic insulating material.
- the second insulating layer 15 falls within the range of the first insulating layer 12, and the area of the second insulating layer 15 is smaller than the area of the first insulating layer 12, thereby exposing a portion of the first insulating layer 12, as shown in FIG.
- Two layers of insulation facilitate the formation of the desired height difference structure.
- the specific process is as follows: First, the first insulating layer 12 is formed, and a window 17 is formed in the first insulating layer 12 by an etching process, as shown in FIG.
- a second insulating layer is formed over the first insulating layer 12.
- the layer 15 is etched to etch the second insulating layer 15 such that the second insulating layer 15 falls within the range of the first insulating layer 12, and the area of the second insulating layer 15 is smaller than that of the first insulating layer 12. The area is such that a portion of the first insulating layer 12 is exposed.
- the second insulating layer 15 is formed with a plurality of slots 11 , and a portion of the transparent conductive layer falling into the slot 11 is formed as a filling block 6 adjacent to the first electrode 2, and the slot 11 makes The height of the first electrode 2 with respect to the base substrate 10 is different from the height of the adjacent filling block 6 with respect to the base substrate 10, so that the first electrode 2 and the adjacent filling block 6 are staggered in the height direction.
- the first electrode 2 and the filling block 5, which are the same height as the base substrate 10, are separated by the slit 11.
- the touch panel in this embodiment further includes a photosensitive layer 14 disposed on the second insulating layer 15 and forming the first electrode. Between the transparent conductive layers of 2, the cross sections of the second insulating layer 15 and the photosensitive layer 14 are formed into a plurality of T-shaped structures having a large end and a large bottom end.
- the first insulating layer 12 and the second insulating layer 15 are selected from silicon nitride, silicon oxide, silicon oxynitride or a combination of any two or a combination of the three, and the T is formed by the following process.
- Type structure :
- a photosensitive layer 14 is coated on the second insulating layer 15, such as a transparent organic resin layer, as shown in FIG. 8; then, the photosensitive layer 14 is exposed and developed to form a photosensitive layer non-retained region and a photosensitive layer. Retaining area, as shown in FIG. 9; Finally, the second insulating layer 15 of the photosensitive layer non-retained area is engraved by dry etching, and a plurality of slots 11 are formed to expose the first insulating layer 12, so that the first insulating layer 12 The surface forms a height difference.
- the longitudinal cross section of the second insulating layer 15 and the remaining photosensitive layer 14 constitutes a T-shaped structure having a small end and a large bottom end, as shown in FIG. 10, thereby ensuring a transparent conductive layer.
- the transparent conductive layer is divided into the first electrode, the second electrode sub-assembly array and the filling block by the height difference structure, and the second electrode sub-assembly array is connected in series by the conductive bridge wiring array.
- the two electrodes thus omitting the patterning process for the transparent conductive layer, reduce the manufacturing process and reduce the production cost.
- the transparent conductive layer covers the entire base substrate, the uniformity of transmittance and reflectance of the entire touch panel is improved, thereby improving the uniformity of the display screen.
- the scale of the bridge wire 1 is very small, the array of the bridge wires 1 does not adversely affect the uniformity of the transmittance and reflectance of the touch panel.
- the transparent display layer is divided into two parts of the filling block 5 and the filling block 6 by the height difference structure, wherein the filling block 6 and The first electrode 2 is flush.
- the present invention is not limited thereto, and the filling block 5 and the filling block 6 may be formed integrally, and the first electrode 2, the second electrode sub-member 3, and the adjacent one of the filling blocks are opposed to the base substrate 10
- the heights are different so as to be staggered from each other in the height direction, so that the first electrode 2, the second electrode sub-member 3, and the adjacent two of the filler blocks are insulated from each other.
- the heights of the first electrode 2, the second electrode sub-member 3, and the filling block with respect to the base substrate 10 are the highest, the first electrode 2 is the highest, the filling block is second, and the second electrode sub-piece 3 is the lowest.
- the present invention is not limited thereto, and it may be set such that the first electrode 2 is the lowest, the filling block is second, and the array of the second electrode sub-pieces 3 is the highest.
- an array of recesses may be formed on the second insulating layer 15, and a portion of the transparent conductive layer falling into the array of recesses is formed as an array of the second electrode sub-pieces 3, and then the array of the second electrode sub-pieces 3 is electrically conductive.
- the array of bridge wires 1 is connected in series to a plurality of columns of second electrodes. Or, you can set it to other height order.
- the touch panel may further include a third insulating layer 16 and the third insulating layer 16 and the substrate The top surface of the opposite side of the substrate 10 serves as an insulation protection as shown in FIG.
- the following describes a method for manufacturing a touch panel according to the present invention, and specifically includes: preparing a substrate 10;
- the transparent conductive layer covers the entire base substrate 10, the portion of the transparent conductive layer falling into the array of the window 17 is formed as an array of the second electrode sub-pieces 3, and the remaining portion is divided into the first by the height difference structure.
- An electrode 2 and filling blocks 5 and 6 between the first electrode 2 and the second electrode sub-piece 3 array, the first electrode 2, the second electrode sub-member 3 and the adjacent two of the filling blocks 5 and 6 The heights are different from each other with respect to the base substrate 10 so as to be staggered from each other in the height direction, so that the first electrode 2, the second electrode sub-member 3, and the adjacent ones of the filling blocks 5 and 6 are insulated from each other,
- the connecting directions of the two end portions of the bridge wires 1 are perpendicular to the extending direction of the first electrode 2; the second electrode sub-members 3 are overlapped with the ends of the corresponding bridge wires 1, so that the bridge wires 1 will
- the second electrode sub-piece 3 array is serially connected in a plurality of rows of second electrodes, and each of the second electrodes extends in a direction perpendicular to the extending direction of the first electrode 2.
- the first electrode 2 is a sensing electrode, and the second electrode is a driving electrode.
- the steps of forming the height difference structure include:
- the first insulating layer 12 is formed, and an array of windows 17 is formed in the first insulating layer 12 by an etching process, as shown in FIG. 7;
- a second insulating layer 15 is formed over the first insulating layer 12, and the second insulating layer 15 is etched by an etching process, so that the second insulating layer 15 falls within the range of the first insulating layer 12, ::: The area of the insulating layer 15 is smaller than the area of the first insulating layer 12, thereby exposing a portion of the first insulating layer 12.
- the first insulating layer 12 and the second insulating layer 15 are each formed of an inorganic insulating material.
- the gap 11 is such that the height of the first electrode 2 relative to the base substrate 10 is different from the height of the adjacent filling block 6 relative to the base substrate 10, thereby The first electrode 2 is shifted from the adjacent filling block 6 in the height direction.
- the first electrode 2 and the filling block 5, which are the same height as the base substrate 10, are separated by the slit 11.
- the step of etching the second insulating layer 15 further includes:
- a photosensitive layer 14 such as a transparent organic resin layer is coated on the second insulating layer 15, as shown in FIG.
- the photosensitive layer 14 is exposed and developed to form a photosensitive layer non-retained region and a photosensitive layer retention region, as shown in FIG.
- the second insulating layer 15 of the photosensitive layer non-retained region is etched away by the dry etching, and a plurality of slits 11 are formed to expose the first insulating layer 12 such that the surface of the first insulating layer 12 forms a height difference. Due to the undercut phenomenon in the dry etching process, the longitudinal section of the second insulating layer 15 and the remaining photosensitive layer 14 constitutes a T-shaped structure having a small top end and a small end, as shown in FIG.
- the first electrode 2 and the adjacent filling block 6 can be completely broken by the slit 11, as shown in Fig. 11.
- the manufacturing method of the touch panel prepared in the embodiment further includes the step of forming the third insulating layer 16, and the third insulating layer 16 constitutes a top surface of the side opposite to the substrate substrate 10. For protection of insulation) 3 ⁇ 4, as shown in Figure 4.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/415,694 US10045441B2 (en) | 2013-12-19 | 2014-04-22 | Touch panel and its manufacturing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310705569.3A CN103699261B (zh) | 2013-12-19 | 2013-12-19 | 触控面板及其制造方法 |
CN201310705569.3 | 2013-12-19 |
Publications (1)
Publication Number | Publication Date |
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WO2015089967A1 true WO2015089967A1 (zh) | 2015-06-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CN2014/075904 WO2015089967A1 (zh) | 2013-12-19 | 2014-04-22 | 触控面板及其制造方法 |
Country Status (3)
Country | Link |
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US (1) | US10045441B2 (zh) |
CN (1) | CN103699261B (zh) |
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CN108268174A (zh) * | 2018-01-12 | 2018-07-10 | 深圳市骏达光电股份有限公司 | 触摸屏的制造工艺 |
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CN103699261B (zh) * | 2013-12-19 | 2016-08-31 | 京东方科技集团股份有限公司 | 触控面板及其制造方法 |
CN105242800A (zh) * | 2014-06-27 | 2016-01-13 | 深圳莱宝高科技股份有限公司 | 触控显示面板及其制作方法、驱动方法 |
CN106657762A (zh) * | 2016-09-30 | 2017-05-10 | 上海斐讯数据通信技术有限公司 | 一种基于双摄像头的缩略图生成方法及*** |
CN107329614A (zh) * | 2017-06-30 | 2017-11-07 | 昆山国显光电有限公司 | 一种触控面板 |
CN111309180B (zh) * | 2020-02-11 | 2022-09-20 | 业成科技(成都)有限公司 | 触控面板、其制备方法及触控显示装置 |
KR20220036540A (ko) * | 2020-09-16 | 2022-03-23 | 삼성전자주식회사 | 패턴이 형성된 커버 부재 및 이를 포함하는 전자 장치 |
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US20150366068A1 (en) | 2015-12-17 |
CN103699261B (zh) | 2016-08-31 |
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